A double-layer decoupling jet flow liquid cooling plate with reinforced heat exchange and secondary flow path

Abstract

The application discloses a double-layer decoupling type jet flow liquid cooling plate with reinforced heat exchange and secondary flow paths, and relates to the technical field of liquid cooling heat dissipation. The double-layer decoupling type jet flow liquid cooling plate with reinforced heat exchange and secondary flow paths comprises a heat dissipation plate, a partition plate, a distribution plate and a cover plate arranged from bottom to top. The cover plate and the distribution plate form a distribution cavity in communication with an inlet. The distribution plate and the partition plate form an isothermal cavity in communication with an outlet. The heat dissipation plate is provided with a plurality of jet flow cavities. The distribution plate is provided with a plurality of nozzles. The partition plate is provided with a plurality of jet flow inlets and a plurality of jet flow outlets. One end of the nozzle is in communication with the distribution cavity, and the other end is in communication with the jet flow inlet. The double-layer decoupling type jet flow liquid cooling plate with reinforced heat exchange and secondary flow paths can impact a plurality of liquid jets independently by arranging a plurality of jet flow cavities, so that the interaction of the cooling liquid during heat exchange on the surface of the heat dissipation plate and the accumulation of the cooling liquid in the jet flow cavity are avoided.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, specifically to a double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path. Background Technology

[0002] The explosive growth in demand for high-performance computing and artificial intelligence has driven a rapid increase in chip integration and power density. The thermal design power of chips is climbing at an unprecedented rate, posing a severe challenge to the thermal management of high-power chips. Traditional air-cooling solutions are no longer sufficient to meet heat dissipation requirements.

[0003] Liquid cooling solutions, with their superior heat dissipation capabilities, are becoming a core direction for industry transformation. Among the various liquid cooling technologies, including immersion cooling, microchannel radiators, liquid cooling plates, spray cooling, nanofluid cooling, and jet impingement cooling, jet impingement cooling has attracted widespread attention from researchers due to its excellent heat transfer capabilities.

[0004] For example, the patent document with authorization announcement number CN223092876U, authorization announcement date July 11, 2025, and titled "A Jet Liquid Cooling Device," includes a cover plate with at least one inlet and two outlets at its upper end; a base mounted on the bottom surface of the cover plate, with several jet holes on the base; and a chip assembly mounted below the base. This jet liquid cooling device can improve the heat dissipation effect of the chip.

[0005] In existing technologies, multi-nozzle array jet impacting liquid cooling plates can achieve high heat transfer coefficients for cooling electronic devices that generate extremely high heat flux densities. However, in practical applications, the following technical drawbacks still exist: First, after the fluid impacts the heat exchange surface through the multi-nozzle array, it needs to travel a long path to reach the outlet located at the edge, resulting in high flow resistance and significant pressure drop, which limits its application in low-energy-consumption scenarios. Second, because multiple liquid jets interact when impacting the heated surface, the fluid that has completed heat exchange accumulates in the jet cavities, leading to uneven distribution of the heat transfer coefficient on the heated surface. This results in insufficient heat dissipation in localized areas of the chip, forming hot spots and reducing heat transfer performance. Therefore, it is difficult to meet the stringent requirements of high-power chips for heat dissipation uniformity and efficiency. Summary of the Invention

[0006] The purpose of this invention is to provide a double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path to overcome the above-mentioned shortcomings in the prior art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path includes a heat dissipation plate, a partition plate, a distribution plate, and a cover plate arranged from bottom to top. A distribution cavity communicating with the liquid inlet is formed between the cover plate and the distribution plate, and a temperature equalization cavity communicating with the liquid outlet is formed between the distribution plate and the partition plate. A plurality of jet cavities are constructed on the heat dissipation plate, a plurality of nozzles are constructed on the distribution plate, and a plurality of jet inlets and a plurality of jet outlets are constructed on the partition plate. One end of the nozzle is connected to the distribution cavity, and the other end is connected to the jet inlet, so that the coolant flows into the jet cavity through the nozzle and the jet inlet for impact heat dissipation, and then flows into the temperature equalization cavity through the jet outlet for temperature equalization.

[0009] The above-mentioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path has the liquid inlet constructed on the cover plate.

[0010] The above-mentioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path has the liquid outlet constructed on the distribution plate.

[0011] The aforementioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path has multiple jet outlets arranged around one jet inlet.

[0012] The aforementioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path has a protruding structure inside the jet cavity.

[0013] The aforementioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path has a buffer zone connected to the liquid outlet on one side of the temperature equalization cavity.

[0014] The aforementioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path includes a movable plate slidably disposed on the partition plate, the movable plate having several through holes adapted to the nozzle, an overflow hole on the movable plate, and an elastic element for forcing the movable plate closer to the heat sink plate.

[0015] The aforementioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path, under the action of the elastic element, has a movable plate attached to the heat dissipation plate to block the overflow hole; when the pressure in the jet cavity increases, the movable plate overcomes the elastic force of the elastic element and moves upward to expose the overflow hole.

[0016] The aforementioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path has an overflow groove constructed on the nozzle, with both ends of the overflow groove located on the outer circumferential wall of the nozzle.

[0017] The aforementioned double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path has the bottom end of the overflow groove blocked by the inner wall of the through hole when the movable plate is attached to the heat dissipation plate; when the movable plate is away from the heat dissipation plate, the bottom end of the overflow groove is exposed so as to connect the jet cavity and the uniform temperature cavity through the overflow groove.

[0018] In the above technical solution, the present invention provides a double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path. By setting several jet cavities, multiple liquid jet impacts are separated. This decoupled design avoids the interaction of coolant on the heat exchanger surface and the accumulation in the jet cavities, which would lead to deterioration of heat transfer performance and increased pressure loss, thus fully utilizing the efficient heat dissipation capability of the jet impact. When the coolant flows into the uniform temperature cavity through the jet outlet, it forms several short-path flows, significantly reducing flow resistance and temperature gradient. When the coolant flows in the uniform temperature cavity, it further improves the temperature uniformity and enhances the overall heat transfer coefficient. Inside the uniform temperature cavity, the cylindrical outer wall of the nozzle can act as a turbulence structure, further improving the temperature uniformity. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0020] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention;

[0021] Figure 2 This is a cross-sectional structural schematic diagram provided for another embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the exploded structure provided in another embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of a protrusion structure provided in another embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of an overflow hole structure provided in another embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of an overflow groove structure provided in another embodiment of the present invention;

[0026] Figure 7 This is a schematic diagram of a movable plate structure provided in another embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of a turbulence-inducing fan blade structure provided in another embodiment of the present invention;

[0028] Figure 9 This is a schematic diagram of a brake block structure provided in another embodiment of the present invention;

[0029] Figure 10 This is a schematic diagram of a rotating ring structure provided in another embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Heat sink; 2. Partition plate; 3. Distribution plate; 4. Cover plate; 5. Nozzle; 6. Jet inlet; 7. Jet outlet; 8. Jet chamber; 9. Liquid inlet; 10. Liquid outlet; 11. Buffer zone; 12. Movable plate; 13. Overflow hole; 14. Elastic element; 15. Extension; 16. Overflow groove; 17. Rotary ring; 18. Baffle blade; 19. Braking block. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0033] Reference Figure 1-10 This invention provides a double-layer decoupled jet liquid cooling plate with enhanced heat exchange and a secondary flow path, comprising a heat dissipation plate 1, a partition plate 2, a distribution plate 3, and a cover plate 4 arranged from bottom to top. A distribution cavity communicating with a liquid inlet 9 is formed between the cover plate 4 and the distribution plate 3, and a temperature equalization cavity communicating with a liquid outlet 10 is formed between the distribution plate 3 and the partition plate 2. The heat dissipation plate 1 has a plurality of jet chambers 8, the distribution plate 3 has a plurality of nozzles 5, and the partition plate 2 has a plurality of jet inlets 6 and a plurality of jet outlets 7. One end of each nozzle 5 communicates with the distribution cavity, and the other end communicates with the jet inlet 6, allowing the coolant to flow into the jet chambers 8 through the nozzles 5 and jet inlets 6 for impact heat dissipation, and then flow into the temperature equalization cavity through the jet outlets 7 for temperature equalization. The liquid inlet 9 is located on the cover plate 4. The liquid outlet 10 is located on the distribution plate 3.

[0034] Specifically, the jet liquid cooling plate is generally provided with an inlet 9 and an outlet 10, and pipes are generally connected to the inlet 9 and outlet 10 to allow the coolant to flow. In this embodiment, the inlet 9 is constructed on the cover plate 4 and communicates with the distribution chamber, so that the coolant first enters the distribution chamber and spreads, and then flows out of the distribution chamber through several nozzles 5. In this embodiment, the outlet 10 is constructed on the distribution plate 3 and communicates with the heat equalization chamber, so that the coolant after heat exchange can be discharged. The side of the heat sink 1 away from the partition plate 2 is used to attach to the chip and other structures, so that the heat from the chip and the heat sink 1 can be removed by the flow of coolant. The heat sink 1, partition plate 2, distribution plate 3 and cover plate 4 are set as a multi-layer composite structure, which is convenient for disassembly and installation. Optionally, two adjacent layers of plates can be connected by adhesive or bolts to ensure stable and sealed operation of each cavity. The above are all prior art and will not be described in detail here. The innovations of this invention are as follows: First, several jet chambers 8 corresponding to nozzles 5 are provided to independently separate the impact of multiple liquid jets, minimizing the interaction of coolant during heat exchange on the surface of the heat sink 1. Second, jet inlets 6 and jet outlets 7 are simultaneously provided on the partition 2, allowing coolant to impact into the jet chambers 8 through the jet inlets 6 and then flow into the temperature equalization chamber through the jet outlets 7. This creates several short-path flows of coolant on the partition 2, significantly reducing flow resistance and temperature gradient. Third, the coolant can further dissipate heat while flowing in the temperature equalization chamber, improving temperature uniformity, increasing the overall heat transfer coefficient of the liquid cooling plate, and improving the temperature uniformity of the chip. Fourth, the nozzles 5 can create turbulence in the temperature equalization chamber, thereby extending the coolant's outflow path and further improving heat exchange efficiency and temperature uniformity.

[0035] This invention provides a double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path. By setting several jet cavities 8, multiple liquid jet impacts are separated. This decoupled design avoids the interaction of coolant on the heat exchanger surface 1 and the accumulation in the jet cavities, which would lead to deterioration of heat transfer performance and increased pressure loss, thus fully utilizing the efficient heat dissipation capability of the jet impact. When the coolant flows into the temperature equalization cavity through the jet outlet 7, it forms several short-path flows, significantly reducing flow resistance and temperature gradient. When the coolant flows in the temperature equalization cavity, it further improves the temperature uniformity (i.e., improves the temperature uniformity of the chip) and enhances the overall heat transfer coefficient. Inside the temperature equalization cavity, the cylindrical outer wall of the nozzle 5 can act as a turbulence structure, further improving the temperature uniformity.

[0036] In another embodiment of the present invention, a plurality of jet outlets 7 are arranged around one of the jet inlets 6. Specifically, there are preferably four jet outlets 7. In this embodiment, one nozzle 5 corresponds to one jet cavity 8, and one jet cavity 8 corresponds to one jet inlet 6, so that the coolant flows into the jet cavity 8 through the distribution cavity, the nozzle 5 and the jet inlet 6, and after impact heat exchange in the jet cavity 8, it flows out through the four jet outlets 7 and the temperature equalization cavity, thereby completing the heat exchange flow of the coolant.

[0037] Preferably, the jet cavity 8 has a protruding structure. Specifically, the protruding structure is preferably a plurality of pyramidal structures arranged in an array (e.g., Figure 4 As shown, by introducing a pyramid structure, the heat exchange area is effectively increased; on the other hand, the raised surface structure helps to alleviate the problem of rapid heat exchange efficiency decay outside the jet stagnation zone, forming an extremely thin thermal boundary layer at the impact point to achieve efficient heat dissipation with high heat flux density. After the coolant working fluid impacts the heat exchange surface inside the jet cavity 8, it is discharged through the jet outlet 7, thereby forming convection inside the jet cavity 8 to achieve heat dissipation.

[0038] Preferably, a buffer zone 11 communicating with the liquid outlet 10 is provided on one side of the temperature equalization chamber. Specifically, the buffer zone 11 is triangular in shape and is located on one side of the temperature equalization chamber. It is used to accommodate the coolant that has completed the jet impact heat exchange but has not yet been discharged. Together with the temperature equalization chamber and the liquid outlet 10, it forms the outlet system of the entire liquid cooling plate.

[0039] In another embodiment of the present invention, as an alternative to the integral structure of the partition 2 described above, preferably, a movable plate 12 is slidably disposed on the partition 2. The movable plate 12 has a plurality of through holes adapted to the nozzles 5 and an overflow hole 13. It also includes an elastic element 14 for forcing the movable plate 12 closer to the heat sink 1. Specifically, in this embodiment, the jet inlet 6 described above is omitted, and the nozzles 5 are directly extended into the jet cavity 8 by constructing through holes. In the above embodiment, the coolant is sprayed into the jet cavity 8 at high speed for heat exchange. The flow rate and pressure of the coolant are affected by the external pumping structure, and the water pressure or flow rate may be unstable, that is, the flow rate or pressure of the coolant may change. Therefore, the movable plate 12 and the elastic element 14 are provided as adaptive structures. In this embodiment, the partition 2 has a movable hole in the middle, and the movable plate 12 is slidably disposed in the movable hole. The range of the movable plate 12 and the movable hole corresponds to the plurality of jet chambers 8. Under the action of the elastic member 14, the movable plate 12 is attached to the heat sink 1. The overall structure is similar to the above embodiment. The coolant normally performs impact heat exchange. At this time, the movable plate 12 is subjected to the pressure of the coolant in the jet chamber 8 but does not move. When the flow rate or pressure of the coolant increases to a certain threshold, the pressure on the movable plate 12 is larger, so as to overcome the elastic force of the elastic member 14 and move slightly away from the heat sink 1. At this time, the space of the plurality of jet chambers 8 becomes larger and interconnected. At the same time, the overflow hole 13 is exposed so that the coolant in the plurality of jet chambers 8 can flow into the uniform temperature chamber through the jet outlet 7 and the overflow hole 13 at the same time.

[0040] With this configuration, under the action of the elastic element 14, the movable plate 12 adheres to the heat dissipation plate 1 to block the overflow hole 13; when the pressure inside the jet cavity 8 increases, the movable plate 12 overcomes the elastic force of the elastic element 14 and moves upward to expose the overflow hole 13. The advantage is that when the flow rate or pressure of the coolant is affected by the external pumping structure and exceeds (increases) a certain threshold, the movable plate 12 can be passively moved upward to increase the space of the jet cavity 8 and increase the flow path of the coolant. In this way, while ensuring the impact heat exchange effect of the device, the speed of coolant outflow from the device is increased, thereby improving the adaptability of the device.

[0041] Optionally, the elastic element 14 can be a spring structure from the prior art, with one end fixed to the inner wall of the jet cavity 8 and the other end fixed to the movable plate 12, so that the movable plate 12 is forced to fit against the heat sink 1 through the elastic element 14; in order to facilitate the disassembly of the partition 2 and the heat sink 1, preferably, the partition 2 is constructed with four extensions 15, the extensions 15 are constructed in an L shape, one end of the elastic element 14 is fixed to the extension 15 and the other end is fixed to the movable plate 12, so that the movable plate 12 is forced to fit against both the extensions 15 and the heat sink 1 through the elastic element 14. The advantage is that, in this embodiment, no extra connecting structure is provided between the partition 2 and the heat sink 1, which facilitates disassembly and installation. During installation, the four extensions 15 on the partition 2 are simply embedded into the corresponding jet cavities 8 (no protruding structure is provided in the jet cavity 8 corresponding to the extensions 15, such as...). Figure 5 (As shown).

[0042] In another embodiment of the present invention, as a replacement or parallel arrangement of the overflow hole 13, preferably, an overflow groove 16 is constructed on the nozzle 5, with both ends of the overflow groove 16 located on the outer circumferential wall of the nozzle 5. Specifically, in this embodiment, the inner diameter of the through hole and the outer diameter of the nozzle 5 are adapted to each other, allowing the nozzle 5 to slide relative to each other within the through hole. The overflow groove 16 is arranged along the length direction of the nozzle 5. With this arrangement, when the movable plate 12 is attached to the heat sink 1, the inner wall of the through hole seals the bottom end of the overflow groove 16 (e.g., ...). Figure 6 As shown); when the movable plate 12 is away from the heat sink 1, the bottom end of the overflow groove 16 is exposed, so that the jet cavity 8 and the heat equalization cavity can be connected through the overflow groove 16 (as shown). Figure 7 (As shown). The advantage is that, in this embodiment, the overflow groove 16 can replace the overflow hole 13 in the above embodiment. When the flow rate or pressure of the coolant exceeds (increases) a certain threshold due to the influence of the external pumping structure, the movable plate 12 is passively moved upward so that the bottom end of the overflow groove 16 is connected to the jet cavity 8, thereby allowing the coolant in the jet cavity 8 to flow into the uniform temperature cavity through the overflow groove 16.

[0043] It should be noted that in order to reduce the friction between the nozzle 5 and the through hole, a small gap can be left between the through hole and the nozzle 5. That is, the flow of coolant between the through hole and the nozzle 5 does not affect the use of the overflow groove 16.

[0044] Furthermore, a rotating ring 17 is rotatably connected to the nozzle 5. The rotating ring 17 has multiple baffles 18, which correspond to the jet outlets 7. When the coolant flows out through the jet outlets 7, it impacts the baffles 18, causing them to rotate and improve the turbulence effect. Specifically, the rotating ring 17 is located on the side of the nozzle 5 away from the baffle 2. When the coolant is discharged through several jet outlets 7, it impacts the baffles 18, causing the rotating ring 17 and the baffles 18 to rotate. This further agitates the flow of liquid within the homogenizing chamber through the baffles 18. Combined with the cylindrical shape of the nozzle 5, this extends the coolant's discharge path, effectively improving heat exchange and temperature uniformity.

[0045] Furthermore, a braking block 19 is constructed on the movable plate 12. When the movable plate 12 moves to its limit position, the braking block 19 abuts against the rotating ring 17, forcing the turbulence-inducing blades 18 to stop rotating. Specifically, in the above embodiment, if the flow rate or pressure of the coolant increases, the turbulence structure will affect the flow of the coolant. Therefore, the braking block 19 is provided. As the movable plate 12 moves away from the jet cavity 8, the braking block 19 will approach the rotating ring 17 until it abuts against the rotating ring 17. At this point, the braking block 19 brakes the turbulence-inducing blades 18 to reduce their turbulence effect, minimize the impact on the circulation of the coolant, and further improve the adaptability of the device.

[0046] It should be noted that in this embodiment, the external coolant pumping structure can autonomously control the flow rate or pressure (this is prior art, not described in detail, and not illustrated) to optionally control the movement of the movable plate 12, thereby changing the state of the device and actively adapting to different heat dissipation conditions.

[0047] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A double-layer decoupled jet liquid cooling plate with enhanced heat exchange and secondary flow path, comprising a heat dissipation plate, a partition plate, a distribution plate, and a cover plate arranged from bottom to top, characterized in that, A distribution cavity communicating with the liquid inlet is formed between the cover plate and the distribution plate, and a temperature equalization cavity communicating with the liquid outlet is formed between the distribution plate and the partition plate. Several jet cavities are constructed on the heat dissipation plate, several nozzles are constructed on the distribution plate, and several jet inlets and several jet outlets are constructed on the partition plate. One end of the nozzle is communicating with the distribution cavity, and the other end is communicating with the jet inlet, so that the coolant flows into the jet cavity through the nozzle and the jet inlet for impact heat dissipation, and then flows into the temperature equalization cavity through the jet outlet for temperature equalization.

2. The double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 1, characterized in that, The liquid inlet is constructed on the cover plate.

3. The double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 1, characterized in that, The liquid outlet is constructed on the distribution plate.

4. A double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 1, characterized in that, A plurality of jet outlets are provided around one of the jet inlets.

5. A double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 1, characterized in that, The jet cavity has a protruding structure.

6. A double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 1, characterized in that, A buffer zone connected to the liquid outlet is provided on one side of the temperature equalization chamber.

7. A double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 1, characterized in that, A movable plate is slidably disposed on the partition plate. The movable plate has several through holes adapted to the nozzles and overflow holes. It also includes an elastic element for forcing the movable plate close to the heat sink plate.

8. A double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 7, characterized in that, Under the action of the elastic element, the movable plate adheres to the heat dissipation plate to block the overflow hole; when the pressure in the jet cavity increases, the movable plate overcomes the elastic force of the elastic element and moves upward to expose the overflow hole.

9. A double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 7, characterized in that, The nozzle is provided with an overflow groove, with both ends of the overflow groove located on the outer circumference of the nozzle.

10. A double-layer decoupled jet liquid cooling plate with enhanced heat transfer and secondary flow path according to claim 9, characterized in that, When the movable plate is attached to the heat sink, the inner wall of the through hole seals the bottom of the overflow groove; when the movable plate is away from the heat sink, the bottom of the overflow groove is exposed so as to connect the jet cavity and the temperature equalization cavity through the overflow groove.

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