Heat dissipation structure and domain controller
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHONGQING LANDIAN AUTOMOBILE TECHNOLOGY CO LTD
- Filing Date
- 2026-05-18
- Publication Date
- 2026-08-07
AI Technical Summary
[0003]本申请提供了一种散热结构及域控制器，以解决现有域控制器中高功率芯片因散热方案无法适配非均匀热分布，导致核心计算区域散热不足，影响算力输出稳定性与可靠性的技术问题
本申请实施例提供的散热结构，将需要进行冷却的芯片装配于散热结构内，且芯片对应第一流道设置，当冷却介质经喷淋孔汇入第一流道后，实现对芯片的精准、高效冷却，而周侧的第二流道则可辅助冷却。本申请通过将喷淋孔集中对应流道板的第一流道设置，使冷却介质能够集中作用于芯片核心计算区域，实现对核心计算区域的强化冷却，同时利用周侧第二流道对散热需求较低的外围区域进行适度冷却，形成差异化冷却。
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Figure CN122534815A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic device technology, and in particular to a heat dissipation structure and a domain controller. Background Technology
[0002] In existing technologies, heat dissipation of high-power chips mainly relies on uniform flow channel liquid cooling plates and vapor chambers, combined with thermally conductive interface materials to achieve heat transfer. However, the heat flux density of the core computing area of a high-power chip is much higher than that of the peripheral and cache areas. Existing heat dissipation solutions cannot provide differentiated cooling based on this non-uniform heat distribution, resulting in insufficient heat dissipation in the core computing area and internal temperature differences exceeding 10°C, which seriously affects the stability and reliability of computing power output. Summary of the Invention
[0003] This application provides a heat dissipation structure and a domain controller to solve the technical problem in existing domain controllers where high-power chips cannot adapt to non-uniform heat distribution, resulting in insufficient heat dissipation in the core computing area and affecting the stability and reliability of computing power output.
[0004] In a first aspect, this application provides a heat dissipation structure for heat dissipation of a chip; the heat dissipation structure includes: a housing, a perforated distribution plate, a flow channel plate, and a chip; The outer shell has a receiving cavity inside, and the porous distribution plate and the flow channel plate are spaced apart in the receiving cavity along a first direction. The outer shell and the porous distribution plate form a spray cavity, and the porous distribution plate and the flow channel plate form a flow channel cavity. The spray cavity and the flow channel cavity are in communication. The outer wall of the outer shell is provided with a medium inlet and a medium outlet. The medium inlet is connected to the spray chamber, and the medium outlet is connected to the flow channel chamber. The porous distribution plate is provided with spray holes. The flow channel plate is provided with a first flow channel and a second flow channel provided on the side facing the porous distribution plate. The arrangement density of the first flow channel is greater than that of the second flow channel. The spray holes are provided corresponding to the first flow channel.
[0005] In an optional embodiment, a third flow channel is further provided on the side of the flow channel plate facing the porous distribution plate. The third flow channel is disposed between the first flow channel and the second flow channel, and the arrangement density of the third flow channel is greater than that of the second flow channel but less than that of the first flow channel.
[0006] In one alternative embodiment, the width of the first flow channel ranges from 100μm to 200μm, and the width of the second flow channel ranges from 500μm to 800μm.
[0007] In one optional embodiment, the spray nozzle aperture ranges from 50 μm to 100 μm. In one alternative embodiment, the flow channel plate is provided with a plurality of ribs on the side facing the porous distribution plate, and the interval between two adjacent ribs forms the first flow channel, the second flow channel, or the third flow channel.
[0008] In an alternative embodiment, a contact platform is provided on the side of the flow channel plate opposite to the porous distribution plate.
[0009] In one alternative embodiment, the housing includes a shell, a first cover plate, and a second cover plate. The shell has a first opening and a second opening disposed opposite to each other. The first cover plate is used to close the first opening, and the second cover plate is used to close the second opening.
[0010] In one alternative embodiment, the first cover plate, the second cover plate, and the housing are integrally formed.
[0011] Secondly, this application provides a domain controller, including a chip and the aforementioned heat dissipation structure. The chip is disposed on the side of the flow channel plate away from the porous distribution plate and corresponds to the first flow channel.
[0012] In an alternative implementation, the domain controller further includes a PCB board on which the chip is disposed.
[0013] The technical solutions provided in this application have the following advantages compared with the prior art: The heat dissipation structure provided in this application embodiment assembles the chip that needs to be cooled within the heat dissipation structure, and the chip is positioned corresponding to a first flow channel. When the cooling medium flows into the first flow channel through the spray holes, it achieves precise and efficient cooling of the chip, while the peripheral second flow channel can assist in cooling. By concentrating the spray holes in the first flow channel corresponding to the flow channel plate, this application enables the cooling medium to act on the core computing area of the chip in a concentrated manner, achieving enhanced cooling of the core computing area. At the same time, the peripheral second flow channel is used to moderately cool the peripheral areas with lower heat dissipation requirements, forming differentiated cooling. Attached Figure Description
[0014] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.
[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0017] Figure 1 This is a schematic diagram illustrating one implementation of a domain controller provided in this application. Figure 2 A schematic diagram of one embodiment of the flow channel plate provided in this application; Figure 3 for Figure 2 A structural schematic diagram of the provided flow channel plate from another perspective; Figure 4 A cross-sectional schematic diagram of a domain controller provided in an embodiment of this application; Figure 5 This is another cross-sectional schematic diagram of the domain controller provided in an embodiment of this application.
[0018] Explanation of reference numerals in the attached figures: 100, Outer shell; 110, Housing; 120, First cover plate; 130, Second cover plate; 140, Medium inlet; 150, Medium outlet; 200, Perforated distribution plate; 210, Spray hole; 300, Flow channel plate; 310, First flow channel; 320, Second flow channel; 330, Third flow channel; 340, Rib; 350, Contact stage; 400, Chip; 500, PCB board. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0020] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.
[0021] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.
[0022] To address the technical problem that insufficient heat dissipation in core technology areas of high-power chips in existing domain controllers is caused by heat dissipation schemes that cannot adapt to non-uniform heat distribution, thus affecting the stability and reliability of computing power output, this application provides a heat dissipation structure and domain controller that can effectively solve the technical problem that existing heat dissipation schemes cannot perform differentiated cooling according to the non-uniform heat distribution of chips.
[0023] In a first aspect, embodiments of this application provide a heat dissipation structure for heat dissipation of a chip; including: a housing 100, a porous distribution plate 200, and a flow channel plate 300; The outer shell 100 has an internal cavity, and the porous distribution plate 200 and the flow channel plate 300 are spaced apart in the cavity along a first direction; the outer shell 100 and the porous distribution plate 200 form a spray cavity, and the porous distribution plate 200 and the flow channel plate 300 form a flow channel cavity; the spray cavity is connected to the flow channel cavity; The outer wall of the outer casing 100 is provided with a medium inlet 140 and a medium outlet 150. The medium inlet 140 is connected to the spray chamber, and the medium outlet 150 is connected to the flow channel chamber. The porous distribution plate 200 is provided with spray holes 210. The flow channel plate 300 is provided with a first flow channel 310 and a second flow channel 320 on the side facing the porous distribution plate 200. The arrangement density of the first flow channel 310 is greater than that of the second flow channel 320. The spray holes 210 are arranged corresponding to the first flow channel 310.
[0024] like Figures 1-5 As shown, the outer shell 100 has a flat box-like structure. Taking the thickness direction of the outer shell 100 as the first direction, the porous distribution plate 200 and the flow channel plate 300 are spaced apart in the receiving cavity inside the outer shell 100 along the thickness direction of the outer shell 100. Through the layering separation of the porous distribution plate 200 and the flow channel plate 300, independent and interconnected spray chambers and flow channel chambers are formed sequentially from top to bottom inside the receiving cavity, wherein the spray chamber is located above the flow channel chamber.
[0025] The outer wall of the outer casing 100 is provided with a medium inlet 140 and a medium outlet 150, which are located on opposite sides of the outer casing 100. One end of the medium inlet 140 is connected to an external medium supply source, and the other end is located on the side of the spray chamber. The cooling medium flows smoothly into the spray chamber from the side through the medium inlet 140. One end of the medium outlet 150 is located on the side of the flow channel cavity, and the other end is connected to an external recovery component. After the cooling medium has completed the heat exchange and cooling operation in the cavity, it can be collected through the flow channel cavity and discharged outward from the medium outlet 150, and finally transported to the external recovery component for unified collection and recycling. In the embodiments disclosed in this application, the cooling medium is preferably cooling water, which is readily available and has a stable heat exchange and cooling effect. In other embodiments, the cooling medium can also be liquids such as oil and ethylene glycol.
[0026] The porous distribution plate 200 serves as a separator between the spray chamber and the flow channel chamber. It has several spray holes 210 that penetrate the upper and lower surfaces of the porous distribution plate 200, enabling communication between the spray chamber and the flow channel chamber and guiding the cooling medium from the spray chamber into the flow channel chamber. Preferably, the spray holes 210 are located in the central region of the porous distribution plate 200.
[0027] The flow channel plate 300 has a first flow channel 310 and a second flow channel 320 on the side facing the porous distribution plate 200. The first flow channel 310 is located in the central region of the flow channel plate 300, corresponding to the spray holes 210. The second flow channel 320 is arranged around the periphery of the first flow channel 310, forming a differentiated flow channel distribution. To meet the heat dissipation requirements of the chip 400, the density of the first flow channel 310 is greater than that of the second flow channel 320, allowing the cooling medium to circulate more densely in the corresponding area of the chip 400, thereby improving the heat exchange efficiency of the core area.
[0028] The corresponding arrangement of the spray hole 210 and the first flow channel 310 ensures that the cooling medium falling through the spray hole 210 can accurately flow into the first flow channel 310, further ensuring the precise cooling of the core area by the cooling medium.
[0029] The chip 400, which needs to be cooled, is mounted on the side of the flow channel plate 300 opposite to the porous distribution plate 200, and the mounting position of the chip 400 corresponds to the first flow channel 310 on the flow channel plate 300, so that the heat generated by the chip 400 can be directly conducted to the first flow channel 310 area of the flow channel plate 300. When the cooling medium flows into the first flow channel 310 through the spray holes 210, it achieves precise and efficient cooling of the chip 400. The second flow channel 320 on the periphery can assist in cooling, further effectively improving the heat transfer stability and uniformity.
[0030] This application effectively solves the technical problem that existing heat dissipation solutions cannot perform differentiated cooling based on the non-uniform heat distribution of the chip 400. By concentrating the spray holes 210 in the central region of the multi-hole distribution plate and setting the first flow channel 310 in the central region of the flow channel plate 300, and setting the density of the first flow channel 310 is greater than the density of the peripheral second flow channel 320, the cooling medium can be concentrated on the core computing area of the chip 400 to achieve enhanced cooling of the core computing area. At the same time, the peripheral second flow channel 320 is used to moderately cool the peripheral area with lower heat flux density, thus forming differentiated cooling.
[0031] In some embodiments, a third flow channel 330 is provided on the side of the flow channel plate 300 facing the porous distribution plate 200. The third flow channel 330 is disposed between the first flow channel 310 and the second flow channel 320. The arrangement density of the third flow channel 330 is greater than that of the second flow channel 320 and less than that of the first flow channel 310.
[0032] like Figures 1-5As shown, to further optimize heat dissipation uniformity, a third flow channel 330 is provided on the side of the flow channel plate 300 facing the porous distribution plate 200. The third flow channel 330 is located between the first flow channel 310 and the second flow channel 320. The third flow channel 330 serves as a transition structure, corresponding to the transition region between the core area and the peripheral area of the chip 400. The density of this transition region is between the density of the first flow channel 310 and the density of the second flow channel 320. Specifically, by making the density of the third flow channel 330 greater than that of the second flow channel 320, sufficient cooling medium flow can be provided to the transition region with a relatively high heat flux density, preventing heat accumulation in the transition region due to insufficient heat dissipation. Simultaneously, the density of the third flow channel 330 is less than that of the first flow channel 310, which avoids ineffective consumption of cooling medium and creates a smooth transition between the first flow channel 310 and the second flow channel 320, achieving gradient cooling from the core area to the peripheral area.
[0033] The third flow channel 330 can not only receive some of the cooling medium overflowing from the edge of the spray hole 210, but also serve as a transition structure connecting the first flow channel 310 and the second flow channel 320, achieving uniform distribution of the cooling medium and enabling it to be rationally allocated to the first flow channel 310, the second flow channel 320, and the third flow channel 330. The addition of the third flow channel 330 not only optimizes the flow path of the cooling medium and reduces its flow resistance within the channels, but also allows the cooling medium to diffuse more smoothly from the first flow channel 310 to the second flow channel 320. Simultaneously, the gradient flow channel layout can further reduce the temperature gradient within the chip 400, controlling the temperature difference between the core area, transition area, and peripheral area of the chip 400 within a more reasonable range, further improving the stability of the chip 400's computing power output and operational reliability.
[0034] In some embodiments, the width of the first flow channel 310 ranges from 100μm to 200μm, and the width of the second flow channel 320 ranges from 500μm to 800μm. In other embodiments, the width ranges of the first flow channel 310 and the second flow channel 320 can be set according to actual conditions.
[0035] The width of the first flow channel 310 ranges from 100μm to 200μm. Within this width range, the heat exchange efficiency of the cooling medium within the first flow channel 310 can be effectively improved while ensuring smooth flow of the medium, quickly removing the large amount of heat generated in the core area. The width of the second flow channel 320 ranges from 500μm to 800μm. The width of the second flow channel 320 is significantly larger than that of the first flow channel 310. Since the heat dissipation requirements of the peripheral area are low, there is no need to achieve enhanced cooling through dense and narrow flow channels. The width range of the second flow channel 320 can reduce the flow resistance of the cooling medium within the second flow channel 320, allowing the cooling medium to flow and diffuse more smoothly within the channel, while also taking into account the basic heat dissipation requirements of the peripheral area.
[0036] In some embodiments, the aperture of the spray orifice 210 ranges from 50 μm to 100 μm. In other embodiments, the aperture range of the spray orifice 210 can be set according to actual conditions.
[0037] The spray holes 210 serve as a crucial channel for the cooling medium to enter the flow channel cavity from the spray chamber. Their aperture size directly affects the spraying effect and flow rate of the cooling medium. The aperture range of 50μm-100μm is determined by considering the width range of the first flow channel 310 and the heat dissipation requirements. Within this aperture range, the spray holes 210 ensure that the cooling medium ejected from the spray holes 210 accurately flows into the first flow channel 310, preventing the cooling medium from splashing to the outside of the first flow channel 310 due to excessively large apertures, thus avoiding ineffective losses in non-core areas.
[0038] In some embodiments, the flow channel plate 300 is provided with a plurality of ribs 340 on the side facing the porous distribution plate 200, and the interval between two adjacent ribs 340 forms a first flow channel 310, a second flow channel 320 or a third flow channel 330.
[0039] like Figure 2 As shown, the ribs 340 protrude vertically from the surface of the flow channel plate 300 facing the porous distribution plate 200, and are arranged in a uniform and orderly manner. The gap formed between two adjacent ribs 340 is the flow channel for the cooling medium. In other words, the first flow channel 310, the second flow channel 320, and the third flow channel 330 are all integrally formed by the spacer area of the adjacent ribs 340, eliminating the need for separate processing of each flow channel. This effectively simplifies the processing flow of the flow channel plate 300 and reduces the processing difficulty and production cost.
[0040] The first flow channel 310 in the central region has a smaller spacing between adjacent ribs 340 and a higher rib density, which matches the higher density and narrower width of the first flow channel 310. The densely arranged ribs 340 form a narrow and dense first flow channel 310, meeting the enhanced cooling requirements of the core area. The second flow channel 320 in the outer region has a larger spacing between adjacent ribs 340 and a lower rib density, forming a wide and sparse second flow channel 320, suitable for the lower heat dissipation area of the outer region. The third flow channel 330 in the transition region has a spacing between adjacent ribs 340 that is between the spacing of the first and second flow channels 310 and the rib density of the second flow channel 320, forming a gradient rib arrangement structure that matches the gradient density design of the third flow channel 330.
[0041] In some embodiments, a contact platform 350 is provided on the side of the flow channel plate 300 opposite to the porous distribution plate 200.
[0042] like Figures 3-5 As shown, the contact stage 350 is integrally formed on the side of the flow channel plate 300 opposite to the porous distribution plate 200. Its position precisely corresponds to the position of the first flow channel 310, ensuring that the contact stage 350 can be directly aligned with the chip 400. The surface of the contact stage 350 is precision polished to form a flat and smooth contact surface, which can effectively reduce the contact gap between the chip 400 and the contact stage 350.
[0043] After the contact platform 350 is attached to the chip 400, the heat generated during the operation of the chip 400 is first quickly conducted to the contact platform 350, and then transferred from the contact platform 350 to the entire flow channel plate 300, where it is carried away by the cooling medium flowing within the flow channel. Since the contact platform 350 is positioned corresponding to the first flow channel 310, a large amount of heat generated in the core computing area of the chip 400 is directly conducted through the contact platform 350 to the first flow channel 310 area with the highest heat exchange efficiency, achieving rapid heat removal.
[0044] In addition, the contact platform 350 also serves to position and support the chip 400, ensuring precise positioning of the chip 400 and guaranteeing that it accurately aligns with the first flow channel 310 after installation. This prevents heat from the core area from being ineffectively conducted to the flow channel due to chip 400 misalignment. Simultaneously, the contact platform 350 protrudes from the surface of the flow channel plate 300, providing stable support for the chip 400 and preventing damage due to uneven force when the chip 400 is directly attached to the surface of the flow channel plate 300, thus ensuring the stability of the contact between the chip 400 and the flow channel plate 300.
[0045] In some embodiments, the housing 100 includes a housing 110, a first cover plate 120, and a second cover plate 130. The housing 110 has a first opening and a second opening disposed opposite to each other. The first cover plate 120 is used to close the first opening, and the second cover plate 130 is used to close the second opening. The first cover plate 120 and the porous distribution plate 200 form a spray chamber.
[0046] like Figure 1 As shown, the housing 110 has a hollow structure and has a first opening and a second opening that are arranged opposite to each other. The two openings are located on opposite sides of the housing 110, forming an internal space through the housing 110, i.e., a receiving cavity, for accommodating components such as the porous distribution plate 200 and the flow channel plate 300.
[0047] In order to effectively seal the two openings of the housing 110 and ensure the overall airtightness of the outer shell 100, the first cover plate 120 is used to seal the first opening of the housing 110, and the second cover plate 130 is used to seal the second opening of the housing 110. By cooperating with the first cover plate 120 and the second cover plate 130, the two openings of the housing 110 can be completely closed, so that the outer shell 100 forms a sealed overall structure.
[0048] Preferably, the housing 110, the first cover plate 120, and the second cover plate 130 can be sealed and welded together by friction stir welding, so that the three are formed into an integral structure, ensuring the sealing reliability of the housing 100.
[0049] Furthermore, the flow channel plate 300 can also be sealed and welded to the housing 110 by friction stir welding.
[0050] In some embodiments, the first cover plate 120 and the second cover plate 130 are integrally formed with the housing 110.
[0051] To further enhance the structural strength and sealing reliability of the outer casing 100 and simplify the processing and assembly process, the outer casing 100 can adopt an integrated molding structure design, that is, the first cover plate 120, the second cover plate 130 and the casing 110 are integrally molded, forming a complete and sealed whole, providing a more stable installation and protection environment for the internal core components.
[0052] In some embodiments, the housing 100 is made of a thermally conductive material.
[0053] The outer casing 100 has a room temperature thermal conductivity of ≥140W / m. K is made of thermally conductive material, preferably aluminum-silicon-magnesium cast aluminum alloy or copper, which not only has high thermal conductivity and can help conduct heat generated by internal components, improving the overall heat dissipation effect, but also has good mechanical strength and weldability.
[0054] Secondly, embodiments of this application provide a domain controller, including a chip 400 and the aforementioned heat dissipation structure. The chip 400 is disposed on the side of the flow channel plate 300 away from the porous distribution plate 200 and corresponds to the first flow channel 310.
[0055] It should be noted that the heat dissipation structure disclosed in this application is not only used in domain controllers, but can also be used in other electronic devices that require heat dissipation.
[0056] In some embodiments, the domain controller further includes a PCB board 500, on which the chip 400 is disposed.
[0057] like Figure 1 and Figure 5 As shown, the PCB board 500 (Printed Circuit Board) is the circuit carrier inside the domain controller. The chip 400 is fixed to the PCB board 500 using mature electronic assembly processes such as soldering. The side of the chip 400 facing away from the PCB board 500 can fit tightly against the release platform on the flow channel board 300. The PCB board 500 not only provides a stable mounting base for the chip 400, but also undertakes the circuit connection between the chip 400 and other electronic components of the domain controller.
[0058] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.
[0059] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.
[0060] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.
Claims
1. A heat dissipation structure for dissipating heat from a chip; characterized in that, The heat dissipation structure includes: a shell (100), a perforated distribution plate (200), and a flow channel plate (300). The outer shell (100) has an internal cavity, and the porous distribution plate (200) and the flow channel plate (300) are spaced apart in the cavity along a first direction; the outer shell (100) and the porous distribution plate (200) form a spray cavity, and the porous distribution plate (200) and the flow channel plate (300) form a flow channel cavity; the spray cavity is connected to the flow channel cavity; The outer wall of the outer shell (100) is provided with a medium inlet (140) and a medium outlet (150). The medium inlet (140) is connected to the spray chamber, and the medium outlet (150) is connected to the flow channel chamber. The porous distribution plate (200) is provided with spray holes (210). The flow channel plate (300) is provided with a first flow channel (310) and a second flow channel (320) provided on the side facing the porous distribution plate (200). The arrangement density of the first flow channel (310) is greater than that of the second flow channel (320). The spray holes (210) are provided corresponding to the first flow channel (310).
2. The heat dissipation structure according to claim 1, characterized in that, A third flow channel (330) is also provided on the side of the flow channel plate (300) facing the porous distribution plate (200). The third flow channel (330) is disposed between the first flow channel (310) and the second flow channel (320). The arrangement density of the third flow channel (330) is greater than that of the second flow channel (320) and less than that of the first flow channel (310).
3. The heat dissipation structure according to claim 1, characterized in that, The width of the first flow channel (310) ranges from 100μm to 200μm, and the width of the second flow channel (320) ranges from 500μm to 800μm.
4. The heat dissipation structure according to claim 1, characterized in that, The diameter of the spray hole (210) ranges from 50μm to 100μm.
5. The heat dissipation structure according to claim 2, characterized in that, The flow channel plate (300) has a plurality of ribs (340) on the side facing the porous distribution plate (200), and the interval between two adjacent ribs (340) forms the first flow channel (310), the second flow channel (320) or the third flow channel (330).
6. The heat dissipation structure according to claim 1, characterized in that, The flow channel plate (300) has a contact platform (350) on the side opposite to the porous distribution plate (200).
7. The heat dissipation structure according to claim 1, characterized in that, The outer casing (100) includes a housing (110), a first cover plate (120), and a second cover plate (130). The housing (110) has a first opening and a second opening disposed opposite to each other. The first cover plate (120) is used to close the first opening, and the second cover plate (130) is used to close the second opening.
8. The heat dissipation structure according to claim 7, characterized in that, The first cover plate (120), the second cover plate (130), and the housing (110) are integrally formed.
9. A domain controller, characterized in that, Includes a chip (400) and a heat dissipation structure according to any one of claims 1-8, wherein the chip (400) is disposed on the side of the flow channel plate (300) opposite to the porous distribution plate (200) and corresponds to the first flow channel (310).
10. The domain controller according to claim 9, characterized in that, The domain controller also includes a PCB board (500), on which the chip (400) is disposed.