A semiconductor package inspection apparatus

Abstract

This invention relates to the field of semiconductor processing and inspection technology, and in particular to a semiconductor packaging inspection device, comprising a first motor and a gearbox. The output shaft of the first motor is fixedly connected to the gearbox, and the outer wall of the gearbox is rotatably connected to the main shaft via a toothed belt. A CCD camera moving inspection mechanism is provided outside the conveyor belt. Through the cooperation of the housing and the semiconductor packaging box transmission mechanism, a second motor drives the first bevel gear to rotate. In this way, the semiconductor packaging box can be moved to the middle of the conveyor belt without the need for operator placement, avoiding errors during inspection. Through the cooperation of the conveyor belt and the CCD camera moving inspection mechanism, the CCD camera can inspect the side walls of the semiconductor packaging box, avoiding incomplete inspection, thus improving the pass rate of the semiconductor packaging inspection device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing and testing technology, specifically to a semiconductor packaging testing device. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion, among other fields. For example, diodes are devices made using semiconductors. From both a technological and economic development perspective, the importance of semiconductors is immense. Most electronic products, such as computers, mobile phones, and digital recorders, rely heavily on semiconductors as their core components. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being the most influential in their applications. After semiconductor packaging, the packaging effect needs to be tested.

[0003] However, in the existing technology, when inspecting the packaging effect of semiconductor packaging boxes, operators need to manually place the packaging box directly under the inspection camera. However, it is difficult for operators to accurately and quickly place the packaging box directly under the inspection camera, which leads to a decrease in the inspection effect of the inspection camera and thus a large error in the semiconductor packaging inspection.

[0004] Meanwhile, the existing semiconductor packaging inspection cameras are positioned in a fixed position and can only inspect one side of the semiconductor packaging inspection box. When the other sides of the semiconductor packaging box are not properly packaged, the inspection camera cannot capture the situation. This results in semiconductor packaging boxes that are not properly packaged being inspected as qualified products, thus reducing the inspection pass rate of the inspection equipment. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of operators having difficulty accurately placing semiconductor packaging boxes under the inspection camera, resulting in inspection errors and the inspection camera being unable to inspect other sides of the semiconductor packaging box, leading to incomplete inspection and reduced pass rate. Therefore, a semiconductor packaging inspection device is proposed.

[0006] To achieve the above objectives, the present invention provides the following technical solution: Design a semiconductor packaging inspection device, including a first motor and a gearbox. The output shaft of the first motor is fixedly connected to the gearbox. The outer wall of the gearbox is rotatably connected to the main shaft via a toothed belt. The outer wall of the main shaft is rotatably connected to a conveyor belt. The protective shell of the side wall of the conveyor belt is fixedly connected to the housing. The outer wall of the toothed belt passes through the housing via a through hole. A semiconductor packaging box pushing mechanism is provided outside the housing. A CCD camera movement inspection mechanism is provided outside the conveyor belt.

[0007] Preferably, the semiconductor packaging box pushing mechanism includes a horizontal plate, a second motor, a first bevel gear, a second bevel gear, a turntable, a protrusion, a vertical rod, a round rod, a first base, a horizontal rod, and a push plate; The outer wall of the horizontal plate is fixedly connected to the housing, the outer wall of the horizontal plate is fixedly connected to the second motor, the output shaft of the second motor is fixedly connected to the first bevel gear, the outer wall of the first bevel gear is rotatably connected to the horizontal plate through a bearing, the first bevel gear and the second bevel gear are meshed together, the outer wall of the second bevel gear is fixedly connected to the turntable, the outer wall of the turntable is fixedly connected to the protrusion, the outer wall of the protrusion is slidably connected to the vertical rod through a groove machined on the surface of the vertical rod, the vertical rod is slidably connected to the round rod through a through hole, the outer wall of the round rod is fixedly connected to the first base, the outer wall of the vertical rod is fixedly connected to the horizontal rod, and the surface of the horizontal rod is fixedly connected to the push plate.

[0008] Preferably, the upper surface of the housing is fixedly connected to the feeding box, and a semiconductor packaging box is placed inside the feeding box.

[0009] Preferably, the CCD camera motion detection mechanism includes a base plate, an incomplete gear, a bent plate, a cylinder, a connecting plate, a CCD camera, a gear, a square plate, and a third motor; The outer wall of the base plate is fixedly connected to the protective shell of the conveyor belt side wall. The surface of the base plate is fixedly connected to the incomplete gear through a bracket. The upper surface of the base plate is fixedly connected to the curved plate. The curved plate is slidably connected to two cylinders through a surface-machined groove. The surfaces of the two cylinders are respectively fixedly connected to two connecting plates. The surfaces of the two connecting plates are fixedly connected to a CCD camera through a bracket. The surfaces of the two cylinders are respectively rotatably connected to two gears through bearings. Both gears are meshed with the incomplete gear. The outer walls of the two gears are fixedly connected to the output shaft of the third motor. The outer walls of the two third motors are fixedly connected to the square plate. The outer walls of the two square plates are respectively fixedly connected to the two connecting plates through brackets.

[0010] Preferably, the first base is fixedly connected to the housing, and the outer wall of the push plate is in contact with the housing.

[0011] Preferably, the outer wall of the conveyor belt and the housing are both fixedly connected to the columns via brackets, and the lower ends of the plurality of columns are fixedly connected to the second base.

[0012] Preferably, the surface of the feeding box is machined with an observation port, which allows the operator to observe the number of semiconductor packaging boxes inside the feeding box.

[0013] Preferably, the two CCD cameras are symmetrically distributed.

[0014] Preferably, the moving radius of the bump is the same as the distance the pusher moves the semiconductor package box to the middle of the conveyor belt, and the width of the groove machined on the surface of the vertical rod is the same as the diameter of the bump.

[0015] The semiconductor packaging inspection equipment proposed in this invention has the following advantages: Through the cooperation of the housing and the semiconductor packaging box transmission mechanism, the second motor drives the first bevel gear to rotate. The first bevel gear rotates on the horizontal plate and simultaneously drives the second bevel gear to rotate. The second bevel gear drives the turntable to rotate, and the turntable drives the protrusions on its surface to rotate synchronously. Since the protrusions are always located in the grooves on the surface of the vertical rod, when the protrusions follow the turntable to rotate, the protrusions will drive the vertical rod to move closer to the housing. At this time, the vertical rod slides on the outer wall of the round rod. The round rod is fixed to the housing by the first base, so the round rod will guide the movement of the vertical rod. The vertical rod drives the horizontal rod to move to the upper material box, and the horizontal rod drives the push plate to move. When the push plate moves, it pushes the bottom semiconductor packaging box out of the upper material box. When the turntable drives the protrusions to move to the closest point to the housing, the semiconductor packaging box is pushed to the middle of the conveyor belt. In this way, the semiconductor packaging box can be moved to the middle of the conveyor belt without the need for operators to place it, thus avoiding errors in the inspection equipment during inspection.

[0016] Through the coordination of the conveyor belt and the CCD camera moving detection mechanism, a third motor drives the gears to rotate and move. These gears move on an incomplete gear, causing two gears to move along the incomplete gear. This movement of the two gears drives the cylinder, which moves within a curved plate. The cylinder then moves the connecting plate, which in turn moves the square plate and the CCD cameras. This allows the two CCD cameras to rotate at an angle, and they are always directly facing the semiconductor packaging box. This enables the two CCD cameras to inspect the sides of the semiconductor packaging box. When the CCD cameras detect a defective semiconductor packaging box, they will issue an alarm to alert the operator. This method allows the CCD cameras to inspect the side walls of the semiconductor packaging box, avoiding incomplete inspections and thus improving the pass rate of the semiconductor packaging inspection equipment.

[0017] At the same time, the two CCD cameras can be moved by two third motors, which allows the two CCD cameras to move independently to detect different positions of the semiconductor packaging box, thus improving the applicability of the detection equipment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the external structure of the present invention; Figure 2 for Figure 1 A diagram showing the rear view. Figure 3 for Figure 2A diagram illustrating the right-view state; Figure 4 for Figure 2 A three-dimensional schematic diagram of the CCD camera motion detection mechanism; Figure 5 for Figure 4 A diagram showing the rear view. Figure 6 for Figure 2 A partial schematic diagram of the long transmission mechanism of the semiconductor packaging box; Figure 7 for Figure 6 A diagram illustrating the right-view state; Figure 8 for Figure 7 A diagram showing the rear view.

[0019] In the diagram: 1. First motor, 2. Gearbox, 3. Toothed belt, 4. Main shaft, 5. Conveyor belt, 6. Housing, 7. Semiconductor packaging box transmission mechanism, 701. Horizontal plate, 702. Second motor, 703. First bevel gear, 704. Second bevel gear, 705. Turntable, 706. Protrusion, 707. Vertical rod, 708. Round rod, 709. First base, 710. Horizontal rod, 711. Push plate, 8. CCD camera movement detection mechanism, 801. Base plate, 802. Incomplete gear, 803. Bent plate, 804. Cylinder, 805. Connecting plate, 806. CCD camera, 807. Gear, 808. Square plate, 809. Third motor, 9. Semiconductor packaging box, 10. Column, 11. Second base, 12. Feeding box. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings: See attached document Figure 1-8 In this embodiment, a semiconductor packaging inspection device includes a first motor 1 and a gearbox 2. The output shaft of the first motor 1 is fixedly connected to the gearbox 2. The model of the first motor 1 is selected according to actual needs, and only needs to meet the working requirements are selected. The outer wall of the gearbox 2 is rotatably connected to the main shaft 4 through a toothed belt 3. The first motor 1 drives the main shaft 4 to rotate through the gearbox 2 and the toothed belt 3. The outer wall of the main shaft 4 is rotatably connected to the conveyor belt 5. The main shaft 4 drives the conveyor belt 5 to rotate. The protective shell on the side wall of the conveyor belt 5 is fixedly connected to the housing 6. The outer wall of the toothed belt 3 passes through the housing 6 through a through hole. A semiconductor packaging box pushing mechanism 7 is provided on the outside of the housing 6. A CCD camera moving inspection mechanism 8 is provided on the outside of the conveyor belt 5.

[0021] The semiconductor packaging box pushing mechanism 7 includes a horizontal plate 701, a second motor 702, a first bevel gear 703, a second bevel gear 704, a turntable 705, a protrusion 706, a vertical rod 707, a round rod 708, a first base 709, a horizontal rod 710, and a push plate 711. The outer wall of the horizontal plate 701 is fixedly connected to the housing 6, and the outer wall of the horizontal plate 701 is fixedly connected to the second motor 702. The model of the second motor 702 is selected according to actual needs, and only those that meet the working requirements are selected. The output shaft of the second motor 702 is fixedly connected to the first bevel gear 703. The second motor 702 drives the first bevel gear 703 to rotate. The outer wall of the first bevel gear 703 is rotatably connected to the horizontal plate 701 through a bearing. The first bevel gear 703 rotates on the horizontal plate 701. The first bevel gear 703 meshes with the second bevel gear 704, and the first bevel gear 703 drives the second bevel gear 704 to rotate. The outer wall of the second bevel gear 704 is fixedly connected to the turntable 705. The second bevel gear 704 drives... The rotating turntable 705 rotates, and the outer wall of the turntable 705 is fixedly connected to the protrusion 706. The turntable 705 drives the protrusion 706 to rotate. The outer wall of the protrusion 706 is slidably connected to the vertical rod 707 through a groove machined on the surface of the vertical rod 707. The protrusion 706 drives the vertical rod 707 to move. The vertical rod 707 is slidably connected to the round rod 708 through a through hole. The vertical rod 707 slides on the round rod 708. The outer wall of the round rod 708 is fixedly connected to the first base 709. The round rod 708 is fixed on the first base 709. The outer wall of the vertical rod 707 is fixedly connected to the horizontal rod 710. The vertical rod 707 drives the horizontal rod 710 to move. The surface of the horizontal rod 710 is fixedly connected to the push plate 711. The horizontal rod 711 drives the push plate 711 to move.

[0022] Through the cooperation of the housing and semiconductor packaging box transmission mechanism, the second motor 702 drives the first bevel gear 703 to rotate. The first bevel gear 703, rotating on the horizontal plate 701, simultaneously drives the second bevel gear 704 to rotate. The second bevel gear 704 drives the turntable 705 to rotate, and the turntable 705 drives the protrusions 706 on its surface to rotate synchronously. Since the protrusions 706 are always located within the grooves on the surface of the vertical rod 707, when the protrusions 706 rotate with the turntable 705, they drive the vertical rod 707 to move closer to the housing 6. At this time, the vertical rod 707 slides on the outer wall of the round rod 708, and the round rod 708 passes through the first bottom... The base 709 is fixed to the housing 6, so the round rod 708 guides the movement of the vertical rod 707. The vertical rod 707 drives the horizontal rod 710 to move upward to the material box 12. The horizontal rod 710 drives the push plate 711 to move. When the push plate 711 moves, it pushes the lowest semiconductor package box 9 in the material box 12 out of the material box 12. When the turntable 705 drives the protrusion 706 to move to the position closest to the housing 6, the semiconductor package box 9 is pushed to the middle of the conveyor belt 5. In this way, the semiconductor package box can be moved to the middle of the conveyor belt without the need for operators to place it, thus avoiding errors in the detection equipment during detection.

[0023] The upper surface of the housing 6 is fixedly connected to the feeding box 12, and the semiconductor packaging box 9 is placed inside the feeding box 12.

[0024] The CCD camera motion detection mechanism 8 includes a base plate 801, an incomplete gear 802, a curved plate 803, a cylinder 804, a connecting plate 805, a CCD camera 806, a gear 807, a square plate 808, and a third motor 809. The outer wall of the base plate 801 is fixedly connected to the protective shell of the side wall of the conveyor belt 5. The surface of the base plate 801 is fixedly connected to the incomplete gear 802 via a bracket. The upper surface of the base plate 801 is fixedly connected to the curved plate 803. The curved plate 803 is slidably connected to two cylinders 804 via surface-machined grooves. The cylinders 804 move on the curved plate 803. The surfaces of the two cylinders 804 are fixedly connected to two connecting plates 805 respectively. The cylinders 804 drive the connecting plates 805 to move. The surfaces of the two connecting plates 805 are fixedly connected to the CCD camera 806 via a bracket. The connecting plates 805 drive the CCD camera 806 to move. The model of the CCD camera 806 is selected according to actual needs, choosing one that meets the working requirements. The surfaces of the two cylinders 804 are respectively connected to the shaft... The bearing is rotatably connected to two gears 807, which rotate on a cylinder 804. Both gears 807 mesh with an incomplete gear 802, rotating on and moving along its surface. The outer walls of the two gears 807 are fixedly connected to the output shaft of a third motor 809. The third motor 809 drives the gears 807 to rotate and move. The model of the third motor 809 is selected according to actual needs, choosing one that meets the operational requirements. The outer walls of the two third motors 809 are fixedly connected to a square plate 808. The outer walls of the two square plates 808 are fixedly connected to two connecting plates 805 via brackets. The square plates 808 drive the connecting plates 805 to move.

[0025] Through the coordination of the conveyor belt and the CCD camera moving detection mechanism, the third motor 809 drives the gears 807 to rotate and move, causing the two gears 807 to move along the incomplete gear 802. As the two gears 807 move, they drive the cylinder 804 to move. The cylinder 804 moves within the curved plate 803, which in turn drives the connecting plate 805 to move. The connecting plate 805 simultaneously drives the square plate 808 and the CCD camera 806 to move, allowing the two CCD cameras 806 to adjust their angles. Furthermore, the lenses of the two CCD cameras 806 are always directly facing the semiconductor packaging box 9, enabling them to detect the packaging gaps in the semiconductor packaging box 9 (the orientation of the packaging gaps differs depending on the packaging box). When the CCD camera 806 detects a defective semiconductor packaging box 9, it will issue an alarm to alert the operator. The operator can then remove the defective semiconductor packaging box 9. This method allows the CCD camera to detect the side walls of the semiconductor packaging box, avoiding incomplete detection and improving the pass rate of the semiconductor packaging inspection equipment.

[0026] The first base 709 is fixedly connected to the housing 6, and the outer wall of the push plate 711 is in contact with the housing 6.

[0027] The outer walls of the conveyor belt 5 and the housing 6 are fixedly connected to the columns 10 via brackets, and the lower ends of the multiple columns 10 are fixedly connected to the second base 11.

[0028] The surface of the feeding box 12 is machined with an observation port, which allows operators to easily observe the number of semiconductor packaging boxes 9 inside the feeding box 12.

[0029] The two CCD cameras are symmetrically distributed.

[0030] The moving radius of the bump 706 is the same as the distance that the pusher plate 711 sends the semiconductor package 9 to the middle of the conveyor belt 5, and the width of the groove machined on the surface of the vertical rod 707 is the same as the diameter of the bump 706.

[0031] Working principle: When it is necessary to inspect the packaging of a semiconductor package: Semiconductor package placement stage: First, the operator places the semiconductor packaging boxes 9 to be tested sequentially into the loading box 12. Then, the external power supply of the second motor 702 is connected, and the second motor 702 is started. The second motor 702 drives the first bevel gear 703 to rotate. The first bevel gear 703 rotates on the horizontal plate 701, and at the same time, it drives the second bevel gear 704 to rotate. The second bevel gear 704 drives the turntable 705 to rotate. The turntable 705 drives the protrusions 706 on its surface to rotate synchronously. Since the protrusions 706 are always located in the grooves on the surface of the vertical rod 707, when the protrusions 706 rotate with the turntable 705, the protrusions 706 will drive the vertical rod 707 to move closer to the housing 6. At this time, the vertical rod 707 slides on the outer wall of the round rod 708. The round rod 708 is fixed to the housing 6 by the first base 709. Therefore, the round rod 708 will... The movement of the vertical rod 707 serves as a guide, driving the horizontal rod 710 to move upwards to the feed box 12. The horizontal rod 710 drives the push plate 711 to move. When the push plate 711 moves, it pushes the lowest semiconductor package box 9 out of the feed box 12. When the turntable 705 drives the protrusion 706 to move to the position closest to the housing 6, the semiconductor package box 9 is pushed to the middle of the conveyor belt 5. Afterwards, as the turntable 705 continues to rotate, the protrusion 706 begins to move away from the housing 6. The cam 706 drives the push plate 711 away from the semiconductor package box 9 in the above manner, and the second motor 702 stops working. After the push plate 711 is reset, the semiconductor package box 9 on the upper surface of the feed box 12 falls to the lower end of the feed box 12, so that the push plate 711 can push the new semiconductor package box 9 to move in subsequent operations.

[0032] Semiconductor package inspection stage: When the external power supply to the first motor 1 is connected, the first motor 1 is started. The first motor 1 drives the main shaft 4 to rotate via the gearbox 2 and the toothed belt 3. The main shaft 4 drives the conveyor belt 5 to rotate. After the conveyor belt 5 moves the semiconductor packaging box 9 to the lower end of the two CCD cameras 806, the first motor 1 stops working. Then, the external power supply to the two CCD cameras 806 is connected, and the two CCD cameras 806 are started. Then, the external power supply to the two third motors 809 is connected, and the third motors 809 are started. The third motors 809 drive the gears 807 to rotate and move, so that the two gears 807... Moving along the incomplete gear 802, the two gears 807 drive the cylinder 804 to move. The cylinder 804 moves within the curved plate 803, driving the connecting plate 805 to move. The connecting plate 805 simultaneously drives the square plate 808 and the CCD camera 806 to move, allowing the two CCD cameras 806 to adjust their angles. The lenses of the two CCD cameras 806 are always directly facing the semiconductor packaging box 9, enabling them to detect the packaging gaps of the semiconductor packaging box 9 (different packaging boxes have different orientations for their packaging gaps). When the CCD camera 806 detects a defective semiconductor packaging box 9, it will issue an alarm to alert the operator. The operator then removes the defective semiconductor packaging box 9. After the inspection is completed, the third motor 809 and the CCD camera 806 stop working, while the first motor 1 continues working. Through this process, the conveyor belt 5 transports the qualified semiconductor packaging box 9 to the other end of the conveyor belt 5. Then, the first motor 1 stops working, completing the semiconductor packaging inspection.

[0033] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art will understand that various changes in form and detail are possible within the scope of the claims.

Claims

1. A semiconductor packaging inspection device, comprising a first motor (1) and a gearbox (2), wherein the output shaft of the first motor (1) is fixedly connected to the gearbox (2), the outer wall of the gearbox (2) is rotatably connected to the main shaft (4) via a toothed belt (3), the outer wall of the main shaft (4) is rotatably connected to a conveyor belt (5), the protective shell of the side wall of the conveyor belt (5) is fixedly connected to the housing (6), the outer wall of the toothed belt (3) passes through the housing (6) through a through hole, a semiconductor packaging box pushing mechanism (7) is provided outside the housing (6), and a CCD camera moving inspection mechanism (8) is provided outside the conveyor belt (5).

2. The semiconductor package inspection apparatus of claim 1, wherein: The semiconductor packaging box pushing mechanism (7) includes a horizontal plate (701), a second motor (702), a first bevel gear (703), a second bevel gear (704), a turntable (705), a protrusion (706), a vertical rod (707), a round rod (708), a first base (709), a horizontal rod (710), and a push plate (711).

3. The outer wall of the horizontal plate (701) is fixedly connected to the housing (6), and the outer wall of the horizontal plate (701) is fixedly connected to the second motor (702). The output shaft of the second motor (702) is fixedly connected to the first bevel gear (703). The outer wall of the first bevel gear (703) is rotatably connected to the horizontal plate (701) through a bearing. The first bevel gear (703) meshes with the second bevel gear (704), and the outer wall of the second bevel gear (704) is fixedly connected to the turntable (705). The outer wall of the turntable (705) is fixedly connected to the protrusion (706). The outer wall of the protrusion (706) is slidably connected to the vertical rod (707) through a groove machined on the surface of the vertical rod (707). The vertical rod (707) is slidably connected to the round rod (708) through a through hole. The outer wall of the round rod (708) is fixedly connected to the first base (709). The outer wall of the vertical rod (707) is fixedly connected to the horizontal rod (710). The surface of the horizontal rod (710) is fixedly connected to the push plate (711).

4. The semiconductor package inspection apparatus of claim 1, wherein: The upper surface of the housing (6) is fixedly connected to the feeding box (12), and a semiconductor packaging box (9) is placed inside the feeding box (12).

5. The semiconductor package inspection apparatus of claim 1, wherein: The CCD camera motion detection mechanism (8) includes a base plate (801), an incomplete gear (802), a curved plate (803), a cylinder (804), a connecting plate (805), a CCD camera (806), a gear (807), a square plate (808), and a third motor (809). The outer wall of the base plate (801) is fixedly connected to the protective shell of the side wall of the conveyor belt (5). The surface of the base plate (801) is fixedly connected to the incomplete gear (802) through a bracket. The upper surface of the base plate (801) is fixedly connected to the curved plate (803). The curved plate (803) is slidably connected to two cylinders (804) through a surface-machined groove. The surfaces of the two cylinders (804) are fixedly connected to two connecting plates (805) respectively. The surfaces of the two connecting plates (805) are connected to C through a bracket. The CD camera (806) is fixedly connected. The surfaces of the two cylinders (804) are rotatably connected to the two gears (807) through bearings. The two gears (807) are meshed with the incomplete gear (802). The outer walls of the two gears (807) are fixedly connected to the output shaft of the third motor (809). The outer walls of the two third motors (809) are fixedly connected to the square plate (808). The outer walls of the two square plates (808) are fixedly connected to the two connecting plates (805) through brackets.

6. The semiconductor package inspection apparatus of claim 2, wherein: The first base (709) is fixedly connected to the housing (6), and the outer wall of the push plate (711) is in contact with the housing (6).

7. The semiconductor package inspection apparatus of claim 1, wherein: The outer walls of the conveyor belt (5) and the housing (6) are fixedly connected to the columns (10) by brackets, and the lower ends of the multiple columns (10) are fixedly connected to the second base (11).

8. The semiconductor package inspection apparatus of claim 3, wherein: The surface of the feeding box (12) is machined with an observation port, which allows the operator to observe the number of semiconductor packaging boxes (9) inside the feeding box (12).

9. The semiconductor package inspection apparatus of claim 4, wherein: The two CCD cameras (806) are symmetrically distributed.

10. The semiconductor package inspection apparatus of claim 2, wherein: The moving radius of the bump (706) is the same as the distance by which the pusher plate (711) sends the semiconductor package box (9) to the middle of the conveyor belt (5), and the width of the groove processed on the surface of the vertical rod (707) is the same as the diameter of the bump (706).

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