System and method for a heater assembly

Abstract

Systems and methods for a heater assembly are described herein. A gas chromatography apparatus can include a heater assembly. The heater assembly can include a plate. The plate can have an inner diameter, an outer diameter, a planar surface, and a curved surface. The heater assembly can include a thermally conductive wire. The thermally conductive wire can form a plurality of coils around the inner diameter and the outer diameter of the plate. A diameter of each coil of the plurality of coils can be greater than half of a difference between the outer diameter of the plate and the inner diameter of the plate. Each coil of the plurality of coils can be configured to intersect the inner diameter of the plate and the outer diameter of the plate. A radial width can be defined by half of a difference between the outer diameter of the plate and the inner diameter of the plate. The radial width can be greater than a thickness of the plate.

Description

Cross-references to related applications

[0001] This application claims the benefit and priority of U.S. Patent Application No. 18 / 431,878, filed February 2, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application generally relates to gas chromatography. Background Technology

[0003] Gas chromatography (GC) is used to analyze and detect the presence of many different substances in a sample. The function of a gas chromatograph is to separate the components (called analytes) of a chemical sample and to determine what those components are and / or their concentrations. Separation is typically achieved using a capillary GC column. In some cases, the column is essentially a section of fused silica tube coated with a stationary phase that interacts with the sample to separate the components. The sample is propelled through the column using a pressurized gas (called the mobile phase). The GC column can be kept isothermal throughout the analysis or gradually heated to aid separation or shorten analysis time. Summary of the Invention

[0004] Operating a gas chromatograph may involve heating a column oven using a heater coil. During normal instrument operation (e.g., heating the column oven to a temperature between 350ºC and 450ºC) or testing (e.g., heating the column oven to a temperature above 450ºC), the heater coil may shift from its original or manufacturing position. The heater coil may sag, move, and / or collapse, which can lead to electrical short circuits or hot spots. This may shorten the instrument's lifespan. The solutions described herein can provide a heater assembly. This heater assembly may include a support for the heating coil to prevent sag or collapse of the heating coil.

[0005] At least one aspect of this disclosure relates to a heater assembly. The heater assembly may include a plate. The plate may have an inner diameter, an outer diameter, a planar surface, and a curved surface. The heater assembly may include heat-conducting wires. The heat-conducting wires may form a plurality of coils around the inner and outer diameters of the plate. The diameter of each of the plurality of coils may be greater than half the difference between the outer diameter and the inner diameter of the plate. Each of the plurality of coils may be configured to intersect the inner and outer diameters of the plate. A radial width is defined by half the difference between the outer and inner diameters of the plate, and the radial width is greater than the thickness of the plate.

[0006] Another aspect of this disclosure relates to a GC device. The GC device may include a heater assembly. The heater assembly may include a plate. The plate may have an inner diameter, an outer diameter, a planar surface, and a curved surface. The heater assembly may include heat-conducting wires. The heat-conducting wires may form a plurality of coils around the inner and outer diameters of the plate. The diameter of each of the plurality of coils may be greater than half the difference between the outer diameter and the inner diameter of the plate. Each of the plurality of coils may be configured to intersect the inner and outer diameters of the plate. A radial width is defined by half the difference between the outer and inner diameters of the plate, and the radial width is greater than the thickness of the plate. The GC device may include a mounting member configured to couple to the heater assembly.

[0007] Another aspect of this disclosure relates to a method. The method may include providing a plate having an inner diameter, an outer diameter, a plane, and a curved surface. The method may include providing a heat-conducting wire configured to form a plurality of coils around the plate. The diameter of each of the plurality of coils may be greater than half the difference between the outer diameter and the inner diameter of the plate. Each of the plurality of coils may be configured to intersect with both the inner diameter and the outer diameter of the plate. A radial width is defined by half the difference between the outer diameter and the inner diameter of the plate, and the radial width is greater than the thickness of the plate.

[0008] Those skilled in the art will understand that the Summary of the Invention is merely illustrative and not intended to be limiting in any way. Other aspects, inventive features, and advantages of the apparatus and / or process described herein (defined only by the claims) will be revealed in the Detailed Description section, which is set forth herein in conjunction with the accompanying drawings. Attached Figure Description

[0009] Details of one or more implementations of the subject matter described in this specification are set forth in the accompanying drawings and the following detailed description. The detailed description, drawings, and claims will reveal further features, aspects, and advantages of the subject matter.

[0010] Figure 1 This is a schematic diagram of a gas chromatography system according to one implementation plan.

[0011] Figure 2 This is a schematic diagram of a gas chromatography system according to one embodiment.

[0012] Figure 3 This is a schematic diagram of a gas chromatography system according to one embodiment.

[0013] Figure 4 This is a schematic diagram of a portion of a board according to one implementation scheme.

[0014] Figure 5This is a schematic diagram of a portion of the plate according to one embodiment.

[0015] Figure 6 This is a schematic flowchart illustrating a method for providing a heater assembly according to one embodiment.

[0016] Similar figures and labels in the accompanying drawings indicate similar elements. Detailed Implementation

[0017] The following is a more detailed description of the various concepts and implementations related to methods, apparatus, and systems for heater assemblies. The various concepts introduced above and discussed in detail below can be implemented in any of a variety of ways, as the described concepts are not limited to any particular implementation. Examples of specific implementations and applications are provided primarily for illustrative purposes.

[0018] Column oven heater assemblies used in gas chromatographs (e.g., 200 V AC gas chromatographs) are prone to failure at maximum power. Below maximum power, the heating wires of the heater assembly may sag, which can cause clumping and / or hot spots in adjacent coils (e.g., heater coils). Short circuits to the frame and collapsing coils contacting adjacent coils can result in high currents and higher localized temperatures. When heater coils fail, this can cause problems when the heater coils contact the column oven wall. Furthermore, this can lead to problems with subsequent high-pressure testing. Additionally, runaway testing may require prolonged full-power operation. Under these conditions, heater assembly failure may involve heater coil sag and possible melting. High-temperature air bath convection column ovens may fail due to short circuits of the column oven coil elements to the support structure, circulating fan, and / or adjacent coils. High power densities can cause column oven coil elements to overheat, sag, or melt. Tests may be performed under extreme conditions. If the above failure modes occur, it would be beneficial if the failed column oven coil element did not form a short circuit.

[0019] Gas chromatographs can use quartz rings to support heater coils. However, quartz rings can be expensive and difficult to manufacture and assemble. Furthermore, quartz can have a high thermal mass and be brittle. Gas chromatograph air bath column ovens may require rapid heating and cooling. Therefore, they may benefit from low-mass, fast-response heaters.

[0020] This disclosure relates to systems and methods for heater assemblies. Supports (e.g., mica rings) can support helical heater coils and achieve more robust performance at extreme power densities and high temperatures (e.g., greater than 450ºC) in air bath column ovens. Lightweight mica disks located at the bisecting plane of the helical column oven coils can stabilize the structure, ensuring that the heater assembly (e.g., coils) remains properly spaced and maintains optimal performance at extreme temperatures and power levels. In the event of a failure of one or more coils, the broken coils can be held in place by the mica support, preventing short circuits and failure problems.

[0021] The disclosed solution offers a technical advantage by providing a heater assembly that prevents individual coils from migrating and converging between the ceramic and insulating supports. The disk (e.g., ring, mica disk, mica ring) can contact each coil and hold it at the desired pitch. Compared to quartz rings, mica rings can be lighter and have lower thermal mass. Mica can withstand some breakage without losing the integrity of the bisector disk. The disk can have a low cross-section and limited contact area, thereby maximizing the power density of the heater's heat-conducting wire. The disk can help maximize the number of coils between the ceramic supports. The disk can support the coils in a ring shape, rather than allowing the coils to extend in a straight line between the supports. This allows the coils (e.g., spirals) to maintain a ring (e.g., toroidal) shape and prevents short circuits with the support structure of adjacent moving parts (e.g., fans).

[0022] Figure 1 This is a schematic diagram of a gas chromatography system 100 (GC system, GC device). GC system 100 may include a representative GC system. GC system 100 may include one or more injection ports 105 (e.g., inlets, sample inlets). Injection ports 105 may receive samples injected into GC system 100 for analysis. For example, a sample may be injected into injection port 105 and, if not already in a gaseous state, evaporate therein for analysis by GC system 100.

[0023] GC system 100 may include one or more pressurized gas sources 110 (e.g., pressurized gas supply, gas source, gas supply, supply gas). Pressurized gas source 110 may include a storage tank. Pressurized gas source 110 (e.g., carrier gas supply, carrier gas source, carrier gas) may be fluidly (e.g., flow-through) coupled (e.g., connected) to sample inlet port 105. Pressurized gas source 110 may supply a carrier gas, such as, but not limited to, helium, hydrogen, nitrogen, argon / methane mixture, or other such inert gases, which delivers the injected sample from sample inlet port 105 through GC system 100. Pressurized gas source 110 may include a pressurized gas supply source. Pressurized gas source 110 may be a pressurized gas distribution system. Pressurized gas can be found in a laboratory. Pressurized gas source 110 may include a variety of gases. Pressurized gas source 110 may be coupled to GC system 100 via a distribution panel.

[0024] The GC system 100 may include one or more electro-pneumatic control (EPC) modules 140 (e.g., flow control modules). The EPC module 140 may be coupled (e.g., connected) to a pressurized gas source 110. The EPC module 140 may be fluidly coupled to an inlet port 105. For example, the inlet port 105 may be attached to the EPC module 140. The EPC module 140 can control the flow rate and / or pressure of the inlet port 105. The carrier gas may enter the first EPC module before entering the inlet port 105. Each inlet may have its own EPC module 140. Each EPC module 140 may be coupled to the same gas supply or different gas supplies.

[0025] GC system 100 may include one or more columns 115 (e.g., tubes, flow restrictors, separation columns). Column 115 may be fluidly coupled to injection port 105. Column 115 may be selected from a variety of columns used for separating sample components by gas chromatography. A gas chromatograph configured for backflushing, detector splitting, or other pneumatic switching may include multiple columns 115. A carrier gas may deliver a sample from injection port 105 to column 115 for separation. Column 115 may separate components of a gaseous sample to produce one or more target analytes for analysis by GC system 100. Column 115 may include a capillary column and / or may include a fused silica tube with a coating (e.g., a stationary phase coating) on ​​its inner wall that interacts with the sample injected into injection port 105 to separate sample components. Column 115 may be made of metal. The dimensions of column 115 may include an inner diameter ranging from 50 µm (micrometers) to 530 µm and a length ranging up to 200 meters. The injection port 105 can supply a sample to the column 115 for separation. The column 115 may include a separation column or a column used as a flow restrictor fluidly connected to the separation column.

[0026] GC system 100 may include one or more detectors 120. Detector 120 may receive separated components (e.g., analytes of the sample) after the sample has been delivered through column 115. Detector 120 may be fluidly coupled to column 115. Detector 120 may analyze the separated sample components to detect the presence and / or amount of sample analytes separated by column 115. Detector 120 may include flame ionization detector (FID), mass selective detector (MSD), thermal conductivity detector (TCD), electron capture detector (ECD), nitrogen-phosphorus detector (NPD), sulfur chemiluminescence detector (SCD), nitrogen chemiluminescence detector (NCD), flame photometric detector (FPD), or helium ionization detector (HID), etc. Detector 120 may be coupled to a computer. The computer may process and / or display data from detector 120.

[0027] GC system 100 may include one or more column heaters 125. Column heater 125 may include a column oven, convection heater, conduction heater, air bath, or other such heating device for heating certain components of GC system 100. Column heater 125 can heat or cool column 115 and other flow path components to a desired temperature. Column heater 125 may be configured to heat column 115 such that column 115 remains isothermal during sample analysis.

[0028] GC system 100 may include one or more controllers (not shown). The controllers may be directly or indirectly communicatively connected to column heater 125, injection port 105, one or more sensors, and / or other components of GC system 100. The controllers may be electrically coupled to GC system 100. The controllers may be onboard computing units physically integrated into a housing of GC system 100, which houses column 115, column heater 125, and other components of GC system 100. The controllers may be one or more separate computing devices and / or other such control devices located inside and / or outside the housing of GC system 100. The controllers or a portion thereof may be located within GC system 100. For example, the controllers or a portion thereof may be disposed within GC system 100. The controllers may be distributed in multiple locations. The controllers may be disposed outside GC system 100.

[0029] The controller may include one or more processors, such as, but not limited to, single-core processors, multi-core processors, logic devices, or other such data processing circuitry, configured to execute, analyze, and process data and information of the GC system 100. The controller may include a non-transitory memory device communicatively connected to the processor. The memory device may be configured as a volatile memory device (e.g., SRAM and DRAM), a non-volatile memory device (e.g., flash memory, ROM, and hard disk drive), or any combination thereof. The memory device may store executable code and other such information generated and / or processed by the processor during operation of the GC system 100.

[0030] The GC system 100 may include one or more input / output devices communicatively connected to a controller. These input / output devices enable operators and / or users to receive information from the controller and input information and parameters into the controller. This information and parameters may be stored in the memory device, accessed by the processor, and output to the input / output device. For example, the input / output device may include a monitor, display device, touchscreen device, keyboard, microphone, joystick, knob, button, or other such device to enable the input and output of information and parameters. The input / output device can be used to input information to the controller and output or otherwise display information and data generated by the processor of the GC system 100.

[0031] GC system 100 may include one or more heater assemblies 150 (e.g., heating assemblies). Heater assembly 150 may include one or more heater coils. The diameter of heater assembly 150 may be equal to or greater than the diameter of the ring or circle formed by column 115. The diameter of heater assembly 150 may be smaller than the diameter of the ring or circle formed by column 115. Heater assembly 150 can heat the column oven. For example, heater assembly 150 can raise the temperature of the column oven. Column heater 125 may include heater assembly 150.

[0032] The GC system 100 may include one or more mounting members 160. Mounting members 160 may be coupled to heater assembly 150. Mounting members 160 may be disposed on the rear wall of the column oven. Mounting members 160 may form the rear wall of the column oven. Mounting members 160 may have multiple holes. These holes allow airflow between the space where heater assembly 150 is located and the rest of the column oven. The length and width of mounting members 160 may be the same as the length and width of the column oven. Mounting members 160 may be coupled to heater assembly 150.

[0033] Mounting element 160 may be made of one or more materials, such as iron, steel (e.g., stainless steel). The material of mounting element 160 may be suitable for normal operation (e.g., up to 450ºC or higher), exposure to high temperatures (e.g., exceeding 1000ºC) due to proximity to the heater coil, and / or extreme temperatures during testing. The material of mounting element 160 may be selected based on cost and / or manufacturability.

[0034] Figure 2 This is a schematic diagram of a portion of a GC system 100. The GC system 100 may include a mounting element 160. The GC system 100 may include a heater assembly 150. The heater assembly 150 may include one or more plates 205. Plate 205 may include ceramic (e.g., made of ceramic). Plate 205 may include mica. Plate 205 may contain alumina, aluminosilicate, silica, or quartz. Plate 205 may be electrically insulating. Plate 205 may be non-conductive. Plate 205 may be cut from a single piece of material. Plate 205 may remain flat rather than being shaped, bent, or deformed. Plate 205 may be free from any strain due to elastic or plastic deformation. Plate 205 may have various shapes. For example, plate 205 may be circular. Plate 205 may be annular. For example, plate 205 may include a planar ring. Plate 205 may be a ring. For example, plate 205 may be a ring with a measurable thickness. Plate 205 may be symmetrical (e.g., radially symmetrical). Plate 205 can remain flat (e.g., planar) rather than being bent or coiled. Plate 205 can be flat and stress-free. The surface of plate 205 with the largest surface area can be perpendicular to the central axis 250. Plate 205 can be cut (e.g., die-cut) from mica sheet. Plate 205 can be cut such that it can be displaced (e.g., bent) out of plane. Plate 205 can be radially sliced ​​such that it can be bent out of plane to form a spiral or inclined plane, facilitating assembly and / or allowing other geometries for the heater coil support.

[0035] Plate 205 can be configured to melt at a temperature greater than 1000ºC. The melting point of plate 205 can be greater than or equal to 1000ºC. For example, the melting point of plate 205 can be greater than or equal to 1000ºC, greater than or equal to 1100ºC, greater than or equal to 1200ºC, greater than or equal to 1300ºC, greater than or equal to 1400ºC, or greater than or equal to 1500ºC. Plate 205 can be made of a material with a melting point greater than or equal to 1000ºC. For example, plate 205 can be made of a material with a melting point greater than or equal to 1000ºC, greater than or equal to 1100ºC, greater than or equal to 1200ºC, greater than or equal to 1300ºC, greater than or equal to 1400ºC, or greater than or equal to 1500ºC. Plate 205 can be configured to melt at a temperature less than 1000ºC.

[0036] Plate 205 may have an inner diameter 210. The inner diameter 210 may include the distance between a first point and a second point on the inner edge of plate 205. The first point on the inner edge of plate 205 may be positioned opposite the second point on the inner edge of plate 205. The inner diameter 210 may pass through the center of plate 205. The inner diameter 210 may include the minimum distance between two points on the inner edge of plate 205. The inner diameter 210 of plate 205 may be in the range of 125 mm to 160 mm. For example, the inner diameter 210 of plate 205 can be in the range of 125 mm to 135 mm, 125 mm to 140 mm, 125 mm to 145 mm, 125 mm to 150 mm, 125 mm to 155 mm, 125 mm to 160 mm, 135 mm to 140 mm, 135 mm to 145 mm, 135 mm to 150 mm, 135 mm to 155 mm, 135 mm to 160 mm, 140 mm to 145 mm, 140 mm to 150 mm, 140 mm to 155 mm, 140 mm to 160 mm, 145 mm to 150 mm, 145 mm to 155 mm, 145 mm to 160 mm, 150 mm to 155 mm, 150 mm to 160 mm, or 155 mm to 160 mm. The inner diameter 210 of plate 205 can be less than 135 mm. The inner diameter 210 of plate 205 can be greater than 160 mm.

[0037] Plate 205 may have an outer diameter 215. The outer diameter 215 may include the distance between a first point and a second point on the outer edge of plate 205. The first point on the outer edge of plate 205 may be positioned opposite the second point on the outer edge of plate 205. The outer diameter 215 may pass through the center of plate 205. The outer diameter 215 may include the maximum distance between two points on the outer edge of plate 205. The outer diameter 215 of plate 205 may be in the range of 140 mm to 175 mm. For example, the outer diameter 215 of plate 205 can be 140 mm to 145 mm, 140 mm to 150 mm, 140 mm to 155 mm, 140 mm to 160 mm, 140 mm to 165 mm, 140 mm to 170 mm, 140 mm to 175 mm, 145 mm to 150 mm, 145 mm to 155 mm, 145 mm to 160 mm, 145 mm to 165 mm, 145 mm to 170 mm, 145 mm to 175 mm, 150 mm to 155 mm, 150 mm to 160 mm, 150 mm to 165 mm, 150 mm to 170 mm, 150 mm to 175 mm, 155 mm to 160 mm, 155 mm to 165 mm, 155 mm to 175 mm, 155 mm to 175 mm, 160 mm to 16 ... The outer diameter 215 of plate 205 can be less than 140 mm. The outer diameter 215 of plate 205 can be greater than 175 mm. The outer diameter 215 can be greater than the inner diameter 210. The inner diameter 210 can be less than the outer diameter 215.

[0038] The difference between the outer diameter 215 and the inner diameter 210 of plate 205 can be greater than 10 mm. For example, the difference between the outer diameter 215 and the inner diameter 210 of plate 205 can be greater than 10 mm, greater than 11 mm, greater than 12 mm, greater than 13 mm, greater than 14 mm, greater than 15 mm, greater than 20 mm, greater than 25 mm, or greater than 30 mm. The difference between the outer diameter 215 and the inner diameter 210 of plate 205 can be less than or equal to 10 mm.

[0039] Plate 205 may have one or more surfaces. For example, plate 205 may have one or more planes 220. For example, plate 205 may include an inner plane and an outer plane. Plane 220 may be parallel to mounting member 160. For example, plane 220 may be parallel to the surface of mounting member 160 with the largest surface area. Plate 205 may be disposed in GC system 100 such that plane 220 is parallel to the sidewall of the column oven. Plane 220 may include the surface of plate 205 with the largest surface area compared to the other surfaces of plate 205. Plane 220 may be perpendicular to central axis 250. Central axis 250 may include the central axis of inner diameter 210. Central axis 250 may include the central axis of outer diameter 215. The central axis of inner diameter 210 may be offset from the central axis of outer diameter 215. The central axis of inner diameter 210 may coincide with the central axis of outer diameter 215. Plane 220 may be perpendicular to the central axis of inner diameter 210. Plane 220 may be perpendicular to the central axis of outer diameter 215. The surface of plate 205 with the largest upper surface area can be perpendicular to the central axis 250 of the inner diameter 210. The surface of plate 205 with the largest upper surface area can be perpendicular to the central axis 250 of the outer diameter 215.

[0040] Plate 205 may have one or more curved surfaces. For example, plate 205 may include an inner curved surface 223 and an outer curved surface 225. The curved surfaces may be perpendicular to the mounting member 160. For example, the curved surfaces may be perpendicular to the surface of the mounting member 160 with the largest surface area. Plate 205 may be disposed in the GC system 100 such that the curved surfaces are perpendicular to the sidewalls of the column oven. The curved surfaces may include the surface of plate 205 with the smallest surface area compared to the other surfaces of plate 205. The curved surfaces may be parallel to the central axis 250. For example, the curved surfaces may be parallel to the central axis of the inner diameter 210. The curved surfaces may be parallel to the central axis of the outer diameter 215. The surface area of ​​the curved surfaces may be smaller than the surface area of ​​plane 220. The surface area of ​​plane 220 may be larger than the surface area of ​​the curved surfaces. Plate 205 may have one or more rounded edges.

[0041] The heater assembly 150 may include one or more heat-conducting wires 230 (e.g., heater heat-conducting wires). The heat-conducting wires 230 may include nickel and chromium (e.g., made of nickel and chromium). For example, the heat-conducting wires 230 may be made of a nickel-chromium alloy. The heat-conducting wires 230 may have a melting point lower than the melting point of the plate 205. The melting point of the plate 205 may be higher than the melting point of the heat-conducting wires 230. The heat-conducting wires 230 may extend from one plate to another.

[0042] The heat-conducting wire 230 can form a plurality of coils 235 (e.g., heater coils). For example, the heat-conducting wire 230 can form the plurality of coils 235 around a plate 205. The plurality of coils 235 can be wound around the plate 205. For example, the plurality of coils 235 can be wound around the plate 205 such that the heat-conducting wire 230 extends from an inner diameter 210 to an outer diameter 215 and then back for each of the plurality of coils 235. The plurality of coils 235 can be wound around the plate 205 such that, on each individual coil of the plurality of coils 235, the heat-conducting wire 230 extends from an inner diameter 210 to an outer diameter 215 and then back. The plurality of coils 235 can be coupled to the plate 205. For example, the plurality of coils 235 can be in physical contact with the plate 205. The plurality of coils 235 can form one or more loops. Plate 205 can be configured to provide friction to prevent the plurality of coils 235 from sagging or moving.

[0043] The spacing between the plurality of coils 235 may be the same or different. The pitch of the plurality of coils 235 may include the spacing between the plurality of coils 235. The pitch of the plurality of coils 235 may include the spacing between the plurality of coils plus the diameter of the heat-conducting wire 230. The plurality of coils 235 may be uniform or non-uniform. The pitch may be in the range of 2 to 4 times the diameter of the heat-conducting wire 230.

[0044] Plate 205 can be fitted inside the plurality of coils 235. The plurality of coils 235 may include helical coils (e.g., helical coils of the heating wire in a heater assembly). Plate 205 can slide inside the plurality of coils 235. Plate 205 can pass through the entire periphery of the heater assembly 150 at its bisecting plane. Plate 205 can penetrate the plurality of coils 235. For example, plate 205 can penetrate the plurality of coils 235 to support the heated heating wire in the heater assembly. Plate 205 can penetrate the plurality of coils 235 to minimize the migration of the plurality of coils 235. If one coil in the plurality of coils 235 fails, that single coil can be supported by plate 205 instead of causing a short circuit. Plate 205 can be positioned along the bisecting plane of the plurality of coils 235. The plurality of coils 235 can remain aligned. A failed coil may sag or move due to gravity when heated. Preventing the plurality of coils 235 from short-circuiting with adjacent coils avoids problems caused by increased current during a short circuit. Plate 205 may be positioned at the bisecting surface of the annular ring formed by the plurality of coils 235. Plate 205 prevents short circuits to the frame (e.g., mounting 160) or adjacent coils. Plate 205 can cause the plurality of coils 235 to fail in a predetermined manner. When the plurality of coils 235 begin to move or droop, the plurality of coils 235 may contact the edge of plate 205 (e.g., outer edge, inner edge). When the plurality of coils 235 begin to move or droop, the plurality of coils 235 may find a resting point on plate 205. Plate 205 can stabilize the plurality of coils 235. Plate 205 can prevent the plurality of coils 235 from sliding and bundling together.

[0045] The plurality of coils 235 may be separated from the plate 205. For example, there may be a gap between each coil of the plurality of coils 235 and the plate 205. Each coil of the plurality of coils 235 may be separated from the outer edge and / or the inner edge of the plate 205. Each coil of the plurality of coils 235 may contact the plate 205. For example, each coil of the plurality of coils 235 may contact the outer edge and / or the inner edge of the plate 205. The plate 205 may have one or more edges that contact each coil of the plurality of coils 235. Friction between the plurality of coils 235 and the plate 205 may prevent or limit movement of the plurality of coils 235. For example, friction between the plurality of coils 235 and the plate 205 may prevent or limit movement of the plurality of coils 235 beyond a threshold distance. The plurality of coils 235 may be constrained radially (relative to the diameter of the plate 205). The plurality of coils 235 may be constrained axially (along the short diameter of the annulus formed by the plurality of coils 235).

[0046] Each of the plurality of coils 235 can be configured to intersect with the inner diameter 210 and the outer diameter 215 of the plate 205. For example, each of the plurality of coils 235 can be wound around the plate 205 such that each of the plurality of coils 235 intersects with the inner diameter 210 of the plate 205. Each of the plurality of coils 235 can be wound around the plate 205 such that each of the plurality of coils 235 intersects with the outer diameter 215 of the plate 205.

[0047] The GC system 100 may include one or more fans. The fans may be located at or near the center of plate 205. The fans may be located inside plate 205. The fans may provide cooling for the GC system 100. The fans may provide mixing to achieve a uniform temperature in the air bath column chamber. The fans may mix and / or exchange air. The fans may dissipate heat generated by the plurality of coils 235. The fans may be located near the center of plate 205.

[0048] Figure 3 This is a schematic diagram of a portion of a GC system 100. The GC system 100 may include a mounting component 160, a plate 205, and the plurality of coils 235. The plate 205 may include a plane 220 and a curved surface.

[0049] Each of the plurality of coils 235 may have a diameter (e.g., coil diameter 305). The diameter of each of the plurality of coils 235 may be greater than half the difference between the outer diameter 215 and the inner diameter 210 of the plate 205. The coil diameter 305 may be greater than half the difference between the outer diameter 215 and the inner diameter 210 of the plate 205. The plurality of coils 235 may have varying diameters. For example, adjacent coils among the plurality of coils 235 may have different diameters. The plate 205 may pass through the plurality of coils 235 without jamming. A gap may exist between the plate 205 and the plurality of coils 235. The plurality of coils 235 may have an average diameter. The average diameter of the plurality of coils 235 may be greater than half the difference between the outer diameter and the inner diameter of the plate 205.

[0050] The GC system 100 may include one or more locking elements 310 (e.g., locking components, spacers, positioning components). Locking element 310 may include spacers that lock one or more of the plurality of coils 235 into place. Locking element 310 may couple the plurality of coils 235 to a mounting member 160. For example, locking element 310 may contact the plurality of coils 235 and the mounting member 160. Locking element 310 may couple the mounting member 160 to one or more of the plurality of coils 235. Locking element 310 may prevent movement of the plurality of coils 235. Locking element 310 may include a plurality of holes or slots. The plurality of coils 235 may pass through the holes or slots of locking element 310. Locking element 310 may separate a first plate and a second plate. Locking element 310 may contact plate 205. For example, locking element 310 may contact the first plate. Locking element 310 may contact the second plate. Locking element 310 may be electrically insulating. Locking element 310 may be made of ceramic. One of the plurality of coils 235 may pass through the locking element 310. The locking element 310 may fix the position of one or more of the plurality of coils 235.

[0051] Half the difference between the outer diameter 215 and the inner diameter 210 of plate 205 can be the radial width. The radial width is defined by half the difference between the outer diameter and the inner diameter of the plate, and this radial width is greater than the thickness of the plate. The radial width can be greater than the thickness 315. The thickness 315 can be in the range of 0.5 mm to 2.0 mm. For example, the thickness can be in the range of 0.5 mm to 1.0 mm, 0.5 mm to 1.5 mm, 0.5 mm to 2.0 mm, 1 mm to 1.5 mm, 1.0 mm to 2.0 mm, or 1.5 mm to 2.0 mm.

[0052] Compared to a plate with a cylindrical shape and a radial width less than or equal to its thickness, a radial width greater than the thickness 315 of plate 205 makes the plate more durable and easier to manipulate and assemble. Furthermore, a radial width greater than the thickness 315 of plate 205 allows the plate to support the plurality of coils 235 with a smaller contact area and without strain compared to a plate with a radial width less than or equal to its thickness. A radial width greater than the thickness 315 of plate 205 also gives the plate higher rigidity in the radial direction (e.g., perpendicular to the central axis 250), preventing the plurality of coils 235 from sagging due to gravity. Finally, a radial width greater than the thickness 315 of plate 205 allows the plate to have a lower mass and a smaller cross-section compared to a plate with a radial width less than or equal to its thickness. Compared to a plate whose radial width is less than or equal to its thickness, a radial width greater than the thickness 315 of plate 205 can make the plate more flexible in the axial direction.

[0053] In some embodiments, plate 205 may include a first plate, and the plurality of coils 235 may include a first plurality of coils. Heater assembly 150 may include a second plate. The second plate may have the same shape as the first plate. The second plate may have a different shape compared to the first plate. The second plate may have an inner diameter, an outer diameter, a flat surface, and a curved surface. A second plurality of coils may be formed around the second plate using heat-conducting wires 230. The heat-conducting wires 230 may extend from the first plate to the second plate. The second plate may be positioned at a distance from the first plate. The second plate and the first plate may be separated by a distance. This distance may be large enough that the first plurality of coils do not contact the second plurality of coils.

[0054] The diameter of each of the second plurality of coils (e.g., coil diameter 305) can be greater than half the difference between the outer diameter and the inner diameter of the second plate. The coil diameter 305 can be greater than half the difference between the outer diameter and the inner diameter of the second plate. The second plurality of coils can have varying diameters. For example, adjacent coils in the second plurality of coils can have different diameters. The second plurality of coils can have an average diameter. The average diameter of the second plurality of coils can be greater than half the difference between the outer diameter and the inner diameter of the second plate.

[0055] The difference between the outer diameter and the inner diameter of the second plate can be greater than 10 mm. For example, the difference can be greater than 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, 20 mm, 25 mm, or 30 mm. The difference between the outer diameter and the inner diameter of the second plate can be less than or equal to 10 mm.

[0056] The second plurality of coils may be separated from the second plate. For example, a gap may exist between each of the second plurality of coils and the second plate. Each of the second plurality of coils may be separated from the outer edge and / or the inner edge of the second plate. Each of the second plurality of coils may contact the second plate. For example, each of the second plurality of coils may contact the outer edge and / or the inner edge of the second plate. Friction between the second plurality of coils and the second plate may prevent or limit movement of the second plurality of coils. For example, friction between the second plurality of coils and the second plate may prevent or limit movement of the second plurality of coils beyond a threshold distance. The second plurality of coils may be constrained radially (to the diameter of plate 205). The second plurality of coils may be constrained axially (along the short diameter of the annulus formed by the plurality of coils).

[0057] The GC system 100 may include a heater assembly 150. The heater assembly 150 may include a plate 205. The plate 205 may include an inner diameter 210. The plate 205 may include an outer diameter 215. The plate 205 may include a plane 220. The plate 205 may include a curved surface. The heater assembly 150 may include a heat-conducting wire 230. The heat-conducting wire 230 may be configured to form a plurality of coils 235 around the plate 205. The diameter of each coil in the plurality of coils 235 may be greater than half the difference between the outer diameter 215 and the inner diameter 210 of the plate 205. Each coil in the plurality of coils 235 may be configured to intersect with both the inner diameter 210 and the outer diameter 215 of the plate 205. The surface area of ​​the plane 220 may be greater than the surface area of ​​the curved surface.

[0058] The GC system 100 may include a mounting member 160. The mounting member 160 may be coupled to the heater assembly 150. The mounting member 160 may be disposed on the rear wall of the column oven. The mounting member 160 may form the rear wall of the column oven. The length and width of the mounting member 160 may be the same as the length and width of the column oven.

[0059] Figure 4This is a schematic diagram of a portion of plate 205. Plate 205 may include a plurality of notches 405 (e.g., slots). The plurality of notches 405 may be provided on a portion of plate 205. For example, the plurality of notches 405 may be provided on the exterior of plate 205. The plurality of notches 405 may be provided on the interior of plate 205. The plurality of notches 405 may be provided on the outer edge of plate 205. The plurality of notches 405 may be provided on the inner edge of plate 205. The plurality of notches 405 may form a serrated pattern. The serrated pattern allows plate 205 to be inserted into the plurality of coils 235 more easily in one direction than in the opposite direction. The plurality of coils 235 may slide on the serrated edges of plate 205. Plate 205 may include serrated protrusions (e.g., serrated teeth). The serrated protrusions may engage the plurality of coils 235. The serrated protrusions may prevent the plurality of coils 235 from sagging or clustering along the axis of the annulus formed by the plurality of coils 235. The serrated protrusions allow for a greater width to further constrain the plurality of coils 235 to a target or desired location. The plurality of notches 405 prevent each coil of the plurality of coils 235 from moving beyond a threshold distance. Each coil of the plurality of coils 235 may be disposed in each of the plurality of notches 405. The plurality of notches 405 may be coupled to the plurality of coils 235. For example, the plurality of notches 405 may contact (e.g., physically contact) the plurality of coils 235. A portion of the plate 205 having the plurality of notches 405 may contact the plurality of coils 235. The outer diameter 215 of the plate 205 may include the distance between two notches of the plurality of notches 405. These two notches may be disposed at opposite ends of the plate 205.

[0060] Figure 5 This is a schematic diagram of a portion of plate 205. Plate 205 may include one or more slits 505. For example, plate 205 may include one or more breaks along one or more portions of plate 205. Slits 505 may form edges of plate 205. Slits 505 may divide plate 205 into multiple parts. Slits 505 may allow plate 205 to be inserted into the multiple coils 235. For example, when inserting plate 205 into the multiple coils 235, plate 205 may be temporarily bent out of plane. Slits 505 may form cuts through plate 205 without dividing plate 205 into multiple parts. For example, plate 205 with slits 505 may be a single piece.

[0061] Plate 205 can be divided into two, three, four, etc. Plate 205 may include one or more C-shaped plates 510. For example, plate 205 may include a first C-shaped plate. Plate 205 may include a second C-shaped plate. Heater assembly 150 may include the second C-shaped plate. C-shaped plates 510 may form two two-part sections of plate 205. Multiple plate portions may be coupled together to form plate 205. For example, multiple plate portions may be disposed in the multiple coils 235. The multiple plate portions may be serrated or form a serrated pattern. For example, the outer edges of the multiple plate portions may be serrated or form a serrated pattern. The inner edges of the multiple plate portions may be serrated or form a serrated pattern.

[0062] Plate 205 may include one or more attachments 515. Attachment 515 may support a portion of the heat-conducting wire 230. For example, attachment 515 may support a portion of the heat-conducting wire 230 configured to extend from the plurality of coils 235. Attachment 515 may support the weight of this portion of the heat-conducting wire 230. Without attachment 515, the portion of the heat-conducting wire 230 extending from the plurality of coils 235 may sag. Attachment 515 may position the heater assembly 150 or anchor the heater assembly 150 via a fixed point. The heat-conducting wire 230 may be coupled to a plug 240 (e.g., an electrical plug). Attachment 515 may support the portion of the heat-conducting wire 230 coupled to the plug 240.

[0063] Figure 6 This is a schematic flowchart illustrating a method 600 for providing a heater assembly. Method 600 may include providing a plate (block 605). Method 600 may include providing a heater coil (block 610). Method 600 may include inserting the plate into the coil (block 615). Method 600 may include preventing coil movement (block 620).

[0064] Method 600 may include providing a plate (frame 605). The plate may have an inner diameter, an outer diameter, a plane, and a curved surface. The plate may include a first plate. The plate may include a planar ring. The plate may be made of mica. The plate may include a plurality of notches disposed on the exterior of the plate. The plate may be configured to melt at a temperature above 1000ºC. The plate may include slits. The plate may include a first C-shaped plate and a second C-shaped plate. The surface area of ​​the plane may be larger than the surface area of ​​the curved surface.

[0065] Method 600 may include providing heater coils (block 610). The heater coils may form a plurality of coils around a plate. The diameter of each of the plurality of coils may be greater than half the difference between the outer diameter and the inner diameter of the plate. Each of the plurality of coils may intersect with both the inner and outer diameters of the plate. A radial width is defined by half the difference between the outer and inner diameters of the plate, and this radial width is greater than the thickness of the plate. The plurality of coils may include a first plurality of coils. The plate, the plurality of coils, a mounting element, and a locking element may form a heater assembly. Method 600 may include providing a heater assembly. The difference between the outer and inner diameters of the plate may be greater than 10 mm. The outer diameter of the plate may be in the range of 140 mm to 175 mm. The inner diameter of the plate may be in the range of 125 mm to 160 mm. The plate may include an accessory configured to support a portion of a heat-conducting wire. This portion of the heat-conducting wire may extend from the plurality of coils.

[0066] Method 600 may include inserting the plate into the coils (block 615). For example, method 600 may include inserting the plate into the plurality of coils. The plate may include a slit, allowing the plate to be inserted into the plurality of coils. Method 600 may include inserting the plate into the plurality of coils before or after the plurality of coils are constrained into a circular (e.g., annular) configuration. Method 600 may include bending the plate out of plane at the slit and inserting the plate into the plurality of coils. The plate may be made of a plurality of separate pieces, such that each separate piece of the plate can be inserted into the plurality of coils. Inserting the plate into the plurality of coils may include bending the plate out of plane to form a helix or ramp, and then sliding the plate across the plurality of coils from one end of the plurality of coils. After the heat-conducting wire is wound into a helix to form the plurality of coils, the helix may be bent around a circle to form an annulus. The helix may have a first opening and a second opening. The slit plate may be stretched to form a ramp. One end of the plate may pass inside the first opening and be guided around a small diameter of the annulus. The plate may revolve around the helix and eventually reach the second opening. The plate can be held inside the plurality of coils.

[0067] Method 600 may include preventing coil movement (block 620). For example, method 600 may include preventing the plurality of coils from moving beyond a threshold distance. Method 600 may include preventing the plurality of coils from moving beyond a threshold distance after the plate 205 has been inserted. Method 600 may include limiting the movement of the plurality of coils beyond a threshold distance. The threshold distance may be less than the distance between two adjacent coils among the plurality of coils. If the plurality of coils move beyond the threshold distance, the plurality of coils may contact and shunt, which may result in lower resistance and higher current. Shunting of the plurality of coils may lead to a runaway condition. If the plurality of coils move beyond the threshold distance and contact the frame, it may lead to a short circuit. Without plate 205, the plurality of coils may move beyond the threshold distance.

[0068] In some embodiments, the heater assembly may include a second plate having an inner diameter, an outer diameter, a flat surface, and a curved surface. The heat-conducting wire may form a second plurality of coils around the second plate. The diameter of each of the second plurality of coils may be greater than half the difference between the outer diameter and the inner diameter of the second plate.

[0069] Any implementation, element, or action of a system or method mentioned in the singular form herein may include an implementation containing multiple such elements, and any implementation, element, or action mentioned in the plural form herein may include an implementation containing only a single element. The singular or plural references are not intended to limit the currently disclosed systems or methods, their components, actions, or elements to a single or multiple configuration. A reference to any action or element based on any information, action, or element may include an implementation in which the action or element is at least partially based on any information, action, or element.

[0070] Although the operations may be depicted in a specific order in the accompanying drawings, these operations do not need to be performed in the specific order shown or sequentially, and not all of the operations shown need to be performed. The actions described herein may be performed in different orders.

[0071] Any implementation disclosed herein may be combined with any other implementation, and the terms "an implementation," "some implementations," "an alternative implementation," "various implementations," "one implementation," etc., are not necessarily mutually exclusive and are intended to indicate that a particular feature, structure, or characteristic described in connection with that implementation may be included in at least one implementation. These terms used herein do not necessarily refer to the same implementation. Any implementation may be inclusively or exclusively combined with any other implementation in any manner consistent with the aspects and implementations disclosed herein.

[0072] A reference to "or" can be interpreted as inclusive, so that any item described using "or" can indicate any of the single, multiple, or all of the items described. A reference to at least one of a plurality of items listed by a conjunction can be interpreted as an inclusive "or" to indicate any of the single, multiple, or all of the items described. For example, a reference to "at least one of 'A' and 'B'" can include only "A", only "B", or both "A" and "B". Elements other than "A" and "B" can also be included.

[0073] The systems and methods described herein can be implemented in other specific forms without departing from their inherent characteristics. The foregoing implementations are illustrative and not intended to limit the systems and methods described.

[0074] In the accompanying drawings, detailed descriptions, or any claims, technical features are followed by reference numerals. These reference numerals are included to enhance the comprehensibility of the drawings, detailed descriptions, and claims. Therefore, the presence or absence of reference numerals does not limit the scope of any claim element.

[0075] The systems and methods described herein may be implemented in other specific forms without departing from their characteristics. The foregoing implementations are illustrative and not limiting of the systems and methods described. Therefore, the scope of the systems and methods described herein is indicated by the appended claims rather than the foregoing description, and variations in the meaning and scope of the equivalence of the claims are included therein.

Claims

1. A heater assembly, comprising: A plate having an inner diameter, an outer diameter, a plane, and a curved surface; as well as A heat-conducting wire, configured to form multiple coils around the inner and outer diameters of the plate. Wherein, the diameter of each of the plurality of coils is greater than half the difference between the outer diameter and the inner diameter of the plate. Each of the plurality of coils is configured to intersect with the inner diameter and the outer diameter of the plate, and The radial width is defined by half the difference between the outer diameter and the inner diameter of the plate, and the radial width is greater than the thickness of the plate.

2. The heater assembly according to claim 1, wherein, The plate is a first plate, and the plurality of coils are a first plurality of coils, the heater assembly further comprising: The second plate has an inner diameter, an outer diameter, a flat surface, and a curved surface. The heat-conducting wire is configured to form a second plurality of coils around the second plate, and The diameter of each of the second plurality of coils is greater than half the difference between the outer diameter and the inner diameter of the second plate.

3. The heater assembly according to claim 1, wherein, The difference between the outer diameter and the inner diameter of the plate is greater than 10 mm.

4. The heater assembly according to claim 1, wherein, The outer diameter of the plate is in the range of 140 mm to 175 mm.

5. The heater assembly according to claim 1, wherein, The inner diameter of the plate is in the range of 125 mm to 160 mm.

6. The heater assembly according to claim 1, wherein, The plate includes a planar ring.

7. The heater assembly according to claim 1, wherein, The plate contains mica.

8. The heater assembly according to claim 1, wherein, The plate includes a plurality of recesses disposed on the exterior of the plate.

9. The heater assembly according to claim 1, wherein, The plate is configured to melt at a temperature above 1000ºC.

10. The heater assembly of claim 1, wherein, The plate includes a crack.

11. The heater assembly of claim 1, wherein, The plate includes a first C-shaped plate, and the heater assembly further includes a second C-shaped plate.

12. The heater assembly of claim 1, wherein, The plate includes an accessory configured to support a portion of the heat-conducting wire, the portion of which is configured to extend from the plurality of coils.

13. A gas chromatography (GC) apparatus, comprising: The heater assembly according to claim 1; as well as Mounting element, which is configured to be coupled to the heater assembly.

14. The GC device according to claim 13, wherein, The plate is a first plate, and the plurality of coils are a first plurality of coils, the heater assembly further comprising: The second plate has an inner diameter and an outer diameter. The heat-conducting wire is configured to form a second plurality of coils around the second plate, and The diameter of each of the second plurality of coils is greater than half the difference between the outer diameter and the inner diameter of the second plate.

15. The GC device of claim 14, further comprising a plurality of locking elements, each of the plurality of locking elements being configured to: The mounting component is coupled to one or more of the plurality of coils; and Separate the first plate and the second plate.

16. The GC device of claim 13, further comprising a plurality of locking elements, each of the plurality of locking elements being configured to couple the mounting member to one or more of the plurality of coils.

17. The GC device of claim 13, further comprising a fan disposed near the center of the plate.

18. A method comprising: A plate is provided, the plate having an inner diameter, an outer diameter, a plane, and a curved surface; as well as A heat-conducting wire is provided, the heat-conducting wire being configured to form a plurality of coils around the inner and outer diameters of the plate. Wherein, the diameter of each of the plurality of coils is greater than half the difference between the outer diameter and the inner diameter of the plate. Each of the plurality of coils is configured to intersect with the inner diameter and the outer diameter of the plate, and The radial width is defined by half the difference between the outer diameter and the inner diameter of the plate, and the radial width is greater than the thickness of the plate.

19. The method of claim 18, further comprising: To prevent the plurality of coils from moving beyond a threshold distance.

20. The method of claim 18, further comprising: After constraining the plurality of coils into a circular configuration, the plate is inserted into the plurality of coils.

21. The method according to claim 18, wherein, The plate includes a crack, and the method further includes: The plate is bent out of plane at the crack; and The plate is inserted into the plurality of coils.

22. The method of claim 18, further comprising: The plate is inserted into the plurality of coils before constraining them into a circular configuration.

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