PCB with soldering and printing process

Abstract

The application provides a PCB continuous printing process, which comprises the following steps: step one: pre-treatment production, using pre-treatment liquid to clean and roughen the copper surface, so that the PCB is cleaned, and a honeycomb layer is formed on the copper surface to increase the bonding force between the PCB and the ink; step two: printing production; step three: short baking production, the ink is pre-dried; step four: exposure production; step five: development production, the ink on the pattern which does not occur polymerization is developed clean through the developing solution; and step six: long baking production, the ink is solidified through high temperature. The PCB continuous printing process provided by the application optimizes the printing mode, and the advantages are as follows: the via hole is blocked with the ink by using the nail bed as the base for printing and changing the scraper mode from parallel scraping to inverted eight scraping, the hole does not need to be blocked separately, the action of once up and down plate is cancelled, the manpower is saved, the risk of handling scratch is effectively reduced, and the printing machine capacity is saved.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and more particularly to a PCB manufacturing process that combines printing and stamping. Background Technology

[0002] With market capacity saturation and intensifying competition, low-cost and flexible manufacturing capabilities have become essential. Currently, there are two main methods for ink plugging in the industry: 1) Traditional resin plugging and grinding process requires an additional grinding process after plugging, and the grinding process affects the copper thickness and expansion / contraction of the product. Compared with the processing cost, cycle and quality of the patent application, it has no advantage. 2) Anti-soldering hole plugging process, which is characterized by adding a hole plugging process before printing ink on the surface, requires 3 printing machines to operate, increases the up and down movement of the plates, and requires multiple people to operate.

[0003] Therefore, it is necessary to provide a PCB manufacturing process that combines plugging and printing to solve the above-mentioned technical problems. Summary of the Invention

[0004] This invention provides a PCB manufacturing process with integrated printing. The technical problem to be solved by this invention is to overcome the processing cost and limitations of the prior art and to provide a PCB manufacturing process with integrated printing that can overcome the bottlenecks of the prior art.

[0005] To solve the above-mentioned technical problems, the present invention provides a PCB manufacturing process with integrated printing, characterized by comprising the following steps: Step 1: Pre-treatment process. Pre-treatment solution is used to clean and roughen the copper surface, cleaning the PCB and forming a honeycomb layer on the copper surface to increase the adhesion between the PCB and the ink. Step Two: Printing and Production; Step 3: Short baking process to pre-dry the ink; Step 4: Exposure Production; Step 5: Development process, using a developing solution to clean the ink from the unpolymerized areas of the pattern; Step Six: Long baking process, which uses high temperature to cure the ink.

[0006] Preferably, in step two, the printing process involves inserting ink into the hole to be blocked while simultaneously printing surface ink.

[0007] Preferably, in step four, the exposure process involves using light to induce a polymerization reaction in the graphic that needs to be covered by ink.

[0008] Compared with related technologies, the PCB manufacturing process with integrated plug and printing provided by this invention has the following advantages: This invention provides a PCB manufacturing process that includes both plug and printing: Traditional resin plugging and grinding processes require grinding the product, and the mechanical force of grinding can cause product deformation and differences in copper thickness, which is not conducive to subsequent processing and affects product quality. This invention eliminates the grinding process, avoids product deformation and differences in copper thickness, and shortens the processing flow, greatly increasing processing advantages. The anti-soldering hole-plugging process is characterized by adding a hole-plugging process before printing ink on the surface. It requires 3 printing machines to operate, increases the up and down movement of the plates, and requires multiple people to operate.

[0009] This invention optimizes the printing method by: Using a bed of nails as a base for printing, and changing the squeegee method from parallel to an inverted eight-shaped squeegee, allows for the filling of via holes that require ink sealing. Its advantages are: 1. No need to plug holes separately, eliminating one step of loading and unloading the plates, saving manpower; 2: Effectively reduces the risk of scratches during handling; 3. Save printing press capacity. Attached Figure Description

[0010] Figure 1 A flowchart of a preferred embodiment of the PCB manufacturing process with printing and plugging provided by the present invention; Figure 2 This is a schematic diagram of the printing table of a preferred embodiment of the PCB printing process provided by the present invention. Detailed Implementation

[0011] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0012] Please refer to the following: Figure 1 , Figure 2 ,in Figure 1 A flowchart of a preferred embodiment of the PCB manufacturing process with printing and plugging provided by the present invention; Figure 2 This is a schematic diagram of the printing table in a preferred embodiment of the PCB printing process provided by the present invention. The PCB printing process includes the following steps: Step 1: Pre-treatment process. Pre-treatment solution is used to clean and roughen the copper surface, cleaning the PCB and forming a honeycomb layer on the copper surface to increase the adhesion between the PCB and the ink. Step Two: Printing and Production; Step 3: Short baking process to pre-dry the ink; Step 4: Exposure Production; Step 5: Development process, using a developing solution to clean the ink from the unpolymerized areas of the pattern; Step Six: Long baking process, which uses high temperature to cure the ink.

[0013] In step two, the printing process involves inserting ink into the holes to be blocked while simultaneously printing ink onto the surface.

[0014] One hole-plugging process is reduced. During printing, the ink is inserted into the hole to be plugged while the surface ink is printed.

[0015] In step four, the exposure process involves using light to create a polymerization reaction in the graphic that needs to be covered by ink.

[0016] The PCB manufacturing process of this invention, which combines plugging and printing, solves the problems of long process flow, poor quality and high cost of traditional processes.

[0017] Compared with related technologies, the PCB manufacturing process with integrated plug and printing provided by this invention has the following advantages: This invention provides a PCB manufacturing process that includes both plug and printing: Traditional resin plugging and grinding processes require grinding the product, and the mechanical force of grinding can cause product deformation and differences in copper thickness, which is not conducive to subsequent processing and affects product quality. This invention eliminates the grinding process, avoids product deformation and differences in copper thickness, and shortens the processing flow, greatly increasing processing advantages. The anti-soldering hole-plugging process is characterized by adding a hole-plugging process before printing ink on the surface. It requires 3 printing machines to operate, increases the up and down movement of the plates, and requires multiple people to operate.

[0018] This invention optimizes the printing method by: Using a bed of nails as a base for printing, and changing the squeegee method from parallel to an inverted eight-shaped squeegee, allows for the filling of via holes that require ink sealing. Its advantages are: 1. No need to plug holes separately, eliminating one step of loading and unloading the plates, saving manpower; 2: Effectively reduces the risk of scratches during handling; 3. Save printing press capacity.

[0019] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A PCB manufacturing process that combines plugging and printing, characterized in that, Includes the following steps: Step 1: Pre-treatment process. Pre-treatment solution is used to clean and roughen the copper surface, cleaning the PCB and forming a honeycomb layer on the copper surface to increase the adhesion between the PCB and the ink. Step Two: Printing and Production; Step 3: Short baking process to pre-dry the ink; Step 4: Exposure Production; Step 5: Development process, using a developing solution to clean the ink from the unpolymerized areas of the pattern; Step Six: Long baking process, which uses high temperature to cure the ink.

2. The PCB manufacturing process with integrated printing as described in claim 1, characterized in that, In step two, the printing process involves inserting ink into the holes to be blocked while simultaneously printing ink onto the surface.

3. The PCB manufacturing process with integrated plug and printing according to claim 1, characterized in that, In step four, the exposure process involves using light to create a polymerization reaction in the graphic that needs to be covered by ink.

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