High temperature sample collection and transport device

Abstract

The embodiments of this disclosure provide a high-temperature sample collection and transport device suitable for transporting high-temperature samples, comprising: a chassis frame having a first placement area and a second placement area for carrying samples; a first cooling mechanism detachably disposed in the first placement area and forming a sealed cooling chamber together with the chassis frame to accommodate the sample to be cooled, the first cooling mechanism including at least one cooler, the cold end of the cooler being located inside the cooling chamber and the hot end of the cooler being exposed outside the cooling chamber; and a second cooling mechanism disposed in the second placement area and configured to forcibly dissipate heat from at least one of the sample in the second placement area and the hot end of the cooler.

Description

Technical Field

[0001] This disclosure relates to the field of transfer equipment technology, and in particular to a high-temperature sample collection and transfer device. Background Technology

[0002] Currently, in industries such as electrolytic aluminum and chemicals, the collection and transportation of high-temperature samples mainly rely on manual operation. Taking the electrolytic aluminum industry as an example, operators need to retrieve shaped aluminum or electrolyte samples one by one from the electrolytic cell, mark each sample, and then place it on-site to cool naturally. After the samples have cooled down, they are collected and transported to a designated location for centralized cooling and testing. A complete sampling usually involves dozens to hundreds of samples, requiring personnel to frequently move between various electrolytic cells.

[0003] The above-mentioned operating method has obvious drawbacks: First, the natural cooling rate is slow, and the samples remain at a high temperature for an extended period, which not only occupies a large amount of on-site space but also greatly increases the risk of burns to operators during subsequent handling. Second, the sampling and transportation processes are disconnected, lacking integrated cooling and transportation tools, making it impossible to conduct sample collection, temporary storage, and cooling in a coherent manner, resulting in low overall operational efficiency. Furthermore, freshly formed samples cannot be directly touched or handled, further exacerbating the operational difficulty and safety risks. Summary of the Invention

[0004] In view of this, embodiments of the present disclosure provide a high-temperature sample collection and transport device to at least partially solve the above-mentioned technical problems.

[0005] This disclosure provides a high-temperature sample collection and transport device suitable for transporting high-temperature samples, comprising: a chassis frame having a first placement area and a second placement area for carrying the sample; a first cooling mechanism detachably disposed in the first placement area and forming a sealed cooling chamber with the chassis frame to accommodate the sample to be cooled, the first cooling mechanism including at least one cooler, the cold end of the cooler being located inside the cooling chamber and the hot end of the cooler being exposed outside the cooling chamber; and a second cooling mechanism disposed in the second placement area and configured to forcibly dissipate heat from at least one of the sample in the second placement area and the hot end of the cooler.

[0006] According to embodiments of this disclosure, the cooler includes a semiconductor cooler; the first cooling mechanism further includes a temperature control unit electrically connected to the semiconductor cooler and configured to control the cooling power of the semiconductor cooler.

[0007] According to an embodiment of the present disclosure, the first cooling mechanism further includes: a cover detachably mounted on the first storage area, the portion of the cover and the chassis frame defining the cooling cavity; at least two sleeves spaced apart in the cooling cavity, each sleeve defining a first storage space to accommodate at least one of the samples.

[0008] According to an embodiment of this disclosure, the portion of the chassis frame opposite to the second storage area is hollowed out; the second cooling mechanism includes: a fan disposed on the chassis frame and opposite to the second storage area; and a battery unit disposed on the chassis frame and electrically connected to the fan and / or the cooler.

[0009] According to an embodiment of this disclosure, the high-temperature sample collection and transport device further includes: at least one basket, detachably disposed in the second storage area, the basket having at least two second storage positions for each of the above-mentioned samples; wherein, the portion of the basket corresponding to each of the second storage positions is provided with a unique identifier corresponding to the second storage position.

[0010] According to embodiments of this disclosure, the high-temperature sample collection and transfer device further includes at least two of the aforementioned baskets, which are stacked together; and / or, at least two of the aforementioned second storage positions are arranged in an array within the aforementioned baskets.

[0011] According to an embodiment of this disclosure, the high-temperature sample collection and transfer device further includes: a clamping mechanism disposed in the second storage area, having a clamping state for clamping the basket and a separation state for releasing the basket; when the clamping mechanism is in the clamping state, the basket is held in the second storage position.

[0012] According to an embodiment of this disclosure, the clamping mechanism includes: an actuating part having a mounting end and an output end, the mounting end being disposed on the chassis frame; and a clamping plate disposed on the output end and configured to move with the actuating part between a clamping position abutting the basket and a disengaging position detached from the basket, so that the clamping mechanism has the clamping state and the disengaging state.

[0013] According to an embodiment of this disclosure, the clamping mechanism further includes a guide portion disposed between the chassis frame and the clamping plate, wherein the guide portion is configured as a scissor structure.

[0014] According to an embodiment of this disclosure, the chassis frame is provided with a first connecting portion and a second connecting portion at opposite ends. The first connecting portion of one of the high-temperature sample collection and transfer devices is configured to be detachably connected to the second connecting portion of another high-temperature sample collection and transfer device. The high-temperature sample collection and transfer device further includes a locking member configured to be connected between the first connecting portion of one high-temperature sample collection and transfer device and the second connecting portion of another high-temperature sample collection and transfer device, so that at least two high-temperature sample collection and transfer devices are kept in a sequentially connected state.

[0015] According to an embodiment of the present disclosure, the first connecting portion is configured as a recess, and the second connecting portion is configured as a protrusion that can engage with the recess.

[0016] According to embodiments of this disclosure, the high-temperature sample collection and transport device further includes: at least two rotating rods symmetrically arranged on both sides of the chassis frame and pivotally connected to the chassis frame; and a telescopic member configured in a U-shape, one end of which is telescopically disposed on one of the rotating rods, and the other end of which is telescopically disposed on the top of the two rotating rods.

[0017] According to an embodiment of this disclosure, the high-temperature sample collection and transfer device further includes a connecting rod, one end of which is detachably connected to the telescopic component of one of the high-temperature sample collection and transfer devices, and the other end of which is detachably connected to the telescopic component of another of the high-temperature sample collection and transfer devices.

[0018] The high-temperature sample collection and transport device provided in this disclosure divides the chassis frame into a first storage area and a second storage area, and a first cooling mechanism is detachably installed in the first storage area. This first cooling mechanism, together with the chassis frame, forms a sealed cooling chamber. The cold end of its built-in cooler directly acts on the sample inside the chamber, using active cooling instead of natural cooling, significantly shortening the duration of high sample temperature and eliminating the risk of burns and space occupation from the source. Simultaneously, the hot end of the cooler is exposed outside the chamber, preventing heat accumulation from affecting cooling efficiency. Meanwhile, the second cooling mechanism in the second storage area can forcibly dissipate heat from the temporarily stored sample and the hot end of the cooler. This ensures stable performance of the cooling system during continuous operation and allows for seamless connection of the entire process from sample collection, cooling to transport on the same platform, eliminating the need for back-and-forth handling or waiting for natural cooling, thereby significantly improving overall operational efficiency. Attached Figure Description

[0019] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0020] Figure 1A perspective view of a high-temperature sample collection and transport apparatus according to an embodiment of the present disclosure is shown schematically.

[0021] Figure 2 yes Figure 1 A three-dimensional view of the high-temperature sample collection and transport device from an upward perspective;

[0022] Figure 3 yes Figure 1 The enlarged view from another angle of the high-temperature sample collection and transport device shows the temperature control unit;

[0023] Figure 4 This is a diagram showing the usage status of two high-temperature sample collection and transport devices connected by a connecting rod.

[0024] Figure 5 yes Figure 1 The enlarged view of the first cooling mechanism shown is partially obscured, with the cover omitted.

[0025] Figure 6 yes Figure 1 The diagram shows the usage state where the first cooling mechanism is separated from the chassis frame.

[0026] Figure 7 yes Figure 1 The enlarged view of the basket shown illustrates the second storage compartment;

[0027] Figure 8 yes Figure 1 A partially enlarged view of the clamping mechanism shown.

[0028] Figure label:

[0029] 10. Chassis frame; 11. Road wheels; 12. Foot brake plate; 13. First connecting part; 14. Second connecting part; 15. Locking element; 16. Partition; 17. First storage area; 18. Second storage area;

[0030] 20. First cooling mechanism; 21. Cover; 22. Refrigerator; 221. Hot end; 222. Cold end; 23. Sleeve; 24. Temperature control unit;

[0031] 30. Basket body; 31. Second storage location; 32. Unique identifier;

[0032] 40. Sample;

[0033] 50. Rotating rod;

[0034] 60; Telescopic component; 61; Button;

[0035] 70. Second cooling mechanism; 71. Fan; 72. Battery unit;

[0036] 80. Clamping mechanism; 81. Actuating part; 82. Clamping plate; 83. Guide part;

[0037] 90. Connecting rod. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0039] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0040] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0041] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0042] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0043] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0044] Figure 1 A perspective view of a high-temperature sample collection and transport apparatus according to an embodiment of the present disclosure is shown schematically. Figure 2 yes Figure 1 The image shows a three-dimensional view of the high-temperature sample collection and transport device from an upward perspective.

[0045] This disclosure provides a high-temperature sample collection and transport device suitable for transporting high-temperature samples 40, specifically including but not limited to aluminum samples or electrolyte samples, as described above. Figure 1 and Figure 2 As shown, the system includes a chassis frame 10, a first cooling mechanism 20, and a second cooling mechanism 70. The first cooling mechanism 20 is detachably disposed in the first storage area 17 and, together with the chassis frame 10, forms a sealed cooling chamber to accommodate the sample 40 to be cooled. The first cooling mechanism 20 includes at least one cooler 22, with the cold end 222 of the cooler 22 located inside the cooling chamber and the hot end 221 of the cooler 22 exposed outside the cooling chamber. The second cooling mechanism 70 is disposed in the second storage area 18 and is configured to forcibly dissipate heat from at least one of the sample 40 in the second storage area 18 and the hot end 221 of the cooler 22.

[0046] In some illustrative embodiments, reference is made to Figure 1 As shown, the chassis frame 10 is assembled from square steel tubes by welding to form a truss structure, ensuring sufficient structural strength and load-bearing capacity. Further, refer to... Figure 2 As shown, travel wheels 11 are installed at the four corners of the bottom of the chassis frame 10 to facilitate the overall movement of the high-temperature sample collection and transfer device. The travel wheels 11 can be passive wheels, i.e., wheels without active movement; alternatively, the travel wheels 11 can also be equipped with drive components such as motors to form active wheels with active movement capabilities. Furthermore, at least a portion of the travel wheels 11 are equipped with foot brakes 12 on their sides. By pressing the foot brakes 12, the operator can lock the travel wheels 11, ensuring the device remains stable during sampling or loading / unloading materials.

[0047] Reference Figure 1As shown, the internal space of the chassis frame 10 is divided into two functional areas by a partition 16. Specifically, one of the two sides of the partition 16 forms a first storage area 17 with an upper opening for installing the first cooling mechanism 20 described below; the other forms a second storage area 18 located in the internal cavity of the chassis frame 10 for carrying and transporting the cooled or uncooled sample 40.

[0048] Based on this, the first cooling mechanism 20 is detachably assembled at the first placement area 17. The first cooling mechanism 20 includes at least one cooler 22, with the cold end 222 of the cooler 22 facing the interior of the cooling chamber, directly contacting the sample 40 or efficiently absorbing heat from the sample 40 through a thermally conductive medium (such as thermally conductive silicone); the hot end 221 of the cooler 22 protrudes from the cover 21 and is exposed to the environment outside the cooling chamber. By placing the hot end 221 and the cold end 222 separately inside and outside the chamber, the heat generated by the cooler 22 itself can be effectively prevented from accumulating inside the cooling chamber, thereby maintaining stable cooling efficiency.

[0049] Furthermore, the second cooling mechanism 70 is disposed in the second placement area 18 and configured to perform a dual heat dissipation function: on the one hand, the forced airflow it generates can purge and cool the sample 40 placed in the second placement area 18; on the other hand, the airflow can also act on the hot end 221 of the cooler 22 exposed to the outside of the cooling chamber, subjecting it to forced convection heat dissipation, ensuring that the cooler 22 can operate continuously and stably for a long time. Preferably, the portion of the chassis frame 10 corresponding to the second placement area 18 is configured with a hollow structure to facilitate airflow.

[0050] In the above embodiments, the high-temperature sample collection and transport device achieves a high degree of integration between cooling and transport functions. During operation, the high-temperature sample 40 can be placed by the operator in the cooling chamber of the first storage area 17 for rapid and active cooling, thereby solving the problem of slow natural cooling and significantly shortening the duration of the sample 40 being in a dangerously high-temperature state, eliminating the risk of burns. After cooling, the sample 40 can be transferred to the second storage area 18 for temporary storage or continue to be assisted in heat dissipation by the second cooling mechanism 70. At the same time, the forced heat dissipation of the hot end 221 of the cooler 22 by the second cooling mechanism 70 ensures the continuous performance of the cooling system. The entire sampling, cooling, and transport process is seamlessly connected on the same device, eliminating the need for personnel to travel back and forth or wait for the sample 40 to cool naturally, significantly improving operational efficiency.

[0051] Figure 3 yes Figure 1 The enlarged view from another angle of the high-temperature sample collection and transport device shows the temperature control unit.

[0052] According to embodiments of this disclosure, referring to Figure 2As shown, the cooler 22 includes a semiconductor cooler. The first cooling mechanism 20 also includes a temperature control unit 24, which is electrically connected to the semiconductor cooler and configured to control the cooling power of the semiconductor cooler.

[0053] According to embodiments of this disclosure, referring to Figure 1 and Figure 3 As shown, the chassis frame 10 has a first connecting portion 13 and a second connecting portion 14 at opposite ends. The first connecting portion 13 of one high-temperature sample collection and transfer device is configured to be detachably connected to the second connecting portion 14 of another high-temperature sample collection and transfer device. The high-temperature sample collection and transfer device also includes a locking member 15, configured to connect between the first connecting portion 13 of one high-temperature sample collection and transfer device and the second connecting portion 14 of another high-temperature sample collection and transfer device, so that at least two high-temperature sample collection and transfer devices are kept in a sequentially connected state.

[0054] According to embodiments of this disclosure, referring to Figure 1 and Figure 3 As shown, the first connecting portion 13 is configured as a recess, and the second connecting portion 14 is configured as a protrusion that can fit into the recess.

[0055] In some illustrative embodiments, reference is made to Figure 1 and Figure 3 As shown, the chassis frame 10 is a truss structure welded from square steel tubes, with a first connecting part 13 and a second connecting part 14 formed at both ends. Specifically, the square steel tube end of one end of the chassis frame 10 is open, and its internal cavity naturally forms a concave structure; an extension rod is fixedly installed on the opposite side of the other end of the chassis frame 10. The size and shape of the extension rod are configured to be able to be inserted into the open end cavity of the chassis frame 10 of another high-temperature sample collection and transfer device, thereby forming a convex structure that fits into the concave. When multiple high-temperature sample collection and transfer devices need to be connected into a vehicle group, the extension rod of one device can be inserted into the cavity of the square tube end of another device to achieve rapid alignment and fitting. In addition, the high-temperature sample collection and transfer device is also equipped with a pin as a locking element 15. The pin can be simultaneously inserted into the corresponding pin hole on the side wall of the fitted square tube and the extension rod, thereby locking the two and keeping at least two high-temperature sample collection and transfer devices in a stable connected state in a sequential arrangement.

[0056] In this implementation, the connection method, which utilizes the concave portion formed by the square steel tube's own structure to engage with the convex portion of the extension rod, eliminates the need for additional complex connecting parts. The structure is simple and makes full use of the existing components of the chassis frame 10. The insertion of the locking pin ensures the overall rigidity when multiple high-temperature sample collection and transfer devices are linked, allowing operators to push multiple fully loaded sample trolleys at once, significantly improving the efficiency of large-scale sample collection and transfer. When a single high-temperature sample collection and transfer device needs to be used, simply pulling out the locking pin and removing the extension rod from the end of the square tube allows for quick separation, balancing the flexibility of multi-vehicle coordination with independent single-vehicle use.

[0057] According to embodiments of this disclosure, referring to Figure 1 and Figure 3 As shown, the high-temperature sample collection and transport device also includes at least two rotating rods 50 and a telescopic component 60. The at least two rotating rods 50 are symmetrically arranged on both sides of the chassis frame 10 and pivotally connected to the chassis frame 10. The telescopic component 60 is configured with a U-shaped structure, with one end of the telescopic component 60 telescopically connected to one of the rotating rods 50, and the other end of the telescopic component 60 telescopically connected to the top of the two rotating rods 50.

[0058] In some illustrative embodiments, reference is made to Figure 1 and Figure 3 As shown, the high-temperature sample collection and transfer device also includes two rotating rods 50 and a telescopic component 60. The two rotating rods 50 are symmetrically arranged on both sides of the chassis frame 10, and their lower ends are connected to the side wall of the chassis frame 10 through a pivot shaft, so that the rotating rods 50 can rotate forward or backward relative to the chassis frame 10, thereby realizing the adjustment of the armrest angle or folding for storage. The upper part of each rotating rod 50 is hollow tubular, forming an outer sleeve structure.

[0059] Specifically, the telescopic component 60 is U-shaped, with its two side rods serving as inner sleeves, slidably inserted into the hollow cavities of the two rotating rods 50. A button 61 is mounted on the crossbeam of the telescopic component 60, which is linked to a locking mechanism inside the component. Multiple positioning holes are axially formed on the wall of the rotating rods 50. When button 61 is pressed, the locking mechanism releases the constraint on the positioning holes, allowing the telescopic component 60 to slide freely up and down to adjust its height. When button 61 is released, the locking mechanism automatically resets, and its locking tongue engages with the positioning hole corresponding to the current height, thus reliably fixing the telescopic component 60 in any adjusted position. This height-adjustable handrail design allows operators to flexibly adjust the handrail height according to their height or operating habits, improving comfort and convenience. When not in use or for storage, the rotating rods 50 and the telescopic component 60 can be folded towards the chassis frame 10, reducing the overall footprint of the device.

[0060] It should be noted that the above-mentioned locking mechanism is not the focus of this disclosure. The relative position of the telescopic rod and the rotating rod 50 can also be fixed by other locking methods such as corresponding holes and pins, which will not be elaborated here.

[0061] Figure 4 This is a diagram showing the usage status of two high-temperature sample collection and transport devices connected by a connecting rod.

[0062] According to embodiments of this disclosure, referring to Figure 4 As shown, the high-temperature sample collection and transfer device also includes a connecting rod 90. One end of the connecting rod 90 is detachably connected to the telescopic component 60 of one high-temperature sample collection and transfer device, and the other end of the connecting rod 90 is detachably connected to the telescopic component 60 of another high-temperature sample collection and transfer device.

[0063] In some illustrative embodiments, reference is made to Figure 4 As shown, when multiple high-temperature sample collection and transport devices are assembled into a vehicle group via the aforementioned connecting structure, each high-temperature sample collection and transport device is also equipped with a connecting rod 90. Both ends of the connecting rod 90 are respectively provided with snap-fit ​​structures adapted to the telescopic components 60, such as U-shaped buckles or clamps, and are detachably fixed using quick-release bolts or pins. In use, one end of the connecting rod 90 is secured to the telescopic component 60 of one device, and the other end is secured to the telescopic component 60 of an adjacent device, thereby connecting the handrails of multiple devices to each other, enhancing the overall stability of the vehicle group during movement, and preventing swaying or deviation due to different travel speeds of the vehicles. When a specific high-temperature sample collection and transport device needs to be used alone, it can be quickly separated simply by loosening the snap-fit ​​structures at both ends of the connecting rod 90.

[0064] Figure 5 yes Figure 1 The first cooling mechanism shown is a partial enlarged view, omitting the cover. Figure 6 yes Figure 1 The diagram shows the usage state where the first cooling mechanism is separated from the chassis frame.

[0065] According to embodiments of this disclosure, referring to Figure 5 and Figure 6 As shown, the first cooling mechanism 20 also includes a cover 21 and at least two sleeves 23. The cover 21 is detachably mounted to the first storage area 17, and the portion of the cover 21 enclosed by the chassis frame 10 defines a cooling chamber. At least two sleeves 23 are spaced apart in the cooling chamber, and each sleeve 23 defines a first storage space to accommodate at least one sample 40.

[0066] In some illustrative embodiments, reference is made to Figure 5 and Figure 6As shown, the aforementioned cooler 22 includes, but is not limited to, a semiconductor cooler. A semiconductor cooler, also known as a thermoelectric cooler or thermoelectric differential cooler, is a solid-state device that utilizes the Peltier effect of semiconductor materials to achieve cooling. Its basic structure typically consists of multiple pairs of P-type and N-type semiconductor thermocouples connected in series via copper conductors and sandwiched between two ceramic substrates. When direct current passes through this thermoelectric stack, electrons undergo energy level changes as they pass through the semiconductor junctions, causing one junction to absorb heat (forming a cold end 222) and the other junction to release heat (forming a hot end 221). Thus, by placing the cold end 222 and the hot end 221 in different environments inside and outside the cooling chamber, unidirectional heat transfer can be achieved.

[0067] Based on this, the first cooling mechanism 20 also includes a temperature control unit 24, which is electrically connected to the semiconductor cooler and configured to adjust its cooling power by controlling the direction and magnitude of the current input to the semiconductor cooler. Changing the current direction allows the hot and cold ends 221 to be interchanged to adapt to different temperature control requirements; adjusting the current magnitude allows for precise control of the cooling capacity, thereby achieving precise management of the cooling process of the sample 40.

[0068] It should be noted that the semiconductor cooler is only one exemplary cooling method in this disclosure and does not constitute a limitation on the scope of protection of this disclosure. Any other type of cooling mechanism that can be applied to the cooling scenario of sample 40, such as a compressor cooling module, phase change cold storage material, or circulating water cooling system, can be selected and applied according to actual needs, provided that it can achieve active cooling of sample 40 and can be detachably installed in this device.

[0069] In some illustrative embodiments, reference is made to Figure 5 and Figure 6 As shown, the first cooling mechanism 20 also includes a cover 21 and a plurality of sleeves 23 spaced apart along the extension direction of the first storage area 17. Specifically, the cover 21 is detachably mounted to the first storage area 17. When the cover 21 is separated from the chassis frame 10, the openings formed in each sleeve 23 are exposed. An operator can place the sample 40 to be cooled one by one into the sleeve 23 through the openings. The inner diameter of the sleeve 23 can be configured to be approximately the same as, or slightly larger than, the outer diameter of the sample 40, so that the sample 40 can be smoothly inserted into the sleeve 23 and thus contained. Furthermore, a cooler 22 (such as the semiconductor cooler described above) can be fixed to the cover 21, and when the cover 21 is closed, the cold end 222 of each cooler 22 is positioned within a corresponding sleeve 23 and interacts with the sample 40 to form a heat conduction.

[0070] In this implementation, the sleeve 23 configured in the first cooling mechanism 20 not only achieves orderly separation of multiple samples 40, avoiding collisions between them, but also further improves cooling efficiency by increasing the contact area between the samples 40 and the cooling environment. Compared with the traditional method of directly exposing the samples 40 to ambient air for natural cooling, this embodiment adopts a closed cooling chamber combined with a semiconductor cooler for active cooling, which has a significant difference in cooling effect: the closed chamber effectively blocks the intrusion of external heat, forming a relatively independent low-temperature environment; the cold end 222 of the semiconductor cooler acts directly on the samples 40, efficiently removing heat from the samples 40 through heat conduction. This active cooling method significantly shortens the duration of the samples 40 being in a dangerously high-temperature state, significantly improving cooling efficiency and operational safety.

[0071] Based on the embodiments of this disclosure, continue to refer to Figure 3 As shown, the chassis frame 10 has a perforated section opposite the second storage area 18. The second cooling mechanism 70 includes a fan 71 and a battery unit 72. The fan 71 is mounted on the chassis frame 10 and is positioned opposite the second storage area 18. The battery unit 72 is mounted on the chassis frame 10 and is electrically connected to the fan 71 and / or the cooler 22.

[0072] In some illustrative embodiments, reference is made to Figure 3 As shown, the portion of the chassis frame 10 opposite the second storage area 18 is perforated to form a through airflow channel. Specifically, the second cooling mechanism 70 includes a fan 71 and a battery unit 72. The fan 71 typically consists of fan blades and an electric motor. The motor drives the fan blades to rotate, causing directional airflow and thus forming forced convection airflow. The fan 71 is mounted on the chassis frame 10 and corresponds to the perforated position of the second storage area 18. Furthermore, the battery unit 72 is also mounted on the chassis frame 10 and is electrically connected to the fan 71 and / or the cooler 22, providing independent power support for the second cooling mechanism 70 and the cooling system, enabling the high-temperature sample collection and transport device to operate continuously without relying on an external power source.

[0073] It should be noted that the relative position of the fan 71 and the perforated structure of the second storage area 18 can be flexibly configured according to actual heat dissipation requirements: on the one hand, the fan 71 can blow air directly towards the perforated area, allowing the forced airflow to directly act on the sample 40 temporarily stored in the second storage area 18 through the perforated structure, purging and cooling it; on the other hand, this airflow can also act on the hot end 221 of the cooler 22 exposed outside the cooling chamber. When the perforated structure and the hot end 221 of the cooler 22 are misaligned (e.g., misaligned vertically), although the airflow generated by the fan 71 cannot directly blow on the hot end 221, the airflow carries away the air beside the hot end 221, creating a local pressure difference in the horizontal direction, thereby inducing surrounding air to flow across the surface of the hot end 221, achieving indirect forced heat dissipation of the hot end 221. This design, by optimizing the airflow path, effectively avoids the accumulation of heat outside the cooling chamber, ensuring that the cooler 22 can maintain stable cooling performance for a long time.

[0074] Figure 7 yes Figure 1 The enlarged view of the basket shown illustrates the second storage compartment.

[0075] According to embodiments of this disclosure, referring to Figure 6 and Figure 7 As shown, the high-temperature sample collection and transport device also includes at least one basket 30. At least one basket 30 is detachably disposed in the second storage area 18, and the basket 30 has at least two second storage positions 31, each accommodating one sample 40. The portion of the basket 30 corresponding to each second storage position 31 is equipped with a unique identifier 32 corresponding to the second storage position 31.

[0076] According to embodiments of this disclosure, referring to Figure 6 and Figure 7 As shown, the high-temperature sample collection and transfer device also includes at least two baskets 30, which are stacked together. And / or, at least two second storage positions 31 are arranged in an array within the baskets 30.

[0077] In some illustrative embodiments, reference is made to Figure 6 and Figure 7 As shown, the basket 30 includes, but is not limited to, a rectangular cage (or box) structure made of high-temperature resistant material, the interior of which is divided by crisscrossing grids to form multiple independent and orderly arranged storage spaces. Each independent storage space is a second storage position 31, used to hold a sample 40 that has been preliminarily cooled or is to be transported.

[0078] Furthermore, the aforementioned multiple second storage positions 31 are preferably arranged in an array (e.g., multiple rows and columns) within the basket 30 to achieve neat placement and rapid counting of the samples 40. Each second storage position 31 is marked with a unique identifier 32 on its edge or partition 16. This unique identifier 32 includes, but is not limited to, printed or etched numbers, letters, QR codes, or barcodes, such as a combination of row and column numbers, giving each storage position independent and unique coordinate information. Through this design, operators can place samples 40 collected from different electrolytic cells into their corresponding numbered storage positions in a preset order, thus achieving a one-to-one correspondence between the sample 40 and the sampling location, facilitating subsequent quality traceability and data statistics.

[0079] Furthermore, the high-temperature sample collection and transport device may include at least two baskets 30, which are stacked within the second storage area 18. That is, the high-temperature sample collection and transport device can stack two, three, four, or any other number of baskets 30. The edges of these baskets 30 may have mutually cooperating positioning protrusions and grooves to ensure structural stability when multiple layers are stacked. The stacking design fully utilizes the vertical space of the second storage area 18, significantly increasing the number of samples 40 that can be carried in a single transport, thereby further improving the overall efficiency of sampling and transport operations.

[0080] Figure 8 yes Figure 1 A partially enlarged view of the clamping mechanism shown.

[0081] According to embodiments of this disclosure, referring to Figure 1 and Figure 8 As shown, the high-temperature sample collection and transfer device also includes a clamping mechanism 80. The clamping mechanism 80 is disposed in the second storage area 18 and has a clamping state for holding the basket 30 and a disengaging state for releasing the basket 30. When the clamping mechanism 80 is in the clamping state, the basket 30 is held in the second storage position 31.

[0082] According to embodiments of this disclosure, referring to Figure 8 As shown, the clamping mechanism 80 includes an actuating part 81 and a clamping plate 82. The actuating part 81 has a mounting end and an output end, with the mounting end disposed on the chassis frame 10. The clamping plate 82 is disposed on the output end and is configured to move with the actuating part 81 between a clamping position abutting against the basket 30 and a disengaging position detached from the basket 30, so that the clamping mechanism 80 has a clamping state and a disengaging state.

[0083] According to embodiments of this disclosure, referring to Figure 8 As shown, the clamping mechanism 80 also includes a guide portion 83. The guide portion 83 is disposed between the chassis frame 10 and the clamping plate 82, and the guide portion 83 is configured as a scissor mechanism.

[0084] In some illustrative embodiments, reference is made to Figure 8 As shown, the clamping mechanism 80 includes an actuating part 81, a clamping plate 82, and a guiding part 83. Specifically, the actuating part 81 has a mounting end and an output end. The mounting end is fixed to the chassis frame 10, and the output end is connected to the clamping plate 82. The actuating part 81 can be a linear drive element such as an electric push rod, a cylinder, or a linear motor, driving the clamping plate 82 to move through the telescopic movement of the output end. The clamping plate 82 is located at the output end of the actuating part 81 and can reciprocate between a clamping position against the basket 30 and a disengaging position away from the basket 30 as the actuating part 81 moves, thereby enabling the clamping mechanism 80 to switch between a clamping state and a disengaging state.

[0085] Furthermore, a guide section 83 is disposed between the actuating section 81 and the clamping plate 82, specifically configured as a scissor structure. This scissor structure consists of one (or more) sets of hinged links, used to guide the clamping plate 82 to move smoothly along a predetermined trajectory. Taking a typical single-set scissor structure as an example: one end of one link is pivotally connected to the side wall of the chassis frame 10, while the other end forms both a pivotal and sliding connection with the clamping plate 82; one end of another link is pivotally connected to the side wall of the clamping plate 82, while the other end forms both a pivotal and sliding connection with the side wall of the chassis frame 10. Through this combination of hinged and sliding connections, the scissor structure not only ensures the clamping plate 82 maintains stable posture during movement but also provides a certain force amplification effect, enabling the clamping plate 82 to clamp against the basket 30 with an appropriate clamping force.

[0086] Positionally, the clamping plate 82 and the partition plate 16 used to separate the first storage area 17 and the second storage area 18 are arranged horizontally opposite each other. When the basket 30 is placed in the second storage area 18, the clamping plate 82 and the partition plate 16 are located on opposite sides of the bottom basket 30. When the clamping mechanism 80 is activated, the clamping plate 82 moves towards the partition plate 16, and together with the partition plate 16, clamps the bottom basket 30 from both sides. Because the baskets 30 adopt a stacked structure with positioning protrusions and grooves, the upper baskets 30 are stably stacked on top of the bottom basket 30 based on the interlocking relationship. Therefore, when the bottom basket 30 is clamped and fixed, the upper baskets 30 are also held together. In this way, no matter how many layers of baskets 30 are stacked in the second storage area 18, only the bottom basket 30 needs to be clamped to achieve a stable fixation of the entire basket group 30. This not only simplifies the configuration of the clamping mechanism 80, but also ensures the stability of the multi-layer baskets 30 during transportation.

[0087] The above are merely specific embodiments of this disclosure, but the scope of protection of this application is not limited thereto. Any changes or substitutions made within the spirit and principles of this disclosure should be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A high-temperature sample collection and transport device, suitable for transporting high-temperature samples, characterized in that, include: The chassis frame (10) has a first storage area (17) and a second storage area (18) for carrying samples. The first cooling mechanism (20) is detachably disposed in the first storage area (17) and together with the chassis frame (10) forms a closed cooling chamber to accommodate the sample to be cooled. The first cooling mechanism (20) includes at least one cooler (22), the cold end (222) of the cooler (22) is located inside the cooling chamber, and the hot end (221) of the cooler (22) is exposed outside the cooling chamber. A second cooling mechanism (70) is disposed in the second storage area (18) and configured to force heat dissipation on at least one of the sample in the second storage area (18) and the hot end (221) of the cooler (22).

2. The high-temperature sample collection and transport device according to claim 1, characterized in that, The cooler (22) includes a semiconductor cooler; The first cooling mechanism (20) further includes: The temperature control unit (24), electrically connected to the semiconductor cooler, is configured to control the cooling power of the semiconductor cooler.

3. The high-temperature sample collection and transport device according to claim 1 or 2, characterized in that, The first cooling mechanism (20) further includes: The cover (21) is detachably mounted to the first storage area (17), and the portion enclosed by the cover (21) and the chassis frame (10) defines the cooling cavity; At least two sleeves (23) are spaced apart in the cooling chamber, each sleeve (23) defining a first storage space to accommodate at least one of the samples.

4. The high-temperature sample collection and transport device according to claim 1, characterized in that, The chassis frame (10) is partially hollowed out opposite to the second storage area (18); The second cooling mechanism (70) includes: A fan (71) is mounted on the chassis frame (10) and is positioned opposite to the second storage area (18); A battery unit (72) is disposed on the chassis frame (10) and electrically connected to the fan (71) and / or the cooler (22).

5. The high-temperature sample collection and transport device according to claim 1, characterized in that, Also includes: At least one basket (30) is detachably disposed in the second storage area (18), the basket (30) having at least two second storage compartments (31) for each of the samples; The portion of the basket (30) corresponding to each of the second storage locations (31) is equipped with a unique identifier (32) corresponding to the second storage location (31).

6. The high-temperature sample collection and transport device according to claim 5, characterized in that, It also includes at least two of the baskets (30), which are stacked together; And / or, at least two of the second storage locations (31) are arranged in an array within the basket (30).

7. The high-temperature sample collection and transport device according to claim 5 or 6, characterized in that, Also includes: A clamping mechanism (80) is provided in the second storage area (18) and has a clamping state for clamping the basket (30) and a separation state for releasing the basket (30); When the clamping mechanism (80) is in the clamping state, the basket (30) is held in the second storage position (31).

8. The high-temperature sample collection and transport device according to claim 7, characterized in that, The clamping mechanism (80) includes: The actuator (81) has a mounting end and an output end, wherein the mounting end is disposed on the chassis frame (10). A clamping plate (82) is disposed at the output end and is configured to move with the actuating part (81) between a clamping position abutting the basket (30) and a disengaging position detached from the basket (30) so that the clamping mechanism (80) has the clamping state and the disengaging state.

9. The high-temperature sample collection and transport device according to claim 8, characterized in that, The clamping mechanism (80) further includes: A guide (83) is disposed between the chassis frame (10) and the clamp (82), and the guide (83) is configured as a scissor lift structure.

10. The high-temperature sample collection and transport device according to claim 1, characterized in that, The chassis frame (10) is provided with a first connecting part (13) and a second connecting part (14) at opposite ends. The first connecting part (13) of one high-temperature sample collection and transfer device is configured to be detachably connected to the second connecting part (14) of another high-temperature sample collection and transfer device. The high-temperature sample collection and transfer device further includes a locking element (15) configured to connect between the first connecting part (13) of one of the high-temperature sample collection and transfer devices and the second connecting part (14) of the other high-temperature sample collection and transfer device, so that at least two of the high-temperature sample collection and transfer devices are kept in a sequentially connected state.

11. The high-temperature sample collection and transport device according to claim 10, characterized in that, The first connecting portion (13) is configured as a recess, and the second connecting portion (14) is configured as a protrusion that can engage with the recess.

12. The high-temperature sample collection and transport device according to claim 1, characterized in that, Also includes: At least two rotating rods (50) are symmetrically arranged on both sides of the chassis frame (10) and pivotally connected to the chassis frame (10). The telescopic member (60) is configured as a U-shaped structure, with one end of the telescopic member (60) telescopically disposed on one of the rotating rods (50), and the other end of the telescopic member (60) telescopically disposed on the top of one of the rotating rods (50).

13. The high-temperature sample collection and transport device according to claim 12, characterized in that, Also includes: A connecting rod (90), one end of which is detachably connected to the telescopic component (60) of one of the high-temperature sample collection and transfer devices, and the other end of which is detachably connected to the telescopic component (60) of another of the high-temperature sample collection and transfer devices.

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