A low thermal resistance, high heat dissipation efficiency LED backlight heat dissipation module and its assembly process

Abstract

This invention belongs to the field of lighting device technology, specifically relating to a low thermal resistance, high heat dissipation efficiency LED backlight heat dissipation module and its assembly process. It includes a housing and LED chips fixed inside the housing. The housing includes a backplate for accommodating the LED chips, with wires connecting the LED chips to the backplate. The backplate is concave, and a diffuser plate and a light guide plate are sequentially bonded to its opening from the inside out. The connection seam between the backplate and the LED chips is filled with thermally conductive silicone grease, which transfers heat from the LED chips to the backplate, achieving heat dissipation. The invention also includes a thermally conductive pipe assembly and a gasket assembly in contact with each other, disposed inside the housing. This invention employs mechanical heat dissipation, utilizing the heat absorption during the phase change of the thermally conductive medium and transferring the heat to the outside for heat dissipation. It has the advantages of low thermal resistance and high heat dissipation efficiency, solving the problem of reduced energy efficiency.

Description

Technical Field

[0001] This invention belongs to the field of lighting device technology, specifically relating to a low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module and its assembly process. Background Technology

[0002] Energy-saving lighting equipment refers to lighting products and technologies that are designed with high luminous efficiency, low energy consumption, and long lifespan in mind, and consume significantly less electricity than traditional incandescent lamps while providing the same lighting effect (luminous flux). These mainly include LED (Light Emitting Diode), fluorescent lamps, and sensor lamps.

[0003] LEDs can convert the vast majority of electrical energy into light energy, rather than heat, and their luminous efficiency far exceeds that of fluorescent lamps and traditional light bulbs, making them the mainstream choice for current and future lighting. However, LEDs cannot convert 100% of electrical energy into light; some energy is dissipated as heat, requiring heat dissipation measures.

[0004] In practical use, equipping LEDs with a water-cooling system that includes a cold plate, water pump, water pipes and a fan can greatly improve heat dissipation performance, but the significant increase in the system's own power consumption leads to a decrease in its energy-saving level. Summary of the Invention

[0005] The purpose of this invention is to provide an LED backlight heat dissipation module and assembly process with low thermal resistance and high heat dissipation efficiency. It can perform mechanical heat dissipation by using a thermally conductive medium to absorb heat during the phase change process and transfer the heat to the outside for heat dissipation. It has the advantages of low thermal resistance and high heat dissipation efficiency, thus solving the problem of lowering its energy-saving level.

[0006] The specific technical solution adopted by this invention is as follows: A low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module includes a housing and LED beads fixed inside the housing. The housing includes a back plate for accommodating the LED beads. The LED beads are connected to wires passing through the back plate. The back plate is concave, and a diffuser plate and a light guide plate are sequentially bonded to its opening from the inside to the outside. The connection seam between the backplate and the LED beads is filled with thermally conductive silicone grease, which is used to transfer the heat of the LED beads to the backplate, thereby achieving heat dissipation of the LED beads.

[0007] A low thermal resistance, high heat dissipation efficiency LED backlight heat dissipation module, applied to the aforementioned low thermal resistance, high heat dissipation efficiency LED backlight, comprising: The heat-conducting pipe assembly and the gasket assembly that are in contact with each other are disposed inside the housing; The heat-conducting pipe assembly includes a first pipe, a second pipe, a third pipe and a fourth pipe bonded to the inner wall of the housing. The second pipe and the third pipe are connected to the first pipe in a grid pattern. A fifth pipe extending out of the housing is connected to the first pipe. The heat-conducting pipe assembly is filled with immiscible heat-conducting media A and B. The heat from the LED beads is transferred to the second pipe along the liner assembly, causing the heat-conducting media A to change from a liquid state to a gaseous state and flow to the outside of the shell along the fifth pipe, so that the heat is dissipated to the external environment.

[0008] As an optional solution, a deformable heat transfer assembly is provided on the outside of the shell, the deformable heat transfer assembly including a deformable bladder and a first heat-conducting mesh that are in contact with each other; The deformable bladder is disposed through the middle of the fifth pipe, and a second heat-conducting mesh extending outward toward the shell is welded to the middle of the first heat-conducting mesh. A traction strap is bonded between the edge of the first heat-conducting mesh and the outer side of the shell. The deformable bladder expands under the action of the gaseous heat-conducting medium A, which in turn causes the first heat-conducting mesh to unfold, thereby increasing the heat exchange area between the deformable bladder and the first heat-conducting mesh and improving the heat exchange efficiency.

[0009] As an alternative, the gasket assembly includes a heat-collecting ring and a heat-conducting bridge fixed together in a straight line; The heat collection ring is annularly fitted around the outside of the LED bead and closely attached to the thermal grease, so that the heat of the LED bead can be transferred to the thermal pipeline assembly along the thermal grease, the heat collection ring and the thermal bridge.

[0010] As an optional solution, both the second and third pipes are located at the gaps between the LED beads to prevent blocking the light emitted by the LED beads, and the inner wall of the back plate is coated with a heat-reflective coating. The heat-reflective coating is used to reflect the heat radiation of the LED beads, so that the heat in the back plate is concentrated in the second and third pipes.

[0011] As an alternative, the thermally conductive medium A is a fluorinated liquid, and the thermally conductive medium B is a hydrocarbon. The density of the thermally conductive medium A is less than the density of the thermally conductive medium B.

[0012] As an alternative, the first heat-conducting mesh is arc-shaped and wraps around the outer arc surface of the deformable bladder, and the second heat-conducting mesh extends along the central axis of the first heat-conducting mesh.

[0013] As an alternative, the first heat-conducting mesh is internally fixed with a support frame for restoring its deformation, and the width of the support frame is not greater than the aperture size of the mesh of the first heat-conducting mesh.

[0014] As an alternative, the heat-conducting bridge is welded with arc-shaped fins that wrap around the outer arc surface of the second pipe. The arc-shaped fins are used to increase the heat exchange area between the heat-conducting bridge and the second pipe.

[0015] An assembly process for a low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module, used to assemble the low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module as described above, includes the following steps: Pre-processing: The workers cut and process the base material into a back plate, a first pipe, a second pipe, a third pipe, a fourth pipe and a fifth pipe, and weld the second and third pipes to the first pipe in a grid pattern. The two fourth pipes are laser welded to both ends of the first pipe to form an open grid pipeline. Mounting: The staff operates the spraying equipment to apply thermal grease to the inner wall of the back panel, and then puts the back panel and LED chips into the SMT automated equipment for mounting. The back panel and LED chips are then soldered together by the soldering equipment. Wiring: Workers use soldering equipment to solder the positive and negative terminals on the backplate. The positive and negative terminals are used to power the LED beads. Piping installation: The workers will attach the open mesh pipes to the inner wall of the shell with thermally conductive adhesive, and then connect the fifth pipe to the two fourth pipes through a sealing joint to complete the installation of the sealed mesh pipes, and add the deformable heat transfer components. Packaging: Operators use robotic arms to sequentially bond the diffuser plate and light guide plate at the opening of the back panel from the inside out, thus obtaining an LED backlight with a heat dissipation module.

[0016] The technical effects achieved by this invention are as follows: This invention provides an energy-saving LED backlight that achieves mechanical heat dissipation of the LED backlight without the need for additional electrical equipment, thus avoiding increased power consumption and solving the problem of lowering its energy-saving level.

[0017] This invention provides an energy-saving LED backlight and its heat dissipation module, capable of mechanical heat dissipation. During heat dissipation, two heat-conducting media circulate through a sealed mesh pipe. One of the heat-conducting media absorbs heat during a phase change and transfers the heat to the outside in a gaseous state, thus dissipating heat. This method has the advantages of low thermal resistance and high heat dissipation efficiency, avoiding increased power consumption of the LED backlight and solving the problem of lowering its energy-saving level.

[0018] This invention provides an energy-saving LED backlight and its heat dissipation module, which is capable of mechanical heat dissipation. During heat dissipation, the sealed mesh pipeline expands outside the LED backlight to increase the heat transfer area and improve heat dissipation efficiency. Attached Figure Description

[0019] Figure 1This is a schematic diagram of the first structure of an LED backlight with low thermal resistance and high heat dissipation efficiency according to Embodiment 1 of the present invention. Figure 2 This is a schematic diagram of the second structure of an LED backlight with low thermal resistance and high heat dissipation efficiency according to Embodiment 1 of the present invention. Figure 3 This is the invention Figure 1 A schematic diagram of the structure of a finished LED backlight assembly with low thermal resistance and high heat dissipation efficiency. Figure 4 This is a schematic diagram of the first structure of the LED backlight assembly product in Embodiment 2 of the present invention; Figure 5 This is the invention Figure 4 A schematic diagram of the LED backlight in the on state; Figure 6 This is the present invention. Figure 5 Schematic diagram of the structure of the central heat conduction pipe assembly; Figure 7 This is the invention Figure 6 A partial structural schematic diagram of the central heat conduction pipe assembly; Figure 8 This is the invention Figure 7 Schematic diagram of the middle liner assembly; Figure 9 This is the invention Figure 6 Schematic diagram of the structure of the first and second heat-conducting meshes; Figure 10 This is a schematic diagram of the second structure of the LED backlight assembly product in Embodiment 2 of the present invention; Figure 11 This is the invention Figure 10 A schematic diagram of the LED backlight in the on state; Figure 12 This is the invention Figure 11 Schematic diagram of the structure of the central heat conduction pipe assembly; Figure 13 This is the invention Figure 12 A partial structural schematic diagram of the central heat conduction pipe assembly; Figure 14 This is the invention Figure 13 Schematic diagram of the middle liner assembly; Figure 15 This is the invention Figure 12 Schematic diagram of the structure of the first and second heat-conducting meshes; Figure 16 This is a diagram from Embodiment 3 of the present invention.

[0020] The attached diagram lists the components represented by each number as follows: 1. Housing; 101. Backplate; 102. Diffuser plate; 103. Light guide plate; 2. LED beads; 201. Wires; 3. Heat-conducting piping assembly; 301, First pipe; 302, Second pipe; 303, Third pipe; 304, Fourth pipe; 305, Fifth pipe; 4. Deformable heat transfer assembly; 401. Deformable bladder; 402. First heat conduction mesh; 403. Second heat conduction mesh; 404. Support frame; 405. Traction belt; 5. Gasket assembly; 501. Heat collection ring; 502. Thermal bridge; 503. Arc-shaped fins. Detailed Implementation

[0021] To make the objectives and advantages of this invention clearer, the invention will be specifically described below with reference to embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of the invention and does not strictly limit the scope of protection specifically claimed by the invention.

[0022] Example 1: like Figures 1-3 As shown, a low thermal resistance and high heat dissipation efficiency LED backlight includes a housing 1. The housing 1 includes a back plate 101 formed into a concave shape by stamping an aluminum plate. During production, the operator uses a spraying device to coat the inner wall of the back plate 101 with thermally conductive silicone grease. Then, the back plate 101 and LED beads 2 are placed into an SMT (Surface Mount Technology) placement machine for mounting. The back plate 101 and LED beads 2 are welded together by a welding device. The thermally conductive silicone grease is used to transfer the heat of the LED beads 2 to the back plate 101, thereby achieving heat dissipation of the LED beads 2. Then, the staff operates the welding equipment to weld two wires 201 on the back plate 101, which are divided into positive and negative terminals, for powering the LED beads 2. Next, the staff operates the adhesive equipment to glue the diffuser plate 102 and the light guide plate 103 in the opening of the back plate 101 in the order from the inside to the outside. Waterproof sealant can be used at the bonding point. After the bonding is firm, the LED backlight is obtained.

[0023] Specifically, LED backlights can be customized according to user needs, such as being designed as headphone backlights, instrument backlights, or logo backlights depending on their application.

[0024] When in use, the LED bead 2 is powered on and emits a light beam. The light beam is refracted by the diffuser plate 102 and reaches the light guide plate 103. The light guide plate 103 performs optical processing to achieve uniform light output.

[0025] Existing LED backlights generally use water cooling. For example, a heat dissipation core cold head is added to the back of the backplate 101. Water is pumped by a water pump and matching pipelines to circulate water inside the heat dissipation core cold head, so as to remove the heat of the backplate 101 and send it to the external radiator for heat dissipation. At the same time, a cooling fan is used for forced heat dissipation. However, as the number of LED backlights used increases, the number of water pumps and cooling fans and the power consumption will also increase exponentially, which will have an adverse impact on the energy efficiency of LED backlights.

[0026] Example 2: like Figures 4-15 As shown, a low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module adopts a mechanical heat dissipation method, eliminating the need for additional electrical equipment. The heat dissipation module includes a heat-conducting pipe assembly 3, a deformable heat transfer assembly 4, and a pad assembly 5 that are in contact with each other. The heat-conducting pipe assembly 3 and the pad assembly 5 are disposed inside the housing 1. The heat-conducting pipe assembly 3 is filled with immiscible thermally conductive media A and B. The heat from the LED beads 2 is transferred to the deformable heat transfer assembly 4 along the pad assembly 5 and the heat-conducting pipe assembly 3, causing the thermally conductive media A to change from a liquid state to a gas state and flow along the heat-conducting pipe assembly 3 to the outside of the housing 1, thereby dissipating heat to the external environment and significantly improving heat dissipation performance. This eliminates the need for additional electrical equipment and solves the problem of reduced energy efficiency during heat dissipation.

[0027] See attached document Figure 5 and Figure 11 The heat-conducting pipe assembly 3 includes a first pipe 301, a second pipe 302, a third pipe 303, and a fourth pipe 304 bonded to the inner wall of the housing 1 by thermally conductive adhesive. A fifth pipe 305 extending out of the housing 1 is connected to the first pipe 301. During operation, the first pipe 301, the second pipe 302, the third pipe 303, the fourth pipe 304, and the fifth pipe 305 form a closed grid pipe, through which immiscible thermally conductive media A and thermally conductive media B flow. The heat from the LED beads 2 is transferred along the pad assembly 5 to the second pipe 302, causing the thermally conductive media A to be heated and change from a liquid state to a gaseous state, and then flow along the fifth pipe 305 to the outside of the housing 1, so that the heat is dissipated to the external environment. Meanwhile, the heat-conducting medium B continues to absorb the heat from the LED beads 2, while the gaseous heat-conducting medium A undergoes a phase change after being cooled, transforming into a liquid state and returning to the second pipe 302. This achieves the function of internal and external heat exchange through the phase change of the heat-conducting medium, and has the advantages of low thermal resistance and high heat dissipation efficiency. During installation, workers use copper or aluminum pipes to process the first pipe 301, the second pipe 302, the third pipe 303, the fourth pipe 304, and the fifth pipe 305 by laser cutting (or CNC machining center cutting). Then, the second pipe 302 and the third pipe 303 are welded to the first pipe 301 in a grid pattern, and the two fourth pipes 304 are laser welded to both ends of the first pipe 301 to form an open grid pipeline. Meanwhile, the staff attached the open mesh pipe to the inner wall of the shell 1 with thermally conductive adhesive, and then connected the fifth pipe 305 between the two fourth pipes 304 through a sealing joint to complete the installation of the sealed mesh pipe.

[0028] For details, see Figure 5 , Figure 6 and Figure 7 For the headphone backlight, the first conduit 301 adopts a multi-bend structure to adapt to the multi-curved side plate of the back panel 101, leaving an installation gap and space for airflow.

[0029] For details, see Figure 11 , Figure 12 and Figure 13 For the instrument backlight, the first pipe 301 adopts a "U" shaped structure, which can surround all the LED beads 2 inside the back plate 101 and control the heat dissipation of the heat source within its enclosed range.

[0030] As an optional embodiment, the heat-conducting medium A is a fluorinated liquid (e.g., perfluorotriethylamine) or a hydrofluoroether reagent, and the heat-conducting medium B is a hydrocarbon (e.g., polyalphaolefin). Specifically, the heat-conducting pipe assembly 3 and the deformable heat transfer assembly 4 can be coated with a polytetrafluoroethylene corrosion-resistant coating to address the problem of corrosion and perforation of the heat-conducting medium. Among them, the working temperature of LED lamp bead 2 can reach 60℃~150℃, the working temperature of housing 1 can reach 80℃~85℃, while the boiling point of heat-conducting medium A reaches 68℃ and the boiling point of heat-conducting medium B reaches 198℃, so that heat-conducting medium A can undergo a phase change from liquid to gas after being heated, while heat-conducting medium B hardly undergoes a phase change, ensuring the continuity of internal and external heat exchange through phase change of heat-conducting medium. The density of thermally conductive medium A is less than that of thermally conductive medium B. When thermally conductive medium A is in the liquid phase, it can sink below thermally conductive medium B and absorb the heat of LED beads 2 through the pad assembly 5. When thermally conductive medium A is in the gas phase, it can flow to the deformable heat transfer assembly 4 outside the housing 1. Furthermore, thermally conductive medium B replaces thermally conductive medium A in absorbing the heat of LED beads 2 through the pad assembly 5, ensuring the continuity of the heat dissipation process. Then, the heat of thermally conductive medium B can be transferred to thermally conductive medium A under the action of the temperature gradient.

[0031] See attached document Figure 5and Figure 11 The second pipe 302 and the third pipe 303 are both located at the gaps of the LED beads 2 to prevent blocking the light emitted by the LED beads 2. At the same time, the inner wall of the back plate 101 is coated with a heat-reflective coating, such as rutile titanium dioxide, titanium dioxide, zinc oxide and other metal oxides. The heat-reflective coating is used to reflect the heat radiation of the LED beads 2, so that the heat in the back plate 101 is concentrated in the second pipe 302 and the third pipe 303, which can improve the efficiency of heat exchange between the inside and outside through the phase change of the heat-conducting medium.

[0032] See attached document Figure 5 and Figure 11 The shell 1 is provided with a deformable heat transfer component 4. The deformable heat transfer component 4 includes a deformable bladder 401 and a first heat-conducting mesh 402 that are in contact with each other. A second heat-conducting mesh 403 extending outward from the shell 1 is welded to the middle of the first heat-conducting mesh 402. A traction strap 405 is bonded between the edge of the first heat-conducting mesh 402 and the outer side of the shell 1. The deformable bladder 401 can be made of highly elastic and corrosion-resistant fluororubber. The first heat-conducting mesh 402 and the second heat-conducting mesh 403 can be made of copper or aluminum alloy. The traction strap 405 can be made of highly elastic rubber. After the sealed mesh pipeline is installed, the workers will place the deformable bladder 401 through the joint in the middle of the fifth pipe 305, and weld the first heat-conducting mesh 402 and the second heat-conducting mesh 403 together. The first heat-conducting mesh 402 will be used to wrap the outer arc surface of the deformable bladder 401. At the same time, the traction belt 405 will be bonded between the edge of the first heat-conducting mesh 402 and the outside of the shell 1. In terms of application, taking headphone backlight or instrument backlight as an example, the second heat conduction mesh 403 is connected to the external heat dissipation structure of the headphone backlight or instrument backlight, so as to realize the internal heat conduction of the LED backlight to the external heat dissipation structure. Alternatively, the second heat conduction mesh 403 can be directly exposed to the outside air to dissipate heat to the outside air. When the heat-conducting medium A undergoes a phase change, the deformable bladder 401 expands under the action of the gaseous heat-conducting medium A, which drives the first heat-conducting mesh 402 to unfold, thereby increasing the heat exchange area between the deformable bladder 401 and the first heat-conducting mesh 402, so as to improve the heat exchange efficiency of the heat dissipation module, and stretches the traction belt 405, so that the traction belt 405 accumulates elastic potential energy. When the heat-conducting medium A changes from a gaseous state to a liquid state, the deformable bladder 401 shrinks. Under the action of the elastic potential energy of the traction belt 405, it gradually approaches the fifth pipe 305 and returns to its initial position.

[0033] See attached document Figure 9 and Figure 15 The first heat-conducting mesh 402 is arc-shaped and wraps around the outer arc surface of the deformable bladder 401 to increase the contact area between the two. In addition, the second heat-conducting mesh 403 extends along the central axis of the first heat-conducting mesh 402 to prevent the two from being misaligned, so that the second heat-conducting mesh 403 conducts heat in the center.

[0034] See attached document Figure 9 and Figure 15 The first heat-conducting mesh 402 has a support frame 404 bonded (or welded) inside for restoring its deformation. For example, when the first heat-conducting mesh 402 is opened, it pulls the support frame 404 to deform in the forward direction, approaching a straight state. When the first heat-conducting mesh 402 is closed, the support frame 404, because it is made of shape memory alloy, can deform in the reverse direction and restore its bent state. As an optional embodiment, the width of the support frame 404 is not greater than the aperture size of the first heat-conducting mesh 402, so as to avoid obstructing the flow of air along the mesh.

[0035] See attached document Figure 5 and Figure 11 The gasket assembly 5 includes a heat collection ring 501 and a heat conduction bridge 502 welded together in a straight line (or integrally stamped). After the LED beads 2 are mounted, the workers use welding equipment to weld the heat collection ring 501 and the heat conduction bridge 502 to the inner wall of the back plate 101. The heat collection ring 501 is ring-shaped and fits tightly against the outside of the LED beads 2, so that the heat of the LED beads 2 can be transferred to the heat conduction pipeline assembly 3 along the heat conduction grease, the heat collection ring 501 and the heat conduction bridge 502.

[0036] See attached document Figure 8 and Figure 14 The heat-conducting bridge 502 is welded with arc-shaped fins 503 that wrap around the outer arc surface of the second pipe 302. The arc-shaped fins 503 are used to increase the heat exchange area between the heat-conducting bridge 502 and the second pipe 302, thereby improving the efficiency of heat exchange between the heat-conducting bridge 502 and the second pipe 302.

[0037] Example 3: like Figure 16 As shown, an assembly process for a low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module, used to assemble the low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module as provided in Example 2, includes the following steps: Pre-processing: The workers cut and process the base material into a back plate 101, a first pipe 301, a second pipe 302, a third pipe 303, a fourth pipe 304 and a fifth pipe 305. The second pipe 302 and the third pipe 303 are welded to the first pipe 301 in a grid pattern. The two fourth pipes 304 are laser welded to both ends of the first pipe 301 to form an open grid pipeline. Mounting: The staff operates the spraying equipment to apply thermal grease to the inner wall of the backplate 101, and then puts the backplate 101 and LED beads 2 into the SMT automated equipment for mounting. The backplate 101 and LED beads 2 are then welded together by the welding equipment. Wiring: The staff uses welding equipment to weld two wires 201 on the back plate 101, which are divided into positive and negative terminals, for powering the LED beads 2; Pipeline installation: The workers will attach the open mesh pipes to the inner wall of the shell 1 with thermally conductive adhesive, and then connect the fifth pipe 305 to the two fourth pipes 304 through a sealing joint to complete the installation of the sealed mesh pipes. Meanwhile, the staff added the deformable heat transfer component 4. For example, the deformable bladder 401 was installed in the middle of the fifth pipe 305 through the joint, and the first heat conduction net 402 and the second heat conduction net 403 were welded together. The first heat conduction net 402 was used to wrap the outer arc surface of the deformable bladder 401. At the same time, the traction belt 405 was glued between the edge of the first heat conduction net 402 and the outside of the shell 1. Encapsulation: The operator uses a robotic arm to bond the diffuser plate 102 and the light guide plate 103 sequentially from the inside out at the opening of the back plate 101. Waterproof sealant can be used at the bonding points to obtain an LED backlight with a heat dissipation module.

[0038] The above description is merely an optional embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described or explained in this invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module, comprising a housing (1) and LED beads (2) fixed inside the housing (1), wherein the housing (1) includes a back plate (101) for accommodating the LED beads (2), the LED beads (2) are connected to a wire (201) passing through the back plate (101), the back plate (101) is concave, and a diffuser plate (102) and a light guide plate (103) are sequentially bonded at its opening from the inside to the outside, characterized in that, Also includes: The heat-conducting pipe assembly (3) and the gasket assembly (5) that are in contact with each other are disposed inside the housing (1); The heat-conducting pipe assembly (3) includes a first pipe (301), a second pipe (302), a third pipe (303) and a fourth pipe (304) bonded to the inner wall of the shell (1). The second pipe (302) and the third pipe (303) are connected to the first pipe (301) in a grid pattern. A fifth pipe (305) extending out of the shell (1) is connected to the first pipe (301). The heat-conducting pipe assembly (3) is filled with immiscible heat-conducting media A and heat-conducting media B. The heat of the LED beads (2) is transferred to the second pipe (302) along the pad assembly (5), so that the heat-conducting media A is heated and changes from liquid to gas, and flows to the outside of the shell (1) along the fifth pipe (305), so that the heat is dissipated to the external environment.

2. The low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module according to claim 1, characterized in that: The connection seam between the back plate (101), the pad assembly (5) and the LED bead (2) is filled with thermal grease. The thermal grease is used to transfer the heat of the LED bead (2) to the back plate (101) and the pad assembly (5) to achieve heat dissipation of the LED bead (2).

3. The low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module according to claim 1, characterized in that: The shell (1) is provided with a deformable heat transfer component (4), which includes a deformable bladder (401) and a first heat-conducting mesh (402) that are in contact with each other. The deformable bladder (401) is disposed in the middle of the fifth pipe (305), and a second heat-conducting mesh (403) extending outward from the shell (1) is welded in the middle of the first heat-conducting mesh (402). A traction belt (405) is bonded between the edge of the first heat-conducting mesh (402) and the outer side of the shell (1). The deformable bladder (401) expands under the action of the gaseous heat-conducting medium A, which drives the first heat-conducting mesh (402) to unfold, thereby increasing the heat exchange area between the deformable bladder (401) and the first heat-conducting mesh (402) and improving the heat exchange efficiency.

4. The low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module according to claim 1, characterized in that: The gasket assembly (5) includes a heat collection ring (501) and a heat-conducting bridge (502) fixed together in a straight line. The heat collection ring (501) is ring-shaped and sleeved on the outside of the LED bead (2) and closely attached to the thermal grease, so that the heat of the LED bead (2) can be transferred to the thermal pipeline assembly (3) along the thermal grease, the heat collection ring (501) and the thermal bridge (502).

5. The low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module according to claim 1, characterized in that: The second pipe (302) and the third pipe (303) are both located at the gaps of the LED beads (2) to prevent blocking the light emitted by the LED beads (2). The inner wall of the back plate (101) is coated with a heat-reflective coating. The heat-reflective coating is used to reflect the heat radiation of the LED beads (2), so that the heat in the back plate (101) is concentrated in the second pipe (302) and the third pipe (303).

6. The low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module according to claim 1, characterized in that: The thermally conductive medium A is a fluorinated liquid, and the thermally conductive medium B is a hydrocarbon. The density of the thermally conductive medium A is less than the density of the thermally conductive medium B.

7. The low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module according to claim 3, characterized in that: The first heat-conducting mesh (402) is arc-shaped and wraps around the outer arc surface of the deformable bladder (401), and the second heat-conducting mesh (403) extends along the central axis of the first heat-conducting mesh (402).

8. The low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module according to claim 3, characterized in that: The first heat-conducting mesh (402) has a support frame (404) fixed inside for restoring its deformation. The width of the support frame (404) is not greater than the aperture size of the mesh of the first heat-conducting mesh (402).

9. The low thermal resistance and high heat dissipation efficiency LED backlight heat dissipation module according to claim 4, characterized in that: The heat-conducting bridge (502) is welded with arc-shaped fins (503) that wrap around the outer arc surface of the second pipe (302). The arc-shaped fins (503) are used to increase the heat exchange area between the heat-conducting bridge (502) and the second pipe (302).

10. An assembly process for a low thermal resistance, high heat dissipation efficiency LED backlight heat dissipation module, used to assemble the low thermal resistance, high heat dissipation efficiency LED backlight heat dissipation module as described in any one of claims 1-9, characterized in that, Includes the following steps: Pre-processing: The staff cuts and processes the substrate into a back plate (101), a first pipe (301), a second pipe (302), a third pipe (303), a fourth pipe (304), and a fifth pipe (305). The second pipe (302) and the third pipe (303) are welded to the first pipe (301) in a grid pattern. The two fourth pipes (304) are laser welded to both ends of the first pipe (301) to form an open grid pipeline. Mounting: The staff operates the spraying equipment to apply thermal grease to the inner wall of the backplate (101), and then puts the backplate (101) and LED beads (2) into the SMT automated equipment for mounting. The backplate (101) and LED beads (2) are welded together by the welding equipment. Wiring: The staff operates the welding equipment to weld the positive and negative electrodes on the back plate (101). The positive and negative electrodes are used to power the LED beads (2). Pipeline installation: The staff will attach the open mesh pipe to the inner wall of the shell (1) with thermal adhesive, and then connect the fifth pipe (305) between the two fourth pipes (304) through the sealing joint to complete the installation of the closed mesh pipe and add the deformable heat transfer component (4). Packaging: The staff operates a robotic arm to sequentially attach the diffuser plate (102) and the light guide plate (103) at the opening of the back plate (101) from the inside out, to obtain an LED backlight with a heat dissipation module.

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