A feeding device and a semiconductor support hole hot solid encapsulation all-in-one machine

Abstract

The application provides a feeding device and a semiconductor support hole hot solid encapsulation integrated machine, and belongs to the technical field of semiconductor encapsulation. The feeding device comprises a feeding track, a pushing mechanism and a feeding mechanism. The feeding track is provided with a through groove along the conveying direction of the feeding track. The pushing mechanism is vertically movably arranged below the feeding track. The feeding mechanism is arranged above the feeding track. The feeding mechanism comprises a hot solid hopper and a feeding plate. The feeding plate is provided with a plurality of feeding channels along the conveying direction of the feeding track. The bottom of the feeding plate is provided with a plurality of quantitative feeding mechanisms corresponding to the feeding channels. The semiconductor support hole hot solid encapsulation integrated machine system comprises a feeding unit, a feeding unit, a hot solid unit and a receiving unit. The feeding unit comprises the feeding device. The scheme of the application can utilize the cooperation of the spherical hot solid material and the support hole to complete the feeding in the form of feeding one product at a time, improve the feeding efficiency, and make the product adapt to the high-voltage working scene by means of the characteristics of the hot solid material.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a feeding device and a semiconductor support hole thermosetting packaging integrated machine. Background Technology

[0002] One type of semiconductor device, model 220F, consists of 20 molded unit modules connected together by a support structure during the semi-finished product assembly stage. The molded unit is injection molded from a substrate with a chip attached. During injection molding, the substrate is placed into upper and lower mold cavities. To prevent deformation, a pair of support pins are formed at the bottom of the upper mold cavity, pressing against the top surface of the substrate. Therefore, after injection molding, support holes are formed on the surface of the molded unit, exposing the portion of the substrate corresponding to these holes. A screw hole is also formed on the molded unit, used to engage with a screw to secure the electronic device to a circuit board. However, when the electronic device is fixed to the circuit board, if a high voltage is applied, the exposed portion of the substrate within the support hole can react with the screw, causing electrical leakage and burning out the circuit.

[0003] Currently, the solution to prevent leakage current in the device is to seal the support holes with adhesive. During the adhesive spraying process, the nozzle of the adhesive syringe is aligned with the support hole, and pulsed air pressure is applied to the syringe to spray the required amount of adhesive into each support hole once. However, the above solutions have the following drawbacks: (1) Due to the high dilution of the glue, the nozzle diameter needs to be designed to be small in order to prevent the glue from dripping out, which will result in slower glue dispensing and affect processing efficiency; (2) The glue spraying machine uses visual recognition to align the nozzle with the support hole, but there will still be cases of inaccurate alignment, which will lead to glue spraying deviation and adverse effects on the product appearance; (3) The pulse is unstable, which will result in inconsistent glue dispensing volume each time, which may cause glue to overflow from the edge of the support hole and adverse effects on the product appearance; (4) Due to the dilution of the glue, there will be a depression in the middle of the glue sprayed into the support hole, which cannot completely fill the support hole; (5) After the glue is sprayed, it is necessary to bake at high temperature. Because the glue curing time is long, the high temperature baking often takes more than 1 hour, and the glue will continue to shrink before it is fully cured. The glue thickness covering the platform is already insufficient. When the user has high requirements for product voltage, the current will still break through the support hole; (6) There is only one set of glue syringes. Using the moving alignment method, a product may need to be sprayed 20 times to finish spraying, which is inefficient. Therefore, improvements are necessary. Summary of the Invention

[0004] To address the shortcomings of the prior art, this application provides a feeding device and a semiconductor support hole thermosetting packaging integrated machine. It can utilize the cooperation between spherical thermosetting material and support holes to complete the feeding of one product at a time, thereby improving feeding efficiency. Furthermore, by leveraging the characteristics of thermosetting material, the product can be adapted to working scenarios with high voltage requirements.

[0005] To achieve the above objectives, the present invention employs the following techniques: A feeding device includes a feeding track, a pushing mechanism, and a feeding mechanism. The track surface is the same as the product width, and the feeding track has a through groove along its own conveying direction. The pushing mechanism is vertically movable below the feeding track. When rising, the pushing mechanism passes through the through groove and pushes the product to the end of the feeding track. The feeding mechanism is located above the feeding track and includes a thermosetting hopper and a feeding plate. The thermosetting hopper is mounted on a bracket by a first spring. A vibrating motor is installed on the thermosetting hopper. The feeding plate has multiple feeding channels arrayed along the conveying direction of the feeding track. When the product is in a predetermined position, the support holes on it are located below the feeding channels one by one. The thermosetting hopper is connected to the feeding channels one by one through multiple steel wire guides. The bottom of the feeding plate has multiple quantitative feeding mechanisms corresponding to the feeding channels, which are used to output one thermosetting material from the corresponding feeding channel.

[0006] A semiconductor support hole thermosetting packaging machine, comprising: The feeding unit is used for feeding products. The feeding unit includes the feeding device, and the front end of the feeding track conveyor is used to connect with the output end of the feeding unit. The thermosetting unit includes a thermosetting track and a curing machine. The front end of the thermosetting track is used to connect with the end of the feeding track. The curing machine includes an insulation shell mounted on the thermosetting track and a hot air assembly inside the insulation shell. The air outlet of the hot air assembly is set towards the thermosetting track. The receiving unit includes a receiving track and a receiving mechanism. The front end of the receiving track is used to connect with the end of the thermosetting track, and the receiving mechanism is used to unload the product.

[0007] The beneficial effects of this invention are as follows: (1) The thermosetting material is designed with a spherical structure. On the one hand, it has a guiding shape, which can ensure stable cooperation with the support hole with a conical structure, reduce the possibility of material deviation, and avoid affecting the appearance of the product. On the other hand, it can more intuitively control the amount of material fed, that is, one thermosetting material is the amount of material fed at one time, so as to improve the processing quality. (2) By aligning multiple feeding channels with corresponding support holes, a single product can be fed at once, improving processing efficiency; (3) Compared with the spray adhesive method, the curing efficiency is higher due to the characteristic that thermosetting materials gradually harden after melting; (4) The thermosetting material properties will not shrink, the coating thickness is sufficient, and it can fully withstand high voltage application scenarios. Attached Figure Description

[0008] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of the invention.

[0009] Figure 1 This is a three-dimensional view of the overall structure of Embodiment 1 of this application.

[0010] Figure 2 This is a side view structural diagram of Embodiment 1 of this application.

[0011] Figure 3 This is a schematic diagram of the process when the claw pushes for the first time in Embodiment 1 of this application, where (a), (b) and (c) are arranged in chronological order.

[0012] Figure 4 This is a schematic diagram of the process when the claw pushes for the second time in Embodiment 1 of this application, where (a), (b) and (c) are arranged in chronological order.

[0013] Figure 5 This is a side view of the feeding mechanism in Embodiment 1 of this application.

[0014] Figure 6 This is a three-dimensional view of the overall structure of Embodiment 2 of this application.

[0015] Figure 7 This is a front view structural diagram of the feeding unit in Embodiment 2 of this application.

[0016] Figure 8 This is a schematic diagram of the overall structure of the thermosetting unit in Embodiment 2 of this application.

[0017] Figure 9 This is a schematic diagram of the overall structure of the receiving unit in Embodiment 2 of this application.

[0018] Figure 10 This is a schematic diagram of the cooperation structure between the material box and the lifting mechanism in Embodiment 2 of this application.

[0019] Figure 11 This is a schematic diagram of the structure of the 220F semiconductor device in the embodiments of this application.

[0020] Figure 12 This is a schematic diagram of the structure of the encapsulated body in the embodiments of this application.

[0021] Figure 13This is a schematic diagram of the structure of the encapsulated body during adhesive spraying in an embodiment of this application.

[0022] Reference numerals: 1-Feeding track, 11-Through groove, 2-Pushing mechanism, 21-Top plate, 211-Third guide rod, 22-Slide rail, 23-Slider, 24-Claw, 25-Pushing motor, 26-Base plate, 27-Lifting cylinder, 3-Feeding mechanism, 31-Thermosetting hopper, 32-Feeding plate, 321-Feeding channel, 33-First spring, 34-Bracket, 35-Vibrating motor, 36-Steel wire guide tube, 37-Quantitative feeding mechanism, 371-Front plug, 372-Rear plug, 373-Push plate, 374-First guide rod, 375-Second spring, 376-Feeding cylinder, 4-Thermosetting track, 41-Claw, 5-Curing machine, 51-Insulation shell, 52- Hot air assembly, 521-Hot air duct, 522-Break plate, 523-Blower motor, 524-Heating wire, 6-Collection track, 7-Collection mechanism, 71-Grabbing mechanism, 711-Suction nozzle, 712-Suction nozzle plate, 713-Support plate, 714-Second guide rod, 715-Air pump, 716-Suction cylinder, 717-Discharge cylinder, 72-Material box positioning seat, 721-Placement hole, 73-Material box, 731-Hanging platform, 732-Material support plate, 74-Lifting mechanism, 741-Lifting plate, 742-Geared lifting rod, 743-Gear, 744-Rotating motor, 8-Detection track, 81-Vision inspection machine, 82-Tilter, 83-Support bar, 9-Chassis. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments.

[0024] Example 1 This application provides a feeding device for simultaneously feeding spherical thermosetting material into multiple support holes of a product (i.e., a 220F semiconductor device in the semi-finished product assembly stage). Figures 1-5 As shown, it includes a feeding track 1, a pushing mechanism 2, and a feeding mechanism 3.

[0025] The track surface of the feeding track 1 is consistent with the width of the product, which can limit the product and simplify the product positioning work in subsequent processes. The feeding track 1 also has a through groove 11 along its own conveying direction.

[0026] The pushing mechanism 2 is vertically movable below the feeding track 1. The pushing mechanism 2 includes a top plate 21, on which a slide rail 22 is provided along the length of the feeding track 1. A slider 23 is slidably engaged with the slide rail 22. A claw 24 is provided on the slider 23, and the claw 24 matches the gap between two adjacent plastic seals. The slider 23 is driven to move by a pushing motor 25, which is mounted on the top plate 21. Specifically, a pair of third guide rods 211 are vertically connected to the bottom surface of the top plate 21. The third guide rods 211 are slidably mounted on a bottom plate 26. A lifting cylinder 27 is mounted on the bottom plate 26, which is used to drive the top plate 21 to move vertically.

[0027] The feeding mechanism 3 is located above the feeding track 1. The feeding mechanism 3 includes a thermosetting hopper 31 and a feeding plate 32. The thermosetting hopper 31 is mounted on a bracket 34 by a first spring 33 to form a floating fixation. A vibrating motor 35 is installed on the thermosetting hopper 31. The feeding plate 32 has multiple vertical feeding channels 321 arrayed along the conveying direction of the feeding track 1. The diameter of the feeding channel 321 matches the diameter of the thermosetting material. When the product moves to the predetermined feeding position of the feeding mechanism 3, the support holes on it are located below the feeding channel 321. In order to prevent the thermosetting hopper 31 and the feeding plate 32 from vibrating at the same time and causing the position accuracy of the feeding plate 32 to deviate, multiple steel wire guide tubes 36 are connected to the feeding channel 321 below the thermosetting hopper 31. Multiple quantitative feeding mechanisms 37 are provided at the bottom of the feeding plate 32, corresponding to the feeding channel 321.

[0028] Specifically, such as Figure 5 As shown, the quantitative feeding mechanism 37 includes a front plug needle 371 and a rear plug needle 372. Both the front plug needle 371 and the rear plug needle 372 are axially inserted through the feeding channel 321 perpendicular to it. The height difference between the front plug needle 371 and the rear plug needle 372 is greater than or equal to the diameter of the thermosetting material and less than 1.5 times the diameter of the thermosetting material. The front plug needle 371 is higher than the rear plug needle 372. Push plates 373 are connected to the outer sides of both the front plug needle 371 and the rear plug needle 372. The push plates 373 are slidably mounted on a first guide rod 374. The first guide rod 374 is installed on the outer side of the feeding plate 32. A second spring 375 is sleeved on both the front plug needle 371 and the rear plug needle 372. The second spring 375 is located between the feeding plate 32 and the corresponding push plate 373. Each push plate 373 is driven to move by a feeding cylinder 376. The feeding cylinders 376 are respectively mounted on the feeding plate 32 through fixed seats. More specifically, the insertion of the front plug needle 371 and the rear plug needle 372 is achieved by pushing the push plate 373 inward through the output end of the corresponding feeding cylinder 376. The exit of the front plug needle 371 and the rear plug needle 372 is achieved by moving the output end of the corresponding feeding cylinder 376 outward, and the push plate 373 moves outward under the action of the second spring 375.

[0029] More specifically, such as Figure 5As shown, multiple material shortage sensors are installed on the feeding plate 32 corresponding to multiple feeding channels 321. The material shortage sensor is located above the front plug pin 371. The material shortage sensor is used to detect whether there is thermosetting material at the sensing position. If not, the system will remind you that there is a material shortage.

[0030] The specific feeding process is as follows, such as Figure 5 As shown, under the combined action of the vibrating motor 35 and the first spring 33, the thermosetting material in the thermosetting hopper 31 enters the corresponding feeding channel 321 through multiple wire guides 36. At this time, the rear plug needle 372 is inserted into the feeding channel 321 to block the thermosetting material. After the product moves to the predetermined feeding position, the front plug needle 371 is inserted into the feeding channel 321 to separate the bottom thermosetting material from the thermosetting material above it. The rear plug needle 372 is then inserted out of the feeding channel 321 to release the bottom thermosetting material, which then falls into the product's support hole. Since the support hole is a conical structure with the small end facing down, and the thermosetting material is a spherical structure, the combination of the two has a certain guiding effect. Based on the alignment of the support hole with the corresponding feeding channel 321, the possibility of feeding deviation is reduced.

[0031] Specifically, such as Figure 3 As shown in (a), a sensor is installed on the feeding track 1 to transmit a signal after the sensor detects a product, thereby activating the lifting cylinder 27 to raise the top plate 21 to a predetermined highest position, as shown in (a). Figure 3 As shown in (b), the claw 24 is inserted into the gap between two adjacent encapsulated bodies above, and then the push motor 25 is activated to move the slider 23 towards the end of the feeding track 1, so that the product is moved to the predetermined feeding position by the claw 24. Figure 3 As shown in (c), the support holes on the product are located below the corresponding feeding channel 321. Then, the lifting cylinder 27 is activated to lower the top plate 21 to the predetermined lowest position, causing the claw 24 to disengage from the gap. This is the first push of the claw 24. After the product support holes are filled with thermosetting material, as shown in (c), the product supports the product support holes are filled with thermosetting material. Figure 4 As shown in (b), the push motor 25 is started to move the slider 23 towards the front end of the feeding track 1, the claw 24 retracts to the initial position, and the lifting cylinder 27 is started to raise the top plate 21 to the predetermined highest position, so that the claw 24 enters the gap between the two adjacent plastic seals above, as shown in (b). Figure 4 As shown in (c), the push motor 25 is then activated to move the slider 23 towards the end of the feeding track 1, so that the product leaves the feeding track 1 under the action of the claw 24, as shown in (c). Figure 4 As shown, this is the second push of the claw 24.

[0032] Example 2 This application provides a semiconductor support hole thermosetting packaging integrated machine, such as... Figure 6As shown, the system includes a chassis 9 and a feeding unit, a feeding unit, a thermosetting unit, and a receiving unit located above the chassis 9. The feeding unit is used to feed the product, the feeding unit includes the feeding device described in Embodiment 1, the thermosetting unit includes a thermosetting track 4 and a curing machine 5, and the receiving unit includes a receiving track 6 and a receiving mechanism 7.

[0033] like Figure 1 and Figure 7 As shown, the feeding unit includes a feeding device. The front end of the feeding track 1 is used to connect with the output end of the feeding unit. The front end of the feeding track 1 is connected to the front end of a detection track 8. A vision inspection machine 81 is installed on the detection track 8 to distinguish whether there is thermosetting material in the product support hole. If it is detected that there is no thermosetting material in the support hole, the system will issue an alarm.

[0034] like Figure 1 and Figure 7 As shown, the front end of the thermoset track 4 is used to connect with the end of the rocker 82. The thermoset track 4 is a steel belt conveyor belt with multiple teeth 41 along the conveying direction. The distance between two adjacent teeth 41 is equal to the distance between two adjacent plastic seals. In this embodiment, the steel belt conveyor belt is sleeved on multiple sets of support wheels. One set of support wheels is driven to rotate by a power motor. The two ends of the support wheels are respectively fixed to a pair of fixed upright plates. The rocker 82 is rotatably installed at the end of the detection track 8. The axis of rotation of the rocker 82 is perpendicular to the conveying direction of the detection track 8. The bottom of the rocker 82 is hinged to one end of a support bar 83. The other end of the support bar 83 is hinged to the end of the top plate 21 facing the detection track 8. The hinge axis of the support bar 83 is parallel to the axis of rotation of the rocker 82. When the top plate 21 rises to the predetermined highest position, the track surface of the thermoset track 4 is lower than the end of the rocker 82. When the top plate 21 falls to the predetermined lowest position, the track surface of the thermoset track 4 is flush with the top surface of the rocker 82.

[0035] The rocker arm 82 is designed to prevent damage to the product caused by a discrepancy between the conveying speed of the thermosetting track 4 and the pushing speed of the pusher motor 25. The teeth 41 on the thermosetting track 4 could damage the product. Therefore, after thermosetting material is added to all the product support holes, the pawl 24 pushes the product a second time to move it away from the feeding track 1. At this point, the top plate 21 rises to the predetermined highest position and, through the support bar 83, drives the rocker arm 82 to rotate, causing the end of the rocker arm 82 to tilt upwards. Figure 7 As shown, when the front end of the product reaches the thermoset track 4, it cannot temporarily contact the surface of the thermoset track 4. After the claw 24 completes the second push, the top plate 21 and the slider 23 need to return to the initial position, that is, the top plate 21 descends to the predetermined lowest position, the claw 24 disengages from the product and returns to the initial position, and the support bar 83 rotates to a horizontal state under the drive of the top plate 21. The front end of the product that has reached the thermoset track 4 is caught by the claw 41, which will drive the entire product to be transported onto the thermoset track 4.

[0036] like Figure 8 As shown, the curing machine 5 includes an insulation shell 51 mounted on the thermosetting track 4 and three hot air assemblies 52 disposed inside the insulation shell 51. Each hot air assembly 52 includes a hot air pipe 521, which includes an air outlet and a return air section. The bottom openings of both the air outlet and the return air section face the thermosetting track 4. The air outlet and the return air section are connected in the middle. A baffle 522 is provided at the connection between the air outlet and the return air section. A blower motor 523 is provided at the top of the air outlet, and its output shaft is connected to a blower fan blade. A heating wire 524 is provided at the bottom of the air outlet. The specific usage is as follows: the heating wire 524 is heated to a specified temperature, the blower motor 523 is turned on to blow air downwards, the air becomes hot air when it passes through the heating wire and is blown from the bottom of the air outlet onto the thermosetting track 4. Since there is a baffle 522 at the connection between the air outlet and the return air section, a negative pressure is formed on the leeward side of the baffle 522, which will cause the hot air blown from the bottom of the air outlet to act on the thermosetting track 4 and then be drawn back into the bottom of the return air section to form a complete hot air circulation process. This setting can save energy while improving thermosetting efficiency.

[0037] like Figure 8 As shown, the front end of the receiving track 6 is used to connect with the end of the thermosetting track 4. The end of the receiving track 6 is equipped with a baffle wall, and the end of the conveying track is slightly higher than the front end. A track vibrator is provided below the receiving track 6 to vibrate the product to the predetermined receiving position.

[0038] like Figure 9 and Figure 10 As shown, the receiving mechanism 7 includes a gripping mechanism 71 and a material box positioning seat 72 located outside the receiving track 6. The gripping mechanism 71 includes multiple suction nozzles 711 arranged in an array along the conveying direction of the receiving track 6. The suction nozzles 711 are fixed below a suction nozzle plate 712. A support plate 713 is provided above the suction nozzle plate 712. The support plate 713 slides through a second guide rod 714. The second guide rod 714 is vertically arranged on the suction nozzle plate 712. Multiple air pumps 715 and suction cylinders 7 are provided on the support plate 713. 16. Multiple air pumps 715 are connected to the suction nozzles 711 one by one via hoses. The output end of the suction cylinder 716 is connected to the top surface of the suction nozzle plate 712. The outer side of the support plate 713 is connected to the output end of a discharge cylinder 717. The discharge cylinder 717 is used to drive the support plate 713 to move perpendicular to the conveying direction of the receiving track 6. The material box positioning seat 72 is used to place the material box 73. When the support plate 713 moves to the predetermined position, the material box positioning seat 72 and the suction nozzle plate 712 are vertically aligned.

[0039] Specifically, such as Figure 10 and Figure 11As shown, the material box positioning seat 72 has a placement hole 721 that matches the material box 73. The material box 73 has a U-shaped structure with its opening facing the material gripping mechanism 71. The inner sides of the two vertical parts of the material box 73 are provided with a hanging platform 731. A material support plate 732 is vertically movable inside the material box 73. The material support plate 732 is matched with the inner wall of the material box 73 and is located above the hanging platform 731. A lifting mechanism 74 is provided below the material box positioning seat 72. The lifting mechanism 74 includes a lifting plate 74 that slides vertically through the material box 73. 1. The dimensions of the lifting plate 741 must be set to ensure that it can effectively support the material support plate 732 while avoiding interference with the hanging platform 731, so as to facilitate the installation and replacement of the material box 73. The bottom of the lifting plate 741 is connected to a toothed lifting rod 742. The toothed surface of the toothed lifting rod 742 meshes with a gear 743. The gear 743 is driven to rotate by a rotating motor 744. The gear 743 and the rotating motor 744 are located inside the machine housing 9. The toothed lifting rod 742 and the lifting plate 741 pass through the top surface of the machine housing 9.

[0040] The working process of the semiconductor support hole thermosetting packaging integrated system includes the following steps.

[0041] Feeding: Input the products sequentially into the feeding track 1 according to the preset posture.

[0042] Feeding: After the sensor detects the product, the pushing mechanism 2 pushes the product to the predetermined feeding position. The quantitative feeding mechanism 37 causes the corresponding feeding channel 321 to output a thermosetting material. The thermosetting material falls into the corresponding support hole. The pushing mechanism 2 pushes the product out. The product will first enter the detection track 8 and pass the visual inspection, and then enter the thermosetting track 4.

[0043] Thermosetting: As the product moves on the thermosetting track 4, the thermosetting material on it will gradually melt. Due to the characteristics of thermosetting material, it will also gradually harden after melting, ensuring that the thermosetting material has completely melted and hardened after the product has been heated for the set time, covering the support hole.

[0044] Material collection: After the product moves to the predetermined collection position, the discharge cylinder 717 drives the support plate 713 to move above the thermosetting track 4, and the suction cylinder 716 drives the suction nozzle plate 712 to move downward. After the suction nozzle 711 contacts the product, the vacuum is turned on, and the suction cylinder 716 drives the suction nozzle plate 712 to move upward to pick up the product. The discharge cylinder 717 drives the support plate 713 to move above the material box 73, closes the negative pressure of the suction nozzle 711, and the product will fall onto the receiving plate 732.

[0045] Among them, it is necessary to ensure that the product is not damaged when it falls onto the support plate 732. This problem can be solved by keeping the product's drop height consistent and at a preset safe height value. Specifically, this can be achieved by raising or lowering the support plate 732 via the lifting plate 741 during material collection.

[0046] More specifically, a light sensor is provided above the material box positioning seat 72, and the light sensor is at the same height as the top opening of the material box 73. A product sensor is provided below the lifting plate 741, and a product sensing hole is provided on the material support plate 732 corresponding to the product sensor.

[0047] In use, when the product sensor detects that there is no product on the support plate 732, the rotating motor 744 is started to raise the lifting plate 741, which lifts the support plate 732 until it reaches the top opening of the material box 73. When the light sensor detects that there is an object blocking it, the rotating motor 744 is started to lower the lifting plate 741, which lowers the support plate 732 a certain distance until the light sensors can sense each other.

[0048] In application, the above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. A feeding device, characterized in that, The system includes a feeding track (1), a pushing mechanism (2), and a feeding mechanism (3). The track surface of the feeding track (1) is consistent with the width of the product, and the feeding track (1) has a through groove (11) along its own conveying direction. The pushing mechanism (2) is vertically movable below the feeding track (1). The pushing mechanism (2) is used to pass through the through groove (11) and push the product to the end of the feeding track (1) when it rises. The feeding mechanism (3) is located above the feeding track (1). The feeding mechanism (3) includes a thermosetting hopper (31) and a feeding plate (32). The thermosetting hopper (31) is mounted on a bracket by a first spring (33). On the thermosetting hopper (31), a vibrating motor (35) is installed. The feeding plate (32) is arrayed with multiple feeding channels (321) along the feeding track (1) conveying direction. When the product moves to the predetermined position, the support holes on it are located below the feeding channels (321) one by one. The thermosetting hopper (31) is connected to the feeding channels (321) one by one through multiple steel wire guides (36). The bottom of the feeding plate (32) is provided with multiple quantitative feeding mechanisms (37) corresponding to the feeding channels (321) to make the corresponding feeding channels (321) output one thermosetting material particle at a time.

2. The feeding device according to claim 1, characterized in that, The pushing mechanism (2) includes a top plate (21), a slide rail (22) is provided on the top plate (21) along the length of the feeding track (1), a slider (23) is slidably fitted on the slide rail (22), a claw (24) is provided on the slider (23), the claw (24) matches the gap between the two adjacent plastic seals, and the slider (23) is driven to move by a pushing motor (25), which is mounted on the top plate (21).

3. The feeding device according to claim 1, characterized in that, The quantitative feeding mechanism (37) includes a front plug pin (371) and a rear plug pin (372). Both the front plug pin (371) and the rear plug pin (372) are perpendicular to the feeding channel (321) and axially pass through the feeding channel (321). The height difference between the front plug pin (371) and the rear plug pin (372) is greater than or equal to the diameter of the thermosetting material and less than 1.5 times the diameter of the thermosetting material. Push plates (373) are connected to the outer sides of both the front plug pin (371) and the rear plug pin (372). 3) Sliding through a first guide rod (374), the first guide rod (374) is installed on the outside of the feeding plate (32), and a second spring (375) is sleeved on the front plug needle (371) and the rear plug needle (372). The second spring (375) is located between the feeding plate (32) and the corresponding push plate (373). Each push plate (373) is driven to move by a feeding cylinder (376). The feeding cylinders (376) are respectively installed on the feeding plate (32) through fixed seats.

4. A semiconductor support hole thermosetting packaging integrated machine, characterized in that, include: The feeding unit is used for feeding products. The feeding unit includes the feeding device as described in any one of claims 1-3, wherein the front end of the feeding track (1) is used to connect with the output end of the feeding unit; The thermosetting unit includes a thermosetting track (4) and a curing machine (5). The front end of the thermosetting track (4) is used to connect with the end of the feeding track (1). The curing machine (5) includes an insulation shell (51) mounted on the thermosetting track (4) and a hot air assembly (52) located inside the insulation shell (51). The air outlet of the hot air assembly (52) is set towards the thermosetting track (4). The receiving unit includes a receiving track (6) and a receiving mechanism (7). The front end of the receiving track (6) is used to connect with the end of the thermosetting track (4), and the receiving mechanism (7) is used to unload the product.

5. A semiconductor support hole thermosetting packaging integrated machine according to claim 4, characterized in that, The hot air assembly (52) is provided in three parts. The hot air assembly (52) includes a hot air pipe (521). The hot air pipe (521) includes an air outlet and a return air section. The bottom openings of the air outlet and the return air section face the thermosetting track (4). The air outlet and the return air section are connected in the middle. A baffle (522) is provided at the connection between the air outlet and the return air section. A blower motor (523) is provided at the top of the air outlet. The output shaft of the blower motor (523) is connected to a blower fan blade. A heating wire (524) is provided at the bottom of the air outlet.

6. The semiconductor support hole thermosetting packaging integrated machine according to claim 4, characterized in that, The receiving mechanism (7) includes a gripping mechanism (71) and a material box positioning seat (72) located outside the receiving track (6). The gripping mechanism (71) includes multiple suction nozzles (711) arranged in an array along the conveying direction of the receiving track (6). The suction nozzles (711) are fixed below a suction nozzle plate (712). A support plate (713) is provided above the suction nozzle plate (712). The support plate (713) slides through a second guide rod (714). The second guide rod (714) is vertically arranged on the suction nozzle plate (712). Multiple air pumps (715) and suction cylinders (715) are provided on the support plate (713). 16) The suction ends of multiple air pumps (715) are connected to the suction nozzles (711) one by one through hoses. The output end of the suction cylinder (716) is connected to the top surface of the suction nozzle plate (712). The outer side of the support plate (713) is connected to the output end of a discharge cylinder (717). The discharge cylinder (717) is used to drive the support plate (713) to move perpendicular to the conveying direction of the receiving track (6). The material box positioning seat (72) is used to place the material box (73). When the support plate (713) moves to the predetermined position, the material box positioning seat (72) and the suction nozzle plate (712) are in an up-down corresponding relationship.

7. A semiconductor support hole thermosetting packaging integrated machine according to claim 6, characterized in that, The material box positioning seat (72) has a placement hole (721) that matches the material box (73) and is vertically connected. The material box (73) has a U-shaped structure with its opening facing the material gripping mechanism (71). The inner sides of the two vertical parts of the material box (73) are provided with a hanging platform (731). The material box (73) is vertically movable with a support plate (732). The support plate (732) is located above the hanging platform (731). The material box positioning seat (72) is provided with a lifting mechanism (74) below it. The lifting mechanism (74) includes a lifting plate (741) that slides vertically through the material box (73). The bottom of the lifting plate (741) is connected to a toothed lifting rod (742). The toothed surface of the toothed lifting rod (742) meshes with a gear (743). The gear (743) is driven to rotate by a rotating motor (744).

8. A semiconductor support hole thermosetting packaging integrated machine according to claim 4, characterized in that, A detection track (8) is also provided between the feeding track (1) and the thermosetting track (4). A vision inspection machine (81) is installed on the detection track (8) to distinguish whether there is thermosetting material in the product support hole.

9. A semiconductor support hole thermosetting packaging integrated machine according to claim 8, characterized in that, The thermosetting track (4) is a steel belt conveyor belt with multiple teeth (41) along the conveying direction. The spacing between two adjacent teeth (41) matches the spacing between two adjacent plastic seals. A rocker (82) is rotatably installed at the conveying end of the detection track (8). The rocker (82) has a rotating shaft perpendicular to the conveying direction of the detection track (8). The bottom of the rocker (82) is hinged to one end of a support bar (83), and the other end of the support bar (83) is hinged to the top plate (21) facing the detection track (8).

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