A heat pump and semiconductor coupled dehumidification system and defrosting method

Abstract

This invention relates to the field of dehumidification equipment technology, providing a heat pump and semiconductor coupled dehumidification system and a defrosting method. The system includes a housing, a heat pump assembly, a semiconductor heat exchanger, a dehumidification duct, a defrosting duct, and a drain pipe. The housing has a total inlet and a total outlet. The heat pump assembly includes an evaporator and a condenser. The semiconductor heat exchanger has a first cold end for cooling air and a first hot end for generating heat. The dehumidification duct connects the total inlet and the total outlet. The evaporator, the first cold end, and the condenser are arranged sequentially on the dehumidification duct. The inlet end of the defrosting duct is connected to the first hot end. The defrosting duct has a dehumidification mode and a defrosting mode. In dehumidification mode, the outlet end of the defrosting duct faces outwards from the housing; in defrosting mode, the outlet end of the defrosting duct faces the evaporator. The drain pipe guides a portion of the airflow from the first cold end to the first hot end. This heat pump and semiconductor coupled dehumidification system enables continuous and stable dehumidification and efficient cascade utilization of waste heat.

Description

Technical Field

[0001] This invention relates to the field of dehumidification equipment technology, and more particularly to a heat pump coupled with a semiconductor dehumidification system and a defrosting method. Background Technology

[0002] In agriculture, warehousing, and other applications where strict humidity control is required, heat pump dehumidifiers are widely used due to their high efficiency and energy saving. However, under low temperature and high humidity conditions, the evaporator surface is prone to frost formation. When defrosting using methods such as reverse circulation, electric heating, or hot gas bypass, the dehumidification operation must be interrupted, causing fluctuations in ambient humidity, affecting the application effect, and the defrosting energy consumption is relatively high.

[0003] To alleviate the aforementioned problems, semiconductor dehumidification equipment has been introduced into related technologies to assist heat pumps in dehumidification, thus preventing the heat pump from being shut down during defrosting and affecting dehumidification. However, semiconductor dehumidification equipment and heat pump dehumidifiers are independent devices with low system integration, resulting in limited improvement in overall dehumidification capacity. Moreover, the waste heat generated at the hot end of the semiconductor dehumidification equipment during operation is usually directly discharged, leading to energy waste. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in related technologies. To this end, this invention proposes a heat pump and semiconductor coupled dehumidification system to solve the defects in the prior art, such as the need for interruption of dehumidification during defrosting of heat pump dehumidifiers leading to fluctuations in ambient humidity, and the ineffective recovery and utilization of waste heat from semiconductor dehumidification equipment, thereby achieving continuous and stable dehumidification and efficient cascade utilization of waste heat.

[0005] The present invention also proposes a defrosting method.

[0006] The heat pump and semiconductor coupled dehumidification system according to an embodiment of the present invention includes: The casing has a main inlet and a main outlet; Heat pump components, including evaporators and condensers; A semiconductor heat exchanger having a first cold end for cooling air and a first hot end for generating heat; A dehumidification duct connects the main inlet and the main outlet, and the evaporator, the first cold end, and the condenser are arranged sequentially on the dehumidification duct. The defrosting duct has an inlet end connected to the first hot end. The defrosting duct has a dehumidification mode and a defrosting mode. In the dehumidification mode, the outlet end of the defrosting duct faces outward from the housing. In the defrosting mode, the outlet end of the defrosting duct is positioned towards the evaporator to defrost the evaporator. A drainage pipe is provided in the defrosting air duct, with its inlet end connected to the first cold end and its outlet end connected to the first hot end. The drainage pipe is used to guide part of the airflow from the first cold end to the first hot end.

[0007] In some embodiments, the heat pump coupled with semiconductor dehumidification system includes: An electrically controlled three-way valve is provided on the defrosting air duct. The electrically controlled three-way valve includes a first port, a second port and a third port. The first port is connected to the first hot end, the second port faces the evaporator, the housing is provided with a secondary outlet, and the third port is connected to the secondary outlet.

[0008] In some embodiments, the heat pump coupled with semiconductor dehumidification system includes a detection component disposed on the heat pump assembly, the detection component comprising: A temperature sensor is used to detect the surface temperature of the evaporator or the inlet and outlet air temperatures. And / or, a pressure sensor for detecting the air pressure difference between the inlet and outlet sides of the evaporator; And / or, a humidity sensor for detecting the air humidity at the total inlet and the total outlet.

[0009] In some embodiments, the heat pump coupled with semiconductor dehumidification system includes: A controller is connected to the detection component via a signal, and the controller is configured to control the operation of the electrically controlled three-way valve based on the signal from the detection component.

[0010] In some embodiments, the heat pump coupled with semiconductor dehumidification system includes: A control and display panel is disposed on the outer surface of the housing. The control and display panel is electrically connected to the controller and is used to set parameters and display the working status.

[0011] In some embodiments, the dehumidification duct is provided with a diversion port, which is located between the first cold end and the condenser, and the inlet end of the drain pipe is connected to the diversion port.

[0012] In some embodiments, the heat pump coupled with semiconductor dehumidification system includes: A water tank, located below the evaporator, is used to collect condensate from the surface of the evaporator.

[0013] In some embodiments, the heat pump coupled with semiconductor dehumidification system includes: A first fan is installed in the dehumidification duct and located downstream of the condenser. The first fan is used to drive airflow from the total inlet to the total outlet. The second fan is installed in the defrosting duct and is located downstream of the first hot end.

[0014] In some embodiments, the heat pump coupled with semiconductor dehumidification system includes: An air guide is provided on the outside of the first hot end, and the outlet end of the drain pipe is connected to the air guide. The air guide is used to guide the airflow to blow evenly across the first hot end.

[0015] An embodiment of the present invention discloses a defrosting method, comprising: Monitor the status of the evaporator; When the evaporator is detected to meet the defrosting conditions, the airflow flowing through the first hot end is guided to the surface of the evaporator through the defrosting air duct for defrosting. The defrosting conditions are that the surface temperature of the evaporator is lower than a first preset threshold, and / or the air pressure difference before and after the evaporator is higher than a second preset threshold. When the evaporator does not meet the defrosting conditions, the airflow flowing through the first hot end is controlled to be discharged to the total outlet.

[0016] The above-described one or more technical solutions in the embodiments of the present invention have at least one of the following technical effects: First, the heat pump and semiconductor coupled dehumidification system of this embodiment of the invention utilizes the evaporator of the heat pump component, the first cold end of the semiconductor heat exchanger, and the condenser of the heat pump component for dehumidification, and couples the heat pump component with the semiconductor heat exchanger to improve the dehumidification capacity.

[0017] Secondly, the heat pump and semiconductor coupled dehumidification system of this embodiment of the invention sets up an independent defrosting air duct so that the hot air required for defrosting comes from a portion of the airflow diverted from the dehumidification air duct. This enables the dehumidification operation of the dehumidification air duct to continue uninterrupted while the defrosting operation is in progress, thereby maintaining the continuity of the dehumidification operation and preventing fluctuations in indoor humidity.

[0018] Finally, the present invention places the first cold end of the semiconductor heat exchanger in a dehumidification duct for dehumidification, while using a drainage pipe and a defrosting duct to directly guide the waste heat generated by the first hot end of the semiconductor heat exchanger to the evaporator of the heat pump assembly for defrosting, so that the waste heat of the first hot end is no longer discharged into the environment, but is recycled and reused, thereby improving the compactness and energy utilization efficiency of the equipment.

[0019] The defrosting method of this invention triggers defrosting based on real-time monitoring of physical quantities (temperature, pressure difference), achieving on-demand defrosting and avoiding the energy waste and efficiency loss that may occur with timed defrosting, such as "defrosting without frost" or "thick frost that doesn't defrost." Simultaneously, this method decouples the defrosting process from the main dehumidification process in terms of airflow, allowing defrosting operation to continue without interrupting the main air duct's dehumidification work. This solves the humidity fluctuation problem caused by defrosting shutdowns in low-temperature, high-humidity environments, ensuring continuous and stable environmental humidity. Furthermore, utilizing the heat from the semiconductor heat exchanger 3 for defrosting improves energy utilization efficiency.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention and are not considered as limitations on this application. Moreover, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0022] Figure 1 This is one of the schematic structural diagrams of the heat pump and semiconductor coupled dehumidification system provided by the present invention.

[0023] Figure 2 This is the second schematic structural diagram of the heat pump and semiconductor coupled dehumidification system provided by the present invention.

[0024] Figure label: 100. Heat pump and semiconductor coupled dehumidification system; 200. Greenhouse; 1. Shell; 11. Main Inlet; 12. Main Outlet; 13. Secondary Outlet; 2. Heat pump assembly; 21. Evaporator; 22. Condenser; 23. Capillary tube; 24. Compressor; 3. Semiconductor heat exchanger; 31. First cold end; 32. First hot end; 4. Dehumidifying air duct; 5. Defrosting air duct; 51. Drainage pipe; 6. Electrically controlled three-way valve; 7. Detection components; 8. Control and display panel; 9. Water tank; 10. First fan; 14. Second fan; 15. Traveling assembly. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0026] The specific terms used in this specification are for illustrative purposes only and are not intended to limit the illustrated embodiments. For example, expressions such as "same" and "identical" not only indicate a strictly identical state, but also indicate a state with tolerances or differences in the degree of functionality. For example, expressions indicating relative or absolute arrangement such as "in a certain direction," "along a certain direction," "side by side," "perpendicular," "centered on," "concentric," or "coaxial" not only strictly indicate such an arrangement, but also indicate a state of relative displacement by tolerances or angles or distances with the same degree of functionality.

[0027] The terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0028] Furthermore, features specified as "first" or "second" may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "multiple" means two or more. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified. In the description of the embodiments of this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, C1 and / or C2 can represent: C1 existing alone, C1 and C2 existing simultaneously, and C2 existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] The following is combined Figures 1 to 2 The present invention describes a heat pump and semiconductor coupled dehumidification system 100.

[0031] like Figure 1As shown, the heat pump and semiconductor coupled dehumidification system 100 of this embodiment includes a housing 1, a heat pump assembly 2, a semiconductor heat exchanger 3, a dehumidification duct 4, a defrosting duct 5, and a drain pipe 51.

[0032] The housing 1 has a total inlet 11 and a total outlet 12. The heat pump assembly 2 includes an evaporator 21 and a condenser 22. The semiconductor heat exchanger 3 has a first cold end 31 for cooling air and a first hot end 32 for generating heat. A dehumidification duct 4 connects the total inlet 11 and the total outlet 12, and the evaporator 21, the first cold end 31, and the condenser 22 are arranged sequentially on the dehumidification duct 4. The inlet end of the defrosting duct 5 is connected to the first hot end 32. The defrosting duct 5 has a dehumidification mode and a defrosting mode. In the dehumidification mode, the outlet end of the defrosting duct 5 faces outward from the housing 1; in the defrosting mode, the outlet end of the defrosting duct 5 is positioned towards the evaporator 21 to defrost the evaporator 21. A guide pipe 51 is provided in the defrosting duct 5, with its inlet end connected to the first cold end 31 and its outlet end connected to the first hot end 32. The guide pipe 51 is used to guide part of the airflow from the first cold end 31 to the first hot end 32.

[0033] The casing 1 has a main inlet 11 and a main outlet 12 at its two ends, forming a general channel for air entry and exit. The heat pump assembly 2 includes an evaporator 21 and a condenser 22, which are the core components of the heat pump system for cooling and heating. The semiconductor heat exchanger 3 has a physically isolated first cold end 31 and a first hot end 32, where the first cold end 31 is used to cool the air, and the first hot end 32 is used to generate heat. The semiconductor heat exchanger 3 operates using the Peltier effect.

[0034] The dehumidification duct 4 is the main airflow channel penetrating the casing 1, with its two ends connected to the main inlet 11 and the main outlet 12, respectively. Within this dehumidification duct 4, the evaporator 21, the first cold end 31 of the semiconductor heat exchanger 3, and the condenser 22 are arranged sequentially along the main inlet 11 towards the main outlet 12 and connected by pipes, forming a series arrangement. The first hot end 32 of the semiconductor heat exchanger 3 is located outside the dehumidification duct 4. The inlet end of the guide pipe 51 is connected to the downstream position of the first cold end 31, and its outlet end is connected to the first hot end 32, thus forming an airflow branch between the dehumidification duct 4 and the first hot end 32, so that part of the airflow flowing from the first cold end 31 is guided to the defrosting duct 5. The defrosting duct 5 is an airflow channel independent of the dehumidification duct 4. Its inlet end is connected to the space where the first hot end 32 is located, and its outlet end is positioned facing the surface of the evaporator 21, so that the airflow flowing from this outlet end can directly act on the evaporator 21. All components on the dehumidification duct 4 and the defrosting duct 5 are connected by ventilation pipes.

[0035] When the heat pump and semiconductor coupled dehumidification system 100 operates in the greenhouse 200, humid air enters through the main inlet 11 and first flows through the evaporator 21 to be cooled and dehumidified, with most of the moisture precipitated. Subsequently, this pre-dehumidified air flows through the first cold end 31 of the semiconductor heat exchanger 3, where it is further cooled to achieve deep dehumidification. Afterward, the air is heated by the condenser 22 and finally discharged through the main outlet 12, completing the continuous dehumidification process of the dehumidification duct 4.

[0036] The defrosting duct 5 has both dehumidification and defrosting modes. When frost forms on the surface of the evaporator 21 and defrosting is required, the defrosting duct 5 enters defrosting mode. A portion of the low-temperature, dry air flowing through the first cold end 31 of the semiconductor heat exchanger 3 is guided through the guide pipe 51 to the first hot end 32 of the semiconductor heat exchanger 3, absorbing the heat generated during its operation and becoming a warm airflow. This heated, dry airflow is precisely guided through the defrosting duct 5 and blown onto the surface of the evaporator 21, using its heat to melt the frost layer. Throughout the defrosting process, the dehumidification process in the main airflow channel remains unaffected and continues. When the evaporator 21 is normally frost-free, the defrosting duct 5 enters dehumidification mode. This warm airflow is not used for defrosting at this time but is directly discharged outside the shell 1 and into the greenhouse 200.

[0037] Semiconductor dehumidification equipment has been introduced into related technologies to assist heat pumps in dehumidification, thus preventing the heat pump from being affected by defrosting shutdowns. However, semiconductor dehumidification equipment and heat pump dehumidifiers are independent devices with low system integration, resulting in limited improvement in overall dehumidification capacity. Moreover, the waste heat generated at the hot end of semiconductor dehumidification equipment during operation is usually directly discharged, leading to energy waste.

[0038] The heat pump and semiconductor coupled dehumidification system 100 of this embodiment of the invention has the following effects: First, the heat pump and semiconductor coupled dehumidification system 100 of this embodiment of the invention utilizes the evaporator 21 of the heat pump assembly 2, the first cold end 31 of the semiconductor heat exchanger 3, and the condenser 22 of the heat pump assembly 2 for dehumidification, and couples the heat pump assembly 2 with the semiconductor heat exchanger 3 to improve the dehumidification capacity.

[0039] Secondly, the heat pump and semiconductor coupled dehumidification system 100 of this embodiment of the invention sets up an independent defrosting air duct 5 so that the hot air required for defrosting comes from a portion of the airflow diverted from the dehumidification air duct 4. This enables the dehumidification operation of the dehumidification air duct 4 to continue uninterrupted while the defrosting operation is in progress, thereby maintaining the continuity of the dehumidification operation and preventing fluctuations in indoor humidity.

[0040] Finally, the present invention places the first cold end 31 of the semiconductor heat exchanger 3 in the dehumidification duct 4 for dehumidification, and at the same time uses the drainage pipe 51 and the defrosting duct 5 to directly guide the waste heat generated by the first hot end 32 of the semiconductor heat exchanger 3 to the evaporator 21 of the heat pump assembly 2 for defrosting, so that the waste heat of the first hot end 32 is no longer discharged into the environment, but is recycled and reused, thereby improving the compactness and energy utilization efficiency of the equipment.

[0041] In some embodiments, such as Figure 1 As shown, the heat pump and semiconductor coupled dehumidification system 100 includes an electrically controlled three-way valve 6, which is located on the defrosting duct 5. The electrically controlled three-way valve 6 includes a first port, a second port and a third port. The first port is connected to the first hot end 32, the second port faces the evaporator 21, the housing 1 is provided with a secondary outlet 13, and the third port is connected to the secondary outlet 13.

[0042] In this embodiment, the heated airflow exiting the first hot end 32 does not have a single outlet, but is intelligently distributed by the electrically controlled three-way valve 6. The first port of the electrically controlled three-way valve 6 serves as a common inlet, connecting to the airflow from the first hot end 32. Its second port faces the evaporator 21, and its third port is connected to an independent secondary outlet 13 on the casing 1. When the first port is connected to the second port, the defrosting duct 5 enters defrosting mode; when the first port is connected to the third port, the defrosting duct 5 enters dehumidification mode. Thus, by switching the valve, it is possible to control whether the airflow flows to the evaporator 21 for defrosting or is directly discharged through the secondary outlet 13.

[0043] The heat pump and semiconductor coupled dehumidification system 100 of this embodiment of the invention, by setting an electrically controlled three-way valve 6, realizes on-demand and controllable switching of the use of semiconductor waste heat. This not only provides precise defrosting heat during frosting, but also, under normal dehumidification conditions when the evaporator 21 is frost-free, guides the semiconductor waste heat to the secondary outlet 13 to assist in heating the exhaust gas, thereby improving the energy utilization rate of the heat pump and semiconductor coupled dehumidification system 100 and realizing the cascade utilization of waste heat under all operating conditions.

[0044] In some embodiments, such as Figure 1 As shown, the heat pump and semiconductor coupled dehumidification system 100 includes a detection component 7, which is disposed on the heat pump component 2. The detection component 7 includes a temperature sensor, which is used to detect the surface temperature of the evaporator 21 or the inlet and outlet air temperature.

[0045] In this embodiment, the temperature sensor can be directly placed on the surface of the metal fins of the evaporator 21 to measure its temperature; or it can be placed in the airflow channels before and after the evaporator 21 to measure the inlet and outlet air temperatures. By monitoring temperature changes, it can be determined whether the surface of the evaporator 21 has reached the low-temperature conditions for condensation or frost formation.

[0046] The heat pump and semiconductor coupled dehumidification system 100 of this embodiment of the invention introduces a temperature sensor as a direct sensing element for the frost state of the evaporator 21, providing a key physical quantity input for the controller's decision-making.

[0047] In some embodiments, the detection component 7 includes a pressure sensor for detecting the air pressure difference between the inlet and outlet sides of the evaporator 21.

[0048] In this embodiment, the detection component 7 is also equipped with a pressure sensor. This pressure sensor is connected to the air duct on the inlet and outlet sides of the evaporator 21 and is used to measure the pressure difference generated before and after the air flows through the evaporator 21 in real time. When the airflow channel narrows and the air resistance increases due to frost on the surface of the evaporator 21, this pressure difference value will rise accordingly.

[0049] The heat pump and semiconductor coupled dehumidification system 100 of this invention provides an indirect but highly sensitive means of monitoring frost thickness by adding a pressure sensor. The differential pressure signal can reflect the degree of frost accumulation blocking the air duct in real time, providing another reliable basis for the controller to determine the defrosting timing. In particular, it can be used in conjunction with a temperature sensor to improve the accuracy of defrosting judgment and ensure the timeliness and effectiveness of defrosting action.

[0050] In some embodiments, the detection component 7 includes a humidity sensor for detecting the air humidity at the total inlet 11 and the total outlet 12.

[0051] In this embodiment, the detection component 7 further integrates a humidity sensor. The humidity sensor can be installed at the main inlet 11 to monitor ambient humidity, or at the main outlet 12 to monitor exhaust humidity, or both. By monitoring humidity, the dehumidification needs of the environment and the actual dehumidification effect of the equipment can be understood.

[0052] The heat pump and semiconductor coupled dehumidification system 100 of this invention, by adding a humidity sensor, enables the system to achieve closed-loop control based on the target humidity. The controller can automatically adjust the operating power of the equipment according to the difference between the set humidity and the measured ambient humidity, achieving more refined energy-saving operation while meeting dehumidification requirements.

[0053] In other embodiments, the detection component 7 includes a composite sensor integrating a temperature sensor, a pressure sensor, and a humidity sensor. The composite sensor is mounted on the evaporator 21 to detect the temperature, pressure, and humidity of the evaporator 21.

[0054] In some embodiments, the heat pump coupled with semiconductor dehumidification system 100 includes a controller that is signal-connected to the detection component 7 and is configured to control the operation of the electrically controlled three-way valve 6 according to the signal from the detection component 7.

[0055] In this embodiment, the controller establishes a signal connection with the aforementioned detection components 7, such as the temperature sensor, pressure sensor, and humidity sensor, and receives the operating condition data collected by them in real time. The controller has pre-stored control logic, which can automatically generate control commands based on the received signals (such as the evaporator 21 temperature being below 0°C or the pressure difference exceeding the set value) and output them to the electrically controlled three-way valve 6 to drive its valve core to move, thereby enabling the defrosting air duct 5 to automatically switch between "defrosting mode" and "normal mode".

[0056] The heat pump and semiconductor coupled dehumidification system 100 of this invention realizes the complete automation of the defrosting process by introducing a controller. Without manual intervention, it can intelligently schedule semiconductor waste heat resources according to the actual frosting state, thereby improving the reliability of the heat pump and semiconductor coupled dehumidification system 100.

[0057] In some embodiments, the heat pump and semiconductor coupled dehumidification system 100 includes a control and display panel 8, which is disposed on the outer surface of the housing 1 and electrically connected to the controller. The control and display panel 8 is used to set parameters and display the operating status.

[0058] In this embodiment, a human-machine interface integrating input and display functions—a control and display panel 8—is provided on the outer surface of the housing 1. The control and display panel 8 is electrically connected to the internal controller. Users can set parameters such as target humidity and operating mode through the buttons or touch screen on the panel; the display screen on the panel can display the current ambient temperature and humidity, equipment operating mode, fault codes, and other operating status information in real time.

[0059] The heat pump and semiconductor coupled dehumidification system 100 of this embodiment of the invention provides users with an intuitive and convenient device operation and monitoring window by adding a control and display panel 8, making parameter settings and device status viewing clear at a glance.

[0060] In some embodiments, the dehumidification duct 4 is provided with a diversion port, which is located between the first cold end 31 and the condenser 22, and the inlet end of the drain pipe 51 is connected to the diversion port.

[0061] In this embodiment, the diversion port is located on the duct wall of the dehumidification duct 4, and its position is limited to the pipe section between the first cold end 31 and the condenser 22. The inlet end of the drain pipe 51 is directly connected to the diversion port, thereby determining the "extraction point" of the defrosting airflow.

[0062] The heat pump and semiconductor coupled dehumidification system 100 of this embodiment of the invention ensures that the airflow directed to the first hot end 32 has undergone two stages of deep dehumidification—by limiting the flow outlet after the first cold end 31—by the evaporator 21 and the semiconductor heat exchanger 3. This air is characterized by low temperature and low moisture content, which is used to cool the semiconductor hot end, resulting in a large heat exchange temperature difference and high efficiency. Furthermore, it avoids condensation at the first hot end 32 due to contact with humid air, ensuring the safety and efficiency of the waste heat recovery process.

[0063] In some embodiments, such as Figure 1 and Figure 2 As shown, the heat pump coupled with semiconductor dehumidification system 100 includes a water tank 9, which is located below the evaporator 21 and is used to collect condensate from the surface of the evaporator 21.

[0064] In this embodiment, a water tank 9 is installed directly below the evaporator 21. During the dehumidification process, a large amount of condensate that is released from the surface of the evaporator 21 due to the cooling air drips down under the influence of gravity and is collected by the water tank 9 below.

[0065] The heat pump and semiconductor coupled dehumidification system 100 of this invention, by setting up a water tank 9, avoids problems such as electrical short circuits, metal corrosion or bacterial growth that may be caused by the overflow of condensate inside the equipment, thus ensuring the internal cleanliness and safety of the equipment during long-term operation.

[0066] In some embodiments, such as Figure 1 As shown, the heat pump coupled with semiconductor dehumidification system 100 includes a first fan 10 and a second fan 14. The first fan 10 is disposed in the dehumidification duct 4 and is located downstream of the condenser 22. The first fan 10 is used to drive airflow from the total inlet 11 to the total outlet 12. The second fan 14 is disposed in the defrosting duct 5 and is located downstream of the first hot end 32.

[0067] In this embodiment, the first fan 10 serves as the main fan and is installed at the end of the dehumidification duct 4 (downstream of the condenser 22). It is responsible for generating a continuous main airflow from the total inlet 11 to the total outlet 12 and is the core power source for the dehumidification function. The second fan 14 serves as an auxiliary fan and is installed on the defrosting duct 5 (downstream of the first hot end 32). It is specifically responsible for driving or enhancing the defrosting airflow that flows through the first hot end 32 and leads to the evaporator 21.

[0068] The heat pump and semiconductor coupled dehumidification system 100 of this embodiment of the invention can actively and independently control the flow rate and speed of the defrosting airflow by setting an independent second fan 14, without being constrained by the operating conditions of the first fan 10.

[0069] In some embodiments, the heat pump coupled with semiconductor dehumidification system 100 includes an air guide, which is disposed outside the first hot end 32. The outlet end of the drain pipe 51 is connected to the air guide, and the air guide is used to guide the airflow to blow evenly across the first hot end 32.

[0070] In this embodiment, an air guide is installed outside the first hot end 32 of the semiconductor. The airflow delivered by the guide pipe 51 first enters the cavity inside this air guide, and then, under the guidance and constraint of the cavity, it diffuses evenly and flows across the entire surface of the heat dissipation fins of the first hot end 32.

[0071] The heat pump and semiconductor coupled dehumidification system 100 of this embodiment optimizes the airflow through the first hot end 32 by adding an air guide, thereby eliminating possible short circuits or uneven distribution of airflow and ensuring that each part of the heat dissipation fins can be effectively covered by airflow, thereby improving the utilization efficiency of semiconductor waste heat.

[0072] In some embodiments, the heat pump coupled with semiconductor dehumidification system 100 includes a walking assembly 15 disposed at the bottom of the housing 1.

[0073] In this embodiment, a walking assembly 15, such as casters with brakes, is installed at the bottom of the housing 1. This allows the entire heat pump and semiconductor-coupled dehumidification system 100 to be easily moved on a flat surface.

[0074] The heat pump and semiconductor coupled dehumidification system 100 of this embodiment transforms the device from a fixed to a mobile type by adding a walking component 15. This greatly enhances the flexibility of the device, allowing users to easily adjust its position as needed.

[0075] In some embodiments, the heat pump assembly 2 further includes a capillary tube 23, and the condenser 22, capillary tube 23, and evaporator 21 are connected by a pipeline. The capillary tube 23 acts as a throttling element, responsible for throttling and reducing the pressure of the high-pressure liquid refrigerant, enabling it to absorb heat and evaporate in the evaporator 21.

[0076] The heat pump assembly 2 also includes a compressor 24, which is connected to the evaporator 21 and the condenser 22 via pipelines, forming a closed refrigerant circulation loop. When the compressor 24 is working, it draws in low-temperature, low-pressure gaseous refrigerant and compresses it into high-temperature, high-pressure gas, providing the necessary energy conversion conditions for subsequent heat release in the condenser 22 and heat absorption in the evaporator 21, and is the power source for realizing the heat pump dehumidification function.

[0077] The defrosting method of this invention includes: Monitor the status of evaporator 21. When the evaporator 21 meets the defrosting conditions, control the airflow flowing through the first hot end 32 to be guided to the surface of evaporator 21 through defrosting air duct 5 for defrosting.

[0078] The defrosting conditions are that the surface temperature of the evaporator 21 is lower than the first preset threshold, and / or the air pressure difference before and after the evaporator 21 is higher than the second preset threshold.

[0079] When the defrosting conditions are not met in the evaporator 21, the airflow flowing through the first hot end 32 is controlled to be discharged to the total outlet 12.

[0080] In this embodiment, the method determines whether defrosting is needed by real-time monitoring of the surface temperature or air resistance changes of the evaporator 21. When the surface temperature of the evaporator 21 is too low (potentially causing frost formation) or the air pressure difference is too large (leading to increased air resistance due to thicker frost), the controller determines that the defrosting conditions are met. At this time, the airflow path is automatically switched to guide the waste heat generated by the first hot end 32 of the semiconductor heat exchanger 3 to the evaporator 21 for defrosting. Under normal dehumidification conditions, this waste heat is guided to the secondary outlet 13 for discharge.

[0081] The defrosting method of this invention triggers defrosting based on real-time monitoring of physical quantities (temperature, pressure difference), achieving on-demand defrosting and avoiding the energy waste and efficiency loss that may occur with timed defrosting, such as "defrosting without frost" or "thick frost that doesn't defrost." Simultaneously, this method decouples the defrosting process from the main dehumidification process in terms of airflow, allowing defrosting operation to continue without interrupting the main air duct's dehumidification work. This solves the humidity fluctuation problem caused by defrosting shutdowns in low-temperature, high-humidity environments, ensuring continuous and stable environmental humidity. Furthermore, utilizing the heat from the semiconductor heat exchanger 3 for defrosting improves energy utilization efficiency.

[0082] Finally, it should be noted that the above embodiments are only for illustrating the present invention and not for limiting the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications, or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and should be covered within the scope of the claims of the present invention.

Claims

1. A heat pump coupled with a semiconductor dehumidification system, characterized in that, include: The shell (1) has a total inlet (11) and a total outlet (12); The heat pump assembly (2) includes an evaporator (21) and a condenser (22); The semiconductor heat exchanger (3) has a first cold end (31) for cooling air and a first hot end (32) for generating heat. A dehumidifying duct (4) is connected to the total inlet (11) and the total outlet (12). The evaporator (21), the first cold end (31) and the condenser (22) are arranged sequentially on the dehumidifying duct (4). The defrosting duct (5) has an inlet end connected to the first hot end (32). The defrosting duct (5) has a dehumidification mode and a defrosting mode. In the dehumidification mode, the outlet end of the defrosting duct (5) faces out of the housing (1). In the defrosting mode, the outlet end of the defrosting duct (5) is set towards the evaporator (21) to defrost the evaporator (21). A drainage pipe (51) is provided in the defrosting air duct (5), with its inlet end connected to the first cold end (31) and its outlet end connected to the first hot end (32). The drainage pipe (51) is used to guide part of the airflow from the first cold end (31) to the first hot end (32).

2. The heat pump and semiconductor coupled dehumidification system according to claim 1, characterized in that, The heat pump coupled with semiconductor dehumidification system includes: An electrically controlled three-way valve (6) is provided on the defrosting air duct (5). The electrically controlled three-way valve (6) includes a first port, a second port and a third port. The first port is connected to the first hot end (32), the second port faces the evaporator (21), and the housing (1) is provided with a secondary outlet (13). The third port is connected to the secondary outlet (13).

3. The heat pump and semiconductor coupled dehumidification system according to claim 2, characterized in that, The heat pump and semiconductor coupled dehumidification system includes a detection component (7) disposed on the heat pump component (2), and the detection component (7) includes: A temperature sensor is used to detect the surface temperature of the evaporator (21) or the inlet and outlet air temperature; And / or, a pressure sensor for detecting the air pressure difference between the inlet and outlet sides of the evaporator (21); And / or, a humidity sensor for detecting the air humidity at the total inlet (11) and the total outlet (12).

4. The heat pump and semiconductor coupled dehumidification system according to claim 3, characterized in that, The heat pump coupled with semiconductor dehumidification system includes: A controller is connected to the detection component (7) by signal, and the controller is configured to control the operation of the electrically controlled three-way valve (6) according to the signal of the detection component (7).

5. The heat pump and semiconductor coupled dehumidification system according to claim 4, characterized in that, The heat pump coupled with semiconductor dehumidification system includes: A control and display panel (8) is disposed on the outer surface of the housing (1). The control and display panel (8) is electrically connected to the controller. The control and display panel (8) is used to set parameters and display the working status.

6. The heat pump and semiconductor coupled dehumidification system according to claim 1, characterized in that, The dehumidification duct (4) is provided with a diversion port, which is located between the first cold end (31) and the condenser (22). The inlet end of the drain pipe (51) is connected to the diversion port.

7. The heat pump and semiconductor coupled dehumidification system according to claim 1, characterized in that, The heat pump coupled with semiconductor dehumidification system includes: A water tank (9) is located below the evaporator (21) and is used to collect condensate from the surface of the evaporator (21).

8. The heat pump and semiconductor coupled dehumidification system according to claim 1, characterized in that, The heat pump coupled with semiconductor dehumidification system includes: The first fan (10) is disposed in the dehumidification duct (4) and located downstream of the condenser (22). The first fan (10) is used to drive the airflow from the total inlet (11) to the total outlet (12). The second fan (14) is located in the defrosting duct (5) and downstream of the first hot end (32).

9. The heat pump and semiconductor coupled dehumidification system according to claim 1, characterized in that, The heat pump coupled with semiconductor dehumidification system includes: An air guide is provided on the outside of the first hot end (32). The outlet end of the drain pipe (51) is connected to the air guide. The air guide is used to guide the airflow to blow evenly across the first hot end (32).

10. A dehumidification method using a heat pump and semiconductor coupled dehumidification system according to any one of claims 1-9, characterized in that, include: Monitor the status of the evaporator (21); When the evaporator (21) is detected to meet the defrosting conditions, the airflow flowing through the first hot end (32) is guided to the surface of the evaporator (21) through the defrosting air duct (5) for defrosting. The defrosting conditions are that the surface temperature of the evaporator (21) is lower than a first preset threshold, and / or the wind pressure difference before and after the evaporator (21) is higher than a second preset threshold; When the defrosting conditions are not met in the evaporator (21), the airflow flowing through the first hot end (32) is controlled to be discharged to the total outlet (12).

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