Semiconductor cooling type hybrid hose device

Abstract

The application relates to a heat dissipation technology field of a glue dispenser, and discloses a semiconductor cooling type mixed glue pipe device which comprises a sleeve pipe and a mixed glue pipe, a heat conduction plate is fixedly connected to the sleeve pipe, a semiconductor refrigerating sheet is magnetically attracted and installed on the heat conduction plate, the semiconductor refrigerating sheet is fixedly connected to the heat conduction plate on the sleeve pipe through magnetic attraction and firm adhesion, the semiconductor refrigerating sheet is internally provided with large-area radiating fins, and a radiating fan is further arranged on the radiating fins; the device can realize local temperature control on the glue in the mixed glue pipe, especially in the harsh working condition of high-temperature seasons, the adhesion performance after glue discharge is guaranteed from being reduced, the operation energy consumption is greatly reduced compared with the scheme of full-zone temperature control in a workshop, or normal production can be guaranteed in the workshop without full-zone temperature control in the high-temperature season, the adhesion quality after glue discharge is not reduced, through the installation mode of the magnetic attraction base, the semiconductor refrigerating sheet and the matched radiating structure are quickly disassembled and assembled without tools, and the difficulty of device replacement and daily cleaning and maintenance due to faults is greatly reduced.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for dispensing machines, specifically to a semiconductor-cooled mixing hose device. Background Technology

[0002] In the manufacturing process of gas stoves, the stove panel is often made of high-strength tempered glass, brushed stainless steel, and other mainstream materials. It requires an adhesive application process to bond it to the metal base, burner support components, and valve body protection structure. This process must ensure the panel's impact resistance, high-temperature resistance, and resistance to oil stains and aging after bonding. Strict control over the adhesive application precision and curing state is also crucial to prevent adhesive overflow from contaminating the panel's appearance, uneven adhesive layers that could lead to stress concentration and cracking of the tempered glass, and to ensure timely achievement of high-standard adhesion. Current adhesive application processes commonly use high-performance functional adhesives such as two-component epoxy structural adhesives and high-temperature silicone sealants. These adhesives require precise and uniform mixing of the two components to trigger a cross-linking reaction and achieve the designed bond strength and sealing performance. High temperatures accelerate the curing process. During the continuous operation of a dispensing machine, the moment the two components are uniformly sheared and mixed in the mixing tube by the spiral blades, an irreversible cross-linking polymerization chemical reaction is triggered, continuously releasing a large amount of reaction heat. Especially in the continuous operation of panel assembly lines, the high temperature environment of summer workshops, and the conditions of applying glue to large-size panels with high flow rates, the reaction heat in the mixing tube will accumulate rapidly, causing the temperature of the glue inside the tube to rise sharply. This will not only accelerate the cross-linking and curing process of the glue, causing a sudden increase in glue viscosity and loss of fluidity, but may also cause production problems such as blockage of the mixing tube, glue dispensing interruption, and insufficient glue in the dispensing path.

[0003] Currently, temperature control solutions for mixed adhesive hoses mainly employ air cooling, central air conditioning for overall temperature control, and circulating liquid cooling. However, conventional air cooling solutions rely solely on ambient air convection for limited heat dissipation, resulting in low heat dissipation efficiency and an inability to counteract the continuous exothermic reaction of the adhesive cross-linking. Central air conditioning for overall temperature control requires cooling the entire production workshop, achieving only a rough adjustment of ambient temperature and failing to provide precise localized temperature control for mixed adhesive hoses, while also consuming high energy. While some dispensing machines utilize circulating liquid cooling devices, these devices are bulky, inconvenient to disassemble and maintain, and prone to leakage. Furthermore, the air-cooled heat dissipation units used in conventional air cooling and circulating liquid cooling systems typically have their fans and heat sinks facing the diffusion path of suspended adhesive mist generated during dispensing. When airflow containing adhesive mist is drawn in by the fan, adhesive particles adhere to the gaps between the fan blades and heat sink fins, causing airflow blockage and reduced heat dissipation efficiency. Summary of the Invention

[0004] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a semiconductor-cooled mixing hose device, which has the advantages of high heat dissipation efficiency, convenient structure disassembly, and reduced adhesive mist corrosion. It solves the problems of low heat dissipation efficiency, complex structure assembly, and susceptibility to environmental adhesive mist corrosion in existing mixing hose temperature control solutions.

[0005] (II) Technical Solution To achieve the aforementioned goals of high heat dissipation efficiency, convenient structural disassembly, and reduced adhesive mist corrosion, this invention provides the following technical solution: a semiconductor-cooled hybrid hose device, comprising a sleeve and a hybrid hose coaxially fixedly installed within the sleeve. A cross-shaped heat-conducting plate is fixedly connected to the sleeve to uniformly dissipate heat from the sleeve. A semiconductor cooling chip is magnetically mounted on the heat-conducting plate to reduce its temperature. The semiconductor cooling chip is fixedly connected to a magnetic base that attracts it to the heat-conducting plate. A heat sink is also fixedly mounted on the semiconductor cooling chip to reduce the temperature of its heat-dissipating end. The heat-absorbing end of the semiconductor cooling chip is in contact with the heat-conducting plate, and the heat-dissipating end of the semiconductor cooling chip is in contact with the heat sink. Furthermore, a cooling fan is provided on the heat sink to generate vertical downward airflow.

[0006] Preferably, a housing is also fixedly connected to the magnetic base, the heat sink is fixedly disposed between the housing and the magnetic base, and a drive motor is disposed between the housing and the cooling fan, and the drive motor is fixedly connected to the housing.

[0007] Preferably, the outer casing has an air inlet for mounting the cooling fan, and a support frame is provided below the air inlet. The drive motor is coaxially disposed in the air inlet and fixedly connected to the support frame. Both sides of the magnetic base are machined with exhaust grilles, and the downward airflow generated by the cooling fan on the heat sink is discharged from the exhaust grilles along both ends of the heat sink.

[0008] Preferably, a power interface is embedded in the side of the outer casing, specifically a Type-C interface. A wiring fixing cylinder is provided on the magnetic base. A wiring groove is also machined inside the outer casing, and wires connecting the circuit inside the wiring fixing cylinder to the power interface are provided in the wiring groove. The drive motor is electrically connected to the wires in the wiring groove. The wiring inside the wiring fixing cylinder is connected to the thermoelectric cooler. Furthermore, a controller for controlling the power of the thermoelectric cooler and the speed of the cooling fan is installed above the magnetic base, and the controller is connected to the wiring inside the wiring fixing cylinder.

[0009] Preferably, the controller is controlled by a touch switch.

[0010] Preferably, the cross structure of the heat-conducting plate includes an integrally formed vertical arm and a horizontal arm. The vertical arm and the horizontal arm are perpendicularly intersecting each other, and the magnetic base is magnetically connected to the intersection of the vertical arm and the horizontal arm. The upper and lower end faces of the magnetic base are parallel to the horizontal arm. The vertical arm is machined with heat-spreading holes to uniformly conduct the surface temperature of the sleeve to the heat-conducting plate. The sleeve and the heat-spreading holes are coaxially fixedly connected.

[0011] Preferably, the distance between the upper and lower end faces of the horizontal arm is greater than the distance between the left and right end faces of the vertical arm.

[0012] Preferably, the cooling fan includes an active fan and a driven fan arranged coaxially. One side of the active fan is fixedly connected to the drive shaft of the drive motor, and a sliding shaft is coaxially fixedly mounted on the other side of the active fan. The driven fan is axially slidably connected to the sliding shaft. A meshing structure is also provided between the active fan and the driven fan to drive the driven fan to rotate. A reset structure is also provided between the sliding shaft and the driven fan to apply an axial preload force toward the active fan to the driven fan.

[0013] Preferably, when the active fan drives the driven fan to increase its speed to the point where the generated airflow aerodynamic pull is greater than the axial preload force generated by the reset structure on the driven fan, the driven fan moves away from the active fan along the sliding shaft and disengages the transmission connection of the meshing structure, causing the driven fan speed to decrease. When the driven fan speed decreases, the reset structure pushes the driven fan to move axially toward the active fan along the sliding shaft, causing the meshing structure to resume meshing transmission.

[0014] Preferably, the meshing structure includes meshing teeth and meshing sleeves. The meshing teeth are machined at the end of the driven fan facing the driving fan, and the meshing sleeves are correspondingly provided at the end of the driving fan facing the driven fan. The tooth tips of the meshing teeth are provided with arc-shaped guide chamfers, and the tooth groove inlet of the meshing sleeves is provided with guide cone surfaces.

[0015] Preferably, the reset structure includes a sliding groove and a limiting ring. The sliding groove is machined axially on the surface of the sliding shaft. The limiting ring is coaxially fixedly installed inside the shaft of the driven fan. The diameter of the limiting ring is smaller than the shaft diameter of the driven fan. The limiting ring is slidably connected to the sliding groove. An elastic structure is provided between the limiting ring and the sliding groove to generate a squeezing force on the limiting ring toward the direction of the driving fan.

[0016] Preferably, the elastic structure is a fixed magnetic ring. The fixed magnetic ring is coaxially fixedly installed on the end face of the sliding groove away from the active fan. The limiting ring is made of the same magnetic material as the magnetic pole of the fixed magnetic ring. When the limiting ring axially approaches the fixed magnetic ring, the fixed magnetic ring generates an axial repulsive force on the limiting ring, which slides towards the active fan.

[0017] Preferably, the elastic structure is a spring, and a spring is coaxially arranged between the sliding groove and the limiting ring. When the driven fan moves away from the driving fan axially, the limiting ring compresses the spring, and the spring generates an axial elastic force on the limiting ring to slide in the direction of the driving fan. The two ends of the spring are rotatably connected to the end face of the sliding groove and the end face of the limiting ring, respectively.

[0018] Preferably, the air inlet is also coaxially fitted with a detachable liquid collection ring for collecting colloids. When the colloids attached to the driven fan are detached by centrifugal force, they are thrown into the liquid collection ring. The liquid collection ring is machined with four or more sets of guide grooves along its circumference, and the liquid collection ring is in the shape of a frustum.

[0019] Preferably, the sleeve is made of stainless steel.

[0020] Preferably, an electrical interface is provided between the controller and the housing, the electrical interface is fixedly connected to the housing, and the electrical interface is electrically connected to the wiring inside the fixed cylinder.

[0021] Preferably, the controller is also fixedly provided with an expansion interface on its top.

[0022] (III) Beneficial Effects Compared with the prior art, the present invention provides a semiconductor-cooled mixing hose device, which has the following advantages: 1. This semiconductor-cooled mixing hose device, through the combined use of a semiconductor cooling chip structure and a magnetic base structure, achieves precise local temperature control for the actual reaction conditions of the colloid within the mixing hose compared to traditional technologies. This significantly reduces operating energy consumption compared to existing whole-area temperature control solutions. Furthermore, the cross-shaped heat-conducting plate design evenly distributes the heat of the colloid reaction transferred by the sleeve along the circumference and axial direction, ensuring heat conduction between the semiconductor cooling chip and the heat-conducting plate. This effectively eliminates local hot spots within the mixing hose, preventing premature cross-linking and curing of the colloid due to excessively high temperatures, and avoiding a sudden increase in viscosity. Simultaneously, the magnetic base installation method enables tool-free quick assembly and disassembly of the semiconductor cooling chip and its supporting heat dissipation structure, greatly reducing the difficulty of device replacement and daily cleaning and maintenance. The absence of additional fasteners effectively reduces the overall size of the device and avoids gaps caused by uneven fastener fastening. This ensures long-term heat dissipation stability while reducing production and maintenance costs.

[0023] 2. This semiconductor-cooled hybrid hose device, through the combined use of an active fan structure and a driven fan structure, simultaneously intercepts and processes adhesive mist in the intake airflow during the operation of the cooling fan. No additional power or filtration structures are required. Through the cooperation of the engagement and reset structures, the driven fan can complete a cyclical action of disengagement, deceleration, adhesive mist aggregation, reset, and engagement according to the speed changes of the drive motor. This achieves highly efficient adhesive mist aggregation and interception under high-speed conditions with large amounts of adhesive mist. The strong relative shear flow and annular vortex formed by the sudden drop in the driven fan speed allow adhesive mist particles that are difficult to capture in the airflow to collide and aggregate into droplets, greatly improving the adhesive mist capture efficiency. This effectively blocks the flow of adhesive mist particles towards the active fan, preventing adhesive mist from adhering to the active fan and heat sink, thus avoiding airflow blockage and reduced heat dissipation efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the semiconductor-cooled mixing hose device of the present invention; Figure 2 This is a front view of the semiconductor-cooled mixing hose device of the present invention; Figure 3 This is a partial cross-sectional view of the heat-conducting plate structure of the semiconductor-cooled hybrid hose device in this invention; Figure 4 This is an exploded view of the magnetic base structure and the outer shell structure of the semiconductor-cooled mixing hose device of the present invention; Figure 5 This is a schematic diagram of the magnetic base structure of the semiconductor cooling mixing hose device in this invention; Figure 6This is a schematic diagram of the heat-conducting plate structure of the semiconductor-cooled mixing hose device in this invention; Figure 7 This is a cross-sectional view of the magnetic base structure and the outer shell structure of the semiconductor cooling hybrid hose device of the present invention; Figure 8 This is a partial structural cross-sectional view of the cooling fan of the semiconductor-cooled hybrid hose device in this invention; Figure 9 This is a schematic diagram of the axial movement of the driven fan structure in the semiconductor cooling hybrid hose device of the present invention; Figure 10 This is a schematic diagram of the active fan structure of the semiconductor-cooled hybrid hose device in this invention; Figure 11 This is a schematic diagram of the driven fan structure of the semiconductor-cooled mixing hose device in this invention; Figure 12 This is a schematic diagram of the structure of Example 2.

[0025] In the diagram: 1. Sleeve; 11. Mixing hose; 2. Heat-conducting plate; 21. Vertical arm; 22. Horizontal arm; 23. Heat dissipation hole; 3. Semiconductor cooling chip; 4. Magnetic base; 41. Wiring fixing cylinder; 42. Heat sink; 43. Exhaust grille; 5. Outer shell; 51. Air inlet; 52. Support frame; 53. Power interface; 54. Cable tray; 55. Drive motor; 6. Cooling fan; 61. Active fan; 62. Sliding shaft; 621. Sliding groove; 622. Fixed magnetic ring; 63. Driven fan; 631. Limiting ring; 64. Engaging teeth; 65. Engaging sleeve; 66. Spring; 7. Controller; 8. Liquid collection ring; 81. Guide groove. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Example 1

[0028] Please see Figures 1-11A semiconductor-cooled hybrid tubing device 11 includes a sleeve 1 and a hybrid tubing 11 coaxially fixedly installed inside the sleeve 1. A cross-shaped heat-conducting plate 2 is fixedly connected to the sleeve 1 to evenly conduct heat from the sleeve 1. A semiconductor cooling chip 3 to reduce its temperature is magnetically mounted on the heat-conducting plate 2. A magnetic base 4 to attract the semiconductor cooling chip 3 to the heat-conducting plate 2 is fixedly connected to the heat-conducting plate 2. The cross-shaped heat-conducting plate 2 is integrally cast from a high thermal conductivity metal material and is fixedly connected to the sleeve 1 without gaps through an interference fit. The magnetic base 4 is made of the same high thermal conductivity metal material as the heat-conducting plate 2, and a permanent magnet is embedded inside the base. The end face of the magnetic base 4 that contacts the heat-conducting plate 2 is mirror-finished. The thermoelectric cooler 3 and the magnetic base 4 are bonded together with high thermal conductivity insulating silicone grease and then fixed together by riveting. A heat sink 42 to reduce the temperature of its heat dissipation end is also fixedly installed on the thermoelectric cooler 3. The heat absorption end of the thermoelectric cooler 3 is bonded to the heat conduction plate 2, and the heat dissipation end of the thermoelectric cooler 3 is bonded to the heat sink 42. Thermal conductive silicone grease is evenly coated between each bonding surface. The heat sink 42 is integrally formed using a high thermal conductivity metal material consistent with the magnetic base 4. The specific material of the heat sink 42 is aluminum or copper. The fins of the heat sink 42 are arranged parallel to the airflow direction, and a continuous air supply channel is formed between the fins. The bonding surfaces at both ends of the thermoelectric cooler 3 are flattened and precisely processed to be completely compatible with the bonding surfaces of the heat conduction plate 2 and the heat sink 42. The heat sink 42 is also equipped with a cooling fan 6 that delivers vertical downward airflow to it. The airflow direction of the cooling fan 6 is completely perpendicular to the fin arrangement direction of the heat sink 42, and the exhaust surface of the cooling fan 6 is directly facing the windward surface of the fins of the heat sink 42.

[0029] Please see Figures 1-11The magnetic base 4 is also fixedly connected to the outer shell 5. The heat sink 42 is fixedly set between the outer shell 5 and the magnetic base 4. A drive motor 55 is set between the outer shell 5 and the cooling fan 6. The drive motor 55 is fixedly connected to the outer shell 5. The outer shell 5 and the magnetic base 4 are fixedly connected by a snap-fit ​​structure evenly distributed in the circumference. After the outer shell 5 and the magnetic base 4 are spliced ​​together, a closed heat dissipation channel is formed. The heat sink 42 is completely wrapped inside the closed heat dissipation channel. The outer casing 5 has an air inlet 51 for mounting a cooling fan 6. A support frame 52 is provided below the air inlet 51. The drive motor 55 is coaxially mounted inside the air inlet 51 and fixedly connected to the support frame 52. The air inlet 51 is an annular opening structure that runs through the top end face of the outer casing 5. The opening area of ​​the air inlet 51 is larger than the windward area of ​​the cooling fan 6. The support frame 52 adopts a spoke structure and is evenly arranged along the circumference of the air inlet 51. The two ends of the support frame 52 are fixedly connected to the inner wall of the air inlet 51 and the outer wall of the drive motor 55, respectively. The spokes of the support frame 52 are streamlined along the airflow direction. Both sides of the magnetic base 4 are machined with exhaust grilles 43. The downward airflow generated by the cooling fan 6 on the heat sink 42 is discharged from the exhaust grilles 43 along both ends of the heat sink 42. The exhaust grilles 43 adopt multiple sets of parallel grille structures and are evenly arranged along the side wall of the magnetic base 4. The gap between the grilles corresponds to the airflow channel of the fins of the heat sink 42. The overall flow area of ​​the exhaust grilles 43 is not less than the opening area of ​​the air inlet 51. The arrangement direction of the grilles is adapted to the flow direction of the airflow.

[0030] Please see Figures 1-11The outer casing 5 has a power interface 53 embedded in its side. The magnetic base 4 has a wiring fixing cylinder 41. The outer casing 5 also has a wiring groove 54. The wiring groove 54 contains wires that connect the circuit inside the wiring fixing cylinder 41 to the power interface 53. The drive motor 55 is electrically connected to the wires inside the wiring groove 54. The wiring inside the wiring fixing cylinder 41 is connected to the semiconductor cooling chip 3. The power interface 53 adopts a Type-C interface structure with anti-detachment buckle. The interface and the outer casing 5 are fixed by interference fit with a sealing rubber ring. The wiring fixing cylinder 41 is a hollow cylindrical structure that extends vertically along the end face of the magnetic base 4. The inner wall of the cylinder has a slot structure for fixing the circuit. The wiring groove 54 is a closed groove structure that is processed in a closed loop along the inner wall of the outer casing 5. The opening of the groove is equipped with a removable wire pressing cover. All wires are high temperature resistant, flame retardant, and insulated sheathed wires. The connection ends of the wires and each component are fixed by cold pressing terminals and then insulated and sealed. Above the magnetic base 4 is a controller 7 that controls the power of the thermoelectric cooler 3 and the speed of the cooling fan 6. The controller 7 is connected to the wiring inside the wiring fixing tube 41. The controller 7 adopts an integrated PCB control board structure and is fixedly installed on the upper surface of the magnetic base 4 by a snap-fit ​​structure. The outer side of the controller 7 is provided with a protective shell that snaps into the outer shell 5. A sealing buffer pad is provided between the protective shell and the magnetic base 4. The signal input terminal of the controller 7 is connected to the wiring of the power interface 53, and the control output terminal is connected to the thermoelectric cooler 3 and the drive motor 55 respectively through the wiring inside the wiring fixing tube 41. The controller 7 integrates a temperature acquisition module and a speed adjustment module, which can acquire the temperature signals of the thermoelectric cooler 3 and the heat conduction plate 2 in real time. The controller 7 is controlled by a touch switch. The cross structure of the heat-conducting plate 2 includes an integrally set vertical arm 21 and a horizontal arm 22. The vertical arm 21 and the horizontal arm 22 are arranged perpendicularly to each other, and the magnetic base 4 is magnetically connected to the intersection of the vertical arm 21 and the horizontal arm 22. The upper and lower end faces of the magnetic base 4 are parallel to the horizontal arm 22. The intersection of the vertical arm 21 and the horizontal arm 22 is thickened with a rounded transition. The end face at the intersection is precision machined with a mirror flatness. The magnetic contact end face of the magnetic base 4 is fully in contact with the flat end face at the intersection. The magnetic coverage of the magnetic base 4 completely covers the joint area of ​​the horizontal arm 22 and the vertical arm 21 at the intersection. The vertical arm 21 is machined with heat dissipation holes 23 to uniformly conduct the surface temperature of the sleeve 1 to the heat conduction plate 2. The sleeve 1 and the heat dissipation holes 23 are coaxially fixedly connected. The heat dissipation holes 23 are circular through holes that extend along the axial direction of the vertical arm 21. The inner wall of the heat dissipation holes 23 is mirror rolled. The inner diameter of the heat dissipation holes 23 is perfectly matched with the outer diameter of the sleeve 1. The outer wall of the sleeve 1 and the inner wall of the heat dissipation holes 23 are filled with heat conduction adhesive and then fixed by interference fit.The distance between the upper and lower end faces of the horizontal arm 22 is greater than the distance between the left and right end faces of the vertical arm 21. Both the upper and lower end faces of the horizontal arm 22 are flat and smooth planar structures. The vertical distance between the two end faces is the overall thickness of the horizontal arm 22. The vertical distance between the left and right side end faces of the vertical arm 21 is the overall width of the vertical arm 21. The surface area of ​​the two end faces of the horizontal arm 22 is greater than the surface area of ​​the side end faces of the vertical arm 21. The end faces of the horizontal arm 22 completely cover the heat-absorbing end contact area of ​​the semiconductor cooling chip 3.

[0031] Please see Figures 1-11 The sleeve 1 is made of stainless steel and is integrally stretched and formed from stainless steel. Both the inner and outer walls of the sleeve 1 are mirror-polished, and the wall thickness of the sleeve 1 is uniform. Both ends are machined with annular boss structures for limiting movement. An electrical interface is provided between the controller 7 and the housing 5. The electrical interface is fixedly connected to the housing 5 and electrically connected to the wiring inside the fixed cylinder. The electrical interface adopts an industrial-grade plug-in interface with a locking structure. The interface body is fastened to the end face of the housing 5 with screws through a flange. The plug end of the interface faces the outside of the housing 5, and the wiring end faces the inside of the housing 5. The wiring end is fixedly connected to the wiring led out from inside the fixed cylinder by welding. The weld is sealed with insulating heat shrink tubing for protection. The plug end of the interface is equipped with a flip-up dustproof sealing cap. The top of the controller 7 is also fixed with an expansion interface. The expansion interface adopts a multi-pin standardized ribbon cable interface. The interface body is fixed to the PCB board of the controller 7 by surface mounting. The pins of the interface correspond to the functional channels of temperature signal acquisition, external sensor connection, and linkage control. The outer side of the interface is provided with a limit slot integrally formed with the protective shell of the controller 7.

[0032] Please see Figures 1-11The cooling fan 6 includes an active fan 61 and a driven fan 63 coaxially arranged. One side of the active fan 61 is fixedly connected to the drive shaft of the drive motor 55, and the other side of the active fan 61 is also coaxially fixedly mounted with a sliding shaft 62. The driven fan 63 is axially slidably connected to the sliding shaft 62. Both the active fan 61 and the driven fan 63 adopt an axial flow fan structure. The hub center of the active fan 61 is machined with a shaft hole that is interference-fitted with the drive shaft. After the drive shaft is inserted into the shaft hole, it is double-fixed in both the circumferential and axial directions by a flat key and a locking nut. The sliding shaft 62 is a high-precision optical shaft with a mirror-polished surface. One end of the sliding shaft 62 is coaxially fastened to the hub center of the active fan 61. The axis of the sliding shaft 62 is completely coincident with the axis of the drive shaft of the drive motor 55. The hub center of the driven fan 63 is machined with a sliding through hole that matches the outer diameter of the sliding shaft 62. The inner wall of the sliding through hole is inlaid with a self-lubricating graphite bushing, and the inner wall of the self-lubricating graphite bushing is clearance-fitted with the surface of the sliding shaft 62. A meshing structure is provided between the active fan 61 and the driven fan 63, which drives the driven fan 63 to rotate via the active fan 61. A reset structure is provided between the sliding shaft 62 and the driven fan 63, which applies an axial preload force to the driven fan 63 towards the active fan 61. Both the meshing structure and the reset structure are coaxially arranged along the axis of the drive shaft. The meshing transmission end face of the meshing structure is completely perpendicular to the axis of the drive shaft, and the force direction of the reset structure is completely parallel to the axis of the drive shaft. When the speed of the driven fan 63 driven by the active fan 61 increases to the point that the aerodynamic pull of the airflow generated is greater than the axial preload force generated by the reset structure on the driven fan 63, the driven fan 63 moves away from the active fan 61 along the sliding shaft 62 and disengages the transmission connection of the meshing structure, causing the speed of the driven fan 63 to decrease. When the speed of the driven fan 63 decreases, the reset structure pushes the driven fan 63 to move axially towards the active fan 61 along the sliding shaft 62, restoring the meshing transmission.

[0033] Please see Figures 1-11 The meshing structure includes meshing teeth 64 and meshing sleeve 65. The meshing teeth 64 are machined on the end of the driven fan 63 facing the driving fan 61, and the meshing sleeve 65 is correspondingly provided on the end of the driving fan 61 facing the driven fan 63. The tooth tips of the meshing teeth 64 are provided with arc-shaped guide chamfers, and the tooth groove inlet of the meshing sleeve 65 is provided with guide cone surfaces. The meshing teeth 64 are evenly distributed circumferentially along the end face of the hub of the driven fan 63, and the tooth grooves of the meshing sleeve 65 are along the end face of the hub of the driving fan 61. The meshing teeth 64 are evenly distributed circumferentially, and the number of meshing teeth 64 is exactly the same as the number of tooth grooves of meshing sleeve 65. The tooth profile of meshing teeth 64 is perfectly matched with the tooth groove shape of meshing sleeve 65. The torque bearing surface of meshing teeth 64 is completely perpendicular to the axis of the drive shaft. The arc guide chamfer is continuously set along the tooth tip of meshing teeth 64. The guide cone surface is flared along the circumferential direction of the entrance of tooth groove of meshing sleeve 65. The meshing contact surfaces of meshing teeth 64 and meshing sleeve 65 are all hardened and wear-resistant.

[0034] Please see Figures 1-11 The reset structure includes a sliding groove 621 and a limiting ring 631. The sliding groove 621 is machined axially on the surface of the sliding shaft 62. The limiting ring 631 is coaxially fixedly installed inside the shaft of the driven fan 63. The diameter of the limiting ring 631 is smaller than the shaft diameter of the driven fan 63. The limiting ring 631 and the sliding groove 621 are slidably connected. An elastic structure is provided between the limiting ring 631 and the sliding groove 621 to generate a squeezing force on the limiting ring 631 in the direction of the driving fan 61. The sliding groove 621 is an annular through groove structure extending axially along the sliding shaft 62. The inner walls on both sides of the groove are smooth and wear-resistant. The limiting ring 631 adopts an integrally formed annular metal structure. The outer ring surface of the limiting ring 631 is press-fitted to the inner wall of the sliding through hole of the driven fan 63 hub. The inner ring surface of the limiting ring 631 forms a sliding fit with the sliding groove 621. The elastic structure consists of a fixed magnetic ring 622. The fixed magnetic ring 622 is coaxially fixed to the end face of the sliding groove 621 away from the active fan 61. The limiting ring 631 is made of the same magnetic material as the fixed magnetic ring 622. Specifically, the fixed magnetic ring 622 is a sintered neodymium iron boron rare earth permanent magnet. The outer diameter of the fixed magnetic ring 622 matches the width of the sliding groove 621. It is coaxially bonded to the end face of the sliding groove 621 using anaerobic adhesive. The end face of the fixed magnetic ring 622 facing the limiting ring 631 is magnetized, with the entire end face having a single magnetic pole. The limiting ring 631... 1. The entire structure is integrally sintered from a permanent magnet material with the same magnetic pole as the fixed magnetic ring 622. The end faces of the limiting ring 631 and the fixed magnetic ring 622 have the same magnetic poles and are coaxially opposed. The minimum axial distance between the fixed magnetic ring 622 and the limiting ring 631 is not less than the maximum design sliding stroke of the driven fan 63. When the limiting ring 631 approaches the fixed magnetic ring 622 axially, the fixed magnetic ring 622 generates an axial repulsive force on the limiting ring 631 that slides towards the active fan 61. The sliding groove 621 can limit the axial sliding distance of the driven fan 63.

[0035] Please see Figures 1-11 The air inlet 51 is also coaxially fitted with a detachable liquid collection ring 8 for collecting colloids. When the colloids attached to the driven fan 63 are detached by centrifugal force, they are thrown into the liquid collection ring 8. The liquid collection ring 8 has four or more sets of guide grooves 81 machined along its circumference, and the liquid collection ring 8 is truncated cone-shaped. The liquid collection ring 8 is made of transparent high-temperature resistant engineering plastic and is integrally injection molded. The small diameter end of the liquid collection ring 8 is detachably snapped and fixed to the inner wall of the air inlet 51 by elastic buckles evenly distributed around the circumference. The large-diameter end of the liquid collecting ring 8 extends toward the driven fan 63. The inner wall of the liquid collecting ring 8 forms a guide slope that is inclined toward the outside of the air inlet 51. The guide groove 81 is uniformly processed along the circumference of the inner wall of the liquid collecting ring 8. The direction of the guide groove 81 is adapted to the centrifugal glue-throwing direction generated by the rotation of the driven fan 63. The inner diameter of the large-diameter end of the liquid collecting ring 8 is larger than the outer diameter of the blade of the driven fan 63. After the colloid is collected in the liquid collecting ring 8, it can be disassembled from the air inlet 51 for separate cleaning.

[0036] Please see Figures 1-11 During device operation, the controller 7 adjusts the cooling power of the thermoelectric cooler 3 and the speed of the drive motor 55 in real time according to the temperature of the colloid inside the mixing tube 11. When the reaction heat generated by the cross-linking of the two-component colloid inside the mixing tube 11 is generated, the heat is conducted to the sleeve 1, and then evenly transferred to the cross-shaped heat-conducting plate 2 through the circumferential wall of the sleeve 1. The horizontal arm 22 and the vertical arm 21 of the cross-shaped heat-conducting plate 2 are perpendicularly intersected, which can evenly distribute the heat of the sleeve 1 along the circumference and axial direction. At the same time, since the distance between the upper and lower end faces of the horizontal arm 22 is greater than the distance between the left and right end faces of the vertical arm 21, it can provide a larger bonding area for the thermoelectric cooler 3, which is magnetically installed at the intersection of the cross-shaped heat-conducting plate 2, to ensure the bonding stability and heat conduction efficiency of the thermoelectric cooler 3. The cooling energy generated by the thermoelectric cooler 3 is evenly transferred to the sleeve 1 and the mixing tube 11 through the heat-conducting plate 2, controlling the temperature of the colloid inside the mixing tube 11 within the set range, and preventing the colloid from prematurely cross-linking and curing due to excessive temperature, thus preventing blockage of the mixing tube 11. In this design, the heat-absorbing end of the thermoelectric cooler 3 is attached to the heat-conducting plate 2, while the heat-releasing end is tightly attached to the heat sink 42. When the thermoelectric cooler 3 is powered on, the heat-absorbing end continuously absorbs the heat transferred from the heat-conducting plate 2, and then transfers the heat to the heat sink 42 through the heat-releasing end. Then, the cooling fan 6 is driven by the drive motor 55 to generate vertical downward airflow towards the heat sink 42, which carries away the heat on the heat sink 42 and then exhausts it from the exhaust grilles 43 on both sides, thereby achieving heat dissipation of the heat-releasing end of the thermoelectric cooler 3 and ensuring the cooling efficiency of the thermoelectric cooler 3. Furthermore, this device uses a magnetic base 4 to attach the semiconductor cooling chip 3 to the heat-conducting plate 2. The magnetic attraction between the magnetic base 4 and the heat-conducting plate 2 enables quick and fast fixing without fasteners. The magnetic installation method allows for flexible adjustment of the magnetic base 4's position on the cross-shaped heat-conducting plate 2, adapting to the structure of the sleeve 1 and heat-conducting plate 2 for different diameter mixed tubing 11. During routine maintenance, the entire device can be removed from the heat-conducting plate 2 for cleaning, significantly reducing the difficulty of disassembly and maintenance. Simultaneously, the magnetic installation eliminates the need for additional bolts, clips, or other fixing structures, effectively reducing the overall size of the device. The magnetic attraction ensures a tight fit between the semiconductor cooling chip 3 and the heat-conducting plate 2 and heat sink 42, effectively reducing contact thermal resistance to ensure stable heat dissipation and avoiding gaps caused by uneven fastener fastening. This also reduces the overall production and maintenance costs of the device.

[0037] Please see Figures 1-11In actual dispensing processes, adhesive mist is generated, which is drawn in by the cooling fan 6 and adheres to the device surface, reducing heat dissipation efficiency and affecting the device's lifespan. This application, however, effectively reduces the adhesive mist content in the gas drawn into the heat sink 42 through the active fan 61 and the driven fan 63, thereby significantly reducing adhesive adhesion within the device. During operation, the driven fan 63 engages with the engaging sleeve 65 on the driving fan 61 via the engaging teeth 64 and rotates synchronously with the driving fan 61, with the speed gradually increasing. When the axial aerodynamic pull of the airflow generated during the rotation of the driven fan 63 is less than the axial repulsive force of the fixed magnetic ring 622 on the limiting ring 631, the engaging teeth 64 and the engaging sleeve 65 maintain stable engagement. As the driving fan 61 drives the driven fan 63 to gradually increase its speed, the axial aerodynamic pull of the airflow on the driven fan 63 increases exponentially with the square of the speed. When the speed increases to the point where the generated axial aerodynamic pull is greater than the axial repulsive force of the fixed magnetic ring 622 on the limiting ring 631, the aerodynamic pull generated by the driven fan 63 overcomes the axial repulsive force of the fixed magnetic ring 622, causing the driven fan 63 to move away from the driving fan 61 along the sliding shaft 62, thereby causing the engaging teeth 64 to engage more rapidly. 4. Disengagement transmission between the driven fan 63 and the meshing sleeve 65. When the driven fan 63 loses the drive of the active fan 61, it will rapidly decrease in speed due to inertia. At this time, the active fan 61 will still rotate at high speed, and the intake airflow will still flow downward at high speed. This will form a strong relative shear flow between the driven fan 63 blades and the fan 63 blades, thereby inducing a pulsating flow field with high turbulence. This will cause a significant velocity gradient and inertia difference in the atomized particles of different sizes in the airflow, greatly increasing the probability of atomized particle collision. This will cause the atomized particles to collide violently and coalesce into large droplets that are easy to separate from the airflow. At the same time, the transient flow field change caused by the sudden drop in speed will generate a stable closed annular vortex ring in the flow channel. The circumferential rotation suction force of the vortex ring can wrap and intercept the atomized particles, thereby blocking most of the generated droplets from flowing towards the active fan 61. This will allow the atomized particles to fully adhere to the blade surface of the driven fan 63 and complete the initial capture.When the driven fan 63's speed decreases, the aerodynamic pull generated by the airflow on it decreases exponentially. The axial repulsive force of the fixed magnetic ring 622 on the limiting ring 631 pushes the driven fan 63 to move axially toward the driving fan 61 along the sliding shaft 62. This causes the meshing teeth 64 to re-engage with the meshing sleeve 65. Furthermore, the arc-shaped guide chamfer at the tip of the meshing teeth 64 matches the guide cone surface at the tooth groove entrance of the meshing sleeve 65, guiding the driven fan 63 to produce circumferential adaptive rotation. This allows the meshing teeth 64 to engage into the rotating tooth groove of the meshing sleeve 65, restoring the meshing structure and transmission. The driven fan 63 then re-rotates synchronously with the driving fan 61 at high speed, instantly jumping from a low-speed inertial rotation state to a high-speed rotation state matching the driving fan 61. The sudden change causes the adhesive droplets adhering to the surface of the driven fan 63 blades to be subjected to a strong centrifugal force proportional to the square of the rotational speed. This centrifugal force causes the adhesive droplets to quickly overcome the adhesion between the adhesive droplets and the surface of the driven fan 63 blades, and to be continuously thrown outward along the radial direction of the driven fan 63 blades, completely detaching from the downward mainstream intake airflow field, and finally falling into the liquid collection ring 8 coaxially mounted at the air inlet 51, completing the final interception and collection of adhesive mist. This effectively avoids the problem of adhesive mist adhering to the active fan 61 and the heat sink 42, causing airflow blockage and reduced heat dissipation efficiency. As the speed of the drive motor 55 changes, the driven fan 63 repeats the above-mentioned cycle of disengagement, deceleration, coalescence, reset, and engagement, realizing an adhesive mist interception function that is adaptive to the dispensing conditions.

[0038] Example 2

[0039] Please see Figure 12 The elastic structure is a spring 66. A spring 66 is coaxially arranged between the sliding groove 621 and the limiting ring 631. When the driven fan 63 moves away from the driving fan 61 axially, the limiting ring 631 compresses the spring 66. The spring 66 generates an axial elastic force on the limiting ring 631, causing it to slide towards the driving fan 61. The spring 66 is a cylindrical helical compression spring. The outer diameter of the spring 66 is clearance-fitted with the groove width of the sliding groove 621. The inner diameter of the spring 66 is larger than the shaft diameter of the sliding shaft 62. Rotary connecting seats are respectively provided at both ends of the spring 66. The rotating connecting seats are respectively connected to the end face of the sliding groove 621 and the end face of the limiting ring 631 through bearings to achieve relative circumferential rotation. The two ends of the spring 66 are respectively welded and fixed to the end face of the rotating connecting seats. The free length of the spring 66 is greater than the effective axial length of the sliding groove 621. When the driven fan 63 is in the meshing state, the spring 66 is in a slightly compressed pre-tightened state.

[0040] Please see Figure 12In this embodiment, the elastic structure of the reset structure adopts a spring 66. When the device is running, in the initial state and when the active fan 61 drives the driven fan 63 at a low speed, the spring 66 is in a naturally extended or slightly compressed state, continuously applying an axial preload elastic force to the limiting ring 631 in the direction of the active fan 61. As the drive motor 55 rotates, the active fan 61 drives the driven fan 63 to increase its speed synchronously. The axial aerodynamic pull of the airflow on the driven fan 63 increases exponentially with the square of the speed. When the speed increases to a set threshold, the axial aerodynamic pull of the airflow on the driven fan 63 overcomes the axial preload elastic force of the spring 66, causing the driven fan 63 to move away axially along the sliding shaft 62. The active fan 61, with its limiting ring 631 fixed within the shaft of the driven fan 63, slides synchronously along the sliding groove 621 with the driven fan 63, compressing the spring 66 to store elastic potential energy. Simultaneously, the meshing teeth 64 on the driven fan 63 disengage from the meshing sleeve 65 on the active fan 61, disengaging the transmission connection of the meshing structure. When the driven fan 63 loses the torque drive of the active fan 61, it rotates solely due to its own inertia, causing its speed to rapidly decrease. Meanwhile, the active fan 61 maintains a stable high-speed rotation, continuously driving the intake airflow to maintain a downward high-speed flow. A strong relative shear flow is formed between the high-speed mainstream airflow and the rapidly decreasing speed blades of the driven fan 63, inducing a highly turbulent pulsating flow field. This causes the ultrafine aerosol particles in the airflow to collide and coalesce violently into easily separable large droplets. Simultaneously, the annular vortex formed within the flow channel encapsulates and intercepts the aerosol particles, ensuring they adhere fully to the surface of the driven fan 63's blades. As the driven fan 63's speed rapidly decreases, the axial aerodynamic pull exerted on it by the airflow decreases exponentially with the decrease in speed. When the aerodynamic pull is less than the axial elastic force applied by the spring 66, the compressed spring 66 releases its stored elastic potential energy, pushing the limiting ring 631 to slide along the sliding groove 621 towards the driving fan 61. This, in turn, causes the driven fan 63 to move synchronously along the sliding shaft 62 towards the driving fan 61, allowing the meshing teeth 64 on the driven fan 63 to engage with the driving fan... The engagement sleeve 65 on the fan 61 re-engages, and the arc-shaped guide chamfer at the tip of the engagement tooth 64 cooperates with the guide cone surface at the inlet of the engagement sleeve 65, guiding the driven fan 63 to generate a slight circumferential adaptive rotation, so that the engagement tooth 64 smoothly engages in the groove of the engagement sleeve 65. The engagement structure restores stable engagement transmission, and the driven fan 63 rotates synchronously with the active fan 61 at high speed. The strong centrifugal force generated by the instantaneous increase in speed overcomes the adhesion force between the adhesive mist droplets and the fan blade surface, and throws the adhesive mist droplets that have gathered on the fan blade surface of the driven fan 63 radially outward, so that they completely break away from the downward mainstream intake airflow field and finally fall into the liquid collection ring 8 coaxially assembled at the air inlet 51 to complete the final interception and collection of adhesive mist.Compared to the fixed magnetic ring 622 in Example 1, the spring 66 in Example 2 provides a stable and linearly controllable axial preload elastic force for the engagement and disengagement of the driven fan 63. This ensures that the trigger speed threshold for the disengagement and reset actions of the driven fan 63 remains accurate and flexibly adjustable. Simply replacing the spring 66 with one of different elastic coefficients can adapt to the dispensing conditions and adhesive mist characteristics of two-component colloids with different viscosities and solid contents, greatly expanding the adaptability range of the device. This avoids the problems of difficulty in adjusting the speed threshold and insufficient adaptability caused by the nonlinear change of magnetic repulsion in the fixed magnetic ring 622 scheme. At the same time, the spring 66 is a general-purpose standardized mechanical part, and commercially available finished parts can be directly selected without the need for customized mold opening and magnetic pole matching design, which greatly reduces the production and manufacturing costs of the device and the subsequent maintenance costs. During subsequent maintenance and replacement, there is no need to consider installation requirements such as installation gaps and magnetic pole correspondence; maintenance can be completed by direct replacement.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor-cooled mixing hose (11) device, comprising a sleeve (1) and a mixing hose (11) coaxially fixedly installed within the sleeve (1), characterized in that: A cross-shaped heat-conducting plate (2) is fixedly connected to the sleeve (1) to uniformly conduct the heat of the sleeve (1). A semiconductor refrigeration chip (3) is magnetically installed on the heat-conducting plate (2) to reduce its temperature. A magnetic base (4) is fixedly connected to the semiconductor refrigeration chip (3) to attract it to the heat-conducting plate (2). A heat sink (42) is also fixedly installed on the semiconductor refrigeration chip (3) to reduce the temperature of its heat-dissipating end. The heat-absorbing end of the semiconductor refrigeration chip (3) is in contact with the heat-conducting plate (2), and the heat-dissipating end of the semiconductor refrigeration chip (3) is in contact with the heat sink (42). A cooling fan (6) is also provided on the heat sink (42) to generate vertical downward airflow towards it. The magnetic base (4) is also fixedly connected to the outer shell (5), and a drive motor (55) is provided between the outer shell (5) and the cooling fan (6). The cooling fan (6) includes an active fan (61) and a driven fan (63) arranged coaxially. One side of the active fan (61) is fixedly connected to the drive shaft of the drive motor (55). A sliding shaft (62) is also fixedly installed coaxially on the other side of the active fan (61). The driven fan (63) is axially slidably connected to the sliding shaft (62). A meshing structure is also provided between the active fan (61) and the driven fan (63) to drive the driven fan (63) to rotate. A reset structure is also provided between the sliding shaft (62) and the driven fan (63) to apply an axial preload force toward the active fan (61).

2. The semiconductor-cooled mixing hose (11) device according to claim 1, characterized in that: The heat sink (42) is fixedly disposed between the outer shell (5) and the magnetic base (4), and the drive motor (55) is fixedly connected to the outer shell (5).

3. The semiconductor-cooled mixing hose (11) device according to claim 2, characterized in that: The outer casing (5) is provided with an air inlet (51) for mounting the cooling fan (6). A support frame (52) is provided below the air inlet (51). The drive motor (55) is coaxially arranged inside the air inlet (51) and fixedly connected to the support frame (52). Both sides of the magnetic base (4) are processed with exhaust grilles (43). The downward airflow generated by the cooling fan (6) on the heat sink (42) is discharged from the exhaust grilles (43) along both ends of the heat sink (42).

4. The semiconductor-cooled mixing hose (11) device according to claim 2, characterized in that: A power interface (53) is embedded in the side of the outer shell (5). A wiring fixing cylinder (41) is provided on the magnetic base (4). A wiring groove (54) is also processed inside the outer shell (5). A wire is provided in the wiring groove (54) to connect the circuit inside the wiring fixing cylinder (41) to the power interface (53). The drive motor (55) is electrically connected to the wire inside the wiring groove (54). The wiring inside the wiring fixing cylinder (41) is connected to the semiconductor cooling chip (3). A controller (7) for controlling the power of the semiconductor cooling chip (3) and the cooling fan (6) is also installed above the magnetic base (4). The controller (7) is connected to the wiring inside the wiring fixing cylinder (41).

5. The semiconductor-cooled mixing hose (11) device according to claim 1, characterized in that: The cross structure of the heat-conducting plate (2) includes an integrally formed vertical arm (21) and a horizontal arm (22). The vertical arm (21) and the horizontal arm (22) are perpendicularly intersecting each other, and the magnetic base (4) is magnetically connected to the intersection of the vertical arm (21) and the horizontal arm (22). The upper and lower end faces of the magnetic base (4) are parallel to the horizontal arm (22). The vertical arm (21) is machined with heat-spreading holes (23) that uniformly conduct the surface temperature of the sleeve (1) to the heat-conducting plate (2). The sleeve (1) and the heat-spreading holes (23) are coaxially fixedly connected. The distance between the upper and lower end faces of the horizontal arm (22) is greater than the distance between the left and right end faces of the vertical arm (21).

6. The semiconductor-cooled mixing hose (11) device according to claim 1, characterized in that: The meshing structure includes meshing teeth (64) and meshing sleeve (65). The meshing teeth (64) are machined on one end of the driven fan (63) facing the active fan (61). The meshing sleeve (65) is correspondingly provided on one end of the active fan (61) facing the driven fan (63). The tooth tip of the meshing teeth (64) is provided with a rounded guide chamfer, and the tooth groove inlet of the meshing sleeve (65) is provided with a guide cone surface.

7. The semiconductor-cooled mixing hose (11) device according to claim 1, characterized in that: The reset structure includes a sliding groove (621) and a limiting ring (631). The sliding groove (621) is machined axially on the surface of the sliding shaft (62). The limiting ring (631) is coaxially fixedly installed inside the shaft of the driven fan (63). The diameter of the limiting ring (631) is smaller than the shaft diameter of the driven fan (63). The limiting ring (631) is slidably connected to the sliding groove (621). An elastic structure is provided between the limiting ring (631) and the sliding groove (621) to generate a squeezing force on the limiting ring (631) toward the driving fan (61).

8. The semiconductor-cooled mixing hose (11) device according to claim 7, characterized in that: The elastic structure is a fixed magnetic ring (622). The fixed magnetic ring (622) is coaxially fixedly installed on the end face of the sliding groove (621) away from the active fan (61). The limiting ring (631) is made of the same magnetic material as the magnetic pole of the fixed magnetic ring (622). When the limiting ring (631) approaches the fixed magnetic ring (622) axially, the fixed magnetic ring (622) generates an axial repulsive force on the limiting ring (631) to slide in the direction of the active fan (61).

9. A semiconductor-cooled mixing hose (11) device according to claim 3, characterized in that: The air inlet (51) is also coaxially fitted with a detachable liquid collection ring (8) for collecting colloids.

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