Detachable thermoelectric refrigeration device performance testing device and refrigeration capacity measurement method

Abstract

This application discloses a detachable thermoelectric cooling device performance testing apparatus and a cooling capacity measurement method, comprising: a clamping device and a testing device; the testing device includes at least one temperature measuring device electrically connected to the thermoelectric cooling device; the clamping device includes a support platform, a positioning bar, a pressure rod, and at least one connecting rod, with both ends of the connecting rod connected to the support platform and the positioning bar respectively, forming a testing device accommodating area between the support platform and the positioning bar; the pressure rod extends through the positioning bar into the testing device accommodating area to apply pressure to the testing device, and the testing device is clamped by the pressure rod and the support platform. The detachable clamping device makes the entire testing apparatus flexible and adaptable, and the cooling capacity measurement does not simply read the input power, but comprehensively considers the heat loss of the testing device and the testing environment, resulting in more accurate cooling measurement results.

Description

Technical Field

[0001] This application relates to the field of thermoelectric cooling device testing technology, and in particular to a detachable and modifiable thermoelectric cooling device performance testing device and a cooling capacity measurement method. Background Technology

[0002] Currently, the equipment and methods for performance testing of thermoelectric cooling devices still face two major challenges: poor equipment versatility and low measurement accuracy.

[0003] In terms of equipment design, existing technologies mostly adopt an integrated welded structure. This fixed integration method prevents the heat dissipation capacity and clamping structure of the device from being dynamically adjusted according to actual needs. When dealing with thermoelectric cooling devices of different specifications, sizes, or levels, the cooling capacity of the liquid cooling plate and the size of the clamping device are fixed, making it difficult for a single device to adapt to diverse test windows, resulting in severely limited testing flexibility. In addition, the integrated design also brings inconvenience in maintenance; any local damage may require adjustments to the entire structure, increasing maintenance costs and complexity.

[0004] In terms of measurement methods, existing technologies mainly rely on directly reading the power of the heat source or indirectly calculating using standard samples, but both methods have significant errors. When using lasers as heat sources, the low absorption rate of light by the copper layer on the device surface leads to uneven energy input due to reflection and refraction, resulting in severe measurement deviations. While using electric heaters can achieve near 100% electrothermal conversion efficiency, the temperature difference between the heater surface and the environment causes significant heat conduction losses, which existing devices typically do not correct for, affecting the measurement accuracy of micro-devices (with a maximum cooling capacity of only a few hundred milliwatts). On the other hand, the method of indirect calculation using standard samples is problematic because the micro-devices are extremely small, and the samples required to establish the temperature difference are often elongated with a very high aspect ratio, making them difficult to stabilize during assembly and prone to uneven temperature distribution, leading to severe measurement errors. Therefore, how to achieve high-precision measurement of the cooling capacity of micro-thermoelectric cooling devices while ensuring equipment flexibility has become a pressing technical challenge in this field.

[0005] The testing equipment described in the currently published patents are all integrated welding equipment with fixed heat dissipation and device clamping capabilities. They cannot dynamically adjust the heat dissipation and clamping structure of the device according to actual needs, making maintenance inconvenient.

[0006] The publicly available methods for measuring the cooling capacity of micro thermoelectric cooling devices are mainly divided into two types. One method is to read the power of the heat source as the cooling capacity. Common heat sources are mainly electric heaters and lasers. Since lasers are essentially light energy, there will inevitably be reflection and refraction when they irradiate the upper surface of the device. In order to solve the problem of uneven heating in thermoelectric cooling devices, commercial devices are currently coated with copper on both the upper and lower surfaces. However, copper has a very low light absorption rate, so using the laser power as the cooling capacity of the device has serious deviations. Electric heaters, represented by ceramic or graphene heating elements, can directly convert electrical energy into heat energy to provide a heat load. The electrothermal conversion efficiency of resistance heating is close to 100%, and using electrical power as heat power is reasonable. Therefore, electric heaters are superior in terms of heat load selection. However, in actual testing, there is a significant difference between the surface temperature of the electric heater and the ambient temperature. For example, when the device's operating current is very small, a large electric heater power will cause its surface temperature to be significantly higher than the ambient temperature. When the device is operating at the optimal current and the electric heater power is small, its surface temperature will be cooled to tens of degrees below zero Celsius, far below the ambient temperature. This temperature difference inevitably causes heat conduction, and the heating power of the electric heater will cause errors in using the electric heater power as the cooling capacity. For miniature thermoelectric cooling devices with a maximum cooling power of only a few hundred milliwatts, this heat loss cannot be ignored if you want to measure its cooling capacity more accurately. Another method is to indirectly calculate heat flow using standard samples made of standard materials with known geometric dimensions and thermal conductivity. Typically, holes are made at equal intervals on the standard sample, and a temperature measuring device is inserted into the holes to read the temperature. The heat flow is then calculated by fitting the temperature gradient. However, this method is not suitable for miniature devices. To establish a temperature difference, the height of the standard sample has a lower limit, and the cross-sectional area of ​​the miniature device is very small. Slender standard samples with a very large aspect ratio cannot be stabilized during actual assembly. Furthermore, standard samples of this size have significant uneven temperature distribution, resulting in serious measurement errors. Therefore, for miniature devices, the best approach is to directly attach the heater to the upper surface of the device.

[0007] Traditional testing equipment typically features an integrated welded design, meaning that damage to one part affects the entire system, and individual components cannot be replaced according to specific needs, making maintenance difficult. Different specifications, sizes, and levels of thermoelectric cooling devices have varying requirements for the cooling capacity of liquid cooling plates and the size of clamping devices. Existing integrated welded design devices cannot replace liquid cooling plates and clamping devices of different sizes as needed, resulting in a narrow testing window. Most publicly available devices do not have methods for measuring the cooling capacity of devices, and those that can perform tests have errors in their testing methods and have not performed necessary data corrections. Summary of the Invention

[0008] In view of this, this application provides a detachable and modifiable thermoelectric cooling device performance testing apparatus and a cooling capacity measurement method to solve the problem that existing cooling capacity testing devices cannot replace components and have poor application flexibility. To achieve one, some, or all of the above objectives, or other objectives, the first aspect of this application proposes a detachable and modifiable thermoelectric cooling device performance testing apparatus, comprising: Clamping device and testing device; The testing device includes at least one temperature measuring device, and at least one of the temperature measuring devices is electrically connected to a thermoelectric cooling device. The clamping device includes a support platform, a positioning bar, a pressure bar, and at least one connecting rod. The two ends of the at least one connecting rod are respectively connected to the support platform and the positioning bar, so that a test device accommodating area is formed between the support platform and the positioning bar. The pressure bar extends through the positioning bar into the receiving area of ​​the test device to apply pressure to the test device, and the test device is clamped by the pressure bar and the support platform.

[0009] Preferably, the thermoelectric cooling device performance testing device further includes a base and a protective cover, the protective cover being disposed on the surface of the base to form a sealed cavity, and the clamping device and the testing device being disposed within the sealed cavity.

[0010] Preferably, a support rod is provided on the base, and the support rod extends from the base and connects to the support platform; Alternatively, the base may be provided with at least one flange.

[0011] Preferably, the connecting rod and the positioning strip are connected by a thread, making the height of the testing device accommodating area adjustable.

[0012] Preferably, the pressure rod is a threaded rod, which extends into the receiving area of ​​the test device through a threaded hole on the positioning strip, so that the threaded rod is detachably connected to the positioning strip, and the length of the threaded rod extending into the receiving area of ​​the test device is adjustable.

[0013] Preferably, the pressure bar is connected to a pressure head at one end of the end located in the receiving area of ​​the test device.

[0014] Preferably, the testing device includes a cooling component, a heater, a first temperature measuring device, a second temperature measuring device, a third temperature measuring device, and a fourth temperature measuring device; The liquid cooling plate is disposed between the support platform and the thermoelectric refrigeration device; The heater is disposed on the thermoelectric refrigeration device, and the heater and the liquid cooling plate form a clamping shape for the thermoelectric refrigeration device; A first temperature measuring device is connected at the connection point between the liquid cooling plate and the thermoelectric refrigeration device; A second temperature measuring device is connected at the connection point between the thermoelectric refrigeration device and the heater; The heater's concealed wiring is connected to a third temperature measuring device. The end of the heater furthest from the lead wire is connected to the fourth temperature sensing device. Preferably, a heat insulation block is provided at the end of the heater away from the thermoelectric refrigeration device; The fourth temperature measuring device is located between the heater and the heat insulation block; A fifth temperature measuring device is provided at the end of the heat insulation block away from the heater.

[0015] Preferably, the thermoelectric refrigeration device performance testing device further includes a vacuum holding system and a controller; The clamping device and the testing device are located within the vacuum holding system; The controller controls the operation of the testing device and the vacuum holding system; The controller controls the testing device to measure the cooling capacity of the thermoelectric refrigeration device.

[0016] A second aspect of this application provides a method for measuring cooling capacity, applied to a performance testing device for detachable thermoelectric refrigeration devices as described in any of the preceding claims, comprising: Provide a thermoelectric refrigeration device; The thermoelectric cooling device is placed in the thermoelectric cooling device receiving area of ​​the test device; The testing device is clamped onto the clamping device; The clamping device, together with the testing device and the thermoelectric cooling device, is placed in a vacuum environment; The testing device measures the cooling capacity of the thermoelectric refrigeration device in a vacuum environment and obtains the cooling capacity measurement results. The cooling capacity measurement results are corrected for the influence of the test environment, which includes at least one of the heat loss of the test device, the friction loss of the power transmission equipment, and the conductor loss.

[0017] The beneficial effects of this application are: This application achieves stable clamping and testing of thermoelectric cooling devices of different specifications by constructing a flexibly assembleable clamping device. Specifically, each component of the testing device is electrically connected to the thermoelectric cooling device, and the overall structural dimensions after assembly change accordingly with variations in the number and size of the thermoelectric cooling device. Therefore, the support platform, positioning bars, and connecting rods in the clamping device all adopt detachable connection structures, allowing for adjustable height of the testing device's accommodating area after installation. Simultaneously, the support platform can be replaced according to the actual dimensions of the thermoelectric cooling device. This design gives the entire testing device excellent dimensional adaptability, enabling it to be used for testing the cooling capacity of thermoelectric cooling devices of different numbers and sizes, significantly improving the device's versatility and flexibility. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] in: Figure 1 This is a schematic diagram of the performance testing device for thermoelectric refrigeration devices in one embodiment; Figure 2 This is a schematic diagram of the mounting structure of the clamping device and the testing device in one embodiment; Figure 3 This is a schematic diagram of the cooling capacity measurement method in one embodiment; Figure 4 This is a schematic diagram of a thermoelectric refrigeration device performance testing device in one embodiment; Figure 5 This is a schematic diagram of the thermal correction results calculated from the measured data of each temperature measuring device in one embodiment. Figure 6 In one embodiment, the dimensions are 3.5 × 3.5 × 1.2 mm. 3 A schematic diagram of the measured performance of the device at a hot junction temperature of 300K; Figure 7 In one embodiment, the dimensions are 8.2 × 6.0 × 1.8 mm. 3 A schematic diagram of the measured performance of the device at a hot junction temperature of 300 K. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] In this application, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] The terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0026] The present application will now be described in conjunction with specific embodiments.

[0027] like Figure 1 As shown, a performance testing device for thermoelectric cooling devices is disclosed, including a clamping device 10 and a testing device 20. The testing device 20 includes at least one temperature measuring device 21, which is electrically connected to a thermoelectric cooling device 30. The clamping device 10 includes a support platform 11, a positioning bar 12, a pressure rod 13, and at least one connecting rod 14. The two ends of the connecting rod 14 are respectively connected to the support platform 11 and the positioning bar 12, forming a testing device receiving area 201 between the support platform 11 and the positioning bar 12. The pressure rod 13 extends through the positioning bar 12 into the testing device receiving area 201 to apply pressure to the testing device 20, thereby clamping the testing device 20 through the pressure rod 13 and the support platform 11.

[0028] The temperature measuring device 21 is a temperature measuring device including a contact temperature sensor. One end of the sensor is connected in contact with the area to be measured, and the other end is electrically connected to a temperature display device. Optionally, the temperature sensor is a thermocouple or a thermistor. At least one temperature measuring device 21 is used; preferably, at least two temperature measuring devices 21 are used, one located at the cold end of the thermoelectric cooling device 30 and the other at the hot end of the thermoelectric cooling device 30. This allows for real-time feedback of the temperatures at the hot and cold ends of the thermoelectric cooling device 30, and the difference between the two temperatures reflects the cooling capacity of the thermoelectric cooling device 30.

[0029] The testing device 20, in conjunction with the temperature measuring device 21, measures the cooling capacity of the thermoelectric cooling device 30. The clamping device 10, through the upper and lower supporting platforms 11 and the positioning bars 12, and the connecting rod 14 connecting the supporting platforms 11 and the positioning bars 12, forms a testing device receiving area 201. The testing device 20 is located within the testing device receiving area 201. The pressure rod 13 passes through the positioning bars 12 to apply pressure to the testing device 20, thereby clamping the positioning bars 12 to stabilize its position. During the cooling capacity test, the testing device 20 will not experience lateral or longitudinal displacement.

[0030] This application achieves stable clamping and testing of thermoelectric cooling devices 30 of different specifications by constructing a flexibly assembleable clamping device 10. Specifically, each component of the testing device 20 is electrically connected to the thermoelectric cooling device 30, and the overall structural dimensions after assembly change accordingly as the number and size of the thermoelectric cooling device 30 changes. Therefore, the support platform 11, positioning bar 12, and connecting rod 14 in the clamping device 10 all adopt a detachable connection structure, making the height of the testing device accommodating area 201 adjustable after installation. Simultaneously, the support platform 11 can be replaced according to the actual size of the thermoelectric cooling device 30. The above design gives the entire testing device 20 excellent dimensional adaptability, making it suitable for testing the cooling capacity of thermoelectric cooling devices 30 of different numbers and sizes, significantly improving the versatility and flexibility of the device.

[0031] Optionally, there are at least two connecting rods 14. At least two connecting rods 14 are arranged symmetrically on both sides of the support platform 11 to support and fix the support platform 11 and the positioning strip 12, and to limit the lateral and longitudinal positions of the support platform 11 and the positioning strip 12. In this embodiment, there are two connecting rods 14; in other embodiments, there are three or more connecting rods 14, depending on the actual application. Generally, two connecting rods 14 are the optimal choice, as they provide the simplest structure for stable lateral and longitudinal positioning of the upper and lower layers.

[0032] In some embodiments, the pressure rod 13 is detachably fixed to the positioning strip 12 when it passes through the positioning strip 12. The detachable fixing structure is a snap-fit, latch, or threaded structure, which locks the pressure rod 13 to longitudinally limit and position it.

[0033] Specifically, the positioning strip 12 is provided with positioning holes, the shape of which corresponds to the pressure rod 13. Optionally, the positioning holes are located at the center of the pressure rod 13. Optionally, the position of the positioning holes corresponds to the center position of the thermoelectric cooling device 30 during installation, so that when the pressure rod 13 passes through the positioning holes, it is exactly above the thermoelectric cooling device 30, and when the pressure rod 13 is pressed down, it applies uniform pressure to the thermoelectric cooling device 30.

[0034] Optionally, the support platform 11 is provided with a threaded connection hole corresponding to the connecting rod 14. The end of the connecting rod 14 connected to the support platform 11 has a threaded structure, and the connecting rod 14 can be directly screwed into the threaded connection hole for fixation.

[0035] Optionally, the support platform 11 is provided with a snap-fit ​​connection hole corresponding to the connecting rod 14. Specifically, the connecting rod 14 is provided with a snap-fit ​​boss, and the snap-fit ​​connection hole is provided with a groove corresponding to the snap-fit ​​boss. The snap-fit ​​can be engaged into the groove to fix the connecting rod to the support platform 11.

[0036] Optionally, the positioning bar 12 is provided with a connecting hole, which corresponds to the connecting rod 14. The connecting hole is a threaded hole, and the connecting rod 14 is detachably connected to the threaded hole on the positioning bar 12 through a threaded structure. The threaded connection position can be adjusted according to the required height of the test device accommodating area 201.

[0037] Optionally, the connecting hole on the positioning strip 12 is a smooth through hole. By setting a positioning structure on the connecting rod 14, the connection position between the connecting rod 14 and the positioning strip 12 is fixed, so as to flexibly adjust the connection position between the positioning strip 12 and the connecting rod, thereby adjusting the height of the test device receiving area 201. For example, the positioning structure is a buckle. After the connecting rod 14 passes through the positioning strip, a buckle is added to the connecting rod 14. The buckle is fixed on the connecting rod 14 to support and position the positioning strip. The buckle can be opened and closed at will, and its position can be flexibly adjusted on the connecting rod 14.

[0038] In some embodiments, the positioning strip 12 is an elongated structure, and its specific shape is not limited. It allows for a fixed connection with the connecting rod 14, and after insertion into the pressure rod 13, the pressure rod is less prone to wobbling. In this embodiment, the positioning strip 12 is rectangular. Designing the positioning strip 12 as a rectangle (or a regular elongated shape) provides a uniform force-bearing surface. When the pressure rod 13 applies pressure through the positioning strip, the rectangular structure effectively disperses stress, preventing the positioning strip itself from twisting or deforming, thereby ensuring that the pressure applied to the testing device is vertical and stable.

[0039] In some embodiments, the thermoelectric cooling device performance testing apparatus further includes a base 40 and a protective cover 41. The protective cover 41 covers the surface of the base 40 to form a sealed cavity, and both the clamping device 10 and the testing device 20 are disposed within the sealed cavity. The sealed cavity formed by the base 40 and the protective cover 50 physically isolates the testing system from the external environment. This effectively prevents external dust and moisture from corroding the precision testing devices, while significantly reducing heat loss from the chamber environment during the testing process.

[0040] In some embodiments, the base 40 has a cavity structure with a flat horizontal surface on the upper surface, which facilitates the placement of other devices. The edge of the protective cover 41 is embedded in the base 40 and fixedly sealed. A vacuum holding system 50 is provided inside the base 40. The vacuum holding system 50 can extract the air from the sealed cavity formed by the protective cover 41 and the base 40 and maintain a vacuum state, so as to facilitate the measurement of the cooling capacity of the thermoelectric refrigeration device 30.

[0041] In some embodiments, the protective cover 41 is made of a transparent material with high light transmittance to ensure visibility of internal components or effective light transmission. The transparent material can be glass or plastic. For example, when glass, it can be chemically tempered glass, borosilicate glass, or quartz glass to provide excellent hardness, scratch resistance, and thermal stability; when plastic, it can be polycarbonate (PC), polymethyl methacrylate (PMMA, commonly known as acrylic or plexiglass), polyethylene terephthalate (PET), or cyclic olefin copolymers (COC), which typically offer good toughness, impact resistance, ease of molding, and relatively low cost. The choice of material can be optimized based on the specific application environment's requirements for transparency, mechanical strength, chemical resistance, temperature resistance, and cost.

[0042] In some embodiments, a support rod 42 is provided on the base 40, extending from the base 40 and connecting to the support platform 11. The support rod 42 supports the platform 11, and the platform 11 and the support rod 42 are detachably connected, for example, by threads or snap-fit ​​connections. The support rod 42 is made of metal or a low thermal conductivity composite material, such as carbon fiber reinforced plastic or hollow thermally insulated ceramic rod.

[0043] In some embodiments, the support rod 42 is a lifting rod. After the support rod 42 is raised, the clamping device 10, the testing device 20, and the thermoelectric cooling device 30 are installed. After installation, the support rod 42 is lowered to measure the cooling capacity of the thermoelectric cooling device 30. Specifically, the support rod 42 is a pneumatic lifting rod. In some embodiments, the support rod 42 can be a telescopic nested structure, that is, the support rod 42 is composed of multiple sections of tubing with decreasing diameters connected together, and is equipped with a locking knob. The multi-section nested design has extremely high radial stiffness in the extended state, which can effectively prevent the support platform from shaking under high pressure clamping and ensure mechanical stability during the testing process.

[0044] In some implementations, the support rod 42 is detachably connected to the base 40, specifically, it can be a threaded connection or a snap-fit ​​connection.

[0045] In some embodiments, at least one flange 43 is provided on the base 40. The flange 43 connects to the vacuum pump on one hand and seals the cavity of the base 40 on the other hand to ensure the vacuum level within the sealed cavity. In this embodiment, there are two flanges 43, located on opposite sides of the base, which facilitates inspection of the interior of the base and replacement of parts.

[0046] In some embodiments, the pressure rod 13 is a threaded rod that extends into the test device receiving area 201 through a threaded hole on the positioning bar 12, so that the threaded rod is detachably connected to the positioning bar 12, and the length of the threaded rod extending into the test device receiving area 201 is adjustable.

[0047] Specifically, the length of the thread on the pressure rod 13 can be designed according to actual needs. The entire surface of the pressure rod 13 can be threaded, or a portion of the surface of the pressure rod 13 can be threaded. The rod is screwed into the threaded hole of the positioning bar 12, and the length of the rod extending into the receiving area 201 of the testing device can be adjusted by the depth of screwing, thereby adjusting the pressure applied to the testing device 20. At the same time, it can be adapted to thermoelectric cooling devices 30 of different heights.

[0048] In some embodiments, a pressure head 131 is connected to one end of the pressure rod 13 located in the testing device receiving area 201. Optionally, the pressure head 131 and the pressure rod 13 are detachably connected, specifically by threads or snap-fit ​​connections, for easy installation and disassembly.

[0049] In some embodiments, the downward pressing surface of the pressure head 131 is a plane to apply pressure uniformly to the testing device 20. Preferably, the projection surface of the pressure head 131 covers the thermoelectric cooling device 30, so that the downward pressure of the pressure head 131 is uniformly transmitted to the entire thermoelectric cooling device 30.

[0050] In some implementations, such as Figure 2As shown, the testing device 20 includes a cooling element 22, a heater 23, a first temperature measuring device 211, a second temperature measuring device 212, a third temperature measuring device 213, and a fourth temperature measuring device 214. The cooling element 22 is disposed between the support platform 11 and the thermoelectric cooling device 30; the heater 23 is disposed on the thermoelectric cooling device 30, and the heater 23 and the cooling element 22 clamp the thermoelectric cooling device 30. The first temperature measuring device 211 is connected at the connection between the cooling element 22 and the thermoelectric cooling device 30; the second temperature measuring device 212 is connected at the connection between the thermoelectric cooling device 30 and the heater 23; the end of the lead wire of the heater 23 is connected to the third temperature measuring device 213, and the end of the heater 23 opposite to the end of the lead wire is connected to the fourth temperature measuring device. The end of the lead wire refers to the connection point where the wire connects to the heater 23, and the wire supplies current to the heater 23 for heating.

[0051] Specifically, the cooling component 22 is a cooling structure, specifically a flat plate-shaped cooling structure made of a metal with high thermal conductivity. It connects to the cold end of the thermoelectric cooling device 30 and can quickly absorb heat from the cold end of the thermoelectric cooling device 30, preventing heat accumulation and ensuring the measurement of the cooling capacity of the thermoelectric cooling device 30. Preferably, the cooling component 22 is a liquid-cooled plate, which is a hollow metal heat sink. The internal cavity of the metal plate is filled with a cooling medium, which quickly conducts heat to the cold end, rapidly transferring heat from the interface between the thermoelectric cooling device 30 and the liquid-cooled plate.

[0052] Heater 23 is a small heating device that simulates a heat source, supplying heat to the hot end of thermoelectric cooling device 30. Typically, it stabilizes the temperature of the hot end of thermoelectric cooling device 30 at a certain temperature, such as 300K. Heater 23 is an electric heater, which can be selected from one of the following: a thin-film heater, a metal sheet heater, a power resistor, or a graphene heating element. It is connected to an external power supply. Preferably, it is a semiconductor thin-film heater, a metal sheet heater, or a graphene heater, which have high heating efficiency.

[0053] The first temperature measuring device 211, the second temperature measuring device 212, and the third temperature measuring device 213 can be selected as temperature measuring devices including contact temperature sensors, with one end connected to the area to be measured in contact and the other end electrically connected to a temperature display device. Optionally, the temperature sensor is a thermocouple or a thermistor.

[0054] The first temperature measuring device 211 and the second temperature measuring device 212 measure the real-time actual temperatures of the hot and cold ends of the thermoelectric cooling device 30, obtaining the actual temperature difference between the hot and cold ends of the thermoelectric cooling device 30, which facilitates the calculation of the true cooling capacity of the thermoelectric cooling device 30. The third temperature measuring device 213 is connected to the end of the concealed wire of the heater 23 and measures the actual temperature of the end of the lead wire of the heater 23, which is used to calculate the heat transfer on the wire. From the actual temperature of the wire, the heat loss of the heater can be known, thereby correcting the heater power and facilitating the calculation of the true cooling capacity of the thermoelectric cooling device 30.

[0055] In some embodiments, a heat insulation block 24 is provided at the end of the heater 23 away from the thermoelectric cooling device 30; a fourth temperature measuring device 214 is provided between the heater 23 and the heat insulation block 24; and a fifth temperature measuring device 215 is provided at the end of the heat insulation block 24 away from the heater 23.

[0056] The fourth temperature measuring device 214 and the fifth temperature measuring device 215 can be selected as temperature measuring devices including contact temperature sensors, with one end connected to the area to be measured in contact and the other end electrically connected to a temperature display device. Optionally, the temperature sensor is a thermocouple or a thermistor. The fourth temperature measuring device 214 and the fifth temperature measuring device 215 measure the actual temperature at both ends of the heat insulation block 24, thereby calculating the heat loss of the heat insulation block to correct the heater power and facilitate the calculation of the actual cooling capacity of the thermoelectric cooling device 30. The heat insulation block 24 is used to block heat transfer outside the test path, and its material is engineering plastic or ceramic, etc.

[0057] In conventional thermoelectric cooling device 30 cooling capacity measurement, the electrical power of heater 23 is usually directly equated to the cooling capacity output. However, this application points out that the electrical power read by the instrument is the total output electrical power of the system, while the actual effective electrical power supplied to heater 23 needs to be subtracted from this reading due to the power loss along the path caused by the resistance of the test equipment wires. Based on this, this application further considers the parasitic losses in the test equipment, the temperature difference between each temperature measurement point, and other influencing factors, and combines the thermal resistance of each component to quantitatively calculate the amount of heat exchange between heater 23 and the environment through the heat insulation block 24 and heater wires. Therefore, the measurement logic of this application is: based on the instrument reading, subtract the power loss along the path, and then add the amount of heat exchange between the component and the environment, thereby achieving the correction processing of the cooling capacity. This cooling capacity is not obtained by direct measurement, but requires post-calculation processing of the test data, thus having higher accuracy.

[0058] In some embodiments, the thermoelectric cooling device performance testing apparatus further includes a vacuum holding system 50 and a controller 60; the clamping device 10 and the testing device 20 are located within the vacuum holding system; the controller 60 controls the operation of the testing device 20 and the vacuum holding system 50, and at the same time, the controller 60 controls the testing device 20 to measure the cooling capacity of the thermoelectric cooling device 30.

[0059] Specifically, the vacuum holding system 50 includes a controllable sealed vacuum environment formed between the base 40 and the protective cover 41 cavity. The vacuum holding system 50 includes the base 40, the protective cover 41, a vacuum pumping device, and sealing components required for sealing the protective cover 41. The vacuum holding system 50 is communicatively connected to the controller 60. After the clamping device 10, the testing device 20, the thermoelectric cooling device 30, the base 40, and the protective cover 41 are installed, the controller 60 controls the vacuum holding system 50 to extract air from the sealed cavity formed between the protective cover 41 and the base 40, maintaining a certain vacuum level.

[0060] The controller 60 is a device equipped with wireless or wired communication capabilities, which can control the operation of the vacuum holding system 50. Simultaneously, the controller 60 is communicatively connected to the testing device 20. Once the predetermined vacuum level is reached within the sealed cavity, the controller 60 can control the testing device 20 to perform a cooling capacity test on the thermoelectric refrigeration device 30.

[0061] Optionally, the controller 60 includes a display device that can display the real-time temperatures measured by each temperature sensor. Alternatively, the controller 60 has logic calculation capabilities; based on the real-time temperatures measured by each temperature sensor, the controller calculates the heat loss of each component in real time, then corrects the actual cooling capacity of the thermoelectric cooling device 30 based on the heating power input to the heater, and displays the actual cooling capacity on the display in real time. For example, the controller 60 can be a tablet, mobile phone, computer, or various portable control devices.

[0062] Optionally, the controller 60 is an assembly of various switching devices and communication systems, which can control the electrical switching of the test device 20 and the vacuum holding system 50, and at the same time transmit the data of the test device 20 and the vacuum holding system 50 to a predetermined user terminal.

[0063] This application also includes a method for measuring cooling capacity, applied to a performance testing device for detachable thermoelectric refrigeration devices as described in any of the preceding claims, such as... Figure 4 As shown, it includes: S1: Provide a thermoelectric refrigeration device 30; S2: Place the thermoelectric cooling device 30 in the thermoelectric cooling device receiving area 201 of the test device 20; S3: Clamp the test device 20 onto the clamping device 10; S4: Place the clamping device 10 together with the testing device 20 and the thermoelectric cooling device 30 in a vacuum environment; S5: The testing device 20 measures the cooling capacity of the thermoelectric cooling device 30 in a vacuum environment and obtains the cooling capacity measurement result; wherein, the cooling capacity measurement result is corrected for the influence of the testing environment, which includes at least one of the heat loss of the testing device, the friction loss of the power transmission equipment, and the conductor loss.

[0064] Specifically, the size and number of stages of the thermoelectric cooling device 30 are set according to actual needs, and it can be a miniature thermoelectric cooling device 30 of any size.

[0065] In step S2, the specific installation method can be as follows: place the thermoelectric cooling device 30 on the support platform 11, install each component of the test device 20 in sequence, fix the connecting rod 14 and the positioning strip 12 to the support platform 11, and finally insert the pressure rod 13 into the positioning hole of the positioning strip 12 to apply pressure to the test device 20. The test device 20 transmits the pressure to the thermoelectric cooling device 30, so that the entire test device 20 and the thermoelectric cooling device 30 are not prone to lateral or sideways movement.

[0066] In step S4, specifically, the support platform 11 is first installed on the base 40. More specifically, the support platform 11 is installed on the support rod 42, the protective cover 41 is covered and sealed, and the air inside the protective cover is extracted using a vacuum pump to maintain a certain vacuum level. This completes the step of placing the clamping device 10, along with the testing device 20 and the thermoelectric cooling device 30, in a vacuum environment. Testing the cooling capacity in a vacuum environment greatly reduces heat loss due to heat diffusion to the environment, making the measurement of the cooling capacity of the thermoelectric cooling device 30 more accurate.

[0067] In step S5, the specific method for measuring the cooling capacity of the thermoelectric cooling device 30 can be as follows: the heater 23 is heated to a predetermined temperature with a predetermined power, the temperature of each temperature measuring device is obtained at the predetermined temperature, the heat loss at each part of the test device is calculated, the actual input power is corrected by the heat loss, and the actual cooling capacity of the thermoelectric cooling device 30 is obtained.

[0068] Specifically, the friction loss of power transmission equipment refers to the energy loss along the entire power transmission path from the power output terminal to the input terminal of the thermoelectric cooling device 30, caused by factors such as conductor resistance and contact resistance. This loss includes the power supply internals, connecting cables, connectors, switches, and protection circuits. This loss causes the actual power reaching the device to be less than the power supply's displayed output power. It can be obtained through the no-load / short-circuit calibration method or the four-wire method. The no-load / short-circuit calibration method involves short-circuiting the transmission circuit (or connecting a known standard resistor) and measuring the difference between the power supply output power and the actual power reaching the load terminal to obtain loss curves under different current / power conditions. The four-wire method involves drawing a separate voltage detection line from the testing device to directly measure the voltage across the device, thus avoiding voltage drop losses along the line and deriving the friction loss.

[0069] Lead wire loss refers to the Joule heat loss caused by the resistance of the wires connecting various components in a test device, such as those connecting heaters, temperature measuring devices, and thermoelectric cooling devices. It can be obtained through comparative experiments, direct resistance measurement, thermal imaging, or thermocouple measurements. Comparative experiments involve measuring the electrical power input of the heater under the same environmental conditions and comparing its actual heating effect with the theoretical heating effect without lead wire loss; the difference represents the heat deviation caused by lead wire loss. Direct resistance measurement involves measuring the resistance value of the lead wire and calculating the Joule heat power based on the actual current. Thermal imaging or thermocouple measurements involve directly measuring the surface temperature rise of the lead wire and using a thermal model of the lead wire to estimate the heat lost to the environment or conducted to the device under test.

[0070] like Figure 5 - Figure 7 As shown, where, Figure 5 The thermal correction results are calculated from the measured data of each temperature measuring device. Figure 5 (a) is a schematic diagram of the heat loss of each component. Figure 5 (b) is a graph showing the relationship between heat loss through conduction in the conductor and the power of the heater. This application obtains the graph by thermocouple measurement. Specifically, the actual connection temperature of the heater 23 is measured by the third temperature measuring device 213 and compared with the input power to obtain the amount of heat loss through conduction in the conductor. The actual connection temperature of the heater 23 refers to the temperature at which the conductor is connected to the heater 23, and also reflects the conductor temperature. Figure 5 (c) represents the heat loss of the insulation block 24. The temperature at both ends of the insulation block 24 is measured by the fourth temperature measuring device 214 and the fifth temperature measuring device 215 to obtain the heat conducted to the insulation block. Figure 5 (d) shows the relationship between the device's friction loss and the input power, calculated according to the specific device type. In this application, it is obtained through the no-load / short-circuit calibration method. The actual cooling capacity of the thermoelectric cooling device 30 is equal to the power input minus the heat loss along the wires, plus the environmental parasitic heat leaking in through the insulation block.

[0071] Figure 6 The dimensions are 3.5 × 3.5 × 1.2 mm. 3 The measured performance of the micro-device at a hot junction temperature of 300K is presented. The core performance of the thermoelectric cooling device 30 under different operating conditions is demonstrated, intuitively reflecting the changes in cooling capacity and energy efficiency ratio with temperature difference and current.

[0072] Specifically, the heater 23 is heated to 300K, and the actual temperature difference between the hot end and the cold end is measured by the first temperature measuring device 211 and the second temperature measuring device 212, which is the refrigeration temperature difference.

[0073] Figure 6 (a) shows the relationship between actual cooling capacity and cooling temperature difference. As can be seen, the cooling capacity decreases as the temperature difference increases.

[0074] Figure 6 (b) shows the change in COP (cooling capacity divided by input electrical power) with temperature difference.

[0075] Figure 6 (c) illustrates the effect of adjusting current on cooling capacity under a fixed temperature difference. The adjusting current is the current input from the power supply to the thermoelectric cooling device 30 to drive the thermoelectric cooling device 30 to cool. The cooling capacity first increases and then decreases with the increase of current. There is an optimal current peak value, which can be used to determine the optimal operating current of the thermoelectric cooling device.

[0076] Figure 6 (d) illustrates the effect of adjusting the current on the coefficient of performance (COP) at a fixed temperature difference. The current corresponding to the maximum cooling capacity is usually greater than the current corresponding to the highest efficiency. In applications, if energy saving is desired, a smaller current is used; if powerful cooling is required, a larger current is needed.

[0077] Figure 7 The dimensions are 8.2 × 6.0 × 1.8 mm. 3 The measured performance of a standard-sized device at a hot-end temperature of 300 K.

[0078] Figure 7 (a) shows the relationship between cooling capacity and temperature difference. As the temperature difference increases, the cooling capacity decreases; at the same temperature difference, the greater the current, the higher the cooling capacity.

[0079] Figure 7 (b) shows the relationship between the coefficient of performance (COP) and temperature difference. As the temperature difference increases, the COP decreases; at the same temperature difference, the higher the current, the lower the COP.

[0080] Figure 7 (c) shows the relationship between cooling capacity and operating current. As the operating current increases, the cooling capacity first rises and then falls, with an optimal current value.

[0081] Figure 7 (d) shows the relationship between the coefficient of performance (COP) and the operating current. Trend: As the operating current increases, the COP first rises and then falls, with an optimal current value.

[0082] The detachable and modifiable micro thermoelectric cooling device performance testing device described in this application includes a vacuum holding system 50, a clamping device 10, and a testing device 20. The clamping device uses detachable connecting components to replace the traditional welded integrated design, allowing for easy replacement according to the clamping and heat dissipation requirements of thermoelectric cooling devices of different sizes and grades, simplifying maintenance. The method for measuring cooling capacity utilizes the principle of thermal correction, performing actual calculations on all heat loss or replenishment affecting cooling capacity to accurately correct the device's cooling capacity results. Actual testing has verified that this testing device and method are suitable for testing the cooling performance of thermoelectric cooling devices of various sizes over a wide temperature range, and are particularly suitable for the precise measurement of micro-sized thermoelectric cooling devices, providing accurate and reliable measurement results.

[0083] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.

Claims

1. A detachable and modifiable thermoelectric refrigeration device for performance testing, characterized in that, Includes clamping devices and testing devices; The testing device includes at least one temperature measuring device, and at least one of the temperature measuring devices is electrically connected to a thermoelectric cooling device. The clamping device includes a support platform, a positioning bar, a pressure bar, and at least one connecting rod. The two ends of the at least one connecting rod are respectively connected to the support platform and the positioning bar, so that a test device accommodating area is formed between the support platform and the positioning bar. The pressure bar extends through the positioning bar into the receiving area of ​​the test device to apply pressure to the test device, and the test device is clamped by the pressure bar and the support platform.

2. The detachable and modifiable thermoelectric refrigeration device performance testing device as described in claim 1, characterized in that, The thermoelectric cooling device performance testing device also includes a base and a protective cover. The protective cover covers the surface of the base to form a sealed cavity, and the clamping device and the testing device are both disposed inside the sealed cavity.

3. The detachable and modifiable thermoelectric refrigeration device performance testing device as described in claim 2, characterized in that, A support rod is provided on the base, and the support rod extends from the base and connects to the support platform. Alternatively, the base may be provided with at least one flange.

4. The detachable and modifiable thermoelectric refrigeration device performance testing device as described in claim 1, characterized in that, The connecting rod and the positioning strip are connected by a thread, making the height of the testing device's accommodating area adjustable.

5. The detachable and modifiable thermoelectric refrigeration device performance testing device as described in claim 1, characterized in that, The pressure rod is a threaded rod, which extends into the receiving area of ​​the test device through a threaded hole on the positioning strip, so that the threaded rod is detachably connected to the positioning strip, and the length of the threaded rod extending into the receiving area of ​​the test device is adjustable.

6. The detachable and modifiable thermoelectric refrigeration device performance testing device as described in claim 1, characterized in that, The pressure bar is connected to a pressure head at one end of the test device's accommodating area.

7. The detachable and modifiable thermoelectric refrigeration device performance testing device as described in claim 1, characterized in that, The testing device includes a cooling component, a heater, a first temperature measuring device, a second temperature measuring device, a third temperature measuring device, and a fourth temperature measuring device; The liquid cooling plate is disposed between the support platform and the thermoelectric refrigeration device; The heater is disposed on the thermoelectric refrigeration device, and the heater and the liquid cooling plate form a clamping shape for the thermoelectric refrigeration device; A first temperature measuring device is connected at the connection point between the liquid cooling plate and the thermoelectric refrigeration device; A second temperature measuring device is connected at the connection point between the thermoelectric refrigeration device and the heater; The heater lead wire is connected to a third temperature measuring device. The end of the heater furthest from the lead end is connected to the fourth temperature measuring device.

8. The detachable and modifiable thermoelectric refrigeration device performance testing device as described in claim 7, characterized in that, A heat insulation block is provided at the end of the heater away from the thermoelectric refrigeration device; The fourth temperature measuring device is located between the heater and the heat insulation block; A fifth temperature measuring device is provided at the end of the heat insulation block away from the heater.

9. The detachable thermoelectric refrigeration device performance testing device as described in any one of claims 1-8, characterized in that, The thermoelectric refrigeration device performance testing apparatus also includes a vacuum holding system and a controller; The clamping device and the testing device are located within the vacuum holding system; The controller controls the operation of the testing device and the vacuum holding system; The controller controls the testing device to measure the cooling capacity of the thermoelectric refrigeration device.

10. A method for measuring cooling capacity, applied to the performance testing device for detachable thermoelectric refrigeration devices as described in any one of claims 1-9, characterized in that, include: Provide a thermoelectric refrigeration device; The thermoelectric cooling device is placed in the thermoelectric cooling device receiving area of ​​the test device; The testing device is clamped onto the clamping device; The clamping device, together with the testing device and the thermoelectric cooling device, is placed in a vacuum environment; The testing device measures the cooling capacity of the thermoelectric refrigeration device in a vacuum environment and obtains the cooling capacity measurement results. The cooling capacity measurement results are corrected for the influence of the test environment, which includes at least one of the heat loss of the test device, the friction loss of the power transmission equipment, and the conductor loss.

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