A radio frequency chip radio frequency filter production device

Abstract

The present application relates to the technical field of radio frequency front end module production, in particular to a radio frequency chip radio frequency filter production equipment, which comprises an equipment box and a conveying line penetrating through the equipment box, the conveying line is provided with carriers in an equal interval array along the conveying direction, the upper end of the carrier is provided with an anti-static jig for workpiece positioning, the conveying line is provided with a visual inspection station, a cleaning station, a bridge quality inspection station, a preheating station, a cold welding station, a hot welding station and a final inspection station in sequence along the conveying direction, an activation station is arranged between the cold welding station and the hot welding station, and the visual inspection station and the cleaning station are connected with the equipment box through three-axis sliding tables respectively. The present application realizes the continuous mass production of radio frequency chip radio frequency filter integrated products, ensures the quality of radio frequency chip radio frequency filters, improves the product yield and radio frequency performance consistency, and solves the problems of insufficient positioning accuracy, low product yield, poor welding quality and inability to realize continuous mass production of the existing equipment.

Description

Technical Field

[0001] This invention relates to the field of radio frequency front-end module manufacturing technology, specifically to a radio frequency chip and radio frequency filter manufacturing equipment. Background Technology

[0002] With the rapid iteration of communication technology, RF front-end modules are accelerating their development towards miniaturization, high integration, and high reliability. The heterogeneous integration of RF chips and filters has become a core factor determining the performance of RF front-ends. The performance of its mass production equipment directly determines the yield, RF performance consistency, and mass production cost of end products. In the standardized mass production process of RF chip and RF filter integration, the workpieces need to complete the entire process in a fixed sequence. First, the RF chip is surface-mounted on the filter substrate, and the chip is temporarily fixed by solder paste on the pads to obtain the workpiece to be processed. Then, the workpiece is loaded onto a continuous conveyor mechanism, and after completing the sequential flow between multiple stations, the metallurgical interconnection between the chip and the filter substrate is completed by cold soldering and hot soldering to form a stable mechanical and electrical connection.

[0003] However, existing production equipment uses a process of welding first and then inspecting, which cannot identify defects such as mounting deviations and hidden bridging of pads in advance before welding. A large number of defective products are only rejected after entering the high-temperature welding process, resulting in a serious waste of raw materials, processing time and energy. At the same time, existing equipment lacks a standardized low-temperature gradient preheating process, and the workpiece directly enters the high-temperature welding environment. Due to the difference in the thermal expansion coefficients of chips, filters and substrates, large thermal stress is easily generated, which leads to filter center frequency drift and chip microcracks, seriously affecting the consistency of product radio frequency performance.

[0004] In addition, the current mainstream process in the industry uses a single high-temperature reflow soldering process to complete the welding of chips and filter substrates. This process melts and welds the solder within a single high-temperature chamber. During this process, the high-speed circulating hot air directly impacts the chip, which is only temporarily fixed by solder paste. This can easily lead to chip misalignment, rotation, or even detachment, resulting in fatal defects such as cold solder joints or short circuits between adjacent pins. Furthermore, the single high-temperature heating and cooling process cannot meet the thermal compatibility requirements of the multi-material system of the chip, filter, and substrate, further amplifying the performance damage caused by thermal stress. Therefore, it is necessary to design a production equipment for RF chips and RF filters. Summary of the Invention

[0005] Therefore, it is necessary to provide a radio frequency chip and radio frequency filter manufacturing equipment to address the existing technical problems.

[0006] To solve the problems of the prior art, the technical solution adopted by the present invention is as follows:

[0007] A radio frequency chip and radio frequency filter manufacturing equipment includes an equipment box and a conveyor line passing through the equipment box, and further includes:

[0008] The conveyor line is equipped with trays arranged at equal intervals along the conveying direction, and anti-static fixtures for workpiece positioning are installed at the upper end of the trays.

[0009] Along the conveyor line, a vision inspection station for preliminary inspection of the workpiece surface and a cleaning station for cleaning the workpiece surface are set up sequentially on the side of the conveyor line. The vision inspection station and the cleaning station are connected to the equipment box through a three-axis slide table.

[0010] Next to the cleaning station, along the conveying direction, there are a bridging quality inspection station for identifying hidden bridging and short circuit defects on the workpiece pads and a preheating station for low-temperature preheating of the solder paste on the workpiece surface.

[0011] The preheating station is arranged in sequence along the conveying direction, including a cold welding station, a hot welding station, and a final inspection station. On the side where the cold welding station and the hot welding station are close together, there is an activation station for activating the interface of the workpiece welding pad.

[0012] Furthermore, the vision inspection station includes a line scan camera fixedly connected to the movable end of the three-axis slide. Below the line scan camera is a light ring fixedly connected to the movable end of the three-axis slide. Inside the light ring are shadowless lamps that provide illumination to the workpiece.

[0013] Furthermore, the cleaning station includes a negative pressure suction nozzle fixedly connected to the movable end of the three-axis slide. Blowing air knives are symmetrically arranged on both sides of the negative pressure suction nozzle, and the blowing air knives are fixedly connected to the movable end of the three-axis slide.

[0014] Furthermore, ion air bars that are fixed to the output end of the three-axis slide are respectively provided on the side of the two purge air knives that are close to each other.

[0015] Furthermore, baffles are provided on the sides of the two purge air knives that are far apart. The baffles are L-shaped and have soft rubber pads fixed to their lower ends.

[0016] A cylinder is installed on the upper part of each of the two baffle plates. The fixed end of the cylinder is fixedly connected to the three-axis slide table, and the movable end is fixedly connected to the baffle plate.

[0017] Furthermore, the bridge-connected quality inspection station includes an electric slide table set next to the conveyor line. The output end of the electric slide table is fixed to a platform, and two infrared cameras are symmetrically arranged on the side of the platform closest to the conveyor line.

[0018] A fork device for unloading defective workpieces is installed on one side of the two infrared cameras that are close to each other.

[0019] Furthermore, the shift fork device includes a dual-axis manipulator with its fixed end fixed to the middle of the platform. A clamping device is slidably installed at the lower end of the platform. After the clamping device pushes the workpiece at the upper end of the fixture to move, the end of the workpiece extends out of the fixture, and the dual-axis manipulator drives the workpiece away from the fixture.

[0020] Furthermore, a cavity is provided in the middle of the platform, and a conveyor belt is installed in the cavity, with the conveyor belt conveying in the direction of the platform.

[0021] Furthermore, the preheating station includes a preheating box located at the upper end of the conveyor line. The preheating box heats the workpiece in stages. A hot air gun is installed above the preheating box, and the output end of the hot air gun is connected to the inside of the preheating box.

[0022] Furthermore, the activation station includes an ion spray gun positioned above the conveyor line, with the output end of the ion spray gun facing downwards. An exhaust gas filter is located below the ion spray gun, and the air inlet of the exhaust gas filter is aligned with the fixture.

[0023] The beneficial effects of this invention compared to the prior art are:

[0024] Firstly, this equipment achieves standardized and precise workpiece positioning and full-process anti-static protection by setting up load-bearing platforms with anti-static fixtures at equal intervals along the conveyor line. This fundamentally avoids positional deviation and ESD damage during workpiece transfer, significantly reducing early product failure rates. At the same time, through the sequential arrangement of visual inspection, cleaning, bridging quality inspection, and preheating stations, a pre-processing quality control system is constructed, which can identify and reject defective products before welding, avoiding the waste of raw materials and time caused by ineffective processing, significantly reducing mass production costs and improving production yield.

[0025] Secondly, this equipment constructs a production system of pre-fixation, interface activation, and final soldering through the sequential arrangement of cold soldering station, activation station, and hot soldering station. First, the chip mounting position is pre-locked by cold soldering, which solves the problem of chip alignment drift during hot soldering. Then, the activation station set between cold soldering and hot soldering removes the oxide film and organic residue on the surface of the solder pads, which greatly improves the wettability of the solder and controls the void rate of the solder joint within the threshold required by RF products, ensuring the consistency of the product's RF performance. At the same time, the continuous arrangement of all stations realizes uninterrupted production throughout the entire process, which significantly improves mass production efficiency. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of an embodiment;

[0027] Figure 2 This is a front view of an embodiment;

[0028] Figure 3 This is a front view of the conveyor line and each workstation in the embodiment;

[0029] Figure 4 yes Figure 3 Enlarged view of the structure at point A in the middle;

[0030] Figure 5 yes Figure 3Enlarged view of the structure at point B in the middle;

[0031] Figure 6 yes Figure 3 Enlarged view of the structure at point C;

[0032] Figure 7 This is a three-dimensional structural cross-section of the visual inspection station to the bridging quality inspection station in the embodiment.

[0033] Figure 8 yes Figure 7 Enlarged view of the structure at point D;

[0034] Figure 9 yes Figure 7 Enlarged view of the structure at point E in the middle;

[0035] Figure 10 This is a three-dimensional structural cross-section of the preheating station to the final inspection station in the embodiment.

[0036] The numbers on the map are:

[0037] 1. Equipment box; 2. Conveyor line; 3. Support table; 4. Fixture; 5. Vision inspection station; 6. Line scan camera; 7. Lamp ring; 8. Shadowless lamp; 9. Three-axis slide table; 10. Cleaning station; 11. Blowing air knife; 12. Negative pressure suction nozzle; 13. Ionizing air bar; 14. Cylinder; 15. Baffle plate; 16. Soft rubber pad; 17. Bridged quality inspection station; 18. Infrared camera; 19. Electric slide table; 20. Carrier; 21. Cavity; 22. Conveyor belt; 23. Shifting fork device; 24. Clamping device; 25. Dual-axis robot; 26. Preheating station; 27. Preheating box; 28. Hot air gun; 29. ​​Cold welding station; 30. Activation station; 31. Ion spray gun; 32. Exhaust gas filter device; 33. Hot welding station; 34. Final inspection station. Detailed Implementation

[0038] To further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0039] refer to Figures 1 to 10 A radio frequency chip and radio frequency filter manufacturing equipment includes an equipment box 1 and a conveyor line 2 passing through the equipment box 1, and further includes:

[0040] The conveyor line 2 is provided with support platforms 3 at equal intervals along the conveying direction, and the upper end of the support platform 3 is provided with an anti-static fixture 4 for workpiece positioning.

[0041] Along the conveying direction, the conveyor line 2 is provided with a vision inspection station 5 for preliminary inspection of the workpiece surface and a cleaning station 10 for cleaning the workpiece surface. The vision inspection station 5 and the cleaning station 10 are respectively connected to the equipment box 1 through a three-axis slide table 9.

[0042] Along the conveying direction, the cleaning station 10 is provided with a bridging quality inspection station 17 for identifying hidden bridging and short circuit defects on the workpiece pads and a preheating station 26 for preheating the solder paste on the workpiece surface at low temperature.

[0043] The preheating station 26 is provided with a cold welding station 29, a hot welding station 33 and a final inspection station 34 in sequence along the conveying direction. An activation station 30 for activating the workpiece welding pad interface is provided on the side close to the cold welding station 29 and the hot welding station 33.

[0044] When this device is in operation, the filter substrate workpiece (hereinafter referred to as "workpiece") that has completed the RF chip mounting is fed to the support platform 3 of the conveyor line 2. The anti-static fixture 4 on the top surface of the platform 3 completes the precise positioning and clamping of the workpiece, which not only ensures that the position reference of the workpiece is consistent throughout the entire process, but also eliminates the risk of static electricity accumulation throughout the process, avoiding ESD damage to the RF chip and filter. The conveyor line 2 achieves continuous conveying at a fixed rhythm through the equally spaced array of platforms 3, providing a unified timing reference for the synchronous operation of the subsequent full station.

[0045] Subsequently, the workpieces flow sequentially through the upstream stations along conveyor line 2. First, the visual inspection station 5 performs online preliminary inspection of mounting accuracy and appearance defects to identify obvious defective products in advance. Then, the cleaning station 10 performs non-contact cleaning of dust and flux splashes on the workpiece surface to eliminate the potential for contamination in subsequent soldering. Afterward, the workpieces pass through the bridging quality inspection station 17 to identify hidden bridging and short-circuit defects in the solder pads, rejecting electrically defective products and preventing invalid products from flowing into the soldering process. Finally, the preheating station 26 performs low-temperature gradient preheating of the solder paste to remove adsorbed moisture, reduce the thermal shock of subsequent soldering, and avoid filter frequency drift and chip stress damage.

[0046] After preheating, the workpiece first enters the cold soldering station 29 to complete the pre-fixed soldering of the chip to the corner pads of the filter substrate, locking the mounting alignment accuracy and avoiding chip displacement caused by hot air impact during hot soldering. Then, it enters the activation station 30 to complete the pad interface activation treatment, removing the oxide film and organic residue generated during pre-soldering and improving solder wettability. Finally, it enters the hot soldering station 33 to complete the overall metallurgical soldering of all pads, forming a stable and reliable electrical interconnection. Finally, it passes through the final inspection station 34 to complete the full performance inspection of the finished product, realizing continuous production with full-process positioning, control, soldering and inspection, ensuring product yield and RF performance consistency.

[0047] To supplement the specific structure of visual inspection station 5, the following features were also set:

[0048] like Figure 3 , Figure 7 and Figure 8As shown, the visual inspection station 5 includes a line scan camera 6 fixedly connected to the movable end of the three-axis slide table 9. Below the line scan camera 6 is a light ring 7 fixedly connected to the movable end of the three-axis slide table 9. Inside the light ring 7 are shadowless lamps 8 that provide illumination to the workpiece.

[0049] During equipment operation, the three-axis slide 9 can drive the line scan camera 6, the lamp ring 7 and the shadowless lamp 8 to complete multi-dimensional position adjustments. The shadowless lamp 8 forms uniform shadowless illumination through the circumferential arrangement inside the lamp ring 7, eliminating the specular reflection interference of the gold-plated filter substrate, ensuring that the line scan camera 6 can clearly capture details such as chip mounting position and pad status, accurately complete the real-time detection of mounting accuracy and appearance defects, and provide a reliable quality benchmark for subsequent processes.

[0050] To further elaborate on the specific structure of cleaning station 10, the following features are also included:

[0051] like Figure 3 and Figure 4 The cleaning station 10 includes a negative pressure suction nozzle 12 fixedly connected to the movable end of a three-axis slide 9. Blowing air knives 11 are symmetrically arranged on both sides of the negative pressure suction nozzle 12, and the blowing air knives 11 are fixedly connected to the movable end of the three-axis slide 9. When the workpiece moves to the cleaning station 10, the three-axis slide 9 drives the negative pressure suction nozzle 12 and the blowing air knives 11 to move to the corresponding cleaning area of ​​the workpiece. The symmetrical blowing air knives 11 on both sides simultaneously output directional airflow to remove contaminants such as dust and flux spatter from the workpiece surface. The negative pressure suction nozzle 12 in the middle simultaneously generates negative pressure suction to remove the removed contaminants in real time, forming a cycle of blowing and adsorption cleaning. This prevents contaminants from falling back and contaminating the workpiece again. Simultaneously, the entire process is non-contact, ensuring the chip mounting and alignment accuracy is not compromised.

[0052] To neutralize electrostatic charges and eliminate electrostatic adsorption, the following features are specifically designed:

[0053] like Figure 4 As shown, two ion bars 13, which are fixed to the output end of the three-axis slide table 9, are respectively installed on the side of the two blowing air knives 11 that are close to each other. During the cleaning operation, the two ion bars 13 release positive and negative balanced ions simultaneously to neutralize the static charge accumulated on the surface of the workpiece, fixture 4 and substrate in real time, completely eliminating the electrostatic adsorption force of dust, allowing the blowing airflow to completely remove micron-sized contaminants, greatly improving the cleaning effect. At the same time, the ion bars 13 can dissipate the instantaneous static electricity generated by the airflow, avoiding ESD soft breakdown of RF chips and electrostatic damage to the piezoelectric structure of filters, providing full-process electrostatic protection for RF sensitive devices.

[0054] To prevent dust blown up during the cleaning process from affecting chips at other workstations, the following features were specifically designed:

[0055] like Figure 4As shown, baffles 15 are respectively provided on the side of the two purge air knives 11 that are far apart. The baffles 15 are L-shaped and the lower end is fixed with a soft rubber pad 16.

[0056] Two baffles 15 are respectively equipped with cylinders 14 at their upper ends. The fixed end of the cylinder 14 is fixedly connected to the three-axis slide table 9, and the movable end is fixedly connected to the baffle 15.

[0057] Before the cleaning operation starts, the cylinder 14 drives the baffle plate 15 to move downward, so that the soft rubber pad 16 at the lower end of the baffle plate 15 adheres to the top surface of the fixture 4, forming a sealed barrier on both sides of the cleaning area, blocking the outward diffusion of the blowing airflow, and preventing the stripped dust from flying to adjacent workstations and contaminating other workpieces. After the cleaning operation is completed, the cylinder 14 drives the baffle plate 15 to reset, without affecting the normal flow of the workpiece with the conveyor line 2, thus balancing the cleaning effect with the continuous operation efficiency of the production line.

[0058] To supplement the detailed structure of the bridge connection quality inspection station 17, the following features were also provided:

[0059] like Figure 3 , Figure 5 , Figure 7 and Figure 9 The bridge-connected quality inspection station 17 includes an electric slide table 19 set next to the conveyor line 2. The output end of the electric slide table 19 is fixed to a platform 20. Two infrared cameras 18 are symmetrically arranged on the side of the platform 20 near the conveyor line 2.

[0060] A fork device 23 for unloading defective workpieces is installed on one side of the two infrared cameras 18 that are close to each other. When the workpiece flows to the bridging inspection station 17, the electric slide table 19 drives the platform 20 to move synchronously with the conveyor line 2. The two symmetrically arranged infrared cameras 18 simultaneously scan and image the workpiece's solder pad area. Through the principle of thermal imaging, the hidden bridging and short circuit defects of the solder pads are identified, and qualified workpieces and defective workpieces are accurately determined. For the identified defective workpieces, the fork device 23 can simultaneously unload the defective workpieces, preventing defective products from flowing into subsequent welding processes and reducing the waste of raw materials and processing time.

[0061] To supplement the detailed structure of the shift fork device 23, the following features are also provided:

[0062] like Figure 7 and Figure 9The shift fork device 23 includes a dual-axis manipulator 25 with its fixed end fixed to the middle of the platform 20. A clamping device 24 is slidably installed at the lower end of the platform 20. After the clamping device 24 pushes the workpiece on the upper end of the fixture 4 to move, the end of the workpiece extends out of the fixture 4, and then the dual-axis manipulator 25 drives the workpiece away from the fixture 4. During the defective product unloading operation, the clamping device 24 first slides along the lower end of the platform 20, smoothly pushing the defective workpiece on the fixture 4, so that the end of the workpiece extends out of the fixture 4 to form a clamping position. Then the clamping device 24 continues to move until the end of the defective workpiece extends out of the upper end of the fixture 4. Then the dual-axis manipulator 25 accurately clamps the extended end of the workpiece and drives the defective workpiece to smoothly leave the fixture 4. The entire operation is smooth and impact-free, without touching adjacent qualified workpieces or damaging the fixture 4 and the conveyor line 2 structure, thus achieving accurate and non-destructive unloading of defective products.

[0063] In order to centrally store defective workpieces, the following features are specifically designed:

[0064] like Figure 9 As shown, a cavity 21 is provided in the middle of the platform 20, and a conveyor belt 22 is provided in the cavity 21. The conveyor belt 22 is directed towards the inside of the platform 20.

[0065] After the dual-axis robot 25 unloads the defective workpiece, it can place the defective workpiece stably on the conveyor belt 22 inside the cavity 21. The conveyor belt 22 continues to operate to transport the defective workpiece into the platform 20, completing the centralized collection and temporary storage of defective products. There is no need for frequent manual stops to pick up and put down defective products, ensuring the continuous operation efficiency of the production line. At the same time, it is convenient for subsequent centralized re-inspection and rework of defective products.

[0066] To supplement the detailed structure of preheating station 26, the following features are also provided:

[0067] like Figure 10 As shown, the preheating station 26 includes a preheating box 27 set at the upper end of the conveyor line 2. The preheating box 27 heats the workpiece in a stepped manner. A hot air gun 28 is set above the preheating box 27, and the output end of the hot air gun 28 is connected to the inside of the preheating box 27.

[0068] After the workpiece enters the preheating box 27 along the conveyor line 2, the hot air gun 28 delivers constant temperature hot air into the preheating box 27. The preheating box 27 is set with multiple independent temperature control zones along the conveying direction to perform step-by-step gradient heating on the workpiece, so as to steadily preheat the workpiece to the set temperature, thoroughly remove the trace moisture adsorbed in the substrate and solder paste, and at the same time gently activate the flux activity, reduce the temperature difference between the workpiece and the subsequent soldering station, reduce the thermal shock of soldering, and avoid problems such as center frequency drift and chip microcracks caused by thermal stress in the filter.

[0069] To supplement the detailed structure of activation station 30, the following features are also provided:

[0070] like Figure 10 As shown, the activation station 30 includes an ion spray gun 31 positioned above the conveyor line 2, with the output end of the ion spray gun 31 facing downwards. A waste gas filter 32 is located below the ion spray gun 31, with its inlet aligned with the fixture 4. When a workpiece that has completed cold welding pre-fixation is transferred to the activation station 30, the ion spray gun 31 outputs atmospheric pressure low-temperature plasma downwards to activate the workpiece's solder pad interface, removing the oxide film and flux organic residues generated during cold welding, improving solder wettability, and reducing the void rate of subsequent hot welding. The trace amounts of organic waste gas generated during activation are drawn in and filtered in real-time by the waste gas filter 32 below, preventing waste gas pollution of the workshop environment and workpiece surface, thus ensuring the environmental friendliness of the production process and the cleanliness of the product.

[0071] The detailed working principle of this device is as follows:

[0072] The filter substrate workpiece with completed RF chip mounting is loaded onto the corresponding support platform 3 of the conveyor line 2 that passes through the equipment box 1. The anti-static fixture 4 on the top surface of the support platform 3 completes the precise limiting and clamping, which not only ensures the uniformity of the position reference throughout the entire process, but also eliminates the risk of static electricity accumulation. The conveyor line 2 achieves fixed-rhythm continuous conveying through the equally spaced array of support platforms 3, providing a unified timing reference for synchronous operation of all workstations.

[0073] The workpiece first enters the vision inspection station 5 along the conveyor line 2. The three-axis slide table 9 drives the line scan camera 6, the lamp ring 7, and the shadowless lamp 8 to complete the position adaptation. The shadowless lamp 8 forms uniform shadowless illumination to eliminate substrate reflection interference. The line scan camera 6 accurately completes the online preliminary inspection of mounting accuracy and appearance defects, and identifies obvious defective products in advance. Then the workpiece enters the cleaning station 10. The three-axis slide table 9 drives the cleaning module to move to the target area. The cylinder 14 drives the baffle plate 15 to descend and form a barrier. The blower blades 11 on both sides output directional airflow to remove contaminants. The negative pressure suction nozzle 12 in the middle simultaneously sucks them up. The ion bar 13 inside the blower blades simultaneously releases balanced ions to eliminate electrostatic adsorption and ESD risks, completing non-contact closed-loop cleaning.

[0074] Afterwards, the workpiece enters the bridging quality inspection station 17. The electric slide table 19 drives the platform 20 to move synchronously with the conveyor line 2. The dual infrared camera 18 identifies hidden bridging and short circuit defects of the solder pads through thermal imaging. Defective workpieces are pushed by the clamping device 24 and clamped by the dual-axis robot 25. The conveyor belt 22 placed in the cavity 21 of the platform 20 completes centralized collection. Qualified workpieces continue to flow into the preheating station 26. The preheating box 27 achieves multi-stage stepped heating through the hot air gun 28, which steadily preheats to remove moisture and activate the flux, reducing the thermal shock of subsequent welding.

[0075] After preheating, the workpiece first enters the cold soldering station 29 to pre-fix the chip to the corner pads of the filter substrate, locking the mounting alignment accuracy. Then, the workpiece enters the activation station 30, where plasma is output through the ion spray gun 31 to activate the pad interface. The exhaust gas is treated in real time by the matching exhaust gas filtration device 32. Then, it enters the hot soldering station 33 to complete the overall metallurgical welding of the entire pad, forming a stable electrical interconnection. Finally, the finished product undergoes full performance inspection at the final inspection station 34. This achieves continuous production of the entire process, including positioning, inspection, cleaning, quality control, preheating, cold soldering, activation, hot soldering, and final inspection, which greatly improves product yield, RF performance consistency, and mass production efficiency.

[0076] The above embodiments only illustrate one or more implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A radio frequency chip and radio frequency filter manufacturing equipment, comprising an equipment box (1) and a conveyor line (2) passing through the equipment box (1), characterized in that, Also includes: The conveyor line (2) is provided with trays (3) arranged at equal intervals along the conveying direction, and the upper end of the trays (3) is provided with an anti-static fixture (4) for workpiece positioning. Along the conveying direction, the conveyor line (2) is provided with a visual inspection station (5) for preliminary inspection of the workpiece surface and a cleaning station (10) for cleaning the workpiece surface. The visual inspection station (5) and the cleaning station (10) are connected to the equipment box (1) through a three-axis slide table (9). The cleaning station (10) is arranged along the conveying direction with a bridging quality inspection station (17) for identifying hidden bridging and short circuit defects of workpiece solder pads and a preheating station (26) for low-temperature preheating of solder paste on the workpiece surface. The preheating station (26) is provided with a cold welding station (29), a hot welding station (33) and a final inspection station (34) in sequence along the conveying direction. An activation station (30) is provided on the side of the cold welding station (29) and the hot welding station (33) that is close to each other to activate the interface of the workpiece welding pad.

2. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 1, characterized in that, The visual inspection station (5) includes a line scan camera (6) fixedly connected to the movable end of the three-axis slide (9). Below the line scan camera (6) is a light ring (7) fixedly connected to the movable end of the three-axis slide (9). Inside the light ring (7) are shadowless lamps (8) that provide illumination to the workpiece.

3. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 1, characterized in that, The cleaning station (10) includes a negative pressure suction nozzle (12) fixedly connected to the movable end of the three-axis slide (9). The negative pressure suction nozzle (12) is symmetrically provided with blow-off air knives (11) on both sides, and the blow-off air knives (11) are fixedly connected to the movable end of the three-axis slide (9).

4. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 3, characterized in that, On the side of the two purge air knives (11) that are close to each other, there are ion air bars (13) that are fixed to the output end of the three-axis slide (9).

5. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 4, characterized in that, Two blow-off air knives (11) are respectively provided with baffles (15) on the side that are far apart. The baffles (15) are L-shaped and the lower end is fixed with a soft rubber pad (16). Two baffles (15) are respectively equipped with cylinders (14) at their upper ends. The fixed end of the cylinder (14) is fixedly connected to the three-axis slide (9), and the movable end is fixedly connected to the baffle (15).

6. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 1, characterized in that, The bridge-connected quality inspection station (17) includes an electric slide (19) set on the side of the conveyor line (2). The output end of the electric slide (19) is fixed to a platform (20). Two infrared cameras (18) are symmetrically arranged on the side of the platform (20) near the conveyor line (2). A fork device (23) for unloading defective workpieces is provided on one side of the two infrared cameras (18) that are close to each other.

7. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 6, characterized in that, The shift fork device (23) includes a dual-axis manipulator (25) with its fixed end fixed to the middle of the platform (20). A clamping device (24) is slidably provided at the lower end of the platform (20). After the clamping device (24) pushes the workpiece at the upper end of the fixture (4) to move, the end of the workpiece extends out of the fixture (4), and the dual-axis manipulator (25) drives the workpiece away from the fixture (4).

8. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 7, characterized in that, A cavity (21) is provided in the middle of the platform (20), and a conveyor belt (22) is provided in the cavity (21). The conveyor belt (22) is directed to the inside of the platform (20).

9. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 8, characterized in that, The preheating station (26) includes a preheating box (27) set at the upper end of the conveyor line (2). The preheating box (27) heats the workpiece in a stepped manner. A hot air gun (28) is set above the preheating box (27). The output end of the hot air gun (28) is connected to the inside of the preheating box (27).

10. The radio frequency chip and radio frequency filter manufacturing equipment according to claim 9, characterized in that, The activation station (30) includes an ion spray gun (31) set above the conveyor line (2). The output end of the ion spray gun (31) is set downward. A waste gas filter device (32) is set below the ion spray gun (31). The air inlet of the waste gas filter device (32) is aligned with the fixture (4).

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