Microalloyed copper foil processing device and processing method

Abstract

The application discloses a micro-alloy copper foil processing device and a processing method, which comprises a bottom plate, a unwinding mechanism, a cleaning mechanism and a micro-metal processing mechanism are arranged on the bottom plate, the unwinding mechanism is used for fixing the copper foil to be unwound, the cleaning mechanism is located between the micro-metal processing mechanism and the unwinding mechanism, and is used for cleaning the surface of the copper foil passing through after unwinding, the micro-metal processing mechanism comprises a material receiving roll, an ion gun and a rubber coating roller are arranged on one side of the material receiving roll, the ion gun is used for emitting micro-metal ions to the cleaned surface of the copper foil, and the rubber coating roller is used for brushing glue protection on the surface of the copper foil processed by the ion gun. The unwinding mechanism, the cleaning mechanism and the micro-metal processing mechanism are integrated on the bottom plate, the equipment structure is arranged in strict accordance with the processing sequence of the copper foil, the integrated continuous processing flow of the copper foil unwinding, cleaning, micro-alloy ion processing, glue coating protection and material receiving is realized, and the industry problems of process dispersion, complicated transfer and low processing efficiency of traditional segmented processing equipment are completely avoided.

Description

Technical Field

[0001] This application belongs to the field of micro-alloyed copper foil production technology, and in particular relates to a micro-alloyed copper foil processing device and processing method. Background Technology

[0002] Microalloyed copper foil, with its high strength, high conductivity, excellent corrosion resistance, and superior fatigue resistance, is widely used in high-frequency circuit boards, new energy storage, precision electronic devices, 5G terminal equipment, and other fields, making it a core basic material for the high-end electronics manufacturing industry. As electronic devices iterate towards miniaturization, high precision, and high stability, the market places higher demands on the surface cleanliness, coating uniformity, interfacial bonding strength, and overall protective performance of copper foil. Microalloying surface modification treatment has become the mainstream process for improving the comprehensive performance of copper foil.

[0003] Currently, existing microalloyed copper foil processing equipment still suffers from numerous technical defects in actual production. Firstly, traditional processing equipment suffers from a fragmented process layout, with poor coordination between unwinding, cleaning, ion modification, and adhesive coating. The segmented processing mode often leads to secondary contamination, surface misalignment, and tension fluctuations during copper foil transfer between processes, directly impacting the adhesion of subsequent microalloyed ions and resulting in poor product consistency and low yield. Secondly, existing cleaning structures often employ fixed brush bodies, failing to adaptively adjust the bonding spacing according to copper foil thicknesses and specifications. This poor brushing adaptability easily leads to cleaning dead zones, incomplete removal of surface oil and oxide impurities, and insufficient cleanliness of the copper foil substrate, making it highly susceptible to subsequent ion plating defects such as peeling, flaking, and uneven thickness.

[0004] Therefore, we need to design a micro-alloyed copper foil processing device and processing method to solve these problems. Summary of the Invention

[0005] The problem to be solved by this application is to provide a micro-alloyed copper foil processing device and processing method.

[0006] To achieve the above objectives, the technical solution adopted in this application is:

[0007] A micro-alloyed copper foil processing apparatus includes a base plate, on which an unwinding mechanism, a cleaning mechanism, and a micro-metal processing mechanism are disposed. The unwinding mechanism is used to fix the copper foil to be unwound. The cleaning mechanism is located between the micro-metal processing mechanism and the unwinding mechanism and is used to clean the surface of the copper foil that passes through it after unwinding. The micro-metal processing mechanism includes a take-up roll, on which an ion gun and a coating roller are disposed. The ion gun is used to emit micro-metal ions onto the cleaned copper foil surface, and the coating roller is used to apply adhesive to the copper foil surface after the ion gun treatment for protection.

[0008] Preferably, the micro-metal processing mechanism further includes a fixed frame and a receiving frame fixed on the base plate. The fixed frame is a portal frame with an adjustable frame slidably arranged on its top, and the ion gun is fixed on the adjustable frame. The receiving frame is located inside the fixed frame, and a receiving motor is fixedly arranged on the receiving frame. The receiving roll is rotatably arranged on the receiving frame, and one end of it is fixedly connected to the output end of the receiving motor.

[0009] This configuration, employing a portal frame as the support for the ion gun, leverages the portal frame structure's characteristics of uniform stress distribution, high rigidity, and resistance to deformation. This ensures long-term stable support of the ion gun, preventing vibration and shifting during prolonged operation and guaranteeing the stability of the ion plating process. Simultaneously, fixing the ion gun to a sliding adjustment frame allows for precise adjustment of the ion gun's horizontal position and processing coverage based on copper foils of varying widths and processing requirements. It also enables fine-tuning of the distance between the ion gun and the copper foil surface, flexibly adapting to the micro-alloying modification of various copper foil specifications, significantly enhancing the equipment's versatility and adaptability. In addition, the independently set up receiving rack has an embedded receiving drive structure. The receiving motor and the receiving roll adopt a direct drive method, which eliminates the gap error problem of traditional chain and belt drives. It has high transmission accuracy and stable power output, and can realize uniform traction and receiving of copper foil, ensuring that the copper foil travel speed is constant. This ensures that the ion plating time and plating thickness are consistent, effectively solving the problem of inconsistent finished product performance in batch processing. At the same time, the independent receiving rack has a neat layout, making the equipment disassembly, assembly, inspection and maintenance more convenient.

[0010] Preferably, the coating roller is rotatably connected to the receiving rack. A coating motor and a connecting frame are also fixedly mounted on the receiving rack. The output end of the coating motor is fixedly connected to the coating roller. A glue applicator is hinged on the connecting frame. The output end of the glue applicator is located between the ion gun and the coating roller and slides against the copper foil on the receiving roller. A torsion spring is also provided at the hinge between the connecting frame and the glue applicator. The torsion spring is used to press the output end of the glue applicator against the surface of the copper foil.

[0011] This configuration, with its independent motor driving the coating roller, allows for independent, stepless adjustment of the coating speed. It matches the optimal coating speed based on the copper foil's travel speed, adhesive viscosity, and required adhesive layer thickness, avoiding problems like glue piling, leakage, and uneven adhesive layer thickness caused by speed mismatch in traditional linked coating structures. Secondly, the use of a hinged adhesive applicator with a torsion spring elastic clamping structure, unlike traditional fixed adhesive applicators, allows the applicator to adaptively fine-tune its angle at the hinge point. Simultaneously, the torsion spring continuously provides stable elastic pressure, ensuring the applicator's output end remains tightly pressed against the moving copper foil surface. Even with slight deviations in copper foil flatness or minor vibrations, issues such as adhesive application breaks, localized missed areas, and loose adhesion will not occur. Furthermore, the adhesive applicator is precisely positioned between the ion gun and the coating roller, which allows for the uniform application and application of adhesive to the ion-modified copper foil surface in advance, laying the foundation for subsequent coating by the coating roller. The dual adhesive application and coating mode significantly improves the uniformity and integrity of the adhesive layer, fully encapsulates the micro-alloy coating, maximizes the protective effect, and effectively improves the finished product qualification rate.

[0012] Preferably, the cleaning mechanism includes a cleaning tank fixed on the base plate, at least two guide rollers are rotatably arranged on the top of the cleaning tank, an upper adjustment component and a lower adjustment component are arranged inside the cleaning tank, a main brush body is arranged between the upper adjustment component and the lower adjustment component, and the main brush body is rotatably connected to the cleaning tank.

[0013] This integrated design, employing a single tank structure, combines the cleaning tank, guide rollers, and brushing components into a compact unit with high space utilization, effectively reducing the overall footprint of the equipment and adapting to integrated production line layouts. Multiple guide rollers at the top of the cleaning tank precisely control the copper foil's trajectory, ensuring it enters the tank smoothly and straight, preventing deviation, wrinkling, or misalignment. The core design features a combination of an adjustable up-and-down component and the main brush body, breaking the limitations of traditional fixed brushes that can only clean specific points. The adjustable component can accommodate copper foil of varying thicknesses, precisely controlling the adhesion between the copper foil and the main brush body. Copper foil travels between the brushing structures, enabling all-around brushing of the board surface. Compared to traditional single-sided brushing and spray cleaning methods, mechanical brushing has a stronger cleaning power and can effectively remove stubborn oil stains, oxidation spots, and fine dust particles from the copper foil surface. It completely solves the problems of incomplete cleaning and dead corners in traditional cleaning methods, providing a high-cleanliness copper foil substrate for subsequent micro-metal ion plating and ensuring the quality of subsequent modification processing from the front-end process.

[0014] Preferably, both the upper adjustment assembly and the lower adjustment assembly include adjustment grooves disposed on a set of opposing inner walls of the cleaning tank. An adjustment screw is rotatably disposed within the adjustment groove. The adjustment screw has two sections of threads with opposite directions, and an adjustment block is matched on each section of the thread. An adjustment roller is disposed between the adjustment blocks that are positioned opposite each other on the two adjustment grooves. An adjustment motor is also fixedly disposed on the outer wall of the cleaning tank. The output end of the adjustment motor is fixedly connected to one end of the adjustment screw. When the adjustment motor rotates, the adjustment screw will drive the two adjustment blocks to move closer or further apart.

[0015] This innovative transmission structure, employing a bidirectional reverse-threaded screw, is the core optimization for adapting to the cleaning and processing of copper foil of various specifications. The adjusting screw features two sections with opposite threads, allowing a single screw to drive two sets of adjusting blocks synchronously towards or away from each other. Only one adjusting motor is needed to control the spacing of the two adjusting rollers, significantly simplifying the equipment's drive structure and reducing manufacturing costs and maintenance complexity. Compared to traditional multi-motor independent adjustment and manual adjustment methods, this structure offers high automation, high adjustment precision, and excellent synchronization. It can quickly and accurately adjust the clamping distance and pressure of the upper and lower adjusting rollers according to the thickness, hardness, and cleaning requirements of the copper foil. This ensures that thin copper foil is not stretched, deformed, or damaged due to excessive clamping, while thick copper foil is not left loosely clamped, resulting in insufficient brushing adhesion and inadequate cleaning. Simultaneously, the adjusting groove provides precise limiting and guidance for the adjusting blocks, preventing them from shifting or jamming, ensuring long-term operational stability, and significantly improving the equipment's adaptability and processing tolerance.

[0016] Preferably, a feeding motor is also fixedly installed on one side of the cleaning tank, and the output end of the feeding motor is connected to one of the guide rollers on the cleaning tank.

[0017] This setup, with an independent feeding motor directly driving the guide rollers, enables precise and independent control of the feeding speed in the cleaning process. The guide rollers, as the core transmission component for copper foil feeding, are directly driven by a dedicated motor, offering fast transmission response and precise speed control. This ensures uniform and stable feeding of the copper foil, effectively avoiding problems such as feeding jams, inconsistent speeds, and copper foil stretching caused by traditional equipment relying on rear-end traction feeding. Simultaneously, the independent feeding structure can precisely match the speed of the rear-end receiving and processing mechanisms, achieving coordinated speed across the entire line. This ensures stable tension throughout the copper foil unwinding, cleaning, modification, and receiving processes, preventing defects such as localized stretching deformation, wrinkles, and misalignment. This allows the cleaning process to maintain continuous, stable, and efficient operation, making it suitable for long-term, high-volume automated production operations.

[0018] Preferably, the brush body is located between the four adjusting rollers, and a plurality of auxiliary brush bodies are also arranged around the main brush body, with copper foil passing through the plurality of auxiliary brush bodies and the main brush body.

[0019] This design optimizes the coverage and cleaning power of the brushing process. It employs a combined brushing structure with a main brush at its core and multiple auxiliary brushes arranged around it, creating a comprehensive, dead-angle-free cleaning area. The copper foil travels between the main brush and the surrounding auxiliary brushes, enabling simultaneous cleaning of both sides and the entire surface of the board. This completely overcomes the shortcomings of traditional single-brush systems that can only clean localized areas and leave corners uncleaned. The coordinated operation of multiple brushes allows for layered and multi-stage cleaning of light dust, stubborn oil, and minor oxide scale on the copper foil surface. The progressively increasing cleaning power significantly enhances the cleaning effect, thoroughly removing fine impurities and maximizing the cleanliness of the copper foil surface. Simultaneously, the surrounding brush layout helps to guide and correct slight deviations during the copper foil's movement, ensuring a flat and consistent fit with the cleaning structure. This not only improves cleaning quality but also helps optimize the flatness of the copper foil during processing, providing a high-quality substrate for subsequent high-precision ion plating processes.

[0020] Preferably, the unwinding mechanism includes a feeding frame fixed on the base plate, a feeding roller detachably mounted on the feeding frame, and a magnetic powder brake fixedly mounted on the feeding frame, the output end of which is connected to the feeding shaft for transmission.

[0021] This design optimizes two key pain points for copper foil rolls: ease of feeding and stability of unwinding tension. Firstly, the unwinding roller features a detachable installation structure, allowing operators to quickly disassemble, replace, and align the copper foil rolls, significantly reducing downtime for material changes and improving overall equipment production efficiency. It also accommodates alternating processing of multiple batches and specifications of copper foil. Secondly, a magnetic powder brake is included for tension control. This brake precisely adjusts the unwinding resistance of the unwinding shaft in real time, achieving constant tension unwinding. During continuous copper foil unwinding, it effectively counteracts tension fluctuations caused by changes in roll diameter, preventing issues such as loosening and wrinkling of the copper foil due to excessive unwinding speed, or stretching, thinning, and breakage due to excessive tension. This ensures smooth, uniform, and stable unwinding throughout the process, mitigating subsequent processing quality problems caused by unwinding defects and guaranteeing the continuity and stability of the entire production line.

[0022] Preferably, a support frame is provided between the cleaning mechanism and the receiving roller, and a wiping roller is rotatably mounted on the support frame. The copper foil slides and adheres to the wiping roller. A wiping motor is also provided at one end of the wiping roller, and the output end of the wiping motor is connected to the wiping roller. When the wiping motor rotates, the rotation direction of the wiping roller is opposite to the movement direction of the copper foil.

[0023] This design, with its counter-rotating wiping roller added between the cleaning and micro-metal processing mechanisms, is a key optimized transition structure connecting the cleaning and ion modification processes. After washing and brushing, copper foil leaves a large amount of cleaning solution residue and impurities on its surface. If it directly enters the ion plating process, the moisture and residual liquid will severely affect the adhesion of metal ions, leading to blistering, peeling, and uneven plating, directly causing product scrap. The counter-rotating wiping roller, however, creates relative frictional motion with the copper foil's direction of travel, resulting in a larger wiping contact area and more uniform wiping force. This allows for quick and thorough removal of residual cleaning solution, water stains, and fine dust from the copper foil surface, achieving rapid drying and cleaning. Simultaneously, the independent wiping motor drive precisely controls the wiping roller's speed, adapting to copper foils with different travel speeds. This avoids scratching the surface due to excessively fast wiping or incomplete wiping due to excessively slow wiping, effectively isolating moisture and residual impurities from interfering with subsequent micro-alloy modification processes. This significantly improves the forming quality and adhesion of the ion plating layer, reducing the product defect rate.

[0024] A processing method for a micro-alloyed copper foil processing device includes: fixing a copper foil roll to a feeding rack via a feeding roller and then unwinding it; passing the unwound copper foil end through a cleaning mechanism and fixing it to a take-up roller on a micro-metal processing mechanism; adjusting the position of the adjusting roller by a motor to ensure that the copper foil is in contact with both the main brush and the auxiliary brush; adding cleaning solution to a cleaning tank until the cleaning solution covers half of the main brush; starting the equipment, the take-up roller rotates to move the copper foil, and the copper foil on the feeding rack first enters the cleaning tank, where its surface is cleaned by the main brush and the auxiliary brush; after cleaning, the copper foil is removed from the cleaning tank and wiped with cleaning solution by a wiping roller; then, an ion gun sputters the required alloy onto the copper foil surface in the form of ions; finally, it is coated with adhesive and dried to complete the micro-alloyed copper foil processing process.

[0025] The processing method is designed based on the structural characteristics of the equipment. First, it adopts a mode of fixed feeding, unified machine adjustment, and then batch production. By adjusting the roller spacing in advance, it accurately matches the copper foil specifications, ensuring the brushing and adhesion. At the same time, it adds cleaning fluid in a quantitative manner, standardizes and controls the cleaning conditions, and completely unifies the batch processing parameters to avoid errors from manual adjustment. Second, the overall process follows the core logic of unwinding and flattening, deep mechanical cleaning, wiping and drying of residual liquid, micro-metal ion plating modification, and finally coating with adhesive for protection and drying. The pre-treatment of deep cleaning and drying thoroughly removes impurities and moisture from the substrate surface, providing an ultra-high cleanliness substrate for ion plating. The intermediate ion sputtering modification can precisely form a uniform micro-alloy reinforcement layer on the copper foil surface, improving the mechanical properties, conductivity, and corrosion resistance of the copper foil. The post-treatment of immediate coating with adhesive and drying for protection can quickly solidify the protective layer, lock in the modification effect, and prevent the newly formed plating layer from being oxidized and damaged. The entire process is fully automated with interconnected equipment, requiring minimal human intervention. The processes are tightly integrated, resulting in high production efficiency, strong controllability of process parameters, and excellent batch consistency. This enables the stable production of high-performance, high-quality micro-alloyed copper foil, meeting the demands of large-scale industrial mass production.

[0026] The advantages and positive effects of this application are:

[0027] This application adopts a modular integrated design, integrating three core process structures—an unwinding mechanism, a cleaning mechanism, and a micro-metal treatment mechanism—on the base plate. The equipment structure is arranged strictly according to the copper foil processing sequence, realizing a continuous integrated processing flow for copper foil unwinding, cleaning, micro-alloy ion treatment, adhesive coating protection, and material collection. This completely avoids the industry problems of traditional segmented processing equipment, such as dispersed processes, cumbersome transportation, and low processing efficiency. The core process optimization design is to place the cleaning mechanism between the unwinding mechanism and the micro-metal treatment mechanism: the copper foil undergoes comprehensive cleaning after unwinding and before micro-metal ion plating, thoroughly removing impurities such as dust, oil, and oxide layers adhering to the copper foil during production, storage, and transportation. This fundamentally prevents impurities from obscuring the copper foil surface, effectively ensuring the subsequent adsorption and binding force of micro-metal ions and preventing processing defects such as ion plating peeling, uneven plating, and poor adhesion. Meanwhile, a protective coating roller structure is installed after the ion gun microalloying modification treatment. This structure can cover the copper foil surface with a protective adhesive layer immediately after the microalloy layer is formed, quickly isolating the oxidation, corrosion, and wear damage of the newly formed microalloy coating caused by air, moisture, and dust. This effectively locks in the modification processing effect and significantly improves the corrosion resistance, oxidation resistance, and service life of the finished microalloyed copper foil, taking into account processing precision, processing efficiency, and finished product quality. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is an isometric schematic diagram of the overall structure of this application;

[0030] Figure 2 This is the front view of this application;

[0031] Figure 3 This is a schematic diagram of the cleaning and adjustment components inside the cleaning tank of this application.

[0032] The annotations in the attached figures are explained as follows:

[0033] 1. Base plate; 2. Feeding rack; 3. Feeding roller; 4. Magnetic powder brake; 5. Cleaning tank; 6. Guide roller; 7. Torsion spring; 8. Air duct; 9. Wiping roller; 10. Wiping motor; 11. Fixing frame; 12. Ion gun; 13. Adhesive applicator; 14. Connecting frame; 15. Receiving rack; 16. Receiving motor; 17. Glue roller; 18. Glue roller; 19. Receiving roller; 20. Adjusting frame; 21. Support frame; 22. Feeding motor; 23. Copper foil; 24. Main brush body; 25. Auxiliary brush body; 261. Upper adjusting assembly; 262. Lower adjusting assembly; 2601. Adjusting chute; 2602. Adjusting screw; 2603. Adjusting block; 2604. Adjusting roller; 2605. Adjusting motor. Detailed Implementation

[0034] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0036] The following description, in conjunction with the accompanying drawings, further illustrates this application:

[0037] Example 1: As Figures 1-3 As shown, a micro-alloyed copper foil processing device includes a base plate 1, on which an unwinding mechanism, a cleaning mechanism, and a micro-metal processing mechanism are arranged. The unwinding mechanism is used to fix the copper foil 23 to be unwound, enabling stable output of the copper foil 23 roll and providing a raw material supply basis for subsequent continuous processing. The cleaning mechanism is located between the micro-metal processing mechanism and the unwinding mechanism, forming a front-to-back processing layout with the front-end unwinding mechanism and the rear-end micro-metal processing mechanism. It is used to clean the surface of the copper foil 23 that passes through it after unwinding, removing impurities from the surface of the copper foil 23 and ensuring the processing basis for subsequent micro-metal processing steps. Basic conditions; the micro-metal processing mechanism includes a take-up roll, which serves as the traction terminal of the whole machine and can traction and convey the copper foil 23 throughout the entire process, realizing the full linkage of unwinding, cleaning, modification, and take-up; an ion gun 12 and a coating roller 17 are set on one side of the take-up roll. The ion gun 12 is used to emit micro-metal ions onto the surface of the cleaned copper foil 23 to complete the micro-alloy modification treatment of the surface of the copper foil 23. The coating roller 17 is used to apply adhesive to the surface of the copper foil 23 after the ion gun 12 treatment for protection. The protection treatment is completed in time after the micro-alloy modification layer is formed, forming a continuous matching operation with the modification process of the ion gun 12.

[0038] The micro-metal processing mechanism also includes a fixed frame 11 and a take-up frame 15 fixed on the base plate 1. The fixed frame 11 is a portal frame with a stable overall structure, which can support the stable operation of the ion gun 12. An adjustment frame 20 is slidably installed on its top, and the ion gun 12 is fixed on the adjustment frame 20. The sliding structure of the adjustment frame 20 can drive the ion gun 12 to adjust its working position to adapt to different processing conditions and match the copper foil 23 conveying state. The take-up frame 15 is located inside the fixed frame 11, realizing a compact structural layout. It works in conjunction with the fixed frame 11 to complete the modification and take-up operations without occupying extra space. A take-up motor 16 is fixedly installed on the take-up frame 15. The take-up roll is rotated on the take-up frame 15, and one end of it is fixedly connected to the output end of the take-up motor 16. The take-up motor 16 can drive the take-up roll to rotate at a uniform speed. The traction power of the take-up roll can link all the mechanisms of the whole machine to operate synchronously, providing a unified conveying power for the copper foil 23 unwinding, cleaning, and modification processes, and ensuring a unified operating rhythm for each structure.

[0039] The coating roller 17 is rotatably connected to the take-up rack 15, achieving stable installation and positioning with the take-up rack 15. It forms a coordinated operating structure with the take-up roll and ion gun 12 in the same area. A coating motor 18 and a connecting frame 14 are also fixedly mounted on the take-up rack 15. The output end of the coating motor 18 is fixedly connected to the coating roller 17, and the coating motor 18 independently drives the coating roller 17. The coating rhythm can be adjusted to match the copper foil 23 conveying speed, adapting to the traction speed of the take-up roll. A glue spreader 13 is hinged to the connecting frame 14, and the output end of the glue spreader 13 is located between the ion gun 12 and... The coating rollers 17 slide against each other and against the copper foil 23 on the receiving roller 19, allowing for pre-treatment of the coating to be completed before formal coating after ion modification, thus connecting the operation process of the ion gun 12 and the coating rollers 17. A torsion spring 7 is also provided at the hinge of the connecting frame 14 and the coating applicator 13. The torsion spring 7 is used to press the output end of the coating applicator 13 against the surface of the copper foil 23. The elastic bonding structure ensures that the coating applicator 13 is always in contact with the dynamically conveyed copper foil 23, adapting to the small changes in the state of the copper foil 23 during the conveying process, and ensuring that the coating operation and the conveying of the copper foil 23 are synchronized throughout the entire process.

[0040] The cleaning mechanism includes a cleaning tank 5 fixed on the base plate 1, which serves as the core supporting structure for the copper foil 23 cleaning operation. It receives the copper foil 23 output from the front-end unwinding mechanism and provides a clean copper foil 23 substrate for the back-end micro-metal processing mechanism. At least two guide rollers 6 are rotatably installed on the top of the cleaning tank 5, which can guide and limit the copper foil 23 after unwinding, regulate the copper foil 23 conveying trajectory, and ensure that the copper foil 23 enters the cleaning tank 5 smoothly, realizing the conveying connection between the unwinding mechanism and the cleaning mechanism. The cleaning tank 5 is equipped with an upper adjustment component 261 and a lower adjustment component 262. A main brush body 24 is set between the upper adjustment component 261 and the lower adjustment component 262. The main brush body 24 is rotatably connected to the cleaning tank 5. The upper and lower adjustment components 262 can adjust the passage position and adhesion force of the copper foil 23 to match the brushing operation of the main brush body 24. The three work together to complete the surface cleaning operation of the copper foil 23, ensuring a stable connection between the cleaning process and the preceding and following processes.

[0041] Both the upper adjustment assembly 261 and the lower adjustment assembly 262 include a set of adjustment grooves 2601 disposed on the inner walls of the cleaning tank 5. An adjustment screw 2602 is rotatably disposed within the adjustment groove 2601. The adjustment screw 2602 is provided with two sections of threads with opposite directions, and each section of thread is matched with an adjustment block 2603. When the screw rotates, it can synchronously drive the two sets of adjustment blocks 2603 to move in opposite directions. An adjustment roller 2604 is disposed between the adjustment blocks 2603 that are positioned opposite each other on the two adjustment grooves 2601. The adjustment blocks 2603 can drive the adjustment roller 2604 to synchronously adjust their positions. The spacing is adjusted; an adjustment motor 2605 is also fixedly installed on the outer wall of the cleaning tank 5. The output end of the adjustment motor 2605 is fixedly connected to one end of the adjustment screw 2602. When the adjustment motor 2605 rotates, the adjustment screw 2602 will drive the two adjustment blocks 2603 to move closer or further away from each other, thereby adjusting the spacing and pressure of the upper and lower adjustment rollers 2604 to adapt to the conveying and washing requirements of copper foil 23 of different thicknesses. This makes the adjustment structure work in conjunction with the main brush body 24 and the copper foil 23 conveying process to ensure that copper foil 23 of different specifications can be effectively cleaned.

[0042] A feeding motor 22 is also fixedly installed on one side of the cleaning tank 5. The output end of the feeding motor 22 is connected to one of the guide rollers 6 on the cleaning tank 5. The feeding motor 22 can drive the guide roller 6 to rotate actively, providing active feeding power for the cleaning process. It can cooperate with the traction power of the rear take-up roll to form a two-way power linkage, stabilize the conveying tension of the copper foil 23, avoid the stretching and loosening of the copper foil 23 caused by single traction, realize the speed matching linkage of unwinding, cleaning and take-up, and ensure the continuous and stable operation of the cleaning process.

[0043] The brush body is positioned between four adjusting rollers 2604. The adjusting rollers 2604 can limit and regulate the working area of ​​the main brush body 24, limiting the passage position of the copper foil 23 and ensuring that the copper foil 23 accurately fits the working area of ​​the brush body. In addition, several auxiliary brush bodies 25 are arranged around the main brush body 24. The copper foil 23 passes through the auxiliary brush bodies 25 and the main brush body 24. The main brush body 24 and the auxiliary brush bodies 25 form an integrated brushing structure. With the limiting and adjusting function of the adjusting rollers 2604, the surface of the copper foil 23 can be brushed from multiple directions. Each brush body structure, adjusting component, and guiding feeding structure are linked together and synchronously complete the brushing operation with the copper foil 23, improving the integrity and comprehensiveness of the cleaning operation.

[0044] The unwinding mechanism includes an unwinding frame 2 fixed on the base plate 1. An unwinding roller 3 is detachably mounted on the unwinding frame 2. The detachable structure facilitates the replacement and installation of the copper foil 23 roll, providing raw material replacement conditions for continuous processing of the whole machine. A magnetic powder brake 4 is also fixedly mounted on the unwinding frame 2. The output end of the magnetic powder brake 4 is connected to the unwinding shaft. The magnetic powder brake 4 can control the unwinding resistance of the unwinding roller 3, match the conveying speed of the rear take-up roll and the feeding structure, realize the linkage matching between the unwinding speed and the conveying rhythm of the whole machine, prevent the copper foil 23 from accumulating and stretching due to unwinding too fast or too slow, and ensure the tension stability of the whole machine conveying system.

[0045] A wiping roller 9 is also provided between the cleaning mechanism and the receiving roller 19. The wiping roller 9 is arranged between the two core processes through the support frame 21, and plays an intermediate transition role. It receives the copper foil 23 after cleaning and prepares it for the subsequent micro-metal modification process. The copper foil 23 slides and adheres to the wiping roller 9. A wiping motor 10 is also provided at one end of the wiping roller 9. The output end of the wiping motor 10 is connected to the wiping roller 9. When the wiping motor 10 rotates, the rotation direction of the wiping roller 9 is opposite to the movement direction of the copper foil 23. The reverse rotation structure can enhance the wiping effect, remove the residual cleaning liquid on the surface of the copper foil 23 in time, avoid the influence of residual impurities in the cleaning process on the ion modification process, and realize the process linkage between the cleaning mechanism and the micro-metal processing mechanism.

[0046] The working process of this embodiment is as follows: First, the operator installs and fixes the copper foil 23 roll to be processed onto the unwinding roller 3 of the unwinding mechanism. The unwinding frame 2 is used to position the roll, and at the same time, the magnetic powder brake 4 forms a tension matching foundation with the subsequent conveying structure. The end of the copper foil 23 roll is pulled out and passed sequentially through the guide roller 6 of the cleaning mechanism, between the main brush body 24 and the auxiliary brush body 25, and the wiping roller 9 at the rear end of the cleaning process. Finally, it is fixed on the take-up roll of the micro-metal processing mechanism, completing the threading and docking of the entire copper foil 23 material, so that the various processing mechanisms form a linked conveying system through the copper foil 23. Then, the adjusting motor 2605 on the outside of the cleaning tank 5 is started. The adjusting motor 2605 drives the adjusting screw 2602 to rotate. The two reverse threads of the screw drive the corresponding upper and lower adjusting blocks 2603 and adjusting rollers 2604 to move synchronously. The spacing of the adjusting rollers 2604 is precisely adjusted according to the thickness of the copper foil 23 to be processed, so that the upper and lower surfaces of the copper foil 23 are in close contact with the main brush body 24 and the surrounding auxiliary brush bodies 25, respectively, to ensure the effective contact area for the brushing operation. After the debugging is completed, cleaning fluid is added into the cleaning tank 5 until the liquid level submerges half the height of the main brush body 24, which meets the conditions for wet cleaning operation.

[0047] After the equipment is officially started, all power structures of the machine operate synchronously. The take-up motor 16 drives the take-up roll to rotate at a constant speed, serving as the core traction power for the entire machine, and driving the copper foil 23 to be conveyed forward at a constant speed along the preset trajectory. At the same time, the magnetic powder brake 4 of the unwinding mechanism adjusts the unwinding resistance of the unwinding roller 3 in real time, matching the take-up traction speed, stabilizing the unwinding tension of the copper foil 23, and avoiding problems such as stretching, loosening, and accumulation of the copper foil 23, thus achieving uniform and stable unwinding. Meanwhile, the feeding motor 22 of the cleaning mechanism drives the corresponding guide roller 6 to rotate actively, forming a two-way power linkage with the rear take-up structure, further stabilizing the conveying state of the copper foil 23 and ensuring that the copper foil 23 enters the cleaning tank 5 smoothly.

[0048] After entering the cleaning tank 5, the copper foil 23 is precisely guided by the upper and lower adjusting rollers 2604 to pass between the main brush body 24 and multiple sets of auxiliary brush bodies 25. The rotating main brush body 24 and auxiliary brush bodies 25 simultaneously perform all-round brushing on the upper and lower surfaces of the copper foil 23, thoroughly removing dust, oil, and oxidation impurities adhering to the surface of the copper foil 23, completing the deep cleaning operation of the copper foil 23 surface, and providing a clean substrate for subsequent micro-alloy ion modification. After cleaning, the copper foil 23 continues to be conveyed forward. After leaving the cleaning tank 5, it enters the wiping station between the cleaning mechanism and the micro-metal processing mechanism. The wiping motor 10 drives the wiping roller 9 to rotate in the opposite direction, so that the wiping roller 9 and the copper foil 23 conveying direction form relative friction, quickly and thoroughly wiping away the residual cleaning liquid and fine scum on the surface of the copper foil 23, achieving dry and clean surface of the copper foil 23, and completely avoiding the adverse effects of residual liquid and impurities on the subsequent ion plating process.

[0049] After cleaning and drying, the copper foil 23 continues to be conveyed to the micro-metal processing area. Workers can adjust the horizontal working position and range of the ion gun 12 in advance according to the processing requirements of the copper foil 23 by sliding the adjustment frame 20, adapting to the modification processing needs of copper foils 23 of different specifications. As the copper foil 23 passes through the working area of ​​the ion gun 12, the ion gun 12 continuously emits micro-metal ions onto the clean surface of the copper foil 23, causing the micro-metal ions to be uniformly sputtered and adhered to the surface of the copper foil 23, completing the micro-alloy modification treatment of the copper foil 23, changing the surface alloy structure of the copper foil 23, and improving the overall performance of the copper foil 23.

[0050] The ion-modified copper foil 23 continues to move forward and enters the adhesive application and coating station. The coating motor 18 on the receiving rack 15 drives the coating roller 17 to rotate at a uniform speed, matching the conveying speed of the copper foil 23. At the same time, the torsion spring 7 on the connecting frame 14 continuously provides elastic pressure to the adhesive applicator 13, ensuring that the output end of the adhesive applicator 13 is always in close contact with the surface of the copper foil 23. The uniform adhesive application and coating pretreatment are completed between the ion gun 12 and the coating roller 17. After the pretreatment, the copper foil 23 passes through the coating roller 17 to complete the overall adhesive application, forming a uniform and complete protective adhesive layer on the surface of the microalloy modified layer. This seals and protects the newly formed microalloy coating, preventing oxidation and corrosion of the coating by air and moisture.

[0051] Finally, the micro-alloyed copper foil 23, after being coated with adhesive for protection, is wound up by the continuous traction of the take-up roll. The external dryer is connected to the air duct 8 of the take-up rack 15, and the interlayer is dried and cured by hot air delivered inside the take-up rack 15. The entire continuous processing flow of the micro-alloyed copper foil 23 is finally completed. All mechanisms work together in a coordinated manner and the processes are closely connected, realizing the automated, standardized and continuous production and processing of the micro-alloyed copper foil 23.

[0052] The foregoing has provided a detailed description of one embodiment of this application, but the description is merely a preferred embodiment and should not be construed as limiting the scope of this application. All equivalent variations and improvements made within the scope of this application should still fall within the patent coverage of this application.

Claims

1. A microalloyed copper foil processing apparatus comprising a base plate (1), characterized in that: The base plate (1) is provided with an unwinding mechanism, a cleaning mechanism and a micro-metal treatment mechanism. The unwinding mechanism is used to fix the copper foil (23) to be unwound. The cleaning mechanism is located between the micro-metal treatment mechanism and the unwinding mechanism and is used to clean the surface of the copper foil (23) that passes through it after unwinding. The micro-metal treatment mechanism includes a take-up roll. An ion gun (12) and a coating roller (17) are provided on one side of the take-up roll. The ion gun (12) is used to emit micro-metal ions onto the surface of the cleaned copper foil (23). The coating roller (17) is used to apply adhesive to the surface of the copper foil (23) after the ion gun (12) is treated.

2. The micro-alloyed copper foil processing device according to claim 1, characterized in that: The micro-metal processing mechanism also includes a fixed frame (11) and a receiving frame (15) fixed on the base plate (1). The fixed frame (11) is a portal frame with an adjustable frame (20) slidably mounted on its top. The ion gun (12) is fixed on the adjustable frame (20). The receiving frame (15) is located inside the fixed frame (11). A receiving motor (16) is fixedly mounted on the receiving frame (15). The receiving roll is rotatably mounted on the receiving frame (15), and one end of it is fixedly connected to the output end of the receiving motor (16).

3. The microalloyed copper foil processing apparatus of claim 2, wherein: The coating roller (17) is rotatably connected to the receiving rack (15). A coating motor (18) and a connecting frame (14) are also fixedly installed on the receiving rack (15). The output end of the coating motor (18) is fixedly connected to the coating roller (17). A glue applicator (13) is hinged on the connecting frame (14). The output end of the glue applicator (13) is located between the ion gun (12) and the coating roller (17), and slides against the copper foil (23) on the receiving roller (19). A torsion spring (7) is also provided at the hinge between the connecting frame (14) and the glue applicator (13). The torsion spring (7) is used to press the output end of the glue applicator (13) against the surface of the copper foil (23).

4. The microalloyed copper foil processing apparatus of claim 1, wherein: The cleaning mechanism includes a cleaning tank (5) fixed on the base plate (1). At least two guide rollers (6) are rotatably arranged on the top of the cleaning tank (5). An upper adjustment component (261) and a lower adjustment component (262) are arranged inside the cleaning tank (5). A main brush body (24) is arranged between the upper adjustment component (261) and the lower adjustment component (262). The main brush body (24) is rotatably connected to the cleaning tank (5).

5. The microalloyed copper foil processing apparatus of claim 4, wherein: Both the upper adjustment assembly (261) and the lower adjustment assembly (262) include a set of adjustment grooves (2601) disposed on the inner walls of the cleaning tank (5). An adjustment screw (2602) is rotatably disposed in the adjustment groove (2601). The adjustment screw (2602) is provided with two sections of threads with opposite directions, and an adjustment block (2603) is matched on each section of thread. An adjustment roller (2604) is disposed between the adjustment blocks (2603) positioned opposite each other on the two adjustment grooves (2601). An adjustment motor (2605) is also fixedly disposed on the outer wall of the cleaning tank (5). The output end of the adjustment motor (2605) is fixedly connected to one end of the adjustment screw (2602). When the adjustment motor (2605) rotates, the adjustment screw (2602) will drive the two adjustment blocks (2603) to move closer or further away from each other.

6. The microalloyed copper foil processing apparatus of claim 4, wherein: A feeding motor (22) is also fixedly installed on one side of the cleaning tank (5), and the output end of the feeding motor (22) is connected to one of the guide rollers (6) on the cleaning tank (5).

7. The microalloyed copper foil processing apparatus of claim 4, wherein: The brush body is located between the four adjusting rollers (2604), and a plurality of auxiliary brush bodies (25) are also provided around the main brush body (24), with copper foil (23) passing between the plurality of auxiliary brush bodies (25) and the main brush body (24).

8. The microalloyed copper foil processing apparatus of claim 1, wherein: The unwinding mechanism includes a feeding frame (2) fixed on the base plate (1), a feeding roller (3) is detachably mounted on the feeding frame (2), and a magnetic powder brake (4) is also fixedly mounted on the feeding frame (2). The output end of the magnetic powder brake (4) is connected to the feeding shaft for transmission.

9. The micro-alloyed copper foil processing apparatus according to claim 1, characterized in that: A support frame (21) is also provided between the cleaning mechanism and the receiving roller (19). A wiping roller (9) is rotatably mounted on the support frame (21). The copper foil (23) slides against the wiping roller (9). A wiping motor (10) is also provided at one end of the wiping roller (9). The output end of the wiping motor (10) is connected to the wiping roller (9). When the wiping motor (10) rotates, the rotation direction of the wiping roller (9) is opposite to the movement direction of the copper foil (23).

10. A processing method based on the micro-alloyed copper foil processing apparatus according to any one of claims 1-9, characterized in that, include: After the copper foil roll is fixed to the feeding rack by the feeding roller, it is unwound. The end of the unwound copper foil passes through the cleaning mechanism and is fixed to the take-up roller on the micro-metal processing mechanism. Then, the position of the adjusting roller is adjusted by the adjusting motor to ensure that the copper foil is in contact with both the main brush and the auxiliary brush. Cleaning solution is then added to the cleaning tank until it covers half of the main brush. Next, the equipment is started, and the take-up roller rotates to move the copper foil. The copper foil on the feeding rack first enters the cleaning tank and is cleaned by the main brush and the auxiliary brush. After cleaning, the copper foil is removed from the cleaning tank, and the wiping roller wipes the cleaning solution off its surface. Then, the ion gun sputters the required alloy onto the surface of the copper foil in the form of ions. Finally, the copper foil is brushed with adhesive and dried to complete the processing flow of micro-alloyed copper foil.

Images