Wafer carrier apparatus and semiconductor process equipment

Abstract

The embodiment of the present application provides a wafer bearing device and a semiconductor process equipment, wherein the wafer bearing device comprises a first connecting piece and at least three bearing pieces; the at least three bearing pieces are distributed along a circumference and are connected with the first connecting piece; the bearing piece comprises a first protruding part, the first protruding part protrudes towards a surrounding center of the bearing piece, a wafer passing area is formed between an upper side of the first protruding part and a lower side of the first connecting piece, and the first protruding part is used for bearing a wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a wafer carrier device and semiconductor process equipment. Background Technology

[0002] The semiconductor process chamber includes a base and a lifting mechanism. The lifting mechanism includes multiple ejector pins that pass through the base. When it is necessary to transfer a wafer to the base, the ejector pins are first in an elevated position, with their upper ends protruding from the upper surface of the base. Then, a wafer transfer device can be used to support the wafer, thereby transferring the wafer onto the ejector pins. Subsequently, the ejector pins can be retracted, with the upper ends of the ejector pins lower than the upper surface of the base, thus allowing the wafer to be supported on the base.

[0003] Because the surface of the wafer is very smooth, if the height of the top of each ejector pin is not consistent, the wafer supported by the ejector pin will tilt, which may cause the wafer to slip off the ejector pin and cause the wafer transfer to fail. Summary of the Invention

[0004] This application provides a wafer carrier and semiconductor process equipment to address the problem that wafers may slip off the ejector pins when the upper ends of the ejector pins are not at the same height.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application provide a wafer carrier device.

[0006] The wafer carrier device provided in this application includes: a first connector and at least three carriers; the at least three carriers are distributed along the circumference and are all connected to the first connector; the carrier includes a first protrusion, the first protrusion protrudes toward the center of the carrier, a wafer passage area is formed between the upper side of the first protrusion and the lower side of the first connector, and the first protrusion is used to carry the wafer.

[0007] Optionally, the first protrusion includes a carrier sub-part located at the end of the protrusion facing the surrounding center of the carrier member, the carrier sub-part being used to carry the wafer.

[0008] Optionally, the first protrusion further includes a guide portion, which is used to guide the wafer carried on the guide portion to slide to the carrier portion.

[0009] Optionally, the height of the top surface of the guide portion gradually decreases in the direction from the first protrusion toward the surrounding center of the carrier.

[0010] Optionally, the carrier sub-part has a limiting surface on the side opposite to the surrounding center of the carrier member, the limiting surface being used to confine the wafer within the area enclosed by the limiting surface.

[0011] Optionally, the first connector includes an annular portion and a plurality of second protrusions connected to each other. The second protrusions extend from the outer periphery of the annular portion in a direction opposite to the center of the annular portion, and the carrier is connected to the second protrusions in a corresponding manner.

[0012] Optionally, the wafer carrier is applied to semiconductor process equipment, and the bottom of the carrier is provided with a recess for adapting to the pins of the lifting device of the semiconductor process equipment.

[0013] Secondly, embodiments of this application provide a semiconductor process apparatus.

[0014] The semiconductor process equipment provided in this application includes: a lifting device, a base, and any one of the wafer carrier devices provided in this application; the lifting device includes a plurality of ejector pins, the base is provided with a plurality of first through holes, the number of carriers, ejector pins, and first through holes are all equal, and the ejector pins are correspondingly inserted into the first through holes; the base is used to support the carriers, and the carriers are correspondingly opposite to the first through holes, so that the wafer carrier device can be lifted by the ejector pins and rise relative to the base.

[0015] Optionally, the semiconductor process equipment further includes a chamber body and a heat insulation ring; the lifting device further includes a connecting bracket connected to the chamber body, and the heat insulation ring is disposed between the chamber body and the connecting bracket.

[0016] Optionally, the heat insulation ring has a clearance groove on the side facing the chamber body.

[0017] The above-described technical solutions adopted in the embodiments of this application can achieve the following beneficial effects: In the embodiments of this application, a wafer carrier can be supported by a pin, thereby allowing the wafer to be carried on the wafer carrier. Since the surface of the wafer carrier that contacts the pin does not need to be as smooth as the surface of the wafer, increasing the roughness of the surface of the wafer carrier in contact with the pin makes it easier to prevent the wafer carrier from sliding relative to the pin. Furthermore, the wafer can be confined within the area enclosed by the carrier, thus making it less likely for the wafer to fall from the wafer carrier. Therefore, by using the solution provided in the embodiments of this application, the wafer is less likely to slip off the pin by adding a wafer carrier.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a ejector pin, a wafer carrier device, and a wafer provided for embodiments of this application; Figure 2 for Figure 1 The image shows a rotated cross-sectional view of the ejector pin, wafer carrier, and wafer along the plane passing through the AA-shaped line. Figure 3 A schematic diagram of a carrier provided in an embodiment of this application; Figure 4 A partial schematic diagram of a push pin, a wafer carrier, a wafer, and a wafer transfer robot provided for embodiments of this application shows the wafer located in the wafer passage area; Figure 5 A partial schematic diagram of a push pin, a wafer carrier, a wafer and a transfer robot provided for embodiments of this application shows the wafer positioned above the carrier. Figure 6 A partial schematic diagram of a semiconductor process chamber provided in an embodiment of this application; Figure 7 A schematic diagram of a lifting device provided in an embodiment of this application; Figure 8 A partial cross-sectional view of a push pin, a wafer carrier device, and a wafer provided for embodiments of this application shows the wafer edge being supported by a guide portion; Figure 9 A partial cross-sectional view of a ejector pin, a wafer carrier, and a wafer provided in this application embodiment is shown. Figure 8 Based on this, the scenario where the wafer descends a preset distance; Figure 10 A partial cross-sectional view of a ejector pin, a wafer carrier, and a wafer provided in this application embodiment is shown. Figure 9 Based on this, the wafer is lowered to the point where it is supported on the carrier sub-part; Figure 11 A schematic diagram of another carrier provided in an embodiment of this application; Figure 12 A partial cross-sectional view of a push pin, a wafer carrier, and a wafer provided for an embodiment of this application shows the wafer carrier in an inclined state, with the edge of the wafer supported by a guide portion. Figure 13 A partial cross-sectional view of a ejector pin, a wafer carrier, and a wafer provided in this application embodiment is shown. Figure 12 Based on this, the scenario where the wafer descends a preset distance; Figure 14 A partial cross-sectional view of a ejector pin, a wafer carrier, and a wafer provided in this application embodiment is shown. Figure 13 Based on this, the wafer is lowered to the point where it is supported on the carrier sub-part; Figure 15 A schematic diagram of a heat insulation ring provided in an embodiment of this application; Figure 16 This is a schematic diagram of a rotating disk, a wafer carrier, and a base provided in an embodiment of this application.

[0021] Explanation of reference numerals in the attached figures: 1- Semiconductor process equipment; 100 - Wafer carrier; 110 - First connector; 111 - Annular portion; 112 - Second protrusion; 120 - Carrier; 121 - First protrusion; 1211 - Carrier sub-part; 1212 - Guide sub-part; 1213 - Limiting surface; 122 - Recess; 123 - Connector; 130 - Wafer passage area; 200-Lifting device; 210-Ejector pin; 220-Connecting bracket; 230-Driver; 240-Second connector; 251-Telescopic shaft; 252-Telescopic sealing assembly; 2521-Telescopic sealing sleeve; 2522-Connecting ring; 260-Transmission mechanism; 271-Limiting element; 272-Sensor; 273-Trigger element; 300 - Base; 310 - First perforation; 400 - Chamber body; 410 - Second perforation; 500 - Heat insulation ring; 510 - Clearance groove; 600-Spinning Disk; 2-Wafer; Detailed Implementation To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] Furthermore, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application specification may have been selected by the applicant at his or her own discretion, and their detailed meanings are explained in the relevant sections of this description.

[0024] Furthermore, this application is required to be understood not only through the actual terms used, but also through the meaning implied by each term.

[0025] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0026] This application provides a wafer carrier device. (See reference...) Figures 1 to 15 The wafer carrier device 100 provided in this application embodiment includes: a first connector 110 and at least three carriers 120.

[0027] refer to Figures 1 to 3 At least three carrier members 120 are distributed circumferentially and are all connected to the first connecting member 110. Exemplarily, the number of carrier members 120 can be three, four, five, etc., and the specific number of carrier members 120 will not be listed here. Exemplarily, all carrier members 120 can be evenly distributed along the circumferential direction. The first connecting member 110 is connected to each carrier member 120 to maintain the circumferential distribution of each carrier member 120. In other words, the first connecting member 110 serves as the connecting carrier of the carrier members 120, enabling each carrier member 120 to maintain the circumferential distribution.

[0028] Furthermore, the carrier 120 includes a first protrusion 121. The first protrusion 121 protrudes toward the periphery of the carrier 120, and a wafer passage region 130 is formed between the upper side of the first protrusion 121 and the lower side of the first connector 110. The first protrusion 121 is used to carry the wafer 2. For example, the first protrusion 121 is used to carry the wafer 2 that has moved through the wafer passage region 130 and is above the first protrusion 121.

[0029] It should be noted that this is for reference only. Figures 1 to 5In some embodiments, when it is necessary to support the wafer 2 on the first protrusion 121, a robotic arm can be used to support the wafer 2, allowing it to pass through the wafer passage area 130 and move above the first protrusion 121. Furthermore, the robotic arm can be used to lower the wafer 2 until it is supported on the first protrusion 121. The robotic arm can then be removed.

[0030] Since placing the wafer 2 on the first protrusion 121 and removing the wafer 2 from the first protrusion 121 of the wafer carrier 100 are the reverse processes, the process of removing the wafer 2 from the first protrusion 121 of the wafer carrier 100 will not be described in detail here.

[0031] In this manner, in the embodiments of this application, a wafer carrier 100 can be supported by a ejector pin, and the wafer can then be carried on the wafer carrier 100. Since the surface of the wafer carrier 100 that contacts the ejector pin does not need to be as smooth as the surface of the wafer, by increasing the roughness of the surface of the wafer carrier 100 that contacts the ejector pin, it is easier to prevent the wafer carrier 100 from sliding relative to the ejector pin. Furthermore, the wafer can be confined within the area enclosed by the carrier 120, thus making it less likely for the wafer to fall from the wafer carrier 100. Therefore, by employing the solution provided in the embodiments of this application, the wafer is less likely to slip off the ejector pin by adding a wafer carrier 100.

[0032] refer to Figures 1 to 3 In some embodiments, the first protrusion 121 includes a support sub-part 1211 located at the end of the protrusion 121 facing the center of the carrier 120, and the support sub-part 1211 is used to support the wafer 2. In this way, the support sub-part 1211 of the first protrusion 121 can be used to support the wafer 2, and the processing cost of the carrier 120 can be reduced by primarily machining the support sub-part 1211 to make its surface roughness and dimensions more suitable for supporting the wafer.

[0033] refer to Figure 3 , Figures 8 to 14 In some embodiments, the first protrusion 121 further includes a guide portion 1212. The guide portion 1212 is used to guide the wafer 2, which is carried on the guide portion 1212, to slide to the carrier portion 1211. Thus, during the placement of the wafer 2, if there is a certain positional error between the wafer 2 and the carrier portion 1211, the wafer 2 will first contact the guide portion 1212, and then move to the carrier portion 1211 under the guidance of the guide portion 1212. This improves the positional accuracy of the wafer 2.

[0034] For example, with Figure 8For example, during the placement of wafer 2, if wafer 2 is positioned slightly to the right, wafer 2 will come into contact with the guide portion 1212 of the right-hand support 120. Thus, combined with... Figure 9 During the descent of wafer 2, the guide section 1212 will cause wafer 2 to move to the left. Combined with... Figure 10 Ultimately, under the guidance of the guide sub-section 1212, wafer 2 will move onto the carrier sub-section 1211.

[0035] It should be noted that if the guide sub-section 1212 is not provided, during the placement of wafer 2, if the position of wafer 2 is slightly to the right, the position of wafer 2 will be slightly to the left relative to the preset wafer setting area on the wafer carrier device 100, resulting in a positional deviation of wafer 2.

[0036] refer to Figure 3 and Figure 11 In some embodiments, the height of the top surface of the guide portion 1212 gradually decreases in the direction from the first protrusion 121 toward the center of the carrier 120. In this way, during the placement of the wafer 2, the wafer 2 can slide smoothly toward the carrier portion 1211 under the guidance of the top surface of the guide portion 1212.

[0037] For example, refer to Figure 3 In some embodiments, the top surface of the guide portion 1212 may be a slope. Exemplarily, the angle between the top surface of the guide portion 1212 and the horizontal plane is 45 degrees to 60 degrees. (See reference...) Figure 11 In some embodiments, the top surface of the guide sub-part 1212 can be an arc-shaped surface.

[0038] refer to Figure 3 and Figure 10 In some embodiments, a limiting surface 1213 is provided on the side of the carrier sub-part 1211 away from the surrounding center of the carrier member 120. The limiting surface 1213 is used to restrict the wafer 2 within the area enclosed by the limiting surface 1213.

[0039] For example, the area enclosed by each limiting surface 1213 is a circular setting area, in which the wafer 2 can be accommodated. For instance, the diameter of the circular setting area is 0.2 to 1 mm larger than the diameter of the wafer 2. It is understood that if the diameter of the circular setting area is too large relative to the diameter of the wafer 2, the deviation of the center of the wafer 2 from the center of the circular setting area will be too large. If the diameter of the circular setting area is too small relative to the diameter of the wafer 2, the wafer 2 may not be able to slide smoothly into the circular setting area.

[0040] Therefore, it is recommended that the diameter of the circular setting area be 0.2 to 1 mm larger than the diameter of wafer 2. Of course, in implementing the solution provided in the embodiments of this application, the difference between the diameter of the circular setting area and the diameter of wafer 2 can be flexibly adjusted according to actual needs.

[0041] refer to Figure 3 In some embodiments, in the protrusion direction of the first protrusion 121, the limiting surface 1213 is located between the supporting sub-part 1211 and the guiding sub-part 1212. In this way, the wafer 2, guided by the guiding sub-part 1212, falls into place and is just supported by the supporting sub-part 1211, and is located in the area enclosed by the limiting surface 1213.

[0042] refer to Figures 12 to 14 Even when the heights of the upper ends of the pins 210 are inconsistent, causing the wafer carrier device 100 to tilt, the wafer 2 can still slide accurately to the carrier sub-part 1211 under the guidance of the guide sub-part 1212, thereby achieving the positioning and carrying of the wafer 2.

[0043] refer to Figure 1 In some embodiments, the first connector 110 includes an annular portion 111 and a plurality of second protrusions 112 connected to each other. The second protrusions 112 extend from the outer periphery of the annular portion 111 in a direction opposite to the center of the annular portion 111. The carrier 120 is connected to the second protrusion 112 in a corresponding manner.

[0044] Further, refer to Figure 3 The carrier 120 also includes a connecting portion 123. Combined with... Figure 1 and Figure 2 The connecting portion 123 is connected to the second protrusion 112 in a one-to-one correspondence. For example, in the height direction of the wafer carrier 100, the top surface of the connecting portion 123 protrudes relative to the first protrusion 121, so that when the top surface of the connecting portion 123 is connected to the first connector 110, a wafer passage area 130 is formed between the first protrusion 121 and the first connector 110.

[0045] refer to Figure 6 In some embodiments, the wafer carrier 100 is applied to the semiconductor process equipment 1. Combined with Figure 2 The bottom of the carrier 120 is provided with a recess 122, which is used to adapt to the ejector pin 210 of the lifting device 200 of the semiconductor process equipment 1. In this way, the wafer carrier 100 can be better prevented from sliding relative to the ejector pin 210 by inserting the ejector pin 210 into the recess 122.

[0046] This application also provides a semiconductor process apparatus. Exemplarily, the semiconductor process apparatus is an atomic layer deposition (ALD) apparatus. (See reference...) Figure 6 The semiconductor process equipment 1 provided in this application embodiment includes: a lifting device 200, a base 300, and any one of the wafer carrier devices 100 provided in this application embodiment.

[0047] The lifting device 200 includes a plurality of ejector pins 210. The base 300 has a plurality of first through holes 310. The number of carrier members 120, ejector pins 210, and first through holes 310 are all equal, and the ejector pins 210 are correspondingly inserted into the first through holes 310. The base 300 is used to support the carrier members 120. The carrier members 120 are correspondingly opposite to the first through holes 310, so that the wafer carrier device 100 can be lifted by the ejector pins 210 and raised relative to the base 300.

[0048] For example, if a process is required, the carrier 120 can be supported on the base 300. For example, the base 300 is a heating base. The heating base can heat the wafer 2 on the wafer carrier 100.

[0049] When it is necessary to transfer wafer 2 to wafer carrier 100, the ejector pin 210 can be driven to rise, thereby lifting wafer carrier 100 and allowing a robotic arm to support wafer 2. The robotic arm then moves wafer 2 through wafer passage area 130 to above the first protrusion 121. Further, the robotic arm can be used to lower wafer 2 until it rests on the first protrusion 121, at which point the robotic arm can be removed.

[0050] Since placing the wafer 2 on the first protrusion 121 and removing the wafer 2 from the first protrusion 121 of the wafer carrier 100 are the reverse processes, the process of removing the wafer 2 from the first protrusion 121 of the wafer carrier 100 will not be described in detail here.

[0051] refer to Figure 6 , Figure 7 and Figure 15 In some embodiments, the semiconductor process equipment 1 further includes a chamber body 400 and a heat insulation ring 500. The lifting device 200 also includes a connecting bracket 220 connected to the chamber body 400, and the heat insulation ring 500 is disposed between the chamber body 400 and the connecting bracket 220. In this way, the heat insulation ring 500 can be used to reduce the heat transferred from inside the chamber body 400 to the lifting device 200 through the connecting bracket 220, thereby reducing the possibility of high-temperature damage to external components such as the driver of the lifting device 200.

[0052] In some embodiments, the heat insulation ring 500 has a relief groove 510 on the side facing the chamber body 400. In this way, the relief groove 510 can contain air, and the air in the relief groove 510 can be used as a thermal resistance layer to reduce the heat transferred from the chamber body 400 to the lifting device 200 via the connecting bracket 220.

[0053] Furthermore, the lifting device 200 also includes a driver 230, a second connector 240, a telescopic shaft 251, a telescopic sealing assembly 252, and a transmission mechanism 260. The driver 230 is disposed on the connecting bracket 220, the telescopic shaft 251 passes through the second through hole 410, the driver 230 is driven to the telescopic shaft 251 via the transmission mechanism 260, the telescopic shaft 251 is connected to the second connector 240, and each pin 210 is connected to the second connector 240.

[0054] Furthermore, the telescopic sealing assembly 252 includes a telescopic sealing sleeve 2521 and a connecting ring 2522 connected together. The connecting ring 2522 is sealed to the outer periphery of the second through hole 410. The telescopic sealing sleeve 2521 is disposed outside the telescopic shaft 251, and the side of the telescopic sealing sleeve 2521 facing away from the connecting ring 2522 is sealed to the telescopic shaft 251. A heat insulation ring 500 is sandwiched between the connecting ring 2522 and the connecting bracket 220. A relief groove 510 is provided on the side of the heat insulation ring 500 facing the connecting ring 2522, and a heat insulation cavity is formed between the relief groove 510 and the connecting ring 2522.

[0055] In this way, the air in the insulation cavity reduces the heat transferred from the cavity body 400 to the outside. This reduces the possibility of high-temperature damage to external components such as the transmission mechanism 260 and the driver 230.

[0056] In some other embodiments, the lifting device 200 further includes a driver 230 and a second connector 240. The driver 230 is driven to the second connector 240, and the ejector pins 210 are respectively connected to the second connector 240. In this way, the driver 230 can drive the second connector 240 to rise and fall, thereby causing each ejector pin 210 to rise and fall synchronously with the second connector 240.

[0057] Furthermore, the chamber body 400 is provided with a second through hole 410. The lifting device 200 also includes a telescopic shaft 251 and a telescopic sealing assembly 252, and the driver 230 is driven to connect to the second connector 240 via the telescopic shaft 251. The telescopic shaft 251 passes through the second through hole 410.

[0058] The telescopic sealing assembly 252 includes a telescopic sealing sleeve 2521 and a connecting ring 2522 connected to each other. The connecting ring 2522 is sealingly connected to the outer periphery of the second through hole 410. The telescopic sealing sleeve 2521 is disposed outside the telescopic shaft 251, and the side of the telescopic sealing sleeve 2521 facing away from the connecting ring 2522 is sealingly connected to the telescopic shaft 251. Exemplarily, the telescopic sealing sleeve 2521 is a bellows, and the connecting ring 2522 is a flange.

[0059] In this way, the second connecting member 240 can be raised and lowered via the telescopic shaft 251 using the driver 230 located outside the chamber body 400, thereby causing each ejector pin 210 to rise and fall synchronously. In addition, the telescopic sealing assembly 252 can seal the second perforation 410 to prevent process gas inside the chamber body 400 from leaking through the second perforation 410.

[0060] Furthermore, an annular groove is provided on the outer periphery of the second perforation 410, and a sealing ring is provided in the annular groove. The connecting ring 2522 is provided on the outer periphery of the second perforation 410 and covers the opening of the annular groove. In this way, the sealing effect of the second perforation 410 can be improved by the sealing ring sandwiched between the connecting ring 2522 and the chamber body 400.

[0061] Furthermore, the lifting device 200 also includes a transmission mechanism 260. The transmission mechanism 260 includes a lead screw and a nut, with a driver 230 connected to the lead screw and the nut connected to the telescopic shaft 251. Thus, the driver 230 can drive the lead screw to rotate, causing the nut to move up and down, which in turn drives the telescopic shaft 251 to move up and down. Furthermore, the telescopic shaft 251 is connected to the second connecting member 240, and each ejector pin 210 is connected to the second connecting member 240. Thus, the telescopic shaft 251 can drive the second connecting member 240 and the ejector pins 210 to move up and down synchronously.

[0062] Combination Figure 15 Furthermore, the heat insulation ring 500 has a relief groove 510 on the side facing the connecting ring 2522. Thus, when the heat insulation ring 500 is in contact with the connecting ring 2522, a cavity is formed between the relief groove 510 and the connecting ring 2522. The air in this cavity reduces the heat transferred from the chamber body 400 to the outside. This reduces the possibility of high-temperature damage to external components such as the transmission mechanism 260 and the driver 230.

[0063] refer to Figure 6 and Figure 7 In some embodiments, the lifting device 200 further includes a limiting member 271, a sensor 272, and a trigger member 273. The limiting member 271 is connected to the telescopic shaft 251. When the telescopic shaft 251 moves to its upper limit position, the limiting member 271 abuts against the connecting bracket 220, preventing the telescopic shaft 251 from rising further. The sensor 272 is connected to the connecting bracket 220. For example, the sensor 272 is specifically connected to the connecting bracket 220 via a mounting bracket. The trigger member 273 is connected to the telescopic shaft 251. When the telescopic shaft 251 moves to its lower limit position, the trigger member 273 moves to a position capable of triggering the sensor 272. When the sensor 272 is triggered by the trigger member 273, the actuator 230 can be stopped.

[0064] For example, sensor 272 can be a photoelectric sensor, which includes a light-emitting element and a light-receiving element. Trigger 273 is a light-shielding baffle. When the light-shielding baffle blocks the light-emitting element and the light-receiving element, the light emitted by the light-emitting element cannot be received by the light-receiving element. When the light-shielding baffle is out of the blocking position, the light emitted by the light-emitting element can be received by the light-receiving element. For example, when the telescopic shaft 251 moves to its lower limit position, the light-shielding baffle is exactly in the blocking position, so the light emitted by the light-emitting element cannot be received by the light-receiving element. Therefore, based on the signal acquired by the photoelectric sensor, it can be determined that the telescopic shaft 251 has moved to its lower limit position, thereby controlling the driver 230 to stop operating.

[0065] For example, in some embodiments, the driver 230 may be a device capable of outputting linear driving force, such as a linear motor, a cylinder, or a hydraulic cylinder. For example, the driver 230 may also include a device capable of outputting rotary driving force, such as a rotary motor, a pneumatic motor, or a hydraulic motor, and a transmission mechanism capable of converting rotary motion into linear motion, such as a lead screw drive mechanism or a gear and rack mechanism.

[0066] To help those skilled in the art understand the solutions provided in the embodiments of this application, the following is a brief description of a method for transferring wafers.

[0067] When it is necessary to transfer wafer 2 to wafer carrier 100, the ejector pin 210 can be raised first to lift wafer carrier 100, thereby raising wafer carrier 100 to a certain height relative to base 300.

[0068] Furthermore, the wafer 2 can be driven through the wafer passage area 130 and moved above the carrier sub-section 1211. Furthermore, the wafer 2 can be driven down so that the wafer 2 is supported on the carrier sub-section 1211.

[0069] When semiconductor processing is required on the wafer 2 supported on the wafer carrier 100, taking thin film deposition as an example, the ejector pin 210 can be lowered until the wafer carrier 100 rests on the substrate 300. If the substrate 300 is a heated substrate, the wafer can be heated using the substrate 300. Process gas can be introduced into the reaction chamber of the semiconductor process equipment 1, and a thin film can be deposited on the wafer surface through a chemical reaction within the reaction chamber.

[0070] Furthermore, the process of transferring the wafer from the wafer carrier 100 is the reverse of the process of transferring the wafer to the wafer carrier 100, therefore, the process of transferring the wafer from the wafer carrier 100 will not be described in detail here.

[0071] In some embodiments, the semiconductor process equipment further includes a wafer transfer device. The wafer transfer device is used to transfer wafers to a wafer carrier 100 within the semiconductor process equipment 1, and also to transfer wafers after processing out of the semiconductor process equipment 1. Exemplarily, the wafer transfer device is a wafer transfer robot. The end of the wafer transfer robot is provided with a fork arm, which supports the wafer, thereby driving the wafer to move.

[0072] In some embodiments, the semiconductor process equipment 1 includes multiple sets of lifting devices 200, bases 300, and wafer carriers 100. For example, the semiconductor process equipment 1 includes four sets of lifting devices 200, four sets of bases 300, and four sets of wafer carriers 100. Figure 16 The illustration shows a semiconductor process equipment 1 equipped with four sets of bases 300 and four sets of wafer carriers 100.

[0073] The semiconductor process equipment 1 also includes a rotary table 600. The rotary table 600 is used to transfer the wafer carrier 100 from one base 300 to another base 300.

[0074] For example, each substrate 300 forms a semiconductor processing station. The wafer can undergo a thin film deposition process at each station. For ease of description, the stations formed by each substrate 300 are referred to as the first station, the second station, the third station, and the fourth station, respectively.

[0075] For example, an unprocessed wafer is first transferred to the wafer carrier 100 at the first station, where a first thin-film deposition process is performed. Then, the rotary table 600 transfers the processed wafer along with the wafer carrier 100 to the base 300 at the second station, where a second thin-film deposition process is performed. This process continues until a fourth thin-film deposition process is performed on the wafer at the fourth station. Finally, the processed wafer can be transferred back to the first station along with the wafer carrier 100.

[0076] Furthermore, a wafer transfer device can be used to transfer the processed wafers from the first workstation. After the processed wafers are transferred out, the wafer carrier 100 is idle. Then, the wafer transfer device can be used to transfer unprocessed wafers to the wafer carrier 100 located at the first workstation. This process is repeated cyclically, ensuring that there are wafers undergoing processing at each workstation, thereby improving the processing efficiency of the semiconductor process equipment.

[0077] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0078] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the embodiments of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer carrier device, characterized in that, include: The first connector (110) and at least three carriers (120); The at least three carrier members (120) are distributed circumferentially and are all connected to the first connector (110); The carrier (120) includes a first protrusion (121) that protrudes toward the center of the carrier (120). A wafer passage area (130) is formed between the upper side of the first protrusion (121) and the lower side of the first connector (110). The first protrusion (121) is used to carry the wafer (2).

2. The wafer carrier device according to claim 1, characterized in that, The first protrusion (121) includes a support sub-part (1211) located at the end of the protrusion (121) facing the center of the support member (120), and the support sub-part (1211) is used to support the wafer (2).

3. The wafer carrier device according to claim 2, characterized in that, The first protrusion (121) further includes a guide sub-part (1212), which is used to guide the wafer (2) carried on the guide sub-part (1212) to slide to the carrier sub-part (1211).

4. The wafer carrier device according to claim 3, characterized in that, The height of the top surface of the guide portion (1212) gradually decreases in the direction from the first protrusion (121) toward the center of the support member (120).

5. The wafer carrier device according to claim 2, characterized in that, The carrier sub-part (1211) has a limiting surface (1213) on the side opposite to the surrounding center of the carrier member (120), the limiting surface (1213) is used to restrict the wafer (2) within the area enclosed by the limiting surface (1213).

6. The wafer carrier device according to claim 1, characterized in that, The first connector (110) includes an annular portion (111) and a plurality of second protrusions (112) connected to each other. The second protrusions (112) protrude from the outer periphery of the annular portion (111) in a direction opposite to the center of the annular portion (111). The carrier (120) is connected to the second protrusions (112) in a corresponding manner.

7. The wafer carrier device according to claim 1, characterized in that, The wafer carrier is applied to semiconductor process equipment. The bottom of the carrier (120) is provided with a recess (122), which is used to adapt to the pin (210) of the lifting device (200) of the semiconductor process equipment.

8. A semiconductor process apparatus, characterized in that, include: The lifting device (200), the base (300), and the wafer carrier device according to any one of claims 1 to 7; The lifting device (200) includes a plurality of pins (210), and the base (300) is provided with a plurality of first through holes (310). The number of the bearing (120), the pins (210) and the first through holes (310) are all equal, and the pins (210) are correspondingly inserted into the first through holes (310). The base (300) is used to support the carrier (120), which is correspondingly opposite to the first through hole (310) so that the wafer carrier can be lifted by the ejector pin (210) and rise relative to the base (300).

9. The semiconductor process equipment according to claim 8, characterized in that, The semiconductor process equipment also includes a chamber body (400) and a heat insulation ring (500). The lifting device (200) further includes a connecting bracket (220), which is connected to the chamber body (400), and the heat insulation ring (500) is disposed between the chamber body (400) and the connecting bracket (220).

10. The semiconductor process equipment according to claim 9, characterized in that, The heat insulation ring (500) has a relief groove (510) on the side facing the chamber body (400).

Images