An electric air conditioner compressor heat dissipation structure and compressor

Abstract

The application belongs to the technical field of electric vehicles, and discloses an electric air conditioner compressor heat dissipation structure and a compressor. The electric air conditioner compressor heat dissipation structure comprises a controller shell, a containing space is formed in the controller shell, a control panel is arranged in the containing space, a SiC half-bridge power module is arranged on one side of the control panel close to the bottom of the containing space, and a heat dissipation boss is arranged on the bottom of the containing space and is attached to the SiC half-bridge power module. The application aims to solve the technical problem that the heat dissipation efficiency of the heat dissipation structure of the compressor controller in the prior art is poor and cannot meet the heat dissipation requirement of SiC devices.

Description

Technical Field

[0001] This invention belongs to the field of electric vehicle technology, and particularly relates to a heat dissipation structure and compressor for an electric air conditioning compressor. Background Technology

[0002] As a core component of electric air conditioning systems in new energy vehicles, the air conditioning compressor controller is responsible for converting DC power into AC power to drive the compressor motor. Its internal power devices generate heat under high-frequency switching conditions, and the heat dissipation performance directly determines the controller's reliability, power density, and service life.

[0003] Traditional air conditioner compressor controllers mostly employ silicon-based IGBT solutions, with aluminum fin air cooling as the primary heat dissipation structure. However, silicon-based IGBTs suffer from high switching losses and low operating frequencies. Under high loads, high ambient temperatures, and high-frequency speed control conditions, the junction temperature of the devices easily exceeds the limit, resulting in poor thermal stability, excessive temperature rise, and limited power density. In recent years, SiC MOSFETs, with their advantages of low switching losses, high withstand voltage, high junction temperature tolerance, and high-frequency operation, have been applied to air conditioner compressor controllers to improve system energy efficiency and power density. However, SiC devices have higher power density and greater heat flux density, and traditional heat dissipation structures are no longer sufficient to meet their heat dissipation requirements. Traditional air cooling, with its fin area limited by the controller housing space, suffers from a sharp decline in heat exchange efficiency under high-temperature environments, failing to meet the high-power heat dissipation requirements of SiC devices. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation structure and compressor for an electric air conditioner compressor, so as to solve the technical problem that the heat dissipation structure of the compressor controller in the prior art has poor heat dissipation efficiency and cannot meet the heat dissipation requirements of SiC devices.

[0005] To solve the above-mentioned technical problems, the present invention is implemented using the following technical solution:

[0006] In a first aspect, the present invention provides a heat dissipation structure for an electric air conditioner compressor, comprising: a controller housing, wherein an accommodating space is formed inside the controller housing; a control board, wherein the control board is disposed within the accommodating space; a SiC half-bridge power module, wherein the SiC half-bridge power module is disposed on the side of the control board near the bottom of the accommodating space; and a heat dissipation boss, wherein the heat dissipation boss is disposed at the bottom of the accommodating space and is in contact with the SiC half-bridge power module.

[0007] Furthermore, the SiC half-bridge power module has a welding surface and a heat dissipation surface that are arranged opposite to each other. The welding surface of the SiC half-bridge power module is welded to the control board, and the heat dissipation surface is attached to the heat dissipation boss.

[0008] Furthermore, a thermally conductive medium is filled between the SiC half-bridge power module and the heat dissipation boss.

[0009] Furthermore, the heat dissipation boss is integrally formed with the controller housing.

[0010] Furthermore, the controller housing is made of aluminum alloy.

[0011] Furthermore, the accommodating space has an opening, and the heat dissipation structure also includes: a controller cover, which is detachably connected to the controller housing and closes the opening.

[0012] Furthermore, sealant is used to fill the space between the controller box cover and the controller housing.

[0013] Secondly, the present invention also provides a compressor, including the heat dissipation structure of the electric air conditioning compressor described in any of the preceding claims, with the controller housing disposed on the compressor.

[0014] Furthermore, it also includes: a three-phase terminal block, which is installed in the controller housing, with one end of the three-phase terminal block extending into the receiving space and electrically connected to the control board, and the other end electrically connected to the compressor.

[0015] Beneficial effects

[0016] The technical solution of this invention, by placing the SiC half-bridge power module on the side of the control board near the bottom of the housing space and providing a heat dissipation protrusion directly attached to the SiC half-bridge power module, effectively shortens the heat dissipation path of the SiC half-bridge power module, reduces contact thermal resistance, thereby improving heat dissipation efficiency and better matching the heat dissipation requirements of the SiC half-bridge power module. Specifically, this invention arranges the SiC half-bridge power module on the side of the control board near the bottom of the housing space, and directly attaches the heat dissipation protrusion at the bottom of the housing space to the SiC half-bridge power module. This allows the heat generated by the SiC half-bridge power module during operation to be directly conducted to the heat dissipation protrusion for dissipation, thereby ensuring that the temperature of the SiC half-bridge power module is controllable under high power and high heat flux density conditions, and improving the reliability and service life of the air conditioner compressor. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an exploded view of the heat dissipation structure of an electric air conditioner compressor provided by the present invention.

[0019] Explanation of reference numerals in the attached figures:

[0020] 1. Controller housing; 11. Accommodation space; 12. Heat dissipation boss; 2. Control board; 3. SiC half-bridge power module; 4. Controller box cover; 5. Three-phase terminal block; 6. High-voltage connector; 7. Low-voltage connector; 8. Compressor. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use.

[0022] Example 1:

[0023] In a first aspect, the present invention provides a heat dissipation structure for an electric air conditioner compressor, such as... Figure 1 As shown, the device includes a controller housing 1, a control board 2, a SiC half-bridge power module 3, and a heat dissipation boss 12. The controller housing 1 has an internal accommodating space 11. The control board 2 is disposed within the accommodating space 11. The SiC half-bridge power module 3 is disposed on the side of the control board 2 near the bottom of the accommodating space 11. The heat dissipation boss 12 is disposed at the bottom of the accommodating space 11 and is in contact with the SiC half-bridge power module 3.

[0024] Specifically, the controller housing 1 has an internal accommodating space 11. A mounting post is located at the bottom of the accommodating space 11. The control board 2 is fixedly installed within the accommodating space 11 using the mounting post and bolts. The SiC half-bridge power module 3 is positioned on the side of the control board 2 near the bottom of the accommodating space 11. A heat dissipation protrusion 12 is located at the bottom of the accommodating space 11, directly opposite the SiC half-bridge power module 3. The heat dissipation protrusion 12 protrudes upwards, corresponding to the heat dissipation surface of the SiC half-bridge power module 3. The external dimensions of the heat dissipation protrusion 12 are larger than the heat dissipation surface of the SiC half-bridge power module 3, completely covering it to ensure effective heat conduction and avoid localized heat conduction blind spots. The heat dissipation protrusion 12 allows the heat generated by the SiC half-bridge power module 3 to be quickly conducted to the controller housing 1, where it is dissipated over a large area, thus shortening the heat dissipation path and reducing the operating temperature of the SiC half-bridge power module 3.

[0025] Preferably, in this embodiment, there are three SiC half-bridge power modules 3, which are disposed on the side of the control board 2 near the bottom of the receiving space 11. The bottom of the receiving space 11 is provided with three heat dissipation protrusions 12, which are respectively attached to the three SiC half-bridge power modules 3 to dissipate heat from the three SiC half-bridge power modules 3.

[0026] Furthermore, the SiC half-bridge power module 3 has a welding surface and a heat dissipation surface that are arranged opposite to each other. The welding surface of the SiC half-bridge power module 3 is welded to the control board 2, and the heat dissipation surface is attached to the heat dissipation boss 12.

[0027] Specifically, the SiC half-bridge power module 3 has a soldering surface and a heat dissipation surface. The soldering surface is used for electrical connection with the control board 2. During assembly, the SiC half-bridge power module 3 is soldered to the surface power area of ​​the control board 2 and then... The heat dissipation surface is used for heat dissipation and is located on top of the SiC half-bridge power module 3, opposite to the soldering surface. The heat dissipation surface is parallel to the upper surface of the heat dissipation boss 12, so that the heat dissipation surface and the upper surface of the heat dissipation boss 12 are in complete contact.

[0028] Furthermore, a thermally conductive medium is filled between the SiC half-bridge power module 3 and the heat dissipation boss 12.

[0029] Specifically, in this embodiment, the thermally conductive medium is a high thermal conductivity thermal adhesive. The high thermal conductivity thermal adhesive is uniformly filled between the heat dissipation surface of the SiC half-bridge power module 3 and the upper surface of the heat dissipation protrusion 12. The high thermal conductivity thermal adhesive completely fills the tiny gap between the heat dissipation protrusion 12 and the SiC half-bridge power module 3, expelling any air and thus significantly reducing contact thermal resistance. The high thermal conductivity thermal adhesive achieves a flexible, close contact between the heat dissipation protrusion 12 and the SiC half-bridge power module 3, eliminating contact gaps caused by assembly tolerances and reducing contact thermal resistance. It also possesses insulation, shock absorption, and high-temperature resistance properties, making it suitable for the harsh operating conditions of long-term continuous operation of air conditioners and preventing high-temperature aging, cracking, and delamination.

[0030] Furthermore, the heat dissipation boss 12 is integrally formed with the controller housing 1.

[0031] Specifically, the heat dissipation protrusion 12 is integrally formed with the controller housing 1, so that there is no contact thermal resistance between the heat dissipation protrusion 12 and the controller housing 1. Heat can be conducted from the heat dissipation protrusion 12 to other parts of the controller housing 1, realizing rapid diffusion and uniform distribution of heat.

[0032] Furthermore, the controller housing 1 is made of aluminum alloy.

[0033] Specifically, aluminum alloy has excellent thermal conductivity, which can diffuse the heat conducted by the heat dissipation boss 12 to the entire controller housing 1 and dissipate the heat.

[0034] Furthermore, the accommodating space 11 has an opening, and the heat dissipation structure also includes: a controller cover 4, which is detachably connected to the controller housing 1 and closes the opening.

[0035] Specifically, the internal accommodating space 11 of the controller housing 1 has an opening located at the top of the controller housing 1, for the installation and maintenance of the control board 2 and other components. The controller cover 4 is detachably connected to the controller housing 1 to facilitate the installation and maintenance of the control board 2 and other components within the accommodating space 11. Preferably, the controller cover 4 is bolted to the controller housing 1. After the controller cover 4 closes the opening, it, together with the controller housing 1, forms a closed accommodating space 11, protecting the internal control board 2 and other components and preventing external dust and moisture from entering the accommodating space 11.

[0036] Furthermore, sealant is filled between the controller cover 4 and the controller housing 1.

[0037] Example 2:

[0038] This embodiment also provides a compressor 8, which includes the heat dissipation structure of the electric air conditioner compressor in embodiment one, and the controller housing 1 is disposed on the compressor 8.

[0039] Specifically, the controller housing 1 is mounted on the compressor 8, located on top of the compressor 8. The compressor 8 contains refrigerant, and the outer surface of the controller housing 1 exchanges heat with the refrigerant inside the compressor 8.

[0040] Specifically, the heat generated by the SiC half-bridge power module 3 during operation is transferred from its heat dissipation surface to the heat dissipation protrusion 12 of the controller housing 1 through the high thermal conductivity thermal adhesive. From there, the heat is diffused from the heat dissipation protrusion 12 to the entire aluminum alloy controller housing 1, achieving large-area heat dissipation. Furthermore, heat exchange occurs between the controller housing 1 and the refrigerant inside the compressor 8, rapidly removing heat and achieving efficient cooling of the SiC half-bridge power module 3.

[0041] Specifically, this invention solves the problems of high thermal resistance, slow heat dissipation, and hot spot accumulation in traditional heat dissipation structures by shortening the heat conduction path of the SiC half-bridge power module 3. It fully adapts to the high-frequency, low-loss, and high-heat-flux-density operating characteristics of the SiC half-bridge power module 3, effectively reducing its operating junction temperature and preventing overheating, power descent, and shutdown protection failures during high-load operation of the compressor 8. This invention features a simple structure, high integration, and eliminates the need for additional external components such as cooling fans and heat sinks. The overall size is small, assembly is convenient, and reliability is high, significantly improving the operating efficiency and service life of the compressor 8.

[0042] Furthermore, the compressor 8 also includes a three-phase terminal 5, which is installed in the controller housing 1. One end of the three-phase terminal 5 extends into the receiving space 11 and is electrically connected to the control board 2, while the other end is electrically connected to the compressor 8.

[0043] Specifically, the compressor 8 also includes a high-pressure connector 6 and a low-pressure connector 7, which are respectively mounted on the controller housing 1 and electrically connected to the control board 2.

[0044] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "up," "down," "front," "rear," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used to explain the relative positional relationship and movement between components in a specific posture. If the specific posture changes, the directional indication will also change accordingly. These terms are used only for the convenience of describing the invention and for simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the invention.

[0045] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0046] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0047] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A heat dissipation structure for an electric air conditioner compressor, characterized in that, include: A controller housing, wherein an accommodating space is formed inside the controller housing; A control panel, wherein the control panel is disposed within the accommodating space; The SiC half-bridge power module is located on the side of the control board near the bottom of the housing space. A heat dissipation protrusion is located at the bottom of the accommodating space and is in contact with the SiC half-bridge power module.

2. The heat dissipation structure for an electric air conditioner compressor according to claim 1, characterized in that, The SiC half-bridge power module has a welding surface and a heat dissipation surface that are arranged opposite to each other. The welding surface of the SiC half-bridge power module is welded to the control board, and the heat dissipation surface is attached to the heat dissipation boss.

3. The heat dissipation structure for an electric air conditioner compressor according to claim 1, characterized in that, The space between the SiC half-bridge power module and the heat dissipation boss is filled with a thermally conductive medium.

4. The heat dissipation structure of the electric air conditioner compressor according to claim 1, characterized in that, The heat dissipation boss is integrally formed with the controller housing.

5. The heat dissipation structure for an electric air conditioner compressor according to claim 1, characterized in that, The controller housing is made of aluminum alloy.

6. The heat dissipation structure of the electric air conditioner compressor according to claim 1, characterized in that, The accommodating space has an opening, and the heat dissipation structure further includes: A controller cover, which is detachably connected to the controller housing and closes the opening.

7. The heat dissipation structure for an electric air conditioner compressor according to claim 6, characterized in that, The space between the controller cover and the controller housing is filled with sealant.

8. A compressor, characterized in that, The device includes the heat dissipation structure of the electric air conditioner compressor as described in any one of claims 1 to 7, wherein the controller housing is disposed on the compressor.

9. The compressor according to claim 8, characterized in that, Also includes: The three-phase terminal block is installed in the controller housing. One end of the three-phase terminal block extends into the receiving space and is electrically connected to the control board, while the other end is electrically connected to the compressor.

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