A multi-chip eutectic device and method

Abstract

The present application relates to chip packaging technical field, especially to a kind of multi-chip eutectic device and method.The multi-chip eutectic device includes bearing table, is equipped with mounting area, chip loading area and substrate unloading area on bearing table, chip loading area and substrate unloading area are adjacent and abut on the same side of mounting area, also include eutectic station component and transfer station component on bearing table, first binding head component is equipped in mounting area, first binding head can move between transfer station component and eutectic station component, first binding head component includes first suction nozzle group, and first suction nozzle group includes multiple first suction nozzles, and multiple first suction nozzles on first suction nozzle group can simultaneously correspond to suction multiple chips on first transfer station, and move to first eutectic station or second eutectic station and carry out mounting.Solve the technical problem of low production efficiency of existing chip packaging equipment.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a multi-chip eutectic device and method. Background Technology

[0002] Existing chip mounting equipment often uses a single nozzle to pick up chips one by one and pre-place them on the substrate during multi-chip eutectic bonding, followed by heating to fix the chips in place. This method can lead to stress pulling during eutectic bonding due to the lack of pressure from the nozzle, thus affecting accuracy. Another common method is to use a heated nozzle with a binding head to pick up chips one by one and eutectic bond them onto the substrate. This method is time-consuming. In other words, current multi-chip eutectic bonding equipment uses a single nozzle to pick up and place chips one by one, resulting in low overall production efficiency. Summary of the Invention

[0003] To address the technical problem of low production efficiency in existing chip packaging equipment, this invention provides a multi-chip eutectic device and method.

[0004] The present invention provides a multi-chip eutectic bonding device, including a carrier platform. The carrier platform has a mounting area, a chip loading area, and a substrate loading / unloading area. The chip loading area and the substrate loading / unloading area are adjacent to each other and located on the same side of the mounting area. The multi-chip eutectic bonding device further includes a eutectic stage assembly and a transfer stage assembly disposed on the carrier platform. The eutectic stage assembly includes a rotary table, a first eutectic stage, and a second eutectic stage. The first eutectic stage and the second eutectic stage are located on opposite sides of the rotary table, and the first eutectic stage and the second eutectic stage alternately operate in the substrate loading / unloading area and the mounting area via the rotary table. The transfer stage assembly includes a moving track and a first transfer stage. The moving track extends from the chip loading area to the mounting area. A transfer station moves back and forth between the chip loading area and the mounting area via a moving track. The mounting area is equipped with a first binding head assembly, and the chip loading area is equipped with a second binding head assembly and a chip supply assembly. The second binding head assembly can move between the chip supply assembly and the transfer station assembly to move chips from the chip supply assembly to the first transfer station. The first transfer station has multiple first chip carrier positions. The first binding head can move between the transfer station assembly and the eutectic stage assembly. The first binding head assembly includes a first nozzle group, which includes multiple first nozzles. The multiple first nozzles on the first nozzle group can simultaneously pick up multiple chips from the first transfer station and move them to the first eutectic stage or the second eutectic stage for mounting.

[0005] Preferably, the mounting area includes a first top-view module, a second transfer station, and a first material station, all located on the side of the moving track near the eutectic stage assembly; the first binding assembly further includes a second nozzle group and a first bottom-view module, located on opposite sides of the first nozzle group; the substrate loading / unloading area includes a third binding assembly and a second material station, the third binding assembly being movable between the second material station and the eutectic stage assembly for substrate loading / unloading operations.

[0006] Preferably, the chip loading area is further provided with a second lower view module, a third lower view module, and a second upper view module. The chip supply component includes a chip carrier component and a flip-binding head. The first lower view module, the second lower view module, the first upper view module, and the flip-binding head are arranged colinearly. The chip loading area is provided with a mounting bracket. The second lower view module and the third lower view module are fixed on the mounting bracket. The second lower view module is located above the chip carrier component, and the third lower view module is located above the first transfer platform. The mounting bracket is provided with a lifting component, and the second lower view module is movably connected to the mounting bracket through the lifting component.

[0007] Preferably, the second headgear assembly further includes a transparent suction nozzle assembly. When the transparent suction nozzle assembly moves between the third downward viewing module and the first transfer platform, the third downward viewing module can observe the first transfer platform through the transparent suction nozzle assembly.

[0008] To solve the above-mentioned technical problems, the present invention provides another technical solution as follows: a multi-chip eutectic method, applied to the above-mentioned multi-chip eutectic equipment, the method comprising: in the chip loading area, transporting multiple chips to a first transfer table, and moving the first transfer table to a mounting area via a moving track; in the substrate unloading area, transporting the substrate to a first eutectic stage or a second eutectic stage, and moving the first eutectic stage or the second eutectic stage on which the substrate is placed to the mounting area via a rotary table; in the mounting area, a first binding assembly picks up multiple chips from the first transfer table and moves them to the first eutectic stage or the second eutectic stage for chip mounting operation; in the substrate unloading area, removing the eutectic-completed substrate from the second eutectic stage or the first eutectic stage.

[0009] Preferably, transporting multiple chips to the first transfer platform includes: a second binding assembly picking up chips from the chip supply assembly and placing the chips at a first preset position on the first transfer platform; the second binding assembly continuing to pick up chips from the chip supply assembly and moving them above the first transfer platform; a third downward viewing module detecting the position information of the chips on the first transfer platform through a transparent suction nozzle assembly; and, based on the position information, placing the chips currently on the transparent suction nozzle assembly at a second preset position on the first transfer platform, repeating this step until the number of chips on the first transfer platform reaches a preset value.

[0010] Preferably, the second binding head assembly picks up the chip from the chip supply assembly, including: flipping the binding head to pick up the chip from the chip carrier assembly; flipping the binding head to make the chip face upward, the second downward viewing module rising to focus on the chip on the flipping binding head and acquiring the image information of the chip for detection; the flipping binding head moving towards the first transfer stage to a third preset position, the second binding head assembly moving above the flipping binding head and picking up the chip.

[0011] Preferably, the first bonding assembly picks up multiple chips from the first transfer stage and moves them to the first eutectic stage or the second eutectic stage for chip mounting, including: the first nozzle group picks up multiple chips from the first transfer stage and moves them above the first top-view module for detection; if the number of chips on the first nozzle group is less than a preset threshold, the chips are transferred to the second transfer stage; the second nozzle group picks up chips from the first material stage and places them on the second transfer stage until the number of chips on the second transfer stage meets the preset threshold.

[0012] Preferably, the second suction nozzle group picks up chips from the first material stage and places them on the second transfer stage. After the number of chips on the second transfer stage meets a preset threshold, the method further includes: the first downward-looking module detecting whether the position and / or angle information of the chips on the second transfer stage meets a preset state; if it does, the first suction nozzle group picks up the chips on the second transfer stage; otherwise, the second suction nozzle group adjusts the corresponding chips before the first suction nozzle group picks up the chips on the second transfer stage.

[0013] Preferably, when one of the first eutectic stage or the second eutectic stage is located in the mounting area, the other is located in the substrate loading / unloading area, and the substrate loading / unloading operation and the chip mounting operation are performed simultaneously on the first eutectic stage and the second eutectic stage, respectively.

[0014] Compared with the prior art, the multi-chip eutectic device and method provided by the present invention have the following advantages: 1. This invention provides a multi-chip eutectic bonding device. By dividing the carrier platform into a mounting area, a chip loading area, and a substrate loading / unloading area, and making the chip loading area and the substrate loading / unloading area adjacent to each other and adjacent to the same side of the mounting area, a compact triangular layout is formed. At the same time, a rotary table is used to realize the alternating operation of the first eutectic bonding stage and the second eutectic bonding stage in the substrate loading / unloading area and the mounting area, and a moving track is used to move the first transfer stage between the chip loading area and the mounting area. In conjunction with the first nozzle group of the first binding head assembly, multiple chips are picked up simultaneously for mounting. Overall, the device achieves a high degree of parallelism and space optimization of multi-chip loading, transfer, mounting and substrate loading, eutectic bonding, and unloading, thereby improving production efficiency.

[0015] 2. The multi-chip eutectic bonding equipment provided in this embodiment of the invention establishes a complete material replenishment and correction mechanism and an automatic substrate transfer mechanism in the mounting area by setting a first top view module, a second transfer station and a first material station in the mounting area, integrating a second nozzle group and a first bottom view module on the first binding assembly, and setting a third binding assembly and a second material station in the substrate loading and unloading area. This enables the equipment to complete chip missing replenishment, angle and posture adjustment and automatic substrate loading and unloading without stopping the machine, ensuring the continuity of production and mounting quality.

[0016] 3. The multi-chip eutectic device provided in this embodiment of the invention achieves an integrated layout of the visual inspection module by setting a second lower-view module, a third lower-view module, and a second upper-view module in the chip loading area, and by making the first lower-view module, the second lower-view module, the first upper-view module, and the flipping binding head collinear, thus shortening the movement stroke of the flipping binding head. The flipping binding head can automatically complete the chip pick-up and flipping correction operations, solving the problem of abnormal chip orientation. The second lower-view module has an adaptive height adjustment structure design through a lifting component, which allows the second lower-view module to adjust its height according to the needs of chips of different thicknesses or different working distances, ensuring the accuracy and flexibility of detection focusing.

[0017] 4. The multi-chip eutectic device provided in this embodiment of the invention innovatively realizes the transparent detection function in the material-carrying state of the suction nozzle through the transparent suction nozzle component in the second binding head assembly. This allows the third downward viewing module to observe the first transfer station through the transparent suction nozzle component. Thus, when the second binding head assembly picks up the chip and moves it above the first transfer station, it can detect the precise position of the existing chip on the first transfer station in real time, guide the precise placement of the current chip, effectively avoid the cumulative positional deviation when placing the chip, and improve the arrangement accuracy of multiple chips on the transfer station.

[0018] 5. This invention also provides a multi-chip eutectic method, which performs chip loading, substrate loading / unloading, and mounting operations in parallel across different regions. A rotary table is used to switch between the first eutectic stage and the substrate loading / unloading area. The first binding head assembly picks up multiple chips from the first transfer table for mounting, while another eutectic stage loads / unloads the substrate. This achieves time overlap between chip mounting and substrate loading / unloading, greatly shortening the processing cycle of a single substrate and improving the overall efficiency of the equipment.

[0019] 6. The multi-chip eutectic method provided in this embodiment of the invention, during the process of transporting multiple chips to the first transfer station, sequentially picks up the chips through the second binding head assembly, and when placing subsequent chips, uses the third downward viewing module to detect the position information of the existing chips on the first transfer station through the transparent suction nozzle assembly, and then accurately places the current chip to the second preset position based on the position information, thereby realizing closed-loop position correction, preventing cumulative errors, and ensuring that the arrangement accuracy of multiple chips on the first transfer station is perfectly matched with the shape of the first suction nozzle group.

[0020] 7. The multi-chip eutectic method provided in this embodiment of the invention picks up the chip from the chip carrier component by flipping the binding head and flipping it upward. Then, the second downward viewing module rises to the focusing position to obtain chip image information for detection. Then, the flipping binding head is moved to a preset position, and finally the second binding head component moves to pick up the chip. This process realizes the automatic connection of chip flipping, detection and secondary picking, ensuring that the chips entering the transfer station are all face up and have been quality screened, thus improving the feeding yield.

[0021] 8. In the multi-chip eutectic method provided in this embodiment of the invention, after the first binding head assembly picks up multiple chips, it moves to the top of the first top-view module for detection. If the number of chips is found to be less than a preset threshold, the chips are transferred to the second transfer platform, and the second suction nozzle group picks up chips from the first material platform for replenishment until the number of chips on the second transfer platform meets the threshold. This mechanism realizes online quantity detection and rapid replenishment before mounting, avoiding mounting defects caused by missing chips picked up by the suction nozzle.

[0022] 9. The multi-chip eutectic method provided in this embodiment of the invention detects the position and / or angle information of the chip on the second transfer stage through the first downward viewing module. If the preset state is met, the chip is directly picked up; otherwise, the chip is picked up after the attitude is adjusted by the second suction nozzle group. This achieves fine correction of the position and angle of each chip before mounting, which significantly improves the overall alignment accuracy and eutectic quality of multi-chip mounting on the substrate.

[0023] 10. The multi-chip eutectic method provided in this embodiment of the invention controls the first eutectic stage or the second eutectic stage so that when one is in the mounting area, the other is in the substrate loading and unloading area, and the substrate loading and unloading operation and chip mounting operation are performed simultaneously. This achieves complete parallelism and non-interference between the two workstations, maximizes the advantages of the dual eutectic stage structure, eliminates the idle waiting time caused by loading and unloading, and increases the equipment capacity to the theoretical maximum value. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the framework of a multi-chip mounting device provided in an embodiment of the present invention. Figure 1 .

[0026] Figure 2 This is a schematic diagram of the structure of the first binding head assembly in a multi-chip mounting device provided in an embodiment of the present invention. Figure 1 .

[0027] Figure 3 yes Figure 2 An enlarged view of the first binding head assembly A in a multi-chip mounting device provided in an embodiment of the present invention.

[0028] Figure 4 This is a schematic diagram of the structure of the first binding head assembly in a multi-chip mounting device provided in an embodiment of the present invention. Figure 2 .

[0029] Figure 5 This is a schematic diagram of the framework of a multi-chip mounting device provided in an embodiment of the present invention. Figure 2 .

[0030] Figure 6 This is a schematic diagram of the framework of a multi-chip eutectic device provided in an embodiment of the present invention. Figure 1 .

[0031] Figure 7 This is a schematic diagram of the framework of a multi-chip eutectic device provided in an embodiment of the present invention. Figure 2 .

[0032] Figure 8 This is a schematic diagram of the frame of a chip loading device provided in an embodiment of the present invention.

[0033] Figure 9This is a schematic diagram of the structure of the second binding head assembly in a chip loading device provided in an embodiment of the present invention.

[0034] Figure 10 This is a schematic diagram of the structure of the second lower view module in a chip loading device provided in an embodiment of the present invention.

[0035] Figure 11 This is a schematic diagram of the frame of a substrate loading and unloading device provided in an embodiment of the present invention.

[0036] Figure 12 This is a schematic diagram of the structure of the second material stage in a substrate loading and unloading device provided in an embodiment of the present invention.

[0037] Figure 13 This is a flowchart of a multi-chip eutectic method provided in an embodiment of the present invention.

[0038] Figure 14 This is a detailed flowchart of step S1 in a multi-chip eutectic method provided in an embodiment of the present invention.

[0039] Figure 15 This is a detailed flowchart of step S11 in a multi-chip eutectic method provided in an embodiment of the present invention.

[0040] Figure 16 This is a detailed flowchart of step S3 in a multi-chip eutectic method provided in an embodiment of the present invention.

[0041] Figure 17 This is a detailed flowchart of step S33 in a multi-chip eutectic method provided in an embodiment of the present invention.

[0042] Explanation of reference numerals in the attached diagram: 100. Multi-chip eutectic equipment; 10. Multi-chip mounting device; 20. Chip loading device; 30. Substrate loading and unloading device; 40. Carrier platform; 1. First headgear assembly; 11. First suction nozzle assembly; 111. First suction nozzle; 112. Base; 113. Guide rail slider; 114. Floating seat; 115. First elastic element; 116. Second elastic element; 117. Adjustment assembly; 118. Distance measuring device; 12. Second suction nozzle assembly; 121. Second suction nozzle; 13. First downward viewing module; 2. Eutectic stage assembly; 21. Rotary stage; 22. First eutectic stage; 23. Second eutectic stage; 3. Transfer station assembly; 31. First transfer station; 311. First chip carrier position; 32. Second transfer station; 321. Second chip carrier position; 33. Moving track; 4. First upward-viewing module; 5. First material platform; 6. Gantry support; 201. Chip supply assembly; 202. Second lower-view module; 203. Third lower-view module; 204. Second headgear assembly; 2041. Moving assembly; 2042. Perspective nozzle assembly; 20421. Mounting base; 20422. Third nozzle; 20423. Clearance channel; 20424. Rotation motor; 205. Flip headgear; 206. Mounting bracket; 2061. Lifting assembly; 207. Chip carrying assembly; 208. Second upper-view module; 301. Third binding assembly; 302. Second material table; 3021. Substrate loading area; 3022. Substrate unloading area; 3023. Cooling area; 30231. Cooling chamber; 303. Mounting frame; 401. Mounting area; 402. Chip loading area; 403. Substrate loading and unloading area. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0044] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0045] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0046] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0047] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0048] Please see Figures 1-5 The first embodiment of the present invention provides a multi-chip mounting device 10, which includes a first binding head assembly 1, a eutectic stage assembly 2, and a transfer stage assembly 3. The first binding head assembly 1 is movable between the eutectic stage assembly 2 and the transfer stage assembly 3. The transfer stage assembly 3 includes a first transfer stage 31, on which a plurality of first chip carrier positions 311 are provided. The first binding head assembly 1 includes a first nozzle group 11, which includes a plurality of first nozzles 111. The arrangement of the plurality of first nozzles 111 is consistent with the arrangement of the plurality of first chip carrier positions 311 on the first transfer stage 31. The first nozzle group 11 can simultaneously pick up multiple chips from the first transfer stage 31 and transfer them to the eutectic stage assembly 2.

[0049] It should be noted that the multi-chip mounting device 10 includes a gantry bracket 6, and a first binding head assembly 1 is suspended on the gantry bracket 6 and movably connected to the gantry bracket 6. It can slide along the length of the gantry bracket 6 to move between the eutectic stage assembly 2 and the transfer stage assembly 3. The first binding head assembly 1 includes a first nozzle group 11 for picking up chips. When the first binding head assembly 1 moves between the eutectic stage assembly 2 and the transfer stage assembly 3, it can realize the chip picking and eutectic operation.

[0050] In some embodiments, the plurality of first nozzles 111 of the first nozzle group 11 are arranged in a linear, circular, or rectangular array, which can be specifically set according to actual application requirements to adapt to the parallel pick-up and placement requirements in different production scenarios and improve production efficiency.

[0051] Specifically, in this embodiment, the first transfer station 31 is provided with multiple first chip carrier positions 311 for carrying chips to be mounted. The arrangement of the first chip carrier positions 311 is consistent with the arrangement of the first nozzles 111. That is, during the production process, the arrangement of the multiple chips to be mounted placed on the first transfer station 31 is also consistent with the arrangement of the first nozzles 111. Therefore, when the first nozzle group 11 picks up chips on the first transfer station 31, each first nozzle 111 corresponds exactly to one chip, thereby enabling the first nozzle group 11 to pick up multiple chips on the first transfer station 31 at one time and accurately. This design breaks through the bottleneck of traditional single chip picking and placing operations. Through the alignment and adaptation structure of multiple nozzles and multiple carrier positions, it is possible to pick up and transfer multiple chips at one time and complete the mounting operation, which greatly shortens the travel time and operation cycle of a single chip picking and placing, and significantly improves the overall operation efficiency of chip mounting.

[0052] As an optional implementation, the first nozzle assembly 11 includes a base 112 and a plurality of first nozzles 111 detachably connected to the base 112. The number and position of the first nozzles 111 can be adjusted according to actual mounting requirements to adapt to more diverse mounting scenarios.

[0053] Optionally, the first suction nozzle 111 and the base 112 can be magnetically connected, snap-fitted, riveted, threaded, etc.

[0054] It should be noted that the first suction nozzle assembly 11 also includes a guide rail slider 113 and a floating seat 114. One side of the guide rail slider 113 is slidably connected to the base 112, and the other side is fixed with the floating seat 114. The bottom of the floating seat 114 is connected to the first suction nozzle 111. The floating seat 114 is slidably engaged with the base 112 through the guide rail slider 113, so that the first suction nozzle 111 can move up and down. The guide rail slider 113 provides precise lifting guidance for the floating seat 114, ensuring that the floating seat 114 moves smoothly and accurately.

[0055] Specifically, a first elastic element 115 is provided between the base 112 and the floating seat 114. The first elastic element 115 is preferably a compression spring, with its opposite ends connected to the base 112 and the floating seat 114 respectively, providing continuous and stable downward pressure to the floating seat 114. An adjustment component 117 is also provided at the bottom of the floating seat 114. A second elastic element 116 is connected between the base 112 and the adjustment component 117. The second elastic element 116 is preferably a tension spring. The relative position of the adjustment component 117 and the floating seat 114 is adjustable. The opposite ends of the second elastic element 116 are connected to the adjustment component 117 and the floating seat 114 respectively. The floating seat 114 provides an upward pulling force to balance the weight of the floating seat 114 and the first suction nozzle 111, so that the first suction nozzle 111 can have a better force control effect.

[0056] By changing the relative position of the adjustment component 117 and the floating seat 114, the tension of the second elastic element 116 can be adjusted, that is, the preload of the second elastic element 116 can be adjusted, so that the first suction nozzle 111 can be adapted to chips of different types and thicknesses.

[0057] In some embodiments, a ranging device 118 is also provided at the corresponding position of the base 112 and the floating seat 114. Each floating seat 114 corresponds to a ranging device 118. The ranging device 118 can detect the moving distance of the floating seat 114 in real time and accurately, thereby realizing the downward stroke of the first suction nozzle 111 and the mounting pressure on the chip, achieving closed-loop control of force control, and improving the accuracy and reliability of chip mounting.

[0058] Each first nozzle 111 in this embodiment can slide independently relative to the base 112 and has an independent elastic force control structure and a ranging device 118. This allows each first nozzle 111 to be finely adjusted according to the thickness of the chip it is currently mounting when the first nozzle group 11 is mounting the chip, thereby ensuring that the force is consistent when all chips are eutectic and improving the overall eutectic accuracy.

[0059] In other embodiments, the first binding head assembly 1 has a see-through function. The first binding head assembly 1 includes a drive motor, a fixed base, and a first suction nozzle assembly 11 arranged from top to bottom. The drive motor and the fixed base are provided with see-through holes. The first suction nozzle assembly 11 is positioned corresponding to the see-through holes, so that an external detection module can monitor the first suction nozzle assembly 11 in real time through the see-through holes to ensure the accuracy of the angle and spacing of the chip during transfer and pre-storage.

[0060] Furthermore, the transfer station assembly 3 is provided with a first upward viewing module 4 on the side near the eutectic stage assembly 2. The first upward viewing module 4 is used to identify the chip adsorbed on the first suction nozzle assembly 11. A second transfer station 32 is provided on one side of the first upward viewing module 4. The second transfer station 32 is provided with a plurality of second chip carrier positions 321. The arrangement of the plurality of second chip carrier positions on the second transfer station 32 is consistent with the arrangement of the plurality of first chip carrier positions 311 on the first transfer station 31.

[0061] In this embodiment, the first upward viewing module 4 is used to identify the chips on the first suction nozzle group 11 and can detect in real time whether the chips being picked up are missing or offset. At the same time, a second transfer station 32 with the same bearing position arrangement as the first transfer station 31 is also provided on one side of the first upward viewing module 4. The second transfer station 32 serves as a dedicated buffer transfer station and can temporarily accept chips, providing a compatible transition platform for subsequent replenishment or adjustment, and ensuring the continuity and stability of chip mounting operations.

[0062] Understandably, the arrangement of multiple chip carrier positions on the second relay station 32 is consistent with the arrangement of multiple first chip carrier positions 311 on the first relay station 31. If the number or orientation of chips on the first relay station 31 does not meet the mounting requirements, the chips currently on the first relay station 31 can be transferred to the second relay station 32 for adjustment through the first binding head assembly 1. The first relay station 31 can be reset and synchronously receive the chip storage, reducing the waiting time of the first relay station 31.

[0063] Furthermore, the first head-binding assembly 1 also includes a second nozzle group 12 and a first downward viewing module 13. The second nozzle group 12 and the first downward viewing module 13 are located on opposite sides of the first nozzle group 11. The second nozzle group 12 includes at least one second nozzle 121. The second transfer stage 32 is provided with a first material stage 5 near the eutectic stage assembly 2. The first material stage 5 is used to place chips. When the first upward viewing module 4 detects that the number of chips on the first nozzle group 11 is less than a preset number, the second nozzle 121 can transfer the chips from the first material stage 5 to the second transfer stage 32.

[0064] It should be noted that the first top-view module 4, the second transfer station 32, the first material station 5, and the eutectic stage assembly 2 are compactly arranged. During the placement process, the first bottom-view module 13 first takes a picture of the chip on the first transfer station 31 for identification. Then, the first nozzle group 11 picks up the chip and moves it to the first top-view module 4 for secondary identification. After both identifications are correct, the first nozzle group 11 moves to the eutectic stage assembly 2 to perform eutectic operation on the chip. If the number or orientation of the chips on the first nozzle group 11 is not as expected during the two identifications, the chip is placed on the second transfer station 32, and the chip is adjusted by the second nozzle 121 or a chip is picked up from the first material station 5 to supplement the chip on the second transfer station 32, so as to prevent product defects such as incorrect or insufficient chip placement during the placement process.

[0065] Please see Figures 6-8 The second embodiment of the present invention also provides a multi-chip eutectic device 100, which includes a chip loading device 20 and a multi-chip mounting device 10. The transfer station assembly 3 also includes a moving track 33, which extends from the chip loading device 20 to the multi-chip mounting device 10. The first transfer station 31 moves between the loading device and the multi-chip mounting device 10 via the moving track 33. The chip loading device 20 includes a chip supply assembly 201, a second downward viewing module 202 and a third downward viewing module 203. The second downward viewing module 202 is located above the chip supply assembly 201, and the third downward viewing module 203 is located above the first transfer station 31. The recognition accuracy of the third downward viewing module 203 is higher than that of the second downward viewing module 202.

[0066] As one feasible implementation, the multi-chip eutectic device 100 includes a carrier stage 40 and a substrate loading / unloading device 30. The carrier stage 40 is provided with a mounting area 401, a chip loading area 402 and a substrate loading / unloading area 403. The chip loading area 402 and the substrate loading / unloading area 403 are arranged adjacent to each other and are adjacent to the same side of the mounting area 401. The chip loading device 20 is located in the chip loading area 402, the multi-chip mounting device 10 is located in the mounting area 401, the substrate loading / unloading device 30 is located in the substrate loading / unloading area 403, and the moving track 33 extends from the chip loading area 402 to the mounting area 401.

[0067] Specifically, the eutectic stage assembly 2 includes a rotary table 21, a first eutectic stage 22, and a second eutectic stage 23. The substrate loading / unloading device 30 is located on the side of the eutectic stage assembly 2 away from the first binding head assembly 1. The first eutectic stage 22 and the second eutectic stage 23 are located on opposite sides of the rotary table 21. The first eutectic stage 22 and the second eutectic stage 23 move back and forth between the substrate loading / unloading area 403 and the mounting area 401 via the rotary table 21, so as to alternate between the substrate loading / unloading device 30 and the multi-chip mounting device 10. This allows chip mounting operations to be performed on one side of the workstation while the substrate loading / unloading operation is completed simultaneously on the other side of the workstation. The two core processes operate in parallel without interfering with each other, completely solving the pain points of serial processes and mutual waiting in traditional single-station equipment, greatly improving the overall operating efficiency of the equipment, and eliminating waiting time.

[0068] As another feasible implementation, the chip loading device 20 also includes a second binding head assembly 204. The second binding head assembly 204 can move between the chip supply assembly 201 and the first transfer station 31 to transfer the chip on the chip supply assembly 201 to the first transfer station 31. The first transfer station 31 can move back and forth between the chip loading area 402 and the mounting area 401 via the moving track 33 to transfer the chip on it to the multi-chip mounting device 10 for mounting. When the first transfer station 31 moves to the mounting area 401, the second binding head assembly 204 can move synchronously to the chip supply assembly 201 to pick up the chip, realizing parallel processing of multiple processes and improving the overall mounting efficiency.

[0069] Specifically, the first transfer station 31 can carry multiple chips at the same time, and the multiple nozzles on the first binding assembly 1 can simultaneously pick up multiple chips on the first transfer station 31 and move them to the first eutectic stage 22 or the second eutectic stage 23 for mounting, realizing multi-chip transfer and eutectic bonding, and improving overall production efficiency.

[0070] It should be noted that the first downward-looking module 13 and the third downward-looking module 203 are high-precision recognition systems, while the second downward-looking module 202 is a low-precision recognition system.

[0071] It should be understood that the second downward viewing module 202 is located above the chip supply component 201 and is used to identify the position of the chip on the chip supply component 201 so that the second binding head component 204 can accurately pick up the chip. Its purpose is only to serve chip transfer, so there is no need to use a mounting-level identification system. Using a low-precision identification system as the second downward viewing module 202 reduces costs while meeting the identification requirements for picking up materials and shortening the identification time.

[0072] Please refer to the following: Figure 9 The second headgear assembly 204 includes a movable assembly 2041 and a transparent suction nozzle assembly 2042 connected to each other. The transparent suction nozzle assembly 2042 includes a mounting base 20421 and a third suction nozzle 20422. The movable assembly 2041 and the third suction nozzle 20422 are respectively located on opposite sides of the mounting base 20421. The mounting base 20421 is provided with a through clearance channel 20423, and the third suction nozzle 20422 is located in the clearance channel 20423.

[0073] Specifically, the third suction nozzle 20422 can move along the X, Y and / or Z directions under the drive of the moving component 2041 to transfer the chip to a preset position, and can also rotate along the Z direction to adjust the angle of the chip.

[0074] Understandably, the mounting base 20421 has a rotating motor 20424 at the end away from the third suction nozzle 20422, which is used to drive the third suction nozzle 20422 to rotate, so as to adjust the angle of the chip on the third suction nozzle 20422. The clearance channel 20423 passes through the rotating motor 20424 and the mounting base 20421. The third downward viewing module 203 can observe the state of the third suction nozzle 20422 through the clearance channel 20423, so as to cooperate with the rotating motor 20424 to monitor and adjust it in real time.

[0075] The multi-chip eutectic device 100 provided in this embodiment of the invention has a second binding assembly 204 equipped with a transparent suction nozzle assembly 2042 with a clearance channel 20423, which innovatively realizes the transparent detection function in the suction nozzle material operation state. The third downward viewing module 203 can directly observe and detect the chip arrangement and empty space status of the first transfer platform 31 below without removing the suction nozzle assembly, eliminating the cumbersome process of frequent relocation detection in traditional equipment, simplifying the operation process, shortening the detection time, and avoiding secondary positioning deviation caused by relocation, which greatly improves the accuracy and efficiency of material loading detection.

[0076] Understandably, when the first transfer station 31 moves to the chip loading area 402, the first transfer station 31 corresponds to the third downward viewing module 203. When the second binding head assembly 204 picks up the chip and moves it to the first transfer station 31 for placement, the second binding head assembly 204 is located between the first transfer station 31 and the third downward viewing module 203. That is, the third suction nozzle 20422 moves to the bottom of the third downward viewing module 203. The third downward viewing module 203 can identify the third suction nozzle 20422 located below the mounting base 20421 through the avoidance channel 20423.

[0077] Meanwhile, the size of the clearance channel 20423 is larger than the size of the third suction nozzle 20422. Therefore, when the third downward viewing module 203 is detecting the third suction nozzle 20422, it can also observe the situation of the first transfer platform 31 below through the clearance channel 20423. This embodiment innovatively achieves a transparent detection function in the material-carrying state of the suction nozzle through the transparent suction nozzle component 2042 in the second binding assembly 204. This allows the third downward viewing module 203 to observe the first transfer station 31 through the transparent suction nozzle component 2042. Thus, when the second binding assembly 204 picks up the chip and moves it above the first transfer station 31, it can detect the precise position of the existing chip on the first transfer station 31 in real time, guide the precise placement of the current chip, effectively avoid the cumulative positional deviation during chip placement, and improve the arrangement accuracy of multiple chips on the transfer station.

[0078] It should be noted that the third downward-looking module 203 can detect that the field of view of the first transfer station 31 includes at least two first chip carrier positions 311 through the avoidance channel 20423. This enables the simultaneous detection of the status of multiple chip carrier positions in one imaging, improving the efficiency of visual inspection, reducing movement and positioning time, ensuring the regularity and consistency of the arrangement of multiple chips on the first transfer station 31, and laying a good foundation for subsequent batch synchronous mounting.

[0079] As a feasible implementation method, the third downward viewing module 203 can observe the two first chip carrier positions 311 on the first transfer platform 31 through the avoidance channel 20423. During the placement process, the third suction nozzle 20422 can simultaneously observe the two first chip carrier positions 311. The second binding head assembly 204 can adjust the position and posture of the chip suction on the third suction nozzle 20422 in real time according to the actual position of the chip on the first transfer platform 31, and place the chip on the first transfer platform 31. That is, the second binding head assembly 204 determines the current chip placement position based on the position of the chip on the first transfer platform 31 that it can identify, thereby ensuring that the chip on the first transfer platform 31 can be placed strictly according to the preset arrangement, which is convenient for subsequent placement operations.

[0080] Please refer to the following: Figure 11The mounting area 401 is provided with a first top view module 4, a second transfer station 32 and a first material station 5. The first top view module 4, the second transfer station 32 and the first material station 5 are located on the side of the moving track 33 near the eutectic stage assembly 2. The substrate loading and unloading device 30 in the substrate loading and unloading area 403 includes a mounting frame 303, a third binding assembly 301 and a second material station 302. The third binding assembly 301 is slidably connected to the mounting frame 303 and can move between the second material station 302 and the eutectic stage assembly 2 under the action of the mounting frame 303 to perform substrate loading and unloading operations.

[0081] It should be noted that the first material stage 5 stores chips, the second material stage 302 stores substrates, and the third binding assembly 301 transfers the substrates from the second material stage 302 to the eutectic stage assembly 2. Specifically, it transfers the substrates to the first eutectic stage 22 or the second eutectic stage 23 located in the substrate loading / unloading area 403. Then, the rotary table 21 drives the first eutectic stage 22 or the second eutectic stage 23 to move the substrates to the mounting area 401. The first binding assembly 1 places the chip groups that need adjustment or replenishment onto the second transfer stage 32 and picks up the chips from the second material stage 302 for replenishment. When the number and orientation of the chip groups on the second transfer stage 32 meet the expectations, the first binding assembly 1 simultaneously picks up multiple chips from the second transfer stage 32 and moves them to the first eutectic stage 22 or the second eutectic stage 23 where the substrates are placed for mounting.

[0082] By setting a first top-viewing module 4, a second transfer station 32, and a first material station 5 in the mounting area 401, and setting a third binding assembly 301 and a second material station 302 in the substrate loading and unloading area 403, a complete material replenishment and correction mechanism for the mounting area 401 and an automatic substrate transfer mechanism are constructed. This enables the equipment to complete chip missing replenishment, angle and posture adjustment, and automatic loading and unloading of substrates without stopping the machine, ensuring the continuity of production and mounting quality.

[0083] For specific details, please refer to... Figure 12 The second material stage 302 is provided with a substrate loading area 3021 and a substrate unloading area 3022; the third binding assembly 301 transfers the substrate from the substrate loading area 3021 to the first eutectic stage 22 or the second eutectic stage 23, or transfers the substrate that has completed eutectic on the first eutectic stage 22 or the second eutectic stage 23 to the substrate unloading area 3022.

[0084] This embodiment sets up an independent substrate loading and unloading device 30, equipped with a third binding head assembly 301 and a partitioned second material table 302. The third binding head assembly 301 can automatically pick up the substrate from the loading area and transfer it to the eutectic table, and transfer the substrate that has completed eutectic bonding to the unloading area, realizing fully automatic loading and unloading of substrates, further reducing manual intervention, and improving the overall automation level and operational standardization of the equipment.

[0085] Furthermore, a cooling zone 3023 is provided on the second material stage 302, and a cooling chamber 30231 is provided in the cooling zone 3023 to cool the substrate that has completed eutectic bonding placed thereon.

[0086] The multi-chip eutectic bonding equipment 100 provided in this embodiment of the invention can rapidly cool down the high-temperature substrate that has completed eutectic bonding by setting a cooling zone 3023 on the second material stage 302 and a cooling chamber 30231 in the cooling zone 3023, effectively shortening the waiting time for the substrate to cool and stand, accelerating product turnover, effectively preventing the substrate from deforming due to residual heat or the thermal impact in subsequent processes, and ensuring product quality.

[0087] Furthermore, please refer to the following: Figures 8-10 The chip loading area 402 is also equipped with a second lower view module 202, a third lower view module 203, and a second upper view module 208. The chip supply component 201 includes a chip carrier component 207 and a flip binding head 205. The first lower view module 13, the second lower view module 202, the first upper view module 4, and the flip binding head 205 are arranged in a collinear manner.

[0088] By setting the second lower view module 202, the third lower view module 203 and the flipping binding head 205 in the same line, the layout design of the chip feeding device 20 is optimized and the movement stroke of each mechanism is shortened. Secondly, the flipping binding head 205 can automatically complete the chip picking and flipping correction operation, solving the problem of abnormal chip orientation.

[0089] In some embodiments, a mounting bracket 206 is provided in the chip loading area 402. The second lower view module 202 and the third lower view module 203 are fixed on the mounting bracket 206. The second lower view module 202 is located above the chip carrier component 207, and the third lower view module 203 is located above the first transfer station 31. A lifting component 2061 is provided on the mounting bracket 206, and the second lower view module 202 is movably connected to the mounting bracket 206 through the lifting component 2061.

[0090] Understandably, the chip supply component 201 includes a chip carrier component 207, and the second downward viewing module 202 is located above the chip carrier component 207 to identify the position of the chip so that the flipping head 205 can accurately pick up the chip on the chip carrier component 207.

[0091] In some embodiments, after the flip-tipping head 205 picks up the chip, it flips it 180 degrees so that the bottom surface of the chip faces the second lower view module 202. At this time, the relative position between the chip and the second lower view module 202 changes, and the second lower view module 202 and the chip cannot be focused, which causes the second lower view module 202 to be unable to recognize the chip on the flip-tipping head 205. In this case, the second lower view module 202 can be driven to move upward by the lifting component 2061 to focus on the chip on the flip-tipping head 205 in order to recognize the bottom surface of the chip.

[0092] The second lower-view module 202 of this embodiment of the invention has an adaptive height adjustment structure design through the lifting component 2061, which enables the second lower-view module 202 to adjust its height according to the requirements of chips of different thicknesses or different working distances, thus ensuring the accuracy and flexibility of detection and focusing.

[0093] Please see Figure 13 The third embodiment of the present invention also provides a multi-chip eutectic method, applied to the above-mentioned multi-chip eutectic device 100, the method comprising: Step S1: In the chip loading area, multiple chips are transported to the first transfer table, and the first transfer table is moved to the mounting area via a moving track; Step S2: In the substrate loading and unloading area, the substrate is transported to the first eutectic stage or the second eutectic stage, and the first eutectic stage or the second eutectic stage on which the substrate is placed is moved to the mounting area by a rotary table. Step S3: Within the mounting area, the first binding head assembly picks up multiple chips from the first transfer table and moves them to the first eutectic stage or the second eutectic stage for chip mounting operation. Step S4: In the substrate loading and unloading area, the substrate that has completed eutectic bonding is removed from the second eutectic stage or the first eutectic stage.

[0094] It should be noted that steps S1 and S2 can be executed in parallel, as can steps S2 and S3, and steps S2 and S4.

[0095] This invention also provides a multi-chip eutectic method, which performs chip loading, substrate loading / unloading, and mounting operations in parallel across different regions. A rotary table 21 is used to switch between the first eutectic stage 22 or the second eutectic stage 23 and the mounting area 401 and the substrate loading / unloading area 403. The first binding assembly 1 picks up multiple chips from the first transfer table 31 for mounting, while another eutectic stage performs substrate loading / unloading. This achieves time overlap between chip mounting and substrate loading / unloading, greatly shortening the processing cycle of a single substrate and improving the overall efficiency of the equipment.

[0096] Please see Figure 14 Multiple chips are transported to the first transfer station, including: Step S11: The second binding assembly picks up the chip from the chip supply assembly and places the chip at the first preset position on the first transfer platform; Step S12: The second binding assembly continues to pick up chips from the chip supply assembly and moves to above the first transfer station. The third downward viewing module detects the position information of the chips on the first transfer station through the transparent suction nozzle assembly. Step S13: Based on the position information, place the chip on the current transparent nozzle assembly into the second preset position on the first transfer platform, and repeat this step until the number of chips on the first transfer platform reaches the preset value.

[0097] It should be noted that the first preset position is the position coordinate information set in advance by the operator, while the second preset position refers to the position coordinates that maintain a preset spatial relationship with the chip, based on the position information of the adjacent chip.

[0098] When the second binding assembly 204 places the first chip onto the first transfer station 31, it places the chip directly based on the coordinate information of the first preset position. The second, third, and even more chips are placed by determining the second preset position based on the position of the adjacent chips and the actual chip storage relationship. Even if there is an error when placing the first chip, the subsequent chips are placed based on the error position, without ignoring the error or causing error accumulation, so that the positional relationship of multiple chips meets the expectations.

[0099] For example, four chips need to be placed linearly on the first transfer station 31, with a one-unit interval between each chip. Assuming the first preset position is set to (1,1), the positions of the four chips should be (1,1), (2,1), (3,1), and (4,1). If there is an error when placing the first chip, such as the actual placement position being (1.5,1), then when placing the second chip, the second binding assembly 204 will determine the actual placement position of the current chip as (2.5,1) based on the error position at this time.

[0100] Understandably, the multi-chip eutectic method provided in this embodiment of the invention, during the process of transporting multiple chips to the first transfer station 31, sequentially picks up the chips through the second binding head assembly 204, and when placing subsequent chips, uses the third downward viewing module 203 to detect the position information of the existing chips on the first transfer station 31 through the transparent suction nozzle assembly 2042, and then accurately places the current chip to the second preset position based on the position information, thereby realizing closed-loop position correction, preventing cumulative errors, and ensuring that the arrangement accuracy of multiple chips on the first transfer station 31 perfectly matches the shape of the first suction nozzle assembly 11.

[0101] Further, please refer to Figure 15 The second binding assembly picks up a chip from the chip supply assembly, including: Step S111: Flip the binding head to pick up the chip from the chip carrier assembly; Step S112: Flip the binding head to flip the chip so that it faces upwards. The second downward viewing module rises to focus on the chip on the flipped binding head and acquires the image information of the chip for detection. Step S113: The flipped binding head moves towards the first transfer platform to the third preset position, and the second binding head assembly moves above the flipped binding head and picks up the chip.

[0102] It should be noted that the second downward viewing module 202 adjusts the focusing height by moving up and down, thereby enabling it to identify the chip on the chip carrier component 207 and the chip on the flipping head 205 respectively. When the chip is located on the chip carrier component 207, the second downward viewing module 202 can identify the top surface features of the chip. After the flipping head 205 picks up the chip from the chip carrier component 207, it flips it 180 degrees so that the bottom surface of the chip faces the second downward viewing module 202. When the second downward viewing module 202 moves to focus on the chip, it can identify the bottom surface features of the chip. That is, in this embodiment, the top and bottom surface features of the chip can be identified separately by a single second downward viewing module 202.

[0103] The multi-chip eutectic method provided in this embodiment of the invention picks up a chip from the chip carrier component 207 by flipping the binding head 205 and flipping it upwards. Then, the second downward viewing module 202 rises to the focusing position to obtain chip image information for detection. Next, the flipping binding head 205 is moved to a preset position, and finally, the second binding head component 204 moves to pick up the chip. This process realizes the automatic connection of chip flipping, detection and secondary picking, ensuring that the chips entering the transfer station are all face up and have undergone quality screening, thus improving the feeding yield.

[0104] Further, please refer to Figure 16 The first bonding assembly picks up multiple chips from the first transfer table and moves them to the first or second eutectic stage for chip mounting, including: Step S31: The first suction nozzle group picks up multiple chips from the first transfer station and moves them above the first upward-viewing module for testing; Step S32: If the number of chips on the first nozzle group is less than a preset threshold, the chips are transferred to the second transfer station. Step S33: The second nozzle group picks up chips from the first material stage and places them on the second transfer stage until the number of chips on the second transfer stage meets the preset threshold.

[0105] It should be noted that the second binding assembly 204 transfers the chip to a specific position on the first transfer station 31 only after a high-precision detection and identification process. In other words, the multiple chips on the first transfer station 31 should theoretically meet the mounting requirements and can be directly mounted on the eutectic.

[0106] After the first transfer station 31 is transferred from the chip loading area 402 to the mounting area 401, the first binding head assembly 1 can simultaneously pick up multiple chips from the first transfer station 31 onto the first nozzle group 11 and move them to the first top-view module 4 for detection, so as to avoid the first binding head assembly 1 missing chips. If the number of chips is found to be less than a preset threshold, the chips are transferred to the second transfer station 32, and the second nozzle group 12 picks up chips from the first material table 5 for replenishment until the number of chips on the second transfer station 32 meets the threshold. This mechanism realizes online quantity detection and rapid replenishment before mounting, avoiding mounting defects caused by missing chips picked up by the nozzle.

[0107] In some embodiments, the first upward viewing module 4 can not only identify whether the number of chips on the first nozzle group 11 meets a preset threshold, but also detect whether the chip angle or the features on the chip meet preset mounting conditions.

[0108] Further, please refer to Figure 17 The second suction nozzle assembly picks up chips from the first material stage and places them on the second transfer stage. This process continues until the number of chips on the second transfer stage meets a preset threshold. Step S331: The first downward-looking module detects whether the position and / or angle information of the chip on the second relay platform meets the preset state; Step S332: If the conditions are met, the chip on the second transfer station is picked up through the first nozzle group; otherwise, the chip is adjusted through the second nozzle group and then picked up through the first nozzle group.

[0109] The multi-chip eutectic method provided in this embodiment of the invention detects the position and / or angle information of the chips on the second transfer stage 32 through the first downward viewing module 13. If the preset state is met, the chips are directly picked up; otherwise, the corresponding chips are adjusted in attitude by the second suction nozzle group 12 before being picked up. This achieves fine correction of the position and angle of each chip before mounting, which significantly improves the overall alignment accuracy and eutectic quality of multi-chip mounting on the substrate.

[0110] Specifically, the preset states in step S331 include, but are not limited to, the positional relationships between the chip and adjacent chips set by the user in advance, such as the spacing distance, as well as the chip angle, number of chips, and chip shape.

[0111] It should be noted that before picking up the chip, the first binding head assembly 1 first uses the first downward viewing module 13 to identify the chip on the first transfer station 31. If the identification result is correct, the first binding head assembly 1 will pick up multiple chips on the first transfer station 31 at the same time and move them to the first upward viewing module 4 for secondary detection. If the secondary detection is successful, the chip can be directly transferred to the first eutectic stage 22 or the second eutectic stage 23 for eutectic processing.

[0112] If the first downward-looking module 13 and / or the first upward-looking module 4 detect that the number or angle of the chips on the first transfer station 31 or the first suction nozzle group 11 does not meet the expected conditions, the chips are transferred to the second transfer station 32 for temporary storage, and the second suction nozzle group 12 is used to replenish or adjust the orientation of the chips. Then, the first suction nozzle group 11 is used to pick up the chips from the second transfer station 32 and move them to the first upward-looking module 4 for final identification and detection.

[0113] Furthermore, when one of the first eutectic stage 22 or the second eutectic stage 23 is located in the mounting area 401, the other is located in the substrate loading / unloading area 403. The substrate loading / unloading operation and the chip mounting operation are performed simultaneously on the first eutectic stage 22 and the second eutectic stage 23, respectively.

[0114] The multi-chip eutectic method provided in this embodiment of the invention controls the first eutectic stage 22 or the second eutectic stage 23 so that when one is in the mounting area 401, the other is in the substrate loading / unloading area 403, and the substrate loading / unloading operation and chip mounting operation are performed simultaneously. This achieves complete parallelism and non-interference between the two workstations, maximizes the advantages of the dual eutectic stage structure, eliminates the idle waiting time caused by loading / unloading, and increases the equipment capacity to the theoretical maximum value.

[0115] The foregoing has provided a detailed description of a multi-chip eutectic device and method disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-chip eutectic device, characterized in that: The device includes a carrier platform, which is provided with a mounting area, a chip loading area and a substrate loading area. The chip loading area and the substrate loading area are arranged adjacent to each other and are adjacent to the same side of the mounting area. The multi-chip eutectic device also includes a eutectic stage assembly and a transfer stage assembly disposed on the carrier platform. The eutectic stage assembly includes a rotary table, a first eutectic stage and a second eutectic stage. The first eutectic stage and the second eutectic stage are located on opposite sides of the rotary table. The first eutectic stage and the second eutectic stage work alternately in the substrate loading / unloading area and the mounting area through the rotary table. The transfer station assembly includes a moving track and a first transfer station. The moving track extends from the chip loading area to the mounting area, and the first transfer station moves back and forth between the chip loading area and the mounting area via the moving track. The mounting area is provided with a first binding head assembly, and the chip loading area is provided with a second binding head assembly and a chip supply assembly. The second binding head assembly can move between the chip supply assembly and the transfer table assembly to move the chip on the chip supply assembly to the first transfer table. The first transfer table is provided with a plurality of first chip carrying positions. The first binding head assembly is movable between the transfer station assembly and the eutectic stage assembly. The first binding head assembly includes a first nozzle group, which includes multiple first nozzles. The multiple first nozzles on the first nozzle group can simultaneously pick up multiple chips on the first transfer station and move them to the first eutectic stage or the second eutectic stage for mounting.

2. The multi-chip eutectic device as described in claim 1, characterized in that: The mounting area is provided with a first top-view module, a second transfer station, and a first material station. The first top-view module, the second transfer station, and the first material station are located on the side of the moving track close to the eutectic stage assembly. The first head-binding assembly also includes a second suction nozzle group and a first downward viewing module, wherein the second suction nozzle group and the first downward viewing module are respectively located on opposite sides of the first suction nozzle group; The substrate loading and unloading area is provided with a third binding head assembly and a second material stage. The third binding head assembly can move between the second material stage and the eutectic stage assembly to perform substrate loading and unloading operations.

3. The multi-chip eutectic device as described in claim 2, characterized in that: The chip loading area is also provided with a second lower view module, a third lower view module, and a second upper view module. The chip supply component includes a chip carrier component and a flip binding head. The first lower view module, the second lower view module, the first upper view module, and the flip binding head are arranged in the same line. A mounting bracket is provided in the chip loading area. The second lower view module and the third lower view module are fixed on the mounting bracket. The second lower view module is located above the chip carrier component, and the third lower view module is located above the first transfer platform. A lifting component is provided on the mounting bracket, and the second lower view module is movably connected to the mounting bracket through the lifting component.

4. The multi-chip eutectic device as described in claim 3, characterized in that: The second headgear assembly also includes a transparent suction nozzle assembly. When the transparent suction nozzle assembly moves between the third downward viewing module and the first transfer platform, the third downward viewing module can observe the first transfer platform through the transparent suction nozzle assembly.

5. A multi-chip eutectic method, characterized in that: Applied to the multi-chip eutectic device as described in any one of claims 1-4, the method comprises: In the chip loading area, multiple chips are transported to the first transfer table, and the first transfer table is moved to the mounting area via a moving track; In the substrate loading and unloading area, the substrate is transported to the first eutectic stage or the second eutectic stage, and the first eutectic stage or the second eutectic stage on which the substrate is placed is moved to the mounting area by a rotary table. Within the mounting area, the first binding head assembly picks up multiple chips from the first transfer table and moves them to the first eutectic stage or the second eutectic stage for chip mounting operations. Within the substrate loading and unloading area, the substrate that has completed eutectic bonding is removed from the second eutectic stage or the first eutectic stage.

6. The multi-chip eutectic method as described in claim 5, characterized in that, Multiple chips were transported to the first transfer station, including: The second binding assembly picks up a chip from the chip supply assembly and places the chip at a first preset position on the first transfer platform; The second binding assembly continues to pick up chips from the chip supply assembly and moves them above the first transfer station. The third downward-viewing module detects the position information of the chip on the first transfer platform through the transparent suction nozzle assembly; Based on the location information, the chip on the current transparent suction nozzle assembly is placed into the second preset position on the first transfer platform, and this step is repeated until the number of chips on the first transfer platform reaches a preset value.

7. The multi-chip eutectic method as described in claim 6, characterized in that, The second binding assembly picks up the chip from the chip supply assembly, including: The flip-over tie-on picks up the chip from the chip carrier assembly; The flipping head is flipped so that the chip faces upwards, and the second downward viewing module rises to focus on the chip on the flipping head and acquires the image information of the chip for detection. The flip-top binder moves toward the first transfer platform to the third preset position, and the second binder assembly moves above the flip-top binder and picks up the chip.

8. The multi-chip eutectic method as described in claim 5, characterized in that, The first bonding assembly picks up multiple chips from the first transfer table and moves them to the first or second eutectic stage for chip mounting, including: The first suction nozzle group picks up multiple chips from the first transfer station and moves them above the first upward-viewing module for testing; If the number of chips on the first nozzle group is less than a preset threshold, the chips are transferred to the second transfer station. The second suction nozzle group picks up chips from the first material stage and places them on the second transfer stage until the number of chips on the second transfer stage meets a preset threshold.

9. The multi-chip eutectic method as described in claim 8, characterized in that, The second suction nozzle assembly picks up chips from the first material stage and places them on the second transfer stage. Once the number of chips on the second transfer stage meets a preset threshold, the process continues as follows: The first downward-looking module detects whether the position and / or angle information of the chip on the second relay platform meets the preset state; If the conditions are met, the chip on the second transfer station is picked up by the first suction nozzle group; otherwise, the chip is adjusted by the second suction nozzle group before being picked up by the first suction nozzle group.

10. The multi-chip eutectic method as described in claim 5, characterized in that: When one of the first eutectic stage or the second eutectic stage is located in the mounting area, the other is located in the substrate loading / unloading area. The substrate loading / unloading operation and the chip mounting operation are performed simultaneously on the first eutectic stage and the second eutectic stage, respectively.

Images