A cooling device and a cooling and heat recovery system

Abstract

The embodiment of the present specification provides a cooling device and a cooling and heat recovery system, the cooling device comprising a shell, an inside of the shell forming a cooling chamber, the cooling chamber comprising: a flow guide module arranged on an inner surface of a bottom end panel of the shell, an outer surface of the bottom end panel being in contact with a surface of an object to be cooled; a spraying module configured to receive a liquid medium and spray the liquid medium towards the flow guide module; an exhaust module configured to collect a gaseous medium formed after the liquid medium sprayed towards the flow guide module absorbs heat of the object to be cooled and discharge the cooling device; and a replenishment module configured to collect residual liquid medium on the flow guide module and return the collected residual liquid medium to the spraying module.

Description

Technical Field

[0001] This specification relates to the field of heat dissipation in electronic devices, and in particular to a cooling device and a cooling and heat recovery system. Background Technology

[0002] With the development of artificial intelligence training, large-scale data centers, and high-performance computing, chip integration and power density continue to increase, leading to a continuous increase in heat flux per unit area. Problems such as localized hot spots, uneven heat dissipation, and excessive energy consumption are becoming increasingly prominent. Especially in the long-term high-load operation scenarios of intelligent computing centers, traditional air cooling methods are no longer sufficient to balance heat dissipation capacity, energy efficiency, and operational stability. Liquid cooling and phase change cooling are gradually becoming important heat dissipation methods for high heat flux density chips.

[0003] Existing heat dissipation solutions include single-phase cold plate liquid cooling, immersion liquid cooling, microchannel enhanced heat transfer, spray / jet impingement, and porous media enhanced boiling. Among these, single-phase liquid cooling is limited by heat transfer coefficients and flow resistance, making it difficult to meet higher heat flux density requirements; immersion liquid cooling has high requirements for dielectric liquids, sealing, and maintenance systems; while microchannels and jet structures possess strong heat transfer capabilities, they are prone to problems such as uneven gas-liquid distribution, flow oscillation, localized drying, and gas phase stagnation under two-phase flow conditions; porous media structures may also experience blockage and decreased stability due to poor gas and liquid drainage. Furthermore, most of these solutions rely on complex microfabricated structures, placing high demands on manufacturing consistency and engineering reliability.

[0004] Therefore, there is an urgent need for a cooling device and a cooling and heat recovery system to solve the problems of severe gas-liquid path coupling, insufficient local heat exchange stability, low exhaust and liquid drainage efficiency, and difficulty in achieving efficient heat dissipation and heat recovery in existing two-phase cooling schemes, so as to support the stable direct cooling and waste heat recovery integrated application of high heat flux density chips. Summary of the Invention

[0005] This specification provides one or more embodiments of a cooling device, including a housing, the interior of which forms a cooling chamber, the cooling chamber comprising: a flow guiding module disposed on the inner surface of a bottom panel of the housing, the outer surface of the bottom panel contacting the surface of an object to be cooled; a spray module configured to receive a liquid medium and spray the liquid medium toward the flow guiding module; an exhaust module configured to collect the gaseous medium formed after the liquid medium is sprayed onto the flow guiding module and absorbs heat from the object to be cooled, and exhaust it from the cooling device; and a replenishment module configured to collect residual liquid medium on the flow guiding module and return the collected residual liquid medium to the spray module.

[0006] This specification provides a cooling and heat recovery system in one or more embodiments, including a circulation module, a heat exchange module, and the aforementioned cooling device; the cooling device contacts the object to be cooled to dissipate heat; the heat exchange module is connected to a heat receiving end; the circulation module is configured to: transport the gaseous medium separated from the cooling device to the heat exchange module for heat exchange, and then transport the liquid medium obtained after heat exchange back to the cooling device. Attached Figure Description

[0007] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0008] Figure 1 This is a schematic diagram of the cooling device according to some embodiments of this specification; Figure 2 These are schematic diagrams of the drainage components shown in some embodiments of this specification; Figure 3 This is a schematic diagram of a cooling and heat recovery system according to some embodiments of this specification. Detailed Implementation

[0009] Exemplary embodiments or implementations will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this specification as detailed in the appended claims.

[0010] The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this specification. The singular forms “a,” “the,” and “the” as used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0011] It should be understood that the terms "first," "second," and similar terms used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an" or "a" and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. Unless otherwise stated, the terms "front," "rear," "lower," and / or "upper" and similar terms are for illustrative purposes only and are not limited to a location or spatial orientation. The terms "comprising" or "including" and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, but do not exclude other elements or objects.

[0012] The cooling device and cooling and heat recovery system provided in this manual are mainly used for efficient heat dissipation of high heat flux density heat-generating components, such as central processing units (CPUs), graphics processing units (GPUs), and application-specific integrated circuit (ASIC) chips in data centers, as well as artificial intelligence (AI) training chips in intelligent computing centers. It is particularly suitable for two-phase direct cooling scenarios using carbon dioxide (CO2) as the phase change cooling medium, effectively solving the problem of insufficient heat dissipation capacity of traditional air cooling and single-phase liquid cooling at high power densities, while overcoming the engineering challenges of gas phase stagnation, localized drying, and unstable flow commonly encountered in two-phase phase change cooling.

[0013] In some embodiments, the application scenarios of the cooling device include, but are not limited to: chip-level direct cooling in high-performance server racks, central processing unit cooling in blade servers, thermal management of graphics processor clusters, and radio frequency power amplifier modules in communication base stations that require high heat flux density cooling capabilities. In these scenarios, the bottom panel of the cooling device is in direct contact with the object to be cooled, and efficient and stable two-phase heat exchange is achieved by spraying liquid CO2 into the flow guiding module.

[0014] In some embodiments, in addition to data centers and intelligent computing centers, the cooling device can also be applied to other fields that require high power density heat dissipation and have heat recovery value, such as heat dissipation of insulated gate bipolar transistor modules or inverters in power electronic devices, high-performance computing systems, heat dissipation of high-power X-ray generators in medical devices, heat dissipation of laser arrays, and heat dissipation of power conversion units in electric vehicles or energy storage systems.

[0015] The cooling device and cooling and heat recovery system provided in this specification effectively solve the heat exchange instability problems caused by gas phase retention, localized drying, and lack of liquid replenishment paths in existing two-phase cooling technologies. To address this, the gas-liquid paths are decoupled through the synergy of a flow guiding module, a jetting module, an exhaust module, and a replenishment module: the exhaust module rapidly discharges the gaseous medium to prevent retention, and the replenishment module collects residual liquid medium and returns it to the jetting module, continuously maintaining wettability and suppressing drying instability. Furthermore, stable and efficient two-phase heat exchange capabilities can be obtained without complex micro-machining, improving manufacturability and consistency. Further integration with the heat exchange and circulation module enables waste heat recovery and utilization, forming a closed-loop system integrating heat dissipation and heat recovery.

[0016] It should be understood that the application scenarios of the cooling devices and cooling and heat recovery systems described in this specification are merely some examples or embodiments of this specification. For those skilled in the art, this specification can be applied to other similar scenarios based on these drawings without any creative effort.

[0017] Figure 1 This is a schematic diagram of the cooling device according to some embodiments of this specification.

[0018] In some embodiments, such as Figure 1 As shown, the cooling device 1000 includes a housing 100, the interior of which forms a cooling chamber 200. The cooling chamber 200 includes: a flow guiding module 300 disposed on the inner surface of the bottom panel of the housing, the outer surface of which is in contact with the surface of the object to be cooled; a spray module 400 configured to receive a liquid medium and spray the liquid medium into the flow guiding module; an exhaust module 500 configured to collect the gaseous medium formed after the liquid medium is sprayed into the flow guiding module and absorbs the heat of the object to be cooled, and discharge it from the cooling device; and a replenishment module 600 configured to collect the residual liquid medium on the flow guiding module and return the collected residual liquid medium to the spray module.

[0019] The outer casing 100 refers to a structural component used to form an external enclosed space for the cooling device and to support, seal, and protect the internal functional modules.

[0020] In some embodiments, the housing is provided with liquid and gas interfaces for fluid communication with the outside, enabling the input and discharge of cooling media. The liquid interface refers to the port structure connecting the external liquid supply line to the internal injection module of the cooling device. For example, the liquid interface can be a standard threaded pipe fitting, a flared pipe fitting, etc. The gas interface refers to the port structure connecting the internal exhaust module of the cooling device to the external exhaust line. For example, the gas interface can be a standard threaded pipe fitting, a compression fitting, etc.

[0021] Cooling medium refers to the fluid medium used to absorb and transfer heat. Examples include carbon dioxide, ethylene glycol solution, fluorinated liquid, and cooling oil.

[0022] In some embodiments, the housing 100 includes a bottom panel 110, a top panel, and side panels. Figure 1 (Not shown in the image).

[0023] The top panel refers to the plate-like structure that forms the top boundary of the shell. It is set opposite to the bottom panel. The bottom panel, top panel and side panels together enclose the internal space of the shell, namely the cooling chamber 200.

[0024] The bottom panel 110 refers to the plate-like structure that forms the bottom boundary of the outer shell.

[0025] In some embodiments, the inner surface and the outer surface of the bottom panel 110 are located on opposite sides in the thickness direction of the bottom panel 110, wherein the surface that contacts the inner space of the housing (i.e., the side surface facing the interior of the cooling chamber 200) is the inner surface, and the surface that contacts the outer space of the housing (i.e., the side surface facing away from the interior of the cooling chamber 200 and towards the object to be cooled) is the outer surface.

[0026] In some embodiments, the outer surface of the bottom panel 110 contacts the surface of the object to be cooled, serving as the primary heat exchange interface for heat transfer.

[0027] An object to be cooled refers to an object that needs to have its temperature reduced or heat removed. For example, an object to be cooled may be an electronic chip, power device, integrated circuit module, battery module, or other heat-generating component that requires heat dissipation.

[0028] In some embodiments, the bottom panel 110 may be made of a material with high thermal conductivity, such as copper, aluminum or other thermally conductive materials, to improve heat transfer efficiency.

[0029] In some embodiments, the housing 100 may serve as an external pressure-bearing sealing structure for the cooling device, providing a mounting and fixing foundation for the internal functional modules. For example... Figure 1 The flow guiding module 300 shown can be installed on the inner surface of the bottom panel 110.

[0030] Liquid media refers to cooling media that are in a liquid phase. For example, liquid media can be liquid carbon dioxide, liquid nitrogen, liquid fluorinated liquid, liquid refrigerant, or other liquids that can achieve cooling and heat exchange.

[0031] Cooling chamber 200 refers to the space formed inside the outer shell. In some embodiments, cooling chamber 200 can be an internal space that accommodates flow guiding module 300, injection module 400, exhaust module 500 and replenishment module 600, and realizes liquid medium injection heat exchange, gas-liquid flow and reflux process.

[0032] The flow guiding module 300 refers to a structural module used to guide, diffuse, or distribute the liquid medium ejected by the injection module.

[0033] In some embodiments, such as Figure 1 As shown, the heat guiding module 300 is disposed on the inner surface of the bottom panel 110 of the housing 100, and the outer surface of the bottom panel 110 is in contact with the surface of the object to be cooled. The heat generated by the object to be cooled can be transferred to the heat guiding module 300 through the bottom panel 110.

[0034] In some embodiments, the flow guiding module 300 is used to guide, diffuse, and distribute the liquid medium ejected by the injection module to improve heat exchange uniformity.

[0035] In some embodiments, the heat diversion module 300 can also rapidly diffuse the heat generated by the object to be cooled within the plane of the bottom panel, alleviating local heat accumulation and preventing local overheating.

[0036] In some embodiments, the flow guiding module 300 can also be used to capture residual liquid medium, and to collect and transport the residual liquid medium to reduce the retention of liquid medium in the jet impact area. Residual liquid medium refers to the liquid medium that remains after jet impact but has not completely evaporated.

[0037] In some embodiments, the flow guiding module 300 can also provide a stable liquid film interface for the liquid medium jet, thereby suppressing liquid medium splashing and gas-liquid entrainment, and improving the stability of the cooling process.

[0038] In some embodiments, such as Figure 1 As shown, the flow guiding module 300 includes a temperature equalization component 310 and a drainage component 320.

[0039] The heat spreader 310 refers to a structural component used to achieve heat diffusion and foundation pressure support. For example, the heat spreader 310 can be a heat spreader plate, a heat diffusion plate, a high thermal conductivity metal plate, or other components that have the functions of in-plane heat spreader and structural support.

[0040] In some embodiments, the heat equalization element 310 can rapidly diffuse the concentrated heat generated by the object to be cooled in the plane direction of the bottom panel to avoid excessive heat concentration, thereby improving the temperature uniformity of the cooling area. The cooling area refers to the area that exchanges heat with the object to be cooled.

[0041] In some embodiments, the temperature distribution element 310 can also be used to provide mechanical support for the internal structure of the flow guiding module 300 and the cooling chamber 200.

[0042] In some embodiments, such as Figure 1As shown, one side of the temperature equalizer 310 is disposed on the inner surface of the bottom panel 110. The side of the temperature equalizer 310 near the inner surface of the bottom panel 110 can be referred to as the lower surface of the temperature equalizer 310.

[0043] In some embodiments, the lower surface of the temperature equalizer 310 is tightly connected to the inner surface of the bottom panel 110, and the contact thermal resistance between the two can be reduced by using interface materials or metal connection structures. The connection method can be, but is not limited to, welding, bonding, bolting, riveting, etc.

[0044] The drain component 320 refers to a liquid phase management structural component used to capture, collect, and directionally transport residual liquid media. For example, the drain component 320 can be a flow guide, capillary drain structure, drain channel, collection tank, suction structure, or other structures with liquid guiding and draining functions.

[0045] In some embodiments, the draining component 320 can be used to collect the residual liquid medium that has not evaporated after the spraying module 400 sprays, and guide and transport the residual liquid medium to reduce the retention of the residual liquid medium in the spraying chamber and improve the liquid medium recovery efficiency.

[0046] In some embodiments, such as Figure 1 As shown, one side of the draining component 320 is located on the other side of the inner surface of the temperature equalization component 310 away from the bottom panel 110. The other side of the inner surface of the temperature equalization component 310 away from the bottom panel 110 can be referred to as the upper surface of the temperature equalization component 310. The side of the draining component 320 located on the upper surface of the temperature equalization component 310 is referred to as the lower surface of the draining component 320.

[0047] Figure 2 This is a schematic diagram of the structure of the draining component shown in some embodiments of this specification.

[0048] In some embodiments, combined with Figure 1 and Figure 2 As shown, the draining component 320 is provided with a draining tank 321 and a collecting tank 322; the draining tank 321 is configured to guide the liquid medium to the collecting tank 322; the collecting tank 322 is connected to the replenishment module 600.

[0049] The drain tank 321 refers to a channel structure used for guiding and transporting liquid media.

[0050] In some embodiments, the drain tank can be used to capture unevaporated liquid media that has seeped down from the pressure vessel and to transport the liquid media to the collection tank.

[0051] In some embodiments, the structure of the drainage trough may include an annular interception trough, a spiral collecting trough, a fractal vein trough, or other groove structures capable of guiding liquid flow. For example, the drainage trough may be an annular interception trough arranged around the jet impact area; the jet impact area refers to the area where the liquid medium ejected by the jet module directly contacts and impacts the flow guiding module.

[0052] In some embodiments, the upstream end of the drain tank may be located below the pressure vessel to receive the liquid medium flowing down from the pressure vessel; its downstream end may be connected to the collection tank to guide the delivered liquid medium into the collection tank.

[0053] The liquid collection tank 322 refers to the channel structure for temporarily storing and distributing liquid media.

[0054] In some embodiments, the liquid collection tank 322 may be a channel structure machined on the surface of the drain component and communicating with the drain. The liquid collection tank 322 may be connected to the downstream end of a plurality of drains 321 to receive liquid media conveyed from each drain 321 and form a temporary storage area for the liquid media. The liquid collection tank may also be directly connected to the replenishment module to provide a liquid source for the replenishment module.

[0055] In some embodiments of this specification, by providing a drain trough 321, a clear and low-resistance flow path can be provided for the liquid medium after jet impact, thereby quickly removing the liquid medium from the high heat flux density area, reducing the retention of the liquid medium in the jet impact area, and lowering the risk of local overheating or ineffective evaporation. Simultaneously, by structurally separating and coordinating the guiding and conveying function of the drain trough 321 with the storage and distribution function of the collection trough 322, the flow path of the liquid medium can be made clearer, facilitating the optimization of the flow channel layout and liquid collection structure, and improving the efficiency of liquid medium management. Furthermore, the collection trough can also be directly connected to the replenishment module, thereby improving the replenishment efficiency and circulation response speed of the liquid medium.

[0056] In some embodiments, such as Figure 2 As shown, the liquid collection tank 322 is located at the end of the liquid discharge component 320. The end can refer to the end position in the length direction of the liquid discharge component.

[0057] In some embodiments of this specification, by setting the liquid collection tank 322 at the end of the drain component 320, the liquid medium after being guided by the drain tank 321 can be concentrated and collected in the end area, thereby reducing the disorderly diffusion of the liquid medium during the flow process, improving the liquid collection efficiency, and facilitating subsequent liquid recovery.

[0058] In some embodiments, the width of the collection tank is greater than the width of the drainage tank.

[0059] In some embodiments of this specification, by setting the width of the liquid collection tank 322 to be greater than the width of the drain tank 321, the liquid holding capacity of the liquid collection tank 322 can be improved, thereby buffering and smoothing the fluctuations in liquid flow from multiple drain tanks 321, and providing a relatively stable working environment for the multi-hole liquid sampling head of the replenishment module 600, so as to improve the continuity and stability of the liquid medium reflux process.

[0060] In some embodiments, the liquid collection tank 322 may also be disposed at any other location on the surface of the drain component 320. For example, the liquid collection tank 322 may be disposed in the central region, edge region, or side region of the drain component 320.

[0061] In some embodiments of this specification, by positioning the heat spreader near the bottom panel 110, the heat generated by the object to be cooled can be preferentially diffused within the heat spreader, thereby reducing local heat accumulation and improving heat exchange uniformity. Simultaneously, by positioning a drain component on the side of the heat spreader away from the bottom panel 110, the drain component can be placed closer to the liquid medium flow area, facilitating the rapid guidance and collection of unevaporated liquid medium. This layered arrangement of the heat spreader and drain component allows the heat diffusion function and the liquid phase guiding function to work together, contributing to simultaneously improving cooling efficiency and liquid medium management efficiency.

[0062] In some embodiments, such as Figure 2 As shown, the flow guiding module 300 also includes a pressure-bearing component 330; the pressure-bearing component 330 is disposed on the side of the drain component 320 near the spray module 400. The side of the drain component 320 near the spray module 400 is referred to as the upper surface of the drain component 320, and the pressure-bearing component 330 is disposed on the upper surface of the drain component 320.

[0063] Pressure-bearing component 330 refers to a structural component used to stabilize the interface of liquid media and provide a cooling zone.

[0064] In some embodiments, the pressure-bearing member 330 may be used to receive the liquid medium ejected by the injection module 400.

[0065] In some embodiments, the pressure-bearing component may have a porous structure.

[0066] In some embodiments, the pressure-bearing member 330 can be used to stabilize the liquid film formed by the jet impact. Its porous structure can anchor the liquid medium, thereby increasing the residence time of the liquid medium in the cooling zone, thus improving the heat absorption efficiency of the liquid medium, and reducing splashing or entrainment of the liquid medium by the jet impact. The anchoring effect refers to the holding, adhesion, and constraint effect of the porous structure on the liquid medium.

[0067] In some embodiments, the pressure-bearing component 330 can also serve as an interface for phase change heat transfer of the liquid medium, allowing the liquid medium to absorb heat and undergo boiling vaporization on the surface of the pressure-bearing component. For example, liquid carbon dioxide can directly undergo jet impact heat transfer and phase change heat transfer on the surface of the pressure-bearing component to improve cooling efficiency.

[0068] In some embodiments, the pressure-bearing component may also form a pressure-bearing structure in the flow guiding module 300 together with the temperature equalization component 310 and the drain component 320 to improve the mechanical stability and pressure-bearing capacity of the internal structure of the cooling chamber 200.

[0069] In some embodiments, the pressure-bearing member 330 can be arranged in various ways. For example, the pressure-bearing member 330 can be arranged continuously to fully cover the draining member.

[0070] In some embodiments, such as Figure 1 As shown, the pressure-bearing components 330 are spaced apart or arranged in an array, and are positioned opposite to at least one nozzle of the injection module.

[0071] The interval setting refers to the setting method in which multiple pressure-bearing components 330 are separated from each other along a preset direction with intervals.

[0072] An array arrangement refers to a method in which multiple pressure-bearing components 330 are arranged in a regular pattern according to a preset array structure. For example, multiple pressure-bearing components 330 can form a linear array, a ring array, or other array structures.

[0073] In some embodiments, the temperature equalization component 310, the drainage component 320, and the pressure bearing component 330 are welded together or integrally cast.

[0074] like Figure 1 As shown, the temperature equalization component 310, the drain component 320, and the pressure-bearing component 330 are arranged sequentially from bottom to top. The temperature equalization component 310 is located at the bottom, the drain component 320 is located above the temperature equalization component 310, and the lower surface of the drain component 320 is connected to the upper surface of the temperature equalization component 310; the pressure-bearing component 330 is located above the drain component 320, and the lower surface of the pressure-bearing component 330 is connected to the upper surface of the drain component 320.

[0075] In some embodiments, the temperature equalization element 310 is a lower layer of foamed copper; the drainage element 320 is a thin, dense copper plate in the middle; and the pressure-bearing element 330 is an upper layer of foamed copper.

[0076] Copper foam refers to a material with a large number of pores distributed in a copper matrix.

[0077] In some embodiments, copper foam can be used to enhance the ability of heat to diffuse in a planar direction and increase the contact area between the liquid medium and the flow guiding module 300 to facilitate the heat exchange process.

[0078] In some embodiments, the porous structure of copper foam can also retain and anchor liquid media, thereby improving liquid film stability and reducing liquid splashing.

[0079] Thin, dense copper plates refer to plate-shaped copper materials with a substantially non-porous structure. In some embodiments, drainage grooves 321 and collection grooves 322 can be formed on the surface of thin, dense copper plates by means of machining, etching, stamping, or additive manufacturing.

[0080] In some embodiments of this specification, a layered structure consisting of a homogenizing layer (lower layer of foamed copper), a drainage layer (middle thin dense copper plate), and a pressure-bearing component (upper layer of foamed copper) can be used to achieve homogenized heat expansion, liquid phase guidance, and pressure-bearing flow stabilization functions, respectively. The lower layer of foamed copper improves the efficiency of heat diffusion in the planar direction; the middle thin dense copper plate facilitates the formation of a precise liquid flow network to improve the collection and transport efficiency of the liquid medium; and the upper layer of foamed copper stabilizes the sprayed liquid film and enhances the phase change heat transfer process. By assigning different functions to different layer structures, the materials and structures of each layer can be optimized for their respective functions. Furthermore, integrating the layer structures into a flow-guiding module 300 through welding or integral molding can improve overall heat exchange efficiency, liquid management capabilities, and structural stability while ensuring structural compactness.

[0081] The injection module 400 refers to a liquid supply structure module used to receive liquid media and spray the liquid media onto the surface of the flow guiding module.

[0082] In some embodiments, the injection module 400 is configured to receive an input liquid medium and spray the liquid medium into the flow guide module 300.

[0083] In some embodiments, the injection module 400 includes a liquid supply distribution chamber and a nozzle area.

[0084] A liquid supply and distribution chamber is a cavity structure used to receive externally input liquid media and to store, buffer, and distribute the liquid media.

[0085] A nozzle region is a structure used to form a jet of liquid medium and eject it. In some embodiments, the nozzle region includes one or more nozzles. A nozzle is a fluid output structure that ejects liquid medium.

[0086] In some embodiments, the nozzle area can accelerate the liquid medium, causing the liquid medium to form a high-speed jet, which is then sprayed onto the surface of the flow guiding module 300 through the nozzle.

[0087] In some embodiments, the injection module 400 is connected to an external liquid supply line via a liquid interface on the housing 100. The liquid medium can flow into the liquid supply distribution chamber in the injection module 400 via the external liquid supply line and the liquid interface on the housing 100; subsequently, the liquid medium is distributed from the liquid supply distribution chamber to each nozzle in the nozzle area, and after forming a jet through the nozzle, it is sprayed onto the surface of the flow guiding module 300.

[0088] In some embodiments, the injection module 400 may be disposed above the flow guiding module 300, and at least one nozzle in the nozzle area may be disposed opposite to the pressure bearing member of the flow guiding module, so that the liquid medium jet formed by the injection can impact the surface of the flow guiding module 300.

[0089] The exhaust module 500 refers to the exhaust structure module used to collect the gaseous medium formed during the heat exchange process and discharge the gaseous medium from the cooling device.

[0090] In some embodiments, the exhaust module 500 is configured to collect the gaseous medium formed after the liquid medium is sprayed into the flow guide module and absorbs the heat of the object to be cooled, and then discharge it from the cooling device.

[0091] Gaseous media refers to cooling media in a gaseous state. Examples include gaseous carbon dioxide, water vapor, nitrogen, and fluorinated liquid vapor.

[0092] In some embodiments, since the cooling medium may contain incompletely vaporized droplets during evaporation and flow, the gaseous medium may include a small amount of liquid medium, that is, the gaseous medium may be a two-phase gas-liquid medium.

[0093] The liquid medium absorbs heat from the object to be cooled on the surface of the flow guiding module 300 and then transforms into a gaseous medium.

[0094] In some embodiments, the exhaust module includes a gas collection area and an exhaust channel. The gas collection area is a spatial region used to collect the gaseous medium generated after heat exchange. The exhaust channel is a flow channel structure communicating with the gas collection area and used to discharge the gaseous medium out of the cooling device. In some embodiments, the gas collection area is located above the injection chamber.

[0095] The jet chamber refers to the cavity area used for heat exchange and gas-liquid separation via liquid media jetting. Further details about the jet chamber are provided in the following description.

[0096] In some embodiments, a buffer chamber, baffle plate or other gas-liquid separation auxiliary structure may be provided at the inlet of the exhaust channel to reduce the probability that droplets are entrained by high-speed airflow and discharged with the gaseous medium.

[0097] In some embodiments, the exhaust module and the injection module are arranged side-by-side in a cross configuration, with the exhaust module's gas collection area covering the injection chamber. Further details regarding the injection chamber are provided in the related description below.

[0098] In some embodiments, the outlet end of the exhaust channel is connected to an external exhaust pipe through a gas interface on the housing, leading to a gas-liquid separation module outside the cooling device, so as to perform gas-liquid separation treatment on the discharged gas-liquid two-phase medium.

[0099] In some embodiments, the liquid medium absorbs heat and evaporates on the surface of the flow guiding module, transforming into a gaseous medium. The gaseous medium rises into the gas collection area of ​​the exhaust module, and is discharged from the cooling device through the exhaust channel, and sent to subsequent components such as the gas-liquid separation module.

[0100] The replenishment module 600 refers to a liquid return structure module used to collect residual liquid medium on the flow guiding module and transport the residual liquid medium back to the injection module.

[0101] In some embodiments, the replenishment module 600 is configured to collect residual liquid medium on the flow guiding module and return the collected residual liquid medium to the injection module.

[0102] In some embodiments, the replenishment module 600 recovers the residual liquid medium and then transports the recovered residual liquid medium to the injection module 400 for reuse, thereby reducing the consumption of liquid medium and replenishing the supply of liquid medium, thereby reducing the risk of a decrease in heat exchange efficiency in local areas due to insufficient supply of liquid medium.

[0103] In some embodiments, the replenishment module 600 includes a porous liquid sampling head and a capillary replenishment channel; the porous liquid sampling head is connected to a liquid collection tank; the capillary replenishment channel is used to return residual liquid medium collected from the liquid collection tank to the injection module.

[0104] A porous liquid sampling head is a porous structural component used to extract residual liquid media from a liquid collection tank 322.

[0105] In some embodiments, the porous liquid sampling head may be made of sintered metal, porous metal, porous ceramic or other materials with capillary liquid absorption capability, and use capillary force to absorb residual liquid medium in the liquid collection tank.

[0106] In some embodiments, the porous liquid sampling head is connected to a region in the liquid collection tank where the liquid medium has a low flow rate, in order to improve the stability of liquid medium absorption and reduce the occurrence of air bubble entrapment or discontinuous liquid suction.

[0107] Capillary replenishment channels refer to microchannel structures used to transport residual liquid media.

[0108] In some embodiments, residual liquid medium collected on the surface of the guide module 300 can flow into the collection tank through the drain tank and be absorbed by the porous liquid head; the capillary replenishment channel can connect the porous liquid head and the spray module 400, and the residual liquid medium absorbed by the porous liquid head can be transported to the liquid supply and distribution chamber of the spray module 400 through the capillary replenishment channel to realize the return and utilization of the liquid medium.

[0109] In some embodiments, a flow restrictor may also be provided in the capillary recirculation channel to regulate the recirculation flow rate of the liquid medium, thereby reducing the interference of gas backflow or excessive recirculation flow rate on the jet stream.

[0110] In some embodiments of this specification, the replenishment module includes a porous liquid sampling head and a capillary replenishment channel, which can actively recover and reuse the residual liquid medium that has not evaporated on the surface of the guide module, thereby reducing the consumption of liquid medium. At the same time, the porous liquid sampling head can improve the stability of residual liquid medium recovery by utilizing capillary liquid absorption, and the capillary replenishment channel can stably deliver the recovered liquid medium to the spray module 400 to maintain the supply of liquid medium, reduce the risk of local drying and heat exchange failure, and improve the continuity and stability of the cooling process.

[0111] In some embodiments, a cooling structure is provided between the replenishment module and the injection module, the cooling structure being configured to reduce the temperature of the collected liquid medium.

[0112] A cooling structure refers to a heat exchange structure used to cool down residual liquid media. For example, a cooling structure can be a microchannel heat exchanger, a heat sink structure, an air-cooled heat dissipation structure, or other heat exchange components with heat removal functions.

[0113] In some embodiments, a cooling structure is connected in series on the liquid delivery path between the replenishment module and the injection module. The residual liquid medium recovered by the replenishment module is cooled by the cooling structure and then enters the liquid supply distribution chamber of the injection module.

[0114] In some embodiments of this specification, a cooling structure is provided between the replenishment module and the injection module to increase the supercooling of the injection liquid, enhance its heat absorption capacity, thereby improving heat dissipation efficiency and helping to suppress premature bubble formation in the injection chamber due to the high temperature of the replenishment liquid.

[0115] In some embodiments of this specification, by collaboratively arranging a spray module, a flow guiding module, an exhaust module, and a replenishment module within the cooling chamber, a synergistic cooling system can be formed, featuring liquid medium spray heat exchange, rapid discharge of gaseous medium, and recycling of residual liquid medium. Specifically, the spray module sprays liquid medium onto the surface of the flow guiding module to efficiently absorb heat using the latent heat of vaporization during the phase change of the liquid medium; the flow guiding module diffuses the heat generated by the object to be cooled and guides and collects unevaporated liquid medium, thereby reducing localized heat accumulation and liquid stagnation; the exhaust module promptly discharges the gaseous medium generated during heat exchange from the cooling device, reducing gas-liquid interference caused by gaseous medium accumulation in the spray area; and the replenishment module recovers residual liquid medium and returns it to the spray module to maintain the supply of liquid medium near the spray area. Through the division of labor and cooperation among these modules, problems such as gas-liquid mixing, localized drying, and heat exchange instability that easily occur in traditional two-phase cooling processes can be reduced, thereby improving the stability, continuity, and heat exchange efficiency of the heat dissipation process of the object to be cooled under high heat flux density conditions.

[0116] In some embodiments, an isolation element 700 is also provided in the cooling chamber.

[0117] The isolation component 700 refers to a structural component used to fix the internal functional structure and spatially divide the cooling chamber 200.

[0118] In some embodiments, such as Figure 1 As shown, the isolator 700 is configured to fix the injection module 400, the exhaust module 500 and the replenishment module 600, and to divide the cooling chamber into a collection chamber 210 and an injection chamber 220. The collection chamber is configured to provide a receiving space for liquid inlet and exhaust. The flow guide module is located in the injection chamber.

[0119] For details regarding the collection chamber 210 and the jet chamber 220, please refer to the relevant descriptions above.

[0120] In some embodiments, the spacer may be made of metallic materials, polymeric materials, or composite materials, such as stainless steel, aluminum alloy, engineering plastics, or ceramic materials.

[0121] The collection cavity 210 refers to the space formed by the area below the top panel, the upper surface of the separator (not shown in the figure), and the side panel of the housing (not shown in the figure).

[0122] In some embodiments, the manifold is used to centrally house liquid and gas interfaces and to provide space for related pipelines (such as external liquid supply lines and external exhaust lines).

[0123] The external liquid supply pipeline refers to the pipeline structure that transports liquid media to the interior of the cooling device. The liquid media flows through the external liquid supply pipeline and enters the spray module inside the cooling device through the liquid interface.

[0124] External exhaust piping refers to the piping structure that discharges the gas generated or collected inside the cooling device. Gaseous media enter the external exhaust piping through a gas interface and are then transported to the designated area by the external exhaust piping.

[0125] In some embodiments, the collecting cavity 210 can serve as a flow collecting area for liquid and gaseous media within the cooling device, thereby enabling the distribution of liquid media and the discharge of gaseous media.

[0126] In some embodiments, the injection chamber 220 may be formed by the lower surface of the separator 700 (not shown), the side panel of the housing (not shown), and the bottom panel.

[0127] In some embodiments, the injection chamber 220 can serve as a heat exchange region for the liquid medium to undergo jet impact, endothermic evaporation, and gas-liquid separation. In some embodiments, a flow guiding module is located in the injection chamber 220.

[0128] In some embodiments of this specification, by providing an isolator within the cooling chamber, the injection module, exhaust module, and replenishment module can be centrally fixed, thereby improving the installation stability and structural integration of each functional module. Simultaneously, by dividing the cooling chamber into a collection chamber and an injection chamber, the isolator separates the liquid inlet path, exhaust path, and injection heat exchange area, thereby reducing mutual interference between gas and liquid flows and improving the stability of liquid medium transport and the efficiency of gaseous medium discharge. Furthermore, by placing the flow guiding module within the injection chamber, the injected liquid medium can complete the injection heat exchange, flow guiding, and recovery processes within a relatively independent heat exchange space, thereby improving the overall heat exchange efficiency and the ability to manage liquid medium circulation.

[0129] In some embodiments, the injection module 400 is disposed within the isolation member, and the liquid medium enters the injection module 400 after passing through the collection chamber. At least one nozzle of the injection module 400 extends into the injection chamber. The exhaust module 500 is disposed within the isolation member 700, and the gas collection port of the exhaust module 500 is located within the injection chamber. The collected gaseous medium is discharged from the cooling device 1000 after passing through the collection chamber. The replenishment module 600 is disposed within the isolation member 700 and collects the liquid medium from the guide module 300 into the collection chamber for re-entry into the injection module 400.

[0130] In some embodiments, the position of the gas collection port of the exhaust module 500 can be set according to the position distribution of the nozzles of the injection module 400, and is not limited to being arranged in a cross pattern with the nozzles of the injection module 400.

[0131] In some embodiments of this specification, the collection chamber and the injection chamber are physically separated by an isolator, which makes the liquid medium distribution path and the gas medium discharge path independent of each other, thereby reducing the mixing and interference between the gas and liquid phases inside the cooling device. At the same time, by integrating the injection module 400, the exhaust module 500 and the replenishment module 600 into the isolator 700, a compact fluid circulation system can be formed to improve the stability of liquid medium injection, the efficiency of gas medium discharge and the efficiency of liquid medium recovery, thereby improving the heat exchange stability and continuous operation capability of the cooling device under high heat flux density conditions.

[0132] The heat generated by the object to be cooled is first conducted to the bottom panel 110 of the outer casing 100 in contact with it, and then sequentially conducted from the bottom panel 110 to the temperature equalization element 310, the drain element 320, and the pressure-bearing element 330 in the flow guiding module 300. The liquid medium is sprayed onto the surface of the flow guiding module 300 through the spray module 400 and exchanges heat with it, thereby absorbing heat. Part of the liquid medium after absorbing heat evaporates to form a gaseous medium, which carries heat and is discharged from the cooling device 1000 through the exhaust module 500. The other part of the unevaporated liquid medium flows along the drain groove 321 of the drain element 320 and collects in the collection groove 322, and is then transported back to the spray module 400 by the replenishment module 600 to continue participating in the heat exchange cycle.

[0133] Figure 3 This is a schematic diagram of a cooling and heat recovery system according to some embodiments of this specification.

[0134] In some embodiments, such as Figure 3 As shown, the cooling and heat recovery system 2000 includes a circulation module 2100, a heat exchange module 2200, and a cooling device 1000.

[0135] For more information about the cooling unit 1000, please refer to [link / reference]. Figure 1 And its related descriptions.

[0136] In some embodiments, such as Figure 3 As shown, the cooling device 1000 contacts the object to be cooled to dissipate heat, and the heat exchange module 2200 is connected to the heat receiving end; the circulation module 2100 is configured to: transport the gaseous medium separated from the cooling device 1000 to the heat exchange module 2200 for heat exchange, and then transport the liquid medium obtained after heat exchange back to the cooling device 1000.

[0137] For more information on cooling devices, objects to be cooled, gaseous media, and liquid media, please refer to the relevant descriptions above.

[0138] The heat exchange module 2200 refers to a heat exchange structure module used to recover and utilize the heat carried by the gaseous medium.

[0139] In some embodiments, after the compression module of the circulation module 2100 compresses the gaseous medium, the pressure and temperature of the gaseous medium will increase, thereby forming a high-temperature and high-pressure gaseous medium. The heat exchange module 2200 can receive the high-temperature and high-pressure gaseous medium from the circulation module 2100 and transfer the heat in the gaseous medium to the heat receiving end through heat exchange to realize heat recovery and utilization. The gaseous medium after heat exchange can be condensed to form a liquid medium or a gas-liquid two-phase medium and then transported back to the circulation module 2100.

[0140] In some embodiments, the heat exchange module 2200 may be an air cooler, a plate heat exchanger, a shell-and-tube heat exchanger, or other heat exchange equipment capable of heat exchange.

[0141] In some embodiments, the upstream interface of the heat exchange module 2200 can be connected to the circulation module 2100 (the outlet end of the compression module) to receive the high-temperature and high-pressure gaseous medium; the downstream interface of the heat exchange module 2200 can be connected to the circulation module 2100 (the inlet end of the expansion module) to transport the liquid medium or gas-liquid two-phase medium condensed after heat exchange back to the circulation module 2100; the heat exchange module 2200 is also provided with a user-side interface connected to the heat receiving end, so that the medium in the heat receiving end can exchange heat with the high-temperature and high-pressure gaseous medium to absorb heat, thereby outputting heat to the heat receiving end.

[0142] A heat receiving end refers to an external heat-using device or system used to receive the heat output from the heat exchange module 2200. For example, a heat receiving end can be a hot water system, a heating system, a process heat-using device, a domestic hot water device, or other heat utilization device capable of utilizing recovered heat.

[0143] In some embodiments, such as Figure 3 As shown, the heat receiving end is connected to the heat exchange module via the waste heat output interface.

[0144] The circulation module 2100 refers to a circulation structure module used to drive the circulation of cooling medium and to regulate and transport the state of the cooling medium.

[0145] In some embodiments, the cooling medium may include a liquid medium and a gaseous medium.

[0146] In some embodiments, the circulation module is configured to: transport the gaseous medium obtained from the cooling device and separated to the heat exchange module for heat exchange, and then transport the liquid medium obtained after heat exchange back to the cooling device.

[0147] For more information on liquid media and cooling devices, please refer to [link / reference]. Figure 1 And its related descriptions.

[0148] In some embodiments, the circulation module 2100 can be used to perform gas-liquid separation, pressure stabilization, compression and pressure increase, and throttling and pressure reduction on the cooling medium from the cooling device 1000, so as to realize the circulation of liquid and gaseous media in the cooling and heat recovery system.

[0149] In some embodiments, such as Figure 3 As shown, the circulation module 2100 includes a gas-liquid separation module 2101, a pressure stabilizing module 2102, a compression module 2103, and an expansion module 2104 connected in sequence via pipelines.

[0150] In some embodiments, the heat exchange module 2200 is disposed between the compression module 2103 and the expansion module 2104; the cooling device 1000 is disposed between the expansion module 2104 and the gas-liquid separation module 2101; the gas-liquid separation module 2101 is configured to: receive the gaseous medium generated by the cooling device and transported through a pipeline, perform gas-liquid separation on the gaseous medium, and input the separated gas into the pressure stabilizing module; the pressure stabilizing module 2102 is configured to: stabilize the gas and transport the stabilized gas to the compression module; the compression module 2103 is configured to: compress and boost the pressure of the stabilized gas and transport the boosted gas to the heat exchange module 2200; the expansion module 2104 is configured to: receive the liquid medium obtained after heat exchange from the heat exchange module, and transport it to the cooling device after throttling.

[0151] Since the gaseous medium discharged from the cooling device 1000 may contain a small amount of incompletely evaporated liquid medium, it is necessary to separate the liquid medium through the gas-liquid separation module 2101 to reduce the risk of liquid slugging, lubrication failure, or unstable operation after the liquid medium enters the compression module 2103. Furthermore, by reducing the liquid content in the gaseous medium, the stability and efficiency of subsequent compression and heat exchange processes can be improved.

[0152] The gas-liquid separation module 2101 refers to a structural module used for gas-liquid two-phase separation of gaseous media.

[0153] In some embodiments, the gas-liquid separation module 2101 can be a gas-liquid separator, a cyclone separation structure, a baffle structure, a filter structure, or other structures capable of achieving gas-liquid separation.

[0154] In some embodiments, the gas-liquid separation module 2101 may be a vertical or horizontal tank structure, and baffles, filters, swirl channels, etc. may be provided inside it.

[0155] In some embodiments, the inlet of the gas-liquid separation module 2101 is connected to the gas interface of the cooling device 1000 via a pipe to receive the gaseous medium (i.e., gas-liquid two-phase medium) containing a small amount of liquid medium generated by the cooling device 1000. The gas-liquid separation module then separates the gas and liquid to obtain the separated gas. The gas outlet of the gas-liquid separation module 2101 is connected to the inlet of the voltage regulator module 2102 to deliver the separated gas to the voltage regulator module 2102. The gas-liquid separation module 2101 also includes a liquid outlet, through which the liquid after gas-liquid separation can be discharged or recirculated.

[0156] Voltage regulator module 2102 refers to a voltage regulator module used to smooth pressure fluctuations and stabilize the state of the cooling medium. The state of the cooling medium refers to parameters characterizing its state, such as pressure and phase.

[0157] In some embodiments, the pressure stabilizing module 2102 can be a pressure stabilizing container, a buffer tank, or other volumetric structure capable of achieving pressure stability.

[0158] In some embodiments, the voltage stabilizing module 2102 may be a separately configured buffer container or may be integrated with the gas-liquid separation module 2101.

[0159] In some embodiments, the inlet end of the pressure stabilizing module 2102 can be connected to the outlet end of the gas-liquid separation module 2101 to receive the gas after gas-liquid separation, and the pressure stabilizing module stabilizes the gas to obtain the stabilized gas; the outlet end of the pressure stabilizing module 2102 can be connected to the inlet section of the compression module 2103 to deliver the relatively stable pressure gaseous medium to the compression module 2103.

[0160] The pressure stabilizing module 2102 can buffer the gaseous medium (i.e., the separated gas) from the gas-liquid separation module 2101 and output a gaseous medium (i.e., the pressure-stabilized gas) with relatively stable pressure to reduce pressure changes caused by changes in the heat load of the object to be cooled or fluctuations in two-phase flow, thereby improving the stability of the evaporation heat exchange process in the cooling device 1000.

[0161] Compression module 2103 refers to a structural module used to compress and increase the pressure of gaseous media and drive the circulation of cooling media.

[0162] In some embodiments, the compression module 2103 may include a compressor or other device capable of compressing gas. For example, the compression module 2103 may employ a scroll compressor, a reciprocating compressor, a screw compressor, or other compression equipment.

[0163] In some embodiments, the compression module 2103 can increase the pressure and temperature of the low-pressure gaseous medium by doing work on it, thereby providing driving force for the circulation of the cooling medium and improving the thermal grade of the cooling medium for subsequent heat recovery.

[0164] In some embodiments, the inlet of the compression module 2103 can be connected to the outlet of the pressure stabilizing module 2102 to draw in a low-pressure gaseous medium (i.e., the stabilized gas). The pressure stabilized gas is then compressed and pressurized by the compression module to obtain a pressurized gas. The outlet of the compression module 2103 can be connected to the upstream interface of the heat exchange module 2200 to deliver the pressurized gas to the heat exchange module 2200. The pressurized gas undergoes heat exchange through the heat exchange module to obtain a liquid medium after heat exchange. Since the gaseous medium usually maintains its compressed pressure state during the heat exchange process, the liquid medium after the heat exchange module is a high-pressure liquid medium.

[0165] Expansion module 2104 refers to a structural module used for throttling and reducing the pressure of high-pressure liquid media.

[0166] In some embodiments, the expansion module 2104 can reduce the pressure and temperature of the liquid medium by throttling the high-pressure liquid medium (i.e., the liquid medium obtained after heat exchange) from the heat exchange module 2200, thereby forming a low-temperature, low-pressure liquid medium that re-enters the cooling device 1000.

[0167] In some embodiments, the expansion module may be a throttling device such as an expansion valve, a thermostatic expansion valve, an electronic expansion valve, or a capillary tube.

[0168] In some embodiments, the inlet end of the expansion module 2104 can be connected to the downstream interface of the heat exchange module 2200 to receive the high-pressure liquid medium obtained after heat exchange, and obtain a low-temperature and low-pressure liquid medium after throttling by the expansion module; the outlet end of the expansion module 2104 can be connected to the liquid interface of the cooling device 1000 to transport the low-temperature and low-pressure liquid medium back to the cooling device 1000 to achieve recycling.

[0169] In some embodiments of this specification, by sequentially arranging a gas-liquid separation module, a pressure stabilizing module, a compression module, and an expansion module in the circulation module, and placing the heat exchange module between the compression module and the expansion module, and the cooling device between the expansion module and the gas-liquid separation module, a complete and clear cooling medium circulation chain can be constructed. Specifically, the gas-liquid separation module can separate the gas-liquid mixture discharged from the cooling device, reducing the risk of liquid slugging or operational instability caused by liquid medium entering the compression module; the pressure stabilizing module can buffer and stabilize the separated gas, improving the stability of the cooling and heat recovery system on the low-pressure side; the compression module can compress and increase the pressure of the gas, thereby improving the thermal quality of the cooling medium and providing driving force for the cooling medium circulation; the heat exchange module can recover heat using the pressurized high-temperature, high-pressure gas; and the expansion module can throttle and depressurize the liquid medium after heat exchange, forming a low-temperature, low-pressure liquid medium that re-enters the cooling device. Through the sequential coordination of the above modules, a complete thermodynamic cycle process of "gas-liquid separation - pressure stabilization - compression - heat exchange - throttling - cooling" can be formed, providing a clear engineering implementation path, while improving system operation stability, heat exchange efficiency and heat recovery capability.

[0170] In some embodiments, the circulation module 2100 is further configured to re-input the separated liquid medium obtained from the gas-liquid separation module 2101 into the cooling device 1000.

[0171] In some embodiments, the circulation module 2100 may further include a reflux device disposed between the liquid outlet end of the gas-liquid separation module 2101 and the liquid interface of the cooling device 1000, so as to re-transport the liquid medium separated during the gas-liquid separation process to the cooling device 1000.

[0172] A reflux device refers to a liquid transport structure used to re-transport the liquid medium separated by the gas-liquid separation module 2101 back to the cooling device 1000. For example, a reflux device may include a power system such as a liquid pump and a transport channel such as a reflux pipeline.

[0173] In some embodiments, the separated liquid medium can be re-flowed into the cooling device 1000 via a return pipeline under the drive of a liquid pump or pressure difference and gravity, to participate in subsequent circulating heat exchange. In some embodiments, a valve may also be provided in the return pipeline to adjust the return flow rate of the separated liquid medium.

[0174] The liquid medium to be separated refers to the liquid medium obtained from the gas medium generated by the cooling device in the gas-liquid separation module 2101, that is, the liquid after gas-liquid separation by the gas-liquid separation module.

[0175] In some embodiments, the circulation module further includes a recooling module, which is configured to cool the separated liquid medium obtained from the gas-liquid separation module and then re-input it into the cooling device.

[0176] A recooling module is a cooling structure module used to cool down separated liquid media.

[0177] In some embodiments, the recooling module can be used to reduce the temperature of the separated liquid medium to reduce the occurrence of premature evaporation or flash evaporation of the separated liquid medium during transportation, thereby improving the stability of the liquid medium re-entering the cooling device.

[0178] In some embodiments, the recooling module can be a heat exchanger. For example, a plate-fin microchannel heat exchanger, a shell-and-tube heat exchanger, or other heat exchange structures capable of cooling the liquid.

[0179] In some embodiments, a recirculation module may be installed on the return pipeline between the liquid outlet end of the gas-liquid separation module and the liquid interface of the cooling device to pre-cool the separated liquid medium returning to the cooling device.

[0180] In some embodiments of this specification, the recooling module significantly reduces the risk of flash evaporation of the separated liquid medium due to heat during transportation and distribution by recooling the separated liquid medium, ensuring that the liquid jet sprayed onto the chip surface is always a stable liquid column or droplet, which greatly enhances the stability and predictability of the microjet evaporation process.

[0181] In some embodiments of this specification, the circulation module can more accurately maintain the optimal liquid level and gas-liquid ratio in the cooling device by actively recovering and reusing liquid, preventing dryness or insufficient liquid supply caused by liquid loss, thereby improving the system's robustness in response to changes in heat load.

[0182] In some embodiments of this specification, a cooling and heat recovery system 2000, comprising a cooling device 1000, a circulation module 2100, and a heat exchange module 2200, can achieve synergistic heat dissipation and heat recovery of the object to be cooled. The cooling device 1000 utilizes a liquid medium to undergo phase change heat transfer with the object to be cooled, achieving efficient cooling under high heat flux density conditions. The circulation module 2100 circulates and regulates the state of the cooled medium after heat exchange. The heat exchange module 2200 transfers the heat carried by the cooled medium to a heat receiving end, outputting usable thermal energy. Through this structure, dissipative waste heat that is traditionally discharged directly into the environment can be converted into high-grade thermal energy that can be reused. This achieves efficient chip cooling while providing a heat source for domestic hot water, district heating, or process reheating, thereby improving the overall energy utilization efficiency of the system.

[0183] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification and therefore remain within the spirit and scope of the exemplary embodiments described herein.

[0184] Furthermore, this specification uses specific terms to describe embodiments thereof. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "an embodiment," "one embodiment," or "an alternative embodiment" in different locations throughout this specification do not necessarily refer to the same embodiment. Moreover, certain features, structures, or characteristics in one or more embodiments of this specification can be appropriately combined.

[0185] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this specification are not intended to limit the order of the processes and methods described herein. Although various examples have been discussed in the foregoing disclosure of some embodiments of the invention that are currently considered useful, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the spirit and scope of the embodiments described herein. For example, while the system components described above can be implemented using hardware devices, they can also be implemented solely using software solutions, such as installing the described system on existing servers or mobile devices.

[0186] Similarly, it should be noted that, in order to simplify the description disclosed herein and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of embodiments in this specification may sometimes combine multiple features into a single embodiment, drawing, or description thereof. However, this method of disclosure does not imply that the subject matter of this specification requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of a single embodiment disclosed above.

[0187] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this specification are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0188] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this specification, the entire contents of which are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this specification, as well as documents that limit the broadest scope of the claims in this specification (currently or subsequently appended to this specification). It should be noted that in the event of any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials to this specification and the content of this specification, the descriptions, definitions, and / or terminology used in this specification shall prevail.

[0189] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. A cooling device, characterized in that, Includes a housing, the interior of which forms a cooling chamber, the cooling chamber comprising: A flow guiding module is disposed on the inner surface of the bottom panel of the housing, and the outer surface of the bottom panel is in contact with the surface of the object to be cooled; The injection module is configured to receive a liquid medium and spray the liquid medium toward the flow guiding module; An exhaust module is configured to collect the gaseous medium formed after the liquid medium is sprayed onto the flow guiding module and absorbs the heat of the object to be cooled, and then discharge it from the cooling device. The replenishment module is configured to collect residual liquid medium on the flow guiding module and return the collected residual liquid medium to the injection module.

2. The apparatus as claimed in claim 1, characterized in that, The flow guiding module includes a temperature equalization component and a liquid drainage component; One side of the temperature equalization element is disposed on the inner surface of the bottom panel; One side of the draining component is located on the other side of the inner surface of the temperature equalization component, away from the bottom panel.

3. The apparatus as described in claim 2, characterized in that, The flow guiding module also includes a pressure-bearing component; The pressure-bearing component is located on the side of the drain component near the injection module.

4. The apparatus as claimed in claim 2, characterized in that, The draining component is provided with a draining trough and a collecting trough; The drain tank is configured to guide the liquid medium to the collection tank; The liquid collection tank is connected to the replenishment module.

5. The apparatus as described in claim 4, characterized in that, The liquid collection tank is located at the end of the liquid discharge component.

6. The apparatus as claimed in claim 1, characterized in that, The replenishment module includes a porous liquid sampling head and a capillary replenishment channel; The porous liquid sampling head is connected to the liquid collection tank; The capillary refill channel is used to collect residual liquid medium from the collection tank and return it to the injection module.

7. The apparatus as claimed in claim 4, characterized in that, The cooling chamber is also equipped with an isolation component; The isolator is configured to fix the injection module, the exhaust module and the recharge module, and to divide the cooling chamber into a collection chamber and an injection chamber; The collection chamber is configured to provide a receiving space for liquid inlet and venting. The flow guiding module is located in the injection chamber.

8. The apparatus as claimed in claim 7, characterized in that, The injection module is disposed within the isolation member. The liquid medium enters the injection module after passing through the collection chamber. At least one nozzle of the injection module extends into the injection chamber. The exhaust module is disposed within the isolation component, and the gas collection port of the exhaust module is located within the injection chamber. The collected gaseous medium is discharged from the cooling device after passing through the collection chamber. The replenishment module is located inside the isolation component and collects the liquid medium from the flow guiding module into the collection cavity for re-entry into the injection module.

9. A cooling and heat recovery system, characterized in that, Includes a circulation module, a heat exchange module, and a cooling device as described in any one of claims 1-8; The cooling device dissipates heat through contact with the object to be cooled; The heat exchange module is connected to the heat receiving end; The circulation module is configured to: obtain a gaseous medium from the cooling device and separate it, transport it to the heat exchange module for heat exchange, and then transport the liquid medium obtained after heat exchange back to the cooling device.

10. The system as described in claim 9, characterized in that, The circulation module includes a gas-liquid separation module, a pressure stabilizing module, a compression module, and an expansion module connected in sequence via pipelines; The heat exchange module is disposed between the compression module and the expansion module; The cooling device is disposed between the expansion module and the gas-liquid separation module; The gas-liquid separation module is configured to: receive the gaseous medium generated by the cooling device and transported through the pipeline, perform gas-liquid separation on the gaseous medium, and input the separated gas into the voltage stabilizing module; The pressure stabilizing module is configured to: stabilize the gas pressure and deliver the stabilized gas to the compression module; The compression module is configured to: compress and increase the pressure of the stabilized gas, and then deliver the increased pressure gas to the heat exchange module; The expansion module is configured to receive the liquid medium obtained after heat exchange from the heat exchange module, and then deliver it to the cooling device after throttling.

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