Low-maintenance radiator and method of using same

Abstract

The application discloses a low-maintenance radiator and an application method thereof, and solves the radiator performance reduction caused by the pump-out effect and high-temperature volatilization effect in the field of heat dissipation by arranging a material supplementing module and diffusion pulses; the heat dissipation interface improvement material can be automatically or manually supplemented without stopping the machine, so that the maintenance workload of the radiator is reduced; meanwhile, liquid gold is well adapted as an interface layer, so that the radiator with higher performance, less maintenance requirement and wider application range is prepared.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation, and more particularly to small-area, high-load heat dissipation such as chip heat dissipation, robot joint heat dissipation, and electric vehicle heat dissipation. Background Technology

[0002] Replacing heat dissipation materials constitutes a significant portion of equipment maintenance work, currently almost entirely requiring downtime for maintenance. Moreover, as the heat dissipation interface materials deteriorate with use, the efficiency of the heat sink continuously declines. The traditional method involves removing the heat sink and reapplying the interface material, but the removal process leads to the cumulative deformation of the heat sink, and the effectiveness of reapplying the interface material deteriorates over time. The intervals between heat dissipation material replacements are becoming shorter, while the cost of replacing heat dissipation materials is increasing. To reduce the workload of heat dissipation material replacement, improve heat dissipation efficiency, and reduce downtime, we have proposed this invention. Summary of the Invention

[0003] To address the above technical problems, the purpose of this application is to provide a low-maintenance heat sink and its application method, which maintains or even improves the working state of the thermal interface material while reducing the need for reapplying the thermal interface material; the technical solution adopted by this invention is as follows: A low-maintenance radiator and its application method are proposed. The radiator proposed in this invention consists of two modules: a heat dissipation working module (1) and a material replenishment module (2).

[0004] The heat dissipation module (1) is used to dissipate heat from the heat source, and the material replenishment module (2) is used to maintain and improve the heat dissipation module (1). Heat dissipation capacity; A heat sink is configured with at least one heat dissipation working module (1) and one material replenishment module (2); The material replenishment module (2) is attached to the heat dissipation working module (1), embedded in the heat dissipation working module (1) heat dissipation plate, or set independently of the heat dissipation working module (1). The setting form can be flexibly selected according to different equipment installation space and heat dissipation conditions.

[0005] The heat dissipation module (1) is the heat dissipation unit of the radiator, which continues the heat conduction and heat dissipation functions of the traditional radiator, and its surface is provided with diffusion veins (11). The diffusion vein (11) is a structure and space that is naturally formed or artificially designed to facilitate the diffusion and movement of heat dissipation interface materials. Specifically, it can be one or more combinations of indentations, concave points, convex points, interface flatness design structures, gaps formed between heat sources and heat sinks, or additional layers. The design of the diffusion vein (11) can increase the contact area between the interface material and the heat sink and heat source, and at the same time guide the interface material to diffuse evenly in the heat dissipation gap, avoiding local material accumulation or gaps. The processing of the diffusion pulse (11) can be carried out by physical processing techniques such as laser engraving, mechanical engraving, water jet engraving, etc., or by chemical and electrochemical etching techniques. It can also be a gap formed between the heat source and the heat sink plate or surface. Such a space can be used for the storage or movement of silicone grease, thermally conductive metal, air and liquid. If the diffusion vein (11) is a machined groove, its physical specifications are generally a groove-shaped channel with a width of 0.1 mm to 0.5 mm and a depth of 0.05 mm to 0.5 mm. It is arranged around the heat source hot spot and is connected to the natural gap formed by the radiator and the heat-receiving plate as much as possible. This facilitates the filling of the heat dissipation interface material into the natural gap formed by the radiator and the heat-receiving plate, while squeezing out the air in the gap. In order to facilitate the flow of material inside the diffusion vein (11), the diffusion vein (11) can be designed as a ring or mesh arrangement.

[0006] The diffusion pulsation (11) provides a channel for the material to enter and exit such gaps, making it possible to improve the material by supplementing the heat dissipation interface when the heat source is working.

[0007] The material replenishment module (2) is used to improve the condition of the heat sink and consists of a material storage structure (21) and a control structure. (22); The storage structure (21) is used to store a certain amount of heat dissipation improvement material. The space capacity is adapted to the design working conditions. For example, the thickness of a common silicone grease thermal interface material on the market is usually 0.05mm, and the corresponding working area is 2 square centimeters. The volatile content of the silicone grease is 10%. In 24 hours at 150℃, the volatilization is about 2.7%. The design working time is 400 days. Then the storage space capacity of the storage chamber (212) of the storage structure should be greater than 0.05x200x0.027x400x0.1=10.8 cubic millimeters. The material storage structure (21) is used to store interface improvement materials, including a release port (211) and a storage chamber (212). The release port (211) is used to release, replenish and recycle the material in the heat dissipation gap according to the designed direction and range. Its appearance shape can be designed as one or more of dot, line, square or circle according to the working conditions. One end of the release port (211) is connected to the diffuser (11) and the other end is connected to the storage chamber (212). The storage chamber (212) can store different types and different doses of interface improvement materials according to the heat dissipation requirements. The manufacturing method is to process it by drilling holes in the heat-receiving plate when the storage space requirement is small. The cavity formed by drilling provides space for the storage chamber (212). The control structure (22) is used to control the release and extraction parameters of the interface-improving material, including a sensing element (221) and an actuating element (222). and control elements (223); The components can be merged or further subdivided according to the actual working conditions. The control structure (22) can be a complex program control device (such as an electronic control system with a microcontroller) or a simple mechanical control unit (such as an elastic pressure control structure) to adapt to heat dissipation scenarios with different cost and accuracy requirements.

[0008] In cases where the demand for heat dissipation improvement materials is large, the material replenishment module (2) is set up separately; in cases where the demand for heat dissipation improvement materials is small, it is embedded, and the material replenishment module (2) can be attached to or embedded in the heat-receiving plate (12). Attached Figure Description

[0009] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 is a schematic diagram of the structure of the radiator provided in the embodiment of this application; the appearance structure of the radiator of this application can be made similar to that of the traditional radiator, and can be conveniently replaced in different scenarios; the material supplement module (2) in this figure is embedded in the heat-receiving plate.

[0011] Figure 2 shows the bottom view of the radiator; it illustrates the difference from the heatsink plate of a traditional radiator, and also shows the matching diffusion pulses (11) in... Figure 1 One configuration method under the embodiment structure.

[0012] Figure 3 is a schematic diagram of the independent structure of the heat sink material replenishment module; it shows the structure of the material replenishment module (2) when the demand for heat dissipation improvement materials is large. When it works together with the heat dissipation working module (1) in an external manner, the material replenishment module (2) can be further configured to enhance its function.

[0013] Figure 4 shows the bottom view of the independent setting of the heat sink material replenishment module; it shows a setting method of the matching diffusion pulse (11) when the heat dissipation improvement material demand is large.

[0014] Figure 5 is a node diagram of the heat sink embedded material supplement module (2); it shows the spatial relationship between the storage method, storage structure (21) and control structure (22) of the interface improvement material.

[0015] Figure 6 is a schematic diagram of the heat sink embedded material replenishment module (2) with a sealing cover.

[0016] Figure 7 is a schematic diagram of the heat sink embedded material supplement module (2) with a sealing cover and connecting pipe.

[0017] Illustrations: 1. Heat dissipation module; 2. Material replenishment module; 3. Heat dissipation improvement material; 11. Diffuser pulse; 12. Heating plate; 13. Heat pipe; 14. Heat dissipation fins; 21. Material storage structure; 211. Release port; 212. Material storage chamber; 22. Control structure; 221. Sensing element; 222. Actuating element; 223. Control element; 2221. Sealing cover; 2222. Connecting pipe. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0019] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "comprising" or "including," and similar terms used in this disclosure, mean that the element or structure preceding the term encompasses the elements or structures listed following the term and their equivalents, without excluding other elements or structures. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0020] As shown in Figures 1 to 7, this invention provides a novel heat sink, including a heat dissipation working module and a material replenishment module. The heat dissipation working module is similar to that of a traditional heat sink, while the material replenishment module can automatically replenish heat dissipation improving materials such as interface thermal conductive grease and liquid metal, without removing the heat sink from the heat source. It can replenish materials affecting heat dissipation while the heat source, such as a CPU chip, GPU chip, battery pack, or miniature radar, is working, thereby achieving "non-stop" heat dissipation maintenance.

[0021] Since the thermal conductivity of a thermal interface material is determined by three core factors—the material's bulk thermal conductivity, interfacial contact thermal resistance, and interfacial layer thickness—the material replenishment module in this invention is designed to replenish a certain amount of thermal interface improving material (hereinafter referred to as "material") to improve the thermal conductivity of the thermal interface material and reduce interfacial contact thermal resistance. However, since thermal conductivity is inversely proportional to the thickness of the interfacial layer, theoretically the thinner the interfacial layer, the better. But if the interfacial layer is too thin, the material cannot pass through. When the interfacial layer is relatively thin, there needs to be a "channel" to replenish the material. Therefore, this invention sets up a diffusion vein, which is connected to the interfacial layer, allowing the material to flow between the diffusion vein and the interfacial layer.

[0022] The material storage structure provided in this invention can provide space to store a certain amount of material, and the control structure can ensure the release and recovery of the target material according to certain parameters.

[0023] The material storage structure includes essential components such as a release port and a storage chamber; the storage chamber provides space for the target substance to ensure the quantity required for its operation, and the release port provides directional constraints for the target substance to ensure that the spatial range of its action meets design requirements; to ensure the accuracy of the substance release, the release port is connected to the diffusion pulse.

[0024] To improve the efficiency of the radiator, it is necessary to control the quantity and timing of material release. This invention sets up a control structure, which consists of a sensing element, an actuating element, and a control element. The sensing element collects information data on the working status of the radiator, such as the radiator temperature, the pressure of the storage chamber and the diffusion pulse, and transmits it to the control element. After receiving the relevant information data, the control element sends an actuating signal to the actuating element according to a preset mechanism or program. After receiving the actuating signal, the actuating element acts on the storage chamber and the adjacent diffusion pulse, and a certain amount of material is squeezed out or returned to the storage chamber and the diffusion pulse.

[0025] Depending on the requirements of different working conditions, the control structure can be designed with varying degrees of complexity. For example, the sensing element can be designed as a programmable thermal resistor, a thermocouple, or a simple heat-conducting plate; the actuating element can be an expander with a motor or a simple thermally expanding and contracting solid block; the control unit is similar. Figure 3 shows a more complex situation---the sensing element, actuating element, and control element are set separately; Figure 5 shows a combined situation---the sensing element, actuating element, and control element are combined into a thermally expanding and contracting solid block, which obtains the thermal state of the heat sink through heat conduction, and then expands under heat to squeeze the material in the storage chamber out to the diffusion pulse.

[0026] Example 1 This invention can be used to replace traditional chip heat sinks. As shown in Figure 1, this invention can achieve a similar appearance and material to traditional heat sinks. The difference is that a material replenishment module (2) and a diffusion pulse (11) are added on the basis of traditional chip heat sinks.

[0027] The manufacturing method is to cut a conical cavity with an upper diameter of 3mm and a lower diameter of 0.5mm on a metal heating plate (12) with a thickness of 2mm. The cavity is open from top to bottom and is the material storage cavity (212) of the present invention. The side closer to the heat source is defined as the lower opening. The lower opening is temporarily closed. The volume of the conical cavity is V=1 / 3×π×2×2.6875≈5.63 cubic millimeters.

[0028] A 1.5 cubic millimeter volume of paraffin wax is encapsulated in ethylene-vinyl acetate copolymer (EVA) and processed into a similar cone shape with an average wall thickness between 0.15 mm and 0.35 mm. Since paraffin wax is solid at room temperature and its melting point is usually between 50°C and 70°C, when it is heated to 60°C to 100°C, it will gradually change from solid to liquid. During this phase transition, the volume of paraffin wax will expand very drastically and significantly. The ethylene acetate copolymer has strong elasticity and can better encapsulate the paraffin wax, preventing it from flowing freely. The paraffin wax cone encapsulated by the ethylene acetate copolymer has thermal expansion and contraction volume changes. The cone and the EVA and paraffin wax therein are components of the control structure (22).

[0029] Inject 2 cubic millimeters of thermal interface improving material into the storage chamber (212). In this embodiment, dimethylsiloxane is specifically used. Then, the cone mentioned above is placed into the storage chamber (212), as shown in Figure 5.

[0030] The upper opening is sealed with a sealing cap (2221). In this embodiment, the sealing cap is made of polyethylene (PE), which is easy to process. At this time, the storage chamber... (212) Contains dimethylsiloxane, a thermal interface improving substance, to control the structure (22) of a polyvinyl acetate copolymer cone encapsulating paraffin.

[0031] The 0.5mm lower opening of the conical cavity mentioned above is the release port (211). A rectangular groove with a width of 0.3mm, a height of 0.3mm, and a length of 1.5mm is made on the surface of the heated plate (12) that is in contact with the heat source along the release port. This groove is the diffusion vein (11) of this embodiment. Multiple material replenishment modules (2) and corresponding diffusion veins (11) can be made on the heated plate, as shown in Figure 2.

[0032] After the interface layer is applied, the release port (211) of this embodiment is temporarily closed and removed, and the heat sink is installed on the heat source. The heat source heats up, causing the heat sink to heat up. The control structure (22) inside the heat sink expands under heat according to the design amount, squeezing the material in the storage chamber into the diffusion vein. The material further enters the interface layer in the diffusion vein, and the heat dissipation performance of the interface layer is improved.

[0033] Example 2 In practical applications, some working conditions require applying greater pressure to the thermal interface improving material, releasing a larger amount, and precisely controlling the release amount or release time. This invention provides a solution---the material replenishment module is set independently, as shown in Figure 3.

[0034] In this embodiment, the storage chamber (212) is set as an independent container to store a large amount of thermal interface improvement material, and there is a dedicated pipe connecting the storage chamber (212) and the release port (211). In this embodiment, the storage chamber (212) is a rectangular container with an external size of 10mm*10mm*8mm and a wall thickness of 1mm, and is made of engineering plastic. The connecting pipe is a circular pipe with a diameter of 3mm and a wall thickness of 1mm, and is made of engineering plastic.

[0035] The control structure (22) consists of a sensing element (221), an actuating element (222), and a control element (223); the sensing element (221) is a semiconductor IC temperature sensor or thermistor sensor that can convert the heat source into corresponding data and signals of the heat sink. It is connected to the heat-receiving plate by bonding or low-temperature metal welding. In this embodiment, the TITMP113 series sensor is used. The control element (223) is a programmable PLC chip or an embedded controller (EC) chip. It outputs control signals according to the received data and signals. In this embodiment, the water pump starts and works for 1.2 seconds when the temperature reaches 70 degrees. The actuating element (222) is a pressure and flow device. In this embodiment, it is a piezoelectric micropump (piezoelectric ceramic plate pump). The signal is transmitted through physical wires such as copper wires and signal lines. The power supply is taken from the chip motherboard.

[0036] To adapt to the above situation, the diffusion vein (11) of this embodiment has been appropriately optimized in detail. As shown in Figure 4, the diffusion vein is formed in a ring or mesh shape, and the ratio of its width to the diameter of the release port (211) is increased to between 1:1 and 1:2. In this embodiment, the diffusion vein (11) has a width of 0.5 mm and a height of 0.5 mm, and the diameter of the release port (211) is 0.6 mm, which facilitates the flow of substances in the diffusion vein. At the same time, multiple overflow ports are provided so that air and substances in the diffusion vein can be squeezed out according to the working requirements.

[0037] Example 3: Example with connecting pipe In some operating conditions, in order to further improve the efficiency of the heat sink of the present invention and prevent the thermal interface improvement material from moving outside the space formed by the storage cavity (212) and the diffusion vein (11), a maintenance structure is added in some embodiments to ensure the airtightness of the heat sink; O-rings, gaskets, sealants, etc. can be used to isolate the space formed by the storage cavity (212) and the diffusion vein (11) from the surroundings; even if some materials of the interface layer are vaporized, the released gas will accumulate in the space formed by the storage cavity (212) and the diffusion vein (11), as shown in the structure of FIG5, the gas will gather at the top of the storage cavity (212) due to its low density.

[0038] The structure shown in Figure 7 adds a connecting pipe (2222), which can extract the gas and thermal interface improvement material that gathers at the top of the storage chamber (212), replenish the material in the storage chamber (212), or increase the pressure in the storage chamber (212). It can also be used as a pressure tap for sealing detection to check the sealing performance.

[0039] The heat sink of the present invention can greatly reduce the maintenance cost when liquid gold (gallium) is used as the thermal interface for heat conduction, and improve the performance stability under such conditions.

[0040] Example 4: Specialized Example for Liquid Gold Liquid metal for heat dissipation usually refers to gallium and gallium alloys. Gallium has an extremely low melting point and is usually liquid when used as a heat-conducting material. When liquid gallium solidifies into a solid, its volume expands by about 3.2%. Due to the volume change caused by the solid-liquid conversion, gallium, as the interface layer, is prone to a "pumping out" effect. Since the present invention provides a storage cavity (212) and a diffusion pulse (11) to provide sufficient space, the volume of this space is much larger than the volume of gallium as the interface layer. Even if the volume of gallium increases when it cools, the change in volume is small relative to the entire storage cavity (212) and diffusion pulse (11) space. By changing the sealing cover (2221) to an elastic PVC material, the impact of the volume change caused by the "pumping out" effect on the interface layer can be well solved. When gallium cools and solidifies, it is pumped out of the interface layer, and when gallium is heated and liquefied, it is squeezed back into the interface layer. Alternatively, thermal expansion and contraction materials, such as paraffin wax wrapped with ethylene-vinyl acetate copolymer mentioned above, can be filled into the storage cavity (212) and diffusion pulse (11) to offset the volume change of gallium.

[0041] In traditional processes, the gallium interface layer is applied by coating. However, gallium is easily oxidized in air, and the oxide layer has low thermal conductivity. The present invention, in the embodiment with sealing measures described above, can better solve this problem. Specifically, the process is as follows: First, the storage chamber (212) and the diffusion pulse are sealed. (11) Seal the space formed, leaving only part of the connecting pipe (2222) unsealed, at least one of which serves as the inlet and at least one as the outlet; perform pressure tests on the storage chamber (212) and the diffusion pulse (11). If the pressure test results prove that the sealing effect meets the requirements, proceed to the next step. If it does not meet the requirements, reapply the sealing measures until the sealing effect meets the requirements.

[0042] A material that does not chemically react with gallium is injected through the connecting pipe (2222) from the feed inlet; in this embodiment, this is silicone oil, filling the storage cavity. (212) and the space formed by the diffusion pulse (11); then liquid gallium is injected from the feed port, the injection amount is between the volume of the diffusion pulse and the volume of the diffusion pulse plus the storage cavity, because the density of gallium is greater than that of silicone oil, and as shown in Figure 7, the connecting pipe (2222) is opened above the storage cavity (212), and the silicone oil will cover the liquid gallium on the upper layer to prevent gallium from oxidizing in the air.

[0043] If there are process requirements for the air content of the interface layer, extraction and injection can be repeated until the silicone oil and liquid gallium fill the entire diffusion pulse (11).

[0044] Furthermore, in order to reduce the corrosive effect of gallium on the heat sink metal, a plating layer can be applied to the gallium metal contact surface of the storage cavity (212) and the diffusion pulse (11).

[0045] Example 5: Silver Precipitation Filler Enhanced Type To further improve the performance of using gallium metal as the interface layer heat sink, the present invention has the following embodiment: pure gallium is replaced with a 90% Ga mixed with 10% Ag (mass ratio) liquid alloy, the room temperature thermal conductivity of which is about 30 to 38 W / (m K), which is much higher than that of pure gallium; since the storage cavity (212) is higher than the diffusion pulse (11) in physical position, the silver content in the 90% Ga mixed with 10% Ag (mass ratio) liquid alloy is in a supersaturated state, and the silver particles will precipitate at the bottom of the diffusion pulse (11) and gradually fill the gaps, thereby improving the interface layer thermal conductivity, thus achieving the state of "the more it is used, the better the performance", especially for chip heat dissipation with heat source temperature higher than 100 degrees Celsius, micron / submicron silver particles form an additional heat conduction path in liquid metal, and the overall thermal conductivity increases; in this embodiment, the mixing ratio of gallium and silver can be adjusted according to the working conditions.

[0046] This invention allows for an adaptive layout of multiple heat sources, enabling the arrangement of more than one heat dissipation module and material replenishment module, and allowing for the simultaneous arrangement of different types of heat dissipation modules and material replenishment modules.

[0047] Example 6: Intensive To further enhance the performance stability of the present invention, different components can be combined. The present invention has the following embodiment: the material replenishment module (2) and the diffusion pulse (11) are combined into a groove. This groove can be processed by the heating plate (12) or formed by the gap between different heating plates. The groove specification is determined according to the amount of interface improvement material required. For example, a groove with a width of 0.4 mm, a height of 2 mm and a length of 20 mm is processed on the copper heating plate (12) using CNC technology. Interface improvement material, such as dimethylsiloxane, is directly injected into the groove. Since dimethylsiloxane has a certain viscosity and surface tension, it will slowly penetrate into the interface layer. At the same time, the gas emitted when the heat sink is working will enter this groove and be stored at the top. When heated, the volume expands and gradually squeezes the dimethylsiloxane in the lower part into the interface layer. This groove simultaneously functions as the material replenishment module (2) and the diffusion pulse (11). Due to its simple structure, it is durable and has strong stability.

[0048] When the heat source is a small-area, multi-point heat source (such as a multi-core processor), the heat-receiving plate of the present invention can be assembled from multiple heat-receiving plates (12). The assembled heat-receiving plates will naturally form assembly seams. These seams can be used as material supplement modules (2) and diffusion veins (11) to close both ends, forming grooves to prevent liquid from overflowing. Interface-improving substances, such as dimethylsiloxane, can be directly injected into them, which can also achieve the heat dissipation improvement effect expected by the present invention.

[0049] The storage and control methods related to the interface-improving substances can be further refined in the above two types of embodiments, or combined with the embodiments mentioned above, all of which are within the scope of this invention.

[0050] Example 7: Phase Change Endothermic Type The heat sink does not rely on the interface layer to absorb and conduct heat from the heat source for heat dissipation. Instead, it uses the phase change material in the space of the material supplement module (2) and the diffusion pulse (11) to absorb heat for heat dissipation.

[0051] The implementation steps are as follows: ① Install the radiator and simultaneously implement sealing measures; ② Evacuate the gas in the radiator material replenishment module (2) and diffusion pulse (11) and test the sealing performance; ③ Add phase change material, evacuate the gas in the replenishment module (2) and diffusion pulse (11) again to form a negative pressure in the space, install the pressure detection device (pressure gauge) and seal it.

[0052] In this embodiment, the heat source is a GPU core with dimensions of 32mm × 25.6mm, a thickness of 1.65mm when packaged and mounted on a substrate, and an actual operating power of 620W to 700W.

[0053] The specific manufacturing method is as follows: First, protect the chip (heat source) with a PET dustproof sheet. The dustproof sheet has the following specifications: the outer dimensions are 32.5mm x 26mm x 1.7mm (inner edge) and the thickness is 0.2mm. Then, make a ring-shaped silicone sealing gasket with a thickness of 0.15mm, an outer edge size of 45mm x 35mm, and an inner edge size of 32mm x 25.6mm. The gasket has a heat resistance of 140 degrees Celsius and the flexibility parameter Shore A of the silicone gasket is 25A. Press the silicone gasket firmly against the substrate on which the chip is located.

[0054] A square tube made of engineering plastic (ABS) with a cross-section of 33mm*27mm, a wall thickness of 0.3mm, and a length of 3mm is placed along the GPU core, with the tube wall parallel to the outer edge of the chip; then another square tube made of engineering plastic (ABS) with a cross-section of 35mm*29mm, a wall thickness of 0.2mm, and a length of 3mm is placed in the same space, keeping the two square tubes concentric and parallel, with the tube walls parallel to the outer edge of the chip, forming a ring-shaped cavity with the two ABS square tubes.

[0055] Then insert a heat shrink tubing with a cross-section of 36mm*30mm before heat shrinking, a wall thickness of 0.3mm, and a length of 1mm. The heat shrink material is a cross-linked polyolefin (PO) composite square tube that shrinks from 80℃, with a low shrinkage ratio of about 1.2:1. The tube wall is parallel to the outer edge of the chip and the vertical position is close to the heat source side.

[0056] A concave surface with a depth of 1.8 mm and an outer edge size of 35.5 mm * 29.5 mm is machined on the heat plate (12) at the position corresponding to the heat source. The position of the concave surface corresponds to the heat source chip. Specifically, the line connecting the centroid of the concave surface and the centroid of the chip is perpendicular to the concave surface, and the positions of the long and short sides are consistent with and parallel to the positions of the long and short sides of the chip.

[0057] A material supplement module (2) with a sealing cap (2221) and a connecting pipe (2222) as shown in Figure 7 is made at the middle position of the concave surface.

[0058] A ring-shaped silicone sealing gasket with a thickness of 0.7mm, an outer edge size of 35.5mm*29.5mm, and an inner edge size of 31mm × 25mm, and a heat resistance temperature of 140 degrees Celsius, is placed in the concave surface with its long and short sides flush.

[0059] Two-component silicone rubber (AB) is injected into the annular cavity formed by the two ABS square tubes. The amount of glue injected is such that it reaches the same level as the ABS square tubes. After the glue is injected, the chip (heat source) and PET dustproof sheet are removed.

[0060] Then install the heat-receiving plate (12) according to the heat sink positioning requirements and close the connecting pipe (2222). At this time, the space composed of the concave surface, the material replenishment module (2) chip, and the sealed structure is the diffusion pulse (11) of this embodiment.

[0061] Gas is extracted from the diffusion vein (11) through the connecting pipe (2222) and a pressure test is performed to ensure the sealing of the diffusion vein (11). If the sealing requirements are not met, the work is reworked according to the above requirements until the sealing requirements are met.

[0062] After the pressure test is passed, an appropriate amount of phase change material, in this example 0.6 ml of pure water, is placed into the diffusion pulse (11). Before the ice melts, the pressure of the diffusion pulse (11) is 0.01 MPa. Then the connecting pipe (2222) is closed.

[0063] Start the server where the chip is located, and first set the chip power to 100 watts (W). Observe the relationship between chip power and chip temperature. If the temperature is below 80 degrees Celsius, continue to increase the chip power. If it reaches 80 degrees Celsius, restore the chip to automatic adjustment state until the chip power reaches 800 watts (W). Stop increasing the chip power and restore the power to the chip automatic adjustment state.

[0064] Furthermore, piezoelectric ceramic plate pumps can be added to the diffusion pulse (11) to produce fine water mist for direct injection of the chip, or the water can be replaced with other phase change heat-absorbing materials, and various methods can be used to expand or shrink the volume of the diffusion pulse (11) to increase heat dissipation capacity, all of which are within the logical scope disclosed in this invention.

[0065] Example 8: Manual Operation Type To meet the need for interface-improving substances to be released when manually operating radiators and to reduce the risks in situations where automatic control cannot be used, this invention has a manual operation type.

[0066] A suitable bolt is set in the control structure (22) to control the release of interface improvement material in the storage chamber (212) by tightening the bolt; or a manually operated syringe can be connected to the connecting pipe (2222) to add and extract interface improvement material in the material replenishment module (2) and diffusion pulse (11).

[0067] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention in any way. Any simple modifications, alterations, and equivalent changes made to the above embodiments based on the technical essence of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A low-maintenance radiator and its application method, characterized in that... The method includes the following steps: A heat dissipation interface improvement material storage and release structure is added to a traditional heat sink. This structure can store the heat dissipation interface improvement material, release the heat dissipation interface improvement material to the target location, and promote the movement and diffusion of the heat dissipation interface improvement material. This heat dissipation improvement storage release structure responds to changes in operating parameters such as temperature changes, pressure changes, contact surface deformation, and changes in thermal interface material of the heat sink, and can actively or passively release heat dissipation interface improvement material. The device is equipped with a control device to control the release parameters of the heat dissipation interface improving material, and can also perform the reverse operation to extract the material from the heat conduction interface (reverse release). By improving the material storage and release structure through the interface, the thermal conductivity of the interface material in contact with the heat sink is improved, the thermal resistance on the heat dissipation path is reduced, and the heat dissipation efficiency is improved. By improving the control of the material storage and release structure through the additional heat dissipation interface, the attenuation of the interface thermal conductive material inside the radiator can be reduced or reversed. This eliminates the need to reapply the interface thermal conductive material, reduces the disassembly and assembly of the radiator, reduces downtime for maintenance, and lowers maintenance costs.

2. The low-maintenance radiator and its application method according to claim 1, characterized in that, During operation, the heat source and the material in the gap between the heat source and the heat sink can be controlled to maintain and improve the heat sink's performance. This heat sink consists of two parts: a heat dissipation working module (1) and a material replenishment module (2). The material replenishment module (2) is set up to ensure and improve the performance of the heat dissipation working module (1). A heat sink has at least one heat dissipation working module (1) and one material replenishment module (2). The material replenishment module (2) acts on the heat dissipation working module (1). In terms of spatial structure, it can be embedded in the heat dissipation working module (1) or it can be independent of the heat dissipation working module (1). However, the action logic of the material replenishment module (2) must be based on the heat dissipation state of the heat dissipation working module (1). The heat dissipation working module (1) is consistent with the working principle and structure of traditional heat sinks. New materials and technologies can also be used to improve the performance of some components.

3. A maintenance-type radiator and its application method according to claim 2, characterized in that, The surface of the heat dissipation working module (1) has naturally formed or artificially designed structures and spaces to facilitate the diffusion and movement of heat dissipation interface materials, such as grooves, concave points, convex points, interface flatness design, gaps formed between the heat source and the heat sink, additional layers, etc., which are collectively referred to as diffusion pulses (11) in this invention. The interface heat-conducting material is diffused or collected in the material replenishment module (2) through the diffusion pulses (11). Each diffusion pulse (11) is directly connected to at least one release port (211). The specifications of the diffusion pulses (11) are determined comprehensively based on the heat sink body specifications, internal material types, and working environment, and should be able to meet the requirements for diffusion or collection of interface heat-conducting materials within a certain time. The diffusion pulses (11) are arranged around the heat source. The processing methods can adopt physical processing techniques such as laser engraving, mechanical engraving, water jet engraving, etc., or chemical and electrochemical etching techniques can be used.

4. A maintenance-type radiator and its application method according to claim 2, characterized in that, The material replenishment module (2) consists of a material storage structure (21) and a control structure (22), used to fill and extract heat dissipation interface material into the gap between the heat source and the radiator. (21) Includes a release port (211), a storage chamber (212), and a control structure (22) including a sensing element (221), an action element (222), and a control element (223). The above structures can be combined or further subdivided according to the actual working conditions. The material replenishment module (2) can be processed by drilling holes on the heat-dissipating working module (1), or it can be an independent external device separate from the heat-dissipating working module (1), or it can be combined with the diffusion pulse (11).

5. A maintenance-type radiator and its application method according to claims 1 to 4, characterized in that, The heat dissipation module (1) and the material replenishment module (2) work together to adjust the material state in the diffusion pulse (11), change the thermal conductivity of the heat-conducting material associated with the heat source and radiator, thereby reducing the thermal resistance on the heat dissipation path and improving the heat dissipation efficiency; the heat dissipation interface improvement material contained in the material storage structure (21) enters the diffusion pulse (11) through the release port (211), and the heat dissipation interface improvement material in the diffusion pulse diffuses to other parts of the diffusion pulse (11) under the working environment, thereby improving heat dissipation; the diffusion pulse (11) can also be used as a path to extract high thermal resistance material and extract it. Under the condition of sealing measures, the cavity composed of the diffusion pulse (11) and the storage structure (21) forms a negative pressure lower than one standard atmosphere.

6. A maintenance-type radiator and its application method according to claims 1 to 5, characterized in that, The release port (211) is used to release, replenish and recycle the heat dissipation gap material according to the design. It has various appearances and shapes, such as dot-shaped, line-shaped, square, and round, depending on the working conditions. The size is related to the material in the diffusion pulse (11) and the storage chamber (212). One end of the release port (211) is connected to the diffusion pulse (11) and the other end is connected to the storage chamber (212). The storage chamber (212) is used to store the heat dissipation interface improvement material. The control structure (22) acts on the heat dissipation interface improvement material in the storage chamber (212) and then controls the release of the interface material according to certain parameters. It can be a simple mechanical control unit, such as a thermal expansion ball that expands in volume when heated, thereby squeezing the surrounding heat dissipation interface improvement material, or a complex program control device. It can also be subdivided into a sensor element (221), an action element (222), and a control element (223). The sensor element (221) converts the physical state of the heat sink into a signal, the action element (222) performs an action according to the control command, and the control element (223) converts the specific signal into an executable command.

7. A maintenance-type radiator and its application method according to claims 1 to 6, characterized in that, The control structure (22) takes action after sensing the state of a specific monitored object, such as a heat source or a radiator itself. It can also take action actively according to programming. The action ultimately affects the composition and state of the substance in the diffusion pulse. In addition to automatic action, the control structure (22) can also be manually operated according to the needs of the manager.

8. A maintenance-type radiator and its application method according to claims 1 to 7, characterized in that, By controlling the material storage structure (21), the attenuation of the interface thermal conductive material associated with the heat sink can be improved without reapplying the interface thermal conductive material. Under the action of the material storage structure (21) and the control structure (22), both material can be replenished and material can be extracted. Without reapplying the interface thermal conductive material, the disassembly and assembly of the heat sink are reduced, the number of downtime maintenance is reduced, and the maintenance cost is reduced.

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