Three-dimensional heat transfer device

Abstract

A three-dimensional heat transfer device is adapted to be thermally coupled to a heat source and includes a heat conducting shell, at least one first heat pipe and at least one second heat pipe. The heat conducting shell has a gas-tight chamber and a thermal contact surface. The thermal contact surface faces away from the gas-tight chamber and is thermally coupled to the heat source. The at least one first heat pipe is arranged in the heat conducting shell and communicates with the gas-tight chamber. The at least one second heat pipe is arranged in the heat conducting shell and communicates with the gas-tight chamber. The cross section of the at least one first heat pipe relative to the heat conducting shell is different from the cross section of the at least one second heat pipe relative to the heat conducting shell, so that when air flow is guided to a main heat dissipation area by the at least one first heat pipe and the at least one second heat pipe, air flow with different flow directions can be generated in the main heat dissipation area.

Description

Technical Field

[0001] This invention relates to a heat transfer device, and more particularly to a three-dimensional heat transfer device. Background Technology

[0002] The technical principle of a vapor chamber is similar to that of a heat pipe, but the heat conduction method differs. A heat pipe uses one-dimensional linear heat conduction, while heat in a vapor chamber is conducted over a two-dimensional surface, resulting in higher efficiency. Specifically, a vapor chamber mainly consists of a cavity with a hollow chamber inside, which is filled with a working fluid. The heated portion of the cavity is called the evaporation zone. The portion that dissipates heat is called the condensation zone. The working fluid absorbs heat and vaporizes in the evaporation zone, rapidly expanding throughout the cavity. In the condensation zone, it releases heat and condenses into a liquid state. Then, the liquid working fluid returns to the evaporation zone, forming a cooling cycle.

[0003] Generally, most vapor chambers and heat pipes operate independently, resulting in individual planar or linear heat transfer for each vapor chamber or heat pipe, rather than integrated three-dimensional heat transfer, thus limiting their heat dissipation efficiency. Some manufacturers have integrated vapor chambers and heat pipes to create three-dimensional heat transfer devices. However, the heat transfer efficiency of current three-dimensional heat transfer devices remains insufficient due to limitations such as server height, overall system space, and airflow conditions. Furthermore, the farther the fins are from the heat source, the lower their heat dissipation efficiency, further contributing to the inefficiency of the three-dimensional heat transfer device. In other words, more fins are not necessarily better; the focus should be on improving fin heat dissipation efficiency. Therefore, how to further improve the heat dissipation efficiency of three-dimensional heat transfer devices is one of the problems that researchers should address. Summary of the Invention

[0004] The present invention provides a three-dimensional heat transfer device that guides airflow to the main heat dissipation area by configuring the shape, number and position of heat pipes to achieve efficient heat dissipation, thereby further improving the heat dissipation efficiency of the fins of the three-dimensional heat transfer device.

[0005] An embodiment of the present invention discloses a three-dimensional heat transfer device suitable for thermal coupling to a heat source, and includes a heat-conducting shell, at least one first heat pipe, and at least one second heat pipe. The heat-conducting shell has an airtight chamber and a thermal contact surface. The thermal contact surface faces away from the airtight chamber and is thermally coupled to the heat source. At least one first heat pipe is disposed in the heat-conducting shell and communicates with the airtight chamber. At least one second heat pipe is disposed in the heat-conducting shell and communicates with the airtight chamber. The cross-section of the at least one first heat pipe relative to the heat-conducting shell is different from the cross-section of the at least one heat pipe relative to the heat-conducting shell, so as to guide airflow to a main heat dissipation area corresponding to the thermal contact surface through the at least one first heat pipe and the at least one second heat pipe.

[0006] In the aforementioned three-dimensional heat transfer device, the heat-conducting shell includes a first shell and a second shell, the second shell being mounted on the first shell so that the first shell and the second shell together form the airtight chamber, and the at least one first heat pipe and the at least one second heat pipe are connected to the second shell of the heat-conducting shell.

[0007] In the aforementioned three-dimensional heat transfer device, the cross-sectional dimensions of the at least one first heat pipe relative to the second housing are different from the cross-sectional dimensions of the at least one second heat pipe relative to the second housing.

[0008] In the aforementioned three-dimensional heat transfer device, the cross-sectional area of ​​the at least one first heat pipe is less than or equal to 80% of the cross-sectional area of ​​the at least one second heat pipe.

[0009] In the aforementioned three-dimensional heat transfer device, the shape of the cross-section of the at least one first heat pipe relative to the second shell is different from the shape of the cross-section of the at least one second heat pipe relative to the second shell.

[0010] In the aforementioned three-dimensional heat transfer device, both the at least one first heat pipe and the at least one second heat pipe are elliptical, and the flatness of the cross-section of the at least one first heat pipe is different from the flatness of the cross-section of the at least one second heat pipe.

[0011] In the aforementioned three-dimensional heat transfer device, the cross-sectional shape of the at least one first heat pipe and the at least one second heat pipe is an airfoil, an ellipse, or a gear.

[0012] The aforementioned three-dimensional heat transfer device further includes at least one third heat pipe disposed on the second housing and connected to the airtight chamber. The cross-section of the at least one third heat pipe relative to the second housing is different from the cross-section of the at least one first heat pipe relative to the second housing and the cross-section of the at least one second heat pipe relative to the second housing.

[0013] In the aforementioned three-dimensional heat transfer device, the at least one third heat pipe is located in the main heat dissipation area, the main heat dissipation area corresponds to the heat contact surface, the number of the at least one first heat pipe and the at least one second heat pipe is multiple, and they are respectively located on opposite sides of the at least one third heat pipe, and the second heat pipes located on the same side of the at least one third heat pipe are located between the first heat pipes and the at least one third heat pipe.

[0014] In the aforementioned three-dimensional heat transfer device, the flatness of the first heat pipes is greater than that of the second heat pipes, and the flatness of the second heat pipes is greater than that of the at least one third heat pipe.

[0015] The aforementioned three-dimensional heat transfer device further includes multiple fourth heat pipes and multiple fifth heat pipes. The number of at least one third heat pipe is multiple. The first to fifth heat pipes are arranged in sequence, and the cross-sectional dimensions of the first to fifth heat pipes gradually increase in sequence.

[0016] The present invention also provides a three-dimensional heat transfer device, wherein it is suitable for thermal coupling to a heat source, the three-dimensional heat transfer device comprising:

[0017] A heat-conducting shell has an airtight chamber and a thermal contact surface, the thermal contact surface facing away from the airtight chamber and thermally coupled to the heat source;

[0018] At least one first heat pipe is disposed in the heat-conducting shell and communicates with the airtight chamber; and

[0019] At least one second heat pipe is disposed in the heat-conducting shell and connected to the airtight chamber;

[0020] The cross-section of the at least one first heat pipe relative to the heat-conducting shell is the same as the cross-section of the at least one second heat pipe relative to the heat-conducting shell, so as to guide airflow to a main heat dissipation area through the at least one first heat pipe and the at least one second heat pipe.

[0021] In the aforementioned three-dimensional heat transfer device, the heat-conducting shell includes a first shell and a second shell, the second shell being mounted on the first shell so that the first shell and the second shell together form the airtight chamber, and the at least one first heat pipe and the at least one second heat pipe are connected to the second shell of the heat-conducting shell.

[0022] In the aforementioned three-dimensional heat transfer device, both the at least one first heat pipe and the at least one second heat pipe are elliptical, and the flatness of the cross-section of the at least one first heat pipe is the same as the flatness of the cross-section of the at least one second heat pipe.

[0023] The aforementioned three-dimensional heat transfer device further includes at least one third heat pipe disposed on the second housing and connected to the airtight chamber. The cross-section of the at least one third heat pipe relative to the second housing, the cross-section of the at least one first heat pipe relative to the second housing, and the cross-section of the at least one second heat pipe relative to the second housing are the same.

[0024] In the aforementioned three-dimensional heat transfer device, the at least one third heat pipe is located in the main heat dissipation area, the main heat dissipation area corresponds to the heat contact surface, the number of the at least one first heat pipe and the at least one second heat pipe is multiple, and they are respectively located on opposite sides of the at least one third heat pipe, and the second heat pipes located on the same side of the at least one third heat pipe are located between the first heat pipes and the at least one third heat pipe.

[0025] In the aforementioned three-dimensional heat transfer device, the flatness of the first heat pipes, the flatness of the second heat pipes, and the flatness of the at least one third heat pipe are the same.

[0026] The aforementioned three-dimensional heat transfer device further includes multiple fourth heat pipes and multiple fifth heat pipes, and the number of at least one third heat pipe is multiple, with the first to fifth heat pipes arranged in sequence.

[0027] In the aforementioned three-dimensional heat transfer device, the cross-sections of the at least one first heat pipe, the at least one second heat pipe, and the at least one third heat pipe are in the shape of an airfoil, an ellipse, a circle, or a gear.

[0028] According to the three-dimensional heat transfer device of the above embodiment, since the cross-sections of these heat pipes are different from those of the heat-conducting shell, and the airflow is guided to the main heat dissipation area of ​​the corresponding thermal contact surface through these heat pipes, the airflow can flow more efficiently through the high-temperature area in the three-dimensional heat transfer device, thereby improving the heat exchange efficiency. In this way, the heat dissipation efficiency of the three-dimensional heat transfer device can be improved.

[0029] The above description of the content of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention. Attached Figure Description

[0030] Figure 1 This is a three-dimensional schematic diagram of the three-dimensional heat transfer device according to the first embodiment of the present invention.

[0031] Figure 2 for Figure 1 An exploded view of a three-dimensional heat transfer device.

[0032] Figure 3 for Figure 1 A cross-sectional schematic diagram of the heat pipes in a three-dimensional heat transfer device.

[0033] Figure 4 This is a three-dimensional schematic diagram of the three-dimensional heat transfer device according to the second embodiment of the present invention.

[0034] Figure 5 for Figure 4 A cross-sectional schematic diagram of the heat pipes in a three-dimensional heat transfer device.

[0035] Figure 6 This is a three-dimensional schematic diagram of the three-dimensional heat transfer device according to the third embodiment of the present invention.

[0036] Figure 7 for Figure 6 A cross-sectional schematic diagram of the heat pipes in a three-dimensional heat transfer device.

[0037] Figure 8This is a three-dimensional schematic diagram of the three-dimensional heat transfer device according to the fourth embodiment of the present invention.

[0038] Figure 9 for Figure 8 A cross-sectional schematic diagram of the heat pipes in a three-dimensional heat transfer device.

[0039] In the attached figures, the following labels are used:

[0040] 10, 10A, 10D, 10E: Three-dimensional heat transfer device

[0041] 11: Thermal conductive shell

[0042] 111: First shell component

[0043] 112: Second shell

[0044] 113: Thermal contact surface

[0045] 12, 12A, 12D, 12E: First heat pipe

[0046] 121, 121A, 121D, 121E: Cross-sections

[0047] 13, 13A, 13D, 13E: Second heat pipe

[0048] 131, 131A, 131D, 131E: Cross-sections

[0049] 14, 14A, 14D, 14E: Third heat pipe

[0050] 141, 141A, 141D, 141E: Cross-sections

[0051] 15D: Fourth heat pipe

[0052] 151D: Cross-section

[0053] 16D: Fifth heat pipe

[0054] 161D: Cross section

[0055] M: Main heat dissipation area

[0056] S: Airtight chamber

[0057] R1, R2, R3: Major axis

[0058] r1, r2, r3: minor axis Detailed Implementation

[0059] Please see Figures 1 to 3 . Figure 1 This is a three-dimensional schematic diagram of the three-dimensional heat transfer device according to the first embodiment of the present invention. Figure 2 for Figure 1An exploded view of a three-dimensional heat transfer device. Figure 3 for Figure 1 A cross-sectional schematic diagram of the heat pipes in a three-dimensional heat transfer device.

[0060] The three-dimensional heat transfer device 10 of this embodiment is suitable for thermal coupling to a heat source (not shown). Thermal coupling refers to thermal contact or connection through other heat-conducting media. The three-dimensional heat transfer device 10 includes a heat-conducting shell 11, a plurality of first heat pipes 12, a plurality of second heat pipes 13, and a third heat pipe 14. The heat-conducting shell 11 includes a first shell member 111 and a second shell member 112. The second shell member 112 is mounted on the first shell member 111, such that the first shell member 111 and the second shell member 112 together form an airtight chamber S. In addition, the heat-conducting shell 11 has a thermal contact surface 113. The thermal contact surface 113 faces away from the airtight chamber S and is used for thermal coupling to the heat source.

[0061] The first heat pipes 12, the second heat pipes 13, and the third heat pipe 14 are arranged in parallel on the second housing 112 and communicate with the airtight chamber S. The first heat pipes 12 and the second heat pipes 13 are located on opposite sides of the third heat pipe 14, and the second heat pipes 13 located on the same side of the third heat pipe 14 are located between the first heat pipes 12 and the third heat pipe 14.

[0062] The cross-sections 121 of the first heat pipes 12 relative to the second housing 112, the cross-sections 131 of the second heat pipes 13 relative to the second housing 112, and the cross-sections 141 of the third heat pipe 14 relative to the second housing 112 are, for example, different. For instance, the shape of the cross-sections 121 of the first heat pipes 12 and the shape of the cross-sections 131 of the second heat pipes 13 are elliptical, and the shape of the cross-sections 141 of the third heat pipe 14 is circular.

[0063] Each of the first heat pipes 12 has a cross-section 121, each of the second heat pipes 13 has a cross-section 131, and each of the third heat pipes 14 has a cross-section 141, each having a major axis R1, R2, R3 and a minor axis r1, r2, r3. The ratio of the major axis R1 to the minor axis r1 in the cross-section 121 of each of the first heat pipes 12 is, for example, greater than the ratio of the major axis R2 to the minor axis r2 in the cross-section 131 of each of the second heat pipes 13, and the ratio of the major axis R2 to the minor axis r2 in the cross-section 131 of each of the second heat pipes 13 is, for example, greater than the ratio of the major axis R3 to the minor axis r3 in the cross-section 141 of the third heat pipe 14. In other words, the flatness of the cross-section 121 of the first heat pipes 12 is, for example, greater than the flatness of the cross-section 131 of the second heat pipes 13, and the flatness of the cross-section 131 of the second heat pipes 13 is, for example, greater than the flatness of the cross-section 141 of the third heat pipe 14.

[0064] The first heat pipe 12, the second heat pipe 13, and the third heat pipe 14 can guide airflow to a main heat dissipation area M, for example, corresponding to the thermal contact surface 113. "Corresponding" means that the main heat dissipation area M is located within the area projected from the thermal contact surface 113 onto the second housing 112. The main heat dissipation area M is, for example, a region with a higher temperature in the corresponding heat source, and the third heat pipe 14 is located within the main heat dissipation area M to dissipate heat from it.

[0065] In this embodiment, the advantage of having different flatness of the cross-section 121 of the first heat pipes 12, the cross-section 131 of the second heat pipes 13, and the cross-section 141 of the third heat pipe 14 is that the difference in the shape of these heat pipes 12-14 allows for a change in the direction of airflow (not shown) through them. For example, when airflow passes through the main heat dissipation area M, it is easier to generate turbulent airflow direction, thereby improving the efficiency of heat exchange. In this way, the heat dissipation efficiency of the three-dimensional heat transfer device 10 can be improved.

[0066] In this embodiment, the three-dimensional heat transfer device 10 may further include multiple fins (not shown). These fins are arranged, for example, along the extension direction of heat pipes 12, 13, and 14, but are not limited thereto. By providing these fins and guiding airflow to the main heat dissipation area M through the shape, number, and position of heat pipes 12, 13, and 14, heat sources can be dissipated efficiently. In this way, the heat dissipation efficiency of the fins of the three-dimensional heat transfer device 10 can be further improved.

[0067] In this embodiment, there are multiple first heat pipes 12 and multiple second heat pipes 13, and only one third heat pipe 14, but this is not a limitation. In other embodiments, there may be only one first heat pipe and only one second heat pipe, and there may be multiple third heat pipes.

[0068] In this embodiment, the cross-sectional shape 121 of the first heat pipes 12 and the cross-sectional shape 131 of the second heat pipes 13 are elliptical, and the cross-sectional shape 141 of the third heat pipe 14 is circular, but this is not a limitation. In other embodiments, the cross-sectional shapes of the first heat pipes, the second heat pipes, and the third heat pipe may also be wing-shaped or gear-shaped.

[0069] In this embodiment, the main heat dissipation area M corresponds to the thermal contact surface 113, but this is not a limitation. In other embodiments, the main heat dissipation area may not correspond to a thermal contact surface.

[0070] In the first embodiment, the cross-sections 121 of the first heat pipes 12 relative to the second housing 112, the cross-sections 131 of the second heat pipes 13 relative to the second housing 112, and the cross-sections 141 of the third heat pipe 14 relative to the second housing 112 are different, but this is not a limitation. For other embodiments, please refer to... Figure 4 and Figure 5 . Figure 4 This is a three-dimensional schematic diagram of the three-dimensional heat transfer device according to the second embodiment of the present invention. Figure 5 for Figure 4 A cross-sectional schematic diagram of the heat pipes in a three-dimensional heat transfer device.

[0071] The three-dimensional heat transfer device 10A of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10A includes a heat-conducting shell 11, a plurality of first heat pipes 12A, a plurality of second heat pipes 13A, and a third heat pipe 14A. The heat-conducting shell 11 includes a first shell member 111 and a second shell member 112. The second shell member 112 is mounted on the first shell member 111.

[0072] The first heat pipes 12A, the second heat pipes 13A, and the third heat pipe 14A are disposed on the second housing 112. The first heat pipes 12A and the second heat pipes 13A are respectively located on opposite sides of the third heat pipe 14A, and the second heat pipes 13A located on the same side of the third heat pipe 14A are located between the first heat pipes 12A and the third heat pipe 14A.

[0073] The cross-sections 121A of the first heat pipes 12A relative to the second housing 112, the cross-sections 131A of the second heat pipes 13A relative to the second housing 112, and the cross-sections 141A of the third heat pipe 14A relative to the second housing 112 are, for example, identical. For instance, the shapes of the cross-sections 121A of the first heat pipes 12A, the cross-sections 131A of the second heat pipes 13A, and the cross-sections 141A of the third heat pipe 14A are, for example, wing-like.

[0074] In this embodiment, the shape of the cross-section 121A of the first heat pipes 12A, the cross-section 131A of the second heat pipes 13A, and the cross-section 141A of the third heat pipe 14A are shaped like wings. This has the advantage that when airflow passes through the main heat dissipation area M, the wing-shaped heat pipes 12A-14A can more effectively improve heat exchange efficiency. In this way, the heat dissipation efficiency of the three-dimensional heat transfer device 10A can be improved.

[0075] The first heat pipe 12A, the second heat pipe 13A, and the third heat pipe 14A can guide airflow to a main heat dissipation area M corresponding to the thermal contact surface 113. The main heat dissipation area M is, for example, a region with a higher temperature in the corresponding heat source, and the third heat pipe 14A is located in the main heat dissipation area M to dissipate heat from the main heat dissipation area M.

[0076] Please see Figure 6 and Figure 7 . Figure 6 This is a three-dimensional schematic diagram of the three-dimensional heat transfer device according to the third embodiment of the present invention. Figure 7 for Figure 6 A cross-sectional schematic diagram of the heat pipes in a three-dimensional heat transfer device.

[0077] The three-dimensional heat transfer device 10D of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10D includes a heat-conducting shell 11, a plurality of first heat pipes 12D, a plurality of second heat pipes 13D, a plurality of third heat pipes 14D, a plurality of fourth heat pipes 15D, and a plurality of fifth heat pipes 16D. The heat-conducting shell 11 includes a first shell 111 and a second shell 112. The second shell 112 is mounted on the first shell 111.

[0078] These first heat pipes 12D to these fifth heat pipes 16D are disposed on the second housing 112 and arranged in sequence. The dimensions of the first heat pipes 12D relative to the cross section 121D of the second housing 112 to the dimensions of the fifth heat pipes 16D relative to the cross section 161D of the second housing 112 are, for example, different.

[0079] For example, the cross-sectional areas of the first heat pipes 12 (121D) to the fifth heat pipes 16 (161D) increase sequentially, and the cross-sectional area of ​​the first heat pipes 12 (121D) is, for example, less than or equal to 20% of the cross-sectional area of ​​the second heat pipes 13 (131D), the cross-sectional area of ​​the second heat pipes 13 (131D) is, for example, less than or equal to 80% of the cross-sectional area of ​​the third heat pipes 14 (141D), the cross-sectional area of ​​the third heat pipes 14 (141D) is, for example, less than or equal to 80% of the cross-sectional area of ​​the fourth heat pipes 15 (151D), and the cross-sectional area of ​​the fourth heat pipes 15 (151D) is, for example, less than or equal to 80% of the cross-sectional area of ​​the fifth heat pipes 16 (161D). In this way, the heat dissipation efficiency of the three-dimensional heat transfer device 10D can be improved.

[0080] The first heat pipes 12D to the fifth heat pipes 16D can guide airflow to a main heat dissipation area M corresponding to the thermal contact surface 113. The main heat dissipation area M is, for example, a region with a higher temperature in the corresponding heat source, and some of the third heat pipes 14D are located in the main heat dissipation area M to dissipate heat from the main heat dissipation area M.

[0081] In this embodiment, the cross-sections of the first heat pipes 12D to the fifth heat pipes 16D gradually increase, but this is not a limitation. In other embodiments, the cross-sections of the first heat pipes to the fifth heat pipes may also increase from opposite ends of the second housing towards the center of the second housing.

[0082] In the first embodiment, the cross-sections 121 of the first heat pipes 12 relative to the second housing 112, the cross-sections 131 of the second heat pipes 13 relative to the second housing 112, and the cross-sections 141 of the third heat pipe 14 relative to the second housing 112 are different, but this is not a limitation. For other embodiments, please refer to... Figure 8 and Figure 9 . Figure 8 This is a three-dimensional schematic diagram of the three-dimensional heat transfer device according to the fourth embodiment of the present invention. Figure 9 for Figure 8 A cross-sectional schematic diagram of the heat pipes in a three-dimensional heat transfer device.

[0083] The three-dimensional heat transfer device 10E of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment. Therefore, the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10E includes a heat-conducting shell 11, a plurality of first heat pipes 12E, a plurality of second heat pipes 13E, and a third heat pipe 14E. The heat-conducting shell 11 includes a first shell member 111 and a second shell member 112. The second shell member 112 is mounted on the first shell member 111.

[0084] The first heat pipes 12E, the second heat pipes 13E, and the third heat pipe 14E are disposed on the second housing 112. The first heat pipes 12E and the second heat pipes 13E are respectively located on opposite sides of the third heat pipe 14E, and the second heat pipes 13E located on the same side of the third heat pipe 14E are located between the first heat pipes 12E and the third heat pipe 14E.

[0085] The cross-sections 121E of the first heat pipes 12E relative to the second housing 112, the cross-sections 131E of the second heat pipes 13E relative to the second housing 112, and the cross-sections 141E of the third heat pipe 14E relative to the second housing 112 are, for example, identical. For instance, the shapes of the cross-sections 121E of the first heat pipes 12E, the cross-sections 131E of the second heat pipes 13E, and the cross-sections 141E of the third heat pipe 14E are, for example, circular.

[0086] The first heat pipe 12E, the second heat pipe 13E, and the third heat pipe 14E can guide airflow to a main heat dissipation area M corresponding to the thermal contact surface 113. The main heat dissipation area M is, for example, a region with a higher temperature in the corresponding heat source, and some of the third heat pipes 14E are located in the main heat dissipation area M to dissipate heat from the main heat dissipation area M.

[0087] Furthermore, since the second heat pipes 13E and the third heat pipes 14E are densely arranged in and around the main heat dissipation area M, the heat pipe density in the higher temperature area of ​​the three-dimensional heat transfer device 10E is high. This allows the cooling fluid to exchange heat densely in the airtight chamber S and the heat pipes located in the higher temperature area, thereby reducing the amount of cooling fluid flowing to the lower temperature area for heat exchange. This shortens the cooling circulation path of the cooling fluid (not shown) in the three-dimensional heat transfer device 10E, thus improving the heat dissipation efficiency of the three-dimensional heat transfer device 10E.

[0088] According to the three-dimensional heat transfer device of the above embodiment, since the cross-sections of these heat pipes are different from those of the heat-conducting shell, and the airflow is guided to the main heat dissipation area of ​​the corresponding thermal contact surface through these heat pipes, the airflow can flow more efficiently through the high-temperature area in the three-dimensional heat transfer device, thereby improving the heat exchange efficiency. In this way, the heat dissipation efficiency of the three-dimensional heat transfer device can be improved.

[0089] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A three-dimensional heat transfer device, characterized in that, Suitable for thermal coupling to a heat source, the three-dimensional heat transfer device includes: A heat-conducting shell has an airtight chamber and a thermal contact surface, the thermal contact surface facing away from the airtight chamber and thermally coupled to the heat source; At least one first heat pipe is disposed in the heat-conducting shell and communicates with the airtight chamber; and At least one second heat pipe is disposed in the heat-conducting shell and connected to the airtight chamber; Specifically, by setting the cross-section of the at least one first heat pipe relative to the heat-conducting shell to be different from the cross-section of the at least one second heat pipe relative to the heat-conducting shell, airflow with different flow directions can be generated in the main heat dissipation area when the airflow is guided to a main heat dissipation area through the at least one first heat pipe and the at least one second heat pipe.

2. The three-dimensional heat transfer device as described in claim 1, characterized in that, The heat-conducting shell includes a first shell and a second shell, the second shell being mounted on the first shell so that the first shell and the second shell together form the airtight chamber, and the at least one first heat pipe and the at least one second heat pipe are connected to the second shell of the heat-conducting shell.

3. The three-dimensional heat transfer device as described in claim 2, characterized in that, The cross-sectional dimensions of the at least one first heat pipe relative to the second housing are different from the cross-sectional dimensions of the at least one second heat pipe relative to the second housing.

4. The three-dimensional heat transfer device as described in claim 3, characterized in that, The cross-sectional area of ​​the at least one first heat pipe is less than or equal to 80% of the cross-sectional area of ​​the at least one second heat pipe.

5. The three-dimensional heat transfer device as described in claim 2, characterized in that, The shape of the cross section of the at least one first heat pipe relative to the second housing is different from the shape of the cross section of the at least one second heat pipe relative to the second housing.

6. The three-dimensional heat transfer device as described in claim 5, characterized in that, Both the at least one first heat pipe and the at least one second heat pipe are elliptical, and the flatness of the cross-section of the at least one first heat pipe is different from the flatness of the cross-section of the at least one second heat pipe.

7. The three-dimensional heat transfer device as described in claim 5, characterized in that, The cross-sectional shape of the at least one first heat pipe and the at least one second heat pipe is an airfoil, an ellipse, or a gear.

8. The three-dimensional heat transfer device as described in claim 2, characterized in that, It further includes at least one third heat pipe disposed in the second housing and communicating with the airtight chamber, wherein the cross-section of the at least one third heat pipe relative to the second housing is different from the cross-section of the at least one first heat pipe relative to the second housing and the cross-section of the at least one second heat pipe relative to the second housing.

9. The three-dimensional heat transfer device as described in claim 8, characterized in that, The at least one third heat pipe is located in the main heat dissipation area, which corresponds to the heat contact surface. There are multiple first heat pipes and at least one second heat pipe, which are located on opposite sides of the at least one third heat pipe. The second heat pipes located on the same side of the at least one third heat pipe are located between the first heat pipes and the at least one third heat pipe.

10. The three-dimensional heat transfer device as described in claim 9, characterized in that, The flatness of the first heat pipes is greater than that of the second heat pipes, and the flatness of the second heat pipes is greater than that of the at least one third heat pipe.

11. The three-dimensional heat transfer device as described in claim 9, characterized in that, It also includes multiple fourth heat pipes and multiple fifth heat pipes, and the number of at least one third heat pipe is multiple. The first to fifth heat pipes are arranged in sequence, and the cross-sectional dimensions of the first to fifth heat pipes gradually increase in sequence.

12. A three-dimensional heat transfer device, characterized in that, Suitable for thermal coupling to a heat source, the three-dimensional heat transfer device includes: A heat-conducting shell has an airtight chamber and a thermal contact surface, the thermal contact surface facing away from the airtight chamber and thermally coupled to the heat source; At least one first heat pipe is disposed in the heat-conducting shell and communicates with the airtight chamber; and At least one second heat pipe is disposed in the heat-conducting shell and connected to the airtight chamber; The cross-section of the at least one first heat pipe relative to the heat-conducting shell is the same as the cross-section of the at least one second heat pipe relative to the heat-conducting shell, so as to guide the airflow to a main heat dissipation area through the at least one first heat pipe and the at least one second heat pipe, and the at least one second heat pipe is arranged close to the main heat dissipation area to shorten the cooling circulation path of the cooling fluid.

13. The three-dimensional heat transfer device as described in claim 12, characterized in that, The heat-conducting shell includes a first shell and a second shell, the second shell being mounted on the first shell so that the first shell and the second shell together form the airtight chamber, and the at least one first heat pipe and the at least one second heat pipe are connected to the second shell of the heat-conducting shell.

14. The three-dimensional heat transfer device as described in claim 12, characterized in that, Both the at least one first heat pipe and the at least one second heat pipe are elliptical, and the flatness of the cross-section of the at least one first heat pipe is the same as the flatness of the cross-section of the at least one second heat pipe.

15. The three-dimensional heat transfer device as described in claim 12, characterized in that, It further includes at least one third heat pipe disposed in the second housing and communicating with the airtight chamber. The cross-section of the at least one third heat pipe relative to the second housing, the cross-section of the at least one first heat pipe relative to the second housing, and the cross-section of the at least one second heat pipe relative to the second housing are the same.

16. The three-dimensional heat transfer device as described in claim 15, characterized in that, The at least one third heat pipe is located in the main heat dissipation area, which corresponds to the heat contact surface. There are multiple first heat pipes and at least one second heat pipe, which are located on opposite sides of the at least one third heat pipe. The second heat pipes located on the same side of the at least one third heat pipe are located between the first heat pipes and the at least one third heat pipe.

17. The three-dimensional heat transfer device as described in claim 15, characterized in that, The flatness of the first heat pipes, the flatness of the second heat pipes, and the flatness of the at least one third heat pipe are the same.

18. The three-dimensional heat transfer device as described in claim 15, characterized in that, It also includes multiple fourth heat pipes and multiple fifth heat pipes, and the number of at least one third heat pipe is multiple, with the first to fifth heat pipes arranged in sequence.

19. The three-dimensional heat transfer device as described in claim 12, characterized in that, The cross-sections of the at least one first heat pipe, the at least one second heat pipe, and the at least one third heat pipe are in the shape of an airfoil, an ellipse, a circle, or a gear.

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