Electronic device and method of manufacturing the same
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- INNOLUX CORP
- Filing Date
- 2025-08-21
- Publication Date
- 2026-08-07
Smart Images
Figure CN122534846A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to an electronic device and a method for manufacturing the same, and more particularly to an electronic device and a method for manufacturing the same that can reduce the number of transfers of electronic components to be connected in series or improve the utilization rate of electronic components on a carrier board. Background Technology
[0002] Electronic devices, or spliced electronic devices, are widely used in various fields such as communications, displays, automotive, and aerospace. With the rapid development of electronic devices, they are trending towards thinner and lighter designs, thus placing higher demands on their reliability and quality. Summary of the Invention
[0003] This disclosure relates to an electronic device and a method for manufacturing the same, which can reduce the number of transfers of electronic components to be connected in series or improve the utilization rate of electronic components on a carrier board.
[0004] According to embodiments disclosed herein, a method for manufacturing an electronic device includes the following steps: providing a carrier board and a plurality of electronic components disposed on the carrier board, wherein the plurality of electronic components include a first electronic component and a second electronic component; providing a circuit board, wherein the circuit board includes a plurality of series-connected pad assemblies, one of the plurality of series-connected pad assemblies including a first pad, a second pad, a third pad, and a fourth pad, the second pad being electrically connected to the third pad; simultaneously picking up the first electronic component and the second electronic component; and simultaneously transferring the first electronic component and the second electronic component onto the circuit board. The first electronic component is correspondingly disposed on the first pad and the second pad, and the second electronic component is correspondingly disposed on the third pad and the fourth pad, and the first electronic component and the second electronic component are connected in series with each other.
[0005] According to embodiments disclosed herein, an electronic device includes a circuit board and a plurality of electronic components. The circuit board has a first unit and a second unit. The circuit board includes a substrate and a circuit layer disposed on the substrate. The circuit layer includes a first pad, a second pad, a third pad, and a fourth pad. The second pad is electrically connected to the third pad. The plurality of electronic components are disposed on the circuit board. The plurality of electronic components include a first electronic component, a second electronic component, and a third electronic component. The first electronic component is disposed on the first and second pads in the first unit. The second electronic component is disposed on the third and fourth pads in the first unit. The third electronic component is disposed on the first and second pads in the second unit. The first and third pads of the first unit are separated by a first distance D1 in the first direction, and the first pads of the first unit and the first pads of the second unit are separated by a second distance D2 in the first direction. The first distance D1, the second distance D2, and the parameter R1 conform to the following relationships: R1 × M1 × 0.9 ≦ D1 ≦ R1 × M1 × 1.1; and R1 × M2 × 0.9 ≦ D2 ≦ R1 × M2 × 1.1. M1 and M2 are positive integers, and M1 is less than M2. Attached Figure Description
[0006] Figures 1 to 3 This is a top view schematic diagram of a method for manufacturing an electronic device according to the first embodiment of this disclosure;
[0007] Figure 4 From Figure 1 The position and order in which electronic components are picked up from the carrier board;
[0008] Figure 5 This is a top view schematic diagram of the electronic device according to the second embodiment of this disclosure;
[0009] Figure 6A for Figure 5 A cross-sectional schematic diagram of the electronic device along section line I-I'.
[0010] Figure 6B for Figure 5 A cross-sectional schematic diagram of the electronic device along section line II-II';
[0011] Figure 6C for Figure 5 A cross-sectional schematic diagram of the electronic device along section line III-III';
[0012] Figure 6D for Figure 5 A schematic cross-sectional view of the electronic device along section line IV-IV';
[0013] Figure 7 From Figure 5 The position and sequence of picking up electronic components from a carrier board in the manufacturing process of electronic devices;
[0014] Figure 8 This is a partial top view of the electronic device according to the third embodiment of this disclosure;
[0015] Figure 9 This is a partial top view of the electronic device according to the fourth embodiment of this disclosure.
[0016] Explanation of icon numbers
[0017] 10, 10a, 10b, 10c: Electronic devices
[0018] 100, 100a: Carrier plate
[0019] 200, 400, 500: Electronic components
[0020] 210: First electronic component
[0021] 220: Second electronic component
[0022] 230: Third electronic component
[0023] 240: Fourth electronic component
[0024] 300, 300a, 300b: Circuit board
[0025] 310: Substrate
[0026] 320, 320a: Circuit layer
[0027] 322, 322b: Series connection pad assembly
[0028] 3221: First bonding pad
[0029] 3222: Second bonding pad
[0030] 3223: Third joint pad
[0031] 3224: Fourth bonding pad
[0032] 3225: Fifth bonding pad
[0033] 3226: Sixth connector pad
[0034] 3227: Seventh Connector Pad
[0035] 3228: Eighth connecting pad
[0036] 324, 324a, 324b: Series circuit combinations
[0037] 3241: Route 1
[0038] 3242: Second Line
[0039] 3243: Third Line
[0040] 3244: Fourth Line
[0041] 3245: Route 5
[0042] 3246: Route 6
[0043] 3247: Route 7
[0044] 326: Insulation layer
[0045] BSU1: First Spare Subunit
[0046] BSU2: Second Backup Subunit
[0047] BSU3: Third Backup Subunit
[0048] D1: First Distance
[0049] D2: Second Distance
[0050] D3: Third Distance
[0051] D4: Fourth Distance
[0052] L1: First Length
[0053] NT: Non-transparent area
[0054] R1, R2: Parameters
[0055] RA1: First Repair Zone
[0056] RA2: Second Repair Zone
[0057] SU1: First Subunit
[0058] SU2: Second Subunit
[0059] SU3: Third Subunit
[0060] T1, T2: Transparent areas
[0061] U1: Unit 1
[0062] U2: Unit 2
[0063] U3: Unit 3
[0064] U4: Unit 4
[0065] W1: First width
[0066] X: Second direction
[0067] Y: First direction
[0068] Z: Third-party direction Detailed Implementation
[0069] This disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the drawings in this disclosure depict only a portion of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.
[0070] In the following description and claims, the words “containing” and “including” are open-ended terms, and therefore should be interpreted as “containing but not limited to…”.
[0071] It should be understood that when an element or membrane is referred to as being "on" or "connected" to another element or membrane, it can be directly on or directly connected to that other element or membrane, or there may be an inserted element or membrane between them (indirect cases). Conversely, when an element is referred to as being "directly" on or "directly connected" to another element or membrane, there may be no inserted element or membrane between them.
[0072] Although the terms "first," "second," "third," etc., can be used to describe multiple components, the components are not limited to these terms. These terms are used only to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but rather replaced by "first," "second," "third," etc., according to the order in which the elements are declared in the claims. Therefore, in the following description, a first component may be a second component in the claims.
[0073] In this text, the terms "about," "approximately," "substantively," and "roughly" typically indicate that a given value or range is within 10%, 5%, 3%, 2%, 1%, or 0.5%. The given quantity is an approximate quantity; that is, even without specific mention of "about," "approximately," "substantively," or "roughly," the meaning of "about," "approximately," "substantively," or "roughly" can still be implied.
[0074] In some embodiments disclosed herein, terms such as "connection" and "interconnection," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, wherein another structure is disposed between the two structures. Furthermore, these terms regarding engagement and connection may also include situations where both structures are movable or both structures are fixed. In addition, the term "coupled" encompasses any direct and indirect connection means.
[0075] In some embodiments disclosed herein, an optical microscope (OM), a scanning electron microscope (SEM), an alpha-step thickness gauge, an ellipsometry, or other suitable methods can be used to measure the area, width, thickness, or height of each element, or the distance or spacing between elements. More specifically, according to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional image containing the elements to be measured, and to measure the area, width, thickness, or height of each element, or the distance or spacing between elements.
[0076] In this disclosure, the electronic device may include a display device (including a transparent display device), a light-emitting device, a backlight device, a virtual reality device, an augmented reality (AR) device, an antenna device, a sensing device, a splicing device, or any combination thereof, but is not limited thereto. The display device may be a non-self-emissive display or a self-emissive display, and may be a color display or a monochrome display, depending on the requirements. The antenna device may be a liquid crystal type antenna device or a non-liquid crystal type antenna device; the sensing device may be a sensing device that senses capacitance, light, heat, or ultrasound; and the splicing device may be a display splicing device or an antenna splicing device, but is not limited thereto. Electronic components in the electronic device may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited thereto. Transistors may include, for example, top-gate thin-film transistors, bottom-gate thin-film transistors, or dual-gate thin-film transistors, but are not limited thereto. Electronic devices may also include fluorescent materials, phosphorescent materials, quantum dot (QD) materials, or other suitable materials as needed, but are not limited thereto. Electronic devices may have peripheral systems such as drive systems, control systems, light source systems, etc., to support display devices, antenna devices, wearable devices (e.g., augmented reality or virtual reality devices), automotive devices (e.g., automotive windshields), or splicing devices. It should be noted that electronic devices can be any combination of the foregoing, but are not limited thereto. The following description uses electronic devices as examples to illustrate the content of this disclosure, but this disclosure is not limited thereto.
[0077] It should be understood that the features in the following embodiments can be replaced, recombined, or mixed to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.
[0078] Reference will now be made in detail to the exemplary embodiments disclosed herein, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.
[0079] Figures 1 to 3This is a top view schematic diagram of a method for manufacturing an electronic device according to the first embodiment of this disclosure. Figure 4 From Figure 1 The position and order in which electronic components are picked up from the carrier board.
[0080] The manufacturing method of the electronic device 10 in this embodiment may include the following steps:
[0081] First, please refer to Figure 1 The system provides a carrier board 100 and a plurality of electronic components 200. Specifically, it may be, for example, a COW (chip-on-wafer) or COC (chip-on-carrier). In this embodiment, the carrier board 100 may include a rigid carrier board, a flexible carrier board, or a combination thereof. For example, the material of the carrier board 100 may include glass, quartz, sapphire, ceramic, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), other suitable carrier board materials, or combinations thereof, but is not limited thereto.
[0082] Multiple electronic components 200 are disposed on the carrier plate 100, and the multiple electronic components 200 can be used, for example, to provide light of the same color. In this embodiment, the multiple electronic components 200 are arranged on the carrier plate 100 in an array of 8×14, but are not limited thereto. In this embodiment, the multiple electronic components 200 can be red light-emitting elements, green light-emitting elements, or blue light-emitting elements, but are not limited thereto.
[0083] The plurality of electronic components 200 includes a first electronic component 210, a second electronic component 220, a third electronic component 230, and a fourth electronic component 240. One of the plurality of electronic components 200 has a first length L1 in a first direction Y, and one of the plurality of electronic components 200 has a first width W1 in a second direction X. The first length L1 can be the maximum length of the electronic component 200 measured along the first direction Y, and the first width W1 can be the maximum width of the electronic component 200 measured along the second direction X.
[0084] In this embodiment, parameter R1 can be the distance measured along the first direction Y between the first repeating features of two adjacent electronic components 200 (e.g., adjacent first electronic component 210 and second electronic component 220) on the carrier board 100, and parameter R2 can be the distance measured along the second direction X between the first repeating features of two adjacent electronic components 200 on the carrier board 100, but is not limited thereto. In this embodiment, "adjacent" means that there are no other identical components between two identical components, and "first repeating feature" can be, for example, the center-to-center or edge-to-edge distance between two adjacent electronic components on the carrier board, but is not limited thereto.
[0085] In this embodiment, parameter R1 can be greater than the first length L1 but less than 3 times the first length L1 (i.e., L1 < R1 < 3 × L1), and parameter R2 can be greater than the first width W1 but less than 3 times the first width W1 (i.e., W1 < R2 < 3 × W1), so that multiple electronic components 200 can be arranged closely on the carrier board 100 by effectively utilizing the space on the carrier board 100, but is not limited thereto. If parameter R1 is designed to be greater than or equal to 3 times the first length L1, or parameter R2 is designed to be greater than or equal to 3 times the first width W1, it may result in ineffective utilization of the space on the carrier board, thereby increasing manufacturing costs, or affecting the yield of electronic components manufactured on the carrier board.
[0086] In this embodiment, the first direction Y, the second direction X, and the third direction Z are different directions. For example, the first direction Y is... Figure 1 The extension direction of the first length L1 of the electronic component 200, and the second direction X, for example, are Figure 1 The first width W1 of the electronic component 200 extends in a direction where the third direction Z is, for example, the normal direction of the carrier plate 100. The first direction Y may be substantially perpendicular to the second direction X, and the first direction Y and the second direction X may each be substantially perpendicular to the third direction Z, but are not limited thereto.
[0087] Next, please continue to refer to Figure 1 A circuit board 300 is provided. Specifically, the circuit board 300 may have a first unit U1, a second unit U2, a third unit U3, and a fourth unit U4. The first unit U1 and the second unit U2 are arranged along a first direction Y, the third unit U3 and the fourth unit U4 are arranged along the first direction Y, and the first unit U1 and the third unit U3 are arranged along a second direction X. In addition, the first unit U1, the second unit U2, the third unit U3, and the fourth unit U4 each include a first sub-unit SU1, a second sub-unit SU2, and a third sub-unit SU3. The first sub-unit SU1, the second sub-unit SU2, and the third sub-unit SU3 are arranged along the second direction X.
[0088] The circuit board 300 may include a substrate 310 and a circuit layer 320. In this embodiment, the substrate 310 may include a rigid substrate, a flexible substrate, or a combination thereof. For example, the material of the substrate 310 may include glass, quartz, sapphire, ceramic, polycarbonate, polyimide, polyethylene terephthalate, other suitable substrate materials, or combinations thereof, but is not limited thereto.
[0089] A circuit layer 320 is disposed on a substrate 310. The circuit layer 320 includes a plurality of series pad assemblies 322 and a plurality of series line assemblies 324. The plurality of series pad assemblies 322 are disposed on the plurality of series line assemblies 324, and the plurality of series pad assemblies 322 and the plurality of series line assemblies 324 are located on different layers. One of the plurality of series pad assemblies 322 may include a first pad 3221, a second pad 3222, a third pad 3223, and a fourth pad 3224. One of the plurality of series line assemblies 324 may include a first line 3241, a second line 3242, a third line 3243, and a fourth line 3244. The first pad 3221, the second pad 3222, the third pad 3223, and the fourth pad 3224 are electrically connected to the first line 3241, the second line 3242, the third line 3243, and the fourth line 3244, respectively. The first pad 3221, the second pad 3222, the third pad 3223, and the fourth pad 3224 can overlap the first line 3241, the second line 3242, the third line 3243, and the fourth line 3244 respectively in the third direction Z.
[0090] The second pad 3222 can be electrically connected to the third pad 3223. For example, in this embodiment, the second line 3242 can contact and be electrically connected to the third line 3243, and the second pad 3222 can be electrically connected to the third pad 3223 through the second line 3242 and the third line 3243, and the second pad 3222 and the third pad 3223 are separate from each other, but are not limited thereto. The second line 3242 and the third line 3243 can, for example, be the same line corresponding to two parts of the second pad 3222 and the third pad 3223 respectively, but are not limited thereto.
[0091] Then, please refer to Figure 2 Simultaneously, the first electronic component 210, the second electronic component 220, the third electronic component 230, and the fourth electronic component 240 are picked up from the carrier board 100; and the picked-up first electronic component 210, second electronic component 220, third electronic component 230, and fourth electronic component 240 are transferred to the circuit board 300.
[0092] Specifically, after the pickup and transfer steps, the first electronic component 210 can be correspondingly disposed on the first pad 3221 and the second pad 3222 in the first sub-unit SU1 of the first unit U1; the second electronic component 220 can be correspondingly disposed on the third pad 3223 and the fourth pad 3224 in the first sub-unit SU1 of the first unit U1; the third electronic component 230 can be correspondingly disposed on the first pad 3221 and the second pad 3222 in the first sub-unit SU1 of the second unit U2; and the fourth electronic component 240 can be correspondingly disposed on the first pad 3221 and the second pad 3222 in the first sub-unit SU1 of the third unit U3. In this embodiment, the first electronic component 210 and the second electronic component 220 transferred to the circuit board 300 can be connected in series with each other. In this disclosure, each electronic component 200 has, for example, two types of electrodes (such as P-terminal and N-terminal). The first pad 3221 and the second pad 3222 correspond to different electrodes of the first electronic component 210, and the third pad 3223 and the fourth pad 3224 correspond to different electrodes of the second electronic component 220. The second pad 3222 and the third pad 3223 correspond to different electrodes of different electronic components, allowing the different electronic components to be connected in series. In this embodiment, the multiple electronic components connected in series can be driven by the same driving circuit. "Pads of a series pad combination" and "lines of a series line combination" refer to the pads and lines used to allow multiple electronic components to form a serial circuit, respectively.
[0093] In this embodiment, the first pad 3221 of the first unit U1 and the third pad 3223 of the first unit U1 are separated by a first distance D1 in the first direction Y, the first pad 3221 of the first unit U1 and the first pad 3221 of the second unit U2 are separated by a second distance D2 in the first direction Y, and the first pad 3221 of the first unit U1 and the first pad 3221 of the third unit U3 are separated by a third distance D3 in the second direction X. In this embodiment, the first distance D1 can be regarded as the minimum distance measured along the first direction Y between the second repeating features of two adjacent electronic components 200 (e.g., adjacent first electronic component 210 and second electronic component 220) in the first unit U1, the second distance D2 can be regarded as the minimum distance measured along the first direction Y between the second repeating features of two adjacent units (e.g., adjacent first unit U1 and second unit U2) in the circuit board 300, and the third distance D3 can be regarded as the minimum distance measured along the first direction Y between the second repeating features of two adjacent units (e.g., adjacent first unit U1 and third unit U3) in the circuit board 300. The "second repeating feature" can refer to the pad corresponding to the electronic component 200, but is not limited to this.
[0094] In some embodiments, the "second repeating feature" may also be the line corresponding to the electronic component 200 or the center point (or edge) of the electronic component 200 itself. For example, the first distance D1 may also be the distance measured along the first direction Y between the first line 3241 corresponding to the first electronic component 210 and the third line 3243 corresponding to the second electronic component 220, or the distance measured along the first direction Y between the center point (or edge) of the first electronic component 210 and the center point (or edge) of the second electronic component 220. The second distance D2 may also be the distance measured along the first direction Y between the first line 3241 corresponding to the first electronic component 210 of the first unit U1 and the first line 3241 corresponding to the third electronic component 230 of the second unit U2, or the distance measured along the first direction Y between the center point (or edge) of the first electronic component 210 of the first unit U1 and the center point (or edge) of the third electronic component 230 of the second unit U2. The third distance D3 can also be the distance measured along the second direction X between the first line 3241 corresponding to the first electronic component 210 of the first unit U1 and the first line 3241 corresponding to the fourth electronic component 240 of the third unit U3, or the distance measured along the second direction X between the center point (or side) of the first electronic component 210 of the first unit U1 and the center point (or side) of the fourth electronic component 240 of the third unit U3.
[0095] In this embodiment, electronic components to be connected in series in the same unit (e.g., the first electronic component 210 and the second electronic component 220) and electronic components in different units (e.g., the first electronic component 210 and the third electronic component 230) can be simultaneously picked up from the carrier 100 and transferred to the circuit board 300, thereby reducing the number of electronic component transfers or improving the utilization rate of electronic components on the carrier. The first distance D1, the second distance D2, and the parameter R1 can conform to the following relationship: R1 × M1 × 0.9 ≦ D1 ≦ R1 × M1 × 1.1, R1 × M2 × 0.9 ≦ D2 ≦ R1 × M2 × 1.1, where M1 and M2 are positive integers and M1 < M2 (that is, the first distance D1 and the second distance D2 on the circuit board 300 can be approximately positive integer multiples of the parameter R1 on the carrier 100, and the first distance D1 is less than the second distance D2). In this embodiment, M1 and M2 can be, for example, 1 and 4 (i.e., the first distance D1 is approximately 1 times the parameter R1, and the second distance D2 is approximately 4 times the parameter R1), but are not limited thereto. In this embodiment, "0.9 times" and "1.1 times" are used to cover possible process offsets during the fabrication of pads (or lines) or possible bonding offsets when electronic components are bonded to the circuit board.
[0096] In this embodiment, the third distance D3 and the parameter R2 can conform to the following relationship: R2 × M3 × 0.9 ≦ D3 ≦ R2 × M3 × 1.1, where M3 is a positive integer (i.e., the third distance D3 on the circuit board 300 is approximately a positive integer multiple of the parameter R2), in order to reduce the number of electronic component transfers or improve the utilization rate of electronic components on the carrier board. In this embodiment, M3 can be, for example, 7 (i.e., the third distance D3 is approximately 7 times the parameter R2), but is not limited thereto.
[0097] In this embodiment, there are two multiple relationships in the first direction Y (i.e., multiple M1 and multiple M2), and one multiple relationship in the second direction X (i.e., multiple M3). The total number of multiple relationships (i.e., multiple M1, multiple M2 and multiple M3) can be greater than or equal to 3, which indicates that there are electronic components connected in series in the same unit of the circuit board 300, but is not limited thereto.
[0098] In this embodiment, the utilization rate of the electronic components 200 on the carrier board 100 can be determined by dividing the total number of all picked-up electronic components 200 by the total number of electronic components 200 on the carrier board 100 before picking them up. In this embodiment, the utilization rate of the electronic components on the carrier board can be greater than 0.8 to indicate that the carrier board has a better utilization rate, but it is not limited thereto. For example, please refer to... Figure 4 The grid represents the electronic components 200 arranged in an 8×14 array on the carrier 100 (i.e., the total number of electronic components 200 on the carrier 100 before picking is 8×14 = 112), and the numbers in the grid represent the position and order in which the electronic components 200 are picked from the carrier 100. Figure 4 As shown, during the first picking step, 8 electronic components 200 can be picked up from position "1" in the figure; then, during the second picking step, 8 electronic components 200 can be picked up from position "2" in the figure; then, after sequentially going through 14 picking steps, 112 (8×14) electronic components 200 can be picked up from the carrier board 100. Therefore, by dividing the total number of all picked electronic components 200 (112) by the total number of electronic components 200 on the carrier board 100 before picking (112), it can be seen that the utilization rate of electronic components 200 on the carrier board 100 in this embodiment can be 1 (112 / 112).
[0099] Then, please refer to Figure 3 , in a similar way Figure 1 and Figure 2The steps shown involve picking up electronic component 400 from another carrier board (not shown) and transferring it to the second sub-unit SU2 of the first unit U1, second unit U2, third unit U3, and fourth unit U4 of the circuit board 300, and picking up electronic component 500 from another carrier board (not shown) and transferring it to the third sub-unit SU3 of the first unit U1, second unit U2, third unit U3, and fourth unit U4 of the circuit board 300. Adjacent electronic components 400 in the second sub-unit SU2 can be connected in series, and adjacent electronic components 500 in the third sub-unit SU3 can also be connected in series. In this embodiment, electronic components 200, 400, and 500 can each be light-emitting elements that provide different colors of light. For example, electronic component 200 can be a red light-emitting element, electronic component 400 can be a green light-emitting element, and electronic component 500 can be a blue light-emitting element, but the method is not limited to these.
[0100] In this embodiment, although the first unit U1, the second unit U2, the third unit U3, and the fourth unit U4 may each include two electronic components 200 (or electronic components 400, or electronic components 500) connected in series, the number of electronic components that can be connected in series in each unit is not disclosed or limited. That is, in some embodiments, each unit may also include three or more electronic components 200 (or electronic components 400, or electronic components 500) connected in series.
[0101] At this point, the electronic device 10 of this embodiment can be largely completed.
[0102] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.
[0103] Figure 5 This is a top view schematic diagram of an electronic device according to the second embodiment of this disclosure. Figure 6A for Figure 5 A cross-sectional schematic diagram of the electronic device along section line I-I'. Figure 6B for Figure 5 A cross-sectional schematic diagram of the electronic device along section line II-II'. Figure 6C for Figure 5 A schematic cross-sectional view of the electronic device along section line III-III'. Figure 6D for Figure 5 A schematic cross-sectional view of the electronic device along section line IV-IV'. Figure 7 From Figure 5The diagram illustrates the position and sequence of electronic components picked up from a carrier board during the manufacturing process of an electronic device. For clarity and ease of explanation, the diagram is provided. Figure 5 Several components in the electronic device 10a (e.g., some circuitry in the circuit board 300a) are omitted from the diagram. Please also refer to... Figure 3 , Figure 4 , Figure 5 as well as Figure 7 The electronic device 10a in this embodiment is similar to Figure 3 The electronic device 10 differs from the other in that: in the electronic device 10a of this embodiment, each unit of the circuit board 300a (i.e., the first unit U1, the second unit U2, the third unit U3 and the fourth unit U4) has a non-transparent area NT and multiple transparent areas (i.e., transparent areas T1 and transparent areas T2), and the first electronic component 210 and the second electronic component 220 connected in series in the same unit can be arranged diagonally opposite each other.
[0104] Specifically, please refer to Figure 5 Multiple transparent areas (i.e., transparent area T1 and transparent area T2) can be separated by non-transparent areas NT. Electronic components 200, 400 and 500 can be set to correspond to the non-transparent areas NT, and the first pad 3221, the second pad 3222, the third pad 3223 and the fourth pad 3224 can be set to correspond to the non-transparent areas NT.
[0105] Taking the first unit U1 as an example, the first electronic component 210 and the second electronic component 220 connected in series can be arranged diagonally opposite each other, the two electronic components 400 connected in series are arranged adjacent to each other in the first direction Y, and the two electronic components 500 connected in series can be arranged diagonally opposite each other.
[0106] Please refer to the following at the same time Figure 5 as well as Figures 6A to 6D The circuit layer 320a may include multiple series pad assemblies 322, multiple series line assemblies 324a, and an insulating layer 326. The multiple series line assemblies 324a are disposed on the substrate 310, the insulating layer 326 is disposed on the multiple series line assemblies 324a, and the multiple series pad assemblies 322 are disposed on the insulating layer 326. The multiple series line assemblies 324a may include a first line 3241, a second line 3242, a third line 3243, a fourth line 3244, a fifth line 3245, a sixth line 3246, and a seventh line 3247.
[0107] Taking the first unit U1 as an example, the second pad 3222 corresponding to the first electronic component 210 can be electrically connected to the third pad 3223 corresponding to the second electronic component 220 through the fifth line 3245. The second pad 3222 corresponding to one electronic component 400 can be electrically connected to the third pad 3223 corresponding to another electronic component 400 through the sixth line 3246. The second pad 3222 corresponding to one electronic component 500 can be electrically connected to the third pad 3223 corresponding to another electronic component 500 through the seventh line 3247.
[0108] In this embodiment, as Figure 6A As shown, the first pad 3221 corresponding to the first electronic component 210 in the first unit U1 and the first pad 3221 corresponding to the third electronic component 230 in the second unit U2 are separated by a second distance D2 in the first direction Y. Figure 6B As shown, the first pad 3221 corresponding to the electronic component 500 in the first unit U1 and the third pad 3223 corresponding to the second electronic component 220 in the first unit U1 are separated by a first distance D1 in the first direction Y. Figure 6C As shown, the first pad 3221 corresponding to the first electronic component 210 in the first unit U1 and the first pad 3221 corresponding to the fourth electronic component 240 in the third unit U3 are separated by a third distance D3 in the second direction X. Figure 6D As shown, the third pad 3223 corresponding to the electronic component 500 in the first unit U1 and the third pad 3223 corresponding to the second electronic component 220 in the first unit U1 are separated by a fourth distance D4 in the second direction X.
[0109] In this embodiment, the third distance D3, the fourth distance D4, and the parameter R2 can conform to the following relationships: R2 × M3 × 0.9 ≦ D3 ≦ R2 × M3 × 1.1, R2 × M4 × 0.9 ≦ D4 ≦ R2 × M4 × 1.1, where M3 and M4 are positive integers and M4 < M3 (that is, the third distance D3 and the fourth distance D4 on the circuit board 300 can be approximately positive integer multiples of the parameter R2 on the carrier board 100a, and the fourth distance D4 is less than the third distance D3), thus reducing the number of transfers of the electronic components to be connected in series or improving the utilization rate of the electronic components on the carrier board. In this embodiment, M3 and M4 can be, for example, 10 and 2 respectively (that is, the third distance D3 is approximately 10 times the parameter R2, and the fourth distance D4 is approximately 2 times the parameter R2), but are not limited thereto. Furthermore, in this embodiment, the second distance D2 can be equal to the third distance D3, but are not limited thereto.
[0110] Compared to the first embodiment, this embodiment has two multiple relationships (i.e., multiple M3 and multiple M4) in the second direction X, and the total number of multiple relationships (i.e., multiple M1, multiple M2, multiple M3 and multiple M3) can be greater than or equal to 3, thereby indicating that there are electronic components connected in series in the same unit of the circuit board 300a, but it is not limited to this.
[0111] Please refer to Figure 7 The grid represents the electronic components 200 arranged in a 20×22 array on the carrier 100a (i.e., the total number of electronic components 200 on the carrier 100a before picking is 20×22 = 440). The numbers in the grid indicate the position and order in which the electronic components 200 are picked from the carrier 100a, and the "×" in the grid indicates the position where the electronic component 200 was not picked from the carrier 100a. For example... Figure 7 As shown, during the first picking step, eight electronic components 200 can be picked up from position "1" in the diagram, so that the picked-up eight electronic components 200 can be directly transferred to... Figure 5 On the circuit board 300a; then, in the second picking step, eight electronic components 200 can be picked up from the position marked "2" in the figure, so that the eight picked-up electronic components 200 can be directly transferred to the circuit board 300a or other circuit boards; then, after sequentially going through 50 picking steps, 400 (8×50) electronic components 200 can be picked up from the carrier board 100a. Therefore, after dividing the total number of all picked-up electronic components 200 (400) by the total number of electronic components 200 on the carrier board 100a before picking up (440), it can be found that the utilization rate of electronic components 200 on the carrier board 100a in this embodiment is approximately 0.91 (400 / 440).
[0112] Figure 8 This is a partial top view of the electronic device according to the third embodiment of this disclosure. The drawings are for clarity and ease of explanation. Figure 8 Several components in the electronic device 10b (e.g., some circuitry in the circuit board 300b) are omitted from the diagram. Please also refer to... Figure 8 and Figure 5 The electronic device 10b in this embodiment is similar to Figure 5 The electronic device 10a differs from the electronic device 10b in that each unit of the circuit board 300b (i.e., the first unit U1, the second unit U2, the third unit U3, and the fourth unit U4) further includes a first spare subunit BSU1, a second spare subunit BSU2, and a third spare subunit BSU3.
[0113] Specifically, please refer to Figure 8 The following explanation will take the first unit U1 as an example.
[0114] The first backup subunit BSU1, the second backup subunit BSU2, and the third backup subunit BSU3 each have a first repair area RA1 and a second repair area RA2. The first repair area RA1 and the second repair area RA2 of the first backup subunit BSU1 are located between the first electronic component 210 and the second electronic component 220 connected in series. The first repair area RA1 and the second repair area RA2 of the second backup subunit BSU2 are located between two electronic components 400, and the first repair area RA1 and the second repair area RA2 of the third backup subunit BSU3 are located between two electronic components 500. In this embodiment, the backup subunits (i.e., the first backup subunit BSU1, the second backup subunit BSU2, and the third backup subunit BSU3) can be considered as reserved repair points, so that when an electronic component is damaged, a new electronic component can be additionally installed in the first repair area RA1 or the second repair area RA2 of the backup subunit.
[0115] Multiple series-connected pad combinations 322b may include a first pad 3221, a second pad 3222, a third pad 3223, a fourth pad 3224, a fifth pad 3225, a sixth pad 3226, a seventh pad 3227, and an eighth pad 3228. The first pad 3221, the second pad 3222, the third pad 3223, and the fourth pad 3224 are disposed in the first subunit SU1, the second subunit SU2, and the third subunit SU3. The fifth pad 3225 and the sixth pad 3226 are disposed in the first spare subunit BSU1, the second spare subunit BSU2, and the third spare subunit BSU3.
[0116] Multiple series circuit combinations 324b may include a first circuit 3241, a second circuit 3242, a third circuit 3243, a fourth circuit 3244, a fifth circuit 3245, a sixth circuit 3246, and a seventh circuit 3247.
[0117] The first pad 3221 corresponding to the first electronic component 210 can be electrically connected to the fifth pad 3225 in the first backup subunit BSU1 via the corresponding first line 3241, and the second pad 3222 corresponding to the first electronic component 210 can be electrically connected to the sixth pad 3226 in the first backup subunit BSU1 via the corresponding second line 3242. The third pad 3223 corresponding to the second electronic component 220 can be electrically connected to the seventh pad 3227 in the first backup subunit BSU1 via the corresponding third line 3243, and the fourth pad 3224 corresponding to the second electronic component 220 can be electrically connected to the eighth pad 3228 in the first backup subunit BSU1 via the corresponding fourth line 3244. The sixth pad 3226 in the first backup subunit BSU1 can be electrically connected to the seventh pad 3227 in the first backup subunit BSU1 via the fifth line 3245, so that the first electronic component 210 and the second electronic component 220 can be connected in series.
[0118] The sixth pad 3226 in the second backup subunit BSU2 can be electrically connected to the seventh pad 3227 in the second backup subunit BSU2 via the sixth line 3246, so that one electronic component 400 can be connected in series with another electronic component 400. The sixth pad 3226 in the third backup subunit BSU3 can be electrically connected to the seventh pad 3227 in the third backup subunit BSU3 via the seventh line 3247, so that one electronic component 500 can be connected in series with another electronic component 500.
[0119] In this embodiment, the first pad 3221 corresponding to the first electronic component 210 in the first unit U1 and the first pad 3221 corresponding to the third electronic component 230 in the second unit U2 are separated by a second distance D2 in the first direction Y. The first pad 3221 corresponding to the first electronic component 210 in the first unit U1 and the first pad 3221 corresponding to the fourth electronic component 240 in the third unit U3 are separated by a third distance D3 in the second direction X. In this embodiment, the second distance D2 can be equal to the third distance D3, but is not limited thereto.
[0120] Figure 9 This is a partial top view of the electronic device according to the fourth embodiment of this disclosure. Please also refer to... Figure 9 and Figure 8 The electronic device 10c in this embodiment is similar to Figure 8 The electronic device 10b differs from the electronic device 10c in that, in the electronic device 10c of this embodiment, the first repair area RA1 and the second repair area RA2 in the backup subunits (i.e., the first backup subunit BSU1, the second backup subunit BSU2 and the third backup subunit BSU3) are respectively disposed on the same side of the corresponding electronic components.
[0121] Specifically, please refer to Figure 9 In the first backup subunit BSU1, the first repair area RA1 and the second repair area RA2 are respectively located to the right of the first electronic component 210 and the right of the second electronic component 220. In the second backup subunit BSU2, the first repair area RA1 and the second repair area RA2 are respectively located to the right of one electronic component 400 and the right of the other electronic component 400. In the third backup subunit BSU3, the first repair area RA1 and the second repair area RA2 are respectively located to the right of one electronic component 500 and the right of the other electronic component 500.
[0122] In summary, in the electronic device and manufacturing method of the present disclosure according to an embodiment, by simultaneously picking up and transferring the first electronic component and the second electronic component to be connected in series onto the circuit board, the number of transfers of the electronic components to be connected in series can be reduced or the utilization rate of the electronic components on the carrier board can be improved. Since the first distance and the second distance (or the third distance and the fourth distance) on the circuit board can be approximately positive integer multiples of the parameters on the carrier board, the first electronic component and the second electronic component to be connected in series in the same unit can be simultaneously picked up from the carrier board and directly transferred to the circuit board, thereby reducing the number of transfers of the electronic components to be connected in series or improving the utilization rate of the electronic components on the carrier board.
[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions disclosed herein, and are not intended to limit them. Although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments disclosed herein.
Claims
1. A method for manufacturing an electronic device, characterized in that, include: A carrier board and a plurality of electronic components disposed on the carrier board are provided, wherein the plurality of electronic components include a first electronic component and a second electronic component; A circuit board is provided, wherein the circuit board includes a plurality of series pad assemblies, one of the plurality of series pad assemblies including a first pad, a second pad, a third pad and a fourth pad, and the second pad is electrically connected to the third pad. Simultaneously pick up the first electronic component and the second electronic component; as well as Simultaneously, the first electronic component and the second electronic component are transferred onto the circuit board. The first electronic component is disposed on the first and second pads respectively, and the second electronic component is disposed on the third and fourth pads respectively, and the first electronic component and the second electronic component are connected in series.
2. The manufacturing method according to claim 1, characterized in that, The circuit board has a first unit and a second unit, the first unit and the second unit including the plurality of series pads, the plurality of electronic components further including a third electronic component, and the manufacturing method further includes: Simultaneously pick up the first electronic component, the second electronic component, and the third electronic component; Simultaneously, the first electronic component, the second electronic component, and the third electronic component are transferred onto the circuit board. The first electronic component is disposed on the first and second pads in the first unit, the second electronic component is disposed on the third and fourth pads in the first unit, and the third electronic component is disposed on the first and second pads in the second unit.
3. The manufacturing method according to claim 2, characterized in that, The first pad in the first unit and the third pad are separated by a first distance in a first direction, and the first pad in the first unit and the first pad in the second unit are separated by a second distance in the first direction, wherein the first distance is less than the second distance.
4. The manufacturing method according to claim 1, characterized in that, The utilization rate of the plurality of electronic components on the carrier is greater than 0.
8.
5. An electronic device, characterized in that, include: A circuit board has a first unit and a second unit, and includes a substrate and a circuit layer disposed on the substrate, wherein the circuit layer includes a first pad, a second pad, a third pad and a fourth pad, and the second pad is electrically connected to the third pad. as well as Multiple electronic components are disposed on the circuit board, and include: A first electronic component is disposed on the first pad and the second pad in the first unit; A second electronic component is disposed on the third and fourth pads in the first unit; and A third electronic component is disposed on the first and second pads in the second unit; Wherein, the first pad in the first unit and the third pad are separated by a first distance D1 in the first direction, and the first pad in the first unit and the first pad in the second unit are separated by a second distance D2 in the first direction, and the first distance D1, the second distance D2 and the parameter R1 conform to the following relationship: R1 × M1 × 0.9 ≦ D1 ≦ R1 × M1 × 1.1; and R1 × M2 × 0.9 ≦ D2 ≦ R1 × M2 × 1.1, Where M1 and M2 are positive integers, and M1 is less than M2.
6. The electronic device according to claim 5, characterized in that, One of the plurality of electronic components has a first length L1 in the first direction, and L1 < R1 < 3×L1.
7. The electronic device according to claim 5, characterized in that, The plurality of electronic components are used to provide light of the same color, and the first electronic component and the second electronic component are connected in series with each other.
8. The electronic device according to claim 5, characterized in that, The circuit board further includes a third unit, and the plurality of electronic components also include: A fourth electronic component is disposed on the first and second pads in the third unit. The first pad in the first unit and the first pad in the third unit are separated by a third distance in the second direction, and the third distance is equal to the second distance.
9. The electronic device according to claim 5, characterized in that, The first unit and the second unit have a non-transparent area and multiple transparent areas, the multiple transparent areas are separated by the non-transparent areas, and the first pad, the second pad, the third pad and the fourth pad are arranged corresponding to the non-transparent areas.
10. The electronic device according to claim 5, characterized in that, The first unit includes a first sub-unit and a first spare sub-unit, and the circuit layer further includes a fifth pad and a sixth pad. The first and second pads are disposed in the first subunit, and the fifth and sixth pads are disposed in the first spare subunit. The fifth pad is electrically connected to the first pad, and the sixth pad is electrically connected to the second pad.