A bernoulli quartz chuck detection device

Abstract

This invention relates to the field of fluid leak detection technology and proposes a Bernoulli quartz suction cup detection device. The device includes a detection preparation module, a simulated air supply module, a static adsorption verification module, a dynamic movement simulation module, and a comprehensive judgment module. The suction cup to be tested is installed on a swing arm and the adsorption surface is leveled, sealing the airflow output end of the detection station. Pressure and flow parameters are set according to the end-user's environment to simulate air supply to the suction cup. A standard wafer is statically adsorbed, and the first physical state information, such as stable adsorption, shaking, swaying, and rotation, is monitored. The swing arm is driven to move, simulating the working conditions, and the second physical state information, such as wafer swaying, rotation, and falling, is monitored. The two types of physical state information are integrated and comprehensively analyzed to obtain the suction cup detection result, enabling a comprehensive and accurate assessment of the suction cup performance. This invention can improve the efficiency of Bernoulli quartz suction cup detection devices.

Description

Technical Field

[0001] This invention relates to the field of fluid leak detection technology, and in particular to a Bernoulli quartz suction cup detection device. Background Technology

[0002] Existing Bernoulli quartz suction cup testing technology cannot accurately determine the appropriate air supply pressure and airflow parameters based on the actual usage scenarios of end customers. The air supply conditions used in the testing process deviate significantly from the actual air supply environment of the suction cup during on-site operation, failing to fully reproduce the air supply status of the suction cup in practical applications. Current testing methods do not continuously and sequentially collect pressure and flow rates throughout the entire air supply process, nor do they compare the collected actual air supply data with the dynamic parameter range used by the end user. This fails to guarantee that the tested air supply conditions are completely consistent with the actual usage environment, resulting in test results that do not accurately reflect the actual air supply adaptability of the suction cup. The authenticity and application reference value of the test data are severely lacking.

[0003] Current Bernoulli quartz chuck inspection methods can only verify the static adsorption state of the chuck, failing to simulate dynamic conditions such as horizontal left-right and horizontal forward-backward movements during actual wafer pick-up and transfer operations. They cannot capture in real-time key physical state information such as wafer displacement and angular deflection during dynamic movement. Existing inspection methods do not integrate static adsorption and dynamic movement data for analysis, resulting in a single and incomplete inspection dimension. They cannot accurately identify hidden anomalies such as internal airway blockages or leaks, nor can they effectively determine operational faults such as wafer shaking, rotation, or falling during movement. The accuracy and completeness of the inspection are insufficient, and the overall inspection efficiency cannot meet the production quality inspection and practical application requirements of quartz chucks. Summary of the Invention

[0004] This invention provides a Bernoulli quartz suction cup testing device, characterized in that the device includes a testing preparation module, a simulated gas supply module, a static adsorption verification module, a dynamic movement simulation module, and a comprehensive judgment module, wherein:

[0005] The detection preparation module is used to install the Bernoulli quartz suction cup to be tested onto the suction cup mounting arm, and adjust the adsorption surface of the Bernoulli quartz suction cup to a horizontal state through the adjustment mechanism, and seal and connect the airflow output end of the detection station with the air inlet of the Bernoulli quartz suction cup. The simulated air supply module is used to determine the pressure range and airflow rate of the detection station output according to the end customer's usage environment, and to simulate air supply to the Bernoulli quartz chuck. The static adsorption verification module is used to adsorb a standard wafer under a Bernoulli quartz chuck under simulated gas supply conditions and monitor the first physical state information of the standard wafer under static adsorption. The first physical state information includes whether it is stably adsorbed and whether there is shaking, swaying or rotation. The dynamic movement simulation module is used to monitor the second physical state information of the standard wafer during the movement process under simulated gas supply conditions, with the additional suction cup mounting swing arm as the movement condition. The second physical state information includes whether shaking, rotation or falling occurs. The comprehensive judgment module is used to comprehensively judge the Bernoulli quartz chuck based on the first physical state information and the second physical state information, and obtain the detection result of the Bernoulli quartz chuck.

[0006] Preferably, when the detection preparation module is used to install the Bernoulli quartz suction cup to be tested onto the suction cup mounting arm, adjust the adsorption surface of the Bernoulli quartz suction cup to a horizontal state through the adjustment mechanism, and seal the airflow output end of the detection station with the air inlet of the Bernoulli quartz suction cup, it is specifically used for: The Bernoulli quartz chuck to be tested is placed on the mounting reference surface of the chuck mounting arm, and the positioning features are used to position the Bernoulli quartz chuck and the chuck mounting arm in a predetermined relative position. The posture of the suction cup mounting arm is adjusted by the adjustment mechanism, while the deviation between the adsorption surface of the Bernoulli quartz suction cup and the horizontal direction is detected until the deviation is eliminated and the adsorption surface is in a horizontal state. Connect the airflow output end of the testing station to the air inlet of the Bernoulli quartz chuck, and apply a sealing force to create an airtight connection at the connection point.

[0007] Preferably, when the simulated gas supply module determines the pressure range and airflow rate of the detection station output based on the end-user's usage environment, it is specifically used for: To obtain the dynamic range of air supply pressure and airflow rate changes when end customers actually use Bernoulli quartz chucks. Set the dynamic range of gas supply pressure to the pressure range output by the detection station, and set the dynamic range of airflow to the flow range output by the detection station.

[0008] Preferably, when the simulated air supply module performs simulated air supply to the Bernoulli quartz chuck, it is specifically used for: During the process of supplying air to the Bernoulli quartz suction cup, the actual pressure value and actual flow rate value output by the detection station are continuously collected and collected to form the air supply pressure time sequence and the air supply flow rate time sequence. The gas supply pressure time series is compared with the pressure range, and the gas supply flow time series is compared with the flow range; If the actual pressure value and the actual flow rate value are within the pressure range and flow rate range at all times throughout the entire gas supply process, then the simulated gas supply is determined to be consistent with the end customer's usage environment.

[0009] Preferably, when the static adsorption verification module performs the operation of adsorbing a standard wafer under a Bernoulli quartz chuck under simulated gas supply conditions and monitoring the first physical state information of the standard wafer under static adsorption, it is specifically used for: Under simulated gas supply conditions, the gas flow distribution of multiple flow paths inside the Bernoulli quartz chuck and the gap pressure distribution at multiple locations between the lower surface of the standard wafer and the Bernoulli quartz chuck when the wafer is adsorbed were obtained. By correlating and integrating the gas flow rate distribution and the gap pressure distribution at the same moment, a static adsorption feature set of a standard wafer is obtained.

[0010] Preferably, when the static adsorption verification module performs the correlation and integration of the gas flow rate distribution and gap pressure distribution at the same moment to obtain the static adsorption feature set of the standard wafer, it is specifically used for: Based on the static air path feature set, determine whether there is air path blockage or leakage abnormality in the Bernoulli quartz chuck. Within the standard vacuum pressure range, the static gas path characteristic concentrated gas supply pressure value and regional flow rate value are compared with the preset standard gas supply pressure range and standard flow rate range, respectively. If all comparison results are within the corresponding range, the static gas path is determined to be normal, a static qualified intermediate signal is generated, and it is combined with the static adsorption feature set to form the first physical state information of the standard wafer.

[0011] Preferably, when the dynamic movement simulation module is used under simulated air supply conditions and the additional suction cup mounting arm is in a moving condition, it is specifically used for: While maintaining continuous output of simulated gas supply conditions, the first hinge in the hinge structure set on the swing arm by the suction cup causes the swing arm to move left and right in the horizontal direction, carrying the suction cup and the standard wafer being adsorbed. The combination of the first hinge, the second hinge, and the third hinge in the hinge structure allows the swing arm to move back and forth horizontally along the suction cup and the standard wafer being suctioned, simulating the movement scenario when the client picks up the wafer.

[0012] Preferably, when the dynamic movement simulation module executes the second physical state information monitoring of the standard wafer during movement, it is specifically used for: During the process of moving the standard wafer with the chuck mounting arm, the dynamic displacement and dynamic angle characteristics of the standard wafer relative to the Bernoulli quartz chuck are acquired in real time at multiple different moving stages. The dynamic displacement features and dynamic angle features are correlated in the order of movement time, and the correlated movement response feature sequence is used as the second physical state information. Based on the second physical state information, it is determined whether the dynamic displacement characteristics under different movement stages exceed the preset allowable parameter range, so as to determine whether the standard wafer is shaking, rotating or falling.

[0013] Preferably, when the dynamic movement simulation module performs the task of determining whether the dynamic displacement characteristics at different movement stages exceed the preset allowable parameter range based on the second physical state information, in order to determine whether the standard wafer is shaking, rotating, or falling, it is specifically used for: The movement period is divided into multiple movement stages according to the change nodes of movement direction or movement speed. The minimum value of real-time vertical height, the fluctuation range of real-time horizontal offset, and the cumulative change of real-time deflection angle are extracted in each movement stage. The values ​​extracted in each movement stage are compared with the pre-set lower limit of vertical height, upper limit of fluctuation range, and upper limit of cumulative change for the corresponding stage. If the lowest real-time vertical height during any movement phase is lower than the lower limit of the allowable vertical height, a fall is determined to have occurred. If the fluctuation of the real-time horizontal offset exceeds the upper limit of the allowable fluctuation range during any movement phase, it is determined that a sway has occurred. If the cumulative change in the real-time deflection angle exceeds the upper limit of the allowable cumulative change during any movement phase, then rotation is determined to have occurred.

[0014] Preferably, when the comprehensive judgment module performs a comprehensive judgment on the Bernoulli quartz chuck based on the first physical state information and the second physical state information to obtain the detection result of the Bernoulli quartz chuck, it is specifically used for: The results of stable adsorption, no shaking, no swaying, and no rotation are collected from the first physical state information, and the results of no swaying, no rotation, and no falling are collected from the second physical state information. If all judgment results meet the requirements, the qualified comprehensive judgment result will be taken as the test result; If any judgment result is that the requirements are not met, the overall judgment result is unqualified, and the corresponding abnormality type is extracted from the judgment result that does not meet the requirements as a component of the test result.

[0015] As can be seen from the above technical solution, the Bernoulli quartz suction cup detection device provided by the present invention has the following beneficial effects: 1. This invention can accurately match the actual usage scenarios of end customers, automatically determine the appropriate dynamic range of gas supply pressure and gas flow rate, continuously collect actual pressure and flow rate data throughout the entire gas supply detection process, form a complete time sequence and complete full-process verification, ensuring that the gas supply conditions are highly consistent with the actual application environment. At the same time, it accurately collects the gas flow distribution of each flow path inside the suction cup and the pressure distribution of the wafer adsorption gap, and integrates the flow rate and pressure data to form a complete static adsorption feature set, effectively identifying abnormal problems such as gas path blockage and gas path leakage, generating accurate static qualified intermediate signals, comprehensively improving the accuracy and stability of static adsorption detection, and ensuring the reliable execution of the static detection process.

[0016] 2. This invention utilizes a multi-hinge structure with a suction cup mounting arm to simulate horizontal left-right and horizontal forward-backward movements during actual wafer handling. During dynamic movement, it collects real-time dynamic displacement and angle characteristics of the wafer, forming a complete sequence of movement response characteristics in chronological order. This accurately determines the wafer's swaying, rotation, and falling states, comprehensively integrating static adsorption and dynamic movement physical state information for integrated analysis. It clearly outputs a pass / fail conclusion or specific anomaly type, achieving systematization and standardization of the testing process. This comprehensively improves the comprehensiveness, accuracy, and efficiency of testing, ensuring that the test results accurately reflect the actual application performance of the suction cup and enhancing the overall quality of product testing. Attached Figure Description

[0017] Other objects and results of the invention will become more apparent and readily understood by referring to the following description taken in conjunction with the accompanying drawings, and with a more complete understanding of the invention. In the drawings: Figure 1 This is a system architecture diagram of a Bernoulli quartz suction cup detection device provided in an embodiment of the present invention. Detailed Implementation

[0018] Existing Bernoulli quartz chuck detection technology cannot match the actual gas supply environment used by end customers. It cannot accurately determine the appropriate dynamic range of pressure and flow, nor can it continuously collect and verify the pressure and flow throughout the entire gas supply process. Therefore, there is a discrepancy between the gas supply conditions and the actual application scenario. Current static adsorption detection can only observe whether the wafer is adsorbed; it cannot collect the gas flow distribution inside the chuck or the pressure distribution in the wafer adsorption gap, and cannot correlate them to form a complete static adsorption characteristic. It also cannot identify hidden anomalies such as gas path blockage or leakage, resulting in static detection results lacking accuracy and reliability.

[0019] Current Bernoulli quartz chuck inspection methods lack dynamic movement simulation capabilities, failing to recreate the actual horizontal movement conditions during wafer pickup and transfer. They cannot acquire real-time data on wafer displacement and angular changes during movement, and cannot identify dynamic anomalies such as wafer wobbling, rotation, or dropping. Existing inspection methods do not integrate static and dynamic data analysis, relying solely on a single inspection dimension. This results in a limited overall assessment of the chuck's performance, limited inspection coverage, and a simplistic judgment logic. Consequently, the overall inspection efficiency and accuracy fail to meet practical quality inspection requirements.

[0020] To address the aforementioned problems, this invention provides a Bernoulli quartz suction cup detection device. The specific embodiments of this invention will be described in detail below with reference to the accompanying drawings.

[0021] To illustrate the Bernoulli quartz chuck detection device provided by the present invention Figure 1 An exemplary illustration of a Bernoulli quartz suction cup detection device according to an embodiment of the present invention is provided.

[0022] The following description of exemplary embodiments is merely illustrative and is in no way intended to limit the invention or its application or use. Techniques and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques and equipment should be considered part of the specification.

[0023] like Figure 1 The figure shown is a system architecture diagram of a Bernoulli quartz suction cup detection device provided in an embodiment of the present invention.

[0024] The Bernoulli quartz suction cup testing device of the present invention may include a testing preparation module, a simulated gas supply module, a static adsorption verification module, a dynamic movement simulation module, and a comprehensive judgment module, wherein: The detection preparation module is used to install the Bernoulli quartz suction cup to be tested onto the suction cup mounting arm, and adjust the adsorption surface of the Bernoulli quartz suction cup to a horizontal state through the adjustment mechanism, and seal and connect the airflow output end of the detection station with the air inlet of the Bernoulli quartz suction cup. In this embodiment of the invention, the detection preparation module, when performing the following steps: installing the Bernoulli quartz suction cup to be detected onto the suction cup mounting arm, adjusting the adsorption surface of the Bernoulli quartz suction cup to a horizontal state via an adjustment mechanism, and sealing the airflow output end of the detection station with the air inlet of the Bernoulli quartz suction cup, is specifically used for: The Bernoulli quartz chuck to be tested is placed on the mounting reference surface of the chuck mounting arm, and the positioning features are used to position the Bernoulli quartz chuck and the chuck mounting arm in a predetermined relative position. The posture of the suction cup mounting arm is adjusted by the adjustment mechanism, while the deviation between the adsorption surface of the Bernoulli quartz suction cup and the horizontal direction is detected until the deviation is eliminated and the adsorption surface is in a horizontal state. Connect the airflow output end of the testing station to the air inlet of the Bernoulli quartz chuck, and apply a sealing force to create an airtight connection at the connection point.

[0025] The Bernoulli quartz chuck to be tested is placed stably on the mounting reference surface of the chuck mounting arm, which has been calibrated for flatness, without tilting or offset. The positioning boss and positioning groove on the chuck mounting arm, which are pre-set according to the outer dimensions of the Bernoulli quartz chuck, cooperate with each other to form positioning features. The outer peripheral edge of the Bernoulli quartz chuck is completely and tightly fitted with the mating surfaces of the positioning boss and positioning groove without gaps or misalignment, so that the Bernoulli quartz chuck and the chuck mounting arm always maintain the preset fixed assembly relative position, ensuring the consistency of the mounting reference for subsequent testing.

[0026] The adjustment mechanism uses an electric drive to drive the suction cup mounting arm to perform multi-dimensional continuous attitude deflection adjustment. The horizontal detection element is in close contact with the adsorption surface of the Bernoulli quartz suction cup and continuously collects the three-dimensional orientation information of the adsorption surface. The real-time collected three-dimensional orientation information of the adsorption surface is compared with the three-dimensional orientation information of the preset standard horizontal reference surface of the equipment dimension by dimension. When the orientation information of all dimensions of the adsorption surface completely coincides with the orientation information of all dimensions of the preset horizontal reference surface, all driving actions of the adjustment mechanism are immediately stopped, so that the adsorption surface of the Bernoulli quartz suction cup is stably kept in an absolutely horizontal state without any tilt or deflection.

[0027] Driven by a linear drive mechanism, the airflow output end of the testing station moves smoothly along a straight line perpendicular to the end face of the Bernoulli quartz chuck inlet until the airflow output end port is precisely aligned with the Bernoulli quartz chuck inlet port port and completes a seamless docking. After docking, a constant and stable contact pressure is applied along the docking axis of the airflow output end and the inlet as a sealing force. This sealing force ensures that the annular contact end face of the airflow output end and the inlet is completely and tightly fitted, with no tiny gas leakage gaps between the contact surfaces. Finally, a completely sealed and airtight connection docking state is formed at the docking position of the airflow output end and the inlet.

[0028] The simulated air supply module is used to determine the pressure range and airflow rate of the detection station output according to the end customer's usage environment, and to simulate air supply to the Bernoulli quartz chuck. In this embodiment of the invention, when the simulated gas supply module determines the pressure range and airflow rate of the detection station output based on the end-user's usage environment, it is specifically used for: To obtain the dynamic range of air supply pressure and airflow rate changes when end customers actually use Bernoulli quartz chucks. Set the dynamic range of gas supply pressure to the pressure range output by the detection station, and set the dynamic range of airflow to the flow range output by the detection station.

[0029] When the simulated air supply module performs simulated air supply to the Bernoulli quartz chuck, it is specifically used for: During the process of supplying air to the Bernoulli quartz suction cup, the actual pressure value and actual flow rate value output by the detection station are continuously collected and collected to form the air supply pressure time sequence and the air supply flow rate time sequence. The gas supply pressure time series is compared with the pressure range, and the gas supply flow time series is compared with the flow range; If the actual pressure value and the actual flow rate value are within the pressure range and flow rate range at all times throughout the entire gas supply process, then the simulated gas supply is determined to be consistent with the end customer's usage environment.

[0030] In the actual air supply circuit of the Bernoulli quartz suction cup at the end customer's site, the pressure acquisition component is tightly installed on the pipeline section between the air supply source and the air inlet of the Bernoulli quartz suction cup. This covers the entire operating cycle of the suction cup from start-up air supply, stable adsorption to stop air supply, continuously collecting air supply pressure data at every moment. After reviewing all pressure data throughout the entire operation, the minimum and maximum boundary points are determined. Using the minimum boundary point as the lower limit and the maximum boundary point as the upper limit, the dynamic range of air supply pressure variation when the end customer actually uses the Bernoulli quartz suction cup is formed. In the same end customer's actual air supply circuit, the flow acquisition component is coaxially installed on the pipeline section where the pressure acquisition component is located. This synchronously collects airflow data throughout the entire operating cycle of the suction cup. After reviewing all flow data throughout the entire operation, the minimum and maximum boundary points are determined. Using the minimum boundary point as the lower limit and the maximum boundary point as the upper limit, the dynamic range of airflow variation when the end customer actually uses the Bernoulli quartz suction cup is formed.

[0031] By adjusting the gas supply parameters at the testing station, the dynamic range of gas supply pressure actually used by the end customer is directly imported into the output parameter configuration module of the testing station. The lower limit of the gas pressure output by the testing station is set as the minimum boundary value of the dynamic range of gas supply pressure, and the upper limit of the gas pressure output by the testing station is set as the maximum boundary value of the dynamic range of gas supply pressure. This ensures that the numerical range of the output pressure at the testing station completely coincides with the dynamic range of gas supply pressure without deviation. Similarly, by adjusting the gas supply parameters at the same testing station, the dynamic range of airflow rate actually used by the end customer is directly imported into the output parameter configuration module of the testing station. The lower limit of the airflow rate output by the testing station is set as the minimum boundary value of the dynamic range of airflow rate, and the upper limit of the airflow rate output by the testing station is set as the maximum boundary value of the dynamic range of airflow rate. This ensures that the numerical range of the output flow rate at the testing station completely coincides with the dynamic range of airflow rate without deviation.

[0032] Throughout the entire process of the testing station continuously and stably supplying gas to the installed Bernoulli quartz suction cup according to the set pressure and flow range, the pressure acquisition component installed at the airflow output end of the testing station collects the actual pressure value of the output end at fixed and equal time intervals, completing the full-time collection without interruption or omission. The flow acquisition component installed at the airflow output end of the same testing station maintains the same fixed time interval as the pressure acquisition component and synchronously collects the actual flow value of the output end. All the actual pressure values ​​collected in chronological order are arranged in order of collection time from first to last to form a continuous and complete gas supply pressure time sequence, and all the actual flow values ​​collected in chronological order are arranged in order of collection time from first to last to form a continuous and complete gas supply flow time sequence.

[0033] The actual pressure value corresponding to each independent acquisition time point in the gas supply pressure time sequence is retrieved one by one. This value is then compared with the minimum and maximum boundary values ​​of the preset detection station pressure range to confirm whether the value is between the two boundary values. The verification of pressure values ​​at all time points is completed sequentially. Similarly, the actual flow rate value corresponding to each independent acquisition time point in the gas supply flow time sequence is retrieved one by one. This value is then compared with the minimum and maximum boundary values ​​of the preset detection station flow rate range to confirm whether the value is between the two boundary values. The verification of flow rate values ​​at all time points is completed sequentially.

[0034] Throughout the continuous gas supply process at the testing station, the actual pressure values ​​at all sampling points within the gas supply pressure time series are within the minimum and maximum boundary values ​​of the preset pressure range, with no value exceeding the range. Simultaneously, the actual flow values ​​at all sampling points within the gas supply flow time series are within the minimum and maximum boundary values ​​of the preset flow range, with no value exceeding the range. When both conditions are met, it is officially determined that the simulated gas supply status of the testing station is completely consistent with the actual usage environment of the end customer.

[0035] The static adsorption verification module is used to adsorb a standard wafer under a Bernoulli quartz chuck under simulated gas supply conditions and monitor the first physical state information of the standard wafer under static adsorption. The first physical state information includes whether it is stably adsorbed and whether there is shaking, swaying or rotation. In this embodiment of the invention, when the static adsorption verification module performs the task of adsorbing a standard wafer under a Bernoulli quartz chuck under simulated gas supply conditions and monitoring the first physical state information of the standard wafer under static adsorption, it is specifically used for: Under simulated gas supply conditions, the gas flow distribution of multiple flow paths inside the Bernoulli quartz chuck and the gap pressure distribution at multiple locations between the lower surface of the standard wafer and the Bernoulli quartz chuck when the wafer is adsorbed were obtained. By correlating and integrating the gas flow rate distribution and the gap pressure distribution at the same moment, a static adsorption feature set of a standard wafer is obtained.

[0036] When the static adsorption verification module correlates and integrates the gas flow rate distribution and gap pressure distribution at the same moment to obtain the static adsorption feature set of the standard wafer, it is specifically used for: Based on the static air path feature set, determine whether there is air path blockage or leakage abnormality in the Bernoulli quartz chuck. Within the standard vacuum pressure range, the static gas path characteristic concentrated gas supply pressure value and regional flow rate value are compared with the preset standard gas supply pressure range and standard flow rate range, respectively. If all comparison results are within the corresponding range, the static gas path is determined to be normal, a static qualified intermediate signal is generated, and it is combined with the static adsorption feature set to form the first physical state information of the standard wafer.

[0037] Under the premise of maintaining a stable output with no fluctuations in pressure and flow under simulated gas supply conditions, high-precision flow acquisition elements are densely deployed at the inlet and outlet ports of each independent gas flow path inside the Bernoulli quartz chuck. All flow acquisition elements are synchronously activated with the same clock reference to acquire gas flow data for the corresponding independent flow path in real time. The flow data of all flow paths are then systematically organized and summarized according to the layout and arrangement of the paths inside the chuck, forming a complete and traceable gas flow distribution of multiple flow paths inside the Bernoulli quartz chuck. Multiple preset detection points, including the central region, circumferential edge region, and transition region from the center to the edge between the lower surface of the wafer and the horizontal adsorption surface of the Bernoulli quartz chuck, are densely equipped with high-precision pressure acquisition elements. All pressure acquisition elements and flow acquisition elements are synchronized with each other using the same clock reference to acquire gas pressure data at the corresponding detection points in real time. The pressure data of all detection positions are then organized and summarized according to the spatial coordinates and distribution order to form the gap pressure distribution at multiple locations between the lower surface of the standard wafer and the adsorption surface of the Bernoulli quartz chuck when the wafer is stably adsorbed.

[0038] In the complete process of simulating gas supply, the same time node with completely consistent sampling time is selected. At this time node, the gas flow distribution inside the Bernoulli quartz chuck and the gap pressure distribution of the standard wafer adsorption gap are precisely matched one by one according to the spatial correspondence between the flow path and the gap detection point. All the gas flow distribution data and all the gap pressure distribution data after spatial matching are integrated without omission to form a complete data set containing both flow and pressure dimensions. This integrated dual-dimensional data set is the static adsorption feature set of the standard wafer in the static adsorption state.

[0039] The system retrieves gas flow data from all independent flow paths of the Bernoulli quartz chuck and pressure data from all detection locations in the adsorption gap, all contained in the static gas path feature set. It then precisely compares the gas flow data for each independent flow path with the device's preset gas path unobstructed baseline flow rate, and the pressure data for each gap detection location with the device's preset gas path sealing baseline pressure. If the gas flow data for any flow path fails to reach the preset gas path unobstructed baseline flow rate, the Bernoulli quartz chuck is directly determined to have a gas path blockage abnormality. Similarly, if the pressure data for any gap detection location fails to reach the preset gas path sealing baseline pressure, the Bernoulli quartz chuck is directly determined to have a gas path leakage abnormality.

[0040] The environmental conditions for static adsorption detection are strictly limited within the preset standard vacuum pressure range of the equipment. The real-time gas supply pressure value recorded in the static gas path feature set is retrieved, and the gas supply pressure value is compared precisely with the minimum and maximum boundary values ​​of the preset standard gas supply pressure range of the equipment. The regional flow rate value corresponding to each detection area recorded in the static gas path feature set is retrieved, and the regional flow rate value is compared precisely with the minimum and maximum boundary values ​​of the preset standard flow rate range of the equipment.

[0041] If all recorded air supply pressure values ​​in the static air path feature set are between the minimum and maximum boundary values ​​of the preset standard air supply pressure range, and all recorded regional flow values ​​are between the minimum and maximum boundary values ​​of the preset standard flow range, then the static air path operation status of the Bernoulli quartz chuck can be officially determined to be normal. Subsequently, a static qualified intermediate signal representing the static test is automatically generated. This static qualified intermediate signal is then merged and organized with all the data in the static adsorption feature set to finally form the first physical state information of the standard wafer under static adsorption state.

[0042] The dynamic movement simulation module is used to monitor the second physical state information of the standard wafer during the movement process under simulated gas supply conditions, with the additional suction cup mounting swing arm as the movement condition. The second physical state information includes whether shaking, rotation or falling occurs. In this embodiment of the invention, when the dynamic movement simulation module is used under simulated air supply conditions and the additional suction cup mounting swing arm is in a moving condition, it is specifically used for: While maintaining continuous output of simulated gas supply conditions, the first hinge in the hinge structure set on the swing arm by the suction cup causes the swing arm to move left and right in the horizontal direction, carrying the suction cup and the standard wafer being adsorbed. The combination of the first hinge, the second hinge, and the third hinge in the hinge structure allows the swing arm to move back and forth horizontally along the suction cup and the standard wafer being suctioned, simulating the movement scenario when the client picks up the wafer.

[0043] When the dynamic movement simulation module executes the second physical state information monitoring of the standard wafer during its movement, it is specifically used for: During the process of moving the standard wafer with the chuck mounting arm, the dynamic displacement and dynamic angle characteristics of the standard wafer relative to the Bernoulli quartz chuck are acquired in real time at multiple different moving stages. The dynamic displacement features and dynamic angle features are correlated in the order of movement time, and the correlated movement response feature sequence is used as the second physical state information. Based on the second physical state information, it is determined whether the dynamic displacement characteristics under different movement stages exceed the preset allowable parameter range, so as to determine whether the standard wafer is shaking, rotating or falling.

[0044] The dynamic movement simulation module, when performing a judgment based on the second physical state information to determine whether the dynamic displacement characteristics at different movement stages exceed the preset allowable parameter range, in order to determine whether the standard wafer is shaking, rotating, or falling, is specifically used for: The movement period is divided into multiple movement stages according to the change nodes of movement direction or movement speed. The minimum value of real-time vertical height, the fluctuation range of real-time horizontal offset, and the cumulative change of real-time deflection angle are extracted in each movement stage. The values ​​extracted in each movement stage are compared with the pre-set lower limit of vertical height, upper limit of fluctuation range, and upper limit of cumulative change for the corresponding stage. If the lowest real-time vertical height during any movement phase is lower than the lower limit of the allowable vertical height, a fall is determined to have occurred. If the fluctuation of the real-time horizontal offset exceeds the upper limit of the allowable fluctuation range during any movement phase, it is determined that a sway has occurred. If the cumulative change in the real-time deflection angle exceeds the upper limit of the allowable cumulative change during any movement phase, then rotation is determined to have occurred.

[0045] To maintain a stable output pressure and flow rate without fluctuations in the simulated gas supply, the first hinge in the suction cup mounting arm hinge structure is driven by the drive component to rotate at a fixed axis and angle. During the rotation, the first hinge maintains rigid synchronous linkage with the suction cup mounting arm, causing the entire arm to perform a translational motion without deviation. The arm further drives the Bernoulli quartz suction cup and the standard wafer stably adsorbed below the suction cup to move in a uniform linear reciprocating motion along a preset horizontal left-right directional trajectory, without any jamming or lateral deviation during the movement.

[0046] The simulated gas supply pressure and flow output are maintained continuously without interruption. The control unit precisely controls the first, second, and third hinges within the hinge structure to synchronously perform extension and retraction actions according to the preset coordinated transmission ratio. The extension and retraction strokes and speeds of the three sets of hinges are kept completely consistent. The combined extension and retraction force is smoothly transmitted to the suction cup mounting arm and drives it to generate horizontal directional displacement. The arm drives the Bernoulli quartz suction cup and the standard wafer being adsorbed to move in a uniform linear motion along the preset horizontal forward and backward directional trajectory, completely replicating the entire process of movement in the actual wafer retrieval operation of the end customer.

[0047] Within the complete cycle of horizontal left-right and horizontal forward-backward movement of the standard wafer driven by the chuck mounting arm, the movement process is divided into multiple continuous independent movement stages according to the start time, constant speed operation time, and movement stop time. The displacement acquisition component is in close contact with the surface of the standard wafer, and in each independent movement stage, it collects the horizontal orientation offset data and vertical height change data of the standard wafer relative to the Bernoulli quartz chuck in real time. All the collected displacement-related data are organized and integrated to form the dynamic displacement characteristics of the standard wafer. The angle acquisition component is aligned with the plane reference position of the standard wafer, and in each independent movement stage, it collects the plane deflection angle data of the standard wafer relative to the Bernoulli quartz chuck in real time. All the collected angle-related data are organized and integrated to form the dynamic angle characteristics of the standard wafer.

[0048] The dynamic displacement and dynamic angle features corresponding to each independent movement stage are bound and combined one-to-one according to the time sequence of data acquisition. All the bound feature data are arranged continuously in timeline to form a complete data sequence without interruption or loss. This combination of feature data arranged in time sequence is the movement response feature sequence. This movement response feature sequence is directly used as the second physical state information of the standard wafer during the dynamic movement process.

[0049] Extract all dynamic displacement feature data corresponding to each independent movement stage from the second physical state information. Match each dynamic displacement feature data with the upper and lower boundary values ​​of the preset allowable parameter range for that movement stage. Based on the matching results of the dynamic displacement feature data and the corresponding allowable parameter range boundary values, accurately determine whether the standard wafer has shaken, rotated or fallen during the overall dynamic movement process.

[0050] The displacement and velocity detection components identify critical nodes where the moving direction changes and critical nodes where the moving speed changes. Using these critical nodes as dividing boundaries, the complete moving period of the standard wafer from the start to the stop of the movement is divided into multiple independent moving stages that do not overlap. In each independent moving stage, the height acquisition component continuously collects real-time vertical height data of the standard wafer and filters to determine the lowest value in that stage. The offset acquisition component continuously collects real-time horizontal offset data of the standard wafer and calculates to determine the numerical fluctuation range in that stage. The angle acquisition component continuously collects real-time deflection angle data of the standard wafer and accumulates to determine the cumulative numerical change in that stage.

[0051] The minimum real-time vertical height corresponding to each independent movement stage is directly compared point-to-point with the pre-set lower limit of the allowable vertical height for that stage. The fluctuation range of the real-time horizontal offset corresponding to each independent movement stage is directly compared point-to-point with the pre-set upper limit of the allowable fluctuation range for that stage. The cumulative change of the real-time deflection angle corresponding to each independent movement stage is directly compared point-to-point with the pre-set upper limit of the allowable cumulative change for that stage.

[0052] If the minimum real-time vertical height of the standard wafer is less than the lower limit of the allowable vertical height for any independent movement stage in the complete movement process, it can be uniquely determined that the standard wafer has fallen abnormally during the dynamic movement.

[0053] If the fluctuation range of the real-time horizontal offset of the standard wafer exceeds the upper limit of the allowable fluctuation range for any independent movement stage in the complete movement process, it can be uniquely determined that the standard wafer has experienced an abnormal shaking situation during the dynamic movement.

[0054] If the cumulative change in the real-time deflection angle of the standard wafer exceeds the upper limit of the allowable cumulative change for that stage within any independent movement stage of the complete movement process, it can be uniquely determined that the standard wafer has experienced a rotational anomaly during the dynamic movement process.

[0055] The comprehensive judgment module is used to comprehensively judge the Bernoulli quartz chuck based on the first physical state information and the second physical state information, and obtain the detection result of the Bernoulli quartz chuck.

[0056] In this embodiment of the invention, when the comprehensive judgment module performs a comprehensive judgment on the Bernoulli quartz chuck based on the first physical state information and the second physical state information to obtain the detection result of the Bernoulli quartz chuck, it is specifically used for: The results of stable adsorption, no shaking, no swaying, and no rotation are collected from the first physical state information, and the results of no swaying, no rotation, and no falling are collected from the second physical state information. If all judgment results meet the requirements, the qualified comprehensive judgment result will be taken as the test result; If any judgment result is that the requirements are not met, the overall judgment result is unqualified, and the corresponding abnormality type is extracted from the judgment result that does not meet the requirements as a component of the test result.

[0057] From the first physical state information corresponding to the static adsorption of the standard wafer, four judgment items—stable adsorption, no shaking, no swaying, and no rotation—are extracted one by one without omission. From the second physical state information corresponding to the dynamic movement of the standard wafer, three judgment items—no swaying, no rotation, and no falling—are extracted one by one without omission. The above seven judgment items are uniformly collected according to the classification order of static detection and dynamic detection. All judgment results are sorted and their completeness is checked to form all the basic judgment data for the comprehensive performance evaluation of Bernoulli quartz chucks.

[0058] All the collected basic judgment data were verified item by item to confirm that the judgment results of stable adsorption, no shaking, static no swaying, static no rotation, dynamic no swaying, dynamic no rotation, and no falling all met the preset judgment standards. There were no judgment results that did not meet the requirements. At this time, the comprehensive judgment result of the Bernoulli quartz suction cup was officially determined to be qualified, and this qualified conclusion was directly used as the final test result of the Bernoulli quartz suction cup.

[0059] All the collected basic judgment data are verified item by item. If any of the seven judgment results fails to meet the preset judgment standard or is in a state of non-compliance, the comprehensive judgment result of the Bernoulli quartz chuck is immediately officially determined to be unqualified. From all the items that fail to meet the requirements, the corresponding abnormality type identifiers are extracted one by one. The unqualified comprehensive judgment conclusion and all the extracted abnormality type identifiers are combined in an orderly manner to form the final test result of the Bernoulli quartz chuck containing the unqualified conclusion and the specific abnormality type.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A Bernoulli quartz suction cup detection device, characterized in that, The device includes a detection preparation module, a simulated gas supply module, a static adsorption verification module, a dynamic movement simulation module, and a comprehensive judgment module, wherein: The detection preparation module is used to install the Bernoulli quartz suction cup to be tested onto the suction cup mounting arm, and adjust the adsorption surface of the Bernoulli quartz suction cup to a horizontal state through the adjustment mechanism, and seal and connect the airflow output end of the detection station with the air inlet of the Bernoulli quartz suction cup. The simulated air supply module is used to determine the pressure range and airflow rate of the detection station output according to the end customer's usage environment, and to simulate air supply to the Bernoulli quartz chuck. The static adsorption verification module is used to adsorb a standard wafer under a Bernoulli quartz chuck under simulated gas supply conditions and monitor the first physical state information of the standard wafer under static adsorption. The first physical state information includes whether it is stably adsorbed and whether there is shaking, swaying or rotation. The dynamic movement simulation module is used to monitor the second physical state information of the standard wafer during the movement process under simulated gas supply conditions, with the additional suction cup mounting swing arm as the movement condition. The second physical state information includes whether shaking, rotation or falling occurs. The comprehensive judgment module is used to comprehensively judge the Bernoulli quartz chuck based on the first physical state information and the second physical state information, and obtain the detection result of the Bernoulli quartz chuck.

2. The Bernoulli quartz suction cup detection device as described in claim 1, characterized in that, The detection preparation module, when executing the steps of installing the Bernoulli quartz suction cup to be tested onto the suction cup mounting arm, adjusting the adsorption surface of the Bernoulli quartz suction cup to a horizontal state via the adjustment mechanism, and sealing the airflow output end of the detection station with the air inlet of the Bernoulli quartz suction cup, is specifically used for: The Bernoulli quartz chuck to be tested is placed on the mounting reference surface of the chuck mounting arm, and the positioning features are used to position the Bernoulli quartz chuck and the chuck mounting arm in a predetermined relative position. The posture of the suction cup mounting arm is adjusted by the adjustment mechanism, while the deviation between the adsorption surface of the Bernoulli quartz suction cup and the horizontal direction is detected until the deviation is eliminated and the adsorption surface is in a horizontal state. Connect the airflow output end of the testing station to the air inlet of the Bernoulli quartz chuck, and apply a sealing force to create an airtight connection at the connection point.

3. The Bernoulli quartz suction cup detection device as described in claim 1, characterized in that, When the simulated gas supply module determines the pressure range and airflow rate of the detection station output based on the end-user's usage environment, it is specifically used for: To obtain the dynamic range of air supply pressure and airflow rate changes when end customers actually use Bernoulli quartz chucks. Set the dynamic range of gas supply pressure to the pressure range output by the detection station, and set the dynamic range of airflow to the flow range output by the detection station.

4. The Bernoulli quartz chuck detection device as described in claim 3, characterized in that, When the simulated air supply module performs simulated air supply to the Bernoulli quartz chuck, it is specifically used for: During the process of supplying air to the Bernoulli quartz suction cup, the actual pressure value and actual flow rate value output by the detection station are continuously collected and collected to form the air supply pressure time sequence and the air supply flow rate time sequence. The gas supply pressure time series is compared with the pressure range, and the gas supply flow time series is compared with the flow range; If the actual pressure value and the actual flow rate value are within the pressure range and flow rate range at all times throughout the entire gas supply process, then the simulated gas supply is determined to be consistent with the end customer's usage environment.

5. The Bernoulli quartz chuck detection device as described in claim 1, characterized in that, The static adsorption verification module, when performing the task of adsorbing a standard wafer under a Bernoulli quartz chuck under simulated gas supply conditions and monitoring the first physical state information of the standard wafer under static adsorption, is specifically used for: Under simulated gas supply conditions, the gas flow distribution of multiple flow paths inside the Bernoulli quartz chuck and the gap pressure distribution at multiple locations between the lower surface of the standard wafer and the Bernoulli quartz chuck when the wafer is adsorbed were obtained. By correlating and integrating the gas flow rate distribution and the gap pressure distribution at the same moment, a static adsorption feature set of a standard wafer is obtained.

6. The Bernoulli quartz chuck detection device as described in claim 5, characterized in that, When the static adsorption verification module correlates and integrates the gas flow rate distribution and gap pressure distribution at the same moment to obtain the static adsorption feature set of the standard wafer, it is specifically used for: Based on the static air path feature set, determine whether there is air path blockage or leakage abnormality in the Bernoulli quartz chuck. Within the standard vacuum pressure range, the static gas path characteristic concentrated gas supply pressure value and regional flow rate value are compared with the preset standard gas supply pressure range and standard flow rate range, respectively. If all comparison results are within the corresponding range, the static gas path is determined to be normal, a static qualified intermediate signal is generated, and it is combined with the static adsorption feature set to form the first physical state information of the standard wafer.

7. The Bernoulli quartz chuck detection device as described in claim 1, characterized in that, When the dynamic movement simulation module is executed under simulated air supply conditions, with the additional suction cup mounting arm in a moving condition, it is specifically used for: While maintaining continuous output of simulated gas supply conditions, the first hinge in the hinge structure set on the swing arm by the suction cup causes the swing arm to move left and right in the horizontal direction, carrying the suction cup and the standard wafer being adsorbed. The combination of the first hinge, the second hinge, and the third hinge in the hinge structure allows the swing arm to move back and forth horizontally along the suction cup and the standard wafer being suctioned, simulating the movement scenario when the client picks up the wafer.

8. The Bernoulli quartz chuck detection device as described in claim 7, characterized in that, When the dynamic movement simulation module executes the second physical state information monitoring of the standard wafer during its movement, it is specifically used for: During the process of moving the standard wafer with the chuck mounting arm, the dynamic displacement and dynamic angle characteristics of the standard wafer relative to the Bernoulli quartz chuck are acquired in real time at multiple different moving stages. The dynamic displacement features and dynamic angle features are correlated in the order of movement time, and the correlated movement response feature sequence is used as the second physical state information. Based on the second physical state information, it is determined whether the dynamic displacement characteristics under different movement stages exceed the preset allowable parameter range, so as to determine whether the standard wafer is shaking, rotating or falling.

9. The Bernoulli quartz chuck detection device as described in claim 8, characterized in that, The dynamic movement simulation module, when performing a judgment based on the second physical state information to determine whether the dynamic displacement characteristics at different movement stages exceed the preset allowable parameter range, in order to determine whether the standard wafer is shaking, rotating, or falling, is specifically used for: The movement period is divided into multiple movement stages according to the change nodes of movement direction or movement speed. The minimum value of real-time vertical height, the fluctuation range of real-time horizontal offset, and the cumulative change of real-time deflection angle are extracted in each movement stage. The values ​​extracted in each movement stage are compared with the pre-set lower limit of vertical height, upper limit of fluctuation range, and upper limit of cumulative change for the corresponding stage. If the lowest real-time vertical height during any movement phase is lower than the lower limit of the allowable vertical height, a fall is determined to have occurred. If the fluctuation of the real-time horizontal offset exceeds the upper limit of the allowable fluctuation range during any movement phase, it is determined that a sway has occurred. If the cumulative change in the real-time deflection angle exceeds the upper limit of the allowable cumulative change during any movement phase, then rotation is determined to have occurred.

10. The Bernoulli quartz chuck detection device as described in claim 1, characterized in that, When the comprehensive judgment module performs a comprehensive analysis of the Bernoulli quartz chuck based on the first and second physical state information to obtain the detection result of the Bernoulli quartz chuck, it is specifically used for: The results of stable adsorption, no shaking, no swaying, and no rotation are collected from the first physical state information, and the results of no swaying, no rotation, and no falling are collected from the second physical state information. If all judgment results meet the requirements, the qualified comprehensive judgment result will be taken as the test result; If any judgment result is that the requirements are not met, the overall judgment result is unqualified, and the corresponding abnormality type is extracted from the judgment result that does not meet the requirements as a component of the test result.

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