Water-cooled heat sink

CN122544494APending Publication Date: 2026-08-11KUAN DING INDUSTRIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-11
Publication Date
2026-08-11

AI Technical Summary

Technical Problem

[0003]再者,现有水冷系统虽能达到散热目的,然而,由于循环管路中的水冷液仅靠单个水泵加压,因此水冷液的流速提升有限,使得管路中的水冷液无法更快速地进行热交换,导致无法更有效率地提升散热效率

Benefits of technology

[0012] In one embodiment of this application, the circulation loop assembly includes a water tank, a second outlet pipe, and a second inlet pipe. A second water pump is installed in the water tank. The second outlet pipe is connected to a second outlet, and the second inlet pipe is connected to a second inlet. Compared to the known, the water-cooled heat dissipation device of this application includes a water-cooling radiator and a water-cooling head assembly and a circulation loop assembly connected in parallel. The water-cooling head assembly and the circulation loop assembly are each equipped with a water pump. Furthermore, the water-cooled heat dissipation device includes two circulation loops: a first circulation loop and a second circulation loop. The second circulation loop, which includes the second water pump, has a shorter overall water path distance, thus allowing for rapid circulation to obtain a lower-temperature coolant. Accordingly, the coolant in the second circulation loop cools the high-temperature fluid returning from the first circulation loop after mixing in the water chamber, achieving a first cooling effect before entering the water-cooling radiator for a second cooling effect. This results in a better coolant heat dissipation effect, thereby improving the flow rate and heat dissipation efficiency of the coolant.

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Abstract

This application provides a water-cooled heat dissipation device. The water-cooling radiator includes an inlet chamber, an outlet chamber, a collecting chamber, a first water-cooling pipe, and a second water-cooling pipe. The first water-cooling pipe connects the inlet chamber and the collecting chamber. The second water-cooling pipe connects the collecting chamber and the outlet chamber. The water-cooling head assembly includes a water-cooling head, a first water pump, a first outlet pipe, and a first inlet pipe. The water-cooling head includes a first outlet and a first inlet. The first water pump is disposed within the water-cooling head. The first outlet pipe connects the first outlet and the inlet chamber. The first inlet pipe connects the first inlet and the outlet chamber. The circulation loop assembly includes a water tank, a second water pump, a second outlet pipe, and a second inlet pipe. The water tank includes a second outlet and a second inlet. The second water pump is disposed within the water tank. The second outlet pipe connects the second outlet and the inlet chamber. The second inlet pipe connects the second inlet and the outlet chamber.
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Description

Technical Field

[0001] This application relates to water-cooled heat dissipation devices, and more particularly to a water-cooled device with a water pump. Background Technology

[0002] A water cooling system mainly consists of components such as a water radiator, water cooling head, water pump, and connecting pipes. In general, a water cooling system uses a water cooling head attached to the surface of a heat-generating component to absorb the heat generated. Coolant is then transported to the water radiator through pipes for heat exchange. The water pump pressurizes the system to improve circulation efficiency, thereby achieving the purpose of dissipating heat from the heat-generating component.

[0003] Furthermore, although existing water cooling systems can achieve heat dissipation, the flow rate of the coolant in the circulation pipeline is limited because it is only pressurized by a single water pump. This prevents the coolant in the pipeline from exchanging heat more quickly, resulting in an inability to improve heat dissipation efficiency more effectively.

[0004] In view of this, the applicant has devoted himself to studying the aforementioned prior art and applying theoretical principles to try his best to solve the above-mentioned problems, which has become the target of the applicant's improvement. Summary of the Invention

[0005] One objective of this application is to provide a water-cooled heat dissipation device that increases the flow rate of the coolant and accelerates heat exchange, thereby improving the heat dissipation efficiency of the water-cooled heat dissipation device.

[0006] To achieve the above objectives, this application relates to a water-cooled heat dissipation device, including a water-cooling radiator, a water-cooling head assembly, and a circulation loop assembly. The water-cooling radiator includes an inlet chamber, an outlet chamber, a collecting chamber, a plurality of first water-cooling pipes, and a plurality of second water-cooling pipes. The plurality of first water-cooling pipes connect the inlet chamber and the collecting chamber. The plurality of second water-cooling pipes connect the collecting chamber and the outlet chamber. The water-cooling head assembly is disposed on one side of the water-cooling radiator and includes a water-cooling head and a first water pump. The water-cooling head includes a first outlet and a first inlet. The first water pump is disposed within the water-cooling head and is coupled to the inlet chamber via the first outlet. The first inlet pipe is coupled to the outlet chamber. The circulation loop assembly includes a second water pump, a second outlet coupled to the second water pump, and a second inlet. The second outlet is coupled to the inlet chamber. The second inlet is coupled to the outlet chamber. The first water-cooling pipe includes a first outer water-cooling pipe adjacent to the first water pump and a first inner water-cooling pipe adjacent to the second water pump. The second water-cooling pipe includes a second external water-cooling pipe connected to the first water pump and a second internal water-cooling pipe connected to the second water pump. The first water pump, the inlet chamber, the first external water-cooling pipe, the collecting chamber, the second external water-cooling pipe, and the outlet chamber together form the first circulation loop. The second water pump, the inlet chamber, the first internal water-cooling pipe, the collecting chamber, the second internal water-cooling pipe, and the outlet chamber together form the second circulation loop.

[0007] In one embodiment of this case, the water inlet chamber is located on one side of the first water cooling pipe, and the water outlet chamber is located on one side of the second water cooling pipe. The water inlet chamber and the water outlet chamber are located on the same side and are arranged side by side.

[0008] In one embodiment of this application, the collecting cavity is located on the other side of the first water-cooling pipe and the second water-cooling pipe, and the collecting cavity is located on the opposite side of the water inlet cavity and the water outlet cavity.

[0009] In one embodiment of this application, the water cooling radiator further includes a plurality of fins, which are spaced apart between the first water cooling pipe and the second water cooling pipe.

[0010] In one embodiment of this application, the circulation loop assembly is disposed between the water cooling radiator and the water cooling head assembly.

[0011] In one embodiment of this application, the water cooling head assembly includes a first water outlet pipe and a first water inlet pipe, wherein the first water outlet pipe is connected to a first water outlet and the first water inlet pipe is connected to a first water inlet.

[0012] In one embodiment of this application, the circulation loop assembly includes a water tank, a second outlet pipe, and a second inlet pipe. A second water pump is installed in the water tank. The second outlet pipe is connected to a second outlet, and the second inlet pipe is connected to a second inlet. Compared to the known, the water-cooled heat dissipation device of this application includes a water-cooling radiator and a water-cooling head assembly and a circulation loop assembly connected in parallel. The water-cooling head assembly and the circulation loop assembly are each equipped with a water pump. Furthermore, the water-cooled heat dissipation device includes two circulation loops: a first circulation loop and a second circulation loop. The second circulation loop, which includes the second water pump, has a shorter overall water path distance, thus allowing for rapid circulation to obtain a lower-temperature coolant. Accordingly, the coolant in the second circulation loop cools the high-temperature fluid returning from the first circulation loop after mixing in the water chamber, achieving a first cooling effect before entering the water-cooling radiator for a second cooling effect. This results in a better coolant heat dissipation effect, thereby improving the flow rate and heat dissipation efficiency of the coolant. Attached Figure Description

[0013] Figure 1 This is a plan view of the water-cooled heat dissipation device of this application.

[0014] In the attached figures, the following labels are used:

[0015] 1: Water-cooled heat dissipation device

[0016] 100: First loop

[0017] 200: Second loop

[0018] 10: Water-cooled radiator

[0019] 11:Enter the water cavity

[0020] 12: Water outlet chamber

[0021] 13: Converging cavity

[0022] 14: First water-cooling pipe

[0023] 14a: First external water cooling pipe

[0024] 14b: First internal water cooling pipe

[0025] 15: Second water-cooling pipe

[0026] 15a: Second external water cooling pipe

[0027] 15b: Second internal water cooling pipe

[0028] 16: Fins

[0029] 20: Water cooling head assembly

[0030] 21: Water cooling block

[0031] 211: First outlet

[0032] 212: First water inlet

[0033] 22: First water pump

[0034] 23: First water outlet pipe

[0035] 24: First water inlet pipe

[0036] 30: Circulation loop component

[0037] 31: Water tank

[0038] 311: Second outlet

[0039] 312: Second water inlet

[0040] 32: Second water pump

[0041] 33: Second water outlet pipe

[0042] 34: Second water inlet pipe Detailed Implementation

[0043] The detailed description and technical content of this application are explained below with reference to the accompanying drawings. However, the accompanying drawings are provided for reference and illustration only and are not intended to limit this application.

[0044] Please refer to Figure 1 This is a plan view of the water-cooled heat dissipation device of this application. The water-cooled heat dissipation device 1 of this application includes a water-cooling radiator 10, a water-cooling head assembly 20, and a circulation loop assembly 30. The water-cooling head assembly 20 and the circulation loop assembly 30 are arranged in parallel to connect to the water-cooling radiator 10, thereby constituting the water-cooled heat dissipation device 1. The water-cooled heat dissipation device 1 is described in more detail below.

[0045] The water-cooled radiator 10 includes a water inlet chamber 11, a water outlet chamber 12, a collecting chamber 13, a plurality of first water-cooled pipes 14, and a plurality of second water-cooled pipes 15. The plurality of first water-cooled pipes 14 are arranged at intervals and connect the water inlet chamber 11 and the collecting chamber 13. The plurality of second water-cooled pipes 15 are arranged at intervals and connect the collecting chamber 13 and the water outlet chamber 12.

[0046] Specifically, the water inlet chamber 11 is located on one side of the plurality of first water-cooling pipes 14, and the water outlet chamber 12 is located on one side of the plurality of second water-cooling pipes 15. The water inlet chamber 11 and the water outlet chamber 12 are located on the same side and are arranged side by side. Furthermore, the collecting chamber 13 is located on the other side of the plurality of first water-cooling pipes 14 and the plurality of second water-cooling pipes 15, and the collecting chamber 13 is located on the opposite side of the water inlet chamber 11 and the water outlet chamber 12.

[0047] In this embodiment, the water cooling radiator 10 further includes a plurality of fins 16. The plurality of fins are spaced apart between the plurality of first water cooling pipes 14 and the plurality of second water cooling pipes 15, thereby increasing the heat dissipation area of ​​the water cooling radiator 10 and improving the heat dissipation efficiency.

[0048] The water-cooling head assembly 20 is disposed on one side of the water-cooling radiator 10 and includes a water-cooling head 21, a first water pump 22, a first outlet pipe 23, and a first inlet pipe 24. The water-cooling head assembly 21 includes a first outlet 211 and a first inlet 212. The first water pump 22 is disposed in the water-cooling head 21. The first outlet pipe 23 connects the first outlet 211 and the inlet chamber 11. The first inlet pipe 24 connects the first inlet 212 and the outlet chamber 12.

[0049] The circulation loop assembly 30 is disposed between the water-cooled radiator 10 and the water-cooled head assembly 20, and includes a water tank 31, a second water pump 32, a second water outlet pipe 33, and a second water inlet pipe 34. The water tank 31 includes a second water outlet 311 and a second water inlet 312. The second water pump 32 is disposed in the water tank 31. Furthermore, the second water outlet pipe 33 connects the second water outlet 311 and the water inlet chamber 11. The second water inlet pipe 34 connects the second water inlet 312 and the water outlet chamber 12.

[0050] It should be noted that the plurality of first water-cooling pipes 14 include a first external water-cooling pipe 14a connected to the first water pump 22 and a first internal water-cooling pipe 14b connected to the second water pump 32. Furthermore, the plurality of second water-cooling pipes 15 include a second external water-cooling pipe 15a connected to the first water pump 22 and a second internal water-cooling pipe 15b connected to the second water pump 32. Moreover, the first water pump 22, the water inlet chamber 11, the plurality of first external water-cooling pipes 14a, the collecting chamber 13, the plurality of second external water-cooling pipes 15a, and the water outlet chamber 12 together form a first circulation loop 100. In addition, the second water pump 32, the water inlet chamber 11, the plurality of first internal water-cooling pipes 14b, the collecting chamber 13, the plurality of second internal water-cooling pipes 15b, and the water outlet chamber 12 together form a second circulation loop 200.

[0051] In use, the water-cooled heat dissipation device 1 of this invention has its water-cooling head 21 of the water-cooling head assembly 20 attached to a heat-generating component (not shown), and the coolant circulates within the water-cooled heat dissipation device 1 to dissipate heat from the heat-generating component. In actual use, after absorbing heat from the heat-generating component, the coolant flows out from the first outlet 211 and then into the inlet chamber 11 through the first outlet pipe 23. Furthermore, the coolant flows out from the inlet chamber 11 and into the plurality of first water-cooling pipes 14. At this time, the heat of the coolant dissipates through the first water-cooling pipes 14 and the plurality of fins 16, thereby reducing the temperature.

[0052] Subsequently, the coolant flows out from the first water-cooling pipe 14 and into the collecting chamber 13, then flows out from the collecting chamber 13 and into the second water-cooling pipe 15. At this time, the heat of the coolant will dissipate through the second water-cooling pipe 15 and the multiple fins 16 to further reduce the temperature. Next, the coolant flows from the second water-cooling pipe 15 into the outlet chamber 12. After flowing out of the outlet chamber 12, the coolant enters the first inlet 212 through the first inlet pipe 24, and finally flows back to the water cooling head 21, where it undergoes the next heat exchange cycle under the pressurization of the first water pump 22.

[0053] It should be noted that after the coolant flows out of the second water cooling pipe 15, some of the coolant will pass through the second water inlet pipe 34 and enter the water tank 31 from the second water inlet 312. Under the pressure of the second water pump 32, it will flow out from the second water outlet 311 and then flow into the plurality of first water cooling pipes 14 through the second water outlet pipe 33 to accelerate the reduction of the coolant temperature.

[0054] It should also be noted that the water-cooled heat dissipation device 1 in this case includes two circulation loops: a first circulation loop and a second circulation loop. The second circulation loop, which includes a second water pump, has a shorter overall water path distance, allowing for rapid circulation to obtain a lower-temperature coolant. Accordingly, the coolant in the second circulation loop first cools the high-temperature fluid returning from the first circulation loop after mixing with it in the water chamber, and then it enters the water radiator for a second cooling, thus achieving a better coolant heat dissipation effect.

[0055] The above description is merely a preferred embodiment of this case and is not intended to define the scope of the patent in this case. Other equivalent variations that utilize the spirit of the patent in this case should all fall within the scope of the patent in this case.

Claims

1. A water-cooled heat dissipation device, comprising: A water-cooled radiator includes a water inlet chamber, a water outlet chamber, a collecting chamber, a plurality of first water-cooled pipes and a plurality of second water-cooled pipes, wherein the plurality of first water-cooled pipes are connected to the water inlet chamber and the collecting chamber, and the plurality of second water-cooled pipes are connected to the collecting chamber and the water outlet chamber. A water-cooling head assembly, disposed on one side of the water-cooling radiator, includes a water-cooling head and a first water pump. The water-cooling head includes a first water outlet and a first water inlet. The first water pump is disposed within the water-cooling head. The first water outlet is coupled to the water inlet chamber, and the first water inlet is coupled to the water outlet chamber. A circulation loop assembly includes a second water pump, a second outlet and a second inlet coupled to the second water pump, the second outlet being coupled to the inlet chamber and the second inlet being coupled to the outlet chamber; in, The plurality of first water-cooled pipes include a first external water-cooled pipe connected to the first water pump and a first internal water-cooled pipe connected to the second water pump; the plurality of second water-cooled pipes include a second external water-cooled pipe connected to the first water pump and a second internal water-cooled pipe connected to the second water pump. The first water pump, the inlet chamber, the plurality of first external water-cooling pipes, the collecting chamber, the plurality of second external water-cooling pipes, and the outlet chamber together form a first circulation loop; and The second water pump, the water inlet chamber, the plurality of first internal water-cooling pipes, the collecting chamber, the plurality of second internal water-cooling pipes, and the water outlet chamber together form a second circulation loop.

2. The water-cooled heat dissipation device as claimed in claim 1, wherein the water inlet chamber is located on one side of the plurality of first water-cooling pipes, the water outlet chamber is located on one side of the plurality of second water-cooling pipes, and the water inlet chamber and the water outlet chamber are located on the same side and are arranged side by side.

3. The water-cooled heat dissipation device as claimed in claim 2, wherein the collecting cavity is located on the other side of the plurality of first water-cooling pipes and the plurality of second water-cooling pipes, and the collecting cavity is located on the opposite side of the water inlet cavity and the water outlet cavity.

4. The water-cooled heat dissipation device as claimed in claim 1, wherein the water-cooling radiator further includes a plurality of fins, the plurality of fins being spaced apart between the plurality of first water-cooling pipes and the plurality of second water-cooling pipes.

5. The water-cooled heat dissipation device as claimed in claim 1, wherein the circulation loop assembly is disposed between the water-cooling radiator and the water-cooling head assembly.

6. The water-cooled heat dissipation device as claimed in claim 1, wherein the water cooling head assembly includes a first water outlet pipe and a first water inlet pipe, the first water outlet pipe being connected to the first water outlet and the first water inlet pipe being connected to the first water inlet.

7. The water-cooled heat dissipation device as claimed in claim 1, wherein the circulation loop assembly includes a water tank, a second water outlet pipe and a second water inlet pipe, the second water pump is disposed in the water tank, the second water outlet pipe is connected to the second water outlet, and the second water inlet pipe is connected to the second water inlet.