Cleaning device and cleaning method for electrically conductive rings in plating jigs

Abstract

This disclosure provides a cleaning device and method for a conductive ring in an electroplating fixture. The cleaning device includes a support structure, an image processing module, an image acquisition module and a cleaning structure communicatively connected to the image processing module. The support structure supports the conductive ring. The image acquisition module acquires image data of the electroplated surface of the conductive ring after electroplating and sends it to the image processing module. The image processing module generates a matching target cleaning command based on the image data to drive the cleaning structure to perform a corresponding cleaning operation on the conductive ring. This method can automatically detect the cleanliness of the electroplated surface of the conductive ring after electroplating, automatically identify and analyze stain characteristics, eliminate the need for manual subjective inspection, achieve high detection accuracy, shorten detection time, and improve detection efficiency. Furthermore, based on the detection results, a control algorithm is used to select cleaning process parameters online and control the completion of the cleaning process, further improving cleaning efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of wafer electroplating, and in particular to a cleaning device and method for a conductive ring in an electroplating fixture. Background Technology

[0002] The cleanliness of the conductive contact components of a wafer plating fixture, especially the surface of the conductive rings, is crucial to the plating capability of the equipment. Poor surface cleanliness of the conductive rings can lead to contaminants and impurities adhering to them, resulting in increased contact resistance, decreased conductivity (contaminants hinder smooth current transmission), poor plating quality (unclean surfaces cause plating defects), plating detachment from the substrate plating interface, and increased equipment failure risk (long-term contamination can damage conductive contact components, increasing the likelihood of equipment malfunction). Therefore, ensuring the cleanliness of the conductive ring surface is a key factor in ensuring good plating capability.

[0003] Traditional detection methods typically include visual and optical inspection, wetting method, and talc method. Among the detection techniques mentioned above, visual and optical inspection is simple but highly subjective in the conductive ring electroplating process; wetting method is fast but may not be accurate in judging oxide film; talc method is intuitive but has limited applicability; and copper replacement method is accurate in detecting oil stains but is only applicable to ferrous metal plating layers and is cumbersome. Furthermore, in the subsequent cleaning process, it is necessary to manually confirm the stains before preparing the cleaning solution for cleaning. Summary of the Invention

[0004] The technical problem to be solved by this disclosure is to overcome the shortcomings of the prior art, such as the difficulty in judging the contamination of conductive rings in electroplating fixtures and the troublesome cleaning process, and to provide a cleaning device and cleaning method for conductive rings in electroplating fixtures.

[0005] This disclosure solves the above-mentioned technical problems through the following technical solution:

[0006] In a first aspect, a cleaning device for a conductive ring in an electroplating fixture is provided. The cleaning device includes a support structure, an image processing module, an image acquisition module and a cleaning structure that are communicatively connected to the image processing module.

[0007] The support structure is used to support the conductive ring;

[0008] The image acquisition module is used to acquire image data of the electroplated surface of the conductive ring after electroplating and send it to the image processing module;

[0009] The image processing module is used to generate a matching target cleaning instruction based on the image data, so as to drive the cleaning structure to perform a corresponding cleaning operation on the conductive ring.

[0010] Optionally, the image acquisition module includes a first image acquisition unit, a second image acquisition unit, and a switching switch. The switching switch is electrically connected to the image processing module, the first image acquisition unit, and the second image acquisition unit, respectively. The image magnification of the first image acquisition unit is less than that of the second image acquisition unit.

[0011] The image processing module is used to control the switching switch to connect to the first image acquisition device in order to acquire the first image data of the electroplated surface of the conductive ring after electroplating.

[0012] The image processing module is also used to determine the stain location information based on the first image data, and control the switch to switch to the second image acquisition device to acquire the second image data at the location of the stain location information.

[0013] The image processing module is further configured to generate a matching target cleaning instruction based on the second image data, so as to drive the cleaning structure to perform a corresponding cleaning operation on the conductive ring.

[0014] Optionally, the image processing module is further configured to determine the stain features at the corresponding location based on the second image data, determine the stain type based on the stain features, determine a cleaning process matching the stain type, and generate a corresponding target cleaning instruction.

[0015] Optionally, the support structure includes a fixing member for fixing the conductive ring;

[0016] Optionally, the support structure includes a fixed component and a movable component for structural connection. The fixed component is used to fix the conductive ring, and the movable component is used to drive the fixed component to rotate and move to different positions.

[0017] Optionally, the cleaning device further includes a supplementary lighting structure, which is located at a predetermined position away from the conductive ring;

[0018] The supplementary lighting structure is used to supplement the light of the conductive ring in order to provide a light source to the image acquisition module.

[0019] Optionally, the cleaning structure includes a cleaning controller communicatively connected to the image processing module, a cleaning nozzle communicatively connected to the cleaning controller, and several mixing components connected to the cleaning nozzle and providing different cleaning components;

[0020] The cleaning controller is used to receive the target cleaning command sent by the image processing module;

[0021] The cleaning controller is also used to determine the matching combination of the mixing components according to the target cleaning instruction, and control the ratio and / or dosage of the cleaning components output by the corresponding mixing components, so as to prepare a cleaning solution that matches the target cleaning instruction and output it to the cleaning nozzle.

[0022] The cleaning controller is also used to control the cleaning nozzle to perform corresponding cleaning operations on the conductive ring according to the cleaning solution.

[0023] Optionally, the cleaning controller is further configured to drive and adjust the incident angle and / or height of the cleaning nozzle according to the target cleaning command;

[0024] Optionally, the distance between the cleaning nozzle and the conductive ring can be adjusted;

[0025] Optionally, the flow rate of the cleaning solution sprayed by the cleaning nozzle can be adjusted;

[0026] Optionally, the flow rate of the rinsing purified water sprayed from the cleaning nozzle can be adjusted;

[0027] Optionally, the flow rate of the desiccant sprayed by the cleaning nozzle can be adjusted;

[0028] Optionally, the step-by-step time of the cleaning nozzle can be adjusted.

[0029] Optionally, the cleaning device further includes a display;

[0030] The display is used to show the working status data of the image acquisition module and / or the cleaning structure.

[0031] Optionally, the first image acquisition device is a magnifying glass;

[0032] Optionally, the second image acquisition device is a microscope.

[0033] Secondly, a method for cleaning conductive rings in an electroplating fixture is provided, wherein the cleaning method is implemented using the cleaning apparatus described above, and the cleaning method includes:

[0034] Image data of the electroplated surface of the conductive ring after electroplating was acquired;

[0035] Based on the image data, generate matching target cleaning instructions;

[0036] In response to the target cleaning command, the cleaning structure in the cleaning device is driven to perform a corresponding cleaning operation on the conductive ring.

[0037] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of this disclosure.

[0038] The positive advancements of this disclosure are as follows: It integrates optical detection, image processing, and cleaning control into one unit, enabling automatic detection of the cleanliness of the electroplated surface of conductive rings after electroplating. It can automatically identify and analyze stain characteristics, eliminating the need for manual subjective inspection, achieving high detection accuracy, shortening inspection time, improving inspection efficiency, and meeting production needs. Furthermore, based on the detection results, it uses a control algorithm to select cleaning process parameters online and control the completion of the cleaning process, greatly improving cleaning efficiency. It is applicable to various conductive ring materials and surface conditions, rather than being limited to certain situations, thus having a wide range of applications and effectively overcoming the limitations of existing technologies. Attached Figure Description

[0039] Figure 1 A schematic diagram of a cleaning device for a conductive ring in an electroplating fixture, provided as an exemplary embodiment of this disclosure;

[0040] Figure 2 A schematic diagram of the structure of an image acquisition module provided in an exemplary embodiment of this disclosure;

[0041] Figure 3 A flowchart illustrating a cleaning method for a conductive ring in an electroplating fixture, provided as an exemplary embodiment of this disclosure;

[0042] Figure 4 A schematic diagram of the structure of the cleaning nozzle of a cleaning device for a conductive ring in an electroplating fixture, provided as an exemplary embodiment of this disclosure;

[0043] Figure 5 This is a schematic diagram of the structure of an electronic device shown in an example embodiment of the present disclosure. Detailed Implementation

[0044] The present disclosure is further illustrated below by way of embodiments, but the present disclosure is not limited to the scope of the embodiments described herein.

[0045] The prefixes such as "first" and "second" used in this disclosure are merely for distinguishing different descriptive objects and do not limit the position, order, priority, quantity, or content of the described objects. The use of ordinal numbers and other prefixes used to distinguish descriptive objects in this disclosure does not constitute a limitation on the described objects. The description of the described objects is given in the context of the embodiments, and the use of such prefixes should not constitute unnecessary restrictions. Furthermore, in the description of this embodiment, unless otherwise stated, "multiple" means two or more.

[0046] Figure 1This is a schematic diagram of a cleaning device for a conductive ring in an electroplating fixture, provided as an exemplary embodiment of the present disclosure. The cleaning device includes a support structure 1, an image processing module 2, an image acquisition module 3, and a cleaning structure 4, which are communicatively connected to the image processing module 2. The support structure 1 supports the conductive ring 5; the image acquisition module 3 acquires image data of the electroplated surface of the conductive ring after electroplating and sends it to the image processing module; the image processing module 2 generates a matching target cleaning command based on the image data to drive the cleaning structure 4 to perform a corresponding cleaning operation on the conductive ring.

[0047] Specifically, the conductive ring is placed on the conductive ring support structure 1. The image acquisition module 3 is used to observe the plating surface of the conductive ring and acquire image data of the plating surface after electroplating. The image acquisition module 3 sends the acquired image data to the image processing module 2. After receiving the image data, the image processing module 2 processes the image data, including but not limited to image preprocessing (denoising, enhancing, etc., to improve image quality); stain feature extraction (using algorithms to extract the shape, size, color, and other feature information of stains); stain identification and classification (comparing the extracted features with known stain types to identify the type of stain); and data analysis and evaluation (analyzing and evaluating the stain condition and providing corresponding detection results and cleaning suggestions). After completing the above steps, a matching target cleaning instruction is generated and sent to the cleaning structure. The cleaning structure performs the cleaning operation on the conductive ring according to the target cleaning instruction. The output includes the type, ratio, and dosage of the corresponding cleaning agent, as well as the movement trajectory and dwell time of the cleaning nozzle.

[0048] In this embodiment, the device integrates optical detection, image processing, and cleaning control, enabling more accurate detection of the cleanliness of the conductive ring and selection of cleaning process parameters for cleaning. It can automatically detect the cleanliness of the electroplated surface of the conductive ring after electroplating, automatically identify and analyze stain characteristics, eliminating the need for manual subjective inspection, achieving high detection accuracy, shortening detection time, improving detection efficiency, and meeting production requirements. Furthermore, based on the detection results, the device uses a control algorithm to select cleaning process parameters online and control the completion of the cleaning process, greatly improving cleaning efficiency. It is applicable to various conductive ring materials and surface conditions, rather than being limited to certain situations, thus having a wide range of applications and effectively overcoming the limitations of existing technologies.

[0049] Figure 2This is a schematic diagram of an image acquisition module provided for an exemplary embodiment of the present disclosure. The image acquisition module 3 includes a first image acquisition unit 21, a second image acquisition unit 22, and a switching switch 23. The switching switch 23 is electrically connected to the image processing module 2, the first image acquisition unit 21, and the second image acquisition unit 22, respectively. The image magnification of the first image acquisition unit 21 is less than that of the second image acquisition unit 22. The image processing module 2 is used to control the switching switch 23 to connect to the first image acquisition unit 21 to acquire first image data of the electroplated surface of the conductive ring after electroplating. The image processing module 2 is also used to determine the stain location information based on the first image data and control the switching switch 23 to switch to the second image acquisition unit 22 to acquire second image data at the location of the stain location information. The image processing module 2 is also used to generate a matching target cleaning instruction based on the second image data to drive the cleaning structure to perform a corresponding cleaning operation on the conductive ring.

[0050] In one embodiment, the first image acquisition device is a magnifying glass.

[0051] In one embodiment, the second image acquisition device is a microscope.

[0052] Specifically, taking a magnifying glass as the first image acquisition device and a microscope as the second image acquisition device as an example, after receiving a cleaning command, the image processing module 2 controls the switch 23 to connect to the first terminal 24, thereby enabling the image processing module 2 to control the magnifying glass to execute a search and detection command. The magnifying glass executes the acquisition command, acquires the first image data, and sends it to the image processing module 2. Based on the first image data, the image processing module 2 identifies and determines the location information of the stains in the image. The stain location information includes coarse localization and shape range determination of the contaminant. Subsequently, based on the stain location information determined by the first image data, the image processing module 2 controls the switch 23 to switch the second terminal 25 to the microscope system for further fine contaminant image localization. After localization, a magnified image is acquired, and the image information is transmitted to the image processing module 2. The image processing module 2 performs image analysis and processing, and then generates a matching target cleaning command based on the acquired second image data to drive the cleaning structure to perform the corresponding cleaning operation on the conductive ring.

[0053] In this embodiment, the magnifying glass provides a large field of view, enabling rapid localization of the approximate area of ​​the conductive ring plating. The microscope, on the other hand, further magnifies the image within the area identified by the magnifying glass, revealing the fine structure and details of the conductive ring plating, achieving high-definition observation. Simultaneously, the microscope system eliminates the need for large adjustment travel, saving time and cost when searching for stains. The microscope offers higher magnification, ensuring accurate detection of stains. The combined use of the magnifying glass and microscope ensures both observation efficiency and accuracy requirements. Through specific optical path design or switching mechanisms, users can flexibly switch between magnifying glass and microscope observation modes as needed. By combining the advantages of a magnifying glass and an optical microscope, the fine structure and stain conditions of the conductive ring plating can be clearly observed, reducing the influence of subjective factors, improving the reliability and consistency of detection results, and enhancing the reliability of the detection process.

[0054] In one embodiment, the image processing module 2 is further configured to determine the stain features at the corresponding location based on the second image data, determine the stain type based on the stain features, determine a cleaning process that matches the stain type, and generate a corresponding target cleaning instruction.

[0055] Specifically, after acquiring the second image data, the image processing module extracts stain features based on the data. First, the image is preprocessed (denoising, enhancement, etc., to improve image quality), and then stain features are extracted. Stain feature extraction can use an image recognition model to extract features such as the shape, size, and color of the stains. These features are then imported into a convolutional neural network model for stain recognition and classification; or, based on the extracted features, they are compared with known stain types to identify the stain category. Afterward, the stain condition is analyzed and evaluated, and corresponding detection results are provided. Based on the detection results, a cleaning process matching the stain type is determined, and a corresponding target cleaning instruction is generated.

[0056] In this embodiment, an applicable image analysis algorithm is used to automatically identify and analyze stain features without human intervention or subjective inspection, thereby improving detection efficiency and making the results more accurate. It is applicable to a variety of conductive ring materials and surface conditions, rather than being limited to certain situations, thus having a wide range of applications. It can effectively overcome the inaccurate judgment of oxide film by the exhalation method and atomizer spray method in the application of the existing wetting method, as well as the limitations of the copper replacement method.

[0057] In one embodiment, the support structure 1 includes a fixing member for fixing the conductive ring;

[0058] In one embodiment, the support structure 1 includes a fixed component and a movable component connected by a structure. The fixed component is used to fix the conductive ring, and the movable component is used to drive the fixed component to rotate and move to different positions.

[0059] In this embodiment, the rotational movement of the support structure enables the image acquisition module to acquire image data of the conductive ring under different poses. It can also be used to adjust the different poses of the conductive ring during the cleaning process, and to clean the conductive ring from multiple angles.

[0060] In one embodiment, the cleaning device further includes a supplementary lighting structure, which is located at a preset position away from the conductive ring; the supplementary lighting structure is used to supplement the conductive ring to provide a light source to the image acquisition module.

[0061] Specifically, the supplementary lighting structure can be set around the supporting structure. The supplementary lighting structure includes optical illumination elements and / or a supplementary lighting plate, and can adjust the lighting environment to provide all-round supplementary lighting for the conductive ring, ensuring that the image captured by the conductive ring during the image acquisition process is free of shadows and ensuring the accuracy of the captured image.

[0062] In one embodiment, such as Figure 1 The cleaning structure 4 shown includes a cleaning controller 6 communicatively connected to the image processing module, a cleaning nozzle 7 communicatively connected to the cleaning controller, and several mixing components 8 connected to the cleaning nozzle and providing different cleaning components. The cleaning controller 6 is used to receive the target cleaning instruction sent by the image processing module 2. The cleaning controller 6 is also used to determine the matching combination of the mixing components 8 according to the target cleaning instruction, and control the ratio and / or dosage of the cleaning components output by the corresponding mixing components to prepare a cleaning solution that matches the target cleaning instruction, and output it to the cleaning nozzle 7. The cleaning controller 6 is also used to control the cleaning nozzle 7 to perform corresponding cleaning operations on the conductive ring according to the cleaning solution.

[0063] Specifically, when a target cleaning command is sent to the cleaning structure, the cleaning controller responds to the command and prepares the cleaning solution accordingly. The cleaning structure contains multiple mixing components, each containing different cleaning ingredients. Since different types of stains require different cleaning solutions, the specific cleaning solution must be determined based on the stain type. The cleaning controller determines the configuration parameters based on the cleaning solution corresponding to the stain type in the target cleaning command, controls the multiple mixing components to output different ratios and dosages, prepares a cleaning solution matching the target cleaning command, and outputs it to the cleaning nozzle 7. After preparing the cleaning solution, the cleaning controller activates the cleaning nozzle to precisely spray and clean the conductive ring, removing the stains. (The supplementary lighting structure can be removed during the cleaning phase for better cleaning operation), and monitors the cleaning process (real-time monitoring to ensure the cleaning effect meets expectations and does not damage the conductive ring).

[0064] In this embodiment, the cleaning solution is automatically configured online according to the target cleaning instruction, making the cleaning of the conductive ring more reliable and efficient, and effectively cleaning the dirt on the conductive ring.

[0065] In one embodiment, the cleaning controller is also configured to drive the adjustment of the incident angle and / or height of the cleaning nozzle according to the target cleaning instruction;

[0066] In one embodiment, the distance between the cleaning nozzle and the conductive ring is adjusted;

[0067] In one embodiment, the liquid flow rate of the cleaning solution sprayed by the cleaning nozzle is adjusted;

[0068] In one embodiment, the flow rate of the rinsing purified water sprayed from the cleaning nozzle is adjusted;

[0069] In one embodiment, the flow rate of the desiccant sprayed from the cleaning nozzle is adjusted;

[0070] In one embodiment, the step-by-step time of the cleaning nozzle is adjusted.

[0071] Specifically, such as Figure 3 As shown, the cleaning nozzle 7 is a movable design. The cleaning nozzle is equipped with a distance sensor to detect the distance between the cleaning nozzle and the conductive ring 5 (the conductive teeth 10 are part of the conductive ring, and the conductive teeth are the tooth-like shape of the inner edge of the conductive ring). This allows the cleaning nozzle to adjust its incident angle and height, as well as its distance from the conductive ring, thus completing multi-directional cleaning. The target cleaning command specifically includes multiple processes such as cleaning, rinsing, and drying, and the execution time of each process is not entirely consistent. When the cleaning controller executes the target cleaning command, it will execute the distribution commands and the distribution time of each step in sequence, and can adjust the liquid flow rate of the cleaning solution sprayed by the cleaning nozzle, the flow rate of the rinse water sprayed, and the flow rate of the desiccant (such as nitrogen) sprayed in real time to complete the target cleaning command.

[0072] In one embodiment, during the drying process, the cleaning device adjusts the rotation speed of the support structure according to the target cleaning instruction, and cooperates with the cleaning structure to carry out the drying operation. Specifically, in the cleaning stage, the liquid covering the conductive ring is thrown off by the centrifugal force of the rotating conductive ring, and the surface of the conductive ring is blown dry by an external nitrogen source.

[0073] In this embodiment, the cleaning controller controls the cleaning nozzles in real time to complete the target cleaning command, enabling the conductive ring to be cleaned in all directions, thus improving cleaning efficiency.

[0074] In one embodiment, the cleaning device further includes a display for showing the operating status data of the image acquisition module and / or the cleaning structure, enabling the user to understand the operating status of the cleaning device in real time and monitor the cleaning process. Specifically, monitoring the cleaning process mainly involves monitoring parameters such as the rotational speed of the conductive ring, liquid spray flow rate, nitrogen flow rate, and nozzle incident angle. This monitoring is accomplished through multiple sensors and controllers within the cleaning device.

[0075] Figure 4 The flowchart illustrates a cleaning method for a conductive ring in an electroplating fixture, provided as an exemplary embodiment of this disclosure. The cleaning method employs the aforementioned cleaning apparatus and includes:

[0076] Step 101: Acquire image data of the electroplated surface of the conductive ring after electroplating;

[0077] Step 102: Generate matching target cleaning instructions based on image data;

[0078] Step 103: In response to the target cleaning command, drive the cleaning structure in the cleaning device to perform the corresponding cleaning operation on the conductive ring.

[0079] In this embodiment, by acquiring image data of the conductive ring, the cleanliness of the conductive ring can be detected more accurately, and cleaning process parameters can be selected for cleaning. It can automatically detect the cleanliness of the electroplated surface of the conductive ring after electroplating, and can automatically identify and analyze stain characteristics, eliminating the need for manual subjective inspection. This results in high detection accuracy, shortened detection time, and improved detection efficiency, meeting production requirements. Furthermore, based on the detection results, a control algorithm is used to select cleaning process parameters online and control the completion of the cleaning process, greatly improving cleaning efficiency. It is applicable to various conductive ring materials and surface conditions, rather than being limited to certain situations, thus having a wide range of applications. It effectively overcomes the limitations of existing wettation methods such as the inaccurate assessment of oxide films using the breath method and atomizer spray method, as well as the limitations of the copper replacement method.

[0080] Figure 5 This is a schematic diagram of the structure of an electronic device according to an example embodiment of the present disclosure. The electronic device includes a memory, a processor, and a computer program stored in the memory and used to run on the processor. When the processor executes the computer program, it implements the cleaning method described in any of the above embodiments. Figure 5 The electronic device 50 shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments disclosed herein.

[0081] like Figure 5As shown, the electronic device 50 can be manifested in the form of a general-purpose computing device, such as a server device. The components of the electronic device 50 may include, but are not limited to: at least one processor 51, at least one memory 52, and a bus 53 connecting different system components (including memory 52 and processor 51).

[0082] Bus 53 includes a data bus, an address bus, and a control bus.

[0083] The memory 52 may include volatile memory, such as random access memory (RAM) 521 and / or cache memory 522, and may further include read-only memory (ROM) 523.

[0084] The memory 52 may also include a program tool 525 (or utility) having a set (at least one) program module 524, such program module 524 including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0085] The processor 51 executes various functional applications and data processing, such as the cleaning method provided in any of the above embodiments, by running a computer program stored in the memory 52.

[0086] Electronic device 50 can also communicate with one or more external devices 54 (e.g., keyboard, pointing device, etc.). This communication can be performed through input / output (I / O) interface 55. Furthermore, electronic device 50 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public network, such as the Internet) via network adapter 56. As shown, network adapter 56 communicates with other modules of electronic device 50 via bus 53. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with electronic device 50, including but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID (disk array) systems, tape drives, and data backup storage systems.

[0087] It should be noted that although several devices / modules or sub-devices / modules of an electronic device have been mentioned in the detailed description above, this division is merely exemplary and not mandatory. In fact, according to embodiments of this disclosure, the features and functions of two or more devices / modules described above can be embodied in a single device / module. Conversely, the features and functions of a single device / module described above can be further divided and embodied by multiple devices / modules.

[0088] This disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the cleaning method provided in any of the above embodiments.

[0089] The readable storage medium may be more specifically adopted, including but not limited to: portable disk, hard disk, random access memory, read-only memory, erasable programmable read-only memory, optical storage device, magnetic storage device, or any suitable combination thereof.

[0090] This disclosure also provides a computer program product, including a computer program that, when executed by a processor, implements the cleaning method described in any of the above embodiments.

[0091] The program code for executing the computer program product of this disclosure can be written in any combination of one or more programming languages, and the program code can be executed entirely on a user device, partially on a user device, as a stand-alone software package, partially on a user device and partially on a remote device, or entirely on a remote device.

[0092] While specific embodiments of this disclosure have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this disclosure is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this disclosure, but all such changes and modifications fall within the scope of protection of this disclosure.

Claims

1. A cleaning device for conductive rings in an electroplating fixture, characterized in that, The cleaning device includes a support structure, an image processing module, an image acquisition module and a cleaning structure that are communicatively connected to the image processing module; The support structure is used to support the conductive ring; The image acquisition module is used to acquire image data of the electroplated surface of the conductive ring after electroplating and send it to the image processing module; The image processing module is used to generate a matching target cleaning instruction based on the image data, so as to drive the cleaning structure to perform a corresponding cleaning operation on the conductive ring.

2. The cleaning apparatus of claim 1, wherein The image acquisition module includes a first image acquisition unit, a second image acquisition unit, and a switching switch. The switching switch is electrically connected to the image processing module, the first image acquisition unit, and the second image acquisition unit, respectively. The image magnification of the first image acquisition unit is less than that of the second image acquisition unit. The image processing module is used to control the switching switch to connect to the first image acquisition device in order to acquire the first image data of the electroplated surface of the conductive ring after electroplating. The image processing module is also used to determine the stain location information based on the first image data, and control the switch to switch to the second image acquisition device to acquire the second image data at the location of the stain location information. The image processing module is further configured to generate a matching target cleaning instruction based on the second image data, so as to drive the cleaning structure to perform a corresponding cleaning operation on the conductive ring.

3. The cleaning apparatus of claim 2, wherein The image processing module is further configured to determine the stain features at the corresponding location based on the second image data, determine the stain type based on the stain features, determine a cleaning process that matches the stain type, and generate a corresponding target cleaning instruction.

4. The cleaning apparatus of any one of claims 1-3, wherein, The support structure includes a fixing member, which is used to fix the conductive ring. And / or, the support structure includes a fixed component and a movable component that are structurally connected, wherein the fixed component is used to fix the conductive ring, and the movable component is used to drive the fixed component to rotate and move to different positions.

5. The cleaning apparatus of claim 4, wherein The cleaning device also includes a supplementary lighting structure, which is located at a preset position away from the conductive ring; The supplementary lighting structure is used to supplement the light of the conductive ring in order to provide a light source to the image acquisition module.

6. The cleaning apparatus of claim 1, wherein The cleaning structure includes a cleaning controller that is communicatively connected to the image processing module, a cleaning nozzle that is communicatively connected to the cleaning controller, and several mixing components that are connected to the cleaning nozzle and provide different cleaning components. The cleaning controller is used to receive the target cleaning command sent by the image processing module; The cleaning controller is also used to determine the matching combination of the mixing components according to the target cleaning instruction, and control the ratio and / or dosage of the cleaning components output by the corresponding mixing components, so as to prepare a cleaning solution that matches the target cleaning instruction and output it to the cleaning nozzle. The cleaning controller is also used to control the cleaning nozzle to perform corresponding cleaning operations on the conductive ring according to the cleaning solution.

7. The cleaning apparatus of claim 6, wherein The cleaning controller is also used to drive the adjustment of the incident angle and / or height of the cleaning nozzle according to the target cleaning command; And / or, adjust the distance between the cleaning nozzle and the conductive ring; And / or, adjust the liquid flow rate of the cleaning solution sprayed by the cleaning nozzle; And / or, adjust the flow rate of the rinsing purified water sprayed from the cleaning nozzle; And / or, adjust the flow rate of the desiccant sprayed from the cleaning nozzle; And / or, adjust the step time of the cleaning nozzle.

8. The cleaning apparatus of claim 1, wherein The cleaning device also includes a display; The display is used to show the working status data of the image acquisition module and / or the cleaning structure.

9. The cleaning apparatus as described in claim 2, characterized in that, The first image acquisition device is a magnifying glass; and / or, the second image acquisition device is a microscope.

10. A method for cleaning conductive rings in an electroplating fixture, characterized in that, The cleaning method is implemented using the cleaning apparatus as described in any one of claims 1-9, and the cleaning method includes: Image data of the electroplated surface of the conductive ring after electroplating was acquired; Based on the image data, generate matching target cleaning instructions; In response to the target cleaning command, the cleaning structure in the cleaning device is driven to perform a corresponding cleaning operation on the conductive ring.

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