A DIP component rework device

CN122534776BActive Publication Date: 2026-09-18JIANGXI JINGHUA MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202611023687.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-07-10
Publication Date
2026-09-18
Estimated Expiration
2046-07-10

AI Technical Summary

Technical Problem

[0004]目前,DIP元件返修时,通常采用烙铁和锡丝将固定DIP元件的焊锡加热熔化后,工作人员用手将DIP元件从PCB取下来,再单独给通孔加热,使得通孔内的焊锡完全熔化,接着抖动PCB板,将通孔里面的锡渣抖出,方便后续的元件焊接;上述清通孔分两次操作,疏通通孔效率较低;此外,抖动PCB板时易损坏其它元件;同时不便于收集锡渣

Benefits of technology

[0014]与现有技术相比,本发明的有益效果是:(1)本发明通过抽真空机构对锡渣收集管内部抽真空,在锡渣收集管内部形成负压,能够将熔化得到的锡渣及脱落的DIP元件自动吸入到锡渣收集管中;与此同时,还能一并疏通PCB板上的通孔;相较于现有技术需分两步完成疏通的方式,本发明效率更高,也方便了锡渣的集中收集;

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a DIP component rework device, comprising a frame, a solder dross collection tube, a vacuum tube, and a vacuum mechanism. The frame includes a top plate with a limiting groove for placing the PCB board containing the DIP component to be reworked. The solder dross collection tube collects molten solder dross and catches any detached DIP components. The vacuum tube is connected at both ends to the limiting groove and the solder dross collection tube, respectively. The vacuum mechanism creates a vacuum inside the solder dross collection tube. This invention creates a negative pressure inside the solder dross collection tube by creating a vacuum, automatically drawing the molten solder dross and detached DIP components into the tube, while simultaneously clearing the through-holes on the PCB board. Compared to existing two-step clearing methods, this invention is more efficient and facilitates the centralized collection of solder dross.
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Description

Technical Field

[0001] This invention relates to the field of PCB technology, specifically to a DIP component rework device. Background Technology

[0002] DIP (Dual In-line Package) is a common type of electronic component packaging used for integrated circuits (ICs) and other electronic devices. DIP devices have a rectangular plastic or ceramic housing with multiple pins on the bottom. These pins are designed to insert into holes on a printed circuit board (PCB) and are secured by soldering, thus providing an electrical connection between the device and the circuitry.

[0003] During the printing, surface mount, and reflow soldering processes of PCBs, issues may arise with the soldering of DIP components. Alternatively, DIP components may become damaged during later use of PCBs that have already left the factory. Therefore, there is a need to rework PCBs with damaged DIP components.

[0004] Currently, when reworking DIP components, the usual method is to heat and melt the solder holding the DIP component with a soldering iron and solder wire. Then, the worker manually removes the DIP component from the PCB, heats the via separately to completely melt the solder inside, and then shakes the PCB to remove the solder dross from the via, making it easier for subsequent component soldering. This process of cleaning vias in two steps is inefficient. In addition, shaking the PCB can easily damage other components, and it is also inconvenient to collect the solder dross. Summary of the Invention

[0005] To overcome the shortcomings of existing technologies, the present invention provides a DIP component rework device, comprising: A frame, the frame including a top plate, the top plate having a limiting groove for placing a PCB board; Solder dross collection tube: After the solder on the PCB board that is used to fix the pins of DIP components to be repaired is heated and melted, the solder dross collection tube is used to collect the melted solder dross and to catch the detached DIP components. A suction pipe, the two ends of which are respectively connected to a limiting groove and a tin dross collection pipe; A vacuuming mechanism is used to create a vacuum inside the tin dross collection tube.

[0006] Preferably, it further includes a slag discharge mechanism, the slag discharge mechanism comprising: The slag discharge port is located in the middle of the inclined tin slag collection pipe; The second piston is slidably disposed at the bottom of the tin dross collection tube; The first guide groove is formed on the tin dross collection pipe; A blocking plate is slidably disposed in the first guide groove and is used to block the slag discharge port. A through groove, wherein the through groove is formed on the blocking plate; The first driving mechanism is used to drive the second piston and the plug plate to reciprocate so that when the slag discharge port corresponds to the through slot, the second piston discharges the solder slag and DIP components out of the solder slag collection pipe.

[0007] Preferably, the diameter of the tin slag collection pipe is 4-6 times the diameter of the exhaust pipe.

[0008] Preferably, the vacuum pumping mechanism includes: Vacuum chamber; The first piston is slidably disposed in the vacuum chamber; The second drive mechanism is used to drive the first piston to reciprocate relative to the vacuum chamber. The first gas guide pipe is connected at both ends to the tin dross collection pipe and the vacuum box, respectively. The second gas guide tube; the two ends of the second gas guide tube are respectively connected to the vacuum chamber and the external environment; The first check valve is disposed on the first air guide pipe; The second check valve is located on the second air guide pipe.

[0009] Preferably, there are two of each of the first and second gas guide pipes, and each of the first and second gas guide pipes is equipped with a solenoid valve; the first check valves on the two first gas guide pipes flow in opposite directions, and the second check valves on the two second gas guide pipes also flow in opposite directions; the two first gas guide pipes are connected to the slag collection pipe and the vacuum box through a transfer pipe, and the two second gas guide pipes are connected to the vacuum box and the external environment through a transfer pipe; and the connection between the two first gas guide pipes and the slag collection pipe corresponds to the slag discharge port.

[0010] Preferably, it further includes a reversing mechanism, the reversing mechanism comprising: Common terminal block; When the common terminal and the first terminal are connected, the solenoid valves corresponding to the first air pipe flowing towards the vacuum box and the second air pipe flowing away from the vacuum box are energized. When the common terminal and the second terminal are connected, the solenoid valves corresponding to the first air pipe flowing away from the vacuum box and the second air pipe flowing towards the vacuum box are energized. The swing arm; the middle part of the swing arm is rotatably connected to a common terminal block; A pressing rod is used to abut against a pressing head at the end of the swing arm away from the common terminal; a second spring is fixedly connected to the end of the pressing rod away from the swing arm. Two levers are provided, and the two levers are located on the output end of the first drive mechanism; the two levers drive the swing arm to swing toward the first terminal and the second terminal respectively.

[0011] Preferably, the reversing mechanism further includes: The trigger lever has two components, each corresponding to a toggle lever. The two trigger levers respectively trigger the swing arm to swing toward the first terminal and the second terminal. Both sides of the trigger lever near the toggle lever are beveled. When the output end of the first drive mechanism extends, the toggle lever corresponding to the second terminal drives the trigger lever to trigger the swing arm to swing toward the second terminal. When the output end of the first drive mechanism retracts, the toggle lever corresponding to the first terminal drives the trigger lever to trigger the swing arm to swing toward the first terminal. The first spring is used to reset the trigger lever.

[0012] Preferably, a collection frame is provided directly below the slag discharge port.

[0013] Preferably, the limiting groove has a groove in the middle, and the two ends of the groove extend to the outside of the limiting groove.

[0014] Compared with the prior art, the beneficial effects of the present invention are: (1) The present invention uses a vacuuming mechanism to create a vacuum inside the tin dross collection tube, thereby creating a negative pressure inside the tin dross collection tube, which can automatically suck the molten tin dross and the detached DIP components into the tin dross collection tube; at the same time, it can also clear the through holes on the PCB board; compared with the prior art which requires two steps to clear the through holes, the present invention is more efficient and facilitates the centralized collection of tin dross. (2) By setting up a slag discharge mechanism, the present invention facilitates the automatic discharge of slag and DIP components collected in the slag collection tube; (3) By setting two first air guide pipes and two second air guide pipes with opposite flow directions, and flexibly selecting the energization of the solenoid valves on the first air guide pipes and the second air guide pipes, the present invention can both evacuate the tin dross collection pipe and blow air into the tin dross collection pipe; when the vacuuming mechanism blows air into the tin dross collection pipe, the airflow can blow off the tin dross adhering to the second piston, thus preventing the tin dross from remaining in the tin dross collection pipe; (4) The present invention automatically switches the vacuuming mechanism from vacuuming state to air blowing state during the extension of the output end of the electric telescopic rod by cooperating with the reversing mechanism and the electric telescopic rod. This switching operation corresponds to the action of the second piston pushing the tin dross to the dross discharge port, ensuring that the vacuuming mechanism blows air into the tin dross collection tube during dross discharge. During the tin dross collection process, the vacuuming mechanism is responsible for evacuating the tin dross collection tube. Attached Figure Description

[0015] Figure 1 This is a first-view perspective three-dimensional structural diagram of a DIP component rework device provided in an embodiment of the present invention; Figure 2 This is a second-view perspective three-dimensional structural diagram of a DIP component rework device provided in an embodiment of the present invention; Figure 3 This is a cross-sectional structural diagram of a DIP component rework device provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the vacuum pumping mechanism provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the cross-sectional structure of the tin dross collection pipe provided in an embodiment of the present invention; Figure 6 This is a three-dimensional structural diagram of the tin dross collection pipe provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the three-dimensional structure of the blocking plate provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of the reversing mechanism structure provided in an embodiment of the present invention.

[0016] Reference numerals: 1. Frame; 101. Base plate; 102. Side plate; 103. Top plate; 1031. Limiting groove; 1032. Groove; 2. Vacuuming mechanism; 201. Vacuum box; 202. Rotary motor; 203. Crank-connecting rod mechanism; 204. Slider; 205. Partition plate; 206. Connecting rod; 207. First piston; 3. Slag discharge mechanism; 301. First fixed cylinder; 302. Electric telescopic rod; 303. Second piston; 304. Slag discharge port; 305. Blocking plate; 3051. Through groove; 306. First guide groove; 307. Second guide groove. 4. Reversing mechanism; 401. Transmission frame; 402. Actuating rod; 403. Trigger rod; 404. First spring; 405. Common terminal; 406. First terminal; 407. Second terminal; 408. Swing rod; 409. Second fixed cylinder; 410. Second spring; 411. Extrusion rod; 5. Air extraction pipe; 6. Solder dross collection pipe; 7. Connecting pipe; 8. First air guide pipe; 9. Second air guide pipe; 10. Adaptor pipe; 11. Solenoid valve; 12. First check valve; 13. Second check valve; 14. Collection frame; 15. PCB board. Detailed Implementation

[0017] To make the objectives, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0019] like Figures 1-3 As shown, the present invention provides a DIP component rework device, including a frame 1, which is composed of a base plate 101, side plates 102, and a top plate 103. Two side plates 102 are installed between the edges of the base plate 101 and the top plate 103, so that the center of the frame 1 is hollowed out. Preferably, the top plate 103 is inclined, and a limiting groove 1031 is formed in the center of the upper surface of the top plate 103. The shape and size of the limiting groove 1031 match the shape of the PCB board 15 to be reworked, for placing and positioning the PCB board 15. Preferably, a recess 1032 is formed in the center of the limiting groove 1031, and both ends of the recess 1032 extend to the outside of the limiting groove 1031 to facilitate the operator to pick up and place the PCB board 15.

[0020] A vacuum pipe 5, a solder dross collection pipe 6, and a vacuum mechanism 2 are installed in the hollowed-out area of ​​frame 1. The solder dross collection pipe 6 is equipped with a dross discharge mechanism 3. The vacuum mechanism 2 is used to evacuate the inside of the vacuum pipe 5. After the solder on the PCB board 15 that is fixing the DIP component to be repaired is heated and melted, the solder dross collection pipe 6 collects the melted solder dross and catches the detached DIP component. The solder dross collection pipe 6 is inclined, with its higher end connected to one end of the vacuum pipe 5 through a connecting pipe 7. The other end of the vacuum pipe 5 passes through the top plate 103 and is connected to the limiting groove 1031. The position of the vacuum pipe 5 corresponds to the position of the DIP component to be repaired. Therefore, after the soldering iron and solder wire are used to melt and fix the solder on the pins of the DIP component to be repaired, the inside of the solder dross collection tube 6 is evacuated by the vacuum mechanism 2. After the negative pressure is formed inside the solder dross collection tube 6, the melted solder dross and DIP component will be automatically sucked into the solder dross collection tube 6 under the action of pressure, thereby realizing the automatic collection of solder dross and DIP component.

[0021] It should be noted that the exhaust pipe 5 and the tin dross collection pipe 6 can be set as one set or multiple sets. Those skilled in the art can set them flexibly according to the actual situation, and this application does not make specific limitations.

[0022] It should be further explained that the connecting pipe 7 can be detachably connected to the solder dross collection pipe 6, or it can be connected in other ways. When the connecting pipe 7 is detachably connected to the solder dross collection pipe 6, it is convenient to manually clean the solder dross collection pipe 6.

[0023] The two ends of the suction pipe 5 are connected to the limiting groove 1031 and the solder dross collection pipe 6, respectively, serving as channels to guide the molten solder dross and detached DIP components from the PCB board 15 into the solder dross collection pipe 6. The vacuum mechanism 2 is used to create a vacuum inside the solder dross collection pipe 6, thereby forming a negative pressure inside the suction pipe 5 and the solder dross collection pipe 6, automatically drawing the molten solder dross and detached DIP components into the solder dross collection pipe 6.

[0024] Optionally, the angle between the solder dross collection tube 6 and the horizontal plane is 15°-45°, preferably 20°, so that the solder dross and DIP components can slide down to the bottom of the solder dross collection tube 6 under the action of gravity.

[0025] In this embodiment, the dross collection pipe 6 is configured as a T-junction pipe, and its diameter is 4-6 times that of the extraction pipe 5. The connecting pipe 7 is connected to the extraction pipe 5 via a pipe fitting. Because the dross collection pipe 6 is a T-junction pipe, the extraction direction of the vacuum mechanism 2 is perpendicular to the sliding direction of the dross and DIP components within the dross collection pipe 6. Furthermore, the diameter of the dross collection pipe 6 is larger than that of the extraction pipe 5. Therefore, when the vacuum mechanism 2 extracts air, the airflow velocity within the dross collection pipe 6 decreases relative to the extraction pipe 5, and the dross and DIP components slide down to the bottom of the dross collection pipe 6 under gravity, preventing them from entering the vacuum mechanism 2 with the airflow.

[0026] Please see Figures 5-7 The slag discharge mechanism 3 is used to automatically discharge the slag and DIP components collected in the slag collection pipe 6. The slag discharge mechanism 3 includes a slag discharge port 304, a second piston 303, a first guide groove 306, a blocking plate 305, and a first drive mechanism. The slag discharge port 304 is located in the middle of the lower side wall of the inclined slag collection pipe 6, facilitating the discharge of slag and DIP components from the slag discharge port 304 under gravity. The second piston 303 is slidably disposed at the lower end of the slag collection pipe 6, and the first guide groove 306 is disposed on the slag collection pipe 6. The blocking plate 305 is slidably disposed in the first guide groove 306, and the blocking plate 305 is used to block the slag discharge port 304. A through groove 3051 is provided on the blocking plate 305. Preferably, the cross-sections of the slag discharge port 304 and the first guide groove 306 are both arc-shaped.

[0027] In this embodiment, the first driving mechanism is used to drive the second piston 303 and the blocking plate 305 to reciprocate together; of course, a separate first driving mechanism can also be used to drive the second piston 303 to slide relative to the tin dross collection pipe 6 and the blocking plate 305 to slide relative to the first guide groove 306 respectively. This application does not make specific limitations, and all are within the protection scope of this application.

[0028] Preferably, a second guide groove 307 is also provided on the inner wall of the tin dross collection pipe 6. The second guide groove 307 extends along the axial direction of the tin dross collection pipe 6. A connecting block is slidably fitted in the second guide groove 307. The connecting block is used to fix the second piston 303 and the block plate 305 together.

[0029] When the blocking plate 305 slides within the first guide groove 306 until the through groove 3051 aligns with the slag discharge port 304, the slag discharge port 304 is opened. Simultaneously, the second piston 303 pushes the solder slag and DIP components in the solder slag collection tube 6 to the slag discharge port 304, causing the solder slag and DIP components to be pushed out of the slag discharge port 304. After slag discharge is completed, the first drive mechanism drives the second piston 303 to reset and drives the blocking plate 305 to reset to a position where the through groove 3051 is misaligned with the slag discharge port 304, and the blocking plate 305 re-blocks the slag discharge port 304.

[0030] In this embodiment, the first driving mechanism is an electric telescopic rod 302. Of course, the first driving mechanism can also be a cylinder, a hydraulic cylinder, an electric push rod, etc. The electric telescopic rod 302 is disposed inside the first fixed cylinder 301, which is installed on the side of the solder dross collection pipe 6 away from the connecting pipe 7.

[0031] Preferably, butyl rubber or fluororubber is provided at the contact points between the second piston 303 and the plug plate 305 and the tin dross collection pipe 6 to improve sealing.

[0032] Preferably, a collection frame 14 is provided directly below the slag discharge port 304 to receive the solder slag and DIP components discharged from the slag discharge port 304 for centralized processing.

[0033] Please see Figure 1 and Figure 4 The vacuum pumping mechanism 2 includes a vacuum chamber 201, a first piston 207, and a second drive mechanism. The outer wall of the vacuum chamber 201 is connected to the side plate 102 via a support rod, which supports the vacuum chamber 201. The first piston 207 is slidably disposed inside the vacuum chamber 201, and the second drive mechanism is used to drive the first piston 207 to reciprocate relative to the vacuum chamber 201.

[0034] In this embodiment, the second driving mechanism includes a rotary motor 202, which is mounted on the outer wall of the vacuum chamber 201. The output shaft of the rotary motor 202 is connected to a crank-connecting rod mechanism 203 inside the vacuum chamber 201. One end of the crank-connecting rod mechanism 203 away from the rotary motor 202 is rotatably connected to a slider 204, which is also slidably disposed inside the vacuum chamber 201. A partition 205 is also installed inside the vacuum chamber 201, and a connecting rod 206 is slidably fitted on the partition 205. Both ends of the connecting rod 206 are connected to the first piston 207 and the slider 204, respectively. Therefore, after starting the rotary motor 202, it will drive the slider 204 to reciprocate within the vacuum chamber 201, thereby driving the first piston 207 to reciprocate within the vacuum chamber 201. Alternatively, the second driving mechanism can be a pneumatic cylinder or a hydraulic cylinder, with its output end connected to the first piston 207.

[0035] The rodless chamber of the vacuum chamber 201 is connected to a first gas guide pipe 8 and a second gas guide pipe 9. The end of the first gas guide pipe 8 furthest from the vacuum chamber 201 is connected to the slag collection pipe 6 via a pipe joint, and the end of the second gas guide pipe 9 furthest from the vacuum chamber 201 is connected to the external environment. A first check valve 12 is installed on the first gas guide pipe 8, and a second check valve 13 is installed on the second gas guide pipe 9. The first check valve 12 on the first gas guide pipe 8 only allows gas to flow from the slag collection pipe 6 to the vacuum chamber 201, and the second check valve 13 on the second gas guide pipe 9 only allows gas to flow from the vacuum chamber 201 to the external environment.

[0036] When the second drive mechanism drives the first piston 207 to move away from the rodless chamber, the volume of the rodless chamber in the vacuum box 201 increases and the pressure decreases, opening the first check valve 12. Gas in the solder dross collection tube 6 is drawn into the vacuum box 201 through the first gas guide tube 8, thus creating a vacuum inside the solder dross collection tube 6. At this time, the second check valve 13 closes. When the second drive mechanism drives the first piston 207 to move closer to the rodless chamber, the volume of the rodless chamber in the vacuum box 201 decreases and the pressure increases, opening the second check valve 13. Gas in the vacuum box 201 is discharged to the external environment through the second gas guide tube 9. At this time, the first check valve 12 closes. By driving the first piston 207 to reciprocate through the second drive mechanism, a vacuum can be created inside the solder dross collection tube 6, thereby drawing solder dross and DIP components into the solder dross collection tube 6.

[0037] In some preferred embodiments, two first gas guide pipes 8 and two second gas guide pipes 9 are provided, and each first gas guide pipe 8 and each second gas guide pipe 9 is equipped with a solenoid valve 11. The flow directions of the first check valves 12 on the two first gas guide pipes 8 are opposite, and the flow directions of the second check valves 13 on the two second gas guide pipes 9 are also opposite. The two ends of the two first gas guide pipes 8 are respectively connected to the slag collection pipe 6 and the vacuum box 201 through the adapter pipes 10, and the two ends of the two second gas guide pipes 9 are respectively connected to the vacuum box 201 and the external environment through the adapter pipes 10; and the connection between the two first gas guide pipes 8 and the slag collection pipe 6 corresponds to the slag discharge port 304.

[0038] By setting up two sets of first air guide pipes 8 and second air guide pipes 9 with opposite flow directions, and flexibly selecting the energization of the solenoid valves 11 on the first air guide pipes 8 and second air guide pipes 9, it is possible to both evacuate the tin dross collection pipe 6 and blow air into the tin dross collection pipe 6.

[0039] It should be noted that, due to the stickiness of solder dross, some of it will adhere to the inner wall of the solder dross collection tube 6 and the second piston 303. Therefore, after the solder dross and DIP components are automatically collected into the solder dross collection tube 6, air is blown into the solder dross collection tube 6 through the vacuum mechanism 2; at the same time, after the second piston 303 pushes the solder dross to the dross discharge port 304, the airflow can blow off the solder dross adhering to the second piston 303, preventing solder dross from remaining in the solder dross collection tube 6.

[0040] Please see Figure 8 The invention also includes a reversing mechanism 4, used to control the on / off state of each solenoid valve 11 on the first air guide pipe 8 and the second air guide pipe 9, so as to realize the automatic switching between vacuuming and blowing operations. The reversing mechanism 4 includes a transmission frame 401, which is installed on the outside of the first fixed cylinder 301. The transmission frame 401 is equipped with a common terminal 405, a first terminal 406, a second terminal 407, a swing rod 408, and a pressing rod 411.

[0041] When the common terminal 405 is connected to the first terminal 406 via the swing arm 408, the solenoid valves 11 corresponding to the first air guide pipe 8 flowing towards the vacuum box 201 and the second air guide pipe 9 flowing away from the vacuum box 201 are energized, and the vacuuming mechanism 2 is in the state of evacuating the solder dross collection pipe 6. When the common terminal 405 is connected to the second terminal 407 via the swing arm 408, the solenoid valves 11 corresponding to the first air guide pipe 8 flowing away from the vacuum box 201 and the second air guide pipe 9 flowing towards the vacuum box 201 are energized, and the vacuuming mechanism 2 is in the state of blowing air into the solder dross collection pipe 6.

[0042] The middle part of the rocker arm 408 is rotatably connected to the common terminal 405. The rocker arm 408 is made of a conductive metal material. The rocker arm 408 is T-shaped, with one end away from the common terminal 405 serving as a pressing head, and the other two ends serving as contact points for contact with the first terminal 406 or the second terminal 407. Preferably, the pressing head of the rocker arm 408 is triangular. The pressing rod 411 abuts against the pressing head of the rocker arm 408. The end of the pressing rod 411 away from the rocker arm 408 is slidably engaged with the second fixed cylinder 409, and the pressing rod 411 is connected to the bottom wall of the second fixed cylinder 409 via a second spring 410. The second fixed cylinder 409 is mounted on the outer wall of the first fixed cylinder 301. The second spring 410 is used to apply a compressive force to the compressive rod 411 in the direction of the rocker arm 408, so that the compressive rod 411 is kept in close contact with the compressive head of the rocker arm 408, thereby making the contact end of the rocker arm 408 in close contact with the first terminal 406 or the second terminal 407.

[0043] To trigger the swing arm 408 to swing, the reversing mechanism 4 also includes two trigger rods 403, which are slidably mounted on the first fixed cylinder 301. The reversing mechanism 4 also includes two actuating rods 402, corresponding one-to-one with the trigger rods 403. The two actuating rods 402 are mounted on the output end of the electric telescopic rod 302, and are used to drive the swing arm 408 to swing toward the first terminal 406 and the second terminal 407, respectively. Preferably, a first spring 404 is sleeved on the outer surface of the trigger rod 403. The two ends of the first spring 404 are connected to the outer wall of the first fixed cylinder 301 and the retaining ring on the trigger rod 403, respectively. The two sides of the trigger rod 403 near the actuating rod 402 are both beveled. Therefore, when the output end of the electric telescopic rod 302 extends or retracts, it will drive the toggle lever 402 to press the trigger lever 403, thereby causing the trigger lever 403 to act on the contact ends on both sides of the swing arm 408.

[0044] Specifically, when the output end of the electric telescopic rod 302 extends, the toggle lever 402 corresponding to the first terminal 406 drives the corresponding trigger lever 403. Since the contact end of the swing arm 408 is in close contact with the first terminal 406 at this time, the triggered lever 403 will not contact the swing arm 408 after the action, thus preventing the swing arm 408 from swinging. Then, the toggle lever 402 corresponding to the second terminal 407 drives the corresponding trigger lever 403. This trigger lever 403 can act on the contact end of the swing arm 408, causing the swing arm 408 to rotate around its middle until the contact end of the swing arm 408 is in close contact with the second terminal 407, causing the common terminal 405 to switch to be connected to the second terminal 407. Therefore, during the extension of the output end of the electric telescopic rod 302, the present invention automatically realizes the switching of the vacuum mechanism 2 from the vacuum working state to the air blowing working state.

[0045] Specifically, when the output end of the first drive mechanism retracts, the toggle lever 402 corresponding to the second terminal 407 first drives the corresponding trigger lever 403. Since the contact end of the swing arm 408 is in close contact with the second terminal 407 at this time, the trigger lever 403 will not contact the swing arm 408 after the action, thus preventing the swing arm 408 from swinging. Then, the toggle lever 402 corresponding to the first terminal 406 drives the corresponding trigger lever 403. The trigger lever 403 acts on the swing arm 408, causing the swing arm 408 to rotate around its middle part, causing the swing arm 408 to swing towards the first terminal 406 until the contact end of the swing arm 408 is in close contact with the first terminal 406, and the common terminal 405 is connected to the first terminal 406, thus restoring the initial working state.

[0046] Understandably, when the lever 402 disengages from the trigger lever 403, the trigger lever 403 can automatically return to its initial position under the reset action of the first spring 404.

[0047] The specific working process of this invention is as follows: In actual use, the operator places the PCB board 15 with DIP components to be repaired into the limiting groove 1031; the operator uses a soldering iron and solder wire to melt the solder fixing the DIP component pins; then the vacuum mechanism 2 is activated to evacuate the inside of the solder dross collection tube 6, so that a negative pressure is formed inside the solder dross collection tube 6. Under the action of the negative pressure, the melted solder dross and the detached DIP components are automatically sucked into the solder dross collection tube 6; at the same time, the through holes on the PCB board 15 are cleared, which facilitates the subsequent component soldering; then the output end of the electric telescopic rod 302 is controlled to extend, and the electric telescopic rod 302 simultaneously drives the second piston 303 and the blocking plate 305 to slide relative to the solder dross collection tube 6, so that the dross discharge port 304 is opened, and the solder dross and DIP components are pushed out from the dross discharge port 304. During the extension of the output end of the electric telescopic rod 302, it drives the toggle lever 402 to drive the corresponding trigger lever 403. After the trigger lever 403 is activated, it acts on the contact end of the swing rod 408, causing the swing rod 408 to rotate around its middle until the contact end of the swing rod 408 separates from the first terminal 406 and makes close contact with the second terminal 407. This causes the vacuuming mechanism 2 to switch from vacuuming operation to air blowing operation. At this time, air is blown into the solder dross collection tube 6 through the vacuuming mechanism 2. Just as the second piston 303 pushes the solder dross to the dross discharge port 304, the airflow can blow off the solder dross adhering to the second piston 303, preventing solder dross from remaining in the solder dross collection tube 6.

[0048] The above embodiments are merely one implementation of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A DIP component rework device, characterized in that, include: A frame, the frame including a top plate, the top plate having a limiting groove for placing a PCB board; Solder dross collection tube: After the solder on the PCB board that is used to fix the pins of DIP components to be repaired is heated and melted, the solder dross collection tube is used to collect the melted solder dross and to catch the detached DIP components. A suction pipe, the two ends of which are respectively connected to a limiting groove and a tin dross collection pipe; A vacuuming mechanism is used to create a vacuum inside the tin dross collection tube. Reversing mechanism; The vacuum pumping mechanism includes: Vacuum chamber; The first piston is slidably disposed in the vacuum chamber; The second drive mechanism is used to drive the first piston to reciprocate relative to the vacuum chamber. The first gas guide pipe is connected at both ends to the tin dross collection pipe and the vacuum box, respectively. The second gas guide tube; the two ends of the second gas guide tube are respectively connected to the vacuum chamber and the external environment; The first check valve is disposed on the first air guide pipe; The second check valve is installed on the second air guide pipe; There are two of each of the first and second gas guide pipes, and each first and second gas guide pipe is equipped with a solenoid valve. The first check valves on the two first gas guide pipes flow in opposite directions, and the second check valves on the two second gas guide pipes also flow in opposite directions. The two first gas guide pipes are connected to the slag collection pipe and the vacuum box through a connecting pipe, and the two second gas guide pipes are connected to the vacuum box and the external environment through a connecting pipe. The connection points of the two first gas guide pipes with the slag collection pipe correspond to the slag discharge port. The reversing mechanism includes: Common terminal block; When the common terminal and the first terminal are connected, the solenoid valves corresponding to the first air pipe flowing towards the vacuum box and the second air pipe flowing away from the vacuum box are energized. When the common terminal and the second terminal are connected, the solenoid valves corresponding to the first air pipe flowing away from the vacuum box and the second air pipe flowing towards the vacuum box are energized. The swing arm; the middle part of the swing arm is rotatably connected to a common terminal block; A pressing rod is used to abut against a pressing head at the end of the swing arm away from the common terminal; a second spring is fixedly connected to the end of the pressing rod away from the swing arm. Two levers are provided, and the two levers are located on the output end of the first drive mechanism; the two levers drive the swing arm to swing toward the first terminal and the second terminal respectively; The reversing mechanism also includes: The trigger lever has two components, each corresponding to a toggle lever. The two trigger levers respectively trigger the swing arm to swing toward the first terminal and the second terminal. Both sides of the trigger lever near the toggle lever are beveled. When the output end of the first drive mechanism extends, the toggle lever corresponding to the second terminal drives the trigger lever to trigger the swing arm to swing toward the second terminal. When the output end of the first drive mechanism retracts, the toggle lever corresponding to the first terminal drives the trigger lever to trigger the swing arm to swing toward the first terminal. The first spring is used to reset the trigger lever.

2. The DIP component rework device according to claim 1, characterized in that: It also includes a slag removal mechanism, which includes: The slag discharge port is located in the middle of the inclined tin slag collection pipe; The second piston is slidably disposed at the bottom of the tin dross collection tube; The first guide groove is formed on the tin dross collection pipe; A blocking plate, which is slidably disposed in the first guide groove, is used to block the slag discharge port; A through groove, wherein the through groove is formed on the blocking plate; The first driving mechanism is used to drive the second piston and the plug plate to reciprocate so that when the slag discharge port corresponds to the through slot, the second piston discharges the solder slag and DIP components out of the solder slag collection pipe.

3. The DIP component rework device according to claim 1, characterized in that, The diameter of the tin slag collection pipe is 4-6 times that of the exhaust pipe.

4. A DIP component rework device according to claim 2, characterized in that: A collection frame is installed directly below the slag discharge port.

5. A DIP component rework device according to claim 1, characterized in that: The limiting groove has a groove in the middle, and the two ends of the groove extend to the outside of the limiting groove.

Citation Information

Patent Citations

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    CN113500265A

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