A logging instrument thermal management system and control method based on gas-liquid phase change

Abstract

The present application belongs to the technical field of well logging heat management, and discloses a well logging instrument heat management system and control method based on gas-liquid phase change. The system comprises a refrigerant supply structure, a fluid control assembly, a circuit skeleton and an adsorption device. The fluid control assembly comprises a solenoid valve. The circuit skeleton is used to carry downhole electronic devices, and the inside of the circuit skeleton is provided with a two-phase heat exchange flow channel and flow channel inlets and outlets formed at both ends. The refrigerant supply structure, the solenoid valve, the two-phase heat exchange flow channel and the adsorption device are sequentially communicated through fluid pipelines. The refrigerant supply structure is used to charge liquid refrigerant into the two-phase heat exchange flow channel under the control of the solenoid valve. The two-phase heat exchange flow channel is used to provide gas-liquid phase change and flow space for the refrigerant to achieve cooling heat management of the downhole electronic devices through phase change latent heat. The adsorption device is used to adsorb and process gaseous refrigerant after heat exchange. The present application can realize sufficient and uniform heat exchange of the carried electronic devices by absorbing surrounding heat through phase change latent heat.

Description

Technical Field

[0001] This invention belongs to the technical field of well logging thermal management, and more specifically, relates to a well logging instrument thermal management system and control method based on gas-liquid phase change. Background Technology

[0002] With the ever-increasing demand for petroleum resources, deep-sea oil fields have become a hotspot for oil exploration and development. During deep-sea exploration, downhole temperatures rise sharply with increasing depth. When logging instruments perform their tasks, the high-power, high-precision electronic components inside continuously generate a large amount of heat. Within the confined, high-temperature tubular space, this heat is difficult to dissipate effectively, easily leading to overheating failure of the electronic components. Developing high-temperature resistant electronic components is an intuitive solution to this challenge; however, due to the physical limitations of semiconductor materials, high development costs, and extremely long development cycles, this approach has significant limitations and cannot universally meet the urgent needs of current high-integration computing and high-precision measurement. Therefore, equipping logging instruments with an efficient and reliable thermal management system has become an inevitable choice.

[0003] However, existing thermal management systems have shown significant shortcomings when faced with extremely long logging missions. Patent CN115379720B discloses a liquid-cooled phase change thermal management device and method. While this solid-liquid phase change thermal management system is technically mature and reliable, its capacity is limited by the internal volume of the logging instrument, resulting in a physical upper limit to the heat storage capacity of the phase change material, which cannot meet the continuous heat dissipation requirements of extremely long logging missions. Patent CN109788715B discloses an active cooling system for downhole circuits using TEC semiconductor cooling chips. While this thermoelectric cooling system has the advantage of compact size, its cooling efficiency is too low, making it unsuitable for the cooling needs of high-power devices inside large logging instruments. Patent CN109653708A discloses a vapor compression downhole cooling device. The vapor compression refrigeration cycle theoretically has the best cooling energy efficiency ratio, but this system introduces high-speed mechanical moving parts such as compressors. Its reliability needs further verification under extreme downhole conditions of high temperature, high pressure, and strong vibration. In summary, existing technologies struggle to balance ultra-long battery life, high cooling power, and high system reliability, necessitating a novel thermal management architecture. Summary of the Invention

[0004] To address the aforementioned deficiencies or improvement needs of existing technologies, this invention provides a logging instrument thermal management system and control method based on gas-liquid phase change. This system addresses the objective engineering challenge of existing ultra-deep logging instruments operating in high-temperature downhole environments, where the high-power, high-precision electronic components inside continuously generate a large amount of heat that is difficult to dissipate, easily leading to overheating failure. The invention aims to provide a stable cooling effect for logging instruments, ensuring that downhole electronic components can reliably perform logging tasks in high-temperature environments.

[0005] To achieve the above objectives, according to one aspect of the present invention, a logging tool thermal management system based on gas-liquid phase change is provided, comprising a refrigerant supply structure, a fluid control component, and a circuit frame housed within a heat insulation component, and an adsorption device connected to the heat insulation component; the fluid control component includes a solenoid valve; the circuit frame is used to mount downhole electronic devices, and the circuit frame has a two-phase heat exchange channel inside, with a channel inlet and a channel outlet formed at both ends of the circuit frame; the refrigerant supply structure, the solenoid valve, the two-phase heat exchange channel, and the adsorption device are sequentially connected through fluid pipelines; The refrigerant supply structure is used to charge liquid refrigerant into the two-phase heat exchange channel under the control of the solenoid valve. The two-phase heat exchange channel is used to provide gas-liquid phase change and flow space for the refrigerant to achieve cooling thermal management of downhole electronic devices through the latent heat of phase change. The adsorption device is used to adsorb and treat the gaseous refrigerant after heat exchange.

[0006] The logging tool thermal management system based on gas-liquid phase change provided by the present invention further includes a one-way valve, which is disposed in the fluid pipeline between the downstream of the circuit skeleton and the upstream of the adsorption device, for limiting the one-way flow of gaseous refrigerant toward the adsorption device. And / or, the fluid control assembly further includes a throttling assembly connected in series in the fluid line downstream of the solenoid valve.

[0007] According to the gas-liquid phase change-based logging tool thermal management system provided by the present invention, the heat insulation component includes a pressure-bearing thermos bottle and an axial heat insulation plug; the pressure-bearing thermos bottle has a metal shell; the axial heat insulation plug is respectively filled at both ends of the internal cavity of the pressure-bearing thermos bottle, and a vacuum heat insulation cavity is also embedded in the circumferential direction inside the bottle body of the pressure-bearing thermos bottle; The pressure-bearing thermos bottle has a communication opening at one end connected to the adsorption device, and the fluid pipeline connected downstream of the circuit frame passes through the communication opening and connects to the upstream of the adsorption device.

[0008] According to the gas-liquid phase change-based logging tool thermal management system provided by the present invention, the refrigerant supply structure includes a high-pressure liquid refrigerant container, which includes a container shell, a liquid phase end cap, a gas phase end cap, and a piston. The liquid phase end cap and the gas phase end cap are assembled at both ends of the container shell; the piston is slidably disposed inside the container shell, dividing the inside of the container shell into two independent sealed areas for storing liquid refrigerant and compressed gas. When the solenoid valve is opened, the liquid refrigerant is pushed into the two-phase heat exchange channel by the compressed gas.

[0009] According to the gas-liquid phase change-based logging tool thermal management system provided by the present invention, the initial injection pressure of the compressed gas is higher than the physical constant value of the saturated vapor pressure of the liquid refrigerant at a preset temperature threshold, so that the liquid refrigerant in the high-pressure liquid refrigerant container remains liquid during operation.

[0010] According to the gas-liquid phase change-based logging tool thermal management system provided by the present invention, the adsorption device includes a pressure-bearing shell and an adsorption gas distribution assembly disposed inside the pressure-bearing shell. The adsorption gas distribution assembly includes a central gas equalization pipe and a solid adsorbent layer sleeved on the outer periphery of the central gas equalization pipe. The central gas equalization pipe has gas distribution holes on its pipe wall, and the flow channel outlet is connected to one end of the central gas equalization pipe through a fluid pipeline.

[0011] According to the gas-liquid phase change-based logging tool thermal management system provided by the present invention, the fluid control component further includes a pressure sensor, the probe of which is connected to the interior of the refrigerant supply structure to monitor the real-time pressure of the internal liquid refrigerant.

[0012] The logging tool thermal management system based on gas-liquid phase change provided by the present invention further includes a control module disposed on the circuit skeleton. The control module includes a main control circuit, a valve control drive circuit, a power supply module, and a temperature sensor for monitoring downhole electronic devices. The temperature sensor and the pressure sensor are respectively communicatively connected to the main control circuit, and the main control circuit is signal-connected to the valve-controlled drive circuit; the valve-controlled drive circuit is electrically connected to the solenoid valve; the power supply module is respectively connected to the main control circuit and the valve-controlled drive circuit.

[0013] According to another aspect of the present invention, a logging tool thermal management control method based on gas-liquid phase change is provided. Based on the logging tool thermal management system based on gas-liquid phase change described in any one of the preceding claims, the control method includes: Monitor and acquire the temperature of preset measurement points of downhole electronic devices, and compare it with preset temperature thresholds; If the temperature at the measuring point exceeds the preset temperature threshold, the solenoid valve is driven to perform a single-pulse opening action to inject liquid refrigerant into the two-phase heat exchange channel in a pulse manner for heat exchange and cooling.

[0014] According to the logging tool thermal management control method based on gas-liquid phase change provided by the present invention, driving the solenoid valve to perform a single-pulse opening action specifically includes: If the temperature at the measuring point exceeds the preset temperature threshold, the real-time pressure value of the liquid refrigerant in the refrigerant supply structure is obtained, and the opening degree and / or opening time of the solenoid valve are determined based on the real-time pressure value, so that a single pulse opens and releases a fixed amount of liquid refrigerant.

[0015] In summary, compared with the prior art, the thermal management system and control method for logging tools based on gas-liquid phase change provided by this invention offer the following advantages: 1. The system of the present invention is sequentially connected through a refrigerant supply structure, a circuit frame, and an adsorption device. During the downhole operation of the logging tool, liquid refrigerant is introduced into the two-phase heat exchange channel through the refrigerant supply structure via a solenoid valve. The liquid refrigerant undergoes flash evaporation upon entering the two-phase heat exchange channel and moves along the channel under the action of initial kinetic energy and flash evaporation expansion force. It absorbs the surrounding heat using the latent heat of phase change to cool down the mounted electronic devices. Furthermore, the adsorption device adsorbs and collects the gaseous refrigerant at the channel outlet, which can maintain the pressure range within the two-phase heat exchange channel. This facilitates the continuous evaporation and phase change of the refrigerant to fully realize the evaporation and phase change and improve the heat exchange capacity. It also ensures the smooth flow of the refrigerant so that the refrigerant can fully penetrate the entire channel and achieve sufficient and uniform heat exchange for the mounted electronic devices. 2. The system of this invention features a one-way valve between the circuit frame and the low-pressure adsorption container, unidirectionally blocking the backflow of fluid. This structure reliably prevents the high-temperature gaseous heat generated during adsorption from flowing back into the circuit frame, ensuring the independence of the phase change refrigeration zone. The structure also physically blocks heat conduction and convection through a pressure-bearing insulated bottle containing a vacuum insulation cavity and an axial heat-insulating plug. This design effectively isolates radial and axial heat leakage from the downhole environment, objectively reducing the refrigeration load required to maintain the system's operating temperature range. 3. The system of the present invention utilizes gas pressure to drive the phase change of liquid refrigerant to absorb heat and adsorbent to capture and form a low-pressure zone in the flow channel. The circuit is driven by physical phase change and adsorption. This structure avoids high-speed mechanical compression components, eliminates the risk of mechanical wear and downtime in downhole high temperature, high pressure and strong vibration conditions, and improves hardware reliability. 4. The control method of the present invention is based on the physical law that the driving pressure decreases with the consumption of refrigerant. It calculates and compensates the injection pulse width by retrieving the real-time pressure value so that a fixed amount of refrigerant is injected with each pulse. This logic ensures that the volume of refrigerant released by the solenoid valve in a single operation is constant during the operating condition decay cycle, avoiding excessive and ineffective consumption caused by the initial pressure and ensuring the system's ultra-long working time under limited loading volume. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the architecture of the logging tool thermal management system based on gas-liquid phase change provided by the present invention.

[0017] Figure 2 This is a schematic diagram of the fluid path and heat flow direction of the thermal management system.

[0018] Figure 3 This is a schematic diagram of a high-pressure liquid refrigerant container.

[0019] Figure 4 This is a schematic diagram of the circuit skeleton.

[0020] Figure 5 This is the system's electromechanical signal connection topology diagram.

[0021] Figure 6 This is the logic flowchart for adaptive valve control pulse signals.

[0022] Figure 7 This is an experimental effect diagram of the present invention in a specific implementation scenario.

[0023] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein: 100-High-pressure liquid refrigerant container; 101-Compressed gas; 102-Piston; 103-Liquid refrigerant; 104-Container shell; 105-Liquid phase end cap; 106-Gas phase end cap; 107-Wire channel; 108-Wire binding channel; 200-Fluid control assembly; 201-Pressure sensor; 202-Solenoid valve; 203-Sealing quick connector; 204-Throttling assembly; 205-Metal connecting cover; 300-Electrical... 310-Downhole electronic components; 311-Valve-controlled drive circuit; 312-Main control circuit; 313-Power module; 314-Downhole measurement circuit; 320-Two-phase heat exchange channel; 330-Skeleton metal body; 400-Low-pressure adsorption container; 401-Adsorbent; 402-Pressure-bearing shell; 500-Insulation components; 510-Axial heat insulation plug; 520-Pressure-bearing thermos bottle; 521-Vacuum insulation cavity; 6-One-way valve. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0025] Please see Figure 1 and Figure 2This embodiment provides a logging tool thermal management system based on gas-liquid phase change. The logging tool thermal management system includes a refrigerant supply structure, a fluid control component 200, and a circuit frame 300 housed within a heat insulation component 500, as well as an adsorption device connected to the heat insulation component 500. The fluid control component 200 includes a solenoid valve 202. The circuit frame 300 is used to mount downhole electronic devices 310, and a two-phase heat exchange channel 320 is provided inside the circuit frame 300, with a channel inlet and a channel outlet formed at both ends. The refrigerant supply structure, the solenoid valve 202, the two-phase heat exchange channel 320, and the adsorption device are sequentially connected via fluid pipelines. The refrigerant supply structure is used to charge liquid refrigerant 103 into the two-phase heat exchange channel 320 under the control of the solenoid valve 202. The two-phase heat exchange channel 320 is used to provide gas-liquid phase change and flow space for the refrigerant so as to achieve cooling thermal management of downhole electronic devices 310 through the latent heat of phase change. The adsorption device is used to adsorb and treat the gaseous refrigerant after heat exchange.

[0026] In this embodiment, the refrigerant supply structure, fluid control component 200, and circuit frame 300 are all housed inside the heat insulation component 500. Solenoid valve 202 is located in fluid control assembly 200; two-phase heat exchange channel 320 is integrated inside circuit skeleton 300, and downhole electronic device 310 is mounted on the outside of circuit skeleton 300; during the downhole operation of logging tool, liquid refrigerant 103 is introduced into two-phase heat exchange channel 320 by refrigerant supply structure through solenoid valve 202. Liquid refrigerant 103 undergoes flash evaporation upon entering two-phase heat exchange channel 320 and moves along the channel under the action of initial kinetic energy and flash evaporation expansion force. It absorbs the surrounding heat by utilizing the latent heat of phase change to cool down the mounted electronic device. Furthermore, the gaseous refrigerant at the channel outlet is adsorbed and collected by adsorption device, which can maintain the pressure range in two-phase heat exchange channel 320. This is conducive to the continuous phase change of refrigerant evaporation to fully realize the phase change of evaporation and improve the heat exchange capacity, and ensures the smooth flow of refrigerant so that the refrigerant can fully penetrate the entire channel to achieve full and uniform heat exchange for mounted electronic device.

[0027] In some embodiments, the logging tool thermal management system further includes a one-way valve 6, which is located in the fluid pipeline between the downstream of the circuit frame 300 and the upstream of the adsorption device, for restricting the one-way flow of gaseous refrigerant toward the adsorption device.

[0028] In a further preferred embodiment, the fluid control component 200 is connected to the circuit frame 300, the circuit frame 300 is connected to the one-way valve 6, and the one-way valve 6 is connected to the adsorption device via corrugated metal hoses for static sealing. The liquid refrigerant 103 is preferably pure water. The corrugated metal hose connection provides the fluid pipeline with a certain degree of flexibility and vibration resistance, enabling it to adapt well to the downhole vibration environment.

[0029] Optionally, the fluid control component 200 further includes a throttling component 204, which is connected in series in the fluid pipeline downstream of the solenoid valve 202. The solenoid valve 202 can also be configured as an electronic expansion valve to generate a throttling effect, initially throttling the liquid refrigerant 103 flowing into the two-phase heat exchange channel 320 to better promote the evaporation phase change of the refrigerant. The two-phase heat exchange channel 320 can be in a pre-vacuum state, i.e., pre-vacuumed before use downhole, so that a negative pressure state can be maintained during operation. This negative pressure can be used to promote the evaporation phase change of the refrigerant, allowing for a more complete phase change and thus improving the heat exchange effect. The adsorption device can also be in a pre-vacuum state. The liquid refrigerant 103 can also be charged into the two-phase heat exchange channel 320 at a preset pressure, making the inlet pressure of the two-phase heat exchange channel 320 higher than the outlet pressure, which is beneficial for better maintaining the continuous evaporation and flow of the refrigerant. The outlet pressure of the two-phase heat exchange channel 320 can be lower than the saturation pressure corresponding to the preset temperature threshold to ensure the smooth phase change of the refrigerant. The preset temperature threshold can be set according to the target temperature control temperature of the electronic device, and can be set based on experience. Generally, the temperature limit of the downhole electronic device 310 does not exceed 175°C. For example, the preset temperature threshold can be set to 150°C.

[0030] In some embodiments, the heat insulation component 500 includes a pressure-bearing thermos bottle 520 and an axial heat insulation plug 510; the pressure-bearing thermos bottle 520 has a metal shell; the axial heat insulation plugs 510 are respectively filled at both ends of the internal cavity of the pressure-bearing thermos bottle 520, and a vacuum insulation cavity 521 is also embedded in the circumferential direction inside the bottle body of the pressure-bearing thermos bottle 520; the outside of the pressure-bearing thermos bottle 520 is exposed to the downhole environment, it withstands the environmental pressure through the metal shell, and is isolated from radially conducted heat flow through the vacuum insulation cavity 521; the system's signal lines and fluid lines are led out to the outside through the axial heat insulation plug 510.

[0031] The pressure-bearing thermos flask 520 has a communication opening at one end connected to the adsorption device. A fluid pipeline connected downstream of the circuit frame 300 passes through the communication opening and connects to the upstream of the adsorption device. The first end of the pressure-bearing thermos flask 520 is open and detachably connected to a heat-insulating end cap. The second end of the pressure-bearing thermos flask 520 has a communication opening, and the adsorption device is connected to the second end of the pressure-bearing thermos flask 520.

[0032] The diameter of the connecting opening is smaller than the diameter of the internal cavity of the pressure-bearing thermos flask 520, resulting in an axial limiting step formed on the inner wall of the second end of the pressure-bearing thermos flask 520; the axial heat insulation plug 510 at the second end abuts against the axial limiting step. The refrigerant supply structure, fluid control component 200, and circuit frame 300 are sequentially arranged from the first end to the second end within the internal cavity of the pressure-bearing thermos flask 520; a metal cylinder is provided around the fluid control component 200, and the metal cylinder is matched to the inner wall of the pressure-bearing thermos flask 520; the refrigerant supply structure, the metal cylinder, and the circuit frame 300 are fixed axially. The copper metal is formed by splicing multiple metal connecting cover plates 205, which can be easily opened for installation or maintenance.

[0033] A vacuum insulation cavity 521 can also be provided at the second end of the pressure-bearing thermos bottle 520, near the end of the connecting opening close to the axial heat insulation plug 510. This vacuum insulation cavity 521 can be connected with the vacuum insulation cavity 521 embedded inside the body of the pressure-bearing thermos bottle 520 to better form a heat insulation effect at the end.

[0034] In some embodiments, reference Figure 1 and Figure 3 The refrigerant supply structure includes a high-pressure liquid refrigerant 103 container 100, which includes a container shell 104, a liquid phase end cap 105, a gas phase end cap 106, and a piston 102. The liquid phase end cap 105 and the gas phase end cap 106 are assembled at both ends of the tubular container shell 104. The piston 102 is slidably and sealably disposed inside the container shell 104, dividing the interior of the container shell 104 into two independent sealed areas for storing liquid refrigerant 103 and compressed gas 101. When the solenoid valve 202 is opened, the liquid refrigerant 103 is pushed into the two-phase heat exchange channel 320 by the compressed gas 101.

[0035] The compressed gas 101 is preferably nitrogen or air. In a further preferred embodiment, a sliding seal is provided between the piston 102 and the inner wall of the container shell 104 to achieve dynamic isolation; the surface of the container shell 104 is provided with a wire binding groove 108 and a wire passage groove 107 along the axial direction, and the system's signal line is embedded in the wire passage groove 107; then it passes through the axial heat insulation plug 510.

[0036] In some embodiments, the initial injection pressure of the compressed gas 101 is higher than the physical constant value of the saturated vapor pressure of the liquid refrigerant 103 at a preset temperature threshold, so that the liquid refrigerant 103 in the high-pressure liquid refrigerant 103 container 100 remains liquid during operation.

[0037] In some embodiments, the fluid control assembly 200 further includes a pressure sensor 201, the probe of which is connected to the interior of the refrigerant supply structure to monitor the real-time pressure of the internal liquid refrigerant 103; The solenoid valve 202 is used to pulse open when the temperature at the measuring point reaches a preset temperature threshold to charge liquid refrigerant 103 into the two-phase heat exchange channel 320, that is, to intermittently charge liquid refrigerant 103; when the solenoid valve 202 opens with a single pulse, it is also used to determine the opening degree and / or opening time according to the real-time pressure of liquid refrigerant 103, so that a certain amount of liquid refrigerant 103 is released with a single pulse opening.

[0038] In this embodiment, the fluid control assembly 200 further includes a pressure sensor 201, a throttling assembly 204, and a sealing quick connector 203. The solenoid valve 202, the sealing quick connector 203, and the pressure sensor 201 are securely connected to the liquid phase end cap 105. A pressure-sensing hole is provided inside the liquid phase end cap 105, through which the probe of the pressure sensor 201 is connected to the interior of the high-pressure liquid refrigerant 103 container 100; the throttling assembly 204 is connected in series in the fluid pipeline downstream of the solenoid valve 202. The throttling assembly 204 is preferably a throttling orifice plate, a capillary tube, or a miniature expansion valve. In a further preferred embodiment, a metal connecting cover plate 205 is provided between the high-pressure liquid refrigerant 103 container 100 and the circuit frame 300.

[0039] Preferably, refer to Figure 4 The circuit skeleton 300 includes a skeleton metal body 330. A two-phase heat exchange channel 320 is integrally embedded inside the circuit skeleton 300, meaning the two-phase heat exchange channel 320 is formed by slotting inside the skeleton metal body 330, and the integral two-phase heat exchange channel 320 is completely integrated inside the skeleton metal body 330; the downhole electronic device 310 is mounted on the outside of the skeleton metal body 330. Conductive heat transfer is achieved through the physical contact between the integral two-phase heat exchange channel 320 and the skeleton metal body 330.

[0040] Furthermore, the outer wall of the circuit frame 300 is provided with a circuit mounting surface, and the circuit frame 300 between the two-phase heat exchange channel 320 and the circuit mounting surface forms a heat capacity buffer layer. The heat capacity buffer layer is used to absorb the cold energy released by a single pulse of refrigerant, as well as the heat released by the electronic devices between two pulses of refrigerant. Furthermore, the heat capacity of the heat capacity buffer layer is greater than or equal to the cold energy released by a single pulse of refrigerant.

[0041] This embodiment takes into account that for this type of phase change heat dissipation, the transient heat absorption effect caused by the gas-liquid phase change is extremely intense. The flash evaporation of the refrigerant in a very short time will take away a large amount of heat. Currently, conventional thin-walled heat exchange plate designs based on minimizing thermal resistance lack thermal inertia and cannot adapt to the high-frequency thermal shock caused by pulsed phase change heat absorption. There is a technical problem that conventional thin-walled cold plates can easily cause large fluctuations in device temperature. Based on this, this embodiment proposes that the circuit skeleton 300 between the two-phase heat exchange channel 320 and the circuit mounting surface forms a heat capacity buffer layer. The heat capacity buffer layer is located between the circuit mounting surface and the two-phase heat exchange channel 320 and is a continuous metal solid structure that constitutes the cold storage substrate. In this embodiment, a heat capacity buffer layer with a certain thickness is required to enable the heat capacity buffer layer to have a certain heat storage and cold storage capacity. The heat capacity buffer layer can absorb cold energy during the single pulse charging of refrigerant, so that the cold energy is not directly transferred to the electronic device in large quantities. Between two pulse charging of refrigerant, the heat capacity buffer layer can also absorb the heat of the electronic device to achieve a continuous cooling effect on the electronic device, thereby helping to ensure the continuous temperature stability of the electronic device, effectively avoiding large temperature fluctuations of the electronic device, and achieving a stable temperature control effect.

[0042] Optionally, the wall thickness of the heat capacity buffer layer is 4mm-10mm; the injection pulse bandwidth value can be: injection pulse bandwidth: 0.5s-1.5s. In this embodiment, the specific thickness of the heat capacity buffer layer is set to 6mm.

[0043] In some embodiments, the adsorption device, i.e., the low-pressure adsorption container 400, includes a pressure-bearing outer shell 402 and an adsorption gas distribution assembly disposed inside the pressure-bearing outer shell 402. The adsorption gas distribution assembly includes a central gas equalization pipe and a solid adsorbent layer sleeved around the outer periphery of the central gas equalization pipe. The central gas equalization pipe has gas distribution holes on its pipe wall, and the flow channel outlet is connected to one end of the central gas equalization pipe through a fluid pipeline. The adsorbent 401 is preferably a porous zeolite, molecular sieve, or calcium oxide material.

[0044] The adsorption device provided in this embodiment can be in the form of a long cylindrical structure to adapt to the downhole environment. It is proposed that a central gas distribution pipe be installed through the middle of the solid adsorbent layer in the adsorption gas distribution assembly. Gas distribution holes are distributed on the pipe wall of the central gas distribution pipe. The inner cavity of the central gas distribution pipe forms a fluid axial mainstream channel. Thus, the gaseous refrigerant enters the fluid axial mainstream channel through the gas inlet. During the flow along the fluid axial mainstream channel, it diffuses axially to the surrounding area through the gas distribution holes. This is beneficial for the solid adsorbent 401 at all parts along the axial direction to contact the gaseous refrigerant and adsorb it. This allows the adsorption device to improve the gas penetration and diffusion ability under a large length-to-diameter ratio structure, thereby improving the adsorption performance of the adsorption device. It can be applied to the gas-liquid phase change heat management system of logging tool.

[0045] In some embodiments, the adsorption gas distribution assembly further includes metal gas equalization sheets, which are porous structures. Multiple layers of the solid adsorbent and multiple metal gas equalization sheets are alternately stacked around the central gas equalization pipe. The central gas equalization pipe communicates with each metal gas equalization sheet via the gas distribution holes. Through this structure, gaseous refrigerants such as water vapor can achieve uniform radial diffusion through the metal gas equalization sheets, thereby radially diffusing into the surrounding solid adsorbent 401, constructing a gas diffusion network distributed radially from the center, avoiding the problem of local media being unable to participate in the reaction due to uniaxial gas flow. Optionally, the metal gas equalization sheets are sintered metal wire mesh sheets or metal foam sheets; the metal gas equalization sheets are flexible structures capable of mechanical deformation to absorb the axial stress generated by the adsorption expansion of the solid adsorbent layers. The outer edge of the metal gas equalization sheets is in direct or indirect contact with the inner wall of the pressure-bearing shell 402 to construct a continuous solid heat conduction path for radial heat conduction from the interior of the adsorption gas distribution assembly to the pressure-bearing shell 402.

[0046] In some embodiments, reference Figure 5 The logging tool thermal management system also includes a control module mounted on the circuit skeleton 300. The control module includes a main control circuit 312, a valve-controlled drive circuit 311, a power supply module 313, and a temperature sensor for monitoring the downhole electronic device 310. The temperature sensor and the pressure sensor 201 are communicatively connected to the main control circuit 312, and the main control circuit 312 is signal-connected to the valve-controlled drive circuit 311. The valve-controlled drive circuit 311 is electrically connected to the solenoid valve 202. The power supply module 313 is connected to both the main control circuit 312 and the valve-controlled drive circuit 311. The temperature sensor is integrated into the downhole measurement circuit 314 inside the downhole electronic device 310. The power supply module 313 is electrically connected to and supplies power to both the main control circuit 312 and the valve-controlled drive circuit 311.

[0047] During the system's physical operation, driven by the pressure of compressed gas 101, liquid refrigerant 103 flows sequentially through the liquid phase zone end cap 105 and solenoid valve 202. After passing through the throttling component 204, the fluid experiences a pressure drop and transforms into a gas-liquid mixture, subsequently entering the integrated two-phase heat exchange channel 320. Within the integrated two-phase heat exchange channel 320, the gas-liquid mixture absorbs heat from the skeleton metal entity 330, undergoing a physical gas-liquid phase change, thus achieving physical cooling of the mounted downhole electronic device 310. The phase-change gaseous refrigerant flows out of the circuit skeleton 300 and flows unidirectionally to the low-pressure adsorption container 400, i.e., the adsorption device, via fluid pipelines and one-way valve 6. The adsorbent 401 in the low-pressure adsorption container 400 captures the gaseous refrigerant, forming a local low-pressure zone, and releases heat to the environment outside the pressure-bearing shell 402 during the capture process. The one-way valve 6 prevents the gaseous refrigerant in the low-pressure adsorption container 400 from flowing back into the circuit skeleton 300.

[0048] In some embodiments, a logging tool thermal management control method based on gas-liquid phase change is also provided. Based on the logging tool thermal management system based on gas-liquid phase change described in any one of the preceding embodiments, the control method includes: The temperature of the preset measuring points of the downhole electronic device 310 is monitored and compared with the preset temperature threshold. If the temperature at the measuring point exceeds the preset temperature threshold, the solenoid valve 202 is driven to perform a single-pulse opening action, injecting liquid refrigerant 103 into the two-phase heat exchange channel 320 in a pulsed manner for heat exchange and cooling. This embodiment considers that the amount of refrigerant that can be carried in downhole conditions is limited, and continuous injection would be wasteful. Therefore, it proposes periodically and intermittently injecting refrigerant, such as pure water, into the heat-generating area in a pulsed manner. This can minimize the amount of refrigerant used while achieving effective thermal management, adapting to the downhole environment and increasing the duration of thermal management.

[0049] In some embodiments, driving the solenoid valve 202 to perform a single-pulse opening action specifically includes: If the temperature at the measuring point exceeds the preset temperature threshold, the real-time pressure value of the liquid refrigerant 103 in the refrigerant supply structure is obtained, and the opening degree and / or opening time of the solenoid valve 202 are determined based on the real-time pressure value, so that a single pulse opens and releases a fixed amount of liquid refrigerant 103.

[0050] In some specific embodiments, reference is made to Figure 6 A control method based on the above-mentioned logging tool thermal management system includes the following steps: In step S1, the main control circuit 312 receives the temperature data of the measuring point output by the temperature sensor, and at the same time receives the real-time pressure signal of the liquid refrigerant 103 output by the pressure sensor 201. Step S2: The main control circuit 312 acquires the temperature of the measuring point during the heating process in real time and compares it with the preset safety threshold. Step S3: If the temperature at the measuring point does not exceed the safety threshold, continue to acquire the temperature at the next moment. Step S4: If the temperature at the measuring point exceeds the safety threshold, the main control circuit 312 retrieves the real-time pressure value of the pressure sensor 201 and calculates the adaptively compensated injection pulse width based on the pre-stored fluid consumption and attenuation model, and then outputs the target PWM signal to the valve control drive circuit 311. In step S5, the valve control drive circuit 311 drives the solenoid valve 202 to perform a single pulse opening action according to the target PWM signal, releasing a fixed amount of refrigerant. Step S6: Update and store the current injection pulse width, and proceed to the next control cycle.

[0051] During the physical preparation phase before the system is run into the well, the metal connection cover 205 is opened, and the pipeline joint of the external liquid filling equipment is connected to the sealing quick connector 203 to complete the filling of liquid refrigerant 103. The initial filling pressure of compressed gas 101 is set to a physical constant value of saturated vapor pressure corresponding to the highest operating temperature of liquid refrigerant 103, i.e., the preset temperature threshold.

[0052] This embodiment provides a logging tool thermal management system and control method based on gas-liquid phase change, mainly used to provide continuous cooling for electronic devices in a confined space with high temperature and high pressure downhole. The control method calculates the injection pulse width based on the real-time acquired refrigerant pressure value, and then outputs a target PWM signal to drive the solenoid valve 202 to perform a single pulse opening to release a fixed amount of liquid refrigerant 103.

[0053] like Figure 7 The physical test environment data shown is as follows: Under the boundary conditions of a constant external ambient temperature of 210°C and a constant heating power of 20W for the downhole electronic device 310, relying on the above-mentioned gas-liquid phase change physical structure and pulse valve control execution logic, the physical measurement point feedback shows that the measured temperature of the downhole electronic device 310 is maintained at 150°C during a continuous 16-hour cycle, and the physical volume of the liquid refrigerant 103 consumed in the fluid pipeline is less than 500ml.

[0054] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A logging tool thermal management system based on gas-liquid phase change, characterized in that, The device includes a refrigerant supply structure, a fluid control assembly, and a circuit frame housed within a heat insulation component, as well as an adsorption device connected to the heat insulation component. The fluid control assembly includes a solenoid valve. The circuit frame is used to mount downhole electronic devices, and the circuit frame has a two-phase heat exchange channel inside, with a channel inlet and a channel outlet formed at both ends. The refrigerant supply structure, the solenoid valve, the two-phase heat exchange channel, and the adsorption device are sequentially connected through fluid pipelines. The refrigerant supply structure is used to charge liquid refrigerant into the two-phase heat exchange channel under the control of the solenoid valve. The two-phase heat exchange channel is used to provide gas-liquid phase change and flow space for the refrigerant to achieve cooling thermal management of downhole electronic devices through the latent heat of phase change. The adsorption device is used to adsorb and treat the gaseous refrigerant after heat exchange.

2. The logging tool thermal management system based on gas-liquid phase change as described in claim 1, characterized in that, It also includes a one-way valve, which is located in the fluid pipeline between the downstream of the circuit frame and the upstream of the adsorption device, and is used to restrict the gaseous refrigerant from flowing unidirectionally toward the adsorption device. And / or, the fluid control assembly further includes a throttling assembly connected in series in the fluid line downstream of the solenoid valve.

3. The logging tool thermal management system based on gas-liquid phase change as described in claim 1, characterized in that, The heat insulation component includes a pressure-bearing thermos bottle and an axial heat insulation plug; the pressure-bearing thermos bottle has a metal shell; the axial heat insulation plug is respectively filled at both ends of the internal cavity of the pressure-bearing thermos bottle, and a vacuum heat insulation cavity is also embedded in the circumferential direction inside the bottle body of the pressure-bearing thermos bottle; The pressure-bearing thermos bottle has a communication opening at one end connected to the adsorption device, and the fluid pipeline connected downstream of the circuit frame passes through the communication opening and connects to the upstream of the adsorption device.

4. The logging tool thermal management system based on gas-liquid phase change as described in any one of claims 1-3, characterized in that, The refrigerant supply structure includes a high-pressure liquid refrigerant container, which includes a container shell, a liquid phase end cap, a gas phase end cap, and a piston. The liquid phase end cap and the gas phase end cap are assembled at both ends of the container shell; the piston is slidably disposed inside the container shell, dividing the inside of the container shell into two independent sealed areas for storing liquid refrigerant and compressed gas. When the solenoid valve is opened, the liquid refrigerant is pushed into the two-phase heat exchange channel by the compressed gas.

5. The logging tool thermal management system based on gas-liquid phase change as described in claim 4, characterized in that, The initial injection pressure of the compressed gas is higher than the physical constant value of the saturated vapor pressure of the liquid refrigerant at a preset temperature threshold, so that the liquid refrigerant in the high-pressure liquid refrigerant container remains liquid during operation.

6. The logging tool thermal management system based on gas-liquid phase change as described in any one of claims 1-3, characterized in that, The adsorption device includes a pressure-bearing shell and an adsorption gas distribution assembly disposed inside the pressure-bearing shell. The adsorption gas distribution assembly includes a central gas equalization pipe and a solid adsorbent layer sleeved on the outer periphery of the central gas equalization pipe. The central gas equalization pipe has gas distribution holes on its pipe wall. The flow channel outlet is connected to one end of the central gas equalization pipe through a fluid pipeline.

7. The logging tool thermal management system based on gas-liquid phase change as described in any one of claims 1-3, characterized in that, The fluid control assembly also includes a pressure sensor, the probe of which is connected to the interior of the refrigerant supply structure to monitor the real-time pressure of the internal liquid refrigerant.

8. The logging tool thermal management system based on gas-liquid phase change as described in claim 7, characterized in that, It also includes a control module mounted on the circuit skeleton, the control module including a main control circuit, a valve control drive circuit, a power supply module, and a temperature sensor for monitoring downhole electronic devices; The temperature sensor and the pressure sensor are respectively communicatively connected to the main control circuit, and the main control circuit is signal-connected to the valve-controlled drive circuit; the valve-controlled drive circuit is electrically connected to the solenoid valve; the power supply module is respectively connected to the main control circuit and the valve-controlled drive circuit.

9. A logging tool thermal management control method based on gas-liquid phase change, characterized in that, The control method of the logging tool thermal management system based on gas-liquid phase change according to any one of claims 1-8 includes: Monitor and acquire the temperature of preset measurement points of downhole electronic devices, and compare it with preset temperature thresholds; If the temperature at the measuring point exceeds the preset temperature threshold, the solenoid valve is driven to perform a single-pulse opening action to inject liquid refrigerant into the two-phase heat exchange channel in a pulse manner for heat exchange and cooling.

10. The logging tool thermal management control method based on gas-liquid phase change as described in claim 9, characterized in that, The solenoid valve is driven to perform a single-pulse opening action, specifically including: If the temperature at the measuring point exceeds the preset temperature threshold, the real-time pressure value of the liquid refrigerant in the refrigerant supply structure is obtained, and the opening degree and / or opening time of the solenoid valve are determined based on the real-time pressure value, so that a single pulse opens and releases a fixed amount of liquid refrigerant.

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