PCB tantalum wire welding equipment and welding method

Abstract

The present application relates to the technical field of sensor production and manufacturing, and discloses a PCB tantalum wire welding device and a welding method, which comprises a rack, and the rack is integrated with a feeding mechanism, a suction feeding mechanism, a horizontal moving mechanism, a tantalum wire roll feeding mechanism, a welding mechanism, a cutting mechanism, a suction material moving mechanism, a detection mechanism, a detection material moving mechanism and a discharging mechanism; the front end of the welding mechanism is provided with a pressing strip with an inlet part, which can press the PCB material during welding. The present application integrates all core processes of tantalum wire welding, including feeding, transfer, step welding, feeding, cutting, detection and discharging, in the same rack, so that the whole process of continuous PCB processing can be completed without intervention and additional transfer equipment, greatly shortening the processing cycle; the cutting mechanism and the welding mechanism are connected in advance, the detection and material moving mechanisms are matched, and the horizontal moving mechanism is used for step welding, so that the welding, cutting and detection are realized in a coherent operation, the welding consistency and product yield are ensured, and the present application is suitable for large-scale continuous production requirements.

Description

Technical Field

[0001] This invention relates to the field of sensor manufacturing technology, and in particular to a PCB tantalum wire welding equipment and welding method. Background Technology

[0002] In the manufacturing process of sensors, tantalum wires need to be soldered and fixed to the pads of the sensor PCB to achieve electrical connection. The quality of the tantalum wire soldering directly determines the electrical performance and service life of the sensor. Batch soldering of connected sensor PCBs is the core production requirement of this process.

[0003] In existing technologies, the production of tantalum wire soldering for connected sensor PCBs suffers from the following core defects: In current production models, PCB loading, tantalum wire soldering, scrap trimming, soldering quality inspection, and finished product unloading are all independent and dispersed workstations. Material transfer between these workstations requires manual labor or additional transport equipment, resulting in a lengthy and inefficient production process, significantly increasing costs and hindering continuous production of connected PCB tantalum wire soldering. Existing soldering equipment for connected PCBs lacks a lateral soldering mechanism to coordinate with the soldering mechanism. Soldering multiple positions on a connected PCB requires multiple alignment adjustments or multiple machines performing the work in stages. This leads to poor consistency in soldering positions, resulting in defects such as cold solder joints and misaligned solder joints. Furthermore, continuous soldering production is impossible, and product yield and production efficiency cannot meet the demands of large-scale production. Summary of the Invention

[0004] This invention aims to at least solve the technical problems existing in the prior art. To this end, this invention proposes a PCB tantalum wire welding equipment and welding method, which integrates the entire tantalum wire welding process into the same equipment, realizes continuous production, and significantly improves production efficiency, welding accuracy and product yield.

[0005] According to some embodiments of the first aspect of the present invention, a sensor PCB tantalum wire welding device includes a frame, and a feeding mechanism, an adsorption feeding mechanism, a transverse conveying mechanism, a tantalum wire coil feeding mechanism, a welding mechanism, a cutting mechanism, an adsorption transfer mechanism, a detection mechanism, a detection transfer mechanism, and a unloading mechanism, all disposed on the frame; the feeding mechanism is used to carry the PCB material of a continuous row of sensors; the adsorption feeding mechanism is disposed beside the feeding mechanism and is used for picking up, placing, and transferring the PCB material; the output end of the transverse conveying mechanism is provided with a welding table, the welding table being used to carry the PCB material, and so on. The traverse mechanism drives the welding table to move stepwise along the welding direction; the tantalum wire coil feeding mechanism is used to feed tantalum wire to the welding station; the welding mechanism is located above the moving path of the welding table; the cutting mechanism is located beside the welding mechanism near the tantalum wire coil feeding mechanism; the adsorption and transfer mechanism is located beside the discharge end of the traverse mechanism; the detection and transfer mechanism is located at the bottom of the adsorption and transfer mechanism; the detection mechanism is located at the top of the detection and transfer mechanism and is used to perform welding quality inspection on the welded PCB materials; the unloading mechanism is used to collect good PCB materials. According to some embodiments of the present invention, a sensor PCB tantalum wire welding device includes a feeding mechanism and a discharging mechanism, both of which include a rotary drive motor and a turntable. The turntable is fixed to the output end of the rotary drive motor. The top surface of the turntable is provided with a plurality of material slots for carrying PCB materials along the circumferential direction. A plurality of limiting rods are provided on the outer periphery of each material slot. A first clearance groove is provided in the middle of the bottom of the material slot, and the first clearance groove passes through the edge of the turntable.

[0006] According to some embodiments of the present invention, a tantalum wire welding device for a sensor PCB is provided, wherein a transfer platform is fixedly arranged on the frame, and the adsorption feeding mechanism includes a first linear displacement mechanism, a first lifting adsorption component and a gripper mechanism. A connecting plate is fixedly arranged at the output end of the first linear displacement mechanism, and the first lifting adsorption component and the gripper mechanism are respectively fixedly arranged at the front and rear ends of the connecting plate. The transfer platform is provided with a second clearance groove for the gripper mechanism to extend into and pick up materials.

[0007] According to some embodiments of the present invention, a tantalum wire welding device for a sensor PCB includes a traversing mechanism comprising a linear drive module. The welding table is fixedly mounted on the output end of the linear drive module. A boss is provided on the top of the welding table, and positioning pins are provided at both ends of the boss. The linear drive module can drive the welding table to move stepwise along the welding direction.

[0008] According to some embodiments of the present invention, a sensor PCB tantalum wire soldering device includes a cutting mechanism comprising a mounting base, a telescopic drive mechanism, and pneumatic scissors. The telescopic drive mechanism is disposed on the mounting base, and the cutting blade is fixed to the output end of the telescopic drive mechanism.

[0009] According to some embodiments of the present invention, a sensor PCB tantalum wire soldering device includes a detection and transfer mechanism comprising a support platform and a second linear displacement mechanism. The support platform is fixed to the output end of the second linear displacement mechanism to drive the material through the detection station of the detection mechanism. The detection mechanism includes a vision detection component, the lens of which faces the upper surface of the support platform.

[0010] According to some embodiments of the present invention, a sensor PCB tantalum wire welding device includes an adsorption and transfer mechanism comprising two vertical columns, an X-axis beam, an X-axis linear module, and a second lifting adsorption assembly. The two vertical columns are respectively mounted on a frame, the X-axis beam is horizontally fixed to the top of the two columns, and the X-axis linear module is arranged along the length of the beam. A vertical Z-axis mounting plate is fixed on the slide of the X-axis linear module. The second lifting adsorption assembly includes a second Z-axis lifting cylinder and a second vacuum nozzle assembly. The second Z-axis lifting cylinder is vertically fixed on the Z-axis mounting plate, and a horizontal nozzle mounting plate is fixed to the end of the piston rod of the cylinder. A plurality of second vacuum nozzles are fixed on the bottom surface of the nozzle mounting plate.

[0011] According to some embodiments of the present invention, a tantalum wire soldering device for a sensor PCB is provided on the frame, wherein an NG (Not From Good) product unloading mechanism is provided. The NG product unloading mechanism includes an NG product transverse movement mechanism, a third lifting and adsorption assembly, and an NG material tank. The output end of the NG product transverse movement mechanism is fixedly connected to the third lifting and adsorption assembly. The third lifting and adsorption assembly includes a third Z-axis lifting cylinder and a third vacuum nozzle. The output end of the third Z-axis lifting cylinder is connected to the third vacuum nozzle.

[0012] According to some embodiments of the present invention, a tantalum wire welding device for a sensor PCB includes a tantalum wire coil feeding mechanism comprising a coil hopper, a guide wheel assembly, a feeding drive motor, a drive roller, a driven roller, and a guide needle tube. The coil hopper is mounted on a frame. The guide wheel assembly includes two guide rollers arranged vertically and horizontally. Two fixed columns are mounted on the frame. The guide rollers are rotatably mounted on the fixed columns. The tantalum wire passes through the guide wheel assembly and enters between the drive roller and the driven roller. A wire feeding seat is mounted on the frame. The drive roller is coaxially and fixedly connected to the output shaft of the feeding drive motor. The drive roller and the driven roller are rotatably mounted on the wire feeding seat. A guide needle tube is mounted at one end of the wire feeding seat near the welding mechanism.

[0013] A method for soldering tantalum wires onto a sensor PCB according to some embodiments of the second aspect of the present invention, implemented based on a sensor PCB tantalum wire soldering apparatus according to some embodiments of the first aspect, includes the following steps: S1. The continuous sensor PCB material is output through the feeding mechanism, and the PCB material is transferred to the welding table of the transverse mechanism by the adsorption feeding mechanism. S2. Tantalum wire is fed to the welding station through the tantalum wire coil feeding mechanism. The welding mechanism welds and fixes the tantalum wire to the pads of the PCB. The cutting mechanism cuts off the excess tantalum wire after welding. The transverse mechanism drives the welding table to move step by step to complete the welding of tantalum wire at all positions to be welded on the PCB. S3. The PCB material that has been soldered is transferred to the inspection and transfer mechanism through the adsorption and transfer mechanism, and the inspection mechanism completes the soldering quality inspection of the PCB. S4. PCB materials that pass the inspection are transferred by the adsorption and transfer mechanism to the unloading mechanism for storage.

[0014] The present invention has the following beneficial effects: This invention integrates all core processes of tantalum wire welding for sensor PCBs—including loading, transfer, step welding, tantalum wire feeding, cutting, inspection, and unloading—into a single frame. It completes the entire process of processing a single connected PCB without manual intervention or additional transfer equipment, significantly shortening the processing cycle for a single piece and enabling continuous mass production. The cutting mechanism is positioned next to the welding mechanism near the tantalum wire coil feeding mechanism, directly connecting the welding and cutting processes. Combined with the stepping movement of the traverse mechanism, continuous welding and cutting of all solder positions on the connected PCB can be completed without additional transfer. Simultaneously, the inspection and transfer mechanism is located at the bottom of the adsorption and transfer mechanism, and the inspection mechanism is located at the top, enabling direct transfer and inspection of the welded material without additional handling. This streamlined and efficient inspection process further improves overall production efficiency. The invention uses the traverse mechanism to drive the welding table's stepping movement, combined with the precise feeding of the tantalum wire coil feeding mechanism and the stable welding of the welding mechanism. After welding, quality inspection and storage are automatically completed, perfectly meeting the needs of large-scale mass production of tantalum wire for sensor PCBs.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the feeding mechanism or unloading mechanism according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of the adsorption feeding mechanism and the transfer platform according to an embodiment of the present invention.

[0019] Figure 4This is a schematic diagram of the transverse movement mechanism, welding table, and welding mechanism according to an embodiment of the present invention.

[0020] Figure 5 for Figure 4 Enlarged view of part A in the middle.

[0021] Figure 6 This is a schematic diagram of the adsorption and transfer mechanism according to an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the detection mechanism and the detection transfer mechanism according to an embodiment of the present invention.

[0023] Figure 8 This is a schematic diagram of the tantalum wire coil feeding mechanism and the cutting mechanism according to an embodiment of the present invention.

[0024] Reference numerals: 1. Frame; 2. Feeding mechanism; 3. Adsorption feeding mechanism; 4. Transfer table; 5. Transverse mechanism; 6. Welding table; 7. Tantalum wire coil feeding mechanism; 8. Welding mechanism; 9. Cutting mechanism; 10. Adsorption transfer mechanism; 11. Detection mechanism; 12. Detection transfer mechanism; 13. Unloading mechanism; 14. NG product unloading mechanism; 201. Rotary drive motor; 202. Turntable; 203. Material trough; 204. Limiting rod; 205. First clearance groove. 301. First linear displacement mechanism; 302. Connecting plate; 303. First lifting and adsorption assembly; 304. Gripper mechanism; 305. First Z-axis lifting cylinder; 306. First vacuum nozzle; 307. Gripper lifting cylinder; 308. Parallel gripper cylinder; 309. Gripper; 401. Second clearance groove; 501. Welding linear drive module; 601. Boss; 602. Positioning pin; 701. Coil hopper; 702. Guide wheel assembly; 703. Feeding drive. Motor, 704, Driven Roller, 705, Driven Roller, 706, Guide Needle Tube, 707, Fixed Column, 708, Wire Feeder, 801, Welding Mounting Plate, 802, Lifting Linear Module, 803, Welding Head Mounting Base, 804, Pressure Strip, 805, Welding Head, 806, Inlet Section, 901, Mounting Base, 902, Cutting Telescopic Cylinder, 903, Pneumatic Shears, 101, Vertical Column, 102, X-Axis Beam, 103, X-Axis Linear Module, 1 04. Z-axis mounting plate; 105. Second lifting and adsorption assembly; 1051. Second Z-axis lifting cylinder; 1052. Nozzle mounting plate; 1053. Second vacuum nozzle; 111. Vision inspection assembly; 121. Second linear displacement mechanism; 122. Support platform; 123. Rotary drive mechanism; 141. NG product transverse movement mechanism; 142. Third lifting and adsorption assembly; 143. NG material tank; 144. Third Z-axis lifting cylinder; 145. Third vacuum nozzle. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0026] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, left, right, front, and back, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the module or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0027] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0028] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0029] like Figures 1-8 As shown, this embodiment of the invention provides a tantalum wire welding device for sensor PCBs.

[0030] like Figure 1 As shown, this embodiment provides a tantalum wire welding device for sensor PCBs, including a frame 1, and a feeding mechanism 2, an adsorption feeding mechanism 3, a transfer table 4, a transverse moving mechanism 5, a welding table 6, a tantalum wire roll feeding mechanism 7, a welding mechanism 8, a cutting mechanism 9, an adsorption transferring mechanism 10, a detection mechanism 11, a detection transferring mechanism 12, a feeding mechanism 13, and an NG product feeding mechanism 14, all of which are mounted on the frame 1.

[0031] The feeding mechanism is used to carry the PCB material of the continuous sensor; the adsorption feeding mechanism is located beside the feeding mechanism and is used for picking up, placing and transferring the PCB material; the output end of the transverse mechanism is equipped with a welding table, which is used to carry the PCB material, and the transverse mechanism can drive the welding table to move stepwise along the welding direction; the tantalum wire coil feeding mechanism is used to feed tantalum wire to the welding station; the welding mechanism is located above the moving path of the welding table; the cutting mechanism is located beside the welding mechanism near the tantalum wire coil feeding mechanism; the adsorption transfer mechanism is located beside the discharge end of the transverse mechanism; the detection transfer mechanism is located at the bottom of the adsorption transfer mechanism; the detection mechanism is located at the top of the detection transfer mechanism and is used to perform welding quality detection on the welded PCB material; the unloading mechanism is used to collect good PCB material.

[0032] A protective cover is installed on the outside of the frame 1; a safety door is installed on the front of the protective cover, and a safety light curtain is installed at the safety door. When the safety door is opened during equipment operation, the machine will stop immediately to ensure the safety of equipment operation; an electrical cabinet and a vacuum generator assembly are also installed inside the bottom frame to provide electrical control and vacuum power for the equipment.

[0033] The feeding mechanism 2 is located at the loading end of the equipment mounting plate and is used to carry the PCB materials of the continuous sensor array; the unloading mechanism 13 has the same structure as the feeding mechanism 2 and is located at the unloading end of the equipment mounting plate, used to collect the soldered, finished PCB materials. Figure 3 As shown, both the feeding mechanism 2 and the unloading mechanism 13 include a rotary drive motor 201, a reducer, a turntable 202, and a top-loading mechanism 206. The rotary drive motor 201 is a stepper servo motor. The input end of the reducer is connected to the output shaft of the rotary drive motor 201, and the output end of the reducer is coaxially and fixedly connected to the central rotating shaft of the turntable 202. The top surface of the turntable 202 has eight circumferentially spaced material slots 203 for carrying PCB materials. Each material slot 203 has multiple limiting rods 204 on its outer periphery. Four limiting rods 204 are vertically arranged corresponding to the corners of the PCB materials, which can limit the movement of the PCB materials around their perimeter and prevent the materials from shifting or moving during the rotation of the turntable 202. Each material slot 203 has eight circumferentially spaced material slots 203 for carrying PCB materials. Each of the 03 has a first clearance groove 205 at the bottom center. The first clearance groove 205 extends radially along the turntable 202 and passes through the edge of the turntable 202, so that the gripper mechanism 304 can extend into the bottom of the material trough 203 to realize the bottom lifting and placement of PCB materials. The frame 1 is provided with a top material mechanism 206. The output end of the top material mechanism 206 passes through the material trough 203 to push out the PCB materials. The turntable 202 is also provided with a sensor. The rotation drive motor 201 can drive the turntable 202 to rotate intermittently. Whenever the material in a material trough 203 is removed, the turntable 202 rotates 45° to rotate the next full material trough 203 to the loading position, so as to realize the continuous loading and storage of materials.

[0034] The adsorption feeding mechanism 3 is located beside the feeding mechanism 2 and is used for picking up, placing and transferring PCB materials. A transfer platform 4 is fixedly installed on the frame 1. The transfer platform 4 is located between the feeding mechanism 2 and the transverse moving mechanism 5. The top surface is provided with a positioning groove that matches the shape of the PCB. A second clearance groove 401 is provided in the middle of the positioning groove so that the gripper mechanism 304 can extend into the bottom of the positioning groove to lift and place the PCB materials. This is used for the transfer and buffering of PCB materials, matching the feeding rhythm and the soldering rhythm, and improving the continuity of equipment operation.

[0035] The adsorption feeding mechanism 3 includes a first linear displacement mechanism 301, a first lifting adsorption component 303, and a gripper mechanism 304. The first linear displacement mechanism 301 is an X-axis ball screw module, which is fixed on the top mounting column of the frame 1. The stroke of the first linear displacement mechanism 301 covers the lateral range of the feeding mechanism 2, the transfer table 4, and the transverse movement mechanism 5. A vertical connecting plate 302 is fixed on the slide of the first linear displacement mechanism 301. The first lifting adsorption component 303 and the gripper mechanism 304 are respectively fixed at the front and rear ends of the connecting plate 302. The center distance between the two is equal to the center distance from the material feeding position of the feeding mechanism 2 to the transfer table 4 and from the transfer table 4 to the welding table 6, so that the material picking and placing actions of the two stations can be completed simultaneously.

[0036] The first lifting and adsorption assembly 303 includes a first Z-axis lifting cylinder 305 and a first vacuum nozzle 306, with the first vacuum nozzle 306 fixed to the piston rod end of the first Z-axis lifting cylinder 305. The gripper mechanism 304 includes a gripper lifting cylinder 307, a parallel gripper cylinder 308, and a gripper 309, with the parallel gripper cylinder 308 fixed to the piston rod end of the gripper lifting cylinder 307 and the gripper 309 fixed to the gripper finger of the parallel gripper cylinder 308, enabling opening and closing gripping actions. The adsorption feeding mechanism 3 can simultaneously complete the material picking and unloading actions between the feeding mechanism 2, the transfer station 4, and the welding station 6. That is, while the front-end gripper mechanism 304 picks up material from the feeding mechanism 2 to the transfer station 4, the rear-end first lifting and adsorption assembly 303 picks up material from the transfer station 4 to the welding station 6, significantly improving the feeding efficiency.

[0037] The transverse movement mechanism 5 includes a welding linear drive module 501, which is horizontally fixed to the middle of the equipment mounting plate along the welding direction. Both ends of the welding linear drive module 501 are fixed with a welding transverse movement slot-type photoelectric origin sensor and a welding transverse movement limit sensor. The welding table 6 is fixedly mounted on the slide of the welding linear drive module 501 and is used to carry PCB materials. The welding linear drive module 501 can drive the welding table 6 to move stepwise along the welding direction. The single step distance matches the spacing between adjacent sensor solder joints on the PCB, enabling continuous welding of all solder joints on a row of PCBs. The welding table 6 is made of aluminum alloy and has an integrally formed boss 6 on its top. 01. The width of the boss 601 perfectly matches the width of the PCB material, providing precise left and right positioning to prevent lateral displacement after placement. Positioning pins 602 are fixed at both ends of the boss 601 for precise positioning of the PCB material. Positioning holes are provided on both sides of the PCB material. Multiple vacuum adsorption holes are arrayed on the top surface of the boss 601, each corresponding to a sensor unit on the PCB. A vacuum connector is fixed to the side of the soldering station 6, connected to a vacuum generator via an air pipe, allowing for adsorption and fixation of the PCB material to prevent displacement during soldering. Figure 6 As shown, the tantalum wire coil feeding mechanism 7 is used to feed tantalum wire to the welding station. It includes a coil bin 701, a guide wheel assembly 702, a feeding drive motor 703, a drive roller 704, a driven roller 705, and a guide needle tube 706. The coil bin 701 is fixedly mounted on the rear upright plate of the frame 1 and is used to hold the tantalum wire coil. The guide wheel assembly 702 includes two guide wheels arranged vertically and vertically. Two fixed columns 707 are correspondingly mounted on the frame 1. The two guide wheels are rotatably mounted on the two fixed columns 707 through bearings. After the tantalum wire is drawn out from the coil bin 701, it passes through the guide wheel assembly 702 to achieve tension and guidance, and then enters between the drive roller 704 and the driven roller 705. A wire feeder 708 is fixedly installed on the frame 1. The drive roller 704 is coaxially and fixedly connected to the output shaft of the feed drive motor 703 through a coupling. The drive roller 704 and the driven roller 705 are rotatably mounted on the wire feeder 708 through bearings. A hard alloy guide needle tube 706 is fixedly installed at one end of the wire feeder 708 near the welding mechanism 8. The inner hole of the guide needle tube 706 is clearance-fitted with the diameter of the tantalum wire. After the tantalum wire passes through the drive roller 704 and the driven roller 705, it is precisely guided by the guide needle tube 706 and then transported to the welding station. The feed drive motor 703 is a high-precision stepper motor, which can accurately control the feeding length of the tantalum wire and ensure the consistency of each feeding.

[0038] The welding mechanism 8 is located above the moving path of the welding table 6. Solder is pre-set at the welding positions on the PCB. The welding mechanism 8 includes a welding mounting plate 801, a lifting linear module 802, a welding head mounting base 803, and a welding head 805. The welding mounting plate 801 is vertically fixed to the equipment mounting plate, and the lifting linear module 802 is vertically fixed to the front end of the welding mounting plate 801. The output end of the lifting linear module 802 is fixedly connected to the welding head mounting base 803. The welding end of the welding head 805 faces the welding table 6 below. The middle part of the welding mechanism 8... A pressure strip 804 is provided at the front end, which is located on the top of the welding table 6. An inlet 806 is provided at the end of the pressure strip 804 near the adsorption feeding mechanism. The inlet 806 is tilted upward. When the welding table 6 moves laterally to the bottom of the welding mechanism 8, the pressure strip 804 presses down the PCB material on the boss 601 to position the PCB material during welding. The inlet 806 facilitates the introduction of the boss 601. When the boss 601 moves to the bottom of the welding mechanism 8, the pressure strip 804 is exactly on the side of the positioning pin 602 near the welding mechanism 8.

[0039] The cutting mechanism 9 is located on the side of the welding mechanism 8 near the tantalum wire coil feeding mechanism 7. It includes a mounting base 901, a cutting telescopic cylinder 902, and a pneumatic scissor 903. The mounting base 901 is fixed to the feeding side of the welding mounting plate 801. The cutting telescopic cylinder 902 is horizontally fixed on the mounting base 901. The pneumatic scissor 903 is fixed to the output end of the cutting telescopic cylinder 902 by locking bolts. It can complete the horizontal telescopic movement under the drive of the cutting telescopic cylinder 902. After welding is completed, the cutting telescopic cylinder 902 drives the pneumatic scissor 903 to extend to the cutting position. The pneumatic scissor 903 closes to complete the tantalum wire cutting. After cutting, it resets to avoid interference with the welding operation.

[0040] The adsorption and transfer mechanism 10 is located beside the discharge end of the transverse transfer mechanism 5 and is used to transfer the PCB materials to be soldered. It includes two vertical columns 101, an X-axis beam 102, an X-axis linear module 103, and a second lifting adsorption assembly 105. The two vertical columns 101 are respectively vertically fixed on the frame 1 and are located on the left and right sides of the transverse transfer mechanism 5. The X-axis beam 102 is horizontally fixed to the top of the two columns 101. The X-axis linear module 103 is arranged along the length of the X-axis beam 102. The stroke of the module covers the transverse range of the soldering table 6, the detection and transfer mechanism 12, and the unloading mechanism 13. A vertical Z-axis mounting plate 104 is fixed on the slide of the X-axis linear module 103. The second lifting adsorption assembly 105 includes a second Z-axis lifting cylinder 1051 and a second vacuum nozzle assembly. The second Z-axis lifting cylinder 1051 is vertically fixed on the Z-axis mounting plate 104. A horizontal nozzle mounting plate 1052 is fixed to the end of the piston rod of the cylinder. Four second vacuum nozzles 1053 are fixed on the bottom surface of the nozzle mounting plate 1052. The four second vacuum nozzles 1053 are respectively located at the four corners of the nozzle mounting plate 1052, matching the length and width of the PCB, so as to realize the stable adsorption and transfer of PCB materials.

[0041] The detection and transfer mechanism 12 is located at the bottom of the adsorption and transfer mechanism 10, and includes a support platform 122 and a second linear displacement mechanism 121. The second linear displacement mechanism 121 is a high-precision linear module, which is horizontally fixed on the frame 1 in a direction perpendicular to the transverse transfer mechanism 5. A detection displacement origin sensor and a detection displacement limit sensor are fixed at both ends of the second linear displacement mechanism 121. The support platform 122 is fixed on the slide output end of the second linear displacement mechanism 121. The top surface of the support platform 122 has a positioning groove matching the shape of the PCB, and a vacuum adsorption hole is provided in the groove to fix the PCB material to be detected. The second linear displacement mechanism 121 can drive the support platform 122 to move the material at a uniform speed through the detection mechanism 11. Inspection station; Inspection mechanism 11 is set on top of inspection and transfer mechanism 12, including vision inspection component 111. Vision inspection component 111 consists of an industrial camera, a fixed-focus lens and a ring light source. Inspection mechanism 11 is fixed on frame 1 by gantry bracket. The industrial camera is fixed vertically downward. The fixed-focus lens is installed at the front end of the industrial camera. The ring light source is coaxially set below the fixed-focus lens through bracket. The illumination surface of the ring light source faces the upper surface of the support platform 122. The industrial camera is connected to the industrial control computer of the equipment through network cable. The industrial control computer is equipped with a deep learning-based image recognition algorithm, which can identify welding defects such as cold solder joints, off-center solder joints, missing solder joints, and tantalum wire length discrepancies, and complete welding quality inspection and good / NG product determination.

[0042] The frame 1 is also equipped with an NG product unloading mechanism 14, which includes an NG product transverse movement mechanism 141, a third lifting and adsorption assembly 142, and an NG material tank 143. The NG product transverse movement mechanism 141 is a high-precision linear module, which is horizontally fixed to the side of the detection and transfer mechanism 12. Its stroke covers the detection station of the detection and transfer mechanism 12 and the top of the NG material tank 143. The third lifting and adsorption assembly 142 includes a third Z-axis lifting cylinder 144 and a third vacuum nozzle 145. The third Z-axis lifting cylinder 144 is vertically fixed to the output end of the NG product transverse movement mechanism 141 and can complete horizontal displacement under the drive of the NG product transverse movement mechanism 141. The third vacuum nozzle 145 is fixed to the piston rod end of the third Z-axis lifting cylinder and is used to adsorb defective PCBs after detection. The NG material tank 143 is located at the end of the stroke of the NG product transverse movement mechanism 141 and is used to collect defective PCBs to achieve the classification and collection of good and defective products.

[0043] This embodiment provides a method for soldering tantalum wires onto a sensor PCB, implemented using the aforementioned soldering equipment, and includes the following steps: S1 Loading Step: The rotary drive motor 201 of the feeding mechanism 2 drives the turntable 202 to rotate, rotating the material tank 203 containing the row of sensor PCBs to the loading position. The first linear displacement mechanism 301 of the adsorption feeding mechanism 3 drives the connecting plate 302 to move to the corresponding work position. The first lifting adsorption component 303 and the gripper mechanism 304 descend synchronously. The gripper mechanism 304 extends into the bottom of the material tank 203 through the first clearance groove 205, and works with the first lifting adsorption component 303 to take the PCB material out of the material tank 203 of the feeding mechanism 2 and transfer it to the transfer table 4. Then, through the cooperation of the second clearance groove 401 of the transfer table 4, the PCB material on the transfer table 4 is synchronously transferred to the welding table 6 of the transverse movement mechanism 5. The welding table 6 completes the positioning and fixing of the PCB material through the boss 601, the positioning pin 602 and vacuum adsorption.

[0044] S2 Welding Steps: The feeding drive motor 703 of the tantalum wire coil feeding mechanism 7 operates, cooperating with the active roller 704 and the driven roller 705 to feed a tantalum wire of a set length to the welding station. The tantalum wire is precisely guided to the solder pad on the PCB by the guide needle tube 706. The lifting linear module 802 of the welding mechanism 8 drives the welding head 805 to move downward, applying a set welding pressure to the tantalum wire and the PCB solder pad. At the same time, the ultrasonic transducer 804 is activated to weld and fix the tantalum wire to the solder pad on the PCB. After welding, the welding head 805 rises and resets. The cutting telescopic cylinder 902 of the cutting mechanism 9 drives the pneumatic scissors 903 to extend to the cutting position. The pneumatic scissors 903 closes to cut off the excess tantalum wire after welding. After cutting, the pneumatic scissors 903 resets. The transverse movement mechanism 5 drives the welding table 6 to move one welding position spacing along the welding direction, repeating the welding and cutting actions until all solder pads on the PCB have been welded with tantalum wire.

[0045] S3 Inspection Steps: The X-axis linear module 103 of the adsorption and transfer mechanism 10 drives the second lifting adsorption component 105 to move above the welding station 6, lifting the PCB material that has completed all welding positions and transferring it to the carrier platform 122 of the inspection and transfer mechanism 12. The bottom of the carrier platform 122 is equipped with a rotary drive mechanism 123. The carrier platform 122 fixes the PCB by vacuum adsorption, and the rotary drive mechanism 123 drives the PCB material to turn, so that the PCB can pass through the vision inspection component 111 one by one. The second linear displacement mechanism 121 of the inspection and transfer mechanism 12 drives the carrier platform 122 to move at a uniform speed, so that the PCB passes through the inspection station of the inspection mechanism 11. The inspection mechanism 11 collects the welding images of all welding positions of the PCB through the vision inspection component 111 and transmits them to the industrial control computer. The welding quality is judged by the image recognition algorithm, and qualified good products and unqualified NG products are distinguished.

[0046] S4 Unloading Step: PCB materials that are determined to be qualified (good) are transferred by the adsorption and transfer mechanism 10 to the material tank 203 of the unloading mechanism 13. The turntable 202 of the unloading mechanism 13 rotates intermittently to complete the continuous collection of good products. PCB materials that are determined to be defective (NG) are moved by the NG product horizontal transfer mechanism 141 of the NG product unloading mechanism 14, which drives the third lifting adsorption component 142 to adsorb defective PCBs and transfer them to the NG material tank 143 to complete the individual collection of defective products. This completes the entire process of processing a single PCB.

[0047] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A sensor PCB tantalum wire soldering device, characterized in that: The system includes a frame, and on the frame are a feeding mechanism, an adsorption feeding mechanism, a transverse conveying mechanism, a tantalum wire coil feeding mechanism, a welding mechanism, a cutting mechanism, an adsorption transfer mechanism, a detection mechanism, a detection transfer mechanism, and a unloading mechanism. The feeding mechanism is used to carry the PCB material of the continuous sensor. The adsorption feeding mechanism is located beside the feeding mechanism and is used for picking up, placing, and transferring the PCB material. The output end of the transverse conveying mechanism is equipped with a welding table, which is used to carry the PCB material. The transverse conveying mechanism can drive the welding table to move stepwise along the welding direction. The tantalum wire coil feeding mechanism is used to feed tantalum wire to the welding station. The welding mechanism is located above the moving path of the welding table; the cutting mechanism is located beside the welding mechanism near the tantalum wire coil feeding mechanism; the adsorption and transfer mechanism is located beside the discharge end of the transverse transfer mechanism; the detection and transfer mechanism is located at the bottom of the adsorption and transfer mechanism; the detection mechanism is located at the top of the detection and transfer mechanism and is used to detect the welding quality of the welded PCB materials; the unloading mechanism is used to collect good PCB materials; a pressure bar is provided at the front end of the middle of the welding mechanism; the pressure bar is located at the top of the welding table; and an inlet is provided at the end of the pressure bar near the adsorption and feeding mechanism.

2. The sensor PCB tantalum wire soldering equipment according to claim 1, characterized in that: Both the feeding mechanism and the unloading mechanism include a rotary drive motor and a turntable. The turntable is fixed to the output end of the rotary drive motor. The top surface of the turntable has multiple circumferential grooves for carrying PCB materials. Multiple limiting rods are provided on the outer periphery of each groove. A first clearance groove is provided in the middle of the bottom of the groove, and the first clearance groove passes through the edge of the turntable.

3. The sensor PCB tantalum wire soldering equipment according to claim 1, characterized in that, A transfer platform is fixedly installed on the frame. The adsorption feeding mechanism includes a first linear displacement mechanism, a first lifting adsorption component, and a gripper mechanism. A connecting plate is fixedly installed at the output end of the first linear displacement mechanism. The first lifting adsorption component and the gripper mechanism are respectively fixedly installed at the front and rear ends of the connecting plate. The transfer platform is provided with a second clearance groove for the gripper mechanism to extend into and pick up / place materials.

4. The sensor PCB tantalum wire soldering equipment according to claim 1, characterized in that, The traverse mechanism includes a linear drive module. The welding table is fixedly installed at the output end of the linear drive module. A boss is provided on the top of the welding table, and positioning pins are provided at both ends of the boss. The linear drive module can drive the welding table to move stepwise along the welding direction.

5. The sensor PCB tantalum wire soldering equipment according to claim 1, characterized in that, The cutting mechanism includes a mounting base, a telescopic drive mechanism, and pneumatic scissors. The telescopic drive mechanism is mounted on the mounting base, and the cutting blade is fixed to the output end of the telescopic drive mechanism.

6. The sensor PCB tantalum wire soldering equipment according to claim 1, characterized in that, The detection and transfer mechanism includes a support platform and a second linear displacement mechanism. The support platform is fixed to the output end of the second linear displacement mechanism to drive the material through the detection station of the detection mechanism. The detection mechanism includes a vision detection component, and the lens of the vision detection component faces the upper surface of the support platform.

7. The sensor PCB tantalum wire soldering equipment according to claim 1, characterized in that: The adsorption and transfer mechanism includes two vertical columns, an X-axis beam, an X-axis linear module, and a second lifting adsorption assembly. The two vertical columns are respectively mounted on the frame, and the X-axis beam is horizontally fixed to the top of the two columns. The X-axis linear module is arranged along the length of the beam. A vertical Z-axis mounting plate is fixed on the slide of the X-axis linear module. The second lifting adsorption assembly includes a second Z-axis lifting cylinder and a second vacuum nozzle assembly. The second Z-axis lifting cylinder is vertically fixed on the Z-axis mounting plate, and a horizontal nozzle mounting plate is fixed to the end of the piston rod of the cylinder. Several second vacuum nozzles are fixed on the bottom surface of the nozzle mounting plate.

8. The sensor PCB tantalum wire soldering equipment according to claim 1, characterized in that: The frame is also equipped with an NG product unloading mechanism, which includes an NG product transverse movement mechanism, a third lifting and adsorption component and an NG material tank. The output end of the NG product transverse movement mechanism is fixedly connected to the third lifting and adsorption component. The third lifting and adsorption component includes a third Z-axis lifting cylinder and a third vacuum nozzle. The output end of the third Z-axis lifting cylinder is connected to the third vacuum nozzle.

9. The sensor PCB tantalum wire soldering equipment according to claim 1, characterized in that, The tantalum wire coil feeding mechanism includes a coil bin, a guide wheel assembly, a feeding drive motor, a drive roller, a driven roller, and a guide needle tube. The coil bin is mounted on a frame. The guide wheel assembly includes two guide wheels arranged vertically and horizontally. Two fixed columns are mounted on the frame. The guide wheels are rotatably mounted on the fixed columns. The tantalum wire passes through the guide wheel assembly and enters between the drive roller and the driven roller. A wire feeding seat is mounted on the frame. The drive roller is coaxially and fixedly connected to the output shaft of the feeding drive motor. The drive roller and the driven roller are rotatably mounted on the wire feeding seat. A guide needle tube is mounted at one end of the wire feeding seat near the welding mechanism.

10. A method for soldering tantalum wires onto a sensor PCB, implemented using the soldering equipment described in any one of claims 1-9, characterized in that... Includes the following steps: S1. The continuous sensor PCB material is output through the feeding mechanism, and the PCB material is transferred to the welding table of the transverse mechanism by the adsorption feeding mechanism. S2. Tantalum wire is fed to the welding station through the tantalum wire coil feeding mechanism. The welding mechanism welds and fixes the tantalum wire to the pads of the PCB. The cutting mechanism cuts off the excess tantalum wire after welding. The transverse mechanism drives the welding table to move step by step to complete the welding of tantalum wire at all positions to be welded on the PCB. S3. The PCB material that has been soldered is transferred to the inspection and transfer mechanism through the adsorption and transfer mechanism, and the inspection mechanism completes the soldering quality inspection of the PCB. S4. PCB materials that pass the inspection are transferred by the adsorption and transfer mechanism to the unloading mechanism for storage.

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