Liquid cooling heat dissipation structure, air conditioner frequency converter and electronic equipment

Abstract

The application provides a liquid cooling heat dissipation structure, an air conditioner frequency converter and electronic equipment. The liquid cooling heat dissipation structure comprises: a heat dissipation plate body, which is used for abutting against a device to be cooled to perform contact heat exchange; and a flow channel for heat exchange medium flow inside the heat dissipation plate body; wherein, the extension direction of the thickness dimension of the heat dissipation plate body is a thickness direction, and at least 40% of the projection of the abutting surface of the heat dissipation plate body is located in the projection of the flow channel. According to the application, at least 40% of the projection of the abutting surface of the heat dissipation plate body is located in the projection of the flow channel, so that the effective heat dissipation area of the flow channel can cover the heat source of the device to be cooled, thereby realizing efficient heat dissipation of the device to be cooled and avoiding problems such as performance degradation or burning of the device to be cooled due to overheating.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, and more specifically, to a liquid cooling heat dissipation structure, an air conditioning inverter, and electronic equipment. Background Technology

[0002] Currently, electronic devices contain many heat-generating components. The heat from these components needs to be dissipated in a timely and effective manner. If the heat cannot be dissipated in a timely and effective manner, it will affect the performance and lifespan of the electronic devices. In order to control the temperature of the electronic devices in electronic devices within a suitable temperature range, a heat sink is usually fixed on the surface of the electronic devices. The electronic devices transfer heat to the heat sink through contact heat exchange, and the fins on the heat sink diffuse the heat outward, thereby reducing the temperature of the electronic devices.

[0003] In the air conditioning industry, the air conditioning inverter module plays a role in power conversion and amplification in the entire air conditioning inverter. Due to switching losses and the resistance of the module itself, the air conditioning inverter module generates a lot of heat during operation. Moreover, the larger the power of the air conditioning unit corresponding to the inverter, the greater the heat generation. If this heat is not dissipated in time, it will reduce the performance of the air conditioning inverter module, and in severe cases, it may even burn out the air conditioning inverter module.

[0004] Existing radiators for air conditioner inverter modules typically include a heat sink with internal flow channels. The heat source of the air conditioner inverter module is attached to the heat sink for contact heat exchange. However, the flow channels inside the existing heat sinks have a small area, which prevents the heat exchange medium from dissipating the heat transferred from the air conditioner inverter module in a timely manner. This results in poor cooling performance for the air conditioner inverter module and fails to meet its heat dissipation requirements.

[0005] Therefore, there is an urgent need for a heat sink that can be used in air conditioner inverter modules to solve the above problems. Summary of the Invention

[0006] This invention provides a liquid cooling heat dissipation structure, an air conditioner inverter, and electronic equipment to solve the problem that the flow channel area inside the heat sink in the prior art is too small, which makes it impossible for the heat exchange medium to dissipate heat in time, thus failing to meet the heat dissipation requirements of the air conditioner inverter module.

[0007] To address the aforementioned problems, according to one aspect of the present invention, a liquid cooling heat dissipation structure is provided, comprising: a heat dissipation plate for contacting a device to be cooled for heat exchange; the heat dissipation plate having a flow channel for the flow of a heat exchange medium; wherein, with the extension direction of the thickness dimension of the heat dissipation plate as the thickness direction, at least 40% of the projection of the contact surface of the heat dissipation plate is located within the projection of the flow channel.

[0008] Furthermore, the flow channel includes at least one heat exchange group, and the heat exchange group includes a first flow section, an intermediate section, and a second flow section; when there is only one heat exchange group, the end of the first flow section away from the intermediate section is the inlet of the flow channel, and the other end is connected to the intermediate section; the end of the second flow section close to the intermediate section is connected to the intermediate section, and the other end is the outlet of the flow channel; wherein, the projection of the part of the heat dissipation device that abuts against the heat sink is located within the projection of the flow channel when projected along the thickness direction onto the same plane perpendicular to the thickness direction.

[0009] Furthermore, when there are at least two heat exchange groups, one end of the first flow section of one heat exchange group is the inlet of the flow channel, and one end of the second flow section of the other heat exchange group is the outlet of the flow channel; the flow channel also includes at least one connecting channel; adjacent heat exchange groups are connected by the connecting channel; wherein, a portion of the heat exchange groups in the at least two heat exchange groups are arranged in a one-to-one correspondence with at least one heat dissipation device; and / or, when there are at least two heat exchange groups, one heat exchange group is arranged in parallel with another heat exchange group, and one end of the first flow section of the two heat exchange groups is the inlet of the flow channel, and one end of the second flow section of the two heat exchange groups is the outlet of the flow channel.

[0010] Furthermore, the opening at one end of the connecting channel is connected to the second flow section of a heat exchange group, and the inner diameter of at least a portion of the connecting channel is smaller than the minimum internal size of the second flow section, so as to form a first constriction structure when flowing from the second flow section into the connecting channel; and / or, the opening at the other end of the connecting channel is connected to the first flow section of another heat exchange group, and the inner diameter of at least a portion of the connecting channel is smaller than the minimum internal size of the first flow section, so as to form a first flaring structure when flowing from the connecting channel into the first flow section.

[0011] Furthermore, the projection along the thickness direction onto the same plane perpendicular to the thickness direction is set at an interval between the projection of the part of the heat sink that abuts against the heat sink and the projection of the connecting channel.

[0012] Furthermore, the connecting portion between the first flow section and the intermediate section is rounded and smooth to reduce the flow resistance of the heat exchange medium; and / or, the connecting portion between the second flow section and the intermediate section is rounded and smooth to reduce the flow resistance of the heat exchange medium.

[0013] Furthermore, the liquid cooling heat dissipation structure also includes at least one flow-dispersing element, which is connected to the heat dissipation plate and located within the flow channel; the flow-dispersing element is used to conduct contact heat exchange with the heat dissipation plate and to disturb the heat exchange medium within the flow channel.

[0014] Furthermore, the turbulence-inducing element includes turbulence protrusions that protrude toward the interior of the flow channel; the turbulence protrusions are located at the inlet and / or outlet of the flow channel to create turbulence within the flow channel; and / or, the turbulence-inducing element includes turbulence columns disposed within the flow channel; wherein the outer periphery of the turbulence column is an arc-shaped surface that contacts the heat exchange medium for heat exchange; the turbulence column creates turbulence by agitating the heat exchange medium within the flow channel.

[0015] Furthermore, there are multiple turbulence columns, which are arranged in rows and / or columns, with the axial direction of the turbulence columns parallel to the thickness direction, and the axial directions of the multiple turbulence columns are arranged in parallel; and / or, the turbulence columns are cylindrical or elliptical cylindrical structures.

[0016] Furthermore, the inner diameter of at least a portion of the flow channel gradually increases or decreases along the flow direction of the heat exchange medium.

[0017] Furthermore, the liquid-cooled heat dissipation structure also includes a first flow pipe, the outlet of one end of which is connected to the inlet of the flow channel. The heat exchange medium flows in from the inlet at the other end of the first flow pipe, passes through the outlet of the first flow pipe, and enters the flow channel. The outlet inner diameter of the first flow pipe is smaller than the inner diameter of the portion between the two ends of the first flow pipe, forming a second constriction structure. This second constriction structure is used to increase the flow velocity of the heat exchange medium entering the flow channel. The inner diameter of the portion of the first flow pipe at the outlet gradually decreases along the flow direction of the heat exchange medium, and becomes smallest at the outlet. And / or, the liquid... The heat dissipation structure also includes a second flow tube. The inlet of one end of the second flow tube is connected to the outlet of the flow channel. The heat exchange medium flows into the inlet of the second flow tube from the outlet of the flow channel and flows out through the outlet of the other end of the second flow tube. The inner diameter of the inlet of the second flow tube is smaller than the inner diameter of the middle part of both ends of the second flow tube to form a second flared structure. The second flared structure is used to reduce the flow velocity of the heat exchange medium flowing into the second flow tube from the flow channel. The inner diameter of a portion of the inlet end of the second flow tube gradually increases along the flow direction of the heat exchange medium, and the size at the inlet of the second flow tube is the smallest.

[0018] Furthermore, the liquid cooling structure also includes connectors, and the heat sink has at least one mounting hole, which is spaced apart from the flow channel; the connectors are respectively engaged with the device to be cooled and the mounting hole, so that the heat sink and the device to be cooled are in contact and engaged.

[0019] According to another aspect of the present invention, an air conditioner inverter is provided, the air conditioner inverter including the above-mentioned liquid cooling heat dissipation structure, the air conditioner inverter further including an air conditioner inverter module, the air conditioner inverter module being a device to be cooled; the area of ​​the surface of the heat sink for contacting the air conditioner inverter module is not less than the area of ​​the surface of the air conditioner inverter module for contacting the heat sink.

[0020] According to another aspect of the present invention, an electronic device is provided, which includes the liquid cooling heat dissipation structure described above.

[0021] Applying the technical solution of the present invention, the present invention provides a liquid cooling heat dissipation structure, including: a heat dissipation plate, which is used to abut against the device to be cooled for contact heat exchange; the heat dissipation plate has a flow channel inside for the flow of heat exchange medium; wherein, with the extension direction of the thickness dimension of the heat dissipation plate as the thickness direction, at least 40% of the projection of the abutment surface of the heat dissipation plate is located within the projection of the flow channel.

[0022] This invention achieves efficient heat dissipation of the heat sink by ensuring that at least 40% of the projection of its contact surface lies within the projection of the flow channel. This allows the effective heat dissipation area of ​​the flow channel to cover the heat source of the device being cooled, thus preventing performance degradation or burnout due to overheating. When the liquid cooling structure proposed in this invention was applied to the air conditioner inverter module, it was found that the design of the flow channel ensures sufficient effective heat dissipation area. The heat exchange medium within the flow channel can promptly dissipate the heat transferred from the air conditioner inverter module, thereby improving the cooling efficiency and effectively meeting the heat dissipation requirements of the air conditioner inverter module. This invention is simple in structure and low in cost, easy to assemble and maintain, and can be modified from existing heat sink structures, making it suitable for large-scale application. Attached Figure Description

[0023] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0024] Figure 1 An internal structural perspective view of the liquid cooling heat dissipation structure provided in Embodiment 1 of the present invention is shown;

[0025] Figure 2 A cross-sectional view of the liquid cooling heat dissipation structure provided in Embodiment 1 of the present invention is shown along the direction perpendicular to the thickness.

[0026] Figure 3 A schematic diagram of the external structure of the liquid cooling heat dissipation structure provided in an embodiment of the present invention is shown;

[0027] Figure 4 A schematic diagram of the internal structure of the liquid cooling heat dissipation structure provided in Embodiment 2 of the present invention is shown;

[0028] Figure 5 A schematic diagram of the internal structure of the liquid cooling heat dissipation structure provided in Embodiment 3 of the present invention is shown;

[0029] Figure 6 A schematic diagram of the internal structure of the liquid cooling heat dissipation structure provided in Embodiment 4 of the present invention is shown.

[0030] The above figures include the following reference numerals:

[0031] 10. Heat sink body;

[0032] 20. Distribution channels;

[0033] 30. Heat exchanger assembly; 31. First flow section; 32. Intermediate section; 33. Second flow section;

[0034] 40. Connecting channel;

[0035] 50. Turbidity protrusion;

[0036] 60. Baffle column;

[0037] 70. First circulation tube;

[0038] 80. Second circulation tube;

[0039] 90. Mounting holes. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] like Figures 1 to 6 As shown, an embodiment of the present invention provides a liquid cooling heat dissipation structure, including: a heat dissipation plate 10, which is used to abut against the device to be cooled for contact heat exchange; the heat dissipation plate 10 has a flow channel 20 inside, which is used to flow a heat exchange medium; wherein, with the extension direction of the thickness dimension of the heat dissipation plate 10 as the thickness direction, at least 40% of the projection of the abutment surface of the heat dissipation plate 10 is located within the projection of the flow channel 20.

[0042] This invention achieves efficient heat dissipation of the heat sink 10 by ensuring that at least 40% of the projection of its contact surface lies within the projection of the flow channel 20. This allows the effective heat dissipation area of ​​the flow channel 20 to cover the heat source of the device being cooled, thus preventing performance degradation or burnout due to overheating. When the liquid cooling structure proposed in this invention was applied to the air conditioner inverter module, it was found that the design of the flow channel 20 ensures sufficient effective heat dissipation area. The heat exchange medium within the flow channel 20 can promptly dissipate the heat transferred from the air conditioner inverter module, thereby improving the cooling efficiency and effectively meeting the heat dissipation requirements of the air conditioner inverter module. This invention is simple in structure and low in cost, easy to assemble and maintain, and can be modified from existing heat sink structures, making it suitable for large-scale application.

[0043] like Figure 1 and Figure 2 As shown, the flow channel 20 includes at least one heat exchange group 30. A heat exchange group 30 includes a first flow section 31, an intermediate section 32, and a second flow section 33. When there is only one heat exchange group 30, the end of the first flow section 31 away from the intermediate section 32 is the inlet of the flow channel 20, and the other end is connected to the intermediate section 32. The end of the second flow section 33 close to the intermediate section 32 is connected to the intermediate section 32, and the other end is the outlet of the flow channel 20. The projection of the part of the heat dissipation device that abuts against the heat sink 10 is located within the projection of the flow channel 20 when projected along the thickness direction onto the same plane perpendicular to the thickness direction.

[0044] By designing at least one heat exchange group 30 in the flow channel 20, each heat exchange group 30 includes a first flow section 31, an intermediate section 32 and a second flow section 33 with specific flow rate regulation functions, the flow rate and flow velocity of the heat exchange medium can be dynamically adjusted according to the heat distribution of the device to be cooled, thereby further optimizing the heat dissipation performance.

[0045] like Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, the projection of the part of the heat dissipation device that abuts against the heat dissipation plate 10 along the thickness direction onto the same plane perpendicular to the thickness direction is located within the projection of the middle section 32; and / or, the projection of the middle section 32 is one of elliptical, circular, elliptical or circular.

[0046] The projection of the middle section 32 is designed to be one of elliptical, circular, elliptical or circular. This design can increase the effective heat exchange area of ​​the flow channel 20, while maintaining the uniform distribution of fluid, thus improving the heat dissipation uniformity and efficiency.

[0047] like Figure 4 As shown, when there are at least two heat exchange groups 30, one end of the first flow section 31 of one heat exchange group 30 is the inlet of the flow channel 20, and one end of the second flow section 33 of the other heat exchange group 30 is the outlet of the flow channel 20; the flow channel 20 also includes at least one connecting channel 40; two adjacent heat exchange groups 30 are connected by the connecting channel 40; wherein, a portion of the heat exchange groups 30 in the at least two heat exchange groups 30 are arranged in a one-to-one correspondence with at least one heat dissipation device.

[0048] By setting at least one connecting channel 40, fluid communication between multiple heat exchange groups 30 is achieved, allowing fluid to flow between different heat exchange groups 30 as needed, thereby improving the flexibility of the heat dissipation structure and the utilization efficiency of the heat exchange medium.

[0049] In one specific embodiment of the present invention, when there are at least two heat exchange groups 30, one heat exchange group 30 is arranged in parallel with another heat exchange group 30. One end of the first flow section 31 of the two heat exchange groups 30 is the inlet of the flow channel 20, and one end of the second flow section 33 of the two heat exchange groups 30 is the outlet of the flow channel 20. By arranging at least two heat exchange groups 30 in parallel, the effective heat exchange area is increased, and the applicability of the heat exchange groups 30 to the heat dissipation requirements of different devices to be cooled is improved.

[0050] like Figure 4 As shown, the opening at one end of the connecting channel 40 is connected to the second flow section 33 of a heat exchange group 30, and the inner diameter of at least a portion of the connecting channel 40 is smaller than the minimum internal size of the second flow section 33, so as to form a first constriction structure when the heat exchange medium flows from the second flow section 33 into the connecting channel 40. The first constriction structure is used to increase the flow rate of the heat exchange medium entering the connecting channel 40; and / or, the opening at the other end of the connecting channel 40 is connected to the first flow section 31 of another heat exchange group 30, and the inner diameter of at least a portion of the connecting channel 40 is smaller than the minimum internal size of the first flow section 31, so as to form a first flaring structure when the heat exchange medium flows from the connecting channel 40 into the first flow section 31. The first flaring structure is used to reduce the flow rate of the heat exchange medium entering the connecting channel 40.

[0051] By designing a first constriction structure and / or a first flaring structure at the connection between the connecting channel 40 and the heat exchange group 30, the flow rate of the fluid in the flow channel 20 can be effectively controlled, thereby optimizing the heat exchange between the fluid and the heat-dissipating device, which helps to improve heat dissipation efficiency and reduce system energy consumption.

[0052] Specifically, the projection along the thickness direction onto the same plane perpendicular to the thickness direction is set at an interval between the projection of the part of the heat dissipation device that abuts against the heat dissipation plate 10 and the projection of the connecting channel 40.

[0053] By setting the projection interval between the heat dissipation device and the connecting channel 40, the heat of the heat dissipation device is prevented from directly affecting the fluid in the connecting channel 40, thereby ensuring the smooth flow of the fluid in the connecting channel 40 and improving the flow reliability of the connecting channel 40.

[0054] like Figure 1 , Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, the connecting portion between the first flow section 31 and the intermediate section 32 is smoothly rounded to reduce the flow resistance of the heat exchange medium; and / or, the connecting portion between the second flow section 33 and the intermediate section 32 is smoothly rounded to reduce the flow resistance of the heat exchange medium.

[0055] By using a rounded arc to smoothly connect the first flow section 31, the second flow section 33, and the intermediate section 32, the flow resistance of the fluid in the flow channel 20 is reduced, the flow efficiency of the fluid is improved, and thus the heat dissipation effect is enhanced.

[0056] like Figure 5 and Figure 6 As shown, the liquid cooling heat dissipation structure also includes at least one flow-dispersing element, which is connected to the heat dissipation plate 10 and located in the flow channel 20; the flow-dispersing element is used to conduct contact heat exchange with the heat dissipation plate 10 and to disturb the heat exchange medium in the flow channel 20.

[0057] By providing at least one turbulence element (e.g., turbulence protrusion 50 and / or turbulence column 60), the turbulence of the fluid can be increased, the temperature boundary layer of the fluid can be disrupted, thereby significantly improving the heat exchange efficiency. At the same time, the heat exchange efficiency between the fluid and the heat sink 10 is also improved.

[0058] It should be noted that in a specific embodiment of the present invention, the number of turbulence-disrupting elements gradually increases along the flow direction of the fluid (i.e., the heat exchange medium), that is, the number of turbulence-disrupting elements that first come into contact with the heat exchange medium is less than the number of turbulence-disrupting elements that follow. This arrangement makes the turbulence-disrupting effect of the turbulence-disrupting elements gradually increase along the flow direction of the heat exchange medium, thereby improving the heat exchange uniformity between the fluid and the heat dissipation plate 10.

[0059] like Figure 5 As shown, the turbulence element includes a turbulence protrusion 50 that protrudes toward the interior of the flow channel 20; the turbulence protrusion 50 is located at the inlet and / or outlet of the flow channel 20 to create turbulence within the flow channel 20.

[0060] By providing turbulence protrusions 50 at the inlet and / or outlet of the flow channel 20, turbulence can be generated when the fluid enters or leaves, which further improves the heat exchange efficiency and helps to reduce the temperature of the fluid in the flow channel.

[0061] like Figure 6 As shown, the turbulence-disrupting component includes a turbulence-disrupting column 60, which is disposed within the flow channel 20. The outer periphery of the turbulence-disrupting column 60 is an arc-shaped surface, which contacts the heat exchange medium for heat exchange. The turbulence-disrupting column 60 creates turbulence by disturbing the heat exchange medium within the flow channel 20.

[0062] By setting the outer periphery of the turbulence column 60 to be an arc-shaped surface, the area for heat exchange with the fluid is further increased. At the same time, while ensuring smooth fluid flow, turbulence can be formed, which increases the degree of disturbance to the fluid, thereby optimizing the heat exchange performance and making the temperature distribution of the fluid uniform.

[0063] like Figure 6 As shown, there are multiple turbulence columns 60, which are arranged in rows and / or columns. The axial direction of the turbulence columns 60 is parallel to the thickness direction, and the axial directions of the multiple turbulence columns 60 are arranged in parallel; and / or, the turbulence columns 60 are cylindrical or elliptical cylindrical structures.

[0064] By setting the arrangement direction and method of the turbulence columns 60, not only is the disturbance effect on the heat exchange medium guaranteed, but the heat exchange area is also effectively increased, thereby improving the heat exchange capacity of the heat dissipation plate 10.

[0065] Optionally, the inner diameter of at least a portion of the flow channel 20 gradually increases or decreases along the flow direction of the heat exchange medium.

[0066] By setting the inner diameter of the flow channel 20 to gradually change along the flow direction of the heat exchange medium, the principle of fluid mechanics is utilized to optimize the flow velocity of the fluid at different positions in the flow channel 20, thereby improving the heat dissipation efficiency while maintaining stable fluid flow.

[0067] like Figures 1 to 6 As shown, the liquid cooling heat dissipation structure also includes a first flow pipe 70. The outlet of one end of the first flow pipe 70 is connected to the inlet of the flow channel 20. The heat exchange medium flows in from the inlet of the other end of the first flow pipe 70 and enters the flow channel 20 through the outlet of the first flow pipe 70. The inner diameter of the outlet of the first flow pipe 70 is smaller than the inner diameter of the portion between the two ends of the first flow pipe 70 to form a second constriction structure. The second constriction structure is used to increase the flow rate of the heat exchange medium entering the flow channel 20.

[0068] By setting up a first flow pipe 70 and designing a second constriction structure at its outlet, the flow rate can be increased when the heat exchange medium enters the flow channel 20, which accelerates the heat exchange between the fluid and the heat dissipation device and improves the heat dissipation efficiency.

[0069] In addition, the design of the second constriction structure has a throttling and jetting effect on the heat exchange medium, further reducing the temperature of the heat exchange medium (e.g., refrigerant), increasing the temperature difference with the heat-dissipating device, thereby increasing the heat exchange capacity, increasing the flow rate of the heat exchange medium and the heat transfer coefficient.

[0070] like Figure 1 As shown, the inner diameter of a portion of the first flow tube 70 at the outlet end gradually decreases along the flow direction of the heat exchange medium, and the size becomes the smallest at the outlet.

[0071] The gradual change in the inner diameter of the outlet of the first flow pipe 70 allows the fluid to be accelerated before entering the flow channel 20, which helps to form a high flow velocity region and thus optimizes the heat exchange performance of the heat sink 10.

[0072] like Figures 1 to 6 As shown, the liquid cooling heat dissipation structure also includes a second flow pipe 80. The inlet of one end of the second flow pipe 80 is connected to the outlet of the flow channel 20. The heat exchange medium flows into the inlet of the second flow pipe 80 from the outlet of the flow channel 20 and flows out through the outlet of the other end of the second flow pipe 80. The inner diameter of the inlet of the second flow pipe 80 is smaller than the inner diameter of the middle part of both ends of the second flow pipe 80 to form a second flared structure. The second flared structure is used to reduce the flow rate of the heat exchange medium flowing into the second flow pipe 80 from the flow channel 20.

[0073] By setting up a second flow pipe 80 and designing a second flared structure at its inlet, the flow velocity of the heat exchange medium can be effectively reduced when it flows from the flow channel 20 into the second flow pipe 80, which helps to regulate the fluid pressure at the outlet and thus reduces system energy consumption.

[0074] It should be noted that the design of the second flared structure reduces both the flow rate and pressure of the heat exchange medium, thereby increasing the temperature of the heat exchange medium. This, in turn, reduces the power consumption of the air conditioning compressor, making the system more energy-efficient.

[0075] like Figure 1 As shown, the inner diameter of a portion of the inlet end of the second flow pipe 80 gradually increases along the flow direction of the heat exchange medium, and the inlet size of the second flow pipe 80 is the smallest.

[0076] The gradual change in inner diameter design at the inlet end of the second flow pipe 80 causes the fluid velocity to gradually decrease as it leaves the flow channel 20, which helps control the fluid temperature at the outlet. This reduces the burden on the air conditioner's compressor and other refrigeration systems, making the system more energy-efficient.

[0077] like Figures 1 to 6 As shown, the liquid cooling structure also includes connectors. The heat sink 10 has at least one mounting hole 90, which is spaced apart from the flow channel 20. The connectors are respectively engaged with the device to be cooled and the mounting hole 90 so that the heat sink 10 and the device to be cooled can be in contact.

[0078] By setting the connector to cooperate with at least one mounting hole 90 on the heat sink 10, a tight contact between the heat sink 10 and the device to be cooled is ensured, the heat exchange resistance is reduced, the heat exchange efficiency is improved, and the heat sink 10 and the device to be cooled are also facilitated to be quickly installed and removed.

[0079] The present invention also provides an air conditioner inverter, which includes the above-mentioned liquid cooling heat dissipation structure and an air conditioner inverter module, which is a device to be cooled.

[0080] The air conditioner inverter proposed in this invention can effectively solve the problem of high temperature generated by the inverter module during operation, improve the overall heat dissipation performance of the inverter, ensure the stable operation of the inverter module, and extend the service life of the inverter.

[0081] Optionally, the area of ​​the surface of the heat sink 10 that contacts the air conditioner inverter module is not less than the area of ​​the surface of the air conditioner inverter module that contacts the heat sink 10.

[0082] This design ensures that the heat from the air conditioner inverter module can be fully transferred to the heat sink 10, thereby improving heat dissipation efficiency and reducing the temperature rise of the air conditioner inverter module. Simultaneously, this design allows the heat sink 10 to have a larger effective heat exchange area and better fit against the heat source of the air conditioner inverter module, completely covering it. This prevents the heat source from being exposed to media with high thermal resistance, such as air, thus avoiding a reduction in the heat dissipation effect of the air conditioner inverter module.

[0083] The present invention also provides an electronic device, which includes the liquid cooling heat dissipation structure described above.

[0084] The electronic device proposed in this invention can effectively improve the heat dissipation performance of electronic devices, reduce the temperature of key components, improve the operational stability and reliability of the device, and extend the service life of the electronic device.

[0085] The specific working process and principle of one embodiment of the present invention will now be described in detail as follows:

[0086] This invention relates to the field of radiators, and the proposed liquid cooling heat dissipation structure can be applied to air conditioner inverter modules for heat dissipation. The liquid cooling heat dissipation structure includes a heat sink 10, a first flow pipe 70, and a second flow pipe 80. The heat sink 10 has mounting holes 90 extending along its thickness direction for close mounting and fixing to the air conditioner inverter module using connectors (e.g., screws). The surface of the heat sink 10 is flat, and it is in close contact with the heat source of the air conditioner inverter module directly or through a heat-conducting medium. The first flow pipe 70 and the second flow pipe 80 respectively form a second constriction structure and a second flare structure. The design of the inlet structure has a throttling and jetting effect on the heat exchange medium, further reducing the temperature of the heat exchange medium (e.g., refrigerant), increasing the temperature difference with the heat-dissipating device, thereby increasing the heat exchange capacity, increasing the flow rate and heat transfer coefficient of the heat exchange medium; the design of the second flared inlet structure reduces both the flow rate and pressure of the heat exchange medium, resulting in an increase in the temperature of the heat exchange medium, which in turn reduces the power consumption of the air conditioning compressor and makes the system more energy-efficient; the projection surface of the middle section 32 of the flow channel 20 is approximately elliptical to have a larger heat exchange area and to better fit the heat source of the air conditioning inverter module;

[0087] This invention optimizes the fluid flow within the flow channel 20 through the design of the turbulence protrusion 50 and the turbulence column 60. The turbulence protrusion 50 can adopt an internal tooth structure, and the turbulence column 60 can adopt an elliptical cylinder structure. This simple structure effectively improves the heat exchange area and heat exchange efficiency, reduces the operating temperature of the air conditioning inverter module, and thus extends the module's service life. In addition, the heat sink 10 can be made of materials with high thermal conductivity and corrosion resistance, ensuring the long-term working stability and reliability of the heat sink 10. Furthermore, a temperature sensor can be added to achieve real-time monitoring of the heat exchange medium temperature and / or the air conditioning inverter module temperature, so as to adjust parameters such as the flow rate of the heat exchange medium in a timely manner, ensuring the efficient operation of the air conditioning inverter module.

[0088] In summary, this invention provides a liquid-cooled heat dissipation structure, an air conditioner inverter, and electronic equipment. By ensuring that at least 40% of the projection of the portion of the heat-dissipating device that contacts the heat sink 10 lies within the projection of the flow channel 20, the effective heat dissipation area of ​​the flow channel 20 can cover the heat source of the heat-dissipating device, thereby achieving efficient heat dissipation and preventing performance degradation or burnout due to overheating. When the liquid-cooled heat dissipation structure proposed in this invention is applied to the air conditioner inverter module, it is found that the size design of the flow channel 20 ensures sufficient effective heat dissipation area. The heat exchange medium within the flow channel 20 can promptly dissipate the heat transferred from the air conditioner inverter module, thereby improving the cooling efficiency of the air conditioner inverter module and effectively meeting its heat dissipation requirements. This invention has a simple structure, low cost, is easy to assemble and maintain, can be modified from existing heat sink structures, and is suitable for large-scale promotion and use.

[0089] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0090] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0091] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0092] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0093] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0094] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A liquid-cooled heat dissipation structure, characterized in that, include: A heat sink (10) is used to contact the device to be cooled for heat exchange; the heat sink (10) has a flow channel (20) for the flow of heat exchange medium; wherein, with the extension direction of the thickness dimension of the heat sink (10) as the thickness direction, at least 40% of the projection of the contact surface of the heat sink (10) is located within the projection of the flow channel (20).

2. The liquid cooling heat dissipation structure according to claim 1, characterized in that, The flow channel (20) includes at least one heat exchange group (30), and one of the heat exchange groups (30) includes a first flow section (31), an intermediate section (32), and a second flow section (33); When there is one heat exchange group (30), the first flow section (31) is located away from the middle section (32) at one end, which is the inlet of the flow channel (20), and the other end is connected to the middle section (32). The second flow section (33) is located near the middle section (32) at one end, which is connected to the middle section (32), and the other end is the outlet of the flow channel (20). Among them, the projection of the part of the heat dissipation device that abuts against the heat dissipation plate (10) along the thickness direction onto the same plane perpendicular to the thickness direction is located within the projection of the flow channel (20).

3. The liquid cooling heat dissipation structure according to claim 2, characterized in that, When there are at least two heat exchange groups (30), one end of the first flow section (31) of one heat exchange group (30) is the inlet of the flow channel (20), and one end of the second flow section (33) of the other heat exchange group (30) is the outlet of the flow channel (20). The flow channel (20) further includes at least one connecting channel (40); two adjacent heat exchange groups (30) are connected through the connecting channel (40); wherein, a portion of the heat exchange groups (30) are provided in a one-to-one correspondence with at least one of the heat dissipation devices; And / or, when there are at least two heat exchange groups (30), one heat exchange group (30) is connected in parallel with another heat exchange group (30), one end of the first flow section (31) of the two heat exchange groups (30) is the inlet of the flow channel (20), and one end of the second flow section (33) of the two heat exchange groups (30) is the outlet of the flow channel (20).

4. The liquid cooling heat dissipation structure according to claim 3, characterized in that, The opening at one end of the connecting channel (40) is connected to the second flow section (33) of one of the heat exchange groups (30), and the inner diameter of at least a portion of the connecting channel (40) is smaller than the minimum internal size of the second flow section (33) to form a first constriction structure when flowing from the second flow section (33) into the connecting channel (40). And / or, the opening at the other end of the connecting channel (40) is connected to the first flow section (31) of another heat exchange assembly (30), and at least a portion of the inner diameter of the connecting channel (40) is smaller than the minimum internal size of the first flow section (31) to form a first flared structure when flowing from the connecting channel (40) into the first flow section (31).

5. The liquid cooling heat dissipation structure according to claim 3, characterized in that, Projecting along the thickness direction onto the same plane perpendicular to the thickness direction, the projection of the part of the heat dissipation device that abuts against the heat dissipation plate (10) is spaced apart from the projection of the connecting channel (40).

6. The liquid cooling heat dissipation structure according to claim 2, characterized in that, The connecting portion between the first flow section (31) and the intermediate section (32) is rounded and smooth to reduce the flow resistance of the heat exchange medium; and / or, the connecting portion between the second flow section (33) and the intermediate section (32) is rounded and smooth to reduce the flow resistance of the heat exchange medium.

7. The liquid-cooled heat dissipation structure according to claim 1, characterized in that, The liquid cooling heat dissipation structure also includes at least one flow-dispersing element, which is connected to the heat dissipation plate (10) and located in the flow channel (20); the flow-dispersing element is used to contact the heat dissipation plate (10) for heat exchange and to disturb the heat exchange medium in the flow channel (20).

8. The liquid cooling heat dissipation structure according to claim 7, characterized in that, The turbulence-inducing element includes a turbulence-inducing protrusion (50) that protrudes toward the interior of the flow channel (20); the turbulence-inducing protrusion (50) is located at the inlet and / or outlet of the flow channel (20) to create turbulence within the flow channel (20); And / or, the turbulence element includes a turbulence column (60) disposed within the flow channel (20); wherein, the outer periphery of the turbulence column (60) is an arc-shaped surface, the arc-shaped surface is in contact with the heat exchange medium for heat exchange; the turbulence column (60) generates turbulence by disturbing the heat exchange medium within the flow channel (20).

9. The liquid cooling heat dissipation structure according to claim 8, characterized in that, There are multiple turbulence columns (60), and the multiple turbulence columns (60) are arranged in rows and / or columns. The axial direction of the turbulence columns (60) is parallel to the thickness direction, and the axial directions of the multiple turbulence columns (60) are arranged in parallel. And / or, the turbulence column (60) is a cylindrical structure or an elliptical cylindrical structure.

10. The liquid-cooled heat dissipation structure according to claim 1, characterized in that, The inner diameter of at least a portion of the flow channel (20) gradually increases or decreases along the flow direction of the heat exchange medium.

11. The liquid-cooled heat dissipation structure according to claim 1, characterized in that, The liquid cooling heat dissipation structure also includes a first flow pipe (70), the outlet of one end of the first flow pipe (70) is connected to the inlet of the flow channel (20), the heat exchange medium flows in from the inlet of the other end of the first flow pipe (70), and enters the flow channel (20) through the outlet of the first flow pipe (70); wherein, the inner diameter of the outlet of the first flow pipe (70) is smaller than the inner diameter of the portion between the two ends of the first flow pipe (70) to form a second constriction structure, the second constriction structure is used to increase the flow rate of the heat exchange medium entering the flow channel (20); The first flow tube (70) has an inner diameter that gradually decreases along the flow direction of the heat exchange medium at one end of the outlet, and the size becomes the smallest at the outlet. And / or, the liquid cooling heat dissipation structure further includes a second flow pipe (80), the inlet of one end of the second flow pipe (80) is connected to the outlet of the flow channel (20), the heat exchange medium flows into the inlet of the second flow pipe (80) from the outlet of the flow channel (20) and flows out through the outlet of the other end of the second flow pipe (80); wherein, the inner diameter of the inlet of the second flow pipe (80) is smaller than the inner diameter of the middle part of both ends of the second flow pipe (80) to form a second flared structure, the second flared structure is used to reduce the flow rate of the heat exchange medium flowing into the second flow pipe (80) from the flow channel (20); The second flow pipe (80) has an inner diameter that gradually increases along the flow direction of the heat exchange medium at one end of the inlet, and the inlet size of the second flow pipe (80) is the smallest.

12. The liquid-cooled heat dissipation structure according to claim 1, characterized in that, The liquid cooling structure also includes a connector. The heat sink (10) has at least one mounting hole (90), which is spaced apart from the flow channel (20). The connector is respectively engaged with the device to be cooled and the mounting hole (90) so that the heat sink (10) and the device to be cooled are in contact.

13. An air conditioner frequency inverter, characterized in that, The air conditioner inverter includes the liquid cooling heat dissipation structure according to any one of claims 1 to 12, and the air conditioner inverter also includes an air conditioner inverter module, which is the device to be cooled; the area of ​​the surface of the heat sink (10) that contacts the air conditioner inverter module is not less than the area of ​​the surface of the air conditioner inverter module that contacts the heat sink (10).

14. An electronic device, characterized in that, The electronic device includes the liquid cooling structure according to any one of claims 1 to 12.

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