A preparation mold and method for thermoelectric refrigeration device

Abstract

The application discloses a preparation mold and a preparation method of a thermoelectric refrigeration device, relates to the technical field of thermoelectric semiconductor device manufacturing, and comprises a machine table and a whole arrangement table arranged on the top of the machine table. The top of the whole arrangement table is provided with an arrangement mechanism for regularizing the conductors of refrigeration pieces. The arrangement mechanism comprises a pair of bottom plates fixedly installed on the top of the whole arrangement table. Two lower base plates and one lower drawer are clamped and fixed in the inside of each bottom plate. A piece drawing plate is slidingly installed on the top of each lower base plate. A plurality of mold clamping grooves are uniformly formed in the inside of each piece drawing plate. The top of the arrangement mechanism is provided with an auxiliary mechanism for assisting the arrangement of the conductors. The bottom of the auxiliary mechanism is provided with a control mechanism for controlling the discharging of the conductors. The preparation mold and the preparation method of the thermoelectric refrigeration device have the effects of high convenience, high automation degree and operation perfection.

Description

Technical Field

[0001] This invention relates to the field of thermoelectric semiconductor device manufacturing technology, and in particular to a mold and method for preparing a thermoelectric cooling device. Background Technology

[0002] Thermoelectric semiconductors are materials that can convert electrical energy into heat energy, and thermoelectric cooling chips, also called thermoelectric coolers, are a type of heat pump. Their advantages include the absence of sliding parts, making them suitable for applications where space is limited, reliability is critical, and refrigerant contamination is undesirable. Utilizing the Peltier effect of semiconductor materials, when direct current passes through a coupler composed of two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the coupler, achieving cooling. It is a cooling technology that generates negative thermal resistance, characterized by the absence of moving parts and relatively high reliability.

[0003] In the production process of thermoelectric cooling chips, hundreds or even thousands of tiny conductor components need to be arranged in a strict array onto a substrate or mold. Currently, the common method is to use a vibratory feeder combined with a single-layer arranging mold for automatic arrangement. However, due to the tiny size of the conductor components, the existence of tolerances, and the randomness of vibratory feeding, there will always be a "leaking" phenomenon after a single arrangement, where some mold holes are not filled. Existing technologies usually rely on manual visual inspection and manual replenishment, which is not only inefficient and costly, but also makes it difficult to guarantee the accuracy and consistency of manual operation, becoming a bottleneck restricting the automation level of the production line and the improvement of product yield. Summary of the Invention

[0004] This invention discloses a mold and method for preparing thermoelectric cooling devices, aiming to solve the technical problem that the existing equipment for producing thermoelectric cooling chips needs to be improved in terms of automation and operational sophistication.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A mold for manufacturing thermoelectric cooling devices includes a machine base and an aligning table disposed on the top of the machine base. The top of the aligning table is provided with an arrangement mechanism for arranging the conductors of the cooling chips. The arrangement mechanism includes a pair of base plates fixedly installed on the top of the aligning table. Each base plate has two lower base plates and a lower drawer locked inside. Each lower base plate has a sliding piece slidably installed on the top. The interior of the sliding piece is evenly provided with a plurality of mold slots. The top of the arrangement mechanism is provided with an auxiliary mechanism for arranging auxiliary conductors. The auxiliary mechanism includes an upper base plate mounted on the top of the lower base plate and an upper drawer fixed to the top of the bottom plate. Several mold slots are opened through the interior of the upper base plate. The bottom of the auxiliary mechanism is provided with a control mechanism for controlling the conductor feeding. The control mechanism includes a partition plate that is slidably installed on the bottom of each upper substrate. Each partition plate is provided with a number of grid windows inside. The auxiliary mechanism, in conjunction with the control mechanism, assists the arrangement mechanism in filling in any gaps or imperfections in the conductors arranged by the arrangement mechanism after the arrangement mechanism has completed the approximate arrangement of the conductors.

[0006] Based on existing thermoelectric conductor aligning machines and technologies, this invention improves upon the traditional single-mold structure of aligning machines. Firstly, a modular arrangement mechanism is incorporated to arrange the thermoelectric conductors. The arranged conductors can be easily detached from the machine during the pulling process, reducing interference when handling the arranged conductors and significantly improving operational convenience. Furthermore, auxiliary and control mechanisms allow for the additional arrangement of a layer of conductors during the aligning mechanism's operation, directly applying the arranged conductors to the array of conductors already arranged. This achieves full automation from alignment and detection to replenishment, completely replacing the inefficient and unstable manual replenishment process. The machine's "double-mold" structure modularizes the "aligning" and "preparation / replenishment" functions, providing strong system fault tolerance. By replacing the upper and lower molds with different aperture arrays, it can adapt to the production of different models and array specifications of thermoelectric coolers, offering flexible application.

[0007] In a preferred embodiment, a limiting groove is formed on the top of the lower substrate, and the pull tab is slidably mounted inside the limiting groove.

[0008] Based on existing cooling chip conductor arranging machines and technologies, the single mold structure of the traditional arranging machine is improved. First, a lower substrate and a sheet-pulling structure, which exist in a split assembly form, are set up to replace the single fixed mold structure in the traditional equipment. The cooling chip conductors are automatically arranged, and the arranged conductors can be easily removed from the inside of the entire equipment along with the sheet-pulling.

[0009] In a preferred embodiment, the upper surface of the upper drawer is flush with the upper substrate, each mold through slot and a mold slot are symmetrically distributed in the vertical direction, and a retaining edge is provided on the top side of the upper substrate away from the upper drawer.

[0010] By extending an upper substrate structure controlled by a control mechanism on the basis of the lower substrate, the upper substrate moves synchronously with the lower substrate. When the lower substrate is running, an additional layer of conductors can be arranged in an auxiliary manner, and the arranged conductors can be directly applied to the conductor array arranged on the lower substrate. This achieves full automation from alignment and detection to replenishment, completely replacing the inefficient and unstable manual replenishment process.

[0011] In a preferred embodiment, each of the grid windows is vertically distributed between a mold through slot and a mold slot, and forms a shield on the bottom of the mold through slot. An electric push rod is vertically fixed to the top of the base plate, and an extrusion member is fixedly installed at the output end of the electric push rod. The extrusion member and the end of the partition plate are in extrusion contact.

[0012] By setting a partition plate structure on the upper substrate that is squeezed and translated by an electric push rod, the opening and closing of the mold through slot inside the upper substrate is controlled by the partition plate with built-in grid window in conjunction with the squeezing of the electric push rod, thereby controlling the timing of material replenishment to the upper substrate and maintaining the perfect and reasonable operation of the equipment.

[0013] As can be seen from the above, the thermoelectric refrigeration device preparation mold and preparation method provided by the present invention have the following technical effects.

[0014] Firstly, based on existing cooling chip conductor arranging machines and technologies, the single mold structure of the traditional arranging machine is improved. Firstly, a lower substrate and a sheet-pulling structure, which exist in a split assembly form, are used to replace the single fixed mold structure in the traditional equipment. The cooling chip conductors are automatically arranged. The arranged conductors can be easily removed from the inside of the entire equipment along with the sheet-pulling. This reduces the interference rate of the conductors when the traditional equipment is handling the arranged conductors and greatly improves the ease of operation.

[0015] Secondly, by extending the lower substrate with an upper substrate structure controlled by a mechanism, the upper substrate moves synchronously with the lower substrate. During the operation of the lower substrate, an additional layer of conductors can be arranged in an auxiliary manner, and the arranged conductors can be directly applied to the conductor array on the lower substrate. This achieves full automation from alignment and detection to replenishment, completely replacing the inefficient and unstable manual replenishment process. The "double-layer mold" structure of this equipment modularizes the "alignment" and "material preparation / replenishment" functions, has strong system fault tolerance, and can adapt to the production of thermoelectric cooling chips of different models and array specifications by changing the upper and lower molds with different hole arrays, making it flexible in application. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure proposed in this invention.

[0017] Figure 2 This is a schematic diagram of the top structure of the aligner proposed in this invention.

[0018] Figure 3 This is an exploded view of the overall structure proposed in this invention.

[0019] Figure 4 This is a cross-sectional view of the top structure of the base plate proposed in this invention.

[0020] Figure 5 The present invention proposes Figure 4 Enlarged view of the structure at point A in the middle.

[0021] Figure 6 This is a schematic diagram of the upper substrate structure proposed in this invention.

[0022] Figure 7 This is a schematic diagram of the sheet-drawing structure proposed in this invention.

[0023] Figure 8 This is a cross-sectional view of the sheet-drawing structure proposed in this invention.

[0024] Figure 9 This is a schematic diagram of the working state of the device proposed in this invention.

[0025] In the diagram: 1. Machine base; 2. Alignment table; 3. Arrangement mechanism; 301. Base plate; 302. Lower base plate; 303. Lower drawer; 3031. Pin; 304. Sheet pull; 3041. Mold slot; 3042. Handle; 305. Limiting groove; 4. Auxiliary mechanism; 401. Upper base plate; 402. Mold through slot; 403. Upper drawer; 404. Edge guard; 405. Support leg; 5. Control mechanism; 501. Middle partition; 5011. Arc edge; 502. Grid window; 503. Elastic element; 504. Electric push rod; 505. Extrusion part. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0027] The thermoelectric refrigeration device preparation mold and preparation method disclosed in this invention are mainly applied to the scenario of fully automatic leak repair and arrangement of internal conductors of a refrigeration chip.

[0028] Reference Figures 1 to 9A mold for manufacturing thermoelectric cooling devices includes a machine base 1 and an aligning table 2 set on the top of the machine base 1. The top of the aligning table 2 is provided with an arrangement mechanism 3 for arranging the conductors of the cooling chip. The arrangement mechanism 3 includes a pair of base plates 301 fixedly installed on the top of the aligning table 2. Each base plate 301 has two lower base plates 302 and a lower drawer 303 locked inside. Each lower base plate 302 has a slidable drawer 304 on the top. The drawer 304 has a plurality of mold slots 3041 evenly opened inside. The top of the arrangement mechanism 3 is provided with an auxiliary mechanism 4 for arranging auxiliary conductors. The auxiliary mechanism 4 includes an upper substrate 401 mounted on the top of the lower substrate 302 and an upper drawer 403 fixed to the top of the bottom plate 301. Several mold slots 402 are opened through the interior of the upper substrate 401. The bottom of the auxiliary mechanism 4 is provided with a control mechanism 5 for controlling the conductor feeding. The control mechanism 5 includes a partition plate 501 that is slidably installed on the bottom of each upper substrate 401. Each partition plate 501 has a number of grid windows 502 inside. The auxiliary mechanism 4, in conjunction with the control mechanism 5, assists the arrangement mechanism 3. After the arrangement mechanism 3 completes the approximate arrangement of the conductors, it fills in any gaps or imperfections in the conductors arranged by the arrangement mechanism 3.

[0029] In this embodiment: Before use, the worker needs to empty a large number of conductors for the cooling chips from the top of the lower drawer 303 and the upper drawer 403, and start the entire device. At this time, the aligning table 2 located on top of the machine 1 starts to run, causing the entire base plate 301 to tilt and vibrate towards the lower drawer 303. At this time, the conductors located on top of the upper drawer 403 will slide along the top of the upper base plate 401 and be arranged inside the mold slot 402. After a preset time, the aligning table 2 causes the entire base plate 301 to tilt and vibrate slightly towards the upper drawer 403, causing the conductors located on top of the lower drawer 303 to slide along the top of the chip drawer 304 and be arranged inside several mold slots 3041. After continuing to run and reaching the preset time, the aligning table 2 causes the entire base plate 301 to tilt and vibrate towards the lower drawer 303. The direction continues to tilt and vibrate before resetting, resetting the excess conductor at the top of the sheet 304. At the same time, the control mechanism 5 operates and releases the limit on the mold through slot 402, causing the conductor inside the mold through slot 402 to fall vertically, filling the mold slot 3041 that is not filled with conductor. After that, the alignment table 2 repeats the above operation to reset the excess conductor at the top of the sheet 304. At the same time, the worker pulls the sheet 304 filled with conductor from the side of the whole equipment and flips it to cover the top of the pre-arranged lower substrate 302, and then covers it with the upper substrate 401. During this process, a pre-formed solder sheet needs to be added between the conductor and the substrate. After that, the worker puts the assembled cooling chip assembly into a vacuum or protective atmosphere (such as nitrogen) furnace and heats it according to the precise temperature curve to form a metallurgical bond, completing the preparation.

[0030] Reference Figure 3 and Figure 7 In a preferred embodiment, a limiting groove 305 is formed on the top of the lower substrate 302, and the pull tab 304 is slidably mounted inside the limiting groove 305.

[0031] After the conductor filling of the mold slot 3041 inside the sheet 304 is completed, the worker pulls the sheet 304 horizontally, causing the sheet 304 to slide along the inside of the limiting groove 305 and be pulled out from the side of the base plate 301.

[0032] The lower drawer 303 has symmetrically arranged pins 3031 on both sides. The pins 3031 are inserted and fixed to both sides of the base plate 301, and fix the lower drawer 303 and the lower base plate 302 which is limited by the lower drawer 303. At the same time, by pulling the pins 3031, the lower base plate 302 and the lower drawer 303 can also be quickly disassembled.

[0033] Furthermore, each of the pull tabs 304 is provided with a handle 3042 at its end. The handles 3042 are distributed on the outside of the base plate 301, which makes it convenient for workers to hold and disassemble the pull tabs 304.

[0034] Reference Figure 2 and Figure 3 In a preferred embodiment, the upper surface of the upper drawer 403 is flush with the upper substrate 401, each mold through slot 402 and a mold slot 3041 are symmetrically distributed in the vertical direction, and a retaining edge 404 is provided on the top side of the upper substrate 401 away from the upper drawer 403.

[0035] When the aligning table 2 located at the top of the machine 1 starts to run and causes the entire base plate 301 to vibrate, the side guard 404 located on the side of the upper base plate 401 will cooperate with the drawer 403 to form a shield around the entire upper base plate 401, thereby preventing the conductor located at the top of the upper base plate 401 from falling to the top of the lower base plate 302.

[0036] Each upper substrate 401 is provided with a support leg 405 at its bottom corner, and is fixed to the top of the lower substrate 302 by the support leg 405. At the same time, the upper substrate 401 can be quickly disassembled and assembled by pulling it vertically.

[0037] Reference Figures 3 to 6 In a preferred embodiment, each grid window 502 is vertically distributed between a mold through slot 402 and a mold slot 3041, and forms a shield on the bottom of the mold through slot 402. An electric push rod 504 is vertically fixed on the top of the base plate 301. An extrusion member 505 is fixedly installed at the output end of the electric push rod 504. The extrusion member 505 and the end of the partition plate 501 are in extrusion contact.

[0038] Under normal conditions, the grid windows 502 inside the partition plate 501 are distributed below the mold channel 402 and block the mold channel 402. When the mold channel 402 is filled with conductors, the electric push rod 504 is activated, the output shaft extends downward and drives the extruder 505, causing the extruder 505 to push the partition plate 501 to move horizontally, causing the grid windows 502 to release their blockage of the mold channel 402, and thus causing the conductors accumulated inside the mold channel 402 to fall vertically.

[0039] In this embodiment, an elastic element 503 is fixedly connected between the interlayer of each partition plate 501 and the upper substrate 401. When the partition plate 501 loses the squeezing push of the squeezing element 505, it will be reset by the elastic element 503. The end of the partition plate 501 is provided with an arc edge 5011, and the arc edge 5011 and the squeezing element 505 are in squeezing contact to reduce the resistance of the partition plate 501 when it is squeezed.

[0040] Working principle: During use, the worker needs to pour a large amount of conductors for the cooling chips onto the top of the lower drawer 303 and the upper drawer 403 in advance, and start the entire equipment at the same time. At this time, the aligning table 2 located on top of the machine 1 starts to run, and drives the entire base plate 301 to tilt and vibrate towards the lower drawer 303. At this time, the conductors located on the top of the upper drawer 403 will slide along the top of the upper base plate 401 and be arranged inside the mold through groove 402. After reaching the preset time, the aligning table 2 drives the entire base plate 301 towards the upper drawer. The direction of 403 is slightly tilted and vibrated, causing the conductor at the top of the lower drawer 303 to slide along the top of the drawer 304 and be arranged into the interior of several mold slots 3041. After continuing to run and reaching the preset time, the entire platform 2 drives the entire base plate 301 to continue tilting and vibrating towards the lower drawer 303 and then reset, resetting the excess conductor at the top of the drawer 304. Under normal conditions, the grid windows 502 inside the partition plate 501 are distributed below the mold through slot 402 and form a grid on the mold through slot 402. When the mold slot 402 is filled with conductors, the electric push rod 504 is activated, extending its output shaft downwards and driving the extruder 505. This causes the extruder 505 to push the partition plate 501 to move horizontally, thus releasing the grid window 502 from blocking the mold slot 402. Consequently, the conductors accumulated inside the mold slot 402 fall vertically, filling any gaps in the mold slot 3041 that are not filled with conductors. Afterwards, the alignment table 2 repeats the above operation to remove any excess conductors from the top of the sheet extraction 304. During the reset process, the worker horizontally pulls the pull tab 304, causing it to slide along the inside of the limiting groove 305 and be pulled out from the side of the base plate 301. The pull tab 304 is then flipped over and placed on top of the pre-arranged lower substrate 302, and then the upper substrate 401 is placed on top. During this process, a pre-formed solder sheet needs to be added between the conductor and the substrate. After that, the worker puts the assembled cooling chip assembly into a vacuum or protective atmosphere (such as nitrogen) furnace and heats it according to a precise temperature curve to form a metallurgical bond, thus completing the preparation.

[0041] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A mold for fabricating thermoelectric cooling devices, comprising a machine base (1) and an alignment table (2) disposed on top of the machine base (1), characterized in that, The top of the aligning table (2) is provided with an arrangement mechanism (3) for arranging the conductors of the cooling chip. The arrangement mechanism (3) includes a pair of base plates (301) fixedly installed on the top of the aligning table (2). Each base plate (301) has two lower base plates (302) and a lower drawer (303) locked inside. Each lower base plate (302) has a sliding piece (304) slidably installed on the top of it. The sliding piece (304) has a number of mold slots (3041) evenly opened inside. The top of the arrangement mechanism (3) is provided with an auxiliary mechanism (4) for arranging auxiliary conductors. The auxiliary mechanism (4) includes an upper substrate (401) mounted on the top of the lower substrate (302) and an upper drawer (403) fixed to the top of the bottom plate (301). The interior of the upper substrate (401) is provided with a number of mold slots (402). The bottom of the auxiliary mechanism (4) is provided with a control mechanism (5) for controlling the conductor feeding. The control mechanism (5) includes a partition plate (501) that is slidably installed on the bottom of each upper substrate (401). Each partition plate (501) has a number of grid windows (502) inside. The upper surface of the upper drawer (403) is flush with the upper base plate (401). Each mold through slot (402) and a mold slot (3041) are symmetrically distributed in the vertical direction. A retaining edge (404) is provided on the top side of the upper base plate (401) away from the upper drawer (403). Each of the grid windows (502) is vertically distributed between a mold through slot (402) and a mold slot (3041), and forms a shield on the bottom of the mold through slot (402). An electric push rod (504) is vertically fixed on the top of the base plate (301). An extrusion member (505) is fixedly installed at the output end of the electric push rod (504). The extrusion member (505) and the end of the partition plate (501) are in extrusion contact.

2. The mold for fabricating a thermoelectric refrigeration device according to claim 1, characterized in that, A limiting groove (305) is provided on the top of the lower substrate (302), and the pull tab (304) is slidably installed inside the limiting groove (305).

3. The mold for fabricating a thermoelectric refrigeration device according to claim 1, characterized in that, The lower drawer (303) is symmetrically provided with pins (3031) on both sides. The pins (3031) are inserted and fixed to both sides of the base plate (301) and fix the lower drawer (303) and the lower base plate (302) which is limited by the lower drawer (303).

4. The mold for fabricating a thermoelectric refrigeration device according to claim 1, characterized in that, Each of the drawers (304) is provided with a handle (3042) at its end, and the handles (3042) are distributed on the outer side of the base plate (301).

5. The mold for fabricating a thermoelectric refrigeration device according to claim 1, characterized in that, Each of the upper substrates (401) is provided with a support foot (405) at its bottom corner, and is fixed to the top of the lower substrate (302) by means of the support foot (405).

6. The mold for fabricating a thermoelectric refrigeration device according to claim 1, characterized in that, An elastic element (503) is fixedly connected between the interlayer of each of the partition plates (501) and the upper substrate (401).

7. The mold for fabricating a thermoelectric refrigeration device according to claim 4, characterized in that, The end of the partition plate (501) is provided with an arc edge (5011), and the arc edge (5011) and the extrusion member (505) are pressed into contact.

8. The method for preparing a mold for thermoelectric refrigeration devices according to claim 1, characterized in that, Includes the following steps; S1: Before use, the worker pours a large amount of conductors of the cooling chip into the top of the lower drawer (303) and the upper drawer (403) and starts the entire device at the same time; S2: The aligning table (2) located at the top of the machine (1) starts to run and drives the entire base plate (301) to tilt and vibrate towards the lower drawer (303). At this time, the conductor located at the top of the upper drawer (403) will slide along the top of the upper base plate (401) and be arranged inside the mold through slot (402). S3: After the preset time is reached, the aligning table (2) drives the entire base plate (301) to tilt and vibrate slightly towards the upper drawer (403), causing the conductor at the top of the lower drawer (303) to slide along the top of the drawer (304) and be arranged into the interior of several mold slots (3041). S4: After the preset time is reached, the alignment table (2) drives the entire base plate (301) to continue to tilt and vibrate towards the lower drawer (303) and then reset, so as to reset the excess conductor at the top of the drawer (304). At the same time, the control mechanism (5) runs and releases the limit on the mold through groove (402), causing the conductor located inside the mold through groove (402) to fall vertically, and to fill the gaps in the mold slot (3041) that is not filled with conductor. S5: Afterwards, the aligning table (2) repeats the above operation to reset the excess conductor at the top of the pull piece (304). At the same time, the worker pulls the pull piece (304) filled with conductor from the side of the whole equipment and flips it to cover the top of the pre-arranged lower substrate, and then covers the upper substrate. During this process, a pre-formed solder sheet needs to be added between the conductor and the substrate. S6: After that, the workers put the assembled cooling chip assembly into a vacuum or protective atmosphere (such as nitrogen) furnace and heat it according to a precise temperature curve to form a metallurgical bond, thus completing the preparation.

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