Light emitting device and laser projection apparatus

Abstract

The application relates to a light-emitting device and a laser projection equipment. In the light-emitting device, a mounting substrate comprises a connection pattern, an electric connection part and an in-board interconnection area, the electric connection part is located on the surface of the mounting substrate, and the electric connection part is electrically connected through the in-board interconnection area and the connection pattern; a light-emitting unit comprises a package tube and at least two laser chip groups with different light-emitting colors arranged in the package tube, the light-emitting unit is fixed to the mounting substrate, and the light-emitting unit is electrically connected with the connection pattern. The electric connection part is arranged in multiple groups and corresponds to the at least two laser chip groups one by one, each group of the electric connection part comprises a positive electrode connection part and a negative electrode connection part, the positive electrode connection part is connected with the positive electrode of the laser chip group with the corresponding color, and the negative electrode connection part is connected with the negative electrode of the laser chip group with the corresponding color. The light-emitting device solves the problem that the number of driving circuits increases with the increase of the number of lasers, effectively improves the working efficiency of the driving circuit, reduces the cost, and is beneficial to miniaturization design.

Description

Light-emitting devices and laser projection equipment

[0001] This application claims priority to Chinese patent application number 202311683844.6 filed on December 8, 2023, with application name “Light-emitting device and laser device”, and application number 202323356173.0 filed on December 8, 2023, with application name “Light-emitting device and laser device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of laser technology, and in particular to a light-emitting device and a laser projection device. Background Art

[0003] Laser projectors are widely used due to their high color saturation and high brightness, which help increase users' viewing comfort. Laser projectors include a light-emitting device (i.e., a laser) and a driving circuit for driving the laser to emit light. The laser includes a variety of laser chips with different light colors. Usually, in order to reduce their own wiring and save space, the multiple laser chips with different light colors in the laser adopt a common anode or common cathode wiring method.

[0004] However, the common anode or common cathode routing method of the laser chip has the problem that the number of driving circuits increases with the number of lasers, which not only affects the working efficiency of the driving circuit but also leads to increased costs.

[0005] Public content

[0006] The exemplary embodiments of the present application provide a light-emitting device and a laser projection device for solving the problem that the number of lasers used is limited by the driving circuit. While increasing the number of lasers, the number of driving circuits will not increase, which can effectively improve the working efficiency of the driving circuit and reduce costs.

[0007] The technical solutions provided by the embodiments of this application are as follows:

[0008] In a first aspect, an embodiment of the present application provides a light-emitting device, comprising:

[0009] A mounting substrate comprising a connection pattern, an electrical connection portion, and an intra-board interconnection region, wherein the electrical connection portion is located on a surface of the mounting substrate and is electrically connected to the connection pattern via the intra-board interconnection region;

[0010] a light-emitting unit comprising a package shell and at least two laser chip groups with different light emission colors disposed within the package shell, each laser chip group comprising one or multiple laser chips connected in series, the light-emitting unit being fixed to the mounting substrate and electrically connected to the connection pattern;

[0011] The electrical connection parts are provided in multiple groups and correspond one-to-one to the at least two laser chip groups. Each group of the electrical connection parts includes a positive connection part and a negative connection part. The positive connection part is connected to the positive electrode of the laser chip group of the corresponding color, and the negative connection part is connected to the negative electrode of the laser chip group of the corresponding color.

[0012] In a second aspect, an embodiment of the present application provides a laser projection device, the laser projection device comprising:

[0013] A light-emitting device, wherein the light-emitting device is as described above;

[0014] Driving circuits, the number of the driving circuits being consistent with the number of laser chip groups in the light-emitting device;

[0015] The positive electrode connection portion connected to the laser chip group is electrically connected to the positive electrode of the corresponding driving circuit, and the negative electrode connection portion connected to the laser chip group is electrically connected to the negative electrode of the corresponding driving circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the implementation methods in the embodiments of the present application or related technologies, the following is a brief introduction to the drawings required for use in the embodiments or related technology descriptions. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0017] FIG1 shows a working principle diagram of a laser in the related art;

[0018] FIG2 shows a circuit diagram of a common anode wiring method in the related art;

[0019] FIG3 shows a circuit diagram of a common cathode wiring method in the related art;

[0020] FIG4 shows a schematic structural diagram of a light-emitting device provided in an embodiment of the present application;

[0021] FIG5 shows a circuit diagram of a light-emitting device provided in an embodiment of the present application;

[0022] FIG6 is a schematic structural diagram of a package shell provided by an embodiment of the present application on a side facing a mounting substrate;

[0023] FIG7 shows a schematic structural diagram of a mounting substrate provided in an embodiment of the present application;

[0024] FIG8 shows a wiring diagram of a mounting substrate in the light emitting device shown in FIG7 ;

[0025] FIG9 shows a schematic structural diagram of another light-emitting device provided in an embodiment of the present application;

[0026] FIG10 shows a schematic structural diagram of another mounting substrate provided in an embodiment of the present application;

[0027] FIG11 shows a schematic structural diagram of another mounting substrate provided in an embodiment of the present application;

[0028] FIG12 shows a schematic structural diagram of another mounting substrate provided in an embodiment of the present application;

[0029] FIG13 shows a circuit diagram of a package shell provided in an embodiment of the present application;

[0030] FIG14 shows a schematic structural diagram of another light-emitting device provided in an embodiment of the present application;

[0031] FIG15 shows a simplified diagram of wiring inside the first tube shell provided in an embodiment of the present application;

[0032] FIG16 shows a top view of the wiring inside the first tube shell provided by an embodiment of the present application;

[0033] FIG17 shows a cross-sectional view of wiring inside a first tube shell provided by an embodiment of the present application;

[0034] FIG18 shows a simplified diagram of wiring inside the second tube shell provided in an embodiment of the present application;

[0035] FIG19 shows a top view of the wiring inside the second tube shell provided by an embodiment of the present application;

[0036] FIG20 shows a cross-sectional view of wiring inside a second tube shell provided by an embodiment of the present application;

[0037] FIG21 shows a circuit diagram of a thermistor provided in an embodiment of the present application;

[0038] FIG22 shows a schematic structural diagram of another light-emitting device provided in an embodiment of the present application;

[0039] FIG23 shows a schematic structural diagram of another mounting substrate provided in an embodiment of the present application;

[0040] FIG24 shows a schematic structural diagram of another light-emitting device provided in an embodiment of the present application;

[0041] FIG25 is a schematic structural diagram showing a side of another package shell facing the mounting substrate provided by an embodiment of the present application;

[0042] FIG26 shows a schematic structural diagram of another light-emitting device provided in an embodiment of the present application;

[0043] FIG27 shows a schematic structural diagram of another mounting substrate provided in an embodiment of the present application;

[0044] FIG28 shows a top view of wiring inside a package shell provided by an embodiment of the present application;

[0045] FIG29 shows a schematic structural diagram of another light-emitting device provided in an embodiment of the present application;

[0046] FIG30 shows a schematic structural diagram of a side of another package shell facing the mounting substrate provided by an embodiment of the present application;

[0047] FIG31 shows a schematic structural diagram of a laser projection device provided in an embodiment of the present application;

[0048] FIG32 shows a schematic diagram of a projection imaging optical path of a laser projection device provided in an embodiment of the present application;

[0049] FIG33 is a schematic diagram showing a circuit control principle of a laser projection device provided in an embodiment of the present application;

[0050] FIG34 shows a schematic structural diagram of a projection system provided in an embodiment of the present application.

[0051] The accompanying drawings respectively represent: 1. mounting substrate; 11. electrical connection portion / connection pad; 111. positive electrode connection portion; 112. negative electrode connection portion; 12. intra-board interconnection area; 13. connection pattern; 131. conductive area; 132. metal portion; 1311. transfer pad; 2. light-emitting unit; 20. laser chipset; 201. first color chipset; 202. second color chipset; 203. third color chipset; 21. laser chip; 211. first color chip; 212. second color chip; 213. third color chip; 22. package tube shell; 221. first tube shell; 222. second tube shell; 23. tube wall trace; 24. conductive structure; 241. bottom pad; 25. metal film; 26. step portion; 3. thermistor; 4. lens; 5. reflective prism; 6. heat sink substrate; 7. antistatic device; 001. Laser light source; 002. Light modulation component; 0021. Light uniformity component; 0022. Reflector; 0023. Lens; 0024. Light valve; 0025. Prism assembly; 003. Lens; 004. Housing; 005. Display control circuit; 006. Light drive circuit; 007. Power supply circuit; A. Laser projection equipment; B. Projection screen. DETAILED DESCRIPTION

[0052] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application will be further described below with reference to the accompanying drawings and examples. However, the example embodiments can be implemented in various forms and should not be understood as being limited to the embodiments set forth herein; on the contrary, these embodiments are provided to make the present application more comprehensive and complete, and to fully convey the concepts of the example embodiments to those skilled in the art. The same figure marks in the figures represent the same or similar structures, and their repeated descriptions will be omitted. The words expressing position and direction described in this application are all explained using the accompanying drawings as examples, but changes can be made as needed, and all changes are included in the scope of protection of this application. The drawings in this application are only used to illustrate relative position relationships and do not represent true proportions.

[0053] In order to make the purpose and implementation of this application clearer, the exemplary implementation of this application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only part of the embodiments of this application, not all of the embodiments.

[0054] It should be noted that the brief descriptions of terms in this application are only for the purpose of facilitating the understanding of the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their ordinary and usual meanings.

[0055] The terms "comprise," "include," and "have," and any variations thereof, are intended to cover but not exclude inclusion; for example, a product or device comprising a list of components is not necessarily limited to all the components expressly listed but may include other components not expressly listed or inherent to such product or device.

[0056] In the laser projection device involved in the related technology, its working principle is shown in Figure 1. The display part of the laser projection device powers the driving circuit and provides a driving signal. The driving circuit is used to transmit the driving signal to the three-color laser. When the three-color laser is powered on, it emits light based on the received driving signal.

[0057] Figure 2 shows three lasers with a common anode connection, and Figure 3 shows three lasers with a common cathode connection. In Figures 2 and 3, the three RGB laser chips form a three-color laser. R_T, G_T, and B_T are the driving circuits for the three-color laser. When multiple three-color lasers need to work simultaneously to increase brightness, as the number of lasers increases, the number of driving circuits also increases (R_T0, G_T0, B_T0, ..., R_Tn, G_Tn, B_Tn). The increase in driving circuits leads to reduced working efficiency and increased cost of the driving circuits.

[0058] To address the above-mentioned technical problems, embodiments of the present application provide a light-emitting device and a laser projection apparatus, as shown in Figures 4 to 7 . The light-emitting device comprises: a mounting substrate 1 and a light-emitting unit 2. Referring to Figure 7 , the mounting substrate 1 comprises a connection pattern 13, an electrical connection portion 11, and an intra-board interconnection region 12. The electrical connection portion 11 is located on the surface of the mounting substrate 1 and is electrically connected to the connection pattern 13 via the intra-board interconnection region 12. Referring to Figure 4 , the light-emitting unit 2 comprises a package 22 and at least two laser chip groups 20 with different light emission colors disposed within the package 22. Each laser chip group 20 comprises one or multiple laser chips 21 connected in series. The light-emitting unit 2 is fixed to the mounting substrate 1 and is electrically connected to the connection pattern 13. The electrical connection parts 11 are arranged in multiple groups and correspond one-to-one to at least two laser chip groups 20. Each group of electrical connection parts 11 includes a positive electrode connection part 111 and a negative electrode connection part 112. The positive electrode connection part 111 is connected to the positive electrode of the laser chip group 20 of the corresponding color, and the negative electrode connection part 112 is connected to the negative electrode of the laser chip group 20 of the corresponding color.

[0059] The light-emitting device provided in the embodiment of the present application, on the one hand, electrically connects the laser chip group 20 of each light-emitting color in the light-emitting unit 2 to a corresponding set of positive connection portions 111 and negative connection portions 112 on the mounting substrate 1. When used, the number of driving circuits is set to be consistent with the number of laser chip groups 20. For example, the positive connection portion 111 connected to the laser chip group 20 is electrically connected to the positive terminal of the corresponding driving circuit, and the negative connection portion 112 connected to the laser chip group 20 is electrically connected to the negative terminal of the corresponding driving circuit. Thus, the driving circuit can independently power and drive the laser chips 21 of different light-emitting colors. If a new light-emitting device (i.e., a laser) is added, it is only necessary to connect the new light-emitting device in series with the original light-emitting device, so that the laser chip groups 20 of the same light-emitting color in multiple light-emitting devices are connected in series and share a common driving circuit. There is no need to add new driving circuits as the number of light-emitting devices increases. This solves the problem that the number of lasers used is limited by the number of driving circuits. The number of driving circuits does not increase while the number of lasers is increased, which not only effectively improves the working efficiency of the driving circuit but also reduces the cost. On the other hand, by having the mounting substrate 1 include the connection pattern 13, the electrical connection portion 11, and the intra-board interconnection region 12, the light-emitting unit 2 is electrically connected to the connection pattern 13, and the connection pattern 13 is further electrically connected to the electrical connection portion 11 via the intra-board interconnection region 12, thereby electrically connecting the electrical connection portion 11 to the laser chipset 20 in the light-emitting unit 2. In the embodiment of the present application, the electrical connection portion 11 is located on the surface of the mounting substrate 1. Compared to electrical connection portions 11 disposed on the wall of the package 22 (e.g., extending in a direction parallel to the mounting substrate 1), this facilitates reducing the size of the light-emitting device and facilitating its miniaturization.

[0060] FIG5 illustrates the principle of three-color separate driving of a three-color laser. As shown in FIG5 , the light-emitting unit 2 can include three laser chip groups 20 with different light emission colors, namely, a laser chip group 20 with a red light emission color, a laser chip group 20 with a green light emission color, and a laser chip group 20 with a blue light emission color. The laser chip group with a red light emission color includes a plurality of red laser chips 21 (abbreviated as R) connected in series, and a red light driving circuit (abbreviated as R_T0) is connected to the positive connection portion 111 and the negative connection portion 112 connected to the laser chip group. The laser chip group with a green light emission color includes a plurality of green laser chips 21 (abbreviated as G) connected in series, and a green light driving circuit (abbreviated as G_T0) is connected to the positive connection portion 111 and the negative connection portion 112 connected to the laser chip group. The blue laser chipset includes multiple blue laser chips 21 (B) connected in series, each connected to a blue light driver circuit (G_T0) based on its positive connection portion 111 and negative connection portion 112. The laser chipset 20 containing the red laser chip 21, the laser chipset 20 containing the green laser chip 21, and the laser chipset 20 containing the blue laser chip 21 are each powered and driven independently.

[0061] For each laser chip group 20 of light emission color, the number of laser chips 21 contained therein can be adjusted according to the required light emission brightness. As the brightness requirement increases, the number of laser chips 21 contained therein also increases accordingly. When each laser chip group 20 of light emission color contains multiple laser chips 21, the multiple laser chips 21 can be connected in series.

[0062] In some examples, there are multiple light-emitting devices, and multiple groups of electrical connection portions 11 corresponding to the laser chip group 20 of the same light-emitting color in the multiple light-emitting devices are connected in series.

[0063] For example, for a certain laser projection device, if a three-color light-emitting device B is further added on the basis of the three-color light-emitting device A, the set of electrical connections 11 corresponding to the laser chipset 20 with a red light output color in the three-color light-emitting device A and the set of electrical connections 11 corresponding to the laser chipset 20 with a red light output color in the three-color light-emitting device B can be connected in series, and they can share a red light driving circuit. The set of electrical connections 11 corresponding to the laser chipset 20 with a green light output color in the three-color light-emitting device A and the set of electrical connections 11 corresponding to the laser chipset 20 with a green light output color in the three-color light-emitting device B can be connected in series, and they can share a green light driving circuit. The set of electrical connections 11 corresponding to the laser chipset 20 with a blue light output color in the three-color light-emitting device A and the set of electrical connections 11 corresponding to the laser chipset 20 with a blue light output color in the three-color light-emitting device B can be connected in series, and they can share a blue light driving circuit.

[0064] It can be seen that as the number of light-emitting devices in the laser projection equipment increases, the number of driving circuits does not increase, which is beneficial to the working efficiency and low cost of the driving circuit. Moreover, the increase in the number of light-emitting devices is also beneficial to the increase in light brightness and light path, thereby improving the light-emitting effect.

[0065] A conductive structure 24 is provided on the side of the package tube shell 22 facing the mounting substrate 1, and a conductive area 22 is also provided on the connection pattern 13. The light-emitting unit 2 is fixed on the connection pattern 13 and electrically connected to the conductive area 22. The laser chipset 20 is electrically connected to the tube wall trace 23 of the package tube shell 22, and the tube wall trace 23 is also electrically connected to the conductive structure 24.

[0066] As described above, mounting substrate 1 includes connection pattern 13, electrical connection portion 11, and intra-board interconnection region 12. Electrical connection portion 11 is electrically connected to connection pattern 13 via intra-board interconnection region 12. Light-emitting unit 2 includes package 22 and laser chipset 20 disposed within package 22. Electrical connection portion 11 and light-emitting unit 2 are located on the same side surface of mounting substrate 1.

[0067] In order to achieve electrical connection between the laser chipset 20 and the electrical connection portion 11, as shown in Figure 6, the package tube shell 22 is provided with a conductive structure 24 on the side facing the mounting substrate 1. As shown in the figure, the connection pattern 13 is also provided with a conductive area 131. The light-emitting unit 2 is fixed on the connection pattern 13 and electrically connected to the conductive area 131. The laser chipset 20 is electrically connected to the tube wall trace 23 of the package tube shell 22, and the tube wall trace 23 is also electrically connected to the conductive structure 24.

[0068] In this arrangement, the light-emitting unit 2 is fixed on the mounting substrate 1, for example, the light-emitting unit 2 is fixed on the connection pattern 13, and the laser chip group 20 of each light-emitting color is electrically connected to a corresponding set of electrical connection parts 11 (positive connection part 111 and negative connection part 112) through the tube wall routing 23, the conductive structure 24, the conductive area 131 and the intra-board interconnection area 12 in sequence, thereby realizing separate power supply for laser chip groups 20 of different colors.

[0069] The light-emitting device and laser projection equipment provided in the embodiments of the present application are exemplarily described below with reference to the accompanying drawings.

[0070] In some embodiments, as shown in FIG4 , the light-emitting device includes: a mounting substrate 1 and a light-emitting unit 2, wherein the light-emitting unit 2 is located on one side of the mounting substrate 1. As shown in FIG7-8 , a connection pattern 13, an electrical connection portion 11, and an intra-board interconnection region 12 are provided on the side of the mounting substrate 1 facing the light-emitting unit 2. For example, the intra-board interconnection region 12 is a metal film layer, and the electrical connection portion 11 is electrically connected to the conductive region 131 of the connection pattern 13 through the intra-board interconnection region 12. As shown in FIG7 , the connection pattern 13 includes a metal portion 132 and a conductive region 131. The metal portion 132 is a portion for fixing the light-emitting unit 2. For example, the metal portion 132 is rectangular in shape when viewed from above in FIG7 . The metal portion 132 can be made of copper, for example, and acts as a heat sink. The conductive region 131 is electrically connected to the light-emitting unit 2. The area marked with a thick black frame in FIG7 is the fixed position of the light-emitting unit 2 on the mounting substrate 1.

[0071] As shown in FIG. 4 , the light emitting unit 2 includes a package shell 22 and a laser chip 21 . The laser chip 21 is located inside the package shell 22 .

[0072] Exemplarily, the packaging tube shell 22 includes a tube shell bottom, a tube shell side wall and a sealing glass. The tube shell bottom is parallel to the plane where the mounting substrate 1 is located, and the tube shell side wall is perpendicular to the plane where the mounting substrate 1 is located. The sealing glass is located on the side of the tube shell side wall away from the tube shell bottom. The tube shell bottom, the tube shell side wall and the sealing glass form a sealed space, and the laser chip 21 is located in the sealed space.

[0073] The tube wall wiring 23 may be arranged in the bottom wall and / or the side wall of the tube shell, and the bottom wall and / or the side wall of the tube shell may be made of ceramic material.

[0074] As shown in FIG6 , a conductive structure 24 and a metal film 25 are provided on the side of the package tube shell 22 facing the mounting substrate 1 (i.e., the lower surface of the bottom wall of the tube shell). The conductive structure 24 is formed in a manner opposite to the conductive area 131 of the mounting substrate 1, and the metal film 25 is formed in a manner opposite to the metal portion 132 of the mounting substrate 1. The metal film 25 and the metal portion 132 act as heat sinks. For example, both are made of copper.

[0075] The laser chipset 20 is electrically connected to the conductive structure 24 via the wall traces 23 of the package tube 22. The conductive structure 24 is electrically connected to the conductive area 131 of the mounting substrate 1. The conductive area 131 is electrically connected to the electrical connection portion 11 via the intra-board interconnection region 12, thereby achieving an electrical connection between the laser chip 21 and the electrical connection portion 11. The electrical connection portion 11 is used to connect to the driving circuit. For example, the electrical connection portion 11 can be connected to the driving circuit via a connector, a flexible substrate, a glass epoxy substrate, a leaf spring terminal, etc.

[0076] For example, the package tube shell 22 may be made of ceramic, and the tube wall trace 23 may be disposed on at least one of the tube shell side wall and the tube shell bottom wall.

[0077] The laser core group 20 includes laser chips 21 of at least two colors with different light emission colors. Each color of the laser chip 21 is connected to a corresponding group of electrical connection parts 11, and is electrically connected to the corresponding group of electrical connection parts 11 through the tube wall wiring 23, the conductive structure 24, the conductive area 131 and the internal interconnection area 12, thereby realizing separate power supply for the laser chip 21 of each light emission color.

[0078] Exemplarily, as shown in FIG4 , the laser chip group 20 includes a laser chip 21 of a first light emitting color and a laser chip 22 of a second light emitting color. For example, the laser chip 21 of the first light emitting color emits blue laser light, and the laser chip 22 of the second light emitting color emits red or green laser light. The laser chip 22 of the first light emitting color is electrically connected to the corresponding two electrical connection parts 11, and the laser chip 22 of the second light emitting color is electrically connected to the corresponding two electrical connection parts 11. Therefore, at least four electrical connection parts 11 need to be provided on the mounting substrate 1.

[0079] It should be noted that FIG4 merely illustrates an exemplary embodiment of a light-emitting device including two laser chip assemblies 20 with different light emission colors, and does not constitute a limitation on the light-emitting device provided in the embodiments of the present application. In other embodiments, the laser chip assembly 20 may further include laser chips 21 with three different light emission colors, each emitting laser light of a different color. The three laser chips 21 are electrically connected to the corresponding electrical connection portion 11 via the tube wall traces 23 and the conductive structure 24 of the package tube 22, and are independently powered. This is not a limitation herein.

[0080] 5 , the light-emitting device includes three laser chip groups 20: red, green, and blue (RGB). Each laser chip group 20 for each light-emitting color is connected to a corresponding drive circuit. Regardless of how the number of laser chip groups 20 for each color is increased, the number of drive circuits remains unchanged. This solves the problem of the number of laser chips being limited by the drive circuits, effectively improving the efficiency of the drive circuits and reducing costs.

[0081] In some embodiments, in order to achieve separate power supply and meet miniaturized design, the mounting substrate 1 adopts a copper substrate, which is a single-sided board (i.e., a single-sided board). This allows the back of the copper substrate to have sufficient space for heat dissipation, which is beneficial to the heat dissipation of the light-emitting device.

[0082] The embodiment of the present application does not limit the size of the mounting substrate 1, and can be flexibly set according to needs. For example, the mounting substrate 1 adopts a 15.8mm×26mm copper substrate with a thickness of 1.6mm.

[0083] In some embodiments, the thickness of the circuit board portion of the mounting substrate 1 is 2 oz, approximately 70 microns.

[0084] In some embodiments, as shown in Figures 6-8, in the direction perpendicular to the plane where the substrate 1 is mounted, the electrical connection portion 11 at least partially overlaps with the intra-board interconnection area 12, the connection pattern 13 at least partially overlaps with the intra-board interconnection area 12, and the conductive structure 24 at least partially overlaps with the connection pattern 13.

[0085] The electrical connection portion 11 , the intra-board interconnection region 12 and the connection pattern 13 are all located on a side of the mounting substrate 1 facing the light emitting unit 2 .

[0086] In some examples, in a direction perpendicular to the plane of the mounting substrate 1 , the electrical connection portion 11 at least partially overlaps with the intra-board interconnection region 12 , the connection pattern 13 at least partially overlaps with the intra-board interconnection region 12 , and the conductive structure 24 at least partially overlaps with the connection pattern 13 .

[0087] In a direction perpendicular to the plane on which the substrate 1 is mounted, there is an overlapping area between the electrical connection portion 11 and the intra-board interconnection region 12. This overlapping area is the connection area between the electrical connection portion 11 and the intra-board interconnection region 12. A larger connection area between the electrical connection portion 11 and the intra-board interconnection region 12 is beneficial for improving electrical connection stability and current flow.

[0088] The electrical connection portion 11 at least partially overlaps with the intra-board interconnection area 12, including: the electrical connection portion 11 is located in the intra-board interconnection area 12 (as shown in Figure 7 or 8), or the electrical connection portion 11 partially overlaps with the intra-board interconnection area 12, and there is also a non-overlapping area between the two.

[0089] In a direction perpendicular to the plane where the substrate 1 is mounted, there is an overlapping area between the connection pattern 13 (or the conductive area 131) and the intra-board interconnection area 12. The overlapping area is the connection area between the connection pattern 13 (or the conductive area 131) and the intra-board interconnection area 12. The larger the connection area between the connection pattern 13 and the intra-board interconnection area 12, the more conducive it is to improving the stability of the electrical connection and the amount of current. The at least partial overlap between the connection pattern 13 and the intra-board interconnection area 12 includes: the conductive area 131 of the connection pattern 13 is located within the intra-board interconnection area 12 (as shown in Figures 7 or 8), or the conductive area 131 of the connection pattern 13 partially overlaps with the intra-board interconnection area 12, and there is also a non-overlapping area between the two. In this way, the electrical connection portion 11 is electrically connected to the connection pattern 13 through the intra-board interconnection area 12.

[0090] In a direction perpendicular to the plane of the mounting substrate 1 , the conductive structure 24 at least partially overlaps with the connection pattern 13 , that is, there is an overlapping area between the conductive structure 24 and the connection pattern 13 , thereby achieving electrical connection between the conductive structure 24 and the connection pattern 13 .

[0091] As shown in FIG. 7 or 8 , within the plane of the mounting substrate 1 , multiple groups of connection portions 11 are located on the same side of the mounting substrate 1 , that is, on one side of the package shell 22 . For example, multiple groups of connection portions 11 are arranged side by side, which not only ensures the miniaturization of the entire light-emitting device, but also makes the appearance of the light-emitting device more beautiful and enhances the operability of manual soldering.

[0092] In other embodiments, the electrical connection portion 11 may also be located on two opposite sides of the package shell 22 , which can still achieve independent power supply for each color laser chip, but is not conducive to miniaturization.

[0093] As shown in FIG7 , multiple groups of electrical connection portions 11 are arranged side by side. FIG7 illustrates that multiple groups of electrical connection portions 11 are arranged side by side and at intervals along the width direction of one side of the mounting substrate 1. This helps to make the space occupied by the multiple groups of electrical connection portions 11 on the mounting substrate 1 more concentrated, which is beneficial to the miniaturized arrangement of the light-emitting device.

[0094] Furthermore, at least some of the positive electrode connection parts 111 and the negative electrode connection parts 112 included in the multiple groups of electrical connection parts 11 are arranged to be adjacent to each other with the same polarity. For example, Figure 7 illustrates that R- in the negative electrode connection part 112 is arranged adjacent to B- in the negative electrode connection part 112, and B+ in the negative electrode connection part 112 is arranged adjacent to G+ in the negative electrode connection part 112. This helps to prevent the problem of positive and negative short circuit caused by welding errors.

[0095] As shown in FIG6 , the conductive structure 24 includes a plurality of bottom pads 241. As shown in FIG7 , the connection pattern 13 includes a plurality of transfer pads 1311. The transfer pads 1311 are electrically connected to the bottom pads 241 in a one-to-one correspondence. The bottom pads 241 are also electrically connected to the tube wall traces 23. The transfer pads 1311 are also electrically connected to the electrical connection portions 11 via the intra-board interconnection region 12. The multiple transfer pads 1311 are arranged side by side and are located at least on one side of the connection pattern 13 near the multiple groups of electrical connection portions 11. The side-by-side arrangement direction of the multiple transfer pads 1311 is the same as the side-by-side arrangement direction of the multiple groups of electrical connection portions 11.

[0096] The number of transfer pads 1311 can be the same as the number of bottom pads 241, and the positions of the multiple transfer pads 1311 correspond one-to-one with the positions of the multiple bottom pads 241, thereby facilitating the connection and electrical conduction between the two in an opposing manner. By arranging the multiple transfer pads 1311 side by side and at least on one side of the connection pattern 13 close to the multiple groups of electrical connection portions 11, and with the multiple transfer pads 1311 arranged in the same direction as the multiple groups of electrical connection portions 11, this facilitates a more compact routing structure on the mounting substrate 1, thereby facilitating miniaturization of the mounting substrate 1.

[0097] In some examples, the number of transfer pads 1311 is greater than the total number of positive connection portions 111 and negative connection portions 112 included in the multiple groups of electrical connection portions 11, resulting in a one-to-many connection between some positive connection portions 111 or some negative connection portions 112 and the transfer pads 1311. It should be noted that for schemes where multiple transfer pads 1311 are connected to one electrical connection portion 11, the multiple transfer pads 1311 must be connected through the same intra-board interconnection region 12 to ensure that the current electrical connection portion 11 is connected to the target laser chip set 20.

[0098] Taking FIG. 7 as an example, B- in the negative electrode connection portion 112 is connected through the transfer pad 1311 labeled 3, the transfer pad 1311 labeled 4, and the transfer pad 1311 labeled 5 above it, that is, B- and the transfer pad 1311 are connected in a one-to-three manner.

[0099] This arrangement, on the one hand, can expand the trace width of the mounting substrate 1, thereby increasing the amount of current passing through it. The higher the current, the stronger the luminous intensity of the light-emitting device. It also provides greater adaptability for mounting other components on the mounting substrate 1. For example, FIG7 illustrates the mounting substrate 1 further including a thermistor 3. The thermistor 3 blocks the direct connection between B- in the negative connection portion 112 and the transfer pad 1311 corresponding to the blue laser chipset 20. The one-to-three connection between B- and transfer pad 1311 indirectly achieves electrical continuity between B- in the negative connection portion 112 and the transfer pad 1311 corresponding to the blue laser chipset 20.

[0100] Based on any of the above-mentioned light-emitting devices, the electrical connection parts 11 (the positive electrode connection part 111 and the negative electrode connection part 112 ) involved therein can be in the form of pads, that is, the electrical connection parts 11 are connection pads 11 .

[0101] The electrical connection portion 11 is in the form of a solder pad, which simplifies the preparation process of the electrical connection portion 11 on the mounting substrate 1 and facilitates the connection between the light-emitting device and the driving circuit by soldering. Of course, it is not ruled out that the electrical connection portion 11 can also be designed as other electrical connector forms, such as plug-in electrical connectors, crimp-type electrical connectors, etc.

[0102] In some embodiments, within the plane of the mounting substrate 1, the width of a single side of the electrical connection portion 11 (connection pad 11) is 1.3 mm to 1.7 mm; along the arrangement direction of the electrical connection portions 11, the spacing between adjacent electrical connection portions 11 is 0.8 mm to 1.2 mm. Within this size range, short circuits caused by solder overflow between adjacent connection pads 11 during soldering are avoided, while also facilitating a compact structure and miniaturization of the mounting substrate 1.

[0103] In some embodiments, within the plane of the mounting substrate 1 , the long side width of the transfer pad 1311 is 1.1 mm to 1.5 mm, and the short side width is 0.4 mm to 0.8 mm; along the arrangement direction of the transfer pad 1311 , the spacing between adjacent transfer pads 1311 is 0.1 mm to 0.5 mm.

[0104] The embodiment of the present application does not limit the size (including length and width) of the package shell 22, and the size of the package shell 22 can be set according to the requirements of the light-emitting device. For example, the size of the package shell 22 is 10.6 mm×6.4 mm.

[0105] In some examples, as shown in FIG7 , the light-emitting device involved in the embodiments of the present application further includes: a thermistor 3, and the mounting substrate 1 has a set of electrical connection parts 11 corresponding to the thermistor 3; the two ends of the thermistor 3 are respectively electrically connected to the positive connection part 111 and the negative connection part 112 of the corresponding electrical connection part 11.

[0106] The thermistor 3 is connected to a corresponding set of electrical connection parts 11 through wiring. The thermistor 3 is used to detect the heating condition of the laser chip group 20.

[0107] Exemplarily, the thermistor 3 includes a negative temperature coefficient thermistor (NTC), or other types of thermistors known to those skilled in the art, which are not limited here. For example, FIG. 7 illustrates that the thermistor 3 is an NTC thermistor.

[0108] Exemplarily, as shown in FIG. 7 , the thermistor 3 is located between the multiple groups of electrical connection portions 11 and the at least two laser chip groups 20 , and the multiple groups of electrical connection portions 11 are symmetrically distributed on both sides of the thermistor 3 .

[0109] That is, the thermistor 3 is located on one side of the connection pattern 13 close to the multiple groups of electrical connection parts 11. Figure 7 also illustrates that the eight electrical connection parts 11 are symmetrically distributed on both sides of the thermistor 3. The group of electrical connection parts 11 corresponding to the thermistor 3 (i.e., NTC+ and NTC-) is located on the outermost side. The corresponding circuit diagram is shown in Figure 21. The thermistor 3 is electrically connected to the thermistor positive polarity pad (NTC+) and the thermistor negative polarity pad (NTC-) through the corresponding intra-board interconnection area 12; wherein TP1 represents the thermistor positive polarity pad (NTC+), and TP8 represents the thermistor negative polarity pad (NTC-).

[0110] In combination with any of the above-mentioned light-emitting devices, some exemplary light-emitting devices are described below to more clearly illustrate the wiring method of the light-emitting device involved in the embodiments of the present application.

[0111] In some embodiments, as shown in Figures 7-9, the laser chip group 20 includes a first color chip group 201, a second color chip group 202, and a third color chip group 203, each of which has different light emission colors. The first color chip group 201 includes a plurality of first color chips 211 connected in series, the second color chip group 202 includes a plurality of second color chips 212 connected in series, and the third color chip group 203 includes a plurality of third color chips 213 connected in series.

[0112] Each color laser chip 21 within the same package shell 22 is connected in series and correspondingly connected to a group of two connecting pads 11 (a group of connecting pads 11 includes a positive polarity pad and a negative polarity pad); wherein the number of connecting pads 11 is twice the number of color types of the laser chip group 20, and the connecting pads 11 of the same polarity are arranged adjacent to each other.

[0113] In this embodiment, the three laser chip groups 20 include three laser chips: a first color chip 211, a second color chip 212, and a third color chip 213. Each laser chip 21 emits a laser of a different color. The colors of the light emitted by the first color chip 211, the second color chip 212, and the third color chip 213 are different. For example, the wavelength of the light emitted by the third color chip group 203 is greater than the wavelength of the light emitted by the first color chip group 201 and the second color chip group 202. For example,

[0114] The first color chip 211 emits blue laser, the second color chip 212 emits green laser, and the third color chip 213 emits red laser; or the first color chip 211 emits green laser, the second color chip 212 emits blue laser, and the third color chip 213 emits red laser.

[0115] The light emitting device includes at least one package 22, in which at least one laser chip group 3 can be disposed. In the same package 22, all laser chips 21 with the same light emission color are connected in series and connected to a corresponding set of connection pads 11.

[0116] For example, as shown in FIG9 , the light-emitting device includes a first housing 221 and a second housing 222 arranged side by side. The first housing 221 houses a third color chip set 203, while the second housing 222 houses a first color chip set 201 and a second color chip set 202. Specifically, the light-emitting device includes two packaged housings 22. Four third color chips 213 are housed in the first housing 221, located on the left. The four third color chips 213 are connected in series, with the ends of the series circuit electrically connected to stepped portions 26 on either side. A metal film is provided on the upper surface of the stepped portion 26. The metal film is electrically connected to a conductive structure 24 via sidewall traces 23. The conductive structure 24 is electrically connected to a conductive region 131 of a connection pattern 13. The connection pattern 13 is electrically connected to two corresponding connection pads 11 via an intra-board interconnect region 12, thereby electrically connecting the third color chip 213 to a corresponding set of connection pads 11.

[0117] Two first color chips 211 and three second color chips 212 are arranged in the second tube shell 222 located on the right side. The two first color chips 211 are connected in series, and the two ends of the series circuit line are electrically connected to the step portion 26. The metal film on the upper surface of the step portion 26 is electrically connected to the conductive structure 24 through the sidewall trace 23. The conductive structure 24 is electrically connected to the conductive area 131 of the connection pattern 13. The connection pattern 13 is electrically connected to the corresponding two connection pads 11 through the intra-board interconnection area 12, thereby realizing the electrical connection between the first color chip 211 and the corresponding group of connection pads 11.

[0118] The three second color chips 212 are connected in series, and the two ends of the series circuit line are electrically connected to the step portion 26. The metal film on the upper surface of the step portion 26 is electrically connected to the conductive structure 24 through the side wall routing 23. The conductive structure 24 is electrically connected to the conductive area 131 of the connection pattern 13. The connection pattern 13 is electrically connected to the corresponding two connection pads 11 through the intra-board interconnection area 12, thereby realizing the electrical connection between the first color chip 211 and the corresponding group of connection pads 11.

[0119] It should be noted that FIG9 merely illustrates an exemplary embodiment of a light-emitting device including two packages 22, and does not constitute a limitation on the embodiments of the present application. In other embodiments, the light-emitting device may include a single package 22, with the first color chip 211, the second color chip 212, and the third color chip 213 located within the same package 22; or the light-emitting device may include three packages 22, with the first color chip 211, the second color chip 212, and the third color chip 213 corresponding to each package 22, and laser chipsets 20 emitting light of the same color located within the same package 22. This is not a limitation herein.

[0120] Exemplarily, as shown in FIG7 , the mounting substrate 1 includes four groups of connecting pads 11, namely: a thermistor positive polarity pad (NTC+), a red positive polarity pad (R+) and a red negative polarity pad (R-), a blue positive polarity pad (B+) and a blue negative polarity pad (B-), a green positive polarity pad (G+) and a green negative polarity pad (G-), and a thermistor negative polarity pad (NTC-).

[0121] In order to prevent the positive and negative poles from being short-circuited due to welding errors, the positions of the connecting pads 11 are arranged according to the principle of adjacent ones with the same polarity. The arrangement order of the eight connecting pads 11 from left to right is: thermistor positive polarity pad (NTC+), red positive polarity pad (R+), red negative polarity pad (R-), blue negative polarity pad (B-), blue positive polarity pad (B+), green positive polarity pad (G+), green negative polarity pad (G-) and thermistor negative polarity pad (NT-), that is, the thermistor positive polarity pad (NTC+) is adjacent to the red positive polarity pad (R+), the red negative polarity pad (R-) is adjacent to the blue negative polarity pad (B-), the blue positive polarity pad (B+) is adjacent to the green positive polarity pad (G+), and the green negative polarity pad (G-) is adjacent to the thermistor negative polarity pad (NTC-).

[0122] The embodiment of the present application does not limit the type of the connecting pad 11, which can be set as a cross pad (as shown in FIG7), or can be set as any type of pad known to those skilled in the art.

[0123] In some embodiments, as shown in FIG6 , the conductive structure 24 includes a bottom pad 241 located on the side of the package 22 facing the mounting substrate 1 and connected to the wall trace 23 within the package 22. As shown in FIG7 or 8 , in a direction perpendicular to the plane of the mounting substrate 1, the conductive region 131 of the connection pattern 13 includes a transfer pad 1311 that at least partially overlaps the intra-board interconnection region 12; the transfer pad 1311 is electrically connected to the bottom pad 241 in a one-to-one correspondence.

[0124] The transfer pad 1311 is electrically connected to the connection pad 11 through the intra-board interconnection area 12. The transfer pad 1311 is electrically connected to the bottom pad 241 one-to-one. The bottom pad 241 is electrically connected to the corresponding laser chip 21 through the tube wall trace 23 in the package tube shell 22. The laser chips 21 with the same light output color in the same package tube shell 22 are connected in series, thereby realizing separate power supply for each color of laser chip. As the number of laser chips 21 increases, the number of drivers will not increase, which is conducive to reducing costs.

[0125] In some embodiments, as shown in Figures 8 and 9, the first and second housings 221, 222 include four bottom pads 241 arranged side by side on at least one side near the connection pads 11. A plurality of transfer pads 1311 are provided on the mounting substrate 1 in a one-to-one correspondence with the bottom pads 241. Two bottom pads 241 of the second housing 222 are connected to one group of connection pads 11, and the other two bottom pads 241 are connected to another group of connection pads 11. Two bottom pads 241 of the first housing 221, which are farther away from the second housing 222, are connected to yet another group of connection pads 11. At least one of the other two adjacent bottom pads 241, which is closer to the second housing 222, is electrically connected to the bottom pad 241 of the second housing 222, which is closer to the first housing 221.

[0126] In this embodiment, a metal film 25 and a bottom pad 241 are provided on the side of the first tube shell 221 and the second tube shell 222 facing the mounting substrate 1. The metal film 25 corresponds to and is fixedly connected to the fixing portion 132 of the connection pattern 13. The bottom pad 241 corresponds one-to-one with the transfer pad 1311 and is electrically connected. The connection path is bottom pad 241-transfer pad 1311-intra-board interconnection area 12-connection pad 11, thereby achieving fixation and electrical connection between the light-emitting unit 2 and the mounting substrate 1 (as shown in FIG9 ).

[0127] 7 or 8 , the first tube shell 221 and the second tube shell 222 are fixed and electrically connected to the mounting substrate 1 in the following manner: the fixing portion 132 of the connection pattern 13 located on the right side is fixedly connected to the metal film 25 on the side of the second tube shell 222 facing the mounting substrate, and at least the side of the connection pattern 13 near the connection pad 11 includes transfer pads 1311 arranged side by side, wherein two transfer pads 1311 are connected to one group of connection pads 11 through the intra-board interconnection area 12, and the other two transfer pads 1311 are connected to the other group of connection pads 11 through the intra-board interconnection area 12. The fixing portion 132 of the connection pattern 13 on the left is fixedly connected to the metal film 25 on the side of the first tube shell 21 facing the mounting substrate 1, and at least the side of the connection pattern 13 close to the connection pad 11 includes transfer pads 1311 arranged side by side, wherein the two transfer pads 1311 away from the right connection pattern 13 are connected to a group of transfer pads 11 through the intra-board interconnection area 12, and at least one of the other two transfer pads 1311 close to the right connection pattern 13 is connected to the transfer pad of the right connection pattern 13 close to the left connection pattern 13 through the same intra-board interconnection area 12.

[0128] The third color chip 213 of the third color chip group 203 emits light with a greater wavelength than the first color chip 211 of the first color chip group 201, and the third color chip 213 also emits light with a greater wavelength than the second color chip 212 of the second color chip group 202. For example, the third color chip 213 emits red laser light, corresponding to a wavelength range of 622nm to 760nm, the first color chip 211 emits blue laser light, corresponding to a wavelength range of 435nm to 450nm, and the second color chip 212 emits green laser light, corresponding to a wavelength range of 492nm to 577nm.

[0129] In other embodiments, the first color chip 211 , the second color chip 212 , and the third color chip 213 may also emit lasers of other colors, which are not limited herein.

[0130] Among them, since it is necessary to set a positioning hole on the mounting substrate 1, the distance between the package tube shell 22 and the positioning hole is compressed to 0.5 mm, and the routing condition is not met. Therefore, in this embodiment, the bottom pad 241 can be set only on the side of the package tube shell 22 close to the connection pad 11. The bottom pad 241 is electrically connected to the corresponding connection pad 11 through the transfer pad 1311 located on the side of the mounting substrate 1 close to the connection pad and the intra-board interconnection area 12.

[0131] In other embodiments, under the condition that the spacing between the positioning hole and the package shell 22 and the spacing between the package shells 22 meet the minimum trace width, a bottom pad 241 can also be provided on the side of the package shell 22 away from the connection pad 11. In this case, an intra-board interconnection area 12 can also be provided in the area between the positioning hole and the package shell 22 on the mounting substrate 1, and / or an intra-board interconnection area 12 can be provided in the area between two package shells on the mounting substrate 1, so that the transfer pads 1311 that are close to each other can be interconnected through the above-mentioned intra-board interconnection area 12 and then electrically connected to the connection pad 11, thereby increasing the trace width and thereby increasing the amount of current passing therethrough.

[0132] Exemplarily, as shown in FIG9 , the light-emitting device includes two package tube shells 22 , namely a first tube shell 221 and a second tube shell 222 , eight connecting pads 11 are located on the same side of the two package tube shells 22 , and four bottom pads 241 are provided on the side of each package tube shell 22 close to the connecting pad 11 .

[0133] The mounting substrate 1 corresponding to the first tube shell 221 and the second tube shell 222 is shown in Figure 7 or 8. In order to clearly illustrate the correspondence between the laser chip 21, the bottom solder pad 241, the transfer solder pad 1311 and the connecting solder pad 11, the transfer solder pad 1311 on the side of the connecting pattern 13 close to the connecting solder pad 11 is numbered. The transfer solder pads 1311 corresponding to the four bottom solder pads 241 of the first tube shell 221 are numbered 1 to 4, and the transfer solder pads 1311 corresponding to the four bottom solder pads 241 of the second tube shell 222 are numbered 5 to 8.

[0134] Exemplarily, the first color chip 211 emits blue laser, the second color chip 212 emits green laser, and the third color chip 213 emits red light. The third color chip 213 is encapsulated in the first tube shell 221, and the third color chip 213 is electrically connected to the corresponding bottom pad 241 through the tube wall trace 23 in the first tube shell 221. The bottom pad 241 is connected to the corresponding transfer pad 1311 (numbered 1 and 2). The transfer pad 1311 numbered 1 is connected to the red positive polarity pad (R+) through the intra-board interconnection area 12, and the transfer pad 1311 numbered 2 is connected to the red negative polarity pad (R-) through the intra-board interconnection area 12.

[0135] The first color chip 211 and the second color chip 212 are encapsulated in the second tube shell 222. The first color chip 211 is electrically connected to the corresponding bottom pad 241 through the tube wall trace 23 in the second tube shell 222. The bottom pad 241 is connected to the corresponding transfer pad 1311 (numbered 5 and 6). The transfer pad 1311 numbered 5 is connected to the blue negative polarity pad (B-) through the interconnection area 12 on the board. The transfer pad 1311 numbered 6 is connected to the blue negative polarity pad (B-). 1 is connected to the blue positive polarity pad (B+); the second color chip 212 is electrically connected to the corresponding bottom pad 241 through the tube wall trace 23 in the second tube shell 222, and the bottom pad 241 is connected to the corresponding transfer pad 1311 (numbered 7 and 8). The transfer pad 1311 numbered 7 is connected to the green positive polarity pad (G+) through the intra-board interconnection area 12, and the transfer pad 1311 numbered 8 is connected to the green negative polarity pad (G-).

[0136] For example, as shown in Figures 7 or 10, due to the limitation of wiring space and the increase of thermistor 3, it is difficult to route wiring between the transfer pad 1311 (numbered 5) and the blue negative polarity pad (B-), which will either reduce the area of ​​other wiring or cause the wiring to overlap with the thermistor, resulting in a short circuit. Therefore, as shown in Figure 10, the transfer pads 1311 numbered 3 and 4 and the transfer pad 1311 numbered 5 are electrically connected to the blue negative polarity pad (B-) through the same intra-board interconnection area 12. Specifically, the blue negative polarity pad (B-) is connected to the three transfer pads 1311 numbered 3, 4, and 5 through the corresponding intra-board interconnection area 12. Such a setting, on the one hand, increases the routing width, thereby increasing the amount of current passing through. The higher the current, the stronger the luminous intensity of the laser chipset 20. On the other hand, it does not affect the placement of the thermistor 3 and the connection pad 11, making the overall structure look more concise.

[0137] For example, as shown in FIG11 , the transfer pad 1311 numbered 4 and the transfer pad 1311 numbered 5 are electrically connected to the blue negative polarity pad (B-) through the same intra-board interconnection region 12. The transfer pad 1311 numbered 5 is correspondingly connected to the bottom pad 241 at the bottom of the second tube shell 222, which is connected to the negative electrode of the blue laser chip, thereby achieving an electrical connection between the blue laser chip and the blue negative polarity pad (B-). The transfer pad 1311 numbered 3 and the transfer pad 1311 numbered 2 are electrically connected to the red negative polarity pad (R-) through the same intra-board interconnection region 12. The transfer pad 1311 numbered 2 is correspondingly connected to the bottom pad 241 at the bottom of the first tube shell 221, which is connected to the negative electrode of the red laser chip, thereby achieving an electrical connection between the red laser chip and the red negative polarity pad (R-).

[0138] With this arrangement, the trace widths of the red negative pad (R-) and the blue negative pad (B-) can be doubled, thereby increasing the amount of current passing through. The higher the current, the stronger the luminous intensity of the laser chipset 20. It also does not affect the placement of the thermistor 3 and the connecting pad 11, making the overall structure look simpler.

[0139] In other embodiments, taking the orientation shown in FIG12 as an example, with the position of the thermistor 3 as the dividing line, only the red positive pad (R+) and the red negative pad (R-) can be set on the left, and the blue negative pad (B-), the blue positive pad (B+), the green positive pad (G+), and the green negative pad (G-) can be set on the right, and basically aligned with the bottom pad 241 of the package shell 22 to ensure a relatively uniform trace width.

[0140] In this structure, the positive polarity pad (NTC+) and the negative polarity pad (NTC-) of the thermistor can both be set on the left side (see Figure 12). With this arrangement, the bottom pad 241 of each package tube shell 22 can be directly electrically connected to its adjacent connection pad 11. However, the routing between the connection pad 11 and the thermistor 3 needs to be readjusted. For example, the space on the lower side of the mounting substrate 1 needs to be increased to accommodate this routing. Alternatively, the positive polarity pad (NTC+) and the negative polarity pad (NTC-) of the thermistor are still set on the left and right sides respectively, with different numbers of connection pads 11 on both sides. This either reduces the area of ​​the right connection pad 11, which may lead to reduced welding reliability, or increases the area of ​​the right mounting substrate 1, which is not conducive to miniaturization.

[0141] In other embodiments, if the space requirement of the thermistor is not considered, the transfer pads 1311 corresponding to the various laser chips 21 can be aligned and evenly distributed with respect to the bottom pads 241 of the package 22 , which is not limited here.

[0142] For example, FIG13 is a circuit diagram corresponding to the light-emitting device shown in FIG7 or 10. In FIG13, U1 represents the first tube shell 221, and U2 represents the second tube shell 222. The structures of the first tube shell 221 and the second tube shell 222 are the same. U2 is obtained by rotating U1 180° clockwise. Pin 1 of U1 is connected to TP2, pin 2 is connected to TP3, pins 3-4 and pin 5 of U2 are both connected to TP4, pin 6 of U2 is connected to TP5, pin 7 is connected to TP6, and pin 10 is connected to TP10. n8 is connected to TP7; among them, pins 1-4 of U1 correspond to four transfer pads 1311 numbered 1-4 respectively, pins 5-8 of U2 correspond to four transfer pads 1311 numbered 5-8 respectively, and TP2-TP7 correspond to six connection pads 11, namely red positive pad (R+), red negative pad (R-), blue positive pad (B+), blue negative pad (B-), green positive pad (G+) and green negative pad (G-).

[0143] In addition, based on the above, it can be seen that when multiple packaging tube shells 22 are used to package different laser chip groups 20, the multiple packaging tube shells 22 can adopt the same type of laser chip packaging tube shell. It is only necessary to adjust the orientation of the packaging tube shell 22 according to the specific light output type of the laser chip group 20 encapsulated therein. For example, Figure 13 illustrates that the first tube shell 221 and the second tube shell 222 are both common RGB three-color laser chip packaging tube shells. The orientation of the first tube shell 221 (i.e., U1) is such that the pins corresponding to the red laser chip 21 are adjacent to the connection pads 11 on the mounting substrate 1, and the orientation of the second tube shell 222 (i.e., U2) is such that the pins corresponding to the blue laser chip 21 and the green laser chip 21 are adjacent to the connection pads 11 on the mounting substrate 1.

[0144] Exemplarily, as shown in FIG14 , the light-emitting device includes a first tube shell 221 and a second tube shell 222, which are arranged along a first direction Y; a laser chip 21 and a reflective prism are provided in the first tube shell 221 and the second tube shell 222, and the laser chip 21 emits laser in the first direction Y. The laser is projected onto the reflective surface of the reflective prism and is reflected, and the reflected laser is emitted through the light window and / or lens 4.

[0145] Exemplarily, in conjunction with Figures 15 to 17, a third color chip 213 is provided in the first tube shell 221, and all the third color chips 213 are connected in series. The negative electrode and the positive electrode of the third color chip 213 are respectively connected to the bottom pad 241 provided at the bottom of the first tube shell 221 through the tube wall trace 23 in the first tube shell 221. The bottom pad 241 is electrically connected to the transfer pad 1311 of the mounting substrate 1. The transfer pad 1311 is electrically connected to the connection pad 11 through the intra-board interconnection area 12, thereby realizing the electrical connection between the third color chip 213 and the connection pad 11 of the mounting substrate 1; the tube wall trace 23 in the first tube shell 221 can be located in the tube shell side wall and the tube shell bottom wall.

[0146] Exemplarily, in conjunction with Figures 18 to 20, a first color chip 211 and a second color chip 212 are provided in the first tube shell 221. All the first color chips 211 are connected in series, and all the second color chips 212 are connected in series. There is no connection between the first color chip 211 and the second color chip 212. The positive and negative electrodes of the first color chip 211 are electrically connected to the corresponding bottom pads 241 at the bottom of the second tube shell 222 through the tube wall trace 23 in the second tube shell 222 respectively. The bottom pads 241 are electrically connected to the transfer pads 1311 of the mounting substrate 1. The transfer pads 1311 are electrically connected to the corresponding connecting pads 11 through the intra-board interconnection area 12, thereby realizing the electrical connection between the first color chip 211 and the connecting pads 11 of the mounting substrate 1. The positive and negative electrodes of the second color chip 212 are electrically connected to corresponding bottom pads 241 at the bottom of the second housing 222 via wall traces 23 within the second housing 222. The bottom pads 241 are electrically connected to transfer pads 1311 on the mounting substrate 1. The transfer pads 1311 are connected to corresponding connection pads 11 via the intra-board interconnection region 12, thereby achieving electrical connection between the second color chip 212 and the connection pads 11 on the mounting substrate 1. The wall traces 23 of the second housing 222 can be located in the housing sidewalls and the housing bottom wall.

[0147] In other embodiments, the light emitting device further includes other components known to those skilled in the art, such as a reflective prism 5 , a heat sink substrate 6 , a light window (or sealing glass) and a lens 4 , which are not limited here.

[0148] In some embodiments, as shown in Figures 22-25 , each package 22 contains a laser chip set 20 of a specific light-emitting color. The packages 22 are arranged in the same direction as the electrical connections 11. Each package 22 includes two bottom solder pads 241 arranged side by side on at least one side near the electrical connections 11. The two bottom solder pads 241 of each package 22 are connected to a corresponding set of electrical connections 11.

[0149] That is, a laser chip 21 of one color is disposed in each package shell 22 , and on the side of the package shell 22 facing the mounting substrate 1 , each package shell 22 includes two bottom pads 241 disposed side by side at least on the side close to the connection pad 11 .

[0150] In this embodiment, the light-emitting device includes three packages 22. Each color laser chip 21 is individually packaged within a package 22. That is, the laser chips 21 within each package 22 emit light of the same color, and the multiple laser chips 21 are connected in series. Specifically, all first-color chips 211 are disposed within the same package 22, and all first-color chips 211 are connected in series; all second-color chips 212 are disposed within the same package 22, and all second-color chips are connected in series; and all third-color chips 213 are disposed within the same package 22, and all third-color chips 213 are connected in series. Connecting pads 11 are located on the same side of the three packages 22, and the connecting pads 11 and packages 22 are arranged in the same direction. Two bottom pads 241 are disposed on the side of each package 22 proximal to the connecting pads 11. The two bottom pads 241 are arranged in the same direction as the connecting pads 11. The two bottom pads 241 of each package 22 are electrically connected to a corresponding set of connecting pads 11.

[0151] 23 , the mounting substrate 1 includes three connection patterns 13 corresponding to the package shell 22. Each connection pattern 13 includes two transfer pads 1311 arranged side by side near the connection pad 11. Each transfer pad 1311 is electrically connected to the corresponding connection pad 11 through the intra-board interconnection area 12. The transfer pads 1311 are connected one-to-one with the bottom pads 241 of the package shell 22. The bottom pads 241 are electrically connected to the laser chip 21 located in the package shell 22 through the tube wall traces 23 in the package shell 22, thereby realizing the electrical connection between the laser chip 21 and the corresponding connection pads 11.

[0152] For example, as shown in FIG23 , the left package tube shell 22 is used to package the red laser chip 21, and the corresponding two bottom pads 241 are respectively connected to the red positive polarity pad (R+) and the red negative polarity pad (R-) through the transfer pad 1311 and the intra-board interconnection area 12; the middle package tube shell 22 is used to package the blue laser chip 21, and the corresponding two bottom pads 241 are respectively connected to the blue negative polarity pad (B-) and the blue positive polarity pad (B+) through the transfer pad 1311 and the intra-board interconnection area 12; the right package tube shell 22 is used to package the green laser chip 21, and the corresponding two bottom pads 241 are respectively connected to the green positive polarity pad (G+) and the green negative polarity pad (G-) through the transfer pad 1311 and the intra-board interconnection area 12.

[0153] In other embodiments, bottom pads 241 may be further provided on both the side of the package shell 22 close to the connection pad 11 and the side away from the connection pad 11. Correspondingly, transfer pads 1311 may be provided on both the side of the mounting substrate 1 close to the connection pad 11 and the side away from the connection pad. Under the condition that the spacing between the positioning hole and the package shell 22 and the spacing between the package shells 22 meet the minimum trace width, an intra-board interconnection area 12 may be provided between the positioning hole and the package shell 22 and / or between the package shells to electrically connect the transfer pad 1311 on the side away from the connection pad 11 and the transfer pad 1311 on the side close to the connection pad 11, so as to increase the trace width and thereby increase the amount of current passing therethrough.

[0154] In some embodiments, as shown in Figures 26 to 30, a laser chip group 20 with three light emitting colors is set in the package tube shell 22, that is, three colors of laser chips 21 are set in the package tube shell 22; the package tube shell 22 includes four bottom pads 241 arranged side by side on at least the first side close to the connecting pad 11, and includes one bottom pad 241 on the second side and the third side adjacent to the first side, respectively, and the second side is arranged opposite to the third side; the six bottom pads 241 of the package tube shell are respectively connected to the three groups of connecting pads 11.

[0155] In this embodiment, three color laser chips 21 (ie, a first color chip 211 , a second color chip 212 , and a third color chip 213 ) are packaged in the same package 22 .

[0156] For example, as shown in Figure 28, the first color chip 211, the second color chip 212 and the third color chip 213 are located in the same packaging tube shell 22. The three colors of laser chips 21 are arranged in a row from left to right, and are respectively connected to the inside of the packaging tube shell 22 through gold wires and electrically connected to the tube wall wiring 23 of the packaging tube shell 22.

[0157] Assuming that the third color chip 213 is a red laser chip, the first color chip 211 is a blue laser chip, and the second color chip 212 is a green laser chip, the blue laser chip and the green laser chip need to be equipped with an anti-static device 7, while the red laser chip material has a stronger anti-static ability, so the red laser chip is not equipped with an anti-static device 7.

[0158] It should be noted that the light-emitting device also includes a reflective prism 5 and a heat sink substrate 6. The laser chipset 20 and the anti-static device 7 are disposed above the heat sink substrate 6. The reflective prism 5 is located on the light-emitting side of the laser chipset 20, and the reflective surface of the reflective prism 5 is aligned with the laser chipset 20. The laser chipset 20 can be arranged in a one-to-one correspondence with the heat sink substrate 6, or multiple laser chipsets 20 emitting the same color can be arranged on the same heat sink substrate 6, without limitation.

[0159] For example, as shown in Figures 29-30, the side of the package tube shell 22 close to the connecting pad 11 is the first side, and the second side and the third side are respectively located on the left and right sides of the first side and are adjacent to the first side; four bottom pads 241 are arranged side by side on the first side of the package tube shell 22, one bottom pad 241 is arranged on the second side, and one bottom pad 241 is arranged on the third side.

[0160] Correspondingly, as shown in FIG27 , the mounting substrate 1 includes a connection pattern 13, a connection pad 11 and an intra-board interconnection region 12. The connection pattern 13 includes four transfer pads 1311 on one side close to the connection pad 11 (corresponding to the first side of the package shell 22), and one transfer pad 1311 on the left and right sides (corresponding to the second side and the third side of the package shell 22). These six transfer pads 1311 are connected to the six bottom pads 241 in a one-to-one correspondence; the transfer pads 1311 are electrically connected to the corresponding connection pads 11 through the intra-board interconnection region 12, thereby realizing the connection between the six bottom pads 241 and the substrate. The six connecting pads 11 are connected correspondingly, and the specific connection relationship is as follows: the bottom pad 241 on the second side (taking the left side as an example) is electrically connected to the transfer pad 1311 numbered 1, and the transfer pad 1311 numbered 1 is electrically connected to the red positive polarity pad (R+) through the intra-board interconnection area 12; optionally, at least one of the transfer pads 1311 numbered 9 and 10 and the transfer pad 1311 numbered 1 can be electrically connected to the red positive polarity pad (R+) through the same intra-board interconnection area 12; the first bottom pad 241 on the left end of the first side is electrically connected to the transfer pad 1311 numbered 2 The transfer pad 1311 numbered 2 is electrically connected to the red negative polarity pad (R-) through the intra-board interconnection area 12; the second bottom pad 241 at the left end of the first side is electrically connected to the transfer pad 1311 numbered 3, and the transfer pad 1311 numbered 3 is electrically connected to the blue negative polarity pad (B-) through the intra-board interconnection area 12; the second bottom pad 241 at the right end of the first side is electrically connected to the transfer pad 1311 numbered 4, and the transfer pad 1311 numbered 4 is electrically connected to the blue positive polarity pad (B+) through the intra-board interconnection area 12; the first bottom pad 241 at the right end of the first side is electrically connected to the transfer pad 1311 numbered 4, and the transfer pad 1311 numbered 4 is electrically connected to the blue positive polarity pad (B+) through the intra-board interconnection area 12. 41 is electrically connected to the transfer pad 1311 numbered 5, the transfer pad 1311 numbered 5 is electrically connected to the green positive polarity pad (G+) through the intra-board interconnection area 12, and the bottom pad 241 on the third side (taking the right side as an example) is electrically connected to the transfer pad 1311 numbered 6, the transfer pad 1311 numbered 6 is electrically connected to the green negative polarity pad (G-) through the intra-board interconnection area 12; optionally, at least one of the transfer pads 1311 numbered 7 and 8 and the transfer pad numbered 6 can also be electrically connected to the green negative polarity pad (G-) through the same intra-board interconnection area 12.

[0161] In other embodiments, the red positive polarity pad (R+) can also be connected to at least one transfer pad 1311 numbered 1, 10 and 9 through the intra-board interconnection area 12; similarly, the green negative polarity pad (G-) can be connected to at least one transfer pad 1311 numbered 6, 7 and 7 through the intra-board interconnection area 12, and can be set according to the relative position and size of the mounting substrate 1, the packaging tube shell 22 and the positioning hole, which is not limited here.

[0162] In some embodiments, as shown in Figures 29-30, the package tube shell 22 also includes a fourth side arranged opposite to the first side, and includes four bottom solder pads 241 arranged side by side on the fourth side; two of the bottom solder pads 241 on the fourth side are connected to the bottom solder pads 241 on the second side through the same intra-board interconnection area 12, and the other two bottom solder pads 241 are connected to the bottom solder pads 241 on the third side through the same intra-board interconnection area 12.

[0163] In this embodiment, the fourth side of the package tube shell 22 is the side away from the connection pad 11, and four bottom pads 241 are also provided on this side. Correspondingly, as shown in FIG27 , four transfer pads 1311 (numbered 7 to 10) are also provided on the side of the connection pattern 13 away from the connection pad 11. The four transfer pads 1311 are connected one-to-one with the four bottom pads on the fourth side of the package tube shell 22; among them, the two transfer pads 1311 numbered 9 and 10 are electrically connected to a transfer pad 1311 (numbered 1) located on the left side of the connection pattern 13, so that the transfer pad 1311 numbered 1 is electrically connected to the bottom pad 1311 on the fourth side of the package tube shell 22. The three transfer pads 1311 numbered 7, 9 and 10 are electrically connected to the red positive polarity pad (R+) through the same intra-board interconnection area 12, so that the two bottom pads 241 on the fourth side of the package tube shell 22 are connected to the bottom pad 241 on the second side through the same intra-board interconnection area 12; the two transfer pads 1311 numbered 7 and 8 are connected to a transfer pad 1311 (numbered 6) located on the right side of the connection pattern 13, so that the three transfer pads 1311 numbered 6, 7 and 8 are electrically connected to the green negative polarity pad (G-) through the same intra-board interconnection area 12.

[0164] With this arrangement, the red positive-polarity pad (R+) and the green negative-polarity pad (G-) are both connected to the three transfer pads 1311, allowing the two bottom pads 241 on the fourth side of the package 22 to connect to the bottom pads 241 on the third side via the same intra-board interconnection region 12. This arrangement increases the width of the intra-board interconnection region 12, which helps increase current flow.

[0165] It should be noted that Figures 27 and 29 only exemplarily show that the transfer pads 1311 on the side of the mounting substrate 1 away from the connecting pad 11 are grouped into two and two, that is, numbers 9 and 10 are one group, and 7 and 8 are one group, which are electrically connected to the transfer pad 1311 numbered 1 and the transfer pad 1311 numbered 6, respectively, but do not constitute a limitation on the light-emitting device provided in the embodiment of the present application.

[0166] In other embodiments, at least one of the four transfer pads 1311 can be electrically connected to the transfer pad 1311 numbered 1, and at least one of the remaining transfer pads 1311 can be electrically connected to the transfer pad 1311 numbered 6; for example, the transfer pads 1311 numbered 8, 9, and 10 are electrically connected to the transfer pad 1311 numbered 1, and the transfer pad 1311 numbered 7 is electrically connected to the transfer pad 1311 numbered 6, or the transfer pad 1311 numbered 10 is electrically connected to the transfer pad 1311 numbered 1, and the transfer pads 1311 numbered 7, 8, and 9 are electrically connected to the transfer pad 1311 numbered 6 through the same or the four transfer pads 1311 numbered 7 to 10 are electrically connected to the transfer pad 1311 numbered 1 and the transfer pad 1311 numbered 6, which is not limited here.

[0167] On the basis of the above-mentioned embodiments, an embodiment of the present application further provides a laser projection device, which includes any one of the above-mentioned light-emitting devices and has corresponding beneficial effects. To avoid repeated description, they will not be described here.

[0168] Exemplarily, a laser projection device includes: a light-emitting device and a driving circuit. The light-emitting device is as described above, and the number of driving circuits matches the number of laser chipsets 20 in the light-emitting device. The positive electrode connection portion 111 connected to the laser chipset 20 is electrically connected to the positive electrode of the corresponding driving circuit, and the negative electrode connection portion 112 connected to the laser chipset 20 is electrically connected to the negative electrode of the corresponding driving circuit. The driving circuit referred to herein is the optical driving circuit 006 described below.

[0169] Among them, the laser projection equipment may include laser TV and laser projector, and also include other laser projection equipment thought of by those skilled in the art, which are not limited here.

[0170] Based on the laser projection device mentioned above, the embodiments of the present application provide an exemplary description of the structural arrangement of the laser projection device, its working mode and application scenarios.

[0171] FIG31 is a schematic structural diagram of an exemplary laser projection device. Referring to FIG31 , laser projection device A includes a laser light source 001, a light modulation component 002, and a lens 003. Laser projection device A may also include a housing 004 (only a portion of housing 004 is shown in FIG31 ).

[0172] Laser light source 001 is configured to provide an illumination beam (laser beam). Light modulation assembly 002 is configured to modulate the illumination beam provided by laser light source 001 using an image signal to produce a projection beam. Lens 003 is configured to project the projection beam onto a screen or wall, forming a projection image. Laser light source 001, light modulation assembly 002, and lens 003 can be assembled in housing 004. Laser light source 001, light modulation assembly 002, and lens 003 can be connected sequentially along the direction of beam propagation.

[0173] The laser light source 001, the light modulation component 002, and the lens 003 can be enclosed by corresponding housings. The housings corresponding to the laser light source 001, the light modulation component 002, and the lens 003 can support the corresponding optical components and ensure that each optical component meets certain sealing or airtight requirements.

[0174] One end of the light modulation component 002 is connected to the lens 003 , and the light modulation component 002 and the lens 003 are arranged along the emission direction (eg, parallel to the N direction) of the projection beam of the laser projection device A. The other end of the light modulation component 002 can be connected to the laser light source 001 .

[0175] In some embodiments, the arrangement direction of the laser light source 001 and the light modulation assembly 002 is approximately perpendicular to the arrangement direction of the light modulation assembly 002 and the lens 003. That is, in the laser projection device A, the emission direction of the projection light beam (e.g., parallel to the N direction) is approximately perpendicular to the emission direction of the illumination light beam (e.g., parallel to the M direction). This connection structure not only adapts to the optical path characteristics of the reflective light valve in the light modulation assembly 002, but also helps shorten the length of the optical path in one direction, thereby providing more space for the arrangement of the various components of the laser projection device A.

[0176] FIG32 is a schematic diagram of an exemplary projection imaging optical path of a laser projection device. As described above, the laser projection device A includes a laser light source 001, a light modulation component 002, and a lens 003. Referring to FIG32, the illumination beam emitted by the laser light source 001 enters the light modulation component 002.

[0177] Laser light source 001 includes the aforementioned light-emitting device. In some examples, the light-emitting device can emit blue laser light, and laser light source 001 can also include a wavelength conversion device for receiving blue laser light excitation to generate primary colors other than blue, which together form the illumination beam. In other examples, laser light source 001 includes a three-color light-emitting device, i.e., a three-color laser assembly, for emitting three-color laser beams, eliminating the need for a wavelength conversion device. The three-color laser light has a wide color gamut and high brightness, capable of providing a high-quality illumination beam.

[0178] As shown in Figure 32, light modulation assembly 002 includes a light homogenizing component 0021, a reflector 0022, a lens 0023, a light valve 0024, and a prism assembly 0025. Light valve 0024 is configured to modulate the incident illumination beam into a projection beam based on the image signal and direct the projection beam toward lens 003. Light homogenizing component 0021 and light valve 0024 are sequentially arranged along the propagation direction of the light beam. Light homogenizing component 0021 is configured to homogenize the incident illumination beam and direct it toward light valve 0024.

[0179] In some embodiments, the light homogenizing component 0021 is a light pipe. This light pipe receives the illumination beam provided by the laser light source 001 and homogenizes the illumination beam. In some embodiments, the light outlet of the light pipe is rectangular. This light pipe can shape the light spot of the light beam to match the shape of the light valve. In some embodiments, the light homogenizing component 0021 can also be a fly-eye lens.

[0180] Light valve 0024 can be a reflective light valve. It includes multiple reflective sheets, each corresponding to a pixel in the projected image. For example, depending on the image to be displayed, the reflective sheets corresponding to the pixels to be illuminated can reflect a light beam toward lens 003. The light beam reflected toward lens 003 is called the projection beam. In this way, light valve 0024 can modulate the illumination beam to generate the projection beam, which is then used to display the image.

[0181] In some examples, the light valve 0024 is a digital micromirror device (DMD). A DMD includes multiple (e.g., tens of thousands) of individually driven, rotating micromirrors. The micromirrors can be arranged in an array. Each micromirror (e.g., each micromirror) corresponds to a pixel in the projected image to be displayed.

[0182] Continuing with FIG32 , in some embodiments, the light modulation assembly 002 of the laser projection device A may further include an illumination lens assembly located between the light valve 0024 and the light homogenizing component 0021. The illumination lens assembly includes a reflector 0022, a lens 0023, and a prism assembly 0025. The light beam homogenized by the light homogenizing component 0021 may be directed toward the light valve 0024 through the illumination lens assembly.

[0183] The illumination beam emitted from the light homogenizing component 0021 is directed to the reflector 0022, which reflects the illumination beam to the convex lens 0023. The convex lens 0023 converges the illumination beam to the prism assembly 0025, which reflects the illumination beam to the light valve 0024.

[0184] Figure 33 illustrates a schematic diagram of the circuit control principle of the laser projection device involved in an embodiment of the present application. As shown in Figure 33, the display control circuit 005 is connected to the front-end multimedia signal board (which can also be called the system SOC board for decoding audio and video streams). After receiving the video signal, the video signal can be further processed (such as geometric correction processing), and a dimming signal can be generated based on the processed video signal.

[0185] The display control circuit 005 is connected to the light driving circuit 006 , and the display control circuit 005 can transmit a dimming signal to the light driving circuit 006 .

[0186] The dimming signal may include an analog dimming (Adim) signal and a pulse width modulation (Pwm) signal.

[0187] The Pwm signal is used to control the presence or absence of the driving current transmitted to the laser light source 001, and the Adim signal in the dimming signal is used to control the current value of the driving current.

[0188] The optical driving circuit 006 may also be referred to as a laser driving circuit, specifically a DC-DC conversion circuit, and specifically may be a boost circuit or a buck circuit.

[0189] The optical driving circuit 006 is used to receive the dimming signal and the power supply input voltage of the power supply circuit 007, and based on the dimming signal, convert the input power supply input voltage into a power supply output voltage, thereby outputting a driving current to the laser light source.

[0190] The laser light source 001 emits light under the driving current and transmits the light to the light modulation component 002 .

[0191] The laser light source 001 may include at least one light-emitting device (referred to as a laser in FIG33 ) mentioned above in the embodiment of the present application, and the colors of the light beams emitted by the at least one light-emitting device may be the same or different.

[0192] The laser light source 001 includes a multi-color laser, such as a two-color laser including a red laser and a blue laser, or a three-color laser including a red laser, a blue laser, and a green laser. The number of optical drive circuits 006 is consistent with the number of laser chip groups 20 in the light-emitting device, and they correspond one to one.

[0193] For example, the laser light source 001 includes a red laser chipset 20, a blue laser chipset 20, and a green laser chipset 20. Then, the projection device includes a red light driving circuit 006_R, a green light driving circuit 006_G, and a blue light driving circuit 006_B, each electrically connected to the laser chipset 20 of the corresponding color.

[0194] The three-color laser light source 001 can emit red light, green light, and blue light respectively when driven by a driving current. Based on the principle of color synthesis in optics, it can be known that white light can be obtained after combining and homogenizing the three colors of light.

[0195] Continuing with Figure 33 , the light beam emitted by laser light source 001 is transmitted to light modulation assembly 002. Light modulation assembly 002 integrates a digital micromirror device (DMD) and a DMD driver circuit. The DMD is the core light modulation component of light modulation assembly 002. The DMD driver circuit is used to drive the DMD based on a video signal. Thus, under the control of the DMD driver circuit, the DMD is used to modulate the light beam emitted by laser light source 001 to produce the image to be projected.

[0196] For example, the DMD receives a driving control signal corresponding to an image signal, and flips the thousands of tiny mirrors on its surface to the positive or negative angle corresponding to the driving signal, forming the light beam irradiating its surface into the image to be projected and reflected into the projection lens.

[0197] The light modulation component 002 transmits the image to be projected to the projection lens, which can magnify the image to be projected and project the image to be projected in the form of a light beam to a target object, which can be a projection screen or a wall.

[0198] The projection lens may be an ultra-short-throw projection lens, which is used to project an image beam onto a projection screen, thereby realizing projection image display.

[0199] In some examples, the laser projection device involved in the embodiments of the present application may be an ultra-short-throw laser projection device.

[0200] Any of the laser projection devices involved in the above-mentioned embodiments of the present application can be applied to a projection system. Figure 34 illustrates an example of a projection system. As shown in Figure 34, the projection system includes a laser projection device A and a projection screen B. The projection screen B displays the image transmitted by the laser projection device A.

[0201] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

[0202] For ease of explanation, the above description has been made with reference to specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or to limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations are possible. The above embodiments are selected and described to better explain the principles and practical applications, so that those skilled in the art can better utilize the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A light emitting device, wherein: The light emitting device comprises: A mounting substrate (1), comprising a connection pattern (13), an electrical connection portion (11) and an intra-board interconnection region (12), wherein the electrical connection portion (11) is located on a surface of the mounting substrate (1), and the electrical connection portion (11) is electrically connected to the connection pattern (13) via the intra-board interconnection region (12); A light-emitting unit (2), comprising a packaging tube shell (22) and at least two laser chip groups (20) with different light emission colors arranged in the packaging tube shell (22), each of the laser chip groups (20) comprising one or a plurality of laser chips (21) connected in series, the light-emitting unit (2) being fixed to the mounting substrate (1), and the light-emitting unit (2) being electrically connected to the connection pattern (13); The electrical connection parts (11) are arranged in a plurality of groups and correspond one to one with the at least two laser chip groups (20); each group of the electrical connection parts (11) comprises a positive electrode connection part (111) and a negative electrode connection part (112); the positive electrode connection part (111) is connected to the positive electrode of the laser chip group (20) of the corresponding color; and the negative electrode connection part (112) is connected to the negative electrode of the laser chip group (20) of the corresponding color.

2. The light emitting device according to claim 1, wherein: There are a plurality of light-emitting devices, and a plurality of groups of electrical connection portions (11) corresponding to the laser chip group (20) of the same light-emitting color in the plurality of light-emitting devices are connected in series.

3. The light emitting device according to claim 1, wherein: The package tube shell (22) is provided with a conductive structure (24) on a side facing the mounting substrate (1); the connection pattern (13) is also provided with a conductive area (131); the light-emitting unit (2) is fixed on the connection pattern (13) and is electrically connected to the conductive area (131); the laser chip group (20) is electrically connected to a tube wall wiring (23) of the package tube shell (22); and the tube wall wiring (23) is also electrically connected to the conductive structure (24).

4. The light emitting device according to claim 3, wherein: In a direction perpendicular to the plane where the mounting substrate (1) is located, the electrical connection portion (11) at least partially overlaps with the intra-board interconnection region (12), the connection pattern (13) at least partially overlaps with the intra-board interconnection region (12), and the conductive structure (24) at least partially overlaps with the connection pattern (13); In the plane where the mounting substrate (1) is located, the multiple groups of electrical connection portions (11) are located on the same side of the mounting substrate (1).

5. The light emitting device according to claim 4, wherein: The multiple groups of electrical connection parts (11) are arranged side by side; At least some of the positive electrode connecting parts (111) and the negative electrode connecting parts (112) included in the plurality of groups of electrical connecting parts (11) are arranged adjacent to each other with the same polarity.

6. The light emitting device according to claim 3, wherein: The conductive structure (24) comprises a plurality of bottom pads (241), the connection pattern (13) comprises a plurality of transfer pads (1311), the transfer pads (1311) are electrically connected to the bottom pads (241) in a one-to-one correspondence, the bottom pads (241) are also electrically connected to the tube wall wiring (23), and the transfer pads (1311) are also electrically connected to the electrical connection portion (11) via the intra-board interconnection region (12); The plurality of transfer pads (1311) are arranged side by side and are at least located on one side of the connection pattern (13) close to the plurality of electrical connection portions (11), and the side-by-side arrangement direction of the plurality of transfer pads (1311) is the same as the side-by-side arrangement direction of the plurality of electrical connection portions (11).

7. The light emitting device according to claim 6, wherein: The number of the transfer pads (1311) is greater than the total number of the positive electrode connection parts (111) and the negative electrode connection parts (112) contained in the multiple groups of electrical connection parts (11), so that part of the positive electrode connection parts (111) or the negative electrode connection parts (112) are connected to the transfer pads (1311) in a one-to-many manner.

8. The light emitting device according to any one of claims 1 to 7, wherein: The electrical connection portion (11) is a connection pad.

9. The light emitting device according to claim 6, wherein: The laser chip group (20) comprises a first color chip group (201), a second color chip group (202) and a third color chip group (203) having different light emission colors; The light emission wavelength of the third color chip group (203) is greater than the light emission wavelengths of the first color chip group (201) and the second color chip group (202); The package tube shell (22) comprises a first tube shell (221) and a second tube shell (222) arranged side by side, the third color chip group (203) being arranged in the first tube shell (221), and the first color chip group (201) and the second color chip group (202) being arranged in the second tube shell (222); Each of the packaging tube shells (22) comprises four bottom pads (241) arranged side by side at least on one side close to the electrical connection portion (11); two of the bottom pads (241) of the second tube shell (222) are connected to one group of electrical connection portions (11), and the other two bottom pads (241) are connected to another group of electrical connection portions (11); two of the bottom pads (241) of the first tube shell (221) that are far away from the second tube shell (222) are connected to another group of electrical connection portions (11), and at least one of the other two adjacent bottom pads (241) close to the second tube shell (222) is connected to the second tube shell (222) close to the first tube shell (222). The bottom pads (241) of the shell (221) are connected through the same said intra-board interconnection area (12).

10. The light emitting device according to claim 6, wherein: The laser chip group (20) of one light emitting color is arranged in each of the packaging tube shells (22), and the arrangement direction of the packaging tube shells (22) is the same as the arrangement direction of the electrical connection parts (11); Each of the packaging tube shells (22) comprises two bottom pads (241) arranged side by side at least on one side close to the electrical connection portion (11); the two bottom pads (241) of each of the packaging tube shells (22) are correspondingly connected to a group of the electrical connection portions (11).

11. The light emitting device according to claim 6, wherein: The laser chip group (20) with three light emission colors is arranged in the packaging tube shell (22); The packaging tube shell (22) comprises at least four bottom solder pads (241) arranged side by side on a first side close to the electrical connection portion (11), and comprises one bottom solder pad (241) on a second side and a third side adjacent to the first side, respectively, the second side being arranged opposite to the third side; the six bottom solder pads (241) of the packaging tube shell (22) are respectively connected to the three groups of electrical connection portions (11).

12. The light emitting device according to claim 11, wherein: The packaging tube shell (22) further comprises a fourth side arranged opposite to the first side, and the fourth side comprises four bottom pads (241) arranged side by side; Two of the bottom pads (241) on the fourth side are connected to the bottom pads (241) on the second side through the same intra-board interconnection area (12), and the other two bottom pads (241) are connected to the bottom pads (241) on the third side through the same intra-board interconnection area (12).

13. The light emitting device according to claim 4, wherein: In the plane where the mounting substrate (1) is located, the single-side width of the electrical connection portion (11) is 1.3 mm to 1.7 mm; Along the arrangement direction of the electrical connection parts (11), the spacing between adjacent electrical connection parts (11) is 0.8 mm to 1.2 mm.

14. The light emitting device according to any one of claims 1 to 13, wherein: The light-emitting device further comprises: a thermistor (3); the mounting substrate (1) has a group of electrical connection parts (11) corresponding to the thermistor (3); The two ends of the thermistor (3) are electrically connected to the positive electrode connection part (111) and the negative electrode connection part (112) of the corresponding electrical connection part (11), respectively.

15. The light emitting device according to claim 14, wherein: The thermistor (3) is located between the multiple groups of electrical connection portions (11) and the at least two laser chip groups (20), and the multiple groups of electrical connection portions (11) are symmetrically distributed on both sides of the thermistor (3).

16. A laser projection device, wherein: The laser projection device comprises: A light-emitting device, wherein the light-emitting device is as described in any one of claims 1 to 15; driving circuits, the number of which is consistent with the number of laser chip groups (20) in the light-emitting device; The positive electrode connection part (111) connected to the laser chip group (20) is electrically connected to the positive electrode of the corresponding driving circuit, and the negative electrode connection part (112) connected to the laser chip group (20) is electrically connected to the negative electrode of the corresponding driving circuit.

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