A polishing device for semiconductor structure

Abstract

This invention discloses a grinding apparatus for semiconductor structural components, relating to the field of semiconductor processing technology. The grinding apparatus is used to grind semiconductor workpieces and includes a body, a grinding mechanism, a detection mechanism, a supporting mechanism, a radial feed mechanism, and a lifting mechanism. The supporting mechanism and the radial feed mechanism are respectively located inside the body. The radial feed mechanism is equipped with both the lifting mechanism and the detection mechanism, and the grinding mechanism is mounted on the lifting mechanism. The grinding mechanism and the detection mechanism are symmetrically positioned above the semiconductor workpiece, which is placed on the supporting mechanism. The grinding mechanism includes a grinding head. This invention achieves dynamic optimization of the grinding path through a burr detection mechanism, significantly improving grinding efficiency and avoiding repeated grinding. It ensures that the overlap between adjacent grinding paths accurately covers the burr area and utilizes the coolant impact point as a high-precision detection position, effectively eliminating grinding debris interference and improving detection accuracy.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, specifically a grinding apparatus for semiconductor structural components. Background Technology

[0002] In semiconductor manufacturing processes, after the initial processes such as cutting, etching, and deposition, the surfaces of circular semiconductor components, such as wafers and semiconductor substrates, often exhibit defects such as unevenness, burrs, and microcracks. These defects require polishing to achieve a high degree of flatness and smoothness to meet the stringent surface quality requirements of subsequent precision processes such as photolithography, bonding, and thin film deposition. In existing technologies, polishing devices for circular semiconductor components typically employ a rotary table and a oscillating polishing head. During polishing, the semiconductor component is adhered to the rotary table and rotates around its own axis. The polishing head, driven by a mechanism, moves radially, achieving full-surface polishing coverage of the component.

[0003] However, the existing grinding devices have the following drawbacks: First, the overlap range of the grinding path cannot be dynamically optimized, resulting in low processing efficiency and poor surface quality consistency. Existing equipment typically advances the grinding head from the inner to the outer ring with a fixed radial step. Due to the difference in linear velocity between the edge and center of the grinding head and abrasive wear, burrs of varying widths inevitably form on the outer edge of each grinding path. To eliminate these burrs, existing equipment usually employs a high overlap grinding method, leading to a significant waste of processing time on already smoothed areas. Furthermore, because the burr width varies between different batches of workpieces and under different wear conditions, the fixed step cannot adapt to changes in actual processing conditions. When the burr width exceeds the overlap, un-grinded burrs remain; when the burr width is less than the overlap, ineffective overlap occurs, severely impacting surface quality consistency and processing efficiency. Second, there is a lack of precise online burr detection methods, making closed-loop control impossible. In existing technologies, operators must remove the workpiece after grinding, measure the surface quality using offline detection equipment, and then adjust the equipment parameters based on the measurement results. This method is not only time-consuming, but also cannot achieve real-time feedback control during the grinding process, making it difficult to guarantee the processing consistency and finished product yield between different batches of workpieces. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the grinding path overlap range cannot be optimized, resulting in low processing efficiency and poor surface quality consistency. The present invention provides a grinding device for semiconductor structural components.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: A grinding apparatus for semiconductor structural components is disclosed. The grinding apparatus is used to grind semiconductor workpieces. The grinding apparatus includes a body, a grinding mechanism, a detection mechanism, a support mechanism, a radial feed mechanism, and a lifting mechanism. The support mechanism and the radial feed mechanism are respectively provided inside the body. The lifting mechanism and the detection mechanism are respectively provided on the radial feed mechanism. The grinding mechanism is provided on the lifting mechanism. The grinding mechanism and the detection mechanism are symmetrically located above the semiconductor workpiece. The semiconductor workpiece is placed on the support mechanism. The grinding mechanism includes a grinding head; The detection mechanism includes a cantilever, a photoelectric sensor, and a nozzle. The lower end of the cantilever is equipped with a photoelectric sensor and a nozzle, and the nozzle opening is inclined. The diameter of the grinding head is smaller than the radius of the semiconductor workpiece. A cantilever is provided below the radial feed mechanism. The photoelectric sensor is placed above the semiconductor workpiece, and the nozzle opening is inclined along the chord of the semiconductor workpiece.

[0006] The main body serves as the supporting frame structure for the entire grinding device. The bearing mechanism carries the semiconductor workpiece and drives it to rotate at a constant speed around its own axis. The radial feed mechanism provides linear feed motion along the radial direction of the semiconductor workpiece. The grinding head moves synchronously up and down and radially with the lifting mechanism, and performs rotational grinding on the upper surface of the semiconductor workpiece. The photoelectric sensor detects the features on the surface of the semiconductor workpiece. The nozzle sprays cleaning fluid onto the surface of the semiconductor workpiece. The grinding head and the photoelectric sensor are located on both sides of the axis of the semiconductor workpiece. The grinding head and the photoelectric sensor are driven by the radial feed mechanism and move synchronously outward along the radial direction of the semiconductor workpiece. During the movement, the photoelectric sensor detects the annular area that the grinding head has just polished. The photoelectric sensor emits a detection beam towards the surface of the semiconductor workpiece. When the beam hits the polished surface, the light is reflected, and the photoelectric sensor receives a strong reflected light signal. When the beam hits the burr area, the reflected light signal weakens or even disappears due to the microscopic unevenness and fractures on the burr surface. The photoelectric sensor determines the boundary position of the burr area by detecting the change in the reflected light signal. Since the grinding head and the photoelectric sensor move outward synchronously, when the photoelectric sensor detects the burr boundary, the grinding head has already moved to the corresponding radial position. At this point, the grinding head no longer moves outward and begins polishing in place, thus achieving precise coverage of the burr area.

[0007] Furthermore, the radial feed mechanism includes a radial slide rail, a bidirectional lead screw, a radial feed slider, and a radial feed motor. The center plane of the bidirectional lead screw is coplanar with the axis of the semiconductor workpiece. The radial slide rail and the radial feed slider are slidably connected. Two sets of radial feed sliders are symmetrically arranged. A lifting mechanism and a cantilever are respectively provided below the two sets of radial feed sliders. A radial slide rail is provided on the upper part of the machine body. A radial feed motor is provided on one side of the radial slide rail. A bidirectional lead screw is provided at the output end of the radial feed motor. The bidirectional lead screw and the radial slide rail are rotatably connected. The bidirectional lead screw and the radial feed slider are threadedly connected. The outer ring thread of the bidirectional lead screw is symmetrically opposite from the center to both sides.

[0008] The radial slide rail extends horizontally, parallel to the diameter of the semiconductor workpiece. One set of radial feed sliders is fixedly connected to a lifting mechanism, with a grinding mechanism located below the lifting mechanism. The other set of radial feed sliders is fixedly connected to a cantilever, with a photoelectric sensor located below the cantilever. When the radial feed motor drives the bidirectional lead screw to rotate, the two sets of radial feed sliders engage with two oppositely oriented threaded sections on the bidirectional lead screw, causing them to move synchronously towards or away from each other along the radial slide rail. The grinding mechanism and the detection mechanism move synchronously with the two sets of radial feed sliders, achieving synchronous and symmetrical movement of the grinding head and the photoelectric sensor along the radial direction of the semiconductor workpiece. Since the two sets of sliders share the same power source and the same transmission component, the radial distance between the grinding head and the photoelectric sensor remains constant, eliminating the need for separate control and ensuring a precise correspondence between the detection position and the grinding position.

[0009] Furthermore, the testing mechanism also includes an isolation hood and a liquid inlet pipe. The isolation hood is located below the cantilever, and the photoelectric sensor is placed inside the isolation hood. One end of the liquid inlet pipe is connected to the nozzle pipe, and the other end of the liquid inlet pipe passes through the machine body.

[0010] The isolation cover is a cylindrical protective cover, fixedly connected to the lower surface of the cantilever. The photoelectric sensor is fixedly installed at the end of the horizontal section of the cantilever and located inside the isolation cover. The detection spot of the photoelectric sensor passes through the lower opening of the isolation cover and is projected vertically onto the upper surface of the semiconductor workpiece. The isolation cover is used to prevent the grinding debris and coolant generated during the grinding process from splashing onto the detection light path of the photoelectric sensor, ensuring detection accuracy. One end of the liquid inlet pipe is connected to the inlet of the nozzle through a pipe joint, and the other end of the liquid inlet pipe extends through the wall of the machine body to the outside of the machine body and is connected to the external cleaning fluid supply system. A solenoid valve is provided at the inlet of the liquid inlet pipe to control the on / off and flow rate of the cleaning fluid. The nozzle opening is inclined along the chord of the semiconductor workpiece. When the cleaning fluid is sprayed out, it is tangential to the surface of the semiconductor workpiece, thereby improving cleaning efficiency and preventing the cleaning fluid from rushing towards the photoelectric sensor.

[0011] Furthermore, the grinding mechanism also includes an electric spindle, with the electric spindle mounted on the lifting mechanism and a grinding head mounted on the output end of the electric spindle.

[0012] The housing of the electric spindle moves up and down and radially in sync with the lifting mechanism. The spindle core is set vertically downward. The grinding head is fixedly installed on the spindle core extending from the lower end of the electric spindle through a flange and a locking nut. The electric spindle drives the grinding head to rotate at high speed around its own axis to grind the upper surface of the semiconductor workpiece.

[0013] Furthermore, the lifting mechanism includes a lifting slide rail, a lifting screw, a lifting motor, and a lifting slider. The lifting slide rail is fixed below the radial feed slider. The lifting motor is mounted on the lifting slide rail. The output end of the lifting motor is equipped with a lifting screw. The lifting screw and the lifting slide rail are rotatably connected. The lifting screw and the lifting slider are threadedly connected. The lifting slider and the lifting slide rail are slidably connected. An electric spindle is mounted on one side of the lifting slider.

[0014] The lifting slide rail is fixedly installed on the side of the radial feed slider and moves radially synchronously with the radial feed slider. The lifting motor is fixed on the upper end of the lifting slide rail and outputs torque to drive the lifting screw to rotate. The lifting screw and the lifting slider are connected by threads, driving the lifting slide rail to move up and down along the lifting slide rail, thereby driving the electric spindle on one side of the lifting slider to move up and down synchronously, so as to realize the grinding head grinding the surface of the semiconductor workpiece.

[0015] Furthermore, the supporting mechanism includes a tray, a rotary joint, a fixed joint, and a rotary motor. The rotary joint is located below the tray, and the fixed joint is fitted around the outer ring of the rotary joint. The rotary joint and the fixed joint are rotatably connected and internally connected. The rotary motor is fixed inside the machine body, and the output end of the rotary motor is equipped with a rotary joint.

[0016] Semiconductor workpieces are placed on a tray. The rotary motor outputs torque to drive the rotary joint to rotate, which in turn drives the tray and the semiconductor workpieces on the tray to rotate synchronously around their own axis. The fixed joint is fixed on the base and does not rotate with the rotary joint, while maintaining a sealed connection with the inside of the rotary joint, which facilitates continuous air extraction by the external air suction device.

[0017] Furthermore, the tray has a main suction hole in the middle, and several secondary suction holes are provided around the main suction hole. A connecting channel is provided between the main suction hole and the secondary suction holes.

[0018] The external vacuum equipment is connected to the fixed joint. Since the rotary joint and the fixed joint are internally connected, and the main suction port and the rotary joint pipe are connected, when the vacuum adsorption is started, the main suction port generates negative pressure by suction to adsorb the semiconductor workpiece onto the tray surface. Furthermore, there is a connecting channel between the main suction port and the secondary suction port. The secondary suction port provides auxiliary adsorption for the main suction port, further stabilizing the semiconductor workpiece on the tray surface, improving adsorption, and preventing the semiconductor workpiece from shifting position during the polishing process.

[0019] Furthermore, the rotary joint has several vent holes circumferentially arranged at its lower end, and a main ventilation channel is provided inside the rotary joint, with the vent holes and the main ventilation channel connected together. The fixed joint has an air intake hole on the outside and an air intake channel on the inner ring of the fixed joint. The air intake hole and the air intake channel are connected. The intake channel and the vent are connected, and the main vent channel and the main intake port are connected.

[0020] The external vacuum suction device is connected to the suction port through a pipeline to continuously evacuate air from inside the fixed joint. The suction channel of the fixed joint maintains negative pressure inside the main ventilation channel through the ventilation port. The main ventilation channel transmits the negative pressure to the main suction port, and then to each secondary suction port through the connecting channel. Each secondary suction port is evenly distributed in the area of ​​the tray that holds the semiconductor workpiece. The negative pressure stably adsorbs and fixes the semiconductor workpiece on the tray surface. The adsorption force is evenly distributed, which will not cause local stress deformation of the semiconductor workpiece and ensures the grinding and processing accuracy.

[0021] Furthermore, the machine body includes a frame, a base, and a housing. The base is located on top of the frame, and a rotary motor and a housing are respectively located on the base. A radial slide rail is provided on the upper surface inside the housing.

[0022] The frame supports the weight of the entire device, the base provides a stable mounting reference for the load-bearing mechanism, and the housing encloses the grinding area to prevent grinding debris and cleaning fluid from splashing out of the device during the grinding process, thus keeping the processing environment clean.

[0023] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention achieves dynamic optimization of the grinding path through a burr detection mechanism, significantly improving grinding efficiency and avoiding repeated grinding. When the detection beam illuminates a smooth surface, the reflected light signal is strong; when it illuminates the burr area, the reflected light signal is weak. The photoelectric sensor determines the boundary position of the burr area by detecting changes in the reflected light signal. Since the grinding head and the photoelectric sensor move outward synchronously, when the photoelectric sensor detects the burr boundary, the grinding head has already moved to the corresponding radial position. At this point, the grinding head stops moving outward and begins grinding in place, thus achieving precise coverage of the burr area. This method ensures that the overlap between two adjacent grinding paths precisely covers the burr area, preventing unpolished burr grooves that could cause surface defects, and avoiding ineffective overlap in already smooth areas that would waste time. It solves the problems of low efficiency and unstable surface quality caused by the inability of the fixed step size to adapt to changes in burr width in existing technologies.

[0024] 2. This invention effectively eliminates interference from grinding debris and improves detection accuracy by placing the nozzle on one side of the photoelectric sensor and utilizing the impact point of the coolant as a high-precision detection position. The nozzle opening sprays the cleaning fluid at an angle along the chord of the semiconductor workpiece, ensuring that the detection point is precisely located on the impact path of the coolant. Grinding debris generated during polishing enters the rinsing area with the rotating semiconductor workpiece and is washed away by the coolant. Combined with the centrifugal force generated by the rotation of the semiconductor workpiece itself, the residual liquid film is dried, resulting in a substrate detected by the photoelectric sensor that is free of grinding debris accumulation and liquid film coverage. This optimized detection point scheme effectively eliminates interference caused by grinding debris accumulation and avoids the refraction and scattering effects of the coolant film on optical measurements, ensuring that the reflected light signal accurately reflects the surface microstructure and improving detection accuracy. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the grinding mechanism of the present invention; Figure 3 This is a schematic diagram of the radial feed mechanism of the present invention; Figure 4 This is a schematic diagram of the detection mechanism of the present invention; Figure 5 This is a schematic diagram of the lifting mechanism of the present invention; Figure 6 This is a schematic diagram of the structure of the bearing mechanism of the present invention; Figure 7 This is a schematic diagram of the rotary joint and fixed joint of the present invention.

[0026] In the diagram: 1. Machine body; 11. Frame; 12. Base; 13. Housing; 2. Grinding mechanism; 21. Grinding head; 22. Electric spindle; 3. Detection mechanism; 31. Cantilever; 32. Photoelectric sensor; 33. Nozzle; 34. Isolation cover; 35. Liquid inlet pipe; 4. Bearing mechanism; 41. Tray; 411. Main suction port; 412. Secondary suction port; 413. Connecting channel; 42. Rotary joint; 421. Vent; 422. Main ventilation channel; 43. Fixed joint; 431. Suction port; 432. Suction channel; 44. Rotary motor; 5. Radial feed mechanism; 51. Radial slide rail; 52. Bidirectional lead screw; 53. Radial feed slider; 54. Radial feed motor; 6. Lifting mechanism; 61. Lifting slide rail; 62. Lifting lead screw; 63. Lifting motor; 64. Lifting slider; 7. Semiconductor workpiece. Detailed Implementation

[0027] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Example: Figures 1-7 As shown, the present invention provides a technical solution: a polishing device for semiconductor structural components.

[0029] like Figures 1-4 As shown, a grinding device for semiconductor structural components is disclosed. The grinding device is used to grind semiconductor workpiece 7. The grinding device includes a body 1, a grinding mechanism 2, a detection mechanism 3, a bearing mechanism 4, a radial feed mechanism 5, and a lifting mechanism 6. The bearing mechanism 4 and the radial feed mechanism 5 are respectively provided inside the body 1. The lifting mechanism 6 and the detection mechanism 3 are respectively provided on the radial feed mechanism 5. The grinding mechanism 2 is provided on the lifting mechanism 6. The grinding mechanism 2 and the detection mechanism 3 are symmetrically located above the semiconductor workpiece 7. The semiconductor workpiece 7 is placed on the bearing mechanism 4. The grinding mechanism 2 includes a grinding head 21; The detection mechanism 3 includes a cantilever 31, a photoelectric sensor 32, and a nozzle 33. The lower end of the cantilever 31 is provided with a photoelectric sensor 32 and a nozzle 33, and the nozzle 33 has an inclined opening. The diameter of the grinding head 21 is smaller than the radius of the semiconductor workpiece 7. A cantilever 31 is provided below the radial feed mechanism 5. The photoelectric sensor 32 is placed above the semiconductor workpiece 7. The nozzle 33 has its opening inclined along the chord of the semiconductor workpiece 7.

[0030] The body 1 is the supporting frame structure of the entire grinding device. The bearing mechanism 4 is used to carry the semiconductor workpiece 7 and drive the semiconductor workpiece 7 to rotate at a constant speed around its own axis. The radial feed mechanism 5 is used to provide linear feed motion along the radial direction of the semiconductor workpiece 7. The grinding head 21 moves synchronously up and down and radially with the lifting mechanism 6 and performs rotational grinding on the upper surface of the semiconductor workpiece 7. The photoelectric sensor 32 is used to detect the features of the surface of the semiconductor workpiece 7. The nozzle 33 is used to spray cleaning fluid onto the surface of the semiconductor workpiece 7. The grinding head 21 and the photoelectric sensor 32 are located on both sides of the axis of the semiconductor workpiece 7. The grinding head 21 and the photoelectric sensor 32 are driven by the radial feed mechanism 5 and move synchronously outward along the radial direction of the semiconductor workpiece 7. During the movement, the area detected by the photoelectric sensor 32 is the annular area that the grinding head 21 has just polished. The photoelectric sensor 32 emits a detection beam towards the surface of the semiconductor workpiece 7. When the beam shines on the polished surface, the light is reflected, and the photoelectric sensor 32 receives a strong reflected light signal. When the beam shines on the burr area, the reflected light signal weakens or even disappears due to the microscopic unevenness and fractures on the burr surface. The photoelectric sensor 32 determines the boundary position of the burr area by detecting the change in the reflected light signal. Since the grinding head 21 and the photoelectric sensor 32 move outward synchronously, when the photoelectric sensor 32 detects the burr boundary, the grinding head 21 has already moved to the corresponding radial position. At this time, the grinding head 21 no longer continues to move outward and starts polishing in place, thereby achieving precise coverage of the burr area.

[0031] like Figure 3 As shown, the radial feed mechanism 5 includes a radial slide rail 51, a bidirectional lead screw 52, ​​a radial feed slider 53, and a radial feed motor 54. The center plane of the bidirectional lead screw 52 is coplanar with the axis of the semiconductor workpiece 7. The radial slide rail 51 and the radial feed slider 53 are slidably connected. Two sets of radial feed sliders 53 are symmetrically arranged. A lifting mechanism 6 and a cantilever 31 are respectively provided below the two sets of radial feed sliders 53. The radial slide rail 51 is provided on the upper part of the machine body 1. A radial feed motor 54 is provided on one side of the radial slide rail 51. A bidirectional lead screw 52 is provided at the output end of the radial feed motor 54. The bidirectional lead screw 52 and the radial slide rail 51 are rotatably connected. The bidirectional lead screw 52 and the radial feed slider 53 are threadedly connected. The outer ring thread of the bidirectional lead screw 52 is symmetrically opposite from the center to both sides.

[0032] The radial slide rail 51 extends horizontally, parallel to the diameter of the semiconductor workpiece 7. One set of radial feed sliders 53 is fixedly connected to a lifting mechanism 6, with a grinding mechanism 2 located below the lifting mechanism 6. The other set of radial feed sliders 53 is fixedly connected to a cantilever 31, with a photoelectric sensor 32 located below the cantilever 31. When the radial feed motor 54 drives the bidirectional lead screw 52 to rotate, the two sets of radial feed sliders 53 engage with two oppositely oriented threaded sections on the bidirectional lead screw 52, ​​causing them to move synchronously towards or away from each other along the radial slide rail 51. The grinding mechanism 2 and the detection mechanism 3 move synchronously with the two sets of radial feed sliders 53, achieving synchronous and symmetrical movement of the grinding head 21 and the photoelectric sensor 32 along the radial direction of the semiconductor workpiece 7. Since the two sets of sliders share the same power source and the same transmission component, the radial distance between the grinding head 21 and the photoelectric sensor 32 remains constant, requiring no separate control and ensuring a precise correspondence between the detection position and the grinding position.

[0033] like Figure 4 As shown, the detection mechanism 3 also includes an isolation cover 34 and an inlet pipe 35. The isolation cover 34 is located below the cantilever 31. The photoelectric sensor 32 is placed in the inner ring of the isolation cover 34. One end of the inlet pipe 35 is connected to the nozzle 33, and the other end of the inlet pipe 35 passes through the body 1.

[0034] The isolation cover 34 is a cylindrical protective cover, fixedly connected to the lower surface of the cantilever 31. The photoelectric sensor 32 is fixedly installed at the end of the horizontal section of the cantilever 31 and located inside the isolation cover 34. The detection light spot of the photoelectric sensor 32 passes through the lower opening of the isolation cover 34 and is vertically projected onto the upper surface of the semiconductor workpiece 7. The isolation cover 34 is used to prevent the grinding debris and coolant generated during the grinding process from splashing onto the detection light path of the photoelectric sensor 32, thus ensuring detection accuracy. One end of the liquid inlet pipe 35 is connected to the inlet of the nozzle 33 through a pipe joint. The other end of the liquid inlet pipe 35 extends through the wall of the machine body 1 to the outside of the machine body 1 and is connected to the external cleaning fluid supply system. A solenoid valve is provided at the inlet of the liquid inlet pipe 35 to control the on / off state and flow rate of the cleaning fluid. The nozzle 33 sprays the cleaning fluid at an angle along the chord of the semiconductor workpiece 7, so that the detection point is exactly on the impact path of the coolant. The grinding debris generated during grinding enters the rinsing area along with the rotating semiconductor workpiece 7 and is washed away by the coolant. Combined with the centrifugal force generated by the rotation of the semiconductor workpiece 7 itself, the residual liquid film is spun dry, so that the surface detected by the photoelectric sensor 32 is a real substrate without grinding debris accumulation and liquid film coverage.

[0035] like Figure 5 As shown, the grinding mechanism 2 also includes an electric spindle 22. The lifting mechanism 6 is equipped with an electric spindle 22, and the output end of the electric spindle 22 is equipped with a grinding head 21.

[0036] The housing of the electric spindle 22 moves synchronously up and down and radially with the lifting mechanism 6. The spindle core of the electric spindle 22 is set vertically downward. The grinding head 21 is fixedly installed on the spindle core extending from the lower end of the electric spindle 22 by a flange and a locking nut. The electric spindle 22 drives the grinding head 21 to rotate at high speed around its own axis to grind the upper surface of the semiconductor workpiece 7.

[0037] like Figure 5 As shown, the lifting mechanism 6 includes a lifting slide rail 61, a lifting screw 62, a lifting motor 63, and a lifting slider 64. The lifting slide rail 61 is fixed below the radial feed slider 53. The lifting motor 63 is mounted on the lifting slide rail 61. The lifting screw 62 is mounted on the output end of the lifting motor 63. The lifting screw 62 and the lifting slide rail 61 are rotatably connected. The lifting screw 62 and the lifting slider 64 are threadedly connected. The lifting slider 64 and the lifting slide rail 61 are slidably connected. An electric spindle 22 is mounted on one side of the lifting slider 64.

[0038] The lifting slide rail 61 is fixedly installed on the side of the radial feed slider 53 and moves radially synchronously with the radial feed slider 53. The lifting motor 63 is fixed on the upper end of the lifting slide rail 61 and outputs torque to drive the lifting screw 62 to rotate. The lifting screw 62 and the lifting slider 64 are threadedly connected, driving the lifting slide rail 61 to move up and down along the lifting slide rail 61, thereby driving the electric spindle 22 on one side of the lifting slider 64 to move up and down synchronously, so as to realize the grinding head 21 grinding the surface of the semiconductor workpiece 7.

[0039] like Figures 6-7 As shown, the supporting mechanism 4 includes a tray 41, a rotary joint 42, a fixed joint 43, and a rotary motor 44. The rotary joint 42 is located below the tray 41, and the fixed joint 43 is fitted around the outer ring of the rotary joint 42. The rotary joint 42 and the fixed joint 43 are rotatably connected and internally connected. The rotary joint 42 and the fixed joint 43 are internally connected. The rotary motor 44 is fixed inside the machine body 1, and the output end of the rotary motor 44 is provided with the rotary joint 42.

[0040] Semiconductor workpiece 7 is placed on tray 41. The output torque of rotary motor 44 drives rotary joint 42 to rotate, thereby driving tray 41 and semiconductor workpiece 7 on tray 41 to rotate synchronously around their own axis. Fixed joint 43 is fixed on base 12 and does not rotate with rotary joint 42. At the same time, it maintains a sealed connection with the inside of rotary joint 42 to facilitate continuous air extraction by external air suction device.

[0041] like Figure 7 As shown, a main suction hole 411 is provided in the middle of the tray 41, and several secondary suction holes 412 are provided on the outer periphery of the main suction hole 411. A connecting channel 413 is provided between the main suction hole 411 and the secondary suction holes 412.

[0042] An external vacuum device is connected to a fixed connector 43. Since the rotary connector 42 and the fixed connector 43 are internally connected, and the main suction port 411 and the rotary connector 42 are connected, when vacuum adsorption is started, the main suction port 411 generates negative pressure by suction to adsorb the semiconductor workpiece 7 onto the surface of the tray 41. A connecting channel 413 is provided between the main suction port 411 and the secondary suction port 412. The secondary suction port 412 provides auxiliary adsorption for the main suction port 411, further stabilizing the semiconductor workpiece 7 onto the surface of the tray 41, improving adsorption and preventing the semiconductor workpiece 7 from shifting position during the polishing process.

[0043] like Figure 7 As shown, the rotary joint 42 has several vent holes 421 circumferentially arranged at the lower end, and a main ventilation channel 422 is provided inside the rotary joint 42. The vent holes 421 and the main ventilation channel 422 are connected. The fixed connector 43 has an air intake hole 431 on the outside and an air intake channel 432 on the inner ring of the fixed connector 43. The air intake hole 431 and the air intake channel 432 are connected. The intake channel 432 is connected to the vent 421, and the main vent 422 is connected to the intake main vent 411.

[0044] An external vacuum suction device is connected to suction port 431 through a pipeline to continuously evacuate air from inside the fixed joint 43. The suction channel 432 of the fixed joint 43 maintains negative pressure inside the main ventilation channel 422 through ventilation port 421. The main ventilation channel 422 transmits negative pressure to the main suction port 411, and then to each secondary suction port 412 through the connecting channel 413. Each secondary suction port 412 is evenly distributed in the area of ​​the tray 41 that carries the semiconductor workpiece 7. The semiconductor workpiece 7 is stably adsorbed and fixed on the surface of the tray 41 by negative pressure. The adsorption force is evenly distributed, which will not cause local stress deformation of the semiconductor workpiece 7 and ensure the grinding and processing accuracy.

[0045] like Figure 1 As shown, the machine body 1 includes a frame 11, a base 12 and a housing 13. The base 12 is located above the frame 11. The base 12 is equipped with a rotary motor 44 and the housing 13 respectively. The upper surface inside the housing 13 is provided with a radial slide rail 51.

[0046] The frame 11 supports the weight of the entire device, the base 12 provides a stable mounting reference for the bearing mechanism 4, and the housing 13 encloses the grinding area to prevent grinding debris and cleaning fluid from splashing out of the device during the grinding process, thus keeping the processing environment clean.

[0047] Working principle of the invention: Semiconductor workpiece 7 is placed on tray 41. Vacuum negative pressure is transmitted to the upper surface of tray 41 through suction main hole 411, connecting channel 413 and suction secondary hole 412, adsorbing and fixing semiconductor workpiece 7. Rotary motor 44 drives tray 41 and semiconductor workpiece 7 to rotate at a uniform speed. Electric spindle 22 drives grinding head 21 to rotate at high speed. Lifting mechanism 6 drives grinding head 21 to descend and contact the surface of semiconductor workpiece 7 for grinding. The radial feed mechanism 5 drives the grinding head 21 and the photoelectric sensor 32 to move synchronously outward along the radial direction of the semiconductor workpiece 7. The photoelectric sensor 32 is always located radially inside the grinding head 21, detecting the annular area just ground by the grinding head 21. When the detection beam shines on a smooth surface, the reflected light signal is strong; when it shines on a burr area, the reflected light signal is weak. The photoelectric sensor 32 determines the boundary position of the burr area by detecting the change in the reflected light signal. Since the grinding head 21 and the photoelectric sensor 32 move outward synchronously, when the photoelectric sensor 32 detects the burr boundary, the grinding head 21 has already moved to the corresponding radial position. At this time, the grinding head 21 no longer continues to move outward and starts grinding in place, thereby achieving precise coverage of the burr area. The grinding head 21 and the photoelectric sensor 32 are symmetrically arranged on both sides of the axis of the semiconductor workpiece 7 via a bidirectional lead screw 52, ​​achieving synchronous outward movement with a constant radial distance. The nozzle 33 sprays cleaning fluid at an angle along the chord of the semiconductor workpiece 7, and the centrifugal force washes away and dries the grinding debris. The isolation cover 34 prevents coolant splashing from interfering with the photoelectric sensor 32. The above process is repeated until the grinding head 21 moves to the edge of the semiconductor workpiece 7, completing the full grinding.

[0048] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A grinding apparatus for semiconductor structural components, the grinding apparatus being used to grind semiconductor workpieces (7), characterized in that: The grinding device includes a body (1), a grinding mechanism (2), a detection mechanism (3), a support mechanism (4), a radial feed mechanism (5), and a lifting mechanism (6). The body (1) is equipped with a support mechanism (4) and a radial feed mechanism (5). The radial feed mechanism (5) is equipped with a lifting mechanism (6) and a detection mechanism (3). The lifting mechanism (6) is equipped with a grinding mechanism (2). The grinding mechanism (2) and the detection mechanism (3) are symmetrically located above the semiconductor workpiece (7). The semiconductor workpiece (7) is placed on the support mechanism (4). The grinding mechanism (2) includes a grinding head (21); The detection mechanism (3) includes a cantilever (31), a photoelectric sensor (32) and a nozzle (33). The lower end of the cantilever (31) is provided with a photoelectric sensor (32) and a nozzle (33), and the nozzle (33) has an inclined opening. The diameter of the grinding head (21) is smaller than the radius of the semiconductor workpiece (7). A cantilever (31) is provided below the radial feed mechanism (5). The photoelectric sensor (32) is placed above the semiconductor workpiece (7). The nozzle (33) opening is inclined along the chord of the semiconductor workpiece (7).

2. The polishing apparatus for semiconductor structural components according to claim 1, characterized in that: The radial feed mechanism (5) includes a radial slide rail (51), a bidirectional lead screw (52), a radial feed slider (53), and a radial feed motor (54). The center plane of the bidirectional lead screw (52) is coplanar with the axis of the semiconductor workpiece (7). The radial slide rail (51) and the radial feed slider (53) are slidably connected. Two sets of radial feed sliders (53) are symmetrically arranged. A lifting mechanism (6) and a cantilever (31) are respectively provided below the two sets of radial feed sliders (53). The radial slide rail (51) is provided above the inside of the machine body (1). A radial feed motor (54) is provided on one side of the radial slide rail (51). A bidirectional lead screw (52) is provided at the output end of the radial feed motor (54). The bidirectional lead screw (52) and the radial slide rail (51) are rotatably connected. The bidirectional lead screw (52) and the radial feed slider (53) are threadedly connected. The outer ring thread of the bidirectional lead screw (52) is symmetrically opposite from the center to both sides.

3. The polishing apparatus for semiconductor structural components according to claim 1, characterized in that: The detection mechanism (3) also includes an isolation cover (34) and an inlet pipe (35). The isolation cover (34) is located below the cantilever (31). The photoelectric sensor (32) is placed in the inner ring of the isolation cover (34). One end of the inlet pipe (35) is connected to the nozzle (33) pipe, and the other end of the inlet pipe (35) passes through the machine body (1).

4. The polishing apparatus for semiconductor structural components according to claim 1, characterized in that: The grinding mechanism (2) also includes an electric spindle (22), the lifting mechanism (6) is provided with an electric spindle (22), and the output end of the electric spindle (22) is provided with a grinding head (21).

5. A polishing apparatus for semiconductor structural components according to any one of claims 1 to 4, characterized in that: The lifting mechanism (6) includes a lifting slide rail (61), a lifting screw (62), a lifting motor (63), and a lifting slider (64). The lifting slide rail (61) is fixed below the radial feed slider (53). The lifting slide rail (61) is equipped with a lifting motor (63). The output end of the lifting motor (63) is equipped with a lifting screw (62). The lifting screw (62) and the lifting slide rail (61) are rotatably connected. The lifting screw (62) and the lifting slider (64) are threadedly connected. The lifting slider (64) and the lifting slide rail (61) are slidably connected. An electric spindle (22) is provided on one side of the lifting slider (64).

6. The polishing apparatus for semiconductor structural components according to claim 5, characterized in that: The supporting mechanism (4) includes a tray (41), a rotary joint (42), a fixed joint (43), and a rotary motor (44). The rotary joint (42) is provided below the tray (41). The fixed joint (43) is fitted around the outer ring of the rotary joint (42). The rotary joint (42) and the fixed joint (43) are rotatably connected. The rotary joint (42) and the fixed joint (43) are internally connected. The rotary motor (44) is fixed inside the machine body (1). The output end of the rotary motor (44) is provided with a rotary joint (42).

7. The polishing apparatus for semiconductor structural components according to claim 6, characterized in that: The tray (41) has a main suction hole (411) in the middle, and a number of secondary suction holes (412) are provided on the outer periphery of the main suction hole (411). A connecting channel (413) is provided between the main suction hole (411) and the secondary suction holes (412).

8. The polishing apparatus for semiconductor structural components according to claim 7, characterized in that: The rotary joint (42) has several vent holes (421) circumferentially arranged at its lower end, and the rotary joint (42) has a main ventilation channel (422) inside, and the vent holes (421) and the main ventilation channel (422) are connected. The fixed connector (43) is provided with an air intake hole (431) on the outside and an air intake channel (432) on the inner ring of the fixed connector (43). The air intake hole (431) and the air intake channel (432) are connected. The air intake channel (432) and the air vent (421) are connected, and the main air vent (422) and the main air intake vent (411) are connected.

9. A polishing apparatus for semiconductor structural components according to claim 8, characterized in that: The machine body (1) includes a frame (11), a base (12) and a housing (13). The base (12) is provided above the frame (11). A rotary motor (44) and a housing (13) are respectively provided on the base (12). A radial slide rail (51) is provided on the inner upper surface of the housing (13).

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