A heat dissipation device of a sound box and the sound box

Abstract

The embodiment of the application provides a heat dissipation device of a sound box and the sound box, and relates to the technical field of sound boxes, wherein the heat dissipation device of the sound box comprises: a heat-conducting inverting element, the heat-conducting inverting element is provided with an air flow channel, the heat-conducting inverting element is used for being arranged in a sound box main body, and the inside of the sound box main body is communicated with the outside through the air flow channel; a heat transfer element, the heat transfer element is arranged on the heat-conducting inverting element, and the heat transfer element is used for being in contact with a circuit assembly; and a heat dissipation element, the heat dissipation element is arranged on the heat-conducting inverting element, and the heat dissipation element is located in the air flow channel. The heat dissipation device of the sound box and the sound box provided by the embodiment of the application solve the problem that, in the related art, when the sound box is used, the circuit assembly generates heat and continuously accumulates in the inside of the sound box main body, thereby easily reducing the use performance of the sound box and shortening the service life of the sound box.

Description

Technical Field

[0001] This application relates to the field of speaker technology, and more particularly to a speaker heat dissipation device and a speaker. Background Technology

[0002] A bass-reflex speaker is a type of speaker that relies on its internal bass reflex tube to extend the low-frequency limit and improve low-frequency efficiency. It is widely used in many fields such as audio-visual playback, home speakers, and professional sound field equipment.

[0003] In related technologies, a bass-reflex speaker includes a speaker body, a bass reflex tube, a loudspeaker, and circuit components. The loudspeaker is connected to the side wall of the speaker body, the bass reflex tube is connected to the speaker body, and the interior of the bass reflex tube has an airflow channel connecting the interior of the speaker body to the outside. The circuit components (such as circuit boards, heating electronic components, etc.) are located inside the speaker body. During operation, an audio electrical signal is sent to the circuit components. After the circuit components complete signal decoding and power amplification, they send a drive electrical signal to the loudspeaker. The loudspeaker converts the electrical signal into reciprocating mechanical vibration of the diaphragm, thereby radiating sound waves outward from the front, achieving sound production. At the same time, the air inside the speaker body can enter and exit along the airflow channel, allowing the sound waves from the back of the speaker body to be smoothly discharged with the airflow and superimposed in phase with the sound waves radiated from the front of the loudspeaker, mutually enhancing the sound pressure, and ultimately synthesizing a complete sound effect with stronger low-frequency performance.

[0004] However, when the above-mentioned speakers are in use, the circuit components will generate heat and continuously accumulate inside the speaker body, which will easily reduce the performance of the speakers and shorten their service life. Summary of the Invention

[0005] This application provides a heat dissipation device and a speaker to solve the problem in the related art where, during the use of a speaker, the circuit components generate heat and continuously accumulate inside the speaker body, which can easily reduce the performance and shorten the service life of the speaker.

[0006] On one hand, an embodiment of this application provides a heat dissipation device for a speaker, comprising:

[0007] A thermally conductive bass reflex component, wherein the thermally conductive bass reflex component is provided with an airflow channel, the thermally conductive bass reflex component is used to be installed inside the speaker body, and the interior of the speaker body is connected to the exterior through the airflow channel;

[0008] A heat transfer element is disposed on the thermally conductive phase inverter and is used to contact the circuit assembly;

[0009] A heat sink is disposed on the heat-conducting phase inverter and is located within the airflow channel.

[0010] In one possible implementation, a heat transfer medium layer is further included, which is disposed on the heat transfer element and is used to contact the circuit assembly.

[0011] In one possible implementation, the heat sink includes a plurality of heat sink bumps, which are evenly spaced on the heat-conducting phase inverter.

[0012] In one possible implementation, the heat sink includes a plurality of heat sink protrusions, which are evenly spaced on the heat-conducting phase inverter. The heat sink protrusions are long and straight, arc-shaped, or spiral-shaped.

[0013] On the other hand, an embodiment of this application provides a speaker, including: a speaker body, a loudspeaker, a circuit assembly, and a heat dissipation device for the speaker as described in any of the above embodiments. The loudspeaker is disposed on the speaker body, and the heat-conducting bass reflex component in the heat dissipation device is connected to the speaker body or the loudspeaker. The circuit assembly is disposed on the speaker body or the heat-conducting bass reflex component.

[0014] In one possible implementation, the thermally conductive bass reflex component is connected to the speaker body, the airflow channel is formed inside the thermally conductive bass reflex component, and the circuit assembly is disposed on the outer surface of the thermally conductive bass reflex component.

[0015] In one possible implementation, the thermally conductive bass reflex component is connected to the speaker, the outer surface of the thermally conductive bass reflex component and the speaker body together form the airflow channel, the interior of the thermally conductive bass reflex component is provided with a mounting cavity, and the circuit assembly is disposed in the mounting cavity.

[0016] In one possible implementation, the speaker has a connection portion to which the thermally conductive phase-reflecting element is connected.

[0017] In one possible implementation, the speaker is provided with a first channel that connects the mounting cavity to the interior of the speaker body.

[0018] In one possible implementation, the thermally conductive phase-reflecting component is provided with a second channel that connects the mounting cavity to the interior of the speaker body.

[0019] This application provides a heat dissipation device and a speaker for a speaker. The heat dissipation device includes: a thermally conductive bass reflex component with an airflow channel, which is disposed within the speaker body and connects the interior of the speaker body to the exterior via the airflow channel; a heat transfer component disposed on the thermally conductive bass reflex component and in contact with circuit components; and a heat dissipation component disposed on the thermally conductive bass reflex component and located within the airflow channel. Therefore, when the heat dissipation device is applied to the speaker and is in operation, air inside the speaker body can enter and exit along the airflow channel in the thermally conductive bass reflex component. The heat generated by the circuit components can be conducted sequentially through the heat transfer component, the thermally conductive bass reflex component, and the heat dissipation component to one side of the airflow channel. Subsequently, the airflow within the airflow channel carries away the heat from the heat dissipation component and the thermally conductive bass reflex component, thereby effectively dissipating heat from the circuit components and reducing the possibility of reduced speaker performance and shortened lifespan due to heat accumulation inside the speaker body. This invention solves the problem in related technologies where heat is generated by the circuit components during speaker use and accumulates inside the speaker body, which can easily reduce the speaker's performance and shorten its lifespan. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0021] Figure 1 This is an application scenario diagram of a heat dissipation device for a speaker provided in an embodiment of this application, in which the heat-conducting phase inverter is a square tube.

[0022] Figure 2 This is an application scenario diagram of a heat dissipation device for a speaker provided in an embodiment of this application, in which the heat-conducting phase inverter is cylindrical.

[0023] Figure 3 A schematic diagram of the installation of the heat transfer medium layer in a heat dissipation device for a speaker provided in an embodiment of this application;

[0024] Figure 4 for Figure 1 Schematic diagram of the installation of heat dissipation bumps on the thermally conductive phase inverter component;

[0025] Figure 5 for Figure 1 Installation diagram when the heat dissipation protrusion on the heat-conducting phase inverter is long and straight;

[0026] Figure 6 for Figure 1 Installation diagram when the heat dissipation protrusion on the middle heat-conducting phase inverter is arc-shaped;

[0027] Figure 7 for Figure 2 Schematic diagram of the installation of heat dissipation bumps on the thermally conductive phase inverter component;

[0028] Figure 8 for Figure 2 Installation diagram when the heat dissipation protrusions on the central heat-conducting phase inverter are spiral-shaped;

[0029] Figure 9 This is a schematic diagram of the structure of a speaker provided in an embodiment of this application;

[0030] Figure 10 This is a schematic diagram of the structure of a speaker in which the heat-conducting phase-reflecting component is in the shape of a square tube, as provided in an embodiment of this application.

[0031] Figure 11 This is a schematic diagram of the structure of a speaker in which the heat-conducting bass reflex component is cylindrical, as provided in an embodiment of this application.

[0032] Figure 12 This application provides a schematic diagram of the structure of a first channel in a speaker.

[0033] Figure 13 This is a schematic diagram of the structure of the second channel in a speaker provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10-Speaker body; 11-Extension tube;

[0036] 20 - Circuit assembly; 21 - Circuit board; 22 - Heat-generating electronic component;

[0037] 30-speaker;

[0038] 40 - Connecting part;

[0039] 50 - First Channel;

[0040] 60 - Second Channel;

[0041] 100 - Thermally conductive phase inverter; 110 - High thermal conductivity section; 120 - Low thermal conductivity section;

[0042] 200-Airflow channel;

[0043] 300 - Heat transfer components;

[0044] 400 - Heat sink; 410 - Heat sink bump; 420 - Heat sink ridge;

[0045] 500 - Heat transfer medium layer.

[0046] The accompanying drawings have illustrated specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to specific embodiments. Detailed Implementation

[0047] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0048] Among related technologies, bass-reflex speakers are a type of speaker that mainly relies on its internal bass reflex tube to extend the low-frequency lower limit and improve low-frequency efficiency. They are widely used in many fields such as audio-visual playback, home speakers, and professional sound field equipment.

[0049] A bass-reflex speaker enclosure includes a speaker body, a bass reflex port, a loudspeaker, and circuitry. The loudspeaker is connected to the side wall of the speaker body, and the bass reflex port is connected to the speaker body, with an airflow channel inside the port connecting the interior of the speaker body to the exterior. The circuitry (such as circuit boards and heating electronic components) is located inside the speaker body. During operation, an audio signal is sent to the circuitry. After decoding and amplifying the signal, the circuitry sends a drive signal to the loudspeaker. The loudspeaker converts this signal into reciprocating mechanical vibrations of the diaphragm, radiating sound waves outwards to produce sound. Simultaneously, air inside the speaker body can enter and exit along the airflow channel, allowing the sound waves from the back of the speaker body to be smoothly expelled with the airflow. These waves then overlap with the sound waves radiated from the front of the loudspeaker, mutually enhancing the sound pressure and ultimately synthesizing a complete sound with stronger low-frequency performance.

[0050] However, during the use of these speakers, the circuit components generate heat that accumulates inside the speaker body, easily leading to reduced performance and a shortened lifespan. Specifically, because the speaker body is relatively enclosed, the heat generated by the circuit components is difficult to dissipate, causing it to easily accumulate inside. This heat accumulation can lead to the following performance issues: increased amplifier distortion, accelerated component aging, and shortened lifespan; for portable speakers with built-in batteries, it can also accelerate battery degradation, posing safety hazards; more importantly, the acoustic performance of bass-reflex speakers is highly dependent on the cavity air parameters, and internal heat buildup can alter the bass reflex tube's tuning frequency, causing low-frequency distortion and even generating additional convection noise, directly degrading the listening experience.

[0051] Based on this, this application provides a heat dissipation device and a speaker for a speaker. The heat dissipation device includes: a thermally conductive bass reflex component with an airflow channel, which is disposed within the speaker body and connects the interior and exterior of the speaker body through the airflow channel; a heat transfer component disposed on the thermally conductive bass reflex component and in contact with circuit components; and a heat dissipation component disposed on the thermally conductive bass reflex component and located within the airflow channel. Thus, when the heat dissipation device is applied to the speaker and is in operation, air inside the speaker body can enter and exit along the airflow channel in the thermally conductive bass reflex component. The heat generated by the circuit components can be conducted sequentially through the heat transfer component, the thermally conductive bass reflex component, and the heat dissipation component to one side of the airflow channel. Subsequently, the airflow within the airflow channel carries away the heat from the heat dissipation component and the thermally conductive bass reflex component, thereby effectively dissipating heat from the circuit components and reducing the possibility of reduced speaker performance and shortened lifespan due to heat accumulation inside the speaker body caused by the circuit components. This invention solves the problem in related technologies where heat is generated by the circuit components during speaker use and accumulates inside the speaker body, which can easily reduce the speaker's performance and shorten its lifespan.

[0052] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0053] like Figure 1 and Figure 2 As shown in the embodiment of this application, a heat dissipation device for a speaker includes:

[0054] A thermally conductive bass reflex component 100 is provided with an airflow channel 200. The thermally conductive bass reflex component 100 is used to be installed inside the speaker body 10 and to connect the interior of the speaker body 10 with the exterior through the airflow channel 200.

[0055] Heat transfer element 300 is disposed on heat-conducting phase inverter 100 and is used to contact the circuit assembly 20.

[0056] Heat sink 400 is disposed on heat-conducting phase inverter 100 and is located within airflow channel 200.

[0057] The thermally conductive bass reflex component 100 can be square, round, cylindrical, or other irregular shapes, and its shape is not limited. The airflow channel 200 can be located inside the thermally conductive bass reflex component 100 or outside the thermally conductive bass reflex component 100, so that when the thermally conductive bass reflex component 100 is applied to a speaker, the speaker body 10 and the outer surface of the thermally conductive bass reflex component 100 together enclose the airflow channel 200.

[0058] It should be noted that the thermally conductive phase inverter 100 is made of a material with good thermal conductivity, such as aluminum, aluminum alloy, copper, steel and graphene.

[0059] like Figure 3 As shown, the heat transfer element 300 is disposed on the heat-conducting phase inverter 100, so as to contact the circuit assembly 20 through the heat transfer element 300. The circuit assembly 20 can be an existing product, such as a circuit board 21 and a heat-generating electronic component 22 disposed on the circuit board 21, etc., so that the heat transfer element 300 can contact the heat-generating electronic component 22, so that the heat generated by the circuit assembly 20 can be transferred to the heat transfer element 300 and the heat-conducting phase inverter 100. The shape of the heat transfer element 300 is not limited, and it can be block, strip, plate, etc. The heat transfer element 300 can be connected to the heat-conducting phase inverter 100 by integral molding, welding, bonding or other methods. The heat transfer element 300 is also made of a material with good thermal conductivity, such as aluminum, aluminum alloy, copper, steel and graphene.

[0060] It should be noted that when there are multiple circuit components 20, multiple heat transfer elements 300 can also be set accordingly, so that each heat transfer element 300 corresponds to each circuit component 20.

[0061] The heat sink 400 is disposed on the side of the heat-conducting phase inverter 100 facing the airflow channel 200, so that the heat sink 400 is located inside the airflow channel 200.

[0062] Therefore, when the speaker is working, the air inside the speaker body 10 can enter and exit along the airflow channel 200 in the thermally conductive bass reflex component 100. The heat generated by the circuit components 20 can be conducted sequentially through the heat transfer component 300, the thermally conductive bass reflex component 100, and the heat sink 400 to one side of the airflow channel 200. Subsequently, the airflow in the airflow channel 200 carries away the heat on the heat sink 400 and the thermally conductive bass reflex component 100, thereby effectively dissipating heat from the circuit components 20. This reduces the possibility of reduced speaker performance and shortened lifespan due to the accumulation of heat generated by the circuit components 20 inside the speaker body 10. This solves the problem in related technologies where the circuit components 20 generate heat during speaker use, which continuously accumulates inside the speaker body 10, easily leading to reduced speaker performance and shortened lifespan.

[0063] It should be noted that the heat-conducting phase inverter 100 can increase the heat exchange area with the airflow through the heat sink 400, so that the heat-conducting phase inverter 100 and the heat sink 400 can exchange heat with the airflow together, which greatly improves the heat exchange efficiency.

[0064] For example, when the airflow channel 200 is located inside the heat-conducting phase inverter 100, the heat-conducting phase inverter 100 can be configured as a square tube or other shaped tube structure, see further. Figure 1 At this time, the circuit assembly 20 can be disposed on the outside of the heat-conducting phase inverter 100 by screwing, bonding or other means, and the heat transfer element 300 is also located on the outside of the heat-conducting phase inverter 100 accordingly.

[0065] At this time, the heat generated by the circuit component 20 can be transferred from the outside to the inside of the heat-conducting phase inverter 100 to one side of the airflow channel 200 to achieve the purpose of heat dissipation.

[0066] For example, when the airflow channel 200 is formed by the outer surface of the speaker body 10 and the thermally conductive bass reflex component 100, see further... Figure 2 At this time, the heat-conducting phase inverter 100 can be set as a cylinder and made into a hollow structure. The circuit assembly 20 can be set inside the heat-conducting phase inverter 100 by screwing, bonding or other means. Correspondingly, the heat transfer element 300 is also located inside the heat-conducting phase inverter 100.

[0067] At this time, the heat generated by the circuit component 20 can be transferred from the inside to the outside of the heat-conducting phase inverter 100 to one side of the airflow channel 200 to achieve the purpose of heat dissipation.

[0068] Based on this, a channel or through hole can be provided on the heat-conducting bass reflex component 100 to connect the interior of the heat-conducting bass reflex component 100 with the interior of the speaker body 10, so as to improve the speaker's performance and enhance the speaker's bass performance through the channel or through hole.

[0069] like Figure 3 As shown, in some embodiments, the heat dissipation device of the speaker also includes a heat transfer medium layer 500, which is disposed on the heat transfer element 300 and is used to contact the circuit assembly 20.

[0070] The heat transfer medium layer 500 can be any one or more composite structures selected from thermal grease, thermal silicone sheet, thermal phase change material, thermal gel, thermal adhesive, graphite thermal film, or thermal foam layer.

[0071] It should be noted that the heat transfer medium layer 500 is clamped between the heat transfer element 300 and the circuit assembly 20. The heat transfer medium layer 500 can be bonded to at least one of the heat transfer element 300 and the circuit assembly 20, or it can be applied by coating.

[0072] Therefore, the heat transfer medium layer 500 can establish a more adequate interface between the heat transfer element 300 and the circuit assembly 20 to fill the gap formed by the microscopic unevenness of the surfaces of the two, so that the heat generated by the circuit assembly 20 can be transferred to the heat transfer element 300 more stably through the heat transfer medium layer 500, thereby improving the heat dissipation effect of the circuit assembly 20.

[0073] like Figure 4 As shown, in some embodiments, the heat sink 400 includes a plurality of heat sink bumps 410, which are evenly spaced on the heat-conducting phase inverter 100.

[0074] It should be noted that the heat dissipation bump 410 can be integrally formed, bonded, welded, or otherwise disposed on the side of the heat-conducting phase inverter 100 facing the airflow channel 200, so that the heat dissipation bump 410 is located within the airflow channel 200. The heat dissipation bump 410 can be a cuboid, cylinder, hemisphere, or other shape, and there is no limitation thereto. The heat dissipation bump 410 is made of a material with good thermal conductivity, such as aluminum, aluminum alloy, copper, steel, and graphene.

[0075] Therefore, the heat-conducting phase inverter 100 can increase the heat exchange area with the airflow through each heat dissipation bump 410, so that the heat-conducting phase inverter 100 and the heat dissipation bump 410 can exchange heat with the airflow together, greatly improving the heat exchange efficiency.

[0076] In addition, the heat dissipation bump 410 can also reduce flow resistance, thereby reducing airflow noise generated by the phase inverter.

[0077] like Figure 5 and Figure 6 As shown, in some embodiments, the heat sink 400 includes a plurality of heat sink protrusions 420, which are evenly spaced on the heat-conducting phase inverter 100. The heat sink protrusions 420 are long straight, arc-shaped or spiral.

[0078] It should be noted that the heat dissipation protrusion 420 can be integrally formed, bonded, welded, or otherwise disposed on the side of the heat-conducting phase inverter 100 facing the airflow channel 200, so that the heat dissipation protrusion 420 is located within the airflow channel 200. The heat dissipation protrusion 420 can be long and straight, arc-shaped, spiral, or other shapes, and there is no limitation thereto. The heat dissipation protrusion 420 is made of a material with good thermal conductivity, such as aluminum, aluminum alloy, copper, steel, and graphene.

[0079] Therefore, the heat-conducting phase inverter 100 can increase the heat exchange area with the airflow through each heat dissipation protrusion 420, so that the heat-conducting phase inverter 100 and the heat dissipation protrusion 420 can exchange heat with the airflow together, greatly improving the heat exchange efficiency.

[0080] In addition, the heat dissipation ridge 420 can also reduce flow resistance, thereby reducing airflow noise generated by the phase inverter.

[0081] For example, such as Figure 4 , Figure 5 and Figure 6 As shown, when the airflow channel 200 is located inside the heat-conducting phase inverter 100, the heat dissipation bump 410 or the long straight / arc / spiral heat dissipation bump 420 (i.e., heat dissipation component 400) can be placed on the inner surface of the heat-conducting phase inverter 100.

[0082] In this scenario, preferably, the heat sink 400 can also be positioned at the end of the heat-conducting phase inverter 100 close to the heat transfer element 300, so that the heat sink 400 is positioned close to the heat transfer element 300, thereby appropriately shortening the heat transfer path and improving the heat transfer efficiency.

[0083] Based on this, such as Figure 1 As shown, the heat-conducting phase inverter 100 can also be divided into two parts: a high thermal conductivity section 110 near the end of the heat transfer element 300 and a low thermal conductivity section 120 away from the end of the heat transfer element 300. For example, the high thermal conductivity section 110 can be made of high thermal conductivity materials such as aluminum, aluminum alloy, copper, steel and graphene, while the low thermal conductivity section 120 can be made of low-cost, low thermal conductivity materials such as plastic and wood, so as to appropriately control the processing cost.

[0084] For example, such as Figure 7 and Figure 8 As shown, when the airflow channel 200 is formed by the outer surface of the speaker body 10 and the heat-conducting bass reflex component 100, heat dissipation bumps 410 or long straight / arc / spiral heat dissipation ridges 420 can be set on the inner surface of the heat-conducting bass reflex component 100.

[0085] In summary, the speaker heat dissipation device provided in this application embodiment allows air inside the speaker body 10 to enter and exit along the airflow channel 200 in the thermally conductive phase inverter 100 when the speaker is working. Heat generated by the circuit components 20 is sequentially conducted to one side of the airflow channel 200 through the heat transfer component 300, the thermally conductive phase inverter 100, and the heat sink 400. Subsequently, the airflow within the airflow channel 200 carries away the heat from the heat sink 400 and the thermally conductive phase inverter 100, thereby effectively dissipating heat from the circuit components 20. This reduces the possibility of reduced speaker performance and shortened lifespan due to heat accumulation inside the speaker body 10 caused by the circuit components 20. This solves the problem in related technologies where heat generated by the circuit components 20 accumulates inside the speaker body 10 during speaker use, easily leading to reduced speaker performance and shortened lifespan.

[0086] like Figure 9 , Figure 10 and Figure 11 As shown in the embodiment of this application, a speaker includes: a speaker body 10, a speaker 30, a circuit assembly 20, and a heat dissipation device for the speaker in any of the above embodiments. The speaker 30 is disposed on the speaker body 10, and the heat-conducting phase-reflecting element 100 in the heat dissipation device of the speaker is connected to the speaker body 10 or the speaker 30. The circuit assembly 20 is disposed on the speaker body 10 or the heat-conducting phase-reflecting element 100.

[0087] The speaker enclosure 10 is hollow inside, but its shape is not limited and can be square, cylindrical, or other shapes. The speaker enclosure 10 can be made of metal, non-metal, or other materials, such as stainless steel, plastic, or wood. The speaker 30 can be an existing product and is electrically connected to the circuit assembly 20. The circuit assembly 20 can be an existing product, such as a circuit board 21 and a heat-generating electronic component 22 mounted on the circuit board 21.

[0088] The thermally conductive bass reflex component 100 is connected to the speaker body 10 or the speaker 30, so that the airflow channel 200 on the thermally conductive bass reflex component 100 can connect the interior of the speaker body 10 with the exterior. The specific structure of the thermally conductive bass reflex component 100 has been described in detail in the above embodiments and will not be repeated here.

[0089] In use, an audio electrical signal is sent to the circuit assembly 20. After the circuit assembly 20 completes signal decoding and power amplification, it sends a drive electrical signal to the speaker 30. The speaker 30 converts the electrical signal into reciprocating mechanical vibration of the diaphragm, thereby radiating sound waves outward from the front to produce sound. At the same time, the air inside the speaker body 10 can enter and exit along the airflow channel 200, allowing the sound waves from the back of the speaker body 10 to be smoothly discharged with the airflow and superimposed in phase with the sound waves radiated from the front of the speaker 30, mutually enhancing the sound pressure and ultimately synthesizing a complete sound effect with stronger low-frequency performance.

[0090] Furthermore, the heat generated by the circuit assembly 20 can be conducted sequentially to the airflow channel 200 through the heat transfer element 300, the heat-conducting phase inverter 100, and the heat dissipation element 400. Then, the airflow in the airflow channel 200 carries away the heat on the heat dissipation element 400 and the heat-conducting phase inverter 100, thereby effectively dissipating heat from the circuit assembly 20 and reducing the possibility of reduced speaker performance and shortened lifespan due to the accumulation of heat generated by the circuit assembly 20 inside the speaker body 10.

[0091] like Figure 10 As shown, in some embodiments, the thermally conductive phase inverter 100 is connected to the speaker body 10, the airflow channel 200 is opened inside the thermally conductive phase inverter 100, and the circuit assembly 20 is disposed on the outer surface of the thermally conductive phase inverter 100.

[0092] For example, the thermally conductive bass reflex component 100 can be a square tube structure. The thermally conductive bass reflex component 100 can be connected to the speaker body 10 by integral molding, welding or other means, so that the interior of the thermally conductive bass reflex component 100 forms an airflow channel 200.

[0093] At this time, the circuit assembly 20 can be fixed to the outer surface of the thermally conductive phase inverter 100 by screwing, bonding or other means. Correspondingly, the heat transfer element 300 is located on the outside of the thermally conductive phase inverter 100, and the heat dissipation element 400 is located on the inside of the thermally conductive phase inverter 100.

[0094] Therefore, the heat generated by the circuit component 20 can be transferred from the outside to the inside of the airflow channel 200 through the heat transfer element 300, the heat conduction phase inverter 100 and the heat dissipation element 400, thereby achieving the purpose of heat dissipation.

[0095] For example, the heat sink 400 may include a plurality of evenly spaced heat sink protrusions 410, long straight heat sink protrusions 420 or arc-shaped heat sink protrusions 420, etc., as described in the above embodiments, so as to increase the heat dissipation area and increase the heat dissipation efficiency through the heat sink 400.

[0096] like Figure 11 As shown, in some embodiments, the thermally conductive bass reflex component 100 is connected to the speaker 30, and the outer surface of the thermally conductive bass reflex component 100 and the speaker body 10 together form an airflow channel 200. The interior of the thermally conductive bass reflex component 100 is provided with a mounting cavity, and the circuit assembly 20 is disposed in the mounting cavity.

[0097] For example, the thermally conductive bass reflex component 100 can be a cylindrical structure. One end of the thermally conductive bass reflex component 100 is connected to the speaker 30 along its axial direction. The outer surface of the thermally conductive bass reflex component 100 is spaced apart from the speaker body 10, so that the outer surface of the thermally conductive bass reflex component 100 and the speaker body 10 together form an annular airflow channel 200. In implementation, an extension tube 11 can be fixed to the speaker body 10 by adhesive or screwing. The extension tube 11 is coaxially spaced and sleeved on the thermally conductive bass reflex component 100, so that the outer surface of the thermally conductive bass reflex component 100 and the inner surface of the extension tube 11 together form the airflow channel 200.

[0098] At this time, the heat-conducting phase inverter 100 has an internal mounting cavity, and the circuit assembly 20 can be mounted on the heat-conducting phase inverter 100 by screwing, bonding or other means, and is located inside the mounting cavity. Correspondingly, the heat transfer element 300 is located inside the heat-conducting phase inverter 100 (i.e., inside the mounting cavity), and the heat dissipation element 400 is located outside the heat-conducting phase inverter 100.

[0099] Therefore, the heat generated by the circuit component 20 can be transferred from the inside to the outside of the airflow channel 200 through the heat transfer element 300, the heat-conducting phase inverter 100, and the heat dissipation element 400, thereby achieving the purpose of heat dissipation. In addition, the heat-conducting phase inverter 100 can also reduce the maximum flow velocity of the airflow in the airflow channel 200, thereby reducing the generated airflow noise.

[0100] For example, the heat sink 400 may include a plurality of evenly spaced heat sink protrusions 410, long straight heat sink protrusions 420 or arc-shaped heat sink protrusions 420, etc., as described in the above embodiments, so as to increase the heat dissipation area and increase the heat dissipation efficiency through the heat sink 400.

[0101] Furthermore, such as Figure 11 As shown, the speaker 30 has a connecting part 40, and the heat-conducting phase inverter 100 is connected to the connecting part 40.

[0102] The connecting part 40 can be the magnet part in the speaker 30, or other parts in the speaker 30, and can be determined according to the actual structure of the speaker 30. It is only necessary to ensure that the end of the heat-conducting bass reflex component 100 facing the speaker 30 is adapted to the connecting part 40. The heat-conducting bass reflex component 100 can be connected to the connecting part 40 by screwing, welding or other means.

[0103] Therefore, the connecting part 40 can provide an installation base for the heat-conducting phase inverter 100, thereby improving the stability and convenience of installing the heat-conducting phase inverter 100.

[0104] Since a channel or through hole can be provided on the heat-conducting bass reflex component 100 to connect the interior of the heat-conducting bass reflex component 100 with the interior of the speaker body 10, the speaker performance can be improved and the bass performance of the speaker can be enhanced through the channel or through hole.

[0105] In this regard, such as Figure 12 As shown, in some embodiments, a first channel 50 may be provided on the speaker 30, the first channel 50 communicating with the interior of the mounting cavity and the speaker body 10. For example, the first channel 50 may be formed on the connecting portion 40. Figure 13 As shown, in some embodiments, a second channel 60 may also be provided on the thermally conductive bass reflex component 100, the second channel 60 connecting the mounting cavity with the interior of the speaker body 10, wherein the second channel 60 is located at the end of the thermally conductive bass reflex component 100 facing the speaker 30.

[0106] Therefore, the speaker's performance can be improved by using the first channel 50 or the second channel 60, thereby enhancing the speaker's bass performance.

[0107] In summary, the speaker provided in this application embodiment allows the heat generated by the circuit component 20 to be conducted sequentially to the airflow channel 200 via the heat transfer element 300, the heat-conducting phase inverter element 100, and the heat dissipation element 400. Subsequently, the airflow in the airflow channel 200 carries away the heat on the heat dissipation element 400 and the heat-conducting phase inverter element 100, thereby effectively dissipating heat from the circuit component 20. This reduces the possibility of reduced speaker performance and shortened service life due to the accumulation of heat generated by the circuit component 20 inside the speaker body 10.

[0108] In addition, this speaker has advantages including: excellent heat dissipation, utilizing high-speed airflow within the thermally conductive bass reflex unit 100 for heat dissipation without affecting bass performance. While achieving heat dissipation, it also reduces airflow noise generated by the thermally conductive bass reflex unit 100.

[0109] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A heat dissipation device for a speaker, characterized in that, include: A thermally conductive bass reflex component (100) is provided with an airflow channel (200). The thermally conductive bass reflex component (100) is used to be installed inside the speaker body (10) and to connect the interior of the speaker body (10) with the exterior through the airflow channel (200). A heat transfer element (300) is disposed on the thermally conductive phase inverter (100) and is used to contact the circuit assembly (20); Heat sink (400) is disposed on the heat-conducting phase inverter (100) and is located in the airflow channel (200).

2. The heat dissipation device for the speaker according to claim 1, characterized in that, It also includes a heat transfer medium layer (500) disposed on the heat transfer element (300) and the heat transfer medium layer (500) is used to contact the circuit assembly (20).

3. The heat dissipation device for the speaker according to claim 1 or 2, characterized in that, The heat sink (400) includes a plurality of heat sink bumps (410), which are evenly spaced on the heat-conducting phase inverter (100).

4. The heat dissipation device for the speaker according to claim 1 or 2, characterized in that, The heat sink (400) includes a plurality of heat sink protrusions (420), which are evenly spaced on the heat-conducting phase inverter (100). The heat sink protrusions (420) are long straight, arc-shaped or spiral.

5. A speaker, characterized in that, The speaker includes a speaker body (10), a loudspeaker (30), a circuit assembly (20), and a heat dissipation device for the speaker according to any one of claims 1-4. The loudspeaker (30) is disposed on the speaker body (10), and the heat-conducting phase-reflecting element (100) in the heat dissipation device of the speaker is connected to the speaker body (10) or the loudspeaker (30). The circuit assembly (20) is disposed on the speaker body (10) or the heat-conducting phase-reflecting element (100).

6. The speaker according to claim 5, characterized in that, The thermally conductive bass reflex component (100) is connected to the speaker body (10), the airflow channel (200) is opened inside the thermally conductive bass reflex component (100), and the circuit assembly (20) is disposed on the outer surface of the thermally conductive bass reflex component (100).

7. The speaker according to claim 5, characterized in that, The thermally conductive bass reflex component (100) is connected to the loudspeaker (30). The outer surface of the thermally conductive bass reflex component (100) and the speaker body (10) together form the airflow channel (200). The interior of the thermally conductive bass reflex component (100) is provided with a mounting cavity, and the circuit assembly (20) is disposed in the mounting cavity.

8. The speaker according to claim 7, characterized in that, The loudspeaker (30) has a connecting part (40), and the heat-conducting phase inverter (100) is connected to the connecting part (40).

9. The speaker according to claim 7, characterized in that, The speaker (30) is provided with a first channel (50), which connects the mounting cavity to the interior of the speaker body (10).

10. The speaker according to claim 7 or 8, characterized in that, The heat-conducting phase inverter (100) is provided with a second channel (60), which connects the mounting cavity to the interior of the speaker body (10).

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