A method for implementing high-order alignment of a circuit board in a display screen

Abstract

The application discloses a method for realizing high-order alignment of circuit boards in a display screen, comprising: setting an alignment base point in a to-be-pressed PCB board; the to-be-pressed PCB board comprises a functional area and non-functional areas located on opposite sides of the functional area; two non-functional areas are symmetrically provided with a locking edge assembly, and the locking edge assembly comprises a positioning protrusion and a positioning groove located on opposite sides of two adjacent to-be-pressed PCB boards; the to-be-pressed PCB board is placed in a pressing chamber, and alignment is performed by using a CCD vision auxiliary clamping assembly; and the to-be-pressed PCB board after alignment is locked through the locking edge assembly; the pressing chamber is pressed; and the above steps are repeated to perform multi-stage pressing. The alignment of the CCD vision auxiliary clamping assembly can accurately identify the alignment base point, the locking edge assembly can realize locking of a stacked structure, and thus the alignment accuracy in the high-order pressing process of the circuit board is ensured, and the high-order alignment accuracy of the circuit board is improved.

Description

Technical Field

[0001] This invention relates to the technical field of high-order alignment of circuit boards, and more particularly to a method for achieving high-order alignment of circuit boards in a display screen. Background Technology

[0002] As displays rapidly evolve towards higher resolution, higher density, and thinner designs, the bonding and interlayer interconnection processes between circuit boards (including PCBs, FPCs, and multi-layer HDI boards) and display panels place stringent demands on high-level alignment accuracy. Alignment accuracy directly determines the electrical performance, display effect, and product yield of the display. Currently, high-level alignment of display circuit boards mainly relies on traditional visual alignment or semi-automatic alignment methods, which are no longer suitable for the production needs of complex circuit boards such as multi-layer HDI boards and rigid-flex boards.

[0003] In existing technologies, circuit boards are prone to warping and dimensional expansion / contraction during multiple lamination processes, leading to misalignment of alignment marks and subsequent difficulties in bonding and interlayer alignment. Traditional alignment methods cannot accurately capture this dynamic deformation and can only compensate for fixed misalignments, resulting in further misalignment of alignment marks and difficulties in bonding and interlayer alignment. This is particularly unsuitable for easily deformable products such as flexible circuit boards and multi-level HDI boards. Furthermore, traditional alignment methods often use a small number of alignment marks for positioning and lack a full-process error traceability and compensation mechanism. In high-level circuit boards of level three and above, interlayer alignment errors accumulate with each layer, easily causing failures such as via ring breakage and short circuits, severely affecting the electrical performance and reliability of the product. Even a 0.05mm interlayer misalignment can lead to complete failure of high-speed signal integrity. Traditional visual alignment or semi-automatic alignment methods can either only achieve single-direction offset compensation and cannot take into account angular offset, or they have poor adaptability to different types and specifications of circuit boards, making it difficult to meet the alignment requirements of complex circuit boards such as FPC, rigid-flex boards, and multi-layer HDI boards. When switching products, it is necessary to readjust, which is time-consuming and labor-intensive.

[0004] These problems result in insufficient high-order alignment accuracy of circuit boards, low production efficiency, and low product yield, hindering the development of the high-end display industry. Therefore, developing a high-order alignment method for display circuit boards that can accurately compensate for deformation errors, adapt to complex circuit boards, and is highly efficient and reliable has become an urgent technical challenge to be solved. Summary of the Invention

[0005] This invention aims to at least partially solve one of the problems in related technologies. Therefore, one objective of this invention is to provide a method for achieving high-order alignment of circuit boards in a display screen. This method utilizes a CCD vision-assisted clamping component to accurately identify alignment base points, and a locking component to lock the stacked structure, thereby ensuring accurate alignment during high-order lamination and improving the accuracy of high-order alignment of the circuit board.

[0006] A method for achieving high-order alignment of circuit boards in a display screen includes: S1: Set alignment base points in the PCB board to be pressed; the PCB board to be pressed includes functional areas and non-functional areas located on opposite sides of the functional areas; two non-functional areas are symmetrically provided with locking edge components, the locking edge components include positioning protrusions and positioning grooves located on opposite sides of two adjacent PCB boards to be pressed. S2: Place the PCB board to be pressed into the pressing chamber and align it using a CCD vision-assisted clamping assembly; then lock the aligned PCB board to be pressed using the locking assembly. S3: Pressing is performed in the pressing chamber; S4: Repeat steps S2 and S3 to perform multi-stage pressing.

[0007] Furthermore, the outer side of the positioning protrusion and the inner side of the positioning groove are coated with polyurea elastomer coating, and after the polyurea elastomer coating is applied, the size of the positioning protrusion is larger than the size of the positioning groove.

[0008] Furthermore, the positioning protrusion and the positioning groove are corresponding conical structures, a U-shaped stress relief groove is provided at the connection position between the positioning protrusion and the PCB board to be pressed, and a U-shaped transition area is provided at the top of the positioning groove.

[0009] Furthermore, the CCD vision-assisted clamping assembly includes a CCD camera, an image processing unit, and a clamping part; the clamping part includes four opposing jaws, each jaw including a clamping link and slide rails located at both ends of the clamping link, the extension direction of the slide rails being parallel to the extension direction of the clamping link; a movable link is provided in the slide rail, the movable link being connected to both the first movable drive member and the second movable drive member; the first movable drive member can drive the movable link to slide along the slide rail, and the second movable drive member can drive the movable link to rotate within the slide rail, such that the movable link is parallel to or perpendicular to the clamping link.

[0010] Furthermore, after locking the aligned PCB board to be pressed using the locking assembly, the process further includes: Based on the thickness of the stacked structure formed by the PCB board to be pressed, the position of the moving link in the slide rail is determined, and the first moving drive unit drives the moving link to move to the corresponding position. The second moving drive unit drives the moving link to rotate to a position perpendicular to the clamping link. At this time, the clamping link and the moving links at both ends form a U-shaped clamping structure, which is used to lock the stacked structure.

[0011] Furthermore, there are five alignment base points, one of which is located at the center of the functional area, and the other four are located in the non-functional area, and are symmetrical with respect to the alignment base point at the center of the functional area.

[0012] Furthermore, during the lamination process, a combination of multispectral imaging and three-dimensional X-ray tomography is used to capture the warping and expansion / contraction data of the PCB board in real time.

[0013] Furthermore, a combination of multispectral imaging and three-dimensional X-ray tomography is employed, specifically including: S31: The alignment base point position in the upper PCB board is acquired by multispectral imaging, and the original three-dimensional structure is scanned by three-dimensional X-ray CT to establish a joint reference model of the stacked structure surface-internal. S32: During the pressing process, multispectral imaging records the surface displacement of the PCB board above based on the alignment base points, and three-dimensional X-ray CT scanning performs tomographic scanning at key nodes to form a synchronous timestamp aligned data stream; among them, the tomographic scanning of the three-dimensional X-ray CT scan at key nodes is performed sequentially according to the connection lines between the four alignment base points of the non-functional area. S33: Multispectral imaging is used to calculate the warpage of the stacked structure; three-dimensional X-ray CT scanning is used to analyze the difference in expansion and contraction between layers and to construct a stress field distribution map of the stacked structure.

[0014] Further, step S4 specifically includes: accumulating the interlayer offset and warpage during the multi-stage pressing process to obtain the cumulative interlayer offset and cumulative warpage after high-stage pressing; and performing corresponding compensation based on the cumulative interlayer offset and cumulative warpage in subsequent processes.

[0015] Furthermore, it also includes: S5: Remove non-functional areas.

[0016] The technical solutions provided in this application have the following advantages compared with the prior art: The PCB board to be laminated in this application includes a functional area and non-functional areas located on opposite sides of the functional area. Two non-functional areas are symmetrically equipped with locking components, each including a positioning protrusion and a positioning groove on opposite sides of two adjacent PCB boards to be laminated. The PCB board to be laminated is placed in the lamination chamber and aligned using a CCD vision-assisted clamping component. After alignment, the PCB board to be laminated is locked using the locking components. After precise alignment of the PCB board to be laminated using the CCD vision-assisted clamping component, adjacent PCB boards to be laminated are locked together using the locking structure to prevent interlayer misalignment during subsequent lamination. This application can accurately identify alignment base points through the CCD vision-assisted clamping component and lock the stacked structure through the locking components, thereby ensuring accurate alignment during high-order lamination and improving the accuracy of high-order alignment of the circuit board. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] In the attached image: Figure 1 This is a schematic diagram of the distribution of the alignment base points in an embodiment of this application; Figure 2 This is a schematic diagram of the side structure of the positioning protrusion in an embodiment of this application; Figure 3 This is a schematic diagram of the side structure of the positioning groove in an embodiment of this application; Figure 4 This is a schematic diagram showing the positions of the clamping link and the moving link when the clamping part is positioned in an embodiment of this application. Figure 5 This is a schematic diagram showing the positions of the clamping link and the moving link when the clamping part performs edge locking in an embodiment of this application; Figure 6 This is a flowchart illustrating the method for achieving high-order alignment of circuit boards in a display screen in Embodiment 2 of this application.

[0020] Reference numerals: 1. Functional area; 2. Non-functional area; 3. Alignment base point; 4. Positioning protrusion; 41. U-shaped stress relief groove; 5. Positioning groove; 51. U-shaped transition area; 6. Clamping link; 7. Moving link. Detailed Implementation

[0021] To provide a clearer understanding of the technical features, objectives, and effects of this invention, specific embodiments are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the referred mechanism or element must have a specific orientation; therefore, they should not be construed as limitations on this invention.

[0022] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "linking," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0023] In the following description, specific details such as particular system structures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0024] Example 1

[0025] This application provides a method for achieving high-order alignment of circuit boards in a display screen, comprising: S1: Alignment base point 3 is set in the PCB board to be pressed; the PCB board to be pressed includes functional area 1 and non-functional area 2 located on opposite sides of functional area 1; two non-functional areas 2 are symmetrically provided with locking edge components, the locking edge components include positioning protrusions 4 and positioning grooves 5 located on opposite sides of two adjacent PCB boards to be pressed. S2: Place the PCB board to be pressed into the pressing chamber and align it using a CCD vision-assisted clamping assembly; then lock the aligned PCB board to be pressed using the locking assembly. S3: Pressing is performed in the pressing chamber; S4: Repeat steps S2 and S3 to perform multi-stage pressing.

[0026] The PCB board to be pressed is placed in the pressing chamber and aligned using a CCD vision-assisted clamping assembly. After alignment, the PCB board to be pressed is locked using the locking assembly. After the precise alignment of the PCB board to be pressed using the CCD vision-assisted clamping assembly, the two adjacent PCB boards to be pressed are locked together using the locking structure to prevent interlayer displacement during subsequent pressing. This application can accurately identify the alignment base point 3 through the alignment of the CCD vision-assisted clamping assembly, and can lock the stacked structure through the locking assembly, thereby ensuring accurate alignment during high-order pressing and improving the high-order alignment accuracy of the circuit board.

[0027] Example 2

[0028] like Figure 6 As shown, a method for achieving high-order alignment of circuit boards in a display screen includes: S1: Set alignment base points 3 in the PCB board to be laminated. The PCB board to be laminated includes functional area 1 and non-functional areas 2 located on opposite sides of functional area 1. There are five alignment base points 3, one of which is located at the center of functional area 1, and the other four are located in non-functional areas 2, and are symmetrical with respect to the alignment base point 3 at the center of functional area 1, such as... Figure 1 As shown.

[0029] Two non-functional areas 2 are symmetrically equipped with edge-locking components. Each edge-locking component includes a positioning protrusion 4 and a positioning groove 5 located on opposite sides of two adjacent PCB boards to be pressed. The positioning protrusion 4 and the positioning groove 5 are corresponding conical structures. A U-shaped stress-relieving groove 41 is provided at the connection point between the positioning protrusion 4 and the PCB board to be pressed. A U-shaped transition area 51 is provided at the top of the positioning groove 5, forming a V+U composite structure. Figure 2 and Figure 3 As shown.

[0030] The U-shaped stress relief groove 41 can release the stress at the connection point between the positioning protrusion 4 and the PCB board to be pressed, preventing stress concentration at the connection point due to different degrees of expansion and contraction during the pressing process, which could cause the positioning protrusion 4 to break. The U-shaped transition area 51 can release the stress at the top of the positioning groove 5, preventing stress concentration at the top of the positioning groove 5 due to different degrees of expansion and contraction during the pressing process, which could cause cracking inside the positioning groove 5.

[0031] The outer side of the positioning protrusion 4 and the inner side of the positioning groove 5 are coated with polyurea elastomer paint. The polyurea elastomer paint has good elasticity. After the polyurea elastomer paint is applied, the size of the positioning protrusion 4 is slightly larger than the size of the positioning groove 5. This ensures that when the two are inserted and locked, the elastic force of the polyurea elastomer paint can achieve self-alignment and positioning of the positioning protrusion 4 and the positioning groove 5. At the same time, the polyurea elastomer paint can also serve as a buffer layer to release stress.

[0032] S2: Place the PCB board to be pressed into the pressing chamber and use a CCD vision-assisted clamping component for alignment.

[0033] The CCD vision-assisted clamping component in this application includes a CCD camera, an image processing unit, and a clamping part. The camera is used to identify and locate the alignment base points 3 on the PCB board to be pressed; based on the approximate position of the alignment base points 3 preset in the PCB design file, a search area is defined to narrow the search range and improve processing speed. The image processing unit first performs preprocessing on the image captured by the camera, including grayscale conversion, filtering and noise reduction, and adaptive threshold segmentation, to enhance the contrast between the alignment base points 3 and the background layer. The image processing unit then identifies the alignment base points 3 in the processed image and adjusts the position of the PCB board to be pressed.

[0034] In this application, the clamping part includes four opposing grippers. Each gripper includes a clamping link 6 and slide rails located at both ends of the clamping link 6. The extension direction of the slide rails is parallel to the extension direction of the clamping link 6. A movable link 7 is provided in the slide rail. The movable link 7 is connected to both the first movable drive member and the second movable drive member. The first movable drive member can drive the movable link 7 to slide along the slide rail to adjust the distance between the two movable links 7.

[0035] The second moving drive component can cause the moving link 7 to rotate within the slide rail, making the moving link 7 parallel to or perpendicular to the clamping link 6. When the moving link 7 rotates to be perpendicular to the clamping link 6, the moving link 7 extends towards the PCB board to be pressed, and the two moving links 7 respectively abut against the top and bottom of the stacked structure to achieve vertical locking of the stacked structure, which refers to the whole formed after the PCB boards to be pressed are aligned. When the moving link 7 rotates to be parallel to the clamping link 6, the moving link 7 and the clamping link 6 form a plane, which is used to adjust the position of the upper PCB board so that it moves to the target position.

[0036] Step S2 specifically includes: S21: The PCB boards to be pressed are placed sequentially in the pressing chamber. This application addresses multiple PCB boards to be pressed, selecting PCB boards of the same material. During pressing, the warp and weft directions of the PCB boards are aligned to ensure consistent expansion and contraction in the same direction for all PCB boards. By selecting appropriate materials and orientations, this application minimizes differences in expansion and contraction, avoiding excessive interlayer misalignment.

[0037] S22: Alignment is achieved using a CCD vision-assisted clamping component, specifically including: S221: Establish a global coordinate system based on the bottommost PCB board; and determine the target position coordinates of the five alignment base points 3 in the global coordinate system; S222: Identify alignment base point 3 in the upper PCB board, convert the image coordinates into the actual position in the mechanical coordinate system through camera calibration parameters; convert the image coordinates into pixel coordinates, convert the pixel coordinates into normalized coordinates in the camera coordinate system, convert the normalized coordinates in the camera coordinate system into a three-dimensional point in the world coordinate system, convert the world coordinate system into the mechanical coordinate system, and the coordinates in the mechanical coordinate system are the actual position coordinates in the upper PCB board. S223: Calculate the deviation between the actual position coordinates of the alignment base point 3 on the upper PCB board and the target position coordinates. Adjust the position of the upper PCB board by controlling the clamping part so that the actual position coordinates of the alignment base point and the target position coordinates coincide; thus, the precise alignment between the PCB boards to be pressed can be achieved.

[0038] In this step, the second moving drive component drives the moving link 7 to rotate to a position parallel to the clamping link 6. At this time, the clamping link 6 and the moving links 7 at both ends form a straight structure, which is used to adjust the position of the stacked structure. Figure 4 As shown.

[0039] S23: Lock the aligned PCB board to be pressed.

[0040] The locking here has two meanings. One is that the locking component of the non-functional area 2 is locked, that is, the positioning protrusion 4 is locked inside the positioning groove 5.

[0041] After the locking assembly is locked, the entire stacked structure is locked by the moving link 7 and the clamping link 6 in the clamping part. Once the PCBs to be pressed are aligned, the position of the moving link 7 in the slide rail is determined according to the thickness of the stacked structure. The first moving drive component moves the moving link 7 to the corresponding position; the second moving drive component rotates the moving link 7 to a position perpendicular to the clamping link 6. At this time, the clamping link 6 and the moving links 7 at both ends form a U-shaped clamping structure for locking the stacked structure. Figure 5 As shown.

[0042] S3: The pressing chamber performs the pressing process; during the pressing process, a combination of multispectral imaging and three-dimensional X-ray tomography is used to capture real-time dynamic deformation data of the PCB board, such as warpage and expansion / contraction, during processing; specifically including: S31: The position of alignment base point 3 in the upper PCB board is acquired by multispectral imaging, and the original three-dimensional structure is scanned by three-dimensional X-ray CT to establish a joint reference model of the stacked structure surface-internal. S32: During the pressing process, multispectral imaging records the surface displacement of the PCB board above based on the alignment base point 3, and three-dimensional X-ray CT scanning performs tomographic scanning at key nodes to form a synchronous timestamp aligned data stream.

[0043] In this application, the four alignment base points 3 of the non-functional area 2 are connected in pairs to form lines in the length direction, width direction and two diagonal directions of the PCB board. The tomographic scan of the key node of the three-dimensional X-ray CT scan is performed sequentially according to the connection lines of the four alignment base points 3 of the non-functional area 2. In this way, the offset error in the length direction, width direction and two diagonal directions of the PCB board can be obtained.

[0044] S33: Multispectral imaging is used to calculate the warpage of the stacked structure; three-dimensional X-ray CT scanning is used to analyze the difference in expansion and contraction between layers and to construct a stress field distribution map of the stacked structure.

[0045] Specifically, multispectral imaging performs gridded analysis on multiple regions of the entire plate, generating a surface height difference thermal map that visually displays the area of ​​maximum deformation and directional expansion and contraction.

[0046] Three-dimensional X-ray CT scanning uses a filtered back projection algorithm or iterative reconstruction technology to reconstruct the projection data into a high-resolution three-dimensional volume data model. Three-dimensional X-ray CT scanning calculates the interlayer misalignment by using the three-dimensional coordinates of the four alignment base points 3 of the non-functional area 2, performs three-dimensional registration of the scan data before and after heating, and quantifies the expansion and contraction rates of each PCB board in length, width and two diagonal directions.

[0047] S4: Repeat steps S2 and S3 to perform multi-stage pressing, and accumulate the interlayer offset and warpage during the multi-stage pressing process to obtain the cumulative interlayer offset and cumulative warpage after high-stage pressing; in subsequent processes, corresponding compensation is performed based on the cumulative interlayer offset and cumulative warpage.

[0048] This application abandons the traditional fixed offset compensation mode, and instead compensates accordingly in subsequent processes by accumulating interlayer offset and cumulative warpage. It can accurately compensate for the offset of alignment marks caused by deformation, improve the alignment accuracy to the micron level, and stably adapt to the alignment requirements of easily deformable products such as flexible circuit boards and multi-level HDI boards, thereby reducing bonding and interlayer alignment difficulties caused by deformation from the source.

[0049] S5: Remove non-functional area 2. Since lamination has already been performed, meaning the positions between adjacent PCB boards have been fixed by the prepreg, removing non-functional area 2 at this point removes the edge-locking assembly and the four alignment base points 3, preventing them from interfering with subsequent components.

[0050] This application utilizes a combination of multispectral imaging and three-dimensional X-ray tomography, using alignment reference points to precisely quantify the expansion and contraction rates of each PCB layer in length, width, and two diagonal directions. This improves alignment accuracy to the micrometer level, effectively solving the problems of bonding and interlayer alignment difficulties caused by mark offset. Combined with full-process error traceability and cumulative compensation technology, it effectively controls the accumulation of interlayer errors in third-order and higher-order circuit boards, avoiding failures such as via ring breakage and short circuits, significantly improving the electrical performance and product reliability of the circuit board, and ensuring the display effect of high-end displays.

[0051] This application's integrated high-efficiency alignment and real-time detection technology achieves millisecond-level rapid alignment, shortening alignment preparation and execution time while eliminating additional detection steps. It quickly locates alignment defects, reduces manual intervention, and effectively improves production efficiency. The synergistic effect of various technical solutions reduces alignment defect rates and product rework rates, improves product yield, and consequently lowers production costs, meeting the demands of large-scale mass production of high-end displays. This invention is adaptable to high-end circuit boards with easily deformable and complex structures, solving the technical challenges of traditional alignment methods. It balances accuracy, efficiency, and economy, and can be widely applied to the alignment process of circuit boards for high-resolution, high-density, and thin displays. It is compatible with various packaging processes such as COB and SMD, possessing strong practical application value and promising industry prospects.

[0052] It is understood that the above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of the present invention, and can also make several modifications and improvements, all of which fall within the protection scope of the present invention. Therefore, all equivalent transformations and modifications made with respect to the scope of the claims of the present invention should fall within the scope of the claims of the present invention.

Claims

1. A method for achieving high-order alignment of circuit boards in a display screen, characterized in that, include: S1: Set alignment base points in the PCB board to be pressed; the PCB board to be pressed includes functional areas and non-functional areas located on opposite sides of the functional areas; two non-functional areas are symmetrically provided with locking edge components, the locking edge components include positioning protrusions and positioning grooves located on opposite sides of two adjacent PCB boards to be pressed. S2: Place the PCB board to be pressed into the pressing chamber and align it using a CCD vision-assisted clamping assembly; then lock the aligned PCB board to be pressed using the locking assembly. S3: Pressing is performed in the pressing chamber; S4: Repeat steps S2 and S3 to perform multi-stage pressing.

2. The method for achieving high-order alignment of circuit boards in a display screen according to claim 1, characterized in that, The outer side of the positioning protrusion and the inner side of the positioning groove are coated with polyurea elastomer coating. After the polyurea elastomer coating is applied, the size of the positioning protrusion is larger than the size of the positioning groove.

3. The method for achieving high-order alignment of circuit boards in a display screen according to claim 1, characterized in that, The positioning protrusion and positioning groove are corresponding conical structures. A U-shaped stress relief groove is provided at the connection position between the positioning protrusion and the PCB board to be pressed. A U-shaped transition area is provided at the top of the positioning groove.

4. A method for achieving high-order alignment of circuit boards in a display screen according to claim 1, characterized in that, The CCD vision-assisted clamping assembly includes a CCD camera, an image processing unit, and a clamping part. The clamping part includes four opposing grippers, each gripper including a clamping link and slide rails located at both ends of the clamping link. The extension direction of the slide rails is parallel to the extension direction of the clamping link. A movable link is provided in the slide rail, which is connected to both a first movable drive member and a second movable drive member. The first movable drive member can drive the movable link to slide along the slide rail, and the second movable drive member can drive the movable link to rotate within the slide rail, so that the movable link is parallel to or perpendicular to the clamping link.

5. A method for achieving high-order alignment of circuit boards in a display screen according to claim 4, characterized in that, After the aligned PCB board to be pressed is locked by the locking assembly, the process also includes: Based on the thickness of the stacked structure formed by the PCB board to be pressed, the position of the moving link in the slide rail is determined, and the first moving drive unit drives the moving link to move to the corresponding position. The second moving drive unit drives the moving link to rotate to a position perpendicular to the clamping link. At this time, the clamping link and the moving links at both ends form a U-shaped clamping structure, which is used to lock the stacked structure.

6. A method for achieving high-order alignment of circuit boards in a display screen according to claim 1, characterized in that, There are five alignment base points, one of which is located at the center of the functional area, and the other four are located in the non-functional area and are symmetrical with respect to the alignment base point at the center of the functional area.

7. A method for achieving high-order alignment of circuit boards in a display screen according to claim 6, characterized in that, During the lamination process, a combination of multispectral imaging and three-dimensional X-ray tomography is used to capture the warping and expansion / contraction data of the PCB board in real time.

8. A method for achieving high-order alignment of circuit boards in a display screen according to claim 7, characterized in that, The method employs a combination of multispectral imaging and three-dimensional X-ray tomography, specifically including: S31: The alignment base point position in the upper PCB board is acquired by multispectral imaging, and the original three-dimensional structure is scanned by three-dimensional X-ray CT to establish a joint reference model of the stacked structure surface-internal. S32: During the pressing process, multispectral imaging records the surface displacement of the PCB board above based on the alignment base points, and three-dimensional X-ray CT scanning performs tomographic scanning at key nodes to form a synchronous timestamp aligned data stream; among them, the tomographic scanning of the three-dimensional X-ray CT scan at key nodes is performed sequentially according to the connection lines between the four alignment base points of the non-functional area. S33: Multispectral imaging is used to calculate the warpage of the stacked structure; three-dimensional X-ray CT scanning is used to analyze the difference in expansion and contraction between layers and to construct a stress field distribution map of the stacked structure.

9. A method for achieving high-order alignment of circuit boards in a display screen according to claim 1, characterized in that, Step S4 specifically includes: accumulating the interlayer offset and warpage during the multi-stage pressing process to obtain the cumulative interlayer offset and cumulative warpage after high-stage pressing; and performing corresponding compensation based on the cumulative interlayer offset and cumulative warpage in subsequent processes.

10. A method for achieving high-order alignment of circuit boards in a display screen according to claim 1, characterized in that, Also includes: S5: Remove non-functional areas.

Images