Body-robotic domain controller liquid-cooled microsystem

Abstract

The present application relates to the field of robot heat dissipation technology, in particular to a body robot domain controller liquid cooling microsystem, which comprises a stacked upper heat dissipation module, a PCB board and a lower heat dissipation module, the upper heat dissipation module and the lower heat dissipation module comprise a liquid cooling plate, heat dissipation fins and a fan; the liquid cooling plate is internally provided with a circulating flow channel; the liquid cooling plate is provided with an embedded micro-pump for driving fluorinated liquid circulation; the fluorinated liquid is driven by the micro-pump to absorb heat and change into a gaseous state when flowing through the area of the heat source on the PCB board in the liquid cooling plate; the gaseous fluorinated liquid releases heat and changes into a liquid state in the heat dissipation fin area, and the heat is transferred to the heat dissipation fins through the wall surface of the liquid cooling plate and is forced to dissipate by the fan; the upper heat dissipation module, the PCB board and the lower heat dissipation module are integrated into a sandwich integrated structure in a stacked manner, so that the heat dissipation system and the controller are deeply integrated. The integrated design can adapt to the installation constraints of the narrow space inside the body robot while ensuring the minimization and light weight of the overall size.

Description

Technical Field

[0001] This invention belongs to the field of robot heat dissipation, specifically relating to a liquid-cooled microsystem for a domain controller of an embodied robot. Background Technology

[0002] With the rapid development of embodied robot technology, the domain controllers they carry need to process massive amounts of multimodal perception data and complex motion control algorithms. This leads to a surge in power consumption and heat generation in the core chips (such as CPU, GPU, NPU, etc.) within the domain controller, resulting in a significant "hot spot" effect. Traditional air cooling methods are no longer sufficient to meet the heat dissipation requirements of high heat flux density and compact space, and also suffer from problems such as high noise and uneven heat dissipation. Conventional liquid cooling systems are usually bulky and have complex piping, and the use of water or alcohol-based coolants poses safety hazards such as leakage, conductivity, corrosion, and flammability, making them unsuitable for the extremely demanding internal environment of robots with stringent requirements for safety, reliability, and space. Therefore, it is necessary to design a liquid-cooled microsystem for embodied robot domain controllers to solve the above problems. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a liquid-cooled microsystem for embodied robot domain controllers, thereby resolving the issue raised in the background art that existing liquid-cooled systems for embodied robot domain controllers on the market are unsuitable for the internal environments of robots with extremely stringent requirements for safety, reliability, and space.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows: The liquid-cooled microsystem for the embodied robot domain controller includes: An upper heat dissipation module and a lower heat dissipation module are provided, with a PCB board between the upper heat dissipation module and the lower heat dissipation module; The upper and lower heat dissipation modules each independently include a liquid cooling plate, heat dissipation fins on the liquid cooling plate, and a fan; The liquid cooling plate of the upper heat dissipation module is attached to the upper surface of the PCB board, and the liquid cooling plate of the lower heat dissipation module is attached to the lower surface of the PCB board. The liquid cooling plate has a circulation channel inside for the flow of fluorinated liquid; An embedded micropump is installed on the liquid cooling plate to drive the circulation of the fluorinated liquid; Driven by a micro-pump, the fluorinated liquid absorbs heat and changes phase to gas when it flows through the heat source area on the PCB board within the liquid cooling plate. The gaseous fluorinated liquid releases heat and changes phase to liquid in the heat dissipation fin area. The heat is transferred to the heat dissipation fins through the wall of the liquid cooling plate and is forcibly dissipated by the fan. The fluorinated liquid forms a pump-driven two-phase self-circulating loop.

[0005] As a further improvement to the present invention, the liquid cooling plate includes a substrate and a cover plate brazed to the substrate. A circulation channel is formed on the substrate, and the output end of the micro pump is embedded in the circulation channel to form a fully enclosed self-circulating loop with the circulation channel.

[0006] As a further improvement to the present invention, several turbulence fins are brazed and connected inside the circulation channel, and the turbulence fins cover multiple high heat flux density areas on the PCB board.

[0007] As a further improvement to the present invention, the interior of the liquid cooling plate is in a vacuum state before being filled with fluorinated liquid.

[0008] As a further improvement to the present invention, the heat dissipation fins are covered with turbulence fins in the vertical direction.

[0009] As a further improvement to the present invention, the fan is a centrifugal fan, and its airflow direction is consistent with the extension direction of the heat dissipation fins.

[0010] As a further improvement to the present invention, the liquid cooling plate is preformed by cold forging and then precision machined by CNC.

[0011] As a further improvement to the present invention, a protective cover is provided on the top of the heat dissipation fins and the fan. The protective cover is fixedly connected to the liquid cooling plate. The protective cover is provided with a vent for the fan to intake air.

[0012] As a further improvement to the present invention, an air outlet is provided on the side of the protective cover away from the fan.

[0013] As a further improvement to the present invention, the fluorinated liquid is at least one of PFPE, HFE, perfluoroolefin or perfluoroamine.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention integrates the upper heat dissipation module, PCB board and lower heat dissipation module into a sandwich structure by stacking them, so that the heat dissipation system and controller are deeply integrated. This integrated design can adapt to the installation constraints of the narrow space inside the robot while ensuring the overall size is minimized and lightweight. This invention employs a pump-driven two-phase fluorinated liquid circulation cooling mechanism, which significantly improves heat transfer efficiency by utilizing the latent heat of phase change of the fluorinated liquid. The liquid cooling plate is equipped with precision flow channels, which, combined with pump-driven forced circulation, can fully cover multiple high heat flux density areas on the PCB board, effectively eliminating local hot spots and providing excellent heat dissipation performance. This invention integrates the heat dissipation system and controller into a single component through modular design; during installation, only the module needs to be fixed and the power supply connected, which significantly simplifies the robot's production, assembly, and subsequent maintenance process. The liquid cooling plate of this invention is pre-formed using a cold forging process and then precision-machined using CNC machining. The cold forging step initially determines the required shape, and only subsequent CNC precision machining of the details is required to meet the accuracy requirements, thereby significantly reducing processing time and material costs. This invention selects a fluorinated liquid with high resistivity, non-flammability and strong chemical inertness as the cooling medium; in actual use, even if a slight leak occurs under extreme conditions, it will not cause short circuits in PCBs and components, fire, or pollution and corrosion to equipment. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural diagram of the upper heat dissipation module of the present invention; Figure 3 This is a schematic diagram of the three-dimensional structure of the substrate of the present invention.

[0017] The names represented by the part numbers in the three schematic diagrams above are as follows: 1. PCB board; 2. Install the heat dissipation module; 3. Lower heat dissipation module; 4. Liquid cooling plate; 41. Substrate; 42. Cover plate; 43. Circulation channel; 44. Turbulence fins; 5. Heat dissipation fins; 6. Fan; 7. Micro-pump; 8. Protective cover; 81. Ventilation opening; 82. Air outlet. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0019] The present invention provides the following embodiments: The liquid-cooled microsystem for the embodied robot domain controller includes: The upper heat dissipation module 2 and the lower heat dissipation module 3 are provided with a PCB board 1 between them; the liquid cooling plate 4 of the upper heat dissipation module 2 is attached to the upper surface of the PCB board 1, and the liquid cooling plate 4 of the lower heat dissipation module 3 is attached to the lower surface of the PCB board 1. This invention integrates the upper heat dissipation module 2, PCB board 1 and lower heat dissipation module 3 into a sandwich structure by stacking them, so that the heat dissipation system and the controller are deeply integrated. This integrated design can adapt to the installation constraints of the narrow space inside the robot while ensuring the overall size is minimized and lightweight. The upper heat dissipation module 2 and the lower heat dissipation module 3 each independently include a liquid cooling plate 4, heat dissipation fins 5 and a fan 6 disposed on the liquid cooling plate 4; the fan 6 is a centrifugal fan 6, and its airflow direction is consistent with the extension direction of the fins of the heat dissipation fins 5 in order to optimize heat dissipation efficiency. The liquid cooling plate 4 includes a substrate 41 and a cover plate 42 brazed to the substrate 41. A circulation channel 43 is provided on the substrate 41. The output end of the micro pump 7 is embedded in the circulation channel 43 and forms a fully enclosed self-circulating loop with the circulation channel 43. The liquid cooling plate 4 is provided with an embedded micro pump 7 that drives the fluorinated liquid to circulate. Several turbulence fins 44 are brazed inside the circulation channel 43, and the turbulence fins 44 cover multiple high heat flux density areas on the PCB board 1; the heat dissipation fins 5 cover the turbulence fins 44 in the vertical direction.

[0020] Driven by the micro-pump 7, the fluorinated liquid absorbs heat and changes phase to gas when it flows through the heat source area on the PCB board 1 in the liquid cooling plate 4. The gaseous fluorinated liquid releases heat and changes phase to liquid in the area of ​​the heat dissipation fins 5. The heat is transferred to the heat dissipation fins 5 through the wall of the liquid cooling plate 4 and is forcibly dissipated by the fan 6. The fluorinated liquid forms a pump-driven two-phase self-circulating loop, which does not require an external gas-liquid separation device. The liquid cooling plate 4 is preformed by cold forging and then precision machined by CNC. Specifically, the aluminum alloy or copper alloy billet is first forged by cold forging to form the preliminary shape of the substrate 41 and the outline of the circulation channel 43. Then, the circulation channel 43, the micro pump 7 mounting position and the sealing surface of the cover plate 42 are precisely machined by CNC. Finally, the cover plate 4242 is brazed and sealed to the substrate 4141. The top of the heat dissipation fins 5 and the fan 6 is covered with a protective cover 8, which is fixedly connected to the liquid cooling plate 4. The protective cover 8 is provided with a vent 81 for the fan 6 to take in air; the protective cover 8 is provided with an air outlet 82 on the side away from the fan 6 for hot air to be discharged. The fluorinated liquid is at least one of PFPE, HFE, perfluoroolefin or perfluoroamine. Preferably, the fluorinated liquid has a volume resistivity ≥1×10¹² Ω·cm at 25°C, no flash point, and a corrosion rate of ≤0.01mm / year on copper and aluminum at 100°C. The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A liquid-cooled microsystem for a domain controller of an embodied robot, characterized in that, include: An upper heat dissipation module (2) and a lower heat dissipation module (3) are provided, and a PCB board (1) is provided between the upper heat dissipation module (2) and the lower heat dissipation module (3); The upper heat dissipation module (2) and the lower heat dissipation module (3) each independently include a liquid cooling plate (4) and heat dissipation fins (5) and a fan (6) provided on the liquid cooling plate (4); The liquid cooling plate (4) of the upper heat dissipation module (2) is attached to the upper surface of the PCB board (1), and the liquid cooling plate (4) of the lower heat dissipation module (3) is attached to the lower surface of the PCB board (1). The liquid cooling plate (4) is provided with a circulation channel (43) for the flow of fluorinated liquid; An embedded micropump (7) is provided on the liquid cooling plate (4) to drive the fluorinated liquid to circulate; Driven by the micro pump (7), the fluorinated liquid absorbs heat and changes phase to gas when it flows through the heat source area on the PCB board (1) in the liquid cooling plate (4); the gaseous fluorinated liquid releases heat in the area of ​​the heat dissipation fins (5) and changes phase to liquid. The heat is transferred to the heat dissipation fins (5) through the wall of the liquid cooling plate (4) and is forcibly dissipated by the fan (6); the fluorinated liquid forms a pump-driven two-phase self-circulating loop.

2. The liquid-cooled microsystem for the domain controller of the embodied robot according to claim 1, characterized in that: The liquid cooling plate (4) includes a substrate (41) and a cover plate (42) brazed to the substrate (41). A circulation channel (43) is provided on the substrate (41). The output end of the micro pump (7) is embedded in the circulation channel (43) and forms a fully enclosed self-circulating loop with the circulation channel (43).

3. The liquid-cooled microsystem for the domain controller of the embodied robot according to claim 2, characterized in that: Several turbulence fins (44) are brazed inside the circulation channel (43), and the turbulence fins (44) cover multiple high heat flux density areas on the PCB board (1).

4. The liquid-cooled microsystem for the embodied robot domain controller according to claim 3, characterized in that: The interior of the liquid cooling plate (4) is in a vacuum state before being filled with fluorinated liquid.

5. The liquid-cooled microsystem for the domain controller of the embodied robot according to claim 4, characterized in that: The heat dissipation fins (5) cover the turbulence fins (44) in the vertical direction.

6. The liquid-cooled microsystem for the domain controller of the embodied robot according to claim 5, characterized in that: The fan (6) is a centrifugal fan (6), and its airflow direction is consistent with the extension direction of the heat dissipation fins (5).

7. The liquid-cooled microsystem for the domain controller of the embodied robot according to claim 6, characterized in that: The liquid cooling plate (4) is preformed by cold forging and then precision machined by CNC.

8. The liquid-cooled microsystem for the domain controller of the embodied robot according to claim 7, characterized in that: The top of the heat dissipation fins (5) and the fan (6) is covered with a protective cover (8), which is fixedly connected to the liquid cooling plate (4). The protective cover (8) is provided with a vent (81) for the fan (6) to take in air.

9. The liquid-cooled microsystem for a unibody robot domain controller according to claim 8, characterized in that: An air outlet (82) is provided on the side of the protective cover (8) away from the fan (6).

10. The liquid-cooled microsystem for the domain controller of the embodied robot according to claim 9, characterized in that: The fluorinated liquid is at least one of PFPE, HFE, perfluoroolefin or perfluoroamine.

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