An observation jig for detecting precision of a robot wafer transfer

Abstract

This application discloses an observation fixture for detecting the accuracy of wafer transfer by a robotic arm, relating to the field of semiconductor thin film deposition equipment technology. The fixture includes a base plate, positioning claws, an observation window assembly, a support column, and a first protective plate. The base plate is used to press against a pre-set sealing ring on the top of the PECVD process chamber. At least two positioning claws are provided and installed at the circumferential edge of the base plate to abut against the outer sidewall of the PECVD process chamber. Multiple observation window assemblies are provided and arranged in a ring array on the base plate to provide a top-down observation field. The first protective plate is positioned above the base plate via the support column to isolate the high temperature conducted upwards from the PECVD process chamber. This application can detect wafer transfer accuracy in situ under vacuum and high-temperature conditions, offering high calibration accuracy, fast efficiency, and safe operation, making it suitable for robotic arm wafer transfer calibration operations in PECVD equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor thin film deposition equipment technology, and in particular to an observation fixture for detecting the accuracy of wafer transfer by a robotic arm. Background Technology

[0002] In semiconductor wafer thin film deposition processes, PECVD technology is widely used for the preparation of dielectric thin films such as silicon oxide and silicon nitride due to its advantages such as low deposition temperature, good film uniformity, and strong adaptability. The positioning and alignment accuracy of the wafer on the heating stage of the PECVD process chamber directly determines the uniformity of the plasma field distribution, which in turn affects the consistency of key film deposition parameters such as film thickness and refractive index, and is one of the core factors determining process yield. As semiconductor process nodes continue to advance, the accuracy requirements for wafer transfer and positioning continue to increase, and the limitations of traditional calibration methods are becoming increasingly apparent.

[0003] Currently, the industry standard for calibrating the wafer transfer accuracy of robotic arms is generally conducted in an open environment under normal temperature and pressure. Operators adjust the robot's wafer pick-up and drop coordinates visually or with the aid of external ranging sensors to complete the calibration before sealing the PECVD process chamber and entering production. This type of calibration does not consider the environmental differences of actual process conditions: In actual PECVD production, the PECVD process chamber is under high vacuum, and the heating stage needs to maintain a process temperature above 300°C. High temperatures cause significant thermal expansion deformation of the heating stage, and vacuum pressure differences also cause minor deformations in the PECVD process chamber structure. Ultimately, this results in a systematic off-center shift in the wafer transfer position that is calibrated correctly under normal temperature and pressure under actual process conditions.

[0004] To compensate for this deviation, a feedback calibration method can be used: "deposit test wafer - measure film thickness distribution - back-calculate eccentricity - correct robot parameters". However, this method requires repeated start-stop of the process, occupies a lot of equipment production time, and consumes a lot of test wafers and process gases. The calibration efficiency is extremely low and the cost of consumables is high. Summary of the Invention

[0005] The main objective of this application is to provide an observation fixture for detecting the accuracy of the transfer of robotic arms, aiming to solve the technical problem of low calibration efficiency in existing feedback correction methods for the accuracy of transfer of robotic arms.

[0006] To achieve the above objectives, this application provides an observation fixture for detecting the accuracy of a robotic arm's wafer transfer mechanism, which is installed at the top opening of a PECVD process chamber, and includes: The base plate is used to press against the pre-set sealing ring at the top of the PECVD process chamber; At least two positioning claws are provided and installed at the circumferential edge of the base plate to abut against the outer sidewall of the PECVD process chamber. Multiple observation window components are arranged in a circular array on the base plate to provide a top-down field of view. The first protective plate, mounted above the base plate via a support column, is used to isolate the high temperature transmitted upward from the PECVD process chamber.

[0007] Optionally, one side of the base plate is provided with an outwardly protruding extension, the extension integrating an air intake and air venting structure, the air intake and air venting structure including an air inlet and an air passage, one end of the air passage communicating with the air inlet, and the other end of the air passage extending to the lower side wall of the base plate.

[0008] Optionally, a second protective plate is provided above the extension, and the second protective plate is connected to the extension through a plurality of the support columns to cover the air inlet.

[0009] Optionally, the positioning claw is an L-shaped claw, and there are two positioning claws. The two positioning claws are connected to the circumferential edge of the base plate by a bolt assembly. The inner surfaces of the two positioning claws are set at an included angle so as to abut against two adjacent outer edges of the PECVD process chamber respectively.

[0010] Optionally, the number of observation window components is four, and the four observation window components are arranged in a circular array around the center of the base plate to correspond to the four quadrant positions of the wafer edge.

[0011] Optionally, the base plate has multiple mounting slots, and the observation window assembly includes glass, a buffer heat insulation pad, and an alloy pressure block stacked in each mounting slot from bottom to top; the bottom surface of the mounting slot has a window sealing groove, and a window sealing ring is embedded in the window sealing groove, and the window sealing ring abuts against the glass to form a vacuum seal; the alloy pressure block is connected to the base plate by a bolt assembly.

[0012] Optionally, both the alloy pressure block and the buffer heat insulation pad have through observation holes in their centers.

[0013] Optionally, the first protective plate has a clearance through hole with a diameter larger than the outer diameter of the alloy pressure block at the position corresponding to the mounting groove.

[0014] Optionally, multiple support columns are provided, and the multiple support columns are distributed in a ring array around the center of the base plate.

[0015] Optionally, the base plate is provided with multiple handles.

[0016] The beneficial effects that this application can achieve are as follows: This application simulates the real vacuum environment of the PECVD process chamber by pressing a base plate that can be installed at the top opening of the chamber with a pre-set sealing ring. At least two positioning claws on the circumferential edge of the base plate, which can abut against the outer sidewall of the PECVD process chamber, ensure installation alignment accuracy. Furthermore, multiple observation windows arranged in a ring array on the base plate provide a direct, top-down observation view. This allows for direct, in-situ testing of the robot's wafer transfer positioning accuracy under real high-temperature vacuum process conditions. This effectively reduces wafer landing deviation caused by the disconnect between room-temperature and atmospheric-pressure calibration and actual operating conditions, improving wafer transfer calibration accuracy and thin film deposition process yield. It eliminates the cumbersome process of repeatedly depositing test wafers and indirect back-correction, significantly improving calibration efficiency and reducing testing consumable costs. In addition, a first protective plate with support columns above the base plate isolates the high temperature conducted upwards from the PECVD process chamber, preventing accidental burns to operators and significantly improving the safety of calibration operations. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0018] Figure 1 This is an exploded front view of an observation fixture used for detecting the accuracy of a robotic arm's transfer blades, as described in an embodiment of this application. Figure 2 An exploded view of an observation fixture for detecting the accuracy of a robotic arm's transmission blades, as described in an embodiment of this application. Figure 3 This is a top view of an observation fixture for detecting the accuracy of a robotic arm's transmission blades, as described in an embodiment of this application. Figure 4 for Figure 3 Structural cross-sectional view along the AA direction; Figure 5 for Figure 3 A partial structural cross-sectional view along the BB direction.

[0019] Reference numerals: 1. Base plate; 2. Positioning claw; 3. Observation window assembly; 301. Glass; 302. Buffer heat insulation pad; 303. Alloy pressure block; 304. Observation through hole; 4. Support column; 5. First protective plate; 501. Clearance through hole; 502. Clearance hole; 6. Extension; 7. Air intake and ventilation structure; 701. Air inlet; 702. Air passage; 8. Bolt assembly; 9. Mounting groove; 10. Window sealing groove; 11. Window sealing ring; 12. Second protective plate; 13. Handle.

[0020] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0023] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0025] Example Reference Figures 1-5This embodiment provides an observation fixture for detecting the wafer transfer accuracy of a robotic arm. It is installed at the top opening of the PECVD process chamber and can detect the positioning accuracy of the robotic arm transferring the wafer to the heating stage inside the PECVD process chamber under vacuum and high-temperature process conditions. The fixture includes: The base plate 1 has a circular plate structure. Its lower surface is precision ground and is used to press against the sealing ring pre-set on the top of the PECVD process chamber. After vacuuming, the base plate 1 is tightly pressed onto the end face of the PECVD process chamber by atmospheric pressure difference, so as to achieve a reliable vacuum seal between the fixture and the PECVD process chamber. Positioning claws 2, at least two in number, are installed at the circumferential edge of the base plate 1 to abut against the outer sidewall of the PECVD process chamber, thereby achieving precise horizontal positioning of the fixture relative to the PECVD process chamber. The observation window assembly 3, consisting of multiple components arranged in a circular array on the base plate 1, provides the operator with a top-down observation field to directly observe the edge position of the wafer within the PECVD process chamber. The first protective plate 5 is set above the base plate 1 by the support column 4 to isolate the high temperature conducted upward from the PECVD process chamber and prevent operators from being accidentally burned by touching it.

[0026] As an optional implementation, one side of the base plate 1 is integrally machined with an outwardly protruding extension 6, and the extension 6 integrates an air intake and venting structure 7. The air intake and venting structure 7 includes a vertically arranged air inlet 701 and a horizontally opened air passage 702. One end of the air passage 702 communicates with the air inlet 701, and the other end of the air passage 702 extends to the lower side wall of the base plate 1, communicating with the sealed space formed by the base plate 1 and the PECVD process chamber.

[0027] The extension 6 is integrally formed with the base plate 1, which ensures the structural strength and airtightness of the air passage 702 and avoids the risk of air leakage caused by separate splicing. The air inlet 701 can be connected to an inert gas source. After calibration, filling with inert gas can quickly break the vacuum without the need for additional tooling to pry the base plate 1. This not only improves the disassembly efficiency, but also avoids the problems of sealing ring wear and base plate 1 deformation caused by forced disassembly, ensuring the sealing accuracy and service life of the fixture.

[0028] As an optional implementation, a second protective plate 12 is provided above the extension 6. The second protective plate 12 is connected to the extension 6 through a plurality of the support columns 4 to cover the air inlet 701.

[0029] The second protective plate 12 prevents the components at the air inlet 701 from being directly exposed and damaged. The shape of the second protective plate 12 is adapted to the contour of the extension 6, providing full coverage without any excess protrusion, thus preventing accidental contact by operators.

[0030] As an optional implementation, the positioning claw 2 is an L-shaped claw, and there are two of them. The two positioning claws 2 are connected to the circumferential edge of the base plate 1 by bolt assembly 8. The inner sides of the two positioning claws 2 are set at a certain angle and respectively abut against two adjacent outer edges of the PECVD process chamber to achieve positioning.

[0031] The positioning jaws 2 are made of POM material, which has self-lubricating and wear-resistant properties. During clamping and positioning, they will not scratch the metal outer edge surface of the PECVD process chamber, while ensuring consistent accuracy in repeated positioning. The two positioning jaws 2 use L-shaped jaws to engage with the right-angled outer edge of the PECVD process chamber, simultaneously restricting displacement in both the X and Y horizontal directions. This enables rapid centering and positioning of the fixture, resulting in short single-installation positioning time and high repeatability accuracy, avoiding the need for recalibration of the reference point for each installation.

[0032] As an optional implementation, the number of observation window components 3 is four, and the four observation window components 3 are arranged in a circular array around the center of the base plate 1 to form a quantitative observation reference corresponding to the four quadrant positions of the wafer edge.

[0033] The four observation window components 3 are evenly distributed along the circumference at 90°, precisely covering the four edges of the wafer. Operators can simultaneously observe the relative offset between the wafer edges and the preset baseline through the four observation window components 3, directly reading the direction and magnitude of the eccentricity. This eliminates the need for additional measuring instruments and indirect calculations using deposition samples, providing high intuitiveness and calibration efficiency. Furthermore, the centrally symmetrical layout ensures a unified observation baseline in all directions, avoiding visual errors caused by unilateral observation.

[0034] As an optional implementation, the base plate 1 has multiple mounting slots 9. The observation window assembly 3 includes glass 301, buffer heat insulation pad 302, and alloy pressure block 303 stacked in each mounting slot 9 from bottom to top. The bottom surface of the mounting slot 9 has a window sealing groove 10, and a window sealing ring 11 is embedded in the window sealing groove 10. The window sealing ring 11 abuts against the lower surface of the glass 301 to form an independent vacuum seal. The alloy pressure block 303 is connected to the base plate 1 by multiple sets of evenly distributed bolt assemblies 8.

[0035] The glass 301 is made of double-sided polished high-strength quartz material, which has high light transmittance and can withstand a pressure difference of one atmosphere, ensuring structural safety in a vacuum environment. The window sealing ring 11 is made of high-temperature resistant fluororubber or perfluoroether material, which can adapt to the high-temperature working conditions of the PECVD process chamber and ensure the independent sealing performance of each observation window assembly 3. The sealing failure of a single observation window assembly 3 will not affect the vacuum sealing performance of other observation window assemblies 3 and the whole, and the corresponding alloy pressure block 303 can be disassembled individually to replace the window sealing ring 11 or clean and maintain the glass 301, resulting in low maintenance cost and high efficiency. The buffer heat insulation pad 302 is made of PTFE material and is placed between the glass 301 and the alloy pressure block 303. On the one hand, it can buffer the locking stress of the alloy pressure block 303 to prevent the glass 301 from breaking due to local stress concentration; on the other hand, it can block the upward heat conduction of the PECVD process chamber, reducing the temperature rise of the alloy pressure block 303 and the first protective plate 5.

[0036] As an optional implementation, both the alloy pressure block 303 and the buffer heat insulation pad block 302 have through observation holes 304 in their centers.

[0037] The observation through-holes 304 of the alloy pressure block 303 and the buffer heat insulation pad 302 are coaxially arranged to form an unobstructed vertical observation channel. The operator's line of sight can pass through the glass 301 from top to bottom along the through-hole to clearly observe the wafer edge inside the PECVD process chamber, avoiding the blind spot caused by structural obstruction.

[0038] As an optional implementation, multiple support columns 4 are provided, evenly distributed along multiple concentric circles with the center of the base plate 1 as the center.

[0039] The support column 4 is made of a non-metallic material that is resistant to high temperature and has low thermal conductivity, which can significantly reduce the heat conduction from the base plate 1 to the first protective plate 5 and ensure that the surface temperature of the first protective plate 5 is within a safe range. In this embodiment, a total of 16 support columns 4 are set in the circular main area of ​​the base plate 1, which are evenly distributed along three concentric circles on the same plane. This can take into account both support strength and heat insulation performance. Moreover, the layout of multiple concentric circles ensures that the support is evenly stressed. After the first protective plate 5 is installed, it is flat and stable and will not have local warping or shaking problems. At the same time, it ensures that the heat insulation effect is consistent in all positions.

[0040] As an optional implementation, the first protective plate 5 is made of stainless steel with a thickness of 1mm. The first protective plate 5 has a clearance through hole 501 with a diameter larger than the outer diameter of the alloy pressure block 303 at the position corresponding to the mounting groove 9, so that the upper surface of the alloy pressure block 303 is flush with the upper surface of the first protective plate 5 and does not contact each other.

[0041] The stainless steel material possesses excellent high-temperature resistance and structural strength. The suspended first protective plate 5 can further dissipate heat through air convection, reducing its surface temperature. A gap is left between the through hole 501 and the alloy pressure block 303, preventing direct contact between the two and avoiding direct heat conduction to the first protective plate 5 through the alloy pressure block 303, thus ensuring heat insulation. The design of the upper surface of the alloy pressure block 303 being flush with the first protective plate 5 makes the top of the fixture flat and without protruding structures, which not only improves the overall aesthetics but also avoids dust accumulation and damage from bumps on protruding parts, while reducing the risk of operators getting caught.

[0042] As an optional implementation, the base plate 1 is provided with a plurality of handles 13.

[0043] The handles 13 are provided in two symmetrically arranged on the base plate 1, which ensures balanced force distribution during handling and facilitates stable lifting of the fixture by the operator. The handles 13 are made of heat-resistant and heat-insulating material, so even when the base plate 1 is at a high temperature, the surface temperature of the handles 13 remains within a safe range, preventing burns during handling. The handles 13 extend upwards through the clearance hole 502 on the first protective plate 5. The clearance hole 502 is larger than the cross-section of the handle 13, and the two do not contact each other, preventing heat from being conducted to the protective plate through the handles 13, and also facilitating the installation and removal of the handles 13.

[0044] As another optional implementation, the observation window assembly 3 can also be configured as a single integrated structure, that is, a large-sized mounting groove 9 is opened in the center of the base plate 1, and a large-diameter glass 301 is matched to cover the entire visible area of ​​the wafer. It is suitable for calibration scenarios that require global observation of the overall position of the wafer. Its sealing structure and heat insulation protection structure are the same as those of the four-quadrant window, and are also within the protection scope of this embodiment.

[0045] The operating steps for this fixture are as follows: 1. Preliminary preparation: Confirm that the PECVD process chamber is in a stopped state, remove the original top cover of the PECVD process chamber, clean the sealing ring and installation reference surface of the top surface of the PECVD process chamber, and ensure that the surface is free of debris and scratches.

[0046] 2. Fixture installation: The operator holds the handle 13 with both hands and moves the fixture steadily to the top of the PECVD process chamber. The position is adjusted so that the inner sides of the two L-shaped positioning claws 2 are respectively against the two adjacent outer edges of the PECVD process chamber. After completing the horizontal positioning, the base plate 1 is placed steadily on the sealing ring at the top of the PECVD process chamber.

[0047] 3. Vacuum sealing: Start the vacuum system of the PECVD process chamber to evacuate the sealing space inside the PECVD process chamber and below the base plate 1; as the vacuum level increases, atmospheric pressure will press the base plate 1 tightly against the end face of the PECVD process chamber to form a reliable vacuum seal, simulating the vacuum conditions of the real process.

[0048] 4. Temperature rise simulation: Turn on the heating stage inside the PECVD process chamber and heat it to the actual process temperature to simulate the high temperature conditions of real production. This will cause the heating stage to undergo thermal expansion deformation consistent with the process conditions, ensuring that the calibration conditions are completely consistent with the actual production conditions.

[0049] 5. Wafer Transfer Observation and Calibration: Control the vacuum robot to transfer the wafer into the PECVD process chamber and place it in the preset position on the heating stage; the operator simultaneously observes the relative position of the wafer edge and the preset baseline from the four observation windows 3 on the top of the fixture to determine the eccentricity direction and amount of the wafer; adjust the wafer transfer coordinates of the robot according to the observation results, repeat the wafer transfer verification until the wafer positioning accuracy meets the requirements.

[0050] 6. Vacuum Breaking and Disassembly: After calibration, turn off the heating system, connect the inert gas pipeline to the inlet 701, and slowly fill the sealed space with inert gas to break the vacuum; after the internal and external air pressures are balanced, wait for the PECVD process chamber to cool down to a safe temperature, hold the handle 13 and lift the fixture upwards steadily to remove it from the PECVD process chamber, thus completing the entire calibration process.

[0051] The working principle of this fixture is as follows: To address the core issue of the disconnect between traditional room temperature and pressure calibration methods and actual high-temperature vacuum process conditions, which leads to the misalignment of the actual wafer landing point, this fixture adopts a design concept of a detachable and replaceable top cover. It directly replaces the original top cover of the PECVD process chamber and achieves vacuum sealing by relying on atmospheric pressure difference. It can perform wafer transfer accuracy observation in a vacuum and high-temperature environment that simulates the real process.

[0052] With the independent, sealed observation window assembly 3 distributed in four quadrants on the base plate 1, the operator can directly visually observe the edge position of the wafer on the heating stage. The eccentricity can be quantified with the window reference, eliminating the need for indirect calculation through deposition test pieces and film thickness measurement. This effectively reduces systematic errors caused by differences in operating conditions and significantly improves calibration efficiency.

[0053] The first protective plate 5 is separated from the high-temperature base plate 1 by the support column 4 with low thermal conductivity. The double barrier of heat conduction by the air layer and the support column 4 controls the surface temperature of the first protective plate 5 within a safe range without obstructing the field of vision, thus reducing the risk of burns during observation operations under high-temperature conditions.

[0054] The integrated air intake and ventilator structure 7 can quickly balance the internal and external air pressure, enabling smooth disassembly of the fixture and avoiding disassembly difficulties and component damage caused by vacuum adsorption.

[0055] This achieves the technical effects of full-scale simulation of working conditions, in-situ quantitative observation, and efficient and safe calibration, which not only improves the accuracy and consistency of wafer transfer calibration, but also significantly shortens the calibration time and reduces the cost of test consumables.

[0056] In practical production applications, this fixture is used for PECVD equipment robotic wafer transfer accuracy calibration. Compared with traditional room temperature visual calibration and sample film thickness reverse calibration, it can completely reproduce the thermal expansion state of the heating stage under high temperature vacuum process conditions. After calibration, the actual wafer landing point eccentricity can be controlled at the micrometer level, effectively improving positioning accuracy and ensuring the uniformity of thin film deposition and process yield.

[0057] The time required for a single calibration is effectively reduced, equipment debugging efficiency is improved, and there is no need to consume test wafers and process gases, significantly reducing calibration costs. The fully enclosed thermal protection design allows operators to safely complete all calibration operations at room temperature without the risk of burns, significantly improving operational convenience and safety.

[0058] Meanwhile, this fixture requires no modification to the original equipment; it can be used simply by replacing the top cover of the PECVD process chamber. It is compatible with different brands of PECVD equipment of the same size and specifications, has strong versatility, and offers the advantages of high calibration accuracy, high operating efficiency, good safety protection, and wide applicability.

[0059] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An observation jig for detecting accuracy of a robot transfer sheet, characterized by, For installation at the top opening of the PECVD process chamber, including: The base plate is used to press against the pre-set sealing ring at the top of the PECVD process chamber; At least two positioning claws are provided and installed at the circumferential edge of the base plate to abut against the outer sidewall of the PECVD process chamber. Multiple observation window components are arranged in a circular array on the base plate to provide a top-down field of view. The first protective plate, mounted above the base plate via a support column, is used to isolate the high temperature transmitted upward from the PECVD process chamber.

2. The observation jig for detecting the precision of the robot sheet transfer according to claim 1, wherein The base plate has an outwardly protruding extension on one side, which integrates an air intake and air venting structure. The air intake and air venting structure includes an air inlet and an air passage. One end of the air passage is connected to the air inlet, and the other end of the air passage extends to the lower side wall of the base plate.

3. The observation jig for detecting the precision of the robot sheet transfer according to claim 2, wherein A second protective plate is provided above the extension, and the second protective plate is connected to the extension through a plurality of the support columns to cover the air inlet.

4. The observation jig for detecting the precision of the robot sheet transfer according to claim 1, wherein The positioning claw is an L-shaped claw, and there are two positioning claws. The two positioning claws are connected to the circumferential edge of the base plate by a bolt assembly. The inner sides of the two positioning claws are set at an angle to abut against the two adjacent outer edges of the PECVD process chamber.

5. The observation jig for detecting the precision of the robot sheet transfer according to claim 1, wherein The number of observation window components is four, and the four observation window components are arranged in a circular array around the center of the base plate to correspond to the four quadrant positions of the wafer edge.

6. The observation jig for detecting the precision of the robot sheet transfer according to claim 5, wherein The base plate has multiple mounting slots. The observation window assembly includes glass, a buffer heat insulation pad, and an alloy pressure block stacked in each mounting slot from bottom to top. The bottom surface of the mounting slot has a window sealing groove, and a window sealing ring is embedded in the window sealing groove. The window sealing ring abuts against the glass to form a vacuum seal. The alloy pressure block is connected to the base plate by a bolt assembly.

7. The observation jig for detecting the precision of the robot sheet transfer according to claim 6, wherein Both the alloy pressure block and the buffer heat insulation pad have through observation holes in their centers.

8. The observation fixture for detecting the accuracy of a robotic arm's transmission plate as described in claim 6, characterized in that, The first protective plate has a clearance through hole with a diameter larger than the outer diameter of the alloy pressure block at the position corresponding to the mounting groove.

9. The observation jig for detecting the precision of a robot sheet transfer according to claim 1, wherein The support columns are provided in multiple ways, and the multiple support columns are distributed in a ring array around the center of the base plate.

10. The observation jig for detecting the precision of the robot sheet transfer according to claim 1 or 9, wherein The base plate is equipped with multiple handles.

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