Coil member, method for manufacturing coil member, and electronic / electrical machine

Abstract

The coil component 100 of the present invention, which simultaneously solves the problems of miniaturization and shape stability of coil components, includes a coil conductor portion 20, comprising a first helical conductor portion 11 and a second helical conductor portion 21, both of which are helical in shape when viewed along a first direction and are arranged along the first direction; and a through-hole portion VP, electrically connected to the inner peripheral end portion 12 of the first helical conductor portion 11 and the inner peripheral end portion 22 of the second helical conductor portion 21; and having a conductive path from the outer peripheral end portion 13 of the first helical conductor portion 11 through the through-hole portion VP to the outer peripheral end portion 23 of the second helical conductor portion 21. The coil conductor portion 20 has first conductor portions 11A and 21A extending along the conductive path and made of a first conductive material; and second conductor portions 11B and 21B made of a second conductive material and covering at least a portion of the first conductor portion 11A. The second conductor portion 11B is disposed in at least a portion of the first end portion 11F of the first helical conductor portion 11 on the side opposite to the second helical conductor portion 21.

Description

Technical Field

[0001] This invention relates to a coil component and a method for manufacturing the same, as well as an electronic / electrical machine in which the coil component is mounted. Background Technology

[0002] Patent document 1 discloses a coil component comprising: a body including a coil having a top coil and a bottom coil connected to each other via a through hole; and an external electrode disposed on the outer surface of the body and connected to the coil, wherein a first insulating layer is disposed on the surface of the top coil and a second insulating layer is disposed on the surface of the bottom coil, and the first and second insulating layers are configured to extend between the top coil and the bottom coil.

[0003] As a method for manufacturing the aforementioned coil component, a method comprising the following steps is described: a step of preparing an insulating film; a step of processing a through hole penetrating the insulating film; a step of disposing a conductive layer along the surface of the insulating film including the upper and lower surfaces of the insulating film and the through hole; a step of disposing a patterned insulating wall on the conductive layer; a step of filling the opening of the patterned insulating wall with a plating layer; a step of removing the insulating wall and the conductive layer disposed between the insulating wall and the insulating film; a step of removing the insulating film; and a step of forming an insulating layer covering the entire exposed surface.

[0004] [Existing Technical Documents] [Patent Literature] [Patent Document 1] U.S. Patent Application Publication No. 2020 / 0027643 Summary of the Invention [The problem the invention aims to solve] In the manufacturing method disclosed in Patent Document 1, the thickness of the insulating film is the spacing between the top coil and the bottom coil. Since the insulating film and the insulating wall together form the negative pattern of the top and bottom coils, if its thickness is made too thin, the shape stability of the negative pattern will be reduced, resulting in an unstable coil shape. Therefore, the insulating film needs to have a thickness that ensures a specified rigidity. However, the spacing between the top and bottom coils, set based on this thickness, is a dead space in the coil component, becoming an obstacle to miniaturization. Therefore, in the manufacturing method disclosed in Patent Document 1, miniaturization and coil shape stability are inversely related in the built-in coil component.

[0005] The purpose of this invention is to provide a coil component that can simultaneously solve the problems of miniaturization of coil components and stability of coil shape, a method for manufacturing the coil component, and an electronic / electrical machine in which the coil component is mounted.

[0006] [Technical means to solve the problem] In order to solve the above-mentioned problems, the inventors of this application have explored and obtained a novel insight that the distance between the top coil and the bottom coil can be shortened by setting other conductive layers in the space obtained after removing the insulating layer.

[0007] Based on this understanding, one embodiment of the present invention is a coil component comprising a coil conductor portion including a first helical conductor portion and a second helical conductor portion, each of which is helical in shape and arranged along the first direction when viewed along the first direction; and a through-hole portion electrically connecting the inner peripheral end of the first helical conductor portion and the inner peripheral end of the second helical conductor portion. The coil conductor portion has a conductive path from the outer peripheral end of the first helical conductor portion through the through-hole portion to the outer peripheral end of the second helical conductor portion. The coil conductor portion has: a first conductor portion extending along the conductive path and made of a first conductive material; and a second conductor portion made of a second conductive material and covering at least a portion of the first conductor portion, the second conductor portion being disposed at least a portion of a first end of the first helical conductor portion on the side opposite to the second helical conductor portion. In this coil component, the second conductor portion corresponds to the "other conductive layer" in the above understanding.

[0008] In the above-described coil component, at least a portion of the turn of the first helical conductor portion may have a first corner portion that connects the surface of the first end to the side surface along the first direction in a continuous manner.

[0009] In the manufacturing method disclosed in Patent Document 1, a coil is manufactured by arranging a conductive layer within a region surrounded by a patterned insulating wall and an insulating film. Therefore, when the insulating wall and insulating film in contact with the conductive layer are removed, sharp corners easily form at the boundary between the insulating wall and the insulating film. It is difficult to form an insulating layer at these corners, and even if formed, they are prone to peeling off. Therefore, if the coil portion is covered with a material containing magnetic powder, there is concern that direct contact between the magnetic powder and the coil may occur at the corners. Such direct contact could cause fatal defects in the coil component, such as short circuits. Therefore, as described above, instead of directly forming the insulating layer on the conductive layer (first conductor portion) that previously contacted the boundary between the insulating wall and the insulating film, the insulating layer is formed after covering the conductive layer (first conductor portion) with another conductive layer (second conductor portion). This alleviates the sharpness of the corner shape of the formed insulating layer, stabilizes the formation of the insulating layer at the corners, and makes the formed insulating layer less prone to peeling off.

[0010] When the coil component has a first corner, in the first cross-section obtained by cutting through the first corner and along the first direction, the cross-sectional line drawn by the first corner can have an approximately arc shape, and its radius of curvature is greater than the radius of curvature of the cross-sectional line drawn in the first cross-section between the interface between the second conductor portion and the portion located inside the second conductor portion and made of conductive material.

[0011] In the above-described coil component, a third conductor portion made of a third conductive material may be provided between the second conductor portion disposed at the first end and the first conductor portion covered by the second conductor portion.

[0012] In the above-described coil component, the second conductor portion may also be disposed at least in a portion of the second end portion of the second spiral conductor portion on the side opposite to the first spiral conductor portion.

[0013] In the aforementioned coil component, at least a portion of the turns of the second helical conductor portion preferably has a second corner portion that connects the surface of the second end portion with the side surface along the first direction in a continuous manner. In this case, in the second cross-section obtained by cutting through the second corner portion and along the first direction, the cross-sectional line depicted by the second corner portion can have an approximately arc shape, the radius of curvature of which is greater than the radius of curvature of the cross-sectional line depicted in the second cross-section of the interface between the portion located inside the second conductor portion and made of conductive material and the second conductor portion.

[0014] In the case where the coil component has a second corner, a third conductor portion made of a third conductive material may be provided between the second conductor portion disposed at the second end and the first conductor portion covered by the second conductor portion.

[0015] In the above-described coil component, at least one of the first helical conductor portion and the second helical conductor portion may have two turns arranged in a direction intersecting the first direction, and may have a first insulating portion covering at least a portion of two opposite sides of the two turns. The first insulating portion is equivalent to the "insulating layer" in the above-described view.

[0016] When the first insulating portion is provided as described above, the first insulating portion may have: a portion that contacts one of the two turns; a portion that contacts the other of the two turns; and a first connecting portion that is continuously disposed from these portions and extends in a direction intersecting the first direction, the first connecting portion having a thickness in the first direction that is less than that of the portion of the first insulating portion that contacts either of the two turns.

[0017] When the first insulating portion is provided, the first insulating portion may have an intermediate portion located between the turn of the first spiral conductor portion and the turn of the second spiral conductor portion, wherein at least one of an interface and a pore may be present in the intermediate portion.

[0018] When the first insulating portion is provided as described above, the first insulating portion may be present to cover each of the two opposing sides of the two turns, and at least one of linear intersection and closed space may exist between these first insulating portions.

[0019] When the first insulating portion is provided, a second insulating portion made of a material different from that constituting the first insulating portion may be provided in at least a portion between the first spiral conductor portion and the second spiral conductor portion. In this case, a third conductor portion made of a third conductive material may be provided between the second conductor portion disposed at the first end and the first conductor portion covered by the second conductor portion.

[0020] The coil component described above may also include: a body portion containing magnetic powder and covering the portion other than the two ends of the coil conductor portion; and external electrodes disposed on the body portion and electrically connected to the two ends of the coil conductor portion exposed from the body portion.

[0021] In another embodiment, the present invention provides an electronic / electrical device incorporating the aforementioned coil component, wherein the coil component is connected to a substrate at the external electrode. Examples of such electronic / electrical devices include power supply units equipped with power switching circuits, voltage boosting circuits, smoothing circuits, etc., or small portable communication devices. Because the electronic / electrical device of the present invention incorporates the aforementioned coil component, it exhibits excellent quality and size.

[0022] In another embodiment, the present invention provides a method for manufacturing a coil component, the coil component comprising a coil conductor portion including a first helical conductor portion and a second helical conductor portion, each of which is helical in shape and arranged along the first direction when viewed along the first direction; and a through-hole portion electrically connecting the inner peripheral end of the first helical conductor portion and the inner peripheral end of the second helical conductor portion, the coil conductor portion having a conductive path from the outer peripheral end of the first helical conductor portion through the through-hole portion to the outer peripheral end of the second helical conductor portion. The coil conductor portion has a first conductor portion extending along the conductive path and made of a first conductive material, and a second conductor portion made of a second conductive material and covering at least a portion of the first conductor portion. The first conductor portion has a first portion corresponding to the first helical conductor portion, a second portion corresponding to the second helical conductor portion, and a third portion corresponding to the through-hole portion. The manufacturing method includes: forming a first portion on one side of the main surface of an insulating sheet substrate having a through hole, forming a second portion on the other side of the main surface of the sheet substrate, and forming the third portion inside the through hole; removing portions of the sheet substrate that are neither opposite to the first portion nor to the second portion, and removing at least a portion of a first opposing portion of the first portion facing the side closest to the second portion, and at least a portion of a second opposing portion of the second portion facing the side closest to the first portion; and forming a second conductor portion to cover an exposed portion of a component made of conductive material containing the first conductor portion.

[0023] In the sheet substrate, since at least a portion of the first opposing portion facing the surface of the first portion near the second portion and the second opposing portion facing the surface of the second portion near the first portion are removed, a second conductor portion is formed on at least a portion of the portion consisting of the first opposing portion and the second opposing portion, thereby shortening the distance between the first spiral conductor portion and the second spiral conductor portion in the first direction.

[0024] In this case, the corner of the second conductor portion formed by covering the corner of the first part where the surface intersects the first direction and the first opposite part are connected has a shape in which the surface along the first direction and the surface intersecting the first direction are connected by a continuous surface. Therefore, a layer (first insulating part) made of insulating material can be easily formed on the corner of the second conductor portion, and the formed layer (first insulating part) is not easily peeled off from the second conductor portion. Similarly, the corner of the second conductor portion formed by covering the corner of the second part where the surface intersects the first direction and the second opposite part are connected has a shape in which the surface along the first direction and the surface intersecting the first direction are connected by a continuous surface. Therefore, a layer (first insulating part) made of insulating material can be easily formed on the corner of the second conductor portion, and the formed layer (first insulating part) is not easily peeled off from the second conductor portion.

[0025] When the second conductor portion is formed by plating as described above, the main surface of the sheet substrate may have a third conductor portion made of a third conductive material. The first conductor portion can be formed by electrolytic plating with current applied to the third conductor portion, and the exposed portion forming the second conductor portion may have a portion made of the third conductor portion. In this case, the treated area of ​​the main surface of the sheet substrate undergoing electrolytic plating may include a negative pattern of the insulating layer formed on the third conductor portion. Before removing the sheet substrate, the insulating layer and portions of the third conductor portion that are not in contact with the first conductor portion can be removed. Furthermore, the third conductive material is preferably a material with different etching characteristics than the first conductive material.

[0026] When the coil component has a third conductor portion as described above, the treated area of ​​the main surface of the sheet substrate subjected to the electrolytic plating treatment may include a pattern of the third conductor portion having a shape corresponding to the first portion and the second portion.

[0027] In the above-described method for manufacturing the coil component, insulating material constituting the sheet-like substrate may remain in at least a portion between the first portion and the second portion. In this case, the insulating material may have portions in contact with the first portion and the second portion, or the sheet-like substrate may have a structure in which inorganic particles are dispersed in a matrix portion made of organic material, and the insulating material may contain the inorganic particles.

[0028] In the above-described method for manufacturing coil components, a first insulating portion may also be formed to cover at least a portion of the second conductor portion.

[0029] [The effects of the invention] According to the present invention, a coil component capable of simultaneously solving the problems of miniaturization and coil shape stability can be provided. When this coil component is installed in an electronic / electrical device, the quality of the electronic / electrical device can be stabilized, or the size of the electronic / electrical device can be reduced. Furthermore, according to the present invention, a method for manufacturing the above-described coil component can be provided. Attached Figure Description

[0030] Figure 1 This is a perspective view conceptually illustrating the shape of a coil component according to an embodiment of the present invention.

[0031] Figure 2 This is a diagram illustrating the structure of the coil conductor portion of a coil component according to an embodiment of the present invention.

[0032] Figure 3 This is an XY plan view illustrating the structure of the first helical conductor portion of the coil component according to an embodiment of the present invention.

[0033] Figure 4 This is an XY plan view illustrating the structure of the second helical conductor portion of the coil component according to an embodiment of the present invention.

[0034] Figure 5 yes Figure 2 XZ cross-section at line A-A'.

[0035] Figure 6 yes Figure 5 A magnified view of a portion of the image.

[0036] Figure 7 yes Figure 6 A magnified view of a portion of the image.

[0037] Figure 8 This is an explanatory diagram illustrating the detailed structure (first specific example) of the first insulating portion of a coil component according to an embodiment of the present invention.

[0038] Figure 9 This is an explanatory diagram illustrating the detailed structure (second specific example) of the first insulating portion of a coil component according to an embodiment of the present invention.

[0039] Figure 10 This is an explanatory diagram illustrating the detailed structure (third specific example) of the first insulating portion of the coil component according to an embodiment of the present invention.

[0040] Figure 11 This is an explanatory diagram illustrating the detailed structure (fourth specific example) of the first insulating portion of the coil component according to an embodiment of the present invention.

[0041] Figure 12This is an explanatory diagram illustrating the detailed structure of the first insulation portion of the coil component according to an embodiment of the present invention (a variation of the second specific example 1).

[0042] Figure 13 This is an explanatory diagram illustrating the detailed structure of the first insulating portion of the coil component according to an embodiment of the present invention (a variation of the second specific example 2).

[0043] Figure 14 This is an explanatory diagram illustrating the detailed structure of the first insulation portion of the coil component according to an embodiment of the present invention (a variation of the second specific example, 3).

[0044] Figure 15 This is an XZ cross-sectional view for illustrating a modified example of the second conductor portion of a coil component according to an embodiment of the present invention.

[0045] Figure 16 This is an explanatory diagram (1) illustrating an example of a method for manufacturing a coil component according to an embodiment of the present invention.

[0046] Figure 17 This is an explanatory diagram (Figure 2) illustrating an example of a method for manufacturing a coil component according to an embodiment of the present invention.

[0047] Figure 18 This is an explanatory diagram (3) illustrating an example of a method for manufacturing a coil component according to an embodiment of the present invention.

[0048] Figure 19 This is an explanatory diagram (4) illustrating an example of a method for manufacturing a coil component according to an embodiment of the present invention.

[0049] Figure 20 This is an explanatory diagram (5) illustrating an example of a method for manufacturing a coil component according to an embodiment of the present invention. Detailed Implementation

[0050] The following is a reference to the appendix. Figure 1 The embodiments of the present invention will be described in detail below.

[0051] Figure 1 This is a perspective view conceptually illustrating the shape of a coil component according to an embodiment of the present invention. Figure 2 This diagram illustrates the structure of the coil conductor portion of a coil component according to an embodiment of the present invention. Figure 2 For ease of explanation, the coil conductor is depicted with solid lines, the body is depicted with dashed lines, and the representation of other constituent elements is omitted. Figure 3 This is an XY plan view illustrating the structure of the first helical conductor portion of the coil component according to an embodiment of the present invention. Figure 4This is an XY plan view illustrating the structure of the second helical conductor portion of the coil component according to an embodiment of the present invention. Furthermore, Figure 3 The coil conductor portion is depicted as viewed from the Z1 side in the Z1-Z2 direction. Figure 4 The coil conductor section as seen from the Z2 side in the Z1-Z2 direction is depicted.

[0052] (Overall composition) According to one embodiment of the present invention, the coil component 100 includes: a coil portion 10 having a coil conductor portion 20, a body portion 30, a first external electrode 41, a second external electrode 42, and outer casings 50 and 60.

[0053] (coil) like Figure 2 and Figure 3 As shown, the coil portion 10 has a coil conductor portion 20, including a first helical conductor portion 11. An inner circumferential end portion 12, which is the inner circumferential end portion of the first helical conductor portion 11, extends towards an outer circumferential end portion 13, which is the outer circumferential end portion of the first helical conductor portion 11, forming a helical shape away from the axis O extending along the first direction (Z1-Z2 direction). Figure 2 In this embodiment, the first helical conductor portion 11 is provided with a helical conductor that, when viewed from the Z1 side in the Z1 direction (Z1-Z2 direction), extends clockwise away from the axis O from the inner peripheral end 12 to the outer peripheral end 13. In this specification, the "helical direction" in the first helical conductor portion 11 refers to the direction extending from the inner peripheral end 12 to the outer peripheral end 13. The same applies to the second helical conductor portion 21, which will be described later.

[0054] The conductor (conductive material) constituting the coil conductor portion 20 is not limited as long as it has suitable conductivity. Copper, copper alloys, aluminum, aluminum alloys, and other metals are specific examples of conductors constituting the coil conductor portion 20. For example, the coil conductor portion 20 can be manufactured using film-forming techniques such as plating. The coil portion 10 has an insulating coil insulation portion (…) on the surface of the coil conductor portion 20. Figures 1 to 4 (Not shown). This coil insulation ensures insulation between adjacent conductors (between opposing conductor surfaces) in the coil conductor section 20. The coil insulation is made of, for example, resin material. No coil insulation is provided at the two ends of the coil conductor section 20 (first lead-out end face 14E, second lead-out end face 24E), where the coil section 10 can be electrically connected to other components.

[0055] like Figure 2 and Figure 4As shown, the coil conductor portion 20 has a second helical conductor portion 21 arranged side-by-side with the first helical conductor portion 11 along a first direction. The second helical conductor portion 21 extends from its inner circumferential end 22 (as its inner circumferential end) towards its outer circumferential end 23 (as its outer circumferential end) around an axis O extending along the first direction (Z1-Z2 direction), exhibiting a helical shape away from the axis O. The second helical conductor portion 21 is arranged such that, when viewed from the Z1 side in the Z1-Z2 direction, it presents a direction opposite to that of the first helical conductor portion 11. Figure 2 The coil component 100 is a helical conductor (rotating counterclockwise) away from axis O. The average value of the spacing in the first direction (Z1-Z2 direction) between the first helical conductor portion 11 and the second helical conductor portion 21 is not particularly limited. A smaller spacing makes it easier to reduce the height (Z1-Z2 direction dimension) of the coil component 100, but if it is too small, the insulation between the first helical conductor portion 11 and the second helical conductor portion 21 is easily reduced. From the viewpoint of balancing a low height of the coil component 100 and high insulation between the first helical conductor portion 11 and the second helical conductor portion 21, the spacing is preferably 0.4 μm or more and 20 μm or less. In terms of manufacturing, to reduce spacing deviations and more reliably support the coil in the same plane, the spacing is more preferably 1.0 μm or more, and even more preferably 5.0 μm or more.

[0056] The inner circumferential end 12 of the first helical conductor portion 11 and the inner circumferential end 22 of the second helical conductor portion 21 are electrically connected through a through-hole portion VP. The through-hole portion VP can be made of the same conductor as the coil conductor portion 20. In a specific example, the through-hole portion VP is made of the same material as the first helical conductor portion 11 and the second helical conductor portion 21, and is manufactured simultaneously with the first helical conductor portion 11 and the second helical conductor portion 21. In this case, the through-hole portion VP is integrated with the inner circumferential end 12 of the first helical conductor portion 11 and the inner circumferential end 22 of the second helical conductor portion 21.

[0057] A first lead-out portion 14 is continuously provided on the outer peripheral end 13 of the first helical conductor portion 11, and a second lead-out portion 24 is continuously provided on the outer peripheral end 23 of the second helical conductor portion 21. Therefore, the outer peripheral end 13 of the first helical conductor portion 11 is essentially the interface with the first lead-out portion 14, and the outer peripheral end 23 of the second helical conductor portion 21 is essentially the interface with the second lead-out portion 24. In a specific example, the first lead-out portion 14 and the second lead-out portion 24 are made of the same material as the first helical conductor portion 11 and the second helical conductor portion 21, and are manufactured simultaneously with them. In this case, the first lead-out portion 14 is seamlessly integrated with the outer peripheral end 13 of the first helical conductor portion 11, and the second lead-out portion 24 is seamlessly integrated with the outer peripheral end 23 of the second helical conductor portion 21.

[0058] That is, in this embodiment, the coil conductor portion 20 includes a first helical conductor portion 11 and a second helical conductor portion 21, a through hole portion VP, and a first lead-out portion 14 and a second lead-out portion 24, which are formed of a common conductive material. Thus, the coil conductor portion 20 has a conductive path from the outer peripheral end 13 of the first helical conductor portion 11 through the first helical conductor portion 11 to the inner peripheral end 12, through the through hole portion VP that contacts the inner peripheral end 12 to the inner peripheral end 22 of the second helical conductor portion 21, and from the inner peripheral end 22 through the second helical conductor portion 21 to the outer peripheral end 23 of the second helical conductor portion 21.

[0059] Figure 5 This describes the XZ plane (composed of) the coil section structure of the coil component according to an embodiment of the present invention. Figure 2 A cross-sectional view (XZ section) of the surface shown by line A-A'. Furthermore, in Figure 5 In the middle, elements other than the coil part 10 are hidden.

[0060] like Figure 5 As shown in the cross-section, the turns of the first helical conductor portion 11 and the turns of the second helical conductor portion 21 are arranged along a first direction. The first helical conductor portion 11 has a turn located at the innermost periphery, namely a first inner peripheral side turn 111, a turn located at the outermost periphery, namely a first outer peripheral side turn 113, and a turn located between them, namely a first central turn 112; the second helical conductor portion 21 has a turn located at the innermost periphery, namely a second inner peripheral side turn 211, a turn located at the outermost periphery, namely a second outer peripheral side turn 213, and a turn located between them, namely a second central turn 212.

[0061] The second inner peripheral side ring 211 is located on the Z2 side of the first inner peripheral side ring 111 in the Z1-Z2 direction, the second outer peripheral side ring 213 is located on the Z2 side of the first outer peripheral side ring 113 in the Z1-Z2 direction, and the second central ring 212 is located on the Z2 side of the first central ring 112 in the Z1-Z2 direction. Figure 5 In the coil section 10 shown, there is no second lead-out section 24 on the Z2 side of the outer peripheral end 13 of the first helical conductor section 11 in the Z1-Z2 direction, and there is no first lead-out section 14 on the Z1 side of the outer peripheral end 23 of the second helical conductor section 21 in the Z1-Z2 direction.

[0062] (First conductor section, second conductor section) Figure 6 yes Figure 5 A magnified view of the area enclosed by the dashed line. Figure 7 yes Figure 6 A magnified view of the area surrounded by a chain line.

[0063] like Figure 5 and Figure 6 As shown, the first spiral conductor portion 11 has a first conductor portion 11A extending along a conductive path from the outer peripheral end portion 13 of the first spiral conductor portion 11 through the through hole portion VP to the outer peripheral end portion 23 of the second spiral conductor portion 21 and is made of a first conductive material, and a second conductor portion 11B made of a second conductive material and covering at least a portion of the first conductor portion 11A.

[0064] As described below, in one example, the first conductor portion 11A and the second conductor portion 11B are manufactured using different manufacturing processes. In this case, even if the materials are homogeneous (e.g., materials containing Cu, such as Cu, Cu alloys, etc.), they can be identified by cross-sectional observation due to differences in their tectonic characteristics such as crystal structure, crystal orientation, and crystal growth direction. In a specific example, the first conductor portion 11A is composed of an electrolytically plated precipitate, and the second conductor portion 11B is composed of a plating precipitate. In this case, the plating precipitate can be either an electrolytically plated precipitate or an electroless plating precipitate. From the viewpoint of improving the controllability of the thickness of the second conductor portion 11B, the plating precipitate is preferably an electrolytically plated precipitate.

[0065] In this embodiment, at the end of the first conductor portion 11A opposite to the second spiral conductor portion 21 along the first direction (Z1-Z2 direction) (Z2 side of the Z1-Z2 direction), a [missing information] is provided. Figure 6 The third conductor portion 11C is shown. The third conductive material constituting the third conductor portion 11C is not limited. It can be the same as the material constituting the first conductor portion 11A (e.g., Cu, Cu alloys, or other Cu-containing materials), or it can be different. From a manufacturing point of view (as the bottom film of the electrolytic plating layer), the third conductor portion 11C is preferably made of a material containing at least one of Ni and Cr. The etching characteristics of the material constituting the first conductor portion 11A and the material constituting the third conductor portion 11C are preferably different. For example, when the first conductor portion 11A is made of Cu and the third conductor portion 11C is made of Ni, Ni can be etched with high selectivity depending on the etching conditions. The third conductor portion 11C can be a film or a laminate of different materials.

[0066] In this embodiment, the second conductor portion 11B is configured to cover at least a portion, specifically all, of the first end portion 11F of the first spiral conductor portion 11 opposite to the second spiral conductor portion 21.

[0067] The second helical conductor portion 21, like the first helical conductor portion 11, has a first conductor portion 21A extending along the conductive path and made of a first conductive material, and a second conductor portion 21B made of a second conductive material and covering at least a portion of the first conductor portion 21A. Furthermore, in this embodiment, at the end of the first conductor portion 21A on the side opposite to the first helical conductor portion 11 along the first direction (Z1-Z2 direction) (Z1 side of the Z1-Z2 direction), a third conductor portion 21C made of a third conductive material is also provided (see reference). Figure 6 Furthermore, the second conductor portion 21B is configured to cover at least a portion, specifically all, of the second end portion 21F of the second spiral conductor portion 21 on the side opposite to the first spiral conductor portion 11.

[0068] As described above, since a second conductor portion 11B is provided at both the first end 11F and the second end 21F, the distance between the first helical conductor portion 11 and the second helical conductor portion 21 is shorter than the distance between the third conductor portion 11C and the third conductor portion 21C. When the first conductor portion 11A is formed by electrolytic plating and the third conductor portion 11C is the bottom layer of electrolytic plating, and the second conductor portion 21B is formed by electrolytic plating and the third conductor portion 21C is the bottom layer of electrolytic plating, as described in Patent Document 1, the distance between the first helical conductor portion 11 and the second helical conductor portion 21 is equal to the distance between the third conductor portion 11C and the third conductor portion 21C. However, in this embodiment, since the second conductor portion 11B is located closer to the second helical conductor portion 21 than the third conductor portion 11C, and the second conductor portion 21B is located closer to the first helical conductor portion 11 than the third conductor portion 21C, the distance between the first helical conductor portion 11 and the second helical conductor portion 21 can be shortened. As a result, the dead space is reduced, making it easier to improve the characteristics of the coil component 100 and achieve miniaturization.

[0069] In addition, such as Figure 5 As shown, the first lead-out portion 14 and the second lead-out portion 24 also have the same first conductor portions 14A and 24A, second conductor portions 14B and 24B, and third conductor portions 14C and 24C as the first spiral conductor portion 11 and the second spiral conductor portion 21. That is, the first conductor portions 14A, 11A, 21A, and 24A extend from the end face 14E of the first lead-out portion, sequentially through the first lead-out portion 14, the first spiral conductor portion 11, the through hole portion VP, the second spiral conductor portion 21, and the second lead-out portion 24, to the end face 24E of the second lead-out portion.

[0070] (First corner, second corner) Figure 7 yes Figure 6 A magnified view of the area surrounded by a single chain line. Figure 7The inner circumferential side of the first inner circumferential side turn 111 and the first end 11F side (Z2 side in the Z1-Z2 direction) are shown.

[0071] The first inner peripheral side turn 111 has a surface 11FS connecting the first end 11F with a side surface along the first direction, specifically a first corner 11G connected to the inner peripheral side surface 11SS. Because of this first corner 11G, the surface 11GS of the first corner 11G can be a gentle surface (without sharp bends). On such a surface, the first insulating portion 80 (details described later) is easily formed, and the formed first insulating portion 80 is not easily peeled off. Once the first insulating portion 80 is peeled off, the magnetic powder contained in the body portion 30 will come into direct contact with the first inner peripheral side turn 111 (the first helical conductor portion 11). When the magnetic powder has a metallic component, this contact will become the cause of a short circuit in the coil conductor portion 20 via the magnetic powder. Therefore, the coil component 100 of this embodiment, which has a first helical conductor portion 11 with a first corner 11G, exhibits excellent quality stability.

[0072] In the first cross-section obtained by cutting through the first corner portion 11G along the first direction, the cross-sectional line drawn by the first corner portion 11G has an approximately arc shape, and the radius of curvature of the arc is larger than that of the conductive material located inside the second conductor portion 11B. Figure 7 The third conductor portion 11C, the portion constituting which is connected to the second conductor portion 11B, has its interface IF1 defined by the radius of curvature of the section line depicted in the first cross-section. The first cross-section is typically a surface containing axis O and perpendicular to the XY plane. Figure 7 In the specific example shown, the first cross-section is... Figure 2 The XZ section at line A-A'. A center P is located on the angle bisector L1 of the angle formed by the line formed by the surface 11FS of the first end 11F and the line formed by the inner peripheral surface 11SS of the first inner peripheral side turn 111. The radius R of the line that forms an approximate arc with the surface 11GS of the first corner 11G is larger than the radius of the approximate arc formed by the interface IF1 between the conductive material component (specifically the third conductor 11C) located inside the second conductor 11B and the second conductor 11B, calculated in the same manner.

[0073] Because the radius of this near-circular arc is relatively large, the surface (surface 11GS) forming the first insulating part 80 becomes a gentle surface, which can stably reduce the possibility of short circuit in the coil conductor part 20.

[0074] Although no detailed illustrations are provided, it is as follows: Figure 6As shown, at least a portion of the turns of the second helical conductor portion 21 has a second corner portion 21G that connects the surface of the second end portion 21F with the side surface along the first direction in a continuous plane. Furthermore, in a second cross-section obtained by cutting through this second corner portion 21G along the first direction, the cross-sectional line depicted by the second corner portion 21G has an approximately arc shape, the radius of curvature of which is greater than the radius of curvature of the cross-sectional line depicted in the second cross-section at the interface between the second conductor portion 21B and the portion (third conductor portion 21C) located inside the second conductor portion 21B and made of conductive material. Additionally, the second cross-section, like the first cross-section, is typically a surface containing axis O and orthogonal to the XY plane. A specific example of the second cross-section can be given as... Figure 2 The XZ section at line A-A'.

[0075] (First Insulation Section) The coil insulation portion has a first insulation portion 80, such as Figure 6 As shown, the first insulating portion 80 is provided on at least a portion of the surface of the first helical conductor portion 11 and the surface of the second helical conductor portion 21.

[0076] In this embodiment, the first insulating portion 80 is thermoplastic and contains a thermoplastic resin containing a p-xylene-based polymer. Other examples of thermoplastic resins include polyethylene, polypropylene, polyamide, polyester, polyamide-imide, polyimide, polysulfone, polycarbonate, liquid crystal polymer, polyvinylidene fluoride, and polytetrafluoroethylene. The first insulating portion 80 only needs to be thermoplastic in its entirety; in addition to the aforementioned thermoplastic resins, it may also contain, for example, inorganic insulating particles.

[0077] The first insulating portion 80 preferably has excellent insulation properties; specifically, its volume resistivity, as measured according to ASTM D257, is preferably 1.0 × 10⁻⁶. 14 Ω·cm or higher. More preferably, the volume resistivity is 1.0 × 10⁻⁶ Ω·cm or higher. 15 Ω·cm or above, more preferably 1.0 × 10⁻⁶ 16 Ω·cm or above. There is no particular upper limit to the volume resistivity. The volume resistivity can be 1.0 × 10⁻⁶. 20The dielectric constant is Ω·cm or less. Furthermore, the first insulating portion 80 preferably has good dielectric properties; specifically, its dielectric constant at 60 Hz, measured according to ASTM D150, is preferably 4.0 or less. More preferably, this dielectric constant is 3.5 or less, and even more preferably 3.0 or less. There is no particular limitation on the lower limit of this dielectric constant. The dielectric constant can be 1.0 or higher. The methods for determining the volume resistivity and dielectric constant of the first insulating portion 80 are not limited, as long as equivalent results to those described in ASTM D257 and D150 are expected. For example, a measurement specimen equivalent to the material of the first insulating portion 80 can be prepared in the required size for measurement, and the constituent materials can be determined using analytical methods such as compositional analysis or FT-IR, and then the properties such as the volume resistivity of the material can be evaluated.

[0078] The first insulating portion 80 has a portion that contacts the side of the first helical conductor portion 11 opposite to the side facing the second helical conductor portion 21, that is, a portion of the first helical conductor portion 11 that contacts the portion of the first helical conductor portion 11 facing away from the second helical conductor portion 21 (first facing portion 11FA). Figure 6 In the first inner peripheral side turn 111, the first central turn 112 and the first outer peripheral side turn 113, and the end of the first lead-out portion 14 continuously connected to the first outer peripheral side turn 113 on the Z1 side in the Z1-Z2 direction is the first back part 11FA, and the first insulating portion 80 is configured to contact the first back part 11FA.

[0079] The first insulating portion 80 has a portion that contacts the portion of the second helical conductor portion 21 that is opposite to the first helical conductor portion 11 (the second opposite portion 21FA). Figure 6 In the second inner peripheral side turn 211, the second central turn 212 and the second outer peripheral side turn 213, the ends of the second back-facing portion 21FA on the Z2 side in the Z1-Z2 direction are the second back-facing portion 21FA, and the first insulating portion 80 has a portion that contacts the second back-facing portion 21FA.

[0080] The first insulating portion 80 has a portion that contacts the helical side of the first helical conductor portion 11. Specifically, the side portion is explained by the first inner peripheral side turn 111, which has a side portion facing the inner peripheral side (X1 side in the X1-X2 direction) and a side portion facing the outer peripheral side (X2 side in the X1-X2 direction) and opposite to the first central turn 112. The first insulating portion 80 has a portion that contacts these side portions. Furthermore, the first insulating portion 80 is not provided on the end face (first lead-out end face 14E) of the outer peripheral side end 13 of the first helical conductor portion 11 on the outer peripheral side (X2 side in the X1-X2 direction). This is to allow for electrical connection with other components (first external electrode 41).

[0081] The first insulating portion 80 has a portion that contacts the side portion along the helical direction of the second helical conductor portion 21. Specifically, the side portion is explained using the second inner peripheral side turn 211, which has a side portion facing the inner peripheral side (X1 side in the X1-X2 direction) and a side portion facing the outer peripheral side (X2 side in the X1-X2 direction) and opposite to the second central turn 212. The first insulating portion 80 has a portion that contacts these side portions. Furthermore, although not shown, the side surface of the outer peripheral side (X1 side in the X1-X2 direction) of the outer peripheral end 23 of the second helical conductor portion 21 (see the second lead-out end face 24E) also has this side portion. Figure 5 In order to be electrically connected to other components (second external electrode 42), the first insulating part 80 is not provided.

[0082] From the viewpoint of stably realizing the provision of the first insulating part 80 on the side, the average width of the gap between the two turns arranged side by side in the direction (in the XY plane direction) intersecting the first direction (Z1-Z2 direction) is preferably 0.025 times or more and 0.25 times or less of the average width of the two turns in the side-by-side direction.

[0083] The average thickness of the portion of the first insulating portion 80 that contacts the first back portion 11FA (the back portion of the first helical conductor portion 11 to the second helical conductor portion 21), the portion that contacts the second back portion 21FA (the back portion of the second helical conductor portion 21 to the first helical conductor portion 11), the portion that contacts the side portion of the first helical conductor portion 11, and the portion that contacts the side portion of the second helical conductor portion 21, is preferably 0.2 μm or more and 10 μm or less, from the viewpoint of ensuring good insulation of the first insulating portion 80. From the viewpoint of more stably ensuring insulation, this average value is more preferably 1.0 μm or more.

[0084] The first insulating portion 80 has a first connecting portion 801, which connects to a portion of the side of at least one of the turns (in this embodiment, the first inner peripheral turn 111, the first central turn 112, and the first outer peripheral turn 113) of the first helical conductor portion 11, i.e., the first turn, and to a portion of the side of the second turn of the second helical conductor portion 21 that is closest to the side of the first turn. From the viewpoint of stably forming the first connecting portion 801, the average value of the distance between the first helical conductor portion 11 and the second helical conductor portion 21 along the first direction (Z1-Z2 direction) is preferably 0.4 μm or more and 20 μm or less.

[0085] Taking the first turn as the first inner circumferential turn 111 as an example, the second turn in the second spiral conductor portion 21 that is closest to the side of the first turn (the first inner circumferential turn 111) is the second inner circumferential turn 211. The first insulating portion 80 that connects to the inner circumferential side (X1 side in the X1-X2 direction) of the first inner circumferential turn 111 and the first insulating portion 80 that connects to the inner circumferential side (X1 side in the X1-X2 direction) of the second inner circumferential turn 211, and thus positions the first insulating portion 80, is the first connecting portion 801.

[0086] exist Figure 6 The diagram further shows: a first connecting portion 80 connecting the first insulating portion 80 that contacts the outer peripheral side (X2 side in the X1-X2 direction) of the first inner peripheral side turn 111 and the first insulating portion 80 that contacts the outer peripheral side (X2 side in the X1-X2 direction) of the second inner peripheral side turn 211; and a first connecting portion connecting the first insulating portion 80 that contacts the inner peripheral side (X1 side in the X1-X2 direction) of the first central turn 112 and the first insulating portion 80 that contacts the inner peripheral side (X1 side in the X1-X2 direction) of the second central turn 212. 801; a first connecting portion 801 connecting the first insulating portion 80 that contacts the outer peripheral side (X2 side in the X1-X2 direction) of the first central turn 112 and the first insulating portion 80 that contacts the outer peripheral side (X2 side in the X1-X2 direction) of the second central turn 212; and a first connecting portion 801 connecting the first insulating portion 80 that contacts the inner peripheral side (X1 side in the X1-X2 direction) of the first outer peripheral turn 113 and the first insulating portion 80 that contacts the inner peripheral side (X1 side in the X1-X2 direction) of the second outer peripheral turn 213.

[0087] Thus, by having the first connecting part 801, the volume of the coil insulation part can be reduced, thereby making it easier to improve the electrical characteristics of the coil component 100 or to meet the need for miniaturization of the coil component 100.

[0088] The first insulating portion 80 has: a portion that contacts the portion of the first helical conductor portion 11 opposite to the second helical conductor portion 21 (first end 11F), and a portion that contacts the portion of the second helical conductor portion 21 opposite to the first helical conductor portion 11 (second end 21F). Figure 6 In the first insulating portion 80 shown, these portions are integrally formed to constitute the intermediate portion 80i, and the intermediate portion 80i is integral with the first connecting portion 801. In the intermediate portion 80i, the first insulating portion 80 that contacts the portion (first end 11F) opposite to the second spiral conductor portion 21 of the first spiral conductor portion 11 also contacts the second spiral conductor portion 21 even without a connection boundary. This structure makes it easy to improve the insulation between the first spiral conductor portion 11 and the second spiral conductor portion 21.

[0089] Furthermore, the first insulating portion 80 that contacts the outer peripheral side (X2 side in the X1-X2 direction) of the second outer peripheral side turn 213 has a third connecting portion 803, which connects to the first insulating portion 80 that contacts the first extension 14P, that is, the portion extending from the first end 11F of the first outer peripheral side turn 113 that contacts the Z2 side portion of the first lead-out portion 14 in the Z1-Z2 direction, and the first insulating portion 80 that contacts the outer peripheral side (X2 side in the X1-X2 direction) of the second outer peripheral side turn 213. This third connecting portion 803 is also provided between the first insulating portion 80 that contacts the outer peripheral side (X1 side in the X1-X2 direction) of the first outer peripheral side turn 113 and the first insulating portion 80 that contacts the Z1 side portion in the Z1-Z2 direction of the second lead-out portion 24.

[0090] Figure 6 The first insulating portion 80 shown is the part of the coil conductor portion 20 located inside the body portion 30. Specifically, the first insulating portion 80 is configured to contact the end of the first lead-out portion 14 (X2 side in the X1-X2 direction) (first lead-out end face 14E) and the end of the second lead-out portion 24 (X1 side in the X1-X2 direction) (second lead-out end face 24E) in the coil conductor portion 20. Figure 6 The portion other than (not shown in the image). Therefore, even if the surface of the magnetic powder contained in the body portion 30 is conductive, short circuits inside the coil conductor portion 20 caused by contact between the coil conductor portion 20 and the magnetic powder can be reliably avoided.

[0091] From the viewpoint of more stably preventing short circuits within the coil conductor portion 20, the first insulating portion 80 contacting the first helical conductor portion 11 preferably has a continuous contact with all turns of the first helical conductor portion 11, including the portion contacting the portion opposite to the second helical conductor portion 21 (first end 11F), the portion contacting the portion opposite to the second helical conductor portion 21 (first back portion 11FA), and the portion contacting the side surface, without any connecting boundaries. Similarly, the first insulating portion 80 contacting the second helical conductor portion 21 preferably has a continuous contact with all turns of the second helical conductor portion 21, including the portion contacting the portion opposite to the first helical conductor portion 11 (second end 21F), the portion contacting the portion opposite to the first helical conductor portion 11 (second back portion 21FA), and the portion contacting the side surface, without any connecting boundaries.

[0092] The following will use the term corresponding to Figure 6 The area enclosed by the middle dashed line Figures 8 to 14 The detailed structure of the first insulating portion 80 in the first embodiment will be explained. That is, Figures 8 to 14All figures illustrate the detailed structure of the first insulating portion 80 in the first embodiment. In any figure, at least one of the first helical conductor portion 11 and the second helical conductor portion 21 has two turns arranged in a direction intersecting the first direction (Z1-Z2 direction), i.e., the X1-X2 direction. Specifically, the first helical conductor portion 11 has a first inner peripheral side turn 111 and a first central turn 112, and the second helical conductor portion 21 has a second inner peripheral side turn 211 and a second central turn 212.

[0093] (First specific example) Figure 8 This is an explanatory diagram illustrating the detailed structure (first specific example) of the first insulating portion of a coil component according to an embodiment of the present invention. In the first specific example, the first insulating portion 80 that contacts one of the two opposing sides of the two turns is in contact with the first insulating portion 80 that contacts the other of the two sides, and the two first connecting portions 801 existing in the two turns have an interface 80b and are in contact with each other.

[0094] Specifically, the first insulating portion 811o, which contacts the outer peripheral side (X2 side in the X1-X2 direction) of the first inner peripheral turn 111, has one contact portion with the first insulating portion 812i, which contacts the inner peripheral side (X1 side in the X1-X2 direction) of the first central turn 112 opposite to this side, and an interface 80b, serving as a line segment boundary, exists at the contact portion. Similarly, the first insulating portion 821o, which contacts the outer peripheral side (X2 side in the X1-X2 direction) of the second inner peripheral turn 211, has two contact portions with the first insulating portion 822i, which contacts the inner peripheral side (X1 side in the X1-X2 direction) of the second central turn 212 opposite to this side, and an interface 80b exists at the contact portions. Furthermore, an air hole 80p, serving as a closed space, is formed through the two contact portions. This interface 80b or pore 80p can absorb the displacement of the coil section 10 when the coil section 10 expands due to the heat generated during the operation of the coil component 100, and can reduce the stress applied to the magnetic powder in the body section 30 near the coil section 10, which is prone to magnetic saturation. Therefore, the interface 80b or pore 80p can improve the DC superimposed rated current of the electronic component.

[0095] Furthermore, each of the first inner peripheral side turn 111 and the first central turn 112 has a first connecting portion 801, and these two first connecting portions 801 have an interface 80b and are in contact with each other. In addition, there is an intermediary portion 80i between the first inner peripheral side turn 111 and the second inner peripheral side turn 211, and there is also an intermediary portion 80i between the first central turn 112 and the second central turn 212. All these intermediary portions 80i are integrated with the first connecting portions 801.

[0096] (Second specific example) Figure 9This is an explanatory diagram illustrating the detailed structure of the first insulating portion of a coil component according to an embodiment of the present invention (second specific example). In the second specific example, the first insulating portion 80 that contacts one of the two opposing sides of the two turns is integrated with the first insulating portion 80 that contacts the other of the two sides, and the two first connecting portions 801 present in the two turns are also integrated.

[0097] Specifically, the first insulating portion 811o that contacts the outer peripheral side (X2 side in the X1-X2 direction) of the first inner peripheral side turn 111 has an integrated portion with the first insulating portion 812i that contacts the inner peripheral side (X1 side in the X1-X2 direction) of the first central turn 112 that is opposite to the first insulating portion, which is a fusion portion 80f.

[0098] Furthermore, each of the first inner peripheral side ring 111 and the first central ring 112 has a first connecting portion 801, and these two first connecting portions 801 have a fusion portion 80f and are integrated. In addition, there is an intermediate portion 80i between the first inner peripheral side ring 111 and the second inner peripheral side ring 211, and there is also an intermediate portion 80i between the first central ring 112 and the second central ring 212. All these intermediate portions 80i are integrated with the first connecting portions 801.

[0099] That is, at least one of the two first connecting portions 801 has at least one portion that contacts the opposing portion (first end 11F) of the first helical conductor portion 11 and the opposing portion (second end 21F) of the second helical conductor portion 21. Figure 8 In the middle, both first connecting portions 801 have a portion that contacts the opposite portion (first end 11F) of the first spiral conductor portion 11, and a portion that contacts the opposite portion (second end 21F) of the second spiral conductor portion 21.

[0100] like Figure 9 As shown, the first insulating portion 80, which includes two first connecting portions 801 with a fusion portion 80f, has a portion that contacts one of the two turns (e.g., the first inner peripheral side turn 111), a portion that contacts the other of the two turns (the first central turn 112), and a portion that is continuously disposed from these portions and in a direction intersecting the first direction (Z1-Z2 direction). Figure 9 The second connecting part 802 (in the X1-X2 direction) extends from the middle. Figure 9 (The area enclosed by the dashed line). The second connecting part 802 is composed of the portion of the fusion part 80f included in the two first insulating parts 80.

[0101] The second connecting portion 802 has a thin-walled portion 80t, the thickness of which in the first direction (Z1-Z2 direction) is less than the portion of the first insulating portion 80 that contacts either of the two turns. The thickness Dt of the thin-walled portion 80t in the first direction (Z1-Z2 direction) is preferably 0.6 or more in ratio to the thickness of the other portions of the second connecting portion 802 in the first direction (Z1-Z2 direction). In this case, a recess 80d is formed from the thin-walled portion 80t, and the ratio of the depth of the recess 80d to the thickness of the other portions of the second connecting portion 802 in the first direction (Z1-Z2 direction) is easily achieved to be 0.2 or less.

[0102] (Third specific example) Figure 10 This is an explanatory diagram illustrating the detailed structure (third specific example) of the first insulating portion of the coil component according to an embodiment of the present invention. Figure 8 and Figure 9 The intermediate portion 80i of the first insulating portion 80 shown is integrally provided between the first spiral conductor portion 11 and the second spiral conductor portion 21 for contacting both, but Figure 10 The intermediate portion 80i shown is not integrated. Specifically, the intermediate portion 80i has opposing contact portions 811f that contact the first end 11F of the first inner peripheral side turn 111 and opposing contact portions 821f that contact the second end 21F of the second inner peripheral side turn 211, with an interface 80b between them. In addition, the intermediate portion 80i has opposing contact portions 812f that contact the first end 11F of the first central turn 112 and opposing contact portions 822f that contact the second end 21F of the second central turn 212, with an interface 80b between them as well, and also has vents 80p.

[0103] (Fourth specific example) Figure 11This is an explanatory diagram illustrating the detailed structure (fourth specific example) of the first insulating portion of the coil component according to an embodiment of the present invention. In the fourth specific example, insulating particles 95, such as oxide particles, are present between the first helical conductor portion 11 and the second helical conductor portion 21. Specific examples of insulating particles 95 are inorganic materials such as oxides, carbides, nitrides, and inorganic salts. For example, oxides include silicon dioxide, aluminum oxide, and zirconium oxide. Furthermore, for example, carbides and nitrides include silicon carbide and boron nitride, respectively. Inorganic salts include, for example, silicates, phosphates, borates, and carbonates. Such inorganic salts include minerals such as wollastonite, kaolin, and mica. Among these materials, oxide-based materials such as oxides, silicates, and phosphates are preferred from an insulating perspective. For example, the insulating particles 95 preferably contain at least one selected from the group consisting of silicon (Si), phosphorus (P), boron (B), and calcium (Ca). The shape of the insulating particles 95 is not particularly limited as long as they can be located between the first helical conductor portion 11 and the second helical conductor portion 21. Its shape can be nearly spherical, needle-like with a large aspect ratio, or irregular. When viewed in cross-section between the first helical conductor portion 11 and the second helical conductor portion 21, the average equivalent circular diameter of the insulating particles 95 is preferably 0.0010 μm or more and 2.5 μm or less. This average equivalent circular diameter is more preferably 0.020 μm or more, and even more preferably 0.050 μm or more. Furthermore, the average equivalent circular diameter is more preferably 2.0 μm or less, and even more preferably 1.5 μm or less. From the viewpoint that it also helps to ensure insulation between the first helical conductor portion 11 and the second helical conductor portion 21 during the manufacturing process of the coil component 100, the insulating particles 95 are preferably rigid, and from this viewpoint, the insulating particles 95 are also preferably made of inorganic materials rather than organic materials.

[0104] (Variation example) Figures 12 to 14 These are explanatory diagrams illustrating the detailed structure of the first insulating portion (modifications 1 to 3 of the second specific example) of the coil component according to an embodiment of the present invention. Figure 12 In the modified example 1 shown, the fusion portion 80f formed by the first connecting portion 801 diffuses between the side portion of the first inner peripheral side ring 111 and the side portion of the first central ring 112, and between the side portion of the second inner peripheral side ring 211 and the side portion of the second central ring 212. As a result, the second connecting portion 802 diffuses in the first direction (Z1-Z2 direction). The two ends of the second connecting portion 802 can also extend to the first back portion 11FA and the second back portion 21FA, respectively (see reference). Figure 6 ).exist Figure 13 In Modification 2 shown, compared to Modification 1, the amount of intermediate portion 80i is less, and there are portions at the first end 11F and the second end 21F where the first insulating portion 80 is not in contact. Figure 14 In the modified example 3 shown, the first insulating portion 80 does not have a portion that contacts the first end portion 11F and the second end portion 21F. For example, in Figure 13 , Figure 14 In the case where there is no first insulating portion 80 between the first end 11F and the second end 21F, in order to prevent a short circuit between the first spiral conductor portion 11 and the second spiral conductor portion 21, it is preferable to replace the first insulating portion 80 with insulating particles 95.

[0105] (A variation of the second conductor section) Figure 15 The XZ cross-sectional view is for illustrating a modified example of the second conductor portion of the coil component according to an embodiment of the present invention, and corresponds to... Figure 6 The diagram shows the XZ cross-sectional view. Figure 15 In the variant example shown, with Figure 6 Compared to the embodiment shown, the structures of the second conductor portions 11B and 21B located at the first end 11F and the second end 21F are different, and the second conductor portions 11B and 21B do not cover a part of the third conductor portions 11C and 21C.

[0106] Specifically, at the first end 11F of the first inner circumferential side turn 111, the second insulating portion 90 is configured to cover a portion of the third conductor portion 11C, the second conductor portion 11B partially covers the portion of the third conductor portion 11C not covered by the second insulating portion 90, and the side portion of the second insulating portion 90 ( Figure 15 (The portion in the X1-X2 direction). Similarly, at the second end 21F of the second inner circumferential turn 211, the second insulating portion 90 is also configured to cover a portion of the third conductor portion 21C, and the second insulating portion 90 is partially covered by the second conductor portion 21B. The second insulating portion 90 covering a portion of the first end 11F of the first inner circumferential turn 111 is integral with the second insulating portion 90 covering a portion of the second end 21F of the second inner circumferential turn 211, and the insulating particles 95 are retained in the second insulating portion 90. The second insulating portion 90 partially contacts the second conductor portion 11B. Then, the first insulating portion 80 is configured to cover the second insulating portion 90 and the insulating particles 95.

[0107] At the first end 11F of the first central turn 112, the third conductor portion 11C is covered by the second conductor portion 11B. However, at the second end 21F of the second inner circumferential turn 211, similarly, a second insulating portion 90 is provided to cover a portion of the third conductor portion 11C, and a second conductor portion 11B is provided to cover a portion of the side of this second insulating portion 90. A first insulating portion 80 fills the space between the first end 11F and the second end 21F.

[0108] At the first end 11F of the first outer peripheral turn 113, insulating particles 95 are provided to adhere to the third conductor portion 11C. A second conductor portion 11B is provided to cover the portion of the third conductor portion 11C that is not in contact with the insulating particles 95, as well as a portion of the side of the insulating particles 95. At the second end 21F of the second outer peripheral turn 213, a second insulating portion 90 is provided to cover a portion of the third conductor portion 11C, with insulating particles 95 attached to the first end 11F side of the second insulating portion 90. The second conductor portion 11B is provided to cover the portion of the third conductor portion 11C that is not occupied by the second insulating portion 90. This second conductor portion 11B also covers the second insulating portion 90 and further contacts the insulating particles 95. A first insulating portion 80 fills the space between the first end 11F and the second end 21F.

[0109] As described above, in this modified example, there is a substance other than the first insulating portion 80 between the first end 11F and the second end 21F which are disposed opposite to each other.

[0110] (Second Insulation Section) In this modified example, the second insulating portion 90 contacts at least one of the first helical conductor portion 11 and the second helical conductor portion 21. This ensures insulation between the first helical conductor portion 11 and the second helical conductor portion 21. Furthermore, by simultaneously contacting both the first helical conductor portion 11 and the second helical conductor portion 21 with the second insulating portion 90, short circuits between the first helical conductor portion 11 and the second helical conductor portion 21 can be reliably prevented.

[0111] The material constituting the second insulating part 90 is not limited, as long as it has suitable insulating properties. The volume resistivity of the second insulating part 90, obtained according to ASTM D257, is preferably 1.0 × 10⁻⁶. 14 Ω·cm or higher. More preferably, the volume resistivity is 1.0 × 10⁻⁶ Ω·cm or higher. 15 Ω·cm or above, more preferably 1.0 × 10⁻⁶ 16 Ω·cm or above. There is no particular upper limit to the volume resistivity. The volume resistivity can be 1.0 × 10⁻⁶. 20The volume resistivity of the second insulating portion 90 is Ω·cm or less. Furthermore, the second insulating portion 90 preferably has excellent dielectric properties; specifically, the relative permittivity at 60 Hz, obtained according to ASTM D150, is preferably 4.0 or less. More preferably, the relative permittivity is 3.5 or less, and even more preferably 3.0 or less. There is no particular limitation on the lower limit of the relative permittivity. The relative permittivity can be 1.0 or higher. The methods for measuring the volume resistivity and relative permittivity of the second insulating portion 90 are not limited as long as results equivalent to those obtained in ASTM D257 and D150 described above can be obtained. For example, a measurement specimen equivalent to the material of the second insulating portion 90 can be prepared, adjusted to the required size for measurement, and the constituent materials of the specimen can be identified by analytical methods such as compositional analysis or FT-IR, and then the properties such as the volume resistivity of the material can be evaluated.

[0112] The material constituting the second insulating part 90 can be an organic material, an inorganic material, or a composite material of organic and inorganic materials. When the second insulating part 90 is composed of a composite material, the inorganic material can be in particulate form and dispersed in a matrix composed of organic material. In this case, the inorganic material can be insulating particles 95. Specific examples of organic materials include polyimide resin, polyethylene resin, polypropylene resin, polyamide resin, polyester resin, polyamide-imide resin, polysulfone resin, polycarbonate resin, liquid crystal polymer resin, polyvinylidene fluoride resin, polytetrafluoroethylene resin, etc. Specific examples of inorganic materials, especially in composite materials, include oxides, carbides, nitrides, inorganic salts, etc. For example, oxides include silicon dioxide, alumina, and zirconium oxide. In addition, for example, carbides and nitrides include inorganic materials such as silicon carbide and boron nitride, respectively. Inorganic salts include minerals such as wollastonite, kaolin, and mica. Among these, from the perspective of cost and insulation, oxide-based materials such as oxides, silicates, and phosphates are preferred. For example, the inorganic material preferably contains at least one selected from the group consisting of silicon (Si), phosphorus (P), boron (B), and calcium (Ca).

[0113] (Main body part) The body portion 30 contains magnetic powder and encloses a portion of the coil portion 10. In this embodiment, the body portion 30 is generally rectangular in shape and encloses the portion other than the first lead-out end face 14E and the second lead-out end face 24E located at the ends of the coil portion 10.

[0114] The microstructure of magnetic powders is not limited. This microstructure can contain either a crystalline or amorphous phase. Here, crystalline materials are defined as materials composed of a crystalline phase, amorphous materials are defined as materials composed of an amorphous phase, and composite materials are defined as materials composed of both crystalline and amorphous phases. If the diffraction pattern obtained by conventional X-ray diffraction contains sharp diffraction peaks that identify the type of crystalline phase, then the material contains a crystalline phase. Furthermore, if the diffraction pattern obtained by conventional X-ray diffraction contains broad peaks representing an amorphous phase, then the material contains an amorphous phase. DSC curves obtained by differential thermal analysis showing crystallization peaks, i.e., including the exothermic phase transition from an amorphous to a crystalline phase, also indicate that the material contains an amorphous phase.

[0115] The material system of magnetic powders is unrestricted. Specific examples of crystalline materials include Fe-Si-Cr alloys, Fe-Ni alloys, Fe-Co alloys, Fe-V alloys, Fe-Al alloys, Fe-Si alloys, Fe-Si-Al alloys, pure iron, ferrites, etc. Carbonyl iron powder is preferred for pure iron. Specific examples of amorphous materials include Fe-Si-B alloys, Fe-PC alloys, and Co-Fe-Si-B alloys. Specific examples of composite materials include Fe-Zr alloys, Fe-Zr-B alloys, Fe-Si-B-Nb-Cu alloys, and Fe-Si-BP-Cu alloys. If the magnetic powder is an Fe-containing metal powder, the synergistic effect in improving magnetic properties is particularly significant.

[0116] The chemical composition of the magnetic powder is not limited. For example, Fe-Si-Cr alloys may consist of 1.0 to 10.0% by mass of Si, 1.0 to 10.0% by mass of Cr, and the remainder consisting of Fe and impurities. Furthermore, for example, Fe-Ni alloys may consist of 1.0 to 99.0% by mass of Ni, and the remainder consisting of Fe and impurities. Furthermore, for example, Fe-PC alloys may consist of 1.0 to 13.0 atomic% of P, 1.0 to 13.0 atomic% of C, and Fe and impurities. The Fe-PC alloy may optionally contain one or more elements selected from the group consisting of Ni, Sn, Cr, B, and Si. In this case, for example, the Ni content may be 0 to 10.0 atomic%, the Sn content may be 0 to 3.0 atomic%, the Cr content may be 0 to 6.0 atomic%, the B content may be 0 to 9.0 atomic%, and the Si content may be 0 to 7.0 atomic%. The Fe content is preferably 65 atomic% or more. Furthermore, for example, Fe-Si-B-Nb-Cu alloys can consist of 1.0 to 16.0 atomic% Si, 1.0 to 15.0 atomic% B, 0.50 to 5.0 atomic% Nb, 0.50 to 5.0 atomic% Cu, and the remainder consisting of Fe and impurities. In this case, the Fe content is preferably 65 atomic% or more.

[0117] The shape of the magnetic powder is not limited. Magnetic powder can be spherical, elliptical, flake-like, or irregular in shape. The manufacturing methods to obtain these shapes are also not limited.

[0118] The particle size distribution of the magnetic powder is not limited. The particle size distribution can be obtained by analyzing images (secondary electron images) obtained by imaging a 30° section of the main body using a scanning electron microscope. For example, the average equivalent circle diameter of the magnetic powder can be between 0.50 and 50.0 μm. The distribution of the equivalent circle diameter can contain multiple peaks.

[0119] Magnetic powder can undergo surface insulation treatment. If the magnetic powder undergoes surface insulation treatment, the insulation resistance of the body portion 30 will increase. The type of surface insulation treatment applied to the magnetic powder is not limited. Examples include phosphoric acid treatment, phosphate treatment, oxidation treatment, etc. The surface of the magnetic particles of the magnetic powder may have an insulating coating layer. This insulating coating layer may contain at least one substance selected from Si, P, and B, as well as O (oxygen).

[0120] Magnetic powder can also be a mixture of multiple powder materials. The magnetic powder is preferably a ferromagnetic material, and more preferably a soft magnetic material.

[0121] The body portion 30 may also include optional auxiliary materials. Optional auxiliary materials include, for example, adhesives or modifiers. The adhesive binds together particles such as magnetic powder contained in the body portion 30. To impart insulation resistance to the body portion 30, the adhesive is preferably an insulating material.

[0122] Adhesive materials can be organic or inorganic. Organic materials can be resins. Examples of resins include acrylic resins, silicone resins, epoxy resins, phenolic resins, urea resins, melamine resins, and polyester resins. Inorganic materials can be glass-like materials such as water glass. Adhesive materials can be products of reactions such as thermal decomposition, or mixtures of various materials.

[0123] Modifiers are used, for example, to improve the flowability of powders or to adjust the curing speed of adhesive materials. Modifiers can be glass-like materials.

[0124] The size of the body portion 30 is not limited. For example, the maximum size of the body portion 30 can be 3.2 mm or less.

[0125] (External electrode) like Figure 2 As shown, the first lead-out end face 14E and the second lead-out end face 24E located at the end of the coil portion 10 are exposed from the body portion 30 on the side of the body portion 30 arranged in the X1-X2 direction. The first external electrode 41 is provided to make electrical contact with the first lead-out end face 14E, and the second external electrode 42 is provided to make electrical contact with the second lead-out end face 24E.

[0126] like Figure 1 As shown, the first external electrode 41 has a side portion 41a covering the side of the main body 30 on the X2 side in the X1-X2 direction, and a bottom portion 41b provided to cover a portion of the bottom surface of the main body 30 (the surface on the Z2 side in the Z1-Z2 direction). The bottom portion 41b is the portion facing the substrate during use. The second external electrode 42 has a side portion 42a covering the side of the main body 30 on the X1 side in the X1-X2 direction, and a bottom portion 42b separated from the bottom portion 41b on the bottom surface of the main body 30 and provided to cover a portion of its bottom surface. The bottom portion 42b is also the portion facing the substrate during use.

[0127] The positions of the first external electrode 41 and the second external electrode 42 are not limited to the positions described above. The first external electrode 41 and the second external electrode 42 may be formed to cover a portion of the upper surface of the body portion 30 (the surface on the Z1 side in the Z1-Z2 direction). Alternatively, the first external electrode 41 and the second external electrode 42 may only be provided on a portion of the bottom surface of the body portion 30 (the surface on the Z2 side in the Z1-Z2 direction). In this case, the coil conductor portion 20 may have a connecting conductor portion (not shown) that extends from both ends of the coil portion 10 (the first lead-out portion 14 and the second lead-out portion 24) through the interior of the body portion 30 and connects to the bottom surface of the body portion 30. In this case, the two ends of the coil portion 10 (the end face 14E of the first lead-out portion and the end face 24E of the second lead-out portion) may not be exposed from the side of the body portion 30, but the connecting conductor portion may be exposed from the bottom surface of the body portion 30.

[0128] The materials and structures of the first external electrode 41 and the second external electrode 42 are not limited, as long as they have suitable conductivity. As a non-limiting example of the first external electrode 41 and the second external electrode 42, a layer with a Cu-plated layer / Ni-plated layer / Sn-plated layer structure sequentially formed from the side near the surface of the body portion 30 is included. The first external electrode 41 and the second external electrode 42 can be composed of coating-type electrodes made by dispersing a conductive material such as silver in a resin or the like. Furthermore, the first external electrode 41 and the second external electrode 42 can also be a combination of electroplated and coating-type electrodes.

[0129] (Outer packaging) Insulating outer covers 50 and 60 are respectively provided on the upper surface (the surface on the Z1 side in the Z1-Z2 direction) and the side surface parallel to each other in the Y1-Y2 direction of the main body 30. The portion of the bottom surface of the main body 30 where the bottom portions 41b and 42b are not provided may also be provided with insulating outer covers. Furthermore, the coil component 100 may not have the outer covers 50 and 60. The outer covers 50 and 60 can be provided at any position on the surface of the main body 30 as needed.

[0130] (Manufacturing method) The manufacturing method of the coil component 100 related to this embodiment is not limited. A non-limiting aspect of this manufacturing method is described below.

[0131] Figures 16 to 20 These are explanatory figures (Figures 1 to 5) illustrating an example of a method for manufacturing a coil component related to an embodiment of the present invention.

[0132] (a) Preparation of sheet substrate First, such as Figure 16As shown in (a), a sheet-like substrate 91 is prepared having a substrate through-hole 91H at the location corresponding to the through-hole portion VP. The material of the sheet-like substrate 91 is not limited as long as it possesses mechanical properties that allow it to function as a support when forming the first helical conductor portion 11 and the second helical conductor portion 21. In some cases, it is preferable that the sheet-like substrate 91 has suitable insulation properties required as a raw material for the second insulating portion 90, and as described below, it is preferable that it has suitable removal characteristics at least in a certain area when removing the sheet-like substrate 91.

[0133] The thickness of the sheet substrate 91 needs to be set to ensure it functions appropriately as a support during the formation of the first helical conductor portion 11 and the second helical conductor portion 21. If necessary, the insulation properties of the second insulating portion 90 derived from the sheet substrate 91 and the removal characteristics of the sheet substrate 91 also need to be considered and set. As a non-limiting example, the thickness of the sheet substrate 91 can be set to 0.4 μm or more and 20 μm or less. The thickness of the sheet substrate 91 can also be 1.0 μm or more, or 5.0 μm or more. Furthermore, to further reduce the size of the coil component 100, the thickness of the sheet substrate 91 can be 14.0 μm or less.

[0134] As constituent materials of the sheet-like substrate 91, examples include organic materials, inorganic materials, and composite materials of the same. Specific examples of organic materials include thermoplastic resins such as polyimide resin and polyethylene resin; thermosetting resins such as epoxy resin and phenolic resin; and cellulose, etc. Specific examples of inorganic materials include oxide materials such as glass and alumina; metallic materials such as aluminum and magnesium; and inorganic salt materials such as calcium carbonate, etc. Specific examples of composite materials include structures in which inorganic material powders (inorganic particles) are dispersed within a matrix composed of organic materials.

[0135] (b) Formation of the conductive layer On one surface (Z1 side surface in the Z1-Z2 direction) of the prepared sheet substrate 91, a third conductor portion 11C pattern 11CP corresponding to the first conductor portion 11A is formed, and on the other surface (Z2 side surface in the Z1-Z2 direction) of the sheet substrate 91, a third conductor portion 21C pattern 21CP corresponding to the first conductor portion 21A is formed.

[0136] The specific methods for forming the pattern 11CP of the third conductor portion 11C and the pattern 21CP of the third conductor portion 21C are not limited. For example, examples can be given. Figure 16 (b) to Figure 17 The method shown in (d) is as follows. First, as... Figure 16As shown in (b), a conductive layer 55, made of the same material as the third conductor portions 11C, 14C, 21C, and 24C, is formed on both surfaces (both sides in the Z1-Z2 direction) of the sheet substrate 91. The method of forming the conductive layer 55 is not limited. The conductive layer 55 can be formed by a dry process such as sputtering or a wet process such as chemical plating. From the perspective of reducing the thickness of the conductive layer 55, it is preferable to form the conductive layer 55 by sputtering.

[0137] In this example, such as Figure 16 As shown in (b), a conductive layer 55H is also formed on the inner surface of the through-hole 91H in the substrate. It should be noted that a component with conductive layers 55 pre-formed on both surfaces of the sheet substrate 91, similar to a copper-clad laminate, can also be prepared, and then the through-hole 91H can be formed thereon. In this case, the inner surface of the through-hole 91H can be in a state where the sheet substrate 91 material is exposed, or the conductive layer 55H can be formed separately.

[0138] (c) Formation of the insulating layer Next, as Figure 16 As shown in (c), an insulating layer 56 made of a patternable material such as dry film photoresist is laminated on each conductive layer 55 provided on both surfaces of the sheet substrate 91. The thickness of the insulating layer 56 is formed to be thicker than the thickness of the first conductor portion 11A and the first conductor portion 21A, thereby improving the shape controllability of the first conductor portion 11A and the second conductor portion 21B.

[0139] (d) Formation of the pattern of the third conductor section Subsequently, an exposure and development process is performed on the insulating layers 56 on both sides of the Z1-Z2 direction to remove part of the insulating layers 56, thereby forming negative patterns 56P having a pattern 11CP corresponding to the third conductor portion 11C of the first conductor portion 11A as the first part, and a reversed shape of the pattern 21CP corresponding to the third conductor portion 21C of the first conductor portion 21A as the second part. As a result, part of the conductive layer 55 on both sides of the Z1-Z2 direction is exposed, such as... Figure 17 As shown in (d), the pattern 11CP of the third conductor portion 11C and the pattern 21CP of the third conductor portion 21C are formed.

[0140] When exposing and developing the insulating layers 56 on both sides of the Z1-Z2 direction, by removing the portions corresponding to the third conductor portions 14C of the first lead-out portion 14 and the third conductor portions 24C of the second lead-out portion 24, the negative pattern 56P on the Z1 side of the Z1-Z2 direction can form the pattern 14CP of the third conductor portion 14C, and the negative pattern 56P on the Z2 side of the Z1-Z2 direction can form the pattern 24CP of the third conductor portion 24C. Thus, as... Figure 17As shown in (d), the pattern 14CP of the third conductor portion 14C corresponding to the first conductor portion 14A is continuously formed with the pattern 11CP of the third conductor portion 11C corresponding to the first conductor portion 11A. Simultaneously, the pattern 24CP of the third conductor portion 24C corresponding to the first conductor portion 24A is continuously formed with the pattern 21CP of the third conductor portion 21C corresponding to the first conductor portion 21A. Hereinafter, these patterns will sometimes be collectively referred to as the "pattern of the third conductor portion". The pattern of the third conductor portion has a shape corresponding to the first portion (first conductor portion 11A) and the second portion (first conductor portion 21A).

[0141] (e) Formation of the first conductor section Thus, after the pattern of the third conductor portion is formed, the first plating process is performed. Figure 17 (e)). The first plating process is an electrolytic plating process, wherein the treated area on the main surface of the sheet substrate 91 during the electrolytic plating process includes the pattern of the third conductor portion. Specifically, in the first plating process, the conductive layer 55 provided on both surfaces of the sheet substrate 91 is energized, and the first conductor portion 11A and the first conductor portion 14A, as well as the first conductor portion 21A and the first conductor portion 24A, are formed on the pattern of the third conductor portion.

[0142] Because a negative pattern 56P formed by an insulating layer 56 is disposed at the edge of the aforementioned third conductor pattern, in the first plating process, the negative pattern 56P is used as a mask material for electrolytic plating. First conductor portions 11A and 14A are integrally formed corresponding to the pattern of the third conductor portion, and first conductor portions 21A and 24A are also integrally formed. Furthermore, in the first plating process, a via conductor portion 11H is formed as a third part to fill the substrate through-hole 91H. Since this via conductor portion 11H constitutes a via portion VP, the via portion VP, the first spiral conductor portion 11, and the second spiral conductor portion 21 are integrally formed in the first plating process.

[0143] The deposits formed by electrolytic plating are not limited as long as they have appropriate conductivity. As mentioned above, materials containing Cu, such as Cu alloys, are a non-limiting example.

[0144] (f) Removal of negative patterns Thus, after the first conductor portions 11A, 21A and 14A, 24A are formed on both surfaces of the sheet substrate 91, the negative pattern 56P formed by the insulating layer 56 is peeled off. As a result, as Figure 17As shown in (f), on the sheet substrate 91, the conductive layer 55 covers the entire surface except for the substrate through-hole 91H, and first conductor portions 11A, 21A and 14A, 24A are disposed on the conductive layer 55. As previously described, the first conductor portion 11A and the first conductor portion 21A are electrically connected to each other through the through-hole conductor portion 11H that constitutes the through-hole portion VP.

[0145] (g) Removal of the conductive layer Subsequently, the portion of the conductive layer 55 on the sheet substrate 91 exposed in the first direction (Z1-Z2 direction) is removed, specifically the portion not covered by the first conductor portions 11A, 21A and 14A, 24A. Thus, as... Figure 18 As shown in (g), the conductive layer 55 remaining on the sheet substrate 91 becomes the third conductor portion 11C, 14C, 21C, 24C constituting the coil portion 10 element.

[0146] The method for removing the conductive layer 55 is not limited. Any process that can remove the material constituting the conductive layer 55 and has minimal impact on the first conductor portions 11A, 21A, and 14A, 24A can be selected as appropriate. For example, when the first conductor portions 11A, 21A, and 14A, 24A are made of Cu and the conductive layer 55 is made of Ni, the portions of the conductive layer 55 not covered by the first conductor portions 11A, 21A, and 14A, 24A can be etched away with high selectivity. Furthermore, when the material constituting the conductive layer 55 is the same as that constituting the first conductor portions 11A, 21A, and 14A, 24A, the first conductor portions 11A, 21A, and 14A, 24A will also be partially removed by the process that removes the material of the conductive layer 55. Therefore, the electrolytic plating precipitate shape can be formed in the first plating process taking into account this amount of removal.

[0147] (h) Removal of sheet-like substrate Next, in the sheet substrate 91, a removal process is performed to remove at least a portion of the following: a first opposing portion facing the surface of the first portion (first conductor portion 11A) near the second portion (first conductor portion 21A) (the surface facing Z2 in the Z1-Z2 direction), and a second opposing portion facing the surface of the second portion (first conductor portion 21A) near the first portion (first conductor portion 11A) (the surface facing Z2 in the Z1-Z2 direction). Figure 18In step (h), all the first and second opposing portions of the sheet substrate 91 are removed. The specific method for removing the sheet substrate 91 can be determined depending on the type of material constituting the sheet substrate 91. Removal processes can be broadly categorized into dry processes such as plasma etching and wet processes such as wet etching. From the viewpoint of properly removing the sheet substrate 91 located between the components constituting the first helical conductor portion 11 (first conductor portion 11A, third conductor portion 11C) and the components constituting the second helical conductor portion 21 (first conductor portion 21A, third conductor portion 21C), an isotropic removal process, i.e., wet etching, may be preferred. It is also possible that a portion of the sheet substrate 91 is removed by the removal process, leaving an unremoved residue. For example, the sheet substrate 91 may be composed of a composite of organic and inorganic materials, and the removal process may partially remove the organic material. In this way, the insulating material constituting the sheet substrate 91 may partially remain, and this residual insulating material constitutes the second insulating portion 90 and the insulating particles 95. By forming the second conductor portions 11B and 21B as described below under the residual state of this insulating material, the following can be obtained: Figure 15 The structure shown.

[0148] (i) Formation of the second conductor section By removing the sheet-like substrate 91 in this way, not only are the first conductor portions 11A, 14A, 21A, and 24A exposed, but the third conductor portions 11C, 14C, 21C, and 24C are also exposed. In this state, a second plating process is performed, forming second conductor portions 11B and 21B on the surfaces of the first conductor portions 11A and 21A and the third conductor portions 11C and 21C, and forming second conductor portions 14B and 24B on the surfaces of the first conductor portions 14A, 24A and the third conductor portions 14C and 24C. The plating process in the second plating step can be either an electrolytic plating process or an electroless plating process.

[0149] By performing a second coating treatment, such as Figure 18As shown in (i), a second conductor portion 11B is provided around the first conductor portion 11A and the third conductor portion 11C to form a first spiral conductor portion 11, and a second conductor portion 21B is provided around the first conductor portion 21A and the third conductor portion 21C to form a second spiral conductor portion 21. Furthermore, a second conductor portion 14B is provided around the first conductor portion 14A and the third conductor portion 14C to form a first lead-out portion 14, and a second conductor portion 24B is provided around the first conductor portion 24A and the third conductor portion 24C to form a second lead-out portion 24. At this time, the second conductor portions 11B, 21B, 14B, and 24B form a continuous portion between their intersecting outer surfaces, thereby forming smooth corners. This facilitates the formation of the first insulating portion 80 to be formed subsequently, and makes it difficult to peel off even when in contact with the constituent material of the body portion 30, which includes magnetic powder or the like.

[0150] (j) Formation of the second insulating part Thus, after the second conductor portions 11B, 21B, 14B, and 24B are formed through the second plating process, a first insulating portion 80, consisting of an insulating material, is formed, covering at least a portion of the exposed portion of the coil conductor portion 20. Figure 19 In (j), the insulating portion 80 is provided on the exposed surfaces of the first spiral conductor portion 11 and the second spiral conductor portion 21 constituting the coil conductor portion 20 (both are composed of the second conductor portions 11B and 21B), the exposed surfaces of the first lead-out portion 14 other than the surface facing the X1-X2 direction (composed of the second conductor portion 14B), and the exposed surfaces of the second lead-out portion 24 other than the surface facing the X1-X2 direction (composed of the second conductor portion 24B). External electrodes (first external electrode 41 and second external electrode 42) are provided on the surface where the first insulating portion 80 is not provided.

[0151] The forming process of the first insulating portion 80 can be appropriately set according to the constituent materials of the first insulating portion 80. For example, if the first insulating portion 80 is composed of a p-xylene-based polymer, it is formed by a dry process (CVD). If the first insulating portion 80 contains a curable resin material such as epoxy resin, it can be formed by attaching a powder or liquid containing the constituent material of the first insulating portion 80 to the exposed surface and then curing it by heating or the like.

[0152] (k) Formation of the main body After the coil part 10 is formed through the above processes, in the next step, such as Figure 19As shown in (k), a portion of the first lead-out portion 14 and the second lead-out portion 24 in the coil portion 10 is sealed with a material containing magnetic powder. In this embodiment, this specifically refers to the portion other than the end face 14E of the first lead-out portion and the end face 24E of the second lead-out portion, thereby forming the body portion 30. The method of forming the body portion 30 is not limited; as an example, a molding process can be cited. Specific examples of molding processes include... Figure 19 The finished product shown in (j) is placed in a mold and formed by pressing using a material containing magnetic powder, or by transfer molding of a component containing magnetic powder material or as its raw material.

[0153] The method of forming the body portion 30 is not limited to ensuring that the first lead-out end face 14E and the second lead-out end face 24E are exposed from the body portion 30. For example, the body portion 30 can be formed after the first lead-out end face 14E and the second lead-out end face 24E are covered. Alternatively, a dummy member can be continuously provided to cover or integrally connect to the first lead-out end face 14E and the second lead-out end face 24E, a first insulating portion 80 can be formed on the surface of this dummy member, and then the dummy member can be cut off after the body portion 30 is formed. In this way, the first lead-out end face 14E and the second lead-out end face 24E can also be exposed.

[0154] (l) Formation of outer packaging Next, in the exposed areas of part 30 of the main body, specifically... Figure 20 (l) An outer casing 50 is provided on the upper surface (the surface on the Z1 side in the Z1-Z2 direction) and the lower surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body 30 where neither the first external electrode 41 nor the second external electrode 42 is formed, to protect the main body 30. Although the main body 30 can be left unprotected, the insulating coating on the surface of the magnetic powder constituting the main body 30 may peel off when subjected to external forces caused by collisions with other components, which may lead to a decrease in the surface resistance of the main body 30. Since the reduced surface resistance will lead to a decrease in the reliability of the coil component 100, it is best to equip it with an outer casing 50 made of insulating material. The method of forming the outer casing 50 is not limited, and any known method such as printing or spraying can be used. The structural material of the outer casing 50 can be any common known material such as epoxy resin. From the perspective of enhancing impact resistance, a composite material in which inorganic materials such as glass fiber are dispersed in organic materials such as epoxy resin may be preferred. Furthermore, the outer casing 50 not only enhances insulation and impact resistance, but also helps improve appearance quality and ensures the accuracy of the external electrodes in subsequent fabrication processes (e.g., preventing plating stretching). Note that the outer casing 60 can be formed simultaneously with the outer casing 50 or separately.

[0155] (m) Formation of external electrodes Finally, the portion of the first lead-out portion 14 that was not covered by the magnetic powder material during the manufacturing of the main body portion 30 (i.e., the first lead-out portion end face 14E) is electrically connected to one side of the two electrode terminals (the first external electrode 41); simultaneously, the uncovered portion of the second lead-out portion 24 (the second lead-out portion end face 24E) is electrically connected to the other electrode (the second external electrode 42). The method of manufacturing the first external electrode 41 and the second external electrode 42 is not limited; electroplating and printing using a current-conducting paste are examples. Figure 20 The first external electrode 41 and the second external electrode 42 shown in (m) are formed not only on the side surface of the body portion (that is, in the direction facing X1-X2), but also extend to the bottom surface of the body portion 30 (the side facing Z1-Z2, i.e., Z2). As explained previously, if the outer casing 50 is manufactured first and then the external electrodes (referring to the first external electrode 41 and the second external electrode 42) are applied, it can prevent plating from occurring on the body portion 30 when there is no external surface, thus avoiding the problem of the external electrodes malfunctioning and the increased risk of short circuits between the external electrodes (the problem of plating growth exceeding the predetermined limit). For this reason, as in this application example, the manufacturing process of the outer casing layer is preferably performed by simultaneously applying a protective film to the bottom surface used for the encapsulation plate (in the direction indicated by Z1-Z2, i.e., on the Z2 surface).

[0156] (Electronic / Electrical Machinery) The electronic / electrical device according to one embodiment of the present invention is an electronic / electrical device equipped with the coil component 100 described above, and the coil component 100 is connected to the substrate via a first external electrode 41 and a second external electrode 42. Because the electronic / electrical device according to one embodiment of the present invention incorporates the coil component 100, the device can be easily simplified and made lighter. Furthermore, even if high-power circuitry or high-frequency inputs are implemented within this device, it can resist problems that cause component performance degradation or generate excessive heat.

[0157] The examples and illustrations described above are intended to facilitate understanding and use of the invention and are not intended to limit or restrict its technical means. Therefore, each specific component disclosed in the various embodiments described and presented herein is intended to cover all modifiable designs or alternative functionalities within the technical field of this patent claim. For example, here, the step of removing the insulating film as depicted in Figure 18(h) above... Figure 18 (i) The procedure for removing the four aforementioned items, namely the third conductor sections 11C, 21C, 14C, and 24C, can also be performed within the range of this second plating step. This processing operation is the same as that in... Figure 18 (g) The method of removing the conductive coating 55 shown in the picture can be the same as the operation method. By using this method, the loop-shaped conductor assembly (i.e., the coil conductor part 20) does not contain the four items, namely the third conductor parts 11C, 21C, 14C and 24C, which become the style system of its own structure.

[0158] The annotations in the attached figures are explained as follows: 100: Coil component 10: Coil section 11: First helical conductor section 11A, 14A, 21A, 24A: First conductor section 11B, 14B, 21B, 24B: Second conductor section 11C, 14C, 21C, 24C: Third conductor section 11CP, 14CP, 21CP, 24CP: Pattern 11F: First end 11FA: First Backward Section 11FS, 11GS, 11SS: Face 11G: First Corner 11H: Conductor section of the via 12, 22: Inner circumferential side end 13, 23: Outer peripheral side end 14: First Introduction 14E: First lead-out end face 14P: First Extension 20: Coil conductor section 21: Second spiral conductor section 21F: Second end 21FA: Second Back Section 21G: Second Corner 24: Second Introduction 24E: Second lead-out end face 30: Body part 41: First external electrode 41a, 42a: Side view 41b, 42b: Bottom surface 42: Second external electrode 50, 60: Outer packaging 55, 55H: Conductive layer 56: Insulation layer 56P: Negative Pattern 80, 811o, 812i, 821o, 822i: First insulating part 80b: Interface 80d: concave part 80f: Fusion Department 80i: Real Estate Agency 80p: pores 80t: Thin-walled section 90: Second Insulation Section 91: Sheet substrate 91H: Through hole in substrate 95: Insulating particles 111: First inner peripheral side turn 112: First Central Turns 113: First outer peripheral side turn 201: First coil conductor section 211: Second inner circumferential side turn 212: Second Central Turns 213: Second outer peripheral side turn 801: First connecting part 802: Second connecting part 803: Third connecting part 811f, 812f, 821f, 822f: Opposing contact parts Dt: Thickness of the thin-walled portion IF1: Interface L1: Angle bisector O: Axis P: Center R: radius VP: Through-hole section

Claims

1. A coil component, comprising a coil conductor portion, the coil conductor portion including a first helical conductor portion and a second helical conductor portion, each of which is helical in shape and arranged along the first direction when viewed along the first direction; and a through-hole portion electrically connected to an inner peripheral end of the first helical conductor portion and an inner peripheral end of the second helical conductor portion, the coil conductor portion having a conductive path from an outer peripheral end of the first helical conductor portion through the through-hole portion to an outer peripheral end of the second helical conductor portion. in, The coil conductor portion has: A first conductor portion extending along the conductive path and made of a first conductive material, and A second conductor portion, made of a second conductive material and covering at least a portion of the first conductor portion, and The second conductor portion is disposed at least a portion of the first end portion of the first helical conductor portion on the side opposite to the second helical conductor portion.

2. The coil component of claim 1, wherein at least a portion of the turns of the first helical conductor portion has a first corner portion that connects the surface of the first end portion with the side portion along the first direction in a continuous manner.

3. The coil component of claim 2, wherein in the first cross-section obtained by cutting through the first corner and along the first direction, the cross-sectional line depicted by the first corner has an approximately arc shape, the radius of curvature of which is greater than the radius of curvature of the cross-sectional line depicted in the first cross-section of the interface between the second conductor portion and the portion located inside the second conductor portion and made of conductive material.

4. The coil component of claim 1, wherein a third conductor portion made of a third conductive material is provided between the second conductor portion disposed at the first end and the first conductor portion covered by the second conductor portion.

5. The coil component of claim 1, wherein the second conductor portion is disposed at least a portion of a second end portion of the second helical conductor portion on the side opposite to the first helical conductor portion.

6. The coil component of claim 5, wherein at least a portion of the turns of the second helical conductor portion has a second corner portion having a surface that connects the second end portion to the side portion along the first direction in a continuous manner.

7. The coil component of claim 6, wherein in the second cross-section obtained by cutting through the second corner and along the first direction, the cross-sectional line depicted by the second corner has an approximately arc shape, the radius of curvature of which is greater than the radius of curvature of the cross-sectional line depicted in the second cross-section of the interface between the portion located inside the second conductor portion and made of conductive material and the second conductor portion.

8. The coil component of claim 5, wherein a third conductor portion made of a third conductive material is provided between the second conductor portion disposed at the second end and the first conductor portion covered by the second conductor portion.

9. The coil component of claim 1, wherein at least one of the first helical conductor portion and the second helical conductor portion has two turns arranged in a direction intersecting the first direction, and has a first insulating portion covering at least a portion of two opposing sides of the two turns.

10. The coil component of claim 9, wherein the first insulating portion comprises: The portion that contacts one of the two turns; The portion that contacts the other of the two turns; as well as A first connecting portion is continuously provided from these portions and extends in a direction intersecting the first direction. The first connecting portion has a thin-walled portion whose thickness in the first direction is less than the portion of the first insulating portion that contacts either of the two turns.

11. The coil component of claim 9, wherein, The first insulating portion has an intermediate portion located between the turns of the first spiral conductor portion and the turns of the second spiral conductor portion, and The intermediate portion contains at least one of an interface and a pore.

12. The coil component of claim 9, wherein the first insulating portion is provided to cover each of the two opposing sides of the two turns, and at least one of a linear intersection and a closed space exists between the first insulating portions.

13. The coil component of claim 9, wherein a second insulating portion made of a material different from that constituting the first insulating portion is provided in at least a portion between the first helical conductor portion and the second helical conductor portion.

14. The coil component of claim 13, wherein a third conductor portion made of a third conductive material is provided between the second conductor portion disposed at the first end and the first conductor portion covered by the second conductor portion.

15. The coil component as claimed in any one of claims 1 to 14, further comprising: A body portion containing magnetic powder and covering the portion other than the two ends of the coil conductor portion; as well as External electrodes are disposed on the body portion and electrically connected to the two ends of the coil conductor portion exposed from the body portion.

16. An electronic / electrical machine having a coil component as claimed in claim 15, wherein the coil component is connected to a substrate at the external electrode.

17. A method for manufacturing a coil component, the coil component comprising a coil conductor portion, the coil conductor portion including: Each of the first and second spiral conductor portions, which are spiral-shaped when viewed along the first direction, and arranged along the first direction, includes a first spiral conductor portion and a second spiral conductor portion, and a through-hole portion electrically connecting the inner peripheral end of the first spiral conductor portion and the inner peripheral end of the second spiral conductor portion, and has a conductive path from the outer peripheral end of the first spiral conductor portion through the through-hole portion to the outer peripheral end of the second spiral conductor portion. The coil conductor portion has a first conductor portion extending along the conductive path and made of a first conductive material, and a second conductor portion made of a second conductive material and covering at least a portion of the first conductor portion. The first conductor portion has a first portion corresponding to the first helical conductor portion, a second portion corresponding to the second helical conductor portion, and a third portion corresponding to the through-hole portion. The manufacturing method includes: The first portion is formed on one side of the main surface of the insulating sheet substrate having a through hole, the second portion is formed on the other side of the main surface of the sheet substrate, and the third portion is formed inside the through hole; For the sheet-like substrate, portions that are neither opposite to the first portion nor the second portion are removed, and at least a portion of the first portion facing the surface near the second portion and the second portion facing the surface near the first portion are removed; and The second conductor portion is formed to cover the exposed portion of the component made of conductive material containing the first conductor portion.

18. The method of manufacturing a coil component as claimed in claim 17, wherein the second conductor portion is formed by a plating process.

19. The method of manufacturing the coil component as claimed in claim 18, wherein, The main surface of the sheet-like substrate has a third conductor portion made of a third conductive material. The first conductor portion is formed by electrolytic plating of the third conductor portion with current applied, and The exposed portion forming the second conductor portion has a portion composed of the third conductor portion.

20. The method of manufacturing the coil component as claimed in claim 19, wherein, The treated area of ​​the main surface of the sheet substrate subjected to the electrolytic plating includes a negative pattern of the insulating layer formed on the third conductor portion, and Before removing the sheet substrate, remove the portion of the insulating layer and the third conductor portion that is not in contact with the first conductor portion.

21. The method of manufacturing a coil component as claimed in claim 20, wherein the third conductive material has different etching characteristics than the first conductive material.

22. The method of manufacturing a coil component as claimed in claim 19, wherein the treated area of ​​the main surface of the sheet substrate treated by the electrolytic plating includes a pattern of the third conductor portion having a shape corresponding to the first portion and the second portion.

23. The method of manufacturing a coil component as claimed in claim 17, wherein in at least a portion between the first portion and the second portion, an insulating material constituting the sheet-like substrate remains.

24. The method of manufacturing a coil component as claimed in claim 23, wherein the insulating material has a portion that contacts the first portion and the second portion.

25. The method of manufacturing a coil component as claimed in claim 23, wherein the sheet-like substrate has a structure in which inorganic particles are dispersed in a matrix portion made of organic material, and the insulating material comprises the inorganic particles.

26. The method of manufacturing a coil component as claimed in claim 17, comprising forming a first insulating portion to cover at least a portion of the second conductor portion.

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