Electronic device comprising an electrically conductive structure for improving antenna performance

Abstract

An electronic device according to one embodiment can include a conductive bracket including a recessed portion, and a display disposed on the conductive bracket and including a conductive layer. The electronic device can include a conductive pad including a first surface in contact with the conductive layer and a second surface opposite the first surface, and a non-conductive layer attached on the recessed portion. The electronic device can include a conductive plate including a first portion in contact with the second surface and the non-conductive layer, and a second portion in contact with the recessed portion and including a plurality of connection portions. The conductive plate can be electrically connected to the conductive bracket through the second portion including the plurality of connection portions.

Description

Technical Field

[0001] This disclosure relates to electronic devices including conductive structures for improving antenna performance. Background Technology

[0002] Portable electronic devices such as smartphones or tablet PCs can establish communication channels with external electronic devices such as base stations or other portable electronic devices. In order to reduce signal loss from or to external electronic devices, the electronic device may need a structure for improving the performance of the antenna used to communicate with the external electronic device.

[0003] The above information may be provided as relevant technology for the purpose of aiding understanding of this disclosure. No claim or determination is made as to whether any of the above information can be considered prior art in connection with this disclosure. Summary of the Invention

[0004] An electronic device is disclosed. According to an embodiment, the electronic device may include: a conductive support including a recessed portion; and a display disposed above the conductive support and including a conductive layer. The electronic device may include a conductive pad including a first surface in contact with the conductive layer of the display and a second surface opposite to the first surface, and a portion of the conductive pad may be disposed in the recessed portion. The electronic device may include a non-conductive layer attached to the recessed portion. The electronic device may include a conductive plate including a first portion in contact with the second surface of the conductive pad and the non-conductive layer, and a second portion including a plurality of connecting portions in contact with the recessed portion. The conductive plate may be electrically connected to the conductive support through the second portion including the plurality of connecting portions.

[0005] An electronic device is disclosed. According to an embodiment, the electronic device may include: a display, including a conductive layer; and a housing, including a conductive support and coupled to the display, the conductive support including a metal layer. The electronic device may include a non-conductive layer attached to the surface of the metal layer facing the display. The electronic device may include a conductive pad, the conductive pad including a first surface in contact with the conductive layer of the display and a second surface opposite to the first surface. The electronic device may include a conductive plate, the conductive plate including a first portion in contact with the second surface of the conductive pad and disposed between the non-conductive layer and the conductive pad, and a second portion extending from the first portion and including a plurality of connecting portions. The plurality of connecting portions may extend from the second portion to the metal layer. The conductive plate may be electrically connected to the conductive support through the second portion including the plurality of connecting portions. Attached Figure Description

[0006] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] Figure 2a This is a diagram illustrating an electronic device according to an embodiment.

[0008] Figure 2b This is an exploded perspective view of an electronic device according to an embodiment.

[0009] Figure 3a A portion of an exemplary electronic device is shown.

[0010] Figure 3b It is along Figure 3a A partial cross-sectional view of an exemplary electronic device taken by line A-A'.

[0011] Figure 4a A portion of an exemplary electronic device is shown.

[0012] Figure 4b This is a top plan view of a conductive component of an exemplary electronic device.

[0013] Figure 4c A portion of an exemplary electronic device is shown.

[0014] Figure 5a A portion of an exemplary electronic device is shown before the conductive components are compressed.

[0015] Figure 5b A portion of an exemplary electronic device is shown after the conductive components have been compressed.

[0016] Figure 6 A portion of an exemplary electronic device is shown.

[0017] Figure 7 It is a graph showing the resistance of the current path according to the compression ratio of the conductive component of an exemplary electronic device. Detailed Implementation

[0018] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0019] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one component (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

[0020] Processor 120 can execute, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 coupled to processor 120, and can perform various data processing or calculations. According to embodiments, as at least part of data processing or calculation, processor 120 can store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. In the example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0021] The auxiliary processor 123 can, when the main processor 121 is inactive (e.g., in a sleep state), control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) in place of the main processor 121, or, when the main processor 121 is active (e.g., executing an application), control, together with the main processor 121, at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) can include hardware structures specified for artificial intelligence model processing. The artificial intelligence model can be generated through machine learning. This learning can be performed, for example, by an electronic device 101 that performs artificial intelligence, or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these, but is not limited thereto. Additionally or alternatively, the artificial intelligence model can include a software architecture different from the hardware architecture.

[0022] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0023] Program 140 may be stored as software in memory 130 and may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0024] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by another component of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0025] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0026] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch, or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0027] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0028] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0029] Interface 177 may support one or more specified protocols for enabling electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0030] Connection 178 may include a connector, via which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0031] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that a user can recognize via touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0032] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0033] The power management module 188 can manage the power supply to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

[0034] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0035] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors that can operate independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth™, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can use user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and authenticate the electronic device 101 in the communication network, such as the first network 198 or the second network 199.

[0036] Wireless communication module 192 can support 5G networks and next-generation communication technologies beyond 4G networks, such as New Radio (NR) access technologies. NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or higher) for implementing eMBB, lost coverage (e.g., 164 dB or lower) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0037] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, communication module 190 (e.g., wireless communication module 192) can select at least one antenna from the multiple antennas, for example, an antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0038] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna). The RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band). The multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0039] At least some of the aforementioned components can be interconnected and transmit signals (e.g., commands or data) therebetween via inter-peripheral communication schemes (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0040] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic devices 102 or 104 can be a device of the same or different type as electronic device 101. According to an embodiment, all or some of the operations to be performed at electronic device 101 can be performed in one or more of external electronic devices 102, 104, or 108. In an example, if electronic device 101 is to automatically perform a function or service or should perform a function or service in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a requested portion of the function or service, or perform additional functions or services related to the request, and transmit the execution result to electronic device 101. Electronic device 101 can use the result as at least part of a response to the request, with or without further processing. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies can be used, for example. Electronic device 101 can use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 can be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0041] Figure 2a This is a diagram illustrating an electronic device according to an embodiment.

[0042] refer to Figure 2a The electronic device 200 according to an embodiment may include a housing 210 forming the exterior of the electronic device 200. In an example, the housing 210 may include a front surface 200A, a rear surface 200B, and a side surface 200C surrounding the space between the front surface 200A and the rear surface 200B. According to an embodiment, the housing 210 may refer to a structure forming at least a portion of the front surface 200A, the rear surface 200B, and / or the side surface 200C.

[0043] The electronic device 200 according to an embodiment may include a substantially transparent front panel 202. According to an embodiment, the front panel 202 may form at least a portion of the front surface 200A. According to an embodiment, the front panel 202 may include, for example, a glass plate or a polymer plate including various coatings, but is not limited thereto.

[0044] The electronic device 200 according to an embodiment may include a substantially opaque back panel 211. According to an embodiment, the back panel 211 may form at least a portion of the back surface 200B. According to an embodiment, the back panel 211 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.

[0045] The electronic device 200 according to an embodiment may include a side bezel structure 218 (or side member). According to an embodiment, the side bezel structure 218 may be coupled to a front panel 202 and / or a rear panel 211 to form at least a portion of a side surface 200C of the electronic device 200. In one example, the side bezel structure 218 may form the entire side surface 200C of the electronic device 200, and in another example, the side bezel structure 218 may form the side surface 200C of the electronic device 200 together with the front panel 202 and / or the rear panel 211.

[0046] Unlike the illustrated embodiment, when the side surface 200C of the electronic device 200 is partially formed by the front plate 202 and / or the rear plate 211, the front plate 202 and / or the rear plate 211 may include a region that curves and extends seamlessly from its peripheral portion toward the rear plate 211 and / or the front plate 202. In the example, the extended regions of the front plate 202 and / or the rear plate 211 may be located at both ends of the long side of the electronic device 200, but are not limited to the example described above.

[0047] According to an embodiment, the side frame structure 218 may comprise metal and / or polymer. According to an embodiment, the back panel 211 and the side frame structure 218 may be integrally formed and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. In the example, the back panel 211 and the side frame structure 218 may be formed as separate constructions and / or may comprise different materials.

[0048] According to an embodiment, the electronic device 200 may include at least one of a display 201, audio modules 203, 204 and 207, a sensor module (not shown), camera modules 205, 212 and 213, a key input device 217, a light-emitting element (not shown), and / or a connector hole 208. According to an embodiment, the electronic device 200 may omit at least one of the components (e.g., the key input device 217 or the light-emitting element (not shown)), or may additionally include another component.

[0049] According to an embodiment, the display 201 can be visually exposed through the main portion of the front panel 202. In an example, at least a portion of the display 201 can be seen through the front panel 202 forming the front surface 200A. According to an embodiment, the display 201 can be disposed on the rear surface of the front panel 202.

[0050] According to an embodiment, the appearance of the display 201 can be formed to be substantially the same as the appearance of the front panel 202 adjacent to the display 201. According to an embodiment, in order to expand the visually exposed area of ​​the display 201, the distance between the exterior of the display 201 and the exterior of the front panel 202 can be formed to be substantially the same.

[0051] According to an embodiment, the display 201 (or the front surface 200A of the electronic device 200) may include a screen display area 201A. According to an embodiment, the display 201 may provide visual information to a user through the screen display area 201A. In the illustrated embodiment, when viewed from the front, the screen display area 201A is illustrated as spaced apart from the outer side of the front surface 200A and located inside the front surface 200A, but is not limited thereto. In another embodiment, when viewed from the front, at least a portion of the peripheral portion of the screen display area 201A may substantially coincide with the peripheral portion of the front surface 200A (or the front panel 202).

[0052] According to an embodiment, the screen display area 201A may include a sensing area 201B configured to acquire a user's biometric information. In this document, "screen display area 201A includes sensing area 201B" can be understood as at least a portion of sensing area 201B overlapping with screen display area 201A. In the example, sensing area 201B may represent an area where visual information can be displayed by the display 201 like other areas of screen display area 201A, and where user biometric information (e.g., fingerprint) can be additionally acquired. According to an embodiment, sensing area 201B may be formed in key input device 217.

[0053] According to an embodiment, the display 201 may include an area where the first camera 205 is located. According to an embodiment, an opening may be formed in the area of ​​the display 201, and the first camera 205 (e.g., a punch-hole camera) may be at least partially disposed in the opening facing the front surface 200A. In this case, the screen display area 201A may surround at least a portion of the periphery of the opening. According to an embodiment, the first camera 205 (e.g., an under-display camera (UDC)) may be disposed below the display 201 to overlap with the area of ​​the display 201. In this case, the display 201 can provide visual information to the user through this area, and additionally, the first camera 205 can obtain an image corresponding to the direction facing the front surface 200A through the area of ​​the display 201.

[0054] According to an embodiment, the display 201 may be connected to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure) and / or a digitizer capable of detecting magnetic field type styluses, or may be disposed adjacent to the touch sensing circuit, the pressure sensor capable of measuring touch intensity (pressure) and / or the digitizer capable of detecting magnetic field type styluses.

[0055] According to an embodiment, audio modules 203, 204 and 207 may include microphone holes 203 and 204 and speaker holes 207.

[0056] According to an embodiment, microphone holes 203 and 204 may include a first microphone hole 203 formed in a portion of the side surface 200C and a second microphone hole 204 formed in a portion of the rear surface 200B. A microphone (not shown) for obtaining external sound may be disposed inside microphone holes 203 and 204. The microphone may include multiple microphones to detect the direction of sound.

[0057] According to an embodiment, a second microphone hole 204 formed in a portion of the rear surface 200B may be disposed adjacent to camera modules 205, 212, and 213. In the example, the second microphone hole 204 may acquire sound based on the operation of camera modules 205, 212, and 213. However, it is not limited thereto.

[0058] According to an embodiment, the speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for communication. The external speaker hole 207 may be formed in a portion of the side surface 200C of the electronic device 200. According to an embodiment, the external speaker hole 207 may be implemented as a single hole together with the microphone hole 203. Although not shown, the receiver hole (not shown) for communication may be formed in another portion of the side surface 200C. In an example, the receiver hole for communication may be formed on the opposite side of the external speaker hole 207 on the side surface 200C. In an example, based on Figure 2aAs illustrated, an external speaker hole 207 may be formed on a side surface 200C corresponding to the lower end of the electronic device 200, and a receiver hole for communication may be formed on a side surface 200C corresponding to the upper end of the electronic device 200. However, this is not a limitation; according to an embodiment, the receiver hole for communication may be formed at a location other than the side surface 200C. In the example, the receiver hole for communication may be formed by a space spaced between the front panel 202 (or display 201) and the side bezel structure 218.

[0059] According to an embodiment, the electronic device 200 may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole 207 and / or a receiver hole (not shown) for communication.

[0060] According to an embodiment, the sensor module (not shown) can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device 200 or the external environmental state of the electronic device 200. In the example, the sensor module includes at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0061] According to an embodiment, camera modules 205, 212 and 213 may include a first camera 205 configured to face the front surface 200A of the electronic device 200, a second camera 212 configured to face the rear surface 200B, and a flash 213.

[0062] According to an embodiment, the second camera 212 may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera 212 is not necessarily limited to including multiple cameras and may include a single camera.

[0063] According to an embodiment, the first camera 205 and the second camera 212 may include one or more lenses, image sensors and / or image signal processors.

[0064] According to an embodiment, the flash 213 may include, for example, a light-emitting diode or a xenon lamp. According to an embodiment, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and an image sensor may be disposed on a surface of the electronic device 200.

[0065] According to an embodiment, the key input device 217 may be disposed on the side surface 200C of the electronic device 200. According to an embodiment, the electronic device 200 may not include some or all of the key input devices 217, and the excluded key input devices 217 may be implemented on the display 201 in another form, such as soft keys.

[0066] According to an embodiment, a connector hole 208 may be formed on a side surface 200C of the electronic device 200 to accommodate a connector of an external device. Connection terminals of the connector electrically connected to the external device may be disposed in the connector hole 208. The electronic device 200 according to an embodiment may include an interface module for processing electrical signals transmitted and received through the connection terminals.

[0067] According to an embodiment, the electronic device 200 may include a light-emitting element (not shown). In an example, the light-emitting element (not shown) may be disposed on the front surface 200A of the housing. The light-emitting element (not shown) may provide status information of the electronic device 200 in the form of light. According to an embodiment, the light-emitting element (not shown) may provide a light source associated with the operation of the first camera 205. In an example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0068] Figure 2b This is an exploded perspective view of an electronic device according to an embodiment.

[0069] In the following text, repeated descriptions of configurations having the same reference numerals as the components described above will be omitted.

[0070] Reference Figure 2b The electronic device 200 according to the embodiment may include a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery 270.

[0071] According to an embodiment, the frame structure 240 may include the exterior forming the electronic device 200 (e.g., Figure 2a The frame structure 240 comprises a side bezel structure 218 (side surface 200C) and a support portion 243 extending inwardly from the side bezel structure 218. According to an embodiment, the frame structure 240 may be disposed between the display 201 and the rear panel 211. According to an embodiment, the side bezel structure 218 of the frame structure 240 may surround the space between the rear panel 211 and the front panel 202 (and / or the display 201), and the support portion 243 of the frame structure 240 may extend from the side bezel structure 218 within this space.

[0072] According to an embodiment, the frame structure 240 may support or accommodate other components included in the electronic device 200. In an example, a display 201 may be disposed on a surface of the frame structure 240 facing one direction (e.g., the +z direction), and the display 201 may be supported by a support portion 243 of the frame structure 240. In an example, a first printed circuit board 250, a second printed circuit board 252, a battery 270, and a second camera 212 may be disposed on another surface of the frame structure 240 facing the opposite direction (e.g., the -z direction). The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera 212 may be respectively mounted on recesses defined by the side frame structure 218 and / or the support portion 243 of the frame structure 240.

[0073] According to an embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 can be respectively connected to the frame structure 240. In an example, the first printed circuit board 250 and the second printed circuit board 252 can be fixedly mounted on the frame structure 240 by means of connecting members such as screws. In an example, the battery 270 can be fixedly mounted on the frame structure 240 by means of adhesive members (e.g., double-sided tape). However, the embodiments are not limited to the above examples.

[0074] According to an embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the rear plate 211. According to an embodiment, the cover plate 260 may be disposed on the first printed circuit board 250. In an example, the cover plate 260 may be disposed on the surface of the first printed circuit board 250 facing the -z direction.

[0075] According to an embodiment, the cover plate 260 may at least partially overlap with the first printed circuit board 250 relative to the z-axis. According to an embodiment, the cover plate 260 may cover at least a portion of the first printed circuit board 250. Thus, the cover plate 260 may protect the first printed circuit board 250 from physical impact or prevent the connectors attached to the first printed circuit board 250 from disengagement.

[0076] According to an embodiment, the cover plate 260 can be fixedly mounted on the first printed circuit board 250 by means of a connecting member (e.g., screws), or it can be connected to the frame structure 240 together with the first printed circuit board 250 by means of a connecting member.

[0077] According to an embodiment, the display 201 may be disposed between the frame structure 240 and the front panel 202. In the example, the front panel 202 may be disposed on one side of the display 201 (e.g., in the +z direction), and the frame structure 240 may be disposed on the other side (e.g., in the -z direction).

[0078] According to an embodiment, the front panel 202 can be coupled to the display 201. The front panel 202 and the display 201 can be adhered to each other by means of an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) inserted therebetween.

[0079] According to an embodiment, the front panel 202 can be coupled to the frame structure 240. In an example, the front panel 202 may include an external portion that extends outside the display 201 when viewed in the z-axis direction, and can be attached to the frame structure 240 (e.g., side frame structure 218) by an adhesive member (e.g., double-sided tape) disposed between the external portion of the front panel 202 and the frame structure 240. However, it is not limited to the example described above.

[0080] According to embodiments, the processor, memory, and / or interface may be mounted on the first printed circuit board 250 and / or the second printed circuit board 252. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor central processing unit, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface can electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. According to embodiments, the first printed circuit board 250 and the second printed circuit board 252 may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0081] According to an embodiment, battery 270 can supply power to at least one component of electronic device 200. In an example, battery 270 may include a rechargeable secondary battery or a fuel cell. At least a portion of battery 270 may be disposed on a plane substantially the same as the first printed circuit board 250 and / or the second printed circuit board 252.

[0082] The electronic device 200 according to an embodiment may include an antenna module (not shown). According to an embodiment, the antenna module may be disposed between a rear panel 211 and a battery 270. The antenna module may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with external devices, or wirelessly send and receive power from external devices.

[0083] According to an embodiment, a first camera 205 (e.g., a front-facing camera) may be disposed in at least a portion (e.g., a support portion 243) of the frame structure 240, such that a lens can pass through the front panel 202 (e.g., Figure 1A portion of the front surface 200A (e.g., camera area 237) receives external light.

[0084] According to an embodiment, a second camera 212 (e.g., a rear camera) may be disposed between the frame structure 240 and the rear panel 211. According to an embodiment, the second camera 212 may be electrically connected to the first printed circuit board 250 via a connecting member (e.g., a connector). According to an embodiment, the second camera 212 may be configured such that a lens can receive external light through the camera area 284 of the rear panel 211 of the electronics 200.

[0085] According to an embodiment, camera region 284 may be formed on the surface of rear plate 211 (e.g., Figure 1 The camera region 284 is located on the rear surface 200B of the second camera 212. According to an embodiment, the camera region 284 may be formed to be at least partially transparent, allowing external light to enter the lens of the second camera 212. According to an embodiment, at least a portion of the camera region 284 may protrude from the surface of the rear plate 211 at a predetermined height. However, this is not a limitation, and in another embodiment, the camera region 284 may be formed to be substantially the same plane as the surface of the rear plate 211.

[0086] According to an embodiment, the housing of the electronic device 200 (e.g., Figure 2a The housing 210 can refer to a configuration or structure that forms at least a portion of the exterior of the electronic device 200. In this respect, at least a portion of the front panel 202, frame structure 240, and / or rear panel 211 forming the exterior of the electronic device 200 can be referred to as the housing 210 of the electronic device 200.

[0087] Figure 3a A portion of an exemplary electronic device is shown. Figure 3b It is along Figure 3a A partial cross-sectional view of an exemplary electronic device taken by line A-A'.

[0088] Reference Figure 3a and Figure 3b The electronic device 101 may include a housing 210, a display 310 including a conductive layer 311 (e.g., Figure 2a The display 201), conductive bracket 320 and conductive component 330. The conductive component 330 may be referred to as a conductive pad.

[0089] According to an embodiment, the display 310 may form at least a portion of the front surface 200A of the housing 210. In an example, the display 310 may form at least a portion of the exterior of the housing 210. In an example, the display 310 may be at least partially surrounded by the side bezel structure 218 of the housing 210. In an example, the display 310 may be coupled to the housing 210 by being fastened to it. In an example, the display 310 may include a surface 310a facing the interior (e.g., in the -z direction) of the housing 210 and another surface 310b opposite to surface 310a. The other surface 310b may form at least a portion of the front surface 200A of the housing 210 by being exposed to the exterior of the electronic device 101.

[0090] According to an embodiment, the conductive support 320 may be disposed within the housing 210. The conductive support 320 may include a recessed portion 325 facing the display 310. In an example, the conductive support 320 may be an internal structure of the housing 210. The conductive support 320 may form at least a portion of the housing 210. In an example, the conductive support 320 may be disposed on a front surface 200A and a rear surface opposite to the front surface 200A of the housing 210 (e.g., Figure 2a The rear surface 200B is surrounded by the housing 210. The conductive support 320 can be referred to as... Figure 2b The frame structure 240 or a structure forming at least a portion of the frame structure 240, but not limited thereto. In the example, the conductive support 320 may be disposed inside the housing 210 facing the display 310 to support the display 310.

[0091] In the example, the recessed portion 325 may face the surface 310a of the display 310 formed by the conductive layer 311. In the example, the recessed portion 325 may accommodate at least a portion of the conductive member 330. The recessed portion 325 may support the conductive member 330 by providing space for the conductive member 330. In the example, the recessed portion 325 may include a metal layer from which the conductive support 320 has been removed (e.g., Figure 4a Insulating layer on metal layer 321 (e.g., Figure 4a A portion of the insulating layer 322 is provided for electrical connection between the conductive support 320 and the conductive member 330. The recessed portion 325 may be configured to at least partially accommodate the conductive member 330, such that the metal layer 321 exposed by removing this portion of the insulating layer 322 from it contacts the conductive member 330.

[0092] According to an embodiment, housing 210 may include components for use with external electronic devices (e.g., Figure 1 The antenna for communication of the electronic device 102 (e.g., Figure 1The antenna module 197) has one or more conductive portions (not shown). In the example, one or more conductive portions may form at least a portion of the side frame structure 218 of the housing 210, or may be formed by the side surface of the housing 210 at least partially by the side frame structure 218 (e.g., Figure 2a The side surface 200C of the electronic device 101 is exposed to the outside. In the example, the conductive support 320 may be coupled to or integrally formed with the side frame structure 218, which includes one or more conductive portions. The electronic device 101 may need to use the conductive structures of the display 310 and the conductive support 320 to improve the protection against external electronic devices 102 and / or servers (e.g., by using one or more conductive portions as antennas). Figure 1 The performance of signals received by server 108 or signals sent from electronic devices to external electronic devices 102 and / or server 108 (e.g., increasing the bandwidth of the signal frequency).

[0093] According to an embodiment, the conductive layer 311 of the display 310 may form a surface 310a facing the conductive support 320. The display 310 may include a conductive layer 311 facing the conductive support 320 and a plurality of layers 312 disposed on the conductive layer 311 (e.g., in the +z direction).

[0094] In the example, although not shown, the plurality of layers 312 may include at least one substantially transparent window. At least one window may be exposed to the outside of the electronic device 101 to form at least a portion of the front surface 200A of the housing 210. In the example, the plurality of layers 312 may include a polarizer. The polarizer can reduce the amount of light reflected in the display 310 after incident from the outside of the electronic device 101. Because the amount of light reflected in the display 310 is reduced by the polarizer, the visibility of the display 310 can be improved. The polarizer may be a layer attached to at least one window of the display 310. In the example, the plurality of layers 312 may include a display panel for driving the display 310. In the example, the plurality of layers 312 may include a plurality of adhesive layers for attaching the plurality of layers 312 to each other. However, the embodiments supported by this disclosure are not limited thereto.

[0095] In this example, conductive layer 311 may be attached to one of the layers 312 facing the conductive support 320. When viewing the display 310 from above (e.g., when viewed from the +z direction), conductive layer 311 may overlap with the front surface 200A of housing 210. In this example, conductive layer 311 may be electrically connected to conductive member 330 by contacting conductive member 330. In this example, conductive layer 311 in contact with the surface of conductive member 330 may be electrically connected via conductive member 330 to conductive support 320 on another surface opposite to conductive member 330.

[0096] According to an embodiment, the conductive member 330 may be disposed between the conductive support 320 and the conductive layer 311 for use with external electronic devices (e.g., Figure 1 (Electronic device 102) Communication. The conductive component 330 can provide a current path between the conductive support 320 and the conductive layer 311.

[0097] In the example, the conductive member 330 may include a first surface 330a in contact with the conductive layer 311 and a second surface 330b opposite to the first surface 330a. According to an embodiment, the second surface 330b may be attached to the recessed portion 325 (e.g., in the +z direction).

[0098] In the example, the conductive member 330 may be at least partially disposed within the recessed portion 325 of the conductive support 320 to contact the inner surface of the recessed portion 325. In the example, when referring to... Figure 4a In this case, the conductive member 330 may be disposed on the portion of the recessed portion 325 from which the insulating layer 322 of the conductive support 320 has been removed. The conductive member 330 may be attached to this portion from which the insulating layer 322 of the conductive support 320 has been removed to contact the metal layer 321 of the conductive support 320. The conductive member 330 may be electrically connected to the conductive support 320 by surface-to-surface contacting with the metal layer 321. In the example, the conductive member 330 may be disposed within the internal volume of the recessed portion 325 to fill a portion of the internal volume. However, the embodiments supported by this disclosure are not limited thereto. In the example, unlike the illustration, the recessed portion 325 may be omitted. In this case, the conductive member 330 may be disposed on the portion from which the insulating layer 322 of the conductive support 320 has been removed to contact the metal layer 321 beneath the insulating layer 322 of the conductive support 320.

[0099] In this example, the conductive member 330 may be inserted between the conductive support 320 and the conductive layer 311. The conductive member 330 may contact the conductive support 320 and the conductive layer 311. In this example, the conductive member 330 may be fastened between the conductive layer 311 and the recessed portion 325. The conductive member 330 may be attached to the recessed portion 325 and the conductive layer 311. In this example, the conductive member 330 may be elastic. The conductive member 330 may be pressed by the conductive layer 311 and the conductive support 320, thereby pressing the conductive layer 311 in the direction facing the display 310 (e.g., the +z direction) or the conductive support 320 in the opposite direction (e.g., the -z direction) by the repulsion force of the conductive member 330. The conductive member 330 may be configured to maintain the contact area between the conductive support 320 and the conductive layer 311 by being elastic.

[0100] In the example, the surface of the conductive member 330 facing the display 310 (e.g., the first surface 330a) may contact the conductive layer 311 (or the surface 310a of the display 310 formed by the conductive layer 311). Another surface of the conductive member 330 opposite this surface and facing the conductive support 320 (e.g., the second surface 330b) may contact the conductive support 320. This other surface of the conductive member 330 may be disposed on a portion of the conductive support 320 from which the insulating layer 322 has been removed, to contact the metal layer 321 of the conductive support 320. The conductive member 330 can electrically connect the display 310 and the conductive support 320 by contacting the conductive layer 311 and the metal layer 321.

[0101] In the example, the conductive support 320 may be coupled to a structure (e.g., side frame structure 218) of the housing 210 that includes one or more conductive portions serving as antennas, or may include one or more conductive portions (e.g., metal layer 321) serving as antennas. The conductive member 330 may electrically connect the conductive support 320 and the conductive layer 311 of the display 310 to form a current path between the conductive support 320 and the conductive layer 311 for communication with the external electronic device 102. In the example, when referring to… Figure 3a In this case, the conductive member 330 can electrically connect the conductive layer 311 to the conductive support 320, thereby relatively increasing the surface current density of the area of ​​the conductive support 320 to which the conductive member 330 is attached. The conductive member 330 can increase the bandwidth of the frequency of the signal transmitted from the electronic device 101 to the external electronic device 102 and / or the signal received from the external electronic device 102 to the electronic device 101 by increasing the surface current density of the conductive support 320, which is used as an antenna, so as to communicate with the external electronic device 102.

[0102] Although the electronic device 101 has been described above as including conductive member 330, the embodiments supported by this disclosure are not limited thereto. The electronic device 101 may include a plurality of conductive members providing a current path between conductive support 320 and conductive layer 311. The plurality of conductive members may be arranged adjacent to one or more conductive portions of the conductive support 320 and / or side frame structure 218 that serve as an antenna. In the example, when referring to… Figure 3a The conductive support 320 may include multiple regions 300a, 300b, 300c, 300d, 300e, and 300f on which conductive members are respectively disposed. In the example, regions 300a, 300b, 300c, and 300d may form current paths for improving the frequency bandwidth of the main antenna of the electronic device 101 by including conductive members 330 respectively. In the example, regions 300e and 300f may form current paths for improving the frequency bandwidth of the auxiliary antenna of the electronic device 101 by including conductive members 330 respectively. However, the above embodiments are exemplary and are not limited thereto.

[0103] According to an embodiment, the conductive member 330 and / or the metal layer 321 can be corroded by reacting with the surface-to-surface contact between the conductive member 330 and the metal layer 321 of the conductive support 320. Furthermore, when a nonlinear resistance is generated in the current path provided by the conductive member 330 between the conductive support 320 and the conductive layer 311, the contact surface of the metal layer 321 that contacts the conductive member 330 (e.g., Figure 4a The discontinuity (or relatively high asperity) of surface 321a) may generate noise (e.g., passive intermodulation (PIM)) in signals used for communication with external electronic device 102. Electronic device 101 may require a structure to reduce corrosion of the conductive support 320 and / or conductive member 330 caused by surface-to-surface contact electrical connections between the conductive support 320 and conductive member 330, and to reduce noise in signals used for communication with external electronic device 102 caused by surface-to-surface contact electrical connections between the conductive support 320 and conductive member 330. Figure 4a The following figures and description disclose a structure for reducing corrosion of the conductive support 320 and / or conductive member 330, as well as noise in the signal.

[0104] The electronic device 101 according to one or more of the above embodiments may include a conductive member 330 that provides a current path by electrically connecting the conductive layer 311 and the conductive support 320 of the display 310. The conductive member 330 can improve the frequency bandwidth of the signals of the electronic device 101 for communicating with an external electronic device 102 by forming a current path.

[0105] Figure 4a A portion of an exemplary electronic device is shown. Figure 4b This is a top plan view of a conductive component of an exemplary electronic device. Figure 4c A portion of an exemplary electronic device is shown.

[0106] Reference Figure 4a , Figure 4b and Figure 4c The electronic device 101 may include a housing (e.g., Figure 2a The housing 210), and the display 310 forming at least a portion of the front surface 200A of the housing 210 (e.g., housing 210). Figure 2a The electronic device 101 may include a display 310 and a conductive support 320 for supporting the display 310. The conductive support 320 includes a recessed portion 325 disposed within the housing 210 and facing the display 310. The electronic device 101 may include a display 310, which includes a conductive layer 311 forming a surface 310a facing the conductive support 320. The electronic device 101 may include a conductive member 330 providing a current path between the conductive support 320 and the conductive layer 311.

[0107] According to an embodiment, the electronic device 101 may include a conductive plate 410 attached to a recessed portion 325 of a conductive support 320, and includes a first portion 411 and a second portion 412, the second portion 412 extending from the first portion 411 and including a plurality of connection portions 420 for electrical connection with the conductive support 320.

[0108] In this example, the conductive plate 410 may be at least partially inserted between the conductive support 320 and the conductive member 330. In this example, the conductive plate 410 may be fastened to the conductive support 320 via multiple connecting portions 420. In this example, the conductive plate 410 may be disposed within a recessed portion 325. The conductive plate 410 may be attached to the surface of the recessed portion 325 facing the display 310. In this example, the conductive plate 410 may press the conductive member 330 toward the display 310 (e.g., in the +z direction) by supporting the conductive member 330. In this example, the display-facing surface 410a of the conductive plate 410 may at least partially contact the conductive member 330. Another surface 410b, opposite surface 410a, may be disposed on the conductive support 320. In this example, the other surface 410b of the conductive plate 410 may face the conductive support 320. The other surface 410b of the conductive plate 410 may be attached to the conductive support 320 via a non-conductive layer 430.

[0109] In the example, the first portion 411 may be connected to the second portion 412. In the example, the first portion 411 may be surrounded by the second portion 412. The first portion 411 may be an area for mounting the conductive member 330 onto the conductive plate 410. In the example, when viewed from above (e.g., when viewed from the +z direction), the first portion 411 may at least partially overlap with the conductive member 330. In the example, the first portion 411 may be an area for electrical connection with the conductive member 330. In the example, the first portion 411 may be fastened to face the conductive layer 311 by a plurality of connecting portions 420 disposed within the second portion 412. In the example, the first portion 411 may be in surface-to-surface contact with the conductive member 330 via the surface 410a of the conductive plate 410. In the example, the area of ​​the first portion 411 may be larger than the area of ​​the second portion 412 for attachment of the conductive member 330. The conductive plate 410 may include a first portion 411 that provides a contact surface for contacting the conductive member 330, thereby increasing the contact area with the conductive member 330, and together with the conductive member 330, provides a current path between the conductive support 320 and the conductive layer 311.

[0110] In the example, the second portion 412 may be a region for electrical connection with the conductive support 320. In the example, when viewed from above (e.g., when viewed from the +z direction), the second portion 412 may not overlap with the conductive member 330. In the example, the second portion 412 may be a region where the conductive member 330 is not attached. In the example, the second portion 412 may be a region including the periphery 415 of the conductive plate 410. The second portion 412 may be coupled to the conductive support 320 via multiple connecting portions 420, thereby securing the conductive plate 410 to the conductive support 320.

[0111] In this example, multiple connection portions 420 may be located within the second portion 412. The multiple connection portions 420 may be arranged along the periphery 415 of the conductive plate 410 in the second portion 412. In this example, the multiple connection portions 420 may form a current path between the conductive plate 410 and the conductive support 320 by extending from the conductive plate 410 toward the conductive support 320. In this example, the multiple connection portions 420 may be portions of the conductive plate 410 that contact the metal layer 321 of the conductive support 320. In this example, the multiple connection portions 420 may electrically connect the conductive plate 410 and the metal layer 321 by extending from the conductive plate 410 to the metal layer 321 of the conductive support 320. In this example, another surface 410b of the conductive plate 410 facing the conductive support 320 may be spaced apart from the surface 321a of the metal layer 321 facing the display 310 by a non-conductive layer 430. The conductive plate 410 may contact the metal layer 321 by the multiple connection portions 420 extending into the metal layer 321 in the second portion 412. Since the conductive plate 410 can contact the metal layer 321 through multiple connection portions 420 instead of surface-to-surface contact, the conductive plate 410 can reduce corrosion of the metal layer 321 and / or the conductive plate 410 caused by the reaction between the metal layer 321 and the conductive plate 410 (and / or the conductive member 330).

[0112] According to an embodiment, the conductive member 330 may be attached to a first portion 411 of the conductive plate 410 and disposed between the conductive plate 410 and the conductive layer 311, thereby providing a current path between the conductive support 320 and the conductive layer 311. In an example, the conductive member 330 may be interposed between the conductive plate 410 and the conductive layer 311. In an example, a first surface 330a of the conductive member 330 may contact a surface 310a of the display 310 formed by the conductive layer 311. A second surface 330b of the conductive member 330, opposite to the first surface 330a, may contact a surface 410a of the conductive plate 410 facing the display 310. In an example, the conductive member 330 may extend from the conductive plate 410 to the conductive layer 311. In an example, the conductive plate 410 may be electrically connected to the conductive support 320 via a plurality of connecting portions 420 within a second portion 412 that contact the metal layer 321. The conductive member 330 may be electrically connected to the conductive plate 410 via contact with a first portion 411 extending from the second portion 412. The conductive member 330 can be electrically connected to the conductive layer 311 by contacting the surface 310a of the display 310 formed by the conductive layer 311. The conductive member 330 can provide a current path from the conductive support 320 to the conductive layer 311 and / or from the conductive layer 311 to the conductive support 320 together with the conductive plate 410 connected to the conductive support 320 through a plurality of connection portions 420.

[0113] According to an embodiment, the conductive support 320 may include a metal layer 321 and an insulating layer 322 disposed on the surface 321a of the metal layer 321 facing the display 310.

[0114] Reference Figure 4a The metal layer 321 can contact the non-conductive layer 430. The insulating layer 322 can be removed from the portion of the conductive support 320 where the non-conductive layer 430 is disposed. In the example, the non-conductive layer 430 can be disposed between the first portion 411 of the conductive plate 410 and the metal layer 321. The non-conductive layer 430 can be configured to attach the conductive plate 410 to the recessed portion 325. The first portion 411 of the conductive plate 410 can be spaced apart from the metal layer 321 by the non-conductive layer 430. Since the first portion 411 is spaced apart from the metal layer 321 by the non-conductive layer 430, the electronic device 101 can reduce corrosion of the conductive plate 410 and / or the metal layer 321 caused by surface-to-surface contact between the first portion 411 and the metal layer 321 (or the surface 321a of the metal layer 321).

[0115] Reference Figure 4c At least a portion of the insulating layer 322 may be disposed between the non-conductive layer 430 and the metal layer 321. In the example, the insulating layer 322 may cover the surface 321a of the metal layer 321 facing the display 310. Multiple connection portions 420 may extend from the conductive plate 410 to the metal layer 321 by penetrating the insulating layer 322. However, the above embodiments are exemplary and not limited thereto. In the example, either the non-conductive layer 430 or the insulating layer 322 may be omitted. The first portion 411 of the conductive plate 410 may be spaced from the metal layer 321 by another structure not omitted from the non-conductive layer 430 and the insulating layer 322, thereby reducing corrosion of the conductive plate 410 and / or the metal layer 321 due to surface-to-surface contact between the conductive plate 410 and the metal layer 321.

[0116] In this example, metal layer 321 may be the base material of conductive support 320. Metal layer 321 may be a portion of conductive support 320 configured to conduct current via electrical connection to conductive plate 410. In this example, insulating layer 322 may partially cover the surface 321a of metal layer 321 facing display 310. Insulating layer 322 may be formed on metal layer 321. In this example, the reactivity of insulating layer 322 may be less than that of metal layer 321. Insulating layer 322 may reduce corrosion of metal layer 321 by at least partially covering surface 321a of metal layer 321. In this example, at least a portion of insulating layer 322 is removed within recessed portion 325 to allow non-conductive layer 430 to attach conductive plate 410 to recessed portion 325. In this example, insulating layer 322 may be referred to as an anodized layer by anodizing process of metal layer 321, but is not limited thereto.

[0117] In this example, multiple connection portions 420 can extend from the second portion 412 of the conductive plate 410 to the metal layer 321. The multiple connection portions 420 can provide a current path between the conductive plate 410 and the metal layer 321 by connecting to the metal layer 321. In addition to the multiple connection portions 420, a non-conductive layer 430 can separate another surface 410b of the conductive plate 410 facing the conductive support 320 from the surface 321a of the metal layer 321 facing the display 310.

[0118] According to an embodiment, the electronic device 101 may include a non-conductive layer 430 attached to a recessed portion 325. Each of the plurality of connection portions 420 may include a first conductive portion 420a protruding from the conductive plate 410 toward the conductive layer 311, a second conductive portion 420b contacting the metal layer 321, and a third conductive portion 420c extending from the first conductive portion 420a to the second conductive portion 420b through a second portion 412 penetrating the conductive plate 410. For example, the non-conductive layer 430 may attach the conductive plate 410 to the recessed portion 325. In an example, the non-conductive layer 430 may electrically disconnect the remainder of the conductive plate 410, excluding the plurality of connection portions 420, by being interposed between the conductive support 320 and the conductive plate 410. The electronic device 101 may include a non-conductive layer 430 interposed between the conductive support 320 and the conductive plate 410, thereby reducing corrosion of the conductive plate 410 and / or the conductive support 320 caused by reactions between the conductive plate 410 and the conductive support 320.

[0119] According to an embodiment, the size of the non-conductive layer 430 can be smaller than the size of the conductive plate 410. The thickness of the non-conductive layer 430 can be in the range of 10µm to 50µm. In the example, when viewed from above (e.g., when viewed along the -z direction), the non-conductive layer 430 can overlap with the first portion 411 of the conductive plate 410. The non-conductive layer 430 can reduce damage to the display 310 caused by the conductive plate 410 and conductive members 330 attached to the non-conductive layer 430 by having a thickness within a specified range.

[0120] In this example, the first conductive portion 420a may be a portion of a plurality of connecting portions 420 protruding from the surface 410a of the conductive plate 410 toward the display 310. Since the first conductive portion 420a is formed within the second portion 412, the conductive plate 410 can provide space for mounting the conductive member 330 via the first portion 411 extending from the second portion 412. In this example, the second conductive portion 420b may be a portion coupled to the metal layer 321. The second conductive portion 420b can be electrically connected to the metal layer 321 by contacting it. In this example, the third conductive portion 420c can provide a current path between the first conductive portion 420a and the second conductive portion 420b by connecting the first conductive portion 420a and the second conductive portion 420b. The third conductive portion 420c can extend from the second portion 412 of the conductive plate 410 toward the metal layer 321. The plurality of connecting portions 420 can be configured to electrically connect the metal layer 321 and the conductive plate 410 by respectively including conductive portions 420a, 420b, and 420c. Since the contact area between the second conductive portion 420b and the metal layer 321 is smaller than the area of ​​the surface 321a of the other surface 410b of the conductive plate 410 that is in surface-to-surface contact with the metal layer 321, the structure in which the conductive plate 410 and the metal layer 321 are connected by multiple connecting portions 420 can reduce the corrosion of the metal layer 321 and / or the conductive plate 410.

[0121] According to an embodiment, each of the plurality of connection portions 420 may include a hole 420d extending from a first conductive portion 420a through a third conductive portion 420c to a second conductive portion 420b. For example, at least a portion of the metal layer 321 may be exposed to the outside of the conductive plate 410 through each hole 420d of the plurality of connection portions 420. In the example, the plurality of connection portions 420 may be coupled to the conductive support 320 by soldering. The hole 420d may be formed by soldering. However, the method of coupling the plurality of connection portions 420 to the metal layer 321 is not limited to the embodiments supported by this disclosure, and the plurality of connection portions 420 may be coupled to the metal layer 321 by various processes.

[0122] According to an embodiment, the conductive member 330 may include an elastic member 331, a conductive film 332 covering the elastic member 331, and a first conductive adhesive member 333 attaching the conductive film 332 to the conductive plate 410 for electrical connection between the conductive film 332 and the conductive plate 410. The conductive member 330 may include a first surface 330a in contact with the conductive layer 311 and a second surface 330b opposite to the first surface 330a. The second surface 330b may be in contact with the conductive plate 410.

[0123] In this example, the elastic member 331 may be deformable. The elastic member 331 may be pressed by the conductive layer 311, thereby pressing the conductive layer 311 with a restoring force (or springback force). The conductive member 330 may maintain the contact area between the conductive member 330 and the conductive layer 311 through the restoring force of the elastic member 331, thereby reducing noise in the signal used for communication with the external electronic device 102. In this example, the elastic member 331 may be pressed by the conductive plate 410, thereby pressing the conductive plate 410 and / or the first conductive adhesive member 333 with a restoring force (or springback force). The conductive member 330 may maintain the contact area between the conductive member 330 and the conductive plate 410 through the restoring force of the elastic member 331, thereby reducing noise in the signal used for communication with the external electronic device 102.

[0124] In this example, the conductive film 332 may surround the elastic member 331. The conductive film 332 may provide a conductive surface for the conductive member 330. In this example, the conductive member 330 may further include an adhesive member 334 disposed between the elastic member 331 and the conductive film 332. The adhesive member 334 may attach the conductive film 332 to the elastic member 331, thereby reducing the likelihood of the conductive film 332 separating from the elastic member 331 due to deformation of the elastic member 331. In this example, a portion of the conductive film 332 may contact the conductive layer 311. The conductive film 332 may electrically connect the conductive member 330 and the display 310, for example, by contacting the surface 310a of the display 310 formed by the conductive layer 311.

[0125] In this example, a first conductive adhesive member 333 may be inserted between the conductive film 332 and the conductive plate 410. The first conductive adhesive member 333 can electrically connect the conductive plate 410 and the conductive film 332 by attaching the conductive film 332 to a first portion 411 of the conductive plate 410. In this example, the conductive film 332 may form a first surface 330a of the conductive member 330 that contacts the conductive layer 311 of the display 310. The first conductive adhesive member 333 may form a second surface 330b of the conductive member 330 that contacts the conductive plate 410 and is opposite to the first surface 330a. The second surface 330b of the conductive member 330 can form a current path between the conductive member 330 and the conductive plate 410 by contacting the surface 410a of the conductive plate 410 facing the display 310.

[0126] According to an embodiment, the roughness of the surface 410a of the conductive plate 410 facing the display 310 can be less than the roughness of the surface 321a of the metal layer 321 facing the display 310. In this example, reference is made to... Figure 3b When the conductive plate 410 is omitted, the surface 321a of the metal layer 321 can contact the surface 333a of the conductive member 330 formed by the first conductive adhesive member 333. Since the surface 321a of the metal layer 321 may have a relatively large roughness, the discontinuous contact structure between the surface 321a of the metal layer 321 and the surface 333a of the conductive member 330 may increase the noise of the signal used for communication with the external electronic device 102. In the example, with... Figure 3b Unlike other conductive plates, when the conductive plate 410 is provided, the second surface 330b of the conductive member 330 formed by the first conductive adhesive member 333 can contact the surface 410a (or the first portion 411) of the conductive plate 410 facing the display 310. Since the surface 410a of the conductive plate 410 can have a relatively small roughness, the contact area between the surface-to-surface contact structure between the conductive plate 410 and the conductive member 330 can be increased compared to a structure in which the metal layer 321 and the conductive member 330 are in surface-to-surface contact. The conductive plate 410 can reduce discontinuous contact structures with the conductive member 330 by having a relatively small roughness. The conductive plate 410 can reduce noise in signals used for communication with the external electronic device 102 by reducing discontinuous contact structures with the conductive member 330.

[0127] According to an embodiment, the conductive plate 410 may include at least one of nickel and stainless steel. The conductive member 330 may include at least one of copper, nickel, and polyurethane. In the example, although not shown, the conductive plate 410 may have a structure in which a layer including nickel surrounds a base material including stainless steel. The conductive plate 410 may reduce corrosion of the conductive plate 410 and / or the conductive support 320 connected to the conductive plate 410 by including a layer containing nickel. In the example, the elastic member 331 of the conductive member 330 may include polyurethane. The conductive film 332 surrounding the elastic member 331 may include at least one of copper and nickel. The conductive member 330 may provide a conductive surface for the current path between the conductive support 320 and the conductive layer 311 by including a conductive film 332 containing at least one of copper and nickel.

[0128] According to an embodiment, the plurality of connecting portions 420 may include a first connecting portion 421 and a second connecting portion 422, the second connecting portion 422 facing the first connecting portion 421 and spaced apart from the first connecting portion 421, and disposed along the periphery 415 of the conductive plate 410. In the example, the plurality of connecting portions 420 may be disposed along the periphery 415 of the conductive plate 410. In the example, a first peripheral portion 415a of the conductive plate 410 may be referred to as an end of the conductive plate 410. A second peripheral portion 415b may be referred to as another end opposite to this end of the conductive plate 410. In the example, the first connecting portion 421 may be arranged along the first peripheral portion 415a. The second connecting portion 422 may be spaced apart from the first connecting portion 421 by being arranged along a second peripheral portion 415b spaced apart from the first peripheral portion 415a. In the example, a conductive member 330 may be at least partially disposed between the first connecting portion 421 and the second connecting portion 422. In the example, the direction in which the first connecting portion 421 is arranged (e.g., the +x direction or the -x direction) may correspond to the direction in which the second connecting portion 422 is arranged, but is not limited thereto. Multiple connecting portions 420 can secure the conductive plate 410 to the conductive support 320 by including a first connecting portion 421 and a second connecting portion 422 respectively disposed along both ends of the conductive plate 410, and maintain the flatness of the conductive plate 410 to contact the conductive member 330.

[0129] According to the above embodiments, the electronic device 101 can reduce corrosion of the conductive support 320 and / or conductive member 330 by including a conductive plate 410 electrically connected to the conductive support 320 via multiple connection portions 420. The conductive plate 410 can improve the frequency bandwidth of signals used for communication with external electronic devices 102 by making surface-to-surface contact with the conductive member 330. The surface 410a of the conductive plate 410 facing the display 310 can reduce signal noise by having a roughness less than that of the surface 321a facing the display 310 than that of the metal layer 321, through surface-to-surface contact with the conductive member 330.

[0130] Figure 5a A portion of an exemplary electronic device is shown before the conductive components are compressed. Figure 5b A portion of an exemplary electronic device is shown after the conductive components have been compressed.

[0131] Reference Figure 5a and Figure 5b The electronic device 101 may include a conductive support 320 and a display 310. The conductive support 320 includes a recessed portion 325, and the display 310 is disposed above the conductive support 320 and includes a conductive layer 311. The electronic device 101 may include a conductive member 330, which includes a first surface 330a in contact with the conductive layer 311 of the display 310 and a second surface 330b opposite to the first surface 330a. The conductive member 330 may be disposed in the recessed portion 325. The electronic device 101 may include a non-conductive layer 430 attached to the recessed portion 325. The electronic device 101 may include a conductive plate 410, which includes a first portion 411 in contact with the second surface 330b of the conductive member 330 and the non-conductive layer 430, and a second portion 412 including a plurality of connecting portions 420 in contact with the metal layer 321 of the recessed portion 325. The conductive plate 410 may be electrically connected to the conductive support 320 via the second portion 412 including the plurality of connecting portions 420. According to an embodiment, a plurality of connection portions 420 may be arranged along the periphery 415 of the conductive plate 410 (e.g., a first periphery portion 415a and a second periphery portion 415b).

[0132] In the following text, the pair having the same characteristics will be omitted. Figure 4a and Figure 4b The same configuration of the reference numerals described in the figures is repeated.

[0133] According to an embodiment, the conductive member 330 may have a compression ratio c in the range of 40% to 50%. The compression ratio c of the conductive member 330 may be expressed as the ratio of the thickness t2 of the conductive member 330 after being compressed by the display 310 to the thickness t1 of the conductive member 330 before being compressed by the display 310. The compression ratio c of the conductive member 330 may be expressed by the following equation.

[0134] [Equation 1]

[0135] c / 100 = 1 - (t1 / t2)

[0136] In the example, the resilience of the conductive member 330 to the conductive layer 311 and the conductive plate 410 can be non-linearly increased by the restoring force of the elastic member 331 within a compression ratio c ranging from 40% to 50%. By keeping the compression ratio c within the range of 40% to 50%, the conductive member 330 can increase the contact area between the conductive layer 311 and the conductive plate 410 through the resilience. In the example, within the range of 40% to 50% compression ratio c, the resilience of the conductive member 330 to the conductive layer 311 can be in the range of 10 gf to 80 gf. The conductive member 330 can have a compression ratio c in the range of 40% to 50%, thereby reducing damage to the display 310 due to the relatively high resilience.

[0137] According to an embodiment, the resistance of the current path between the conductive support 320 and the conductive layer 311 provided by the conductive member 330 (and / or the conductive plate 410) can be in the range of 50 mΩ to 200 mΩ. In an example, the conductive member 330 can provide a current path between the conductive support 320 and the conductive layer 311 with a resistance in the range of 50 mΩ to 200 mΩ within a compression ratio c in the range of 40% to 50%. The conductive member 330 can reduce noise for communication with the external electronic device 102 and reduce resistance deviation of the current path by providing a current path with relatively small resistance.

[0138] According to an embodiment, the distance d between the conductive plate 410 and the conductive layer 311 can be greater than the depth h of the recessed portion 325. In the example, the recessed portion 325 can accommodate the conductive plate 410 and a portion of the conductive member 330. In the example, the distance d between the conductive plate 410 and the conductive layer 311 can correspond to the sum of the thickness t2 of the conductive member 330 and the thickness of the conductive plate 410, wherein the conductive member 330 provides a non-linearly increasing compression ratio c for its resilience. Since the distance d is greater than the depth h of the recessed portion 325, the conductive member 330 and the conductive plate 410 can form a current path between the conductive support 320 and the conductive layer 311.

[0139] Although a compression ratio c in the range of 40% to 50% based on the conductive member 330 has been described, the above embodiments are exemplary, and the embodiments supported in this disclosure are not limited thereto. In the examples, the conductive member 330 can have various properties by including various conductive materials and / or elastic materials. Since the thickness t2 (or the depth h and distance d of the groove) of the conductive member 330 inserted between the conductive plate 410 and the conductive layer 311 is designed within the range of a non-linear increase in the resilience force of the conductive member 330, it can be configured to reduce noise in communication with the external electronic device 102 while preventing damage to the display 310 by ensuring a relatively large contact area between the conductive plate 410 and the conductive layer 311. Reference will be made to... Figure 7 This describes the increase in the resilience of the conductive member 330 and the reduction in signal noise based on the compression ratio c of the conductive member 330.

[0140] Figure 6 A portion of an exemplary electronic device is shown.

[0141] Reference Figure 6 The electronic device 101 may include: a conductive support 320 including a recessed portion 325; and a display 310 disposed on the conductive support 320 and including a conductive layer 311. The electronic device 101 may include a conductive member 330, which includes a first surface 330a in contact with the conductive layer 311 of the display 310 and a second surface 330b opposite to the first surface 330a, and the conductive member 330 may be disposed in the recessed portion 325. The electronic device 101 may include a non-conductive layer 430 attached to the recessed portion 325. The electronic device may include: a conductive plate 410 including a second surface 330b of the conductive member 330; a first portion 411 in contact with the non-conductive layer 430; and a second portion 412 including a plurality of connecting portions 420 in contact with the metal layer 321 of the recessed portion 325. The conductive plate 410 may be electrically connected to the conductive support 320 via the second portion 412 including the plurality of connecting portions 420.

[0142] According to the embodiments, with Figures 4a to 5bIn contrast, conductive member 330 may include a second conductive adhesive member 610 inserted between conductive film 332 and conductive layer 311 for electrical connection between the conductive film 332 and conductive layer 311. In one example, the second conductive adhesive member 610, together with a first conductive adhesive member 333, may secure conductive member 330 between conductive plate 410 and conductive layer 311. In another example, the second conductive adhesive member 610 may be inserted between conductive film 332 and surface 310a of display 310 formed by conductive layer 311. In yet another example, the second conductive adhesive member 610 may form a first surface 330a contacting conductive layer 311 of conductive member 330. The first conductive adhesive member 333 may form a second surface 330b contacting conductive plate 410 of conductive member 330. The second conductive adhesive member 610 contacts surface 310a of conductive layer 311 and conductive film 332 of display 310, thereby providing a current path between conductive layer 311 and conductive film 332.

[0143] According to an embodiment, the second conductive adhesive member 610 may be elastic or deformable. The roughness of the second conductive adhesive member 610 may be less than the roughness of the conductive film 332. The second conductive adhesive member 610 may be deformable, thereby reducing damage to the display 310 caused by the conductive member 330. In the example, because the roughness of the surface of the second conductive adhesive member 610 in contact with the conductive layer 311 is less than that of the outer surface of the conductive film 332 (e.g., Figure 4a The surface roughness of the second conductive adhesive member 610 (333a) is such that, compared to the case where the conductive film 332 contacts the conductive layer 311, the second conductive adhesive member 610 can provide a relatively large contact area with the conductive layer 311. The second conductive adhesive member 610 can contact the conductive layer 311, thereby reducing noise in signals used for communication with the external electronic device 102 through surface-to-surface contact between the conductive member 330 and the conductive layer 311.

[0144] According to the above embodiments, the conductive component 330 of the electronic device 101 may include a second conductive adhesive component 610 in contact with the conductive layer 311, thereby improving the frequency bandwidth of the signal used for communication with the external electronic device 102. Since the second conductive adhesive component 610 has a roughness less than that of the conductive film 332, it can reduce signal noise by making surface-to-surface contact with the conductive layer 311.

[0145] Figure 7 It is a graph showing the resistance of the current path according to the compression ratio of the conductive component of an exemplary electronic device.

[0146] Reference Figure 7 The horizontal axis of graph 700 represents electronic devices (e.g., Figure 1 The conductive components of the electronic device 101 (e.g., Figure 3a The compression ratio of the conductive component 330. The first vertical axis on one side of the graph 700 represents the support plate (e.g., provided by the conductive component 330). Figure 3a The conductive bracket 320) and the display (e.g., Figure 2a Monitor 201 Figure 3b The conductive layer of the display 310 (e.g., Figure 3b The resistance of the current path between the conductive layers 311. The second vertical axis of graph 700, opposite to this side, represents the resilience of the conductive member 330.

[0147] Figures 711, 712, and 713, related to the horizontal axis and the first vertical axis of graph 700, will be described. Figures 711, 712, and 713 show the resistance of the current path between the conductive support 320 and the conductive layer 311 provided by the conductive members, respectively, according to the compression ratio of each conductive member with different characteristics. Referring to graph 711, the first conductive member can provide a current path between the conductive support 320 and the conductive layer 311 with a resistance in the range of 100 mΩ to 200 mΩ within a compression ratio of 40% to 50%. Referring to graph 712, the second conductive member can provide a current path between the conductive support 320 and the conductive layer 311 with a resistance in the range of 100 mΩ to 200 mΩ within a compression ratio of 40% to 50%. Referring to Figure 713, the third conductive member can provide a current path with a resistance in the range of 100 mΩ to 200 mΩ between the conductive support 320 and the conductive layer 311 within a compression ratio of 40% to 50%. The conductive member 330 provides a current path with a resistance in the range of 100 mΩ to 200 mΩ between the conductive support 320 and the conductive layer 311 within a compression ratio of 40% to 50%, thereby reducing the current required for connection with external electronic devices (e.g., ...). Figure 1 The resistance deviation of the current path for communication with the electronic device 102 is reduced, and the noise of the signal used for communication with the external electronic device 102 is reduced.

[0148] Curves 721, 722, and 723, related to the horizontal and second vertical axes of curve 700, will be described. Curves 721, 722, and 723 indicate the rebound force of each conductive member according to the compression ratio of each conductive member with different characteristics. Referring to curves 721, 722, and 723, the conductive member can be configured to increase the rebound force non-linearly with increasing compression ratio within a range of 40% to 50%. The conductive member 330 can be held or increased in relation to the conductive plate (e.g., by using a non-linearly increasing rebound force). Figure 4aThe contact area between the conductive plate 410 and the conductive layer 311 is defined as follows: Referring to Figure 721, the first conductive member can ensure the contact area between the conductive plate 410 and the conductive layer 311 and reduce damage to the display 310 by having a rebound force in the range of 30 gf to 80 gf within a compression rate range of 40% to 50%. Referring to Figure 722, the second conductive member can ensure the contact area between the conductive plate 410 and the conductive layer 311 and reduce damage to the display 310 by having a rebound force in the range of 30 gf to 80 gf within a compression rate range of 40% to 50%. Referring to Figure 723, the third conductive member can ensure the contact area between the conductive plate 410 and the conductive layer 311 and reduce damage to the display 310 by having a rebound force in the range of 30 gf to 80 gf within a compression rate range of 40% to 50%.

[0149] According to an embodiment, electronic devices (e.g., Figure 1 The electronic device 101 may include: a conductive support (e.g., Figure 3a The conductive support 320 includes a recessed portion (e.g., Figure 3b The recessed portion 325); and the display (e.g., Figure 2a The monitor 201 and Figure 2b The display 310 is disposed above a conductive support and includes a conductive layer. The electronic device may include a conductive pad, the conductive pad including a first surface that contacts the conductive layer of the display (e.g., Figure 3b The first surface 330a) and the second surface opposite to the first surface (e.g., Figure 3b The second surface 330b), and a portion of the conductive pad may be disposed in the recessed portion. The electronic device may include a non-conductive layer (e.g., ...) attached to the recessed portion. Figure 4a The non-conductive layer 430). The electronic device may include a conductive plate, the conductive plate including a first portion that contacts the second surface of the conductive pad and the non-conductive layer (e.g., Figure 4a The first part 411) and the second part including a plurality of connecting portions that contact the recessed portion (e.g., Figure 4a (Part 412). The conductive plate can be electrically connected to the conductive support through the second part, which includes multiple connecting portions.

[0150] For example, multiple connecting parts can be welded to a conductive support.

[0151] For example, multiple connection portions may include a first connection portion (e.g., Figure 4b The first connecting portion 421) and the second connecting portion (e.g., facing the first connecting portion and spaced apart from the first connecting portion) Figure 4bThe second connecting portion 422), the first connecting portion and the second connecting portion are along the periphery of the conductive plate (e.g., Figure 4a The perimeter is set to 415.

[0152] For example, the conductive support may also include a metal layer (e.g., Figure 4a The metal layer 321) and the insulating layer disposed on the metal layer (e.g., Figure 4a (Insulating layer 322). Multiple connection portions can extend from the conductive plate to the metal layer by penetrating the insulating layer.

[0153] For example, each of the plurality of connection portions may include a first conductive portion protruding from the conductive plate toward the conductive layer (e.g., Figure 4a The first conductive portion 420a), and the second conductive portion in contact with the metal layer (e.g., Figure 4a The second conductive portion 420b), and the third conductive portion extending from the first conductive portion to the second conductive portion by penetrating the second portion (e.g., Figure 4a The third conductive part 420c).

[0154] For example, each of the plurality of connecting portions may also include a hole extending from the first conductive portion through the third conductive portion to the second conductive portion (e.g., Figure 4b Hole 420d).

[0155] For example, conductive pads can have a compression rate in the range of 40% to 50%.

[0156] For example, the resistance of the current path between the conductive support and the conductive layer can be in the range of 50 mΩ to 200 mΩ.

[0157] For example, conductive pads may include elastic members (e.g., Figure 4a The elastic member 331), and the conductive film covering the elastic member (e.g., Figure 4a The conductive film 332), and a first conductive adhesive member (e.g., for attaching the conductive film to the conductive plate for electrical connection between the conductive film and the conductive plate). Figure 4a The first conductive adhesive component 333).

[0158] For example, the conductive pad may also include a second conductive adhesive member (e.g., inserted between the conductive film and the conductive layer) Figure 6 The second conductive adhesive component 610 is used for electrical connection between the conductive film and the conductive layer.

[0159] For example, the conductive pad may be at least partially disposed in the recessed portion. The distance between the conductive plate and the conductive layer (e.g., Figure 5b d) can be greater than the depth of the recessed portion 325 (e.g., Figure 5a h).

[0160] For example, the conductive support may also include a metal layer disposed beneath the insulating layer. The surface of the conductive plate facing the display (e.g., Figure 4a The surface roughness of the surface 410a can be less than that of the surface of the metal layer facing the insulating layer (e.g., Figure 4a The surface roughness (321a).

[0161] For example, the size of the non-conductive layer can be smaller than the size of the conductive plate. The thickness of the non-conductive layer can range from 10 μm to 50 μm.

[0162] For example, the resilience of the conductive pad to the conductive layer can be in the range of 10 gf to 80 gf.

[0163] For example, the conductive plate may include at least one of nickel and stainless steel. The conductive pad may include at least one of copper, nickel, and polyurethane.

[0164] According to an embodiment, an electronic device may include: a display including a conductive layer; and a housing including a conductive support comprising a metal layer and coupled to the display. The electronic device may include a non-conductive layer attached to a surface of the metal layer facing the display. The electronic device may include a conductive pad including a first surface in contact with the conductive layer of the display and a second surface opposite the first surface. The electronic device may include a conductive plate including a first portion in contact with the second surface of the conductive pad and disposed between the non-conductive layer and the conductive pad, and a second portion extending from the first portion and including a plurality of connecting portions. The plurality of connecting portions may extend from the second portion to the metal layer. The conductive plate may be electrically connected to the conductive support through the second portion including the plurality of connecting portions.

[0165] For example, each of the plurality of connection portions may include a first conductive portion protruding from the conductive plate toward the conductive layer, a second conductive portion in contact with the metal layer, and a third conductive portion extending from the first conductive portion to the second conductive portion by penetrating the second portion.

[0166] For example, the multiple connecting portions may include a first connecting portion and a second connecting portion facing and spaced apart from the first connecting portion, the first connecting portion and the second connecting portion being disposed along the periphery of the conductive plate. The direction in which the first connecting portion is arranged may correspond to the direction in which the second connecting portion is arranged.

[0167] For example, the conductive pad can have a compression ratio in the range of 40% to 50%. The resistance of the current path between the conductive support and the conductive layer can be in the range of 50 mΩ to 200 mΩ.

[0168] For example, a conductive pad may include an elastic member, a conductive film covering the elastic member, a first conductive adhesive member for attaching the conductive film to a conductive plate for electrical connection between the conductive film and the conductive plate, and a second conductive adhesive member inserted between the conductive film and the conductive layer for electrical connection between the conductive film and the conductive layer.

[0169] According to an embodiment, electronic devices (e.g., Figure 1 The electronic device 101 may include a housing (e.g., Figure 2a The housing 210), the front surface forming the housing (e.g., Figure 2a At least a portion of the display (e.g., front surface 200A) of the display (e.g., Figure 2a Monitor 201 Figure 3b The display 310), and the conductive bracket for supporting the display ( Figure 3a The conductive support 320 is disposed within the housing and includes a recessed portion facing the display (e.g., Figure 3b The recessed portion 325 in the middle). The electronic device may include a surface forming a conductive support facing the display (e.g., Figure 3b The conductive layer (e.g., surface 310a) of the surface (e.g., Figure 3b The conductive layer 311). Electronic devices may include conductive plates (e.g., Figure 4a The conductive plate 410 is attached to the recessed portion and includes a first portion (e.g., Figure 4b The first part 411) and the second part, the second part extending from the first part and including a plurality of connection portions for electrical connection with the conductive support (e.g., Figure 4a Multiple connection portions 420). The electronic device may include conductive components (e.g., Figure 3a The conductive component 330 provides a current path between the conductive support and the conductive layer by being attached to the first part and disposed between the conductive plate and the conductive layer, so as to communicate with external electronic devices.

[0170] For example, multiple connection portions may include a first connection portion (e.g., Figure 4a The first connecting portion 421) and the second connecting portion (e.g., facing the first connecting portion and spaced apart from the first connecting portion) Figure 4a The second connecting portion 422), the first connecting portion and the second connecting portion are along the periphery of the conductive plate (e.g., Figure 4a The perimeter is set to 415.

[0171] For example, the conductive support may also include a metal layer (e.g., Figure 4a The metal layer 321) and the surface of the metal layer facing the display (e.g., Figure 4a Insulating layer on surface 321a) (e.g., Figure 4a (Insulating layer 322). Multiple connection portions can extend from the conductive plate to the metal layer by penetrating the insulating layer.

[0172] For example, the electronic device may also include a non-conductive layer inserted between a conductive plate and an insulating layer (e.g., Figure 4a The non-conductive layer 430). Each of the plurality of connection portions may include a first conductive portion protruding from the conductive plate toward the conductive layer (e.g., Figure 4a The first conductive portion 420a), and the second conductive portion in contact with the metal layer (e.g., Figure 4a The second conductive portion 420b), and the third conductive portion extending from the first conductive portion to the second conductive portion by penetrating the conductive plate, the non-conductive layer and the insulating layer (e.g., Figure 4a The third conductive part 420c).

[0173] For example, each of the multiple connection portions may include a hole extending into the metal layer through a conductive plate and an insulating layer (e.g., Figure 4b Hole 420d).

[0174] For example, conductive components can have a compression ratio in the range of 40% to 50%.

[0175] For example, the resistance of the current path between the conductive support and the conductive layer can be in the range of 50 mΩ to 200 mΩ.

[0176] For example, a conductive component may include an elastic component (e.g., Figure 4a The elastic member 331), and the conductive film covering the elastic member (e.g., Figure 4a The conductive film 332), and a first conductive adhesive member (e.g., for attaching the conductive film to the conductive plate for electrical connection between the conductive film and the conductive plate). Figure 4a The first conductive adhesive component 333).

[0177] For example, the conductive component may also include a second conductive adhesive component (e.g., inserted between the conductive film and the conductive layer) Figure 6 The second conductive adhesive component 610 is used for electrical connection between the conductive film and the conductive layer.

[0178] For example, the conductive member may be at least partially disposed in the recessed portion. The distance between the conductive plate and the conductive layer (e.g., Figure 5b d) can be greater than the depth of the recessed portion 325 (e.g., Figure 5a h).

[0179] For example, the conductive support may also include a metal layer and an insulating layer disposed on the display-facing surface of the metal layer. The roughness of the first surface of the conductive plate facing the display may be less than the roughness of the surface of the metal layer.

[0180] For example, multiple connecting parts can be welded to a conductive support.

[0181] For example, the resilience of a conductive component to a conductive layer can be in the range of 10 gf to 80 gf.

[0182] For example, the conductive plate may include at least one of nickel and stainless steel. The conductive component may include at least one of copper, nickel, and polyurethane.

[0183] According to embodiments, the electronic device may include a display (e.g., Figure 2a Monitor 201 Figure 4a The display 310). The electronic device may include a housing, the housing including a conductive support (e.g., the conductive support 320 of FIG. 3), the conductive support including a metal layer (e.g., Figure 4a The metal layer 321) and the surface of the metal layer facing the display ( Figure 4a Insulating layer on surface 321a) (e.g., Figure 4a The insulating layer 322), and the housing is connected to the display. Electrons may include the surface of the display facing the conductive support (e.g., Figure 3b The conductive layer (e.g., surface 310b) of the surface (e.g.) Figure 3b The conductive layer 311). Electronic devices may include conductive plates (…). Figure 4a The conductive plate 410 includes a first part (e.g., Figure 4a The first part 411) and the second part extending from the first part (e.g., Figure 4a The second part 412), the second part is attached to the conductive support and includes a plurality of connection portions extending to the metal layer (e.g., Figure 4a Multiple connection portions 420) are used for electrical connection to a conductive support by penetrating an insulating layer. The electronic device may include conductive components (e.g., Figure 3b The conductive component 330 provides a current path between the conductive support and the conductive layer by being attached to the first part and disposed between the conductive plate and the conductive layer, so as to communicate with external electronic devices.

[0184] For example, the electronic device may also include a non-conductive layer inserted between a conductive plate and an insulating layer (e.g., Figure 4a The non-conductive layer 430). Each of the plurality of connection portions may include a first conductive portion protruding from the conductive plate toward the conductive layer (e.g., Figure 4aThe first conductive portion 420a), and the second conductive portion in contact with the metal layer (e.g., Figure 4a The second conductive portion 420b), and the third conductive portion extending from the first conductive portion to the second conductive portion through penetration of the conductive plate and the insulating layer (e.g., Figure 4a The third conductive part 420c).

[0185] For example, multiple connection portions may include a first connection portion (e.g., Figure 4a The first connecting portion 421) and the second connecting portion (e.g., facing the first connecting portion and spaced apart from the first connecting portion) Figure 4a The second connecting portion 422), the first connecting portion and the second connecting portion are along the periphery of the conductive plate (e.g., Figure 4a The perimeter (415) is set. The direction in which the first connecting part is arranged can correspond to the direction in which the second connecting part is arranged.

[0186] For example, the conductive component can have a compression ratio in the range of 40% to 50%. The resistance of the current path between the conductive support and the conductive layer can be in the range of 50 mΩ to 200 mΩ.

[0187] For example, a conductive component may include an elastic component, a conductive film covering the elastic component, and a first conductive adhesive component (e.g., [missing information]) to attach the conductive film to a conductive plate for electrical connection between the conductive film and the conductive plate. Figure 4a The first conductive adhesive member 333), and the second conductive adhesive member (e.g., inserted between the conductive film and the conductive layer for electrical connection between the conductive film and the conductive layer) Figure 6 The second conductive adhesive component 610).

[0188] The electronic device according to various embodiments can be one of a variety of types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to embodiments of this disclosure, the electronic device is not limited to the electronic devices described above.

[0189] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions for the respective embodiments. Regarding the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It should be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more of the described things. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any or all possible combinations of the items listed together in the corresponding phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used only to distinguish the corresponding component from another component, without otherwise limiting the component (e.g., importance or order). It should be understood that, regardless of whether the terms “operably” or “communically” are used, if an element (e.g., the first element) is referred to as being “connected” or “linked” to another element (e.g., the second element), it means that the element can be connected to the other element directly (e.g., wired), wirelessly, or via a third element.

[0190] As used in conjunction with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or its smallest unit or part. For example, according to an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0191] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without one or more other components. This allows the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" means only that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between cases where data is stored semi-permanently in the storage medium and cases where data is temporarily stored in the storage medium.

[0192] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or distributed online (e.g., downloaded or uploaded) through an app store (e.g., the Play Store™), or distributed directly between two user devices (e.g., smartphones). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least temporarily stored, in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a relay server).

[0193] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as the corresponding components in the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

Claims

1. An electronic device (101), comprising: The conductive support (320) includes a recessed portion (325); Monitor (201; 310), disposed above the conductive support (320), including a conductive layer (311); The conductive pad (330) includes a first surface (330a) in contact with the conductive layer (311) of the display (201; 310) and a second surface (330b) opposite to the first surface, and at least a portion of the conductive pad (330) is disposed in the recessed portion (325). A non-conductive layer (430) is attached to the recessed portion (325); as well as Conductive plate (410), comprising: The first portion (411) contacts the second surface (330b) of the conductive pad (330) and the non-conductive layer (430); and The second part (412) includes a plurality of connecting portions (420) that contact the recessed portion (325). The conductive plate (410) is electrically connected to the conductive support (320) via the second part (412) which includes the plurality of connecting portions (420).

2. The electronic device (101) according to claim 1. in, The plurality of connecting portions (420) are connected to the conductive support (320) by welding.

3. The electronic device (101) according to claim 1 or 2. in, The plurality of connecting portions (420) includes a first connecting portion (421) and a second connecting portion (422) facing the first connecting portion (421) and spaced apart from the first connecting portion (421). The first connecting portion (421) and the second connecting portion (422) are disposed along the periphery (415) of the conductive plate (410).

4. The electronic device (101) according to any one of claims 1 to 3. in, The conductive support (320) further includes: Metal layer (321); and An insulating layer (322) is disposed on the metal layer (321). Each of the plurality of connecting portions (420) extends from the conductive plate (410) through the insulating layer (322) to the metal layer (321).

5. The electronic device (101) according to claim 4. in, Each of the plurality of connecting portions (420) includes: A first conductive portion (420a) protrudes from the conductive plate (410) toward the conductive layer (311); The second conductive portion (420b) is in contact with the metal layer (321); and A third conductive portion (420c) extends from the first conductive portion (420a) through the second portion (412) to the second conductive portion (420b).

6. The electronic device (101) according to claim 5. in, Each of the plurality of connecting portions (420) further includes a hole (420d) extending from the first conductive portion (420a), through the third conductive portion (420c), to the second conductive portion (420b).

7. The electronic device (101) according to any one of claims 1 to 6. in, The conductive pad (330) has a compression ratio in the range of 40% to 50%.

8. The electronic device (101) according to any one of claims 1 to 7. in, The resistance of the current path between the conductive support (320) and the conductive layer (311) is in the range of 50 mΩ to 200 mΩ.

9. The electronic device (101) according to any one of claims 1 to 8. in, The conductive pad (330) includes: Elastic member (331); A conductive film (332) covers the elastic member (331); and A first conductive adhesive component (333) attaches the conductive film (332) to the conductive plate (410) for electrical connection between the conductive film (332) and the conductive plate (410).

10. The electronic device (101) according to claim 9. in, The conductive pad (330) further includes a second conductive adhesive member (610), which is inserted between the conductive film (332) and the conductive layer (311) for electrical connection between the conductive film (332) and the conductive layer (311).

11. The electronic device (101) according to any one of claims 1 to 10. in, The distance between the conductive plate (410) and the conductive layer (311) is greater than the depth of the recessed portion (325).

12. The electronic device (101) according to any one of claims 1 to 11. in, The conductive support (320) also includes a metal layer (321) in contact with the non-conductive layer (430). The surface roughness (410a) of the conductive plate (410) facing the display (201; 310) is less than the surface roughness (321a) of the metal layer (321) that contacts the non-conductive layer (430).

13. The electronic device (101) according to any one of claims 1 to 12. in, The size of the non-conductive layer (430) is smaller than the size of the conductive plate (410), and The thickness of the non-conductive layer (430) is in the range of 10µm to 50µm.

14. The electronic device (101) according to any one of claims 1 to 13. in, The resilience of the conductive pad (330) to the conductive layer (311) is in the range of 10 gf to 80 gf.

15. The electronic device (101) according to any one of claims 1 to 14. in, The conductive plate (410) comprises at least one of nickel and stainless steel, and The conductive pad (330) includes at least one of copper, nickel and polyurethane.

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