Motorcycle controller assembly

Abstract

The application relates to a motorcycle controller assembly, which comprises an aluminum substrate assembly, a control plate assembly and a bottom shell, the aluminum substrate assembly comprises an aluminum substrate, a power device and a connecting terminal, the aluminum substrate comprises oppositely arranged heat dissipation surfaces and wiring surfaces, the power device and the connecting terminal are attached to the wiring surfaces, the control plate assembly is welded to the aluminum substrate assembly through the connecting terminal to form a double-layer plate assembly, the double-layer plate assembly is fixedly installed on the bottom shell, the heat dissipation surfaces are arranged towards the outside of the bottom shell, the aluminum substrate covers the opening of the bottom shell and is fixedly connected with the bottom shell to form an integrated shell, and the shell is filled with potting material. The controller assembly has a simple heat dissipation path, avoids heat accumulation in the shell, directly reduces the thermal resistance of the heating part and improves the heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to controller technology, specifically to a motorcycle controller component. Background Technology

[0002] Currently, motorcycle controller manufacturers typically employ the following heat dissipation method: mounting the heat-generating power devices onto a small aluminum substrate, and using thermally conductive adhesive, an aluminum housing, and other components to conduct and dissipate the heat generated by the power devices, thereby ensuring the controller operates within its normal operating temperature range. However, in practical applications, this structure suffers from problems such as a large number of components, complex assembly processes, and long heat conduction paths, limiting further improvements in heat dissipation efficiency and the compactness of the overall structure. Summary of the Invention

[0003] To overcome the above-mentioned defects, this application provides a motorcycle controller assembly. The heat dissipation path of this controller assembly is simple, avoiding heat accumulation in the housing, directly reducing the thermal resistance of the heat-generating parts, and improving heat dissipation efficiency.

[0004] The technical solution adopted by this application to solve its technical problem is:

[0005] A motorcycle controller assembly includes an aluminum substrate assembly, a control board assembly, and a bottom shell. The aluminum substrate assembly includes an aluminum substrate, power devices, and connection terminals. The aluminum substrate includes a heat dissipation surface and a wiring surface disposed opposite to each other. The power devices and the connection terminals are mounted on the wiring surface. The control board assembly is soldered to the aluminum substrate assembly via the connection terminals to form a double-layer board assembly. The double-layer board assembly is fixedly installed on the bottom shell, with the heat dissipation surface facing the outside of the bottom shell. The aluminum substrate covers the opening of the bottom shell and is fixedly connected to the bottom shell to form an integral outer shell. The outer shell is filled with potting compound.

[0006] Optionally, the aluminum substrate assembly further includes a first connector, which is attached to the wiring surface of the aluminum substrate. The first connector is provided with a rib, the upper surface of which is flush with the heat dissipation surface of the aluminum substrate.

[0007] Optionally, the first connector is provided with a plurality of parallel ribs, which are arranged along the width direction of the first connector.

[0008] Optionally, the height of the rib is equal to or less than the thickness of the aluminum substrate.

[0009] Optionally, the control board assembly includes a control board and a second connector and components fixedly connected to the control board. The control board is soldered to the aluminum substrate through the connection terminal, and the control board is an epoxy board.

[0010] Optionally, the bottom shell is a plastic bottom shell, which includes a bottom plate and a side plate fixedly connected to the bottom plate. The bottom plate and the side plate form an accommodating cavity for accommodating the double-layer plate assembly. A slot is formed on the top of the side plate, and the slot is used to apply sealant.

[0011] Optionally, the top surface of the side plate extends upward to form a first step and a second step, the first step being higher than the second step, the slot being located between the first step and the second step, and the bottom of the slot being lower than the top surface of the second step.

[0012] Optionally, the aluminum substrate is placed on the second step of the side plate, and the aluminum substrate and the first step are sealed by the sealant in the slot.

[0013] The beneficial effects of this application are as follows: The heat-generating power device is placed on an aluminum substrate with high heat dissipation performance, and the heat dissipation surface of the aluminum substrate is located on the outer side of the bottom shell. Therefore, the heat dissipation path is simple, avoiding heat accumulation inside the shell, directly reducing the thermal resistance of the heat-generating part, and improving heat dissipation efficiency. The heat dissipation surface of the aluminum substrate is in direct contact with the air / external heat sink, making full use of the high thermal conductivity of aluminum to ensure that the power device operates stably within a safe temperature range for a long time. The aluminum substrate simultaneously serves as a "circuit carrier," "heat dissipation channel," and "cover plate," eliminating the need for additional built-in thermal pads, heat dissipation fins, or other components, as well as additional cover plates. While improving heat dissipation performance, it effectively controls the shell size and assembly complexity, reduces the number of parts, and lowers costs. Furthermore, the use of a double-layer board assembly further enables product miniaturization, significantly reducing the product's size and weight, thus meeting the trend of thinner and lighter electronic products. Attached Figure Description

[0014] Figure 1 This is an exploded view of the controller component in this application;

[0015] Figure 2 This is an assembly diagram of the controller components in this application;

[0016] Figure 3 This is a top view of the controller component in this application;

[0017] Figure 4 This is a bottom view of the controller component in this application;

[0018] Figure 5 This is a simplified internal diagram of the controller component in this application;

[0019] Figure 6 This is a perspective view of the aluminum substrate assembly in this application;

[0020] Figure 7This is a top view of the aluminum substrate assembly in this application;

[0021] Figure 8 This is a bottom view of the aluminum substrate assembly in this application;

[0022] Figure 9 This is a perspective view of the double-layer panel assembly in this application;

[0023] Figure 10 This is a top view of the control panel assembly in this application;

[0024] Figure 11 This is a bottom view of the control panel assembly in this application;

[0025] Figure 12 This is a schematic diagram of the bottom shell structure in this application;

[0026] Figure 13 for Figure 12 Enlarged view of point A in the middle;

[0027] Figure 14 This is a top view of the bottom shell in this application;

[0028] Figure 15 A simplified internal diagram of the first type of controller component in the prior art;

[0029] Figure 16 A simplified internal diagram of the second type of controller component in the prior art;

[0030] In the diagram: 100-Aluminum substrate assembly, 110-Aluminum substrate, 111-Heat dissipation surface, 112-Wiring surface, 120-First connector, 121-Firming strip, 130-Power device, 140-Power module, 150-Connection terminal, 200-Control board assembly, 210-Control board, 220-Second connector, 230-Components, 300-Bottom shell, 310-Bottom plate, 320-Side plate, 321-First step, 322-Second step, 323-Slot, 330-Potent, 331-Potent opening, 400-Outer shell. Detailed Implementation

[0031] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the embodiments of this application. Obviously, the embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0032] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such uses of the terms can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0033] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0034] Example: Figure 1-14As shown, a motorcycle controller assembly includes an aluminum substrate assembly 100, a control board assembly 200, and a bottom shell 300. The aluminum substrate assembly 100 includes an aluminum substrate 110, a power device 130, and a connection terminal 150. The aluminum substrate assembly 100 also includes a power module 140, such as a large electrolytic capacitor for filtering. The aluminum substrate 110 includes a heat dissipation surface 111 and a wiring surface 112 disposed opposite to each other. The power device 130 and the connection terminal 150 are mounted on the wiring surface 112. The control board assembly 200 is soldered to the aluminum substrate assembly 100 through the connection terminal 150 to form a double-layer board assembly. The double-layer board assembly is fixedly installed on the bottom shell 300, and the heat dissipation surface 111 is arranged facing the outside of the bottom shell 300. The aluminum substrate 110 covers the opening of the bottom shell 300 and is fixedly connected to the bottom shell 300 to form an integral outer shell 400. The outer shell 400 is filled with potting compound 330. The aluminum substrate 110 has a single-layer structure, with one side being a heat dissipation surface 111, in contact with the outside environment to quickly dissipate heat; the other side is a wiring surface 112 located inside the product. The power device 130, power module 140, connection terminal 150, and control board assembly 200 are all located inside the bottom shell 300 and are encapsulated and fixed by potting compound 330. Figure 5 As shown, after the potting compound 330 is cured, it forms a dense barrier that can isolate external contaminants and protect the controller components. Furthermore, by curing the controller components together with the potting compound 330, vibration and impact are buffered, preventing situations such as solder joint detachment, pin breakage, or component collision and short circuit.

[0035] In the prior art, controller components such as Figure 15 and Figure 16 As shown, Figure 15 The heat dissipation path of the controller component is: power device → aluminum substrate → thermally conductive material → aluminum casing → outside; Figure 16 The heat dissipation path of the controller component is: power device → insulating heat-conducting plate → aluminum casing → outside. Therefore, the heat dissipation path of the traditional controller component is long and the heat dissipation efficiency is low.

[0036] In this application, the heat-generating power device 130 and power module 140 are both placed on an aluminum substrate 110 with high heat dissipation performance, and the heat dissipation surface 111 of the aluminum substrate 110 is located on the outside of the bottom shell 300, that is, the heat dissipation surface 111 of the aluminum substrate 110 is exposed outside the bottom shell 300. Figure 5As shown, when the product generates heat during operation, its heat dissipation path is: power device → aluminum substrate → outside, where the outside consists of air, a heat sink, etc., making it a direct-flow heat dissipation path. Compared to traditional heat dissipation paths, this controller component has a simpler path, avoiding heat accumulation inside the casing, directly reducing the thermal resistance of the heat-generating parts, and improving heat dissipation efficiency. The aluminum substrate's heat dissipation surface directly contacts the air / external heat sink, fully utilizing the high thermal conductivity of aluminum to ensure that the power device operates stably within a safe temperature range for a long time. The aluminum substrate simultaneously serves as a "circuit carrier," "heat dissipation channel," and "cover plate," eliminating the need for additional built-in thermal pads, heat dissipation fins, or other components, as well as additional cover plates. This improves heat dissipation performance while effectively controlling the casing size and assembly complexity, reducing the number of parts, and lowering costs. Furthermore, the use of a double-layer board assembly further enables product miniaturization, significantly reducing the product's size and weight, thus meeting the trend of thinner and lighter electronic products.

[0037] like Figure 6-9 As shown, the aluminum substrate assembly 100 further includes a first connector 120, which is mounted on the wiring surface 112 of the aluminum substrate 110. A rib 121 is fixedly provided on the first connector 120, and the upper surface of the rib 121 is flush with the heat dissipation surface 111 of the aluminum substrate 110. The first connector 120 is made of high-temperature resistant material and integrates the power plug and phase wire plug into one unit, mounted on the aluminum substrate 110 in an SMT surface mount form. The rib 121 is provided on the housing of the first connector 120. The function of the rib 121 is to ensure that the soldering surface of the terminal pins of the first connector is parallel to the aluminum substrate pads during production, ensuring reliable soldering of the solder joints and further improving production efficiency and product qualification rate.

[0038] like Figure 6 As shown, the rib 121 will not protrude from the substrate 110 and will not affect the overall structure of the controller assembly.

[0039] The shape and arrangement of the ribs 121 are not limited, as long as the welding surface of the connector terminal is parallel to the aluminum substrate pad, and the solder joint quality is ensured. Optionally, the shape of the ribs 121 can be any shape, such as strip, cylinder, or square. In one specific embodiment, the first connector 120 is provided with multiple parallel ribs 121, which are arranged along the width direction of the first connector 120. Figure 6 As shown, the first connector 120 is provided with four parallel ribs 121. The ribs are strip-shaped and extend along the width direction of the first connector 120. During assembly, all four ribs 121 are close to the side wall of the aluminum substrate 110, thereby ensuring that the first connector 120 is in the correct position and will not tilt.

[0040] Optionally, the height of the rib 121 is equal to or less than the thickness of the aluminum substrate 110. During assembly, the upper surface of the housing of the first connector 120 is attached to the wiring surface 112 of the aluminum substrate 110, and the rib 121 is located on the upper surface of the housing. The height of the rib 121 is designed to be less than or equal to the thickness of the aluminum substrate 110 to ensure that the rib 121 does not protrude from the aluminum substrate 110.

[0041] like Figure 10-11 As shown, the control board assembly 200 includes a control board 210 and a second connector 220 and components 230 fixedly connected to the control board 210. The control board 210 is soldered to the aluminum substrate 110 via the connection terminal 150. The control board 210 is an epoxy board. Both sides of the control board 210 are used as linear layout surfaces for signal transmission processing of the control product. The second connector 220 is assembled onto the control board 210 in a surface mount or through-hole form, and after soldering, the control board assembly 200 is formed.

[0042] The base shell 300 can be made of metals such as aluminum, iron, and copper, or plastic. Optionally, the base shell 300 is made of plastic. Since the base shell component only serves as a sealing element, plastic is used, resulting in a weight reduction of more than 20%, achieving product lightweighting and miniaturization. When the base shell 300 is made of metal, the edge of the aluminum substrate 300 is thermally connected to the base shell via thermally conductive adhesive or welding, which further improves the product's heat dissipation performance. Figure 12-14 As shown, the bottom shell 300 includes a bottom plate 310 and a side plate 320 fixedly connected to the bottom plate 310. The bottom plate 310 and the side plate 320 form a receiving cavity for accommodating the double-layer plate assembly. A slot 323 is formed on the top of the side plate 320, and the slot 323 is used to apply sealant. Optionally, the bottom shell 300 is a one-piece molded part. The side plate 320 is arranged along three circumferential sides of the bottom plate 310, that is, the bottom shell 300 has a structure with an open top and an open side. The top shape of the side panel 320 matches the shape of the aluminum substrate 110. During assembly, the double-layer board assembly is mounted on the bottom shell 300, and the aluminum substrate 110 is placed on top of the side panel 320. The heat dissipation surface 111 of the aluminum substrate 110 faces outward, and the wiring surface 112 of the aluminum substrate 110 faces inward. The power devices, power modules, and control board 210 mounted on the wiring surface 112 are located inside the accommodating cavity. The first connector 120 and the second connector 220 have openings on one side of the bottom shell 300 and extend out of the bottom shell 300. A slot 323 is formed on the top of the side panel 320. During assembly, sealant is applied to the slot 323 to seal the bottom shell 300 and the aluminum substrate 110.

[0043] like Figure 13As shown, the top surface of the side plate 320 extends upward to form a first step 321 and a second step 322. The first step 321 is higher than the second step 322. The slot 323 is located between the first step 321 and the second step 322. The bottom of the slot 323 is lower than the top surface of the second step 322.

[0044] During assembly, the aluminum substrate 110 is placed on the second step 322 of the side plate 320, and the aluminum substrate 110 and the first step 321 are sealed together by the sealant in the slot 323. That is, the aluminum substrate 110 and the bottom shell 300 are sealed together by the sealant to form an integral shell 400, and the potting compound is injected into the shell 400 to ensure that the potting compound will not seep out.

[0045] This controller assembly places the heat-generating power device 130 and power module 140 on the aluminum substrate 110. The heat generated by the components is directly conducted to the outside through the heat dissipation surface 111 of the aluminum substrate 110, which directly reduces the thermal resistance of the heat-generating parts and improves the heat dissipation efficiency. Since the bottom shell is made of plastic, the product is lighter and smaller. The technical solutions adopted in this application, such as adding ribs 121 to the first connector 120, using surface mount technology in the aluminum substrate assembly 100, and embedding the double-layer board assembly with the bottom shell 300, achieve the effects of pre-welding positioning, reducing process flow, reducing costs, and improving production efficiency.

[0046] In summary, this controller assembly, through the optimized cooperation of the aluminum substrate assembly 100, the control board assembly 200, and the base shell 300, improves production efficiency while achieving cost reduction, weight reduction, and miniaturization, significantly enhancing product competitiveness.

[0047] The assembly process of this controller component includes the following steps:

[0048] Step 1: As Figure 8 As shown, power devices 130, power modules 140, first connectors 120 and connection terminals 150 are mounted on the wiring surface 112 of aluminum substrate 110 to form aluminum substrate assembly 100.

[0049] Step 2: As Figure 10-11 As shown, multiple components 230, such as an MCU and a second connector 220, are soldered onto the control board 210 to form a control board assembly 200.

[0050] Step 3: The aluminum substrate assembly 100 and the control board assembly 200 are welded together through the connection terminal 150 to form a double-layer board assembly;

[0051] Step 4: Apply sealant to the slot 323 of the bottom shell 300, and then assemble, seal, and fix the double-layer plate assembly after inserting it into the shell.

[0052] Step 5: As Figure 2 As shown, potting compound 330, such as epoxy or polyurethane, is poured into the bottom shell 300 through the potting port 331 between the first connector 120 and the second connector 220, and after curing, it finally forms a motorcycle controller assembly.

[0053] It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application shall be determined by the appended claims.

Claims

1. A motorcycle controller assembly, characterized in that: The system includes an aluminum substrate assembly (100), a control board assembly (200), and a base shell (300). The aluminum substrate assembly (100) includes an aluminum substrate (110), power devices (130), and connection terminals (150). The aluminum substrate (110) includes a heat dissipation surface (111) and a wiring surface (112) disposed opposite to each other. The power devices (130) and the connection terminals (150) are mounted on the wiring surface (112). The control board assembly (200) is connected via... The connecting terminal (150) is soldered to the aluminum substrate assembly (100) to form a double-layer plate assembly. The double-layer plate assembly is fixedly installed on the bottom shell (300), and the heat dissipation surface (111) is arranged facing the outside of the bottom shell (300). The aluminum substrate (110) covers the opening of the bottom shell (300) and is fixedly connected to the bottom shell (300) to form an integral outer shell (400). The outer shell (400) is filled with potting compound (330).

2. The motorcycle controller assembly according to claim 1, characterized in that: The aluminum substrate assembly (100) further includes a first connector (120), which is attached to the wiring surface (112) of the aluminum substrate (110). A rib (121) is fixedly provided on the first connector (120), and the upper surface of the rib (121) is flush with the heat dissipation surface (111) of the aluminum substrate (110).

3. The motorcycle controller assembly according to claim 2, characterized in that: The first connector (120) is provided with a plurality of parallel ribs (121), which are arranged along the width direction of the first connector (120).

4. The motorcycle controller assembly according to claim 2, characterized in that: The height of the rib (121) is equal to or less than the thickness of the aluminum substrate (110).

5. The motorcycle controller assembly according to claim 1, characterized in that: The control board assembly (200) includes a control board (210) and a second connector (220) and components (230) fixedly connected to the control board (210). The control board (210) is welded to the aluminum substrate (110) through the connection terminal (150). The control board (210) is an epoxy board.

6. The motorcycle controller assembly according to claim 1, characterized in that: The bottom shell (300) is a plastic bottom shell. The bottom shell (300) includes a bottom plate (310) and a side plate (320) fixedly connected to the bottom plate (310). The bottom plate (310) and the side plate (320) form a receiving cavity for accommodating the double-layer plate assembly. A slot (323) is opened on the top of the side plate (320), and the slot (323) is used to apply sealant.

7. The motorcycle controller assembly according to claim 6, characterized in that: The top surface of the side plate (320) extends upward to form a first step (321) and a second step (322), the first step (321) being higher than the second step (322), the slot (323) being located between the first step (321) and the second step (322), and the bottom of the slot (323) being lower than the top surface of the second step (322).

8. The motorcycle controller assembly according to claim 7, characterized in that: The aluminum substrate (110) is placed on the second step (322) of the side plate (320), and the aluminum substrate (110) and the first step (321) are sealed by the sealant in the slot (323).

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