Diode automatic mounting equipment

Abstract

The application discloses a diode automatic mounting equipment, which comprises a workbench, a vibration feeding module, a distributing module, a turnover module, a carrying module and an assembling module are sequentially arranged on the workbench along the diode processing direction; the vibration feeding module is fixed on the workbench to output diodes in a vertical state; the distributing module is slidably installed on the workbench to transfer the diodes; the turnover module is located downstream of the distributing module to receive and turn over the diodes to a horizontal state; the assembling module is installed on the workbench to carry a circuit board; the carrying module is slidably installed between the turnover mechanism and the assembling mechanism to transfer the diodes to the assembling module for mounting. The turnover module comprises a driving source, a rotating shaft in transmission connection with the driving source and a turnover claw, the turnover claw is fixedly installed on the rotating shaft, and the driving source works to drive the turnover claw to rotate and turn over the diodes. The diode automatic mounting equipment can automatically feed and mount the bulk diodes on the circuit board.

Description

Technical Field

[0001] This application relates to the field of diode mounting equipment technology, and in particular to an automatic diode mounting device. Background Technology

[0002] A diode is a basic semiconductor device with unidirectional conductivity, widely used in electronic circuits for rectification, switching, and signal modulation. The most traditional and widespread application of infrared LEDs is in remote controls; household appliances such as televisions, air conditioners, and stereos commonly use surface-mount infrared LEDs or infrared receiving diodes to achieve remote control functions. For a long time, infrared remote control has dominated the consumer electronics remote control field due to its advantages such as low cost, low power consumption, and lack of interference with the surrounding environment.

[0003] Early infrared LEDs generally used axial leaded packages (such as DO-35, DO-41, etc.), with leads extending axially from both ends of the component, requiring them to pass through through-holes on the circuit board and be soldered in place. The emergence of surface mount technology (SMT) drove a revolution in component packaging. The core of SMT technology lies in eliminating through-holes, directly mounting and soldering miniaturized components onto the circuit board surface. This allows for wiring and component placement on both sides of the circuit board, reducing component size by 60% to 90% and increasing assembly density by 5 to 10 times. Infrared LEDs subsequently transitioned from axial packaging to surface mount packaging.

[0004] In existing diode mounting processes, diode feeding methods are mainly divided into two categories: one is tape-and-cartridge feeding, where diodes are pre-packaged between carrier tape and top tape, and discharged horizontally for easy pickup by the pick-and-place machine; the other is bulk feeding, where diodes are loosely stored in tubes or boxes and fed after being sorted by a vibratory feeder. Although tape-and-cartridge feeding matches the mounting requirements in terms of discharge direction, it suffers from problems such as high packaging costs, more waste, and poor line changeover flexibility. Bulk feeding, on the other hand, has advantages such as low material costs, environmental friendliness, and flexible line changeover, but because the diodes output by the vibratory feeder are usually in a vertical position, there is a directional mismatch with the horizontal mounting requirements.

[0005] Therefore, the current assembly of loose diodes is typically done in small batches by manual placement, which is inefficient and lacks precision. How to efficiently and reliably automate the placement of loose diodes has become a pressing technical problem to be solved in this field. Summary of the Invention

[0006] To address the inconvenience of automated mounting of bulk diodes in existing technologies, this application provides an automated diode mounting device with the following solution:

[0007] An automated diode mounting device, comprising:

[0008] Workbench;

[0009] A vibratory feeding module is fixedly installed on the workbench and is used to screen and output diodes with their pins facing downwards in a vertical state by vibration.

[0010] The material distribution module is slidably mounted on the worktable and is used to transfer diodes from the vibratory feeding module.

[0011] A flip module, mounted on the workbench and located downstream of the material distribution module, is used to receive diodes from the material distribution module and flip the diodes.

[0012] The assembly module is mounted on the workbench to support the circuit board for diode mounting.

[0013] A transport module is slidably mounted between the flip module and the assembly module, and is used to transport diodes to the assembly module for mounting.

[0014] The flipping module includes a drive source, a rotating shaft driven by the drive source, and a flipping claw for clamping diode leads. The flipping claw is fixedly mounted on the rotating shaft. The drive source drives the rotating shaft to rotate the flipping claw, causing the diode to flip from a vertical state to a horizontal state. The assembly module includes a fixture transport unit mounted on the workbench and a mounting fixture slidably mounted on the fixture transport unit. The fixture transport unit has a limiting area for limiting the mounting fixture. The mounting fixture has a mounting slot for mounting a circuit board. One end of the mounting slot has a pressing area for mounting the diode. The pressing area is provided with a magnetic suction element for attracting the diode leads to the circuit board. When the mounting fixture is located in the limiting area, the transport module works to transfer the diode and mount it onto the circuit board in the pressing area.

[0015] Optionally, the assembly module further includes: an abutment component disposed at the edge of the limiting area for limiting the mounting fixture in the horizontal direction; and a lifting limiting component disposed within the limiting area for lifting and clamping the mounting fixture that has reached the limiting area upwards.

[0016] Optionally, the abutment assembly includes a buffer seat and a lever hinged within the buffer seat; the lever has a strike-receiving end extending out of the buffer seat and a damping end extending into the buffer seat; when the mounting fixture is located in the limiting area, the strike-receiving end can collide with the mounting fixture and press the damping end into the buffer seat, thereby absorbing the collision kinetic energy of the mounting fixture.

[0017] Optionally, the impact-receiving end has a wheel-shaped structure, and when the mounting fixture is located in the limiting area, the impact-receiving end rolls into contact with the side edge of the mounting fixture.

[0018] Optionally, the impacted end is made of a flexible material.

[0019] Optionally, the impact-receiving end is made of magnetic material, and a metal anti-collision vertical plate is fixed to the side edge of the mounting fixture. When the mounting fixture is located in the limiting area, the impact-receiving end and the anti-collision vertical plate are magnetically attracted and positioned.

[0020] Optionally, the conveying module includes a Y-axis drive rail, an X-axis drive rail slidably mounted on the Y-axis drive rail, and a pneumatic suction claw slidably mounted on the X-axis drive rail; a sliding guide beam is arranged side by side on one side of the Y-axis drive rail, and two limiting blocks are spaced apart on the sliding guide beam; one end of the X-axis drive rail is slidably engaged with the sliding guide beam, and the X-axis drive rail can move to be engaged between the two limiting blocks to limit the displacement of the X-axis drive rail along the Y-axis direction.

[0021] Optionally, the pneumatic suction claw has an arc-shaped picking part recessed at the suction end, which is used to accommodate and fit the cylindrical body of the diode during picking.

[0022] Optionally, the material distribution module includes a material distribution base fixedly installed on the workbench, a material distribution seat slidably installed on the material distribution base, and a horizontal material picking claw slidably installed on the workbench; the material distribution seat has a receiving groove for accommodating a single diode, the material distribution seat reciprocates between the receiving position and the discharging position, and the horizontal material picking claw is used to transfer the diode from the receiving groove located at the discharging position to the flipping claw.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. Through the coordinated operation of various modules, the equipment achieves automated feeding, orientation flipping, and handling of bulk diodes, culminating in automated mounting on the circuit board. This integration of modules overcomes the problems of orientation mismatch, low efficiency, and insufficient precision in existing bulk diode mounting processes, improving production efficiency and mounting quality. It provides an effective technical approach for the automated assembly of bulk diodes in consumer electronics products such as remote controls.

[0025] 2. The diode leads are stably attached to the circuit board by magnetic attachment. This design not only enables the transport module to accurately transfer and mount the diodes to the predetermined positions, significantly improving the accuracy and efficiency of diode mounting, but also facilitates subsequent reflow soldering. It prevents the diodes from shifting after the transport module leaves or during subsequent soldering processes, effectively reducing lead floating and cold solder joints.

[0026] 3. The fixture transport unit incorporates an abutment component and a lifting limiting component within the limiting area, significantly improving the positioning accuracy and stability of the mounting fixture. The abutment component precisely limits the mounting fixture in the horizontal direction, effectively solving the problem of lateral deviation that may occur during transport. Simultaneously, the lifting limiting component lifts and clamps the mounting fixture from the transport surface, further enhancing its overall rigidity and stability during placement. This dual limiting mechanism ensures that the mounting fixture is in a precise and stable position during diode placement, allowing the transport module to accurately place the diodes onto the circuit board pads in the pressing area. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application;

[0028] Figure 2 This is an enlarged schematic diagram of part A in the embodiments of this application;

[0029] Figure 3 This is a schematic diagram of the vibration feeding module in the embodiments of this application;

[0030] Figure 4 This is a schematic diagram of the material distribution module in an embodiment of this application;

[0031] Figure 5 This is an enlarged schematic diagram of part B of the embodiment of this application;

[0032] Figure 6 This is an overall structural diagram of the embodiment of the application, which hides the structure of the mounting fixture.

[0033] Figure 7 This is a partial schematic diagram of an embodiment of the present application to illustrate the structure of the pneumatic suction claw;

[0034] Figure 8 This is a schematic diagram illustrating the assembly module in an embodiment of this application;

[0035] Figure 9 This is an enlarged schematic diagram of part C of embodiment C of this application;

[0036] Figure 10 This is a schematic diagram of the abutment component in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Workbench; 11. Base plate; 12. Frame; 2. Vibratory feeding module; 21. Vibratory plate; 22. Discharge track; 221. First limiting cavity; 222. Second limiting cavity; 3. Material distribution module; 31. Material distribution base; 311. Linear guide rail; 32. Material distribution seat; 321. Receiving groove; 33. Horizontal picking claw; 331. X-axis cylinder; 332. X-axis slide; 333. Vacuum nozzle; 34. Receiving position; 35. Discharge position; 36. Laser detection device; 4. Tilting module; 41. Drive source; 42. Rotating shaft; 43. Tilting claw; 431. Clamping part; 44. Y-axis cylinder; 45. Y-axis slider; 5. Assembly module; 51. Fixture conveying unit; 511. Limiting area; 512. Conveyor belt; 513. Conveyor motor; 5 14. Drive roller; 515. Tensioner wheel; 52. Mounting fixture; 521. Mounting groove; 522. Pressing area; 523. Anti-collision vertical plate; 524. Support platform; 53. Magnetic suction component; 54. Abutment assembly; 541. Buffer seat; 5411. Hinge shaft; 5412. Buffer rod; 542. Lever component; 5421. Impact end; 5422. Damping end; 543. Lifting cylinder; 55. Lifting and limiting assembly; 551. Lifting assembly; 5511. Lifting cylinder; 5512. Lifting plate; 5513. Guide column; 5514. Positioning column; 552. Limiting top plate; 6. Handling module; 61. Y-axis drive rail; 62. X-axis drive rail; 63. Pneumatic suction claw; 631. Arc-shaped material picking part; 64. Sliding guide beam; 641. Limiting block. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] The present application will be further described in detail below with reference to the accompanying drawings.

[0043] refer to Figure 1 and Figure 2 This application discloses an automated diode mounting device. The automated diode mounting device includes:

[0044] Workbench 1;

[0045] Vibration feeding module 2 is fixedly installed on the workbench 1 and is used to screen and output diodes with the pins facing down in a vertical state by vibration.

[0046] The material distribution module 3 is slidably mounted on the workbench 1 and is used to transfer diodes from the vibrating feeding module 2;

[0047] The flip module 4 is installed on the workbench 1 and located downstream of the material distribution module 3. It is used to receive diodes from the material distribution module 3 and flip the diodes.

[0048] Assembly module 5 is installed on workbench 1 to support the circuit board for diode mounting.

[0049] The transport module 6 is slidably mounted between the flip module 4 and the assembly module 5, and is used to transport the diode to the assembly module 5 for mounting.

[0050] The flip module 4 includes a drive source 41, a rotating shaft 42 connected to the drive source 41, and a flip claw 43 for holding diode pins. The flip claw 43 is fixedly mounted on the rotating shaft 42. The drive source 41 drives the rotating shaft 42 to rotate the flip claw 43 so that the diode flips from a vertical state to a horizontal state.

[0051] Reference Figure 1 and Figure 2The automated diode mounting equipment includes a workbench 1, which serves as the base of the entire equipment to provide a stable mounting surface. In this embodiment, the top of the workbench 1 has a horizontally arranged substrate 11, with a vibration feeding module 2 and an assembly module 5 located at opposite ends of the substrate 11. Bulk diodes are fed by the vibration feeding module 2 and sequentially pass through a sorting module 3, a flipping module 4, and a transport module 6 along the diode processing direction before finally being mounted onto the circuit board surface located on the assembly module 5. This automated diode mounting equipment, by integrating vibration feeding, sorting, flipping, transporting, and assembly modules, effectively solves the problems of orientation mismatch and low efficiency of manual operation in the traditional mounting process of bulk diodes. This equipment enables automated, efficient, and reliable mounting of bulk diodes, significantly improving production efficiency and mounting accuracy, while reducing labor costs and material waste.

[0052] Reference Figure 1 and Figure 3 In this embodiment, the vibratory feeding module 2 includes a vibratory feeder 21 and a discharge track 22. The diodes are guided into the discharge track 22 by the vibration of the vibratory feeder 21. The diodes in this embodiment are infrared emitting diodes, which include a cylindrical diode body and pins parallel to the axis of the diode body and inserted into the tail of the diode. One end of the discharge track 22 is connected to the discharge end of the vibratory feeder 21, and the other end extends downward along the discharge direction to the material distribution module 3 at an inclination angle of 15°-25°, so that the diodes can slide smoothly by gravity. It is worth mentioning that the discharge track 22 is long and narrow, and its cross-section has a stepped constricted structure that is larger at the top and smaller at the bottom. Specifically, the upper part of the discharge track 22 is provided with a first limiting cavity 221 for the diode body to slide. The cross-section of the first limiting cavity 221 is rectangular, and its width is adapted to the maximum outer diameter of the diode body, allowing only a single diode body to slide in a single row along the length of the track. The lower part of the discharge track 22 is provided with a second limiting cavity 222 that communicates with the first limiting cavity 221. The second limiting cavity 222 is located directly below the first limiting cavity 221, and its cross-section is rectangular. The width of the second limiting cavity 222 is smaller than the diameter of the diode body and larger than the diameter of a single lead of the diode.

[0053] The initial feeding of bulk diodes is handled by a vibration feeding module 2. This module uses vibration to screen and orient the diodes, ultimately outputting the vertically aligned diodes with their leads facing down to the next stage. This method avoids the use of costly and waste-generating tape packaging, while also solving the initial sorting problem of bulk diodes.

[0054] Reference Figure 4 and Figure 5The material distribution module 3 includes a material distribution base 31 fixedly installed on the workbench 1, a material distribution seat 32 slidably installed on the material distribution base 31, and a horizontal picking claw 33 slidably installed on the workbench 1. The material distribution seat 32 is provided with a receiving groove 321 for accommodating a single diode. The material distribution seat 32 reciprocates between the receiving position 34 and the discharge position 35. The horizontal picking claw 33 is used to transfer the diode from the receiving groove 321 located at the discharge position 35 to the flipping claw 43.

[0055] To facilitate the description of spatial relationships, an XYZ rectangular coordinate system is defined. The X and Y axes lie in the horizontal plane and are perpendicular to each other, while the Z axis is perpendicular to the horizontal plane.

[0056] Reference Figure 4 and Figure 5 Specifically, the material distribution base 31 is fixedly mounted on the substrate 11. A linear guide rail 311 is provided on the material distribution base 31 along the X-axis direction. The material distribution seat 32 is slidably mounted on the linear guide rail 311 and can perform linear reciprocating motion along the linear guide rail 311 under the drive of a drive cylinder (not shown in the figure). Specifically, corresponding to the cylindrical diode in this embodiment, the shape of the receiving groove 321 is adapted to the outer contour of the diode. The groove width is slightly larger than the diameter of the diode body, and the depth matches the length of the diode leads. It can only accommodate a single vertical diode with its leads facing down, realizing the separation of materials one by one. The receiving position 34 refers to the alignment of the receiving groove 321 with the end of the discharge track 22 to receive the diode. The discharge position 35 refers to the movement of the material distribution seat 32 to a designated position so that the horizontal picking claw 33 can accurately transfer the diode. To accurately detect whether the diode has successfully entered the receiving slot 321, a laser detection device 36 is also provided on the dispensing seat 32. This laser detection device 36 consists of a laser emitter and a receiver, which are respectively located at the ends of the dispensing seat 32 on both sides of the receiving slot 321. The emitted laser beam passes horizontally through the middle of the receiving slot 321. When the diode enters the receiving slot 321, it will block the laser beam. The receiver will send a feedback signal to the equipment control system to confirm that the material is in place. If no material is detected within a set time, the system will determine that there is a shortage of material and trigger a replenishment or shutdown warning to avoid dry running or material jamming. The movement stroke of the dispensing seat 32 is controlled by the stroke of the cylinder, which can precisely switch between the receiving position 34 and the discharge position 35. When the receiving slot 321 receives the diode at the receiving position 34, the cylinder drives the dispensing seat 32 to slide to the discharge position 35, waiting for the horizontal picking claw 33 to grab it.

[0057] Reference Figure 1 and Figure 5The horizontal picking claw 33 includes an X-axis cylinder 331 fixedly mounted on the substrate 11, an X-axis slide 332 driven by the X-axis cylinder 331, and a vacuum nozzle 333 slidably mounted on the X-axis slide 332. The X-axis slide 332 is driven by the X-axis cylinder 331 fixedly mounted on the substrate 11, and moves linearly along the X-axis direction along the guide rail (not shown in the figure) preset on the worktable 1, so that the vacuum nozzle 333 reciprocates between the discharge position 35 and the flipping claw 43 of the flipping module 4 to realize the transfer of diodes. The vacuum nozzle 333 is connected to a vacuum generator (not shown in the figure) through an air pipe, which can generate a negative pressure suction force to adsorb and pick up the diode body in the receiving groove 321. The downward-facing end of the vacuum nozzle 333 is recessed into an arc shape that fits against the end of the diode away from the pin. In actual operation, a vacuum pressure sensor (not shown in the figure) is also installed in the vacuum circuit of the horizontal picking claw 33 to monitor the adsorption pressure in real time. When the pressure is lower than the set threshold, it is determined that the adsorption has failed, the transfer action is stopped immediately and an alarm is triggered to prevent the diode from falling or the station from malfunctioning.

[0058] The dispensing module 3, through the coordinated action of the dispensing base 31, dispensing seat 32, and horizontal picking claw 33, achieves precise distribution and transfer of diodes. The dispensing seat 32 has a receiving groove 321 for accommodating individual diodes, ensuring that only one diode is processed at a time, effectively avoiding diode accumulation and jamming. The dispensing seat 32 reciprocates between the receiving position 34 and the discharging position 35, allowing diodes to be received orderly from the vibrating feeding module 2 and accurately delivered to the picking point of the horizontal picking claw 33. The horizontal picking claw 33 stably picks up diodes from the receiving groove 321 and transfers them to the flipping claw 43, ensuring the diode's posture stability and positioning accuracy during transfer. Overall, this dispensing module 3 significantly improves the automation, stability, and efficiency of the diode distribution process in the automatic diode mounting equipment, reduces the need for manual intervention, and minimizes production interruptions caused by diode misalignment or jamming.

[0059] Reference Figure 1 and Figure 2The flipping module 4 also includes a Y-axis cylinder 44 fixedly mounted on the base plate 11 and a Y-axis slider 45 driven by the Y-axis cylinder 44. A drive source 41 is fixedly mounted on the Y-axis slider 45. The operation of the Y-axis cylinder 44 drives the Y-axis slider 45 to reciprocate in the Y-axis direction. The rotating shaft 42 is arranged along the X-axis direction. The drive source 41 is a servo motor, which is driven by the rotating shaft 42 via a coupling. The servo motor drives the rotating shaft 42 and the flipping claw 43 to move synchronously. Simultaneously, the flipping claw 43 can slide along the Y-axis direction to achieve alignment with the workstations of the material distribution module 3 and the handling module 6. In this embodiment, the flipping claw 43 is a finger cylinder. The flipping claw 43 has two relatively openable clamping parts 431 to clamp the diode. During operation, after the two clamping parts 431 close to clamp the diode, the output shaft of the drive source 41 rotates 90°, driving the rotating shaft 42 and the finger cylinder to rotate synchronously by 90° via the coupling, causing the diode to change from a vertical state to a horizontal state.

[0060] During operation, the horizontal pick-up claw 33 transfers the vertically positioned diode to the clamping position of the flipping claw 43. The flipping claw 43 clamps the diode's leads. Subsequently, the drive source 41 starts, causing the rotating shaft 42 to rotate 90°. The flipping claw 43 rotates synchronously, flipping the diode from a vertical position with the leads facing down to a horizontal position, ensuring that the diode body faces away from the assembly module 5. At this time, the leads face the assembly module 5. After flipping to the correct position, the flipping claw 43 maintains the clamping state. When the transport module 6 picks up the diode, the two clamping parts 431 of the flipping claw 43 move away from each other to release the diode, facilitating its transport. After completing the flipping process, the device resets to prepare for the next clamping and flipping operation.

[0061] The transport module 6 slides between the flipping module 4 and the assembly module 5 to transport diodes for mounting. However, in actual operation, if the motion control precision of the transport module 6 is insufficient or there is unnecessary shaking during transport, it may cause positioning deviation of the diodes, thereby affecting the accuracy and efficiency of mounting. This problem is particularly prominent in scenarios requiring high-precision mounting.

[0062] Reference Figure 6 and Figure 7 In this regard, this application further proposes that the aforementioned handling module 6 includes a Y-axis drive rail 61, an X-axis drive rail 62 slidably mounted on the Y-axis drive rail 61, and a pneumatic suction claw 63 slidably mounted on the X-axis drive rail 62; a sliding guide beam 64 is arranged in parallel on one side of the Y-axis drive rail 61, and two limiting blocks 641 are spaced apart on the sliding guide beam 64; one end of the X-axis drive rail 62 is slidably engaged with the sliding guide beam 64, and the X-axis drive rail 62 can move to be engaged between the two limiting blocks 641 to limit the displacement of the X-axis drive rail 62 along the Y-axis direction.

[0063] Reference Figure 6 and Figure 7 Specifically, the Y-axis drive rail 61 consists of a linear guide rail and a drive mechanism. The linear guide rail is a synchronous belt guide rail, and the drive mechanism is a servo motor. Its main function is to provide precise linear motion along the Y direction for the handling module 6. The X-axis drive rail 62 is similar to the Y-axis drive rail 61, also consisting of a linear guide rail and a drive mechanism, and is slidably mounted on the Y-axis drive rail 61. Its function is to provide precise linear motion along the X direction for the handling module 6. Working in conjunction with the Y-axis drive rail 61, it achieves two-dimensional motion in the plane, thereby covering the mounting area. The sliding guide beam 64 is a linear guide rail structure. This sliding guide beam 64 is arranged parallel to the Y-axis drive rail 61, providing additional sliding support and guidance for the X-axis drive rail 62. The limiting block 641 is a block-shaped structure made of elastic polyurethane (urethane rubber). Two limiting blocks 641 are spaced apart on the sliding guide beam 64. Their function is to provide buffering and precise mechanical limiting when the X-axis drive rail 62 moves to a specific position, through contact with the X-axis drive rail 62, thereby preventing excessive displacement or shaking of the X-axis drive rail 62 in the Y-axis direction. In this embodiment, when the X-axis drive rail 62 moves to the preset handling station, one end is precisely guided and locked between the two limiting blocks 641, thereby precisely locking the position of the X-axis drive rail 62 in the Y-axis direction during the mounting operation, effectively eliminating its degree of freedom in the Y-axis direction, and ensuring accurate alignment when handling diodes.

[0064] Through the above technical solution, the handling module 6 adopts a two-dimensional motion structure composed of a Y-axis drive rail 61 and an X-axis drive rail 62, enabling flexible and precise positioning of the diode transfer and mounting within a plane. When the X-axis drive rail 62 moves to the picking position above the flipping claw 43, it can precisely engage between the two limiting blocks 641. This effectively restricts the displacement of the X-axis drive rail 62 along the Y-axis at the critical moment when the diode is transferred from the flipping claw 43, greatly enhancing stability and positioning accuracy, thereby avoiding alignment deviations caused by shaking or inaccurate positioning of the handling module 6.

[0065] The pneumatic suction claw 63 included in the above-mentioned handling module 6 has an arc-shaped picking part 631 recessed at the suction end. The arc-shaped picking part 631 is used to accommodate and fit the cylindrical body of the diode during picking.

[0066] Specifically, the arc-shaped material-grabbing part 631 refers to the material-grabbing surface of the pneumatic suction claw 63 that contacts the diode, designed as a groove shape adapted to the outer contour of the diode body. In this embodiment, the suction end is located at the bottom of the pneumatic suction claw 63, and the arc-shaped material-grabbing part 631 is recessed at the suction end with its opening facing the assembly module 5 along the positive Y-axis. The arc-shaped material-grabbing part 631 is used to accommodate and conform to the cylindrical body of the diode during material grabbing. This means that the arc-shaped material-grabbing part 631 can partially wrap around the cylindrical body of the diode and make its surface in close contact with the arc-shaped inner wall of the pneumatic suction claw 63. This design increases the adsorption contact area and improves the adsorption airtightness, so that the diode can be stably fixed on the pneumatic suction claw 63 under the action of pneumatic adsorption, and is not prone to shaking or falling off.

[0067] By recessing an arc-shaped picking section 631 at the picking end of the pneumatic suction claw 63, and using it to accommodate and adhere to the cylindrical body of the diode during picking, this application effectively solves the problems of small contact area and unstable adsorption when traditional planar suction cups pick up cylindrical diodes. This shape-matching design significantly increases the contact area and adhesion between the suction claw and the diode, allowing the pneumatic adsorption force to act more evenly and effectively on the cylindrical surface of the diode. Therefore, during the high-speed, high-precision transfer of diodes by the handling module 6, it ensures that the diode is stably and firmly adsorbed, greatly reducing the risk of diode slippage, detachment, or damage during transfer, thereby improving the diode mounting accuracy and the overall operating efficiency of the equipment.

[0068] Reference Figure 8 and Figure 9 The assembly module 5 includes a fixture conveying unit 51 mounted on the workbench 1 and a mounting fixture 52 slidably mounted on the fixture conveying unit 51. The fixture conveying unit 51 has a limiting area 511 for limiting the mounting fixture 52. The mounting fixture 52 has a mounting groove 521 for mounting a circuit board. One end of the mounting groove 521 has a pressing area 522 for mounting a diode. The pressing area 522 is provided with a magnetic suction member 53 for attracting the diode leads to the circuit board. When the mounting fixture 52 is located in the limiting area 511, the transport module 6 works to transfer the diode and mount it onto the circuit board in the pressing area 522.

[0069] Reference Figure 8 and Figure 9In this embodiment, the workbench 1 also includes a frame 12 located at one end of the substrate 11; a fixture conveying unit 51 is mounted on the frame 12, and the function of the fixture conveying unit 51 is to automatically convey and install the fixture 52. Specifically, the fixture conveying unit 51 includes a conveyor belt 512 mounted on the frame 12 along the X-axis direction, a conveyor motor 513 for driving the conveyor belt 512, and a drive roller 514 for driving the conveyor belt 512. The conveyor motor 513 is fixedly mounted on the frame 12, and the drive roller 514 is rotatably mounted on the frame 12 through a bearing seat. The conveyor belt 512 is sleeved on the drive roller 514. The conveyor motor 513 works to drive the drive roller 514 to rotate, thereby driving the conveyor belt 512 to convey and install the fixture 52 along the X-axis direction. It is worth mentioning that the fixture conveying unit 51 also includes a tensioning wheel 515 slidably mounted on the frame 12 along the X-axis. The tensioning wheel 515 is mounted on a slidable mounting base via bearings. The mounting base can be adjusted in position along the guide rail on the frame 12; its structure will not be described in detail here. By adjusting the horizontal position of the tensioning wheel 515, the tension of the conveyor belt 512 can be changed, effectively compensating for the loosening and deformation of the conveyor belt 512 caused by long-term use, and avoiding problems such as transmission slippage and deviation.

[0070] Reference Figure 8 and Figure 9The limiting area 511 on the fixture transport unit 51 is designed to ensure that the mounting fixture 52 can be accurately fixed when it arrives at the placement station, thereby providing a reliable reference position for subsequent diode placement. The mounting fixture 52 is slidably mounted on the fixture transport unit 51, and its main function is to support the circuit board to be placed. The mounting fixture 52 is a tray customized according to the size and shape of the circuit board and is made of high-strength plastic. The mounting groove 521 on the mounting fixture 52 is shaped and sized to match the circuit board, ensuring that the circuit board can be placed stably and accurately. In order to effectively fix the diode leads to the circuit board during the placement process, a magnetic suction element 53 is also provided in the pressing area 522. Specifically, in this embodiment, since the circuit board product is a structure of five circuit boards connected in parallel during processing, it needs to be cut and separated after mounting and soldering processes. Therefore, to meet the structural requirements of the five circuit boards in parallel, five support platforms 524 are provided in parallel along the X-axis direction in the bottom of the mounting groove 521. Each support platform 524 has a corresponding magnetic suction component 53 fixedly installed inside. In this embodiment, the magnetic suction component 53 is a permanent magnet. The height of the support platform 524 in the Z-axis direction is not higher than the groove opening of the mounting groove 521. When the circuit board is supported on the support platform 524, the upper surface of the circuit board is flush with the groove opening of the mounting groove 521. In this embodiment, the magnetic force generated by the magnetic suction component 53 attracts the metal leads of the diode to the corresponding pads of the circuit board, preventing the diode from shifting after the transport module 6 leaves or in subsequent processes, thereby ensuring the accuracy of mounting. Once the mounting fixture 52 is transported to the limiting area 511 by the fixture transport unit 51 and precisely limited, the transport module 6 begins to work. The transport module 6 picks up the diode that has been flipped to a horizontal state from the flipping module 4 and transfers it to the pressing area 522 of the circuit board on the mounting fixture 52. Then the magnetic suction component 53 plays its role, firmly attaching the diode's pins to the circuit board, completing the initial fixing and mounting of the diode.

[0071] Through the above technical solution, the assembly module 5 achieves automated carrying and transport of the circuit board through the cooperation of the fixture transport unit 51 and the mounting fixture 52. When the mounting fixture 52 is precisely positioned in the limiting area 511, the position of the circuit board is reliably fixed, providing a stable reference for subsequent diode mounting. The mounting slot 521 and the pressing area 522 on the mounting fixture 52 ensure the correct placement of the circuit board and diode, while the magnetic suction element 53 in the pressing area 522 can effectively attract and fix the diode leads to the circuit board, preventing displacement during the mounting process. Furthermore, in the prior art, after the automatic mounting equipment mounts the diode onto the circuit board, the fixture with the circuit board is transported to the subsequent soldering station for reflow soldering. During this process, the leads inevitably shift to some extent, causing the leads to not adhere well to the solder paste on the circuit board, resulting in lead floating during reflow soldering. In this application, the diode leads are stably attached to the circuit board by magnetic attachment 53. This design not only enables the handling module 6 to accurately transfer and mount the diode to the predetermined position, significantly improving the accuracy and efficiency of diode mounting, but also facilitates subsequent reflow soldering, effectively reducing the occurrence of lead floating and cold solder joints.

[0072] The overall process of diode assembly, from sorting to flipping, handling, and mounting is as follows: After the sorting base 32 slides to the discharge position 35 and is detected by the laser sensor, the flipping claw 43 slides along the Y-axis and moves to be aligned with the horizontal picking claw 33 of the sorting module 3, completing the alignment. Then, the horizontal picking claw 33 maintains its adsorption state on the diode and moves above the clamping position of the flipping claw 43, slowly lowering itself to align the diode's leads with the flipping claw 43. The flipping claw 43 closes and clamps the diode's leads. After clamping, the vacuum generator of the horizontal picking claw 33 breaks the vacuum, releasing the diode and resetting it along the X-axis to the receiving position 34, awaiting the next picking action. Next, the drive source 41 starts, driving the rotating shaft 42 to rotate 90°. The flipping claw 43 rotates synchronously, flipping the diode from a vertical position with the leads facing down to a horizontal position. After flipping, the flipping claw 43 slides along the positive Y-axis towards the assembly module 5 until it reaches the preset handling position. At this time, the conveying module 6 is started, and its X-axis drive rail 62 slides along the Y-axis drive rail 61, driving the pneumatic suction claw 63 to move to directly above the flipping claw 43. Then, the pneumatic suction claw 63 moves down and uses the arc-shaped picking part 631 of the suction end to fit against the cylindrical body of the diode. The vacuum generator is started to generate negative pressure, firmly adsorbing the diode. At the same time, the flipping claw 43 releases the clamp on the diode pin. After adsorption is in place, the pneumatic suction claw 63 slides along the negative X-axis towards the dispensing module 3 to remove the diode. The flipping claw 43 resets to the initial position, ready to receive the diode from the dispensing module 3 next time. Finally, under the coordinated drive of the X-axis drive rail 62 and the Y-axis drive rail 61, the pneumatic suction claw 63 transports the adsorbed diode to the limit area 511 above the assembly module 5, aligns it with the circuit board pad of the pressing area 522 of the mounting fixture 52, and slowly descends to precisely press the diode into the corresponding position. The magnetic suction component 53 in the pressing area 522 immediately adsorbs the diode pin to complete the pre-fixation. Then, the pneumatic suction claw 63 breaks the vacuum and resets, completing the core process of material sorting, flipping, handling and mounting.

[0073] Reference Figure 8 and Figure 9 The fixture conveying unit 51 further includes an abutment component 54 and a lifting and limiting component 55. The abutment component 54 is disposed at the edge of the limiting area 511 and is used to limit the installation fixture 52 in the horizontal direction. The lifting and limiting component 55 is disposed within the limiting area 511 and is used to lift and clamp the installation fixture 52 that has reached the limiting area 511 upward and limit it.

[0074] Reference Figure 8 and Figure 9The lifting and limiting assembly 55 includes a lifting assembly 551 fixed on the frame 12 within the limiting area 511 and a limiting top plate 552 fixedly installed on the frame 12 and located above the conveyor belt 512. The lifting assembly 551 lifts the mounting fixture 52 that has reached the limiting area 511 upwards to abut against the lower surface of the limiting top plate 552, thereby achieving clamping and limiting of the mounting fixture 52. Specifically, the lifting assembly 551 includes a lifting cylinder 5511, a lifting plate 5512, and guide columns 5513 arranged along the Z-axis. The lifting cylinder 5511 is fixedly installed on the frame 12 below the limiting area 511. The lifting plate 5512 is horizontally arranged and fixedly installed on the top of the piston rod of the lifting cylinder 5511. Multiple guide columns 5513 are fixedly installed on the frame 12 along the Z-axis and slidably connected to the lifting plate 5512. It is worth mentioning that four positioning posts 5514 arranged in parallel along the Z-axis are also provided on the upper surface of the lifting plate 5512. Correspondingly, four positioning slots (not shown in the figure) are provided on the lower surface of the mounting fixture 52. The lifting cylinder 5511 works and drives the lifting plate 5512 to slide on the guide post 5513 and rise. The positioning posts 5514 on the lifting plate 5512 are inserted into the positioning slots of the mounting fixture 52 one by one to further improve the positioning accuracy of the mounting fixture 52.

[0075] In actual operation, when the mounting fixture 52 is conveyed to the limiting area, it has a certain speed. If the lifting and limiting component 55 is used to lift and clamp the mounting fixture 52, the positional accuracy of the mounting fixture 52 is insufficient, affecting the accuracy and stability of subsequent diode mounting. Therefore, this embodiment introduces an abutment component 54 to limit the mounting fixture 52 in the horizontal direction. The fixture conveying unit 51 has a loading side and a unloading side in the X-axis direction, and the abutment component 54 is set on the frame 12 near the unloading side edge of the limiting area 511. When the mounting fixture 52 enters the limiting area 511, the abutment component 54 contacts the side edge of the mounting fixture 52, thereby preventing or limiting the further movement of the mounting fixture 52 in the horizontal plane, ensuring that it reaches the preset limiting area 511 in the horizontal plane.

[0076] Reference Figure 9 and Figure 10 Specifically, the abutment component 54 includes a buffer seat 541 and a lever 542 hinged within the buffer seat 541; the lever 542 has an impact-receiving end 5421 extending out of the buffer seat 541 and a damping end 5422 extending into the buffer seat 541; the impact-receiving end 5421 can collide with the mounting fixture 52 and press the damping end 5422 into the buffer seat 541, thereby absorbing the impact kinetic energy of the mounting fixture 52.

[0077] Reference Figure 9 and Figure 10The abutment assembly 54 also includes a lifting cylinder 543 fixedly mounted on the frame 12. The piston rod of the lifting cylinder 543 is vertically upward along the Z-axis, and the buffer seat 541 is fixedly mounted on the top of the piston rod of the lifting cylinder 543. In this embodiment, the lifting cylinder 543 is a vertically mounted linear drive cylinder that can drive the buffer seat 541 and the lever 542 mounted on the buffer seat 541 to move vertically. When the cylinder is in the extended state, the buffer seat 541 and the lever 542 rise to the working height, and the lever 542 can interfere with the movement path of the mounting fixture 52 to achieve buffering and deceleration of the mounting fixture 52. When the cylinder is in the retracted state, the buffer seat 541 and the lever 542 descend with the piston rod to the clearance height, and the lever 542 completely exits the movement path of the mounting fixture 52, providing clearance space for the mounting fixture 52 to avoid structural interference.

[0078] Reference Figure 9 and Figure 10 A hinge shaft 5411 is fixedly inserted through the buffer seat 541 along the Y-axis direction. A lever 542 is rotatably mounted on the hinge shaft 5411. A return spring (not shown in the figure) is sleeved on the hinge shaft 5411. The lever 542 forms a lever structure with the hinge shaft 5411 as the fulcrum. The lever 542 includes two functional ends: an impact end 5421 and a damping end 5422. The damping end 5422 is provided with a groove. A damping cavity is vertically opened on the buffer seat 541. A spring (not shown in the figure) is installed at the bottom of the damping cavity. A buffer rod 5412 is slidably connected inside the damping cavity. The top of the buffer rod 5412 slidably abuts against the groove of the damping end 5422. When the mounting fixture 52 moves at a set speed and collides with the impact end 5421, the mounting fixture 52 applies an impact force to the impact end 5421. The lever 542 rotates around the hinge shaft 5411, overcoming the return torque of the return spring, causing the damping end 5422 to rotate towards the buffer rod 5412. This causes the buffer rod 5412 to move into the damping cavity inside the buffer seat 541, pressing the buffer rod 5412 into the buffer seat 541 and compressing the spring in the damping cavity. During this process, the impact kinetic energy of the mounting fixture 52 is transmitted to the damping end 5422 through the lever 542 and absorbed by the compression deformation of the spring, achieving buffering and deceleration of the mounting fixture 52 and reducing impact vibration. In actual operation, when the abutment component 54 descends to avoid the mounting fixture 52, the spring and return spring reset and drive the buffer rod 5412 and the damping end 5422 to rise, thereby resetting the lever 542 and preparing for the next abutment and limiting operation.

[0079] In this embodiment, the impact-receiving end 5421 has a wheel-shaped structure, and the impact-receiving end 5421 rolls with the side edge of the mounting fixture 52 to reduce the frictional resistance between the impact-receiving end 5421 and the mounting fixture 52. When the mounting fixture 52 moves at high speed to the buffer position, the side edge of the mounting fixture 52 first contacts the roller surface of the wheel-shaped impact-receiving end 5421. Since the roller can rotate freely around the axle, the original sliding friction is transformed into rolling friction, which can significantly reduce the frictional resistance between the impact-receiving end 5421 and the mounting fixture 52. On the one hand, it can avoid scratches and wear on the side edge of the mounting fixture 52 due to sliding friction, protecting the mounting fixture 52 and the diode mounting accuracy; on the other hand, it can reduce the interference of frictional resistance on the movement trajectory of the mounting fixture 52, ensuring a smooth and controllable buffer deceleration process, while reducing the noise generated by friction and extending the service life of the impact-receiving end 5421 and the mounting fixture 52, which is especially suitable for scenarios where the mounting fixture 52 moves at high speed.

[0080] In another embodiment, to further enhance the positioning effect of the abutment component 54, the impact-receiving end 5421 is made of magnetic material, and a metal anti-collision vertical plate 523 is fixed to the side edge of the mounting fixture 52. The impact-receiving end 5421 and the anti-collision vertical plate 523 are magnetically attracted and positioned. Specifically, a permanent magnet is selected as the magnetic material, and correspondingly, the metal anti-collision vertical plate 523 is made of steel material that can be magnetically attracted. The metal anti-collision vertical plate 523 is fixedly connected to the side edge of the mounting fixture 52 by bolts, and its installation position corresponds to that of the impact-receiving end 5421 to ensure that the impact-receiving end 5421 and the metal anti-collision vertical plate 523 can be precisely magnetically attracted and engaged.

[0081] In another embodiment, the impact-receiving end 5421 is made of a flexible material, such as silicone, rubber, or polyurethane, which have good elasticity and cushioning properties. When the mounting fixture 52 collides with the impact-receiving end 5421, the flexible material end 5421 undergoes elastic deformation. On the one hand, it can further absorb the impact force of the mounting fixture 52, forming a double buffering effect with the spring in the damping cavity, further reducing impact vibration and preventing vibration from being transmitted to the diode mounting station, thus ensuring mounting accuracy. On the other hand, the flexible material is soft and can avoid rigid collisions with the mounting fixture 52, preventing bumps and deformation of the side edges of the mounting fixture 52, while reducing noise generated by the collision and improving the stability and comfort of equipment operation.

[0082] Through the above technical solution, the fixture conveying unit 51 introduces an abutment component 54 and a lifting limiting component 55 within the limiting area 511, significantly improving the positioning accuracy and stability of the mounting fixture 52. The abutment component 54 effectively solves the problem of lateral deviation that may occur during the conveying process by precisely limiting the mounting fixture 52 in the horizontal direction. At the same time, the lifting limiting component 55 lifts and clamps the mounting fixture 52 from the conveying surface, further enhancing the overall rigidity and stability of the mounting fixture 52 during the placement process. This dual limiting mechanism ensures that the mounting fixture 52 is in a precise and stable position during diode placement, so that the transport module 6 can accurately place the diode onto the circuit board pads of the pressing area 522.

[0083] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. An automatic diode mounting device, characterized in that, include: Workbench (1); Vibration feeding module (2) is fixedly installed on the workbench (1) and is used to screen and output diodes with pins facing down in a vertical state by vibration; The material distribution module (3) is slidably mounted on the worktable (1) for transferring diodes from the vibrating feeding module (2); A flip module (4) is installed on the workbench (1) and located downstream of the material distribution module (3) for receiving diodes from the material distribution module (3) and flipping the diodes. Assembly module (5) is installed on the workbench (1) to support the circuit board for diode mounting; The transport module (6) is slidably mounted between the flip module (4) and the assembly module (5) for transporting the diode to the assembly module (5) for mounting. The flipping module (4) includes a drive source (41), a rotating shaft (42) connected to the drive source (41), and a flipping claw (43) for holding diode pins. The flipping claw (43) is fixedly mounted on the rotating shaft (42). The drive source (41) drives the rotating shaft (42) to rotate the flipping claw (43), so that the diode flips from a vertical state to a horizontal state. The assembly module (5) includes a jig transport unit (51) mounted on the workbench (1) and an mounting jig (52) slidably mounted on the jig transport unit (51). The conveying unit (51) has a limiting area (511) for limiting the mounting fixture (52); the mounting fixture (52) has a mounting groove (521) for mounting a circuit board, one end of the mounting groove (521) has a pressing area (522) for mounting a diode, and the pressing area (522) is provided with a magnetic suction element (53) for attracting the diode pins to the circuit board; when the mounting fixture (52) is located in the limiting area (511), the transport module (6) works to transfer the diode and mount it onto the circuit board in the pressing area (522).

2. The diode automatic mounting equipment according to claim 1, characterized in that, The assembly module (5) also includes: An abutment component (54) is disposed at the edge of the limiting area (511) for limiting the mounting fixture (52) in the horizontal direction; A lifting and limiting component (55) is disposed within the limiting area (511) and is used to lift and clamp the mounting fixture (52) that has reached the limiting area (511) upward.

3. The diode automatic mounting equipment according to claim 2, characterized in that, The abutment assembly (54) includes a buffer seat (541) and a lever (542) hinged within the buffer seat (541); the lever (542) has a strike-receiving end (5421) extending out of the buffer seat (541) and a damping end (5422) extending into the buffer seat (541); when the mounting fixture (52) is located in the limiting area (511), the strike-receiving end (5421) can collide with the mounting fixture (52) and press the damping end (5422) into the buffer seat (541) to absorb the collision kinetic energy of the mounting fixture (52).

4. The diode automatic mounting equipment according to claim 3, characterized in that, The impact-receiving end (5421) has a wheel-shaped structure. When the mounting fixture (52) is located in the limiting area (511), the impact-receiving end (5421) rolls with the side edge of the mounting fixture (52).

5. The diode automatic mounting equipment according to claim 3, characterized in that, The impacted end (5421) is made of a flexible material.

6. The diode automatic mounting equipment according to claim 3, characterized in that, The impact-receiving end (5421) is made of magnetic material, and a metal anti-collision vertical plate (523) is fixed on the side edge of the mounting fixture (52). When the mounting fixture (52) is located in the limiting area (511), the impact-receiving end (5421) and the anti-collision vertical plate (523) are magnetically attracted and positioned.

7. The diode automatic mounting equipment according to claim 1, characterized in that, The conveying module (6) includes a Y-axis drive rail (61), an X-axis drive rail (62) slidably mounted on the Y-axis drive rail (61), and a pneumatic suction claw (63) slidably mounted on the X-axis drive rail (62). A sliding guide beam (64) is arranged in parallel on one side of the Y-axis drive rail (61), and two limiting blocks (641) are spaced apart on the sliding guide beam (64). One end of the X-axis drive rail (62) is slidably engaged with the sliding guide beam (64), and the X-axis drive rail (62) can move to be engaged between the two limiting blocks (641) to limit the displacement of the X-axis drive rail (62) along the Y-axis direction.

8. The diode automatic mounting equipment according to claim 7, characterized in that, The pneumatic suction claw (63) has an arc-shaped picking part (631) recessed at the suction end. The arc-shaped picking part (631) is used to accommodate and fit the cylindrical body of the diode during picking.

9. An automatic diode mounting device according to any one of claims 1-8, characterized in that, The material distribution module (3) includes a material distribution base (31) fixedly installed on the workbench (1), a material distribution seat (32) slidably installed on the material distribution base (31), and a horizontal picking claw (33) slidably installed on the workbench (1); the material distribution seat (32) is provided with a receiving groove (321) for accommodating a single diode, the material distribution seat (32) reciprocates between the receiving position (34) and the discharge position (35), and the horizontal picking claw (33) is used to transfer the diode from the receiving groove (321) located at the discharge position (35) to the flipping claw (43).

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