A plating uniformity control method and a plating system

Abstract

This invention discloses an electroplating uniformity control method and electroplating system, comprising: multiple independently controllable current output units; at least one first anode group and at least one second anode group, wherein the first anode group includes multiple first anode units, each first anode unit being connected to the positive electrode of a current output unit; the second anode group includes multiple second anode units, each second anode unit being connected to the positive electrode of a current output unit; a control module determines the theoretical output current of each current output unit, a first current compensation coefficient corresponding to the first anode unit, and a second current compensation coefficient corresponding to the second anode unit based on the target plate thickness, the target plating thickness, and a preset current parameter database; and determines the actual output current of the corresponding current output unit based on the theoretical output current, the first current compensation coefficient, and the second current compensation coefficient, thereby improving the uniformity of the plating thickness of the product.

Description

Technical Field

[0001] The present invention relates to the field of electroplating technology, and in particular to an electroplating uniformity control method and electroplating system. Background Technology

[0002] As server products are upgraded, the thickness of their PCBs continues to increase, and circuit design is developing towards precision and high density, which puts forward more stringent requirements for the uniformity of copper plating thickness on PCBs.

[0003] When the thickness of the PCB increases, the position of one side of the board relative to the anode remains basically unchanged when held in the electroplating fixture. However, due to the increased thickness, the distance from the anode to the spray nozzle on both sides of the PCB deviates, which directly affects the consistency of the copper plating thickness on both sides of the board.

[0004] Furthermore, as the cumulative production time of the electroplating tank increases, the lower end of the anode will gradually be covered and obscured by electroplating byproducts, which will affect the current distribution and plating solution exchange in the lower area of ​​the board, resulting in uneven copper plating thickness in the upper and lower areas of the same board, further reducing the overall uniformity of copper plating thickness on the board surface. Summary of the Invention

[0005] This invention provides a method and system for controlling the uniformity of electroplating, thereby improving the uniformity of the coating thickness of products.

[0006] In a first aspect, embodiments of the present invention provide an electroplating system, comprising: Multiple independently controllable current output units; Electroplating tank; The cathode is disposed in the electroplating tank and connected to the negative terminal of the current output unit, and the cathode is electrically connected to the target plating workpiece; At least one first anode group and at least one second anode group are respectively disposed on both sides of the cathode in the electroplating tank; the first anode group includes a plurality of first anode units arranged sequentially along the length direction of the electroplating tank, each first anode unit being connected to the positive electrode of a set of current output units; the second anode group includes second anode units arranged sequentially along the length direction of the electroplating tank, each second anode unit being connected to the positive electrode of a set of current output units. The control module is used to acquire the target plate thickness and target coating thickness of the target plated part, and determine the theoretical output current of each current output unit, the first current compensation coefficient corresponding to the first anode unit and the second current compensation coefficient corresponding to the second anode unit based on the target plate thickness, the target coating thickness and the preset current parameter database. Based on the theoretical output current and the first current compensation coefficient, the actual output current of the current output unit connected to the first anode unit is determined and controlled; and based on the theoretical output current and the second current compensation coefficient, the actual output current of the current output unit connected to the second anode unit is determined and controlled.

[0007] Optionally, the electroplating system may also include: a first database establishment module; The first database creation module includes: The first calculation unit is used to obtain the theoretical output current based on Faraday's law, according to the target coating thickness and electroplating parameters. The first experimental unit is used to perform electroplating tests on the samples of each target plate thickness according to the theoretical output current, and to measure the actual plating thickness of the area corresponding to the first anode unit of each target plate thickness sample; and to measure the actual plating thickness of the area corresponding to the second anode unit of each target plate thickness sample. The second calculation unit is used to determine a first current compensation coefficient for each region corresponding to the first anode unit based on the actual coating thickness of the region corresponding to the first anode unit of each target plate thickness and the theoretical output current; and to determine a second current compensation coefficient for each region corresponding to the second anode unit based on the actual coating thickness of the region corresponding to the second anode unit of each target plate thickness and the theoretical output current.

[0008] Optional, the electroplating system also includes: Multiple independently controllable jet units; The first nozzle group and the second nozzle group are placed in the electroplating tank and located on both sides of the cathode; the first nozzle group includes a plurality of first nozzle units arranged sequentially along the length direction of the electroplating tank, and each first nozzle unit is connected to the output end of a set of jet units. The second nozzle assembly includes second nozzle units arranged sequentially along the length of the electroplating tank, each second nozzle unit being connected to the output end of a set of spray units; the spray units are used to drive the electroplating solution in the electroplating tank to be sprayed onto the surface of the target workpiece via the first nozzle assembly and the second nozzle assembly; The control module is also used to determine the theoretical flow rate of each jet unit, the first flow rate compensation coefficient corresponding to the first anode group and the second flow rate compensation coefficient corresponding to the second anode group, based on the target plate thickness, the target coating thickness and the preset jet parameter database. Based on the theoretical jet flow rate and the first flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the first nozzle unit is calculated and controlled, and based on the theoretical jet flow rate and the second flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the second nozzle unit is calculated and controlled.

[0009] Optionally, the electroplating system may also include: a second database establishment module; The second database creation module includes: The second experimental unit is used to conduct orthogonal experiments on different target plate thicknesses, different target coating thicknesses and different spray flow combinations under a fixed theoretical output current, and to measure the deviation of coating thickness in each region. The adjustment unit adjusts the first current compensation coefficient and the first flow rate compensation coefficient based on the thickness deviation; and adjusts the second current compensation coefficient and the second flow rate compensation coefficient until the coating uniformity meets the preset experimental standard, thereby obtaining the final determined first current compensation coefficient, second current compensation coefficient, first flow rate compensation coefficient and second flow rate compensation coefficient under different target plate thicknesses and different target coating thicknesses.

[0010] Optionally, the electroplating system further includes: a float for fixing the position of the target workpiece in the electroplating tank; The float height adjustment module is used to adjust the height of the float according to the plate height range of the target plated part and the cumulative energized power of the first anode unit or the second anode unit.

[0011] In a second aspect, embodiments of the present invention provide a method for controlling electroplating uniformity, executed by the electroplating system described in any embodiment of the present invention, comprising: The target plate thickness and target coating thickness of the target plated part are obtained, and the theoretical output current of each current output unit, the first current compensation coefficient corresponding to the first anode unit and the second current compensation coefficient corresponding to the second anode unit are determined based on the target plate thickness, the target coating thickness and the preset current parameter database. Based on the theoretical output current and the first current compensation coefficient, the actual output current of the current output unit connected to the first anode unit is determined and controlled; and based on the theoretical output current and the second current compensation coefficient, the actual output current of the current output unit connected to the second anode unit is determined and controlled.

[0012] Optionally, the electroplating uniformity control method further includes: Establishing the current parameter database includes: Based on the target coating thickness and electroplating parameters, the theoretical output current is obtained using Faraday's law. Electroplating tests were conducted on the samples of each target plate thickness according to the theoretical output current, and the actual plating thickness of the sample of each target plate thickness in the region corresponding to the first anode unit was measured; and the actual plating thickness of the sample of each target plate thickness in the region corresponding to the second anode unit was measured. A first current compensation coefficient is determined for each region corresponding to the first anode unit based on the actual coating thickness of the region corresponding to the first anode unit of the sample with each target plate thickness and the theoretical output current; and a second current compensation coefficient is determined for each region corresponding to the second anode unit based on the actual coating thickness of the region corresponding to the second anode unit of the sample with each target plate thickness and the theoretical output current.

[0013] Optionally, the electroplating uniformity control method further includes: Based on the target plate thickness, the target coating thickness, and the preset jetting parameter database, the theoretical jetting flow rate of each jetting unit is determined, corresponding to the first flow rate compensation coefficient of the first anode group and the second flow rate compensation coefficient of the second anode group. Based on the theoretical jet flow rate and the first flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the first nozzle unit is calculated and controlled, and based on the theoretical jet flow rate and the second flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the second nozzle unit is calculated and controlled.

[0014] Optionally, the jet parameter database is established, including: Under a fixed theoretical output current, orthogonal experiments were conducted for different target plate thicknesses, different target coating thicknesses, and different combinations of spray flow rates to measure the deviation of coating thickness in each region. Based on the thickness deviation, the first current compensation coefficient and the first flow compensation coefficient are adjusted; and the second current compensation coefficient and the second flow compensation coefficient are adjusted until the coating uniformity meets the preset experimental standard, so as to obtain the first current compensation coefficient, the second current compensation coefficient, the first flow compensation coefficient and the second flow compensation coefficient under different target plate thicknesses and different target coating thicknesses.

[0015] Optionally, the electroplating uniformity control method further includes: The overall float height is adjusted according to the plate height range of the target plate and the cumulative energized power of the first anode unit or the second anode unit.

[0016] The electroplating system provided in this embodiment of the invention includes a first anode group and a second anode group. The first anode group includes multiple first anode units arranged sequentially along the length X of the electroplating tank, with each first anode unit corresponding to the positive electrode of a set of current output units. The second anode group includes second anode units arranged sequentially along the length X of the electroplating tank, with each second anode unit corresponding to the positive electrode of a set of current output units. This divides the first and second anode groups into multiple independent and controllable regions. Each current output unit corresponds to an independent current output channel. By combining the calibrated first and second current compensation coefficients, the current density in different regions of the electroplating tank can be controlled, thereby effectively solving the problem of uneven coating thickness caused by edge effects and electrode distance differences in traditional electroplating, and improving the uniformity of product coating thickness. Attached Figure Description

[0017] Figure 1 This invention provides a schematic diagram of the structure of an electroplating system according to an embodiment of the invention; Figure 2 A schematic diagram of another electroplating system is provided for embodiments of the present invention; Figure 3 This invention provides a schematic diagram of the structure of a jetting system in an electroplating system. Figure 4 This is a flowchart of an electroplating uniformity control method provided in an embodiment of the present invention. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] As the thickness of the PCB increases, the position of one side of the board relative to the anode remains relatively constant under the clamping condition of the electroplating fixture. However, due to the increased board thickness, the distances from the anode and the spray nozzles on both sides of the PCB deviate, directly affecting the consistency of the copper plating thickness on both sides of the board. Although the impact of spacing differences can be reduced by optimizing the electroplating fixture to ensure that the center of the workpiece is always symmetrically positioned at the center of the anode in the electroplating tank, existing electroplating equipment fixtures generally suffer from insufficient adaptability, and modifying the electroplating fixtures alone would significantly increase the equipment modification cost.

[0020] In view of this, the electroplating system provided in this embodiment of the invention, by setting a first anode group and a second anode group, as well as an independent controllable current output unit, realizes the regulation of current density in different areas of the electroplating tank, thereby effectively solving the problem of uneven coating thickness caused by edge effect and electrode distance difference in traditional electroplating, and improving the uniformity of product coating.

[0021] Figure 1 This is a schematic diagram of an electroplating system provided in an embodiment of the present invention. See also: Figure 1 ,include: Multiple independently controllable current output units 110; Electroplating tank 120; The cathode 130 is disposed in the electroplating tank 120 and connected to the negative terminal of the current output unit 110, and the cathode 130 is electrically connected to the target plating workpiece. A first anode group 140 and a second anode group 150 are disposed on both sides of the cathode 130 in the electroplating tank 120. The first anode group 140 includes a plurality of first anode units 141 arranged sequentially along the length direction X of the electroplating tank 120, and each first anode unit 141 is connected to the positive electrode of a set of current output units 110. The second anode group 150 includes second anode units 151 arranged sequentially along the length direction X of the electroplating tank 120, and each second anode unit 151 is connected to the positive electrode of a set of current output units 110. The control module is used to obtain the target plate thickness and target coating thickness of the target plated part, and to determine the theoretical output current of each current output unit 110, the first current compensation coefficient corresponding to the first anode unit 141 and the second current compensation coefficient corresponding to the second anode unit 151 based on the target plate thickness, the target coating thickness and the preset current parameter database. Based on the theoretical output current and the first current compensation coefficient, the actual output current of the current output unit 110 connected to the first anode unit 141 is determined and controlled; and based on the theoretical output current and the second current compensation coefficient, the actual output current of the current output unit 110 connected to the second anode unit 151 is determined and controlled.

[0022] Specifically, the electroplating tank 120 contains an electroplating solution, and the cathode 130 is connected to the negative terminal of the current output unit 110. The cathode 130 can be electrically connected to the target workpiece, and the target workpiece as a whole participates in the electrochemical reaction as the cathode 130. For example, in this embodiment of the invention, the target workpiece can be a PCB board. The current output unit 110 provides multiple power channels with independently adjustable output current, each channel constituting an independent current output unit 110. For example, the current output unit 110 can include a rectifier or a programmable DC power supply, achieving precise current output regulation through program control.

[0023] The first anode group 140 and the second anode group 150 are symmetrically arranged on both sides of the cathode 130. The first anode group 140 includes multiple first anode units 141 arranged linearly along the length X of the electroplating tank 120. The second anode group 150 includes multiple second anode units 151 arranged linearly along the length X of the electroplating tank 120. The first anode units 141 and the second anode units 151 can be phosphor bronze balls, titanium plating, or stainless steel, etc., and can be selected according to the target plating part. Each first anode unit 141 is independently connected to the positive terminal of a current output unit 110 through a wire, and each second anode unit 151 is independently connected to the positive terminal of a current output unit 110 through a wire, thus enabling zoned power supply in the anode area. In this invention, exemplarily, the first anode group 140 is provided with two first anode units 141, and the second anode group 150 is provided with two second anode units 151. In other embodiments, it can be expanded to an arrangement of multiple first anode units 141 and an arrangement of multiple first anode units 141, and multiple arrangements can also be made in the direction X perpendicular to the length of the electroplating tank 120 to adapt to the uniformity requirements of complex three-dimensional structure plating parts. In other optional embodiments, Figure 2 A schematic diagram of another electroplating system is provided for embodiments of the present invention. See also... Figure 2 Along the length X of the electroplating tank 120, multiple sets of first anode groups 140 and second anode groups 150 can be arranged to form multiple electroplating areas to meet the needs of simultaneous processing of different target plating parts and different target plating thicknesses, or the processing needs of different areas of the same target plating part, thereby improving production efficiency.

[0024] Electroplating information can be set for the target plated part, including the target board thickness and the target plating thickness. The control module obtains the target board thickness and the target plating thickness through passive input or active scanning. The target board thickness refers to the physical thickness of the printed circuit board substrate itself. The target plating thickness refers to the target plating thickness of the metal layer deposited on the substrate surface through electroplating. Based on the target board thickness and the target plating thickness, the control module matches the theoretical output current of each current output unit 110 from the current parameter database. The control module further calls the first current compensation coefficient and the second current compensation coefficient corresponding to the current target board thickness and the target plating thickness. For each first anode unit 141, the actual output current can be obtained based on the first current compensation coefficient and the theoretical output current; for example, the actual output current is the product of the first current compensation coefficient and the theoretical output current of the corresponding current output unit 110. For each second anode unit 151, the actual output current can be obtained based on the second current compensation coefficient and the theoretical output current of the corresponding current output unit 110; for example, the actual output current is the product of the first current compensation coefficient and the theoretical output current.

[0025] It should be noted that the theoretical output current in the current parameter database can be calculated based on Faraday's law. For example, the theoretical output current can be calculated by substituting the preset electroplating parameters for each electroplating area, such as current density, electroplating area, and electroplating time, into the Faraday's law formula based on the target coating thickness. However, due to issues in actual electroplating, such as current concentration at the edges, limited mass transfer in the central region, and differences in coating distance from the electrode caused by the electroplating fixture, simply using the theoretical output current will result in uneven coating. Therefore, a first current compensation coefficient is set for the current output unit 110 of the first anode unit 141, and a second current compensation coefficient is set for the current output unit 110 of the second anode unit 151.

[0026] Under the premise of meeting the requirements for electroplating uniformity, in the same section of the first anode group 140 and the second anode group 150, the theoretical output current of the current output unit 110, which is at least partially connected to the first anode group 140, can be obtained based on the same electroplating parameters. For example, the entire electroplating area can be divided into multiple sections, such as an inlet section, a middle section, and an outlet section, etc., and the electroplating parameters of each section can be set independently, thereby realizing regional current control and improving electroplating uniformity. Similarly, the theoretical output current of the current output unit 110, which is at least partially connected to the second anode group 150, can be obtained based on the same electroplating parameters. Of course, when the thickness of the plating area requires high precision, the theoretical output current of the current output unit 110 can also be set with electroplating parameters individually. The setting of electroplating parameters is not specifically limited here. Through the independent regional control of the current output unit 110, precise current regulation of each anode unit can be achieved, thereby further improving the electroplating uniformity.

[0027] The electroplating system provided in this embodiment of the invention includes a first anode group 140 and a second anode group 150. The first anode group 140 includes multiple first anode units 141 arranged sequentially along the length X direction of the electroplating tank 120, and each first anode unit 141 is connected to the positive electrode of a set of current output units 110. The second anode group 150 includes second anode units 151 arranged sequentially along the length X direction of the electroplating tank 120, and each second anode unit 151 is connected to the positive electrode of a set of current output units 110. This divides the first anode group 140 and the second anode group 150 into multiple independent and controllable regions. Each current output unit 110 corresponds to an independent current output channel. By combining the calibrated first current compensation coefficient and second current compensation coefficient, the current density in different regions within the electroplating tank 120 can be controlled, thereby effectively solving the problem of uneven coating thickness caused by edge effects and electrode distance differences in traditional electroplating, and improving the uniformity of the product coating.

[0028] Optionally, the electroplating system may also include a first database establishment module; the first database establishment module includes: The first calculation unit is used to obtain the theoretical output current based on Faraday's law, according to the target coating thickness and electroplating parameters. The first experimental unit is used to conduct electroplating tests on samples of each target plate thickness according to the theoretical output current, and to measure the actual plating thickness of the area corresponding to the first anode unit 141 of the sample of each target plate thickness; and to measure the actual plating thickness of the area corresponding to the second anode unit 151 of the sample of each target plate thickness. The second calculation unit is used to determine the first current compensation coefficient of the region corresponding to the first anode unit 141 based on the actual coating thickness and theoretical output current of the region corresponding to the first anode unit 141 of the sample with each target plate thickness; and to determine the second current compensation coefficient of the region corresponding to the second anode unit 151 based on the actual coating thickness and theoretical output current of the region corresponding to the second anode unit 151 of the sample with each target plate thickness.

[0029] Specifically, the first database establishment module is a hardware and software system for establishing and maintaining a current parameter database. It may include a first calculation unit, a first experimental unit, and a second calculation unit, capable of obtaining current compensation coefficient data through a combination of theoretical calculation and experimental verification. The first calculation unit calculates the theoretical output current based on Faraday's law, according to the target plating thickness and plating parameters. These plating parameters may include current density, plating area, plating time, pulse waveform, and current efficiency. The first experimental unit conducts plating experiments on standard sample plating parts with different target plating thicknesses using the theoretical output current. The standard sample plating parts are typically made of the same material and size as the target plating parts, and undergo the same pretreatment process. After plating, multiple measurement points are selected on the sample surface using precision thickness measuring instruments, such as a CMI copper thickness gauge, X-ray fluorescence thickness gauge, or metallographic microscope, corresponding to the coverage areas of the first anode unit 141 and the second anode unit 151 with different target plating thicknesses, to measure the actual plating thickness in each area. The second calculation unit, based on Faraday's law, can deduce the required current compensation coefficient for each anode unit. It should be noted that the reverse calculation process falls within the scope of existing technology, and its principles and implementation methods have mature applications in the field of electrochemical engineering, so they will not be elaborated here. For example, the first current compensation coefficient can be expressed as the ratio of the actual plating thickness of the first anode unit 141 to the target plating thickness, or as the ratio of the actual output current of the current output unit 110 corresponding to the first anode unit 141 to the theoretical output current. The second current compensation coefficient can be expressed as the ratio of the actual plating thickness of the second anode unit 151 to the target plating thickness, or as the ratio of the actual output current of the current output unit 110 corresponding to the second anode unit 151 to the theoretical output current. The calculated current compensation coefficients, along with the corresponding target plate thickness, electroplating parameters, and other information, are stored in a current parameter database. To ensure data accuracy, multiple repeated experiments are usually required, and the average value can be taken as the final current compensation coefficient.

[0030] By setting a first current compensation coefficient and a second current compensation coefficient for the opposite electroplating surfaces, the unevenness of the plating layer caused by practical factors such as edge effects, uneven solution flow, and differences in electrode distance can be effectively corrected, thereby improving the uniformity of the plating thickness. Furthermore, machine learning algorithms can be introduced to establish a dynamically updated database of current compensation coefficients, thereby continuously correcting and optimizing the compensation coefficients based on real-time monitoring data during the actual production process. For example, the compensation coefficients can be adjusted in real time based on feedback data from an online thickness gauge; dynamically corrected based on the consumption of the anode unit; and adaptively adjusted considering the aging degree of the electroplating solution.

[0031] Figure 3 This is a schematic diagram of the structure of a jetting system in an electroplating system according to an embodiment of the present invention. See also: Figure 3 The electroplating system also includes: Multiple independently controllable jet units; The first nozzle group 320 and the second nozzle group 330 are placed in the electroplating tank 120 and located on both sides of the cathode 130. The first nozzle group 320 includes a plurality of first nozzle units 321 arranged sequentially along the length direction X of the electroplating tank 120. Each first nozzle unit 321 is connected to the output end of a set of jet units. The second nozzle assembly 330 includes second nozzle units 331 arranged sequentially along the length direction X of the electroplating tank 120. Each second nozzle unit 331 is connected to the output end of a set of spray units. The spray units are used to drive the electroplating solution in the electroplating tank 120 to be sprayed onto the surface of the target plated part through the first nozzle assembly 320 and the second nozzle assembly 330. The control module is also used to determine the theoretical flow rate of each jet unit based on the target plate thickness, the target coating thickness and the preset jet parameter database, the first flow rate compensation coefficient corresponding to the first anode group 140 and the second flow rate compensation coefficient corresponding to the second anode group 150. Based on the theoretical jet flow rate and the first flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the first nozzle unit 321 is calculated and controlled, and based on the theoretical jet flow rate and the second flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the second nozzle unit 331 is calculated and controlled.

[0032] Specifically, the spray unit can drive the electroplating solution to circulate, and may include multiple spray units with independently controllable flow rates, enabling zoned control of the solution flow within the electroplating tank 120. The spray unit may include components such as a pump body, flow regulating valve, and flow sensor to control the output flow rate. The first spray nozzle group 320 and the second spray nozzle group 330 are respectively arranged on both sides of the cathode 130. For example, in this embodiment of the invention, the first spray nozzle group 320 and the first anode group 140 are located on the same side of the cathode 130, and the second spray nozzle group 330 and the second anode group 150 are located on the same side of the cathode 130. The first spray nozzle group 320 includes multiple first spray nozzle units 321 arranged sequentially along the length X direction of the electroplating tank 120, used to spray the electroplating solution onto the first plating layer of the target workpiece. The second spray nozzle group 330 includes multiple second spray nozzle units 331 arranged sequentially along the length X direction of the electroplating tank 120, used to spray the electroplating solution onto the second plating layer of the target workpiece. It should be noted that the first nozzle unit 321 and the second nozzle unit 331 may include a spray pipe and a nozzle at its end. The nozzle may be designed as a fan-shaped, conical, or mixed-flow nozzle to achieve different spray angles and ejection velocities for different solutions.

[0033] The control module matches the theoretical jet flow rate of each jet unit from the jet parameter database based on the target plate thickness and target coating thickness. The theoretical jet flow rate, also known as the initial jet value, is typically obtained through actual testing of the coating effect under conditions of minimum target plate thickness and minimum target coating thickness, or other preset target plate thickness and target coating thickness. However, due to issues such as uneven solution flow, nozzle blockage, and differences in pipe resistance during actual electroplating, simply using the theoretical jet flow rate may lead to uneven coating. Therefore, a first flow rate compensation coefficient is set for the electroplating area corresponding to the first anode unit 141, and a second flow rate compensation coefficient is set for the electroplating area of ​​the second anode unit 151.

[0034] The control module further calls upon the first and second flow compensation coefficients corresponding to the current process conditions. The control module then sends these coefficients to the corresponding jetting units, achieving precise flow control by adjusting the variable frequency pump speed or the proportional valve opening. The first anode unit 141 corresponds to the jetting unit in the electroplating area. The actual jetting flow rate can be obtained based on the first flow compensation coefficient and the theoretical jetting flow rate; for example, the actual jetting flow rate is the product of the first flow compensation coefficient and the corresponding theoretical jetting flow rate. The second anode unit 151 also corresponds to the jetting unit in the electroplating area. The actual jetting flow rate can be obtained based on the second flow compensation coefficient and the theoretical jetting flow rate; for example, the actual jetting flow rate is the product of the second flow compensation coefficient and the corresponding theoretical jetting flow rate.

[0035] During the electroplating process, the jetting unit 310 and the current output unit 110 work together. The jetting unit 310 directionally sprays the electroplating solution, effectively disrupting the diffusion layer on the cathode 130 surface, enhancing the mass transfer rate of metal ions, reducing concentration polarization, and thus improving the density and adhesion of the plating layer. The combination of jetting control and current control forms current compensation and flow rate compensation, further improving the uniformity of the plating layer. For parts with deep holes, blind holes, or high aspect ratio structures, adjusting the jetting direction and flow rate can effectively improve the flow of the solution inside complex structures, enhancing the deep plating capability and filling effect.

[0036] Optionally, the electroplating system also includes: a second database establishment module; the second database establishment module includes: The second experimental unit is used to conduct orthogonal experiments on different target plate thicknesses, different target coating thicknesses and different spray flow combinations under a fixed theoretical output current, and to measure the deviation of coating thickness in each region. The adjustment unit adjusts the first current compensation coefficient and the first flow compensation coefficient based on the thickness deviation; and adjusts the second current compensation coefficient and the second flow compensation coefficient until the coating uniformity meets the preset experimental standard, thereby obtaining the final determined first current compensation coefficient, second current compensation coefficient, first flow compensation coefficient and second flow compensation coefficient under different target plate thicknesses and different target coating thicknesses.

[0037] Specifically, the second database establishment module is a hardware and software system for establishing and maintaining a current parameter database. It may include a second experimental unit and an adjustment unit, and can obtain a combination of current compensation coefficients and flow compensation coefficients through orthogonal experiments and iterative optimization.

[0038] The second experimental unit is an experimental system capable of performing orthogonal experiments. Under a fixed theoretical output current, it conducts systematic experiments on different target plate thicknesses, different target coating thicknesses, and different combinations of spray flow rates. The adjustment unit optimizes parameters based on experimental data, adjusting the current compensation coefficient and flow rate compensation coefficient according to coating thickness deviations until the coating uniformity meets the preset standards.

[0039] Based on the electroplating process requirements, the influencing factors affecting the uniformity of the coating are determined. In this embodiment of the invention, the influencing factors may include the target plate thickness, the first actual spray flow rate on one side of the first anode unit 141, the second actual spray flow rate on one side of the second anode unit 151, the first current compensation coefficient, the second current compensation coefficient, the first flow rate compensation coefficient, and the second flow rate compensation coefficient. An orthogonal experimental design is adopted. Orthogonal experiments obtain comprehensive experimental data with fewer experiments by selecting representative experimental combinations, which can be used to analyze the influence of each factor on the results. The second experimental unit follows the orthogonal experimental design. For example, for the same target plate thickness, orthogonal experimental designs are formed for different target coating thicknesses and different spray flow rate combinations; for the same target coating thickness, orthogonal experimental designs are formed for different target plate thicknesses and different spray flow rate combinations. Each group of experiments is executed sequentially using a standard sample. The standard sample is consistent with the target plated part in terms of material, size, and previous process. Electroplating is performed under a fixed theoretical output current condition, and the actual process parameters of each experimental group are recorded. After electroplating is completed, multiple measurement points are selected on the sample surface using a precision thickness gauge, corresponding to the coverage areas of each anode unit and nozzle unit. The actual coating thickness of the area corresponding to the first anode unit 141 and the actual coating thickness of the area corresponding to the second anode unit 151 are measured. Furthermore, the deviation between the actual coating thickness of the area corresponding to the first anode unit 141 and the target coating thickness, and the deviation between the actual coating thickness of the area corresponding to the second anode unit 151 and the target coating thickness can be obtained.

[0040] The adjustment unit analyzes and adjusts based on thickness deviation data. For example, the adjustment unit can use mathematical models, such as regression analysis, to analyze the impact of various factors on thickness deviation, such as the effect of jet flow rate on thickness. Generally, a larger jet flow rate corresponds to a thicker copper layer, and a smaller jet flow rate corresponds to a thinner copper layer. The current compensation coefficient also affects thickness; a larger current corresponds to a thicker copper layer, and a smaller current corresponds to a thinner copper layer. The adjustment unit can use an iterative optimization algorithm to gradually adjust the current compensation coefficient and the flow rate compensation coefficient, thereby obtaining the final optimized first current compensation coefficient, second current compensation coefficient, first flow rate compensation coefficient, and second flow rate compensation coefficient.

[0041] It should be noted that for special process requirements of thick plates and small hole structures in the target plating parts, the spray flow rate can be increased, that is, the first flow rate compensation coefficient and the second flow rate compensation coefficient can be increased to ensure that the chemical solution is fully injected into the small hole. At the same time, the current can be reduced, that is, the first current compensation coefficient and the second current compensation coefficient can be reduced to avoid the thickness exceeding the standard due to the increase of the spray flow rate.

[0042] By synergistically optimizing current and flow rate, the influence of electric field distribution on the coating is considered, as well as the impact of solution flow on the mass transfer process. This optimization of the electric and flow fields significantly improves coating uniformity and quality. For complex structures such as thick plates and small holes, it ensures sufficient chemical filling while avoiding excessive thickness, effectively solving the technical challenges in traditional electroplating.

[0043] Optionally, the electroplating system may also include: The floating frame is used to fix the position of the target plating part in the electroplating tank 120 and to shield the electric field lines from the cathode edge effect. The float height adjustment module is used to adjust the height of the float according to the plate height range of the target plated part and the cumulative energized power of the first anode unit 141 or the second anode unit 151.

[0044] Specifically, the float is a floating support structure used to fix the target workpiece in the electroplating tank 120. It is usually made of corrosion-resistant and non-conductive materials and can support the workpiece and maintain its stable position during the electroplating process. When the anode unit is a soluble anode, such as a copper ball anode, it contains certain trace elements. During the electroplating process, some by-products will gradually fall to the bottom of the anode. These by-products will cause the anode to be shielded. As the charge increases, the shielding height will increase, so the height of the float needs to be adjusted accordingly.

[0045] Furthermore, edge effects exist during electroplating. Therefore, the initially set float height typically has a shielding effect, reducing the concentration of electric field lines at the edges. As anode sludge accumulates, the original shielding effect decreases, and the shielding height of the float must be adjusted accordingly to suppress edge effects. The shielding effect of anode sludge is closely related to the height of the target workpiece. For example, if the total anode length is 750mm and anode sludge has shielded the bottom 50mm, then for workpieces with a height greater than or equal to 700mm, the lower edge may have entered the shielded area, requiring process compensation for height adjustment. However, for workpieces with a height less than 700mm, the entire workpiece remains within the unshielded effective anode area, and initial compensation is sufficient to meet uniformity requirements. This invention provides differentiated process compensation for different workpiece height ranges.

[0046] The plate height range refers to the height dimension interval of the target part to be plated, usually divided into millimeter increments, such as 390-420, 421-450, etc., with each range corresponding to a specific set of height compensation parameters. During the initial use of the equipment, initial testing is conducted, and the plate height range is set into increments based on the actual product sizes and types in the factory. For example, a division method of 30mm increments is used: increment 1 is 390-420mm, increment 2 is 421-450mm, increment 3 is 451-480mm, increment 4 is 481-510mm, etc. For each plate height range, a standard plated part sample of the corresponding size is used to test the electroplating uniformity. The standard plated part sample is mounted on a floating frame, and electroplating is performed under optimal anode conditions, such as new anodes or after maintenance. By adjusting the floating frame height, the coating uniformity is optimized, and the adjustment amount is recorded as the initial compensation value for the corresponding plate height range. Based on equipment usage experience or accelerated aging tests, establish a correspondence between cumulative power consumption and process compensation values. For example, divide the cumulative power consumption into multiple levels. Under each power consumption level, conduct uniformity tests for different plate height ranges to determine the optimal floating frame height adjustment amount, which is then used as the process compensation value. Store the process compensation values ​​for each plate height range under different power consumption levels in a database.

[0047] In actual production, the float height adjustment module determines the plate height range based on the current target plate height dimension, reads the cumulative power consumption of the first anode unit 141 or the second anode unit 151, and determines the power level. The overall float height compensation is calculated according to the float height compensation transportation logic. In this embodiment, the overall float height compensation is the sum of the initial compensation value and the process compensation value. The initial compensation value can be retrieved from the database based on the plate height range, and the process compensation value can be retrieved from the database based on the plate height range and the power level. After the anode unit is maintained, the cumulative power consumption is reset to zero, and the float height adjustment relies solely on the initial compensation value before restarting the cumulative power consumption monitoring, providing a basis for subsequent process compensation.

[0048] By performing initial testing and setting initial compensation values ​​for each piece of equipment, the differences caused by manufacturing, installation, and equipment electrodes were effectively reduced, ensuring uniformity and consistency among different batches of target plating parts. By introducing cumulative power consumption as the basis for process compensation, the system can dynamically adapt to the effects of anode sludge buildup, anode consumption, and equipment aging, thereby improving product quality stability.

[0049] Figure 4 This is a flowchart illustrating a method for controlling electroplating uniformity according to an embodiment of the present invention. This embodiment is applicable to electroplating applications. The method can be executed by an electroplating system, and the device can be implemented in hardware and / or software. The method specifically includes the following steps: S110. Obtain the target plate thickness and target coating thickness of the target plated part, and determine the theoretical output current of each current output unit 110, the first current compensation coefficient corresponding to the first anode unit 141 and the second current compensation coefficient corresponding to the second anode unit 151 based on the target plate thickness, the target coating thickness and the preset current parameter database. Specifically, electroplating information can be set for the target part, including the target board thickness and the target plating thickness. The control module obtains the target board thickness and the target plating thickness through passive input or active scanning. The target board thickness refers to the physical thickness of the printed circuit board substrate itself. The target plating thickness refers to the target plating thickness of the metal layer deposited on the substrate surface through electroplating. Based on the target board thickness and the target plating thickness, the control module matches the theoretical output current of each current output unit 110 from the current parameter database. The control module further calls the first current compensation coefficient and the second current compensation coefficient corresponding to the current target board thickness and the target plating thickness.

[0050] S120. Based on the theoretical output current and the first current compensation coefficient, determine and control the actual output current of the current output unit 110 connected to the first anode unit 141; and based on the theoretical output current and the second current compensation coefficient, determine and control the actual output current of the current output unit 110 connected to the second anode unit 151.

[0051] Specifically, for each first anode unit 141, the actual output current can be obtained based on the first current compensation coefficient and the theoretical output current. For example, the actual output current is the product of the first current compensation coefficient and the theoretical output current of the corresponding current output unit 110. For each second anode unit 151, the actual output current can be obtained based on the second current compensation coefficient and the theoretical output current of the corresponding current output unit 110. For example, the actual output current is the product of the first current compensation coefficient and the theoretical output current.

[0052] It should be noted that the theoretical output current in the current parameter database can be calculated based on Faraday's law. For example, the theoretical output current can be calculated by substituting the preset electroplating parameters for each electroplating area, such as current density, electroplating area, and electroplating time, into the Faraday's law formula based on the target coating thickness. However, due to issues in actual electroplating, such as current concentration at the edges, limited mass transfer in the central region, and differences in coating distance from the electrode caused by the electroplating fixture, simply using the theoretical output current will result in uneven coating. Therefore, a first current compensation coefficient is set for the current output unit 110 of the first anode unit 141, and a second current compensation coefficient is set for the current output unit 110 of the second anode unit 151.

[0053] Under the premise of meeting the requirements for electroplating uniformity, in the same section of the first anode group 140 and the second anode group 150, the theoretical output current of the current output unit 110, which is at least partially connected to the first anode group 140, can be obtained based on the same electroplating parameters. For example, the entire electroplating area can be divided into multiple sections, such as an inlet section, a middle section, and an outlet section, etc., and the electroplating parameters of each section can be set independently, thereby realizing regional current control and improving electroplating uniformity. Similarly, the theoretical output current of the current output unit 110, which is at least partially connected to the second anode group 150, can be obtained based on the same electroplating parameters. Of course, when the thickness of the plating area requires high precision, the theoretical output current of the current output unit 110 can also be set with electroplating parameters individually. The setting of electroplating parameters is not specifically limited here. Through the independent regional control of the current output unit 110, precise current regulation of each anode unit can be achieved, thereby further improving the electroplating uniformity.

[0054] Optionally, electroplating uniformity control methods also include: Establish a current parameter database, including: Based on the target coating thickness and electroplating parameters, the theoretical output current is obtained using Faraday's law. Electroplating tests were conducted on samples of each target plate thickness based on the theoretical output current, and the actual plating thickness of the area corresponding to the first anode unit 141 of each target plate thickness was measured; and the actual plating thickness of the area corresponding to the second anode unit 151 of each target plate thickness was measured. The first current compensation coefficient for each region corresponding to the first anode unit 141 is determined based on the actual coating thickness and theoretical output current of the region corresponding to the first anode unit 141 of the sample with each target plate thickness; and the second current compensation coefficient for each region corresponding to the second anode unit 151 is determined based on the actual coating thickness and theoretical output current of the region corresponding to the second anode unit 151 of the sample with each target plate thickness.

[0055] Specifically, based on the target plate thickness and electroplating parameters, including current density, electroplating area, electroplating time, pulse waveform, and current efficiency, the theoretical output current is calculated using Faraday's law. Then, electroplating tests are conducted on standard sample plates with different target plating thicknesses using the theoretical output current. The standard sample plates are typically made of the same material and have the same dimensions as the target plates, undergoing the same pretreatment process. After electroplating, multiple measurement points are selected on the sample surface using precision thickness gauges, such as a CMI copper thickness gauge, X-ray fluorescence thickness gauge, or metallographic microscope, corresponding to the coverage areas of the first anode unit 141 and the second anode unit 151 for different target plating thicknesses, to measure the actual plating thickness in each area. Based on Faraday's law, the required current compensation coefficient for each anode unit can be derived. It should be noted that this reverse derivation process falls within the scope of existing technology; its principles and implementation methods are already maturely applied in the field of electrochemical engineering and will not be elaborated upon here. For example, the first current compensation coefficient can be expressed as the ratio of the actual plating thickness of the first anode unit 141 to the target plating thickness, or as the ratio of the actual output current of the current output unit 110 corresponding to the first anode unit 141 to the theoretical output current. The second current compensation coefficient can be expressed as the ratio of the actual plating thickness of the second anode unit 151 to the target plating thickness, or as the ratio of the actual output current of the current output unit 110 corresponding to the second anode unit 151 to the theoretical output current. The calculated current compensation coefficient, along with the corresponding target plate thickness, electroplating parameters, and other information, is stored in a current parameter database. To ensure data accuracy, multiple repeated experiments are usually required, and the average value can be taken as the final current compensation coefficient.

[0056] By setting a first current compensation coefficient and a second current compensation coefficient for the opposite electroplating surfaces, the unevenness of the plating layer caused by practical factors such as edge effects, uneven solution flow, and differences in electrode distance can be effectively corrected, thereby improving the uniformity of the plating thickness. Furthermore, machine learning algorithms can be introduced to establish a dynamically updated database of current compensation coefficients, thereby continuously correcting and optimizing the compensation coefficients based on real-time monitoring data during the actual production process. For example, the compensation coefficients can be adjusted in real time based on feedback data from an online thickness gauge; dynamically corrected based on the consumption of the anode unit; and adaptively adjusted considering the aging degree of the electroplating solution.

[0057] Optional, electroplating uniformity control methods also include: Based on the target plate thickness, target coating thickness and preset jet parameter database, the theoretical jet flow rate of each jet unit is determined, corresponding to the first flow rate compensation coefficient of the first anode group 140 and the second flow rate compensation coefficient of the second anode group 150. Based on the theoretical jet flow rate and the first flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the first nozzle unit 321 is calculated and controlled, and based on the theoretical jet flow rate and the second flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the second nozzle unit 331 is calculated and controlled.

[0058] Specifically, based on the target plate thickness and target coating thickness, the theoretical jet flow rate of each jet unit is matched from the jet parameter database. This theoretical jet flow rate, also known as the initial jet value, is typically obtained through actual testing of the coating effect under conditions of minimum target plate thickness and minimum target coating thickness, or other preset target plate thickness and target coating thickness. Because actual electroplating involves issues such as uneven solution flow, nozzle blockage, and differences in pipe resistance, simply using the theoretical jet flow rate may lead to uneven coating. Therefore, a first flow rate compensation coefficient is set for the electroplating area corresponding to the first anode unit 141, and a second flow rate compensation coefficient is set for the electroplating area of ​​the second anode unit 151.

[0059] The system further utilizes the first and second flow compensation coefficients corresponding to the current process conditions, distributing them to the corresponding jet units. Precise flow control is achieved by adjusting the variable frequency pump speed or the proportional valve opening. For each jet unit in the electroplating area corresponding to the first anode unit 141, the actual jet flow rate can be obtained based on the first flow compensation coefficient and the theoretical jet flow rate; for example, the actual jet flow rate is the product of the first flow compensation coefficient and the corresponding theoretical jet flow rate. Similarly, for each jet unit in the electroplating area corresponding to the second anode unit 151, the actual jet flow rate can be obtained based on the second flow compensation coefficient and the theoretical jet flow rate; for example, the actual jet flow rate is the product of the second flow compensation coefficient and the corresponding theoretical jet flow rate.

[0060] During the electroplating process, the jetting unit and the current output unit 110 work together. The jetting unit directionally sprays the electroplating solution, effectively disrupting the diffusion layer on the cathode 130 surface, enhancing the mass transfer rate of metal ions, reducing concentration polarization, and thus improving the density and adhesion of the plating layer. The combination of jetting control and current control forms current compensation and flow rate compensation, further improving the uniformity of the plating layer. For parts with deep holes, blind holes, or high aspect ratio structures, adjusting the jetting direction and flow rate can effectively improve the flow of the solution within complex structures, enhancing the deep plating capability and filling effect.

[0061] Optionally, electroplating uniformity control methods also include: Establish a jet parameter database, including: Under a fixed theoretical output current, orthogonal experiments were conducted for different target plate thicknesses, different target coating thicknesses and different spray flow combinations to measure the deviation of coating thickness in each region. Based on the thickness deviation, the first current compensation coefficient and the first flow compensation coefficient are adjusted; and the second current compensation coefficient and the second flow compensation coefficient are adjusted until the coating uniformity meets the preset experimental standard, so as to obtain the final determined first current compensation coefficient, second current compensation coefficient, first flow compensation coefficient and second flow compensation coefficient under different target plate thicknesses and different target coating thicknesses.

[0062] Specifically, through orthogonal experiments, systematic tests were conducted under a fixed theoretical output current condition for different target plate thicknesses, different target coating thicknesses, and different spray flow rate combinations. Based on the experimental data, parameter optimization was performed, and the current compensation coefficient and flow rate compensation coefficient could be adjusted according to the coating thickness deviation until the coating uniformity met the preset standard.

[0063] Based on the electroplating process requirements, the influencing factors affecting the uniformity of the coating are determined. In this embodiment of the invention, the influencing factors may include the target plate thickness, the first actual spray flow rate on one side of the first anode unit 141, the second actual spray flow rate on one side of the second anode unit 151, the first current compensation coefficient, the second current compensation coefficient, the first flow rate compensation coefficient, and the second flow rate compensation coefficient. An orthogonal experimental design is adopted. Orthogonal experiments obtain comprehensive experimental data with fewer experiments by selecting representative experimental combinations, which can be used to analyze the influence of each factor on the results. According to the orthogonal experimental design, for example, for the same target plate thickness, orthogonal experimental designs are formed for different target coating thicknesses and different spray flow rate combinations; for the same target coating thickness, orthogonal experimental designs are formed for different target plate thicknesses and different spray flow rate combinations. Each group of experiments is executed sequentially using a standard sample. The standard sample is consistent with the target plated part in terms of material, size, and previous process. Electroplating is performed under a fixed theoretical output current condition, and the actual process parameters of each experimental group are recorded. After electroplating is completed, multiple measurement points are selected on the sample surface using a precision thickness gauge, corresponding to the coverage areas of each anode unit and nozzle unit. The actual coating thickness of the area corresponding to the first anode unit 141 and the actual coating thickness of the area corresponding to the second anode unit 151 are measured. Furthermore, the deviation between the actual coating thickness of the area corresponding to the first anode unit 141 and the target coating thickness, and the deviation between the actual coating thickness of the area corresponding to the second anode unit 151 and the target coating thickness can be obtained.

[0064] The adjustment unit analyzes and adjusts based on thickness deviation data. For example, the adjustment unit can use mathematical models, such as regression analysis, to analyze the impact of various factors on thickness deviation, such as the effect of jet flow rate on thickness. Generally, a larger jet flow rate corresponds to a thicker copper layer, and a smaller jet flow rate corresponds to a thinner copper layer. The current compensation coefficient also affects thickness; a larger current corresponds to a thicker copper layer, and a smaller current corresponds to a thinner copper layer. The adjustment unit can use an iterative optimization algorithm to gradually adjust the current compensation coefficient and the flow rate compensation coefficient, thereby obtaining the final optimized first current compensation coefficient, second current compensation coefficient, first flow rate compensation coefficient, and second flow rate compensation coefficient.

[0065] It should be noted that for special process requirements of thick plates and small hole structures in the target plating parts, the spray flow rate can be increased, that is, the first flow rate compensation coefficient and the second flow rate compensation coefficient can be increased to ensure that the chemical solution is fully injected into the small hole. At the same time, the current can be reduced, that is, the first current compensation coefficient and the second current compensation coefficient can be reduced to avoid the thickness exceeding the standard due to the increase of the spray flow rate.

[0066] By synergistically optimizing current and flow rate, the influence of electric field distribution on the coating is considered, as well as the impact of solution flow on the mass transfer process. This optimization of the electric and flow fields significantly improves coating uniformity and quality. For complex structures such as thick plates and small holes, it ensures sufficient chemical filling while avoiding excessive thickness, effectively solving the technical challenges in traditional electroplating.

[0067] Optionally, the electroplating system also includes a floating platform and a floating platform height adjustment module; Electroplating uniformity control methods also include: The overall float height is adjusted according to the plate height range of the target plate and the cumulative energized power of the first anode unit 141 or the second anode unit 151.

[0068] Specifically, the float is a floating support structure used to fix the target workpiece in the electroplating tank 120. It is usually made of corrosion-resistant and non-conductive materials and can support the workpiece and maintain its stable position during the electroplating process. When the anode unit is a soluble anode, such as a copper ball anode, it contains certain trace elements. During the electroplating process, some by-products will gradually fall to the bottom of the anode. These by-products will cause the anode to be shielded. As the charge increases, the shielding height will increase, so the height of the float needs to be adjusted accordingly.

[0069] Furthermore, edge effects exist during electroplating. Therefore, the initially set float height typically has a shielding effect, reducing the concentration of electric field lines at the edges. As anode sludge accumulates, the original shielding effect decreases, and the shielding height of the float must be adjusted accordingly to suppress edge effects. The shielding effect of anode sludge is closely related to the height of the target workpiece. For example, if the total anode length is 750mm and anode sludge has shielded the bottom 50mm, then for workpieces with a height greater than or equal to 700mm, the lower edge may have entered the shielded area, requiring process compensation for height adjustment. However, for workpieces with a height less than 700mm, the entire workpiece remains within the unshielded effective anode area, and initial compensation is sufficient to meet uniformity requirements. This invention provides differentiated process compensation for different workpiece height ranges.

[0070] The plate height range refers to the height dimension interval of the target part to be plated, usually divided into millimeter increments, such as 390-420, 421-450, etc., with each range corresponding to a specific set of height compensation parameters. During the initial use of the equipment, initial testing is conducted, and the plate height range is set into increments based on the actual product sizes and types in the factory. For example, a division method of 30mm increments is used: increment 1 is 390-420mm, increment 2 is 421-450mm, increment 3 is 451-480mm, increment 4 is 481-510mm, etc. For each plate height range, a standard plated part sample of the corresponding size is used to test the electroplating uniformity. The standard plated part sample is mounted on a floating frame, and electroplating is performed under optimal anode conditions, such as new anodes or after maintenance. By adjusting the floating frame height, the coating uniformity is optimized, and the adjustment amount is recorded as the initial compensation value for the corresponding plate height range. Based on equipment usage experience or accelerated aging tests, establish a correspondence between cumulative power consumption and process compensation values. For example, divide the cumulative power consumption into multiple levels. Under each power consumption level, conduct uniformity tests for different plate height ranges to determine the optimal floating frame height adjustment amount, which is then used as the process compensation value. Store the process compensation values ​​for each plate height range under different power consumption levels in a database.

[0071] In actual production, based on the current target plate height, the plate height range is determined, and the cumulative energized power of the first anode unit 141 or the second anode unit 151 is read to determine the power level. The overall float height compensation is calculated according to the float height compensation transportation logic. In this embodiment, the overall float height compensation is the sum of the initial compensation value and the process compensation value. The initial compensation value can be retrieved from the database based on the plate height range, and the process compensation value can be retrieved from the database based on the plate height range and the power level. After the anode unit is maintained, the cumulative power is reset to zero, and the float height adjustment relies solely on the initial compensation value. The cumulative power monitoring then restarts, providing a basis for subsequent process compensation.

[0072] By performing initial testing and setting initial compensation values ​​for each piece of equipment, the differences caused by manufacturing, installation, and equipment electrodes were effectively reduced, ensuring uniformity and consistency among different batches of target plating parts. By introducing cumulative power consumption as the basis for process compensation, the system can dynamically adapt to the effects of anode sludge buildup, anode consumption, and equipment aging, thereby improving product quality stability.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electroplating system, characterized in that, include: Multiple independently controllable current output units; Electroplating tank; The cathode is disposed in the electroplating tank and connected to the negative terminal of the current output unit, and the cathode is electrically connected to the target plating workpiece; At least one first anode group and at least one second anode group are respectively disposed on both sides of the cathode in the electroplating tank; the first anode group includes a plurality of first anode units arranged sequentially along the length direction of the electroplating tank, each first anode unit being connected to the positive electrode of a set of current output units; the second anode group includes a plurality of second anode units arranged sequentially along the length direction of the electroplating tank, each second anode unit being connected to the positive electrode of a set of current output units. The control module is used to acquire the target plate thickness and target coating thickness of the target plated part, and determine the theoretical output current of each current output unit, the first current compensation coefficient corresponding to the first anode unit and the second current compensation coefficient corresponding to the second anode unit based on the target plate thickness, the target coating thickness and the preset current parameter database. Based on the theoretical output current and the first current compensation coefficient, determine and control the actual output current of the current output unit connected to the first anode unit; And based on the theoretical output current and the second current compensation coefficient, determine and control the actual output current of the current output unit connected to the second anode unit.

2. The electroplating system according to claim 1, characterized in that, Also includes: First database creation module; The first database creation module includes: The first calculation unit is used to obtain the theoretical output current based on Faraday's law, according to the target coating thickness and electroplating parameters. The first experimental unit is used to perform electroplating tests on the samples of each target plate thickness according to the theoretical output current, and to measure the actual plating thickness of the area corresponding to the first anode unit of each target plate thickness sample; and to measure the actual plating thickness of the area corresponding to the second anode unit of each target plate thickness sample. The second calculation unit is used to determine a first current compensation coefficient for each region corresponding to the first anode unit based on the actual coating thickness of the region corresponding to the first anode unit of each target plate thickness and the theoretical output current; and to determine a second current compensation coefficient for each region corresponding to the second anode unit based on the actual coating thickness of the region corresponding to the second anode unit of each target plate thickness and the theoretical output current.

3. The electroplating system according to claim 1, characterized in that, Also includes: Multiple independently controllable jet units; The first nozzle group and the second nozzle group are placed in the electroplating tank and located on both sides of the cathode; the first nozzle group includes a plurality of first nozzle units arranged sequentially along the length direction of the electroplating tank, and each first nozzle unit is connected to the output end of a set of jet units. The second nozzle assembly includes second nozzle units arranged sequentially along the length of the electroplating tank, each second nozzle unit being connected to the output end of a set of spray units; the spray units are used to drive the electroplating solution in the electroplating tank to be sprayed onto the surface of the target workpiece via the first nozzle assembly and the second nozzle assembly; The control module is also used to determine the theoretical flow rate of each jet unit, the first flow rate compensation coefficient corresponding to the first anode group and the second flow rate compensation coefficient corresponding to the second anode group, based on the target plate thickness, the target coating thickness and the preset jet parameter database. Based on the theoretical jet flow rate and the first flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the first nozzle unit is calculated and controlled, and based on the theoretical jet flow rate and the second flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the second nozzle unit is calculated and controlled.

4. The electroplating system according to claim 3, characterized in that, include: Second database creation module; The second database creation module includes: The second experimental unit is used to conduct orthogonal experiments on different target plate thicknesses, different target coating thicknesses and different spray flow combinations under a fixed theoretical output current, and to measure the deviation of coating thickness in each region. The adjustment unit adjusts the first current compensation coefficient and the first flow rate compensation coefficient based on the thickness deviation; and adjusts the second current compensation coefficient and the second flow rate compensation coefficient until the coating uniformity meets the preset experimental standard, thereby obtaining the final determined first current compensation coefficient, second current compensation coefficient, first flow rate compensation coefficient and second flow rate compensation coefficient under different target plate thicknesses and different target coating thicknesses.

5. The electroplating system according to claim 1, characterized in that, Also includes: Floating frame, used to fix the position of the target plating part in the electroplating tank; The float height adjustment module is used to adjust the height of the float according to the plate height range of the target plated part and the cumulative energized power of the first anode unit or the second anode unit.

6. A method for controlling electroplating uniformity, characterized in that, Performed by the electroplating system according to any one of claims 1-5, comprising: The target plate thickness and target coating thickness of the target plated part are obtained, and the theoretical output current of each current output unit, the first current compensation coefficient corresponding to the first anode unit and the second current compensation coefficient corresponding to the second anode unit are determined based on the target plate thickness, the target coating thickness and the preset current parameter database. Based on the theoretical output current and the first current compensation coefficient, the actual output current of the current output unit connected to the first anode unit is determined and controlled; and based on the theoretical output current and the second current compensation coefficient, the actual output current of the current output unit connected to the second anode unit is determined and controlled.

7. The electroplating uniformity control method according to claim 6, characterized in that, Also includes: Establishing the current parameter database includes: Based on the target coating thickness and electroplating parameters, the theoretical output current is obtained using Faraday's law. Electroplating tests were conducted on the samples of each target plate thickness according to the theoretical output current, and the actual plating thickness of the sample of each target plate thickness in the region corresponding to the first anode unit was measured; and the actual plating thickness of the sample of each target plate thickness in the region corresponding to the second anode unit was measured. A first current compensation coefficient is determined for each region corresponding to the first anode unit based on the actual coating thickness of the region corresponding to the first anode unit of the sample with each target plate thickness and the theoretical output current; and a second current compensation coefficient is determined for each region corresponding to the second anode unit based on the actual coating thickness of the region corresponding to the second anode unit of the sample with each target plate thickness and the theoretical output current.

8. The electroplating uniformity control method according to claim 6, characterized in that, The electroplating system further includes: multiple independently controllable spray units; a first spray nozzle group, wherein the first spray nozzle group and a second spray nozzle group are placed in the electroplating tank and located on both sides of the cathode; the first spray nozzle group includes multiple first spray nozzle units arranged sequentially along the length direction of the electroplating tank, each first spray nozzle unit being connected to the output end of a set of spray units; the second spray nozzle group includes second spray nozzle units arranged sequentially along the length direction of the electroplating tank, each second spray nozzle unit being connected to the output end of a set of spray units; the spray units are used to drive the electroplating solution in the electroplating tank to be sprayed onto the surface of the target workpiece via the first spray nozzle group and the second spray nozzle group; The electroplating uniformity control method includes: Based on the target plate thickness, the target coating thickness, and the preset jetting parameter database, the theoretical jetting flow rate of each jetting unit is determined, corresponding to the first flow rate compensation coefficient of the first anode group and the second flow rate compensation coefficient of the second anode group. Based on the theoretical jet flow rate and the first flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the first nozzle unit is calculated and controlled, and based on the theoretical jet flow rate and the second flow rate compensation coefficient, the actual jet flow rate of the jet unit connected to the second nozzle unit is calculated and controlled.

9. The electroplating uniformity control method according to claim 8, characterized in that, Establishing the jet parameter database includes: Under a fixed theoretical output current, orthogonal experiments were conducted for different target plate thicknesses, different target coating thicknesses, and different combinations of spray flow rates to measure the deviation of coating thickness in each region. Based on the thickness deviation, the first current compensation coefficient and the first flow compensation coefficient are adjusted; and the second current compensation coefficient and the second flow compensation coefficient are adjusted until the coating uniformity meets the preset experimental standard, so as to obtain the first current compensation coefficient, the second current compensation coefficient, the first flow compensation coefficient and the second flow compensation coefficient under different target plate thicknesses and different target coating thicknesses.

10. The electroplating uniformity control method according to claim 6, characterized in that, The electroplating system also includes a floating frame and a floating frame height adjustment module; The electroplating uniformity control method further includes: The overall float height is adjusted according to the plate height range of the target plate and the cumulative energized power of the first anode unit or the second anode unit.

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