Display module and electronic device

Abstract

The application relates to the technical field of electronic equipment, and provides a display module and electronic equipment, the display module comprises a display panel and a supporting back plate, the display panel comprises a display surface and a backlight surface, the supporting back plate is arranged on the backlight surface, the supporting back plate comprises a first adhesive layer, a supporting layer, a second adhesive layer and a copper layer arranged in sequence in a direction away from the backlight surface, the density of the supporting layer is smaller than the density of the copper layer, and the film printing resistance of the supporting layer is greater than or equal to the film printing resistance of the copper layer. The display module and the electronic equipment thin the copper layer which plays a supporting role in the display module, and at least can keep the film printing resistance of the display module from decreasing.

Description

Display module and electronic device

[0001] Cross-reference to Related Applications

[0002] The present application claims priority to the Chinese patent application No. 202421460133.2, filed on June 24, 2024, and entitled "A display module and electronic device", the whole content of which is incorporated herein by reference. TECHNICAL FIELD

[0003] The present application relates to the technical field of electronic devices, and in particular to a display module and electronic device. BACKGROUND

[0004] In an electronic device with display function, a display module usually includes a support back plate. The main material of the support back plate is copper, and the density of copper is high, so that the weight of the display module is relatively large. Therefore, in specific implementation, the thickness of the copper layer in the support back plate is thinned to reduce the weight of the display module as a whole. However, thinning the thickness of the copper layer in the support back plate will reduce the film printing resistance of the display module. SUMMARY

[0005] Embodiments of the present application provide a display module and electronic device, which can maintain the film printing resistance of the display module while thinning the copper layer in the support back plate.

[0006] In a first aspect, the present application provides a display module, which includes a display panel and a support back plate. The display panel includes a display surface and a back surface. The support back plate is arranged on the back surface. The support back plate includes, in sequence from the direction away from the back surface, a first adhesive layer, a support layer, a second adhesive layer, and a copper layer. The density of the support layer is less than the density of the copper layer, and the film printing resistance of the support layer is greater than or equal to the film printing resistance of the copper layer. In this scheme, the support layer is added, and the film printing resistance of the support layer is greater than or equal to the film printing resistance of the copper layer. Compared with the related art of simply thinning the thickness of the copper layer in the support back plate, the film printing resistance of the display module can be improved. Moreover, the density of the support layer is less than the density of the copper layer, so that the display module provided by the present application can achieve weight reduction of the display module as in the related art, so that the film printing resistance of the display module does not decrease, and can even be improved, without increasing the weight of the display module.

[0007] In a possible embodiment, the thickness of the support layer is 15-35 microns, the film printing resistance is positively correlated with the thickness of the material, which is conducive to ensuring that the film printing resistance of the support layer is greater than or equal to the film printing resistance of the copper layer, and further making the film printing resistance of the display module not decrease, and even be improved. In this scheme, the thickness of the copper layer can be 9-35 microns, so that the display module can be thinned while reducing the weight and the weight is not increased.

[0008] In a possible embodiment, the tensile modulus of the support layer is greater than or equal to 5 Gpa. The film printing resistance is also positively correlated with the tensile modulus of the material, and the tensile modulus of the support layer greater than or equal to 5 Gpa can make the film printing resistance of the support layer better, and further make the film printing resistance of the display module better.

[0009] In a possible embodiment, the support layer can be one of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cyclic olefin polymer layer, and a cellulose triacetate layer, or a laminate composed of at least two of the above.

[0010] In a possible embodiment, the support layer includes, in sequence from the direction away from the backlight surface, a first sub-support layer, a third adhesive layer, a heat-conducting layer, a fourth adhesive layer, and a second sub-support layer. In this scheme, the heat-conducting layer can realize heat conduction. Compared with the scheme of arranging a vacuum chamber heat plate on the surface of the copper layer away from the light-transmitting cover plate, the heat-conducting layer in this scheme is arranged in the display module, and the area of the heat-conducting layer can be larger. Thus, on the basis of realizing the weight reduction of the display module, the display module provided in this scheme can also enhance the heat conduction capacity of the display module through the heat-conducting layer. Exemplarily, the heat-conducting layer can be a graphite layer.

[0011] In a possible embodiment, the edge of the third adhesive layer and the edge of the fourth adhesive layer can both exceed the edge of the heat-conducting layer, and the edge of the third adhesive layer is bonded to the edge of the fourth adhesive layer to form an edge sealing area, which seals the heat-conducting layer and avoids delamination of the heat-conducting layer, thereby ensuring the heat conduction performance of the heat-conducting layer.

[0012] In a possible embodiment, the edge of the display module has a curved area, the heat-conducting layer is located within the range surrounded by the curved area, and the distance between the edge of the heat-conducting layer and the inner edge of the curved area is 1-5 millimeters, thereby avoiding the heat-conducting layer entering the curved area to cause adhesion printing, wrinkles, and the like.

[0013] In a possible embodiment, the sum of the thicknesses of the first sub-support layer and the third adhesive layer can be 5-20 microns; and / or, the thickness of the heat-conducting layer can be 10-25 microns; and / or, the sum of the thicknesses of the fourth adhesive layer and the second sub-support layer can be 5-20 microns, so that the support layer can play a better supporting role and the film printing resistance of the display module can be stronger.

[0014] In a possible embodiment, the tensile modulus of the first sub-support layer and the second sub-support layer are both not less than 5 Gpa, so as to better support the display module and make the display module have better anti-film printing capability.

[0015] In a possible embodiment, the thickness of the first adhesive layer is 70-140 microns, and the tensile modulus of the first adhesive layer is not greater than 75 Kpa, so as to make the first adhesive layer also support the display panel to some extent, and make the first adhesive layer also help to improve the anti-film printing capability of the display module, so that the display module has better anti-film printing capability.

[0016] In a possible embodiment, the thickness of the second adhesive layer is 10-100 microns, and the tensile modulus of the second adhesive layer is not greater than 75 Kpa, so as to make the second adhesive layer also support the display panel to some extent, and make the second adhesive layer also help to improve the anti-film printing capability of the display module, so that the display module has better anti-film printing capability.

[0017] In a second aspect, the embodiments of the present application provide an electronic device, which comprises the display module provided in the first aspect and any possible embodiment thereof. Since the electronic device comprises the display module provided in the first aspect and any possible embodiment thereof, the electronic device provided by the present application can at least achieve the technical effects of the display module, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0018] FIG. 1 is a schematic diagram of simulation results of the relationship between the thickness of the copper layer and the anti-film printing capability;

[0019] FIG. 2 is a schematic diagram of a perspective structure of an electronic device provided by the present application;

[0020] FIG. 3 is a front view of the electronic device shown in FIG. 2;

[0021] FIG. 4a is a cross-sectional view of A-A of FIG. 3;

[0022] FIG. 4b is a partial enlarged view of FIG. 4a;

[0023] FIG. 5 is a partial cross-sectional view of a display module provided by the embodiments of the present application;

[0024] FIG. 6 is a partial cross-sectional view of another display module provided by the embodiments of the present application;

[0025] FIG. 7 is a schematic diagram of the positional relationship between the heat-conducting layer and the edge sealing area in a display module provided by the embodiments of the present application;

[0026] FIG. 8 is a schematic diagram of the positional relationship between the heat-conducting layer and the edge sealing area in a display module provided by the embodiments of the present application during processing;

[0027] FIG. 9 is a partial cross-sectional view of a display module according to an embodiment of the present application;

[0028] FIG. 10 is a partial cross-sectional view of a display module according to an embodiment of the present application;

[0029] FIG. 11 is a partial cross-sectional view of a display module according to an embodiment of the present application;

[0030] FIG. 12a is a top view of a display module;

[0031] FIG. 12b is a bottom view of the display module shown in FIG. 12a;

[0032] FIG. 13 is a side view of a display module.

[0033] 100 - display module; 110 - middle frame; 120 - back cover; 111 - frame; 112 - middle plate; 1 - display panel; 2 - support back plate; 21 - first adhesive layer; 22 - support layer; 221 - first sub-support layer; 222 - third adhesive layer; 223 - heat conduction layer; 224 - fourth adhesive layer; 225 - second sub-support layer; 23 - second adhesive layer; 24 - copper layer; 3 - light-transmitting cover plate; 4 - optical adhesive layer; 5 - polarizer; 6 - back film; 200 - structural member; 300 - circuit board; 400 - battery. DETAILED DESCRIPTION

[0034] Lightweighting is an important direction for the development of electronic devices. How to reduce the weight of each component of an electronic device, and thus ultimately achieve the weight reduction of the entire electronic device, is a challenge that electronic device manufacturers need to constantly address. Specifically, in an electronic device having a display module, the display module includes a light-transmitting cover plate, a screen stack, and a support back plate. The screen stack includes a display panel. The support back plate serves to support and protect the display panel, make the display panel force uniform, and prevent the display module from producing a film print. In the display module, the heaviest component other than the light-transmitting cover plate is the copper layer in the support back plate. For example, a 1-micron-thick copper layer weighs about 0.1 g. Directly reducing the thickness of the copper layer in the support back plate to reduce the weight of the entire display module, although it effectively controls or reduces the weight of the display module, will reduce the anti-film print capability of the display module. For example, as shown in the simulation results of the relationship between the thickness of the copper layer and the anti-film print capability, when the thickness of the copper layer is reduced from 50 microns to 25 microns, the anti-film print capability of the display panel will be reduced by about 35%.

[0035] Based on this, the display module and the electronic device are provided in the embodiments of the present application, so as to maintain the anti-film printing capability of the display module without decline while thinning the copper layer in the support back plate and reducing the weight of the display module. In order to make the purpose, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings.

[0036] The terms used in the following embodiments are only for the purpose of describing the specific embodiments and are not intended to be limiting on the present application. As used in the specification and the appended claims of the present application, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0037] In the present specification, the reference to “one embodiment” or “some embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in additional embodiments,” and so on, in various places throughout the specification are not necessarily all referring to the same embodiment, unless otherwise specifically noted. The terms “comprise,” “comprising,” “include,” “including,” and “has” and their variants are meant to be open-ended, unless otherwise specifically noted.

[0038] The embodiments of the present application provide a display module and an electronic device. For example, the electronic device can be a wearable device, such as a smart watch, a smart bracelet, and the like. The electronic device can also be a mobile phone, a notebook computer, a tablet computer, a vehicle-mounted device, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, or VR helmet, and the like. The display module can be applied to the above electronic devices. For the convenience of description, the electronic device is taken as a mobile phone as an example for detailed description.

[0039] Fig. 2 is a perspective view of an electronic device provided by the present application, Fig. 3 is a front view of the electronic device shown in Fig. 2, Fig. 4a is a sectional view of A-A of Fig. 3, and Fig. 4b is an enlarged view of a part of Fig. 4a. As shown in Fig. 2, Fig. 3, Fig. 4a and Fig. 4b, the electronic device provided by the present application includes a structural member 200 and a display module 100. The structural member 200 has an open accommodating cavity at one end, the display module 100 is at least partially located in the accommodating cavity, and the display module 100 is fixedly connected with the structural member 200. A specific electronic device will be briefly introduced below. Referring to Fig. 4a and Fig. 4b, in a specific implementation, the electronic device includes the display module 100, the structural member 200 and a circuit board 300, etc. The structural member 200 is used to support a plurality of components including the display module 100 and the circuit board 300. In a specific implementation, the structural member 200 can be an integral structure, or the structural member 200 can be split into two components, a middle frame 110 and a back cover 120. The case where the structural member 200 includes the middle frame 110 and the back cover 120 will be introduced below with reference to Fig. 4a and Fig. 4b. As shown in Fig. 4a and Fig. 4b, the middle frame 110 includes a frame 111 and a middle plate 112 used to support various elements. The middle plate 112 is fixed in the middle frame 110, and the middle plate 112 can be provided with holes and steps, etc. to facilitate the arrangement of various elements in the structural member 200. The back cover 120, which can also be referred to as a battery 400 cover, is arranged at one end of the middle frame 110, and the back cover 120 and the middle frame 110 together enclose an accommodating space. The battery 400, the circuit board 300 and other electronic components are arranged in the accommodating space enclosed by the back cover 120 and the middle frame 110. The middle frame 110 and the back cover 120 have an open accommodating cavity at the opposite end, and the display module 100 is at least partially located in the accommodating cavity, and the display module 100 is fixedly connected with the middle frame 110.

[0040] FIG. 5 is a partial cross-sectional view of a display module 100 provided by an embodiment of the present application. As shown in FIG. 5, in some embodiments, the display module 100 includes a display panel 1 and a support back plate, wherein the display panel 1 includes a display surface and a back surface, and the support back plate is disposed on the back surface of the display panel 1. It should be understood that the display panel 1 is part of a screen stack of the display module 100, and the screen stack further includes other layers, that is, the display module 100 includes a screen stack, and the screen stack includes the display panel 1. The other layers of the screen stack will be described later. Next, the support back plate is introduced. Please continue to refer to FIG. 5. The support back plate includes, in sequence in a direction away from the back surface of the display panel 1, a first adhesive layer 21, a support layer 22, a second adhesive layer 23, and a copper layer 24. The first adhesive layer 21 and the second adhesive layer 23 mainly play an adhesive role. Specifically, the first adhesive layer 21 is used to adhere the support layer 22 and the display panel 1 together, and the second adhesive layer 23 is used to adhere the support layer 22 and the copper layer 24 together. Further, the density of the support layer 22 is less than the density of the copper layer 24, and the film printing resistance of the support layer 22 is greater than or equal to the film printing resistance of the copper layer 24. In this scheme, the support layer 22 is added, which can improve the film printing resistance of the display module 100 compared to simply reducing the thickness of the copper layer 24 in the support back plate in the related art. Moreover, the density of the support layer 22 is less than the density of the copper layer 24, so that the display module 100 provided by the present application can achieve weight reduction of the display module 100 as in the related art.

[0041] The anti-film printing ability is positively correlated with the thickness of the material. Therefore, when the anti-film printing ability of the support layer 22 is greater than or equal to that of the copper layer 24, the thickness of the support layer 22 can be set to 15-35 microns. This is conducive to ensuring that the anti-film printing ability of the support layer 22 is greater than or equal to that of the copper layer 24, and thus the anti-film printing ability of the display module 100 does not decrease, and can even be improved. For example, the thickness of the support layer 22 can be 15 microns, 20 microns, 25 microns, or 35 microns, etc. The support layer 22 can be one of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cyclic olefin polymer layer, and a triacetate cellulose layer. The support layer 22 can also be a laminate composed of at least two of the polyethylene terephthalate layer, the polyimide layer, the polymethyl methacrylate layer, the cyclic olefin polymer layer, and the triacetate cellulose layer. For example, the support layer 22 can be a laminate composed of a polyethylene terephthalate layer and a polyimide layer, or a laminate composed of a polyimide layer, a polymethyl methacrylate layer, and a cyclic olefin polymer layer, or a laminate composed of other combinations of the above layers, which are not listed one by one here. Taking a mobile phone as an example, when the copper layer 24 in the support back plate of the display module 100 is not thinned, the thickness of the copper layer 24 is usually 50 microns. In this scheme, the thickness of the copper layer 24 can be 9-35 microns, so that the display module 100 can be thinned while reducing weight. When the copper layer 24 is specifically set, in some embodiments, the thickness of the copper layer 24 can be 9 microns, 18 microns, 20 microns, 25 microns, or 35 microns, etc. The tensile modulus of the copper layer 24 is greater than or equal to 100 GPa.

[0042] The anti-film printing ability is also positively correlated with the tensile modulus of the material. Therefore, in another embodiment, when the anti-film printing ability of the support layer 22 is greater than or equal to that of the copper layer 24, the tensile modulus of the support layer 22 can be greater than or equal to 5 GPa, so that the anti-film printing ability of the support layer 22 is better, and thus the anti-film printing ability of the display module 100 is better. For example, the tensile modulus of the support layer 22 can be 5 GPa, 10 GPa, or 12 GPa, etc.

[0043] In some embodiments, the thickness of the support layer 22 can be 15-35 microns, the tensile modulus of the support layer 22 can be greater than or equal to 5 GPa, and the thickness of the copper layer 24 can be 9-35 microns, so that the anti-film printing ability of the support layer 22 is better, and thus the anti-film printing ability of the display module 100 is better.

[0044] In a specific implementation, the thickness of the first adhesive layer 21 can be 70-140 microns, and the tensile modulus of the first adhesive layer 21 can be no greater than 75 KPa, so that the first adhesive layer 21 can also support the display panel 1 to some extent, thereby helping to improve the anti-film printing capability of the display module 100, and the anti-film printing capability of the display module 100 is better. For example, the thickness of the first adhesive layer 21 can be 70 microns, 80 microns, 100 microns, 130 microns, or 140 microns, etc. The tensile modulus of the first adhesive layer 21 can be 30 KPa, 45 KPa, 50 KPa, or 75 KPa. The first adhesive layer 21 is a silica gel layer.

[0045] In some embodiments, the thickness of the second adhesive layer 23 can be 10-100 microns, and the tensile modulus of the second adhesive layer 23 can be no greater than 75 KPa, so that the second adhesive layer 23 can also support the display panel 1 to some extent, thereby helping to improve the anti-film printing capability of the display module 100, and the anti-film printing capability of the display module 100 is better. For example, the thickness of the second adhesive layer 23 can be 10 microns, 20 microns, 50 microns, or 100 microns, etc. The tensile modulus of the second adhesive layer 23 can be 30 KPa, 45 KPa, 50 KPa, or 75 KPa. The second adhesive layer 23 is a silica gel layer.

[0046] In a specific implementation, the thickness of the first adhesive layer 21 can be 70-140 microns, and the tensile modulus of the first adhesive layer 21 can be no greater than 75 KPa, so that the first adhesive layer 21 can also support the display panel 1 to some extent, thereby helping to improve the anti-film printing capability of the display module 100, and the anti-film printing capability of the display module 100 is better. For example, the thickness of the first adhesive layer 21 can be 70 microns, 80 microns, 100 microns, 130 microns, or 140 microns, etc. The tensile modulus of the first adhesive layer 21 can be 30 KPa, 45 KPa, 50 KPa, or 75 KPa. The first adhesive layer 21 is a silica gel layer.

[0047] Figure 6 is a partial cross-sectional view of another display module 100 according to an embodiment of the present application. As shown in Figure 6, in some embodiments, the support layer 22 includes, in order from the direction away from the backlight surface of the display panel 1, a first sub-support layer 221, a third adhesive layer 222, a heat-conducting layer 223, a fourth adhesive layer 224, and a second sub-support layer 225. That is, the first sub-support layer 221 is attached to the backlight surface of the display panel through the first adhesive layer 21, the heat-conducting layer 223 is attached to the surface of the first sub-support layer 221 away from the display panel 1 through the third adhesive layer 222, the second sub-support layer 225 is attached to the surface of the heat-conducting layer 223 away from the display panel 1 through the fourth adhesive layer 224, and the copper layer 24 is attached to the surface of the second sub-support layer 225 away from the display panel 1 through the second adhesive layer 23. In this scheme, the heat-conducting layer 223 can achieve heat conduction. Compared with the scheme in which a vapor chamber (VC) is arranged on the surface of the copper layer 24 away from the light-transmitting cover plate, in this scheme, the heat-conducting layer 223 is arranged in the display module 100, and the area of the heat-conducting layer 223 can be larger. Thus, on the basis of achieving weight reduction of the display module 100, the display module 100 provided in this scheme can also enhance the heat conduction capacity of the display module 100 through the heat-conducting layer 223. Exemplarily, the heat-conducting layer 223 can be a graphite layer.

[0048] Figure 7 is a schematic view of the positional relationship between the heat-conducting layer 223 and the edge sealing region in a display module 100 according to an embodiment of the present application. Please refer to Figures 6 and 7 together. In some embodiments, the edge of the third adhesive layer 222 and the edge of the fourth adhesive layer 224 can both exceed the edge of the heat-conducting layer 223, and the edge of the third adhesive layer 222 is attached to the edge of the fourth adhesive layer 224 to form an edge sealing region, so as to seal the heat-conducting layer 223 and avoid delamination of the heat-conducting layer 223, thereby ensuring the heat conduction performance of the heat-conducting layer 223.

[0049] Please continue to refer to Figure 7. In some embodiments, the edge of the display module 100 has a curved area, the heat-conducting layer 223 is located within the range surrounded by the curved area A, and the distance C between the edge of the heat-conducting layer 223 and the inner edge of the curved area A is 1-5 millimeters, that is, the edge of the heat-conducting layer 223 is recessed by 1-5 millimeters from the edge of the planar area B of the display module 100, so as to avoid the heat-conducting layer 223 from entering the curved area and causing problems such as adhesion mark and wrinkle. Exemplarily, the distance between the edge of the heat-conducting layer 223 and the inner edge of the curved area is 1 millimeter, 2 millimeters, or 5 millimeters, etc.

[0050] In some embodiments, the sum of the thicknesses of the first sub-support layer 22 and the third adhesive layer 222 can be 5-20 microns, for example, 5 microns, 10 microns, 15 microns, or 20 microns, so that the first sub-support layer 212 and the third adhesive layer 222 can play a certain supporting role, and the display module 100 has stronger anti-film printing capability.

[0051] When the heat-conducting layer 223 is specifically configured, the thickness of the heat-conducting layer 223 can be 10-25 microns, for example, 10 microns, 20 microns, or 25 microns, so that the heat-conducting layer 223 can also play a certain supporting role, thereby improving the anti-film printing capability of the display module 100.

[0052] In some possible embodiments, the sum of the thicknesses of the fourth adhesive layer 224 and the second sub-support layer 225 can be 5-20 microns, for example, 5 microns, 10 microns, 15 microns, or 20 microns, so that the fourth adhesive layer 224 and the second sub-support layer 22 can also play a supporting role, and the display module 100 has stronger anti-film printing capability.

[0053] In a possible embodiment, the tensile modulus of the first sub-support layer 221 and the second sub-support layer 225 is not less than 5 Gpa, so as to play a better supporting role, and the display module 100 has stronger anti-film printing capability. For example, the first sub-support layer 221 can be one of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cyclic olefin polymer layer, and a cellulose triacetate layer. The first sub-support layer 221 can also be a laminate composed of at least two of the polyethylene terephthalate layer, the polyimide layer, the polymethyl methacrylate layer, the cyclic olefin polymer layer, and the cellulose triacetate layer. For example, the first sub-support layer 221 is a laminate composed of a polyethylene terephthalate layer and a polyimide layer, or the first sub-support layer 221 is a laminate composed of a polyimide layer, a polymethyl methacrylate layer, and a cyclic olefin polymer layer, or the first sub-support layer 22 is another combination of the above layers, which is not listed one by one here. The second sub-support layer 225 can also be one of a polyethylene terephthalate layer, a polyimide layer, a polymethyl methacrylate layer, a cyclic olefin polymer layer, and a cellulose triacetate layer. The second sub-support layer 225 can also be a laminate composed of at least two of the polyethylene terephthalate layer, the polyimide layer, the polymethyl methacrylate layer, the cyclic olefin polymer layer, and the cellulose triacetate layer, which is not listed one by one here.

[0054] FIG. 9 is a partial sectional view of a display module 100 according to an embodiment of the present application. As shown in FIG. 9, the display module 100 includes a display panel 1 and a support back plate disposed on the backlight side of the display panel 1. The support back plate includes, in order from the direction away from the backlight side of the display panel 1, a first adhesive layer 21, a first sub-support layer 221, a third adhesive layer 222, a heat conduction layer 223, a fourth adhesive layer 224, and a second sub-support layer 225, a second adhesive layer 23, and a copper layer 24. The first adhesive layer 21 and the second adhesive layer 23 are both silicone gel layers. The thickness of the first adhesive layer 21 can be 100 microns, and the thickness of the second adhesive layer 23 can be 20 microns. The first sub-support layer 221 and the second sub-support layer 225 can both be polyethylene terephthalate layers. The third adhesive layer 222 and the fourth adhesive layer 224 can both be pressure sensitive adhesive tapes (PSA). The thickness of the first sub-support layer 221, the second sub-support layer 225, the third adhesive layer 222, and the fourth adhesive layer 224 can all be 5 microns. The heat conduction layer 223 can be a graphite layer, and the thickness of the graphite layer can be 20 microns. In this solution, the heat dissipation capacity of the display module 100 is 0.7 / mA / °C, the anti-extrusion printing ability of the display module 100 is improved by 46% compared to related art, and the display module 100 is reduced in weight by 0.88-2.57 g.

[0055] Fig. 10 is a partial cross-sectional view of a display module according to an embodiment of the present application, and Fig. 11 is a partial cross-sectional view of another display module according to an embodiment of the present application. As shown in Figs. 10 and 11, in some embodiments, a display module 100 includes a light-transmissive cover plate 3 and a screen stack having a display surface and a backlight surface, and the light-transmissive cover plate 3 is attached to the light-exiting surface of the screen stack by adhesive. Exemplarily, the material of the light-transmissive cover plate can be glass, and the light-transmissive cover plate 3 and the screen stack are attached together by an optically clear adhesive (OCA). The display panel 1 is a part of the screen stack, and specifically, the screen stack includes, in sequence from the direction away from the light-transmissive cover plate, an optically clear adhesive (OCA) 4, a polarizer (POL) 5, a display panel 1 (panel), and a back film (BF) 6, wherein the optically clear adhesive 4 is used to bond the module materials, the polarizer 5 is used to eliminate the influence of external ambient light, the display panel 1 is used to realize display and touch functions, and the back film 6 is used to support and protect the display panel 1. In other embodiments, the polarizer 5 can be replaced by a color filter on encapsulation (COE), which can also achieve the effect of eliminating the influence of ambient light. Please refer to Figs. 4a and 4b, and take the structural member 200 including the middle frame 110 and the back cover 120 as an example. The light-transmissive cover plate 3 is attached to the end of the middle frame 110 away from the back cover 120, the screen stack is located in the space jointly formed by the light-transmissive cover plate and the middle frame 110, and the support back plate 2 is attached to the middle frame 110 by adhesive.

[0056] It is worth noting that the display module 100 mentioned in the present application can be a straight screen, that is, the light-transmissive cover plate and the screen stack of the display module 100 are both flat, as shown in Figs. 12a and 12b, wherein Fig. 12a is a top view of a display module 100, and Fig. 12b is a bottom view of the display module 100 shown in Fig. 12a. The display module 100 mentioned in the present application can also be a curved screen, for example, the display module 100 is a “2.5D screen”, that is, the screen stack of the display module 100 is flat, and the edges of the light-transmissive cover plate are rounded to form a curved area, or the display module 100 is a “3D screen”, that is, the screen stack of the display module 100 and the edges of the light-transmissive cover plate both have a curved area Q, as shown in Fig. 13, wherein Fig. 13 is a side view of a display module 100.

[0057] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A display module, characterized in that, The device includes a display panel and a support backplate. The display panel includes a display surface and a backlight surface. The support backplate is disposed on the backlight surface. The support backplate includes a first adhesive layer, a support layer, a second adhesive layer, and a copper layer arranged sequentially in a direction away from the backlight surface. The density of the support layer is less than the density of the copper layer, and the anti-film printing ability of the support layer is greater than or equal to the anti-film printing ability of the copper layer.

2. The display module as described in claim 1, characterized in that, The thickness of the support layer is 15–35 micrometers, and the thickness of the copper layer is 9–35 micrometers.

3. The display module as described in claim 1 or 2, characterized in that, The tensile modulus of the support layer is greater than or equal to 5 GPa.

4. The display module as described in any one of claims 1-3, characterized in that, The support layer is a laminate composed of one or at least two of the following: polyethylene terephthalate layer, polyimide layer, polymethyl methacrylate layer, cyclic olefin polymer layer, and cellulose triacetate layer.

5. The display module as described in any one of claims 1-3, characterized in that, The support layer includes a first sub-support layer, a third adhesive layer, a thermally conductive layer, a fourth adhesive layer, and a second sub-support layer arranged sequentially in a direction away from the backlight surface.

6. The display module as described in claim 5, characterized in that, The edges of the third adhesive layer and the fourth adhesive layer both extend beyond the edge of the thermally conductive layer, and the edge of the third adhesive layer is bonded to the edge of the fourth adhesive layer.

7. The display module as described in claim 5 or 6, characterized in that, The edge of the display module has a curved area, the heat-conducting layer is located within the area enclosed by the curved area, and the distance between the edge of the heat-conducting layer and the inner edge of the curved area is 1 to 5 millimeters.

8. The display module as described in any one of claims 5-7, characterized in that, The sum of the thicknesses of the first sub-support layer and the third adhesive layer is 5–20 micrometers; and / or The thickness of the thermally conductive layer is 10–25 micrometers; and / or The combined thickness of the fourth adhesive layer and the second sub-support layer is 5 to 20 micrometers.

9. The display module as described in any one of claims 5-8, characterized in that, The tensile modulus of both the first sub-support layer and the second sub-support layer is not less than 5 GPa.

10. The display module according to any one of claims 1-9, characterized in that, The thickness of the first adhesive layer is 70 to 140 micrometers, and the tensile modulus of the first adhesive layer is not greater than 75 kPa.

11. The display module as described in any one of claims 1-10, characterized in that, The thickness of the second adhesive layer is 10 to 100 micrometers, and the tensile modulus of the second adhesive layer is not greater than 75 kPa.

12. An electronic device, characterized in that, Includes the display module as described in any one of claims 1-11.

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