Semiconductor visual inspection method using ultrasound vision fusion

Abstract

This invention belongs to the technical field of semiconductor manufacturing and packaging, and provides a semiconductor visual inspection method based on ultrasonic vision fusion. It includes dynamically fusing decoupled features corresponding to optical and ultrasonic images through an adaptive knowledge distillation gating mechanism to generate fused decoupled features. A decoder is used for uncertainty-aware defect detection, outputting predicted defect information and a score set containing fused, optical, and ultrasonic uncertainty scores in parallel. Based on the fused decoupled features, fused uncertainty scores, and an online prototype memory, a dynamic decision threshold set is generated in real time and calibrated using optical and ultrasonic uncertainty scores. Based on the calibrated dynamic thresholds and fused uncertainty scores, a hierarchical verification process of "direct pass - automatic review - manual review" is performed to generate the final detection result. This invention achieves an intelligent closed loop of fusion, detection, and decision-making, significantly improving the accuracy, robustness, and adaptability of the detection.

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