A eutectic machine equipped with a carrier plate conveying device

Abstract

The present application relates to the field of semiconductor packaging, in particular to a eutectic machine with a carrier plate conveying device, comprising a workbench, two carrier plate conveying devices for driving the carrier plate to convey along the X-axis direction are arranged on the workbench in the left and right directions at intervals along the X-axis direction; a chip feeding device is located at the rear side of the carrier plate conveying device along the Y-axis direction; a eutectic mold group is arranged between the carrier plate conveying device and the chip feeding device; a first pickup mold group that can move along the Y-axis direction is arranged on the right side of the workbench, and a second pickup mold group that can move along the Y-axis direction is arranged on the left side of the workbench; the chip mold group (carrier plate) picked up by the second pickup mold group is sequentially placed at the eutectic mold group; the chip mold group (chip) in the eutectic mold group that is completed after eutectic is sequentially moved to the carrier plate of the carrier plate conveying device by the first pickup mold group; in this way, an efficient and smooth discharge flow path is constructed, and the sequential and undamaged removal of the chip mold group after eutectic is realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging, and in particular to a eutectic machine equipped with a carrier plate conveying device. Background Technology

[0002] Eutectic bonding machines are core pieces of equipment in semiconductor back-end packaging processes. Their core working principle involves using high-precision motion actuators to precisely pick up the chip and stably and accurately bond it to the substrate, completing the eutectic bonding process. The positioning accuracy, bonding consistency, and operational efficiency of this equipment directly determine the yield, dimensional accuracy, and overall production efficiency of the semiconductor packaged products. It is a crucial component for ensuring semiconductor product quality and maintaining stable operation of the packaging process, thus occupying an indispensable position in the semiconductor back-end packaging manufacturing supply chain.

[0003] In the existing eutectic bonding process, after the chip and substrate are eutectic bonded, the pick-up module transfers the eutectic chip module from the eutectic stage to a collection box for temporary storage, and then transports it to a transfer machine, where the transfer machine sequentially removes the eutectic chip modules one by one. During this material handling process, the eutectic chip modules are prone to collisions, friction, and impacts while being stacked in the collection box and transferred within the transfer machine, causing damage to the chip module's appearance, affecting the yield rate, and increasing the sorting and re-inspection costs of subsequent processes, thus hindering the improvement of the overall efficiency of the packaging production line.

[0004] Therefore, how to achieve a rational layout of the functional modules of the eutectic machine, construct an efficient and smooth material flow path, and realize the orderly and damage-free removal of the chip modules after eutectic bonding has become a key technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The technical problem to be solved by this invention is: how to achieve a rational layout of each functional module of the eutectic machine, construct an efficient and smooth material output flow path, and realize the orderly and damage-free removal of chip module products after eutectic bonding.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: This invention relates to a eutectic reactor equipped with a carrier plate conveying device, comprising a worktable, on which two carrier plate conveying devices are arranged at intervals along the X-axis for conveying carrier plates along the X-axis; a chip loading device located behind the carrier plate conveying devices in the Y-axis direction; and a eutectic module disposed between the carrier plate conveying devices and the chip loading device; a first picking module movable along the Y-axis is disposed on the right side of the worktable, and a second picking module movable along the Y-axis is disposed on the left side; the second picking module picks up the chip modules (carrier plates) from the carrier plates and places them orderly at the eutectic module; the first picking module picks up the chip modules (chips) that have completed eutectic bonding within the eutectic module and sequentially transfers them to the carrier plates of the carrier plate conveying device.

[0007] Furthermore, the carrier plate conveying device includes a pressure bar for pressing the carrier plate, and the top surface of the carrier plate is provided with a mounting groove for placing the fishbone clamp. After the first picking module picks up the eutectic, the chip module is placed on the fishbone clamp, and the chip module is pressed into the fishbone clamp by a locking screw fixed to one side of the first picking module.

[0008] Furthermore, the carrier plate conveying device includes a fixed base, which is fixed on the worktable, and a sliding base that is slidably disposed on the fixed base along the X direction, and a support platform is disposed on the sliding base; The support platform is provided with pressure frame plates on both outer sides in the Y direction. The pressure frame plates are mounted on the sliding seat through a lifting module. The inner side of the pressure frame plates is provided with a rotatable conveying assembly. The Y-shaped sides of the carrier plate are supported on the conveyor belt of the conveying assembly. The top of the pressure frame plate is provided with pressure strips spaced apart along the X direction. When the pressure frame plate is lowered to the low position by the lifting module, the pressure strips press the carrier plate onto the support platform.

[0009] Furthermore, the conveying assembly includes: a drive shaft connecting the two pressure frame plates, a plurality of transmission wheels disposed on the inner sidewalls of the corresponding pressure frame plates, and a conveyor belt tensioned between the drive shaft and the plurality of transmission wheels, wherein the horizontal top surface of the conveyor belt constitutes the working surface for conveying the carrier plate.

[0010] Furthermore, a guide rod is fixed on the pressure frame plate, and a guide sleeve is provided on the sliding seat; the lower end of the guide rod is inserted into the guide sleeve to form a linear guide between the pressure frame plate and the sliding seat.

[0011] Furthermore, the inner side of the pressure plate is provided with a support strip along the X-axis direction. When the carrier plate is pressed down by the pressure strip, the carrier plate and the conveyor belt are pressed together on the support strip.

[0012] Furthermore, one of the pressure frame plates has multiple receiving cavities along the X-axis direction on its inner side, and each receiving cavity contains a spring piece; one end of the spring piece is fixedly connected to the bottom of the receiving cavity, and the other end is provided with a connecting clamping block, and a retaining wheel is connected to the connecting clamping block. Under the action of the spring piece, the retaining wheel tends to partially protrude from the receiving cavity, causing the carrier plate to abut against the inner side of the other pressure frame plate along the Y-axis direction.

[0013] Furthermore, the lifting module includes: two support seats disposed on the sliding seat, a drive shaft rotatably disposed on the two support seats, a rotating cam disposed on the drive shaft, and the rotating cam abutting against the bottom edge of the corresponding pressure frame plate.

[0014] Furthermore, the support base and the corresponding pressure frame plate are connected by a tension spring.

[0015] Furthermore, brackets are provided on both the left and right sides of the sliding seat in the X direction, and photoelectric sensors are provided on the brackets.

[0016] Furthermore, a lifting cylinder is provided on the support in front of the conveying component in the conveying direction, and a baffle is provided at the output end of the lifting cylinder.

[0017] The beneficial effects of this invention are as follows: This invention is a eutectic machine equipped with a carrier plate conveying device. The chip module (substrate) on the carrier plate of the left conveying device is accurately transferred to the eutectic module through the second pick-up module. After eutecticization is completed, the eutectic chip module is sequentially transferred to the carrier plate of the right conveying device through the first pick-up module. The conveying device then sequentially removes the carrier plate along with the eutectic chip module, constructing an efficient and smooth material flow path and realizing the orderly and damage-free removal of the chip module after eutecticization. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is the layout diagram of the eutectic generator; Figure 2 This is a structural schematic diagram of this embodiment; Figure 3 This is a structural schematic diagram from another perspective of this embodiment; Figure 4 This is a cross-sectional view of this embodiment; Figure 5 This is a schematic diagram of the pressure frame plate structure; Figure 6 This is a schematic diagram of a pressure frame plate with supporting wheels; Figure 7 This is a schematic diagram of a retaining wheel structure with spring clips; Figure 8This is a schematic diagram of one side of the sliding seat structure; Figure 9 This is a schematic diagram of the structure on the other side of the sliding seat; Figure 10 It is a conveyor device with fishbone clamps; Figure 11 It is the first pickup module with locking batch; In the diagram: 100-Fixed seat, 03-Carrier plate, 03-1-Mounting groove, 1-Conveying device, 1-1-Sliding seat, 1-2-Support platform, 1-3-Pressure frame plate, 1-31-Guide rod, 1-32-Guide sleeve, 1-33-Support bar, 1-34-Accommodation cavity, 1-35-Spring piece, 1-36-Connecting clamp block, 1-37-Holding wheel, 1-4-Lifting module, 1-41-Support seat, 1-42-Drive shaft, 1-43-Rotating cam Wheel, 1-5-Conveying assembly, 1-51-Conveying belt, 1-52-Drive shaft, 1-53-Transmission wheel, 1-6-Pressure bar, 1-7-Tension spring, 1-81-Bracket, 1-82-Photoelectric sensor, 1-83-Lifting cylinder, 1-84-Baffle plate, 1-9-Fishbone clamp, 2-Eutectic module, 3-Third pickup module, 4-Second pickup module, 5-First pickup module, 5-1-Locking batcher, 6-Workbench, 7-Chip feeding device. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0021] See Figure 1 This embodiment is a eutectic machine equipped with a carrier plate conveying device, including a worktable 6. Two carrier plate conveying devices 1 are arranged on the worktable 6 at intervals along the X-axis direction to drive the carrier plate 03 to be conveyed along the X-axis direction. A chip loading device 7 is located behind the carrier plate conveying device 1 in the Y-axis direction. A eutectic module 2 is set between the carrier plate conveying device 1 and the chip loading device 7. A first picking module 5 and a third picking module 3 that can move along the Y-axis direction are respectively arranged on the right side of the worktable 6 along the front and back directions of the Y-axis. A second picking module 4 that can move along the Y-axis direction is arranged on the left side of the worktable 6. The third picking module 3 picks up the chip module (chip) on the chip loading device 7 and transfers it to the eutectic module 2. The second picking module 4 picks up the chip module (substrate) on the carrier plate of the left carrier plate conveying device 1 and accurately transfers it to the eutectic module 2 to participate in eutectic. After eutectic is completed, the first picking module 5 picks up the chip module after eutectic is completed and transfers it in an orderly manner to the carrier plate 03 of the right carrier plate conveying device 1. Compared to conventional eutectic machines, the eutectic machine in this embodiment adds a first pick-up module 5 and two conveying devices 1, so that the substrate can be accurately transferred from the carrier plate to the eutectic module 2; and the chip module after eutectic is completed can be transferred to the carrier plate in an orderly manner, instead of being transported to the collection box. This creates an efficient and smooth material flow path, realizing the orderly and damage-free removal of chip products after eutectic is completed. It should also be noted that, in addition to being picked up and discharged onto the carrier board 03, the eutectic-completed chip modules can also be picked up into a collection box outside the workbench 6 or picked up again onto the chip loading device 7.

[0022] As known from existing technology, the transport device is one of the core actuators in the semiconductor packaging process. It is primarily responsible for carrying the carrier substrate and completing its linear motion, working in conjunction with other equipment to complete chip bonding. In actual production operations, the moment the carrier substrate is placed on the transport device, it is easily affected by multiple factors, including human placement errors, equipment assembly gaps, carrier substrate processing tolerances, and vibrations from the transport mechanism. This can easily lead to positional misalignment and alignment deviations between the carrier substrate and the transport device. Such positional deviations cannot be corrected automatically, directly causing subsequent chip bonding misalignment, significantly reducing packaging accuracy, and resulting in a decrease in product yield.

[0023] See Figure 2-9 In this embodiment, the carrier plate conveying device 1 solves the above-mentioned problems. Specifically, it includes a sliding seat 1-1, which is slidably mounted on a fixed seat 100 along the X-axis direction via a linear motor module. The fixed seat 100 is fixed on the worktable 6. A support platform 1-2 for supporting the carrier plate 03 is fixed on the sliding seat 1-1. Pressure frame plates 1-3 are provided on the outer sides of the support platform 1-2 in the Y direction, that is, pressure frame plates 1-3 are provided in the front and rear directions of the support platform 1-2 respectively. The pressure frame plates 1-3 are mounted on the sliding seat 1-1 via a lifting module 1-4. A rotatable conveying assembly 1-5 is provided on the inner side of the pressure frame plates 1-3. The two sides of the carrier plate 03 are supported on the conveyor belt 1-51 of the conveying assembly 1-5. Multiple pressure strips 1-6 are spaced apart on the top of the pressure frame plates 1-3 along the X direction. When the pressure frame plates 1-3 are lowered to a low position by the lifting module 1-4, the pressure strips 1-6 press the carrier plate 03 onto the support platform 1-2. In this embodiment, when the left conveying device 1 is in the left extreme position, the pressure frame plate 1-3 and the pressure strip 1-6 rise to the high position under the drive of the lifting module 1-4. At this time, the carrier plate 03 can be pushed horizontally into the conveying device 1 by the feeding mechanism. Then, the pressure frame plate 1-3 and the pressure strip 1-6 fall to the low position under the drive of the lifting module 1-4. The pressure strip 1-6 presses the carrier plate 03 onto the support platform 1-2. During the process of the conveying device 1 moving from left to right under the drive of the linear motor module, the second picking module 4 accurately picks up the chip module (substrate) on the carrier plate 03 and transports it to the eutectic module 2. When the left conveying device 1 is in the right position and the right conveying device 1 is in the left position, the two are in a docking state, and the carrier plate can be moved from the left conveying device 1 to the right conveying device 1. The right-side conveying device 1 moves from left to right. After the eutectic process is completed, the chip modules are picked up and adsorbed by the first picking module 5 and transferred to the carrier plate 03. When the right-side conveying device is at the right limit position, the pressure frame plate 1-3 and the pressure strip 1-6 rise to the high position. At this time, the carrier plate 03 is not pressed by the pressure strip 1-6. The conveyor belt 1-51 of the conveying assembly 1-5 rotates and removes the carrier plate 03 from the conveying device 1.

[0024] In other words, the linear motor module drives the conveyor device 1 to perform high-precision overall lateral movement; the rotation of the conveyor belt 1-51 in the conveyor assembly 1-5 on the conveyor device 1 can horizontally input or horizontally output the carrier plate 03 from the conveyor device 1; in addition, the lifting pressure plate 1-3 can press the carrier plate 03 onto the support platform 1-2 through the pressure strip 1-6, which can ensure that the carrier plate 03 is stably supported on the conveyor device 1, and ensure that the chip module (substrate) can be stably transferred to the eutectic module 2 and that the eutectic chip module is accurately transferred to the carrier plate 03.

[0025] See Figure 2 In some possible embodiments, the conveying assembly 1-5 includes: a drive shaft 1-52 connecting the two pressure frame plates 1-3, a plurality of transmission wheels 1-53 disposed on the inner sidewall of the corresponding pressure frame plate 1-3, and a conveyor belt 1-51 tensioned between the drive shaft 1-52 and the plurality of transmission wheels 1-53, the horizontal top surface of the conveyor belt 1-51 constituting the working surface of the conveying carrier plate 03. In this embodiment, two conveyor belts 1-51 are connected to the drive shaft 1-52 in the front and rear. The corresponding conveyor belts 1-51 are tensioned on the transmission wheel 1-53 on the inner side of the corresponding pressure plate 1-3. When the drive shaft 1-52 rotates, it drives the conveyor belts 1-51 to rotate in one direction, which can move the carrier plate 03 on the feeding mechanism (not shown in the figure) to the two pressure plates 1-3 of the conveying device 1, or remove it from the pressure plate 1-3 of the conveying device 1.

[0026] See Figure 4In some possible embodiments, a guide rod 1-31 is fixed on the pressure frame plate 1-3, and a guide sleeve 1-32 is provided on the sliding seat 1-1; the lower end of the guide rod 1-31 is inserted into the guide sleeve 1-32 to form a linear guide between the pressure frame plate 1-3 and the sliding seat 1-1. In this embodiment, the guide rod 1-31 and the guide sleeve 1-32 are inserted and connected so that the pressure plate 1-3 can only move up and down relative to the sliding seat 1-1, thus ensuring the accuracy of the up and down movement of the pressure plate 1-3.

[0027] See Figure 4 In some possible embodiments, the inner side of the pressure frame plate 1-3 is provided with a support bar 1-33 along the X-axis direction. When the pressure frame plate 1-3 is lowered to the low position, the side of the carrier plate 03 is pressed onto the support bar 1-33 by the conveyor belt 1-51. In this embodiment, when the pressure plate 1-3 descends to the low position, in addition to the support platform 1-2 supporting the carrier plate 03, the bottom of the carrier plate 03 is supported on the support bar 1-33 by the conveyor belt 1-51, thus providing more stable support for the carrier plate 03; when the pressure plate 1-3 rises to the high position, under the tension of the conveyor belt 1-51, the carrier plate 03 will detach from the support platform 1-2 and the support bar 1-33, making it easier for the subsequent conveyor belt 1-51 to drive the carrier plate 03 for linear transport.

[0028] See Figure 5-6 In some possible embodiments, the pressure frame plate 1-3 has multiple accommodating cavities 1-34 along the X-axis direction (along its length direction), and a spring piece 1-35 is provided in the accommodating cavity 1-34; one end of the spring piece 1-35 is fixedly connected to the bottom of the accommodating cavity 1-34, and the other end is provided with a connecting clamp 1-36. A retaining wheel 1-37 is connected to the connecting clamp 1-36. Under the action of the spring piece 1-35, the retaining wheel 1-37 tends to protrude partially out of the accommodating cavity 1-34. The retaining wheel 1-37 abuts against the side of the carrier plate 03, limiting the carrier plate 03 between the two pressure frame plates 1-3 along the Y-axis direction. In this embodiment, in addition to the pressure strip 1-6 pressing the carrier plate 03 downward, the abutment wheel 1-37 can abut against the side of the carrier plate 03, so that the other side of the carrier plate 03 is tightly attached to another pressure frame plate 1-3. The carrier plate 03 is stably supported between the two pressure frame plates 1-3, which facilitates the accurate transfer of the chip module after eutectic bonding.

[0029] See Figure 2-4 In some possible embodiments, the lifting module 1-4 includes: two support seats 1-41 disposed on the sliding seat 1-1, a drive shaft 1-42 rotatably disposed on the two support seats 1-41, a rotating cam 1-43 disposed on the drive shaft 1-42, and the rotating cam 1-43 abutting against the corresponding pressure frame plate 1-3. In this embodiment, the drive shaft 1-42 drives the two rotating cams 1-43 to rotate synchronously. When the long diameter side of the rotating cam 1-43 abuts against the pressure frame plate 1-3, the pressure frame plate 1-3 is at its upper limit position. When the short diameter side of the rotating cam 1-43 abuts against the pressure frame plate 1-3, the pressure frame plate 1-3 is at its lower limit position, and the pressure strip 1-6 can press the carrier plate 03.

[0030] See Figure 3 In some possible embodiments, the support base 1-41 and the corresponding pressure frame plate 1-3 are connected by a tension spring; In this embodiment, when the pressure frame plate 1-3 and the pressure strip 1-6 rise to the high position under the drive of the lifting module 1-4, the tension spring 1-7 is stretched. Conversely, when the module is driven down to the low position, the tension spring 1-7 is reset. The tension of the tension spring 1-7 presses the pressure strip 1-6 against the carrier plate 03.

[0031] See Figure 7-8 In some possible embodiments, brackets 1-81 are provided on both the left and right sides of the sliding seat 1-1 in the X direction, and photoelectric sensors 1-82 are provided on the brackets 1-81. In this embodiment, when the carrier plate 03 is horizontally pushed into or pushed out of the conveying device under the action of the conveying components 1-5, if both photoelectric sensors 1-82 detect no obstruction, it indicates that the carrier plate 03 has been pushed into the conveying device 1 or the carrier plate 03 has been pushed out of the conveying device 1.

[0032] See Figure 7 In some possible embodiments, a lifting cylinder 1-83 is provided on the support 1-81 on the front side of the conveying assembly 1-5 in the conveying direction, and a baffle plate 1-84 is provided at the output end of the lifting cylinder 1-83. In this embodiment, the output end of the lifting cylinder 1-83 provided on the right side of the sliding seat 1-1 is connected to the baffle plate 1-84. When the baffle plate 1-84 is in a high position, it can abut against the side of the carrier plate 03, which indicates that the carrier plate 03 has been accurately pushed into the conveying device 1.

[0033] See Figure 10 , 11 In some possible embodiments, the top surface of the carrier plate 03 is provided with a mounting groove 03-1 for placing the fishbone clamp 1-9. After the first pickup module 5 completes the eutectic pick-up, the chip module is placed on the fishbone clamp 1-9, and the eutectic chip module is pressed into the fishbone clamp 1-9 by the locking screw 5-1 fixed to one side of the first pickup module 5. In this embodiment, the eutectic chip modules are first picked up by the first pickup module 5 and placed onto the fishbone clamp 1-9. Then, the first pickup module 5 moves in the Y direction and moves the locking plate 5-1 directly above the fishbone clamp 1-9. By moving the locking plate 5-1 down and cooperating with the fishbone clamp 1-9, multiple eutectic chip modules are locked in sequence. It should be noted that the fishbone clamps 1-9 are existing technologies, such as the fishbone clamps in publication number CN218546812U.

[0034] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A eutectic machine equipped with a carrier plate conveying device, characterized in that, Includes a workbench (6), on which two carrier plate conveying devices (1) are arranged at intervals along the X-axis direction for driving the carrier plate (03) to be conveyed along the X-axis direction. The chip loading device (7) is located on the rear side of the carrier board conveying device (1) in the Y-axis direction, and the eutectic module (2) is set between the carrier board conveying device (1) and the chip loading device (7). The workbench (6) is provided with a first picking module (5) that can move along the Y-axis on the right side and a second picking module (4) that can move along the Y-axis on the left side. The second pickup module (4) picks up the chip modules of the carrier board (03) and places them in an orderly manner at the eutectic module (2); the first pickup module (5) picks up the chip modules that have completed eutectic bonding in the eutectic module (2) and transfers them in sequence to the carrier board (03) of the carrier board conveying device (1).

2. The eutectic machine equipped with a carrier plate conveying device according to claim 1, characterized in that, The carrier plate conveying device (1) includes a pressure strip (1-6) for pressing the carrier plate (03). The top surface of the carrier plate (03) is provided with a mounting groove (03-1) for placing the fishbone clamp (1-9). After the first picking module (5) picks up the eutectic, the chip module is placed on the fishbone clamp (1-9), and the eutectic chip module is pressed into the fishbone clamp (1-9) by a locking bit (5-1) fixed to one side of the first picking module (5).

3. The eutectic machine equipped with a carrier plate conveying device according to claim 2, characterized in that, The carrier plate conveying device also includes a fixed seat (100), which is fixed on the worktable (6), and a sliding seat (1-1) is slidably disposed on the fixed seat (100) along the X direction. A support platform (1-2) is disposed on the sliding seat (1-1). The support platform (1-2) has pressure frame plates (1-3) on both sides of the Y direction. The pressure frame plates (1-3) are mounted on the sliding seat (1-1) via the lifting module (1-4). The inner side of the pressure frame plates (1-3) is provided with a rotatable conveying assembly (1-5). The Y sides of the carrier plate (03) are supported on the conveyor belt (1-51) of the conveying assembly (1-5). The pressure strips (1-6) are spaced apart along the X direction on the top of the pressure frame plate (1-3). When the pressure frame plate (1-3) is lowered to a low position by the lifting module (1-4), the pressure strips (1-6) press the carrier plate (03) onto the support platform (1-2).

4. The eutectic machine equipped with a carrier plate conveying device according to claim 3, characterized in that, The conveying assembly (1-5) includes: a drive shaft (1-52) connecting the two pressure frame plates (1-3), a plurality of transmission wheels (1-53) disposed on the inner sidewall of the corresponding pressure frame plate (1-3), and a conveyor belt (1-51) tensioned between the drive shaft (1-52) and the plurality of transmission wheels (1-53). The horizontal top surface of the conveyor belt (1-51) constitutes the working surface for conveying the carrier plate (03).

5. The eutectic machine equipped with a carrier plate conveying device according to claim 3, characterized in that, A guide rod (1-31) is fixed on the pressure frame plate (1-3), and a guide sleeve (1-32) is provided on the sliding seat (1-1); the lower end of the guide rod (1-31) is inserted into the guide sleeve (1-32) to form a linear guide between the pressure frame plate (1-3) and the sliding seat (1-1).

6. The eutectic machine equipped with a carrier plate conveying device according to claim 3, characterized in that, The inner side of the pressure plate (1-3) is provided with a support strip (1-33) along the X-axis direction. When the carrier plate (03) is pressed down by the pressure strip (1-6), the carrier plate (03) together with the conveyor belt (1-51) is pressed onto the support strip (1-33).

7. The eutectic machine equipped with a carrier plate conveying device according to claim 3, characterized in that, One of the pressure frame plates (1-3) has multiple accommodating cavities (1-34) along the X-axis direction on its inner side. Each accommodating cavity (1-34) contains a spring piece (1-35). One end of the spring piece (1-35) is fixedly connected to the bottom of the accommodating cavity (1-34), and the other end is provided with a connecting clamp (1-36). A retaining wheel (1-37) is connected to the connecting clamp (1-36). Under the action of the spring piece (1-35), the retaining wheel (1-37) tends to protrude partially from the accommodating cavity (1-34), causing the carrier plate (03) to abut against the inner side of another pressure frame plate (1-3) along the Y-axis direction.

8. The eutectic machine equipped with a carrier plate conveying device according to claim 3, characterized in that, The lifting module (1-4) includes: two support seats (1-41) disposed on the sliding seat (1-1), a drive shaft (1-42) rotatably disposed on the two support seats (1-41), a rotating cam (1-43) disposed on the drive shaft (1-42), and the rotating cam (1-43) abutting against the bottom edge of the corresponding pressure frame plate (1-3).

9. The eutectic machine equipped with a carrier plate conveying device according to claim 8, characterized in that, The support base (1-41) and the corresponding pressure frame plate (1-3) are connected by a tension spring (1-7).

10. The eutectic machine equipped with a carrier plate conveying device according to claim 3, characterized in that, The sliding seat (1-1) is provided with brackets (1-81) on both the left and right sides in the X direction, and photoelectric sensors (1-82) are provided on the brackets (1-81); a lifting cylinder (1-83) is provided on the bracket (1-81) on the front side of the conveying assembly (1-5) in the conveying direction, and a baffle plate (1-84) is provided at the output end of the lifting cylinder (1-83).

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