Portable semiconductor ice maker and ice making method

Abstract

This invention provides a portable semiconductor ice maker and ice-making method, including a support frame structure. An ice-making structure is mounted on the upper end of the support frame structure. The ice-making structure includes a TEC chip for ice making, and a heat dissipation structure for cooling the TEC chip is mounted below the ice-making structure, extending to the top of the support frame structure. The advantages of this invention are: the ice maker is compact, customizable in shape, supports installation at any angle, is easy to carry, and can be used readily by users, making it highly practical. Furthermore, its appearance can be designed in the shape of a can, enhancing its aesthetic appeal. The air intake space of this ice maker occupies 20% of the overall machine, ensuring maximum heat dissipation while maintaining a compact design. The insulation layer of the ice-making structure is made of EPS insulation, which can maintain a suitable temperature for a long time under normal use, meeting practical usage needs.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor refrigeration technology, and in particular relates to a portable semiconductor ice maker and ice-making method. Background Technology

[0002] Semiconductor refrigeration, also known as electronic refrigeration or thermoelectric refrigeration, is a discipline that emerged in the 1950s and lies at the intersection of refrigeration technology and semiconductor technology. It utilizes PN junctions made of special semiconductor materials to form thermocouple pairs and generate the Peltier effect, which is a new type of refrigeration method that uses direct current for cooling. It is considered one of the three major refrigeration methods in the world, along with compression refrigeration and absorption refrigeration.

[0003] Currently, semiconductor ice makers have the following problems: (1) Ice makers are mostly for home use, are large in size, and are not easy to carry. They are not readily available for use when people are out and about, making them impractical.

[0004] (2) During the current operation of the refrigeration system, the loss of cold energy during the heat transfer process is relatively large due to many factors such as poor insulation performance of the system, unreasonable design of transmission pipelines, and influence of external ambient temperature.

[0005] (3) The heat preservation capacity of the item is obviously insufficient. Under normal use, it is difficult to maintain a suitable temperature for a long time and cannot meet the actual use needs. Summary of the Invention

[0006] In view of this, the present invention aims to provide a portable semiconductor ice maker and ice-making method to solve at least one of the problems existing in the prior art.

[0007] To achieve the above objectives, the technical solution of the present invention is implemented as follows: In a first aspect, the present invention proposes a portable semiconductor ice maker, including a support frame structure, an ice-making structure installed at the upper end of the support frame structure, the ice-making structure including a TEC chip for making ice, a heat dissipation structure for dissipating heat from the TEC chip installed below the ice-making structure, and the heat dissipation structure being installed at the top of the inside of the support frame structure. The control box is installed at the bottom of the internal support frame structure, and an interface for powering the control box is provided. The TEC chip, heat dissipation structure and control box are electrically connected. There is an air intake space between the bottom of the support frame structure and the heat dissipation structure, and the height of the air intake space is in a ratio of no less than 1:5 to the whole machine.

[0008] Furthermore, it also includes an outer shell and its internal supporting shell, an upper cover insulation layer, and a base. An upper cover insulation layer for insulating the upper layer of the ice-making structure is installed on the upper part of the supporting shell, and a base is installed below the supporting shell. The supporting shell and the base form a hollow structure, and a support frame structure is installed inside the hollow structure. Several heat dissipation holes are opened on the surface of the supporting shell.

[0009] Furthermore, the support frame structure includes two symmetrically arranged support frame bodies. Each support frame body includes an integrally formed cable tray, a heat dissipation mounting bracket, and a bottom protective cover. The top of the cable tray is connected to the ice-making structure, the middle of the cable tray is provided with a semi-circular heat dissipation mounting bracket, and the bottom of the cable tray is provided with a semi-circular bottom protective cover.

[0010] Furthermore, a wiring channel for the ice-making structure, heat dissipation structure, and control box is provided on one side of the wiring bracket, and a branch channel is provided on the top of the wiring bracket. The branch channel has mounting holes. The heat sink of the heat dissipation structure is installed on the top of the wiring bracket by screws passing through the mounting holes at both ends. The lines of the ice-making structure, heat dissipation structure, and control box pass through the wiring channel from bottom to top and are then split by the branch channel.

[0011] Furthermore, the two heat dissipation mounting brackets are connected to form a hollow ring structure. The bottom of the hollow ring structure is provided with a ring boss for installing the heat dissipation fan. The heat sink is installed above the heat dissipation fan.

[0012] Furthermore, the two bottom protective covers are snapped together to form a circular protective cover, and the bottom of the circular protective cover and the base form a receiving space for placing the control box.

[0013] Furthermore, the upper cover insulation layer includes an outer shell and its interior, a pull-ring cover, a lower cover of the upper insulation layer, a foolproof structure, a pull-ring seal, a magnetic ring, and several positioning posts. The lower cover of the upper insulation layer is installed below the pull-ring cover, and an ice-making structure is installed below the lower cover of the upper insulation layer. A foolproof structure is installed between the pull-ring cover and the lower cover of the upper insulation layer. A pull-ring seal is provided on each side of the foolproof structure. Four positioning posts are evenly distributed above the lower cover of the upper insulation layer. A circumferential groove for placing the magnetic ring is also provided on the outer circumference of the lower cover of the upper insulation layer. The magnetic ring is used to form a magnetic structure for sealing and heat preservation with the magnetic block on the ice-making structure.

[0014] Furthermore, the ice-making structure also includes an ice-making support, an ice-making tank unit, an ice-making tank insulation layer, and a TEC chip. The top of the ice-making support is evenly distributed with several placement holes for mounting magnetic blocks. The bottom of the ice-making support is fitted with an ice-making tank insulation layer, which is a barrel-shaped structure with its opening facing upwards. The ice-making tank unit is embedded in the ice-making tank insulation layer, and both of them have a TEC chip at their lower ends. The bottom of the ice-making tank insulation layer has a hollow structure for accommodating the TEC chip. The ice-making tank insulation layer provides a sealed and heat-insulating space. The shape of the ice-making tank unit and the ice-making tank insulation layer are fitted with a gap. The TEC chip is used to make and remove ice from the water in the ice-making tank unit.

[0015] Furthermore, the surface of the ice-making tank unit is provided with four ice-making tank structures, and a refrigeration column is installed inside the ice-making tank structure.

[0016] Secondly, the present invention also proposes an ice-making method for a portable semiconductor ice maker, comprising the following steps: S1. The user opens the top insulation layer, pours an appropriate amount of water into the ice trough structure, and then closes the ice trough structure. S2. Set the target temperature for ice making. Press the power button to start the TEC chip and heat dissipation structure. Ice making is complete when the thermistor NTC in the control box detects that the temperature inside the ice-making tank has reached the target temperature. The target temperature setting range is -1℃ to -5℃. The ice-making time is affected by the ambient temperature. When there are 4 ice cubes and each ice cube weighs 5g; When the ambient temperature is 31℃-35℃, the ice-making time is 17min-18min; When the ambient temperature is 26℃-30℃, the ice-making time is 16min-17min; When the ambient temperature is less than or equal to 25℃, the ice-making time is 12-15 minutes; S3. After ice making is completed, the cooling chip drive control circuit of the control box reverses the power supply to heat the TEC chip, causing the ice to be reheated and de-iced.

[0017] Furthermore, the cooling chip drive control circuit includes a first power switching unit, which is connected between the 12V power supply terminal, reference ground GND-1, and node V1. The first power switching unit includes a P-channel MOSFET Q1 and an N-channel MOSFET Q2. The source of the P-channel MOSFET Q1 is connected to the 12V power supply terminal, the drain is connected to node V1, and the gate is grounded through resistor R4. The drain of the N-channel MOSFET Q2 is connected to node V1, the source is connected to GND-1, and the gate is connected to the 12V power supply terminal through resistor R5. The second power switching unit is connected between the 12V power supply terminal, reference ground GND-1, and node V2. The second power switching unit includes a P-channel MOSFET Q12 and an N-channel MOSFET Q13. The source of the P-channel MOSFET Q12 is connected to the 12V power supply terminal, the drain is connected to node V2, and the gate is grounded through resistor R27. The drain of the N-channel MOSFET Q13 is connected to node V2, the source is connected to GND-1, and the gate is connected to the 12V power supply terminal through resistor R28. The control signal terminals include a cooling control terminal S1 and a heating control terminal S2. A gate drive network is provided, which couples the cooling control terminal S1 and the heating control terminal S2 to the control loops of the first power switch unit and the second power switch unit, respectively. The gate drive network includes: a first drive branch connected to the cooling control terminal S1, which is connected to the gate of the N-channel field-effect transistor Q7 via resistor R17. The source of Q7 is grounded, and the drain is connected to the gate of Q2 via resistor R25. The drain of Q7 is also connected to node V1 via resistor R24. The cooling control terminal S1 is also connected to the gate of the N-channel field-effect transistor Q8 via a voltage divider network composed of resistors R15 and R11. The drain of Q8 is connected to a 12V power supply via resistor R21, and the source is connected to the drain of the N-channel field-effect transistor Q11. The source of Q11 is grounded. The second drive branch is connected to the heating control terminal S2. The heating control terminal S2 is connected to the gate of the N-channel field-effect transistor Q15 via resistor R42. The source of Q15 is grounded, and the drain is connected to the gate of Q12 via resistor R43. The drain of Q15 is connected to the node V2 via resistor R41. The heating control terminal S2 is also connected to the gate of the N-channel field-effect transistor Q16 via resistor R44. The source of Q16 is grounded, and the drain is connected to the gate of the N-channel field-effect transistor Q14 via a voltage divider network composed of resistors R30 and R29. The drain of Q14 is connected to the 12V power supply terminal, and the source is connected to the drain of the N-channel field-effect transistor Q17. The source of Q17 is grounded. Specifically, by switching the on and off combinations of each field-effect transistor in the gate drive network through the level state switching of the cooling control terminal S1 or the heating control terminal S2, the potential relationship between node V1 and node V2 relative to ground is changed, thereby realizing the reverse switching of the voltage polarity at both ends of CN-6.

[0018] Compared with existing technologies, the portable semiconductor ice maker and ice-making method described in this invention have the following advantages: The portable semiconductor ice maker of the present invention is small in size, customizable in shape, supports installation at any angle, is easy to carry, and can be used by people on the go. It is highly practical, and its appearance can be set in the shape of a jar, which is aesthetically pleasing. The air intake space of this ice maker occupies 20% of the entire unit. This proportion ensures maximum heat dissipation while maintaining a compact design, allowing 90% of the heat to be carried away through the air outlets on the radiator. This ice maker uses semiconductor refrigeration, eliminating the need for refrigerants (such as Freon), thus avoiding leakage and pollution, making it highly environmentally friendly. Furthermore, the same device switches between cooling and heating modes via the direction of the current, eliminating the need for an additional heating system; it has no compressor, no vibration, no noise, and a long lifespan (no wear). In addition, the insulation layer of this ice-making structure is EPS insulation. Through the insulation layer of the top cover, the insulation layer of the ice-making tank, and the magnetic structure, the insulation effect is greatly improved while achieving a seal. Under normal use, it can maintain a suitable temperature for a long time to meet the actual use needs. The ice-making tank unit is embedded in the insulation layer of the ice-making tank, and a TEC chip is sandwiched between the lower ends of the two. It has strong heat insulation performance and reasonable transmission pipeline design to avoid large loss of cold energy during the heat transfer process. Attached Figure Description

[0019] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a schematic diagram of the overall structure according to an embodiment of the present invention; Figure 2 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 3 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 4 This is a partial three-dimensional schematic diagram of the overall structure described in an embodiment of the present invention; Figure 5 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 6 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 7 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 8 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 9 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 10 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 11 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 12 This is a partial schematic diagram of the overall structure according to an embodiment of the present invention; Figure 13 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 14 This is a partial schematic diagram of the overall structure according to an embodiment of the present invention; Figure 15 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention; Figure 16 This is a partial schematic diagram of the overall structure described in an embodiment of the present invention (Figure 15). Figure 17 This is a circuit diagram of the cooling chip drive control circuit according to an embodiment of the present invention.

[0020] Explanation of reference numerals in the attached figures: 1. Outer shell; 2. Support shell; 21. Heat dissipation holes; 3. Top cover insulation layer; 31. Pull ring cover; 32. Upper insulation layer and lower cover; 33. Foolproof structure; 34. Pull ring seal; 35. Positioning post; 36. Magnetic ring; 37. Top cover shell; 4. Ice-making structure; 41. Ice-making support; 42. Ice-making tank unit; 421. Ice-making tank structure; 422. Cooling column; 43. Ice-making tank insulation layer; 44. TEC chip; 45. Magnetic block; 5. Heat dissipation structure; 51. Heat sink; 52. Cooling fan; 6. Support frame structure; 61. Cable routing bracket; 62. Heat dissipation mounting bracket; 63. Bottom protective cover; 64. Cable routing channel; 65. Cable distribution channel; 66. Annular boss; 67. Speaker sound outlet; 7. Interface; 8. Power switch; 9. Base. Detailed Implementation

[0021] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] like Figures 1 to 17 As shown, a portable semiconductor ice maker includes a shell 1, a supporting shell 2, and a support frame structure 6. The supporting shell 2 is installed inside the shell 1. An upper cover insulation layer 3 for heat preservation of the ice-making structure 4 is installed on the upper part of the supporting shell 2. A base 9 is installed below the supporting shell 2, and the supporting shell 2 and the base 9 form a hollow structure. The support frame structure 6 is installed inside the hollow structure. Several heat dissipation holes 21 are opened on the surface of the supporting shell 2. The ice-making structure 4 is installed at the upper end of the support frame structure 6. The upper cover insulation layer 3 for heat preservation is installed above the ice-making structure 4. The ice-making structure 4 includes a TEC chip 44 for ice making. A heat dissipation structure 5 for heat dissipation of the TEC chip 44 is installed below the ice-making structure 4. The heat dissipation structure 5 is installed at the top of the support frame structure 6. The control box is installed at the bottom of the support frame structure 6, and it is equipped with an interface 7 for powering the control box. The TEC chip 44 and the heat dissipation structure 5 are electrically connected to the control box. A power switch 8 is also provided on one side of the bottom of the control box. The power switch 8 can control the start of the semiconductor ice maker. In this embodiment, under normal operation, pressing the power switch 8 will turn on the machine. Then, the process of powering on-making ice-removing ice-turning off can be completed automatically. The device defaults to this as one complete cycle. Under abnormal operation, a single click of the power switch 8 will turn on the machine. In the power-on state, a long press of the power switch 8 will turn off the machine. In the power-off state, a long press of the power switch 8 will remove ice. The control box is an existing control structure, and its main control chip is an existing microcontroller, which can be an ST32 series or other series. The power supply interface 7 of the control box can be a Type-C interface. The power supply for the interface 7 can be a power bank, a car power supply, a household power supply, or an adapter, which further improves the portability of this ice maker.

[0026] The support frame structure 6 has wiring channels 64 on both sides for the ice-making structure 4, heat dissipation structure 5, and control box wiring. There is an air intake space between the bottom of the support frame structure 6 and the heat dissipation structure 5. The height of the air intake space is no less than 1:5 of the whole machine. In this embodiment, the air intake can effectively increase the heat dissipation capacity of the equipment in the air-cooled heat dissipation system, and at the same time ensure that the refrigeration system of the ice maker works more smoothly. The air intake space accounts for 20% of the whole machine. Under this ratio, maximum heat dissipation can be guaranteed while ensuring compactness. In this embodiment, if the heat dissipation air volume is 20 CFM, the theoretical maximum air intake clearance space required is 2~3 cm, so that the performance of the cooling fan 52 can be effectively utilized, and 90% of the heat can be carried away through the air outlet of the radiator 51.

[0027] In a preferred embodiment of the present invention, the support frame structure 6 includes two symmetrically arranged support frame bodies. Each support frame body includes an integrally formed cable tray 61, a heat dissipation mounting bracket 62, and a bottom protective cover 63. The top of the cable tray 61 is connected to the ice-making structure 4, the middle of the cable tray 61 is provided with a semi-circular heat dissipation mounting bracket 62, and the bottom of the cable tray 61 is provided with a semi-circular bottom protective cover 63. The support frame body is made of ABS material. In this embodiment, using ABS material to make the support frame body can bring several technical benefits: From the perspective of structural support, the combination of rigidity and flexibility of ABS material allows the support frame to provide sufficient strength to support components such as the ice-making structure, heat dissipation structure, and control box, while also absorbing energy through its own toughness when subjected to external impact, reducing the possibility of damage and effectively protecting internal components. In terms of adaptability to the usage environment, its thermal performance can meet the requirements of conventional indoor environments, and the performance and stability of the support frame will not be affected by temperature changes, ensuring that the ice maker can work normally in different seasons and ambient temperatures. In terms of molding and post-processing, excellent processing performance makes the manufacturing of the support frame more efficient and convenient, enabling the rapid production of products that meet design requirements. Simultaneously, the ease of surface treatment provides more possibilities for product aesthetics, enhancing the product's market competitiveness. Regarding adaptability to diverse usage scenarios, chemical stability allows the support frame to be used in various environments, maintaining stable performance in homes, offices, and outdoors. Electrical insulation properties provide safety assurance in scenarios involving electronic equipment, preventing safety issues such as leakage. Environmentally friendly and safe characteristics allow users to use the machine without worrying about health hazards, providing greater peace of mind. Cost advantages help reduce the overall production cost of the ice maker, improving the product's cost-effectiveness and giving it a more advantageous position in market competition.

[0028] In a preferred embodiment of the present invention, the control box may be equipped with a speaker for prompting sounds. The speaker is mounted on the outside of the wiring bracket 61 near the bottom protective cover 63. The wiring bracket 61 may have a speaker outlet hole 67 at the speaker mounting location, or it may not have a speaker, in which case the wiring bracket 61 does not need to have a speaker outlet hole 67. This can be determined according to the actual situation. (See attached instruction manual) Figure 1 - Appendix Figure 7 All diagrams are structural schematics without a speaker outlet 67. (Instruction manual attached.) Figure 8 - Appendix Figure 12 All of these are schematic diagrams of structures with speaker holes 67.

[0029] In a preferred embodiment of the present invention, a wiring groove 64 is provided on the outer side of the wiring bracket 61, and a branch groove 65 is provided on the top of the wiring bracket 61. A mounting hole 66 is provided in the branch groove 65. The heat sink 51 of the heat dissipation structure 5 is installed on the top of the wiring bracket 61 after passing through the mounting hole 66 with screws on both sides. The wiring of the ice-making structure 4, the heat dissipation structure 5, and the control box passes through the wiring groove 64 from bottom to top and is then split by the branch groove 65. In this embodiment, the branch groove 65 can separate the wiring of the TEC chip 44 and other components, avoiding wiring misconnection caused by unclear wiring during the installation process. The wiring groove 64 facilitates wiring, facilitates installation, hides wiring, and improves appearance.

[0030] In a preferred embodiment of the present invention, two heat dissipation mounting brackets 62 are snapped together to form a hollow annular structure. The bottom of the hollow annular structure is provided with an annular protrusion 66 for mounting the cooling fan 52 of the heat dissipation structure 5. A heat sink 51 is mounted above the cooling fan 52. In this embodiment, the operation of the heat sink 51 and the cooling fan 52 enables the heat dissipation structure 5 to dissipate heat from the ice-making structure 4.

[0031] In a preferred embodiment of the present invention, two bottom protective covers 63 are snapped together to form a circular protective cover, and the bottom of the circular protective cover and the base 9 form a receiving space for placing the control box.

[0032] In this embodiment, the control box uses an existing control structure, and its main control chip is an existing microcontroller, which can be an ST32 series or other series. The main control chip, i.e., the microcontroller, uses a thermoelectric cooler drive control circuit to achieve forward and reverse power supply to the TEC chip. The circuit diagram of the thermoelectric cooler drive control circuit is shown below. Figure 13 As shown, a Type-C interface for power supply is provided on one side of the bottom of the control box, and a power switch 8 is also provided on one side of the bottom of the control box. The power switch 8 can be used to control the start of the semiconductor ice maker.

[0033] This ice maker is small and cleverly designed, making it easy to carry and producing multiple ice cubes at once. It is convenient to use, highly practical, and can be customized to resemble a cola can or beer can. When the ice maker is designed for cans, the height ranges from 120mm to 140mm, the diameter from 60mm to 70mm, and the weight from 270g to 280g (with an error range of ±5g). When the dimensions are 134mm × 68mm, the weight is 275g ±5g. It is suitable for ambient temperatures of 35°C or lower, produces 4 ice cubes at a time, and generates 20g of ice per batch. It is powered by Type-C and supports 65W and above PD protocol Type-C fast charging adapters. The product has a heat dissipation capacity capable of handling approximately 50W of heat.

[0034] In a preferred embodiment of the present invention, a housing 1 is further included, and a supporting housing 2 is installed inside the housing 1. In this embodiment, the housing 1 can be fitted over the supporting housing 2 to improve aesthetics, or this housing structure can be omitted. The surface of the supporting housing 2 is provided with a plurality of heat dissipation holes 21. In this embodiment, the heat dissipation holes 21 are used not only for heat dissipation but also for weight reduction.

[0035] In a preferred embodiment of the present invention, the upper cover insulation layer 3 includes an upper cover shell 37 and an inner pull ring cover 31, an upper insulation layer lower cover 32, a foolproof structure 33, a pull ring seal 34, a magnetic ring 36, and several positioning posts 35. The upper insulation layer lower cover 32 is installed below the pull ring cover 31, and an ice-making structure 4 is installed below the upper insulation layer lower cover 32. The foolproof structure 33 is installed between the pull ring cover 31 and the upper insulation layer lower cover 32. A pull ring seal 34 is provided on each side of the foolproof structure 33. Four positioning posts 35 are equidistantly distributed above the upper insulation layer lower cover 32. The outer circumference of the upper insulation layer lower cover 32 is also provided with a circumferential groove for placing the magnetic ring 36. The magnetic ring 36 is used to form a magnetic attraction structure with the magnetic block 45 on the ice-making structure 4 for sealing and heat preservation. In this embodiment, the magnetic structure enables a tighter seal between the upper cover insulation layer 3 and the ice-making tank insulation layer 43, and prevents the seal from failing due to volume changes from water to ice. The upper cover insulation layer 3 not only provides upper insulation for the ice-making structure 4, but its pull ring cover 31 is also designed to allow users to easily open the upper cover insulation layer 3 and remove the ice from inside the ice-making structure 4. The pull ring cover 31 is provided with a slot for the interlocking anti-foolproof structure 33 and the pull ring seal 34.

[0036] In a preferred embodiment of the present invention, the ice-making structure 4 includes an ice-making support 41, an ice-making tank unit 42, an ice-making tank insulation layer 43, and a TEC chip 44. The top of the ice-making support 41 has several placement holes evenly distributed for mounting magnetic blocks 45. The ice-making tank insulation layer 43 has clearance holes for mounting magnetic blocks 45, and the placement holes, clearance holes, and mounting holes 66 are coaxially arranged. Thus, in actual use, a single screw can connect the cable tray 61 to the ice-making support 41 and the ice-making tank insulation layer 43. The bottom of the ice-making support 41 is fitted with the ice-making tank insulation layer 43, which is a barrel-shaped structure with an upward opening. The ice-making tank unit 42 is embedded within the ice-making tank insulation layer 43, and both have a TEC chip 44 at their lower ends. The ice-making tank insulation layer 43 is also insulated. The bottom of layer 43 has a hollow structure for accommodating the TEC chip 44. The ice-making tank insulation layer 43 provides a sealed and heat-insulating space. The shape of the ice-making tank unit 42 and the ice-making tank insulation layer 43 are fitted together with a gap. The TEC chip 44 is used to make and remove ice from the water in the ice-making tank unit 42. When making ice, the contact surface between the TEC chip 44 and the ice-making tank unit 42 is the cooling surface, and the contact surface between the TEC chip 44 and the heat sink 51 is the heat dissipation surface. When removing ice, the contact surface between the TEC chip 44 and the ice-making tank unit 42 is the heat dissipation surface, and the contact surface between the TEC chip 44 and the heat sink 51 is the cooling surface. In this embodiment, the TEC chip 44 is electrically connected to the control box through wiring. The control box controls the TEC chip 44 to start working, thereby cooling the water in the ice-making tank unit 42.

[0037] In a preferred embodiment of the present invention, the surface of the ice-making tank unit 42 is provided with four ice-making tank structures 421, and a cooling column 422 is installed inside the ice-making tank structure 421. In actual use, the user can open the upper cover insulation layer 3 to inject an appropriate amount of water into the ice-making tank structure 421, and then cover the ice-making tank structure 421. The TEC chip 44 is started through the control box to start working, and ice can be obtained after waiting for a period of time.

[0038] In a preferred embodiment of the present invention, the insulation materials for both the upper cover insulation layer 3 and the ice-making tank insulation layer 43 are EPS insulation materials. EPS insulation material has many significant advantages: First, it is lightweight, effectively reducing the overall weight of the equipment and facilitating installation and transportation; second, it has good thermal insulation performance, minimizing cold loss and maintaining the low-temperature environment required for ice making; third, it has excellent cushioning and shock absorption performance, providing good protection for internal components and reducing the risk of damage caused by vibration; fourth, it has good chemical stability, is not prone to chemical reactions with other substances, and can maintain stable insulation performance over a long period; fifth, it is easy to process and mold, and can be made into various shapes and sizes according to different structural requirements, with strong adaptability; sixth, it is environmentally friendly and recyclable, conforming to the concept of sustainable development and reducing environmental impact. The use of EPS insulation material for the upper cover insulation layer 3 and the ice-making tank insulation layer 43 effectively reduces cold loss, lowers energy consumption, extends equipment lifespan, improves ice-making efficiency, and provides users with a better user experience.

[0039] This invention also proposes a method for making ice using a portable semiconductor ice maker, comprising the following steps: S1. The user opens the top cover insulation layer (3), injects an appropriate amount of water into the ice tank structure (421), and then covers the ice tank structure (421). S2. Set the target temperature for ice making to complete. Press the power button (8) to start the TEC chip (44) and heat dissipation structure (5) to begin working. Ice making is completed when the thermistor NTC in the control box detects that the temperature in the ice making tank structure (421) has reached the target temperature. The target temperature setting range is -1℃ to -5℃. The ice-making time is affected by the ambient temperature. When there are 4 ice cubes and each ice cube weighs 5g; When the ambient temperature is 31℃-35℃, the ice-making time is 17min-18min; When the ambient temperature is 26℃-30℃, the ice-making time is 16min-17min; When the ambient temperature is less than or equal to 25℃, the ice-making time is 12-15 minutes; S3. After ice making is completed, the cooling chip drive control circuit of the control box reverses the power supply to heat the TEC chip (44), so that the ice cube is reheated and de-iced.

[0040] The cooling chip drive control circuit includes a first power switch unit, which is connected between the 12V power supply terminal, reference ground GND-1, and node V1. The first power switch unit includes a P-channel field-effect transistor Q1 and an N-channel field-effect transistor Q2. The source of the P-channel field-effect transistor Q1 is connected to the 12V power supply terminal, the drain is connected to node V1, and the gate is grounded through resistor R4. The drain of the N-channel field-effect transistor Q2 is connected to node V1, the source is connected to GND-1, and the gate is connected to the 12V power supply terminal through resistor R5. The second power switching unit is connected between the 12V power supply terminal, reference ground GND-1, and node V2. The second power switching unit includes a P-channel MOSFET Q12 and an N-channel MOSFET Q13. The source of the P-channel MOSFET Q12 is connected to the 12V power supply terminal, the drain is connected to node V2, and the gate is grounded through resistor R27. The drain of the N-channel MOSFET Q13 is connected to node V2, the source is connected to GND-1, and the gate is connected to the 12V power supply terminal through resistor R28. The control signal terminals include a cooling control terminal S1 and a heating control terminal S2. A gate drive network is provided, which couples the cooling control terminal S1 and the heating control terminal S2 to the control loops of the first power switch unit and the second power switch unit, respectively. The gate drive network includes: a first drive branch connected to the cooling control terminal S1, which is connected to the gate of the N-channel field-effect transistor Q7 via resistor R17. The source of Q7 is grounded, and the drain is connected to the gate of Q2 via resistor R25. The drain of Q7 is also connected to node V1 via resistor R24. The cooling control terminal S1 is also connected to the gate of the N-channel field-effect transistor Q8 via a voltage divider network composed of resistors R15 and R11. The drain of Q8 is connected to a 12V power supply via resistor R21, and the source is connected to the drain of the N-channel field-effect transistor Q11. The source of Q11 is grounded. The second drive branch is connected to the heating control terminal S2. The heating control terminal S2 is connected to the gate of the N-channel field-effect transistor Q15 via resistor R42. The source of Q15 is grounded, and the drain is connected to the gate of Q12 via resistor R43. The drain of Q15 is connected to the node V2 via resistor R41. The heating control terminal S2 is also connected to the gate of the N-channel field-effect transistor Q16 via resistor R44. The source of Q16 is grounded, and the drain is connected to the gate of the N-channel field-effect transistor Q14 via a voltage divider network composed of resistors R30 and R29. The drain of Q14 is connected to the 12V power supply terminal, and the source is connected to the drain of the N-channel field-effect transistor Q17. The source of Q17 is grounded. Specifically, by switching the on and off combinations of each field-effect transistor in the gate drive network through the level state switching of the cooling control terminal S1 or the heating control terminal S2, the potential relationship between node V1 and node V2 relative to ground is changed, thereby realizing the reverse switching of the voltage polarity at both ends of CN-6.

[0041] The air intake space of this ice maker accounts for 20% of the total machine size. This proportion ensures maximum heat dissipation while maintaining a compact design, allowing 90% of the heat to be carried away through the air outlets on the radiator. This ice maker uses semiconductor refrigeration, eliminating the need for refrigerants (such as Freon), thus avoiding leakage and pollution, and is highly environmentally friendly. Moreover, the same device switches between cooling and heating modes via a control circuit driven by a cooling chip, eliminating the need for an additional heating system. It has no compressor, no vibration, no noise, and a long lifespan (no wear). In addition, the insulation layer of this ice-making structure is EPS insulation. Through the insulation layers of the top cover and the ice-making tank, as well as the magnetic structure, a seal is achieved while greatly improving the insulation effect. Under normal use, it can maintain a suitable temperature for a long time to meet actual usage needs. The ice-making tank unit is embedded in the ice-making tank insulation layer, and a TEC chip is sandwiched between the lower ends of both, providing strong heat insulation performance and a reasonable transmission pipeline design to avoid significant loss of cold energy during heat transfer.

[0042] The following is the principle of TEC technology in existing technologies: 1. Basic Definition TEC chip (Thermoelectric Cooler): A solid-state cooling technology based on the Peltier effect, which uses direct current to drive semiconductor materials to achieve directional heat transfer. The model number is TEC1-12707L.

[0043] Peltier effect: refers to the phenomenon that heat absorption or release occurs at the junction when a direct current passes through a thermocouple composed of two different conductors or semiconductor materials.

[0044] 2. Structural characteristics (1) The internal structure consists of multiple N-type and P-type bismuth telluride semiconductors forming an electrical couple.

[0045] (2) Both hot and cold surfaces are covered with a layer of electrical insulator, usually a ceramic plate.

[0046] 3. Working characteristics: (1) When the power is on, the cold end absorbs heat (cooling) and the hot end releases heat (heat dissipation).

[0047] (2) The cooling / heating mode can be switched by reversing the current direction to achieve bidirectional temperature control.

[0048] (3) The temperature difference of a single-stage TEC can reach 60–70℃, and multi-stage stacking can achieve a wide temperature range control from -130℃ to 90℃.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A portable semiconductor ice maker characterized by: The support frame structure (6) includes an ice-making structure (4) installed on the upper end of the support frame structure (6). The ice-making structure (4) includes a TEC chip (44) for making ice. A heat dissipation structure (5) for dissipating heat from the TEC chip (44) is installed below the ice-making structure (4). The heat dissipation structure (5) is installed inside the top of the support frame structure (6). The control box is installed at the bottom of the support frame structure (6), and an interface (7) for powering the control box is provided. The TEC chip (44) and heat dissipation structure (5) are electrically connected to the control box. There is an air intake space between the bottom of the support frame structure (6) and the heat dissipation structure (5), and the height of the air intake space is not less than 1:5 of the whole machine.

2. The portable semiconductor ice maker according to claim 1, characterized in that: It also includes an outer shell (1) and its internal supporting shell (2), upper cover insulation layer (3) and base (9). The upper cover insulation layer (3) for insulating the upper layer of the ice-making structure (4) is installed on the upper part of the supporting shell (2). The base (9) is installed below the supporting shell (2). The supporting shell (2) and the base (9) form a hollow structure. The supporting frame structure (6) is installed inside the hollow structure. Several heat dissipation holes (21) are opened on the surface of the supporting shell (2).

3. The portable semiconductor ice maker according to claim 1, characterized in that: The support frame structure (6) includes two symmetrically arranged support frame bodies. Each support frame body includes an integrally formed cable tray (61), a heat dissipation mounting bracket (62), and a bottom protective cover (63). The top of the cable tray (61) is connected to the ice-making structure (4). The middle of the cable tray (61) is provided with a semi-circular heat dissipation mounting bracket (62), and the bottom of the cable tray (61) is provided with a semi-circular bottom protective cover (63).

4. The portable semiconductor ice maker according to claim 3, characterized in that: The wiring bracket (61) has a wiring groove (64) on one side for wiring the ice-making structure (4), heat dissipation structure (5), and control box. The top of the wiring bracket (61) has a branch groove (65) with mounting holes (66) inside. The heat sink (51) of the heat dissipation structure (5) is installed on the top of the wiring bracket (61) by screws passing through the mounting holes (66). The wiring of the ice-making structure (4), heat dissipation structure (5), and control box passes through the wiring groove (64) from bottom to top and is then split by the branch groove (65).

5. The portable semiconductor ice maker according to claim 3, characterized in that: Two heat dissipation mounting brackets (62) are connected to form a hollow ring structure. The bottom of the hollow ring structure is provided with a ring boss (66) for installing the heat dissipation fan (52) of the heat dissipation structure (5). A heat sink (51) is installed above the heat dissipation fan (52).

6. The portable semiconductor ice maker according to claim 3, characterized in that: Two bottom protective covers (63) are snapped together to form a circular protective cover, and the bottom of the circular protective cover and the base (9) form a receiving space for placing the control box.

7. The portable semiconductor ice maker according to claim 1, characterized in that: The upper cover insulation layer (3) includes an upper cover shell (37) and its internal pull ring cover (31), upper insulation layer lower cover (32), anti-foolproof structure (33), pull ring seal (34), magnetic ring (36) and several positioning posts (35). The upper insulation layer lower cover (32) is installed below the pull ring cover (31), and the ice-making structure (4) is installed below the upper insulation layer lower cover (32). The anti-foolproof structure (33) is installed between the pull ring cover (31) and the upper insulation layer lower cover (32). A pull ring seal (34) is provided on each side of the anti-foolproof structure (33). Four positioning posts (35) are evenly distributed above the upper insulation layer lower cover (32). The outer circumference of the upper insulation layer lower cover (32) is also provided with a circumferential groove for placing the magnetic ring (36). The magnetic ring (36) is used to form a magnetic structure for sealing and heat preservation with the magnetic block (45) on the ice-making structure (4).

8. The portable semiconductor ice maker according to claim 1, characterized in that: The ice-making structure (4) also includes an ice-making support (41), an ice-making tank unit (42), an ice-making tank insulation layer (43), and a TEC chip (44). The top of the ice-making support (41) is evenly distributed with several placement holes for installing magnetic blocks (45). The bottom of the ice-making support (41) is equipped with an ice-making tank insulation layer (43). The ice-making tank insulation layer (43) is a barrel-shaped structure with the opening facing upward. The ice-making tank unit (42) is embedded in the ice-making tank insulation layer (43), and the lower ends of both are provided with TEC chips (44). The bottom of the ice-making tank insulation layer (43) is provided with a hollow structure for accommodating the TEC chip (44). The ice-making tank insulation layer (43) is used to provide a sealed and heat-insulating space. The shape of the ice-making tank unit (42) and the ice-making tank insulation layer (43) are fitted with a gap. The TEC chip (44) is used to make and remove ice from the water in the ice-making tank unit (42).

9. The portable semiconductor ice maker according to claim 8, characterized in that: The surface of the ice-making tank unit (42) is provided with four ice-making tank structures (421), and a refrigeration column (422) is installed inside the ice-making tank structure (421).

10. A method for making ice in a portable semiconductor ice maker, applied to the portable semiconductor ice maker according to any one of claims 1-9, characterized in that: Includes the following steps: S1. The user opens the top cover insulation layer (3), injects an appropriate amount of water into the ice tank structure (421), and then covers the ice tank structure (421). S2. Set the target temperature for ice making to complete. Press the power button (8) to start the TEC chip (44) and heat dissipation structure (5) to begin working. Ice making is completed when the thermistor NTC in the control box detects that the temperature in the ice making tank structure (421) has reached the target temperature. The target temperature setting range is -1℃ to -5℃. The ice-making time is affected by the ambient temperature. When there are 4 ice cubes and each ice cube weighs 5g; When the ambient temperature is 31℃-35℃, the ice-making time is 17min-18min; When the ambient temperature is 26℃-30℃, the ice-making time is 16min-17min; When the ambient temperature is less than or equal to 25℃, the ice-making time is 12-15 minutes; S3. After ice making is completed, the cooling chip drive control circuit of the control box reverses the power supply to heat the TEC chip (44), so that the ice cube is reheated and de-iced.

11. The ice-making method of the portable semiconductor ice maker according to claim 10, characterized in that: The cooling chip drive control circuit includes a first power switch unit, which is connected between the 12V power supply terminal, reference ground GND-1, and node V1. The first power switch unit includes a P-channel field-effect transistor Q1 and an N-channel field-effect transistor Q2. The source of the P-channel field-effect transistor Q1 is connected to the 12V power supply terminal, the drain is connected to node V1, and the gate is grounded through resistor R4. The drain of the N-channel field-effect transistor Q2 is connected to node V1, the source is connected to GND-1, and the gate is connected to the 12V power supply terminal through resistor R5. The second power switching unit is connected between the 12V power supply terminal, reference ground GND-1, and node V2. The second power switching unit includes a P-channel MOSFET Q12 and an N-channel MOSFET Q13. The source of the P-channel MOSFET Q12 is connected to the 12V power supply terminal, the drain is connected to node V2, and the gate is grounded through resistor R27. The drain of the N-channel MOSFET Q13 is connected to node V2, the source is connected to GND-1, and the gate is connected to the 12V power supply terminal through resistor R28. The control signal terminals include a cooling control terminal S1 and a heating control terminal S2. A gate drive network is provided, which couples the cooling control terminal S1 and the heating control terminal S2 to the control loops of the first power switch unit and the second power switch unit, respectively. The gate drive network includes: a first drive branch connected to the cooling control terminal S1, which is connected to the gate of the N-channel field-effect transistor Q7 via resistor R17. The source of Q7 is grounded, and the drain is connected to the gate of Q2 via resistor R25. The drain of Q7 is also connected to node V1 via resistor R24. The cooling control terminal S1 is also connected to the gate of the N-channel field-effect transistor Q8 via a voltage divider network composed of resistors R15 and R11. The drain of Q8 is connected to a 12V power supply via resistor R21, and the source is connected to the drain of the N-channel field-effect transistor Q11. The source of Q11 is grounded. The second drive branch is connected to the heating control terminal S2. The heating control terminal S2 is connected to the gate of the N-channel field-effect transistor Q15 via resistor R42. The source of Q15 is grounded, and the drain is connected to the gate of Q12 via resistor R43. The drain of Q15 is connected to the node V2 via resistor R41. The heating control terminal S2 is also connected to the gate of the N-channel field-effect transistor Q16 via resistor R44. The source of Q16 is grounded, and the drain is connected to the gate of the N-channel field-effect transistor Q14 via a voltage divider network composed of resistors R30 and R29. The drain of Q14 is connected to the 12V power supply terminal, and the source is connected to the drain of the N-channel field-effect transistor Q17. The source of Q17 is grounded. Specifically, by switching the on and off combinations of each field-effect transistor in the gate drive network through the level state switching of the cooling control terminal S1 or the heating control terminal S2, the potential relationship between node V1 and node V2 relative to ground is changed, thereby realizing the reverse switching of the voltage polarity at both ends of CN-6.

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