Display device and electronic device including the same

Abstract

A display device and an electronic device including the same are disclosed. The display device includes a display area including a plurality of emission areas, a plurality of display elements respectively located in the plurality of emission areas and configured to emit different colors of light, each of the plurality of display elements including a pixel electrode, an intermediate layer, and a counter electrode in which a plurality of openings are defined, and an anti-reflection layer on the plurality of display elements, the anti-reflection layer including a plurality of color filters respectively corresponding to the plurality of display elements. In a same emission area among the plurality of emission areas, sizes or shapes of the plurality of openings defined in the counter electrode are different from each other, while a maximum size of each of the plurality of openings in the same emission area is in a range of about 1 micrometer to about 10 micrometers.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2025-0015294, filed on February 6, 2025, and all benefits derived therefrom, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] One or more embodiments relate to an apparatus. More specifically, one or more embodiments relate to a display apparatus and an electronic device including the display apparatus. Background Technology

[0003] Mobile electronic devices are widely used. Tablet PCs and miniaturized electronic devices such as mobile phones are widely used as mobile electronic devices.

[0004] To support various functions, such as providing users with visual information like images, such mobile electronic devices include display devices. As the components configured to drive the display device have been miniaturized, the proportion of the display device in electronic devices has gradually increased, leading to the development of structures within the display device (or electronic device) that can be bent from a flat state to a preset angle. Summary of the Invention

[0005] Generally, when a display device including a color filter is operating, reflected color bands observed due to external light may overlap with color bands in the displayed image. In this case, the display device and the electronic device including the display device may not be able to provide a clear image of the displayed image. One or more embodiments include a display device capable of providing a clear image and an electronic device including the display device.

[0006] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description or may be learned by practice of the embodiments of the present disclosure presented.

[0007] According to one or more embodiments, a display device includes: a substrate including a display area; a plurality of display elements disposed in the display area, each including sequentially stacked pixel electrodes, an intermediate layer and a counter electrode, and configured to emit light of different colors; and an anti-reflective layer disposed on the plurality of display elements and including a plurality of color filters corresponding to the plurality of display elements respectively, wherein the counter electrode is disposed in a region corresponding to the emission area of ​​each of the plurality of display elements and includes a plurality of openings, at least one of the sizes and shapes of the plurality of openings being different from each other, and the maximum width of each of the plurality of openings being in the range of about 1 micrometer (µm) to about 10 micrometers (µm).

[0008] In an embodiment, at least two openings may be provided in the emission area of ​​each display element, and one of the at least two openings and the other of the at least two openings may differ in at least one aspect of size and shape.

[0009] In an embodiment, the display device may further include: an encapsulation layer disposed on the display element, and including at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0010] In an embodiment, at least a portion of one of the organic encapsulation layer and the inorganic encapsulation layer may be inserted into a portion of at least one of the plurality of openings.

[0011] In an embodiment, the display device may further include a cover layer disposed between the counter electrode and the encapsulation layer.

[0012] In one embodiment, at least a portion of the capping layer may be inserted into at least one of the plurality of openings.

[0013] In an embodiment, the opening may have a hole shape.

[0014] In an embodiment, the display device may further include an upper planarization layer disposed on the counter electrode.

[0015] In one embodiment, the counter electrode can be configured to completely cover the display area.

[0016] In an embodiment, the anti-reflective layer may further include a light-shielding layer comprising a plurality of opening regions configured to correspond respectively to a plurality of display elements.

[0017] According to one or more embodiments, an electronic device includes a display device, the display device comprising: a substrate including a display area; a plurality of display elements disposed in the display area, each including sequentially stacked pixel electrodes, an intermediate layer and a counter electrode, and configured to emit light of different colors; and an anti-reflective layer disposed on the plurality of display elements, and including a plurality of color filters respectively corresponding to the plurality of display elements, wherein the counter electrode is disposed in a region corresponding to the emission area of ​​each of the plurality of display elements and includes a plurality of openings, at least one of the sizes and shapes of the plurality of openings being different from each other, and the maximum width of each of the plurality of openings being in the range of about 1µm to about 10µm.

[0018] In an embodiment, at least two openings may be provided in the emission area of ​​each display element, and one of the at least two openings and the other of the at least two openings may differ in at least one aspect of size and shape.

[0019] In an embodiment, the display device may further include: an encapsulation layer disposed on the display element, and including at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0020] In an embodiment, at least a portion of one of the organic encapsulation layer and the inorganic encapsulation layer may be inserted into a portion of at least one of the plurality of openings.

[0021] In an embodiment, the display device may further include a cover layer disposed between the counter electrode and the encapsulation layer.

[0022] In one embodiment, at least a portion of the capping layer may be inserted into at least one of the plurality of openings.

[0023] In an embodiment, the opening may have a hole shape.

[0024] In an embodiment, the display device may further include an upper planarization layer disposed on the counter electrode.

[0025] In one embodiment, the counter electrode can be configured to completely cover the display area.

[0026] In an embodiment, the anti-reflective layer may further include a light-shielding layer comprising a plurality of opening regions configured to correspond respectively to a plurality of display elements.

[0027] From the following detailed description, drawings and claims of the invention, aspects, features and advantages other than those described above will become apparent. Attached Figure Description

[0028] The above and other aspects, features, and advantages of embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 This is a block diagram of an electronic device according to an embodiment;

[0030] Figures 2 to 4 These are schematic diagrams of electronic devices according to various embodiments;

[0031] Figure 5 This is a schematic perspective view of an electronic device according to an embodiment;

[0032] Figure 6 yes Figure 5 A schematic exploded perspective view of the electronic device shown in the figure;

[0033] Figure 7A yes Figure 6 A schematic plan view of a portion of the display device shown in the figure;

[0034] Figure 7B yes Figure 7A A schematic side view of a portion of the display device shown in the image;

[0035] Figure 8 yes Figure 6 A schematic plan view of a portion of the display device shown in the figure;

[0036] Figure 9 It is set in Figure 8 The diagram shows a schematic circuit of a sub-pixel in the display area.

[0037] Figure 10A and Figure 10B yes Figure 6 A schematic cross-sectional view of a portion of the display device shown in the figure;

[0038] Figure 11 It is set in Figure 6 A schematic enlarged plan view of a portion of the display device within a portion of the display area shown in the figure;

[0039] Figure 12A and Figure 12B It is along Figure 11 A cross-sectional view of the display device taken by line B-B';

[0040] Figures 13A to 13H According to the embodiments Figure 11 A schematic plan view of the opening shown in the figure;

[0041] Figure 14A and Figure 14B It is along Figure 11 A schematic cross-sectional view of the display device taken by line B-B'; and

[0042] Figure 15A and Figure 15B It is along Figure 11 A schematic cross-sectional view of the display device taken by line B-B'. Detailed Implementation

[0043] Reference will now be made in detail to embodiments illustrated in the accompanying drawings, in which the same reference numerals refer to the same elements throughout. In this respect, the present embodiments may take different forms and should not be construed as limited to the description set forth herein. Accordingly, embodiments are described below only with reference to the accompanying drawings to illustrate aspects of the present description.

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. Thus, reference to an element “a” followed by reference to an element in a claim includes one such element and a plurality of such elements. For example, “element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” is not to be construed as limited to “a.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0045] Because this disclosure allows for various modifications and numerous embodiments, the embodiments will be illustrated in the accompanying drawings and described in a detailed description. The effects and features of this disclosure and its implementation methods will be elucidated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments described below and can be implemented in various forms.

[0046] In the following description, embodiments will be referenced to the accompanying drawings, wherein, when described with reference to the drawings, the same or corresponding elements are given the same reference numerals, and repeated descriptions thereof are omitted. Within the drawings and text of this disclosure, reference numerals indicating elements in the singular form may also be used to refer to multiple elements.

[0047] In the following embodiments, terms such as “first” and “second” are not used in a limiting sense, but rather for the purpose of distinguishing one element from another.

[0048] In the following embodiments, unless the context explicitly indicates otherwise, singular expressions include plural expressions.

[0049] It will be understood that the terms “comprising” or “including” as used herein indicate the presence of a stated feature or component, but do not preclude the addition of one or more other features or components.

[0050] In the following embodiments, when a layer, region, or element is referred to as being "on" another part or related to another part, this can include not only cases where the layer, region, or element is directly on the other part, but also cases where an intermediary layer, region, or element is disposed between the layer, region, or element and the other part. Conversely, when a layer, region, or element is referred to as being "directly" on another part or related to another part, no intermediary layer, region, or element is disposed therein. For example, elements that are directly on or in contact with each other may (physically) form an interface therebetween.

[0051] For ease of explanation, the dimensions of the elements in the accompanying drawings may be exaggerated or reduced. By way of example, the dimensions and thicknesses of each element shown in the drawings are arbitrarily represented for ease of description, and therefore, this disclosure is not necessarily limited thereto.

[0052] In the following embodiments, the x-axis, y-axis, and z-axis directions are not limited to directions corresponding to the three axes of a Cartesian coordinate system, and can be interpreted in a general sense that includes them. For example, the x-axis, y-axis, and z-axis directions can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0053] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the relative terms are intended to also cover different orientations of the device. For example, if a device in one of the drawings is flipped, an element described as being “down” of the other elements will be oriented “up” of the other elements. Thus, depending on the specific orientation of the drawing, the term “down” can encompass both “down” and “up” orientations. Similarly, if a device in one of the drawings is flipped, an element described as being “below” or “under” the other elements will be oriented “above” the other elements. Thus, the terms “below” or “under” can encompass both “up” and “down” orientations.

[0054] Where embodiments may be implemented differently, a particular process sequence may be performed in a different order than that described. As an example, two processes described consecutively may be performed substantially simultaneously, or may be performed in the reverse order described.

[0055] Given the measurements discussed and the errors associated with the measured values ​​of a particular quantity (i.e., limitations of the measurement system), the terms “about” or “approximately” as used herein include stated values ​​and refer to a range of acceptable deviations from that particular value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0056] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms such as those defined in common dictionaries shall be interpreted as having the same meaning as they have in the relevant art and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense, unless expressly so defined herein.

[0057] The embodiments described herein are illustrated with reference to schematic cross-sectional views of preferred embodiments. Therefore, variations in the illustrated shapes will be expected due to factors such as manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but rather include deviations in shape, for example, resulting from manufacturing processes. For instance, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the regions, nor are they intended to limit the scope of the present claims.

[0058] Figure 1 This is a block diagram of electronic device 1 according to an embodiment.

[0059] refer to Figure 1 The electronic device 1 according to the embodiment may include a display module 2, a processor 3, a memory 4, and a power module 5. The display module 2 may include a display panel 10 (see...). Figure 6 One or more embodiments of ).

[0060] Processor 3 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller. In embodiments, from a functional or structural perspective, processor 3 may be divided into two or more parts. As an example, processor 3 may include a main processor in the form of a first driver chip including a central processing unit and an auxiliary processor in the form of a second driver chip including a controller, wherein the auxiliary processor receives image signals from the main processor and processes the image signals to match the interface specifications of display module 2.

[0061] The memory 4 may include at least one of non-volatile memory and volatile memory. The memory 4 may store data information required for the operation of the processor 3 or the display module 2. When the processor 3 executes the application stored in the memory 4, image data signals and / or input control signals may be transmitted to the display module 2, and the display module 2 may process the provided signals and output image information through the display screen.

[0062] The power module 5 may include a power supply module such as a power adapter or battery cell, and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 1. The power conversion of the power conversion module may include, but is not limited to, DC-DC conversion, AC-DC conversion, and DC-AC conversion.

[0063] The electronic device 1 may further include an input module 6, a non-image output module 7, and / or a communication module 8.

[0064] Input module 6 can provide input information to processor 3 and / or display module 2. Input module 6 may include not only physical buttons, keyboards, and microphones, but also various sensor modules. Examples of sensor modules may include not only touch sensors, pressure sensors, distance sensors, position sensors, digitizers, motion recognition sensors, camera sensors, photodetectors, photoelectric conversion sensors, and temperature sensors, but also biometric sensors such as blood pressure sensors, blood glucose sensors, electrocardiogram sensors, and heart rate sensors.

[0065] The non-image output module 7 can receive information other than the image received from the processor 3 and can provide that information to the user. Examples of the non-image output module 7 may include a sound module, a tactile module, and / or a light-emitting module, and may include unique functional modules of other devices (e.g., a cooling module of a refrigerator).

[0066] The communication module 8 is configured to send / receive information between the electronic device 1 and an external device, and may include a receiver and a transmitter. The communication module 8 may include various wireless communication modules such as mobile communication modules, Wi-Fi (Wireless Fidelity) modules, and Bluetooth modules, and may also include various wired communication modules.

[0067] At least one of the components of electronic device 1 may be included in the display device DV (see embodiment) according to the embodiment. Figure 6 In addition, some of the modules mentioned above can be included in the display device DV, and some other modules can be provided separately from the display device DV. As an example, the display device DV may include display module 2, and processor 3, memory 4, and power module 5 may be provided in electronic device 1 instead of display device DV. As another example, power module 5 may be located in display device DV and can provide power to processor 3 and memory 4 provided in electronic device 1 instead of display device DV, and is not limited thereto.

[0068] Figures 2 to 4 This is a schematic diagram of an electronic device 1 according to various embodiments. Figures 2 to 4Examples of various electronic devices to which the display device DV is applied according to embodiments are shown.

[0069] Figure 2 Examples of electronic device 1 are shown, including a smartphone 1_1a, a tablet PC 1_1b, a laptop computer 1_1c, a TV 1_1d, and a desktop monitor 1_1e.

[0070] In addition to the display module 2, the smartphone 1_1a may also include an input module such as a touch sensor and a communication module. The smartphone 1_1a can process information received through the communication module or other input modules, and can display that information through the display module 2 of the display device DV.

[0071] Similar to smartphone 1_1a, tablet PC 1_1b, laptop computer 1_1c, TV 1_1d and desktop monitor 1_1e may include display module 2 and input module, and may further include communication module depending on the embodiment.

[0072] Figure 3 The example shown illustrates the application of an electronic device 1, including a display module 2, to a wearable electronic device. The wearable electronic device may include smart glasses 1_2a, a head-mounted display 1_2b, and a smartwatch 1_2c.

[0073] The smart glasses 1_2a and the head-mounted display 1_2b may include a display module 2 that outputs images through the display screen and a reflector that reflects the output from the display screen. That is, the display module 2 can provide images to the outside of the electronic device 1 (e.g., to a user) through the display screen. The display module 2 can provide virtual reality or augmented reality images to the user through the display screen.

[0074] The smartwatch 1_2c may include a biometric sensor as an input device and may provide the user with biometric information identified by the biometric sensor through the display module 2.

[0075] Figure 4 The example shown illustrates the application of electronic device 1, including display module 2, to a vehicle. As an example, electronic device 1_3 can be applied to a vehicle's dashboard or central instrument panel, or it can be applied to a central information display (CID) mounted on the vehicle's dashboard or an interior mirror display that replaces the side mirrors.

[0076] Although not shown, the electronic device 1 to which the display device DV is applied according to the embodiment can include not only display-based devices such as billboards, electronic boards, and / or game consoles, but also various household appliances such as refrigerators, washing machines, dryers, air conditioners, and / or robotic vacuum cleaners that display information via the display module 2. Furthermore, where the display module 2 has the function of transmitting light, the display module 2 can be applied to electronic devices 1 such as smart windows or transparent display devices that display the background and the displayed image together. The types of electronic devices 1 according to the embodiment are not limited to this example, and various other electronic devices not shown as examples can be applied.

[0077] For ease of description, the following text will primarily focus on the case where electronic device 1 is a smartphone.

[0078] Figure 5 This is a schematic perspective view of electronic device 1 according to an embodiment. Figure 6 yes Figure 5 A schematic exploded perspective view of the electronic device 1 shown in the figure.

[0079] refer to Figure 5 and Figure 6 The electronic device 1 may include a display device DV comprising a cover window 70, a display panel 10, a data driver 20 and a display circuit board 30 as a first circuit board, a component 40, a bracket 60 as an intermediate cover, a main circuit board 50 as a second circuit board, a battery 80 and / or a lower cover 90.

[0080] In the plan view of this specification, "left," "right," "up," and "down" indicate the directions when the display panel 10 is viewed in a direction perpendicular to (e.g., orthogonal to the main surface of the display panel 10). As an example, "left" represents the -x direction, "right" represents the +x direction, "up" represents the +y direction, and "down" represents the -y direction.

[0081] Electronic device 1 can be shown in a plan view as having a generally rectangular shape. For example, as shown... Figure 5 As shown, in the xy-plane, electronic device 1 can have a generally rectangular shape, having a shorter side in the x-axis direction and a longer side in the y-axis direction. The xy-plane can be defined by intersecting x-axis directions (as a first direction) and y-axis directions (as a second direction). The thickness of electronic device 1, display module 2, and its various components or layers can be defined in a direction orthogonal (or perpendicular) to the xy-plane (e.g., along the z-axis direction (as a third direction, such as the thickness direction)).

[0082] In this case, the edge or perimeter where the short side extending in the x-axis direction intersects the long side extending in the y-axis direction can form a right angle, or it can have an arc shape containing a preset curvature. In the planar view, the planar shape of the electronic device 1 is not limited to a rectangle, but can include other polygonal shapes, elliptical shapes, or irregular planar shapes.

[0083] A cover window 70 can be disposed on the display panel 10 to cover the upper surface of the display panel 10. The cover window 70 can protect the upper surface of the display panel 10.

[0084] The cover window 70 may include a transmissive cover portion DA 70 and a light-shielding cover portion NDA 70, wherein the transmissive cover portion DA 70 corresponds to the display panel 10, and the light-shielding cover portion NDA 70 is adjacent to the transmissive cover portion DA 70. In an embodiment, the light-shielding cover portion NDA 70 may surround the transmissive cover portion DA 70, but is not limited thereto. The light-shielding cover portion NDA 70 may include an opaque material (e.g., a colored opaque material) that blocks light. The light-shielding cover portion NDA 70 may include a pattern visible from the outside of the electronic device 1 (e.g., to the user) when no image is displayed.

[0085] Display panel 10 may be disposed below cover window 70. Display panel 10 may overlap with (or face the cover window 70) the transmissive cover portion DA 70 of cover window 70. Display panel 10 may include display area DA. Display area DA may overlap with the transmissive cover portion DA 70 and not with the light-shielding cover portion NDA 70, or may overlap with both the transmissive cover portion DA 70 and the light-shielding cover portion NDA 70. Display area DA is the area (or planar area) for displaying an image. Display area DA may include a region (hereinafter referred to as the component area) located within the entire planar area of ​​display area DA, in which light emitted from component 40 disposed below display panel 10 is transmitted into display panel 10, transmitted through display panel 10, and / or transmitted from display panel 10.

[0086] Component 40, as a functional component, may include sensors and cameras that use visible light, infrared light, and sound to provide functionality to electronic device 1.

[0087] Display panel 10 can be a light-emitting display panel that includes light-emitting diodes (LEDs) as display elements. The LEDs can include organic light-emitting diodes (OLEDs) containing organic materials or inorganic light-emitting diodes (LEDs) containing inorganic materials. Inorganic LEDs can include PN junction diodes containing inorganic semiconductor materials. When a forward voltage is applied to the PN junction diode, holes and electrons are injected, and light of a preset color can be emitted while the energy generated by the recombination of holes and electrons is converted into light energy. Inorganic LEDs can have widths ranging from a few micrometers to several hundred micrometers. Inorganic LEDs can be represented by miniature LEDs.

[0088] The display panel 10 can be a rigid display panel that is rigid and therefore not easily bent, folded, or rolled up, or a flexible display panel that is flexible and therefore easily bent, folded, or rolled up. As an example, the display panel 10 may include a foldable display panel that can be folded and unfolded, a curved display panel that has a curved display surface, a curved display panel in which areas other than the display surface are bent, a rollable display panel that can be rolled up and unfolded, or a stretchable display panel.

[0089] The display panel 10 can be made transparent and is a transparent display panel, so that an object or background disposed below the display panel 10 at the lower surface of the display panel 10 can be seen from the upper surface of the display panel 10. Alternatively, the display panel 10 can be a reflective display panel that can reflect objects or backgrounds disposed at the upper surface of the display panel 10.

[0090] The data driver 20 may be mounted on the display panel 10 in the form of an integrated circuit (IC). However, this disclosure is not limited thereto. As an example, the data driver 20 may be mounted on the display circuit board 30.

[0091] Display circuit board 30 can be attached to one side of display panel 10. Display circuit board 30 can be a flexible printed circuit board (FPCB) that can be bent, a rigid printed circuit board (PCB) that is rigid and not easily bent, or a composite printed circuit board including both FPCB and rigid PCB. Touch sensor driver can be mounted on display circuit board 30. Touch sensor driver may include integrated circuits. Touch sensor driver can be electrically connected to touch electrodes of touch screen layer of display panel 10 via display circuit board 30.

[0092] The touchscreen layer of the display panel 10 can sense external inputs, such as a user's touch, using at least one of various touch methods, such as resistive (electrical) layer methods and capacitive (electrical) methods. When the touchscreen layer of the display panel 10 senses external input using a capacitive method, the touch sensor driver can determine whether the external input is touching or near the touch sensor layer by applying a drive signal to the drive electrode in the touch electrode and sensing the voltage charged in the mutual capacitance between the drive electrode and the sensing electrode through the sensing electrode in the touch electrode.

[0093] External input can include contact (e.g., physical or mechanical) touch and proximity (non-contact) touch. Contact touch indicates that the user's finger or input tool, such as a pen, is in direct contact with the cover window 70 disposed on the touchscreen layer. Hovering proximity touch indicates that the user's finger or input tool, such as a pen, is located above or near the cover window 70, at a certain distance from the cover window 70, and is not in contact with it. The touch sensor driver can be configured to transmit sensor data to the main processor based on the sensed voltage, and the main processor can calculate the touch coordinates of the touch input by analyzing the sensor data.

[0094] The controller can be located on the display circuit board 30, wherein the controller is configured to supply driving voltages for driving the pixels, gate drivers (not shown), and / or data drivers 20 of the display panel 10.

[0095] A bracket 60, serving as an intermediate cover for supporting the display panel 10, may be disposed below the display panel 10. The bracket 60 may comprise plastic, metal, or both. The bracket 60 may have a first camera hole CMH1 defined therein and into which a camera device 531 extends; a battery hole BH defined therein and into which a battery 80 is disposed; a cable hole CAH defined therein and through which a cable connected to the display circuit board 30 passes; and component holes CPH defined therein to correspond to one or more of the components 40. When viewed in the third direction (z-axis direction), the component holes CPH may overlap with the components 40 of the main circuit board 50. For reference, when viewed in the third direction (z-axis direction), the display area DA of the display panel 10 may overlap with the components 40 of the main circuit board 50. The bracket 60 may not have component holes CPH when necessary. Each of the aforementioned holes may extend completely through the body of the bracket 60, for example, to be open at both the upper and lower surfaces of the bracket 60, but is not limited thereto.

[0096] Component 40 of electronic device 1 may include a first component 41, a second component 42, a third component 43, and a fourth component 44, each overlapping the display panel 10. Each of the first component 41, the second component 42, the third component 43, and the fourth component 44 may include at least one of a proximity sensor, an illumination sensor, an iris sensor, a facial recognition sensor, and a camera (or image sensor). The proximity sensor, using infrared light, can detect objects like input tools located near the upper surface of electronic device 1, and the illumination sensor can detect the brightness of external light incident on the upper surface of electronic device 1. Additionally, the iris sensor can capture images of body parts such as the iris (of a person's eye) located above the upper surface of electronic device 1, and the camera can receive image data of objects positioned on or facing the upper surface of electronic device 1. Component 40 is not limited to proximity sensors, illumination sensors, iris sensors, facial recognition sensors, and cameras, and may include other sensors.

[0097] The main circuit board 50 and the battery 80 can be positioned below the bracket 60. The main circuit board 50 can be a rigid printed circuit board or a flexible printed circuit board.

[0098] The main circuit board 50 may include a main processor (not shown), a camera device 531, a main connector 55, and a component 40. The main processor may include an integrated circuit. When needed, the electronic device 1 may include not only the camera device 531 disposed on the upper surface of the main circuit board 50, but also a camera device 531 disposed on the lower surface of the main circuit board 50 opposite to the upper surface. Each of the main processor and the main connector 55 may be disposed on one of the upper and lower surfaces of the main circuit board 50. The main circuit board 50 may be electrically connected to the display circuit board 30 via the main connector 55, etc.

[0099] The main processor can be configured to control all functions of the electronic device 1. As an example, the main processor can be configured to output digital video data to the data driver 20 via the display circuit board 30, causing the display panel 10 to display an image. The main processor can be configured to receive sensed data from the touch sensor driver. Based on the sensed data, the main processor can determine whether external input from the user is a direct touch or proximity to the touchscreen, and can perform operations corresponding to the user's direct touch or proximity touch. The main processor can be an application processor comprising an integrated circuit, a central processing unit, or a system-on-a-chip.

[0100] Camera device 531 processes image frames, such as still images or moving images, obtained from an image sensor in camera mode and outputs the image frames to a main processor. Camera device 531 may include at least one of a camera sensor (e.g., a charge-coupled device (CCD) and complementary metal-oxide-semiconductor (CMOS), a light sensor (or image sensor), and a laser sensor.

[0101] The cable passing through the cable hole CAH of the bracket 60 can be connected to the main connector 55, and the main circuit board 50 can be electrically connected to the display circuit board 30 through the cable.

[0102] In addition to the main processor, although not shown in the figure, the electronic device 1 may also be represented as including a wireless communication unit, an input unit, a sensor unit, an output unit, an interface unit, a memory and / or a power supply unit.

[0103] The wireless communication unit may include at least one of a broadcast receiving module, a mobile communication module, a wireless internet module, a short-range communication module, and a location information module.

[0104] The broadcast receiving module is configured to receive broadcast signals and / or broadcast-related information from an external broadcast management server via a broadcast channel. The broadcast channel may include a satellite channel or a ground wave channel.

[0105] The mobile communication module is configured to transmit / receive radio signals to / from at least one of a base station, an external terminal, and a server via a mobile communication network established according to technical standards or communication schemes for mobile communication (e.g., Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), Code Division Multiple Access 2000 (CDMA2000), Enhanced Voice Data Optimized or Enhanced Voice Data Only (EV-DO), Wideband CDMA (WCDMA), High-Speed ​​Downlink Packet Access (HSDPA), High-Speed ​​Uplink Packet Access (HSUPA), Long Term Evolution (LTE), and Advanced Long Term Evolution (LTE-A), etc.). The radio signals may include voice call signals, image communication call signals, or various types of data corresponding to text / multimedia message transmission / reception.

[0106] A wireless internet module refers to a module used for wireless internet access. A wireless internet module can be configured to transmit / receive radio signals via a communication network according to wireless internet technologies. Examples of wireless internet technologies may include Wireless Local Area Network (WLAN), Wi-Fi, Wi-Fi Direct, and / or Digital Living Network Alliance (DLNA).

[0107] The short-range communication module is used for short-range communication and can be used via Bluetooth. ®The short-range communication module supports at least one of the following technologies: Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra-Wideband (UWB), ZigBee, Near Field Communication (NFC), Wi-Fi, Wi-Fi Direct, and Wireless Universal Serial Bus (Wireless USB). The short-range communication module can support wireless communication between electronic device 1 and a wireless communication system, between electronic device 1 and another electronic device, or between electronic device 1 and the network where another electronic device (or an external server) resides, via a short-range wireless local area network (WLAN). The short-range WLAN can be a wireless personal area network (WLAN). The other electronic device can be a wearable device capable of exchanging data or performing operations with electronic device 1.

[0108] The location information module, which is used to obtain the location of electronic device 1, may include a Global Positioning System (GPS) module or a Wi-Fi module.

[0109] The input units may include an image input unit, such as a camera device 531, for inputting image signals; a sound input unit, such as a microphone, for inputting sound signals; and an input unit for receiving information from outside the electronic device 1 (e.g., from a user). The camera device 531 processes image frames, such as still images or moving images, acquired by the image sensor in image communication mode or capture mode. The processed image frames may be displayed on the display panel 10 or stored in memory. The microphone processes external sound signals into electronic voice data. The processed voice data may be utilized in various ways depending on the function performed (or the application being performed) in the electronic device 1.

[0110] The main processor can control the operation of the electronic device 1 to correspond to the information input through the input unit. The input unit may include mechanical input devices such as buttons, dome switches, micro wheels, and micro switches, or touch input devices located on the lower or side surface of the electronic device 1. The touch input device may include the touch screen layer of the display panel 10.

[0111] The sensor unit may include at least one sensor that senses at least one of information inside the electronic device 1, information about the surrounding environment of the electronic device 1, and user information, and generates a corresponding sensing signal. The main processor may control the driving or operation of the electronic device 1 based on the sensing signal, or may perform data processing, functions, or operations related to applications installed in the electronic device 1. The sensor unit may be a proximity sensor, illuminance sensor, or facial recognition sensor as described above with respect to component 40. The sensor unit may include an accelerometer, magnetic sensor, gravity sensor, gyroscope sensor, motion sensor, RGB sensor, infrared (IR) sensor, finger scanning sensor, ultrasonic sensor, optical sensor, and / or battery level sensor. Additionally, the sensor unit may include an environmental sensor or a chemical sensor. Environmental sensors may include, for example, a barometer, hygrometer, thermometer, radiation detection sensor, thermal detection sensor, and / or gas detection sensor. Chemical sensors may include, for example, an electronic nose, a health sensor, and / or a biometric sensor.

[0112] The output unit is designed to generate outputs related to vision, hearing or touch, and may include at least one of a display panel 10, a sound output unit, a tactile module and a light output unit.

[0113] Display panel 10 displays (outputs) information processed by electronic device 1. As an example, display panel 10 may display execution screen information of an application driven by electronic device 1, user interface (UI) information corresponding to the execution screen information, or graphical user interface (GUI) information. Display panel 10 may include a display layer and a touchscreen layer, wherein the display layer displays images, and the touchscreen layer senses user touch input. Accordingly, display panel 10 may act as one of the input devices providing an input interface between electronic device 1 and the user, and simultaneously as one of the output devices providing an output interface between electronic device 1 and the user.

[0114] The sound output unit can output sound data received by the wireless communication unit or stored in the memory in call receiving mode, communication mode, recording mode, voice recognition mode, and / or broadcast receiving mode, etc. The sound output unit can output sound signals related to the functions performed by the electronic device 1 (e.g., call signal receiving tone and message receiving tone, etc.). The sound output unit may include a receiver and a speaker. At least one of the receiver and speaker may be a sound generator attached below the display panel 10 and causing the display panel 10 to vibrate to output sound. The sound generator may be a piezoelectric element or piezoelectric actuator that contracts and expands according to an electrical signal, or it may be an exciter that generates magnetic force by using a voice coil to cause the display panel 10 to vibrate.

[0115] The haptic module generates various tactile effects that can be felt by the user. It can provide vibrations as a tactile effect. The haptic module can transmit tactile effects not only through direct contact but also by allowing the user to experience the tactile effects through the muscles in their fingers or arms.

[0116] The light output unit outputs a signal to notify of an event by using light from a light source. Examples of events generated in electronic device 1 may include message reception, call signal reception, missed calls, alarms, schedule notifications, email reception, and / or information reception via an application. The signal output by the light output unit is realized when electronic device 1 emits monochromatic or multi-color light to its front or rear surface. The signal output may end when electronic device 1 detects that the user has acknowledged the event.

[0117] The interface unit acts as a path for various external devices connected to the electronic device 1. The interface unit may include at least one of the following: a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device with an identification module, an audio input / output (I / O) port, a video I / O port, and an earphone port. When an external device is connected to the interface unit, the electronic device 1 can perform appropriate controls associated with the connected external device.

[0118] The memory stores data supporting various functions of the electronic device 1. The memory may store multiple applications driven by the electronic device 1, data for the operation of the electronic device 1, and / or commands. At least some of the applications can be downloaded from an external server via wireless communication. The memory may store applications for the operation of the main processor and may temporarily store input / output data (e.g., data such as phone books, messages, still images, and / or moving images). Additionally, the memory may be configured to store tactile data regarding vibrations of various modes provided to the tactile module and sound data related to various sounds provided to the sound output unit.

[0119] The memory may include at least one type of storage medium selected from flash memory, hard disk, solid-state drive (SSD), silicon disk drive (SDD), multimedia card micro, card memory (e.g., secure digital (SD) or extreme digital (XD) memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic storage, magnetic disk, and optical disk.

[0120] The power supply unit receives external and / or internal power under the control of the main processor and supplies power to the various components included in the electronic device 1. The power supply unit may include a battery 80. Additionally, the power supply unit may include a connection port. The connection port may be an example of an interface unit electrically connected to an external charger, wherein the external charger supplies power to charge the battery 80. Alternatively, the power supply unit may wirelessly charge the battery 80. The battery 80 may be configured not to overlap with the main circuit board 50 in the third direction (z-axis direction). The battery 80 may overlap with the battery hole BH of the bracket 60.

[0121] The lower cover 90 can form the appearance of the electronic device 1 and has an opening therein that exposes a portion of the display panel 10 to the outside of the lower cover 90. The lower cover 90 has an open shape corresponding to the display panel 10 and can be fastened to the display panel 10. That is, as Figure 6 As shown, the lower cover 90 may define a receiving space or recess that opens in the direction toward the display panel 10. The lower cover 90 may be located on the opposite side of the cover window 70, with the display panel 10 between the lower cover 90 and the cover window 70. The lower cover 90 may be disposed below the main circuit board 50 and the battery 80. The lower cover 90 may be fastened and secured to the bracket 60. The lower cover 90 may form the lower appearance of the electronic device 1. The lower cover 90 may include plastic, metal, or both plastic and metal.

[0122] A second camera aperture CMH2 can be formed in the lower cover 90 to expose the lower surface of the camera device 531 to the outside of the lower cover 90. The positions of the camera device 531 and the corresponding first camera aperture CMH1 and second camera aperture CMH2 are not limited to... Figure 6 The embodiments shown are not applicable; various modifications can be made.

[0123] Figure 7A yes Figure 6 A schematic plan view of a portion of the display device DV shown in the figure. Figure 7B yes Figure 7A A schematic side view of a portion of the display device DV shown. Electronic device 1 may include... Figure 7A and Figure 7B A portion of the display device DV shown in the image.

[0124] refer to Figure 7A and Figure 7B The display device DV may include a cover window 70 (see Figure 6 ), display panel 10, data driver 20 and display circuit board 30.

[0125] Display panel 10 may include a display area DA and a peripheral area PA located outside the display area DA. The display area DA is the area where an image is displayed and multiple pixels can be disposed. The display area DA can have various planar shapes such as circular, elliptical, polygonal, or specific graphic shapes. Figure 7A The image shows that the display area DA has a roughly rectangular shape that includes rounded corners.

[0126] The peripheral region PA can be located outside and adjacent to the display region DA. The peripheral region PA can be, for example, a non-display region NDA (see...). Figure 10A The peripheral region PA is a planar area that does not display images. The peripheral region PA may include a first peripheral region PA1 and a second peripheral region PA2, wherein the first peripheral region PA1 is configured to surround at least a portion of the display region DA, and the second peripheral region PA2 is located at the lower end of the display region DA and extends to have a main dimension in a first direction (e.g., the x-axis direction). The width of the second peripheral region PA2 in the first direction (e.g., the x-axis direction) may be smaller than the width of the display region DA in the first direction (e.g., the x-axis direction). With this structure, at least a portion of the second peripheral region PA2 can be easily bent.

[0127] Figure 7A The planar shape of the display panel 10 shown can be consistent with that of the substrate 100 included in the display panel 10 (see...). Figure 8 The shapes of the two regions are substantially the same. When the display panel 10 includes a display area DA and a peripheral area PA located outside the display area DA, this can mean that the substrate 100 includes a display area DA and a peripheral area PA located outside the display area DA. In the following description, for convenience, it is based on the assumption that the substrate 100 includes a display area DA and a peripheral area PA.

[0128] The display panel 10 may include a main area MR, a bent area BR located outside the main area MR, and a sub-area SR separated from the main area MR by the bent area BR. The main area MR may be located on one side of the bent area BR, and the sub-area SR may be located on the other side of the bent area BR. Figure 7B As shown, the display panel 10 can be bent within the bending region BR, and when viewed from a third direction (e.g., the z-axis direction), at least a portion of the sub-region SR can overlap with the main region MR. Although in Figure 7B The illustration shows the display panel 10 being bent, but this disclosure is not limited thereto. As an example, the display panel 10 may be a foldable display panel, in which case the display panel 10 may be bent within the display area DA about a bending axis intersecting the display area DA. The display panel 10 may not be bent when necessary.

[0129] In the bending area BR and the sub-area SR, the bending area BR and / or the sub-area SR can be the non-display area NDA, but are not limited to this. The second peripheral area PA2 can include the bending area BR and / or the sub-area SR, but is not limited to this.

[0130] The data driver 20 can be disposed in the sub-area SR of the display panel 10. The data driver 20 can be disposed on the display panel 10 in the form of an integrated circuit (IC). As an example, the data driver 20 can be a data driver integrated circuit that generates data signals.

[0131] The display circuit board 30 can be attached to the end of the sub-region SR of the display panel 10. The display circuit board 30 can be electrically connected to the data driver 20, etc., through the pads of the sub-region SR of the display panel 10.

[0132] Figure 8 yes Figure 6 A schematic plan view of a portion of the display device DV shown in the figure.

[0133] refer to Figure 8 The display panel 10 may include a substrate 100. Various components forming the display panel 10 may be disposed on the substrate 100.

[0134] Substrate 100 may comprise glass, ceramic, metal, or polymer resin. Substrate 100 may comprise polymer resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and / or cellulose acetate propionate. Substrate 100 may have a multilayer structure comprising two layers containing the aforementioned polymer resin and an inorganic material layer disposed between the two layers. Alternatively, substrate 100 may have a structure in which layers comprising polymer resin and inorganic material layers are alternately stacked. The inorganic material layer may comprise, for example, silicon oxide, silicon nitride, or silicon oxynitride.

[0135] Subpixels can be disposed within a display area DA, and the display area DA can display an image using light emitted from the subpixels. A group of subpixels can be provided in a single pixel. Each subpixel may include a light-emitting diode (LED), which is a display element, and a subpixel circuit PC electrically connected to the LED. The subpixel circuit PC and the LED can be disposed within the display area DA. For convenience, although... Figure 8 The diagram shows a subpixel circuit PC and a light-emitting diode (LED) arranged side by side, but the subpixel circuit PC can actually overlap the LED at least partially. As an example, the LED can be positioned on the subpixel circuit PC.

[0136] The gate drive circuit, pad 14, first power line 15, and second power line 16 can be disposed in the peripheral region PA. The gate drive circuit may include, for example, a first scan drive circuit 11, a second scan drive circuit 12, and / or an emit control drive circuit 13.

[0137] The first scan drive circuit 11 can be configured to provide scan signals to the sub-pixel circuits PC via scan lines SL. The second scan drive circuit 12 can be configured opposite to the first scan drive circuit 11, with the display area DA located between the second scan drive circuit 12 and the first scan drive circuit 11. Some of the sub-pixel circuits PC located in the display area DA can be electrically connected to the first scan drive circuit 11, and others can be connected to the second scan drive circuit 12. Depending on the situation, the second scan drive circuit 12 can be omitted.

[0138] Like the first scan drive circuit 11, the emission control drive circuit 13 can be located on one side of the display area DA. The emission control drive circuit 13 can provide emission control signals to the pixels via the emission control line EL. Although in Figure 8 The diagram shows that the emission control drive circuit 13 is only disposed on one side of the display area DA, but the present invention is not limited thereto. For example, the display panel 10 may include emission control drive circuits 13 disposed on one side and the other side of the display area DA. Alternatively, the display panel 10 may include a first scan drive circuit 11 disposed on one side of the display area DA and an emission control drive circuit 13 disposed on the other side of the display area DA.

[0139] The pad 14, serving as a display pad, can be disposed in the second peripheral region PA2 of the substrate 100. The pad 14 can be exposed to the outside of the display panel 10 without being covered by the insulating layer of the display panel 10. The display panel 10 can be electrically connected to the display circuit board 30 at the pad 14. The pad 34, serving as a circuit board pad of the display circuit board 30, can be electrically connected to the pad 14 of the display panel 10.

[0140] The display circuit board 30 is configured to transmit signals or power from the controller to the display panel 10. Control signals generated by the controller can be transmitted to the gate drive circuit via the display circuit board 30. Additionally, the controller can transmit the first power supply voltage ELVDD (see...) to the gate drive circuit. Figure 9 ) and the second power supply voltage ELVSS (see Figure 9A first power supply voltage (ELVDD) is provided to a first power supply line 15 and a second power supply line 16. The first power supply voltage (ELVDD, also known as the driving voltage) can be supplied to each sub-pixel circuit PC via the driving voltage line PL connected to the first power supply line 15, and the second power supply voltage (ELVSS, also known as the common voltage) can be supplied to the common electrode of the light-emitting diode (LED) connected to the second power supply line 16. The first power supply line 15 may extend in a first direction (x-axis direction). The second power supply line 16 may have an annular shape including an open side and partially surround the display area DA.

[0141] The data signal of the data driver 20 can be transmitted to the sub-pixel circuit PC through the input line IL and the data line DL electrically connected to the input line IL.

[0142] Figure 9 It is set in Figure 8 The diagram shows a schematic circuit of a sub-pixel in the display area DA.

[0143] refer to Figure 9 The light-emitting diode (LED) can be electrically connected to the sub-pixel circuit PC.

[0144] The sub-pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, a third thin-film transistor T3, a fourth thin-film transistor T4, a fifth thin-film transistor T5, a sixth thin-film transistor T6, a seventh thin-film transistor T7, and a storage capacitor Cst.

[0145] The second thin-film transistor T2 is a switching thin-film transistor that can be connected to the scan line SL and the data line DL. It can be configured to transmit a data voltage (or data signal Dm) to the first thin-film transistor T1 based on a switching voltage (or scan signal Sn), with the data voltage input from the data line DL and the switching voltage input from the scan line SL. A storage capacitor Cst can be connected to the first thin-film transistor T1 and the drive voltage line PL, and can be configured to store a voltage corresponding to the difference between the voltage transmitted from the second thin-film transistor T2 and the first power supply voltage ELVDD supplied to the drive voltage line PL.

[0146] The first thin-film transistor T1 is a driving thin-film transistor that can be connected to a driving voltage line PL and a storage capacitor Cst. It can be configured to control the driving current based on the voltage stored in the storage capacitor Cst, with the driving current flowing from the driving voltage line PL to the light-emitting diode (LED). The LED can be configured to emit light with a preset brightness corresponding to the driving current. The second electrode (e.g., the cathode) of the LED can receive a second power supply voltage ELVSS.

[0147] The third thin-film transistor T3 is a compensation thin-film transistor, and its gate electrode can be connected to the scan line SL. The source electrode (or drain electrode) of the third thin-film transistor T3 can be connected to the drain electrode (or source electrode) of the first thin-film transistor T1, and can be connected to the first electrode of the light-emitting diode (LED) via the sixth thin-film transistor T6. The drain electrode (or source electrode) of the third thin-film transistor T3 can be connected to one of the electrodes of the storage capacitor Cst, the source electrode (or drain electrode) of the fourth thin-film transistor T4, and the gate electrode of the first thin-film transistor T1. The third thin-film transistor T3 is turned on according to the scan signal Sn received via the scan line SL, and the first thin-film transistor T1 is diode-connected by connecting its gate electrode and drain electrode (or source electrode) to each other.

[0148] The fourth thin-film transistor T4 is an initialization thin-film transistor, and its gate electrode can be connected to the previous scan line SL-1. The drain electrode (or source electrode) of the fourth thin-film transistor T4 can be connected to the initialization voltage line VL. The source electrode (or drain electrode) of the fourth thin-film transistor T4 can be connected to one of the electrodes of the storage capacitor Cst, the drain electrode (or source electrode) of the third thin-film transistor T3, and the gate electrode of the first thin-film transistor T1. The fourth thin-film transistor T4 can be turned on according to the previous scan signal Sn-1 received via the previous scan line SL-1, and can perform an initialization operation to initialize the voltage of the gate electrode of the first thin-film transistor T1 by transmitting the initialization voltage Vint to the gate electrode of the first thin-film transistor T1.

[0149] The fifth thin-film transistor T5 is an operation control thin-film transistor, and its gate electrode can be connected to the emitter control line EL. The source electrode (or drain electrode) of the fifth thin-film transistor T5 can be connected to the drive voltage line PL. The drain electrode (or source electrode) of the fifth thin-film transistor T5 is connected to the source electrode (or drain electrode) of the first thin-film transistor T1 and the drain electrode (or source electrode) of the second thin-film transistor T2.

[0150] The sixth thin-film transistor T6 is an emitter control thin-film transistor, and its gate electrode can be connected to the emitter control line EL. The source electrode (or drain electrode) of the sixth thin-film transistor T6 is connected to the drain electrode (or source electrode) of the first thin-film transistor T1 and the source electrode (or drain electrode) of the third thin-film transistor T3. The drain electrode (or source electrode) of the sixth thin-film transistor T6 can be electrically connected to the first electrode of the light-emitting diode (LED). The fifth thin-film transistor T5 and the sixth thin-film transistor T6 can be simultaneously turned on according to the emitter control signal En transmitted through the emitter control line EL, the first power supply voltage ELVDD is transmitted to the LED, and a driving current flows through the LED.

[0151] The seventh thin-film transistor T7 can be an initialization thin-film transistor configured to initialize the first electrode of a light-emitting diode (LED). The gate electrode of the seventh thin-film transistor T7 can be connected to the next scan line SL+1. The source electrode (or drain electrode) of the seventh thin-film transistor T7 can be connected to the first electrode of the LED. The drain electrode (or source electrode) of the seventh thin-film transistor T7 can be connected to the initialization voltage line VL. The seventh thin-film transistor T7 can be turned on according to the next scan signal Sn+1 transmitted via the next scan line SL+1, and can initialize the first electrode of the LED.

[0152] Despite Figure 9 The diagram shows that the fourth thin-film transistor T4 and the seventh thin-film transistor T7 are connected to the previous scan line SL-1 and the next scan line SL+1, respectively. However, in the embodiment, both the fourth thin-film transistor T4 and the seventh thin-film transistor T7 can be connected to the previous scan line SL-1 and driven according to the previous scan signal Sn-1.

[0153] The other electrode of the storage capacitor Cst can be connected to the drive voltage line PL. One of the electrodes of the storage capacitor Cst can be simultaneously connected to the gate electrode of the first thin-film transistor T1, the drain electrode (or source electrode) of the third thin-film transistor T3, and the source electrode (or drain electrode) of the fourth thin-film transistor T4.

[0154] The second electrode (e.g., cathode) of the light-emitting diode (LED) is configured to receive a second power supply voltage ELVSS. The LED is configured to emit light by receiving a drive current from a first thin-film transistor T1.

[0155] A light-emitting diode (LED) can be an organic light-emitting diode that uses organic materials as the emitting material. In an embodiment, the LED can be an inorganic light-emitting diode that includes inorganic materials. An inorganic LED can include a PN junction diode containing inorganic semiconductor materials. When a forward voltage is applied to the PN junction diode, holes and electrons are injected, and light of a predetermined color can be emitted while the energy generated by the recombination of holes and electrons is converted into light energy. An inorganic LED can have a width of several micrometers to hundreds of micrometers or several nanometers to hundreds of nanometers. In an embodiment, the LED can include a light-emitting diode containing quantum dots. As described above, the emitting layer of an LED can include organic materials, inorganic materials, quantum dots, organic materials and quantum dots, or inorganic materials and quantum dots. Hereinafter, for ease of description, the case where the LED is an organic light-emitting diode will be described.

[0156] Despite Figure 9The diagram shows a subpixel circuit PC comprising seven thin-film transistors and one storage capacitor; however, in embodiments, the subpixel circuit PC may include two or more thin-film transistors and two or more capacitors. Furthermore, the circuit design of the subpixel circuit PC is not limited to... Figure 9 The design shown in the image can be modified in various ways.

[0157] The first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be various types of thin-film transistors. In the embodiments, such as Figure 9 As shown, all of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be p-channel metal-oxide-semiconductor (MOS) field-effect transistors (FETs) (PMOSFETs). In an embodiment, at least one of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be a PMOSFET, and the remainder can be n-channel metal-oxide-semiconductor (MOS) field-effect transistors (FETs) (NMOSFETs). In an embodiment, all of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be NMOSFETs. Depending on the type of transistor (p-type or n-type), the positions of the source and drain electrodes can be interchanged.

[0158] Figure 9 All of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 shown can be thin-film transistors with a low-temperature polycrystalline silicon (LTPS) semiconductor layer. In this case, the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 are not limited thereto, and at least one of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be a thin-film transistor with an LTPS semiconductor layer, while the rest can be thin-film transistors with an oxide semiconductor layer. Alternatively, all of the first to seventh thin-film transistors T1, T2, T3, T4, T5, T6, and T7 can be thin-film transistors with an oxide semiconductor layer.

[0159] Figure 10A and Figure 10B yes Figure 6 A schematic cross-sectional view of a portion of the display device DV shown in the figure.

[0160] refer to Figure 10A and Figure 10B The display device DV may include a display panel 10 comprising a substrate 100, a display layer 200, an encapsulation layer 400, a touch sensor layer 500 and an anti-reflective layer 600, an adhesive layer OCA, and a cover window 70.

[0161] Substrate 100 may comprise glass or a polymer resin. As examples, the polymer resin may comprise polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and / or cellulose acetate propionate. The substrate 100 comprising the polymer resin may be flexible, rollable, or bendable. The substrate 100 may have a multilayer structure comprising a layer containing the polymer resin and an inorganic layer (not shown).

[0162] The display layer 200 may include a light-emitting diode (LED), a thin-film transistor (TFT) as a light-emitting element, and various insulating layers therebetween, wherein the TFT is electrically connected to an LED, such as an organic light-emitting diode (OLED).

[0163] Although not shown in the figures, the display panel 10 may further include a low-reflection layer located on the display layer 200, and an encapsulation layer 400 may be disposed on the low-reflection layer. As an example, the display layer 200 and / or the low-reflection layer may be sealed by the encapsulation layer 400. In an embodiment, the low-reflection layer may be omitted. In this case, the encapsulation layer 400 may be disposed directly on the display layer 200. The encapsulation layer 400 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0164] In one embodiment, a glass-based encapsulation substrate (not shown) may be provided instead of the encapsulation layer 400. The encapsulation substrate may be disposed on the display layer 200, and the display layer 200 may be disposed between the substrate 100 and the encapsulation substrate. A gap may exist between the encapsulation substrate and the display layer 200, and this gap may be filled with a filler.

[0165] A touch sensor layer 500 may be disposed on the encapsulation layer 400. The touch sensor layer 500 can sense external input (e.g., a touch from a finger or an object such as a stylus) and can allow the display device (DV) to obtain coordinate information corresponding to the touch position. The touch sensor layer 500 may include touch electrodes and traces connected to the touch electrodes. The touch sensor layer 500 can sense external input using mutual capacitance or self-capacitance methods.

[0166] The touch sensor layer 500 can be formed directly on the encapsulation layer 400. Alternatively, the touch sensor layer 500 can be formed separately and then attached to the encapsulation layer 400 by an adhesive layer such as an optically clear adhesive.

[0167] An anti-reflective layer 600 may be disposed on the touch sensor layer 500. The anti-reflective layer 600 can reduce the reflectivity of external light incident on the display device DV through the cover window 70.

[0168] The anti-reflective layer 600 may include a light-shielding layer and a color filter. The color filter can be arranged by taking into account the colors of the light emitted from the light-emitting diodes of the display layer 200.

[0169] A cover window 70 may be disposed on the antireflective layer 600. The cover window 70 protects the layer covered by the cover window 70. The cover window 70 may be formed separately and attached to the antireflective layer 600 via an adhesive layer OCA disposed between the cover window 70 and the antireflective layer 600. The adhesive layer OCA may be, for example, an optically clear adhesive. Alternatively, the cover window 70 may be disposed directly on the antireflective layer 600.

[0170] refer to Figure 10B The touch sensor layer 500 can be disposed on the anti-reflective layer 600. In this case, the anti-reflective layer 600 can be disposed on the encapsulation layer 400, and the touch sensor layer 500, the adhesive layer OCA, and the cover window 70 can be sequentially disposed on the anti-reflective layer 600. However, for ease of description, the case where the anti-reflective layer 600 is disposed on the touch sensor layer 500 will be described in detail.

[0171] Figure 11 It is set in Figure 6 A schematic enlarged plan view of a portion of the display device DV within a portion of the display area DA shown in the figure. Figure 11 yes Figure 8 An enlarged view of region "C" shown in the image.

[0172] refer to Figure 11 The display area DA may include multiple sub-pixels containing multiple display elements. More than one sub-pixel may be provided within the same pixel, but is not limited to this. The multiple display elements may include organic light-emitting diodes (OLEDs) that emit light of different colors. As an example, the multiple display elements may include a first organic light-emitting diode (OLED1), a second organic light-emitting diode (OLED2), and a third organic light-emitting diode (OLED3).

[0173] The first organic light-emitting diode (OLED1), the second organic light-emitting diode (OLED2), and the third organic light-emitting diode (OLED3) can share the counter electrode 230. The counter electrode 230 can be set at... Figure 8 The entire surface of the display area DA is shown in the figure.

[0174] A first opening CH1 may be defined in a portion of the counter electrode 230 disposed in the first emission region EA1, which is an emission region for light emitted from the first organic light-emitting diode OLED1. Multiple first openings CH1 may be provided, and these multiple first openings CH1 may be spaced apart from each other. At least two of the multiple first openings CH1 within the same first emission region EA1 may differ from each other in their planar shape and / or size. The multiple first openings CH1 may be disposed within the first emission region EA1. That is, the planar area (or planar size) of the first openings CH1 may be less than or equal to the total planar area of ​​the first emission region EA1. Additionally, the multiple first openings CH1 may be disposed within the planar shape of the first sub-pixel electrode 210R of the first organic light-emitting diode OLED1. The planar shape of the first sub-pixel electrode 210R may be larger than the planar shape of the first emission region EA1.

[0175] A second opening CH2 can be provided in a portion of the counter electrode 230 within the second emission region EA2, the second emission region EA2 being the light emission region emitted from the second organic light-emitting diode OLED2. Multiple second openings CH2 can be provided, and the multiple second openings CH2 can be spaced apart from each other. At least two of the multiple second openings CH2 within the same second emission region EA2 can differ from each other in their planar shape and / or size. The multiple second openings CH2 can be disposed within the second emission region EA2. Additionally, the multiple second openings CH2 can be disposed within the planar shape of the second sub-pixel electrode 210G of the second organic light-emitting diode OLED2. The planar shape of the second sub-pixel electrode 210G can be larger than the planar shape of the second emission region EA2.

[0176] A third opening CH3 can be provided in a portion of the counter electrode 230 within the third emission region EA3, the third emission region EA3 being the light emission region emitted from the third organic light-emitting diode OLED3. Multiple third openings CH3 can be provided, and the multiple third openings CH3 can be spaced apart from each other. At least two of the multiple third openings CH3 within the same third emission region EA3 can differ from each other in their planar shape and / or size. The multiple third openings CH3 can be disposed within the third emission region EA3. Additionally, the multiple third openings CH3 can be disposed within the planar shape of the third sub-pixel electrode 210B of the third organic light-emitting diode OLED3. The planar shape of the third sub-pixel electrode 210B can be larger than the planar shape of the third emission region EA3.

[0177] The first to third openings CH1, CH2, and CH3 can be configured to completely penetrate the counter electrode 230 in the thickness direction. The first to third openings CH1, CH2, and CH3 can expose the first intermediate layer, the second intermediate layer, and the third intermediate layer to the outside of the counter electrode 230, respectively.

[0178] The first to third openings CH1, CH2, and CH3 can be randomly formed in the counter electrode 230 corresponding to the emission region. The first to third openings CH1, CH2, and CH3 can have the same or different planar shapes. Furthermore, the first to third openings CH1, CH2, and CH3 can differ in size or planar dimensions. In the following description, for ease of description, the case where all the planar shapes of the first to third openings CH1, CH2, and CH3 are circular will be primarily described.

[0179] Figure 12A and Figure 12B It is along Figure 11 A cross-sectional view of the display device DV taken by line B-B'.

[0180] refer to Figure 12A The display device DV may include a display panel 10 comprising a substrate 100, a display layer 200, an encapsulation layer 400, a touch sensor layer 500 and an anti-reflective layer 600, an adhesive layer OCA, and a cover window 70.

[0181] The display panel 10 may include a display area DA (see Figure 8 Multiple sub-pixels are defined in a pixel. Each of the multiple sub-pixels can be configured to emit red, green, or blue light. The multiple sub-pixels may include sub-pixels (e.g., a first sub-pixel, a second sub-pixel, and a third sub-pixel) configured to emit light of different colors from each other. Multiple first, second, and third sub-pixels may be provided. In an embodiment, the first sub-pixel may be a red sub-pixel Pr configured to emit red light, the second sub-pixel may be a green sub-pixel Pg configured to emit green light, and the third sub-pixel may be a blue sub-pixel Pb configured to emit blue light. One or more of the sub-pixels may reside within the same pixel.

[0182] The display layer 200 can be disposed on the substrate 100. The display layer 200 may include a sub-pixel circuit layer as a circuit layer and a light-emitting diode layer as a light-emitting layer. The sub-pixel circuit layer may include a thin-film transistor (TFT) and a buffer layer 201, a gate insulating layer 203, an interlayer insulating layer 205, and a planarization layer 207, each of which is an insulating layer. One or more of these insulating layers may be referred to as "insulating layers".

[0183] A buffer layer 201 may be disposed on the substrate 100 to reduce or block the penetration of foreign matter, moisture, or external air from below the substrate 100, and to provide a flat surface on the substrate 100. The buffer layer 201 may include inorganic materials, organic materials, or organic / inorganic composite materials, and may include a single layer or multiple layers comprising inorganic and organic materials, wherein the inorganic materials include oxides or nitrides.

[0184] A barrier layer (not shown) may be further disposed between the substrate 100 and the buffer layer 201, the barrier layer preventing the permeation of external air. As an example, the buffer layer 201 may include silicon oxide or silicon nitride.

[0185] A thin-film transistor (TFT) can be disposed on the buffer layer 201. The TFT may include a semiconductor layer ACT as the active layer and a gate electrode GE, a source electrode SE, and a drain electrode DE as transistor electrodes. The TFT can be connected to an organic light-emitting diode (OLED) to drive the OLED.

[0186] The semiconductor layer ACT can be disposed on the buffer layer 201. The semiconductor layer ACT can include polycrystalline silicon or amorphous silicon. Alternatively, the semiconductor layer ACT can include an oxide of at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layer ACT can include a channel region, a source region, and a drain region, wherein the source and drain regions are doped with impurities.

[0187] The gate electrode GE, source electrode SE, and drain electrode DE can comprise various conductive materials. In an embodiment, the gate electrode GE can comprise at least one of molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti). As an example, the gate electrode GE can be a single Mo layer, or it can have a three-layer structure including a Mo layer, an Al layer, and a Mo layer. In an embodiment, the source electrode SE and drain electrode DE can each comprise at least one of copper (Cu), titanium (Ti), and aluminum (Al). As an example, the source electrode SE and drain electrode DE can have a three-layer structure including a Ti layer, an Al layer, and a Ti layer.

[0188] To ensure insulation between the semiconductor layer ACT and the gate electrode GE, a gate insulating layer 203 may be disposed between the semiconductor layer ACT and the gate electrode GE. An interlayer insulating layer 205 may be disposed on the gate electrode GE, and the source electrode SE and the drain electrode DE may be disposed on the interlayer insulating layer 205.

[0189] Each of the gate insulating layer 203 and the interlayer insulating layer 205 may comprise an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. The gate insulating layer 203 and the interlayer insulating layer 205 may each be formed by, for example, chemical vapor deposition (CVD) or atomic layer deposition (ALD).

[0190] A planarization layer 207 may be disposed on a thin-film transistor (TFT). To provide a flat upper surface, a planarization layer 207 is formed (or provided), and then the upper surface of the planarization layer 207 may be chemically and mechanically polished. The planarization layer 207 may comprise a general polymer such as photosensitive polyimide, polyimide, polycarbonate, benzocyclobutene (BCB), hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), or polystyrene (PS), a polymer derivative having phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorinated polymers, p-xylene polymers, or vinyl alcohol polymers.

[0191] Despite Figure 12A The planarization layer 207 is shown as a single layer, but in embodiments, the planarization layer 207 may include multiple layers. The first to third sub-pixel electrodes 210R, 210G, and 210B of the first organic light-emitting diode (OLED1), second organic light-emitting diode (OLED2), and third organic light-emitting diode (OLED3), which are respectively the first display element, the second display element, and the third display element, can be electrically connected to the thin-film transistor (TFT) through contact holes in the planarization layer 207.

[0192] A light-emitting diode (LED) layer can be disposed on the sub-pixel circuit layer. In an embodiment, the LED layer may include first to third organic light-emitting diodes OLED1, OLED2, and OLED3, a dam layer 225, and a spacer 227 of the spacer layer. The dam of the display panel 10 may include not only the material of the dam layer 225 but also the material of the spacer 227 (e.g., a solid portion). Here, the entire dam opening may be defined by an upper dam opening between the inner sidewalls of the spacer 227 and a lower dam opening between the inner sidewalls of the dam layer 225. The upper and lower dam openings may overlap each other to define the dam opening of the display panel 10.

[0193] The first organic light-emitting diode (OLED1), the second organic light-emitting diode (OLED2), and the third organic light-emitting diode (OLED3) can be disposed on a sub-pixel circuit layer. The first OLED1 may include a first sub-pixel electrode 210R, a first intermediate layer 220R including a first common layer 221, a first emission layer 222R, and a second common layer 223, and a counter electrode 230. The second OLED2 may include a second sub-pixel electrode 210G, a second intermediate layer 220G including a first common layer 221, a second emission layer 222G, and a second common layer 223, and a counter electrode 230 in a stacked structure. The third OLED3 may include a third sub-pixel electrode 210B, a third intermediate layer 220B including a first common layer 221, a third emission layer 222B, and a second common layer 223, and a counter electrode 230. A first opening CH1 may be defined in the counter electrode 230 at the first emission region EA1. Additionally, a second opening CH2 can be defined in the counter electrode 230 at the second emission region EA2, and a third opening CH3 can be defined in the counter electrode 230 at the third emission region EA3.

[0194] The first to third sub-pixel electrodes 210R, 210G, and 210B can each be disposed on the planarization layer 207. The first to third sub-pixel electrodes 210R, 210G, and 210B can be spaced apart from each other. The first to third sub-pixel electrodes 210R, 210G, and 210B can be in the same layer. When located in the same layer, the components can be formed in the same process and / or comprise the same material, the components can be portions of the same material layer, the components can be in the same layer by forming an interface with the same lower or upper layer, the components can be coplanar or disposed with the same thickness, etc., but are not limited to these.

[0195] The first to third sub-pixel electrodes 210R, 210G, and 210B can be reflective electrodes. The first to third sub-pixel electrodes 210R, 210G, and 210B can include a reflective layer and a transparent or semi-transparent conductive layer located on the reflective layer. The reflective layer includes silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. The transparent or semi-transparent conductive layer can include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and zinc aluminum oxide (AZO).

[0196] A dam layer 225 may be disposed on the first to third sub-pixel electrodes 210R, 210G, and 210B. The dam layer 225 may overlap with the first to third sub-pixel electrodes 210R, 210G, and 210B, and may include first to third lower openings 225OP1, 225OP2, and 225OP3 defined within the dam layer 225 and exposing the central portions of the first to third sub-pixel electrodes 210R, 210G, and 210B, respectively. The solid portion of the dam layer 225 may cover the edges of the first to third sub-pixel electrodes 210R, 210G, and 210B, and arcing or similar phenomena may occur at the edges of the first to third sub-pixel electrodes 210R, 210G, and 210B by increasing the distance between the edges of the first to third sub-pixel electrodes 210R, 210G, and 210B and the counter electrode 230. The first to third lower openings 225OP1, 225OP2 and 225OP3, which are provided as a plurality of dike openings (e.g., a plurality of dike openings), can be defined in the material of the dike layer 225.

[0197] The first to third lower openings 225OP1, 225OP2, and 225OP3 of the embankment layer 225 can define the first to third emission regions EA1, EA2, and EA3 of the first to third organic light-emitting diodes OLED1, OLED2, and OLED3 respectively included in the sub-pixels. For example... Figure 12A As shown, the dam layer 225 may include a first lower opening 225OP1 defining a first emission region EA1 of a first organic light-emitting diode OLED1 for a first sub-pixel. Additionally, the dam layer 225 may include a second lower opening 225OP2 defining a second emission region EA2 of a second organic light-emitting diode OLED2 for a second sub-pixel, and the dam layer 225 may include a third lower opening 225OP3 defining a third emission region EA3 of a third organic light-emitting diode OLED3 for a third sub-pixel.

[0198] The dam layer 225 may include an organic insulating material. Alternatively, the dam layer 225 may include an inorganic insulating material such as silicon nitride or silicon oxide. In this embodiment, the dam layer 225 may include both organic and inorganic insulating materials.

[0199] In an embodiment, the dam layer 225 may include a light-shielding material. As an example, the light-shielding material of the dam layer 225 may be black. The light-shielding material may include carbon black, carbon nanotubes, a resin or paste containing a black dye, metal particles (e.g., nickel, aluminum, molybdenum, and their alloys), metal oxide particles, or metal nitride particles. When the dam layer 225 includes a light-shielding material, external light reflection caused by the metal structure disposed beneath the dam layer 225 can be reduced.

[0200] Insulator 227 may be disposed on dam 225. Insulator 227 may comprise an organic insulating material such as polyimide. Alternatively, insulator 227 may comprise an inorganic insulating material such as silicon nitride or silicon oxide, or may comprise both organic and inorganic insulating materials. In embodiments, insulator 227 may comprise a material different from that of dam 225, which contains a light-shielding material. Insulator 227 and dam 225 may be formed in separate processes.

[0201] In one embodiment, the separator 227 may comprise the same material as the dam layer 225. In this case, the dam layer 225 and the separator 227 may be formed simultaneously during a masking process using a halftone mask.

[0202] The intermediate layer can be disposed on the first to third sub-pixel electrodes 210R, 210G, and 210B and the dam layer 225. As described above, the intermediate layer may include a first common layer 221, an emission layer, and a second common layer 223.

[0203] The first to third emitting layers 222R, 222G, and 222B can be configured as patterns within the first to third lower openings 225OP1, 225OP2, and 225OP3 of the embankment layer 225. The first to third emitting layers 222R, 222G, and 222B may comprise organic materials containing fluorescent or phosphorescent materials capable of emitting green, blue, or red light. These organic materials may comprise low-molecular-weight organic materials or polymeric organic materials.

[0204] The first common layer 221 and the second common layer 223 can be disposed below and above the emitter layer, respectively. The first common layer 221 may include, for example, a hole transport layer (HTL), or may include an HTL and a hole injection layer (HIL). The second common layer 223 may include, for example, an electron transport layer (ETL), or may include an ETL and an electron injection layer (EIL). In an embodiment, the second common layer 223 may not be provided.

[0205] An emission layer is arranged for each sub-pixel to correspond to the first to third lower openings 225OP1, 225OP2, and 225OP3 of the embankment layer 225. Conversely, the first common layer 221 and the second common layer 223 can each be integrally formed to completely cover the substrate 100. In other words, the first common layer 221 and the second common layer 223 can each be integrally formed to completely cover the display area DA of the substrate 100.

[0206] Counter electrode 230 may be a cathode for an electron injection electrode. Counter electrode 230 may comprise a conductive material having a low work function. As an example, counter electrode 230 may comprise a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. Alternatively, counter electrode 230 may further comprise a layer on the (semi-)transparent layer comprising ITO, IZO, ZnO, or In2O3.

[0207] In this embodiment, the capping layer 240 may be further disposed on the display layer 200. The capping layer 240 may be disposed on the first to third organic light-emitting diodes OLED1, OLED2, and OLED3. In this embodiment, due to the principle of constructive interference, the capping layer 240 can improve the luminous efficiency of the first to third organic light-emitting diodes OLED1, OLED2, and OLED3.

[0208] Capping layer 240 can be an organic capping layer including organic materials, an inorganic capping layer including inorganic materials, or a composite capping layer including both organic and inorganic materials. For example, capping layer 240 can include carbocyclic compounds, heterocyclic compounds, amino-containing compounds, porphyrin derivatives, phthalocyanine derivatives, naphthalenephthalocyanine derivatives, alkali metal complexes, alkaline earth metal complexes, or any combination thereof. Carbocyclic compounds, heterocyclic compounds, and amino-containing compounds can be selectively substituted with substitutes including O, N, S, Se, Si, F, Cl, Br, I, or any combination thereof.

[0209] At least a portion of the capping layer 240 may extend into the first opening CH1, the second opening CH2, and / or the third opening CH3. The extension of the capping layer 240 into the respective opening may fill the respective opening.

[0210] Encapsulation layer 400 may be disposed on capping layer 240. Encapsulation layer 400 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. As an example, such as Figure 12A As shown, the encapsulation layer 400 may include a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430 stacked in sequence.

[0211] The first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 may include inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, or zinc oxide. The first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 may include a single-layer structure or a multi-layer structure containing the aforementioned inorganic insulating materials.

[0212] The organic encapsulation layer 420 can alleviate the internal stress of the first inorganic encapsulation layer 410 and / or the second inorganic encapsulation layer 430. The organic encapsulation layer 420 may include polymeric materials. As an example, the organic encapsulation layer 420 may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resins (e.g., polymethyl methacrylate, polyacrylic acid, etc.) or any combination thereof.

[0213] The encapsulation layer 400 may have a multilayer structure comprising a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430. In this case, even if a crack occurs in the encapsulation layer 400, the crack will not propagate between the first inorganic encapsulation layer 410 and the organic encapsulation layer 420, or between the organic encapsulation layer 420 and the second inorganic encapsulation layer 430. The encapsulation layer 400 can prevent or reduce the penetration of external moisture or oxygen into the display area DA.

[0214] In an embodiment, at least one of the layers of the encapsulation layer 400 may extend into a dike opening that overlaps with the first opening CH1, the second opening CH2, and / or the third opening CH3. As an example, the first inorganic encapsulation layer 410, or the first inorganic encapsulation layer 410 and the organic encapsulation layer 420 together, may be disposed within the dike opening corresponding to the first opening CH1, the second opening CH2, and / or the third opening CH3. Here, the entire dike opening may include an overlapping opening between the dike layer 225 and the spacer layer (e.g., between spacers 227).

[0215] The touch sensor layer 500 may be disposed on the encapsulation layer 400. The touch sensor layer 500 may include a first touch electrode MT1, a first touch insulating layer 510, a second touch electrode MT2, and a second touch insulating layer 520. The first touch electrode MT1 may be directly disposed on the encapsulation layer 400. As an example, the first touch electrode MT1 may be directly disposed on the second inorganic encapsulation layer 430 of the encapsulation layer 400. However, this disclosure is not limited thereto.

[0216] In one embodiment, the touch sensor layer 500 may include an insulating layer (not shown) located between the first touch electrode MT1 and the encapsulation layer 400. In this case, the insulating layer may be disposed on a second inorganic encapsulation layer 430 of the encapsulation layer 400 to planarize the surface on which the first touch electrode MT1 and the like are disposed. The insulating layer may include inorganic insulating materials such as silicon oxide, silicon nitride, and silicon oxynitride. In another embodiment, the insulating layer may include an organic insulating material.

[0217] A first touch insulating layer 510 may be disposed on a first touch electrode MT1. The first touch insulating layer 510 may comprise an inorganic or organic material. When the first touch insulating layer 510 comprises an inorganic material, it may comprise at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride. When the first touch insulating layer 510 comprises an organic material, it may comprise at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, and perylene resin.

[0218] The second touch electrode MT2 can be disposed on the first touch insulating layer 510. The second touch electrode MT2 can act as a sensor for sensing the user's touch input. The first touch electrode MT1 can act as a connector for connecting the patterned second touch electrode MT2 in one direction. In an embodiment, both the first touch electrode MT1 and the second touch electrode MT2 can act as sensors. In this case, the first touch electrode MT1 can be electrically connected to the second touch electrode MT2 through a contact hole. When both the first touch electrode MT1 and the second touch electrode MT2 can act as sensors, the resistance of the touch electrodes is reduced, and the user's touch input can be sensed quickly.

[0219] In an embodiment, the first touch electrode MT1 and the second touch electrode MT2 may have a structure through which light emitted from the organic light-emitting diode passes (e.g., a mesh structure). In this case, the materials (e.g., solid portions) of the first touch electrode MT1 and the second touch electrode MT2 may not overlap with each emitting region of the organic light-emitting diode. With the mesh structure defining the touch electrode layer by gaps (or openings) between the materials of the touch electrodes, light emitted from the light-emitting element can pass through the touch electrode layer.

[0220] The first touch electrode MT1 and the second touch electrode MT2 may each include a metal layer or a transparent conductive layer. The metal layer may include at least one of molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al), and their alloys. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO), conductive polymers such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, carbon nanotubes, or graphene.

[0221] The second touch insulating layer 520 may be disposed on the second touch electrode MT2. The second touch insulating layer 520 may comprise inorganic or organic materials. When the second touch insulating layer 520 comprises inorganic materials, it may comprise at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride. When the second touch insulating layer 520 comprises organic materials, it may comprise at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, and perylene resin.

[0222] In one embodiment, the touch sensor layer 500 may include a first touch electrode MT1, a first touch insulating layer 510, and a second touch electrode MT2, but may not include the second touch insulating layer 520. In this case, the anti-reflective layer 600 may have a structure that covers the second touch electrode MT2.

[0223] An anti-reflective layer 600 can be disposed on the touch sensor layer 500.

[0224] The antireflective layer 600 may include a light-shielding layer 610 and a plurality of color filters. In an embodiment, the antireflective layer 600 may include first to third color filters 620R, 620G, and 620B of different colors corresponding to the first to third organic light-emitting diodes OLED1, OLED2, and OLED3, respectively. Each of the first to third color filters 620R, 620G, and 620B may be provided in multiple forms.

[0225] The light-shielding layer 610 may have first to third upper openings 610OP1, 610OP2, and 610OP3 corresponding to the first to third sub-pixels, respectively. The light-shielding layer 610 may include a first upper opening 610OP1 corresponding to the first emitting region EA1, a second upper opening 610OP2 corresponding to the second emitting region EA2, and a third upper opening 610OP3 corresponding to the third emitting region EA3. Light emitted from the first to third organic light-emitting diodes OLED1, OLED2, and OLED3 can be emitted to the outside of the display panel 10 (or display device DV) through the first to third upper openings 610OP1, 610OP2, and 610OP3 of the light-shielding layer 610.

[0226] The first upper opening 610OP1 of the light-shielding layer 610 can overlap with the first lower opening 225OP1 of the embankment layer 225, the second upper opening 610OP2 can overlap with the second lower opening 225OP2, and the third upper opening 610OP3 can overlap with the third lower opening 225OP3.

[0227] In this specification, the width (or size) of each subpixel represents the width (or size) of the emission region of the organic light-emitting diode implementing each subpixel, and the width (or size) of the emission region may be defined by the width (or size) of the lower opening of the embankment 225. As used herein, the width may be measured along a planar direction (e.g., along the xy plane).

[0228] In this embodiment, the width (or size) of each of the first to third upper openings 610OP1, 610OP2, and 610OP3 of the light-shielding layer 610 can be greater than the width (or size) of the corresponding sub-pixel among the first to third sub-pixels. That is, the width (or size) of the first to third upper openings 610OP1, 610OP2, and 610OP3 of the light-shielding layer 610 can be greater than the width (or size) of the corresponding first to third lower openings 225OP1, 225OP2, and 225OP3 of the dike layer 225, respectively.

[0229] In this embodiment, the width (or size) of each of the first to third upper openings 610OP1, 610OP2, and 610OP3 of the light-shielding layer 610 can be substantially the same as the width (or size) of the corresponding sub-pixel among the first to third sub-pixels. That is, the width (or size) of the first to third upper openings 610OP1, 610OP2, and 610OP3 of the light-shielding layer 610 can be substantially the same as the width (or size) of the corresponding first to third lower openings 225OP1, 225OP2, and 225OP3 of the dam layer 225, respectively.

[0230] The light-shielding layer 610 may include an organic insulating material. Alternatively, the light-shielding layer 610 may include an inorganic insulating material such as silicon nitride or silicon oxide. In embodiments, the light-shielding layer 610 may include both organic and inorganic insulating materials.

[0231] In an embodiment, the light-shielding layer 610 may include a light-shielding material. As an example, the light-shielding material of the light-shielding layer 610 may be black. The light-shielding material may include carbon black, carbon nanotubes, a resin or paste containing a black dye, metal particles (e.g., nickel, aluminum, molybdenum, and their alloys), metal oxide particles, or metal nitride particles. Because the light-shielding layer 610 includes a light-shielding material, external light reflection caused by the metal structure disposed beneath the light-shielding layer 610 can be reduced.

[0232] The first to third color filters 620R, 620G, and 620B can be arranged in the first to third upper openings 610OP1, 610OP2, and 610OP3 of the light-shielding layer 610, respectively. The first to third color filters 620R, 620G, and 620B can have colors corresponding to the light emitted from the first to third emission regions EA1, EA2, and EA3. In an embodiment, when the first emission region EA1 emits red light, the first color filter 620R can be a red filter; when the second emission region EA2 emits green light, the second color filter 620G can be a green filter; and when the third emission region EA3 emits blue light, the third color filter 620B can be a blue filter.

[0233] The antireflective layer 600 may further include a protective layer 630. The protective layer 630 may be disposed on the light-shielding layer 610 and / or the first to third color filters 620R, 620G, and 630B. The protective layer 630 may planarize the upper surface of the light-shielding layer 610 and / or the first to third color filters 620R, 620G, and 630B. The protective layer 630 is a colorless, transparent layer that is colorless in the visible light band. The protective layer 630 may include a colorless, transparent organic material such as an acrylic resin.

[0234] The cover window 70 can be positioned above the protective layer 630, wherein the adhesive layer OCA is located between the cover window 70 and the protective layer 630.

[0235] Figure 12B It is along Figure 11 A cross-sectional view of the display device DV taken by line B-B'. Figure 12B Show Figure 12A This is a modified embodiment of the anti-reflective layer 600. The differences are mainly described below.

[0236] refer to Figure 12B The anti-reflective layer 600 may consist of only multiple color filters, without the light-shielding layer 610 (see...). Figure 12A ).

[0237] In an embodiment, the third color filter 620B, the first color filter 620R, and the second color filter 620G can be stacked sequentially in a direction away from the substrate 100 (+z direction).

[0238] The third color filter 620B can be configured to allow most of blue light to pass through while blocking most of red or green light. The third color filter 620B may include a third opening 620BOP corresponding to the second emission region EA2 and the first emission region EA1. The third color filter 620B may include the third opening 620BOP such that green light and red light emitted from the second emission region EA2 and the first emission region EA1, respectively, are not blocked. Most of the blue light emitted from the third emission region EA3 can pass through the third color filter 620B and be emitted to the outside.

[0239] The first color filter 620R can be configured to allow most of red light to pass through while blocking most of blue or green light. The first color filter 620R can fill some of the third opening 620BOP of the third color filter 620B that corresponds to the first emission region EA1, and can be disposed on the third color filter 620B. The first color filter 620R may include a first opening 620ROP corresponding to the second emission region EA2 and the third emission region EA3. The first color filter 620R may include the first opening 620ROP such that green light and blue light emitted from the second emission region EA2 and the third emission region EA3, respectively, are not blocked. Most of the red light emitted from the first emission region EA1 can pass through the first color filter 620R and be emitted to the outside.

[0240] The second color filter 620G can be configured to allow most of green light to pass through while blocking most of red or blue light. The second color filter 620G can fill a portion of the third opening 620BOP of the third color filter 620B corresponding to the second emission region EA2, and a portion of the first opening 620ROP of the first color filter 620R corresponding to the second emission region EA2, and can be disposed on the first color filter 620R. The second color filter 620G may include a second opening 620GOP corresponding to the first emission region EA1 and the third emission region EA3. The second color filter 620G may include a second opening 620GOP such that red and blue light emitted from the first emission region EA1 and the third emission region EA3, respectively, are not blocked. Most of the green light emitted from the second emission region EA2 can pass through the second color filter 620G and be emitted to the outside.

[0241] The antireflective layer 600 may have a light-shielding portion BP in the portion corresponding to the space between the first to third emission regions EA1, EA2, and EA3 or the space between the sub-pixel electrodes 210R, 210G, and 210B. Here, the light-shielding portion BP includes the first to third color filters 620R, 620G, and 620B stacked to overlap each other. The light-shielding portion BP can be configured to remain in place even without the light-shielding layer 610 including black light-shielding material (see...). Figure 12AIt also blocks light in cases where it is not in use. In addition, it can reduce external light reflection from the display device (DV).

[0242] In this embodiment, the width (size) of the first opening 620ROP of the first color filter 620R, which overlaps with the second emission region EA2 of the second sub-pixel, can be greater than the width (size) of the third opening 620BOP of the third color filter 620B. The width (size) of the second opening 620GOP of the second color filter 620G, which overlaps with the third emission region EA3 of the third sub-pixel, can be greater than the width (size) of the first opening 620ROP of the first color filter 620R. The width (size) of the second opening 620GOP of the second color filter 620G, which overlaps with the first emission region EA1 of the first sub-pixel, can be greater than the width (size) of the third opening 620BOP of the third color filter 620B.

[0243] Within the openings at each sub-pixel, the light-emitting region of the sub-pixel can be defined by the opening (or emitting region) of the anti-reflective layer 600, while the non-emitting region between the light-emitting regions can be defined by the material of the anti-reflective layer 600. Figure 12A In this context, the non-emissive area can be defined by a planar region of the light-shielding layer 610 (e.g., its maximum width). Figure 12B In this context, the non-emissive region can be defined by a planar region of the shading portion BP that is common to each of the overlapping color filter portions.

[0244] Figures 13A to 13H yes Figure 11 A schematic plan view of an embodiment of the opening shown in the figure.

[0245] refer to Figures 13A to 13H An opening CH, which is defined in one of the first, second, and third openings in the counter electrode 230, can have various types of planar shapes. When multiple openings CH are defined in the same emission region, such an opening can be referred to as a sub-opening.

[0246] As an example, the planar shape of the opening CH, which is a sub-opening in the same emission region, can be a polygonal shape, a circular shape, and / or an elliptical shape. In embodiments, the opening CH can have an irregular shape other than a polygonal shape, a circular shape, and / or an elliptical shape. As an example, the opening CH can have such... Figure 13H The star-shaped planar shape is shown in the figure.

[0247] The maximum internal width of the opening CH can range from approximately 1 micrometer (µm) to approximately 10 micrometers (µm). As an example, the planar shape of the opening CH is square. Figure 13A In the case of ), the first length LH1 of one side of the opening CH can be in the range of about 1µm to about 10µm.

[0248] The planar shape of the opening CH is circular. Figure 13B In the case of an opening CH, the diameter LH2 can range from approximately 1 µm to approximately 10 µm. When the planar shape of the opening CH is elliptical (…), Figure 13C In the case of ), the second length LH3 of the major axis of the opening CH can be in the range of about 1µm to about 10µm.

[0249] The shape of the plane at the opening CH is rectangular. Figure 13D and Figure 13E In the case of ), regardless of the direction of extension of the long side of the rectangle, the third lengths LH4 and LH5 of the long side of the opening CH can be in the range of approximately 1µm to approximately 10µm.

[0250] The shape of the plane with opening CH is triangular. Figure 13F In the case of a triangle, the fourth length LH6 of the longest side among the three sides can be in the range of approximately 1µm to approximately 10µm.

[0251] The shape of the plane with opening CH is pentagonal. Figure 13G In the case of ), the fifth length LH7, which has the maximum length inside the pentagon, can be in the range of approximately 1µm to approximately 10µm.

[0252] The planar shape of the opening CH is such as a star ( Figure 13H In the case of an irregular shape, the sixth length LH8, which has the maximum length inside the planar shape of the opening CH, can be in the range of about 1µm to about 10µm.

[0253] When the length of the maximum width in the planar shape of the opening CH is less than 1µm, the reflection banding caused by external light reflection will not be reduced because external light will not be reflected in all directions through the opening CH. When the length of the maximum width in the planar shape of the opening CH exceeds 10µm, the brightness of each organic light-emitting diode may be reduced because a preset voltage can be applied to each intermediate layer.

[0254] Figure 14A and Figure 14B This is a schematic cross-sectional view of a portion of a display device DV according to an embodiment. In the following text, it is used in conjunction with... Figure 12A and Figure 12B The same reference numerals in the accompanying drawings denote the same elements. In the following, the main details are as follows: Figure 12A and Figure 12B The differences.

[0255] refer to Figure 14A and Figure 14BThe display device DV may include a display panel 10 comprising a substrate 100, a display layer 200, an encapsulation layer 400, a touch sensor layer 500 and an anti-reflective layer 600, an adhesive layer OCA, and a cover window 70.

[0256] Display layer 200 can be disposed on substrate 100. Display layer 200 may include a sub-pixel circuit layer and a light-emitting diode layer. Sub-pixel circuit layer may include thin-film transistors (TFTs), a buffer layer 201 (which is an insulating layer), a gate insulating layer 203, an interlayer insulating layer 205, and a planarization layer 207 (which is a lower planarization layer). Light-emitting diode layer may be disposed on sub-pixel circuit layer. In an embodiment, light-emitting diode layer may include first to third organic light-emitting diodes (OLED1, OLED2, and OLED3), a barrier layer 225, and a separator 227. The first organic light-emitting diode (OLED) 1 may include a first sub-pixel electrode 210R, a first intermediate layer 220R including a first common layer 221, a first emission layer 222R, and a second common layer 223, and a counter electrode 230. The second organic light-emitting diode (OLED) 2 may include a second sub-pixel electrode 210G, a second intermediate layer 220G including a first common layer 221, a second emission layer 222G, and a second common layer 223, and a counter electrode 230 in a stacked structure. The third organic light-emitting diode (OLED) 3 may include a third sub-pixel electrode 210B, a third intermediate layer 220B including a first common layer 221, a third emission layer 222B, and a second common layer 223, and a counter electrode 230.

[0257] A first opening CH1 can be provided in the counter electrode 230 located in the first emission region EA1. Additionally, a second opening CH2 can be provided in the counter electrode 230 located in the second emission region EA2, and a third opening CH3 can be provided in the counter electrode 230 located in the third emission region EA3.

[0258] The capping layer 240 can be disposed on the light-emitting diode layer. At least a portion of the capping layer 240 can be disposed inside the first to third openings CH1, CH2 and CH3.

[0259] The upper planarization layer 300 may be disposed on the capping layer 240. The upper planarization layer 300 may be disposed inside a dam opening, the dam opening including first to third lower openings 225OP1, 225OP2, and 225OP3 of the dam layer 225 forming the lower opening portion of the dam opening. The upper planarization layers 300 disposed inside the dam opening corresponding to each of the first to third lower openings 225OP1, 225OP2, and 225OP3 may be disposed island-like and separated from each other, for example, disconnected from each other. The upper planarization layer 300 may comprise a material that is the same as or similar to the material of the organic encapsulation layer 420. At least a portion of the upper planarization layer 300 may be disposed inside the first to third openings CH1, CH2, and CH3.

[0260] An encapsulation layer 400, comprising a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430, can be disposed on an upper planarization layer 300 and a capping layer 240. The upper planarization layer 300 can reduce the bending of the first inorganic encapsulation layer 410 by substantially planarizing the surface on which the first inorganic encapsulation layer 410 is disposed.

[0261] A touch sensor layer 500, including a first touch electrode MT1, a first touch insulating layer 510, a second touch electrode MT2, and a second touch insulating layer 520, can be disposed on the encapsulation layer 400.

[0262] like Figure 14A As shown, an anti-reflective layer 600, comprising first to third color filters 620R, 620G, and 620B of different colors corresponding to the first to third organic light-emitting diodes OLED1, OLED2, and OLED3 respectively, and a light-shielding layer 610 of the non-emitting region, can be disposed on the touch sensor layer 500. In an embodiment, as... Figure 14B As shown, an antireflective layer 600, which includes only the first to third color filters 620R, 620G, and 620B in the non-emissive area and lacks a light-shielding layer 610, can be disposed on the touch sensor layer 500. In this case, the antireflective layer 600 may include a light-shielding portion BP located in the non-emissive area, the light-shielding portion BP comprising the first to third color filters 620R, 620G, and 620B stacked and overlapping each other to provide a light-shielding function.

[0263] Figure 15A and Figure 15B This is a schematic cross-sectional view of a portion of a display device DV according to an embodiment. In the following text, it is used in conjunction with... Figure 12A and Figure 12B The same reference numerals in the accompanying drawings denote the same elements. In the following, the main details are as follows: Figure 12A and Figure 12B The differences.

[0264] refer to Figure 15A and Figure 15B The display device DV may include a display panel 10 comprising a substrate 100, a display layer 200, an encapsulation layer 400, a touch sensor layer 500 and an anti-reflective layer 600, an adhesive layer OCA, and a cover window 70.

[0265] The display layer 200 can be disposed on the substrate 100. The display layer 200 may include a sub-pixel circuit layer and a light-emitting diode layer. The sub-pixel circuit layer may include thin-film transistors (TFTs), a buffer layer 201 (which is an insulating layer), a gate insulating layer 203, an interlayer insulating layer 205, and a planarization layer 207. The light-emitting diode layer may be disposed on the sub-pixel circuit layer. In an embodiment, the light-emitting diode layer may include first to third organic light-emitting diodes (OLEDs) OLED1, OLED2, and OLED3, a barrier layer 225, and a separator 227. The first organic light-emitting diode (OLED) 1 may include a first sub-pixel electrode 210R, a first intermediate layer 220R including a first common layer 221, a first emission layer 222R, and a second common layer 223, and a counter electrode 230. The second organic light-emitting diode (OLED) 2 may include a second sub-pixel electrode 210G, a second intermediate layer 220G including a first common layer 221, a second emission layer 222G, and a second common layer 223, and a counter electrode 230 in a stacked structure. The third organic light-emitting diode (OLED) 3 may include a third sub-pixel electrode 210B, a third intermediate layer 220B including a first common layer 221, a third emission layer 222B, and a second common layer 223, and a counter electrode 230.

[0266] A first opening CH1 can be provided in the counter electrode 230 located in the first emission region EA1. Additionally, a second opening CH2 can be provided in the counter electrode 230 located in the second emission region EA2, and a third opening CH3 can be provided in the counter electrode 230 located in the third emission region EA3.

[0267] The capping layer 240 may be disposed on the light-emitting diode layer. At least a portion of the capping layer 240 may be disposed within the dam openings at the first to third openings CH1, CH2, and CH3, respectively. The upper planarization layer 300 may be disposed on the capping layer 240.

[0268] The upper planarization layer 300 can be disposed on the entire surface of the capping layer 240. As an example, a portion of the upper planarization layer 300 can be disposed inside the dike openings overlapping the first to third lower openings 225OP1, 225OP2, and 225OP3 of the dike layer 225. The portions of the upper planarization layer 300 disposed inside each of the first to third lower openings 225OP1, 225OP2, and 225OP3 can be spaced apart from each other in an island-like manner. Another portion of the upper planarization layer 300 can be disposed on the separator 227, and portions of the upper planarization layer 300 disposed inside adjacent lower openings can be connected. Here, the upper planarization layer 300 can be positioned along the thickness direction between the capping layer 240 and the encapsulation layer 400.

[0269] The upper planarization layer 300 may include a material that is the same as or similar to the material of the organic encapsulation layer 420. At least a portion of the upper planarization layer 300 may be disposed inside the first to third openings CH1, CH2 and CH3.

[0270] An encapsulation layer 400, comprising a first inorganic encapsulation layer 410, an organic encapsulation layer 420, and a second inorganic encapsulation layer 430, can be disposed on an upper planarization layer 300 and a capping layer 240. The upper planarization layer 300 can reduce the bending of the first inorganic encapsulation layer 410 by substantially planarizing the surface on which the first inorganic encapsulation layer 410 is disposed.

[0271] A touch sensor layer 500, including a first touch electrode MT1, a first touch insulating layer 510, a second touch electrode MT2, and a second touch insulating layer 520, can be disposed on the encapsulation layer 400.

[0272] like Figure 15A As shown, an anti-reflective layer 600, comprising first to third color filters 620R, 620G, and 620B of different colors corresponding to the first to third organic light-emitting diodes OLED1, OLED2, and OLED3 respectively, and a light-shielding layer 610 located in the non-emitting region, can be disposed on the touch sensor layer 500. In an embodiment, as... Figure 15B As shown, an anti-reflective layer 600, which includes only the first to third color filters 620R, 620G, and 620B in the non-emissive area and lacks a light-shielding layer 610, can be disposed on the touch sensor layer 500. In this case, the anti-reflective layer 600 may include a light-shielding portion BP in the non-emissive area, the light-shielding portion BP including the first to third color filters 620R, 620G, and 620B stacked and overlapping each other.

[0273] The display device DV and the electronic device 1 including the display device DV according to the embodiment can reduce reflective banding caused by external light.

[0274] The display device DV and the electronic device 1 including the display device DV, according to the embodiment, can provide a clear image.

[0275] In an embodiment, the display device DV or electronic device 1 includes: a display area DA comprising a plurality of emitting regions; a plurality of display elements respectively located in the plurality of emitting regions and configured to emit light of different colors, wherein each of the plurality of display elements includes a pixel electrode, an intermediate layer, and a counter electrode 230 defining a plurality of openings CH therein; and an antireflective layer 600 located on the plurality of display elements, the antireflective layer 600 including a plurality of color filters respectively corresponding to the plurality of display elements. Within the same emitting region among the plurality of emitting regions, the size or shape of the plurality of openings CH defined in the counter electrode 230 is different from each other, and the maximum size of each of the plurality of openings CH in the same emitting region is in the range of about 1µm to about 10µm.

[0276] Within the same emission area, at least two openings CH can be defined in the counter electrode 230 of each display element.

[0277] The display device DV (or electronic device 1) may further include an encapsulation layer 400 located on a plurality of display elements, the encapsulation layer 400 including an inorganic encapsulation layer and an organic encapsulation layer 420.

[0278] The display device DV (or electronic device 1) may further include a dam layer (such as 225 and 227 together) defining a plurality of dam openings (e.g., lower openings as lower portions of the dam openings) respectively corresponding to a plurality of emission regions. An inorganic or organic encapsulation layer 420 may extend into the dam openings.

[0279] The display device DV (or electronic device 1) may further include a capping layer 240 located between the counter electrode 230 and the encapsulation layer 400. The capping layer 240 may extend into a plurality of openings CH in the counter electrode 230.

[0280] Within the same emission region, multiple openings CH can pass through the counter electrode 230 in the thickness direction and can be spaced apart from each other along the same emission region.

[0281] The display device DV (or electronic device 1) may further include an upper planarization layer 300 disposed on the counter electrode 230.

[0282] The counter electrode 230 can be configured to completely cover the display area DA.

[0283] The display area DA may further include a non-emissive area adjacent to the emitting area, and the anti-reflective layer 600 may further include a light-shielding layer 610 located in the non-emissive area and defining a plurality of opening areas corresponding to a plurality of display elements (or a plurality of emitting areas).

[0284] It should be understood that the embodiments described herein are to be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects in each embodiment should typically be considered as other similar features or aspects that may be used in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various modifications in form and detail may be made thereto without departing from the spirit and scope as defined by the claims.

Claims

1. A display device, comprising: The display area includes multiple transmission areas; A plurality of display elements, each located in one of the plurality of emission regions and configured to emit light of different colors, each of the plurality of display elements comprising: a pixel electrode; an intermediate layer; and a counter electrode defining a plurality of openings therein; and An anti-reflective layer is located on the plurality of display elements, and the anti-reflective layer includes a plurality of color filters corresponding to the plurality of display elements respectively. Within the same emission region of the plurality of emission regions, the sizes or shapes of the plurality of openings defined in the counter electrode are different from each other, and the maximum size of each of the plurality of openings in the same emission region is in the range of 1 micrometer to 10 micrometers.

2. The display device according to claim 1, wherein, Within the same emission region, at least two openings are defined in the counter electrode of each display element.

3. The display device according to claim 1, further comprising an encapsulation layer located on the plurality of display elements, the encapsulation layer comprising an inorganic encapsulation layer and an organic encapsulation layer.

4. The display device according to claim 3, further comprising a dam layer defining a plurality of dam openings respectively corresponding to the plurality of emission areas. in, The organic or inorganic encapsulation layer extends into the plurality of dike openings.

5. The display device according to claim 3, further comprising a capping layer located between the counter electrode and the encapsulation layer.

6. The display device according to claim 5, wherein, The capping layer extends into the plurality of openings of the counter electrode.

7. The display device according to claim 1, wherein, Within the same emission region, the plurality of openings pass through the counter electrode in the thickness direction and are spaced apart from each other along the same emission region.

8. The display device according to claim 1, further comprising an upper planarization layer disposed on the counter electrode.

9. The display device according to claim 1, wherein, The counter electrode is configured to completely cover the display area.

10. The display device according to claim 1, wherein, The display area further includes a non-emission area adjacent to the plurality of emission areas, and The anti-reflective layer further includes a light-shielding layer located in the non-emissive region and defining a plurality of opening regions corresponding to the plurality of display elements.

11. An electronic device comprising: The display device according to any one of claims 1 to 10.

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