Multi-chip co-package intelligent temperature and pressure regulation and control process

Abstract

This invention discloses a multi-chip collaborative packaging intelligent temperature and pressure control process, relating to the field of chip packaging temperature and pressure control technology. It includes a base and a cover plate. Cover plates are disposed on both sides of the base. A first hydraulic rod is disposed on the surface of the base, controlling the lifting and lowering of the cover plate. The output end of the first hydraulic rod is rotatably connected to the cover plate. A first torsion spring provides downward pressure to the two cover plates and can also reset the cover plates after rotation. One side of the cover plate has an injection port. The control system determines whether to adjust the temperature and pressure of the base and cover plate by the pressure exerted on the sliding frame based on the deformation trend of the pin surface, ensuring heat dissipation of the molding material and guaranteeing condensation efficiency. When the sliding frame moves, the pressure ring slides directly along the pin surface and moves up and down reciprocally, eliminating surface stress on the pins and straightening them, preventing pin bending after packaging from affecting chip use.

Description

Technical Field

[0001] This invention relates to the field of chip packaging temperature and pressure control technology, specifically to a multi-chip collaborative packaging intelligent temperature and pressure control process. Background Technology

[0002] After the chip is bonded to the substrate, it needs to be placed in a mold and molded with epoxy resin and other molding materials to solidify around the chip to form a protective shell.

[0003] Patent publication number CN117577573B relates to a chip packaging auxiliary mold, a chip packaging method, and a packaged chip, falling under the field of chip packaging technology. In the chip packaging auxiliary mold, a first mold strip and a second mold strip enclose a mesh of through-holes. These through-holes, in conjunction with a packaging carrier, form a limiting groove to restrict chip movement, thereby mitigating chip displacement during packaging, reducing the difficulty of subsequent manufacturing processes, and improving chip packaging yield.

[0004] In the aforementioned patent, the mesh vias and the packaging substrate can form a limiting groove to limit the chip, thereby improving the chip displacement problem during the packaging process, reducing the difficulty of subsequent manufacturing processes, and improving the chip packaging yield. However, in the chip packaging process, the chip must first be bonded to the conductive substrate, and then the chip and the substrate are placed together in the mold for packaging. Since the outermost part of the encapsulant will cool and solidify first, the stress difference between it and the encapsulant inside that has not yet begun to cool and solidify can easily cause pin deformation. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a multi-chip collaborative packaging intelligent temperature and pressure control process, which solves the problems mentioned in the background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a multi-chip collaborative packaging intelligent temperature and pressure control process, the device of which includes a base and a cover plate. Cover plates are disposed on both sides of the upper part of the base. A first hydraulic rod is disposed on the surface of the base, controlling the lifting and lowering of the cover plate. The output end of the first hydraulic rod is rotatably connected to the cover plate. A first torsion spring is disposed between the cover plate and the first hydraulic rod, providing downward pressure to the two cover plates and allowing the cover plate to return to its original position after rotation. A filling port is provided on one side of the cover plate surface, and a filling channel is provided between the cover plate and the base. Sliding frames are disposed on both sides of the base. Two sets of second hydraulic rods are disposed on the surface of the base, with two rods in each set, located on both sides of the sliding frame. The output end of the second hydraulic rod is fixedly connected to the sliding frame, and the second hydraulic rod drives the sliding frame to reciprocate. Rotating plates are rotatably mounted on both sides of the base. The rotating plates are sleeved on the surface of the sliding frame. When the sliding frame slides at the front end of the rotating plate, its surface fits against the bottom of the rotating plate, limiting the rotation. Several toothed blocks are provided on the surface of the rotating plate, and the front and rear sides of the toothed blocks are set as inclined surfaces. Several pressure rings are slidably mounted on the surface of the sliding frame. A first spring is provided between the pressure rings and the sliding frame. The elastic force of the first spring causes the pressure rings to return to their original position. A connecting rod is fixedly mounted on the bottom of the pressure ring. When the sliding frame moves, it drives the connecting rod to move. The bottom of the connecting rod is squeezed upward by the toothed blocks. The first hydraulic rod and the second hydraulic rod are both connected to the control system. The cover plate is connected to the control system through the first hydraulic rod. The pressure sensor on the surface of the sliding frame detects the pressure applied by the pins to the surface of the sliding frame, which can determine whether the pins have a bending tendency. The temperature and pressure of the base and the cover plate are adjusted to ensure the heat dissipation effect of the molding material and ensure the solidification efficiency.

[0007] According to the above technical solution, a pressure sensor is provided on the surface of the slide frame, and the slide frame is connected to the control system through the second hydraulic rod. The pressure sensor transmits the information of the needle bending to the control system, and the control system controls the second hydraulic rod to start.

[0008] According to the above technical solution, a sliding plate is slidably installed on both sides of the base. The sliding plate engages with the surface of the rotating plate. A slot is opened on the surface of the rotating plate near the sliding plate. The sliding frame slides to the slot to release the limiting position on the rotating plate. An extrusion plate is rotatably installed on the surface of the sliding plate. A sleeve rod is slidably installed on the surface of the sliding plate. The end of the sleeve rod away from the sliding plate is sleeved on the surface of the extrusion plate. The extrusion plate is tilted at a certain angle. A stop rod is fixedly installed on the surface of the rotating plate. The rotation of the rotating plate drives the stop rod to rotate. The stop rod squeezes the sleeve rod to move, pushing the extrusion plate to rotate inward during the upward movement. This pushes and flattens the raised plastic sealing material on the surface, concentrates the raised part around the root of the needle for compaction, stabilizes the material around the needle, and prevents the needle from deforming again. A second torsion spring is provided between the rotating plate and the base. The rotating plate rotates downward under the elastic force of the second torsion spring, while providing thrust for the stop rod to push the sleeve rod.

[0009] According to the above technical solution, two sets of rotating rods are respectively arranged on both sides of the inside of the cover plate. Each set of rotating rods consists of two rods, which are sleeved on the surface of the cover plate and extend into the inside of the cover plate. The rotating rods can slide inside the cover plate and rotate when the cover plate rises. Several baffles are rotatably installed on the surface of the rotating rods. The inner side of the baffles is aligned with the inner wall of the base, and the baffles fit with the inner wall of the base to ensure the flatness of the encapsulation surface. A slide bar is slidably installed on the surface of the base near the baffles. A fixing rod is fixedly installed on the surface of the baffles. The fixing rod is sleeved on the surface of the slide bar, and the baffles are sleeved on the surface of the slide bar through the fixing rod and slide together with the slide bar. A push rod is hinged to the surface of the second hydraulic rod. The end of the push rod away from the second hydraulic rod is hinged to the slide bar. The second hydraulic rod pushes the slide bar to slide back and forth, causing the baffles to move away from the encapsulation material and then return to their original position. The baffles shape the encapsulation material while not completely adhering to it, which facilitates demolding after encapsulation.

[0010] According to the above technical solution, several racks are fixedly installed on the back of the base. The end of the rotating rod near the rack matches the surface of the rack. The rotating rod can slide inside the cover plate and rotate. By different positions of the rotating rod, the baffle can achieve two different functions.

[0011] According to the above technical solution, the surface of the rack is bent, and the two ends of the bend are misaligned. The part of the rotating rod that enters the rack is divided into front and rear parts. The front part meshes with one end of the rack at the bend, and the rear part has a smooth surface that fits against the other end of the rack at the bend. This allows the rack to not only push the rotating rod to rotate, but also to limit one side of the rotating rod and prevent it from sliding.

[0012] According to the above technical solution, each of the rotating rods has a baffle surface with a baffle block. Several push plates are fixedly installed on the rotating rod surface. The push plates are close to the baffle blocks. The rotating rod drives the push plates to rotate. The push plates push the baffle blocks to rotate away from the packaging surface, so that the packaging can be detached. The distance between the baffle blocks on different baffle surfaces of each rotating rod and the corresponding push plates increases sequentially from front to back. When the rotating rod rotates, the baffles on the surface open sequentially from front to back, so that the packaging slowly falls off from all the baffles on both sides, avoiding damage to the internal chip caused by the impact force when it falls suddenly.

[0013] According to the above technical solution, a rotating head is rotatably installed on both sides of the base surface, and an adhesion roller is rotatably installed on the surface of the rotating head. The adhesion roller rotates by contacting and rubbing against the inner wall of the cover plate, carrying away residual debris and dust from the inner wall of the cover plate, ensuring the cleanliness of the inside of the cover plate, and ensuring the flatness of the subsequent packaging surface. A limit plate is provided between the rotating head and the base, which makes the rotating head rotate in one direction only when the cover plate is lifted. When the cover plate is reset, it remains fixed. The inner wall of the cover plate is adhered to the adhesion roller by the rotation of the cover plate and the elastic force of the first torsion spring. A telescopic strip is provided on the surface of the rotating head, and cylinders are provided on both sides of the base surface. A piston rod is sleeved inside the cylinder, and the top of the piston rod is hinged to the telescopic strip. Exhaust holes are provided on the inner walls of both sides of the base, and the exhaust holes are connected to the cylinders. When the rotating head rotates, it drives the telescopic strip to rotate, squeezing the piston rod to slide inside the cylinder, squeezing the gas inside the piston rod, and allowing the gas to be discharged into the base through the exhaust holes, cleaning and cooling the inside of the base, and accelerating the dissipation of residual heat inside the bottom cover.

[0014] According to the above technical solution, the inner walls on both sides of the base are provided with several notches, and the exhaust hole is located in the notch. The notch is positioned directly opposite the inside of the base, so that the gas discharged from the exhaust hole can quickly come into contact with the inside of the base.

[0015] According to the above technical solution, the bottom shape of the cover plate matches the notch and is not aligned with the exhaust hole. When the cover plate is attached to the base, the notch is closed to ensure the flatness between the cover plate and the base. When the cover plate is lifted, the notch is opened.

[0016] This invention provides a multi-chip collaborative packaging intelligent temperature and pressure control process. It has the following beneficial effects: (1) In this invention, the control system determines whether the temperature and pressure of the base and cover plate need to be adjusted by the extrusion force of the sliding frame based on the deformation trend of the pin surface, so as to ensure the heat dissipation effect of the molding compound and ensure the condensation efficiency. At the same time, when the sliding frame moves, the pressure ring slides directly along the pin surface and moves up and down back and forth to eliminate the stress on the pin surface and straighten the pin, so as to avoid the pin bending after packaging and affect the use of the chip. The extrusion plate moves upward and rotates to squeeze the incompletely solidified surface molding compound around the pin when it deforms, and compacts it in the direction of the pin to ensure the flatness of the packaging surface, while stabilizing the root of the pin to prevent the pin from deforming again. (2) In this invention, the baffle moves back and forth, squeezing the plastic encapsulation surface and moving away. The baffle shapes the plastic encapsulation material while not completely adhering to it, which facilitates demolding after encapsulation and prevents the plastic encapsulation material from sticking to the inside of the base. After encapsulation, the rotating rod will drive the baffles on both sides to rotate and open in sequence, moving away from the encapsulation surface, so that the encapsulation can fall off slowly, avoiding sudden drops that could cause violent vibrations and damage to the internal chip. (3) In this invention, the piston rod is squeezed into the cylinder, so that the air in the cylinder is blown into the base from the exhaust port, which accelerates the dissipation of residual heat inside the base, ensures the thermal conductivity of the base to the plastic encapsulation material during the subsequent encapsulation process, and accelerates the condensation. At the same time, when the cover plate rotates and resets downward, the inner wall contacts the adhesion roller and rubs against the rotation of the adhesion roller, removing the residual debris inside the cover plate, ensuring the cleanliness of the inner wall of the cover plate, and ensuring the flatness of the subsequent encapsulation surface. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the rear structure of the present invention; Figure 3 This is a schematic diagram of the base structure of the present invention; Figure 4 This is a schematic diagram of the top cover structure of the present invention; Figure 5 This is a schematic diagram of the position structure of the sliding frame and the second hydraulic rod of the present invention; Figure 6 This is a schematic diagram of the sliding frame structure of the present invention; Figure 7 This is a schematic diagram of the position structure of the rotating plate and the sliding plate of the present invention; Figure 8 This is a schematic diagram of the position structure of the second hydraulic rod and the slide bar in this invention; Figure 9 This is a schematic diagram of the rotating rod and stop bar structure of the present invention; Figure 10 This is a schematic diagram of the piston rod and cylinder position structure of the present invention.

[0018] In the diagram: 1. Base; 2. Cover plate; 3. First hydraulic rod; 4. Injection channel; 5. Injection port; 6. Second hydraulic rod; 7. Sliding frame; 8. Rotating plate; 9. Tooth block; 10. Pressure ring; 11. Connecting rod; 12. Slide plate; 13. Extrusion plate; 14. Support rod; 15. Sleeve rod; 16. Rotating rod; 17. Baffle plate; 19. Push rod; 20. Fixing rod; 21. Sliding strip; 22. Toothed rack; 23. Push plate; 24. Stop block; 25. Adhesion roller; 26. Rotating head; 27. Limiting plate; 28. Telescopic strip; 29. ​​Piston rod; 30. Cylinder; 31. Notch; 32. Exhaust hole. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1-10 One embodiment of the present invention is a multi-chip co-packaging intelligent temperature and pressure control process, the device of which includes a base 1 and a cover plate 2. Cover plates 2 are arranged on both sides above the base 1. A first hydraulic rod 3 is arranged on the surface of the base 1. The output end of the first hydraulic rod 3 is rotatably connected to the cover plate 2. A first torsion spring is arranged between the cover plate 2 and the first hydraulic rod 3. The first torsion spring provides downward pressure to the two cover plates 2 and can also reset the cover plate 2 after rotation. A filling port 5 is opened on one side of the cover plate 2. A filling channel 4 is arranged between the cover plate 2 and the base 1. Sliding frames 7 are arranged on both sides of the base 1. Two sets of second hydraulic rods 6 are arranged on the surface of the base 1, with two rods in each set, respectively located on both sides of the sliding frame 7. The output end of the second hydraulic rod 6 is fixedly connected to the sliding frame 7, and the second hydraulic rod 6 drives the sliding frame 7 to reciprocate. The base 1 has rotating plates 8 mounted on both sides. The rotating plates 8 are sleeved on the surface of the sliding frame 7. When the sliding frame 7 slides at the front end of the rotating plate 8, its surface is in contact with the bottom of the rotating plate 8, thus limiting the rotation plate 8. The rotating plate 8 has several toothed blocks 9 on its surface. The front and rear sides of the toothed blocks 9 are set as inclined surfaces. Several pressure rings 10 are slidably mounted on the surface of the sliding frame 7. A first spring is set between the pressure rings 10 and the sliding frame 7. The elastic force of the first spring causes the pressure rings 10 to return to their original position. A connecting rod 11 is fixedly mounted at the bottom of the pressure rings 10. The movement of the sliding frame 7 drives the connecting rod 11 to move. The bottom of the connecting rod 11 is squeezed upward by the toothed blocks 9. The first hydraulic rod 3 and the second hydraulic rod 6 are both connected to the control system. The cover plate 2 is connected to the control system through the first hydraulic rod 3. The pressure sensor on the surface of the sliding frame 7 detects the pressure applied by the needle to the surface of the sliding frame 7, which can determine whether the needle has a bending tendency.

[0021] A pressure sensor is provided on the surface of the slide frame 7. The slide frame 7 is connected to the control system through the second hydraulic rod 6. The pressure sensor transmits the information of the needle bending to the control system, and the control system controls the second hydraulic rod 6 to start.

[0022] Slide plates 12 are slidably mounted on both sides of the base 1. The slide plates 12 engage with the surface of the rotating plate 8. The rotating plate 8 rotates and pushes the slide plates 12 upward. A slot is opened on the surface of the rotating plate 8 near the slide plates 12. The sliding frame 7 slides to the slot and releases the restriction on the rotating plate 8. An extrusion plate 13 is rotatably mounted on the surface of the slide plates 12. A sleeve rod 15 is slidably mounted on the surface of the slide plates 12. The end of the sleeve rod 15 away from the slide plates 12 is sleeved on the surface of the extrusion plate 13. The extrusion plate 13 is tilted at a certain angle. A stop rod 14 is fixedly mounted on the surface of the rotating plate 8. The rotation of the rotating plate 8 drives the stop rod 14 to rotate. The stop rod 14 squeezes the sleeve rod 15 to move, pushing the extrusion plate 13 to rotate inward during the upward movement. A second torsion spring is provided between the rotating plate 8 and the base 1. The rotating plate 8 rotates downward under the elastic force of the second torsion spring, while providing thrust for the stop rod 14 to push the sleeve rod 15.

[0023] In this embodiment, the chip, after being bonded to the substrate, is placed inside the base 1. The first hydraulic rod 3 is activated, and its output end causes the cover plate 2 to press down and adhere to the base 1, sealing the chip between the cover plate 2 and the base 1. Molding material is injected through the injection port 5, entering between the cover plate 2 and the base 1 through the injection channel 4 to encapsulate the chip. Once the molding material has completely solidified on the chip surface, the chip encapsulation is complete. During chip placement, the pins on the substrate surface at the bottom of the chip are positioned on the surface of the sliding frame 7. The sliding frame 7 positions the pins to ensure they are not deformed during the molding material solidification process. A pressure sensor on the surface of the sliding frame 7 detects the pressure applied by the pins to the surface of the sliding frame 7, which can determine if the pins have a bending tendency. Because the outermost layer of the molding material is in direct contact with the cover plate 2 and the base 1 when encapsulating the chip, it will cool first. However, the process enters the solidification stage, where the intermediate part cools slowly, resulting in a slow solidification rate. This makes it difficult for the inner and outer molding materials to solidify evenly and synchronously, causing stress differences that compress and deform the pins. The control system judges whether it is necessary to adjust the temperature and pressure of the base 1 and the cover plate 2 based on the deformation trend of the pin surface and the pressure of the sliding frame 7. This ensures the heat dissipation effect on the molding material and guarantees solidification efficiency. At the same time, when the pins begin to compress the sliding frame 7, the control system controls the second hydraulic rod 6 to move back and forth, driving the sliding frame 7 to move on the surface of the rotating plate 8. When the sliding frame 7 moves, it drives the connecting rod 11 and the front and rear inclined surfaces of the tooth block 9 to rub and compress each other, causing the connecting rod 11 to be lifted and moved upward. After the connecting rod 11 moves, it drives the pressure ring 10 to move upward and then reset under the elastic force of the first spring. This allows the pressure ring 10 to slide straight along the pin surface and move up and down back and forth, eliminating the stress on the pin surface and straightening the pins. This prevents the pins from bending after packaging, which would affect the use of the chip. When the slide frame 7 slides to the slotted surface of the rotating plate 8, the rotating plate 8 rotates downward under the elastic force of the second torsion spring, pushing the slide plate 12 to move upward. At the same time, the rotation of the rotating plate 8 drives the abutment rod 14 to rotate and squeeze the sleeve rod 15 to move. After the sleeve rod 15 moves, it pushes the tube extrusion plate 13 to rotate, squeezing the surface plastic sealing material that is not completely solidified around the pin when it is deformed, and compacting it in the direction of the pin to ensure the flatness of the encapsulation surface, while stabilizing the root of the pin to prevent the pin from deforming again.

[0024] Please see Figures 1-10Based on the above embodiments, in another embodiment of the present invention, two sets of rotating rods 16 are respectively provided on both sides of the inner side of the cover plate 2. Each set of rotating rods 16 consists of two rods, which are sleeved on the surface of the cover plate 2 and extend into the interior of the cover plate 2. The rotating rods 16 can slide inside the cover plate 2 and can also rotate when the cover plate 2 is raised. Several baffles 17 are rotatably installed on the surface of the rotating rods 16. The inner side of the baffles 17 is aligned with the inner wall of the base 1, and the baffles 17 fit with the inner wall of the base 1 to ensure the flatness of the plastic sealing surface. A slide bar 21 is slidably installed on the surface of the base 1 near the baffle 17. A fixing rod 20 is fixedly installed on the surface of the baffle 17. The fixing rod 20 is sleeved on the surface of the slide bar 21. The baffle 17 is sleeved on the surface of the slide bar 21 through the fixing rod 20 and slides together with the slide bar 21. A push rod 19 is hinged to the surface of the second hydraulic rod 6. The end of the push rod 19 away from the second hydraulic rod 6 is hinged to the slide bar 21. The second hydraulic rod 6 pushes the slide bar 21 to slide back and forth, causing the baffle 17 to move away from the plastic sealing material and then return to its original position.

[0025] Several racks 22 are fixedly installed on the back of the base 1. The end of the rotating rod 16 near the rack 22 matches the surface of the rack 22. The rotating rod 16 can slide inside the cover plate 2 and rotate. Through different positions of the rotating rod 16, the baffle 17 can achieve two different functions.

[0026] The surface of the rack 22 is bent, and the two ends of the bend are misaligned. The part of the rotating rod 16 that enters the rack 22 is divided into front and rear parts. The front part meshes with one end of the bend of the rack 22, and the rear part has a smooth surface.

[0027] Each rotating rod 16 has a baffle 17 with a baffle 24 on its surface. Several push plates 23 are fixedly installed on the rotating rod 16. The push plates 23 are close to the baffle 24. The rotating rod 16 drives the push plates 23 to rotate. The push plates 23 push the baffle 24 to rotate the baffle 17 away from the encapsulation surface, so that the encapsulation is completed and the baffle is detached. The distance between the baffle 24 on the different baffle 17 surfaces of each rotating rod 16 and the corresponding push plate 23 increases sequentially from front to back. When the rotating rod 16 rotates, the baffles 17 on the surface open sequentially from front to back.

[0028] In this embodiment, when the output end of the second hydraulic rod 6 moves, it pushes the push rod 19 to move. The push rod 19 drives the slide bar 21 to slide back and forth. The slide bar 21 drives the baffle 17 to move back and forth, squeezing the encapsulation surface and then moving away from it. This frequent reciprocating motion allows the baffle 17 to shape the encapsulation material without completely adhering to it, facilitating demolding after encapsulation and preventing the encapsulation material from sticking to the inside of the base 1. After encapsulation, the first hydraulic rod 3 drives the cover plate 2 to lift up. The cover plate 2 drives the rotating rod 16 to move upward. The rotating rod 16 drives the baffle 17 to move upward, causing the fixing rod 20 on the surface of the baffle 17 to be pulled away from the surface of the slide bar 21. When the slide bar 21 is released from its limiting position on the baffle 17, the back of the rotating rod 16 moves into the rack 22 and engages with the inner wall of the rack 22. As the cover plate 2 continues to move upward, the rotating rod 16 rotates under the push of the rack 22. The rotating rod 16 drives the push plate 23 to rotate. The rotation of the push plate 23 pushes the baffle block 24 to rotate, causing the baffle 17 to rotate away from both sides of the package, so that the package falls off and the demolding is completed. Moreover, the position of the baffle block 24 on the surface of each baffle 17 is different. The rotation of the rotating rod 16 causes the baffle 17 to rotate and open from front to back in sequence, so that the package falls off slowly and avoids sudden drops that may cause violent vibrations and damage to the internal chip.

[0029] Please see Figures 1-10 In another embodiment of the present invention, based on the above embodiments, a rotating head 26 is rotatably mounted on both sides of the surface of the base 1, and an adhesion roller 25 is rotatably mounted on the surface of the rotating head 26. The adhesion roller 25 rotates by contacting and rubbing against the inner wall of the cover plate 2. A limiting plate 27 is provided between the rotating head 26 and the base 1, which makes the rotating head 26 rotate in one direction only when the cover plate 2 is lifted. When the cover plate 2 is reset, it remains fixed. The inner wall of the cover plate 2 is pressed against the adhesion roller 25 by the rotation of the cover plate 2 and the elastic force of the first torsion spring. A telescopic strip 28 is provided on the surface of the rotating head 26. A cylinder 30 is provided on both sides of the surface of the base 1. A piston rod 29 is sleeved inside the cylinder 30. The top of the piston rod 29 is hinged to the telescopic strip 28. An exhaust hole 32 is provided on the inner wall of both sides of the base 1. The exhaust hole 32 is connected to the cylinder 30. When the rotating head 26 rotates, it drives the telescopic strip 28 to rotate, squeezing the piston rod 29 to slide inside the cylinder 30 and squeezing the gas inside the piston rod 29.

[0030] The inner walls on both sides of the base 1 are provided with several notches 31, and the exhaust hole 32 is located in the notch 31. The notch 31 is directly facing the inside of the base 1, so that the gas discharged from the exhaust hole 32 can quickly come into contact with the inside of the base 1.

[0031] The bottom shape of the cover plate 2 matches the notch 31, but is not aligned with the exhaust hole 32. When the cover plate 2 is attached to the base 1, the notch 31 is closed to ensure the flatness between the cover plate 2 and the base 1. When the cover plate 2 is lifted, the notch 31 is opened.

[0032] In this embodiment, during operation: when the cover plate 2 is lifted after encapsulation, it pushes the adhesion roller 25 to rotate upwards. The adhesion roller 25 drives the telescopic strip 28 to rotate. After the telescopic strip 28 rotates, it squeezes the piston rod 29 into the cylinder 30, causing the air in the cylinder 30 to be discharged from the exhaust port 32 and blown into the base 1, accelerating the preheating and dissipation inside the base 1, ensuring the thermal conductivity of the base 1 to the plastic encapsulation material during the subsequent encapsulation process, and accelerating condensation. When the cover plate 2 is reset downwards, the inner wall contacts the adhesion roller 25. At this time, the adhesion roller 25 is squeezed from above by the cover plate 2. Under the limitation of the limiting plate 27, the adhesion roller 25 cannot rotate, pushing open the cover plate 2 and rotating to both sides. When the cover plate 2 rotates and resets downwards, the inner wall contacts and rubs against the adhesion roller 25, causing the adhesion roller 25 to rotate, removing residual debris inside the cover plate 2, ensuring the cleanliness of the inner wall of the cover plate 2, and ensuring the flatness of the subsequent encapsulation surface.

[0033] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-chip co-packaging intelligent temperature and pressure control process, the device used of which includes a base (1) and a cover plate (2), characterized in that: The base (1) is provided with cover plates (2) on both sides above it. The base (1) is provided with a first hydraulic rod (3). The cover plate (2) is rotatably connected to the output end of the first hydraulic rod (3). A first torsion spring is provided between the cover plate (2) and the first hydraulic rod (3). A material injection port (5) is opened on the surface of one side of the cover plate (2). A material injection channel (4) is provided between the cover plate (2) and the base (1). Sliding frames (7) are provided on both sides of the base (1). Two sets of second hydraulic rods (6) are provided on the surface of the base (1). Each set of second hydraulic rods (6) has two rods, which are located on both sides of the sliding frame (7). The output end of the hydraulic rod (6) is fixedly connected to the slide frame (7). The base (1) is rotatably mounted with rotating plates (8) on both sides. The rotating plates (8) are sleeved on the surface of the slide frame (7). The rotating plates (8) are provided with several toothed blocks (9) on the surface. The front and rear sides of the toothed blocks (9) are set as inclined surfaces. Several pressure rings (10) are slidably mounted on the surface of the slide frame (7). A first spring is provided between the pressure rings (10) and the slide frame (7). A connecting rod (11) is fixedly mounted at the bottom of the pressure rings (10). The first hydraulic rod (3) and the second hydraulic rod (6) are both connected to the control system. The cover plate (2) is connected to the control system through the first hydraulic rod (3).

2. The intelligent temperature and pressure control process for multi-chip collaborative packaging according to claim 1, characterized in that: A pressure sensor is provided on the surface of the slide frame (7), and the slide frame (7) is connected to the control system through the second hydraulic rod (6).

3. The intelligent temperature and pressure control process for multi-chip collaborative packaging according to claim 2, characterized in that: The base (1) has sliding plates (12) on both sides, which engage with the surface of the rotating plate (8). The rotating plate (8) has a slot near the sliding plate (12). The sliding plate (12) has an extrusion plate (13) rotatably mounted on the surface of the sliding plate (12). The sliding plate (12) has a sleeve rod (15) slidably mounted on the surface of the sliding plate (12). The end of the sleeve rod (15) away from the sliding plate (12) is sleeved on the surface of the extrusion plate (13). The extrusion plate (13) is tilted at a certain angle. The rotating plate (8) has a stop rod (14) fixedly mounted on the surface of the rotating plate (8). A second torsion spring is provided between the rotating plate (8) and the base (1).

4. The intelligent temperature and pressure control process for multi-chip collaborative packaging according to claim 3, characterized in that: Two sets of rotating rods (16) are respectively provided on both sides of the inside of the cover plate (2). Each set of rotating rods (16) is divided into two, which are sleeved on the surface of the cover plate (2) and extend into the inside of the cover plate (2). Several baffles (17) are rotatably installed on the surface of the rotating rods (16). The inner side of the baffles (17) is aligned with the inner wall of the base (1). A slide bar (21) is slidably installed on the surface of the base (1) near the baffles (17). A fixing rod (20) is fixedly installed on the surface of the baffles (17). The fixing rod (20) is sleeved on the surface of the slide bar (21). A push rod (19) is hinged on the surface of the second hydraulic rod (6). The end of the push rod (19) away from the second hydraulic rod (6) is hinged to the slide bar (21).

5. The intelligent temperature and pressure control process for multi-chip collaborative packaging according to claim 4, characterized in that: The base (1) has several racks (22) fixedly installed on its back, and the end of the rotating rod (16) near the rack (22) matches the surface of the rack (22).

6. The intelligent temperature and pressure control process for multi-chip collaborative packaging according to claim 5, characterized in that: The surface of the rack (22) is bent, and the two ends of the bend are misaligned.

7. The intelligent temperature and pressure control process for multi-chip collaborative packaging according to claim 6, characterized in that: Each of the rotating rods (16) has a stop block (24) on the surface of the baffle (17). Several push plates (23) are fixedly installed on the surface of the rotating rod (16). The push plates (23) are close to the stop blocks (24). The distance between the stop blocks (24) on the different baffle (17) surfaces of each rotating rod (16) and the corresponding push plates (23) increases sequentially from front to back.

8. The intelligent temperature and pressure control process for multi-chip co-packaging according to claim 7, characterized in that: Rotary heads (26) are rotatably mounted on both sides of the base (1). Adhesive rollers (25) are rotatably mounted on the surface of the rotary heads (26). A limit plate (27) is provided between the rotary heads (26) and the base (1). A telescopic strip (28) is provided on the surface of the rotary heads (26). Cylinders (30) are provided on both sides of the base (1). A piston rod (29) is sleeved inside the cylinder (30). The top of the piston rod (29) is hinged to the telescopic strip (28). Exhaust holes (32) are provided on the inner walls of both sides of the base (1). The exhaust holes (32) are connected to the cylinders (30).

9. The intelligent temperature and pressure control process for multi-chip collaborative packaging according to claim 7, characterized in that: The base (1) has several notches (31) on its inner walls on both sides, and the exhaust hole (32) is located in the notch (31).

10. The intelligent temperature and pressure control process for multi-chip collaborative packaging according to claim 7, characterized in that: The bottom shape of the cover plate (2) matches the notch (31) and is not aligned with the vent (32).

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