Heat sink waterway, power module, power device and vehicle

Abstract

The application provides a heat dissipation water channel, a power module, a power device and a vehicle, which comprise a first plate member, a second plate member and a shielding fence, a liquid flow channel is enclosed between the first plate member and the second plate member, the second water channel plate part or the first water channel plate part is provided with a flow channel interface, the flow channel interface is communicated with the liquid flow channel, an outer surface of the first water channel plate part is provided with a first heat conduction surface, and an outer surface of the second water channel plate part is provided with a second heat conduction surface; the shielding fence is connected to the side plate part, and a side part shielding cavity is enclosed between the shielding fence and the side plate part. The heat dissipation water channel integrates the three functions of heat dissipation, assembly structure support and electromagnetic shielding, realizes efficient heat dissipation through two plate members to form a closed flow channel, and directly forms a shielding cavity through the side plate part and the shielding fence, thereby providing a convenient assembly space for filter devices, providing a compact shielding environment, and enabling the power module to be independently assembled and operated from the external shell and the heat dissipation water channel.

Description

Technical Field

[0001] This invention relates to the field of new energy equipment, and in particular to a heat dissipation channel, a power module, a power supply device, and a vehicle. Background Technology

[0002] In the new energy vehicle industry, integration is the main form of application for on-board components, including typical on-board chargers and DC-DC converters integrated into one unit. Early integration was completed by third-party suppliers, who independently designed, developed, and manufactured the integrated system according to the electrical and structural requirements of the OEM, and sold it as a whole to the OEM for assembly. In this approach, the integrated components still needed to be installed independently from other integrated components and connected to each other using cables.

[0003] As industry competition intensifies, the demands for cost, size, weight, and simplified assembly of powertrain components are increasing. Systems with higher integration, led by OEMs, are gradually becoming mainstream. This involves third-party suppliers providing functional modules without complete housings to OEMs, who then install these modules with different functions into a unified housing, achieving a higher degree of integration. As component manufacturers, to meet the requirements of different OEMs for functional modules, we must, on the one hand, minimize the size of these modules, and on the other hand, ensure that the modules can achieve complete functionality and assembly as independently as possible, allowing for easy installation into compatible housings.

[0004] However, existing technologies have the following problems: 1. The current overall structure of vehicle OBC and DC-DC combined power systems is based on the housing design. The heat dissipation channels and main circuit board are connected to the housing. The power devices that need to dissipate heat need to be attached to the water channels by means of crimping, bonding, etc. The entire circuit core cannot be separated from the housing to operate independently, which limits the core to be sold directly to customers as a whole.

[0005] 2. Currently, the circuit board of the vehicle-mounted OBC and DC-DC combined power system is installed on the housing with screws. On the one hand, the large number of screws affects production efficiency, and on the other hand, the screw connection is prone to loosening under vibration, which also brings reliability risks.

[0006] 3. As the EMC performance requirements of on-board charging systems become increasingly stringent, shielding of the entire unit's input and output filters is necessary. Traditional shielding cavities are based on the housing, but there are inevitably gaps at the junction of the housing and the circuit board, thus significantly reducing the shielding effectiveness.

[0007] This project aims to solve the above problems by providing a highly integrated, modular, and easy-to-assemble vehicle power supply solution based on cooling channels. Summary of the Invention

[0008] The first objective of this invention is to provide a heat dissipation channel that facilitates the assembly and arrangement of power modules.

[0009] A second objective of this invention is to provide a power module based on an integrated arrangement of heat dissipation channels.

[0010] A third objective of the present invention is to provide a power supply device having the above-described power module.

[0011] A fourth objective of the present invention is to provide a vehicle having the aforementioned power supply device.

[0012] To achieve the first objective of this invention, a heat dissipation channel is provided, comprising a first plate, a second plate, and a shielding enclosure; the first plate is provided with a first water channel plate portion and a side plate portion, the second plate is provided with a second water channel plate portion, the edge of the second water channel plate portion is sealed to the edge of the first water channel plate portion, the inner surface of the second water channel plate portion and the inner surface of the first water channel plate portion form a liquid flow channel, the second water channel plate portion or the first water channel plate portion is provided with a flow channel interface, the flow channel interface is connected to the liquid flow channel, the outer surface of the first water channel plate portion is provided with a first heat-conducting surface, and the outer surface of the second water channel plate portion is provided with a second heat-conducting surface; the shielding enclosure is connected to the side plate portion, and the shielding enclosure and the side plate portion form a side shielding cavity.

[0013] As can be seen from the above, the cooling water channel in this case integrates three major functions: heat dissipation, assembly structure support, and electromagnetic shielding. It achieves efficient heat dissipation by forming a closed flow channel through two plates. Furthermore, the side plate and the shielding fence directly form a shielding cavity, providing convenient assembly space for the filtering devices while also providing a tightly shielded environment. This fundamentally avoids the gap leakage problem caused by traditional casing splicing, significantly improving EMC performance. In addition, the heat-conducting surfaces on both sides can efficiently conduct heat to devices that generate waste heat, such as power devices and magnetic devices. This provides a structural environment for the cooling water channel to be assembled with the power module, which also allows the power module to be assembled and operated independently from the external casing and the cooling water channel.

[0014] A further proposed solution is that the first plate has side plates on opposite sides of the first waterway plate, and a shielding fence is installed on one of the side plates.

[0015] As can be seen from the above, the design of double-sided shielded enclosures allows the input filter and output filter to be placed in separate side shielded cavities on both sides, achieving physical and electromagnetic isolation between the input and output ports, effectively preventing signal crosstalk, and further optimizing the EMC characteristics of the whole machine.

[0016] A further proposed solution is to install a shielding baffle between the two shielding fences in the second panel, forming a central shielding cavity between the two shielding fences and the shielding baffle.

[0017] As can be seen from the above, the addition of shielding baffles also constructs a shielding cavity in the area between the two side shielding cavities. This provides space for placing magnetic devices such as transformers, inductors, or other circuit parts that need to be shielded, achieving all-round shielding coverage of key interference sources inside the power module and improving the cleanliness of the electromagnetic environment inside the module.

[0018] A further proposed solution is that the second plate and the two shielding fences are both located on the same surface side of the first plate. The two shielding fences are located on both sides of the first waterway plate in the width direction, and the shielding baffle extends along the width direction. The two shielding fences, the shielding baffle, and the outer surfaces of the second waterway plate form a central shielding cavity.

[0019] As can be seen from the above, this layout integrates all shielding structures and the second water channel plate on the same plane, resulting in a compact structure. The central shielding cavity is directly formed by the outer surface of the second water channel plate as one side cavity wall, making full use of the physical space of the water channel structure and achieving the reuse of heat dissipation and shielding functions, which greatly saves the overall volume and weight of the module.

[0020] A further proposed solution is to set the flow channel interface on the second water channel plate, with the flow channel interface and the shielding baffle located at opposite ends along the length.

[0021] As can be seen from the above, by arranging the flow channel interface and the shielding baffle (i.e. the central shielding cavity) at both ends of the length direction, the heat dissipation flow channel and the main electromagnetic shielding are separated in space. This layout is conducive to the connection of coolant pipelines and avoids the flow channel interface from interfering with the installation of internal components and the integrity of shielding. At the same time, it makes the spatial planning of thermal management and electromagnetic management inside the module clearer and more efficient.

[0022] A further proposed solution is that the first and second water channel plates are provided with multiple fixed connection holes, which are located outside the liquid flow channel and distributed around the outer periphery of the liquid flow channel.

[0023] As can be seen from the above, the fixed connection holes on the periphery provide a robust and reasonably distributed fixing anchor point for the connection between the entire heat dissipation channel assembly and the external casing. These connection points avoid the internal liquid flow channels, ensuring the sealing safety and structural strength of the water channel, making the final assembly of the module and the casing simple and reliable.

[0024] A further proposed solution is to provide a flow guide strip inside the liquid flow channel, with the flow guide strip adjacent to the inner surface of the second water channel plate and the inner surface of the first water channel plate, and the flow guide strip and the first water channel plate having a first connecting part.

[0025] As can be seen from the above, the flow guide not only guides the flow of coolant, optimizes the flow field, and enhances heat dissipation efficiency, but also provides a stable mechanical fixing point for the circuit board, enhancing the stability of the circuit board installation. Furthermore, when the first heat-conducting surface is thermally connected to electronic components such as power devices, the connection of the first connecting part ensures that the electronic components such as power devices are closely adjacent to the first heat-conducting surface.

[0026] A further proposed solution is that the first connecting part adopts a first welding needle, and a first insulating sleeve is provided on the outer periphery of the first welding needle. The first insulating sleeve is arranged between the first welding needle and the first water channel plate and the flow guide strip.

[0027] As can be seen from the above, using a soldering pin with an insulating sleeve as the first connection part realizes the functions of electrical connection and mechanical support, while ensuring the insulation between the soldering pin and the metal heat dissipation channel. This avoids the risk of electrical short circuit between the solder joints on the circuit board and the metal shell, simplifies the safety spacing design of the PCB board, and is conducive to the miniaturization of the PCB. Furthermore, by using the soldering pin, other electronic components can be soldered and fixed at the same time, which also reduces the application and assembly of screws, thereby reducing costs and improving production efficiency.

[0028] A further proposed solution is to extend the flow guide bar along its length and have at least two flow channel interfaces, which are respectively arranged on both sides of the flow guide bar in the width direction.

[0029] As can be seen above, by placing the flow channel interfaces on both sides of the guide strip and cooperating with the guide strip along the length direction, a U-shaped or more complex flow channel can be formed, which extends the path and residence time of the coolant in the water channel, ensuring that the coolant can fully carry away the heat distributed on the first and second heat conduction surfaces, and achieve uniform and efficient heat dissipation.

[0030] A further proposed solution is to provide a second connecting portion at the edge of the second waterway plate and the edge of the first waterway plate.

[0031] As can be seen from the above, the second connecting part is set at the edge of the water channel plate, which provides mechanical fixing points around the perimeter of the circuit board. At the same time, after the first heat-conducting surface is connected to the power device, the connection between the first connecting part and the second connecting part makes the first heat-conducting surface more flat and tightly adjacent to the power device, thereby ensuring heat conduction efficiency. The multiple connecting parts together form a multi-point and stable support for the circuit board, replacing the traditional screw fixing method.

[0032] A further proposed solution is to use a second welding needle for the second connection part, with a second insulating sleeve provided on the outer periphery of the second welding needle. The second insulating sleeve is arranged to insulate between the edge of the second welding needle and the edge of the second water channel plate and the edge of the first water channel plate.

[0033] As can be seen from the above, the second solder pin on the edge also adopts an insulated design, which not only achieves screwless assembly, but also improves production efficiency and connection reliability, avoids the safety compliance problem of large distances between the solder pin solder joints and components and traces on the PCB, and is conducive to the miniaturization design of PCB boards.

[0034] To achieve the second objective of this invention, this invention provides a power module, including a heat dissipation channel and a circuit module as described above; the circuit module includes a circuit board, a power device, a magnetic device, and a filter device, the power device is soldered to the surface of the circuit board, the magnetic device and the filter device are connected to the circuit board, and the circuit board, power device, liquid channel and magnetic device are stacked sequentially along the thickness direction; one of the power device and the magnetic device is thermally connected to a first heat-conducting surface, and the other of the power device and the magnetic device is thermally connected to a second heat-conducting surface, and the filter device is disposed in a side shielding cavity.

[0035] As can be seen from the above, the power module in this case achieves a high degree of integration. It uses a heat dissipation channel as its core framework, attaching the heat-generating power devices and magnetic devices to the heat-conducting surfaces on both sides of the channel for efficient heat dissipation. At the same time, the sensitive filter devices are built into the side shielding cavity of the channel itself. With the help of the stacked structure and functional partition layout, the power module has complete heat dissipation, shielding and operation capabilities without relying on any external casing, making it a truly independent and fully functional standardized product unit.

[0036] A further proposed solution involves stacking the circuit board, side plate, and filter components sequentially along the thickness direction. The side shielding cavity has an insertion opening on the side away from the side plate in the thickness direction. The filter components are installed into the side shielding cavity through the insertion opening. The side plate has a through-hole for connection, through which the conductive components of the filter components are connected to the circuit board.

[0037] As can be seen from the above, the filter components and circuit boards are arranged in a stacked manner and interconnected through the through-hole layout, resulting in an extremely compact structure that minimizes the horizontal area occupied by the modules. The open installation of the filter facilitates production and assembly. Furthermore, the side plate serves as the base plate of the side shielding cavity, directly transferring the heat generated by the filter to the main body of the heat dissipation channel, which is beneficial for the thermal management and shielding of the filter.

[0038] A further proposed solution is to install an insulating layer inside the side shielding cavity, which surrounds the outer periphery of the filter element. The insulating layer is adjacent to the shielding fence and the side plate. The side plate has a through hole for fixing, through which connecting screws pass to connect with the filter element.

[0039] As can be seen from the above, the insulating layer achieves electrical isolation between the filter components and the metal side shielding cavity, improving electrical safety. Furthermore, the filter components are directly fixed by using connecting screws through the side plate, establishing a high-strength mechanical connection and efficient heat conduction path from the filter to the heat dissipation channel. This method ensures reliable fixation and efficient heat dissipation. The installation of the filter components is entirely based on the heat dissipation channel, decoupling it from the circuit board above and avoiding stress interference between them.

[0040] A further improvement is that the side plate and the insulation layer are provided with operating through holes, which are opposite to the wiring holes of the filter device.

[0041] As can be seen from the above, the operating through hole provides an external operating channel for the wiring terminals on the filter. This allows for convenient connection of input and output cables from the outside even after the power module is fully assembled, greatly improving the convenience of final assembly.

[0042] A further proposed solution is to provide an insulating annular wall on the outer periphery of the operating through hole, with the insulating annular wall fitting with the inner wall of the operating through hole with a clearance.

[0043] As can be seen from the above, the insulating annular wall forms a protective sleeve, which ensures the insulation safety between the metal part of the external connection cable or the metal edge of the operating hole even if the metal part of the external connection cable or the tool accidentally touches the metal edge of the operating hole, thereby improving the safety of the product.

[0044] A further proposed solution is to place both the magnetic components and the filter components on the same side of the first plate, with electromagnetic shielding achieved between them via a shielding baffle.

[0045] As can be seen from the above, since magnetic devices are potential sources of interference and filter devices are sensitive devices, arranging magnetic devices and filter devices on the same side but separating them with a shielding baffle makes full use of the module's three-dimensional space. The shielding baffle effectively blocks the magnetic field generated by the magnetic devices from interfering with the filter, ensuring a clean working environment for the filter devices, thereby improving the overall EMC performance.

[0046] A further proposed solution is that the first plate has side plates on opposite sides of the first waterway plate, and a shielding fence is provided on one side plate. The filtering device includes an input filtering module and an output filtering module, which are respectively housed in a side shielding cavity. The input filtering module, magnetic device and output filtering module are arranged along the width direction.

[0047] As can be seen from the above, the layout is clear and reasonable. The input filter, magnetic device, and output filter are arranged along the width direction, the signal flow is clear, the filters on both sides are independently shielded, and the magnetic device area in the middle is also shielded, achieving a dual shielding effect of port isolation and internal functional area isolation, resulting in the best signal integrity and optimal EMC performance.

[0048] A further proposed solution is that the first and second water channel plates are provided with multiple fixed connection holes, which are located outside the liquid flow channel and distributed around the outer periphery of the liquid flow channel. The circuit board has clearance holes at positions corresponding to the thickness direction of the fixed connection holes.

[0049] As can be seen above, the clearance holes on the circuit board ensure that they do not obstruct the connection of the fixing pins or screws through the heat dissipation channels to the external housing. This achieves physical decoupling and process separation between the internal assembly of the power module (assembly of the circuit board and the heat dissipation channels) and the external assembly (assembly of the heat dissipation channels and the housing). The two assemblies do not interfere with each other, simplifying the production process, avoiding direct connection between the housing and the circuit board, reducing vibration interference to the components on the circuit board, and improving the durability of the equipment.

[0050] A further proposed solution is that the power device is thermally connected to the first heat-conducting surface, and the magnetic device is thermally connected to the second heat-conducting surface; the first water channel plate is provided with a first connecting part, the first connecting part adopts a first welding pin, and the first welding pin is welded to the circuit board.

[0051] As can be seen from the above, the power devices and magnetic devices are cooled by the two sides of the water channel respectively. The heat dissipation path is short and balanced. While realizing the electrical connection and fixation of the circuit board, the first solder pin can apply local pressure to the circuit board at its position, ensuring that the power devices are tightly attached to the first heat-conducting surface. This replaces the traditional unreliable spring clip crimping method, and the heat dissipation interface has smaller and more stable thermal resistance.

[0052] A further proposed solution is to provide a first insulating sleeve around the outer periphery of the first welding needle, with the first insulating sleeve being insulatingly arranged between the first welding needle and the first water channel plate.

[0053] As can be seen from the above, this insulation design allows the solder pins and solder joints to not need to maintain a large safety distance from the metal channels, and the PCB can arrange the traces and components closer to the solder joint area, thereby effectively reducing the area of ​​the PCB board and promoting the further miniaturization of the power module.

[0054] A further proposed solution is to have multiple second connecting parts on the edge of the first water channel plate. The second connecting parts are equipped with second welding pins, which are welded to the circuit board. The first connecting part is located between the multiple second connecting parts.

[0055] As can be seen from the above, the outer second solder pin, together with the inner first solder pin, forms a grid-like support and fixation for the circuit board. This distribution method makes the circuit board evenly stressed, with strong resistance to vibration and deformation, completely eliminating the risk of loosening caused by traditional screw fixing, greatly improving reliability, and also making the first heat-conducting surface more flat and closely adjacent to the power device, thereby ensuring heat conduction efficiency.

[0056] A further proposed solution is to provide a second insulating sleeve around the outer periphery of the second welding needle, with the second insulating sleeve being insulatingly arranged between the second welding needle and the first water channel plate.

[0057] As can be seen from the above, the insulation treatment of the edge solder pins enables the connection between the entire circuit board and the heat dissipation channel to be fully soldered and screwless. This not only improves the automation level and production efficiency of the assembly, but also fundamentally solves the reliability problem of screw connections that may loosen under vibration.

[0058] To achieve the third objective of this invention, this invention provides a power supply device, including a power module and a housing as described above; the power module is disposed inside the housing, and the heat dissipation channels are fixedly connected to the housing.

[0059] As can be seen from the above, the assembly of the power module makes the assembly of the power device extremely simple. It only requires placing the standardized power module, which integrates all functions and can operate independently, into the housing and locking it through a few fixed points reserved on the cooling water channel. This modular assembly method greatly reduces the assembly complexity, time and cost of the vehicle manufacturer's production line.

[0060] A further proposed solution is that the first and second water channel plates are provided with multiple fixed connection holes, which are located outside the liquid flow channel and distributed around the outer periphery of the liquid flow channel; the casing is provided with multiple fixed connection posts, and each fixed connection hole is fixedly connected to one fixed connection post.

[0061] As can be seen from the above, by using a few fixed connecting posts and holes, the cooling water channel and the housing are quickly and accurately positioned and firmly connected. This also avoids direct connection between the housing and the circuit board, reduces vibration interference to the components on the circuit board, and improves the durability of the equipment.

[0062] To achieve the fourth objective of the present invention, the present invention provides a means of transportation, including a power supply device as described above.

[0063] As can be seen from the above, vehicles equipped with the power supply unit of this case will benefit from the high integration, high reliability, excellent heat dissipation and EMC performance of their power supply system, as well as the maintenance convenience brought by modularity. The performance, safety and quality consistency of the vehicle's power system will be effectively improved. Attached Figure Description

[0064] Figure 1 This is a structural diagram of an embodiment of the power supply device of the present invention.

[0065] Figure 2 This is a structural diagram of an embodiment of the power supply device of the present invention from another perspective.

[0066] Figure 3 This is an exploded view of an embodiment of the power supply device of the present invention.

[0067] Figure 4 This is a structural diagram of the housing in an embodiment of the power supply device of the present invention.

[0068] Figure 5 This is a structural diagram of an embodiment of the power module of the present invention.

[0069] Figure 6 This is a structural diagram of an embodiment of the power module of the present invention from a second perspective.

[0070] Figure 7 This is a top view of an embodiment of the power module of the present invention.

[0071] Figure 8 This is an exploded view of an embodiment of the power module of the present invention.

[0072] Figure 9 This is a structural diagram of an embodiment of the power module of the present invention from a third-person perspective.

[0073] Figure 10 This is an exploded view of the circuit board and heat dissipation channels in an embodiment of the power module of the present invention.

[0074] Figure 11 This is a structural diagram of an embodiment of the heat dissipation channel of the present invention.

[0075] Figure 12 This is a structural diagram of an embodiment of the heat dissipation channel of the present invention from another perspective.

[0076] Figure 13 This is an exploded view of an embodiment of the cooling water channel of the present invention.

[0077] Figure 14 This is a cross-sectional view of an embodiment of the power supply device of the present invention at the first connection portion.

[0078] Figure 15 This is a cross-sectional view of an embodiment of the power supply device of the present invention at the liquid flow channel.

[0079] Figure 16 This is a cross-sectional view of the side shielding cavity in an embodiment of the power supply device of the present invention.

[0080] Figure 17 This is a cross-sectional view of an embodiment of the power supply device of the present invention at the fixed connection hole.

[0081] Figure 18 This is a cross-sectional view along the width direction of an embodiment of the power supply device of the present invention.

[0082] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0083] Reference Figures 1 to 18 The power supply device 1 includes a power module 2 and a housing. The housing includes a base 11 and a cover 12. The power module 2 is disposed inside the base 11 and covered by the cover 12. The base 11 forms a first magnetic device mounting slot 111, a second magnetic device mounting slot 112, a filter device mounting slot 113, a filter device mounting slot 114, two interfaces 115, an AC input interface 121, a DC-DC output interface 123, and a DC output interface 122 through the arrangement of multiple partition walls. All of the above interfaces are arranged on one side of the base 11 based on the length direction X, and the two interfaces 115 are arranged on the other side of the base 11 based on the length direction X. The two interfaces 115 are used to connect to two flow channel interfaces 323.

[0084] The power module 2 includes a heat dissipation channel 3 and a circuit module. The heat dissipation channel 3 includes a first plate 31, a second plate 32, and a shielding fence 33. The first plate 31 and the second plate 32 are integrally stamped plates. The first plate 31 is provided with a first water channel plate portion 311 and two side plate portions 312. The two side plate portions 312 are located on both sides of the first water channel plate portion 311 based on the width direction Y. The second plate 32 is provided with a second water channel plate portion 321. The second water channel plate portion 321 is raised in the thickness direction Z away from the first water channel plate portion 311. The edge of the second water channel plate portion 321 is sealed and connected to the edge of the first water channel plate portion 311. The inner surface of the second water channel plate portion 321 and the inner surface of the first water channel plate portion 311 form a liquid flow channel 300.

[0085] The liquid flow channel 300 is provided with a flow guide strip 313 and a flow disturbance support 314. The flow guide strip 313 extends along the length direction X and is located in the middle of the liquid flow channel 300. The flow guide strip 313 is adjacent to the inner surface of the second channel plate portion 321 and the inner surface of the first channel plate portion 311, thereby making the liquid flow channel 300 arranged in a U-shaped flow direction. The second channel plate portion 321 is provided with two flow channel interfaces 323. The two flow channel interfaces 323 are located on both sides of the flow guide strip 313 based on the width direction Y. The flow channel interfaces 323 are connected to the liquid flow channel 300. The flow disturbance support 314 is arranged on the outer periphery of the flow guide strip 313 and supported between the first channel plate portion 311 and the second channel plate portion 321. The outer surface of the first water channel plate portion 311 is provided with a first heat-conducting surface 310, and the outer surface of the second water channel plate portion 321 is provided with a second heat-conducting surface 320. The first heat-conducting surface 310 and the second heat-conducting surface 320 are arranged in a planar manner.

[0086] The shielding fence 33 is arranged in a rectangular frame. The lower edge of the shielding fence 33 is connected to the side plate 312 on one side. The shielding fence 33 and the side plate 312 form a side shielding cavity 330. The side shielding cavity 330 has an insertion opening 331 on the side away from the side plate 312 in the thickness direction Z. Each side shielding cavity 330 has a clearance notch 332 on the side close to the AC input interface 121 or DC output interface 122. The clearance notch 332 is used for assembling the interface.

[0087] The second plate 32 and the two shielding fences 33 are both disposed on the same surface side of the first plate 31. The second plate 32 is provided with a shielding baffle 322 between the two shielding fences 33. The shielding baffle 322 extends along the width direction Y and extends from one side of the shielding fence 33 to the other side of the shielding fence 33. The two shielding fences 33 are respectively located on both sides of the first water channel plate 311 based on the width direction Y. The two shielding fences 33, the shielding baffle 322, and the outer surfaces of the second water channel plate 321 form a central shielding cavity 3221. The flow channel interface 323 and the shielding baffle 322 are respectively located at both ends of the length direction X.

[0088] The first water channel plate 311 and the second water channel plate 321 are provided with a plurality of fixed connection holes 34. In this embodiment, four fixed connection holes 34 are used. The four fixed connection holes 34 are located outside the liquid flow channel 300 and are distributed at the four corners of the outer perimeter of the liquid flow channel 300. Two of the fixed connection holes 34 are located between the shielding fence 33 and the second heat-conducting surface 320, and the other two fixed connection holes 34 are located on the two outer sides of the flow channel interface 323 based on the width direction Y.

[0089] The flow guide bar 313 and the first water channel plate 311 are provided with a plurality of first connecting parts 316, which are distributed along the length direction X. The first connecting parts 316 adopt a first welding needle, and a first insulating sleeve 317 is provided on the outer periphery of the first welding needle. The first insulating sleeve 317 and the first welding needle are integrally injection molded. The fixed end of the first insulating sleeve 317 passes through the flow guide bar 313 and the first water channel plate 311 and is fixedly connected to the flow guide bar 313 and the first water channel plate 311. The first welding needle extends along the thickness direction Z. The welding end of the first welding needle is located on the opposite side of the second plate 32. The first insulating sleeve 317 is insulatingly arranged between the first welding needle, the first water channel plate 311, and the flow guide bar 313.

[0090] Multiple second connecting portions 318 are provided on the edges of the second water channel plate portion 321 and the first water channel plate portion 311. In this embodiment, the multiple second connecting portions 318 are distributed on both sides in the width direction, with four second connecting portions 318 on one side. The multiple second connecting portions 318 on the same side are distributed along the length direction X. The second connecting portions 318 adopt second welding pins, and a second insulating sleeve 319 is provided on the outer periphery of the second welding pins. The second insulating sleeve 319 and the second welding pin are integrally injection molded. The fixed end of the second insulating sleeve 319 passes through the second water channel plate portion 321 and the first water channel plate portion 311 and is fixedly connected to the second water channel plate portion 321 and the first water channel plate portion 311. The second welding pin extends along the thickness direction Z, and the welding end of the second welding pin is located on the opposite side of the second plate 32. The second insulating sleeve 319 is insulatingly arranged between the edges of the second water channel plate portion 321 and the edges of the first water channel plate portion 311. Each side plate portion is provided with a third welding pin, which extends along the thickness direction and is welded to the circuit board 4.

[0091] The circuit module includes a circuit board 4, a power device 42, a DC-DC module 44, magnetic devices 433 and 434, and filter devices. The power device 42 includes multiple power transistors and is soldered to the surface of the circuit board 4. The filter devices include an input filter module 431 and an output filter module 432. Magnetic devices 433 and 434, the input filter module 431, and the output filter module 432 are connected to the circuit board 4. The circuit board 4, the power device 42, the liquid flow channel 300, and the magnetic devices 433 and 434 are stacked sequentially along the thickness direction Z. The power device 42 is thermally connected to the first heat-conducting surface 310. To improve the heat conduction efficiency, thermally conductive adhesive can also be provided between the power device 42 and the first heat-conducting surface 310. The magnetic devices include, but are not limited to, inductors and transformers. Magnetic devices 433 and 434 are disposed in the central shielding cavity 3221 and are thermally connected to the second heat-conducting surface 320.

[0092] The input filter module 431 and the output filter module 432 are respectively disposed in the side shielding cavities 330 on both sides. The input filter module 431, magnetic devices 433 and 434, and the output filter module 432 are arranged along the width direction Y. Taking one side shielding cavity 330 as an example, the circuit board 4, the side plate 312, and the filter devices are stacked sequentially along the thickness direction Z. The side shielding cavity 330 has an insertion opening 331 on the side away from the side plate 312 in the thickness direction Z. The input filter module 431 or the output filter module 432 can be installed into the side shielding cavity 330 through the insertion opening 331. Each side plate 312 has a through hole 3121. The conductive part 4311 of the input filter module 431 passes through the through hole 3121 and is connected to the circuit board 4. The conductive part 4321 of the output filter module 432 passes through the through hole 3121 and is connected to the circuit board 4.

[0093] An insulating layer 333 is provided inside the side shielding cavity 330. The insulating layer 333 surrounds the outer periphery of the filter device. The insulating layer 333 is adjacent to the shielding fence 33 and the side plate portion 312. The side plate portion 312 is provided with a fixing through hole 3123. The connecting screw 3124 passes through the fixing through hole 3123 and is connected to the circuit board of the filter device. Specifically, the circuit board of the filter device is provided with a fixing post 3125. The connecting screw 3124 passes through the fixing through hole 3123 and is fixedly connected to the fixing post 3125. An insulating layer 3126 is provided between the circuit board 4 and the side plate portion 312.

[0094] An operation through hole 3122 is provided through the side plate 312 and the insulating layer 333. The operation through hole 3122 is opposite to the wiring hole 4311 of the input filter module 431. The connecting screw 4312 passes through the operation through hole 3122 and can be connected to the wiring hole 4311. An insulating annular wall 334 is provided on the outer periphery of the operation through hole 3122 of the insulating layer 333. The insulating annular wall 334 is clearance-fitted with the inner wall of the operation through hole 3122. Magnetic devices 433 and 434 and the filter device are all located on the same side of the first plate 31. The magnetic devices 433 and 434 are electromagnetically shielded from the filter device by a shielding baffle 322. The operation through hole 3122 is used for connecting the AC input interface 121 and the DC output interface 122, respectively.

[0095] The power device 42 is thermally connected to the first heat-conducting surface 310. The first welding pin is welded to the first welding hole of the circuit board 4. The outer end of the first insulating sleeve 317 is adjacent to the edge of the first welding hole. The second welding pin is welded to the second welding hole of the circuit board 4. The outer end of the second insulating sleeve 319 is adjacent to the edge of the second welding hole. The first insulating sleeve 317 and the second insulating sleeve 319 can provide a certain degree of support and positioning for the circuit board 4, thereby fixing the distance between the first heat-conducting surface 310 and the circuit board 4, so that the power device 42 and the first heat-conducting surface 310 maintain a stable thermal conduction connection.

[0096] Magnetic devices 433 and 434 are thermally connected to the second heat-conducting surface 320. Magnetic devices 433 and 434 are respectively provided with welding ends, which pass through the first plate 31 and the second plate 32 and are welded to the circuit board 4.

[0097] The base 11 is provided with a plurality of fixed connecting posts 117. The position of a fixed connecting hole 34 is opposite to the position of a fixed connecting post 117. The circuit board 4 is provided with a clearance hole 411 at the corresponding position of each fixed connecting hole 34 based on the thickness direction Z. A fixed connecting hole 34 and a fixed connecting post 117 are fixedly connected by a connecting screw 118. Each connecting screw 118 passes through the clearance hole 411, so that the circuit board 4 is not directly connected to the base 11, but indirectly connected through the heat dissipation channel 3.

[0098] In this embodiment, the DCDC module 44 includes a circuit board 441, a power transistor 442, an output copper busbar 443, an inductor, and a transformer 433. The power transistor 442 is soldered onto the circuit board 441 and is located on one side close to the second heat-conducting surface 320 and is thermally connected to the second heat-conducting surface 320.

[0099] In terms of circuit layout, magnetic device 433 is set in the first magnetic device mounting slot 111, magnetic device 434 is set in the second magnetic device mounting slot 112, input filter module 431 is set in the filter device mounting slot 114, and output filter module 432 is set in the filter device mounting slot 113.

[0100] Circuit board 4, power device 42, first heat-conducting surface 310, liquid flow channel 300 and second heat-conducting surface 320 are stacked sequentially along the thickness direction Z. Magnetic core device 433 and 434 and DC-DC module 44 are disposed in the central shielding cavity. Magnetic core device 433 and 434 and DC-DC module 44 are thermally connected to the second heat-conducting surface 320. Input filter module 431, DC-DC module 44 and output filter module 432 are arranged along the width direction Y. Magnetic core device 433 and 434 and DC-DC module 44 are arranged along the length direction X.

[0101] Circuit board 4, one side plate 312 and input filter module 431 are stacked sequentially along the thickness direction Z, and circuit board 4, the other side plate 312 and output filter module 432 are stacked sequentially along the thickness direction Z. Circuit board 4 is provided with signal interface 124, DC-DC module 44 is provided with low-voltage DC interface 123, input filter module 431 is provided with AC input interface 121, and output filter module 432 is provided with DC output interface 122. AC input interface 121, low-voltage DC interface 123, signal interface 124 and DC output interface 122 are all located on the same side along the length direction X. Output copper busbar 443 bypasses shielding baffle 322 and connects to low-voltage DC interface 123.

[0102] Example of a means of transportation: The transportation vehicle includes the power supply device 1 of the above scheme. The transportation vehicle can be a new energy electric car, a new energy electric bus, a new energy electric freight car, a new energy electric cleaning vehicle, a new energy electric rail transit vehicle, a new energy electric air transport vehicle, a new energy electric shipping vehicle, etc.

[0103] Of course, the above embodiments are only preferred embodiments of this case, and there can be more variations in specific applications. For example, only one side plate can be set to isolate the filter device, the magnetic device can be thermally connected to the first heat-conducting surface, and the power device can be thermally connected to the second heat-conducting surface. This can also achieve the purpose of this case. As for the number of the first and second welding pins, the number and position can be adjusted according to actual needs. The arrangement position of the first welding pin is also unrestricted. All the above changes are within the protection scope of this invention.

Claims

1. A heat dissipation channel, characterized in that, Includes the first panel, the second panel, and the shielding fence; The first plate has a first water channel plate portion and a side plate portion, and the second plate has a second water channel plate portion. The edge of the second water channel plate portion is sealed to the edge of the first water channel plate portion. A liquid flow channel is formed between the inner surface of the second water channel plate portion and the inner surface of the first water channel plate portion. The second water channel plate portion or the first water channel plate portion is provided with a flow channel interface, which communicates with the liquid flow channel. The outer surface of the first water channel plate portion is provided with a first heat-conducting surface, and the outer surface of the second water channel plate portion is provided with a second heat-conducting surface. The shielding fence is connected to the side plate, and the shielding fence and the side plate form a side shielding cavity.

2. The heat dissipation channel according to claim 1, characterized in that: The first plate has side plates on both sides opposite to the first waterway plate, and a shielding fence is provided on each side plate.

3. The heat dissipation channel according to claim 2, characterized in that: The second plate has a shielding baffle between the two shielding fences, and the two shielding fences and the shielding baffle form a central shielding cavity.

4. The heat dissipation channel according to claim 3, characterized in that: The second plate and the two shielding fences are both disposed on the same surface side of the first plate. The two shielding fences are respectively located on both sides of the first waterway plate in the width direction. The shielding baffle extends along the width direction. The two shielding fences, the shielding baffle and the outer surface of the second waterway plate form the central shielding cavity.

5. The heat dissipation channel according to claim 4, characterized in that: The flow channel interface is disposed on the second water channel plate, and the flow channel interface and the shielding baffle are located at opposite ends in the length direction.

6. The heat dissipation channel according to claim 1, characterized in that: The first water channel plate and the second water channel plate are provided with a plurality of fixed connection holes, which are located outside the liquid flow channel and distributed on the outer periphery of the liquid flow channel.

7. The heat dissipation channel according to claim 1, characterized in that: A flow guide strip is provided inside the liquid flow channel. The flow guide strip is adjacent to the inner surface of the second water channel plate and the inner surface of the first water channel plate. A first connecting part is provided between the flow guide strip and the first water channel plate.

8. The heat dissipation channel according to claim 7, characterized in that: The first connecting part adopts a first welding needle, and a first insulating sleeve is provided on the outer periphery of the first welding needle. The first insulating sleeve is arranged to insulate between the first welding needle, the first water channel plate, and the flow guide strip.

9. The heat dissipation channel according to claim 7, characterized in that: The flow guide strip extends along its length, and the number of flow channel interfaces is at least two, with the flow channel interfaces respectively arranged on both sides of the flow guide strip in the width direction.

10. The heat dissipation channel according to any one of claims 1 to 9, characterized in that: The edges of the second waterway plate and the edges of the first waterway plate are provided with a second connecting portion.

11. The heat dissipation channel according to claim 10, characterized in that: The second connecting part adopts a second welding needle, and a second insulating sleeve is provided on the outer periphery of the second welding needle. The second insulating sleeve is arranged between the edge of the second welding needle and the edge of the second water channel plate and the edge of the first water channel plate.

12. A power supply module, characterized in that, Includes the cooling channels and circuit modules as described in any one of claims 1 to 11; The circuit module includes a circuit board, a power device, a magnetic device, and a filter device. The power device is soldered to the surface of the circuit board. The magnetic device and the filter device are connected to the circuit board. The circuit board, the power device, the liquid flow channel, and the magnetic device are stacked sequentially along the thickness direction. One of the power device and the magnetic device is thermally connected to the first heat-conducting surface, and the other of the power device and the magnetic device is thermally connected to the second heat-conducting surface. The filter device is disposed in the side shielding cavity.

13. The power module according to claim 12, characterized in that: The circuit board, the side plate, and the filter are stacked sequentially along the thickness direction. The side shielding cavity has an insertion opening on the side away from the side plate in the thickness direction. The filter is installed into the side shielding cavity through the insertion opening. The side plate has a through hole, and the conductive part of the filter passes through the through hole to connect to the circuit board.

14. The power module according to claim 13, characterized in that: An insulating layer is provided inside the side shielding cavity. The insulating layer surrounds the outer periphery of the filter device. The insulating layer is adjacent to the shielding fence and the side plate. The side plate has a through hole for fixing. A connecting screw passes through the through hole and connects to the filter device.

15. The power module according to claim 14, characterized in that: An operation through hole is provided through the side plate and the insulating layer, and the operation through hole is opposite to the wiring hole of the filter device.

16. The power module according to claim 15, characterized in that: The insulating layer has an insulating annular wall on the outer periphery of the operating through hole, and the insulating annular wall is in clearance fit with the inner wall of the operating through hole.

17. The power module according to claim 13, characterized in that: The magnetic device and the filter device are both disposed on the same side of the first plate, and electromagnetic shielding between the magnetic device and the filter device is achieved by the shielding baffle.

18. The power module according to claim 17, characterized in that: The first plate has side plates on opposite sides of the first waterway plate, and a shielding fence is provided on each side plate. The filtering device includes an input filtering module and an output filtering module, which are respectively disposed in a side shielding cavity. The input filtering module, the magnetic device, and the output filtering module are arranged along the width direction.

19. The power module according to claim 12, characterized in that: The first water channel plate and the second water channel plate are provided with a plurality of fixed connection holes, which are located outside the liquid flow channel and distributed on the outer periphery of the liquid flow channel. The circuit board has clearance holes at positions corresponding to the fixed connection holes in the thickness direction.

20. The power module according to any one of claims 12 to 19, characterized in that: The power device is thermally connected to the first heat-conducting surface, and the magnetic device is thermally connected to the second heat-conducting surface; The first waterway plate is provided with a first connecting part, and the first connecting part adopts a first welding pin, which is welded to the circuit board.

21. The power module according to claim 20, characterized in that: A first insulating sleeve is provided on the outer periphery of the first welding needle, and the first insulating sleeve is arranged between the first welding needle and the first water channel plate.

22. The power module according to claim 20, characterized in that: The edge of the first water channel plate is provided with a plurality of second connecting parts. The second connecting parts are made of second welding pins and are welded to the circuit board. The first connecting part is located between the plurality of second connecting parts.

23. The power module according to claim 22, characterized in that: A second insulating sleeve is provided on the outer periphery of the second welding needle, and the second insulating sleeve is arranged between the second welding needle and the first water channel plate.

24. A power supply device, characterized in that, Includes the power module and housing as described in any one of claims 12 to 23 above; The power module is housed inside the casing, and the cooling water channel is fixedly connected to the casing.

25. The power supply device according to claim 24, characterized in that: The first water channel plate and the second water channel plate are provided with a plurality of fixed connection holes, which are located outside the liquid flow channel and distributed on the outer periphery of the liquid flow channel. The housing is provided with multiple fixed connecting posts, and one of the fixed connecting holes is fixedly connected to one of the fixed connecting posts.

26. A means of transport, characterized in that, Includes the power supply device as described in claim 24 or 25 above.

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