Semiconductor processing apparatus

Abstract

The present disclosure provides a semiconductor processing apparatus, which relates to the field of semiconductor manufacturing. The semiconductor processing apparatus comprises a chamber, a magnetic levitation stator, a magnetic levitation rotor, a lifting mechanism and a limiting mechanism. The interior of the chamber comprises an implementation space and a levitation space in communication with the implementation space. At least part of the magnetic levitation rotor is arranged in the levitation space. The magnetic levitation stator is arranged outside the chamber and opposite to the levitation space. The lifting mechanism comprises a driving member arranged outside the chamber and a lifting member between the magnetic levitation rotor and the driving member. The driving member is used to drive the lifting member to move between an initial position and a levitation position. When the lifting member is in the levitation position, the magnetic levitation rotor is coupled in a controllable magnetic field. The limiting mechanism is arranged outside the chamber and connected with the lifting member. The limiting mechanism is used to abut against the chamber so as to limit the lifting member in the levitation position. The semiconductor processing apparatus of the present disclosure integrates the magnetic levitation driving and the lifting mechanism, and improves the lifting stroke of the magnetic levitation rotor.

Description

Technical Field

[0001] The exemplary embodiments disclosed herein relate generally to the field of semiconductor manufacturing, and more particularly to semiconductor processing equipment. Background Technology

[0002] In semiconductor manufacturing, the lifting and lowering control of magnetic levitation turntables is complex, has low stability, and cannot achieve large-stroke lifting and lowering. Summary of the Invention

[0003] This disclosure provides a semiconductor processing apparatus, including a chamber, a magnetically levitated stator, a magnetically levitated rotor, a lifting mechanism, and a limiting mechanism. The chamber includes an implementation space for performing workpiece processing and a levitation space communicating with the implementation space. At least a portion of the magnetically levitated rotor is disposed within the levitation space. The magnetically levitated rotor carries the workpiece for processing. The magnetically levitated stator is located outside the chamber and configured relative to the levitation space. The magnetically levitated stator provides a controllable magnetic field coupled to the magnetically levitated rotor. The lifting mechanism includes a drive member disposed outside the chamber and a lifting member located between the magnetically levitated rotor and the drive member. The drive member drives the lifting member to move between an initial position and a levitation position. Vertically, the levitation position is above the initial position. When the lifting member is in the levitation position, the magnetically levitated rotor is coupled to the controllable magnetic field. The limiting mechanism is disposed outside the chamber and connected to the lifting member. The limiting mechanism abuts against the chamber to restrict the lifting member to the levitation position.

[0004] In this embodiment, the semiconductor processing device integrates a magnetic levitation drive and a lifting mechanism to increase the lifting stroke of the magnetic levitation rotor.

[0005] In some embodiments, a limiting mechanism is configured to be linked with a lifting member; the limiting mechanism includes a fixed block and a limiting rod; the fixed block is connected to the lifting member and is configured to follow the movement of the lifting member in the same direction; a first end of the limiting rod is movably connected to the fixed block so that the limiting rod moves vertically; a second end of the limiting rod is used to abut against a chamber when the lifting member is in a suspended position.

[0006] In some embodiments, the fixing block includes a threaded hole; the limiting rod includes a screw that mates with the threaded hole.

[0007] In some embodiments, the limiting mechanism includes a driver; the driver is configured to receive driving information to drive the limiting lever to move vertically.

[0008] In some embodiments, a positioning pin is provided at the top of the lifting component; a positioning groove is provided at the bottom of the magnetic levitation rotor, with the groove opening located on the bottom surface of the magnetic levitation rotor; when the lifting component is in the suspended position, the positioning pin is inserted into the positioning groove to constrain the displacement of the magnetic levitation rotor in a plane perpendicular to the vertical direction.

[0009] In some embodiments, the positioning groove includes a bottom wall and a side wall; the bottom wall is disposed opposite to the groove opening; the side wall gradually moves away from the axial direction of the magnetic levitation rotor from top to bottom; wherein the axial direction of the magnetic levitation rotor is parallel to the vertical direction; the top of the positioning pin is configured as a curved surface so as to guide the magnetic levitation rotor to the levitation state by cooperating with the side wall of the positioning pin through the curved surface; wherein when the magnetic levitation rotor is in the levitation state, the positioning groove and the positioning pin are coaxial.

[0010] In some embodiments, the positioning groove includes a bottom wall and a side wall; the bottom wall is disposed opposite to the groove opening; the side wall gradually moves away from the axial direction of the magnetic levitation rotor from top to bottom; wherein the axial direction of the magnetic levitation rotor is parallel to the vertical direction; the top shape of the positioning pin is configured to adapt to the shape of the positioning groove so as to guide the magnetic levitation rotor to the levitation state by the cooperation of the side wall of the positioning groove and the positioning pin; wherein, when the magnetic levitation rotor is in the levitation state, the positioning groove and the positioning pin are coaxial.

[0011] In some embodiments, the diameter of the circumscribed circle of the locating pin's cross-section is smaller than the diameter of the slot; wherein the cross-section is a plane perpendicular to the axial direction of the locating pin.

[0012] In some embodiments, the lifting mechanism further includes a lead screw and nut transmission assembly; the lead screw of the lead screw and nut transmission assembly is connected to the output end of the drive member; the nut of the lead screw and nut transmission assembly is connected to the lifting member; the nut is configured to move linearly along the axial direction of the lead screw under the rotational motion of the lead screw; wherein the axial direction of the lead screw is parallel to the vertical direction.

[0013] In some embodiments, the semiconductor processing apparatus further includes a heat source disposed outside the chamber; the heat source is used to provide thermal energy to the implementation space to perform heat treatment on the workpiece.

[0014] It should be understood that the description in the Summary of the Invention is not intended to limit the key or essential features of the embodiments of this disclosure, nor is it intended to restrict the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0015] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein: Figure 1 This is a schematic diagram of the structure of the semiconductor processing device provided in the embodiments of this disclosure; Figure 2 This is a schematic diagram of the structure of the semiconductor processing device provided in the embodiments of this disclosure; Figure 3 This is a schematic diagram of the structure of the positioning pin and positioning groove connected in accordance with the embodiments of this disclosure; Figure 4 This is a schematic diagram of the structure of the positioning pin and positioning groove connected in accordance with the embodiments of this disclosure; Figure 5 This is a schematic diagram of the structure of the semiconductor processing device provided in the embodiments of this disclosure.

[0016] Explanation of reference numerals in the attached figures: 1000: Semiconductor processing equipment; 1010: Chamber; 1011: Implementation space; 1012: Suspended space; 1020: Magnetic levitation stator; 1030: Magnetic levitation rotor; 1031: Positioning groove; 1040: Lifting mechanism; 1041: Drive component; 1042: Lifting component; 1043: Positioning pin; 1050: Limiting mechanism; 1051: Fixed block; 1052: Limit rod; 1060: Heat source; A: Vertical. Detailed Implementation

[0017] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding, and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0018] like Figures 1 to 5As shown, this embodiment provides a semiconductor processing device 1000, including a chamber 1010, a magnetically levitated stator 1020, a magnetically levitated rotor 1030, a lifting mechanism 1040, and a limiting mechanism 1050. The chamber 1010 includes an implementation space 1011 for performing workpiece processing and a suspension space 1012 communicating with the implementation space 1011. At least a portion of the magnetically levitated rotor 1030 is disposed within the suspension space 1012. The magnetically levitated rotor 1030 is used to carry the workpiece for processing. The magnetically levitated stator 1020 is located outside the chamber 1010 and configured relative to the suspension space 1012. The magnetically levitated stator 1020 is used to provide coupling capability with the magnetically levitated rotor 1030. A controllable magnetic field is provided. The lifting mechanism 1040 includes a drive member 1041 disposed outside the chamber 1010, and a lifting member 1042 located between the magnetic levitation rotor 1030 and the drive member 1041. The drive member 1041 is used to drive the lifting member 1042 to move between an initial position and a suspended position. The suspended position is located above the initial position along the vertical direction A of the chamber 1010. When the lifting member 1042 is in the suspended position, the magnetic levitation rotor 1030 is coupled to a controllable magnetic field. A limiting mechanism 1050 is disposed outside the chamber 1010 and connected to the lifting member 1042. The limiting mechanism 1050 is used to abut against the chamber 1010 to restrict the lifting member 1042 to the suspended position.

[0019] The chamber 1010 is the part of the semiconductor processing equipment 1000 that houses semiconductor components (i.e., workpieces), and the workpieces can be placed inside the chamber 1010 for processing. The chamber 1010 can be cylindrical, such as a cylinder or a prism, and its specific shape can be set according to actual needs.

[0020] For ease of description, this embodiment defines the direction from the top to the bottom of chamber 1010 as the top-to-bottom direction, and the top-to-bottom direction is the vertical direction A of chamber 1010, which is also the axial direction of chamber 1010; the axial direction of chamber 1010 is... Figure 1 , Figure 5 The direction indicated by the middle arrow A.

[0021] The chamber 1010 can be composed of a top wall, a bottom wall, and multiple side walls between the top and bottom walls. The space formed by the top wall, bottom wall, and multiple side walls is the internal space of the chamber 1010. The internal space of the chamber 1010 can be divided into two parts: one part is an implementation space 1011 for accommodating and carrying out workpiece processing, such as... Figure 1 , Figure 5 The space above and in the middle; another part is the levitation space 1012 used to accommodate the magnetic levitation rotor 1030, such as... Figure 1 , Figure 5 The space below and in the middle. In one instance, such as Figure 2 The annular suspended space 1012 is shown.

[0022] The magnetic field generated by the internal electromagnetic coil of the magnetic levitation stator 1020 is a controllable magnetic field; the interaction between the controllable magnetic field and the magnetic material of the magnetic levitation rotor 1030 can generate force and torque, forming a levitation force that overcomes the gravity of the magnetic levitation rotor 1030 and a driving torque that drives the magnetic levitation rotor 1030 to rotate.

[0023] The magnetic levitation stator 1020 is located outside the cavity 1010, for example, disposed outside the side wall of the cavity 1010. The controllable magnetic field it generates can penetrate the side wall of the cavity 1010 and act on the levitation space 1012. The connection method between the magnetic levitation stator 1020 and the side wall of the cavity 1010 can be set according to process requirements, for example, through a rigid connection by flange or key.

[0024] The magnetically levitated stator 1020 can be a single ring stator to provide an axially symmetrical controllable magnetic field; or it can be multiple segmented stators, which can be uniformly distributed along the circumference of the cavity 1010 on the sidewalls to provide an axially symmetrical controllable magnetic field. For example... Figure 2 The present invention provides an example having six segmented magnetic levitation stators 1020 evenly distributed outside the sidewall of the chamber 1010.

[0025] The dimensions of the magnetic levitation stator 1020 can be set according to process requirements, for example... Figure 1 , Figure 5 As shown, the vertical dimension of the magnetic levitation stator 1020 is smaller than that of the levitation space 1012 in the vertical direction A. This can be understood as the controllable magnetic field generated by the magnetic levitation stator 1020 not completely covering the levitation space 1012. In other words, the magnetic levitation rotor 1030 needs to move vertically a certain distance within the levitation space 1012 to couple with the controllable magnetic field. In one example, a magnetic levitation stator 1020 with a larger or smaller controllable magnetic field coverage area can be used to adapt to the magnetic field requirements of different processes. In another example, a magnetic levitation stator 1020 with a higher or lower controllable magnetic field coverage area can also be used to adapt to the magnetic field requirements of different processes.

[0026] The magnetic levitation rotor 1030 can be an annular body located in the annular levitation space 1012; the annular magnetic levitation rotor 1030 and the annular levitation space 1012 can be coaxially arranged. The top of the magnetic levitation rotor 1030 can directly abut against the workpiece to support the workpiece for processing; or a tray can be placed between the top of the magnetic levitation rotor 1030 and the workpiece. By using a magnetic levitation stator 1020 in conjunction with the magnetic levitation rotor 1030, not only is non-contact drive of the magnetic levitation rotor 1030 achieved, avoiding particulate contamination problems caused by rotor rotation, but the rotation speed of the workpiece can also be increased, achieving high-precision angular positioning of the workpiece.

[0027] along Figure 1 , Figure 5 From top to bottom, the size of the magnetic levitation rotor 1030 is smaller than the size of the levitation space 1012 to accommodate the vertical movement of the magnetic levitation rotor 1030 within the levitation space 1012; correspondingly, in the horizontal plane (i.e., the plane perpendicular to vertical A), the size of the magnetic levitation rotor 1030 is smaller than the size of the levitation space 1012 to accommodate the lateral swaying or offset of the magnetic levitation rotor 1030, avoiding collision with the inner wall of the chamber 1010.

[0028] The lifting mechanism 1040 is the part that drives the magnetic levitation rotor 1030 to move up and down in the levitation space 1012. The drive component 1041 is the power source of the lifting mechanism 1040, such as a servo motor or a cylinder, the model of which can be set as needed. The drive component 1041 can be located outside the chamber 1010, for example, at the bottom of the chamber 1010.

[0029] The lifting component 1042 is a structure that supports the vertical movement of the magnetic levitation rotor 1030. The bottom end of the lifting component 1042 is connected to the output end of the drive component 1041, or the output end of the drive component 1041 serves as the lifting component 1042. The top end of the lifting component 1042 extends into the levitation space 1012 and moves between the initial position and the levitation position. The top end of the lifting component 1042 is used to connect with the magnetic levitation rotor 1030 when required by the process, for example, when the lifting component 1042 needs to support the vertical movement of the magnetic levitation rotor 1030, or when the lifting component 1042 needs to adjust the vertical height A of the magnetic levitation rotor 1030. By configuring the drive component 1041 and the lifting component 1042 to adjust the height of the magnetic levitation rotor 1030, and enabling active lifting and lowering relative to the magnetic levitation rotor 1030, the installation and control difficulty is reduced, making it easier for operators to control. The lifting component 1042 can be a cylindrical body, such as a cylinder or prism.

[0030] The number of lifting mechanisms 1040 can be set according to process requirements. For example, if the semiconductor processing equipment 1000 uses 6 evenly distributed magnetic levitation stators 1020, the lifting mechanism 1040 can also be 6 and located below the 6 magnetic levitation stators 1020 respectively; or the lifting mechanism 1040 includes 1 driving member 1041, the output end of which is connected to multiple lifting members 1042. The multiple lifting members 1042 are evenly abutted against the lower part of the magnetic levitation rotor 1030, so that the magnetic levitation rotor 1030 can be lifted and lowered smoothly in the axial direction, avoiding deviation and collision with the chamber 1010 during the lifting process.

[0031] The levitation position can be understood as the high position of the top of the lifting component 1042 in the levitation space 1012. When the lifting component 1042 is in the levitation position, the top of the lifting component 1042 is connected to the magnetic levitation rotor 1030, so that the magnetic levitation rotor 1030 is coupled with the controllable magnetic field generated by the magnetic levitation stator 1020. The controllable magnetic field can apply levitation force and driving torque to the magnetic levitation rotor 1030.

[0032] The initial position can be understood as the lower position of the top of the lifting member 1042 within the levitation space 1012. When the lifting member 1042 is in the initial position, its top can be connected to the magnetic levitation rotor 1030. For example, when the semiconductor processing device 1000 is not operating, the magnetic levitation rotor 1030 is located in the bottom region of the levitation space 1012 and rests against the top of the lifting member 1042 in the initial position. Alternatively, when the lifting member 1042 is in the initial position, its top can also be disconnected from the magnetic levitation rotor 1030. For example, when the controllable magnetic field provided by the magnetic levitation stator 1020 applies a levitation force to the magnetic levitation rotor 1030, causing the magnetic levitation rotor 1030 to levitate in the controllable magnetic field, the lifting member 1042 gradually descends to the initial position, and its top gradually detaches from the magnetic levitation rotor 1030. By configuring the suspension position and initial position of the lifting component 1042, the magnetic levitation rotor 1030 can be adjusted to perform lifting and lowering movements, achieving a wide range of axial lifting and lowering of the magnetic levitation rotor 1030. In one example, the axial distance between the initial position and the suspension position is between 0 and 30 mm.

[0033] The limiting mechanism 1050 is a structure that restricts the position of the lifting member 1042 in the levitation space 1012. For example, when the limiting mechanism 1050 abuts against the chamber 1010, the top of the lifting member 1042 is just in the levitation position, preventing the lifting member 1042 from continuing to rise and deviating from the levitation position. The limiting mechanism 1050 can move synchronously with the lifting member 1042, for example, as the lifting member 1042 rises from its initial position to the levitation position, the limiting mechanism 1050 also rises synchronously until it abuts against the chamber 1010; or it can move independently of the lifting member 1042, for example, after the lifting member 1042 rises from its initial position to the levitation position, the limiting mechanism 1050 rises and falls again until it abuts against the chamber 1010. By configuring the limiting mechanism 1050 to abut against the chamber 1010, the magnetic levitation rotor 1030 can be stabilized in the levitation position, preventing the magnetic levitation rotor 1030 from moving in the vertical direction A. Multiple limit mechanisms 1050 can be configured, and each one is connected to a corresponding lifting component 1042.

[0034] Before application, the semiconductor processing equipment 1000 of this disclosure has the lifting member 1042 in an initial position, and the magnetic levitation rotor 1030 abutting against the top of the lifting member 1042 in the initial position. As the semiconductor processing equipment 1000 is started, the driving member 1041 drives the lifting member 1042 to rise, and the magnetic levitation rotor 1030 gradually rises until it is coupled with a controllable magnetic field. The controllable magnetic field applies a levitation force to the magnetic levitation rotor 1030, and the driving member 1041 drives the lifting member 1042 to fall. The lifting member 1042 gradually disengages from the magnetic levitation rotor 1030, and the controllable magnetic field applies a driving torque to the magnetic levitation rotor 1030 to make the magnetic levitation rotor 1030 rotate. The magnetic levitation rotor 1030 drives the workpiece to rotate synchronously. This semiconductor processing equipment 1000 integrates a non-contact magnetic levitation drive, which keeps the semiconductor processing equipment 1000 in a clean operating environment; and the semiconductor processing equipment 1000 integrates a mechanical lifting mechanism 1040 to increase the lifting stroke of the magnetic levitation rotor 1030; the magnetic levitation drive and the lifting mechanism 1040 do not interfere with each other and can be separated in an orderly manner to adapt to more process requirements.

[0035] In one example, the rotational speed of the magnetic levitation rotor 1030 ranges from 200 to 400 rpm (Revolutions Per Minute).

[0036] In one embodiment, the limiting mechanism 1050 is configured to be linked with the lifting member 1042; the limiting mechanism 1050 includes a fixing block 1051 and a limiting rod 1052; the fixing block 1051 is connected to the lifting member 1042 and is configured to follow the movement of the lifting member 1042 in the same direction; a first end of the limiting rod 1052 is movably connected to the fixing block 1051 so that the limiting rod 1052 moves along the vertical direction A; a second end of the limiting rod 1052 is used to abut against the chamber 1010 when the lifting member 1042 is in a suspended position.

[0037] The fixing block 1051 is a structure in the limiting mechanism 1050 that supports the limiting rod 1052; during the upward movement of the lifting member 1042, the fixing block 1051 rises accordingly; during the downward movement of the lifting member 1042, the fixing block 1051 falls accordingly. The position of the fixing block 1051 relative to the lifting member 1042 can be set as needed, for example... Figure 1 , Figure 5 As shown, the fixing block 1051 is located in the bottom area of ​​the lifting member 1042.

[0038] The first end of the limiting rod 1052 can be understood as the bottom of the limiting rod 1052, which is used to be movably connected to the fixed block 1051. As the bottom of the limiting rod 1052 moves up and down relative to the fixed block 1051, the second end of the limiting rod 1052 moves up and down synchronously. The second end of the limiting rod 1052 can be understood as the top of the limiting rod 1052, which can be used to abut against the outer side of the bottom wall of the chamber 1010.

[0039] The limiting rod 1052 can be configured to move in conjunction with the fixed block 1051 or the lifting member 1042. For example, during the upward movement of the lifting member 1042, the limiting rod 1052 gradually rises or falls, ensuring that when the top of the lifting member 1042 is in a suspended position, the top of the limiting rod 1052 abuts against the chamber 1010. Alternatively, the limiting rod 1052 can be configured to move independently. During the upward movement of the lifting member 1042, the limiting rod 1052 remains stationary relative to the fixed block 1051. After the top of the lifting member 1042 is in a suspended position, the limiting rod 1052 moves until its top abuts against the chamber 1010. Furthermore, the limiting rod 1052 is configured to lift independently. Before the lifting component 1042 rises, the limiting rod 1052 adjusts its height according to the floating position of the lifting component 1042. During the process of the lifting component 1042 rising to the floating position, the limiting rod 1052 remains stationary relative to the fixed block 1051. When the top of the lifting component 1042 is in the floating position, the top of the limiting rod 1052 abuts against the chamber 1010.

[0040] The limiting rod 1052 and the fixed block 1051 can be connected in various ways, such as a sliding groove and slide rail connection, a gear and rack connection, or a linear motor drive. The limiting rod 1052 can be a cylindrical body, such as a cylinder or a prism.

[0041] By using the mechanical limiting of the fixed block 1051 and the limiting rod 1052, on the one hand, when the lifting member 1042 is in the suspended position, the limiting rod 1052 abuts against the chamber 1010 to prevent the lifting member 1042 from continuing to move and stabilize it in the suspended position; on the other hand, the lifting of the limiting rod 1052 can compensate for the error between the top of the lifting member 1042 and the suspended position.

[0042] In one embodiment, the fixing block 1051 includes a threaded hole; the limiting rod 1052 includes a screw that mates with the threaded hole.

[0043] A threaded hole is provided on the fixing block 1051 along the vertical direction A. The threaded hole can pass through a part of the fixing block 1051 or penetrate the fixing block 1051, which can be set according to the needs. The distance between two adjacent threaded holes can be 0.005-0.02mm; correspondingly, the pitch on the screw is adapted to the pitch of the threaded hole.

[0044] The screw can be manually rotated to raise or lower it relative to the fixed block 1051. Alternatively, a rotary motor can be used to drive the screw to rotate, thereby raising or lowering it relative to the fixed block 1051.

[0045] By configuring the threaded hole and screw engagement method, the top position of the lifting component 1042 can be finely adjusted, and the operation is simple and facilitates subsequent maintenance.

[0046] In one embodiment, the limiting mechanism 1050 includes a driver configured to receive driving information to drive the limiting lever 1052 to move along the vertical direction A.

[0047] The driver can be a linear motor or a cylinder to drive the limit rod 1052 to move up and down along vertical A.

[0048] The driving information is the information on the driver driving the limit rod 1052 to rise or fall, such as the limit rod 1052 rising by 5mm or the limit rod 1052 falling by 3mm, etc.

[0049] By driving the limit rod 1052 to rise and fall with the driver, multiple limit rods 1052 can perform rising and falling movements respectively, thereby improving efficiency.

[0050] In one embodiment, when different workpieces are processed or workpieces of different specifications are processed, their suspension position may change. The driver can adjust the lifting height of the limit rod 1052 according to the received driving information, thereby changing the position of the top of the lifting member 1042 so that the top of the lifting member 1042 meets the new suspension position requirements.

[0051] In one embodiment, a positioning pin 1043 is provided on the top of the lifting member 1042; a positioning groove 1031 is provided on the bottom of the magnetic levitation rotor 1030, and the opening of the positioning groove 1031 is located on the bottom surface of the magnetic levitation rotor 1030; when the lifting member 1042 is in the suspended position, the positioning pin 1043 is inserted into the positioning groove 1031 to constrain the displacement of the magnetic levitation rotor 1030 in a plane perpendicular to the vertical direction A.

[0052] The positioning pin 1043 can be a cylindrical pin, a conical pin, a diamond pin, or other pins with a guide surface. When the lifting component 1042 is in the suspended position, that is, when the positioning pin 1043 is in the suspended position; when the lifting component 1042 is in the initial position, that is, when the positioning pin 1043 is in the initial position.

[0053] The shape of the positioning groove 1031 can be the same as that of the positioning pin 1043. In some examples, the positioning groove 1031 can also have a different shape than the positioning pin 1043. For example, when the positioning pin 1043 is curved, the positioning groove 1031 can be a trapezoidal groove or a triangular groove.

[0054] The positioning groove 1031 can be an annular groove to facilitate its connection with the positioning pin 1043 after the magnetic levitation rotor 1030 rotates.

[0055] The plane perpendicular to vertical direction A is the magnetic levitation rotor 1030 in... Figure 1 , Figure 5 The horizontal plane in the middle. When the positioning groove 1031 and the positioning pin 1043 are connected, at least part of the positioning pin 1043 will be inserted into the positioning groove 1031 to satisfy the coaxiality of the positioning groove 1031 and the positioning pin 1043, so that the lifting component 1042 can carry the magnetic levitation rotor 1030 during the movement, and eliminate the radial force on the horizontal plane of the magnetic levitation rotor 1030 during the lifting process.

[0056] In one embodiment, the positioning groove 1031 includes a bottom wall and a side wall; the bottom wall is disposed opposite to the groove opening; the side wall gradually moves away from the axial direction of the magnetic levitation rotor 1030 from top to bottom; wherein the axial direction of the magnetic levitation rotor 1030 is parallel to the vertical direction A; the top of the positioning pin 1043 is configured as a curved surface so as to guide the magnetic levitation rotor 1030 to the levitation state by cooperating with the side wall of the positioning pin 1043 through the curved surface; wherein, when the magnetic levitation rotor 1030 is in the levitation state, the positioning groove 1031 and the positioning pin 1043 are coaxial.

[0057] like Figure 3 , Figure 4 The positioning groove 1031 includes a bottom wall and two side walls, which are generally formed as a trapezoidal groove.

[0058] The curvature of the locating pin 1043 surface can be set as needed.

[0059] The levitation state can be the state where the positioning pin 1043 is in the levitation position, and the magnetic levitation rotor 1030 is simultaneously supported by the positioning pin 1043 and subjected to levitation force by a controllable magnetic field. When the magnetic levitation rotor 1030 is in the levitation state, the central axis of the positioning groove 1031 is coaxial with the central axis of the positioning pin 1043 to prevent the magnetic levitation rotor 1030 from moving laterally.

[0060] When the positioning pin 1043 is connected to the positioning groove 1031, the curved surface can contact the bottom wall and the two side walls at the same time, and the curved surface is held by the three and stabilized in the positioning groove 1031; or the curved surface can contact only the two side walls, and the curved surface is held by the two side walls and stabilized in the positioning groove 1031.

[0061] During the workpiece processing in the semiconductor processing equipment 1000, the magnetically levitated rotor 1030 may experience lateral displacement. After processing in the semiconductor processing equipment 1000, the magnetically levitated rotor 1030 will be suspended in a state similar to... Figure 3 , Figure 4As indicated by the dashed line, during the process of the top of the lifting component 1042 (i.e., the positioning pin 1043) rising from its initial position to its suspended position, the curved surface preferentially abuts against the right side wall of the positioning groove 1031. Due to the inclination of the right side wall, as the positioning pin 1043 continues to rise, the magnetic levitation rotor 1030 will gradually move to the left. Figure 3 , Figure 4 As shown by the solid line, the lateral offset of the magnetic levitation rotor 1030 is eliminated and it is stably abutted against the positioning groove 1031. The magnetic levitation rotor 1030, with its offset eliminated, is in a state of imminent levitation. As the positioning pin 1043 descends from the levitation position to the initial position, the workpiece can continue to be processed in the next step. The cooperation between the positioning groove 1031 and the positioning pin 1043 in this embodiment of the present disclosure not only reserves space for the magnetic levitation rotor 1030 to offset, meeting the high precision requirements of workpiece processing and semiconductor processing equipment 1000, but also automatically corrects or returns to its original position when the magnetic levitation rotor 1030 offsets.

[0062] In one embodiment, the positioning groove 1031 includes a bottom wall and a side wall; the bottom wall is disposed opposite to the groove opening; the side wall gradually moves away from the axial direction of the magnetic levitation rotor 1030 from top to bottom; wherein the axial direction of the magnetic levitation rotor 1030 is parallel to the vertical direction A; the top shape of the positioning pin 1043 is configured to adapt to the shape of the positioning groove 1031 so as to guide the magnetic levitation rotor 1030 to the levitation state through the cooperation of the positioning groove 1031 and the side wall of the positioning pin 1043; wherein, when the magnetic levitation rotor 1030 is in the levitation state, the positioning groove 1031 and the positioning pin 1043 are coaxial.

[0063] This embodiment provides a positioning pin 1043 with the same shape as the positioning groove 1031. Other configurations and descriptions can be found in the previous embodiment and will not be repeated here.

[0064] In one embodiment, the diameter of the outer circle of the cross-section of the positioning pin 1043 is smaller than the diameter of the slot; wherein the cross-section is a plane perpendicular to the axial direction of the positioning pin 1043.

[0065] The diameter of the circumcircle of the cross-section of the locating pin 1043 is... Figure 3 , Figure 4 The width of the center positioning pin is 1043.

[0066] The diameter of the slot is... Figure 3 , Figure 4 Width of the center slot.

[0067] The positioning pin 1043 can be fully inserted into the positioning groove 1031, or the positioning pin 1043 can be partially inserted into the positioning groove 1031, for example, only the top of the positioning pin 1043 is inserted into the positioning groove 1031.

[0068] By configuring a smaller positioning pin 1043, the positioning pin 1043 can be smoothly inserted into the positioning slot 1031, eliminating the offset of the magnetic levitation rotor 1030.

[0069] In one embodiment, the lifting mechanism 1040 further includes a lead screw and nut transmission assembly; the lead screw of the lead screw and nut transmission assembly is connected to the output end of the drive member 1041; the nut of the lead screw and nut transmission assembly is connected to the lifting member 1042; the nut is configured to move linearly along the axial direction of the lead screw under the rotational motion of the lead screw; wherein the axial direction of the lead screw is parallel to the vertical direction A.

[0070] In this embodiment, the mounting axis of the lead screw is parallel to the vertical direction A. When the drive component 1041 drives the lead screw to rotate, the nut's movement trajectory is a precise axial displacement of a vertical straight line, thereby achieving millimeter-level precise positioning of the lifting component 1042 from its initial position to its suspended position.

[0071] In one example, the lead screw can serve as the output of the drive element 1041.

[0072] In one embodiment, the semiconductor processing apparatus 1000 further includes a heat source 1060 disposed outside the chamber 1010; the heat source 1060 is used to provide thermal energy to the implementation space 1011 to perform heat treatment on the workpiece.

[0073] like Figure 5 The heat source 1060 can be located outside the bottom wall of the chamber 1010; the energy generated by the heat source 1060 acts on the implementation space 1011 through the bottom wall of the chamber 1010.

[0074] In this embodiment, the heat source 1060 is located outside the strong chamber, which avoids complex wiring operations inside the chamber 1010 and improves the vacuum reliability inside the chamber 1010.

[0075] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0076] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0077] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0078] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0079] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify the disclosure, specific examples of components and arrangements have been described above. Of course, these are merely examples and are not intended to limit the scope of this disclosure. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0080] The specific embodiments described above do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A semiconductor processing apparatus, characterized by, include: The chamber includes an implementation space for performing workpiece processing and a suspended space communicating with the implementation space. A magnetically levitated rotor, at least a portion of which is disposed within the levitation space; the magnetically levitated rotor is used to carry the workpiece for processing. A magnetically levitated stator is located outside the cavity and configured relative to the levitation space; The magnetically levitated stator is used to provide a controllable magnetic field coupled to the magnetically levitated rotor; The lifting mechanism includes a drive component disposed outside the chamber, and a lifting component located between the magnetic levitation rotor and the drive component; The driving component is used to drive the lifting component to move between an initial position and a suspended position; wherein, along the vertical direction of the chamber, the suspended position is located above the initial position; when the lifting component is located in the suspended position, the magnetically levitated rotor is coupled in the controllable magnetic field; A limiting mechanism is disposed outside the chamber and connected to the lifting member; the limiting mechanism is used to abut against the chamber to restrict the lifting member to the suspended position.

2. The semiconductor processing apparatus according to claim 1, characterized in that, The limiting mechanism is configured to work in conjunction with the lifting component; The limiting mechanism includes a fixed block and a limiting rod; the fixed block is connected to the lifting member and is configured to follow the movement of the lifting member in the same direction; a first end of the limiting rod is movably connected to the fixed block so that the limiting rod moves along the vertical direction; a second end of the limiting rod is used to abut against the chamber when the lifting member is in the suspended position.

3. The semiconductor processing apparatus according to claim 2, characterized in that, The fixing block includes a threaded hole; The limiting rod includes a screw that mates with a threaded hole.

4. The semiconductor processing apparatus according to claim 2, characterized in that, The limiting mechanism includes a driver; the driver is configured to receive driving information to drive the limiting rod to move along the vertical direction.

5. The semiconductor processing apparatus according to claim 1, characterized in that, The top of the lifting component is equipped with a positioning pin; The bottom of the magnetic levitation rotor is provided with a positioning groove, and the opening of the positioning groove is located on the bottom surface of the magnetic levitation rotor. When the lifting component is in the suspended position, the positioning pin is inserted into the positioning groove to constrain the displacement of the magnetic levitation rotor in a plane perpendicular to the vertical direction.

6. The semiconductor processing apparatus according to claim 5, characterized in that, The positioning groove includes a bottom wall and a side wall; the bottom wall is disposed opposite to the groove opening; the side wall gradually moves away from the axial direction of the magnetic levitation rotor from top to bottom; wherein, the axial direction of the magnetic levitation rotor is parallel to the vertical direction; The top of the positioning pin is configured as a curved surface so that the magnetic levitation rotor can be guided to a levitation state by the cooperation of the curved surface with the side wall of the positioning pin; wherein, when the magnetic levitation rotor is in the levitation state, the positioning groove is coaxial with the positioning pin.

7. The semiconductor processing apparatus according to claim 5, characterized in that, The positioning groove includes a bottom wall and a side wall; the bottom wall is disposed opposite to the groove opening; the side wall gradually moves away from the axial direction of the magnetic levitation rotor from top to bottom; wherein, the axial direction of the magnetic levitation rotor is parallel to the vertical direction; The top shape of the positioning pin is configured to adapt to the shape of the positioning groove so as to guide the magnetic levitation rotor to the levitation state by the cooperation between the positioning groove and the side wall of the positioning pin; wherein, when the magnetic levitation rotor is in the levitation state, the positioning groove and the positioning pin are coaxial.

8. The semiconductor processing apparatus according to claim 5, characterized in that, The diameter of the circumscribed circle of the cross-section of the positioning pin is smaller than the diameter of the slot; wherein the cross-section is a plane perpendicular to the axial direction of the positioning pin.

9. The semiconductor processing apparatus according to any one of claims 1-8, characterized in that, The lifting mechanism further includes a lead screw and nut transmission assembly; the lead screw of the lead screw and nut transmission assembly is connected to the output end of the drive component; the nut of the lead screw and nut transmission assembly is connected to the lifting component; the nut is configured to move linearly along the axis of the lead screw under the rotational motion of the lead screw. The axial direction of the lead screw is parallel to the vertical direction.

10. The semiconductor processing apparatus according to claim 8, characterized in that, Also includes: A heat source is located outside the chamber; The heat source is used to provide thermal energy to the implementation space in order to perform heat treatment on the workpiece.

Images