Air floating module, hot bar bonding and die bonding apparatus

Abstract

This invention relates to an air-float module, a hot-press bonding head, and a chip bonding device. The air-float module includes a floating component, a first end cap, and a second end cap, which are respectively disposed at two ends of the floating component. The first end cap and the second end cap are respectively provided with a first air nozzle and a second air nozzle. The floating component includes a spline shaft, a spline sleeve, and an outer sleeve. The spline sleeve is sleeved on the spline shaft. The first end cap and the second end cap are respectively fixedly connected to the spline sleeve. A first air-float gap is formed between the spline sleeve and the spline shaft. The outer sleeve is sleeved on the spline sleeve. A second air-float gap is formed between the outer sleeve and the spline sleeve. The first air-float gap and the second air-float gap communicate with the first air nozzle and the second air nozzle.

Description

Technical Field

[0001] This invention relates to the field of air flotation module technology, and particularly to an air flotation module, a hot press bonding head, and a chip bonding device. Background Technology

[0002] In recent years, in semiconductor chip bonding processes, bonding heads need to simultaneously perform high-speed linear pick-and-place and precise angular alignment, placing stringent requirements on the frictionless, high-cleanliness, and high dynamic response of the motion system. Traditional mechanical guides or ball splines, due to solid contact, are prone to particulate contamination and wear, affecting bonding accuracy and yield. Air bearing technology utilizes high-pressure air film to achieve contactless support, completely eliminating friction and wear. Existing air bearing modules can only achieve linear or rotary motion, and cannot achieve a combination of linear and rotary motion. Summary of the Invention

[0003] To address the technical problem that existing air flotation modules cannot achieve a combination of linear and rotational motion, this invention provides an air flotation module, a hot-press bonding head, and a chip bonding device.

[0004] The present invention provides an air flotation module, comprising a floating component, a first end cap, and a second end cap, which are respectively disposed at two ends of the floating component; the first end cap is provided with a first air nozzle, and the second end cap is provided with a second air nozzle, which are connected to each other; the floating component includes a spline shaft, a spline sleeve, and an outer sleeve; the spline sleeve is fitted onto the spline shaft; the first end cap and the second end cap are respectively fixedly connected to the spline sleeve; a first air flotation gap is formed between the spline sleeve and the spline shaft; the outer sleeve is fitted onto the spline sleeve; a second air flotation gap is formed between the outer sleeve and the spline sleeve; the first air flotation gap and the second air flotation gap are connected to the first air nozzle and the second air nozzle.

[0005] Preferably, the first end cap and the second end cap are respectively provided with through holes corresponding to the position of the spline shaft; the spline shaft passes through the through hole of the second end cap and is exposed outside the second end cap; the first end cap and the second end cap and the outer sleeve form a third air float gap, and air guide pads are respectively provided in the first air float gap, the second air float gap and the third air float gap, and the third air float gap is connected to the first air nozzle and the second air nozzle.

[0006] Preferably, one side of the air guide pad in the first air float gap is fixed to the spline shaft, and the other side has a gap with the spline sleeve; one side of the air guide pad in the second air float gap is fixed to the outer sleeve, and the other side has a gap with the spline sleeve; one side of the air guide pad in the third air float gap is fixed to the first end cap and / or the second end cap, and the other side has a gap with the outer sleeve.

[0007] Preferably, the first end cap and the second end cap are each provided with no less than two air nozzle mounting slots; the air nozzle mounting slots cooperate with the first air nozzle, the second air nozzle, or the plug.

[0008] Preferably, the end face of the first end cap away from the floating component is provided with at least one transmission connection hole.

[0009] Preferably, the spline sleeve has an air passage inside that connects to the air nozzle mounting groove.

[0010] Preferably, the airway is cross-shaped.

[0011] Preferably, the splined shaft has a transmission groove at one end near the first end cover.

[0012] The present invention also provides a hot-press head, including the air flotation module, a body assembly, a Z-axis drive module, and a nozzle module. The body assembly is connected to the movable end of the Z-axis drive module. The body assembly includes a W-axis drive module, a first transmission assembly, a connector, and a second transmission assembly, which are sequentially connected and coaxially arranged. The connector is fixedly connected to the W-axis drive module, and the end face of the connector near the W-axis drive module is connected to the first transmission assembly, while the other end face of the connector is connected to the second transmission assembly. The nozzle module is located at the end of the body assembly away from the W-axis drive module. The W-axis drive module includes a W-axis motor. The movement direction of the Z-axis motor drive end is parallel to the movement direction of the movable end of the Z-axis drive module; a W-axis force control sensor is provided on the connector; a Z-axis force control sensor is provided on the movable end of the Z-axis drive module; when the Z-axis drive module is activated, it drives the first transmission component, pushes the W-axis force control sensor and the connector, and then pushes the second transmission component to move synchronously with the connector, so that the nozzle module moves synchronously downward; the Z-axis force control sensor is held against by the movable end of the Z-axis drive module; or the W-axis motor directly pushes the connector and the W-axis force control sensor, and then pushes the second transmission component to move synchronously with the connector, so that the nozzle module moves synchronously downward; the W-axis force control sensor holds against the second transmission component.

[0013] The present invention also provides a chip bonding device, including a chip bonding device body and the air flotation module, wherein the chip bonding device further includes a linear drive mechanism and / or a rotary drive mechanism.

[0014] Compared with the prior art, the air flotation module, hot press bonding head, and chip bonding equipment provided by the present invention have the following advantages: 1. This invention provides an air-bearing module, which facilitates assembly and disassembly through a separate structure of a floating component, a first end cap, and a second end cap. The first air-bearing gap between the spline sleeve and the spline shaft, and the second air-bearing gap between the outer sleeve and the spline sleeve, are both connected to air nozzles, enabling dual air-bearing support. This provides stable axial air film support for the spline shaft and spline sleeve, reducing contact friction, improving motion smoothness, and achieving high-speed, ultra-high-precision transmission. The separate end caps and air nozzles at both ends contribute to uniform air distribution and symmetrical air-bearing pressure, thereby improving the guiding accuracy and load-bearing capacity of the air-bearing module.

[0015] 2. In the air-float module provided in this embodiment of the invention, through holes are provided in the first and second end caps corresponding to the spline shaft positions, facilitating the spline shaft to pass through the second end cap and be exposed, making it convenient to connect with external loads. This structure ensures the effectiveness of internal air-float, realizes shaft end extension, meets application scenarios requiring axial force output, and at the same time, the air guide pad reduces airflow noise and energy consumption. A third air-float gap is added between the first and second end caps and the outer sleeve, and air guide pads are set in the first, second, and third air-float gaps. The air guide pads are loose and porous, allowing gas to pass through and form an air film, making the gas distribution more uniform, avoiding local pressure fluctuations, and providing rigid support to improve the stability of the air film. This allows the module to also obtain air-float support in the end direction. In this way, all mating surfaces between the spline shaft, spline sleeve, and outer sleeve are isolated by the air film, achieving a multi-directional full floating effect. After the third air-float gap is connected to the air nozzle, it compensates for axial force deformation, improves the straightness and accuracy of the overall movement, and is suitable for high-precision micro-motion applications.

[0016] 3. In the air flotation module provided in the embodiments of the present invention, by reserving gaps between the relatively moving parts and fixing the air guide pad, it is easy to distribute the compressed gas evenly and form a stable air film, thereby reducing the friction and temperature rise during the transmission process and improving the motion accuracy and reliability.

[0017] 4. In the air flotation module provided in this embodiment of the invention, the first end cap and the second end cap are each provided with no less than two air nozzle mounting slots, which can be flexibly installed with air nozzles or plugs as needed. If multiple air supply points are required, multiple air nozzles can be installed to increase the air intake flow rate and response speed; if only a single air supply point is required, plugs can be used to seal the extra slots, simplifying the air circuit connection. This design enhances the module's adaptability to different air supply systems, facilitates on-site piping, and makes it easier to replace air nozzles during subsequent maintenance, reducing operating costs while maintaining a clean appearance of the end caps.

[0018] 5. In the air flotation module provided in this embodiment of the invention, the end face of the first end cap away from the floating component is provided with at least one transmission connection hole, which can be mechanically connected to an external drive mechanism to facilitate the transmission of rotational power and enable the air flotation module to act as a driven guide. The connection hole can ensure connection strength and improve the versatility and assembly convenience of the module.

[0019] 6. In the air flotation module provided in this embodiment of the invention, an air channel is provided inside the spline sleeve and connected to the air nozzle mounting groove, allowing gas to directly reach each air flotation gap from the end cap air nozzle through the internal channel of the spline sleeve. The internal air channel path is short, the pressure loss is small, and an air film can be quickly established, improving the response speed. At the same time, the air channel is integrated into the spline sleeve, which does not affect the movement space of the spline shaft, ensuring structural strength and sealing performance.

[0020] 7. In the air flotation module provided in this embodiment of the invention, the air passage inside the spline sleeve is set in a cross shape. The cross-shaped air passage structure is symmetrical and can simultaneously supply air to multiple directions in the first and second air flotation gaps, ensuring uniform circumferential air film pressure and avoiding uneven air film thickness caused by uneven loading. This shape is simple to process, and the flow channel cross-sectional area is sufficient to provide adequate flow, making the start and stop of air flotation more stable and effectively reducing vibration and noise caused by uneven air supply.

[0021] 8. In the air flotation module provided in this embodiment of the invention, a transmission groove is provided at the end of the spline shaft near the first end cover, which can cooperate with an external rotary drive component to achieve torque transmission. This transmission groove has a simple structure, is easy to process, and does not affect the air flotation fit accuracy of the spline shaft surface. The transmission groove can be in the form of a keyway, a flat groove, or a threaded hole to adapt to different transmission methods. Its placement at this end facilitates docking with the drive source on the first end cover side, realizing the active rotation function of the air flotation module, expanding the module's application range, and enabling it to both guide and be driven to rotate. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a hot-pressed connector provided in an embodiment of the present invention. Figure 1 .

[0024] Figure 2 This is an exploded view of a hot-pressed head provided in an embodiment of the present invention.

[0025] Figure 3 This is a cross-sectional view of a hot-pressed head provided in an embodiment of the present invention.

[0026] Figure 4 This is a hot-pressed head provided in an embodiment of the present invention, and a partial enlarged view A.

[0027] Figure 5This is a hot-pressed head provided in an embodiment of the present invention, and a partially enlarged view B.

[0028] Figure 6 This is a schematic diagram of the structure of a hot-pressed connector provided in an embodiment of the present invention. Figure 2 .

[0029] Figure 7 This is a cross-sectional view of an air flotation module provided in an embodiment of the present invention.

[0030] Figure 8 This is a top view of an air flotation module provided in an embodiment of the present invention.

[0031] Figure 9 This is a schematic diagram of a chip bonding device provided in an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached diagram: 10. Hot-press bonding head; 20. Air flotation module; 30. Chip bonding equipment; 40. Control system; 50. Vision module; 60. XY axis module; 1. Main body assembly; 11. First transmission assembly; 111. Unloading column; 112. Spring pad; 113. Connector; 12. Connecting piece; 13. Second transmission assembly; 131. Top column; 1311. Limiting block; 14. Main body shell 2. Z-axis drive module; 21. Z-axis force control sensor; 22. Z-axis motor; 23. Mounting base; 24. Z-axis slider; 25. Z-axis grating reader; 3. Suction nozzle module; 31. Heating module; 32. Vacuum connector; 4. W-axis drive module; 41. W-axis motor; 42. W-axis force control sensor; 43. W-axis grating reader; 5. θ-axis drive module; 51. θ-axis motor; 52. First connecting platform; 53. Second connecting platform; 54. θ-axis coupling; 6. Air-float spline module; 61. Circular grating; 611. Circular read head; 62. Connecting disk; 7. Leveling module; 71. Leveling motor; 711. Connecting block; 7111. Top head; 7112. Second elastic element; 7113. Supporting element; 7114. Adjusting groove; 72. Spherical air flotation; 73. Adjusting platform; 74. Leveling housing; 75. Height sensor; 76. Leveling grating reader; 77. First elastic element; 8. Floating assembly; 81. Splined shaft; 82. Splined sleeve; 83. Outer sleeve; 84. Plug; 85. Transmission groove; 9. First air flotation gap; 91. Second air flotation gap; 92. Third air flotation gap; 93. Air passage; 94. First end cap; 95. Second end cap; 96. First air nozzle; 97. Second air nozzle; 98. Air flotation shell. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0034] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0035] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0036] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0037] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0038] Please see Figure 1 and Figure 2The first embodiment of the present invention provides a hot-press bonding head 10 for semiconductor chip bonding. The hot-press bonding head 10 includes a body assembly 1, a Z-axis drive module 2, and a nozzle module 3. The body assembly 1 is connected to the movable end of the Z-axis drive module 2. The body assembly 1 includes a W-axis drive module 4, a first transmission component 11, a connector 12, and a second transmission component 13, which are sequentially connected and coaxially arranged. The connector 12 is fixedly connected to the W-axis drive module 4. The end face of the connector 12 near the W-axis drive module 4 is connected to the first transmission component 11, and the other end face of the connector 12 is connected to the second transmission component 13. The nozzle module 3 is located at the end of the body assembly 1 away from the W-axis drive module 4. The W-axis drive module 4 includes a W-axis motor. The movement direction of the W-axis motor 41 driving end is parallel to the movement direction of the Z-axis drive module 2 moving end; the connector 12 is provided with a W-axis force control sensor 42; the moving end of the Z-axis drive module 2 is provided with a Z-axis force control sensor 21; the action of the Z-axis drive module 2 drives the first transmission component 11 to push the W-axis force control sensor 42 and the connector 12, thereby pushing the second transmission component 13, so that the nozzle module 3 moves down synchronously; the Z-axis force control sensor 21 is held against by the moving end of the Z-axis drive module 2; or the action of the W-axis motor 41 directly pushes the connector 12 and the W-axis force control sensor 42, thereby pushing the second transmission component 13, so that the nozzle module 3 moves down synchronously; the W-axis force control sensor 42 holds against the second transmission component 13.

[0039] Understandably, this embodiment of the invention provides a hot-press bonding head 10, which is equipped with dual force control sensors and dual drive modules. The Z-axis force control sensor 21 and the W-axis force control sensor 42 monitor the downward pressure of the Z-axis drive module 2 and the W-axis drive module 4, respectively. This application provides two transmission paths depending on whether the Z-axis drive module 2 or the W-axis drive module 4 is used. The transmission path of the Z-axis drive module 2 is suitable for high-force bonding, while the transmission path of the W-axis drive module 4 is suitable for low-force bonding. As an example, high-force bonding refers to a bonding force in the range of 10N to 500N, and low-force bonding refers to a bonding force in the range of 0.2 to 10N. The Z-axis force control sensor 21 and the W-axis force control sensor 42 detect the downward pressure to ensure high force control accuracy during chip bonding, regardless of whether it is high-force or low-force bonding. The nozzle module 3 is used to fix the chip.

[0040] Please see Figures 2 to 4The main body assembly 1 also includes a main body shell 14; the main body shell 14 is fitted onto the W-axis drive module 4; the W-axis motor 41 is a hollow motor, and the first transmission assembly 11 is located in the hollow position of the W-axis motor 41; the first transmission assembly 11 includes a stress relief column 111, a spring pad 112, and a connector 113, with the connector 113 close to the W-axis force control sensor 42; one end of the stress relief column 111 abuts against the inner wall of the main body shell 14; the stress relief column 111, the spring pad 112, the connector 113, and the connector 12 are coaxially arranged; the stress relief column 111 and the spring pad 112 are connected, the connector 113 and the connector 12 are connected, and there is a gap between the spring pad 112 and the connector 113; the second transmission assembly 13 includes a top column 131 and a splined shaft 81, with the top column 131 close to the W-axis force control sensor 42; the top column 131 and the splined shaft 81 are rotatably connected and coaxially arranged.

[0041] Understandably, in the hot-press head 10 provided in this embodiment of the invention, the outer shell 14 of the main body is fitted over the W-axis drive module 4 for protection. One end of the stress relief column 111 abuts against the inner wall of the outer shell 14, transmitting the downward pressure from the Z-axis drive module 2 and absorbing excess impact force. The W-axis motor 41 adopts a hollow structure to avoid obstruction of the first transmission structure. The first transmission component 11 is placed in the hollow position, allowing the first transmission component 11 to directly drive the connector 12 and the W-axis force control sensor 42. The spring pad 112 provides cushioning and can store elastic force. The connector 113, connector 12, top column 131, and spline shaft 81 are coaxially connected in sequence to ensure coaxiality of force transmission. The top column 131 and spline shaft 81 are rotatably connected, allowing independent rotational movement. The main body component 1 has a compact structure and stable and reliable transmission.

[0042] It should be noted that during bonding via the Z-axis drive module 2, the downward pressure of the Z-axis motor 22 is transmitted to the chip through the main body housing 14, the unloading column 111, the spring pad 112, the connector 113, the W-axis pressure sensor, the connector, the top post 131, and the spline shaft 81; during bonding via the W-axis drive module 4, the downward pressure of the W-axis motor 41 is transmitted to the chip through the W-axis pressure sensor, the connector, the top post 131, and the spline shaft 81. Furthermore, the Z-axis drive module 2 adopts a lead screw drive, and the lead screw structure has a limiting effect on the drive end of the Z-axis motor 22. When bonding is performed through the Z-axis drive module 2, the spring pad 112 is in a compressed state under the action of downward pressure. After a certain period of hot-press bonding, the solder balls of the chip melt, and at this time the elastic force stored in the spring pad 112 is released to drive the chip to move down. Since the W-axis motor 41 directly drives the W-axis pressure sensor and connector, the solder balls of the chip melt, and the W-axis motor 41 directly drives the chip to move down.

[0043] Specifically, the spline shaft 81 has a groove at one end near the top post 131, and a bearing is installed in the groove. The top post 131 and the spline shaft 81 are connected by the bearing. The outer ring of the bearing is connected to the spline shaft 81, and the inner ring of the bearing is connected to the top post 131.

[0044] Understandably, this is to avoid generating additional torsional torque on the top column 131 when the spline shaft 81 rotates, thereby ensuring that the downward pressure is unbiased, improving force control accuracy and reducing wear on transmission components.

[0045] Specifically, the end of the connector 113 that contacts the spring pad 112 has a smooth surface, and the end that contacts the W-axis force control sensor 42 has a boss that corresponds to and fits into the groove of the connector 12. A through hole is provided below the groove of the connector 12, and the W-axis force control sensor 42 is fixed in the through hole with both end faces of the W-axis force control sensor 42 exposed in the through hole.

[0046] Understandably, the smooth end allows the spring pad 112 to deform evenly and be subjected to consistent force, avoiding stress concentration; the boss and the groove of the connector 12 cooperate to prevent the connector 113 from shifting during movement; it facilitates the sensor to measure the magnitude of the force, reduces intermediate transmission links, and makes the force measurement more accurate.

[0047] Specifically, the top post 131 has a circular boss at the end that contacts the W-axis force control sensor 42, and the circular boss is matched with the groove of the W-axis force control sensor 42; the top post 131 has a limiting boss at the end near the spline shaft 81, and the limiting boss is matched with the groove.

[0048] Understandably, the circular boss and the sensor groove cooperate to provide a stable contact point and improve the accuracy of measurement; the limiting boss cooperates with the spline shaft 81 groove to limit the maximum downward stroke of the top post 131 and prevent the chip from being damaged due to over-pressure.

[0049] Please see Figure 3 and Figure 6 The Z-axis drive module 2 includes a Z-axis motor 22, a mounting base 23, and a Z-axis slider 24; the Z-axis slider 24 and the Z-axis motor 22 are connected by a transmission; the mounting base 23 is located on the Z-axis slider 24; the Z-axis force control sensor 21 is located on the mounting base 23; the Z-axis drive module 2 is also provided with a Z-axis grating reader 25 at the position corresponding to the Z-axis slider 24.

[0050] Understandably, in the hot-press bonding head 10 provided in this embodiment of the invention, the Z-axis drive module 2 uses a Z-axis motor 22 to drive the Z-axis slider 24 to move linearly. A mounting base 23 is fixed to the Z-axis slider 24, and a Z-axis force control sensor 21 is mounted on the mounting base 23. The sensor directly detects the downward pressure transmitted by the Z-axis slider 24, resulting in a fast response. A Z-axis grating reader 25 is installed at the corresponding position on the Z-axis slider 24, providing accurate feedback on the Z-axis movement position. The structure of the Z-axis slider 24, Z-axis force control sensor 21, and Z-axis grating reader 25 is simple and direct, with high transmission efficiency. Force control and position detection work together to improve bonding accuracy.

[0051] Please see Figure 2 and Figure 3 The hot press head 10 also includes an θ-axis drive module 5, an air-floating spline module 6, a leveling module 7, and a heating module 31 connected coaxially in sequence; the θ-axis drive module 5 is connected to the W-axis drive module 4; the θ-axis drive module 5 includes an θ-axis motor 51, a first connecting platform 52, a second connecting platform 53, and an θ-axis coupling 54; the rotation direction of the θ-axis motor 51 is perpendicular to the movement direction of the W-axis motor 41; the θ-axis motor 51, the first connecting platform 52, and the second connecting platform 53 are sleeved on the top column 131, the θ-axis motor 51 does not contact the top column 131, the drive end of the θ-axis motor 51 is fixedly connected to the first connecting platform 52, and the second connecting platform 53 is fixedly connected to the air-floating spline module 6; the θ-axis coupling 54 connects the first connecting platform 52 and the second connecting platform 53.

[0052] As can be understood, the hot press head 10 provided in this embodiment of the invention further includes a θ-axis drive module 5, an air-floating spline module 6, a leveling module 7, and a heating module 31, all coaxially connected in sequence. These multiple modules work together to achieve high-precision, multi-degree-of-freedom motion. The rotation direction of the θ-axis motor 51 is perpendicular to the motion direction of the W-axis motor 41, allowing the hot press head 10 to rotate. The θ-axis motor 51 is fitted outside the top column 131 but does not contact it, avoiding interference with the force transmission of the Z-axis and W-axis. The θ-axis motor 51 transmits rotational torque to the air-floating spline module 6 through the first connecting platform 52, the θ-axis coupling 54, and the second connecting platform 53.

[0053] In a specific embodiment, the θ-axis drive module 5 is provided with a body shell 14 on its outer casing 83, and the body shell 14 is fixedly connected to the Z-axis slider 24.

[0054] Please see Figure 2 , Figure 3 and Figure 6The air-float spline module 6 includes an air-float module 20, a circular grating 61, and a connecting disk 62; a spline shaft 81 and a spline sleeve 82 are disposed on the air-float module 20; the circular grating 61, the spline sleeve 82, and the connecting disk 62 are sleeved on the spline shaft 81; the circular grating 61 is disposed at one end of the air-float module 20 near the leveling module 7; the connecting disk 62 is disposed between the circular grating 61 and the air-float module 20; a W-axis grating reader 43 is provided on the connecting disk 62 corresponding to the leveling module 7; two circular readers 611 are also provided on the outer surface of the air-float module 20; the spline sleeve 82 is fixedly connected to the second connecting platform 53; the end of the spline shaft 81 away from the top column 131 is connected to the leveling module 7.

[0055] Understandably, in the hot-pressed head 10 provided in this embodiment of the invention, the air-floating spline module 6 utilizes air-floating technology to reduce friction between the spline shaft 81 and the spline sleeve 82, resulting in smooth movement. A circular grating 61 is installed at one end of the air-floating module 20 near the leveling module 7, and two circular reading heads 611 are located on the outer surface of the air-floating module 20, enabling high-precision angle measurement. A W-axis grating reading head 43 is provided on the connecting disk 62 to provide feedback on the displacement of the hot-pressed head 10 in the Z-axis direction. The spline sleeve 82 is fixed to the second connecting platform 53. When driven by the θ-axis, the spline sleeve 82 rotates, causing the spline shaft 81 to rotate, and the spline shaft 81 can slide axially, achieving composite control of rotation and linear motion.

[0056] It should be noted that after a certain period of hot-press bonding, the solder balls of the chip melt, and the chip moves downward under the elastic force of the spring pad 112 / W-axis pressure. The W-axis grating read head 43 reads the downward movement of the leveling module 7. In order to ensure the height of the chip and the chip base during hot pressing, the W-axis motor 41 is started and makes corresponding compensation in the Z-axis direction according to the temperature and hot pressing time until the hot-press bonding is completed.

[0057] Please see Figure 2 , Figure 3 and Figure 6 The leveling module 7 includes four leveling motors 71, a spherical air float 72, an adjustment platform 73, a leveling housing 74, and three height sensors 75. The leveling motors 71 are located on the leveling housing 74. The adjustment platform 73 is located between the leveling housing 74 and the heating module 31, with the four leveling motors 71 arranged in an array along the circumferential edge of the adjustment platform 73. The height sensors 75 are arranged in an array along the circumferential side of the leveling housing 74. The end face of the adjustment platform 73 near the air float spline module 6 has a spherical air float 72, and the other end face of the adjustment platform 73 has a heating module 31. The heating module 31 is connected to the suction nozzle module 3. The suction nozzle module 3 has a vacuum connector 32.

[0058] Understandably, in the hot-press bonding head 10 provided in this embodiment of the invention, the leveling module 7 includes four leveling motors 71 and three height sensors 75. The leveling motors 71 are arranged in an array along the circumferential edge of the adjustment platform 73, and their operation adjusts the tilt angle of the adjustment platform 73. The height sensors 75 are arranged in an array along the circumferential side of the housing to detect the height difference at different positions of the adjustment platform 73. The adjustment platform 73 is connected to a spherical air float 72; under negative pressure, the spherical air float 72 can lock the adjustment platform 73; under positive pressure, it provides low-friction rotation. The heating module 31 is used to heat the chip and connect to the suction nozzle module 3, which has a vacuum connector 32 for adsorbing the chip. The leveling module 7 can achieve active leveling, ensuring parallel contact between the chip and the substrate, and improving bonding uniformity.

[0059] It should be noted that, in the specific embodiment, after the hot press head 10 is pressed down onto the platform, the height sensor 75 measures the height information of the adjustment table 73, the hot press head 10 rises, and the leveling motor 71 levels the adjustment table 73 according to the height information.

[0060] Please see Figure 3 and Figure 6 The leveling housing 74 is equipped with a leveling grating reader 76 at the position corresponding to the leveling motor 71.

[0061] Understandably, in the hot-press bonding head 10 provided in this embodiment of the invention, the leveling housing 74 is equipped with a leveling grating read head 76 corresponding to the position of each leveling motor 71. The grating read head can accurately measure the movement position of each leveling motor 71. Based on the data from the height sensor 75, the leveling motor 71 is adjusted in a closed loop through feedback from the grating read head. This can precisely control the tilt angle of the adjustment stage 73, improve leveling accuracy, ensure uniform contact between the chip and the substrate, and achieve good bonding quality.

[0062] Please see Figure 2 , Figure 3 , Figure 5 and Figure 6 The driving end of the leveling motor 71 is provided with a connecting block 711, which is connected to the leveling module 7 via a first elastic member 77. The connecting block 711 is provided with an adjustment groove 7114 at the position corresponding to the adjustment table 73, and a top head 7111 is provided in the adjustment groove 7114. The top head 7111 includes a second elastic member 7112 and a supporting member 7113. One end of the supporting member 7113 abuts against the adjustment table 73, and the other end abuts against the second elastic member 7112. The end of the second elastic member 7112 away from the supporting member 7113 abuts against the inner wall of the adjustment groove 7114.

[0063] Understandably, in the hot-press head 10 provided in this embodiment of the invention, the first elastic element 77 connects the leveling motor 71 and the leveling module 7, and is used to buffer the impact during motor start-up, shutdown, and movement. The second elastic element 7112 and the abutment 7113 in the adjustment groove 7114 constitute a floating head 7111, so that the abutment 7113 can adaptively fit according to the angular deviation of the surface of the adjustment table 73, avoiding deformation or jamming of the adjustment table 73 due to hard pushing, thereby ensuring that the leveling force is transmitted evenly and improving the stability of the leveling process.

[0064] Specifically, a quick-release head is provided at the point where the top of the adjustment groove 7114 contacts the second elastic element 7112, for quick replacement of the second elastic element 7112, saving maintenance time.

[0065] Specifically, the leveling housing 74 is provided with a limiting block 1311 located above the top head 7111. The limiting block 1311 cooperates with the connecting block 711 to limit the stroke of the connecting block 711.

[0066] Please see Figure 7 and Figure 8 The second embodiment of the present invention provides an air flotation module 20, including a floating component 8, a first end cap 94 and a second end cap 95, which are respectively disposed at two ends of the floating component 8; the first end cap 94 is provided with a first air nozzle 96, and the second end cap 95 is provided with a second air nozzle 97, which are connected to each other; the floating component 8 includes a spline shaft 81, a spline sleeve 82 and an outer sleeve 83; the spline sleeve 82 is sleeved on the spline shaft 81; the first end cap 94 and the second end cap 95 are respectively fixedly connected to the spline sleeve 82; a first air flotation gap 9 is formed between the spline sleeve 82 and the spline shaft 81; the outer sleeve 83 is sleeved on the spline sleeve 82; the outer sleeve 83 and the spline sleeve 82 form a second air flotation gap 91; the first air flotation gap 9 and the second air flotation gap 91 are connected to the first air nozzle 96 and the second air nozzle 97.

[0067] Understandably, the air flotation module 20, with its separate structure of floating component 8, first end cap 94, and second end cap 95, facilitates assembly and disassembly. The first air flotation gap 9 between spline sleeve 82 and spline shaft 81, and the second air flotation gap 91 between outer sleeve 83 and spline sleeve 82, are both connected to the first air nozzle 96 and the second air nozzle 97, enabling dual air flotation support. This provides stable axial air film support for spline shaft 81 and spline sleeve 82, reducing contact friction, improving motion smoothness, and achieving high-speed, ultra-high-precision transmission. The separate end caps and air nozzles at both ends contribute to uniform air distribution and symmetrical air flotation pressure, thereby improving the guiding accuracy and load-bearing capacity of the air flotation module 20.

[0068] Specifically, the outer surface of the outer jacket 83 is fitted with an air flotation shell 98 to protect the floating component 8.

[0069] Please see Figure 5 and Figure 6 The first end cap 94 and the second end cap 95 are respectively provided with through holes corresponding to the position of the spline shaft 81; the spline shaft 81 passes through the through hole of the second end cap 95 and is exposed outside the second end cap 95; the first end cap 94 and the second end cap 95 and the outer sleeve 83 form a third air float gap 92, and air guide pads are respectively provided in the first air float gap 9, the second air float gap 91 and the third air float gap 92, and the third air float gap 92 is connected to the first air nozzle 96 and the second air nozzle 97.

[0070] Understandably, in the air-float module 20 provided in this embodiment of the invention, the first end cap 94 and the second end cap 95 are provided with through holes corresponding to the position of the spline shaft 81, so that the spline shaft 81 can pass through the second end cap 95 and be exposed, facilitating connection with external loads. This structure ensures the effectiveness of internal air-float, realizes shaft end extension, meets application scenarios that require output shaft force, and at the same time, the air guide pad can reduce airflow noise and reduce energy consumption. A third air-float gap 92 is added between the first end cap 94, the second end cap 95 and the outer sleeve 83, and air guide pads are set in the first air-float gap 91, the second air-float gap 92 and the third air-float gap 92. The air guide pads are loose and porous, allowing gas to pass through and form an air film, making the gas distribution more uniform, avoiding local pressure fluctuations, and also providing rigid support to improve the stability of the air film. This allows the module to also obtain air-float support in the end direction. In this way, all mating surfaces between the spline shaft 81, the spline sleeve 82 and the outer sleeve 83 are isolated by the air film, realizing a multi-directional full floating effect. After the third air bearing gap 92 is connected to the air nozzle, it compensates for axial force deformation, improves the straightness and accuracy of the overall motion, and is suitable for high-precision micro-motion applications.

[0071] Please see Figure 5 and Figure 6 One side of the air guide pad in the first air float gap 91 is fixed to the spline shaft 81, and there is a gap between the other side and the spline sleeve 82; one side of the air guide pad in the second air float gap 91 is fixed to the outer sleeve 83, and there is a gap between the other side and the spline sleeve 82; one side of the air guide pad in the third air float gap 92 is fixed to the first end cap 94 and / or the second end cap 95, and there is a gap between the other side and the outer sleeve 83.

[0072] Understandably, by leaving gaps between relatively moving parts and fixing air guides, compressed gas can be evenly distributed to form a stable air film, thereby reducing friction and temperature rise during transmission and improving motion accuracy and reliability.

[0073] It should be noted that the cross-sections of the first air flotation gap 9, the second air flotation gap 91, and the third air flotation gap 92 are all annular.

[0074] In a specific embodiment, the air-conducting pad is a graphite pad, which is loose and porous and allows gas to pass through.

[0075] Please see Figure 7 and Figure 8 The first end cap 94 and the second end cap 95 are each provided with no less than two air nozzle mounting slots; the air nozzle mounting slots cooperate with the first air nozzle 96, the second air nozzle 97 or the plug 84.

[0076] Understandably, the first end cap 94 and the second end cap 95 are each provided with no fewer than two nozzle mounting slots, allowing for flexible installation of nozzles or plugs 84 as needed. If multi-point air supply is required, multiple nozzles can be installed to increase airflow and response speed; if only single-point air supply is needed, plugs 84 can be used to seal excess slots, simplifying air path connections. This design enhances the module's adaptability to different air supply systems, facilitates on-site piping, and makes nozzle replacement easier during subsequent maintenance, reducing operating costs while maintaining a clean appearance of the end caps.

[0077] Please see Figure 7 and Figure 8 The end face of the first end cap 94 away from the floating component 8 is provided with at least one transmission connection hole.

[0078] Understandably, the end face of the first end cap 94 furthest from the floating component 8 is provided with at least one transmission connection hole, which can be mechanically connected to an external drive mechanism to facilitate the transmission of rotational power, allowing the air flotation module 20 to act as a driven guide. The connection hole ensures connection strength and improves the module's versatility and ease of assembly.

[0079] Please see Figure 7 and Figure 8 The spline sleeve 82 has an air passage 93 inside that connects to the air nozzle mounting slot.

[0080] Understandably, the spline sleeve 82 has an internal air passage 93 connected to the air nozzle mounting slot, allowing gas to flow directly from the end cap air nozzle through the internal channel of the spline sleeve 82 to each air float gap. The internal air passage 93 has a short path and low pressure loss, enabling rapid establishment of an air film and improving response speed. Simultaneously, the air passage 93 is integrated into the spline sleeve 82, not affecting the movement space of the spline shaft 81, thus ensuring structural strength and sealing.

[0081] Please see Figure 7 and Figure 8 The airway 93 is cross-shaped.

[0082] Understandably, the air passage 93 inside the spline sleeve 82 is designed in a cross shape. The cross-shaped air passage 93 has a symmetrical structure and can simultaneously supply air to multiple locations in the first air flotation gap 9 and the second air flotation gap 91, ensuring uniform circumferential air film pressure. This shape is simple to process, and the flow channel cross-sectional area is sufficient to provide ample flow, making the start and stop of air flotation more stable and effectively reducing vibration and noise caused by uneven air supply.

[0083] Please see Figure 7 and Figure 8 The spline shaft 81 has a transmission groove 85 at one end near the first end cover 94.

[0084] Understandably, a transmission groove 85 is provided at the end of the splined shaft 81 near the first end cover 94, which can cooperate with an external rotary drive component to achieve torque transmission. This transmission groove 85 has a simple structure, is easy to manufacture, and does not affect the air-bearing fit accuracy of the splined shaft 81 surface. The transmission groove 85 can be in the form of a keyway, a flat groove, or a threaded hole to adapt to different transmission methods. Its placement at this end facilitates docking with the drive source on the first end cover 94 side, enabling the active rotation function of the air-bearing module 20, expanding the module's application range, and allowing it to both guide and be driven to rotate.

[0085] Please see Figure 7 and Figure 8 After the high-pressure gas enters the first end cap 94 and the second end cap 95 from the first air nozzle 96 and the second air nozzle 97, it is divided into two paths. One path leads to the third air float gap 92. The gas passes through the air guide pad to generate an air film between the end face of the first end cap 94 and the end face of the outer sleeve 83. An air film is also generated between the end face of the second end cap 95 and the end face of the outer sleeve 83, so that there is no friction between the first end cap 94 and the second end cap 95 and the outer sleeve 83 when they rotate. Another path leads to the second air-bearing gap 91, which is connected to the first air-bearing gap 9 through the air passage 93 of the spline sleeve 82. Part of the gas passes through the air guide pad and generates an air film between the spline sleeve 82 and the outer sleeve 83, so that there is no friction between the spline sleeve 82 and the outer sleeve 83 when the spline sleeve 82 rotates; the other part enters the first air-bearing gap 9 through the air passage 93 and passes through the air guide pad to generate an air film between the spline shaft 81 and the spline sleeve 82, so that there is no friction between the spline shaft 81 and the spline sleeve 82 when the spline shaft 81 moves. The spline shaft 81 can move vertically via an external Z-axis drive module 2. The first end cover 94 can be connected to an external θ-axis drive module 5 for rotational movement. Since the spline sleeve 82 is fixedly connected to the first end cover 94, the spline sleeve 82 rotates accordingly. Under the action of the air film, the spline shaft 81 also rotates. This achieves frictionless linear and rotational movement of the spline shaft 81.

[0086] Please see Figure 9 The third embodiment of the present invention provides a chip bonding device 30, including a body and a hot-press bonding head 10. The chip bonding device 30 also includes a control system 40, an XY axis module 60 and a vision module 50; the vision module 50, the XY axis module 60, the hot-press bonding head 10 and the control system 40 are electrically connected.

[0087] As can be understood, the hot-press bonding head 10 provided in this embodiment of the invention includes a chip bonding device 30 comprising a hot-press bonding head 10, an XY-axis module 60, a control system 40, and a vision module 50. The vision module 50 is used to identify the type and position of the chip, improving alignment accuracy, and works with the XY-axis module 60 for alignment in the X and Y directions. The control system 40 is electrically connected to the hot-press bonding head 10, coordinating the actions of each drive module. The hot-press bonding head 10 has multi-axis motion capabilities including Z-axis, W-axis, and θ-axis, as well as force control, leveling, and heating functions. The chip bonding device 30 is suitable for the hot-press bonding process of semiconductor chips, enabling automated operation, reducing manual intervention, and improving production efficiency and bonding consistency.

[0088] In a specific embodiment, four leveling motors 71 are arranged in an array. Four connecting blocks 711 and four top heads 7111 are provided for each of the four leveling motors 71. Based on the measured values ​​of the height sensor 75, the control system 40 calculates the displacement of the leveling motors 71. Based on this displacement, the leveling motors 71 push the connecting blocks 711 to drive the top heads 7111 to adjust the parallelism of the adjustment table 73, so that the suction nozzle is parallel to the platform.

[0089] In a specific embodiment, when the θ-axis motor 51 rotates, it drives the circular grating 61 to rotate. Due to the small gap in the air-bearing transmission of the air-bearing spline, the circular grating 61 does not necessarily perform pure circular motion. The circular reading head 611 reads data. If the data read by the two circular reading heads 611 are the same and in opposite directions, then the circular grating 61 is performing pure circular motion and no compensation is needed. If there is a difference in the data read by the two circular reading heads 611, the control system 40 calculates the displacement of the circular grating 61 in the X and Y directions in addition to the circular motion and controls the XY axis module 60 to perform compensation.

[0090] It should be noted that the hot-press bonding head 10 will undergo thermal deformation during the hot-press bonding process. In order to ensure the accuracy of chip bonding in the Z direction, the control system 40 drives the Z-axis to compensate for the amount of thermal deformation of the bonding head device of the present invention according to the temperature change.

[0091] The fourth embodiment of the present invention provides a chip bonding method, which identifies the chip through a vision module 50, selects different driving modules for force control and performs thermal compensation in the Z-axis direction according to different bonding force requirements, and includes the following steps: When bonding is using the Z-axis drive module 2, the W-axis motor 41 is not powered on. The Z-axis drive module 2 pushes the W-axis force control sensor 42 and the connector 12 through the first transmission component 11, which in turn pushes the second transmission component 13 to transmit downward pressure to the chip. When bonding is performed using the W-axis drive module 4, the W-axis drive module 4 directly pushes the connector 12 and the W-axis force control sensor 42, thereby pushing the second drive component to transmit downward pressure to the chip.

[0092] Understandably, in the hot-press bonding head 10 provided in this embodiment of the invention, the hot-press bonding method identifies the chip position through the vision module 50. The drive module is selected for force control based on the bonding force requirements. When using the Z-axis drive module 2, the W-axis motor 41 is not powered, and the Z-axis drive module 2 transmits downward pressure through the first transmission component 11, suitable for high-force bonding. Utilizing the characteristic that the W-axis motor 41 is not powered and its drive end can move freely, the downward pressure of the first transmission component 11 can be transmitted to the second drive component. When using the W-axis drive module 4, it directly pushes the connector 12 and the force control sensor, suitable for fine bonding with small forces. Switching between the two modes as needed achieves a wide range and high-precision force control output, effectively adapting to the bonding requirements of different chips and improving yield and equipment compatibility.

[0093] The above provides a detailed description of an air flotation module 20, a hot-press bonding head 10, and a chip bonding device 30 disclosed in embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An air flotation module, characterized in that: The system includes a floating assembly, a first end cap, and a second end cap, which are respectively disposed at two ends of the floating assembly. The first end cap has a first air nozzle, and the second end cap has a second air nozzle, which are connected to each other. The floating assembly includes a spline shaft, a spline sleeve, and an outer sleeve. The spline sleeve is fitted onto the spline shaft. The first and second end caps are respectively fixedly connected to the spline sleeve. A first air-bearing gap is formed between the spline sleeve and the spline shaft. The outer sleeve is fitted onto the spline sleeve. A second air-bearing gap is formed between the outer sleeve and the spline sleeve. The first and second air-bearing gaps are connected to the first and second air nozzles, respectively.

2. The air flotation module as described in claim 1, characterized in that: The first end cap and the second end cap are respectively provided with through holes corresponding to the position of the spline shaft; the spline shaft passes through the through hole of the second end cap and is exposed outside the second end cap; the first end cap and the second end cap and the outer sleeve form a third air float gap, and air guide pads are respectively provided in the first air float gap, the second air float gap and the third air float gap, and the third air float gap is connected to the first air nozzle and the second air nozzle.

3. The air flotation module as described in claim 2, characterized in that: One side of the air guide pad in the first air float gap is fixed to the spline shaft, and there is a gap between the other side and the spline sleeve; one side of the air guide pad in the second air float gap is fixed to the outer sleeve, and there is a gap between the other side and the spline sleeve; one side of the air guide pad in the third air float gap is fixed to the first end cap and / or the second end cap, and there is a gap between the other side and the outer sleeve.

4. The air flotation module as described in claim 1, characterized in that: The first end cap and the second end cap are each provided with no less than two air nozzle mounting slots; the air nozzle mounting slots are engaged with the first air nozzle, the second air nozzle, or the plug.

5. The air flotation module as described in claim 1, characterized in that: The end face of the first end cap away from the floating component has at least one transmission connection hole.

6. The air flotation module as described in claim 4, characterized in that: The spline sleeve has an internal air passage that connects to the air nozzle mounting slot.

7. The air flotation module as described in claim 6, characterized in that: The airway is cross-shaped.

8. The air flotation module as described in claim 1, characterized in that: The splined shaft has a transmission groove at one end near the first end cover.

9. A hot-pressed fitting, characterized in that, The system includes an air flotation module, a body assembly, a Z-axis drive module, and a nozzle module as described in any one of claims 1-8. The body assembly is connected to the movable end of the Z-axis drive module. The body assembly includes a W-axis drive module, a first transmission assembly, a connector, and a second transmission assembly, all connected sequentially and coaxially. The connector is fixedly connected to the W-axis drive module, with its end face near the W-axis drive module connected to the first transmission assembly, and its other end face connected to the second transmission assembly. The nozzle module is located at the end of the body assembly furthest from the W-axis drive module. The W-axis drive module includes a W-axis motor. The movement direction of the Z-axis motor drive end is parallel to the movement direction of the movable end of the Z-axis drive module; a W-axis force control sensor is provided on the connector; a Z-axis force control sensor is provided on the movable end of the Z-axis drive module; when the Z-axis drive module is activated, it drives the first transmission component, pushes the W-axis force control sensor and the connector, and then pushes the second transmission component to move synchronously with the connector, so that the nozzle module moves synchronously downward; the Z-axis force control sensor is held against by the movable end of the Z-axis drive module; or the W-axis motor directly pushes the connector and the W-axis force control sensor, and then pushes the second transmission component to move synchronously with the connector, so that the nozzle module moves synchronously downward; the W-axis force control sensor holds against the second transmission component.

10. A chip bonding apparatus, characterized in that, The device includes a chip bonding apparatus body and an air flotation module as described in any one of claims 1-8, wherein the chip bonding apparatus further includes a linear drive mechanism and / or a rotary drive mechanism.

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