Anisotropic adapter plate with both thermal and electrical performance and preparation method thereof

Abstract

The present application relates to a kind of anisotropic adapter plate giving consideration to thermal electric performance and preparation method thereof, the anisotropic adapter plate includes: composite substrate, which includes multiple functional zones and transition zone between functional zones, the material of each functional zone is different;Multiple signal end conductive vias, which pass through the composite substrate, and are configured to transmit signals;Multiple ground end conductive vias, which pass through the composite substrate, the periphery of each signal end conductive via is surrounded by multiple ground end conductive vias, and adjacent ground end conductive vias do not contact;The cross-sectional area of the ground end conductive via is greater than the cross-sectional area of the signal end conductive via.

Description

Technical Field

[0001] This invention relates to the field of adapter plate technology, and in particular to an anisotropic adapter plate that takes into account both thermoelectric and electrical properties and its preparation method. Background Technology

[0002] In the field of advanced packaging technology, the interposer board, as a core component for achieving high-density interconnection and system integration, has a critical impact on the performance, reliability, and cost of the entire package through its material selection and structural design. Currently, the mainstream applications include two types: silicon-based interposers and organic-based interposers.

[0003] Silicon-based adapters offer certain advantages in packaging and integration due to their high thermal conductivity and excellent thermoelectric matching with silicon chips. However, the high dielectric constant of silicon substrates can easily cause signal loss and distortion during high-frequency signal transmission, affecting device performance. Furthermore, the manufacturing process of silicon-based adapters is complex, relying on high-precision equipment, and the lengthy and cumbersome process not only significantly increases manufacturing costs and reduces production efficiency but also increases the risk of performance instability or failure due to process deviations.

[0004] In contrast, organic-based interconnects are low-cost, but their lower thermal conductivity and slower heat dissipation lead to severe heat buildup under high power density conditions, causing localized overheating and affecting system reliability and lifespan. Furthermore, limitations in the linewidth / spacing accuracy and interlayer alignment capabilities of organic materials result in lower integration density, making it difficult to meet the miniaturization and high-integration interconnect requirements of modern high-performance electronic systems. This restricts their application and promotion in high-end fields such as aerospace equipment, satellites, rail transit equipment, marine engineering equipment, and intelligent manufacturing equipment.

[0005] In practical applications, such as specialized sensors, high-performance chip packaging, and precision aerospace electronic equipment, it is often necessary to integrate various materials with different physical parameters, such as thermal conductivity, coefficient of thermal expansion, dielectric constant, and Young's modulus, within the same adapter board structure to achieve specific functions and performance indicators. However, the significant differences in the physical properties of different materials can cause various problems. For example, integrating materials with different coefficients of thermal expansion can lead to thermal stress concentration at the interface during temperature changes, potentially causing delamination, cracking, or interconnect failure, severely impacting the long-term reliability of the system. Existing adapter board structures struggle to achieve the microfabrication integration of multiple different materials while meeting the requirements of thermo-mechanical and electrical performance matching, becoming a common bottleneck restricting the development of related high-reliability system technologies. Therefore, there is an urgent need to develop novel adapter boards with excellent thermo-mechanical and electrical synergistic characteristics that can adapt to the needs of heterogeneous integration. Summary of the Invention

[0006] To address at least some of the aforementioned problems in the prior art, the present invention provides an anisotropic adapter plate that balances thermoelectric properties, comprising: A composite substrate, comprising multiple functional zones and transition zones between the functional zones, with each functional zone made of a different material; Multiple signal-end conductive vias penetrate the composite substrate and are configured for signal transmission; Multiple grounding conductive vias penetrate the composite substrate, and each signal conductive via is surrounded by multiple grounding conductive vias, with adjacent grounding conductive vias not in contact; the cross-sectional area of ​​the grounding conductive vias is larger than the cross-sectional area of ​​the signal conductive vias.

[0007] Furthermore, the composite substrate comprises a matrix and a reinforcing phase incorporated into the matrix, wherein the matrix comprises a plurality of horizontally distributed functional regions and transition regions between the functional regions, the matrix material of each functional region may be the same or different, and the amount and / or type of reinforcing phase incorporated into each functional region is different.

[0008] Further, the matrix material is polyimide, polydimethylsiloxane PDMS, SU-8 negative photoresist, polytetrafluoroethylene, epoxy resin, or perfluoroalkoxyalkane; and / or The reinforcing phase is a 0-dimensional to 2-dimensional nanomaterial, including at least one of silicon carbide whiskers, diamond particles, and alumina particles; and / or The transition zone is made of a flexible material; or the transition zone is formed by fusing the materials of two adjacent functional zones.

[0009] Furthermore, the cross-sectional shape of the grounding terminal conductive via is X-shaped, Y-shaped, or ¥-shaped; All grounding conductive vias are arranged in a mesh structure.

[0010] Furthermore, the grounding terminal conductive via includes at least a cylindrical portion and two wing-shaped shielding portions located on opposite sides of the cylindrical portion, wherein: The height of the cylindrical portion is greater than the height of the airfoil shielding portion; At least one of the wing-shaped shielding portions includes a first wing-shaped portion and a second wing-shaped portion, wherein the roots of the first wing-shaped portion and the second wing-shaped portion are connected and the tops are separated; The first and second sides of the wing-shaped shield are arc-shaped surfaces, and the bending directions of the first and second sides are opposite; or the first and second sides of the wing-shaped shield are planar surfaces. The lengths of the first wing portion and the second wing portion may be the same or different.

[0011] Furthermore, if the length of the grounding conductive via is L, the top width of the first wing-shaped portion and the second wing-shaped portion is w, the radius of the cylindrical portion is r, and the spacing between adjacent grounding conductive vias is p, then: , .

[0012] Furthermore, it also includes: a redistribution layer located on the surface of the composite substrate and electrically connected to a grounding conductive via and a signal conductive via, the redistribution layer comprising metal wiring and an insulating substrate, the insulating substrate filling the gaps between the metal wiring.

[0013] This invention provides a method for preparing an anisotropic transition plate that takes into account both thermoelectric and electromechanical properties, comprising: A first conductive layer is formed on the substrate; A photoresist is formed on a substrate, patterned, and multiple patterns are formed. Metal is filled into the patterns, the photoresist is removed, and this process is repeated multiple times to form multiple signal terminal conductive vias and multiple ground terminal conductive vias. Each signal terminal conductive via is surrounded by multiple signal terminal conductive vias, and adjacent ground terminal conductive vias do not contact each other. The cross-sectional area of ​​the ground terminal conductive via is larger than the cross-sectional area of ​​the signal terminal conductive via. A composite material is filled between a signal-end conductive via and a ground-end conductive via to form a composite substrate; the composite material comprises a matrix material and a doped reinforcing phase; the composite substrate includes multiple functional regions and transition regions located between the functional regions.

[0014] Further, photoresist is formed on the substrate, patterned to form multiple patterns, metal is filled into the patterns, the photoresist is removed, and this process is repeated multiple times to form multiple signal terminal conductive vias and multiple ground terminal conductive vias, including: A first photoresist is formed on a substrate, and the first photoresist on a first conductive layer is patterned to obtain a first pattern. Metal is filled into the first pattern to form a first metal layer, and the first photoresist is removed. A second photoresist is formed on a substrate and patterned to form a second pattern and a third pattern. Metal is filled into the second pattern and the third pattern to form a second metal layer and a third metal layer. The second photoresist is then removed. The second metal layer is a metal cylinder. The third metal layer includes a metal cylinder and two wing-shaped shielding portions located on opposite sides of the metal cylinder. A third photoresist is formed on the substrate and patterned. A fourth pattern is formed on the second and third metal layers. Metal is filled into the fourth pattern to form a fourth metal layer. The third photoresist is then removed. A fourth photoresist is formed on the substrate and patterned to form a fifth pattern. Metal is filled into the fifth pattern to form a second conductive layer, and then the fourth photoresist is removed. The signal terminal conductive via, from bottom to top, includes a first conductive layer, a first metal layer, a second metal layer, a fourth metal layer, and a second conductive layer; the ground terminal conductive via, from bottom to top, includes a first conductive layer, a first metal layer, a third metal layer, a fourth metal layer, and a second conductive layer.

[0015] Furthermore, filling the space between the signal-end conductive via and the ground-end conductive via with a composite material to form a composite substrate includes: A casting machine with partitioned baffles is used to sequentially fill composite materials into the corresponding functional zones according to the design, wherein: A baffle is fixed at the boundary of the first functional area away from the second functional area. The composite material slurry is injected into the first functional area and coated by a scraper at a preset height to form a uniform wet film. Move the baffle to the boundary of the second functional area away from the third functional area, inject the composite material slurry into the second functional area, and coat it with a scraper at a preset height at a uniform speed to form a uniform wet film. Move the baffle to the boundary of the third functional area away from the fourth functional area, inject the composite material slurry into the third functional area, and coat it with a scraper at a preset height at a uniform speed to form a uniform wet film. By analogy, the composite material filling of all functional areas is completed. After the casting is completed, the wet film is kept still to allow the slurry of adjacent functional areas to fuse and form a transition zone of 50μm~100μm. Then, it is cured in a vacuum oven.

[0016] The present invention has at least the following beneficial effects: The composite substrate of the anisotropic adapter plate of the present invention, which takes into account both thermoelectric and electrical properties, is anisotropic as a whole. According to actual needs, multiple functional areas with different physical properties such as thermal conductivity, coefficient of thermal expansion, dielectric constant and Young's modulus are set. Different chips, input and output channels can be set on different functional areas of the composite substrate to achieve high-density integration. Compared with traditional silicon-based, glass-based, and ordinary polymer-based adapter plates, the anisotropic adapter plate of this invention achieves effective integration of various materials with large differences in physical properties through a unique composite substrate design, avoiding the performance degradation problem caused by material incompatibility; the composite substrate has transition zones between different functional areas, which can reduce stress concentration caused by differences in material properties and ensure the structural stability of the substrate under different working conditions. The composite substrate of this invention is made of a polymer matrix composite material doped with reinforcing fibers or fillers (reinforcing phases), which performs excellently in ensuring good electrical connection performance. On the one hand, the composite material can effectively reduce contact resistance and reduce energy loss during signal transmission; on the other hand, it significantly improves connection stability, enabling the adapter board to maintain a reliable connection with external components even in complex working environments and during long-term use, greatly enhancing the stability and reliability of the entire electronic system and providing strong support for the high-performance operation of related equipment. The present invention provides signal-end conductive vias and ground-end conductive vias in a composite substrate. Each signal-end conductive via is surrounded by multiple ground-end conductive vias. The ground-end conductive vias are irregularly shaped vias, which increase the volume compared to cylindrical vias, further improving the electromagnetic shielding capability and weakening the signal coupling between adjacent signal-end vias. At the same time, the ground-end conductive vias improve the equivalent thermal conductivity of the adapter plate, and the multiple adjacent ground-end vias form an "interlocking" structure, effectively reducing the thermal expansion coefficient of the adapter plate and improving the Young's modulus of the adapter plate, so that the adapter plate can achieve the effect of simultaneously taking into account thermoelectric performance. The method for preparing the anisotropic adapter plate of the present invention enhances the interfacial properties of the composite material without increasing the process cost and difficulty, improves the uneven stress distribution of the composite material substrate, and effectively improves the strength and thermal properties of the adapter plate, thereby expanding the application range of the adapter plate. This invention prepares conductive vias for signal terminals and ground terminals using an electroplating process. The resulting conductive vias have a high aspect ratio, which is superior to processes such as isotropic wet etching. Attached Figure Description

[0017] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the embodiments of the invention will be presented with reference to the accompanying drawings. It is to be understood that these drawings depict only typical embodiments of the invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by identical or similar reference numerals for clarity.

[0018] Figure 1 A top view schematic diagram of the composite substrate of an anisotropic adapter plate according to an embodiment of the present invention is shown.

[0019] Figure 2 A partial top view of an anisotropic adapter plate according to an embodiment of the present invention is shown.

[0020] Figure 3 A cross-sectional structural schematic diagram of an anisotropic adapter plate according to an embodiment of the present invention is shown.

[0021] Figure 4A schematic cross-sectional structure of a signal terminal conductive via is shown according to an embodiment of the present invention.

[0022] Figure 5 A schematic cross-sectional structure of a grounding terminal conductive via is shown according to an embodiment of the present invention.

[0023] Figure 6 A schematic cross-section of a grounding conductive via is shown according to an embodiment of the present invention.

[0024] Figure 7 A schematic cross-section of a grounding conductive via is shown according to another embodiment of the present invention.

[0025] Figure 8 A cross-sectional schematic diagram of the process for fabricating an anisotropic adapter plate that combines thermoelectric properties according to an embodiment of the present invention is shown. Detailed Implementation

[0026] It should be noted that the components in the accompanying drawings may be shown exaggerated for illustrative purposes and may not be to scale.

[0027] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0028] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0029] It should also be noted that, in the embodiments of the present invention, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, the required parts or components can be added as needed for specific scenarios.

[0030] It should also be noted that within the scope of this invention, the terms "same", "equal", and "equal to" do not mean that the two values ​​are absolutely equal, but allow for a certain reasonable error. In other words, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0031] It should also be noted that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not explicitly or implicitly suggest that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] Furthermore, the embodiments of the present invention describe the process steps in a specific order. However, this is only for the convenience of distinguishing each step, and is not a limitation on the order of each step. In different embodiments of the present invention, the order of each step can be adjusted according to the process.

[0033] Figure 1 A top view schematic diagram of the composite substrate of an anisotropic adapter plate according to an embodiment of the present invention is shown. Figure 2 A partial top view of an anisotropic adapter plate according to an embodiment of the present invention is shown. Figure 3 A cross-sectional structural schematic diagram of an anisotropic adapter plate according to an embodiment of the present invention is shown. Figure 4 A schematic cross-sectional structure of a signal terminal conductive via is shown according to an embodiment of the present invention. Figure 5 A schematic cross-sectional structure of a grounding terminal conductive via is shown according to an embodiment of the present invention. Figure 6 A schematic cross-section of a grounding conductive via is shown according to an embodiment of the present invention. Figure 7 A schematic cross-section of a grounding conductive via is shown according to another embodiment of the present invention.

[0034] like Figure 1 and 2 As shown, an anisotropic adapter plate that takes into account both thermoelectric and electrical properties includes a composite substrate 1, a grounding conductive via 2, and a signal conductive via 3.

[0035] like Figure 1 As shown, the composite substrate 1 includes multiple functional regions and transition regions (not shown) located between the functional regions. The width of the transition regions is 50 μm to 100 μm. Figure 1 In the middle, for ease of understanding, the functional areas are separated by dotted lines.

[0036] The composite substrate 1 comprises a matrix and a reinforcing phase incorporated into the matrix, wherein the matrix comprises multiple horizontally distributed functional regions and transition regions between the functional regions, the matrix material of each functional region may be the same or different, and the amount and / or type of reinforcing phase incorporated into each functional region is different.

[0037] In one embodiment, the matrix material is polyimide, polydimethylsiloxane (PDMS), SU-8 negative photoresist, polytetrafluoroethylene, epoxy resin, or perfluoroalkoxyalkane.

[0038] In one embodiment, the reinforcing phase is a 0-dimensional to 2-dimensional nanomaterial, including at least one of silicon carbide whiskers, diamond particles, or alumina particles.

[0039] The composite substrate 1 is formed by combining multiple materials through a specific doping process, so that the composite substrate 1 as a whole exhibits anisotropy and forms multiple functional regions with different physical properties such as thermal conductivity, coefficient of thermal expansion, dielectric constant and Young's modulus.

[0040] In one embodiment, the number of functional areas is generally 3 to 10, which can be increased or decreased according to actual functional requirements, and the shape of the functional areas can also be changed according to different requirements.

[0041] The main components of the composite substrate are polyimide, polydimethylsiloxane (PDMS), SU-8 negative photoresist, polytetrafluoroethylene, epoxy resin, or perfluoroalkoxyalkane, with a mass fraction of 60–95 wt.%. The mass fraction of the reinforcing phase is 5–40 wt.%. The content of the reinforcing phase varies gradually among different functional regions.

[0042] Different chips, input and output channels can be set on different functional areas of the composite substrate 1. Different functional areas need to ensure that the corresponding chips operate normally under different signal transmission frequencies and heat generation conditions.

[0043] In one embodiment, the functional areas are formed by casting and curing different composite materials. A composite material slurry is coated in multiple divided areas to form a uniform wet film. The wet film is kept still to allow the composite material slurries of adjacent functional areas to fuse, forming a transition zone of 50μm to 100μm, which is then cured using a vacuum oven.

[0044] This transition region ensures that the composition of the doped material changes gradually between adjacent functional regions, resulting in a smooth transition of material properties and reducing stress concentration caused by abrupt changes in composition.

[0045] In another embodiment, the transition region is made of a flexible material, such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyurethane (PU), silicone, etc.

[0046] In one embodiment, such as Figure 2As shown, each signal terminal conductive via 3 is surrounded by multiple ground terminal conductive vias 2, and adjacent ground terminal conductive vias 2 do not contact each other. The cross-sectional area of ​​the ground terminal conductive via 2 is larger than the cross-sectional area of ​​the signal terminal conductive via 3. All ground terminal conductive vias 2 are arranged in a mesh structure.

[0047] In one embodiment, such as Figure 3 As shown, the grounding conductive via 2 and the signal conductive via 3 penetrate the composite substrate 1. The signal conductive via 3 is not in contact with the grounding conductive via 2. The grounding conductive via 2 and the signal conductive via 3 are made of metal. The depth of the grounding conductive via 2 and the signal conductive via 3 is ≥5μm.

[0048] In one embodiment, such as Figure 4 As shown, the signal terminal conductive via 3 includes a metal pillar body 31 and a first conductive layer 32 and a second conductive layer 33 located at both ends of the metal pillar body 31. At least one surface of the first conductive layer 32 and the second conductive layer 33 exposes the composite substrate. The lateral dimensions of the first conductive layer 32 and the second conductive layer 33 are larger than the lateral dimensions of the metal pillar body 31.

[0049] In one embodiment, the cross-sectional shape of the grounding conductive via is X-shaped, Y-shaped, or ¥-shaped.

[0050] In one embodiment, such as Figure 5 As shown, the grounding terminal conductive via 2 includes a cylindrical portion 21, an airfoil shielding portion 22, a first conductive layer 32, and a second conductive layer 33.

[0051] Two airfoil-shaped shielding parts 22 are located on opposite sides of the cylindrical part 21. The height of the cylindrical part 21 is greater than the height of the airfoil-shaped shielding parts 22.

[0052] like Figure 6 As shown, at least one wing-shaped shield 22 includes a first wing-shaped portion 221 and a second wing-shaped portion 222, and the roots of the first wing-shaped portion 221 and the second wing-shaped portion 222 are connected, while the tops are separated.

[0053] In one embodiment, the first and second sides of the wing-shaped shield 22 are arc-shaped surfaces, and the curvature directions of the first and second sides are opposite. In another embodiment, the first and second sides of the wing-shaped shield 22 are planar surfaces.

[0054] In one embodiment, the first wing portion and the second wing portion may have the same or different lengths.

[0055] In one embodiment, the first conductive layer 32 and the second conductive layer 33 are located at opposite ends of the cylindrical portion 21, and at least one surface exposes the composite substrate. The lateral dimensions of the first conductive layer 32 and the second conductive layer 33 are larger than the lateral dimensions of the cylindrical portion 21.

[0056] The size of the grounding conductive via varies according to the radius of the cylindrical part and the spacing between the grounding vias, while ensuring that electrical continuity does not occur between the signal conductive via and the grounding conductive via. For example... Figure 7 As shown, the length of the grounding conductive via is L, the top width of the first and second wing-shaped portions is w, the radius of the cylindrical portion is r, and the spacing between adjacent grounding conductive vias is p. Then: , .

[0057] Compared to traditional cylindrical through-holes, the grounding conductive through-hole is an irregularly shaped through-hole, increasing its volume and further improving electromagnetic shielding capabilities while weakening signal coupling between adjacent signal conductive through-holes. Simultaneously, it improves the equivalent thermal conductivity of the adapter plate and can form an "interlocking" structure with adjacent grounding through-holes, effectively reducing the thermal expansion coefficient of the adapter plate and increasing its Young's modulus, thus achieving a balance between thermoelectric and electromechanical performance.

[0058] The anisotropic adapter plate, which takes into account both thermoelectric and electrical properties, also includes a redistribution layer (not shown) located on the surface of the composite substrate 1 and electrically connected to the grounding conductive via 2 and the signal conductive via 3. The redistribution layer includes metal wiring and an insulating substrate, with the insulating substrate filling the gaps between the metal wiring. The insulating substrate is made of polyimide, silicon dioxide, or BCB.

[0059] The thickness of the anisotropic adapter plate can be adjusted from 10μm to 2000μm according to actual application requirements, and the area of ​​the anisotropic adapter plate can be ≥5 mm² according to actual application requirements. 2 Adjustments will be made within the specified range.

[0060] Figure 8 A cross-sectional schematic diagram of the process for fabricating an anisotropic adapter plate that combines thermoelectric properties according to an embodiment of the present invention is shown.

[0061] like Figure 8 As shown, a method for fabricating an anisotropic adapter plate that combines thermoelectric and electromechanical properties includes the following steps: Step 1: A first conductive layer 32 is formed on the substrate 101. The first conductive layer 32 is a conductive seed layer.

[0062] Step 2: Form photoresist on substrate 101, pattern the photoresist to form multiple patterns, fill the patterns with metal, remove the photoresist, repeat multiple times to form multiple signal terminal conductive vias and multiple ground terminal conductive vias. The photoresist is a positive photoresist.

[0063] In one embodiment, metal filling is achieved through an electroplating process.

[0064] Specifically as follows: A first photoresist 201 is formed on a substrate 101, and the first photoresist 201 on a first conductive layer 32 is patterned to obtain a first pattern. Metal is filled into the first pattern to form a first metal layer 102, and the first photoresist is removed.

[0065] A second photoresist 202 is formed on the substrate 101 and patterned to form a second pattern and a third pattern. Metal is filled into the second and third patterns to form a second metal layer 103 and a third metal layer 104. The second photoresist is then removed. The second metal layer 103 is a metal cylinder. The third metal layer 104 includes a metal cylinder and two wing-shaped shielding portions 22 located on opposite sides of the metal cylinder. The lateral dimension of the metal cylinder is the same as the lateral dimension of the first metal layer 102.

[0066] A third photoresist 203 is formed on the substrate 101 and patterned. A fourth pattern is formed on the second metal layer 103 and the third metal layer 104. Metal is filled into the fourth pattern to form a fourth metal layer. The third photoresist is then removed.

[0067] A fourth photoresist 204 is formed on the substrate 101 and patterned to form a fifth pattern. Metal is filled into the fifth pattern to form a second conductive layer 33. The fourth photoresist is then removed. The second conductive layer is located above the fourth metal layer.

[0068] The signal terminal conductive via, from bottom to top, includes a first conductive layer 32, a first metal layer 102, a second metal layer 103, a fourth metal layer 105, and a second conductive layer 33; the ground terminal conductive via, from bottom to top, includes a first conductive layer 32, a first metal layer 102, a third metal layer 104, a fourth metal layer 105, and a second conductive layer 33.

[0069] The first metal layer 102, the second metal layer 103, and the fourth metal layer 105 constitute the main body of the metal pillar. The metal cylinders of the first metal layer 102 and the third metal layer 104, and the fourth metal layer 105 constitute the cylindrical part of the grounding terminal conductive via.

[0070] The conductive vias for the signal terminals and the conductive vias for the ground terminals have been described in detail above and will not be repeated here.

[0071] Step 3: Fill the space between the conductive via at the signal end and the conductive via at the ground end with a composite material to form a composite substrate 1.

[0072] The casting machine, equipped with partitioned baffles, sequentially fills the corresponding functional zones with composite materials according to the design. The mold size of the casting machine is customized according to the finished product specifications, and the baffles can be manually adjusted for positioning to ensure precise partition boundaries.

[0073] A baffle is fixed at the boundary of the first functional area away from the second functional area. The composite material slurry is injected into the first functional area and coated by a scraper at a preset height to form a uniform wet film. Move the baffle to the boundary of the second functional area away from the third functional area, inject the composite material slurry into the second functional area, and coat it with a scraper at a preset height at a uniform speed to form a uniform wet film. Move the baffle to the boundary of the third functional area away from the fourth functional area, inject the composite material slurry into the third functional area, and coat it with a scraper at a preset height at a uniform speed to form a uniform wet film. By analogy, the composite material filling of all functional areas is completed. After the casting is completed, the wet film is kept still to allow the slurry of adjacent functional areas to fuse and form a transition zone of 50μm~100μm. Then, it is cured in a vacuum oven.

[0074] Composite materials have been described in detail above and will not be repeated here.

[0075] Optionally, in step 4, a redistribution layer is formed on the composite substrate. The redistribution layer includes metallic wiring and an insulating substrate, with the insulating substrate filling the gaps between the metallic wiring. The metallic wiring is electrically connected to grounding vias and signal vias.

[0076] Step 5, remove substrate 101.

[0077] While some embodiments of the present invention have been described in this application, those skilled in the art will understand that these embodiments are merely illustrative. Numerous variations, alternatives, and improvements will arise in those skilled in the art under the teachings of this invention without departing from its scope. The appended claims are intended to define the scope of the invention and thereby cover methods and structures within the scope of the claims themselves and their equivalents.

Claims

1. An anisotropic adapter plate that combines thermoelectric and electromechanical properties, characterized in that, include: A composite substrate, comprising multiple functional zones and transition zones between the functional zones, with each functional zone made of a different material; Multiple signal-end conductive vias penetrate the composite substrate and are configured for signal transmission; Multiple grounding conductive vias penetrate the composite substrate, and each signal conductive via is surrounded by multiple grounding conductive vias, with adjacent grounding conductive vias not in contact; the cross-sectional area of ​​the grounding conductive vias is larger than the cross-sectional area of ​​the signal conductive vias.

2. The anisotropic adapter plate that combines thermoelectric and electrical properties according to claim 1, characterized in that, The composite substrate comprises a matrix and a reinforcing phase incorporated into the matrix, wherein the matrix comprises multiple horizontally distributed functional regions and transition regions between the functional regions, the matrix material of each functional region may be the same or different, and the amount and / or type of reinforcing phase incorporated into each functional region is different.

3. The anisotropic adapter plate that combines thermoelectric and electrical properties according to claim 2, characterized in that, The matrix material is polyimide, polydimethylsiloxane (PDMS), SU-8 negative photoresist, polytetrafluoroethylene, epoxy resin, or perfluoroalkoxyalkane; and / or The reinforcing phase is a 0-dimensional to 2-dimensional nanomaterial, including at least one of silicon carbide whiskers, diamond particles, and alumina particles; and / or The transition zone is made of a flexible material; or the transition zone is formed by fusing the materials of two adjacent functional zones.

4. The anisotropic adapter plate that combines thermoelectric and electrical properties according to claim 1, characterized in that, The cross-sectional shape of the conductive via at the grounding end is X-shaped, Y-shaped, or ¥-shaped; All grounding conductive vias are arranged in a mesh structure.

5. The anisotropic adapter plate that combines thermoelectric and electrical properties according to claim 1, characterized in that, The grounding terminal conductive via includes at least a cylindrical portion and two wing-shaped shielding portions located on opposite sides of the cylindrical portion, wherein: The height of the cylindrical portion is greater than the height of the airfoil shielding portion; At least one of the wing-shaped shielding portions includes a first wing-shaped portion and a second wing-shaped portion, wherein the roots of the first wing-shaped portion and the second wing-shaped portion are connected and the tops are separated; The first and second sides of the wing-shaped shield are arc-shaped surfaces, and the bending directions of the first and second sides are opposite; or the first and second sides of the wing-shaped shield are planar surfaces. The lengths of the first wing portion and the second wing portion may be the same or different.

6. The anisotropic adapter plate that combines thermoelectric and electrical properties according to claim 5, characterized in that, The length of the grounding conductive via is L, the top width of the first wing-shaped portion and the second wing-shaped portion is w, the radius of the cylindrical portion is r, and the spacing between adjacent grounding conductive vias is p. Then: ， 。 7. The anisotropic adapter plate that combines thermoelectric and electrical properties according to claim 1, characterized in that, Also includes: A redistribution layer is located on the surface of the composite substrate and is electrically connected to grounding conductive vias and signal conductive vias. The redistribution layer includes metal wiring and an insulating substrate, with the insulating substrate filling the gaps between the metal wiring.

8. A method for preparing an anisotropic transition plate that takes into account both thermoelectric and electromechanical properties, characterized in that, include: A first conductive layer is formed on the substrate; A photoresist is formed on a substrate, patterned, and multiple patterns are formed. Metal is filled into the patterns, the photoresist is removed, and this process is repeated multiple times to form multiple signal terminal conductive vias and multiple ground terminal conductive vias. Each signal terminal conductive via is surrounded by multiple signal terminal conductive vias, and adjacent ground terminal conductive vias do not contact each other. The cross-sectional area of ​​the ground terminal conductive via is larger than the cross-sectional area of ​​the signal terminal conductive via. A composite material is filled between a signal-end conductive via and a ground-end conductive via to form a composite substrate; the composite material comprises a matrix material and a doped reinforcing phase; the composite substrate includes multiple functional regions and transition regions located between the functional regions.

9. The method for preparing the anisotropic transition plate that combines thermoelectric and electromechanical properties according to claim 8, characterized in that, A photoresist is formed on a substrate, patterned, and multiple patterns are created. Metal is then filled into the patterns, the photoresist is removed, and this process is repeated multiple times to form multiple signal terminal conductive vias and multiple ground terminal conductive vias, including: A first photoresist is formed on a substrate, and the first photoresist on a first conductive layer is patterned to obtain a first pattern. Metal is filled into the first pattern to form a first metal layer, and the first photoresist is removed. A second photoresist is formed on a substrate and patterned to form a second pattern and a third pattern. Metal is filled into the second pattern and the third pattern to form a second metal layer and a third metal layer. The second photoresist is then removed. The second metal layer is a metal cylinder. The third metal layer includes a metal cylinder and two wing-shaped shielding portions located on opposite sides of the metal cylinder. A third photoresist is formed on the substrate and patterned. A fourth pattern is formed on the second and third metal layers. Metal is filled into the fourth pattern to form a fourth metal layer. The third photoresist is then removed. A fourth photoresist is formed on the substrate and patterned to form a fifth pattern. Metal is filled into the fifth pattern to form a second conductive layer, and then the fourth photoresist is removed. The signal terminal conductive via, from bottom to top, includes a first conductive layer, a first metal layer, a second metal layer, a fourth metal layer, and a second conductive layer; the ground terminal conductive via, from bottom to top, includes a first conductive layer, a first metal layer, a third metal layer, a fourth metal layer, and a second conductive layer.

10. The method for preparing the anisotropic transition plate that combines thermoelectric and electromechanical properties according to claim 8, characterized in that, A composite substrate is formed by filling the space between the signal terminal conductive via and the ground terminal conductive via with a composite material, including: A casting machine with partitioned baffles is used to sequentially fill composite materials into the corresponding functional zones according to the design, wherein: A baffle is fixed at the boundary of the first functional area away from the second functional area. The composite material slurry is injected into the first functional area and coated by a scraper at a preset height to form a uniform wet film. Move the baffle to the boundary of the second functional area away from the third functional area, inject the composite material slurry into the second functional area, and coat it with a scraper at a preset height at a uniform speed to form a uniform wet film. Move the baffle to the boundary of the third functional area away from the fourth functional area, inject the composite material slurry into the third functional area, and coat it with a scraper at a preset height at a uniform speed to form a uniform wet film. By analogy, the composite material filling of all functional areas is completed. After the casting is completed, the wet film is kept still to allow the slurry of adjacent functional areas to fuse and form a transition zone of 50μm~100μm. Then, it is cured in a vacuum oven.

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