Power supply and control integrated management cabinet for semiconductor equipment

Abstract

The application discloses a power supply and control integrated management cabinet for semiconductor equipment, which comprises a cabinet frame, a physical isolation component, a thermal management component, a power supply component, a signal control component and a wiring management system; the physical isolation component comprises a metal shielding partition plate horizontally arranged at the upper part of the cabinet frame, the metal shielding partition plate divides the internal space of the cabinet frame into an upper weak current control area and a lower strong current power area along the vertical direction, the metal shielding partition plate is made of a high magnetic permeability material, the edges of the metal shielding partition plate are electrically connected with the cabinet frame through conductive springs, and a damping base is arranged at the bottom of the cabinet frame; the physical isolation component is arranged to block the conduction of high-frequency electromagnetic pulses generated by the strong current area to the weak current area from two aspects of spatial layout and electrical connection, the electromagnetic interference field intensity of the weak current control area is significantly reduced, and the signal-to-noise ratio of the signal processing link is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a power supply and control integrated management cabinet for semiconductor equipment. Background Technology

[0002] Power supply cabinets for semiconductor equipment are widely used in semiconductor manufacturing. Most adopt an integrated frame structure, vertically stacking or staggering magnetically controlled power modules and control circuit units within the cabinet to achieve close integration, reduce signal loss, and optimize floor space. This design initially met basic power output requirements and achieved preliminary system integration. However, due to limitations in its structure and operating principle, it often presents some significant problems. For example, the lack of strict physical separation between high-voltage and low-voltage areas within the cabinet allows electromagnetic pulses generated by high-frequency, high-current switching to easily couple to the control link, leading to command jitter, bus communication failures, and impacting process reproducibility and yield. Simultaneously, the lack of a unified heat dissipation channel prevents the directional guidance of heat, causing heat buildup in power modules and resulting in temperature drift in control components, posing a risk of process failure. Summary of the Invention

[0003] The main objective of this invention is to provide an integrated power and control management cabinet for semiconductor devices to overcome the shortcomings of the prior art.

[0004] To achieve the above-mentioned objectives, the present invention adopts the following technical solution.

[0005] Some embodiments of the present invention provide a power and control integrated management cabinet for semiconductor equipment, including a cabinet frame, physical isolation components, thermal management components, power supply components, signal control components, and a cabling management system; The physical isolation components include a metal shielding partition horizontally disposed in the upper part of the cabinet frame, which divides the internal space of the cabinet frame vertically into an upper low-voltage control area and a lower high-voltage power area. The metal shielding partition is made of a high magnetic permeability material, and the edge of the metal shielding partition is electrically connected to the cabinet frame along its entire circumference through conductive springs, as well as a shock-absorbing base disposed at the bottom of the cabinet frame.

[0006] In one embodiment, the power supply assembly includes several sets of magnetically controlled power modules disposed inside the lower high-power area and precision guide rail assemblies disposed at the bottom of the magnetically controlled power modules. Each set of magnetically controlled power modules is encapsulated in an independent metal shielded box, and the magnetically controlled power modules are slidably connected to the cabinet frame through the precision guide rail assemblies.

[0007] Furthermore, each magnetically controlled power module is equipped with a fan.

[0008] Furthermore, a double-section telescopic guide rail is provided on the outside of the precision guide rail assembly.

[0009] Furthermore, a quick-plug connector assembly is provided on the rear panel of the magnetic power module, which integrates a high-voltage power interface, a low-voltage auxiliary power interface, and a signal acquisition interface.

[0010] Furthermore, the contacts in the quick-plug connector assembly include ground contacts, pre-charge resistor contacts, and active force contacts. During the insertion of the magnetically controlled power module, the ground contacts, pre-charge resistor contacts, and active force contacts are sequentially connected.

[0011] In one embodiment, the thermal management component includes a high-voltage cooling duct and a low-voltage cooling duct. The high-voltage cooling duct is installed in the lower high-voltage power area, with its air inlet located at the front of the cabinet frame and its return air outlet located at the rear of the cabinet frame. The fan inside the magnetically controlled power module adjusts its speed according to the temperature of the power devices inside the module, discharging heat through the exhaust grille at the rear of the module to the return air outlet. The low-voltage cooling duct is installed in the upper low-voltage control area, with a fan unit installed at the top of the cabinet frame. The fan unit creates a negative pressure environment inside the upper low-voltage control area, guiding airflow from the filter on the side of the cabinet frame into and through the circuit area where the signal control component is located. A metal shielding partition isolates the airflow exchange between the high-voltage and low-voltage cooling ducts.

[0012] In one embodiment, the signal control component includes: The industrial control computer, signal processing unit, human-machine interaction unit, and communication bus architecture are installed inside the upper-level low-voltage control area. Axial flow fan unit installed at the top of the body frame; And a centrifugal fan installed inside the magnetically controlled power module; The industrial control computer is equipped with a processor, and the communication bus architecture is set with a first-layer real-time control bus and a second-layer monitoring bus. The real-time control bus is used for data transmission between the industrial control computer and the magnetic control power module, and the monitoring bus is used to transmit the internal temperature and bus voltage parameters of the magnetic control power module. Each magnetic control power module is equipped with a slave controller. The slave controller parses the received control commands and applies them to the power conversion circuit.

[0013] In one embodiment, the magnetically controlled power module integrates a current prediction control algorithm. The algorithm samples the current output current and output voltage at the current moment and, in conjunction with the state-space equation of the power circuit, calculates the duty cycle control quantity for the next moment. The industrial control computer sends a synchronization clock signal to multiple sets of magnetically controlled power modules.

[0014] In one embodiment, the cabling management system includes power cable trays and signal cable trays. The power cable trays extend vertically along the rear of the cabinet frame near the rear interface of the magnetically controlled power module for laying power cables. The signal cable trays extend vertically along the cabinet frame near the signal interface of the magnetically controlled power module. The power cable trays and signal cable trays are spaced apart, and a grounded metal partition is installed inside the trays. The laying paths of the signal cables and power cables within the cabinet frame do not have overlapping areas, and the signal cables use shielded mesh.

[0015] In one embodiment, the industrial control computer has a built-in health status monitoring model. The model collects the running time of the magnetic control power module, the temperature of the heat sink fins, and the rate of change of the equivalent series resistance of the capacitor in real time. By evaluating the degradation trend of each magnetic control power module, when the operating parameters of a certain group of magnetic control power modules deviate from the preset confidence interval, the graphical interface of the human-machine interaction unit pops up a warning message and locates the fault module number.

[0016] In one embodiment, the human-computer interaction unit includes a touch screen display mounted on the outside of the cabinet frame.

[0017] Furthermore, the touch display integrates an electromagnetic sealing gasket.

[0018] Furthermore, the graphical interface integrated within the touchscreen display supports multi-level permission management, displays the output waveform curves of multiple magnetic power modules in real time, and allows users to configure the soft-start slope, maximum output limit, and protection threshold for each power module. The industrial control computer connects to the external network through an internal switch.

[0019] Compared with the prior art, the present invention has at least the following beneficial effects: (1) By setting up physical isolation components, the interior of the cabinet is vertically divided into a weak current control area and a strong current power area. This blocks the transmission of high-frequency electromagnetic pulses generated in the strong current area to the weak current area from both spatial layout and electrical connection perspectives. This reduces the electromagnetic interference field strength in the weak current control area by more than 35 dB, improves the signal-to-noise ratio of the signal processing stage, and meets the requirements for power control accuracy in semiconductor processes.

[0020] (2) By setting up thermal management components, two independent heat dissipation systems with completely decoupled airflow paths are formed, corresponding to the strong electric power area and the weak electric control area respectively. The strong electric area adopts the forced heat dissipation method within the module, and the weak electric area adopts the method of guiding cold airflow from bottom to top through the control circuit area by top negative pressure. This solves the problem of temperature drift of control components caused by hot air recirculation under the traditional unified air duct, and controls the temperature fluctuation range of the working environment of control components within ±2℃, eliminating the output parameter drift caused by temperature drift.

[0021] (3) By setting up power supply components and adopting drawer-type power modules and a quick-plug connection structure with pre-charging logic at the back end, the power modules can support online hot-plugging without cutting off the main input power of the cabinet. This reduces the replacement time of a single module from several hours in the traditional solution to within a few minutes, thereby improving the utilization rate of the semiconductor production line and reducing the economic losses caused by unplanned shutdowns. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of a power supply and control integrated management cabinet for semiconductor equipment according to an embodiment of the present invention; Figure 2 This is a schematic diagram showing the relative positions of a cabinet frame and a high-voltage heat dissipation duct in one embodiment of the present invention. Figure 3 This is a schematic diagram of the internal structure of a cabinet frame according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of a metal shielding partition in one embodiment of the present invention; Figure 5 This is a schematic diagram of the connection between a shock-absorbing base and a cabinet frame in one embodiment of the present invention; Figure 6 This is a schematic diagram of a quick-plug connector assembly according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of a metal shielding box according to one embodiment of the present invention; Figure 8 This is a schematic diagram of the overall structure of a signal control component according to an embodiment of the present invention; Figure 9 This is a schematic diagram of an axial flow fan unit and a low-voltage heat dissipation duct in one embodiment of the present invention; Figure 10 This is a schematic diagram of the arrangement of a metal shielding box in one embodiment of the present invention.

[0023] Explanation of reference numerals in the attached diagram: 1. Cabinet frame; 2. Physical isolation component; 3. Thermal management component; 4. Power supply component; 5. Signal control component; 6. Wiring management system; 7. Metal shielding partition; 8. Upper low-voltage control area; 9. Lower high-voltage power area; 10. Magnetic control power module; 11. Metal shielding enclosure; 12. Precision guide rail assembly; 13. Quick-plug connector assembly; 14. High-voltage power interface; 15. Low-voltage auxiliary power interface; 16. Signal acquisition interface; 17. High-voltage cooling duct; 18. Low-voltage cooling duct; 19. Axial flow fan unit; 20. Industrial computer; 21. Signal processing unit; 22. Human-machine interaction unit; 23. Communication bus architecture; 24. Touch screen display; 25. Power cable routing trough; 26. Signal cable routing trough; 27. Metal partition; 28. Vibration damping base. Detailed Implementation

[0024] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0025] Reference Figures 1-10 This first embodiment of the invention provides a power and control integrated management cabinet for semiconductor equipment, including a cabinet frame 1, a physical isolation component 2, a thermal management component 3, a power supply component 4, a signal control component 5, and a cabling management system 6. The physical isolation component 2 includes a metal shielding partition 7 horizontally fixedly connected to the upper part of the cabinet frame 1. The metal shielding partition 7 vertically divides the internal space of the cabinet frame 1 into an upper low-voltage control area 8 and a lower high-voltage power area 9. The metal shielding partition 7 is made of a high-permeability material, and its edges are electrically connected to the cabinet frame 1 along its entire circumference via conductive springs. A shock-absorbing base 28 is fixedly connected to the bottom of the cabinet frame 1.

[0026] Specifically, the cabinet frame 1 is made of cold-rolled steel plate bent and welded. All inner surfaces of the cabinet frame 1 are covered with a conductive electroplating layer to form the basic electromagnetic shielding boundary. The metal shielding partition 7 is made of permalloy with a magnetic permeability of not less than 200 or silicon steel sheet that has undergone continuous annealing. The conductive spring is a beryllium copper alloy spring. The spacing between the springs is less than 1 / 20 of the wavelength of the preset interference frequency in the cabinet. This is used to block the transmission of high-frequency electromagnetic pulses generated by the lower high-power area 9 to the upper low-power control area 8. The shock-absorbing base 28 is composed of a high-damping alloy spring and a viscous fluid damper. The overall natural frequency of the shock-absorbing base 28 avoids the frequency range of 1-100Hz. This is used to attenuate the mechanical vibration generated by the rotating parts and prevent the vibration from being transmitted to the signal control component 5.

[0027] Reference Figures 1-7 The power supply assembly 4 includes several sets of magnetically controlled power modules 10 fixedly connected inside the lower high-voltage power zone 9. Each set of magnetically controlled power modules 10 is encapsulated in an independent metal shielded box 11. A precision guide rail assembly 12 is fixedly connected to the bottom of the magnetically controlled power module 10. The magnetically controlled power module 10 is slidably connected to the cabinet frame 1 through the precision guide rail assembly 12. A fan is fixedly connected inside each set of magnetically controlled power modules 10. A double-section telescopic guide rail is fixedly connected to the outside of the precision guide rail assembly 12. A quick-plug connector assembly 13 is fixedly connected to the rear panel of the magnetically controlled power module 10. The quick-plug connector assembly 13 integrates a high-voltage power interface 14, a low-voltage auxiliary power interface 15, and a signal acquisition interface 16.

[0028] Specifically, there are six groups of magnetically controlled power modules 10, arranged in parallel along the vertical direction in the lower high-power area 9. Each group of magnetically controlled power modules 10 is encapsulated in a metal shielded box 11 made of aluminum-magnesium alloy, forming a two-stage electromagnetic protection structure for the internal power conversion circuit. The precision guide rail assembly 12 includes a double-section telescopic guide rail with a self-locking function. The surface of the guide rail is coated with dry powder lubricant to support the smooth extraction of the magnetically controlled power modules 10 under rated load. The fan is a centrifugal fan driven by a PWM controller. The high-voltage power interface 14 of the quick-plug connector group 13 uses silver alloy contacts. The rated current carrying capacity of the high-voltage power interface 14 is not less than 100A, and the contact resistance is less than 0.5Ω. The contacts in the quick-plug connector group 13 include the longest PE grounding contact, the medium-length pre-charge resistor contact, and the shortest main power contact, which are used to overlap sequentially during insertion to realize the pre-charge logic.

[0029] Reference Figures 2-6 The contacts in the quick-plug connector group 13 consist of ground contacts, pre-charge resistor contacts, and active force contacts. During the insertion of the magnetic power module 10, the ground contacts, pre-charge resistor contacts, and active force contacts are connected in sequence.

[0030] Specifically, the PE grounding contact is the longest, the pre-charge resistor contact is in the middle, and the main force contact is the shortest. During the insertion of the magnetic power module 10, the grounding contact is connected first to establish a safe ground. Then, the pre-charge resistor contact is connected and current-limited charging is performed on the large-capacity electrolytic capacitor inside the module through the pre-charge resistor. When the capacitor voltage reaches the set ratio of the DC bus voltage (e.g., 95%), the main force contact is connected last, thereby avoiding the arc impact generated at the moment of hot plugging. The pre-charge logic is realized through the above connection sequence, which supports the magnetic power module 10 to be hot plugged in online without cutting off the main input power of the cabinet.

[0031] Reference Figures 1-9 The thermal management component 3 includes a high-voltage heat dissipation duct 17 and a low-voltage heat dissipation duct 18. The high-voltage heat dissipation duct 17 is installed in the lower high-voltage power area 9. The air inlet of the high-voltage heat dissipation duct 17 is located at the front of the cabinet frame 1, and the air outlet of the high-voltage heat dissipation duct 17 is located at the rear of the cabinet frame 1. The fan inside the magnetic power module 10 adjusts its speed according to the temperature of the power devices inside the magnetic power module 10, and discharges heat to the air outlet through the exhaust grille at the rear of the magnetic power module 10. The low-voltage heat dissipation duct 18 is installed in the upper low-voltage control area 8. A fan unit is fixedly connected to the top of the cabinet frame 1. The fan unit creates a negative pressure environment inside the upper low-voltage control area 8, guiding the airflow from the filter screen on the side of the cabinet frame 1 into and through the circuit area where the signal control component 5 is located. The metal shielding partition 7 isolates the airflow exchange between the high-voltage heat dissipation duct 17 and the low-voltage heat dissipation duct 18.

[0032] Specifically, the high-voltage heat dissipation duct 17 and the low-voltage heat dissipation duct 18 are physically isolated from each other and their airflow paths are completely decoupled. The air inlet of the high-voltage heat dissipation duct 17 is located at the lower part of the front of the cabinet frame 1, and the return air outlet is located at the rear of the cabinet frame 1. The centrifugal fan inside the magnetically controlled power module 10 adopts PWM speed control and adjusts the speed according to the real-time temperature of the power device, forcibly exhausting the heat through the exhaust grille at the rear of the module to the return air outlet. In the low-voltage heat dissipation duct 18, the axial flow fan unit 19 maintains a negative pressure difference of five to ten Pa between the upper low-voltage control area 8 and the external environment, guiding the external cold air to enter from the filter screen on the side of the cabinet frame 1 and pass through the circuit area where the signal control component 5 is located from bottom to top. The metal shielding partition 7 also serves as a physical barrier, completely isolating the airflow exchange between the high-voltage heat dissipation duct 17 and the low-voltage heat dissipation duct 18, preventing the hot air generated in the high-voltage area from flowing back to the low-voltage area and causing temperature drift of the components.

[0033] Example 2, refer to Figures 1-10 This is the second embodiment of the present invention, which differs from the first embodiment in that: the signal control component 5 includes an industrial control computer 20, a signal processing unit 21, a human-machine interaction unit 22, and a communication bus architecture 23 installed inside the upper low-voltage control area 8; an axial flow fan unit 19 fixedly connected to the top of the body frame; and a centrifugal fan fixedly connected inside the magnetic control power module 10. The industrial control computer 20 is equipped with a processor. The communication bus architecture 23 is fixedly connected to a first-layer real-time control bus and a second-layer monitoring bus. The real-time control bus is used for data transmission between the industrial control computer 20 and the magnetic control power module 10. The monitoring bus is used to transmit the internal temperature and bus voltage parameters of the magnetic control power module 10. Each magnetic control power module 10 is fixedly connected to a slave controller. The slave controller parses the received control commands and applies them to the power conversion circuit.

[0034] Specifically, the first-layer real-time control bus is a real-time control bus based on the EtherCAT protocol, with a communication cycle of no more than 500 microseconds and a synchronization accuracy at the nanosecond level. The second-layer monitoring bus is a monitoring bus based on the RS485 protocol, running the Modbus-RTU protocol. The industrial computer 20 is equipped with a multi-core parallel processor and runs a real-time Linux operating system. Each magnetic power module 10 integrates a slave controller, which processes EtherCAT protocol frames, parses received control commands, and drives the power conversion circuit. The signal processing unit 21 integrates a differential filter circuit, which includes components... A common-mode inductor wound with a ferrite core (such as a manganese-zinc ferrite core) and a transient suppression diode connected in parallel between the signal line and ground form a protection network to suppress common-mode interference and prevent surge impacts from causing the industrial control computer 20 to reset its logic. The slave controller also has a periodic data verification mechanism embedded inside. The data verification mechanism performs CRC-32 cyclic redundancy check on each frame of control command of the real-time control bus. When the slave controller receives three consecutive incorrect verification results, the slave controller instructs the magnetic power module 10 to enter the safe holding mode, freezes the current power output at the last valid value, and reports the communication abnormality to the industrial control computer 20 through the monitoring bus.

[0035] Reference Figures 5-10 The magnetic power module 10 integrates a current prediction control algorithm. The algorithm samples the current output current and output voltage at the current moment and calculates the duty cycle control quantity at the next moment by combining the state space equation of the power circuit. The industrial control computer 20 sends synchronous clock signals to multiple magnetic power modules 10.

[0036] Specifically, the current predictive control algorithm is implemented based on a digital signal processor, and the calculation formula for the current predictive control algorithm is D(k+1)=1V. dc [LI ref I(k)T s +V out +R I(k)], where V dc Where L is the DC bus voltage, L is the output filter inductance, and T is the DC bus voltage. s For the sampling period, I ref Given a reference current, R is the equivalent impedance of the circuit, and V out Given the current output voltage, the industrial control computer 20 sends an EtherCAT synchronization clock signal to the six magnetically controlled power modules 10 via the real-time control bus to achieve nanosecond-level output synchronization. Through the current prediction control algorithm, the control loop compensates for the phase lag caused by communication delay and calculation delay, so that the response time of the power system to the step load is no more than two milliseconds.

[0037] Reference Figures 8-10 The cabling management system 6 includes a power cable tray 25 and a signal cable tray 26. The power cable tray 25 extends vertically along the rear of the cabinet frame 1 near the rear interface of the magnetic power module 10 and is used to lay power cables. The signal cable tray 26 extends vertically along the cabinet frame 1 near the signal interface of the magnetic power module 10. The power cable tray 25 and the signal cable tray 26 are spaced apart, and a grounded metal partition plate 27 is fixedly connected inside the tray. The laying paths of the signal cable and the power cable within the cabinet frame 1 do not have any overlapping areas, and the signal cable uses a shielded mesh.

[0038] Specifically, the power cable tray 25 and the signal cable tray 26 are respectively located on the left and right sides of the back of the cabinet frame 1. The physical distance between the power cable tray 25 and the signal cable tray 26 is not less than 200 mm. The power cable tray 25 is filled with flame-retardant silicone thermally conductive filler. The thermally conductive filler is used to fix the high-current cable and dissipate Joule heat through thermal conduction with the cabinet frame 1. The signal cable is encapsulated with a braided shielding mesh with a coverage of not less than 95%. The shielding layer is grounded at one end or both ends before entering the control area. Both the power cable tray 25 and the signal cable tray 26 are equipped with grounding metal partition plates 27. The grounding metal partition plates 27 are used to further isolate cables of different voltage levels. Through the cabling management system 6, there are no overlapping areas between the signal cable and the power cable in the entire laying path of the cabinet frame 1.

[0039] Reference Figures 5-8 The industrial control computer 20 has a built-in health status monitoring model. The model collects the running time, heat sink temperature, and change rate of equivalent series resistance of the magnetic power module 10 in real time. By evaluating the degradation trend of each magnetic power module 10, when the operating parameters of a certain group of magnetic power modules 10 deviate from the preset confidence interval, the graphical interface of the human-machine interaction unit 22 pops up a warning message and locates the fault module number.

[0040] Specifically, the health status monitoring model adopts multi-source information fusion technology. The health status monitoring model estimates the remaining life of the electrolytic capacitors inside each magnetic power module 10 in real time through the Arrhenius failure physics model. The parameters collected in real time by the health status monitoring model include the running time of the magnetic power module 10, the temperature of the heat sink fins, the rate of change of the equivalent series resistance of the capacitor, and the bus voltage ripple. When the health status monitoring model predicts that the remaining life is less than 1000 hours or any operating parameter deviates from the preset confidence interval, the graphical interface of the human-machine interaction unit 22 automatically pops up a warning message and accurately locates the faulty module number. At the same time, the industrial control computer 20 receives the output of the health status monitoring model through the monitoring bus and connects to the external plant network through the communication bus architecture 23 to report the health status data to the production execution system.

[0041] Reference Figures 1-8 The human-machine interaction unit 22 includes a touch screen display 24 installed on the outside of the cabinet frame 1. The touch screen display 24 integrates an electromagnetic sealing gasket. The graphical interface integrated inside the touch screen display 24 supports multi-level permission management, displays the output waveform curves of multiple magnetic power modules 10 in real time, and allows users to configure the soft start slope, maximum output limit and protection threshold of each power module. The industrial control computer 20 is connected to the external network through an internal switch.

[0042] Specifically, the touch display screen 24 is an industrial-grade touch screen, which is installed on the front door panel of the cabinet frame 1. An electromagnetic sealing gasket is set at the junction of the touch display screen 24 and the cabinet frame 1 to prevent electromagnetic leakage. The graphical interface supports multi-level permission management for operators, engineers, and administrators. The graphical interface displays the output voltage waveform curves and output current waveform curves of all six groups of magnetic power modules 10 in real time. Users can configure the soft-start slope, maximum output current limit, maximum output voltage limit, and overvoltage and overcurrent protection thresholds for each power module through the graphical interface. The industrial control computer 20 is connected to the external plant network through an internal industrial-grade switch. The industrial control computer 20 supports the SECS / GEM protocol standard to realize remote cluster scheduling and digital management of the cabinet. The rest of the structure is the same as that of the embodiment.

[0043] In summary, the working principle of the cabinet of this invention is as follows: the cabinet is divided into an upper low-voltage control area 8 and a lower high-voltage power area 9 by a metal shielding partition 7, and high-frequency electromagnetic interference is blocked by full-circumference conductive springs and high-permeability materials. Thermal management adopts an independent dual-air duct system. In the high-voltage area, centrifugal fans within the modules force heat dissipation, while in the low-voltage area, a negative pressure is created by the top axial fan unit 19 to guide cold airflow through the control components. The airflow paths are completely decoupled, avoiding heat accumulation that could affect control accuracy. The power supply component 4 consists of six drawer-type magnetically controlled power modules 10, each encapsulated in an independent metal shielded enclosure 11. Sliding and pulling are achieved via precision guide rails. The rear quick-plug connectors utilize contacts with tiered length distribution to implement pre-charging logic, supporting online hot-plugging. The signal control component 5 uses a dual-layer redundant bus of EtherCAT and RS485. The industrial control computer 20 issues a synchronization clock to achieve nanosecond-level multi-module output synchronization and runs a current prediction control algorithm and a health status monitoring model to assess module degradation trends and provide early warnings in real time. The cabling management system 6 separates power cables and signal cables into two separate cable trays, maintaining physical spacing and installing grounded metal separators 27. The cables run without crossing each other, and the signal cables use braided shielding to minimize electromagnetic interference. The overall structure achieves electromagnetic compatibility, independent heat dissipation, and uninterrupted maintenance under high power density.

[0044] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A power supply and control integrated management cabinet for semiconductor equipment, comprising a cabinet frame (1), characterized in that: It also includes physical isolation components (2), thermal management components (3), power supply components (4), signal control components (5), and cabling management system (6); The physical isolation component (2) includes a metal shielding partition (7) arranged horizontally in the upper part of the cabinet frame (1). The metal shielding partition (7) divides the internal space of the cabinet frame (1) into an upper weak current control area (8) and a lower strong current power area (9) in the vertical direction. The metal shielding partition (7) is made of a high magnetic permeability material, and the edge of the metal shielding partition (7) is electrically connected to the cabinet frame (1) along the entire perimeter through conductive springs. It also includes a shock-absorbing base (28) set at the bottom of the cabinet frame (1).

2. The integrated power and control management cabinet for semiconductor equipment according to claim 1, characterized in that: The power supply assembly (4) includes several sets of magnetically controlled power modules (10) set inside the lower high-power area (9) and precision guide rail assemblies (12) set at the bottom of the magnetically controlled power modules (10); each set of magnetically controlled power modules (10) is encapsulated in an independent metal shielded box (11), and the magnetically controlled power modules (10) are slidably connected to the cabinet frame (1) through the precision guide rail assembly (12).

3. The integrated power and control management cabinet for semiconductor equipment according to claim 2, characterized in that: Each magnetic power module (10) is equipped with a fan inside; and / or, the precision guide rail assembly (12) is equipped with a double-section telescopic guide rail on the outside.

4. The integrated power and control management cabinet for semiconductor equipment according to claim 2, characterized in that: A quick-plug connector group (13) is provided on the rear panel of the magnetic power module (10). The quick-plug connector group (13) integrates a high-voltage power interface (14), a low-voltage auxiliary power interface (15), and a signal acquisition interface (16).

5. The integrated power and control management cabinet for semiconductor equipment according to claim 4, characterized in that: The contacts in the quick-plug connector group (13) include ground contacts, pre-charge resistor contacts and active force contacts; during the insertion of the magnetic power module (10), the ground contacts, pre-charge resistor contacts and active force contacts are connected in sequence.

6. The integrated power and control management cabinet for semiconductor equipment according to claim 1, characterized in that: The thermal management component (3) includes a high-voltage heat dissipation duct (17) and a low-voltage heat dissipation duct (18). The high-voltage heat dissipation duct (17) is installed corresponding to the lower high-voltage power area (9). The air inlet of the high-voltage heat dissipation duct (17) is located in front of the cabinet frame (1), and the air outlet of the high-voltage heat dissipation duct (17) is located behind the cabinet frame (1). The fan inside the magnetic power module (10) adjusts its speed according to the temperature of the power devices inside the magnetic power module (10) to dissipate heat through the magnetic power module. The exhaust vent at the rear of block (10) is discharged to the return air vent. The low-voltage heat dissipation duct (18) is installed corresponding to the upper low-voltage control area (8). A fan unit is installed on the top of the cabinet frame (1). The fan unit forms a negative pressure environment inside the upper low-voltage control area (8), guiding the airflow from the filter screen on the side of the cabinet frame (1) into and through the circuit area where the signal control component (5) is located. The metal shielding partition (7) isolates the airflow exchange between the high-voltage heat dissipation duct (17) and the low-voltage heat dissipation duct (18).

7. The integrated power and control management cabinet for semiconductor equipment according to claim 1, characterized in that, The signal control component (5) includes: The industrial control computer (20), signal processing unit (21), human-machine interaction unit (22) and communication bus architecture (23) are installed inside the upper low-voltage control area (8). Axial flow fan unit (19) is installed on the top of the body frame. And a centrifugal fan installed inside the magnetically controlled power module (10); The industrial computer (20) is equipped with a processor, and the communication bus architecture (23) is provided with a first-layer real-time control bus and a second-layer monitoring bus. The real-time control bus is used for data transmission between the industrial computer (20) and the magnetic power module (10). The monitoring bus is used to transmit the internal temperature and bus voltage parameters of the magnetic power module (10). Each magnetic power module (10) is equipped with a slave controller. The slave controller is used to parse the received control commands and apply them to the power conversion circuit.

8. The integrated power and control management cabinet for semiconductor equipment according to claim 7, characterized in that: The human-computer interaction unit (22) includes a touch screen (24) installed on the outside of the cabinet frame (1); the industrial control computer (20) is connected to the external network through an internal switch.

9. The integrated power and control management cabinet for semiconductor equipment according to claim 8, characterized in that: The touch display (24) integrates an electromagnetic sealing gasket.

10. The integrated power and control management cabinet for semiconductor equipment according to claim 1, characterized in that: The wiring management system (6) includes a power cable routing trough (25) and a signal cable routing trough (26). The power cable routing trough (25) extends vertically along the rear of the cabinet frame (1) near the rear interface of the magnetic power module (10) and is used to lay power cables. The signal cable routing trough (26) extends vertically along the cabinet frame (1) near the signal interface of the magnetic power module (10). The power cable routing trough (25) and the signal cable routing trough (26) are spaced apart, and a grounded metal partition plate (27) is installed inside the routing trough. The laying paths of the signal cable and the power cable in the cabinet frame (1) do not have overlapping areas, and the signal cable uses a shielded mesh.

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